201121030 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種針對發光一極體晶片整合驅動積體電路晶 片所構成的發光組件’能令發光二極體晶片出光亮度不減損，及 混光時的配光曲線，可以呈現規則與穩定的封裝方法，尤指一種 具驅動積體電路晶片的L ED發光組件封裳方法。 【先前技術】 按，L E D發光二極體晶片與驅動積體電路晶片整合在一起形 成一發光組件的設計，如中華民國證書號數第丨2 4 2 2 9 9號 「發光二極體整合驅動晶片」發明專利案，證書號數第〗3 ^ 9 4 5號「-種封裝體内建發光二極體晶片及電流驅動積體電路 晶片之發光半導體組件」發明專鶴，及證書號數5 6 2 3 2號「整合驅動機制的發光^體結構」新型專利案，雖可達 外加㈣電路，簡化接腳數目，減少電路面積’降低雜訊，201121030 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting assembly formed by integrating a driver integrated circuit chip for a light-emitting monolithic wafer, which can make the brightness of the light-emitting diode wafer not detracted, and The light distribution curve of light can present a regular and stable packaging method, especially a method for sealing a L ED light-emitting component with a driver integrated circuit chip. [Prior Art] According to the LED light-emitting diode chip and the driver integrated circuit chip integrated to form a light-emitting component design, such as the Republic of China certificate number No. 2 4 2 2 9 9 "light-emitting diode integrated drive Wafer" invention patent case, certificate number No. 3 ^ 9 4 5 "---------------------------------------------------------------------------------------------------------------------------------------- 6 2 3 No. 2 "Integrated drive mechanism of the illuminating body structure" new patent case, although it can be added to the (four) circuit, simplifying the number of pins, reducing the circuit area 'reducing noise,
Fn 轉目的，然而’當驅動積體電路；（1 C)與L 電路極體^整合封存在—個封I體中時，由於驅動積體 -極體b/C)问度（至少1 Qmil以上），遠高於LED發光 一極體晶片（約4mil)的古Fn turns to the target, however, 'when driving the integrated circuit; (1 C) and the L circuit body are integrated in the sealed body, due to the drive integrated body - polar body b / C) (at least 1 Qmil Above), much higher than the LED light-emitting one-pole wafer (about 4mil)
ED發光二娜日 且—般封裝體内部空間有限’ L 在1，^/^與驅動積體電路晶片（IC)透過膠材封裳 透明封裝膠用的高折射率 '高穿透性L E D封裝專用 的高度將影_ 封裝軸，驅_電路“（1 C ) 光—極體晶片的出光，如圖1，造成混 201121030ED luminescence and the inner space of the package is limited 'L in the high-refractive-index high-impact LED package for the 1, ^/^ and driver integrated circuit wafers (IC) through the plastic package The dedicated height will be shadow _ package shaft, drive _ circuit "(1 C) light-pole wafer light, as shown in Figure 1, resulting in 201121030
光後配光曲線呈現不規則（不穩定）狀（發光品質不良）；又，驅 動積體電路晶片（Ic)的面積或體積，遠大於一般封裝用L E D發光二極體晶片的面積或體積，且驅動積體電路晶片（j c) 材質為Si ’此材質會吸光，l E D發光二極體晶片的光，直接或 間接照射在驅動積體電路晶片（j c)上的將被（材質）吸收， 無法反射出封裝體外，經檢測得平均亮度為1 497(cd)，明顯已造 成出光兗度之損失。或許，在封裝體上把驅動積體電路晶片（j C)與L E D發光二極體晶片隔離封裝的作法，可以改善上述混 光配光崎残瓶亮度敎的問題，唯卻會因此造成導電架設 冲及導電線連接的加王複^!性提冑（成本增加），非最佳的解決之 道；如何在不須提高加卫成本的_下，有效使配光曲線呈現規 則及出光亮度不減損，為當今絲所_努力克服的—項困難。 【發明内容】 本發明之主要目_在提供-種具鶴频魏晶片的l e ==_法’係，基賴之封裝㈣上承載相互電 ==糖綱継少—陳嶋片，且由該 、動積體電路晶片與進_完成·導接後，在該封裝面端上 材；將該霧化膠材抽真空，並注入針筒中再減^拌成霧化勝 一…· τ种再抽真空後，對該封裝 使霧化膠材 ;其中’該麵H般標_率叫i ，的透明聚二甲基樣副膠材，添加在高折射: yPe)的透明㈣基笨基魏魅膠材中均勻混合： 朴— 叫同甲冉抽真空插 之封裝面端上灌注；最後，由琪烤加工程序， 201121030The post-light distribution curve exhibits an irregular (unstable) shape (poor light quality); in addition, the area or volume of the integrated integrated circuit chip (Ic) is much larger than the area or volume of the general package LED light-emitting diode wafer. And the driving integrated