201128866 六、發明說明： 【發明所屬之技術領域】 [⑽1] 本發明涉及一種卡片組件及具有該卡片組件的電子設備 〇 【先前技術】 [0002] 隨著科學技術的飛速發展，電子設備（如行動電話等移動 通信終端）已成為人們生活中必不可少一部分。目前，電 子設備體形的發展趨於小型化，所以内置於電子設備内 的卡片也隨之湧現了新一代的迷你（Mini)型卡片。 [0003] 例如，行動電話體形的發展趨於小型化，所以内置於行 動電話内的用戶身份識別卡（Subscriber Identity Module，SIM卡，亦稱智能卡、客戶識別模組卡）也隨之 湧現了新一代的迷你（Mini)型SIM卡。 [0004] 然而，該Mini型SIM卡與傳統行動電話的規格參數不相同 ，該Mini型SIM卡只適用於與之匹配的新型Mini型行動 電話，而無法安裝在傳統行動電話内，因此，該Mini型 SI Μ卡無法與該傳統行動電話相容。 【發明内容】 [0005] 有鑒於此，有必要提供一種能使規格參數不相同的卡片 與電子設備相相容的卡片組件。 [0006] 一種卡片組件，該卡片組件具有與第一電子設備相對應 的第一規格參數。該卡片組件用於可拆卸地收容卡片， 該卡片具有與該卡片組件的第一規格參數不相同的第二 規格參數。該卡片收容於該卡片組件時，該卡片組件可 099102910 表單編號Α0101 第4頁/共13頁 0992005528-0 201128866 [0007] [0008]❹ [0009] G [0010] [0011] [0012] 099102910 尨同該卡片收容在該第一電子設備内且該卡片與該第一 電子設備直接達成電性連接，該卡片與該卡片組件分離 時，該卡片可收容在第二電子設備内且該卡片與該第二 電子設備直接達成電性連接乂 所述卡片組件，藉由將卡片一併收容在第一電子設備内 ，從而能使規格參數不相同的卡片與第一電子設備相容 〇 鑒於此，還有必要提供—概相減格參數*相同的卡 片的電子設備。 種電子設備，其包括可騎地收容在該電子設備内的 卡片組件，該卡片組件具有與該電子設備相對應的第一 規格參數。該卡片組件用於可拆卸地收容卡片，該卡片 具有與該卡片組件的第一規格參數不相同的第二規格參 數。該卡片收容於該卡片組件時，該卡片組件可偕同該 卡片收容在該電子設備内且該卡片與該電子設備直接達 成電性連接，該卡片與該卡片組件分離時，該卡片可拆 卸地收谷在另一種電子設備内且該卡片與該另一種電子 設備直接達成電性連接。 所述電子a又備，精由將收容有卡片的卡片祖件收容在電 子叹備内，從而成使該電子設備與規格參數不相同的卡 片相容。 【實施方式】 下面將結合附圖，對本發明作進一步的詳細說明。 請參閱圖1，其為一較佳實施方式中電子饺備100的結構 第5頁/共13頁 表單編號A0101 0992005528-0 201128866 示意圖’在本實施方式中，該電子設備100為揭開後蓋或 移走電池的傳統行動電話。該電子設備100包括機身101 及可拆卸地收容在機身101内的卡片組件200。該機身 101開設有用於收容電池等組件（圖未示）的收容槽1 〇3及 與該收容槽103大致垂直相通的收容腔1.05。該收容腔 105的底部設置有複數接觸端1〇7。該複數接觸端1〇7與 收容在該機身101内部的電路板（圖未示）達成電性連接。 [0013] [0014] 請結合圖2，卡片組件200具有與電子設備1〇〇相對應的第 一規格參數，該卡片組件2〇〇用於可拆卸地收容卡片3〇〇 ，以使該卡片300與該電子設備1〇〇直接達成電性連接。 該卡片300具有與該卡片組件2〇〇的第一規格參數不相同 的第二規格參數，在本實施方式中，該第一規格參數與 該第二規格參數均包括形狀、尺寸，且該卡片300為迷你 (Mini)型用戶身份識別（Subscriber Identity Mod_ ule，SIM)卡，該Mini型SIM卡亦稱智能卡、客戶識別模 組卡。該卡片300可拆卸地收容在另一種電子設備（圖未 示）内，且該卡片300與該另一轉電子設備直接達成電性 連接。該卡片300與該機身ιοί相對的一側設置有複數接 觸區301。該複數接觸區3〇1用於與該複數接觸端IQ?電 性接觸，藉由該複數接觸區301與該複數接觸端1〇7的電 性接觸，使該卡片3〇〇與該電路板直接達成電性連接。 卡片組件200包括收容部件2〇1及支撐層2〇3。該收容部 件201用於收容該卡片3〇〇，優選地，該收容部件2〇1的 形狀、尺寸與該收容腔105的形狀、尺寸均相同，該收容 腔105的形狀與該卡片300的形狀相同，尺寸稍大。收容 099102910 表單編號A0101 第6頁/共13頁 0992005528-0 201128866 部件201開設有供該卡片300通過的第一通孔205，在本 實施方式中，該第一通孔205為封閉式的通孔，當然，在 其它實施方式中’該第一通孔2 05還可以為開放式的通孔 。優選地，該第一通孔205與該卡片300的形狀、尺寸均 相同。該支撐層203設置在該收容部件201與該機身1〇1 相對一侧上。該支撐層203開設有第二通孔2〇7，且該第 二通孔207的尺寸比該卡片300的尺寸小，從而可以藉由 覆蓋在該第一通孔205的支撐層203支樓該卡片3〇〇以使 該卡片300收容在該第一通孔205内。在本實施方式中， 該第二通孔207為封閉式的通孔，當然，在其它實施方式 . ' . '-'..π....::...: 中，該第二通孔207還可以為開放式的通孔。優選地，該 第二通孔207的形狀與該卡片300的形狀大致相同，尺寸 略小《該第二通孔207用於在該卡片300收容在該第一通 孔205内時，允許該複數接觸區301透過該第二通孔2〇7 與該複數接觸端107電性接觸。在本實施方式中，該支標 層203為薄膜層，從而在該卡片300收容在該第一通孔 205内時，便於該複數接觸區301透過該第二通孔2〇7與 該複數接觸端107電性接觸。優選地，該薄膜層的材質採 用環氧樹酯，當然該薄膜的材質還可以採用壓克力（聚甲 基丙烯酸曱酯）或聚碳酸酯或橡膠材料等薄型材料。 [0015]在本實施方式中，與該卡片300相對且覆蓋該第一通孔 205的支撐層203上設置有黏膠，以使該卡片300收容在 該第一通孔205内時’該卡片300黏貼在該支撑層2〇3上 ，從而該卡片組件20 0能穩固地收容該卡片300。優選地 ，該黏膠為不乾膠，從而該黏膠可以多次重複利用。再 099102910 表單編號A0101 第7頁/共13頁 0992005528-0 201128866 優選地，為了降低對支撐層203的厚度影響，該黏膠藉由 喷塗設置在該支撐層203上。當然，只要保證在該卡片 300收容在該第一通孔2〇5内時，該複數接觸區3〇1透過 該第二通孔207與該複數接觸端1〇7電性接觸，該黏膠還 可以為雙面膠等具有較大厚度的黏合劑。 [0016] [0017] [0018] [⑻19] 所述卡片組件200，藉由將卡片300一併收容在電子設備 100内，從而能使規格參數不相同的卡片3〇〇與電子設備 100相容。所述電子設備100，藉由將收容有卡片3〇〇的 卡片組件200收容在該電子設備1〇〇内，從而能使該電子 設備100與規格參數不相同的卡片3機相容。 可以理解，該收容部件201與該支撐層203可以為一體成 型結構。還可以理解，當該收容部件2〇1與;該支撐層2〇3 採用不同材質時，該收容部件2〇1與該支撐層203可以採 用雙射成型（double injection)技術一體成型。 還可以理解，該電子設備1{}〇還可以為筆記本電腦、數位 相機等類似電子設備，對應地，該卡片3〇〇可以為記憶體 卡等類似卡片。 所述SIM卡元件，藉由收容Mini型的SIM卡並偕同該Mini 型的SIM卡一併收容在作為第一電子設備的傳統行動電話 内，從而能使該M i n i型的SIΜ卡與該傳統行動電話相容， 當該Mini型的SIM卡與該SIM卡元件分離時，該Mini型的 SIM卡還可以收容在作為第二電子設備的…心型行動電話 内，進而該Mini型的SIM卡能藉由該SIM卡元件，與該傳 統行動電話、該Mini型行動電話均相容。 099102910 表單編號A0101 第8頁/共13頁 0992005528-0 201128866 [0020] 綜上所述，本發明符合發明專利要件，爰依法提出專利 [0021] 申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技 藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1為本發明實施方式提供的電子設備的結構示意圖。 [0022] 圖2為圖1中電子設備的卡片組件的結構示意圖。 