201121397 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別涉及一種熱管散熱模組 〇 【先前技術】 [0002] 隨著電子產業之迅速發展，電腦系統之運作速度大幅度 提高，其產生之熱量亦隨之劇增，如何將所產生之熱量 及時散發出去，以保證電腦系統之正常運行，一直係業 者必需解決之問題。眾所周知，安裝於主機板上之中央 處理器係電腦系統之核心，當電腦運行時，中央處理器 產生熱量。過多之熱量會導致中央處理器無法正常運行 。為有效散發中央處理器於運行過程中產生之熱量，通 常於其上加裝一散熱裝置以便將其產生之熱量散發出去 〇 [0003] 先前之散熱裝置一般包括用於與電子元件結合之底座以 及設於底座上之複數散熱鰭片。底座通常為平滑之導熱 金屬板，其與電子元件表面熱接觸以直接吸收電子元件 所產生之熱量，進而將熱量通過熱傳導之方式傳遞至散 熱鰭片以向四周發散。隨著電腦系統尺寸之逐漸變小， 其中之電子元件會相應之集中化設置，其產生之熱量則 會更加集中，通過直接熱傳導之散熱方式使整個電腦系 統之熱量不能快速得以擴展。 【發明内容】 [0004] 有鑒於此，本發明旨在提供一種散熱效果較好之熱管散 熱模組。 098141795 表單編號A0101 第4頁/共18頁 0982071736-0 201121397 [0005] 一種熱管散熱模組，其包括一第/散熱組合用於對一承 載於一電路板上之一第一電子元件散熱。所述苐一散熱 組合包括一承載板、一用於與所述第一電子元件熱接觸 之導熱底座、一熱管以及一第一散熱片組。所述熱管包 括一蒸發段、一冷凝段以及連接於所述崧發段與冷凝段 之間之一連接段。所述導熱底座設置於所述承載板之底 面，所述第一散熱片組設置於所述承載板之頂面，所述 蒸發段與連接段水平設置於所述承載板之底面，所述蒸 發段夹設於所述導熱底座與所述承載板之間，所述冷凝 〇 段穿過所述承栽板延伸至所述承載板之頂面一側且穿設 ' ' 於所述第一散熱片組中。 [〇〇〇«與先前技術相比，本實施例之熱管散熱模組中，導熱底 座從電子元件所吸收之熱量通過熱管之蒸發段直接擴散 至第一散熱片組，從而及時將電子元件之熱量帶走’避 免熱量集中。 【實施方式】 〇 [0007]以下’將結合附圖及實施例對本技術方案之熱管散熱模 組進行詳細說明。 [0008] 如圖1所示，一電子裝置包括承載有第一電子元件110與 第二電子元件120之電路板100與用於對第一、二電子元 件110，120散熱之熱管散熱模組。該電子裝置於本實施 例中為一遊戲機主機，其中，第一電子元件110產生熱量 較多如CpU(中央處理器），第二電子元件120產生熱量 較少。 [0009] 熱管散熱模組包括—承載板2〇1、固定於承載板201之第 09814,795 表單編號麵 t 5 1/^ 18 I 0982071736-0 201121397 一散熱組合與第二散熱組合230。第一散熱組合用於對第 一電子元件110散熱，第二散熱組合230用於對第二電子 元件120散熱。承載板201於本實施例中為一風扇罩之底 蓋，該底蓋用以與一頂蓋（未圖示）配合，形成一具有 入風口及出風口之風扇罩’以將第一散熱組合、第二散 熱組合230與風扇（圖未杀）整合成於一起，形成—結構 緊凑、散熱效率高之散熱裝置。一併參閱圖4、5，承載 板201大致呈矩形板狀，其由導熱性能良好之金屬材料如 銅、鋁等通過衝壓方式製成。承載板2〇1之第—側部用於 裝設風扇且開有用於與風扇對應之第一開口 2〇2、與第一 侧部相鄰之第；侧部用於裝;配第一散熱組合、第二散熱 組合230。一擋板203自第丨開口 202之罪近承載板go】之 第二側部之邊緣、且自承載板2〇1之底f垂直向下延伸。 擋板203用作定位，以確定第一散熱組舍、第二散熱組合 230與第一電子元件11〇、第二電子元件120分別對應安 置’從而方便熱管散熱模組與電路板100之組裝。 [0010] —併參閱圖2、圖3，第一散熱組合包括導熱底座21〇、熱 官300以及第一散熱片組220。熱管300包括一蒸發段31〇 、一冷凝段320以及連接於蒸發段310與冷凝段320之間 之一連接段330 »蒸發段310為直線形，連接段330自蒸 發段310彎曲延伸’且蒸發段310與連接段330處於同一 平面内；冷凝段320自連接段330之自由端向與該平面垂 直或傾斜之另一平面内延伸。本實施例中，蒸發段310與 連接段330均水平設置於承載板201之底面，導熱底座 210設置於蒸發段31〇之上方且與承載板201之底面熱接 098141795 表單編號A0101 第6頁/共18頁 0982071736-0 201121397 [0011] ο [0012] Ο [0013] 098141795 觸，從而，蒸發段310夾設於導熱底座210與承載板201 之間。第一散熱片組220設置於承載板201之頂面，冷凝 段320穿過承載板201延伸至承載板201之頂面一側，且 冷凝段320穿設於第一散熱片組220中，從而將來自蒸發 段310之熱量直接傳遞至第一散熱片組220。 導熱底座210之侧面與擋板203熱接觸，導熱底座210之 靠近承載板201之底面開設一用於容置所述蒸發段310之 第一溝槽211，導熱底座210之頂面用於與第一電子元件 110熱接觸。承載板201開設一通孔204以供冷凝段320穿 過。 第一散熱片組220包括一垂直設置於所述承載板201之頂 面之導熱板221 '自導熱板221之内側面垂直向内延伸之 二組第一散熱片222以及導熱板221之外側面垂直向外延 伸之複數個第二散熱片223。導熱板221之内侧面開設一 用於容置所述冷凝段之第二溝槽2210，二組第一散熱片 222分佈於第二溝槽2210之兩側。第一散熱片222、第二 散熱片223均平行於承栽板201 〇第一散熱片222設置於 承載板201之第一側部之頂面之一端，複數個第二散熱片 223之外邊緣與承載板2〇1之一邊緣相齊平。 第二散熱組合230包括一固定於承載板2〇1之底面之基座 231及自該基座231垂直延伸之複數個散熱片232。承載 板201開設一與導熱底座21〇相鄰之第二第二開口 2〇5， 基座231固定於第二開口 205之周邊，複數個散熱片232 穿過第二開口 205延伸至承載板2〇1之頂面一側。第二電 子元件120與基座231之底面熱接觸。本實施例中，第二 表單蝙號Α0101 第7頁/共18頁 0982071736-0 201121397 散熱組合230用於對產生較少熱量之第二電子元件12〇散 熱，因此未整合熱管。 [0014] [0015] 為使設置於承載板201之第一側部之風扇所產生之冷卻氣 流能夠於第一散熱片組220之氣流通道與第二散熱組合 2 3 0之氣流通道中父叉流動，以快速散發整個電子裝置之 熱量，將第二散熱組合230與第一散熱片組22〇分別設置 於承載板201之第二側部之兩端。第二散熱組合23〇之複 數個散熱片232包括靠近承載板2〇1之一邊緣一高散熱片 組2321與與該高散熱片組2321相鄰之一低散熱片組2322 。第一散熱片組220之二組第一散熱片222延伸至第二散 熱組合230之低散熱片組2322之上方並與高散熱片組 2321相齊平》熱管散熱模組工作時，風扇所產生之冷卻 氣流從承載板201之第一側部流向第二側部’並同時進入 第一散熱片組220與第二散熱組合230之氣流通道中，以 同時將第一散熱片組220與第二散熱組合23〇之熱量帶走 〇 可以理解，本實施例芝熱管散熱模叙中，第一散熱組合 、第二散熱組合230均可以通過螺釘鎖合、焊接等常規之 固定方式較於承栽板2〇1上。另外，根據第-電子元件 110發熱量之大小，亦可以設置兩個或兩個以上之熱管 300，用於同時對第—電子元件110散熱。例如，將二熱 管300之蒸發段310、連接段33〇平行、水平設置於承載 板201之頂面’二平行之冷凝段32G穿過承載板2〇1冰穿 設於第-散熱片組22G中。二平行之蒸發段31G夾設於導 熱底座210與承載板2〇1之間。