201126390 六 [0001] [0002] [0003] [0004] 099102067 發明說明： 【發明所屬之技術領域】 本發明涉及一種觸控顯示裝置的軟性電路板結合方法及 觸控顯示裝置。 【先前技術】 隨著平板顯示技術的蓬勃發展及製造成本的日益降低， 具有輻射低、厚度小 '功耗低等優點的平板顯示裝置越 來越受到消費者的青睞，因此被廣泛地應用在電子產品 中。為了符合現代人對於更加便利、更加直觀的人機界 面的需要，近年來市場上逐漸推出各種各樣具有觸控功 能的平板顯示裝置，即觸控顯示裝置。通常，觸控顯示 裝置可分為外置式和内後式兩種。其中，外置式觸控顯 不裝置在傳統的平板顯示裝置基礎上附加一觸控面板； 而内置式觸控顯7F裝置是直接將觸控面板通過内敌的方 式整合至顯示面板（比如液晶面板）之中。目前的外置式 觸控面板種類繁多，包括義式、電容式、紅外線式和 表面聲波式等多種類型。 習知觸控顯示裝置的觸控面板（如電容式觸控面板）通常 I括導電層、與導電層電連接的電極或周邊線路及覆蓋 及導電層、電極或周邊線路的保襲。為實現觸控面板 與外部驅動電路的電連接，需要-軟性電路板-方面與 該電極或周邊線路結合（bonding) ’另-方面電連接至 外部驅動電路（如印刷電路板）。 在軟性電路板與觸控面板的結合過程中 ，首先需要將覆 蓋在電極或周邊線路的保護層通過蚀刻製程去除 ，再將 表單編號Αοιοι 第4頁/共21頁 0992004005-0 201126390 [0005] 軟性電路板對應該觸控面板的電極或周邊線路的壓合。 然而，該保護層通常特性比較穩定，不易蝕刻，比如： 當採用二氧化矽作為保護層時，通常需採用氫氟酸蝕刻 製程或者光罩製程去除覆蓋電極或周邊線路的二氧化矽 ，這些製程花費大量人力物力，從而導致習知觸控顯示 裝置的軟性電路板的結合製程複雜、成本較高。 【發明内容】 有鑑於此，提供一種製程簡單、成本較低觸控顯示裝置 的軟性電路板結合方法實為必要。 〇 [0006] 同時，也有必要提供一種製程簡單、成本較低觸控顯示 裝置。 [0007] 一種觸控顯示裝置的軟性電路板結合方法，該觸控顯示 裝置包括一觸控面板及一軟性電路板，該觸控面板包括 導電層、電連接該導電層的接合線路及覆蓋該導電層與 接合線路的保護層，該軟性電路板包括一接合端，該軟 性電路板的結合方法包括如下步驟： W [0008] 提供一具有多個導電粒子的異方性導電膜； [0009] 將該軟性電路板的接合端對應該觸控面板的接合線路， 並將該異方性導電膜設置於該接合端與接合線路之間； 及 [0010] 提供一外力至該軟性電路板的接合端，使得該軟性電路 板的接合端通過該異方性導電膜與該觸控面板結合為一 體，其中，在該外力的作用下，該異方性導電膜中的導 電粒子嵌入該保護層接觸該接合線路。 099102067 表單編號A0101 第5頁/共21頁 0992004005-0 201126390 [0011] 一種觸控顯示裝置，其包括一觸控面板、一軟性電路板 及一異方性導電膜，該觸控面板包括導電層、電連接該 導電層的接合線路及覆蓋該導電層與接合線路的保護層 ，該軟性電路板包括一接合端，該異方性導電膜包括多 個導電粒子，該軟性電路板的接合端通過該異方性導電 膜與該觸控面板的接合線路電連接。其中，該異方性導 電膜中的導電粒子一方面接觸該接合端，另一方面在外 力作用下嵌入該保護層以接觸該接合線路。 [0012] 與習知技術相比較，本發明觸控顯示裝置的軟性電路板 結合方法及通過該方法得到的觸控顯示裝置中，由於異 方性導電膜中的導電粒子在外力下可以嵌入該保護層接 觸該接合線路，進而實現該軟性電路板的接合端與該觸 控面板的接合線路之間的電連接，因此，本發明觸控顯 示裝置的軟性電路板結合方法較習知包括蝕刻製程或光 罩製程的結合方法簡單且成本較低。 【實施方式】 [0013] 請參閱圖1，圖1是本發明觸控顯示裝置的立體分解示意 圖。該觸控顯示裝置100包括一觸控面板110、一軟性電 路板120及一異方性導電膜130。該異方性導電膜130用 於將該軟性電路板120與該觸控面板110結合為一體，以 實現該軟性電路板120與該觸控面板110的電性連接。 [0014] 本實施例中，該觸控面板110為一電容式觸控面板，其包 括一基底111、一設置於該基底111上的第一導電層112 、一設置於該第一導電層112上的絕緣層113、一設置於 該絕緣層113上的第二導電層114、一電連接該第二導電 099102067 表單編號 A0101 第 6 頁/共 21 頁 0992004005-0 201126390 Ο [0015] Ο [0016] 層114的接合線路ι15、及覆蓋該第二導電層η4與該接 合線路115的保護層116。該接合線路115可以位於該第 二導電層114的邊緣區域，其包括設置於該第二導電層 114上的多個金屬引腳1151，該多個金屬引腳1151可以 作為檢測該第二導電層114上的觸控信號的多個探測電極 。該多個金屬引腳1151的材料可以為銀膠、金屬（如：銅 )或者金屬合金（如：銅合金），其中銀膠可以包括膠材及 分佈於膠材中的銀粒子或者其他導電粒子。該第二導電 層114可以包括多條相互平行的電極線（圖未示），該多條 電極線可以與該多個金屬引腳一一電連接。該保護層116 的材料主要為二氧化石夕。 該軟性電路板120包括一對應該接合線路115的接合端 121。該接合端121包括多個金屬引腳121ι，該金屬引腳 1211也可以稱為金手指。該接合端121的多個金屬引腳 1211分別與該接合線路115的多個金屬引腳1151 (即探 測電極）--對應。碑異方性導電膜130分別對應該接合 線路115及該接合端121。 *月一併參閱圖2及圖3，圖2是圖1所示觸控顯示裝置的各 元件結合後的示意圖，圖3是圖2沿線ΙΙ-ΙΙ的剖面示意圖 。該異方性導電膜130包括多個導電粒子131，優選地， 該導電粒子131為不規則形狀的硬質的導電粒子，比如鎳 顆粒、碳顆粒。該硬質的導電粒子可以定義為：在外力 作用下能夠嵌入或穿過該保護層116的導電粒子。該軟性 電路板120的接合端121對應該觸控面板11〇的接合線路 115 ’且該軟性電路板12〇通過該異方性導電膜13〇與該 099102067 表單編號Α0101 第7頁/共21頁 0992004005-0 201126390 觸控面板110結合為—體。具體地’在該外力的作用下， 該異方性導電膜13〇中的導電粒子131 一方面嵌入該保護 層116接觸該接合線路115的金屬引腳1151，另一方面接 觸該接合端121的金屬引腳1211，使得該接合線路115的 金屬引腳11 51與該接合端丨21的金屬引腳1211一—對應 電連接。 [0017] [0018] [0019] 請參閱圖4、圖5及圖6，圖4、圖5及圖6是圖3所示觸控顯 示裝置100的軟性電路板120結合方法的示意圖。該觸控 顯示裝置100的軟性電路板12〇結合方法主要包括以下步 驟： 步驟一：提供一軟性電路板、一異方性導電膜及一觸控 面板。 請參閱圖4，具體而言，該軟性電路板丨2〇包括一具有多 個金屬引腳1211的接合端121。該觸控面板no為電容式 觸控面板，其包括一基底1Π、一設置於該基底U1上的 第一導電層112、一設置於該第一導電層112上的絕緣層 113、一設置於該絕緣層1Γ3上的第二導電層114、一電 連接該第二導電層114的接合線路115、及覆蓋該第二導 電層114與該接合線路115的保護層116。該接合線路jig 位於s亥第一導電層114的邊緣區域，其包括設置於該第二 導電層114上的多個金屬引腳1丨54，該多個金屬引腳 11 51可以作為檢測該第二導電層π4上的觸控信號的探測 電極。該多個金屬引腳1151的材料可以為銀膠、金屬（如 :銅）或者金屬合金（如：銅合金），其中銀勝可以包括膠 材及分佈於膠材中的銀粒子或者其他導電粒子。該接合 099102067 表單編號A0101 第8頁/共21頁 0992004005- 201126390 線路115的多個金屬引腳1151可以在該觸控面板11〇形成 該第二導電層114之後，通過銀漿印刷製程直接形成在該 第二導電層114表面而與該第二導電層114電連接。