201117690 六、發明說明： 【發明所屬之技術領域】 本杂明大致上係關於電子元件的製/ 關使用導電彈性物質將-或多個 寺職，係有 件的裝配中。 夕概動兀件，直接肷入於電子器 【先前技術】 、 f連。例如，導電彈性物質被用在接===電路的 面的接觸，用於陣列式封裝的ί 33連，故為 ΓΪ^ 請内容，聲明具有優先權。、国弟6ν244,861號的臨時專利申 造出一含多生產配製的一個方法。製 係數的導電彈性物皙子器件或基板。將有不同電阻 擇-組特域的接鱗塾上。選 或基板上的“ _二電：二質 =、在 將可直接錢在_上作所需的被動元件， 阻係數的導電彈性更大的好處。使用不同電 以大量減少在目椤+^ 焊墊中，嵌入各種的結構，可 元件所佔·彳電路板上，被動 臺上正常操作所必須補了電子器件在目標平 、 使用導电彈性物質將電性結構直 201117690 接嵌入於接觸焊墊中，右 減少被動it件的打奸產品贼配’經由 同於傳統對於導電彈性^^用進=降低了製造的成本。不 前的發明，使，僅注重它的高電導度，目 含了絕缓强柯也同―電係數的導電彈性物質，其中也包 的被動元件可ΐχΐ接^接觸·的材料，使得單—的或複合 中，二建於電子器件或電子封裝的接觸焊墊 τ 1…，口無知知電子產品的組裝使用。 纟，咖，縣包含所有的組 明書有通常技藝之人依據圖示，說 • φμ — ^1工易知_多附加的特色和優點。此外，必 教;為主非用°兄明書中所使用的語言和敘述’以方便閱讀和 =為主，_以舰或關本發明之標的。 【貫施方式】 相的具體實施例’將配合各個圖示予以說明，圖中 編㈤或功能相似的元件。另外在圖示中，每個 '扁旒取左邊的數字對應到所引用的圖示的編號。 W在，發明欽述中，引用‘‘―個具體實施例，，或者“-具體實 ^個ΐ句’是指至少與本發明的具體實施例有關的一個 舻此、、、，σ構或特徵。在說明書中不同地方出現的“一個且 =‘一具體實施例’’一詞，並不一定完全是指同一個 ^此外，本發明的敘述所使用的語言，基本上是為了便於 閱讀及教示為原則’並非用以侷限或限制本發明之標的。因 此本發明之揭示僅為說明之用，非用以限制本發明所述之 請專利範圍。 第1圖係為於基板100的接觸焊墊上11〇、12〇，耦合了 導電彈性物質的一個具體實施例。在不同的具體實施例中，基 板100可為一積體電路的晶片、一堆疊的積體電路晶、一 ^裝好的積體電路元件、一電子元件、一軟式線路板、一軟硬 /tb合式的線路板、一印刷電路板（pCB)或者是類似的實體。 201117690 在不同的具體實施例中，一個導電 係數、配置及/或幾何形狀。例如，^貝’ ^有不同的電阻 為一個簡單的、均勾-致的接觸^^塾^10 Ϊ 12^可 同功能，而用多種不同導電彈性物:二爲了只現某種不 焊塾。這些不同功能，可以是一方位、、’、^同結構的接觸 支_、-電源連接點、-接地連接‘二：散熱點、一結構 使不同的導電彈性物質;=¥電度的巨大變動範圍’ _合了具有^電 _⑽和 以輕合。另外，接觸烊墊陶，也可 在-的拉導電彈性物質在同一焊墊上。 零歐姆電“導電===、=可為具有均勾的， 外也可以是具有均=生物作貝雜互連焊藝。另 作為耦合一個内逮帝kbaa^令歐姆電阻的導電彈性物質，以 質，作為_合—個二式電=== 使用—絕緣的彈性物 物質，將—㈣阻和電=用更多的彈性 觸焊墊110、120中。、、σ體直接嵌入於互連焊墊的接 式、^積施^方^電彈性㈣可以侧於製程中層壓方 2的方觀到==== 大小上有所不同;物質可以在幾何形狀及/或 塾U0、120上，可以祐夕-不同導電彈性物質耗合到接觸焊 的導電互連，或者一個導二諸如僅是-個簡單 加接一個電容連加接-個電阻、-個導電互連 们導电互連加接一個電阻和電容的組合、一 201117690 電:連加接'絕緣體，或者是加 等4，直接實現在接觸焊墊ii〇 f或多個其它被動元件 在各種電路的設計和應 &上。 ^並接一個電阻，此電‘的另—二見f電子器件的輸入接腳 二或，地’用以控制電子器件的操或上接-個電屢源， 二，諸如將一串聯終止電阻，於、二。其它電路應用的組 ’用來改變電路的阻抗，以出驅動器的 =電阻，用以調整驅動器的的輸出接腳接上- 電子器件輸入/輸出接腳的一外部電阻 (led)的亮度。 电瓜以控制發光二極體 子。為了解說的牛目接到電子器件或褒置200的例 ^200 , 圖的例子中，電阻Ru字丨f接了—個電阻。在第二 選擇操作的模式，諸如決定電二200的f「接腳接地’以 器件的第二接:=^=莫。電阻Μ連接到電子 相合到電子器件200的第^^，、f 電阻。電阻R3 成為一個上拉電阻，用# 八 為連結到電壓源， ί： ^讓以控制流向發光二極體（led ;;歐：化到-千 ‘確的，通常約數十歐姆的電阻。 匕的值疋較 ιΪΓ實施例中，第二圖中所示的電阻Rl、R2、R3和 以由耗合一或多個具有不同電阻係數的導電彈性物 201117690 件的各健贿塾上來完成。搞合不同電 ^彈性物7接觸焊墊上，不僅可使接觸燁塾有電 :實，_ 阻值 數是可以做多樣變化的。導電彈性物質^ 立的外電接== =ΐ:=]電子器ί200接腳的相同功能，進而減少了 在不_實：:二\目二Τ彈需：質面二 方體的 面，面可為一圓柱形的橫截面二立 質的長度，在此可視As、旨表不其中乙代表導電彈性物 度或高度，而上的厚 :二，定的電阻係可在 上。—個接觸谭塾 不是太多’舰可制某—特定# 的電阻數量並 觸烊塾的製作時，直接放置彈性物質，於接 =大量不同的電阻值，如果祇有可能需要 截面積麵-軸 Ϊ \ 1 7 201117690 觸焊墊上，堆疊多個事先已選定 性物質來使用，但有相同總淨t =尚度和電阻係數的導電彈 個接觸得塾上’可以堆疊多個^右於具體貧施例中，在一 質，但所有堆疊於接觸焊塾上的=電阻係數的導電彈性物 路板或系統主板上，均有―爲相^性物質’最後在印刷電 谭塾的總電阻值，亦合乎每^積度’同時每一個接觸 路板上的綱痒塾，其中有—個導5r物貝來製造印刷電 每厘米零歐姆，另-料電彈性物物質的電阻係數約為 百歐姆，一個導電彈性物質的電===數约為每厘米— 道不導电淨生物貝的讓係數約為每厘米-萬歐姐，另右彻 ，性的使壯料轉性㈣，依 度:不同組合的導電彈性物質，輕合在二 淨電阻值達到接腳的功能要求。 要觸知塾上以I成 現勺且^圖^=將;電彈性_馬合在接觸輝墊上，以實 ::f 些使用導電彈性物嶋做】== = 塾=方便’第三圖僅描述了四個圓柱形的接觸烊 10、311、312 和 313。這些接觸焊墊 31〇、3n、312、313 的一端和基板300表面的各個接觸面32〇 电子組件所在的目標平台395的目標接觸面39〇、391、392、 輕合。抵要尺寸的差異不會造成嚴重的次級效應，基板接 觸面320、321、322、323的大小尺寸及/或目標接觸面39〇、 391、392、393的大小尺寸，是可以和接觸焊塾3ι〇、3η、312、 313的橫截面積稍有所不同的。例如，基板接觸面32〇、32ΐ、 322、323的表面積可能大於或小於接觸焊塾31〇、Mi、312 和313的棱截區域面積。 若以接觸焊墊310的橫截區域面積為參考，減小了橫截 201117690 物。·，赌仙相同的導 X 邊311的横截面積是接觸焊墊310 Γ^·那麼接觸焊墊311的電阻將，是接觸焊 =物質，到導電彈性物質·的外圍，來提供 、同日^一致改變電阻值，如圖所示的接觸焊塾312'。、 在第二圖3的實施例中，接觸焊塾313你由 電彈性物質所組成，包含一電阻區域^2531=由U的導 326。電阻區域325輕合高%。fH—南導電區域 ❿ 『的高度，進而減少接觸焊墊';3的電阻值低 313所減少的高度及電阻值與一具有 : ?!觸悍塾間成比例，’如接觸燁墊313截㈡㈡度 J電區，朗阻區域325的第一側面弟二以 中，南導電區域326也可被輛合到電阻 =^施列 以皮分為-第-導電= 導电-人&域/、中第一導電次區域被耦舍到電阻 偏一則面’而第二導電次區域_合至電阻區*32:的第-2面ς同樣地，電阻區域325也可被分為 同戈^二 弟一電阻次區域和第二電阻凃卩托并另小丨』包阻係數的 次區域内做任何次序的對接。°”，、’讓次區域和高導電 電源個電容經常她匈—個電子器件的 何。此外，一個電容也可以連接到一個電子哭杜3:所尚的電 容，作為-個脈衝寬度調變(乂二° ^内d路_合電 作爲阻擋接腳直流電㈣離)ϋ的'位轉換器件，或 微小的傳送時間差異，以及種“ ^ 的相位和 子t，電容C1連結到的電子子。在弟四圖的例 作繼訊的去输，它同;接地和=2腳電1容 201117690 =疋連接到電子II件接腳2的― =-端接地。第四圖中的電容C3爲阻隔ίί ；%二二2 厂J到電子器件的脈衝寬度調變 ; 地，作為跑二2連、、Ί 牛的接腳4，另一端接 $ m侧㈣容來制，諸如用於彳目位鎖❻ 。通常情況下，電晴電i 2 的容目值變化，而其它的電容’例如第四圖所示 取決於它們的翻。需要一個更精確值的電容，這些全 物質&中’將—辦導輕性物質或絕緣彈性 ^ 中’可以於接觸焊塾構建—個嵌入式電 -個雜合夾於兩個導電接觸面之中，其中 △，導：接觸面疋在基板上，而另一個導電接觸面是在目標 ^料所成了—個平行平板電容器。—個均勻的絕緣介質 材抖所xe摘平料㈣容，⑽電雜c抑εΑ/ d來表 緣彈性物質的介f常數，Α是平行平板的面積， 二ί個f订平板之間的距離。插置一個絕緣彈性物質或絕緣 ，=兩個平行平板之間，可提高它們之間的介質常數，以增 加平行平板電容的電容值。 讳固第五圖是一組在接觸焊墊令建造了嵌入式電容的示例側 視圖。弟五圖的三個嵌入式電容510、511、512，其第一表面 分別和基板500的導電接觸面520、521、522耦合，其第二 ，面分別和目標平台595的導電接觸面590、591、592耦合。 :員似於$述圖2和圖3所描述，構建於接觸焊墊上的嵌入式 電阻，嵌入在接觸焊墊510、511、512電容的電容值是可以變 動的。例如，即使將接觸焊墊510、511、512的尺寸大小保 持不變’變動基板的導電接觸面52〇、521、522的表面積， 及/或變動目標平台的導電接觸面590、591、592的表面積， 4κ可以调整嵌入在接觸焊塾51〇、511、512電容的電容值。 不同於第三圖所述嵌入於接觸焊墊31〇、311、312和313的電 201117690 果基板的導電接觸面52〇、521、5 590、591、592的面積能二不變^ 的改變並沒有什麼影$、。51卜512的截面積，對嵌人式電容值 轭中，可以藉由降低絕緣彈性物質的高度， ^加接觸嬋墊512的電容值。如第五圖所示，接觸焊塾512 輕合一導電區域526所組成。為了保持接 =墊12在一疋的向度上，減少了絕緣區域525的高度，201117690 VI. Description of the invention: [Technical field to which the invention pertains] This hybrid is generally related to the use of electrically conductive materials for the manufacture/closing of electronic components, or in the assembly of a plurality of temples.概 兀 兀 , , , , , , 【 【 【 【 【 【 【 【 【 【 【 【 For example, a conductive elastic material is used for the contact of the surface of the === circuit, and is used for the arranging of the array package, so that the content has a priority. The temporary patent of Guodi 6ν244, 861 applies a method containing multiple production preparations. A conductive elastomeric tweezers device or substrate having a coefficient of manufacture. There will be different resistance-selection groups on the scales. Select or "" two on the substrate: the second quality =, in the passive component that will be directly available on the _, the conductive coefficient of the resistance coefficient is greater. Use different electricity to reduce the amount in the target +^ In the soldering pad, various structures are embedded, and the components can be occupied on the circuit board. The normal operation on the passive stage must be supplemented by the electronic device. The target is flat, and the conductive structure is used to connect the electrical structure straight to the contact soldering. In the pad, the right to reduce the passive piece of the traitor product thief with 'through the same as the traditional use of conductive elasticity ^ ^ into the = reduce the cost of manufacturing. Not long ago, so that only pay attention to its high electrical conductivity, the purpose It is also a kind of conductive elastic material which is also the same as the electric coefficient, and the passive component which is also included can be connected to the contact material, so that the contact pad of the electronic device or the electronic package is formed in the single or composite. τ 1..., the ignorance of the electronic product assembly use. 