二平行之冷凝段32〇可分 098141795 表單編號A0101 第8頁/共18頁 0982071736-0 201121397 [0016] 別穿設於第一散熱片222、第二散熱片223中，或者導熱 板221開設二平行之第二溝槽2210容置二平行之冷凝段 320。另外，根據電子裝置之電路板100上所需散熱之電 子元件之個數，可以相應之於承載板201上加設第一散熱 組合、第二散熱組合230等散熱裝置。 導熱板221之内側面垂直向内延伸之二組第一散熱片222 以及導熱板221之外側面垂直向外延伸之複數個第二散熱 片 223。 〇 [0017] 電子裝置工作時，第一電子元件110與第二電子元件120 於運行中產生熱量，第一電子元件110之熱量通過導熱底 座210快速傳遞給熱管300之蒸發段310，熱量繼而通過 冷凝段320迅速傳遞給第一散熱片組220，從而通過風扇 所產生之冷卻氣流將熱量及時帶走。第二電子元件120產 生之熱量通過第二散熱組合230之基座231擴散至複數個 散熱片232，進而通過風扇所產生之冷卻氣流將熱量及時 帶走。 Ο [0018] 相較先前技術，本實施例之熱管散熱模組中，通過熱管 300直接將產生熱量較多之第一電子元件110之熱量迅速 擴散至第一散熱片組220，進而通過風扇所產生之冷卻氣 流將熱量及時帶走，從而避免熱量集中。另外，考慮到 成本，對於發熱量較小之電子元件（如第二電子元件120) 可配合裝設無熱管之散熱裝置（如第二散熱組合230)進行 散熱，從而於確保散熱效率之同時降低成本。 [0019] 綜上所述，本發明符合發明專利要件，爰依法提出專利 098141795 表單編號A0101 第9頁/共18頁 0982071736-0 201121397 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，於爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0020] 圖1為本技術方案實施例之電子裝置之立體組合圖。 [0021] 圖2為圖1之電子裝置之倒置之立體分解圖。 [0022] 圖3為圖2之電子裝置中熱管散熱組合之部分分解圖。 [0023] 圖4為圖3之熱管散熱組合之整體分解圖。 [0024] 圖5為圖4之倒置圖。 【主要元件符號說明】 [0025] 電路板：100 [0026] 第一電子元件： 110 [0027] 第二電子元件： 120 [0028] 承載板：201 [0029] 第一開口 ： 202 [0030] 通孔：204 [0031] 第二開口 ： 205 [0032] 擋板：203 [0033] 導熱底座：210 [0034] 第一溝槽：211 [0035] 第一散熱片組： 220 表單編號A0101 098141795 第10頁/共18頁 0982071736-0 201121397 [0036] 導熱板：221 [0037] 第二溝槽：2210 [0038] 第一散熱片：222 [0039] 第二散熱片：223 [0040] 第二散熱組合：230 [0041] 基座：231 [0042] 散熱片：232 〇 [0043] 高散熱片組：2321 [0044] 低散熱片組：2322 - [0045] 熱管：300 [0046] 蒸發段：310 [0047] 冷凝段：320 〇 [0048] 連接段：330 ρΓ〇，:_; 4 \ f 1 = f fi;''诛 、:斗产！ i 3 098141795 表單編號A0101 第11頁/共18頁 0982071736-0201121397 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a heat sink device, and more particularly to a heat pipe heat sink module [Prior Art] [0002] With the rapid development of the electronics industry, the operation of a computer system The speed is greatly improved, and the heat generated by it is also increasing rapidly. How to dissipate the generated heat in time to ensure the normal operation of the computer system has always been a problem that the system must solve. As is known, the central processor installed on the motherboard is the core of the computer system, and the central processor generates heat when the computer is running. Excessive heat can cause the central processor to not function properly. In order to effectively dissipate the heat generated by the central processing unit during operation, a heat dissipating device is usually added to dissipate the heat generated by the central processing unit. [0003] Previous heat dissipating devices generally include a base for combining with electronic components. A plurality of fins disposed on the base. The base is usually a smooth, thermally conductive metal plate that is in thermal contact with the surface of the electronic component to directly absorb the heat generated by the electronic component, thereby transferring heat to the heat sink fins to divergence around. As the size of computer systems becomes smaller, the electronic components will be centrally set accordingly, and the heat generated will be more concentrated. The heat dissipation of the entire computer system cannot be quickly expanded by the direct heat conduction. SUMMARY OF THE INVENTION [0004] In view of the above, the present invention is directed to a heat pipe heat dissipation module having a better heat dissipation effect. 