201136694 六、發明說明： 【發明所屬之技術領域】 如▲本發明係、與雷射加工有關，特別是關於一種利用前後兩 噴嘴結合雷射加工之複合機制，以提高雷射加工效率並改善 面加工品質之雷射複合加1裝置及其運作方法。 【先前技術】 而言’雷射加工法乃是工業上時常使用到的一種加工 性㈣^射光束具有高準直性’並且雷射加工屬於非接觸 #產生機械擠壓或機械應力，故可取代傳統 ί ΪΓ二方式。雷射加工技術的應用範圍相當廣泛，例 L透過f射光束精準地_工件或於工件上闕圖樣等j 服的ίί際:::專統的雷射加工法仍會遭遇到某些無法克 雷射力工的二主：工件材料所具有的高反射率將會影響到 刺亦會影響到材料的加工精度 =產生的毛邊及毛 射加工技術採取下列_改盖措施7、〃缺失’目前的雷 吸收層來增加㈣對訪^ 在工件觀表面塗佈 使用效率以及改善f射加1品質。 丨藉叫间雷射 然而，雖然目前的雷射加工方法 施’但卻也連帶造成其他的缺點。 上了上述兩種改善措 措施而言，將會導致下列缺點·· 就上述第(1)種改善 (A)增加額外的塗佈程序； 201136694 (B) 部份能量消耗在吸收層而降低雷射使用率； (C) 加工後需要除去吸收層。 此外’社述第⑺種改善措麵t，將會導釘列缺點： (A) 紫外光雷射設備昂貴； (B) 紫外光雷射電光轉換效率低； (C) 維護費用高。201136694 VI. Description of the invention: [Technical field to which the invention pertains] ▲ The invention relates to laser processing, in particular to a composite mechanism using a combination of front and rear nozzles in combination with laser processing to improve laser processing efficiency and improve surface Processing quality laser composite plus 1 device and its operation method. [Prior Art] In terms of 'the laser processing method is a kind of processability that is often used in the industry. (4) The beam has high collimation' and the laser processing is non-contact. It produces mechanical extrusion or mechanical stress. Replace the traditional ί ΪΓ two ways. The application range of laser processing technology is quite extensive. For example, the L-ray beam is precisely _the workpiece or the 阙 pattern on the workpiece, etc.:::Special laser processing method will still encounter some failures. The second main force of the laser work: the high reflectivity of the workpiece material will affect the processing accuracy of the material. The resulting burrs and the laser processing technology take the following _ change measures. The lightning absorption layer is used to increase (4) the accessibility of the surface of the workpiece to improve the efficiency of the coating and improve the quality of the f.丨 borrowed lasers However, although the current laser processing methods have also caused other shortcomings. In view of the above two improvement measures, the following disadvantages will be caused: · Adding additional coating procedures for the above (1) improvement (A); 201136694 (B) Part of the energy consumption in the absorption layer and reducing the thunder Injection rate; (C) The absorption layer needs to be removed after processing. In addition, the (7) improvement measures t will introduce shortcomings: (A) ultraviolet laser equipment is expensive; (B) ultraviolet laser light conversion efficiency is low; (C) high maintenance costs.
