TW201107367A

TW201107367A - Photosensitive polyester composition for forming thermoset film

Info

Publication number: TW201107367A
Application number: TW99111627A
Authority: TW
Inventors: Tadashi Hatanaka; Isao Adachi
Original assignee: Nissan Chemical Ind Ltd
Priority date: 2009-04-14
Filing date: 2010-04-14
Publication date: 2011-03-01
Also published as: JPWO2010119868A1; JP5626536B2; CN102395614A; KR20120013941A; KR101660827B1; CN102395614B; TWI500657B; WO2010119868A1

Abstract

Disclosed is a material which enables pattern formation in an alkaline developer, and shows high solvent resistance, liquid crystal orientation, heat resistance, high transparency, and high planarity after being formed into a cured film, and can be dissolved in a glycol solvent which can be applied to the production line of a planarized film of a color filter while being formed into a cured film. Specifically disclosed is a photosensitive polyester composition for use in forming thermally cured film, containing component (A), component (B), component (C), and component (D): component (A): a modified polyester obtained by reacting a compound having a functional group selected from a glycidyl group and an isocyanate group with a polyester containing a structural unit represented by formula (1); component (B): an epoxy compound having two or more epoxy groups; component (C): an amino group-containing carboxylic acid compound obtained by reacting a diamine compound with dicarboxylic acid dianhydride; and component (D): 1,2-quinone diazide compound. In formula (1), A and B each independently represent an organic group containing a cyclic structure.