纟, café, county contains all the group of books have the usual skills of people according to the diagram, said φμ — ^1 work easy to know _ more additional features and advantages. In addition, must teach; Use the language and narrative used in the brothers' book to make it easier to read and =, _ to ship or to mark the subject of the invention. [Comprehensive mode] The specific embodiment of the phase will be explained in conjunction with each figure. In the figure, (5) or functionally similar components. In addition, in the illustration, each of the numbers on the left side corresponds to the number of the referenced figure. W, in the invention, reference to ''-specific implementation An example, or "-" is a singularity, or a sigma, or feature, at least in connection with a particular embodiment of the invention. The words "a" and "an embodiment" are used in various places in the specification and do not necessarily refer to the same. In addition, the language used in the description of the present invention is basically for ease of reading and teaching. The present invention is not intended to limit or limit the scope of the present invention. Therefore, the disclosure of the present invention is for illustrative purposes only and is not intended to limit the scope of the claimed invention. FIG. 1 is a contact pad on a substrate 100. 〇, 12〇, a specific embodiment in which a conductive elastic material is coupled. In different embodiments, the substrate 100 may be a chip of an integrated circuit, a stacked integrated circuit crystal, and a stacked body. a circuit component, an electronic component, a flexible circuit board, a hard/wired circuit board, a printed circuit board (pCB), or the like. 201117690 In a different embodiment, a conductivity, configuration, and / or geometry. For example, ^be' ^ has a different resistance for a simple, hook-like contact ^^塾^10 Ϊ 12^ can be the same function, and with a variety of different conductive elastics: two for the only present These kinds of different functions can be one-direction, ', ^ contact structure of the same structure _, - power connection point, - ground connection 'two: heat dissipation point, a structure to make different conductive elastic substances; = ¥ The large variation range of electric energy ' _ is combined with ^ electric _ (10) and lightly combined. In addition, the contact enamel pot can also be used on the same conductive pad on the same conductive pad. Zero ohm electric "electricity ===, = can be evenly hooked, but also can have the same = bio-beautiful interconnect soldering. In addition, as a conductive elastic material that couples an ohmic resistor to the kbaa^, it is used as a _ _ _ _ _ _ = = = using - an insulating elastic material, will - (4) resistance and electricity = use more In the elastic contact pads 110, 120. The sigma body is directly embedded in the interconnecting pad, and the electromagnetism (4) can be sideways in the process of laminating square 2 to ==== the size is different; the material can be in geometry On the shape and / or 塾 U0, 120, you can use a different conductive elastic material to the conductive interconnect of the contact solder, or a conductive two such as only a simple addition of a capacitor plus a resistor, - Conductive interconnects are electrically connected to each other by a combination of resistors and capacitors. A 201117690 is electrically connected to the 'insulator, or is added 4, directly on the contact pad ii〇f or multiple other passive components. The design of various circuits should be & ^Connected to a resistor, the other 'see the input pin 2 of the f-electronic device, the ground' is used to control the operation or the connection of the electronic device - an electric source, and the second, such as a series termination resistor, Yu, two. The group of other circuit applications is used to change the impedance of the circuit to the = resistance of the driver to adjust the brightness of an external resistor (led) of the input/output pin of the driver. The electric melon is used to control the light-emitting diode. In order to understand that the bull's eye is connected to the electronic device or the device 200, in the example of the figure, the resistor Ru is connected to a resistor. In the mode of the second selection operation, such as determining f "pin grounding" of the electric two 200 to the second connection of the device: = ^ = Mo. The resistance Μ is connected to the ^^, f resistance of the electron matching to the electronic device 200 Resistor R3 becomes a pull-up resistor, connected to the voltage source with #8, ί: ^ let control flow to the light-emitting diode (led;; European: to - thousand 'true, usually about tens of ohms of resistance The value of 匕 is better than that of the ιΪΓ embodiment, the resistors R1, R2, and R3 shown in the second figure, and the bribes that are consuming one or more conductive elastics with different resistivities. Engage in different electric ^elast 7 contact pads, not only can make contact with electricity: real, _ resistance number can be varied. Conductive elastic material ^ external electrical connection == =ΐ:=] The same function of the