該保 "蔓層116元全覆蓋該接合線路115的多個金屬引腳Η”及 該第二導電層114，以保護該接合線路115及該第二導電 層114不被腐蝕。該保護層116的材料主要為二氧化矽， 該保護層的厚度範圍可以為30nm_1〇〇nm，優選為5〇龍。 . [0020] Ο Q [0021] [0022] 該異方性導電膜130包括絕緣基質及散佈於該絕緣基質中 的導電粒子131。該導電粒子131為硬質的導電粒子，其 硬度可以大於該金屬引腳Π 5〗的硬度。該導電粒子丨3 i可 以為鎳顆粒、碳顆粒或金屬合金顆粒。優選地，該導電 粒子131為不規則形狀，包括多個尖端。該導電粒子131 的直徑範圍可以為l〇um—50um，優選區間為1〇um_3〇um ，其中，該導電粒子131的直徑是指該導電粒子131上任 意兩點間距離的最大值《該導電粒子131的直徑大於該保 護層116的厚度。 步驟二：將該軟性電路板的接合端對應該觸控面板的接 合線路，並將該異方性導電膜設置於該接合端與接合線 路之間。該步驟具體包括： 請參閲圖5，將該觸控面板110設置於一基臺上，且使具 有該保護層11 6的一側位於上方。將該異方性導電膜13〇 放置在該保護層116的對應該接合線路115的區域。接著 ，將該軟性電路板120的接合端121對應該接合線路115 並放置在該異方性導電膜130上，且可以保持該軟性電路 板120與該觸控面板板面基本平行。 099102067 表單編號A0101 0992004005-0 201126390 [0023] [0024] [0025] [0026] [0027] /驟―.提供—外力’使難性電路板的接合端通過該 異方性導電膜與賴控面板結合為—體同時，在該外 力的作用下，該異方科電財的導電好#人該保護 層接觸該接合線路。 具體而言’該步射’可以在該軟性電路板⑽遠離該異 方f生導電膜13G-側提供一熱屢頭，沿垂直該觸控面板 no的方向向該軟性電路板120的接合端121施加一外力 ’進而該軟性電路板12〇、該異方性導電膜⑽及該觸控 面板11 0 ν’σ 口為—體。具體地，在該外力的作用下，該異 方性導電膜13G中的導電粒子131—方面嵌人該保護層 116接觸該接合線路115的金㈣腳⑴^，另一方面接觸 該接合端121的金屬引腳12Η，得該接合線路U5的金 屬引腳1151與該接合端丨21的金屬引腳1211通過該導電 粒子131--電連接。 步驟四：移除外力，完成該軟性電路板與觸控面板的結 合。 請參閱則’㈣減頭，冷職，完成該軟性電路板 120與觸控面板11 〇的電連接。 至此，该軟性電路板120通過該異方性導電膜13〇與該觸 控面板110實現電連接，該觸控顯示裝置1〇〇的軟性電路 板120結合方法結束。 與習知技術相比較，本發明觸控顯示裝置1〇〇的軟性電路 板120結合方法及通過該方法得到的觸控顯示裝置1〇〇中 ’由於異方性導電膜130中的硬質的導電粒子ι31在外力 099102067 表單編號Α0101 第10頁/共21頁 0992004005-0 [0028] 201126390[Technical Field] The present invention relates to a flexible circuit board bonding method of a touch display device and a touch display device. [Prior Art] With the rapid development of flat panel display technology and the decreasing manufacturing cost, flat panel display devices with low radiation, small thickness and low power consumption are more and more popular among consumers, so they are widely used in In electronic products. In order to meet the needs of modern people for a more convenient and more intuitive man-machine interface, in recent years, various flat panel display devices with touch functions, namely touch display devices, have been introduced in the market. Generally, the touch display device can be divided into an external type and an inner type. The external touch display device is attached with a touch panel based on the traditional flat display device; and the built-in touch display 7F device directly integrates the touch panel into the display panel through the internal enemy (such as a liquid crystal panel). Among them. There are many types of external touch panels, including Yi, Capacitance, Infrared and Surface Acoustic. A touch panel (such as a capacitive touch panel) of a conventional touch display device generally includes a conductive layer, an electrode or a peripheral line electrically connected to the conductive layer, and an overlay and a protective layer, an electrode or a peripheral line. In order to achieve electrical connection between the touch panel and the external drive circuit, it is required that the flexible circuit board is bonded to the electrode or the peripheral circuit to be electrically connected to an external drive circuit such as a printed circuit board. In the process of combining the flexible circuit board and the touch panel, the protective layer covering the electrode or the peripheral circuit is first removed by an etching process, and then the form number is Αοιοι Page 4 of 21 pages 0992004005-0 201126390 [0005] Soft The board is pressed against the electrodes of the touch panel or the peripheral lines. However, the protective layer is generally stable in characteristics and difficult to etch. For example, when ruthenium dioxide is used as the protective layer, it is usually necessary to remove the ruthenium dioxide covering the electrode or the peripheral line by a hydrofluoric acid etching process or a mask process. A large amount of manpower and material resources are spent, resulting in a complicated combination process and high cost of the flexible circuit board of the conventional touch display device. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a flexible circuit board bonding method with a simple process and a low cost touch display device. 〇 [0006] At the same time, it is also necessary to provide a touch display device with simple process and low cost. [0007] A flexible circuit board assembly method for a touch display device, the touch display device includes a touch panel and a flexible circuit board, the touch panel includes a conductive layer, a bonding line electrically connecting the conductive layer, and covering the a protective layer of the conductive layer and the bonding circuit, the flexible circuit board comprising a bonding end, the bonding method of the flexible circuit board comprising the following steps: [0008] providing an anisotropic conductive film having a plurality of conductive particles; [0009] Connecting the bonding end of the flexible circuit board to the bonding line of the touch panel, and disposing the anisotropic conductive film between the bonding end and the bonding line; and [0010] providing an external force to the bonding of the flexible circuit board End, the bonding end of the flexible circuit board is integrated with the touch panel through the anisotropic conductive film, wherein the conductive particles in the anisotropic conductive film are embedded in the protective layer under the action of the external force The joint line. 099102067 Form No. A0101 Page 5 of 21 0992004005-0 201126390 [0011] A touch display device includes a touch panel, a flexible circuit board and an anisotropic conductive film, the touch panel including a conductive layer a bonding line electrically connecting the conductive layer and a protective layer covering the conductive layer and the bonding line, the flexible circuit board comprising a bonding end, the anisotropic conductive film comprising a plurality of conductive particles, the bonding end of the flexible circuit board passing The anisotropic conductive film is electrically connected to a bonding line of the touch panel. Wherein, the conductive particles in the anisotropic conductive film contact the bonding end on the one hand, and the protective layer is embedded under the external force to contact the bonding line. [0012] Compared with the prior art, the flexible circuit board bonding method of the touch display device of the present invention and the touch display device obtained by the method, the conductive particles in the anisotropic conductive film can be embedded under an external force The protective layer contacts the bonding line, thereby achieving electrical connection between the bonding end of the flexible circuit board and the bonding line of the touch panel. Therefore, the flexible circuit board bonding method of the touch display device of the present invention is conventionally including an etching process. Or the combination of the reticle process is simple and low cost. [Embodiment] [0013] Please refer to FIG. 1. FIG. 1 is a perspective exploded view of a