Description

201107367 六、發明說明：【發明所屬之技術領域】本發明係有關熱硬化膜形成用感光性聚酯組成物及自該組成物形成之硬化膜。更詳細爲，有關可形成具有較高透明性、平坦化性、液晶配向能及較高溶劑耐性之硬化膜的熱硬化膜形成用感光性聚酯組成物及其硬化膜，以及該硬化膜之適用法。該熱硬化膜形成用感光性聚酯組成物特別適用爲，液晶顯示器中兼具液晶配向機能之彩色濾光片保護劑。【先前技術】一般液晶顯示兀件、有機EL (Electro Luminescent) 元件、固體攝影元件等光裝置中，爲了防止元件表面於製造過程中暴露於溶劑或熱而沒有保護膜。又要求該保護膜不僅可提高相對於被保護基板之密合性以提升溶劑耐性，另具有透明性、耐熱性等性能。該類保護膜作爲彩色液晶顯示裝置或固體攝影元件所使用的彩色濾光片之保護膜用時，一般要求具有使基底層基板之彩色濾光片或黑底樹脂平坦化的性能，即平坦化膜用之性能。特別是製造STN方式或TFT方式之彩色液晶顯示元件時，彩色濾光片基板與對向基板需備有非常嚴密的貼合精確度，以使基板間之單元間隔均勻化係不可欠缺之必要性。另外爲了維持透過彩色濾光片之光透過率，該保護膜之此等平坦化膜需備有較高透明性。 -5- 201107367 又，近年來嘗試檢討將相位差材料導入液晶顯示器之單元內以低成本化、輕量化，又該類相位差材料一般係使用塗布液晶單體且配向後，可光硬化之材料。爲了使該相位差材料配向，底層膜需爲摩擦處理後具有配向性之材料。如此於彩色濾光片之保護膜上使液晶配向層成膜後，可形成相位差材料（參考圖2 ( a ))。形成兼具該液晶配向層及彩色濾光片之保護膜的膜（參考圖2 ( b ))，可得低成本化、削減步驟數等優點，因此強烈寄望於該類材料。一般該彩色濾光片之保護膜係使用透明性較高之丙烯酸樹脂。相對於丙二醇單甲基醚、丙二醇單甲基醚乙酸酯之二元醇系溶劑及乳酸乙酯、乳酸丁酯之酯系溶劑，就安全性、處理、防止由彩色濾光片溶出顏料成份之觀點係廣泛使用該類丙烯酸樹脂。將該類丙烯酸樹脂熱硬化或光硬化’可賦予耐熱性及耐溶劑性（專利文獻1、2 )。先前之熱硬化性或光硬化性丙烯酸樹脂雖具有適當的透明性及平坦化性’但既使對該類平坦化膜進行摩擦處理也無法賦予充分的配向性。又’液晶配向層一般係使用，自溶劑可溶性之聚醯亞胺或聚醯胺酸形成的材料。曾報告此等材料於後烤時可完成醯亞化而賦予耐溶劑性’藉由摩擦處理可賦予充分的配向性（專利文獻3 )。但將此等材料視爲彩色濾光片之平坦化膜時，會有大幅降低平坦化性及透明性等之問題。又’爲了提升平坦化性曾報告聚酯一聚醯胺酸及聚酯 -聚醯亞胺共聚物（專利文獻4 )。但此等聚醋-聚醯胺 ~ 6 - 201107367 酸及聚酯-聚醯亞胺共聚物同聚醯亞胺及聚醯胺酸可溶於 N -甲基吡咯烷酮及r-丁內酯之溶劑，而對二元醇系溶劑及酯系溶劑之溶解性較低，因此製作聚醯亞胺膜時會由彩色濾光片溶出顏料成份及液晶污染成份，而難適用於製作平坦化膜步驟中。又，爲了提升相對於貼合TFT數組側之基板時所使用的密封材料之密合強度，希望能以像片微影法去除接合部分之膜。另外目前爲止尙無有關具有感光性之具有配向性的平坦化膜之報告。先前技術文獻專利文獻專利文獻1 :特開2000-103937號公報專利文獻2 :特開2 0 0 0 - 1 1 9 4 7 2號公報專利文獻3 :特開2 0 0 5 - 0 3 7 9 2 0號公報專利文獻4 :特開2 0 0 8 - 0 3 3 2 4 4號公報【發明內容】發明槪要發明所欲解決之課題有鑑於上述事情，本發明所欲解決之課題爲，提供可以鹼顯像液形成圖型，形成硬化膜後具有較高之溶劑耐性、液晶配向性、高透明性及高平坦化性，且硬化膜形成時可溶解於適用於製作彩色濾光片之平坦化膜步驟的二元i酉1 201107367 系溶劑及乳酸酯系溶劑之材料。解決課題之方法爲了解決上述課題經本發明者專心硏究，結果完成本發明。即’第1觀點爲一種熱硬化膜形成用感光性聚酯組成物’其爲含有（A)成份、（B)成份、（C)成份及（D )成份。 (A)成份：含有下述式（1)所表示的構造單位之聚酯’與具有縮水甘油基及異氰酸酯基中選出的官能基之化合物反應而得的被修飾之聚酯 (B )成份：具有2個以上環氧基之環氧化合物 (C )成份：二胺化合物與二羧酸二酐反應而得的含有胺基之羧酸化合物 (D )成份：1，2 -苯醌二壘氮化合物【化1】[Technical Field] The present invention relates to a photosensitive polyester composition for forming a thermosetting film and a cured film formed from the composition. More specifically, the photosensitive polyester composition for forming a thermosetting film having a high transparency, flatness, liquid crystal alignment energy, and high solvent resistance, and a cured film thereof, and a cured film thereof Applicable law. The photosensitive polyester composition for forming a thermosetting film is particularly preferably used as a color filter protecting agent having a liquid crystal alignment function in a liquid crystal display. [Prior Art] In an optical device such as a liquid crystal display element, an organic EL (Electro Luminescent) element, or a solid-state imaging element, there is no protective film in order to prevent the surface of the element from being exposed to a solvent or heat during the manufacturing process. Further, the protective film is required to not only improve the adhesion to the substrate to be protected, but also improve the solvent resistance, and also has properties such as transparency and heat resistance. When such a protective film is used as a protective film for a color filter used for a color liquid crystal display device or a solid-state imaging device, it is generally required to have a flattening effect of flattening a color filter or a black matrix resin of a base layer substrate, that is, planarization. The performance of the film. In particular, when manufacturing a color liquid crystal display device of the STN method or the TFT method, it is necessary to have a very close bonding precision between the color filter substrate and the opposite substrate, so that the uniformity of the cell spacing between the substrates is indispensable. . Further, in order to maintain the light transmittance through the color filter, the planarizing film of the protective film needs to have high transparency. -5- 201107367 In recent years, attempts have been made to review the introduction of phase difference materials into cells of liquid crystal displays to reduce cost and weight. In addition, such phase difference materials are generally photohardenable materials after coating liquid crystal monomers and after alignment. . In order to align the phase difference material, the underlying film needs to be an anisotropic material after rubbing treatment. After the liquid crystal alignment layer is formed on the protective film of the color filter, a phase difference material can be formed (refer to Fig. 2 (a)). When a film having a protective film of the liquid crystal alignment layer and the color filter is formed (refer to Fig. 2 (b)), the advantages such as low cost and number of steps can be obtained, and therefore, such materials are strongly expected. Generally, the protective film of the color filter is made of a highly transparent acrylic resin. Relative to propylene glycol monomethyl ether, diol glycol monomethyl ether acetate glycol solvent and ethyl lactate, butyl lactate ester solvent, safety, treatment, prevention of pigmentation by color filter The viewpoint is that such an acrylic resin is widely used. The acrylic resin is thermally cured or photohardened to impart heat resistance and solvent resistance (Patent Documents 1 and 2). The conventional thermosetting or photocurable acrylic resin has appropriate transparency and flatness, but does not impart sufficient alignment properties even if the planarizing film is subjected to rubbing treatment. Further, the liquid crystal alignment layer is generally used as a material formed from a solvent-soluble polyimine or polylysine. It has been reported that these materials can be subjected to post-baking to impart solvent resistance, and sufficient alignability can be imparted by rubbing treatment (Patent Document 3). However, when these materials are regarded as flat films of color filters, problems such as flatness and transparency are greatly reduced. Further, in order to improve the flatness, a polyester-polyamine and a polyester-polyimine copolymer have been reported (Patent Document 4). However, these polyester-polyamides 6 - 201107367 acid and polyester-polyimine copolymers are compatible with polyamidiamine and polylysine which are soluble in N-methylpyrrolidone and r-butyrolactone. However, the solubility in the glycol solvent and the ester solvent is low. Therefore, when the polyimide film is produced, the pigment component and the liquid crystal contamination component are eluted from the color filter, which is difficult to apply in the process of producing the planarization film. . Further, in order to improve the adhesion strength of the sealing material used for bonding the substrate on the TFT array side, it is desirable to remove the film of the bonded portion by photolithography. Further, there has been no report on the sensitization of an affixed flattening film. PRIOR ART DOCUMENT PATENT DOCUMENT PATENT DOCUMENT 1: JP-A-2000-103937 PATENT DOCUMENT 2: JP-A-2000 - 1 1 9 4 7 2 Patent Document 3: Special Opening 2 0 0 5 - 0 3 7 9 OBJECT OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In view of the above, the object of the present invention is to solve the problem of the present invention. Providing an alkali-developing liquid to form a pattern, forming a cured film having high solvent resistance, liquid crystal alignment, high transparency, and high flatness, and the cured film is soluble in a color filter suitable for color filter formation. The binary i酉1 201107367 of the planarization film step is a solvent and a solvent of a lactic acid ester solvent. Solution to Problem In order to solve the above problems, the inventors of the present invention have intensively studied and completed the present invention. That is, the 'first aspect is a photosensitive polyester composition for forming a thermosetting film' which contains the components (A), (B), (C) and (D). (A) Component: a modified polyester (B) component obtained by reacting a polyester having a structural unit represented by the following formula (1) with a compound having a functional group selected from a glycidyl group and an isocyanate group: Epoxy compound (C) having two or more epoxy groups: an amine group-containing carboxylic acid compound (D) obtained by reacting a diamine compound with a dicarboxylic acid dianhydride: 1,2-benzoquinone dibasic nitrogen Compound [Chemical 1]