electronic device ί200 pin, which reduces the length of the surface of the two-dimensional projectile: the face of the texture, the face can be a cylindrical cross-section of the two-dimensional length, in This visual As, the table is not where B represents the conductive elastic degree or height, and the upper thickness: two, the fixed resistance system Can be on. - A contact Tan is not too much 'ship can make a certain number of specific # resistance and touch the production of the material, directly placed elastic material, in the connection = a large number of different resistance values, if only the need to cut Area surface - Axis Ϊ \ 1 7 201117690 On the touch pad, stack a number of previously selected substances to use, but have the same total net t = the degree of resistance and the resistivity of the conductive bullets on the contact' can be stacked multiple ^ Right to the specific lean example, all of the conductive elastic boards or system boards that are stacked on the contact pads and have a resistivity are “for the substance” and finally in the printed circuit. The total resistance value is also in accordance with the sum of the 'degrees of the joint itch on each contact plate, which has a guide 5r to produce zero ohms per centimeter of printed electricity, and the resistance of the other electro-elastic material. The coefficient is about 100 ohms, the electric === number of a conductive elastic material is about every centimeter - the non-conducting net bioshell has a coefficient of about 10,000 ohms per centimeter, and the right is the same. Sex (4), Dependence: Different combinations of conductive elastic materials, light The two net resistance values reach the functional requirements of the pin. To touch the 塾 以 以 I 且 且 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^嶋 】 == = 塾 = convenient 'The third figure only describes four cylindrical contact 烊 10, 311, 312 and 313. One end of these contact pads 31 〇, 3n, 312, 313 and the surface of the substrate 300 The target contact faces 39〇, 391, 392 of the target platform 395 where the respective contact faces 32 are located are lightly coupled. The difference in the size of the contacts does not cause a serious secondary effect, and the substrate contact faces 320, 321, 322, 323 The size and/or size of the target contact faces 39, 391, 392, and 393 may be slightly different from the cross-sectional areas of the contact pads 3, 3, 312, and 313. For example, the surface area of the substrate contact faces 32, 32, 322, 323 may be larger or smaller than the area of the edge regions of the contact pads 31, Mi, 312, and 313. If the cross-sectional area of the contact pad 310 is taken as a reference, the cross-section 201117690 is reduced. · The cross-sectional area of the same X-side 311 of the gambling is the contact pad 310 Γ ^ · then the resistance of the contact pad 311 will be the contact welding = substance, to the periphery of the conductive elastic material, to provide, the same day ^ The resistance value is uniformly changed, as shown by the contact pad 312'. In the embodiment of Fig. 3, the contact pad 313 consists of an electroelastic material comprising a resistive region ^2531 = a guide 326 by U. The resistance region 325 is lightly high. fH—the south conductive area ❿ 『the height, and then reduce the contact pad'; the resistance value of 3 is reduced by 313 and the resistance value is one with: ?! proportional to the contact, 'such as the contact pad 313 (2) (2) Degree J electric zone, the first side of the RC zone 325 is in the middle of the second, the south conductive zone 326 can also be connected to the resistance = ^ to list the skin - the first - conductive = conductive - human & /, the first conductive sub-region is coupled to the resistor biased one surface 'and the second conductive sub-region _ is coupled to the resistive region *32: the -2 plane ς Similarly, the resistive region 325 can also be divided into the same ^ The second brother and the second sub-area are coated with the second resistor and the other is in the sub-area of the encapsulation coefficient. °",, 'Let the sub-area and high-conductivity power supply capacitors often her Hungarian-- an electronic device. In addition, a capacitor can also be connected to an electronic crying Du 3: the capacitor, as a pulse width modulation (乂2°^内的路_合电 as a blocking pin DC (4))) ϋ's bit conversion device, or a small difference in transmission time, and the kind of "^ phase and sub-t, the electron to which the capacitor C1 is connected. In the case of the brother's four pictures, the succession of the relay is the same; the grounding and the =2 foot power 1 capacity 201117690 = 疋 connected to the "=- terminal grounding of the electronic II piece pin 2. The capacitor C3 in the fourth figure is the blocking ίί; the pulse width modulation of the J to the electronic device; the ground, as the running two 2, the snail's pin 4, the other end is connected to the m side (four) System, such as for the purpose of the lock. Normally, the capacitance value of the electric i2 varies, while the other capacitances, such as shown in the fourth figure, depend on their flipping. Requires a more accurate value of the capacitor, these all-materials & 'will be light materials or insulation elastic ^ can be built in contact with the welding — - an embedded electric - a hybrid clamp on two conductive contact surfaces Among them, △, lead: the contact surface is on the substrate, and the other conductive contact surface is formed as a parallel plate capacitor in the target material. - a uniform dielectric material shakes xe to pick up the material (four) capacity, (10) electrical hybrid c ε Α / d to the surface of the elastic material of the f constant, Α is the area of the parallel plate, two between the f distance. Insert an insulating elastic