綜上所述， 在上述種種缺點 及其運作方法， 【發明内容】 由於目前的雷射加工裝置及其運作方法仍存 ，因此，本發明提出一種雷射複合加工裝置 以解決上述問題。 根據本發明之第一具體實施例為一種雷射複合加工裝 於此見轭例中，該雷射複合加工裝置包含一第一喷砂裝 二-第二噴砂褒置、一雷射源、一第一喷嘴及一第二喷嘴。 ，、中」該雷_係設置於該第—喷砂裝置與該第二柄'裝置之In view of the above, various disadvantages and methods of operation thereof are provided. SUMMARY OF THE INVENTION The present invention provides a laser composite processing apparatus to solve the above problems, since the current laser processing apparatus and its operation method still exist. According to a first embodiment of the present invention, a laser composite processing apparatus is disclosed in the yoke example. The laser composite processing apparatus comprises a first blasting device, a second blasting device, a laser source, and a laser blasting device. a first nozzle and a second nozzle. , the middle of the mine is disposed in the first sandblasting device and the second handle
，’亚且該第—喷嘴及該第二喷嘴係分別對應於該第-喷砂裝 置及該第二喷砂裝置而設置。 峨、，°玄雷射複合加卫裝置控繼第—喷砂裝置透過該第-喷 =-工件之—表面進行嗔砂，以去除該表面上的污垢並增加 =面的粗糙度。雜射複合加4置控綱雷射源發射出一 =射2束對該表面進行加工。該雷射複合加工裝置控制該第二 置透職第二噴嘴對該表面進行喷砂，以去除該表面經 立、4 α加J1後所形成之毛邊，使其表面雷射加卫品質獲得提 升0 、 根據本發明之第二具體實施例為—種雷射複合加工裝 201136694 置運作方法。於此實施例中，該雷射複合加工裝置包含一 一喷1裝置、-第二喷砂裝置、—雷射源、—第—噴嘴1 一第 一喷鳴。其中，該雷射源係設置於該第一喷砂裝置與該第二 砂裝置之間，並且該第—喷嘴及該第二喷嘴係分別^於^ 一喷砂裝置及該第二喷砂裝置而設置。 / 匕該方法包含下列步驟：(a)控制該第一喷砂裝置透過該第一 喷嘴對-王件之-表面進行喷砂’以去除該表面上的污垢並增 加該表__度；（b)㈣該雷娜聽tH-雷射光束對^ 表面進行加J1;⑹控繼第二嘴砂裝置透過該第二噴嘴對該表 面進行喷妙，以去除該表面經t射複合加工後所形成之毛°邊， 使其表面雷射加工品質獲得提升。 相較於先前技術，根據本發明之雷射複合加工裝置及其 運作方法㈣透過前後兩個喷嘴之設計並結合雷射加工的複 ^機制’即可大幅提升雷射加讀率並改善表面加卫的品質， 並不需要懈在工件材料表碰佈做層，亦不需要使 的紫=光訪設備，故麟有效地簡化雷射加卫的整體製程， 並，即省雷射加工的生產成本，巾又能得到良好的表面雷射加 :口質’使知經由本發明之雷射複合加工衷置及其運作方法加 工後的產品能夠更具有市場競爭力。 更詳細地說，根據本發明之雷射複合加工裝置及其運作 方法可敍應祕精密雷射切割、精密紡絲板(紡口）製程加 太機械加工以及其他餘詩加工躺，不僅可以有效 Γ射力17工的使用效率，更能夠大幅降低雷射力0工的生產 改盖並簡化整體加工製程’使得雷射表面加111品質獲得顯著的 改善’故树雜具祕。 们 201136694 所神可以藉由以下的發明詳述及 【實施方式] 透 先前技術-Γί之設賴結合雷射加工的複合_，不需如同 貴的紫外工件㈣絲渺卜塗佈錄層，林需使用昂 曰ί雷射設傭’即能夠有效地簡化雷射加工的整體製 露—種雷射複合加工裝置及其運作方法， 程，並且節省恭丁 , ------— ”瓦瓶眾And the second nozzle and the second nozzle are respectively provided corresponding to the first blasting device and the second blasting device.峨,, ° Xuan Lei shot composite reinforcement device control - the blasting device through the first spray - the surface of the workpiece - sanding to remove dirt on the surface and increase the roughness of the surface. The spurious composite plus 4 set of control laser sources emit a = shot 2 beam to process the surface. The laser composite processing device controls the second nozzle to spray the surface to remove the burrs formed by the surface, and the surface of the laser is improved. 0. According to a second embodiment of the present invention, a laser composite processing apparatus 201136694 is operated. In this embodiment, the laser composite processing apparatus comprises a spray 1 device, a second sand blasting device, a laser source, a first nozzle 1 and a first squirting sound. Wherein, the laser source is disposed between the first sand blasting device and the second sand device, and the first nozzle and the second nozzle system respectively are a sand blasting device and the second sand blasting device And set. / 匕 The method comprises the steps of: (a) controlling the first blasting device to blast the surface of the first nozzle pair - to remove the dirt on the surface and increasing the __ degree; b) (4) The Reina listens to the tH-laser beam to add J1 to the surface; (6) controls the second nozzle device to spray the surface through the second nozzle to remove the surface after the t-composite processing The formation of the hair edge, the surface laser processing quality