/ HOOC、,COOH -χ〇—C—A—C—Ο—Β \ j· II \ 〇 O/ HOOC,,COOH -χ〇—C—A—C—Ο—Β \ j· II \ 〇 O

(1) (式中’ A爲脂環式骨架或脂肪族骨架鍵結4個鍵結鍵之4價有機基’ B爲脂環式骨架或脂肪族骨架鍵結2個鍵結鍵之2價有機基）。第2觀點爲第1觀點所記載的熱硬化膜形成用感光性聚 -8 - 201107367 酯組成物，其中含有前述式（1 )所表示的構造單位之聚酯爲，含有下述式（i)所表示的四羧酸二酐之四羧酸二酐成份，與含有下述式（ϋ)所表示的二醇化合物之二醇成份反應而得的聚酯，【化2】(1) (wherein A is an alicyclic skeleton or an aliphatic skeleton is bonded to a 4-valent organic group of four bonding bonds' B is an alicyclic skeleton or an aliphatic skeleton bonding 2 bonding bonds Organic base). The second aspect is the photosensitive poly-8 - 201107367 ester composition for forming a thermosetting film according to the first aspect, wherein the polyester containing the structural unit represented by the above formula (1) contains the following formula (i) A polyester obtained by reacting a tetracarboxylic dianhydride component of a tetracarboxylic dianhydride with a diol component containing a diol compound represented by the following formula (ϋ), [Chem. 2]

HO-B-OH ( ϋ) {式（i)及（ii)中，Α及Β同前述式（1)之定義}。第3觀點爲如第1或2觀點所記載的熱硬化膜形成用感光性聚酯組成物，其中前述式（1 )中，A爲下述式（A-1 )至（A-8)所表示之基中選出的至少一種基，B爲下述式 (B-1 )至（B-5 )所表示之基中選出的至少一種基。【化3】 (A-1) (A-2) (A-4) (A-3) r\HO-B-OH ( ϋ) {In the formulas (i) and (ii), Α and Β are as defined in the above formula (1)}. The photosensitive polyester composition for forming a thermosetting film according to the above aspect (1), wherein A is represented by the following formulas (A-1) to (A-8). At least one group selected from the group consisting of B is at least one selected from the group represented by the following formulas (B-1) to (B-5). [A3] (A-2) (A-2) (A-4) (A-3) r\

