201114571 六、發明說明： 【發明所屬之技術領域】 本發明涉及-種將半導體晶圓等工件分離成晶片單元 :斷開裝置’更詳細而t，本發明涉及一種將固定於切割 環之環内之所張設之黏著帶卜夕 聋有命上之工件沿著刻設於工件上之 劃線而分離成晶片單元之斷開奘 阿间裝置。本發明中，作為加工 對象之工件主要是石夕等之半暮於曰 千导體日日圓，但只要是劃線長度 會根據工件上之位置變化之报扯, 之开ν狀（例如圓形或橢圓形等） 之脆性材料所構成之工件，g 卩使係坡璃基板或陶瓷基板亦 可適用》 【先前技術】 ^半導體裝置之生産㈣中’包括將縱橫地排列於圓 =體晶圓上且形成有多數個方形晶片分離成晶 之切割步驟。 圖，表以切割步驟中保持晶圓之環構件之 w由黏著片12與切割二構圖成21日“）是前視圖。環構件 黏著片12。而且，在晶圓以圍。曰曰圓11之背面側貼附在 著片12之切割環13 (亦稱以以張設狀態支承黏 切割環u是厚戶爲广圓環）貼附在相同之黏著片 在切割步驟中，V環槿:m左右之金屬産真。 割機或雷射光束來縱橫：：:固定之晶圓11使用切 長度，橫越晶圓U之巾水 條劃線lla。劃線山之 附近之劃、線Ila較短、附近之劃線lla較長，橫越周緣 且，晶圓11在貼附於環構件】〇、 201114571 之狀態下沿著晶圓11上之各劃線"a分離成晶片單位。 以往，將晶圓11分離成晶片單元時所使用之斷開裝置 是利用如下方法來施加彎曲力矩：從黏著片12之背面侧使 j斷開球滾動以進行按壓（例如參照專利文獻n ;或者 著里j線11a抵壓與日曰圓11之接觸面爲直線狀之線狀按壓 體（以下在本說明書中亦稱爲斷開桿）、或接觸面爲圓柱 之側面之棒狀輥來進行按壓（例如參照專利文獻2)。 [先前技術文獻] [專利文獻] [專利文獻1]曰本特開平1〇_74712號公報 [專利文獻2]日本特開2〇〇6_66539號公報 【發明内容】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for separating a workpiece such as a semiconductor wafer into a wafer unit: a breaking device. In more detail, the present invention relates to a ring to be fixed in a ring of a cutting ring. The adhesive tape provided by the device has a workpiece that is separated from the workpiece by a scribe line engraved on the workpiece to be separated into a wafer unit. In the present invention, the workpiece to be processed is mainly a half-turned conductor of the Shih-Hyun et al., but as long as the length of the scribe line changes according to the position on the workpiece, the opening is ν-like (for example, a circle Or a workpiece made of a brittle material such as an elliptical shape, etc., may be applied to a glass substrate or a ceramic substrate. [Prior Art] ^Production of a semiconductor device (4) includes 'arranging vertically and horizontally on a circle=body wafer A cutting step is formed on which a plurality of square wafers are separated into crystals. The figure is a front view of the ring member holding the wafer in the cutting step by the adhesive sheet 12 and the cut-off pattern. The ring member is attached to the sheet 12. Moreover, the wafer is surrounded by the wafer. The back side is attached to the cutting ring 13 of the sheet 12 (also referred to as supporting the adhesive cutting ring u in a stretched state, the thick ring is a thick ring) attached to the same adhesive sheet in the cutting step, V ring: The metal around m is produced. The cutting machine or laser beam is used for vertical and horizontal::: The fixed wafer 11 uses the cut length, traversing the wafer U to mark the line lla. The line near the line is the line Ila The shorter, adjacent scribe line 11a is longer and traverses the circumference, and the wafer 11 is separated into wafer units along the respective scribe lines "a on the wafer 11 while being attached to the ring member 〇, 201114571. Conventionally, the breaking device used to separate the wafer 11 into wafer units is to apply a bending moment by causing j to be rolled from the back side of the adhesive sheet 12 to be pressed (for example, refer to Patent Document n; A linear pressing body in which the contact surface of the j-line 11a is in a straight line with the contact surface of the corrugated circle 11 (hereinafter In the specification, it is also referred to as a "breaking rod" or a rod-shaped roller whose contact surface is a side surface of a cylinder (for example, refer to Patent Document 2). [Prior Art Document] [Patent Document] [Patent Document 1] 曰本特开平[Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. 6-66539.
* I 如專利文獻1所記載之使用斷開球作爲按壓構件之方 法如圖22所示，使斷開球丨5以一定之間距p在晶圓丨丨上 /α正方向、反方向交替折返地滾動來施加載重。其結果， 斷開球15每描畫一條軌跡，則劃線每次斷開一條或斷開複 數條。 备針對斷開球15之一條軌跡每次斷開一條劃線時，由 於可在所有劃線之正上方使斷開球丨5滾動，因此對各劃線 垂直地施加載重而形成垂直之裂縫，但至斷開晶圓上之所 有剎線爲止需要使斷開球1 5滚動相當長之距離，而使得處 理需要較長之時間》當利用增大了直徑之斷開球15來使晶 圓彎曲，在一條軌跡上每次斷開複數條劃線時，即可縮短 處理時間，但若母次斷開複數條劃線，那麼對於任一條劃 201114571 線’即均不在其正上方而在稍微偏離之位置上使斷開球15 滚動’因此對不在其正上方滾動斷開球之劃線斜向地施加 載重，結果難以使裂缝垂直地滲透，而容易産生毛邊。 又如專利文獻2所記載’在使用如圖23所示之棒狀 輥16或如圖24所示之斷開桿17 (線狀按壓體）作爲按壓 構件，一邊使此等沿著黏著片12之面滑動一邊進行按壓之 方法中，處理速度並不存在問題，但若在棒狀輥16等移動 至即將要斷開之劃線之正下方之位置之前，在從劃線之傾 斜方向受到載重之狀態下進行斷開，如此裂縫將難以於垂 直方向上滲透’而容易産生毛刺。 又，作爲其他問題，在按壓時，若棒狀輥16或斷開桿 1 7碰撞到保持晶圓丨丨之環構件丨〇之切割環13 (圖2 1 )， 如此將無法按壓晶圓11β若將切割環之環内徑設爲a，即如 圖21所示，爲使可按壓之面積成為最大而將棒狀輥或 斷開桿17之長邊方向之寬度設爲此時，可斷開之晶 圓11之直徑最大亦必須在a/A^以下。 曰 因此，需直控相對於晶圓u之直徑足夠大之黏著片以 或切割環13，進而斷開梦罟太& + 所開裝置本身亦必須要相對於作爲加工 對象之晶圓11而整體大型化。 因此，本發明之目的右 的在於k供一種斷開裝置，該斷房 裝：：在藉由使用直徑稍大於加工對象即圓形工件 之=之切割環之環構件來保持工件之狀態下沿著工: 之劃線施加垂直之載重，從而斷開工件。 爲了達成前述目的， 明之斷開裝置是沿著形成 採取如下之技術手段。即，本發 於工件上之複數條劃線來分斷耳s 201114571 件之斷開裝置，且使用由切割環與在切割環之環内所張設 之點著帶所構成之環構件作爲用以保持工件之支承構件。 又，工件處於貼附在環構件之黏著帶之狀態。此外，貼附 於環構件之工件是如圓形或橢圓形般，形成於工件上之複 數條劃線之長度會根據工件上之位置而變化之形狀。 斷開裝置中設置有：按壓機構，其具備斷開桿，該斯 開桿具有直線狀之按壓面，且沿分斷對象之劃線之正背後 從環構件之黏著帶側按壓工件；以及工件支承機構，其具 備抵接於工件側且抵抗斷開桿之按壓力而支承工件之支承 構件； 斷開桿沿按壓面之長邊方向被分割成固定區塊部與可 變區塊部，且設有使可變區塊部之按壓面變化為較固定區 塊部之按壓面更退縮之退避狀態之按壓面調整機構。 又，斷開桿，在根據分斷對象之劃線長度而調整了斷 開桿之按壓面長度之狀態下按壓工件。 亦即，形成於圓形等之工件之複數條劃線之長度在工 件之周緣附近較短，在工件之中央變長，當分斷工件之周 緣附近時，斷開桿之按壓面容易碰撞到切割環。因舍 田 刀斷周緣之較短劃線時，係在將可變區塊部之按壓面退縮 之退避狀態下僅以固定區塊部之按壓面按壓工件，當分斷 周緣時使斷開桿不接觸於切割環。當分斷工件中央之較長 劃線時，係在將可變區塊部之按壓面與固定區塊部之按壓 面相一致之狀態下進行按壓。 藉此’按照工件上之劃線之位置，調整成使斷開桿之 可變區塊部不會碰撞到切割環來進行分斷。 201114571 此外纟隔著工件與斷開桿相反之側使工件支承機 :之支承構件抵接於工件，但支承構件亦可抵接於由斷開 柃斤按壓《冑分區域之正背後附近’亦可抵接於工件整 體。藉此’當斷開桿㈣工件之背面側之黏著帶時，黏著 帶不會於按塵方向上大幅延伸，而是在與按壓前大致相同 之狀態下被分斷’因此可對分斷預定位置之劃線進行高精 度之分斷。 根據本發明，可按照依工件上之位置而變化之劃線之 長度調整成斷開桿t可變區塊部不會碰_切割環之方式 來進行分斷。藉此’可在藉由直徑較作爲加工對象之圓形 工件（晶目等）《直徑略大之環構件來保持工件之狀態下， 向工件之劃線上施加載重來進行斷開。進而，使支承構件 抵接於隔著工件而與斷開桿相反之側來抑制黏著帶之延 伸，因此可使斷開桿沿著劃線準確且垂直地按壓，而能以 垂直之裂縫進行分斷。 上述發明中較佳方式為，斷開桿之可變區塊部在固定 區塊部之長邊方向兩側分別被分割成相同數量之單位區 塊，且單位區塊安裝成在固定區塊部之兩側成左右對稱， 按壓面調整機構係按照位於左右對稱之位置之每對單位區 塊進行使斷開桿之按壓面變化之調整。 藉由將可變區塊部較小地分割成複數個區塊，而可根 據作爲加工對象之劃線之長度而逐漸調整斷開桿之長度， 即便切割環之直徑相同，斷開桿亦不會碰撞到切割環而 可貼附直徑更大之工件進行分斷。 在上述發明中較佳方式為，使前述斷開桿之按壓面冬q 7 201114571 最大長度L相較切割環之環内徑a在下式之範圍内 a > L > a/VI。 藉此對於工件直徑大於a/ 之jl件，只要最大直徑 不超過斷開桿長度L，即可進行分斷。 在上述發明中較佳方式為，支承構件，係由在沿著劃 線=隔著劃線之左右兩側之位置分別抵接於卫件之一對支 承桿構成 冑t承桿分別被分割成固冑區塊部與可變區 塊。卩，且设有使可變區塊部之抵接面變化爲較固定區塊部 之抵接面更退縮之退避狀態之抵接面調整機構。 藉由將支承構件設爲沿著劃線在隔著劃線之左右兩側 之位置上为別抵接於工件之一對支承桿，以沿著劃線支承 斷開桿所按壓之左右兩側’藉此向劃線上準確地施加彎曲 力矩，而使裂縫易於垂直地滲透。 進而，當分斷工件周緣之較短劃線時，係以將支承桿 之可變區塊部之按Μ面退縮之退避狀態<堇以固定區塊部之 按壓面支承工件，以使支承桿於分斷周緣時亦不會接觸切 割環。當分斷工件中央之較長劃線時，形成使支承桿之可 變區塊部之抵接面與固定區塊部之抵接面相一致之狀態。 藉此，與斷開桿相同地，可根據工件上之劃線之長度，以 使支承桿之可變區塊部不碰撞到切割環之方式加以調整來 進行分斷》 此處較佳方式為，一對支承桿之可變區塊部在固定區 塊部之長邊方向之兩側分別被分割成相同數量之單位區 塊，並且單位區塊安裝成在固定區塊部之兩侧成對並左右 對稱’該按壓面調整機構係按照位於左右對稱之位置之每 8 201114571 對單位區塊進行使支承桿之按壓面變化之調整。 藉由將支承桿之可變區塊部較小地分割成複數個單位 區塊，而可與斷開桿同樣地逐漸調整長度，即便切割環之 直私相同，支承桿亦不會碰撞到切割環，而可貼附直徑更 大之工件進行分斷。 又，較佳方式為，支承構件由沿著劃線抵接之支承桿 構成，支承桿被分割成固定區塊部與可變區塊部，且設有 使可變區塊部之抵接面變化爲較固定區塊部之抵接面更退 縮之退避狀態之抵接面調整機構。 藉由將支承構件設爲沿著劃線抵接於工件之支承桿， 以沿著劃線支承斷開桿所按壓之正背後之位置，藉此向劃 線上準確地施加按壓力，而能夠以垂直裂縫進行分斷。