is improved. Compared with the prior art, the laser composite processing apparatus and the operation method thereof according to the present invention (4) can greatly improve the laser reading rate and improve the surface addition by designing the front and rear nozzles in combination with the laser processing mechanism. The quality of Wei, does not need to slap on the workpiece material table to do the layer, and does not need to make the purple = light access equipment, so Lin effectively simplifies the overall process of laser protection, and, that is, the production of laser processing Cost, the towel can get a good surface laser plus: the quality of the product can be more competitive in the market through the laser composite processing and processing method of the invention. More specifically, the laser composite processing apparatus and the operation method thereof according to the present invention can be applied to the precise laser cutting, the precision spinning plate (spinning) process, the machining process, and other poem processing, which can be effectively used. The efficiency of the use of the power of 17 workers, can significantly reduce the production of laser force 0 to change the cover and simplify the overall processing process 'to make the laser surface plus 111 quality to achieve significant improvement'. The 201136694 God can use the following invention details and [implementation] through the prior art - Γί's reliance on laser processing composite _, does not need to be as expensive as the UV workpiece (four) silk 渺 涂布 coating layer, Lin It is necessary to use the 曰 曰 雷 雷 雷 ' 即 即 即 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 能够 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷 雷Bottle
雷射加工品/、生產成本，同時又能得到良好的表面 署。發明之第一具體實施例為-種雷射複合加工裝 田實施例中，該雷射複合加工裝置可應用於任 例如：精密雷射切割、精密紡絲板(紡口)製程二 t機械 或其他精密雷射加β，並純定之限制。 言月參照圖-’圖-係綠示該雷射複合加工裝置對一工件進行雷 射複合加工之示意圖。 田 圖所示，假δ又工件2係沿著X座標軸以由左至右的 移動方向D進行移動，雷射複合加工裝置丨係用以發射出雷 射光束R對工件2表面上的雷射加卫區域Α進行加工。於此 ^施例中’ f射複合加卫裝置丨包含加工控鮮元ig及通道 單兀12，並且通道單元12與加工控制單元1〇彼此相連。其 中，加工 +控制單元10内設置有雷射源100、第一喷砂裴置1〇2 及第二喷砂裝置KH;通道單元π内設置有雷射光束通道 120、第一喷砂通道122、第二喷砂通道124、第一噴嘴14、 第二喷嘴16及雷射光束出口 18。於此實施例中，第—喷嘴 14及第二噴嘴16亦可依照其前後姆位置義分別稱為「前 201136694 噴嘴」.及「後喷嘴」，但不以此為限。 接著，將分別就雷射複合加工裝置1的加工控制單元1〇 及通道單元12進行詳細的介紹。如圖一所示，於加工控制單 凡10内’雷射源1〇〇係設置於第/喷砂裝置102與第二喷砂 裝置104之間。其中，雷射複合加工裝置丨可控制雷射源 冬射出一雷射光束，雷射複合加工裝置1亦可分別控制第一嘴 砂褒置102或第二喷砂裝置1〇4進行喷砂之動作。 、 於此實施例中，通道單元12内的雷射光束通道12〇、第 :噴砂通道122及第二噴砂通道124則是分別貫穿通道單 兀12，並且分別對應於雷射源1〇〇、第一噴砂裝置搬及 =噴砂袭置ι〇4而設置。值得注意的是，雷射光束通道12〇、 道1Ϊ ^噴砂通道124的—端係分別連接 ^射源100、第-喷砂裳置搬及第二喷砂裝置刚；至於 ^喷:⑵、第二喷砂通道124及雷射光束通道⑽ 則分別設置有第-噴嘴M、第二噴嘴Μ及雷射光束 透過上述的設置，於謂複合加碎置丨t，加 =之雷射源1_發出的該雷射光束 “ 嘴嘴16喷出至工件2的表面上。、Ή叫—噴嘴14及第二 面進置1帅表 雷射複合加工她將會_—噴砂裝請嘴 201136694 14對工件2之表面進行喷砂，以去除工件2表面上的污垢並 A加工件2表面的粗糖度。 請參照圖二及圖三，圖二及圖三係分別繪示當工件之表 面經過雷射複合加工裝置加工後所得到的表面粗糙度之量化 數據曲線圖，以及當工件的材料為金屬銅時，雷射能量反射 率與工件表面粗糙度之量化數據曲線圖。於此實施例中，之 要增加工件2表面的粗糙度的理由在於：當雷射光照射在 /月4光滑的金屬工件表面時，金屬中的自由電子將在雷射光波Laser processing products / production costs, while getting a good surface. The first embodiment of the invention is an embodiment of a laser composite processing loading field, and the laser composite processing device can be applied to any process such as: precision laser cutting, precision spinning plate (spinning) process or Other precision lasers are added with beta and are purely limited. A schematic diagram of laser composite processing of a workpiece by the laser composite processing apparatus is shown in Fig. As shown in the field diagram, the false δ and the workpiece 2 are moved along the X coordinate axis in a left-to-right moving direction