circuit chip (jc) is made of Si' material which absorbs light, and the light of the l ED light emitting diode wafer is directly or indirectly irradiated on the driving integrated circuit chip (jc) to be absorbed by (material). Can not reflect out of the package body, the average brightness detected is 1 497 (cd), which has obviously caused the loss of light intensity. Perhaps, the method of isolating and packaging the integrated circuit chip (j C) and the LED light-emitting diode chip on the package body can improve the brightness of the light-mixing light-storing bottle, but the conductive erection And the connection of the conductive wire plus Wang Fu ^! Sexuality (cost increase), non-optimal solution; how to effectively make the light distribution curve present and the brightness is not degraded without increasing the cost of the reinforcement For the current silk, _ efforts to overcome - difficult. SUMMARY OF THE INVENTION The main object of the present invention is to provide a type of le ==_method of a crane-frequency Wei wafer, and the encapsulation of the base (four) carries an electric charge == saccharide 継 less - Chen 嶋 film, and After the moving body circuit wafer is completed and guided, the material is coated on the surface of the package surface; the atomized rubber material is vacuumed, and injected into the syringe tube to be reduced into a fog to win one...· τ species After vacuuming, the package is made of an atomized glue; wherein the surface of the surface is called H, the transparent polydimethyl-like sub-gel is added to the high refractive index: yPe). Uniform mixing in the charm glue: Park - called the same side of the same jacket, vacuum filling the end of the package surface; Finally, by Qi baking process, 201121030
在該封裝面端上固化定型得到霧化封裴膠體；藉由霧化封裝膠體 對光的穿透產生霧化（型態）作用，俾避免或減少驅動積體電路 晶片吸收到發光二極體晶片的亮光，據以令發光二極體晶片的出 光7C度不減損，及混光時的配光曲線，可以呈現規則而穩定。 本發明之次-目的係在提供—種具驅動積體電路晶片的L E D發光組件封裝方法’其中，該聚二甲基魏綱膠材添加在聚 甲基笨基石夕氧烧主膠材中均勻混合授掉成霧化膠材，該聚二甲基 矽氧烧副膠材與聚甲基苯基石夕氧烧主膠材的混合比例為工比工〇 (1 · 1 Q );據以副騎與轉材均妓合制在雌基座體上 對驅動積體電路“與料二極體晶片封裝形捕化封裝膠體， 可有效對光的穿透產生霧化的效果。 本發明之另-目的係在提供—種具驅動频電路晶片的U 發光、、鱗封袭方法’其中，該聚二甲基魏烧轉添聚甲基苯 =氧烧轉射均㈣錢拌捕化騎， 基—主膠材是以5比95(5: 2 0 比 8〇 (ρπ · βπ、 騎，據咐脾^ 1混膠，皆可得霧化效果的霧化 ==依封裝基座體4封_條件或需求 行封裝，構成霧化封裝膠體對積體電路晶片與發光二極體晶片進 【實施方式】 如圖 .種具鄉频電料料led魏組件封裝方法’ 201121030 2係封裝基座體10之封裝面端上承載相互電性連接的一驅 動積體電路晶片2 Q與至少—發光二極體晶片3 0 (可以是包含 R、G、B三色光的led)，且由該驅動積體電路晶片2 〇與進 出接點完成電性導接後，在該縣面端上進行賴4 Q封裝；其 中該膠體4 ◦封裝，如圖3、4、5，是取-般標準（1.41)折 射率（Methyl Type)的透明聚二曱基石夕氧院（化學式如圖4)副 膠材4 1添力〇在* ( 1 53 )折射率（phenyl 丁㈣）的透明聚甲基 笨基石夕尬(化學式如圖5)主轉4 2巾羽混合勝成霧化ς 材4 3，將該霧化膠材4 3抽真空，並注人針筒5 〇中再抽真空 後’如圖2、3，對該封裝其座體10之封裝面端上灌注；最後， 由供烤加工程序’使霧化膠材4 3在該封裝面端上固化定型，得 到霧化封裝频4 Q ;藉由霧化封裝膠體4 0對光的穿透產生霧 化（型_)侧’俾避免或減少鶴雜電路晶片2 〇吸收到發 光一極體晶片3 Q的亮光’據以令發光二極體晶片3 0的出光亮 度不減相’及混光時魏光曲線，可以呈現酬而穩定。 亦即’利用上述實施例，如圖2 ’絲化封裝膠體！ 〇對光 牙透所產生哺化作用和（_)透明封裝賴作亮度數據與檢 疋/刀析比#父（如表-、二）’（制）透鴨裝賴出光的平均亮 度是M97(Cd)，而（本發明）霧化封裝膠體4 0出光的平均亮度 疋1.68〇(ed)，（本發明）霧化封|膠體4 〇出光亮度增加1公％ ; 且在檢驗（本發明）霧化封裝膠體4 ◦的混光後配光曲線，如。圖 6 ’配合曲線_得到改善，呈現删而穩定。 201121030 根據上述實施例，其中，該聚二尹基矽氧烷副膠材4上添加在 聚甲基苯基石夕氧炫主谬材42中均勻混合授拌成霧化耀材43， 該聚二f基錄制膠材4 1與舒絲基錄炫主膠材4 2是 以5比95(5··95)〜20比8〇(2〇:8〇)的比例混 膠’皆可得霧化效果的霧化膠材4 3，據以依封裝基座體工〇或 封裝空間條件或需求的不同變化，可嬉_，得_期對光改 善配光曲線及歧亮度不損失的雜騎43，朋在封裝基座 體1〇上對積體電路晶片2 〇與發光二極體晶片3 〇進行封^， 構成霧化封裝膠體4 〇。 