此 外，在這種情況下，可使支承桿爲一個，但與使一對支承 桿&著劃線之左右兩側抵接之情況相較，需要稍微增強按 壓力。 同樣地，可根據工件上之劃線之長度，將支承桿之可 變區塊部之長度調整成不與切割環碰撞，以進行分斷。 。在這種情況下較佳情形為，支承桿之可變區塊部在固 ^區塊部之長邊方向之兩側分別被分割成相同數量之單位 區塊，並i單位區塊安裝《在固$區塊部之兩側成對並左 右對稱，該按壓面調整機構係按照位於左右對稱之位置之 每對單位區塊進行使支承桿之按壓面變化之調整。 又，上述發明中較佳方式為，具備用以設定對形成於 工件上之複數條劃線之斷開順序之輸入部；工件搬送機構 根據所設定之斷開順序’將環構件之位置調整成分斷對^ 201114571 之劃線會依序來到與斷開桿之按壓面對向之位置。 當取出形成於工件上之晶片時’在存在優先順序之情 、况下’亦可根據優先順序選擇劃線進行分斷。 較佳方式為，輸入部設有依序進給模式作爲可設定之 斷開順序之一’該依序進給模式係依照形成於工件上之複 數條劃線之排列順序進行斷開。 藉由設定依序進給模式，由於工件搬送機構只要依次 使斷開桿之按壓面對準鄰接之劃線即可，因此可縮短位置 調整之時間。 較佳方式為，輸入部設有外侧優先模式作爲可設定之 斷開順序之一，該外側優先模式係對形成於工件上之複數 條劃線，從最接近周緣之左右劃線起進行斷開，依次逐一 進行内側之左右劃線之斷開，最後進行中央之劃線之斷開。 藉由設置外侧優先模式，到進行所有之斷開爲止所花 費之時間會較依序進給模式稍多，但另__方面，由於從接 近工件左右兩側之周緣之側之劃線依次進行斷開，因此可 左右大致均等地且較平衡地進行分斷，㈣帶上所張設之 工件之重心之移動變小，可實現更準確之位置上之分割。 較佳方式為’輸入部設有等分割模式作爲可設定之斷 開順序之…該等分割模式係、對形成於卫件上之複數條割 線進行將工件分爲二部分之斷開，接著進行分爲四部分之 斷開’接著進行分爲八部分之斷開，之後再對經分割之各 工件分別進行等分割。 藉由設置等分割模式，與外側優先模式同樣地，到進 行所有斷開爲止所花費之時間會較依序進給模式稍多，但 10 201114571 另一方面，由於所要斷開之劃線之左右之寬度變得大致均 等，因此可較平衡地進行斷開，且能夠實現準確之位置上 之斷開。 【實施方式】 以下，根據圖式來詳細說明本發明之斷開裝置之詳細 情況。此處，以沿著圓形之晶圓上所刻設之複數條劃線來 斷開晶圓之情形爲例進行說明。 (環構件） 首先’對作爲加工對象之晶圓與保持晶圓之環構件之 關係進行說明。圖1是表示貼附了晶圓之狀態下之環構件 之一例之俯視圖。環構件10由黏著片12與切割環i 3構成。 切割環13是厚度爲丨5 mm左右之金屬製品。將晶圓丨丨之 背面侧貼附於黏著片12上而固定。 在將切割環13之内徑設爲a時，不僅在可利用該環構 件1 〇斷開之晶圓11之直徑D較以往作爲可斷開之最大直 從之a/W更小時可進行斷開’而且即便直徑〇爲a/々以上 之較大直徑，只要較下述斷開桿之最大長度L· (其中L< a) 更小’亦可進行斷開。 (斷開裝置之構造） 其次，對本發明之斷開裝置之構成進行說明。圖2是 厂、 方向（按壓機構側）觀察本發明之一實施形態之 斷開裝置2〇之整㉟播 妙 <登:體構成之立體圖。又，圖3是表示從與圖 反之方向（工件支承機構側）觀察斷開裝置20之整體 構成之圖。a _ 另外，圖4是斷開裝置20之前視圖（按壓機褥s 11 201114571 側）’圖5是德支目固, 爲便於支承機構側）’圖6是俯視圖。 邊 S ’如圖中所示’對於斷開裝置20，將事置 之長邊方向設爲又方向來規定相互正交之χγζ方向將裝置 機構：開裝置2〇主要由基底21、按壓機構22、工件支承 :構…、工件搬送機構24、推車25、空氣板“構 一、土底21上之一側支承按壓機構22與空氣板26，於 另侧支承-對工件支承機構23a、⑽。按壓機構 办 氣板26广中間係支承工件搬送機構24。 - 其-人’對按壓機構22進行說明。圖7是表示按壓機構 22之圖按壓機構22經由台座31而固定於基底21上。在 台座31上固定有垂直臂32,藉此底板^以垂直&方 向）豐立之方式固定。在底板33上平行安裝有2條線性導 件34，#由線性導件34及馬達（未圖示）將可動板35支 承成可在則後方向（z方向）滑動。於可動板3 $安裝有經 單元化之斷開桿36，斷開桿36之前端來到較可動板35之 -側端更朝外側突出之位置。該前端部分成爲按壓晶圓u 之按壓面。 圖8疋表不斷開桿36之構成之圖，圖是立體圖， 圖8 (b)是前視圖，圖8 (c)是俯視圖，圖8 (d)是側視 圖。 斷開桿36被分割成中央之固定區塊37、以及其左右兩 侧之可變區塊38a、38b，進而可變區塊38a、38b分別被分 割成較小之單位區塊39。各單位區塊39由與固定區塊37 一體地固定之支承構件37a支承《各單位區塊39具備使用 12 201114571 氣壓閥且利用空氣作動之升降機構4〇，升降機構4〇是作爲 使各按壓面（各單位區塊39之前端部分）之位置退避至較 固定區塊37之按壓面之位置更退縮之位置之按壓面調整機 構77 (圖17)來發揮作用。又，單位區塊39在固定區塊 3 7之左右兩側數量相同，並且是對稱地安裝，位於對稱之 位置之單位區塊39彼此成對（總計4對）地進行退避動作。 圖9是表示斷開桿36之按壓面之變形圖案之圖。按壓面可 依照單位區塊39之位置變化而變化成ρι〜ρ5這5種圖案。 根據作爲加工對象之晶圓丨丨之大小，適當設定斷開桿 36中之固定區塊37之按壓面之長邊方向之尺寸及單位區塊 39之按壓面之長邊方向之尺寸。在本實施形態中例如將 固定區塊37之長邊方向之長度設爲約1〇〇 mm，將單位區 塊39之長邊方向之長度設爲約125mm (總計8條），作 爲斷開桿36，將最長之長度L設爲約2〇〇 mm。因此，斷開 才干36之長度L根據圖案P1〜p5之變化而成為約1〇〇出爪、 約125 mm、約150 mm、約175 _、約2〇〇匪。藉此，可 斷開最大200 mm ( 8英寸）之晶圓i丄。 圖10是斷開桿36 (固定區塊37及單位區塊39)之按 壓面之寬度方向截面。作爲按壓面之寬度方向之尺寸將 前端設爲0.1 ；zm〜3_左右之錐狀，以較窄之寬度接觸 晶圓11，從而使載重成線狀地集中施加。 另外'斷開桿36 (固定區塊37及單位區塊39)最好 係使用㈣時難以變形之較硬材質，例如使用工具鋼。 其次’對工件支承機構23a、23b進行說明。圖"是表 示工件支承機構23a、23b之構成之圖，_ u⑷是立罈 13 201114571 圖，圖11 (b)是前視圊。工件支承機構23a、23b分別搭 載在台座41a、41b上’借由使用滾珠螺桿及馬達之支承桿 驅動機構41d使台座41a、41b可在執道41〇上移動。 在工件支承機構23a、23b中，除支承桿46 (相當於圖 7之斷開桿36)以外’均採用與圖7 _所說明之按壓機構 22相同之機構。因此，除支承桿46以外之工件支承機構 23a' 23b各部分之符號與圖7相同，所以省略說明。 圖12是表示支承桿46之構成之圖，圖i2(a)是立體 圖’圖12(b)是前視圖’圖12(c)是俯視圖，圖12(d) 是側視圖。 支承桿46被分割成中央之固定區塊47、以及其左右兩 侧之可變區塊48a ' 48b，進而可變區塊48a、48b分別被分 割成較小之單位區塊49。各單位區塊49由與固定區塊47 一體地固定之支承構件47a支承。 各單位區塊49具備使用氣壓閥且利用空氣驅動之升降 機構50，升降機構5〇是作爲使各抵接面（各單位區塊49 之前端部分）之位置退避至較固定區塊47之抵接面位置更 退縮之位置之抵接面調整機構78 (圖17)來發揮作用。又’ 單位區塊49在固定區塊47之左右兩側數量相同且對稱地 安裝，位於對稱之位置之單位區塊49彼此成對（總計4對） 地進行退避動作6 亦即，與圖8之斷開桿36之按壓面調整機構相同之機 構在圖12中發揮支承桿46之抵接面調整機構之作用。又， 關於支承桿46之根據單位區塊49之變形圖案，亦與斷開 桿36之變形圖案同樣地為ρι〜ρ5 (圖9)。 201114571 支承桿46之尺寸基本上與斷開桿36相同，但抵接於 晶圓11之前端部分之形狀及材質不同。 圖13是支承桿46 (固定區塊47及單位區塊49)之寬 度方向截面。支承桿46之前端面呈平面。但並不限於此， 亦可是曲面。支承桿46之前端部分之材質使用彈性橡膠， 以於按壓時柔軟地接觸晶圓u。 其次’再次參照@ 2〜目6對工件搬送機構24及推車 25進行說明。工件搬送搬機構24在垂直登立之框結構之框 架61之上方及下方’設有用於支承且搬送推車Μ之線性 導件62,且利用線性馬達（未圖示）使推車25橫向^方 向）㈣。在推車25之中央形成有安裝環構件Μ之孔。 ，女裝於推車25之環構件1〇藉由工件搬送機構24被搬 运到按壓機構22肖工件支承機構…、⑽之間且使刻設 :晶圓"之劃線來到斷開桿36之正背後之斷開位置。接 =相繼斷開複數條劃線時進行位置調整，以使各劃線 依次來到斷開位置。 位方：Γ整是藉由採用了攝影機之定位方法或機械式定 Γ:中之=方法來進行。例如亦可預先利用安裝在裝置 拍攝，缺二（未圖不）對刻設於晶圓11之對準標記進行 拍攝，然後藉由影像處理進 度地貼附於環構株* 當將晶圓11高精 25 g* ，並將環構件10高精度地安裝於推車 之二=_#425相對於Μ在斷開裝置⑽設定 原點^之位置座標來進行定位。 件10、、推5車"'氣板26。作爲加工對象之晶圓11藉由環構 件搬迭機構24而以垂直豎立之狀態 15 201114571 到支承’且可利用此等之支承進行斷開處理。然而，在環 構件10上，晶圓11是貼附於易受到振動之黏著片12 黏者片12振動，晶圓11本身亦會受到影響。因此為了 沿著刻設於晶圓U之劃線進行更高精度之斷開處理Y 係採行防振對策。 因此，在本實施形態中，係進一步於按壓機構22周圍 進安裝有方形之空氣板I线板26在與環構件10對向 之位置上形成有多個喷嘴孔，從一部分喷嘴孔中噴出乾燥 '空氣，且利用一部分喷嘴孔進行吸引，藉此，當將推車"25 設置於斷開位置時，係以非接觸之狀態使黏著片12及其上 所貼附之晶圓11在垂直豎立之狀態下穩定。 其次，對按壓機構22與工件支承機構23a、2补之斷開 時之位置關係進行說明。圖14是爲便於說明而省略 搬送機構24、推車25、空氣板26來表示按壓機構22與工 件支承機構23a、23b之位置關係之圖。如圖M(a干， 按壓機構22與一對工杜*系她接’ 対工件支承機構23a、23b隔著環構件1〇 而對向。 斷開才干36與支承桿46 (環構件1〇之背面側）在高度*I As shown in Fig. 22, the method of using the disconnecting ball as the pressing member as described in Patent Document 1 is such that the breaking ball 5 is alternately folded back in the positive/negative direction and the opposite direction of the wafer 以 at a certain distance p. Roll to ground to apply the load. As a result, each time the ball 15 is drawn, one line is drawn, and the line is broken one at a time or a plurality of lines are broken. When one of the trajectories of the disconnecting ball 15 is broken each time a scribe line is broken, since the breaking ball 丨 5 can be scrolled directly above all the scribe lines, a vertical load is applied to each scribe line to form a vertical crack. However, it is necessary to make the disconnecting ball 15 roll a considerable distance until all the brake wires on the wafer are disconnected, so that the processing takes a long time" when using the increased diameter of the disconnecting ball 15 to make the wafer Bending, the processing time can be shortened each time a plurality of lines are broken on one track, but if the parent line breaks the plurality of lines, then for any line 201114571 line 'is not directly above it but slightly The position of the deviation causes the breaking ball 15 to roll. Therefore, the load is applied obliquely to the line which does not roll the ball directly above it. As a result, it is difficult to cause the crack to penetrate vertically, and burrs are easily generated. Further, as described in Patent Document 2, "the stick roller 16 shown in FIG. 23 or the break lever 17 (linear pressing body) shown in FIG. 24 is used as the pressing member, and these are along the adhesive sheet 12; In the method of pressing while sliding on the surface, there is no problem in the processing speed, but the load is received from the oblique direction of the scribe line before the rod roller 16 or the like moves to a position immediately below the scribe line