098141795 Form No. A0101 Page 4 of 18 0982071736-0 201121397 [0005] A heat pipe heat dissipation module comprising a first/heat dissipation combination for dissipating heat from a first electronic component carried on a circuit board. The heat dissipation assembly includes a carrier plate, a thermally conductive base for thermal contact with the first electronic component, a heat pipe, and a first heat sink assembly. The heat pipe includes an evaporation section, a condensation section, and a connection section connected between the burst section and the condensation section. The heat conducting base is disposed on a bottom surface of the carrier plate, the first heat sink group is disposed on a top surface of the carrier board, and the evaporation section and the connecting section are horizontally disposed on a bottom surface of the carrier board, and the evaporation a segment is interposed between the heat-conducting base and the carrier plate, and the condensing section extends through the bearing plate to a side of the top surface of the carrier plate and is disposed through the first heat dissipation In the group. [〇〇〇« Compared with the prior art, in the heat pipe heat dissipation module of the embodiment, the heat absorbed by the heat conduction base from the electronic component is directly diffused to the first heat sink group through the evaporation section of the heat pipe, thereby timely putting the electronic component Take away heat 'to avoid heat concentration. [Embodiment] [0007] Hereinafter, a heat pipe cooling module of the present technical solution will be described in detail with reference to the accompanying drawings and embodiments. As shown in FIG. 1, an electronic device includes a circuit board 100 carrying a first electronic component 110 and a second electronic component 120, and a heat pipe cooling module for dissipating heat from the first and second electronic components 110, 120. The electronic device is a game console in this embodiment, wherein the first electronic component 110 generates more heat such as CpU (Central Processing Unit), and the second electronic component 120 generates less heat. [0009] The heat pipe heat dissipating module comprises a carrier plate 2 〇1, a 09814, 795 form numbering surface fixed to the carrier plate 201, and a heat dissipation combination and a second heat dissipation combination 230. The first heat sink combination is used to dissipate heat from the first electronic component 110, and the second heat sink assembly 230 is used to dissipate heat from the second electronic component 120. In this embodiment, the carrier plate 201 is a bottom cover of a fan cover. The bottom cover is configured to cooperate with a top cover (not shown) to form a fan cover having an air inlet and an air outlet to combine the first heat dissipation. The second heat dissipation combination 230 is integrated with the fan (not shown) to form a heat dissipation device with compact structure and high heat dissipation efficiency. Referring to Figures 4 and 5 together, the carrier plate 201 is substantially rectangular in shape and is formed by stamping from a metal material having good thermal conductivity such as copper or aluminum. The first side portion of the carrying plate 2〇1 is for mounting a fan and has a first opening 2〇2 corresponding to the fan, and a first side adjacent to the first side portion; the side portion is for mounting; Combination, second heat sink combination 230. A baffle 203 extends from the edge of the second opening of the second side of the carrier plate 202 and