material or insulation between the two parallel plates to increase the dielectric constant between them to increase the capacitance of the parallel plate capacitor. The fifth figure of tamping is a set of side views of an example of a built-in pad that has been built with contact pads. The three embedded capacitors 510, 511, 512 of the fifth figure are respectively coupled to the conductive contact faces 520, 521, 522 of the substrate 500, and the second faces thereof are respectively electrically conductive contact faces 590 of the target platform 595, 591, 592 coupling. The member is similar to the embedded resistor built on the contact pad as described in Fig. 2 and Fig. 3. The capacitance of the capacitor embedded in the contact pads 510, 511, and 512 can be changed. For example, even if the size of the contact pads 510, 511, 512 is kept constant, the surface area of the conductive contact faces 52, 521, 522 of the substrate is changed, and/or the conductive contact faces 590, 591, 592 of the target platform are varied. The surface area, 4κ, can adjust the capacitance of the capacitors embedded in the contact pads 51〇, 511, and 512. The area of the conductive contact faces 52 〇, 521, 5 590, 591, 592 of the substrate embedded in the contact pads 31 311, 311, 312, and 313 is different from that described in the third figure. Nothing affects $,. The cross-sectional area of 51 512, in the embedded capacitance value yoke, can be increased by the height of the insulating elastic material, plus the capacitance value of the contact pad 512. As shown in the fifth figure, the contact pad 512 is made up of a conductive region 526. In order to maintain the connection of the pad 12 in one turn, the height of the insulating region 525 is reduced.
加導?區Ϊ526的高度。在另一具體實施例+，導 當二被分割為第—導電次區域和第二導電次區域，其中 =一導電次區域被耦合到絕緣區域525的第一表面，而第二導 =次區域被耦合到絕緣區域525的第二表面，使得絕緣區域 置於兩個導電次區域之間。通過齡一絕緣區域525 1 區域526，接觸焊墊512的電容值將可調整，而接觸 焊墊的高度仍可保持不變。 在;具體實施例中，如果應用上需要較小的電容值，一 f小的肷入式電容’是可以由直接耦合基板導電接觸面52〇到 中間^有絕緣材料的目標導電接觸面59〇來組成的。也可以用 個環繞基版導電接觸面520，及/或目標導電接觸面590外 圍的中空型絕緣材料來組成；這個做法，同時又可以提供機械 性結構的支持。總而言之，如果絕緣彈性物質的橫截面積，大 至j 了足以覆盍基板的導電接觸面520、521、522的面積和目 標平台的導電接觸面590、591、592的面積的話，則絕緣彈 性物質的大小尺寸是可變化的，它對於嵌入在接觸焊墊510、 511、512的電容精密度的是不會有太大的影響。經由改變基 板的導電接觸面520、52卜522的面積，目標平台的導電接觸 面590、591、592的面積，及/或上兩種導電接觸面間絕緣層 的厚度’嵌於接觸焊墊中的電容的電容值，是可以改變的。 第六圖是兩組透視橫戴面的示例。示例說明了耗合多個 導電彈性物質於基板或目標平台的導電接觸面上，可以將多個 11 201117690 被動元件猶_轉射。私乡彳, dast〇merr' 式導電線路，等等。在 第，、圖所不一些接觸焊墊的結構，和 山了二曰出 的結構，頗為類似。但由於構建接二用3 種導電彈性物質，每種都可以有不同的電阻3 : = ^ ，導電，，和目標平台的目標接觸面，也可 g 式，以致所猶的接觸痒塾，可以形成各種不 例’基板導電接觸面和目標導電接觸面是非單一j _ 在第六圖中例示兩個複合彈性物質61〇、6ii 為便於説明，例示中的複合彈性物質61〇、6ιι，均以 柱形結構來解釋，雖然在具體實施例中 物 ® =能有不同的結構，例如它的橫截面，可以以 的、€形的、六角形的、八角形的或者是1它 =形狀，和各式形狀的組合。此外，在不同具體實施例、Add the height of the area Ϊ526. In another embodiment, the second is divided into a first conductive sub-region and a second conductive sub-region, wherein = a conductive sub-region is coupled to the first surface of the insulating region 525, and the second conductive sub-region The second surface is coupled to the insulating region 525 such that the insulating region is placed between the two conductive sub-regions. Through the age-insulated region 525 1 region 526, the capacitance of the contact pads 512 will be adjustable while the height of the contact pads will remain the same. In a specific embodiment, if a small capacitance value is required for the application, a small intrusive capacitor can be a target conductive contact surface 59 that can be electrically connected to the substrate by the direct coupling substrate conductive contact surface 52. Composed of. It may also be comprised of a hollow insulating material surrounding the substrate conductive contact surface 520 and/or the target conductive contact surface 590; this practice, while providing mechanical structural support. In summary, if the cross-sectional area of the insulating elastic material is as large as enough to cover the area of the conductive contact faces 520, 521, 522 of the substrate and the area of the conductive contact faces 590, 591, 592 of the target platform, then the insulating elastic material The size is variable and does not have a large effect on the precision of the capacitance embedded in the contact pads 510, 511, 512. By changing the area of the conductive contact faces 520, 52 522 of the substrate, the area of the conductive contact faces 590, 591, 592 of the target platform, and/or the thickness of the insulating layer between the two conductive contact faces is embedded in the contact pads. The capacitance value of the capacitor can be changed. The sixth picture is an example of two sets of perspective transverse wear surfaces. The example illustrates the use of multiple conductive elastomers on the conductive contact surface of the substrate or target platform to convert multiple 11 201117690 passive components. Private home, dast〇merr'-type conductive lines, and so on. In the first and the second, the structure of the contact pad is quite similar to that of the mountain. However, due to the construction of two kinds of conductive elastic materials, each can have different resistances 3 : = ^ , conductive, and the target contact surface of the target platform, can also be g-type, so that the contact is still itch, can Forming various kinds of 'substrate conductive contact surface and target conductive contact surface is non-single j _ Illustrating two composite elastic materials 61 〇, 6 ii in the sixth figure for convenience of explanation, the composite elastic materials 61 〇, 6 ιι in the example are The cylindrical structure is explained, although in the specific embodiment the material ® can have a different structure, for example its cross section, can be in the shape of a square, a hexagon, an octagon or a 1 it = shape, and A combination of various shapes. Moreover, in different embodiments,