〇 [0023] 【主要元件符號說明】 電子設備：100 [0024] 卡片組件：200 [0025] 卡片：300 [0026] 機身：101 [0027] 收容槽：103 〇 [0028] 收容腔：105 [0029] 接觸端：107 [0030] 接觸區：301 [0031] 收容部件：201 [0032] 支撐層：203 [0033] 第一通孔：2 0 5 [0034] 第二通孔：207 099102910 表單編號A0101 第9頁/共13頁 0992005528-0201128866 VI. Description of the Invention: [Technical Field of the Invention] [(10) 1] The present invention relates to a card assembly and an electronic device having the same. [Prior Art] [0002] With the rapid development of science and technology, electronic devices (such as Mobile communication terminals such as mobile phones have become an indispensable part of people's lives. At present, the development of electronic devices tends to be miniaturized, so cards embedded in electronic devices have also emerged as a new generation of Mini cards. [0003] For example, the development of the mobile phone body tends to be miniaturized, so a subscriber identity card (SIM card, also known as a smart card, a customer identification module card) built in a mobile phone has also emerged with new A generation of Mini (SIM) type SIM card. [0004] However, the Mini type SIM card is different from the specifications of the conventional mobile phone, and the Mini type SIM card is only suitable for the matching new type of mobile phone, and cannot be installed in the conventional mobile phone. Therefore, the The Mini SI Leica is not compatible with this traditional mobile phone. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a card assembly that is compatible with electronic devices for cards having different specification parameters. A card assembly having a first specification parameter corresponding to a first electronic device. The card assembly is for removably receiving a card having a second specification parameter that is different from the first specification parameter of the card assembly. When the card is accommodated in the card assembly, the card assembly can be 099102910. Form number Α 0101 Page 4 / Total 13 page 0992005528-0 201128866 [0007] [0009] G [0010] [0012] [0012] 099102910 尨The card is received in the first electronic device and the card is directly electrically connected to the first electronic device. When the card is separated from the card assembly, the card can be received in the second electronic device and the card and the card The second electronic device directly reaches the card assembly, and the card is accommodated in the first electronic device together, so that the card with different specifications can be compatible with the first electronic device. It is necessary to provide an electronic device with the same card as the average reduction parameter*. An electronic device includes a card assembly mountable within the electronic device, the card assembly having a first specification parameter corresponding to the electronic device. The card assembly is for removably receiving a card having a second specification parameter that is different from the first specification parameter of the card assembly. When the card is received in the card assembly, the card assembly can be received in the electronic device and the card is directly electrically connected to the electronic device. When the card is separated from the card assembly, the card is detachably received. The valley is in another electronic device and the card is electrically connected directly to the other electronic device. The electronic component a is further prepared by accommodating the card ancestor containing the card in the electronic sigh, so that the electronic device is compatible with the card having different specifications. [Embodiment] Hereinafter, the present invention will be further described in detail with reference to the accompanying drawings. Please refer to FIG. 1 , which is a structure of an electronic dumpling 100 in a preferred embodiment. Page 5 of 13 Form