to be broken. In the state of being disconnected, it is difficult for the crack to penetrate in the vertical direction, and burrs are easily generated. Further, as another problem, when the pressing roller 16 or the breaking lever 17 collides with the cutting ring 13 that holds the ring member of the wafer cassette (Fig. 21), the wafer 11β cannot be pressed. When the inner diameter of the ring of the cutting ring is a, that is, as shown in FIG. 21, the width of the longitudinal direction of the rod-shaped roller or the breaking lever 17 is set to be the largest in the area where the pressing is possible, and can be broken. The diameter of the opened wafer 11 must also be below a/A^. Therefore, it is necessary to directly control the adhesive sheet or the cutting ring 13 which is sufficiently large with respect to the diameter of the wafer u, and thereby disconnect the nightmare & + the opened device itself must also be relative to the wafer 11 as the processing object. The overall size is large. Therefore, the object of the present invention is to provide a breaking device for maintaining the state of the workpiece by using a ring member having a diameter slightly larger than the cutting ring of the processing object, that is, a circular workpiece. Work: The line draws a vertical load to break the workpiece. In order to achieve the foregoing objects, the breaking device is constructed along the following technical means. That is, the plurality of lines drawn on the workpiece are used to break the breaking device of the earphones 201114571, and the ring member formed by the cutting ring and the point in the ring of the cutting ring is used as a ring member. To maintain the support member of the workpiece. Further, the workpiece is in a state of being attached to the adhesive tape of the ring member. Further, the workpiece attached to the ring member is a circular or elliptical shape, and the length of the plurality of scribe lines formed on the workpiece varies depending on the position on the workpiece. The breaking device is provided with: a pressing mechanism having a breaking lever having a linear pressing surface, and pressing the workpiece from the adhesive tape side of the ring member along the front side of the line of the breaking object; and the workpiece a support mechanism having a support member that abuts against the workpiece side and supports the workpiece against a pressing force of the break lever; the break lever is divided into a fixed block portion and a variable block portion along a longitudinal direction of the pressing surface, and A pressing surface adjustment mechanism that changes the pressing surface of the variable block portion to a retracted state that is more retracted than the pressing surface of the fixed block portion is provided. Further, the lever is broken, and the workpiece is pressed while the length of the pressing surface of the breaking lever is adjusted in accordance with the length of the scribe line of the breaking target. That is, the length of the plurality of scribe lines formed on the workpiece such as a circle is short in the vicinity of the periphery of the workpiece, and becomes long in the center of the workpiece. When the periphery of the workpiece is broken, the pressing surface of the breaking lever is easily collided. Cutting the ring. In the retracted state in which the pressing surface of the variable block portion is retracted, the workpiece is pressed only by the pressing surface of the fixed block portion, and the breaking bar is broken when the peripheral edge is broken. Do not touch the cutting ring. When the long scribe line in the center of the workpiece is broken, the pressing surface of the variable block portion is pressed in a state in which it is aligned with the pressing surface of the fixed block portion. Thereby, the position of the scribe line on the workpiece is adjusted so that the variable block portion of the break lever does not collide with the cutting ring to be broken. 201114571 In addition, the workpiece supporting machine is connected to the workpiece by the opposite side of the workpiece and the breaking rod. However, the supporting member can also abut against the "near the back of the area" Can be attached to the entire workpiece. By the way, when the adhesive tape on the back side of the workpiece of the rod (four) is broken, the adhesive tape does not extend substantially in the direction of the dust, but is broken in a state substantially the same as before the pressing, so that the predetermined order can be divided. The line of position is divided by high precision. According to the present invention, the length of the scribe line which varies depending on the position on the workpiece can be adjusted so that the breaking lever t variable block portion does not touch the dicing ring to perform the breaking. In this way, the load can be applied to the scribe line of the workpiece by a circular member having a diameter smaller than that of the workpiece (crystal head or the like) which is a relatively large diameter to hold the workpiece. Further, the support member is abutted against the side opposite to the break lever via the workpiece to suppress the extension of the adhesive tape, so that the break lever can be accurately and vertically pressed along the scribe line, and can be divided by the vertical crack. Broken. Preferably, in the above invention, the variable block portion of the breaking lever is divided into the same number of unit blocks on both sides in the longitudinal direction of the fixed block portion, and the unit block is installed in the fixed block portion. The two sides are bilaterally symmetrical, and the pressing surface adjustment mechanism adjusts the pressing surface of the breaking lever in accordance with each pair of unit blocks located at the left-right symmetrical position. By dividing the variable block portion into a plurality of blocks, the length of the break bar can be gradually adjusted according to the length of the line to be processed, even if the diameter of the cutting ring is the same, the break bar is not It will collide with the cutting ring and can be attached to a larger diameter workpiece for breaking. In a preferred aspect of the invention, the maximum length L of the pressing surface of the breaking lever is smaller than the inner diameter a of the ring of the cutting ring in the range of the following