61Q'611 "^有不_侧視面’諸如一正方形的 側視面、-長方形_視面、-獅_視面、—薄 任何其他合適的側視面或縱切面。 S 第六圖中的複合彈性物質610，包含一中心導電枉 一導電圓筒仍和-炎在中心導電柱613和導 ，緣物質層6M。在一可變化的具體實施例中圓；於 的外圍側壁，再加上一層絕緣彈性物質作為保護層电直 ίί條ί是’這個外加的絕緣層’不應產生額外散溢性的次i 電谷。弟六圖的另一個複合彈性物質611，是由一導電核心 電柱618，和—個實質上圍繞中心導電柱618二i 弹性物質619所組成。 至於複合彈性物質610的使用，在目標平台的5上，項 有一個對應的目標導電接觸區，它包含了一導電3接觸環69/，、 12 201117690 其内另有-導電接觸，點690。在導電接觸環和導 間，為一個絕緣的表面，將兩者分隔成兩‘二== 電接觸點690，與複合彈性物質_的中心導電柱613 =外圍 =導電接觸環691，則與複合彈性物質⑽的導&符 615耦&。另在基板_的表面，也有—個基板導電接區， =含了 一基板接觸點620 ’用以和複合彈性物質61〇 心 ^柱613 |馬合。在一具體實施例中，在基板_的表面 有-個圍繞基板接觸.點62〇的導電接觸環62卜用以 性物質610的導電圓筒615輕合，進而搞合 桿平^ ; 上的導電接觸環691。 J牡知十口 695 • Ί體實施射，於電子器件的接耻，構建-=入式的去為電容，可以使用類似複合彈性崎61〇的 L0:心柱613，連接外部電源到電子器件 ，斗蟄接捫‘、4 620上，外加一個接地的導電圓筒615， 一 =frH。614圍繞中心導電柱613，形成—個嵌入式電i 612於毛子為件的接觸谭塾中。根據電源滤波的要求，在 用-個小電阻或高導電度的雜物f，作為巾心導電柱 ^複合彈性物質⑽作為電子器件的接 電柱613 ’不僅可以將電源，也可以將電子信號，= η%的導電接觸點_連結到基板接觸焊塾的 620上（即基板接觸點）。在此複合彈性物質61〇的中心·雷 柱=和導電_ 615之間，形成了嵌人在接觸焊塾中的社 ^谷612的兩個表面，並以絕緣物質層6M作為圓柱开^ 介電層。改變絕緣物質層614的厚度，可以改變“ 弹性物質610的電容值。 文艰·σ f餅中心導電柱613，是由一個可以控制電阻係數的導希 二二所組ί，則這個複合彈性物質61G，將可變成-個^ 入^接觸谷（RC)電路’從而將一個低通濾波器直接嵌 在接觸坏塾中。在一實施例中，如果在基板600的表面，加 13 201117690 以和複合彈性物質610的導電圓筒615接觸的導電接 J更多，地將可由目標平台直接連制基板上， 進而私加基板上的電子器件的操作的穩定度。 611 具體實施例中，第六圖係顯示另一複合彈性物質 ^ 這個組合，合了一導電線路和一嵌人式電i於 合裏’目標平台695的表面包含卜 = 有—個導電接觸點692，外繞著-個絕 m更進一步圍繞一個㈣妾觸圓形環693。 ====質611，則包含了—個中心導電柱⑽和一個 =性，61:。這個中心導電柱和絕緣彈性物質在不同： 有不同的橫截面形狀的。在基板_的表面^ U-略板接觸面622，它橫截面區域的大小， 地的目^觸入圓形環693有部分的重4，為形成電容所必須接 導雷^吏用/复^早性物質611 ’作為電子器件的導電焊塾，盆 =中心柱618，搞合了目標平台695表面的導電接二‘ 622，進而將電源或信號從目標 時’基板上的導電接觸面奶與 〜柱618連接，形成兩個嵌人式電容616 * 61 以電=標Πί的接觸圓形環693耦合，成爲兩個 ^ ^絕緣;,吳層。導電接觸面622和 重登區域的面積，決定了嵌入式電容617的電 改變導電接觸面622和目標接觸圓形環693 ^ 調節電容值的大小。但基本前提是，導I = 標=台上的接觸圓形環693接觸，造成短路 ^ 列中:複，_質心如果用為積體電路封:忿 ，在其2具體實施例中，如果將在複合 在微米或次微米較薄的範圍。 的厗度，將疋 201117690 若複合彈性物質611的中心導電柱618 性的彈性物質來製造，即成了-個電阻中心柱^3 = 質如，便形成-個擁有電阻連接於目標平台 口 觸面，並嫩入式電容器616、叫目伴的導= 和基因^ =電子組裝在目標接罐域和基板接龜域的結構，以及 ό彈性物質材料的導電性，複合雜物f可以作為—個辦 電阻、-個嵌入式電容器、-個基板的機械結 ^ ^ 它必要的JL持魏。 肖謂，A者其 第七圖顯示更多複合彈性物質透視横截面的例子。61Q'611 "^ has a side view surface such as a square side view, - rectangle_view, - lion_view, - thin any other suitable side or vertical cut. S. The composite elastic material 610 in the sixth figure, comprising a central conductive 枉 a conductive cylinder still-inflamed in the central conductive pillar 613 and the leading edge material layer 6M. In a variable embodiment, the outer side wall, plus a layer of insulating elastic material as a protective layer, is 'this additional insulating layer' should not produce additional overflow. Valley. Another composite elastic material 611 of the sixth figure is composed of a conductive core post 618, and a substantially elastic surrounding material 619 surrounding the central conductive post 618. As for the use of the composite elastomeric material 610, on the target platform 5, there is a corresponding target conductive contact region comprising a conductive 3 contact ring 69/, 12 201117690 having an additional conductive contact, point 690. In the conductive contact ring and the conducting space, an insulating surface, the two are separated into two 'two == electrical contact points 690, and the central conductive column 613 of the composite elastic material _ = peripheral = conductive contact ring 691, then composite The guide & 615 of the elastic material (10) is coupled to & In addition, on the surface of the substrate _, there is also a substrate conductive connection region, which includes a substrate contact point 620' for mating with the composite elastic material 61. In a specific embodiment, on the surface of the substrate _ there is a conductive contact ring 62 around the substrate contact point 62 〇, the conductive cylinder 615 of the material 610 is lightly combined, thereby engaging the rod flat surface Conductive contact ring 691. J Mu knows ten mouths 695 • The body is shot, in the shame of the electronic device, the construction-= into the capacitor, you can use a composite elastic elastic 61〇 L0: stem 613, connect the external power supply to the electronic device , on the 蛰 扪 ', 4 620, plus a grounded conductive cylinder 615, a = frH. 614 surrounds the central conductive post 613 to form an embedded electrical i 612 in the contact of the hair piece. According to the requirements of the power supply filtering, the use of a small resistance or high conductivity of the impurity f, as the core conductive column ^ composite elastic material (10) as the electronic device of the power column 613 ' can not only power, but also electronic signals, = η% of the conductive contact point _ is attached to the substrate contact 620 of the soldering tip (ie, the substrate contact point). Between the center of the composite elastic material 61〇 and the conductive _ 615, two surfaces of the 谷谷 612 embedded in the contact pad are formed, and the insulating material layer 6M is used as the cylindrical opening. Electrical layer. By changing the thickness of the insulating material layer 614, the capacitance value of the elastic material 610 can be changed. The conductive column 613 of the sturdy σ f cake center is composed of a conductive group 249 which can control the resistivity, and the composite elastic material 61G, which can be turned into a ^ contact valley (RC) circuit' to embed a low pass filter directly in the contact gangrene. In an embodiment, if on the surface of the substrate 600, add 13 201117690 to The conductive cylinder 615 of the composite elastic material 610 contacts more conductive contacts, which can be directly connected to the substrate by the target platform, thereby privately increasing the stability of the operation of the electronic device on the substrate. 