extends vertically downward from the bottom f of the carrier plate 2〇1. The baffle 203 is used for positioning to determine that the first heat dissipation assembly and the second heat dissipation assembly 230 are respectively disposed corresponding to the first electronic component 11 and the second electronic component 120 to facilitate assembly of the heat pipe heat dissipation module and the circuit board 100. [0010] Referring to Figures 2 and 3, the first heat sink assembly includes a thermally conductive base 21, a thermal assembly 300, and a first heat sink assembly 220. The heat pipe 300 includes an evaporation section 31, a condensation section 320, and a connection section 330 connected between the evaporation section 310 and the condensation section 320. The evaporation section 310 is linear, and the connection section 330 is bent and extended from the evaporation section 310. Segment 310 is in the same plane as connecting segment 330; condensation segment 320 extends from the free end of connecting segment 330 into another plane that is perpendicular or oblique to the plane. In this embodiment, the evaporation section 310 and the connection section 330 are horizontally disposed on the bottom surface of the carrier board 201. The heat conduction base 210 is disposed above the evaporation section 31〇 and is thermally connected to the bottom surface of the carrier board 201. 098141795 Form No. A0101 Page 6/ A total of 18 pages 09820717736-0 201121397 [0012] Ο [0013] 098141795 touch, whereby the evaporation section 310 is sandwiched between the thermally conductive base 210 and the carrier plate 201. The first heat sink group 220 is disposed on the top surface of the carrier plate 201 , the condensation portion 320 extends through the carrier plate 201 to the top surface side of the carrier plate 201 , and the condensation portion 320 is disposed in the first heat sink group 220 , thereby The heat from the evaporation section 310 is transferred directly to the first fin set 220. The side of the heat-conducting base 210 is in thermal contact with the baffle 203. The bottom surface of the heat-conducting base 210 is adjacent to the bottom surface of the supporting plate 201. A first groove 211 is formed for receiving the evaporation section 310. An electronic component 110 is in thermal contact. The carrier plate 201 defines a through hole 204 for the condensation section 320 to pass through. The first heat sink group 220 includes a heat conducting plate 221 ′ vertically disposed on a top surface of the carrier plate 201. Two sets of first heat sinks 222 extending perpendicularly inward from an inner side surface of the heat conducting board 221 and outer sides of the heat conducting board 221 a plurality of second fins 223 extending vertically outward. A second groove 2210 is formed in the inner side of the heat conducting plate 221 for accommodating the condensation section. The two sets of first heat sinks 222 are distributed on two sides of the second groove 2210. The first heat sink 222 and the second heat sink 223 are both parallel to the bearing board 201. The first heat sink 222 is disposed at one end of the top surface of the first side of the carrier board 201, and the outer edges of the plurality of second heat sinks 223 It is flush with one edge of the carrier plate 2〇1. The second heat dissipation assembly 230 includes a base 231 fixed to the bottom surface