formula a > L > a/VI. Thereby, for the workpiece having a workpiece diameter larger than a/, the breaking can be performed as long as the maximum diameter does not exceed the length L of the breaking rod. In a preferred aspect of the invention, the support member is divided into a pair of support members by a pair of guard members at positions along the left and right sides of the scribe line; Solid block block and variable block. Further, an abutting surface adjusting mechanism that changes the abutting surface of the variable block portion to a retracted state that is more retracted than the abutting surface of the fixed block portion is provided. By supporting the support member along the scribe line at a position separated from the left and right sides of the scribe line, the support rod is not abutted against the workpiece, and the left and right sides of the detachment rod are pressed along the scribe line. ' Thereby the bending moment is accurately applied to the scribe line, so that the crack is easily penetrated vertically. Further, when the short scribe line of the periphery of the workpiece is broken, the workpiece is supported by the pressing surface of the fixed block portion by the retracted state of the variable block portion of the support rod. The rod does not touch the cutting ring when the rod is broken. When the long scribe line in the center of the workpiece is broken, a state in which the abutting surface of the variable block portion of the support rod coincides with the abutting surface of the fixed block portion is formed. Thereby, similarly to the breaking lever, the variable block portion of the support rod can be adjusted to be broken according to the length of the scribe line on the workpiece so as not to collide with the cutting ring. The variable block portions of the pair of support bars are respectively divided into the same number of unit blocks on both sides in the longitudinal direction of the fixed block portion, and the unit blocks are installed to be paired on both sides of the fixed block portion. And the left-right symmetry 'the pressing surface adjustment mechanism adjusts the pressing surface of the support rod to the unit block every 8 201114571 located at the position of the left-right symmetry. By dividing the variable block portion of the support rod into a plurality of unit blocks, the length can be gradually adjusted in the same manner as the disconnecting rod, and even if the cutting ring is the same, the support rod does not collide with the cutting. The ring can be attached to a workpiece with a larger diameter for breaking. Further, preferably, the support member is constituted by a support rod that abuts along the scribe line, and the support rod is divided into a fixed block portion and a variable block portion, and is provided with an abutting surface of the variable block portion. The abutment surface adjustment mechanism that changes to a retracted state that is more retracted than the abutting surface of the fixed block portion. By using the support member as a support rod that abuts against the workpiece along the scribe line, the position of the positive back of the break lever is supported along the scribe line, thereby accurately applying a pressing force to the scribe line, thereby enabling Vertical cracks are broken. Further, in this case, the support rod can be made one, but it is required to slightly increase the pressing force as compared with the case where the pair of support rods & Similarly, the length of the variable block portion of the support rod can be adjusted so as not to collide with the cutting ring in accordance with the length of the scribe line on the workpiece for breaking. . In this case, it is preferable that the variable block portion of the support rod is divided into the same number of unit blocks on both sides of the long side direction of the solid block portion, and the i unit block is installed. The two sides of the solid block portion are paired and symmetrical, and the pressing surface adjusting mechanism adjusts the pressing surface of the support rod in accordance with each pair of unit blocks located at the left and right symmetry positions. Further, in a preferred aspect of the invention, the input unit for setting a breaking order of the plurality of scribe lines formed on the workpiece is provided, and the workpiece conveying mechanism adjusts the position of the ring member according to the set breaking order. The line of the 201114571 will come to the position facing the press of the break lever. When the wafer formed on the workpiece is taken out, 'in the case where there is a priority order', the scribe line may be selected in accordance with the priority order to be broken. Preferably, the input unit is provided with a sequential feed mode as one of the settable break orders. The sequential feed mode is broken in accordance with the arrangement order of the plurality of lines formed on the workpiece. By setting the sequential feed mode, the workpiece transfer mechanism can sequentially align the pressing surface of the break lever with the adjacent scribe line, so that the position adjustment time can be shortened. Preferably, the input unit is provided with an outer priority mode as one of the settable breaking orders, and the outer priority mode is a plurality of scribe lines formed on the workpiece, and is disconnected from the left and right scribe lines closest to the circumference. Then, the left and right scribe lines are disconnected one by one, and finally the central scribe line is broken. By setting the outer priority mode, the time taken until all the breaks are made will be slightly more than the sequential feed mode, but in other respects, the stitches from the side close to the circumference of the left and right sides of the workpiece are sequentially performed. When it is disconnected, it can be divided equally and uniformly, and the center of gravity of the workpiece placed on the belt becomes smaller, and the division at a more accurate position can be realized. Preferably, the input unit is provided with an equal division mode as a settable disconnection sequence. The division mode is to disconnect the workpiece into two parts for a plurality of secants formed on the guard, and then perform the division. It is divided into four parts of the disconnection', and then divided into eight parts, and then the divided pieces are