(A-7) (A-6) (A-S) (A-8) 201107367 【化4】(A-7) (A-6) (A-S) (A-8) 201107367 【化4】

(B-4) (Β-δ) 第4觀點爲第1至3觀點中任何一項所記載的熱硬化膜形成用感光性聚酯組成物，其中前述（A )成份之被修飾的聚酯爲，具有聚苯乙烯換算下1，0〇〇至3, 〇〇〇之重量平均分子量。第5觀點爲第1至4觀點中任何一項所記載的熱硬化膜形成用感光性聚酯組成物，其中前述（C )成份爲，二胺化合物1莫耳與二羧酸二酐1.7至2莫耳反應而得的含有胺基之羧酸化合物。第6觀點爲第1至5觀點中任何一項所記載的熱硬化膜形成用感光性聚酯組成物，其中相對於前述（A )成份1 00 質量份各自含有3至50質量份之前述（B)成份、3至50質量份之前述（C)成份及5至80質量份之前述（D)成份。第7觀點爲第1至5觀點中任何一項所記載的熱硬化膜形成用感光性聚酯組成物，其中另含有（E )成份之雙馬來醯亞胺化合物。第8觀點爲第6觀點所記載的熱硬化膜形成用感光性聚酯組成物’其中相對於前述（A )成份1 〇〇質量份含有〇. 5 至5 0質量份之第7觀點所記載的（E)成份。桌9觀點爲一種硬化膜’其爲自第1至8觀點中任何一項所記載的熱硬化膜形成用感光性聚酯組成物形成。 -10- 201107367 第1 〇觀點爲一種液晶配向層，其爲使用第1至8觀點中任何一項所記載的熱硬化膜形成用感光性聚酯組成物而得發明之效果本發明之熱硬化膜形成用感光性聚酯組成物可形成具有感光性，及較高平坦化性、較高透明性、較高溶劑耐性、較高耐熱性與液晶配向能之硬化膜，因此適用爲液晶配向膜及平坦化膜之形成材料。特別是可一次形成兼具先前獨立形成之液晶配向層及彩色濾光片之保護層兩者的特性之「液晶配向層」，因此可實現製造步驟簡略化及藉由減少步驟數而低成本化等。又本發明之熱硬化膜形成用感光性聚酯組成物可溶於二元醇系溶劑及乳酸酯系溶劑，因此適用於主要使用此等溶劑之平坦化膜的製作過程中。實施發明之形態如上述般先前提案的丙烯酸樹脂系及聚醯亞胺樹脂系硬化膜爲’無法具有充分符合液晶配向膜及平坦化膜所要求的平坦化性、透明性、配向性等全部性能。又’目前爲止雖有液晶顯示元件之配向材料使用聚酯的提案（參考特開平5-158055號公報、特開2002-229039號公報）’但此等均非具有熱硬化性之物，故所形成的膜之耐溶劑性較差。 -11 - 201107367 本發明之特徵爲’使用熱硬化性之聚酯. 能。即，本發明爲含有（A )成份之聚酯、（有2個以上環氧基的環氧化合物、（C)成份羧酸化合物及（D )成份之1,2-苯醌二疊氮4 化膜形成用感光性聚酯組成物。又本發明爲成份、（B )成份、（C )成份' (D )成份成份之雙馬來醯亞胺化合物的熱硬化膜形成; 組成物。下面將詳細說明各成份。 < (A )成份> (A)成份之聚酯爲，含有下述式（1) 單位之聚酯（以下亦稱爲特定聚合物），與基及異氰酸酯基中選出的官能基之化合物反飾之聚酯。較佳爲自下述式（1)所表示的之聚酯，與具有縮水甘油基及異氰酸酯基中之化合物反應而得的被修飾之聚酯。【化5】 fHOOC、，C〇〇H \ °ΧΑ""~°'Βτ ⑴ (式中，Λ爲脂環式骨架或脂肪族骨架鍵之4價有機基’ Β爲脂環式骨架或脂肪族骨架 I提升上述性 Β )成份之具 L含有胺基的 :合物的熱硬，除了（ A ) 另含有（E ) Ϊ感光性聚酯表不的構造有縮水甘油而得的被修造單位形成出的官能基結4個鍵結鍵鍵結2個鍵結 -12- 201107367 鍵之2價有機基）。前述A較佳爲下述式（1A1)、式（！A2)或（1A3) 所表不之基。【化6】 X >1-R1~At^ >1-< (1A1) (1A2) (1A3) {式（1八1) 、（1A2)及（1A3)中，A1爲環狀飽和烴基’ R1爲單鍵、醚鍵、羰基、磺酸基、碳原子數1至8之飽和烴基或被氟原子取代之碳原子數1至8的飽和烴基，又 ’ R2爲碳原子數1至8之飽和烴基}。前述式中’ A1較佳爲碳原子數4至8之環狀飽和烴基，更佳爲碳原子數4至6之環狀飽和烴基，又，A1基中所含的任意氫原子可各自獨立被脂肪族基取代，且其中2個取代基可相互鍵結形成4至6員環。該取代基之脂肪族基較佳爲碳原子數1至5之脂肪族基，更佳爲碳原子數1至3之脂肪族基。鍵結此等取代基形成環時，例如可爲降茨烯基或金剛烷基等之交聯環式烴基、部分或全部氫化之縮合環式烴基。又，R1較佳爲單鍵、醚鍵、羰基、磺酸蕋、碳原子數 1至5之飽和烴基或被氧原子取代之碳原子數丨至5的飽和烴基。另外R2較佳爲碳原子數1至5之飽和烴基，更佳爲碳原 -13- 201107367 子數1至3之飽和烴基。上述式（1 )中4價有機基之A的較佳具體例如下述式 (A-1)至式（A-8)。下述式（A-1)至（A-8)所表示之基中’ A特佳爲下述式（八-丨）或式（a_2)中選出之基。【化7】 XX W 分。^? 《A·1 ) (A-2) (A-3) (A-4)(B-4) The photosensitive polyester composition for forming a thermosetting film according to any one of the above aspects, wherein the (A) component of the modified polyester The weight average molecular weight of 1,0 〇〇 to 3, 〇〇〇 in terms of polystyrene. The photosensitive polyester composition for forming a thermosetting film according to any one of the above aspects, wherein the component (C) is a diamine compound 1 mol and a dicarboxylic acid dianhydride of 1.7 to An amine group-containing carboxylic acid compound obtained by a molar reaction. The photosensitive polyester composition for forming a thermosetting film according to any one of the above-mentioned (A) components, wherein each of the above-mentioned (A) components contains 3 to 50 parts by mass each of the above ( B) Ingredient, 3 to 50 parts by mass of the above (C) component and 5 to 80 parts by mass of the aforementioned (D) component. The photosensitive polyester composition for forming a thermosetting film according to any one of the first to fifth aspects, further comprising the (B) component of the bismaleimide compound. The eighth aspect is the photosensitive polyester composition for forming a thermosetting film according to the sixth aspect, wherein the first aspect of the component (A) is contained in an amount of 〇. 5 to 50 parts by mass. (E) ingredient. The table 9 is a cured film which is formed of the photosensitive polyester composition for forming a thermosetting film according to any one of the first to eighth aspects. -10-201107367 The first aspect of the present invention is a liquid crystal alignment layer which is obtained by using the photosensitive polyester composition for forming a thermosetting film according to any one of the first to eighth aspects. The photosensitive polyester composition for film formation can form a cured film having photosensitivity, high flatness, high transparency, high solvent resistance, high heat resistance, and liquid crystal alignment energy, and thus is suitable as a liquid crystal alignment film. And a material for forming a planarizing film. In particular, since the "liquid crystal alignment layer" having the characteristics of both the previously independently formed liquid crystal alignment layer and the protective layer of the color filter can be formed at one time, the manufacturing steps can be simplified and the number of steps can be reduced to reduce the