611 In the specific embodiment, the sixth The figure shows another composite elastic material ^ this combination, combined with a conductive line and an embedded electric i on the surface of the target platform 695 contains a = conductive contact point 692, surrounded by a m further surrounds a (four) 圆形 circular ring 693. ====Quality 611, which contains a central conductive column (10) and a = sex, 61: This central conductive column and insulating elastic material are different: different Cross-sectional shape On the surface of the substrate _ U-slab contact surface 622, the size of its cross-sectional area, the ground contact radius 693 has a partial weight of 4, in order to form a capacitor must be guided by lightning / / The early-previous material 611' is used as a conductive pad of the electronic device, and the basin = the center post 618, which engages the conductive connection 2' 622 on the surface of the target platform 695, thereby turning the power source or signal from the target's conductive contact surface on the substrate. The milk is connected with the ~column 618 to form two inlaid capacitors 616 * 61. The contact circular ring 693 is electrically coupled with the ring 693, which becomes two ^ ^ insulation; the Wu layer. The conductive contact surface 622 and the re-entry area The area determines the size of the electrically conductive contact surface 622 of the embedded capacitor 617 and the target contact circular ring 693 ^ to adjust the capacitance value. However, the basic premise is that the contact I = mark = the contact circular ring 693 on the stage contacts, resulting in Short circuit ^ column: complex, _ centroid if used as integrated circuit package: 忿, in its 2 specific examples, if it will be in the range of micron or sub-micron thinner, will be 疋201117690 The central elastic column 611 of the composite elastic material 611 is made of an elastic material, Become a resistance center column ^3 = quality, then form - a resistor with a connection to the target platform mouth, and a soft-in capacitor 616, called the partner of the guide = and the gene ^ = electronic assembly in the target canister The structure of the domain and the substrate is connected to the structure of the turtle, and the conductivity of the material of the elastic material. The composite impurity f can be used as a mechanical resistor, an embedded capacitor, a mechanical junction of a substrate, and the necessary JL. Xiao said that the seventh figure of A shows more examples of the cross-section of the composite elastic material.
具體實施例中’如果以不同方式，將多個接觸焊墊 =物質加喃合，也可以形成不同的複合彈性物質。例如屯 ^七圖中，有兩個接觸焊墊，其各有一個彈性物質。其 彈性物質710’令它是-個導轉性物f，第二雜物質7ιι， 7^0它Λ一^ίίΓ生物質’如果將它們在基板上的焊塾接觸點 =〇和721連釔在一起，也可以形成一個耦合式的複合彈性物 貝。連結基板上的兩個焊墊接觸點72〇和721，可以經由美 =表層或者透過基板的㈣來達成。絲合式雙焊塾的植入 中，第-彈性物質710,連結目標平台799上的第一目標接; 面=0到基板700表面的第一焊墊接觸點72〇，將目標平台上 的信號或電源連接到基板上。第二彈性物質711，它是、& ^，連結於一個接地的、在目標平台上的第二目標接觸面乃卜 它與j基板700表面的第二焊墊接觸點721，形成一個嵌入式 的電容器730。將基板700表面的兩個焊墊接觸點72〇和721 連接在”軸—敏合彈性物質，它不健電源或信號 ^目標平台連結到基板的接觸焊墊上，同時連有一個嵌入式電b 。 在不同的組合中，第七圖顯示另外兩個複合彈性物質 715的例子。這些複合彈性物質，可以視為是將兩個不同的彈 性物質，併接在同-個接觸焊墊上來形成。和上述兩個獨立彈 f生物質710、711麵合的例子類似，複合彈性物質Μ〕，包每 15 201117690In a specific embodiment, different composite elastic materials may be formed if a plurality of contact pads = substances are halved in different manners. For example, in the 七 ^ seven figure, there are two contact pads, each of which has an elastic material. Its elastic substance 710' makes it a --conducting substance f, the second impurity substance 7ιι, 7^0 Λ ^ ^ Γ Γ Γ 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果 如果Together, a coupled composite elastomer can also be formed. The two pad contact points 72A and 721 on the bonding substrate can be achieved via the US= surface layer or the (4) through the substrate. In the implantation of the wire-bonded double-weld, the first elastic material 710 is connected to the first target on the target platform 799; the surface is 0 to the first pad contact point 72 on the surface of the substrate 700, and the signal on the target platform is Or the power supply is connected to the substrate. a second elastic material 711, which is coupled to a grounded second target contact surface on the target platform and a second pad contact point 721 on the surface of the j substrate 700 to form an embedded Capacitor 730. The two pad contact points 72〇 and 721 on the surface of the substrate 700 are connected to the “axis-sensitive elastic material, which is connected to the contact pad of the substrate by the power source or the signal target platform, and is connected with an embedded electric b. In various combinations, the seventh figure shows an example of two other composite elastic materials 715. These composite elastic materials can be considered to be formed by joining two different elastic materials to the same contact pads. Similar to the above two examples of independent bombs, biomass 710, 711, composite elastic material Μ], package every 15 201117690
了第一彈性物質713，令它是一個導電彈性物質，和第二彈性 物質714，令它是一個絕緣彈性物質，假設它們都成柱狀形的 結構，像一個半圓形的柱狀、一個長方形的柱狀或者是其它幾 ，形式的柱狀。在一具體實施例中，在基板7〇〇的表面或目標 =台799的表面的接觸面，可以分開成幾個部份，用以和複合 彈性物資712、715連結。根據應用的需耍，信號或電源可使 用複合彈性物質712、715中較小一半的來傳送，諸如導電彈 性物質713、716。而嵌入式電容器73卜732、733、734，則 可使用複合彈性物質中較大的一半來達成，諸如絕緣彈性物質 714和717，如第七圖所示。同時接觸焊墊，在於基板上的分 開式焊墊接觸面，或於目標平台上的分開式目標接觸面， 以不對稱和不一樣大小的。 在第七圖的另兩組例子，其在目標平台799表面的目杉 接觸面’連結了複合彈性物質712、715，其中包含第一接^ 々區792、794，耦合到第一導電彈性物質713、716，同時包令 f二接觸區793、795,麵合到第二彈性物質714、717。此外. ^中的複合彈性物質712、715亦與基板·表面的焊塾接 塾接it 7f人^另一具體實施例中，在Μ 700表面的輝 墊接巧面，包έ分開的第一接觸區和第二接觸區。