上拥對本發明而言只是說明性的，而非限制性的，本領 ，普通技術人貞理解’在傾離所職明書要求躲定的精神和Curing and setting at the end of the package surface to obtain an atomized sealing colloid; atomizing (type) by atomizing the encapsulating colloid to penetrate light, and avoiding or reducing absorption of the driving integrated circuit wafer to the light emitting diode The brightness of the wafer is such that the light output of the light-emitting diode wafer is not degraded by 7C degrees, and the light distribution curve at the time of light mixing can be regular and stable. The second objective of the present invention is to provide an LED light-emitting component packaging method for driving a semiconductor integrated circuit chip, wherein the polydimethyl Weigang rubber material is uniformly added to the polymethyl ketone base gas-oxygen main rubber material. Mixedly transferred into an atomized rubber material, the mixing ratio of the polydimethyl oxime-burning sub-gel material and the polymethyl phenyl oxy-oxygen main rubber material is a work ratio (1 · 1 Q ); Both the riding and the rotating material are combined on the female base body to drive the integrated circuit "with the material diode package-shaped trapping encapsulation colloid, which can effectively atomize the light to produce atomization effect. - The purpose is to provide a U-lighting and scale-encapsulation method for a chip with a driving frequency circuit. Among them, the polydimethyl-dicarboxylic-transfer-added polymethylbenzene=oxygen-burning conversion (four) money is mixed and captured. Base - the main glue is 5 to 95 (5: 20 to 8 〇 (ρπ · βπ, riding, according to spleen ^ 1 mixed glue, can be obtained atomization effect of atomization == according to the package base body 4 Encapsulation_condition or demand line encapsulation, forming an atomized encapsulation colloid on the integrated circuit chip and the light-emitting diode wafer [embodiment] As shown in the figure, the township frequency electric material led Component packaging method '201121030 2 packaged base body 10 on the package surface end carrying a driving integrated circuit chip 2 Q and at least - LED array 3 0 (may be included R, G, B After the LEDs of the three-color light are electrically connected by the driving integrated circuit chip 2 and the access contacts, the Lai 4 Q package is performed on the surface of the county; wherein the colloid 4 is packaged, as shown in FIG. 3 . 4, 5, is a standard (1.41) refractive index (Methyl Type) of transparent polyphthalocyanine (Oxygen Figure 4) sub-adhesive material 4 1 force 〇 at * ( 1 53 ) refractive index ( Phenyl butyl (4)) transparent polymethyl stupid base stone (chemical formula shown in Figure 5) main turn 4 2 towel feathers mixed into atomized ς material 4 3, the atomized rubber material 4 3 vacuum, and injection syringe 5 After vacuuming in the crucible, as shown in Fig. 2 and Fig. 3, injecting the package surface end of the package body 10; finally, curing the atomization adhesive material 4 on the package surface end by the baking processing program Stereotype, get the atomization package frequency 4 Q; generate atomization (type_) side by the atomization of the encapsulation colloid 40 to avoid the light circuit chip 2亮 absorbing the illuminating light of the illuminating monopolar wafer 3 Q according to the brightness of the illuminating diode chip 30 without degrading the phase and the dimming curve of the mixed light, can be rewarded and stabilized. For example, as shown in Figure 2, 'Silkized encapsulant colloid! 