touch display device of the present invention. The touch display device 100 includes a touch panel 110, a flexible circuit board 120, and an anisotropic conductive film 130. The anisotropic conductive film 130 is used to integrate the flexible circuit board 120 and the touch panel 110 to electrically connect the flexible circuit board 120 to the touch panel 110. [0014] In the embodiment, the touch panel 110 is a capacitive touch panel, and includes a substrate 111, a first conductive layer 112 disposed on the substrate 111, and a first conductive layer 112 disposed on the first conductive layer 112. The upper insulating layer 113, a second conductive layer 114 disposed on the insulating layer 113, and an electrical connection of the second conductive 099102067 Form No. A0101 Page 6 of 21 0992004005-0 201126390 Ο [0016] Ο [0016 The bonding line 145 of the layer 114 and the protective layer 116 covering the second conductive layer η4 and the bonding line 115. The bonding line 115 may be located at an edge region of the second conductive layer 114, and includes a plurality of metal pins 1151 disposed on the second conductive layer 114. The plurality of metal pins 1151 may serve as the second conductive layer. A plurality of detecting electrodes of the touch signal on 114. The material of the plurality of metal pins 1151 may be silver glue, metal (such as copper) or metal alloy (such as copper alloy), wherein the silver glue may include a glue material and silver particles or other conductive particles distributed in the glue material. . The second conductive layer 114 may include a plurality of mutually parallel electrode lines (not shown), and the plurality of electrode lines may be electrically connected to the plurality of metal pins one by one. The material of the protective layer 116 is mainly sulphur dioxide. The flexible circuit board 120 includes a pair of mating ends 121 that should engage the line 115. The joint end 121 includes a plurality of metal pins 1211, which may also be referred to as gold fingers. The plurality of metal pins 1211 of the bonding end 121 respectively correspond to the plurality of metal pins 1151 (i.e., detecting electrodes) of the bonding line 115. The anisotropic conductive film 130 corresponds to the bonding line 115 and the bonding end 121, respectively. Referring to FIG. 2 and FIG. 3, FIG. 2 is a schematic view showing the components of the touch display device shown in FIG. 1, and FIG. 3 is a cross-sectional view of FIG. The anisotropic conductive film 130 includes a plurality of conductive particles 131. Preferably, the conductive particles 131 are irregularly shaped hard conductive particles such as nickel particles or carbon particles. The hard conductive particles may be defined as conductive particles capable of being embedded or passed through the protective layer 116 under an external force. The bonding end 121 of the flexible circuit board 120 corresponds to the bonding line 115 ′ of the touch panel 11 且 and the flexible circuit board 12 〇 passes through the anisotropic conductive film 13 〇 and the 099102067 form number Α 0101 page 7 / total 21 pages 0992004005-0 201126390 The touch panel 110 is combined into a body. Specifically, under the action of the external force, the conductive particles 131 in the anisotropic conductive film 13 are embedded on the one hand, the protective layer 116 is in contact with the metal pin 1151 of the bonding line 115, and on the