The first elastic substance 713 is made of a conductive elastic substance, and the second elastic substance 714 is made of an insulating elastic substance, assuming that they are all in a columnar structure, like a semicircular column, one Rectangular columnar or other forms, columnar in form. In a specific embodiment, the contact surface of the surface of the substrate 7 or the surface of the target = table 799 may be divided into portions for bonding with the composite elastic materials 712, 715. Depending on the needs of the application, the signal or power source can be delivered using less than half of the composite elastomeric materials 712, 715, such as conductive elastomers 713, 716. The embedded capacitors 73, 732, 733, and 734 can be achieved using a larger half of the composite elastomer, such as insulating elastomers 714 and 717, as shown in FIG. At the same time, the contact pads are separated by a contact pad on the substrate or a separate target contact surface on the target platform, which is asymmetrical and not the same size. In the other two examples of the seventh figure, the composite elastic material 712, 715 is joined to the surface of the target platform 799, which includes the first interface 792, 794, coupled to the first conductive elastic material. 713, 716, simultaneously enclosing the two contact areas 793, 795, to the second elastic material 714, 717. In addition, the composite elastic materials 712, 715 in the ^ are also bonded to the substrate and the surface of the substrate. In another specific embodiment, the surface of the Μ 700 has a mating surface, and the first part of the package is separated. Contact zone and second contact zone.
即」午^>數位電路的設計’包括一個電阻和電容的組合（亦 RC電路”）。第八圖歹懷了一些不同RC電路連接到 =路⑽800的接腳5的應用。一 R(^路 ❹辦電雜物f於频 甘欠入於積體電路800的接觸烊塾中。 詞向1接 導軌=人Lit _性物質包圍，含有電阻的中心 5 = f所組成。經㈣變在基板上接觸面 823 _和信_接方式二 的RC電路’諸如連接到積體電路800⑽接腳i、2和3 16 201117690 電路’均可用—個周圍被絕緣彈性物質包圍， 來：弹性物質類似的複合彈物質體810、820、830 路二豆接腳沾、::斤不的耦合於接腳卜2和3的嵌入式此電 腳的連接’輪出信號的標示，接地的連接’和複合彈 性物質體的結構，是為了示例目的而做。 复口早 5的也歹! 舉出更多#馬合到積體電路（IC) 800接腳4和 3二上的複合彈性物質體和耦合於接腳卜2和 接i 性物，有著不同的結構。例如，連 的RC雷路，勺八弟4接腳，嵌入在複合彈性物質體840中 包圍，而後這核圍被-個絕緣柱體所 包圍，’連結 的輪料m觸成了連接到目標平台的rc電路 ^ ^弟/圖所不的複合彈性物質體850，是對一個連社 $積^^ _第4接腳同樣的RC電路 七 ：；體咖的界片接觸面和目標接^ = 到接腳4的Rc電路，可以用於脈衝寬度調變 (WM)或應用於回饋遽頻電路，等等。 第八圖所示的複合彈性物質體_，例 =〒路800第5接腳的Rc電路。這個RC電路，：以 是體實施例中，複合彈性物質體860 的舞性物質所組成’其中—個接觸烊塾 土，表面上的焊墊接觸面，作爲積體電路第5接 ， -個接觸烊墊在基板表面上的焊健觸面 c ^ ’ 做： 將各式各樣的幾何結 中’疋可以將被動凡件和它們的組合，歲入在接觸二 17 201117690 觸個動元件直接巍入於接 法。傳統電===== =;尺::自然會增加。其= 二則:;s 果使用ϊ償電容、終端電阻及/或限流電阻: =shi逆==== 動元件的步驟。這是======放置被 元件數量相當巨大時。 #尤，、疋所萬放置的被動 子系統的性能和表現，Zii就的相互干擾，使得電 ㈣H #轩树麟上_電職或目標平台後，在 電·Π件:從電子fe裝巾料ί子元件的：ΐ 焊f㈣’使電子裝配不需使用加熱5 2= ΐΐ品的生產程序，並且有利於電子元件的ί 這非常有二蜂ίί::ίίί本’同時減少電子廢棄物的氾濫， 、非吊有利綠色_的需要。導電彈性物質，將被動元件 201117690 件的，焊塾中，每年可以減少億萬件分立式被 爲恭子哭化了物料的管理。使用導電彈性物質作 的接觸焊塾材料，將使—個無須回風爐熱焊的電子 或;二了:[主凡要是導電彈性物質一樣可以和在印刷電路板 一不，σ預设的目標接觸面，有良好的接觸。 的挑單機雜縣_裝麟（smt)，有一個新 —疋去蚌接一些超小型的被動元件。在電子組裝中， :;ί有 =焊錫來焊住這些超小型被動元件的接腳二 焊接超小型被動元件到電子組裝上的難題1 ί=ί^?ίί品越來越纽，多數主動式和被動式的元件 件封裝〇二、且;的尺越ί耳Γ'，= 又C\較小的_的封裝所取代。再接下來， 梦虞ϊϋ别取ί的被動元件的封裴，是-個〇_的封 ‘於;們的體密i(mlls)長和5密耳(mils)的寬。 印刷電路板上焊接這些超小封裝的被 烊錫橋接短路或是焊錫从的問題，是 動元針料些超小封裝獨立被動元件的體積很小，被 也曰當ΐίΐ、、且輸、處理或市場上的實際使用時脫落， =tis的製造時，將有需要的被動元件，_ 嵌入在接觸_中，將使-個新 式，^本發㈣具體實“和 靴於在勤^露的歡結構和元 2精朴冑請專概騎㈣的鱗， 置之配置、操作與細節進行各種修正、 19 201117690 【圖式簡單說明】 *第—圖係顯示本發明一具體實施例之具有導㊉^& 貝耦合到接觸焊墊之基板。 導电弹性物 示音圖第二圖係顯示本發明將複數個電阻連接到電子哭件之 所立人第三圖係顯示本發明一具體實施例之用以將導恭π 貝搞5到f子器件的接觸上以形成電阻之側視^爭性物 音圖。四圖係顯示本發明將複數個電容連接到電子器件之示 w人第五圖係顯示本發明一具體實施例之用以將導雷强卜“心 圖。a于4的接鱗塾上以實現不同電容應用之側視 第示本發明—具體實_之 合至一基板的接觸焊執卜 电坪注物貝麵 圖。 調㈣上’⑽成各式截耕組合之橫截面 植入細示本發明另—賤實關之將導電彈性物質 面^。一基板的接觸焊墊上，以形成各式被動元件組合之橫截 合至-明一具體實施例之將導電彈性物質搞 橫截面ί于塾上，以形成各式不同電阻與電容組合之 屬職體實施例。所 = 情本文所収職財法崎不同的實 【主要元件符號說明】 100…基板 110 ' 120…接觸焊墊 200…電子器件 210…發光二極體 20 201117690 300 —基板 310 ' 311、312、313…接觸焊墊 312A---導電彈性物質 312B---絕緣彈性物質 320、321、322、323…基板接觸面 325 —電阻區域 326—南導電區域 390、391、392、393 ---目標接觸面 395 —目標平台 410---電子器件 500 —基板 510、511、512…嵌入式電容 520、521、522 —導電接觸面 525 —絕緣區域 526—導電區域 590、591、592 ---導電接觸面 595---目標平台 600 —基板 610、611…複合彈性物質 612---圓柱形電容 613 —中心導電柱 614…絕緣物質層 615…導電圓筒 616、617---嵌入式電容器 618 —中心導電柱 619- --絕緣彈性物質 620— 基板接觸點 621 ---導電接觸壞 622 —基板接觸面 690…導電接觸點 21 201117690 691- --導電接觸環 692- --導電接觸點 . 693 ---導電接觸圓形環 695 —目標平台 ' 700 —基板 710- --第一彈性物質 711- --第二彈性物質 712、 715—複合彈性物質 713、 716---導電彈性物質 714、 717—絕緣彈性物質 720、721…焊墊接觸點 鲁 722、723 —焊墊接觸面 730、731、732、733、734—嵌入式電容器 790—第一目標接觸面 791…第二目標接觸面 792、 794…第一接觸區 793、 795…第二接觸區 799—目標平台 800…積體電路 810、820、830—複合彈性物質體 ^ 8U、812、813—焊墊接觸面 821、822、823 —目標接觸面 840、850、860…複合彈性物質體 22That is, the design of the "noon^" digital circuit includes a combination of resistors and capacitors (also RC circuit). The eighth figure is the application of some different RC circuits connected to the pin 5 of the =10 (10) 800. ^路❹电杂物f is owed to the contact 烊塾 of the integrated circuit 800. The word is connected to the rail = human Lit _ sexual material surrounded by the center of the resistor 5 = f. The RC circuit on the substrate contact surface 823 _ and the signal connection mode 2 'such as connected to the integrated circuit 800 (10) pins i, 2 and 3 16 201117690 circuit 'is available - surrounded by an insulating elastic material, to: elastic material similar Composite bomb body 810, 820, 830 road two bean pin dip,:: kg is not coupled to the pin 2 and 3 embedded this electric foot connection 'rounding signal indication, grounding connection' and The structure of the composite elastic material body is for the purpose of illustration. It is also the case of the re-opening of the early 5th! Give more #马合到积体电路(IC) 800-pin 4 and 3 on the composite elastic body and Coupling to the pin 2 and the body, have different structures. For example, even the RC road, spoon The 4 pin is embedded in the composite elastic body 840, and then the core is surrounded by an insulating cylinder. The connected wheel m touches the rc circuit connected to the target platform. The composite elastic material body 850 is not the same as the RC circuit 7 of a connected body of $^^_4 pin; the interface contact surface of the body coffee and the Rc circuit of the target connection = 4 to the pin 4, For pulse width modulation (WM) or for feedback to the 遽 frequency circuit, etc. The composite elastic material body _ shown in the eighth figure, for example, the Rc circuit of the fifth pin of the 800路800. This RC circuit,: In the embodiment, the dance material of the composite elastic material body 860 is composed of one of the contact bauxite, the contact pad on the surface, and the fifth contact of the integrated circuit, and a contact