equally divided. By setting the equal division mode, as in the case of the outer priority mode, the time taken until all the disconnection is performed is slightly more than the sequential feed mode, but 10 201114571 on the other hand, due to the line to be broken The width becomes substantially equal, so that the disconnection can be performed more balancedly, and the disconnection at the accurate position can be achieved. [Embodiment] Hereinafter, the details of the breaking device of the present invention will be described in detail based on the drawings. Here, a case where the wafer is disconnected by a plurality of scribe lines engraved on a circular wafer will be described as an example. (Ring Member) First, the relationship between the wafer to be processed and the ring member for holding the wafer will be described. Fig. 1 is a plan view showing an example of a ring member in a state in which a wafer is attached. The ring member 10 is composed of an adhesive sheet 12 and a cutting ring i 3 . The cutting ring 13 is a metal product having a thickness of about 5 mm. The back side of the wafer crucible is attached to the adhesive sheet 12 to be fixed. When the inner diameter of the dicing ring 13 is set to a, not only can the diameter D of the wafer 11 which can be broken by the ring member 1 be smaller than the conventional maximum a/W which can be disconnected. On and even if the diameter 〇 is a larger diameter of a/々 or more, it can be disconnected as long as the maximum length L· (where L < a) is smaller than the following breaking lever. (Structure of Disconnecting Device) Next, the configuration of the breaking device of the present invention will be described. Fig. 2 is a perspective view showing the entire structure of the disconnecting device 2 according to an embodiment of the present invention in the direction of the factory and the direction (pressing mechanism side). Further, Fig. 3 is a view showing the overall configuration of the disconnecting device 20 as viewed from the opposite direction (the workpiece supporting mechanism side). a _ In addition, Fig. 4 is a front view of the breaking device 20 (the side of the pressing machine 褥s 11 201114571). Fig. 5 is a view of the support member, and Fig. 6 is a plan view. The side S' is as shown in the figure. For the breaking device 20, the longitudinal direction of the event is set to be the direction to define the mutually orthogonal χγζ direction. The device mechanism: the opening device 2 is mainly composed of the base 21 and the pressing mechanism 22 , workpiece support: structure, workpiece transport mechanism 24, cart 25, air panel "construction one, one side of soil floor 21 supports the pressing mechanism 22 and the air plate 26, and supports the other side - the workpiece supporting mechanism 23a, (10) The pressing mechanism air plate 26 supports the workpiece conveying mechanism 24 in the middle. The pressing mechanism 22 will be described in the "body". Fig. 7 shows the pressing mechanism 22 of the pressing mechanism 22 being fixed to the base 21 via the pedestal 31. A vertical arm 32 is fixed on the pedestal 31, whereby the bottom plate is fixed in a vertical &litude manner. Two linear guides 34 are mounted in parallel on the bottom plate 33, # linear guide 34 and motor (not The movable plate 35 is supported to be slidable in the rear direction (z direction). The movable plate 3 is mounted with a unitized disconnecting lever 36, and the front end of the breaking lever 36 is brought to the movable plate 35. The side end protrudes further toward the outside. The front end portion becomes a pressed crystal Fig. 8 is a view showing the configuration of the unbroken rod 36, which is a perspective view, Fig. 8(b) is a front view, Fig. 8(c) is a plan view, and Fig. 8(d) is a side view. The rod 36 is divided into a central fixed block 37, and variable blocks 38a, 38b on the left and right sides thereof, and the variable blocks 38a, 38b are respectively divided into smaller unit blocks 39. Each unit block 39 is supported by a support member 37a integrally fixed to the fixed block 37. "Each unit block 39 is provided with a lifting mechanism 4" which uses a 12 201114571 air pressure valve and is operated by air, and the lifting mechanism 4 is used as a pressing surface (each unit) The position of the front end portion of the block 39 is retracted to a pressing surface adjustment mechanism 77 (Fig. 17) which is at a position which is more retracted than the position of the pressing surface of the fixed block 37. Further, the unit block 39 is at the fixed block 3 The number of the left and right sides of 7 is the same, and is symmetrically mounted, and the unit blocks 39 located at the symmetrical positions are retracted in pairs (total of 4 pairs). Fig. 9 is a view showing the deformation pattern of the pressing surface of the breaking lever 36. The pressing surface can be changed according to the position of the unit block 39. The five patterns are changed from ρι to ρ5. The size of the longitudinal direction of the pressing surface of the fixed block 37 in the breaking lever 36 and the unit block 39 are appropriately set according to the size of the wafer 作为 to be processed. In the present embodiment, for example, the length in the longitudinal direction of the fixed block 37 is set to about 1 mm, and the length in the longitudinal direction of the unit block 39 is set to be about 125 mm ( A total of eight), as the break lever 36, the longest length L is set to about 2 〇〇 mm. Therefore, the length L of the disconnection burr 36 becomes about 1 〇〇 claw according to the change of the patterns P1 to p5. 