cost. Wait. Further, since the photosensitive polyester composition for forming a thermosetting film of the present invention is soluble in a glycol solvent and a lactic acid ester solvent, it is suitably used in the production process of a planarizing film mainly using such a solvent. According to the embodiment of the invention, the acrylic resin-based and the polyimide-based resin-based cured film which have been previously proposed are incapable of having sufficient properties such as flatness, transparency, and alignment which are required to sufficiently conform to the liquid crystal alignment film and the planarizing film. . In addition, there is a proposal to use a polyester for an alignment material of a liquid crystal display device (refer to Japanese Laid-Open Patent Publication No. H5-158055, JP-A-2002-229039), but these are not thermosetting materials. The formed film is poor in solvent resistance. -11 - 201107367 The present invention is characterized by the use of a thermosetting polyester. That is, the present invention is a polyester containing (A) component, (epoxy compound having two or more epoxy groups, (C) component carboxylic acid compound, and (D) component 1,2-benzoquinone diazide 4 A photosensitive polyester composition for forming a film. The present invention is also a thermosetting film of a bismaleimide compound of the component (B) component and (C) component (D) component; composition. The components will be described in detail. (A) Ingredients> The polyester of the component (A) is a polyester containing the following formula (1) (hereinafter also referred to as a specific polymer), and a base and an isocyanate group. The polyester of the selected functional group compound is preferably a modified polyester obtained by reacting a polyester represented by the following formula (1) with a compound having a glycidyl group and an isocyanate group. [5] fHOOC,, C〇〇H \ °ΧΑ""~°'Βτ (1) (wherein, Λ is an alicyclic skeleton or a tetravalent organic group of an aliphatic skeleton bond' Β is an alicyclic skeleton or The aliphatic skeleton I enhances the above-mentioned properties. The component contains an amine-based compound: the thermosetting of the compound, in addition to (A) another (E) Ϊ sensitization The structure of the polyester is represented by glycidol. The functional group formed by the unit to be repaired has four bonding bonds, and two bonding bonds are bonded. -12- 201107367 The divalent organic group of the bond. The above A is preferably a group represented by the following formula (1A1), formula (!A2) or (1A3). [Chemical 6] X > 1-R1~At^ >1-< (1A1) (1A2) (1A3) {Formula (1A1), (1A2) and (1A3), A1 is ring-saturated The hydrocarbon group 'R1 is a single bond, an ether bond, a carbonyl group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a saturated hydrocarbon group having 1 to 8 carbon atoms substituted by a fluorine atom, and 'R2 is a carbon number of 1 to 8 saturated hydrocarbon groups}. In the above formula, 'A1 is preferably a cyclic saturated hydrocarbon group having 4 to 8 carbon atoms, more preferably a cyclic saturated hydrocarbon group having 4 to 6 carbon atoms, and further, any hydrogen atom contained in the A1 group may be independently An aliphatic group is substituted, and two of the substituents may be bonded to each other to form a 4- to 6-membered ring. The aliphatic group of the substituent is preferably an aliphatic group having 1 to 5 carbon atoms, more preferably an aliphatic group having 1 to 3 carbon atoms. When the substituents are bonded to form a ring, for example, a crosslinked cyclic hydrocarbon group such as a decyl group or an adamantyl group or a partially or fully hydrogenated condensed cyclic hydrocarbon group may be used. Further, R1 is preferably a single bond, an ether bond, a carbonyl group, a phosphonium sulfonate, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 5 to 5 carbon atoms substituted by an oxygen atom. Further, R2 is preferably a saturated hydrocarbon group having 1 to 5 carbon atoms, more preferably a saturated hydrocarbon group having a carbon number of -13 to 201107367 and having a number of 1 to 3. The specific specificity of A of the tetravalent organic group in the above formula (1) is, for example, the following formula (A-1) to formula (A-8). The base represented by the following formulas (A-1) to (A-8) is particularly preferably a group selected from the following formula (octa-oxime) or formula (a_2). [Chem. 7] XX W points. ^? "A·1" (A-2) (A-3) (A-4)