D, and the laser composite processing device is used to emit the laser beam on the surface of the workpiece 2 by the laser beam R. The area is processed and processed. In the embodiment, the 'f-shot composite reinforcement device 丨 includes the processing control unit ig and the channel unit 12, and the channel unit 12 and the processing control unit 1 are connected to each other. The processing + control unit 10 is provided with a laser source 100, a first blasting device 1〇2 and a second blasting device KH; a laser beam channel 120 and a first blasting channel 122 are disposed in the channel unit π. a second blasting channel 124, a first nozzle 14, a second nozzle 16, and a laser beam exit 18. In this embodiment, the first nozzle 14 and the second nozzle 16 may be referred to as "pre-201136694 nozzle" and "rear nozzle" according to their front and rear position, respectively, but not limited thereto. Next, the machining control unit 1A and the channel unit 12 of the laser composite machining apparatus 1 will be described in detail. As shown in Fig. 1, the laser source 1 is disposed between the sandblasting device 102 and the second sandblasting device 104 in the processing control unit. Wherein, the laser composite processing device can control the laser source to emit a laser beam in the winter, and the laser composite processing device 1 can also control the first nozzle sand device 102 or the second sand blast device 1〇4 for sandblasting. action. In this embodiment, the laser beam channel 12〇, the first blasting channel 122, and the second blasting channel 124 in the channel unit 12 respectively penetrate the channel unit 12 and correspond to the laser source 1〇〇, respectively. The first blasting device is moved and blasted to set ι〇4. It is worth noting that the ends of the laser beam path 12〇, the channel 1Ϊ^blasting channel 124 are respectively connected to the source 100, the first-blasting device and the second sandblasting device; as for the spraying: (2), The second blasting channel 124 and the laser beam channel (10) are respectively provided with a first nozzle M, a second nozzle Μ and a laser beam transmitted through the above arrangement, and the laser source 1 is added to the 丨t. _ The laser beam emitted "The nozzle 16 is sprayed onto the surface of the workpiece 2. The squeaking - the nozzle 14 and the second surface are placed in a 1 table. The laser will be processed. She will be _ blasting the mouth 201136694 14 The surface of the workpiece 2 is sandblasted to remove the dirt on the surface of the workpiece 2 and the coarse sugar content of the surface of the workpiece 2. Referring to Fig. 2 and Fig. 3, Fig. 2 and Fig. 3 respectively show that the surface of the workpiece passes through the thunder. A quantitative data graph of the surface roughness obtained after processing the composite processing apparatus, and a quantitative data graph of the laser energy reflectance and the surface roughness of the workpiece when the material of the workpiece is metallic copper. In this embodiment, The reason for increasing the roughness of the surface of the workpiece 2 is: when the mine Light irradiation / Month 4 a smooth metal surface, the metal of the free electron laser in the optical wave