other hand, the bonding end 121 is contacted. The metal pin 1211 is such that the metal pin 11 51 of the bonding line 115 and the metal pin 1211 of the bonding terminal 21 are electrically connected. [0019] Referring to FIG. 4, FIG. 5 and FIG. 6, FIG. 4, FIG. 5 and FIG. 6 are schematic diagrams showing a method of combining the flexible circuit board 120 of the touch display device 100 of FIG. The flexible circuit board 12 〇 bonding method of the touch display device 100 mainly includes the following steps: Step 1: provide a flexible circuit board, an anisotropic conductive film, and a touch panel. Referring to FIG. 4, in particular, the flexible circuit board 2 includes a joint end 121 having a plurality of metal pins 1211. The touch panel is a capacitive touch panel, and includes a substrate 1 , a first conductive layer 112 disposed on the substrate U1 , and an insulating layer 113 disposed on the first conductive layer 112 . A second conductive layer 114 on the insulating layer 1-3, a bonding line 115 electrically connected to the second conductive layer 114, and a protective layer 116 covering the second conductive layer 114 and the bonding line 115. The bonding line jig is located at an edge region of the first conductive layer 114, and includes a plurality of metal pins 1丨54 disposed on the second conductive layer 114, and the plurality of metal pins 11 51 can be used as the detection The detecting electrode of the touch signal on the two conductive layers π4. The material of the plurality of metal pins 1151 may be silver glue, metal (such as copper) or metal alloy (such as copper alloy), wherein the silver win may include a glue material and silver particles or other conductive particles distributed in the glue material. . The bonding 099102067 Form No. A0101 Page 8 / 21 pages 0992004005-201126390 The plurality of metal pins 1151 of the line 115 can be directly formed by the silver paste printing process after the touch panel 11 is formed into the second conductive layer 114. The second conductive layer 114 is electrically connected to the second conductive layer 114. The protective layer < 116 layer covers the plurality of metal pins 该 of the bonding line 115 and the second conductive layer 114 to protect the bonding line 115 and the second conductive layer 114 from corrosion. The material of 116 is mainly cerium oxide, and the thickness of the protective layer may range from 30 nm to 1 〇〇 nm, preferably 5 〇. [0020] Ο Q [0022] The anisotropic conductive film 130 includes an insulating substrate And conductive particles 131 dispersed in the insulating substrate. The conductive particles 131 are hard conductive particles, and the hardness thereof may be greater than the hardness of the metal pin. The conductive particles 丨3 i may be nickel particles, carbon particles or Preferably, the conductive particles 131 are irregularly shaped and include a plurality of tips. The conductive particles 131 may have a diameter ranging from 10 μm to 50 μm, preferably in a range of 1 μm_3〇um, wherein the conductive particles The diameter of 131 refers to the maximum distance between any two points on the conductive particle 131. The diameter of the conductive particle 131 is larger than the thickness of the protective layer 116. Step 2: The joint end of the flexible circuit board corresponds to the touch panel Bonding line And the anisotropic conductive film is disposed between the bonding end and the bonding line. The