No. A0101 0992005528-0 201128866 Schematic diagram In the present embodiment, the electronic device 100 is a cover for uncovering Or remove the traditional mobile phone of the battery. The electronic device 100 includes a body 101 and a card assembly 200 detachably housed in the body 101. The body 101 is provided with a housing groove 1 〇 3 for accommodating components (not shown) such as a battery, and a housing chamber 1.05 that is substantially perpendicular to the housing groove 103. The bottom of the receiving cavity 105 is provided with a plurality of contact ends 1〇7. The plurality of contact terminals 1〇7 are electrically connected to a circuit board (not shown) housed inside the body 101. [0014] Please refer to FIG. 2, the card assembly 200 has a first specification parameter corresponding to the electronic device 1A, and the card assembly 2 is configured to detachably receive the card 3〇〇 to make the card 300 is directly electrically connected to the electronic device. The card 300 has a second specification parameter that is different from the first specification parameter of the card component 2〇〇. In the embodiment, the first specification parameter and the second specification parameter both include a shape and a size, and the card 300 is a Mini (Subscriber Identity Module, SIM) card, which is also called a smart card, a customer identification module card. The card 300 is detachably housed in another electronic device (not shown), and the card 300 is directly electrically connected to the other electronic device. The card 300 is provided with a plurality of contact areas 301 on the side opposite to the body ιοί. The plurality of contact regions 3〇1 are used for electrical contact with the plurality of contact terminals IQ, and the card 3 is connected to the circuit board by electrical contact between the plurality of contact regions 301 and the plurality of contact terminals 1〇7. Directly reach an electrical connection. The card assembly 200 includes a receiving member 2〇1 and a support layer 2〇3. The receiving member 201 is configured to receive the card 3〇〇. Preferably, the shape and size of the receiving member 201 are the same as the shape and size of the receiving cavity 105. The shape of the receiving cavity 105 and the shape of the card 300 are The same, the size is slightly larger. Containing 099102910 Form No. A0101 Page 6 / Total 13 Page 0992005528-0 201128866 The component 201 is provided with a first through hole 205 for the card 300 to pass through. In the present embodiment, the first through hole 205 is a closed through hole. Of course, in other embodiments, the first through hole 205 may also be an open through hole. Preferably, the first through hole 205 and the card 300 have the same shape and size. The support layer 203 is disposed on a side of the housing member 201 opposite to the body 1〇1. The support layer 203 is provided with a second through hole 2〇7, and the size of the second through hole 207 is smaller than the size of the card 300, so that the support layer 203 can be covered by the first through hole 205. The card 3 is inserted to accommodate the card 300 in the first through hole 205. In this embodiment, the second through hole 207 is a closed through hole. Of course, in other embodiments, ' . '-'..