125 mm, about 150 mm, about 175 _, about 2 〇〇匪. This allows you to disconnect wafers up to 200 mm (8 inches). Fig. 10 is a cross section in the width direction of the pressing face of the breaking lever 36 (the fixing block 37 and the unit block 39). As the size of the pressing surface in the width direction, the tip end is set to have a taper shape of about 0.1 mm; zm to 3 mm, and the wafer 11 is contacted with a narrow width to collectively apply the load in a line shape. In addition, the 'breaking rod 36 (fixed block 37 and unit block 39) is preferably a harder material that is difficult to deform when using (4), for example, using tool steel. Next, the workpiece supporting mechanisms 23a and 23b will be described. The figure " is a diagram showing the composition of the workpiece supporting mechanisms 23a, 23b, _ u (4) is the figure 13 201114571, and Figure 11 (b) is the front view 圊. The workpiece supporting mechanisms 23a and 23b are respectively mounted on the pedestals 41a and 41b. The pedestals 41a and 41b are movable on the lane 41 by using the ball screw and the support rod driving mechanism 41d of the motor. In the workpiece supporting mechanisms 23a and 23b, the same mechanism as the pressing mechanism 22 described with reference to Fig. 7 is employed except for the support rod 46 (corresponding to the breaking lever 36 of Fig. 7). Therefore, the symbols of the respective portions of the workpiece supporting mechanisms 23a' to 23b other than the support rods 46 are the same as those in Fig. 7, and therefore the description thereof will be omitted. Fig. 12 is a view showing the configuration of the support rod 46. Fig. 12(a) is a perspective view. Fig. 12(b) is a front view. Fig. 12(c) is a plan view, and Fig. 12(d) is a side view. The support rod 46 is divided into a central fixed block 47, and variable blocks 48a' to 48b on the left and right sides thereof, and the variable blocks 48a, 48b are respectively divided into smaller unit blocks 49. Each unit block 49 is supported by a support member 47a that is integrally fixed to the fixed block 47. Each of the unit blocks 49 includes an elevating mechanism 50 that is driven by air using a pneumatic valve, and the elevating mechanism 5 is configured to retreat the position of each abutting surface (the front end portion of each unit block 49) to a fixed block 47. The abutting surface adjustment mechanism 78 (Fig. 17) at a position where the joint position is further retracted functions. Further, the unit block 49 is installed in the same number and symmetrically on the left and right sides of the fixed block 47, and the unit block 49 located at the symmetrical position is paired with each other (total of 4 pairs) to perform the retracting action 6 , that is, with FIG. 8 The mechanism in which the pressing surface adjustment mechanism of the breaking lever 36 is the same functions as the abutting surface adjusting mechanism of the support rod 46 in Fig. 12 . Further, the deformation pattern of the support bar 46 by the unit block 49 is also the same as the deformation pattern of the break lever 36 (Fig. 9). The length of the support rod 46 is substantially the same as that of the break lever 36, but the shape and material of the front end portion of the wafer 11 are different. Figure 13 is a widthwise cross section of the support rod 46 (fixed block 47 and unit block 49). The front end face of the support rod 46 is flat. However, it is not limited to this, and it may be a curved surface. The material of the front end portion of the support rod 46 is made of an elastic rubber to softly contact the wafer u when pressed. Next, the workpiece transfer mechanism 24 and the cart 25 will be described with reference to @2~目6 again. The workpiece transfer/transport mechanism 24 is provided with a linear guide 62 for supporting and transporting the cart frame above and below the frame 61 of the frame structure that is vertically erected, and the cart 25 is laterally oriented by a linear motor (not shown). (4). A hole in which the ring member is mounted is formed in the center of the cart 25. The ring member 1 of the women's clothing cart 25 is transported by the workpiece transport mechanism 24 to the pressing mechanism 22 between the workpiece support mechanisms ..., (10) and the scribe line of the wafer " The disconnected position behind the 36. Connect = Position the position when the multiple lines are broken one after the other, so that each line goes to the off position in turn. Position: The adjustment is performed by using the positioning method of the camera or the mechanical definition: medium = method. For example, it may be pre-installed on the device for shooting, and the alignment mark engraved on the wafer 11 may be photographed by the second (not shown), and then attached to the ring structure by image processing progress. High precision 25 g*, and the ring member 10 is mounted on the cart with high precision = _# 425 is positioned relative to the position coordinates of the origin of the disconnecting device (10). Piece 10, push 5 car " 'gas plate 26. The wafer 11 to be processed is vertically erected by the ring member laminating mechanism 24 to the support and can be disconnected by the support of the above. However, on the ring member 10, the wafer 11 is attached to the adhesive sheet 12 which is susceptible to vibration, and the wafer 11 itself is also affected. Therefore, in order to perform a higher-precision disconnection process along the scribe line engraved on the wafer U, the anti-vibration countermeasure is adopted. Therefore, in the present embodiment, a square air plate I is attached to the periphery of the pressing mechanism 22, and a plurality of nozzle holes are formed at positions facing the ring member 10, and are sprayed from a part of the nozzle holes. 'Air, and a part of the nozzle holes are used for attraction, whereby when the cart"25 is set to the off position, the adhesive sheet 12 and the wafer 11 attached thereto are vertically in a non-contact state. Stable under erect condition. Next, the positional relationship between the pressing mechanism 22 and the workpiece supporting mechanisms 23a and 2 will be described. Fig. 14 is a view showing the positional relationship between the pressing mechanism 22 and the workpiece supporting mechanisms 23a and 23b, omitting the conveying mechanism 24, the cart 25, and the air plate 26 for convenience of explanation. As shown in Fig. M (a dry, the pressing mechanism 22 is connected to a pair of workers), the workpiece supporting mechanisms 23a and 23b are opposed to each other via the ring member 1〇. The opening 36 and the supporting rod 46 (ring member 1〇) The back side) at the height