電磁場的作用下出現振動後產生次波，進而形成強烈的反射效 ，，在可見光和紅外光範圍内，大部分金屬都有很高的光反射 98/ί>)。由於傳統的雷射加工均是以較大的雷射能量初始 “氧射金屬工件表面後，使得光能轉換成熱能，導致金屬工件表 面氧化及升溫，因此，若能增加金屬工件表面的粗糙度，即可 有效增加金屬工件對雷射光束的吸收效率，達到提升雷射加工 效率之功效。 、接著，雷射複合加工裝置丨將會控制雷射源1〇〇發射出 射光束對工件2表面上的雷射加工區域A進行加工。在雷 加工私序元成之後’雷射複合加工裝置1即會控制第二喷砂 置104透過第二喷嘴16對工件2表面進行噴砂，以去除工 2表面經雷射複合加工後所形成之毛邊及毛刺，使得工件2 面之雷射加工品質能夠獲得有效提升。 根據本發明之第一具體實施例為一種雷射複合加工 置運作方法。於此實施财，該魏複合加工裝置可應用於 Ϊ雷射加工之用途’例如：精密㈣切割、精密紡絲板⑻ ，程加工、航太機械加工、或其他精密雷射加工等，並無 疋之限制。如圖一所示，該雷射複合加工裝置包含一 201136694 砂裝置、-第二噴砂裝置、—雷射源、—第… 嘴。其中，該雷射源係設置於該第—喷砂_ _ =及嗔嘴及該第二物分別對應以 石> 裝置及邊第二噴砂裝置而設置。 貫 射複=，Γ圖四係繪示本發明之第二具體實施例的· 射複口力I裝置運作方法之餘_。 田 合加工裝置運作方法包含下列步驟:首：，二复 制該第—噴砂裝置透過該第—喷嘴對二件之二ίϊ 著〜去除該表面上的污垢並增加該表面的粗糙度： 該表面進行加工；之後，射光束對 矽裝置透過鄕二倾_表面 =二噴 《抓成之毛邊，使其表面雷射加工品質獲得提 於實際應用中’該雷射複合加 光束出口，並且該馳、、⑥心 m ^包3—雷射 光束出***出至ΪΓΓΓΓ雷射光束顧過該雷射 -二一卜，該雷射光束出口係設置於該第 喷嘴與該第二喷嘴之間 、諸i目、ir先前技術，根據本發明之雷射複合加工裝置及其 人機#丨^夠透過雜_噴嘴之設計並結讀射加工的複 幅提升f射加卫效率並改善表面加工的品質， 沾1^額外在工件材料表面塗佈吸收層，亦不需要使用昂主 並ί 3=設備’故能夠有效地簡化雷射加工的整體製程貝 工口質工Γ生產成本，而又能得到_表面雷射加 工之#織合加讀£及_作方法加 後的產品旎夠更具有市場競爭力。 201136694 .更詳細地說，根據本發明之雷射複合加工 方法可廣泛應祕精密雷射_、精密_板(紡=製= =、航太機械加工以及其他精密雷射加卫領域。因此= 本^明之驟複合加工裝置及其運作方法能夠授權給雷= 工業者、各式觸板加玉業者卩及抛 僅 :==:工的使用效率，更能夠大‘^ ^產成本並間化整體加工餘，使得雷射表面加卫品質獲得 頌者的改善，故本發明極具有產業利用性。 又 2以上較佳具體實施例之詳述，係希望能更加清楚 =本特徵與精神，而並非以上述所揭露的較佳具 ^貫^例來對本發明之範嘴加以限制。相反地，盆目的是 ΐΐΐΐ蓋各種改變及具相等性的安排於本發明所欲申請 之專利範圍的範缚内。 201136694 【圖式簡單說明】 圖一係繪示本發明之第一具體實施例的雷射複合加工襞 置對一工件進行雷射複合加工之示意圖。 圖二係繪示當工件之表面經過雷射複合加工裝置加工後 所得到的表面粗糙度之量化數據曲線圖。 圖三係繪示當工件的材料為金屬銅時，雷射能量反射率 與工件表面粗糙度之量化數據曲線圖。 圖四係繪示本發明之第二具體實施例的雷射複合加工裝 置運作方法之流程圖。 "Under the action of the electromagnetic field, vibration occurs to generate a secondary wave, which in turn forms a strong reflection effect. In the visible and infrared range, most metals have high light reflection 98/ί>). Because the traditional laser processing is based on the large laser energy, "the oxygen is injected into the surface of the metal workpiece, so that the light energy is converted into heat energy, which causes the surface of the metal workpiece to oxidize and heat up. Therefore, if the surface roughness of the metal workpiece can be increased, , can effectively increase the absorption efficiency of the laser beam by the metal workpiece, and achieve the effect of improving the laser processing efficiency. Then, the laser composite processing device 控制 will control the laser source 1 〇〇 emit the outgoing beam on the surface of the workpiece 2 The laser processing area A is processed. After the laser processing is performed, the laser composite processing device 1 controls the second sandblasting device 104 to blast the surface of the workpiece 2 through the second nozzle 16 to remove the surface of the workpiece 2 The burr and burr formed by the laser composite processing can effectively improve the laser processing quality of the workpiece 2 surface. According to the first embodiment of the present invention, a laser composite processing operation method is implemented. The Wei composite processing device can be applied to the application of laser processing, for example: precision (four) cutting, precision spinning plate (8), process processing, aerospace machining , or other precision laser processing, etc., there is no limit. As shown in Figure 1, the laser composite processing device comprises a 201136694 sand device, a second sand blasting device, a laser source, a ... mouth. The laser source is disposed in the first sandblasting___ and the nozzle and the second object are respectively arranged corresponding to the stone > device and the second sandblasting device. The operation method of the shot-recovering force I device of the second embodiment of the present invention is _. The operation method of the field processing device comprises the following steps: first:, copying the first sandblasting device through the first nozzle pair The second part is to remove the dirt on the surface and increase the roughness of the