of the carrier board 201 and a plurality of heat sinks 232 extending perpendicularly from the base 231. The carrier plate 201 defines a second second opening 2〇5 adjacent to the heat conducting base 21〇. The base 231 is fixed to the periphery of the second opening 205, and the plurality of heat sinks 232 extend through the second opening 205 to the carrier board 2顶1 on the top side. The second electronic component 120 is in thermal contact with the bottom surface of the susceptor 231. In this embodiment, the second form bat number 1010101 page 7/18 page 0982071736-0 201121397 The heat dissipation combination 230 is used to dissipate heat from the second electronic component 12 that generates less heat, so the heat pipe is not integrated. [0015] [0015] The cooling airflow generated by the fan disposed on the first side of the carrier plate 201 can be used in the airflow channel of the first heat sink group 220 and the airflow channel of the second heat dissipation combination 230. Flowing to quickly dissipate heat of the entire electronic device, the second heat dissipation assembly 230 and the first heat dissipation fin group 22 are respectively disposed at two ends of the second side portion of the carrier plate 201. The plurality of heat sinks 232 of the second heat dissipation assembly 23 include a high heat sink group 2321 adjacent to one of the edges of the carrier board 2〇1 and a low heat sink group 2322 adjacent to the high heat sink group 2321. The first heat sink 222 of the first heat sink group 220 extends above the low heat sink group 2322 of the second heat dissipation assembly 230 and is flush with the high heat sink group 2321. When the heat pipe heat dissipation module works, the fan generates The cooling airflow flows from the first side of the carrier plate 201 to the second side portion and simultaneously enters the airflow passages of the first heat sink group 220 and the second heat dissipation assembly 230 to simultaneously set the first heat sink group 220 and the second heat sink group 220 It can be understood that the heat dissipation combination of 23 〇 is carried out. In the heat dissipation model of the embodiment, the first heat dissipation combination and the second heat dissipation combination 230 can be fixed by a conventional method such as screwing and welding. 2〇1. Further, depending on the amount of heat generated by the first electronic component 110, two or more heat pipes 300 may be provided for simultaneously dissipating heat to the first electronic component 110. For example, the evaporation section 310 and the connection section 33 of the two heat pipes 300 are parallel and horizontally disposed on the top surface of the carrier plate 201. The two parallel condensation sections 32G pass through the carrier plate 2〇1 and are disposed on the first heat sink group 22G. in. The two parallel evaporation sections 31G are interposed between the heat conduction base 210 and the carrier plate 2〇1. The two parallel condensation sections 32 〇 can be divided into 098141795. Form No. A0101 Page 8 / Total 18 pages 0982071736-0 201121397 [0016] Don't wear in the first heat sink 222, the second heat sink 223, or the heat conductive board 221 The parallel second grooves 2210 accommodate two parallel condensation sections 320. In addition, according to the number of electronic components required to dissipate heat on the circuit board 100 of the electronic