上述式（I )中’ B爲脂環式骨架或脂肪族骨架鍵結2 個鍵結鍵之2價有機基，較佳爲下述式（1B1)或式（1B2 )所表示之基。【化8】 —R4 一 B1 和3 一 B1 夫 R5— —R6-B2-R7~ (1B1) (1B2) {式（1B1)及（1B2)中，B1爲環狀飽和烴基，B2爲伸苯基，又，R3爲單鍵、醚鍵、羰基、磺酸基、碳原子數 1至8之飽和烴基或被氟原子取代之碳原子數1至8的飽和烴基，R4、R5各自獨立爲單鍵或碳原子數1至5之伸烷基’ R6 、R7各自獨立爲碳原子數1至5之伸烷基，又，k爲0或1}。 -14- 201107367 前述式中，βΐ較佳爲碳原子數4至8之環狀飽和烴基，更佳爲碳原子數4至6之環狀飽和烴基，又，Β1基中所含的任意氫原子可各自獨立被脂肪族基取代。其中該取代基之脂肪族基較佳爲碳原子數1至5之脂肪族基’更佳爲碳原子數1至3之脂肪族基。此等取代基鍵結形成環時，例如可形成降茨烯基或金剛烷基等交聯環式烴基、部分或全部氫化之縮合多環式烴基。 R3較佳爲單鍵、醚鍵、羰基、磺酸基、碳原子數1至5 之飽和烴基或被氧原子取代之碳原子數1至5的飽和烴基。又，R4、R5較佳爲單鍵、碳原子數1至3之伸烷基。另外R6、R7較佳爲碳原子數1至3之伸烷基。上述式（1)中2價有機基之Β的較佳具體例如下述式 (Β-1)至式（Β-5)。下述式（Β-1)至（Β-5)所表示之基中，Β特佳爲下述式（Β-1)至（Β-4)中所選出之基。【化9】 (B-1) (Β·2) (Β·3) (Β-4) {B-S} 特定聚合物較佳爲上述式（1)所表示之構造單位中 ’ Α含有上述式（ιΑ1)至（1Α3)所表示之基所成群中選出的至少一種構造，又可含有上述式（1Α1)至（1Α3) 所表示之基以外的構造。其可爲能形成聚酯構造之構造無特別限定’但較佳爲下述式（1 A 4 )及式（1 A 5 )所表示之基中所選出的至少一種構造。 -15- 201107367 【化1 〇】兹分食R9仏切 (1A4) (1A5) {式（1A4)及式（1A5)中，R8、R9、R10各自獨立爲單鍵、醚鍵、羰基、磺酸基、碳原子數1至8之飽和烴基或被氟原子取代之碳原子數1至8的飽和烴基，又，h爲0或1} 〇前述式中，R8、R9、R1Q較佳爲單鍵、醚鍵、羰基、磺酸基、碳原子數1至5之飽和烴基或被氟原子取代之碳原子數1至5的飽和烴基。特佳爲R8爲單鍵、醚鍵、羰基、磺酸基、碳原子數1 至5之飽和烴基或被氟原子取代之碳原子數1至5的飽和烴基。又，R9較佳爲醚鍵、碳原子數1至5之飽和烴基或被氟原子取代之碳原子數1至5的飽和烴基。另外R1G較佳爲醚鍵、羰基、磺酸基、碳原子數1至5 之飽和烴基或被氟原子取代之碳原子數1至5的飽和烴基。前述式（1 A4 )至（1 A5 )之較佳具體例如下述式（al )至（a7 )。 -16- 201107367 【化1 1】 XC tpK? ViX/ (a1) <a2) (a3) (a4)In the above formula (I), B is a divalent organic group in which two bonding bonds are bonded to an alicyclic skeleton or an aliphatic skeleton, and is preferably a group represented by the following formula (1B1) or formula (1B2). [8] - R4 - B1 and 3 - B1, R5 - R6 - B2 - R7~ (1B1) (1B2) {In the formulas (1B1) and (1B2), B1 is a cyclic saturated hydrocarbon group, and B2 is a benzene extending benzene. Further, R3 is a single bond, an ether bond, a carbonyl group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a saturated hydrocarbon group having 1 to 8 carbon atoms substituted by a fluorine atom, and R4 and R5 are each independently a single one. The bond or the alkyl group having a carbon number of 1 to 5 'R6 and R7 are each independently an alkylene group having 1 to 5 carbon atoms, and k is 0 or 1}. -14- 201107367 In the above formula, βΐ is preferably a cyclic saturated hydrocarbon group having 4 to 8 carbon atoms, more preferably a cyclic saturated hydrocarbon group having 4 to 6 carbon atoms, and further, any hydrogen atom contained in the fluorene 1 group. They may each be independently substituted with an aliphatic group. The aliphatic group of the substituent is preferably an aliphatic group having a carbon number of 1 to 5, more preferably an aliphatic group having 1 to 3 carbon atoms. When these substituents are bonded to form a ring, for example, a crosslinked cyclic hydrocarbon group such as a decyl group or an adamantyl group or a partially or fully hydrogenated condensed polycyclic hydrocarbon group can be formed. R3 is preferably a single bond, an ether bond, a carbonyl group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by an oxygen atom. Further, R4 and R5 are preferably a single bond or an alkylene group having 1 to 3 carbon atoms. Further, R6 and R7 are preferably an alkylene group having 1 to 3 carbon atoms. Preferred examples of the fluorene of the divalent organic group in the above formula (1) are, for example, the following formula (Β-1) to (Β-5). Among the groups represented by the following formulas (Β-1) to (Β-5), the group selected from the following formulas (Β-1) to (Β-4). (B-1) (Β·2) (Β·3) (Β-4) {BS} The specific polymer is preferably in the structural unit represented by the above formula (1). At least one structure selected from the group consisting of ιΑ1) to (1Α3) may contain a structure other than the group represented by the above formulas (1Α1) to (1Α3). The structure which can form a polyester structure is not particularly limited, but is preferably at least one selected from the group represented by the following formula (1 A 4 ) and formula (1 A 5 ). -15- 201107367 【化1 〇】Divided by R9仏切(1A4) (1A5) {In the formula (1A4) and (1A5), R8, R9 and R10 are each independently a single bond, an ether bond, a carbonyl group or a sulfonate. An acid group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a saturated hydrocarbon group having 1 to 8 carbon atoms substituted by a fluorine atom, and h is 0 or 1}. In the above formula, R8, R9 and R1Q are preferably a single A bond, an ether bond, a carbonyl group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. Particularly preferably, R8 is a single bond, an ether bond, a carbonyl group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. Further, R9 is preferably an ether bond, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. Further, R1G is preferably an ether bond, a carbonyl group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. Preferred examples of the above formulae (1 A4 ) to (1 A5 ) are, for example, the following formulas (al) to (a7). -16- 201107367 [Chem. 1 1] XC tpK? ViX/ (a1) <a2) (a3) (a4)