surface: the surface is processed; after that, the beam is transmitted through the 鄕 倾 表面 表面 surface = two sprays Laser processing quality is obtained in practical application 'the laser composite plus beam exit, and the Chi, 6 heart m ^ package 3 - laser beam exit is emitted to the ΪΓΓΓΓ laser beam to take care of the laser - two The laser beam exit is set in the first Between the nozzle and the second nozzle, the prior art, the laser composite processing apparatus and the human machine thereof according to the present invention are designed to pass through the design of the miscellaneous nozzle and to read the complex amplitude increase of the shot processing. It also improves the efficiency of the surface and improves the quality of the surface processing. It also applies an additional absorption layer on the surface of the workpiece material, and it does not need to use the main unit and ί 3 = equipment, so it can effectively simplify the overall process of laser processing. The quality of production, the cost of production, and the _ surface laser processing of the woven and read and the _ method of adding products are more competitive in the market. 201136694. In more detail, according to the invention of the thunder The composite processing method can be widely used for precision laser _, precision _ board (spin = system = =, aerospace machining and other precision laser reinforcement field. Therefore = the composite processing device and its operation method can Authorized to Lei = industrial, all kinds of touch panels plus jade industry and throwing only: ==: the efficiency of the use of work, more able to '^ production costs and inter-process the overall processing surplus, so that the laser surface to enhance the quality of the The improvement of the latter, so the invention has great industrial benefits Sex. Further, the details of the preferred embodiments of the present invention are intended to be more apparent, and the present invention is not limited by the preferred embodiments disclosed herein. On the contrary, the purpose of the invention is to cover various modifications and equivalent arrangements within the scope of the patent application to which the invention is claimed. Brief Description of the Drawings Fig. 1 is a schematic view showing a laser composite machining of a workpiece according to a first embodiment of the present invention. Figure 2 is a graph showing the quantitative data of the surface roughness obtained when the surface of the workpiece is processed by a laser composite processing device. Figure 3 is a graph showing the quantitative data of the laser energy reflectivity and the surface roughness of the workpiece when the material of the workpiece is metallic copper. Figure 4 is a flow chart showing the operation method of the laser composite processing apparatus of the second embodiment of the present invention. "
12. 201136694 【主要元件符號說明】 S10〜S14 :流程步驟 1 :雷射複合加工裝置 2 :工件 10 :加工控制單元 12 :通道單元 14 :第一喷嘴 16 :第二喷嘴 18 :雷射光束出口 100 :雷射源 102 :第一喷砂裝置 104 :第二喷砂裝置 D:工件移動方向 120 :雷射光束通道 122 :第一喷砂通道 124 :第二喷砂通道 R :雷射光束 A·雷射加工區域 1312. 201136694 [Description of main component symbols] S10~S14: Flow step 1: Laser composite processing device 2: Workpiece 10: Machining control unit 12: Channel unit 14: First nozzle 16: Second nozzle 18: Laser beam exit 100: laser source 102: first blasting device 104: second blasting device D: workpiece moving direction 120: laser beam path 122: first blasting channel 124: second blasting channel R: laser beam A ·Laser processing area 13