step specifically includes: Referring to FIG. 5, the touch panel 110 is disposed on a base and has the protective layer One side of 11 6 is located above. The anisotropic conductive film 13 is placed in a region of the protective layer 116 corresponding to the bonding line 115. Next, the bonding end 121 of the flexible circuit board 120 corresponds to the bonding line 115 and The flexible circuit board 120 is placed on the anisotropic conductive film 130, and the flexible circuit board 120 can be kept substantially parallel to the touch panel surface. 099102067 Form No. A0101 0992004005-0 201126390 [0023] [0025] [0026] 0027] /step -. Providing - external force' enables the joint end of the difficult circuit board to be combined with the control panel through the anisotropic conductive film, and at the same time, under the action of the external force, the conductive of the heterogeneous electric energy Good #人 The protective layer contacts the bonding line. Specifically, the 'this step' can provide a thermal head on the side of the flexible circuit board (10) away from the opposite side of the conductive film 13G, along the vertical touch panel no The direction of the bonding end 12 of the flexible circuit board 120 1 applying an external force', the flexible circuit board 12A, the anisotropic conductive film (10) and the touch panel 11 0 ν' σ mouth are - body. Specifically, under the action of the external force, the anisotropic conduction The conductive particles 131 in the film 13G are embedded in contact with the gold (four) leg (1) of the bonding line 115, and on the other hand, the metal pin 12 of the bonding terminal 121 is contacted to obtain the metal pin of the bonding line U5. The metal pin 1211 of the bonding terminal 21 of 1151 is electrically connected by the conductive particles 131. Step 4: Remove the external force and complete the combination of the flexible circuit board and the touch panel. Please refer to the '(4) minus head, cold job, complete the electrical connection between the flexible circuit board 120 and the touch panel 11 。. Thus, the flexible circuit board 120 is electrically connected to the touch panel 110 through the anisotropic conductive film 13A, and the flexible circuit board 120 bonding method of the touch display device 1 is completed. Compared with the prior art, the flexible circuit board 120 bonding method of the touch display device 1 of the present invention and the touch display device 1 obtained by the method are based on the hard conductive in the anisotropic conductive film 130. Particle ι31 in external force 099102067 Form number Α0101 Page 10 / Total 21 page 0992004005-0 [0028] 201126390
，，嵌入該保護層116接觸該接合線路U ::電路板12。的接合端121與該觸控面板：現 ''路1丨5之間的電連祖 的接合 的軟性電路板12。結合方：二：觸控顯*裝置1。。 程的蛣合方法簡單且:本較:―刻製程或… [0029] 度U導電好131的直徑敍於該保制IB的厚 ’ _導電粒子131可以輕易穿過該保護層…， 路板12__控面板η㈣結合製程將更加簡 Ο [0030] 、以地，當该’電粒子131的硬度大於該金屬引腳的 硬度時’該金屬引腳1151在壓合過㈣^發生形變， 從而該接合端121的金屬引卿1211與該接合線路115的金 腳1151的電連接特性更好’即該軟牲電路板12〇與該 觸控面板11 〇的結合特性更好。 [0031] Ο 此外，需要說明的是，本發明觸控顯示裝置1〇〇中，實施 例中所示結構的觸控面板li0的第一導電層112通常也可 以電連接一包括多個金屬引腳的另_接合線路（圖未示） ，β亥另一接合線路用於與外部電路（如軟性電路板）結合 ，且也由保s蔓層覆蓋。所屬領域的一般技術人員應當理 解，與該第一導電層112電連接的另—接合線路也可以通 過“上述該軟性電路板120與該接合線路115的電連接方 法”與該外部電路電連接，此處不再贅述。 综上所述，本發明破已符合發明專利之要件，爰依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 099102067 表單編號Α0101 第Π頁/共21頁 0992004005-0 [0032] 201126390 式，本發明之範圍並不以上述實施例為限，該舉凡熟悉 本案技藝之人士援依本發明之精神所作之等效修飾或變 化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0033] 圖1是本發明觸控顯示裝置的立體分解示意圖。 [0034] 圖2是圖1所示觸控顯示裝置的各元件結合後的示意圖。 [0035] 圖3是圖2沿線II -11的剖面示意圖。 [0036] 圖4至圖6是圖3所示觸控顯示裝置的軟性電路板結合方法 的各步驟示意圖。 【主要元件符號說明】 [0037] 觸控面板 110 [0038] 軟性電路板 120 [0039] 異方性導電膜 130 [0040] 基底 111 [0041] 第一導電層 112 [0042] 絕緣層 113 [0043] 第二導電層 114 [0044] 接合線路 115 [0045] 保護層 116 [0046] 金屬引腳 1151 、 1211 [0047] 接合端 121 表單編號A0101 第12頁/共21頁 099102067 0992004005-0 131 201126390 [0048] 導電粒子The protective layer 116 is embedded in contact with the bonding line U::12. The joint end 121 and the touch panel: the flexible circuit board 12 of the junction of the electrical connection between the current roads 1 and 5. Binding side: two: touch display * device 1. . The coupling method of the process is simple and: this comparison: "engraving process or... [0029] The diameter of the U conductive 131 is described in the thickness of the protective IB' _ conductive particles 131 can easily pass through the protective layer ..., the board 12__Control panel η (four) bonding process will be more simple [0030], in the ground, when the hardness of the 'electro-particle 131 is greater than the hardness of the metal pin', the metal pin 1151 is deformed after pressing (four) The electrical connection characteristics of the metal lead 1211 of the joint end 121 and the gold foot 1151 of the joint line 115 are better, that is, the bonding characteristics of the soft board 12 〇 and the touch panel 11 更好 are better. [0031] In addition, it should be noted that, in the touch display device 1 of the present invention, the first conductive layer 112 of the touch panel li0 of the structure shown in the embodiment may also be electrically connected to include a plurality of metal leads. The other _ bonding line of the foot (not shown), the other bonding line of β hai is used for combining with an external circuit (such as a flexible circuit board), and is also covered by a smear layer. One of ordinary skill in the art will appreciate that another bond line electrically coupled to the first conductive layer 112 can also be electrically coupled to the external circuit by "the electrical connection method of the flexible circuit board 120 and the bond line 115 described above". I will not repeat them here. In summary, the invention has been in compliance with the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention 099102067 Form No. 101 0101 Page / Total 21 Page 0992004005-0 [0032] 201126390, the scope of the present invention is not limited to the above embodiment, Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0033] FIG. 1 is a perspective exploded view of a touch display device of the present invention. 2 is a schematic view showing the combination of the components of the touch display device shown in FIG. 1. 3 is a cross-sectional view of FIG. 2 taken along line II-11. 4 to FIG. 6 are schematic diagrams showing steps of a method for bonding a flexible circuit board of the touch display device shown in FIG. 3. [Main Component Symbol Description] [0037] Touch Panel 110 [0038] Flexible Circuit Board 120 [0039] Anisotropic Conductive Film 130 [0040] Substrate 111 [0041] First Conductive Layer 112 [0042] Insulation Layer 113 [0043 Second Conductive Layer 114 [0044] Bonding Line 115 [0045] Metallic Pins 1151, 1211 [0047] Bonding End 121 Form No. A0101 Page 12 / Total 21 Pages 099102067 0992004005-0 131 201126390 [ 0048] Conductive particles
〇 099102067 表單編號A0101 第13頁/共21頁 0992004005-0〇 099102067 Form No. A0101 Page 13 of 21 0992004005-0