方向（Y方向）之位置相一致。而且支承桿Μ之橫向（X 方向）之位置是藉由支承桿驅動機構41d進行調整，如圖 14(b)所示，在隔基曰㈤ 迫缺 隔耆θ曰圓11之劃線S而於左右兩側稍微 偏離之位置抵接。使斷 ^ ^ ρ. ,θ 汗扣36來到里丨J線S之正背後。藉此， 若斷開桿3 6按壓。日in ,, 圓U，彎曲力矩即沿著劃線S對稱地發 揮作用。 爲支承样46之其他抵接方法，亦可如圖15(a) 201114571 :示’使工件支承機構23a退避（或者最初即不搭載工件支 承機構叫，而僅使用工件支承機構$ 在此種情況下，如圖15⑴所示，使支承桿46沿著 倉丨砼之劃線S之正上方抵接。此外’使斷開桿36來到 ^ :之正背後。藉此’若斷開桿36按壓晶圓”，即會因 支承桿46之彈性力所引起之變形而使晶圓"彎曲，藉以 施加彎曲力矩。 (斷開圖案） 圖16是表示環構件1〇上之斷開位置與斷開桿％之按 壓面之圖案之關係之示意圖。 子；畫j線較短之周緣，利用按麼面較短之圖案p 1來進 打斷開’並使圖案依序變形冑p2、p3、p4，在劃線最長之 中央利用按壓面最長之圖案p5來進行斷開，藉此，能夠不 使斷開桿36碰撞到切割環丨3即斷開晶圓丨i。 (控制系統） 其次，對斷開裝置20之控制系統進行說明。圖17是 表示斷開裝置20之控制系統之方塊圖。控制部70是由包 含CPU71、記憶體72、輸入部73、顯示部74之電腦所構 成。此等係在裝置上或裝置附近被設置成控制單位（未圖 不）。進行推車搬送及定位之工件搬送機構24、使晶圓l i 穩定之空氣板26、使斷開桿36按壓之按壓機構22、調整 斷開桿36之按壓面長度之按壓面調整機構77、使支承桿 46抵接之工件支承機構23a、23b、以及調整支承桿長度之 抵接面調整機構78等各部，係根據記憶體72所儲存之程 式或參數、以及從輸入部73輸入之參數、指令來控制，並 17 201114571 利用顯示部74來監控動作狀態。 (斷開順序） 斷開裝置2〇中，當將晶圓n 斷開時’可由輸入部73任音地H“成之複數條劃線 序儲存於記憶體72中（稱爲任意指定模式f =斷開順 儲存之斷開順序來斷開m 肖此利用所 而且，除“任意指定模式” α外，爲了易 順序之今令^ λ β ;進行斷開 輸入細作，還準備了“依序進給模式， 擇之輸入來進行選擇。4"*，由進行模式選 之斷若選擇“依序進給模式’，，那麼如圖18中所示 =斷開順序般’從晶圓U之―側端依次相繼進行斷開。此 時’根據劃線之長度之變化，斷開桿36按照pi、、 p:; P_5、P4'P3、P2、P1之順序變化。藉由以依序進給模 ，進仃斷開，可使工件搬送所需要之時間最小，因此可縮 短處理時間。 '' 另一方面，若選擇“外側優先模式”，則如圖19中所 不之斷開順序般，進行位於晶圓n最外側之左右劃線之斷 開，接著進行下一個位於外側之左右劃線之斷開，之後依 次進行位於内側之左右劃線之斷開。繼而，最後進行位於 中央之最長之劃線之斷開β在此種情況下，根據劃線之長 之順序變 度之變化，斷開桿36按照pi、Ρ2 ' Ρ3、Ρ4、Ρ5 化。 藉由以外側優先模式進行斷開，工件搬送所需要之時 間會較依序進給模式稍長，但晶圓11即便在一部分被斷開 201114571 之狀態下亦是以接近左右對稱之狀態進行斷開，因此晶圓 1 1之重心移動變小，可實現更高精度之斷開。 又’若選擇“等分割模式”’即如圖20中所示之斷開 順序般，形成以晶圓11之中央劃線（劃線爲偶數時則為最 靠近中央之劃線）分爲二部分之晶圓形狀，接著再以分爲 二部分之各部分晶圓各自中央之劃線來將此等分爲二部 分，而將部分晶圓斷開爲四部分，之後同樣地進行將部分 晶圓分爲八部分 '十六部分、…之等分割之斷開。在此種 情況下，由於最初要將位於中央之最長劃線斷開，因此斷 開桿之長度成爲P5，但之後斷開桿之長度則根據隨後要斷 開之劃線之長度而變化。 ’由於藉此即以該時間點之 ’因此左右兩側之寬度均 從而可實現準確之位置上之 利用等分割模式進行斷開， 部分晶圓之中央劃線進行分割， 等，且可較平衡地進行斷開，從 斷開。The position of the direction (Y direction) is the same. Further, the position of the support rod 横向 in the lateral direction (X direction) is adjusted by the support rod drive mechanism 41d, as shown in Fig. 14(b), and the space 曰 (5) is forced to sag the θ 曰 circle 11 line S Abuts at a position slightly offset from the left and right sides. Let ^ ^ ρ. , θ Khan buckle 36 come to the back of the J line S. Thereby, the break lever 36 is pressed. The day in , , the circle U, the bending moment acts symmetrically along the scribe line S. For the other abutment method of the support sample 46, as shown in Fig. 15(a) 201114571, the workpiece support mechanism 23a can be retracted (or the workpiece support mechanism is not initially mounted, but only the workpiece support mechanism is used.) Next, as shown in Fig. 15 (1), the support rod 46 is abutted directly above the scribe line S of the magazine. Further, 'the break lever 36 is brought to the back of the ^:. When the wafer is pressed, the wafer is "bent" due to the deformation caused by the elastic force of the support rod 46, thereby applying a bending moment. (Disconnection pattern) Fig. 16 is a view showing the disconnection position of the ring member 1 Schematic diagram of the relationship between the pattern of the pressing surface of the rod %. The shorter circumference of the j-line is drawn, and the pattern p 1 is used to make a break and the pattern is sequentially deformed 胄p2, p3 And p4 is opened at the center of the longest line of the scribe line by the pattern p5 having the longest pressing surface, whereby the wafer 丨i can be disconnected without causing the break lever 36 to collide with the dicing ring 丨3. (Control System) The control system of the disconnecting device 20 will be described. Fig. 17 is a diagram showing the control of the disconnecting device 20. The control unit 70 is composed of a computer including a CPU 71, a memory 72, an input unit 73, and a display unit 74. These units are provided as control units (not shown) on or near the device. The workpiece transport mechanism 24 for transporting and positioning the cart, the air plate 26 for stabilizing the wafer li, the pressing mechanism 22 for pressing the break lever 36, and the pressing surface adjusting mechanism 77 for adjusting the length of the pressing surface of the disconnecting lever 36, and supporting The workpiece supporting mechanisms 23a and 23b that the rod 46 abuts and the abutting surface adjusting mechanism 78 for adjusting the length of the supporting rod are based on the program or parameters stored in the memory 72 and the parameters and commands input from the input unit 73. Control, and 17 201114571 The operation state is monitored by the display unit 74. (Disconnection sequence) In the disconnection device 2, when the wafer n is disconnected, the input line 73 can be erroneously H. The sequence is stored in the memory 72 (referred to as any specified mode f = disconnected in the disconnected order of the store to disconnect m from the use of this, and in addition to the "arbitrary designation mode" α, in order to facilitate the order of the current ^ λ β ; perform disconnect input In detail, we also prepared the "sequential feed mode, select the input to make the selection. 4 " *, if you select the "sequential feed mode" by the mode selection, then as shown in Figure 18 = disconnect The sequence is 'discontinuously successively from the side of the wafer U. At this time, according to the change of the length of the scribe line, the break lever 36 is in the order of pi, p:; P_5, P4'P3, P2, P1. The change can be shortened by feeding the mold in sequence, and the time required for the workpiece to be conveyed is minimized, so that the processing time can be shortened. '' On the other hand, if the "outside priority mode" is selected, as shown in Fig. 19 In the same way as the disconnection order, the left and right scribe lines on the outermost side of the wafer n are disconnected, and then the next left and right scribe lines on the outer side are broken, and then the left and right scribe lines on the inner side are sequentially broken. . Then, finally, the disconnection β of the longest line in the center is performed. In this case, the break lever 36 is changed in accordance with pi, Ρ2' Ρ3, Ρ4, Ρ5 according to the change in the order of the length of the scribe line. By disconnecting in the outer priority mode, the time required for the workpiece transfer is slightly longer than the sequential feed mode, but the wafer 11 is broken in a state of being close to the left and right symmetry even when a part of the wafer 11 is disconnected from 201114571. Since the movement of the center of gravity of the wafer 11 is small, the disconnection with higher precision can be realized. In addition, if the "division mode" is selected, that is, as shown in the disconnection sequence shown in FIG. 20, the center line of the wafer 11 is formed (the line is the closest to the center when the line is even). Part of the wafer shape, and then divided into two parts by the central line of each part of the wafer divided into two parts, and the partial wafer is broken into four parts, and then the partial crystal is similarly performed. The circle is divided into eight parts, the sixteen parts, the division of the division. In this case, since the longest line at the center is initially broken, the length of the break lever becomes P5, but then the length of the break lever changes depending on the length of the line to be broken later. 'Because of this, it is at this point of time', so the widths of the left and right sides can be used to achieve accurate positional separation, etc., and the central line of some wafers can be divided, etc., and can be balanced. The ground is disconnected and disconnected.