π....::...: The aperture 207 can also be an open through hole. Preferably, the shape of the second through hole 207 is substantially the same as the shape of the card 300, and the size is slightly smaller. The second through hole 207 is configured to allow the plural when the card 300 is received in the first through hole 205. The contact region 301 is in electrical contact with the plurality of contact terminals 107 through the second through holes 2〇7. In the embodiment, the support layer 203 is a film layer, so that when the card 300 is received in the first through hole 205, the plurality of contact regions 301 are facilitated to be in contact with the plurality through the second through holes 2〇7. Terminal 107 is in electrical contact. Preferably, the material of the film layer is epoxy resin. Of course, the film may be made of a thin material such as acrylic (polymethyl methacrylate) or polycarbonate or rubber material. In the embodiment, the support layer 203 opposite to the card 300 and covering the first through hole 205 is provided with an adhesive so that the card 300 is received in the first through hole 205. 300 is adhered to the support layer 2〇3 so that the card assembly 20 0 can securely receive the card 300. Preferably, the adhesive is a self-adhesive so that the adhesive can be reused multiple times. Further, 099102910 Form No. A0101 Page 7 of 13 0992005528-0 201128866 Preferably, in order to reduce the influence on the thickness of the support layer 203, the adhesive is disposed on the support layer 203 by spraying. Of course, as long as the card 300 is received in the first through hole 2〇5, the plurality of contact regions 〇1 are electrically connected to the plurality of contact terminals 1〇7 through the second through hole 207, and the adhesive It is also possible to use a binder having a large thickness such as a double-sided tape. [0018] [(8) 19] The card assembly 200 can be compatible with the electronic device 100 by accommodating the card 300 in the electronic device 100 together, so that the card 3〇〇 having different specification parameters can be compatible with the electronic device 100. . The electronic device 100 can accommodate the electronic device 100 with a card device having a different specification parameter by accommodating the card unit 200 in which the card 3 is accommodated in the electronic device 1A. It can be understood that the receiving member 201 and the supporting layer 203 can be integrally formed. It can also be understood that when the receiving member 2〇1 and the supporting layer 2〇3 are made of different materials, the receiving member 2〇1 and the supporting layer 203 can be integrally formed by a double injection technique. It can also be understood that the electronic device 1 can also be a similar electronic device such as a notebook computer, a digital camera, etc., and correspondingly, the card 3 can be a memory card or the like. The SIM card component can be housed in a conventional mobile phone as a first electronic device by accommodating a Mini SIM card and being associated with the Mini SIM card, thereby enabling the Mini ID card and the conventional The mobile phone is compatible. When the Mini SIM card is separated from the SIM card component, the Mini SIM card can also be accommodated in the heart-shaped mobile phone as the second electronic device, and the Mini SIM card. The SIM card component can be compatible with the conventional mobile phone and the Mini mobile phone. 099102910 Form No. A0101 Page 8 of 13 0992005528-0 201128866 [0020] In summary, the present invention meets the requirements of the invention patent, and the patent is filed according to law [0021]. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. 2 is a schematic structural view of a card assembly of the electronic device of FIG. 1. 〇[0023] [Description of main component symbols] Electronic device: 100 [0024] Card component: 200 [0025] Card: 300 [0026] Body: 101 [0027] Storage slot: 103 〇 [0028] Containment cavity: 105 [ 0029] Contact: 107 [0030] Contact area: 301 [0031] Containment part: 201 [0032] Support layer: 203 [0033] First through hole: 2 0 5 [0034] Second through hole: 207 099102910 Form number A0101 Page 9 of 13 0992005528-0