pad on the substrate. The welding contact surface c ^ ' on the surface: Do: Put a variety of geometric knots in the '疋 can be passive parts and their combination, the year into the contact two 17 201117690 touch moving elements directly into the connection. Traditional electricity ===== =; ruler:: naturally will increase. Its = two:; s use compensation capacitor, terminating resistor / or current limiting resistor: =shi inverse ==== step of moving the component. This is ====== when the number of components placed is quite large. #尤,, 疋 10,000 10,000 placed passive subsystem performance and performance , Zii on the mutual interference, making electricity (four) H #轩树麟上_Electric post or target platform, in the electric parts: from the electronic fe loading towel ί sub-components: 焊 welding f (four) 'to make electronic assembly without the use Heating 5 2 = the production process of the product, and is beneficial to the electronic components ί This is very good for the two bee ίί:: ίίί 本 ' at the same time to reduce the proliferation of electronic waste, non-hanging favorable green _ needs. Conductive elastic materials, passive components 201117690 pieces, in the welding shovel, can reduce hundreds of thousands of discrete pieces each year for Kyoko to cry the management of materials. The contact soldering material made of conductive elastic material will make an electron that does not need to be heat-welded in the return air furnace. Secondly, [the main thing is to be the same as the conductive elastic material and the printed circuit board. Contact surface, good contact. The picking machine, the county, _ smt, has a new one to pick up some ultra-small passive components. In electronic assembly, :; ί == solder to solder these pins of ultra-small passive components, soldering ultra-small passive components to electronic assembly problems 1 ί=ί^? And the passive component package is replaced by a second package, and the replacement is replaced by a package with a smaller size. Next, the nightmare of the passive component of the 虞ϊϋ 裴 裴 is a 〇 _ 封 封 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于The problem of soldering these ultra-small packages to the short-circuited solder or soldering of these ultra-small packages is that the ultra-small package of the ultra-small package is small in size and is also small, and is also processed and processed. Or when the actual use on the market falls off, when the manufacturing of =tis, there will be a passive component needed, _ embedded in the contact _, will make a new style, ^ this hair (four) concrete real and boots in the diligent The structure and the element 2 are simple, please ride the scales of the special (four), and make various modifications to the configuration, operation and details. 19 201117690 [Simplified description of the drawings] * The first figure shows a guide 10 of a specific embodiment of the present invention. ^&Beacon coupled to the substrate of the contact pad. The second diagram of the conductive elastic material diagram shows that the present invention connects a plurality of resistors to the electronic crying member. The third figure shows a specific embodiment of the present invention. It is used to make a 5 to f sub-device contact to form a side view of the resistance. The four figures show the fifth figure of the invention connecting a plurality of capacitors to the electronic device. Shows a specific embodiment of the present invention Lei Qiang Bu guide "heart map. A side view of 4 on the scales to achieve different capacitive applications. The present invention - the specific implementation of the contact welding of a substrate to the substrate. Adjusting (4) above (10) into the cross-section of each type of cut-off combination, the implant is shown in detail, and the other is the conductive elastic material surface. A contact pad of a substrate is formed to form a cross-section of the conductive elastic material in a cross-section of various passive component combinations to form a cross-section of various resistors and capacitors. Body embodiment. ============================================================================================================== ...contact pad 312A---conductive elastic material 312B---insulating elastic material 320, 321, 322, 323... substrate contact surface 325 - resistance region 326 - south conductive region 390, 391, 392, 393 --- target contact Face 395 - target platform 410 - electronic device 500 - substrate 510, 511, 512 ... embedded capacitors 520, 521, 522 - conductive contact surface 525 - insulating region 526 - conductive regions 590, 591, 592 - conductive contact Face 595---target platform 600 - substrate 610, 611... composite elastic material 612 - cylindrical capacitor 613 - central conductive column 614 ... insulating material layer 615 ... conductive cylinder 616, 617 - embedded capacitor 618 - Center conductive column 619--insulating elastic material 620-substrate contact point 621--conductive contact bad 622-substrate contact surface 690...conductive contact point 21 201117690 691- -- conductive contact ring 692- -- conductive contact point. 693 ---Electrical contact round 695 - target platform '700 - substrate 710 - - first elastic material 711 - - second elastic material 712, 715 - composite elastic material 713, 716 - conductive elastic material 714, 717 - insulating elastic material 720, 721 ...pad contact point 722, 723 - pad contact surface 730, 731, 732, 733, 734 - embedded capacitor 790 - first target contact surface 791 ... second target contact surface 792, 794 ... first contact area 793 , 795...second contact area 799—target platform 800... integrated circuit 810, 820, 830—composite elastic material body 8U, 812, 813—pad contact surfaces 821, 822, 823—target contact surfaces 840, 850, 860...composite elastic body 22