t S 19 201114571 又，上述實施形態'巾，隔著晶ffl u使斷開桿刊 面側與1個或—對支承桿46抵接來進行支承，因此可進r 準確之斷開，但支承側之形狀存在自由度，只要是可支= 晶圓11之支承構件，㈣亦可是除此以外之形例如， 亦可代替支承桿46，利用抵接於晶圓 承構件來進行支承。 11之全面之平面狀支 又，上述實施形態中，雖係對圓形之晶圓進行了斷開， 但工件形狀並不限定於圓形。只要是能夠貼附於切割環之 環内且刻設有長度不同之複數條劃線之工件，那麼即便是 例如以橢圓形爲首之其他形狀，亦可有效地利用本發明。 又’上述實施形態中，雖係使環構件1〇呈垂直來進行 支承，但亦可是水平地支承環構件10來進行加工之一般習 知型斷開裝置。 [産業上之可利用性] 本發明之斷開裝置可用於貼附在環構件上之晶圓等之 斷開。 【圖式簡單說明】 圖1是表示貼附了使用本發明之斷開裝置斷開之工件 之環構件之一例之圖。 圖2是表示從推壓機構側所觀察到之本發明之一實施 形態之斷開裝置之整體構成之立體圖。 圖3是表示從工件支承機構側所觀察到之本發明之一 實施形態之斷開裝置之整體構成之立體圖。 圖4是圓1之斷開裝置之前視圖（按壓機構側）。 20 201114571 圖5是圖1之斷開裝置之 发罝之後視圓（工件支承機構側）。 圖6是圖1之斷開裝置之俯視圖。 圖7是表示按壓機構之構成之圖。 圖8是表示斷開桿之構成之圖。 圖9疋表不斷開桿之變形圖案之圖。 圖10是表示斷開桿之按遷面之寬度方向之截面之圖 圖11是表示工件支承機構之構成之圖。 圖12是表示支承桿之構成之圖。 圖13是表示支承桿之抵接面之寬度方向之截面之圖。 圖14是表示按壓機構22肖工件支承機構23a、23k 位置關係之圖。 圖i5是表示按壓機構22 關係之圖。 與工件支承機構23b之位置 圖16是表不環構件1〇上之斷開位置與斷開才旱％之按 壓面之圓案之關係之示意圖。 圖1 7是控制系統之方塊圖。 圖18是表示依序進給模式之斷開順序之圖。 圖19是表示外側優先模式中之斷開順序之圖。 圖20是表示等分割模式中之斷開順序之圖。 圖2丨是表示環構件之圖。 圖22是表示利用斷開球之斷開方法之圖。 圖23是表示利用棒狀輥之斷開方法之圖。 圖24是表示利用線狀按壓體（斷開桿）之斷開方法之t S 19 201114571 In addition, in the above-described embodiment, the towel is supported by the wafer side with respect to the one or the pair of support bars 46, so that it can be accurately disconnected, but supported. There is a degree of freedom in the shape of the side, as long as it is a support member of the wafer 11 and (4) may be other than the support rod 46, and may be supported by the wafer carrier member. In addition, in the above embodiment, the circular wafer is broken, but the shape of the workpiece is not limited to a circular shape. As long as it is a workpiece that can be attached to a ring of a cutting ring and is provided with a plurality of scribe lines having different lengths, the present invention can be effectively utilized even in other shapes such as an elliptical shape. Further, in the above-described embodiment, the ring member 1 is supported vertically, but a general-purpose disconnecting device that supports the ring member 10 horizontally for processing can be used. [Industrial Applicability] The breaking device of the present invention can be used for disconnecting a wafer or the like attached to a ring member. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example of a ring member to which a workpiece to be broken by a breaking device of the present invention is attached. Fig. 2 is a perspective view showing the overall configuration of a disconnecting device according to an embodiment of the present invention as seen from the side of the pressing mechanism. Fig. 3 is a perspective view showing the overall configuration of a disconnecting device according to an embodiment of the present invention as seen from the side of the workpiece supporting mechanism. Fig. 4 is a front view (pressing mechanism side) of the breaking device of the circle 1. 20 201114571 Fig. 5 is a rear view circle (workpiece support mechanism side) of the breaking device of Fig. 1. Figure 6 is a plan view of the disconnecting device of Figure 1. Fig. 7 is a view showing the configuration of a pressing mechanism. Fig. 8 is a view showing the configuration of a disconnecting lever. Figure 9 is a diagram showing the deformation pattern of the unbroken rod. Fig. 10 is a view showing a cross section of the transition surface of the break lever in the width direction. Fig. 11 is a view showing the configuration of the workpiece support mechanism. Fig. 12 is a view showing the configuration of a support rod. Fig. 13 is a view showing a cross section in the width direction of the abutting surface of the support rod. Fig. 14 is a view showing the positional relationship of the workpiece holding mechanisms 23a and 23k of the pressing mechanism 22. Figure i5 is a view showing the relationship of the pressing mechanism 22. Position of the workpiece support mechanism 23b Fig. 16 is a view showing the relationship between the disconnected position on the ring member 1 and the press face of the disconnected %. Figure 17 is a block diagram of the control system. Fig. 18 is a view showing a sequence of disconnection in the sequential feed mode. Fig. 19 is a view showing a disconnection order in the outer priority mode. Fig. 20 is a view showing a disconnection order in the equal division mode. Fig. 2A is a view showing a ring member. Fig. 22 is a view showing a method of opening a broken ball. Fig. 23 is a view showing a method of breaking by a rod-shaped roller. Fig. 24 is a view showing a method of disconnecting a linear pressing body (disconnecting lever);
21 201114571 【主要元件符號說明】 10 環構件 11 晶圓 11 a ' S 劃線 12 黏著帶 13 切割環 15 16 17 20 21 22 23a 、 23b 24 25 26 31 32 33 34 35 36 37 37a 38a ' 38b 斷開球 棒狀輥 斷開桿 斷開裝置 基底 按壓機構 工件支承機構 工件搬送機構 推車 空氣板 台座 垂直臂 固定板 線性導件 可動板 斷開桿 固定區塊 支承構件 可變區塊 22 201114571 39 單位區塊 40 升降機構（按壓面調整機構 41a、 41b 台座 41c 軌道 41d 支承桿驅動機構 46 支承桿 47 固定區塊 47a 支承構件 48a、 48b 可變區塊 49 單位區塊 50 升降機構（抵接面調整機構 61 框 62 線性導件 70 控制部 71 CPU 72 記憶體 73 輸入部 74 顯示部 77 按壓面調整機構 78 抵接面調整機構 PI〜 P5 圖案 D 直徑 2321 201114571 [Description of main component symbols] 10 Ring member 11 Wafer 11 a ' S scribe line 12 Adhesive tape 13 Cutting ring 15 16 17 20 21 22 23a , 23b 24 25 26 31 32 33 34 35 36 37 37a 38a ' 38b Kick-off bar roller breaking lever breaking device base pressing mechanism workpiece supporting mechanism workpiece conveying mechanism cart air plate pedestal vertical arm fixing plate linear guide movable plate breaking bar fixing block supporting member variable block 22 201114571 39 unit Block 40 lifting mechanism (pressing surface adjusting mechanism 41a, 41b pedestal 41c rail 41d supporting rod driving mechanism 46 supporting rod 47 fixing block 47a supporting members 48a, 48b variable block 49 unit block 50 lifting mechanism (abutment surface adjustment Mechanism 61 Frame 62 Linear guide 70 Control unit 71 CPU 72 Memory 73 Input unit 74 Display unit 77 Pressing surface adjustment mechanism 78 Abutment surface adjustment mechanism PI to P5 Pattern D Diameter 23