device, a heat dissipating device such as a first heat dissipating combination and a second heat dissipating combination 230 may be added to the carrier board 201. Two sets of first fins 222 extending perpendicularly inwardly from the inner side surface of the heat conducting plate 221 and a plurality of second fins 223 extending outwardly from the outer side of the heat conducting plate 221 are formed. [0017] When the electronic device is in operation, the first electronic component 110 and the second electronic component 120 generate heat during operation, and the heat of the first electronic component 110 is quickly transmitted to the evaporation section 310 of the heat pipe 300 through the heat conduction base 210, and the heat is passed through The condensing section 320 is quickly transferred to the first fin group 220, so that the heat is taken away in time by the cooling airflow generated by the fan. The heat generated by the second electronic component 120 is diffused to the plurality of heat sinks 232 through the pedestal 231 of the second heat dissipation assembly 230, and the heat is quickly taken away by the cooling airflow generated by the fan. [0018] Compared with the prior art, in the heat pipe heat dissipation module of the embodiment, the heat of the first electronic component 110 that generates more heat is directly diffused to the first heat sink group 220 through the heat pipe 300, and then passes through the fan. The resulting cooling airflow takes heat away in time to avoid heat concentration. In addition, in consideration of cost, an electronic component (such as the second electronic component 120) having a small amount of heat can be dissipated with a heat dissipating device (such as the second heat dissipating combination 230), thereby reducing heat dissipation efficiency. cost. [0019] In summary, the present invention meets the requirements of the invention patent, and patents are filed according to law. 098141795 Form No. A0101 Page 9/18 pages 0982071736-0 201121397 Application. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0020] FIG. 1 is a perspective assembled view of an electronic device according to an embodiment of the present technical solution. 2 is an exploded, isometric view of the electronic device of FIG. 1. [0021] FIG. 3 is a partial exploded view of a heat pipe heat dissipation combination in the electronic device of FIG. 2. 4 is an overall exploded view of the heat pipe heat dissipation assembly of FIG. 3. 5 is an inverted view of FIG. 4. [Main component symbol description] [0025] Circuit board: 100 [0026] First electronic component: 110 [0027] Second electronic component: 120 [0028] Carrier plate: 201 [0029] First opening: 202 [0030] Hole: 204 [0031] Second opening: 205 [0032] Baffle: 203 [0033] Thermally conductive base: 210 [0034] First groove: 211 [0035] First heat sink set: 220 Form No. A0101 098141795 No. 10 Page 18 of 18082207736-0 201121397 [0036] Thermal Conductive Plate: 221 [0037] Second Trench: 2210 [0038] First Heat Sink: 222 [0039] Second Heat Sink: 223 [0040] Second Heat Dissipation Combination : 230 [0041] Base: 231 [0042] Heat sink: 232 〇 [0043] High heat sink set: 2321 [0044] Low heat sink set: 2322 - [0045] Heat pipe: 300 [0046] Evaporation section: 310 [ 0047] Condensation section: 320 〇 [0048] Connection section: 330 ρΓ〇,:_; 4 \ f 1 = f fi; ''诛,: 斗产! i 3 098141795 Form No. A0101 Page 11 of 18 0982071736-0