特定聚合物中，上述式（1)所表示之構造單位的A較佳爲’至少含有60莫耳％以上的上述式（1 A1 )至（！ A3 ) 所表不之基所成群中選出的至少一種構造單位。 (A)成份之被修飾的聚酯可如後述爲，特定聚合物與具有縮水甘油基及異氰酸酯基中選出的官能基之化合物反應而得。 (A )成份之被修飾的聚酯之重量平均分子量較佳爲，聚苯乙烯換算下1,000至30,000，更佳爲1，500至1〇,〇〇〇。該聚酯之重量平均分子量小於前述範圍時，傾向降低自本發明之熱硬化膜形成用感光性聚酯組成物形成的硬化膜之配向性及溶劑耐性，超過前述範圍時會降低平坦化性。 <特定聚合物之製造方法> 本發明中，特定聚合物可自含有下述式（i)所表示之四羧酸二酐之四羧酸二酐成份（以下亦稱爲配成份），成醇二爲稱亦下以 /IV 物合化醇二之示表所 ii)得 ( 而式應述反下 ^ 與份 -17- 201107367 【化1 2】In the specific polymer, A of the structural unit represented by the above formula (1) is preferably selected from the group consisting of the above formulas (1 A1 ) to (! A3 ) containing at least 60 mol% or more. At least one structural unit. The modified polyester of the component (A) can be obtained by reacting a specific polymer with a compound having a functional group selected from a glycidyl group and an isocyanate group, as will be described later. The weight average molecular weight of the modified polyester of the component (A) is preferably from 1,000 to 30,000, more preferably from 1,500 to 1 Torr in terms of polystyrene. When the weight average molecular weight of the polyester is less than the above range, the orientation and solvent resistance of the cured film formed from the photosensitive polyester composition for forming a thermosetting film of the present invention tend to be lowered, and when it exceeds the above range, flatness is lowered. <Production Method of Specific Polymer> In the present invention, the specific polymer may be a tetracarboxylic dianhydride component (hereinafter also referred to as a component) containing a tetracarboxylic dianhydride represented by the following formula (i). The formation of the alcohol is also referred to as the /IV complex alcohol II table ii) (and the formula should be described as the opposite ^ and parts -17- 201107367 [chemical 1 2]

HO-B-OH ( ϋ) {式（i)及（ii)中，A及B同上述式（1)之定義}。又，前述A及B之較佳形態與上述相同。本發明中，前述式（i)所表示之四羧酸二酐、前述式（ii)所表示之二醇化合物可各自獨立爲，單獨使用或使用2種以上。製造前述特定聚合物時，酸成份除了前述式（i )所表示之四羧酸二酐，可倂用其他的四羧酸二酐（以下亦稱爲其他酸二酐）。此時之其他酸二酐於無損本發明效果下無特別限定，較佳爲下述式（i2 )所表示之四羧酸二酐。【化1 3】 Ο 〇HO-B-OH ( ϋ) {In the formulas (i) and (ii), A and B are the same as defined in the above formula (1)}. Further, preferred embodiments of the above A and B are the same as described above. In the present invention, the tetracarboxylic dianhydride represented by the above formula (i) and the diol compound represented by the above formula (ii) may be used singly or in combination of two or more kinds. When the above specific polymer is produced, in addition to the tetracarboxylic dianhydride represented by the above formula (i), other tetracarboxylic dianhydride (hereinafter also referred to as other acid dianhydride) may be used. The other acid dianhydride at this time is not particularly limited, and is preferably a tetracarboxylic dianhydride represented by the following formula (i2). [化1 3] Ο 〇