〇The effect of feeding on the light-toothing and (_) transparent packaging depends on the brightness data and the inspection/knife ratio #父(如表-,二)' The average brightness of the light emitted by the duck is M97 (Cd), and the average brightness of the atomized encapsulant 40 of the present invention is 疋1.68 〇 (ed), (the present invention) the atomization seal|colloid 4 An increase of 1% by weight; and in the inspection (invention) of the atomized encapsulant 4 ◦ after the light mixing curve, such as. Figure 6 'fit curve _ is improved, showing a definite and stable. According to the above embodiment, wherein the polydioxin-based oxane sub-rubber 4 is uniformly mixed and mixed into the polymethylphenyl oxyxan main stalk 42 to be mixed into an atomized blaze 43 F-based recording glue 4 1 and Shusiji recording dazzle main glue 4 2 is 5 to 95 (5 · · 95) ~ 20 to 8 〇 (2 〇: 8 〇) ratio of mixing glue The atomized adhesive material of the effect is 4 3, according to the different conditions of the package base work or packaging space conditions or needs, can be used to improve the light distribution curve and the loss of brightness without loss of the ride 43. The integrated circuit chip 2 〇 and the light-emitting diode chip 3 在 are sealed on the package base body 1 to form an atomized encapsulant 4 〇. The present invention is merely illustrative and not limiting, and the skilled person understands that the spirit of
把圍的情况下’可做出許多修改、變化或等效，但都將落入本於 明的保護範圍内。 X 【圖式簡單說明】 Φ目1係f闕裝方法所得透明封裝膠體的配光曲線圖. 圖2係本發明方法實施的封裹體構造示意圖 圖3係本發明方法霧化膠材配膠與灌注流程示意圖 圖4係本發明方法聚二曱基石夕氧烧副膠材的化學式示意圖 圖5係本發明方法聚曱基苯基石夕氧烧主朦材的化學式示意圖 圖6係本發明方法霧化封裝膠體的配光曲線圖 201121030 【附表】 表一：亮度數據與檢定分析表 表二：透明封裝膠體與霧化封裝膠體亮度比較表 【主要元件符號說明】 封裝基座體10 驅動積體電路晶片2 0 發光二極體晶片3 0 膠體4 0 副膠材4 1 主膠材4 2 霧化膠材4 3 針筒5 0Many modifications, changes, or equivalents may be made in the context of the encirclement, but all fall within the scope of this invention. X [Simple diagram of the drawing] Φ mesh 1 system f armoring method obtained by the transparent encapsulation of the light distribution curve. Figure 2 is a schematic diagram of the structure of the sealing body implemented by the method of the present invention Figure 3 is the method of the present invention atomized rubber material with glue Schematic diagram of the perfusion processFig. 4 is a schematic diagram of the chemical formula of the polydidecyl sulfonium sub-rubber of the method of the present invention. FIG. 5 is a schematic diagram of the chemical formula of the polydecyl phenyl oxy-oxygen main crucible of the method of the present invention. FIG. The light distribution curve of the encapsulation colloid 201121030 [Schedule] Table 1: Luminance data and verification analysis table Table 2: Comparison of transparent encapsulation colloid and atomization encapsulation colloid brightness [Main component symbol description] Package base body 10 drive integrated body Circuit chip 2 0 LED chip 3 0 Colloid 4 0 Sub-adhesive 4 1 Main glue 4 2 Atomized glue 4 3 Syringe 5 0