A AA A

{式（12)中，W爲上述式（1)所定義的上述式（ 1 A4 )及（1 A5 )所表示之基中選出的至少一種構造，R8 、R9、R1Q及h同上述定義}。另外前述式（1 A4 )及（1 A5 )之較佳具體例同如上 -18 - 201107367 述式（al )至（a7 )。本發明較佳爲，酸成份中至少含有6 0莫耳％以上的上述式（Ο所表示之四羧酸二酐° 前述特定聚合物中，四羧酸二酐之合計量（酸成份之合計量）與二醇化合物之合計量（二醇成份之合計量）的添加比，即 <二醇化合物之合計莫耳數>/<四羧酸二酐化合物之合計莫耳數>較佳爲〇·95至1.5。同一般聚縮合反應般，該莫耳比近乎1時可增加所生成的特定聚合物之聚合度，而增加分子量。前述特定聚合物之末端會依存於酸成份與二醇成份之添加比而改變。例如以過剩酸成份進行反應時，末端易形成酸酐。又，使用過剩二醇成份進行聚合時，末端易形成羥基。此時之該末端羥基可與羧酸酐反應，而以酸酐封止末端羥基。該類羧酸酐如，酞酸酐、偏苯三酸酐、馬來酸酐、萘酸酐、氫化酞酸酐、甲基-5-降莰烯-2,3 -二羧酸酐、衣康酸酐、四氫酞酸酐等。因其後的加成反應中與具有縮水甘油基之化合物反應時’會使所生成的羥基與酸酐反應而凝膠化，故特定聚合物之末端是否爲羥基均需以酸酐封止末端羥基。製造特定聚合物時’酸成份與二醇成份之反應溫度可選用50至200°C，較佳爲80至170°C之任意溫度。例如可以反應溫度爲100至140°C、反應時間爲2至48小時之條件得到特定聚合物。 -19- 201107367 又，以酸酐保護末端羥基時之反應溫度可選用50至 2 00 °C，較佳爲80至170 °C之任意溫度。前述酸成份與前述二醇成份之反應一般係於溶劑中進行（以下將使用於聚合特定聚合物時之溶劑稱爲「聚合溶劑」）。此時所使用的溶劑可爲，不含羥基或胺基等會與酸酐反應之官能基之物無特別限定。例如，Ν,Ν-二甲基甲醯胺、Ν,Ν-二甲基乙醯胺、Ν-甲基吡咯烷酮、Ν-乙烯基吡咯烷酮、Ν-甲基己內醯胺、二甲基亞颯、四甲基尿素、二甲基颯、六甲基亞颯、m-甲酚、Τ-丁內酯、環己酮、環庚酮、甲基乙基酮、甲基異丁基酮、2-庚酮、甲基溶纖劑乙酸酯、乙基溶纖劑乙酸酯、丙二醇單甲基醚乙酸酯、丙二醇丙基醚乙酸酯、3-甲氧基丙酸甲酯、2-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、2-甲氧基丙酸乙酯、3-乙氧基丙酸乙酯、2-乙氧基丙酸乙酯等。此等溶劑可單獨或混合使用，但就彩色濾光片之保護劑對步驟的適用性觀點較佳爲丙二醇單甲基醚乙酸酯。又，既使爲不溶解特定聚合物之溶劑，於不析出聚合反應所生成的特定聚合物之範圍內，可混合使用於前述溶劑。又前述酸成份（式（i)及式（i2))與前述二醇成份 (式（ii ))反應時可使用觸媒。聚合特定聚合物時所使用的觸媒之具體例如，苄基三甲基銨氯化物、苄基三甲基銨溴化物、苄基三乙基銨氯化物、苄基三乙基銨溴化物、苄基三丙基銨氯化物、苄基三 -20- 201107367 丙基銨溴化物、四甲基銨氯化物、四乙基銨溴化物、基銨氯化物、四丙基銨溴化物等四級銨鹽、四苯基鱗物、四苯基鐵溴化物、苄基三苯基鱗氯化物、苄基三鱗溴化物、乙基三苯基鳞氯化物、乙基三苯基鐵溴化四級鱗鹽。 <製造（A )成份> 成份（A)之聚酯係自，相對於特定聚合物之羧加10至90莫耳％的具有縮水甘油基及異氰酸酯基中選官能基的化合物進行反應而得。此時可直接使用特定物之聚合溶液。又以共存醇系溶劑可抑制反應中凝膠化而爲佳。醇系溶劑（以下亦稱爲反應溶劑）之具體例如，丙二甲基醚、丙二醇單乙基醚、丙二醇單丁基醚、丙二醇醚、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二丁基醚、甲基溶纖劑、丁基溶纖劑、乳酸乙酯、乳酸、甲醇、乙醇、1-丙醇、2 -丙醇、1-丁醇' 2-丁醇、丁醇、環己醇等。此等溶劑可單獨或2種以上組合使用附加於特定聚合物之羧基的具有縮水甘油基之化的具體例如，縮水甘油基甲基丙烯酸酯、縮水甘油基酸酯、甲基縮水甘油醚、乙基縮水甘油醚、烯丙基縮油醚、4-tert-丁基苯基縮水甘油醚、縮水甘油基丙基縮水甘油基-2-甲基苯基醚、縮水甘油基丙基醚、縮水基異丙基醚、縮水甘油基丁基醚 '縮水甘油基-tert- 四丙氯化苯基物等基添出之聚合該類醇單丙基醇單丁酯 tert- 〇合物丙烯水甘醚、甘油丁基 -21 - 201107367 醚、2-聯苯縮水甘油醚、縮水甘油基-4_甲氧基苯基醚等。又’附加於特定聚合物之羧基的具有異氰酸酯基之化合物的具體例如，甲基異氰酸酯、乙基異氛酸酯、丙基異氰酸酯、異丙基異氰酸酯、丁基異氰酸酯、異丁基異氰酸酯、ter t· 丁基異氰酸酯、苯基異氰酸酯、2-甲苯醯異氰酸酯' 3 -甲苯醯異氰酸酯、4 -甲苯醯異氰酸酯、1-萘基異氰酸酯、環己基異氰酸酯、苄基異氰酸酯、2 -異氰酸酯乙基甲基丙烯酸酯、2 -甲氧基苯基異氰酸酯、3 -甲氧基苯基異氰酸酯、4-甲氧基苯基異氰酸酯、戊基異氰酸酯、己基異氰酸酯等。特定聚合物之羧基與反應用的具有縮水甘油基及異氰酸酯基中選出之官能基的化合物之反應溫度可選用50至 160°C，較佳爲80至140t之任意溫度。例如可以反應溫度爲1 0 0至1 3 0 °C、反應時間爲2至4 8小時之條件得到本發明用之成份（A)的聚酯。由此而得的含有（A)成份之聚酯的溶液可直接使用於調製本發明之熱硬化膜形成用感光性聚酯組成物。又，可於水、甲醇、乙醇、二乙基醚、己烷等弱溶劑中沈澱單離聚酯再回收使用。 < (B )成份> 本發明之（B)成份的具有2個以上環氧基之環氧化合物如，三（2,3-環氧丙基）三聚異氰酸酯、1，4-丁二醇二縮水甘油醚、1,2 -環氧-4-(環氧乙基）環己院、甘油三縮In the formula (12), W is at least one selected from the group represented by the above formula (1 A4 ) and (1 A5 ) defined by the above formula (1), and R8, R9, R1Q and h are the same as defined above} . Further, preferred examples of the above formulas (1 A4) and (1 A5) are the same as those of the above formulas (al) to (a7). In the present invention, the acid component preferably contains at least 60 mol% or more of the above formula (the tetracarboxylic dianhydride represented by Ο). The total amount of the tetracarboxylic dianhydride in the specific polymer (the total of the acid components) The addition ratio of the amount to the total amount of the diol compound (the total amount of the diol components), that is, the total number of moles of the diol compound >/<the total number of moles of the tetracarboxylic dianhydride compound> Preferably, it is from 95 to 1.5. As in the case of a general polycondensation reaction, the molar ratio of about 1 can increase the degree of polymerization of the specific polymer formed and increase the molecular weight. The end of the specific polymer depends on the acid component. The ratio of the addition of the diol component is changed. For example, when the reaction is carried out with a residual acid component, the terminal is likely to form an acid anhydride. Further, when the polymerization is carried out using the excess diol component, the terminal tends to form a hydroxyl group. The reaction is terminated with an acid anhydride such as phthalic anhydride, trimellitic anhydride, maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, and clothing. Acetic anhydride, tetrahydrophthalic anhydride Because the reaction in the subsequent addition reaction reacts with the compound having a glycidyl group, the resulting hydroxyl group reacts with the acid anhydride to gel, so whether the terminal of the specific polymer is a hydroxyl group or not is required to block the terminal hydroxyl group with an acid anhydride. When the specific polymer is produced, the reaction temperature of the acid component and the diol component may be 50 to 200 ° C, preferably 80 to 170 ° C. For example, the reaction temperature may be 100 to 140 ° C, and the reaction time is The specific polymer is obtained under conditions of 2 to 48 hours. -19- 201107367 Further, the reaction temperature for protecting the terminal hydroxyl group with an acid anhydride may be any temperature of 50 to 200 ° C, preferably 80 to 170 ° C. The reaction with the diol component is generally carried out in a solvent (hereinafter, the solvent used in the polymerization of a specific polymer is referred to as a "polymerization solvent"). The solvent used at this time may be a hydroxyl group or an amine group. The functional group of the reaction with the acid anhydride is not particularly limited. For example, hydrazine, hydrazine-dimethylformamide, hydrazine, hydrazine-dimethylacetamide, hydrazine-methylpyrrolidone, fluorene-vinylpyrrolidone, hydrazine- Methyl caprolactam, dimethyl Azulene, tetramethyl urea, dimethyl hydrazine, hexamethyl hydrazine, m-cresol, hydrazine-butyrolactone, cyclohexanone, cycloheptanone, methyl ethyl ketone, methyl isobutyl ketone , 2-heptanone, methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, methyl 3-methoxypropionate , methyl 2-methoxypropionate, ethyl 3-methoxypropionate, ethyl 2-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 2-ethoxypropionate These solvents may be used singly or in combination, but the viewpoint of suitability of the protective agent for the color filter to the step is preferably propylene glycol monomethyl ether acetate. Further, even a solvent which does not dissolve a specific polymer It can be used in combination with the above solvent insofar as it does not precipitate the specific polymer produced by the polymerization reaction. Further, a catalyst may be used in the reaction of the above acid component (formula (i) and formula (i2)) with the aforementioned diol component (formula (ii)). Specific examples of the catalyst used in polymerizing a specific polymer are, for example, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltriethylammonium chloride, benzyltriethylammonium bromide, Benzyltripropylammonium chloride, benzyltri-20-201107367 propylammonium bromide, tetramethylammonium chloride, tetraethylammonium bromide, ammonium chloride, tetrapropylammonium bromide, etc. Ammonium salt, tetraphenyl scale, tetraphenyl iron bromide, benzyl triphenyl scale chloride, benzyl tribulin bromide, ethyl triphenyl scale chloride, ethyl triphenyl iron bromide Grade scale salt. <Production of (A) Component> The polyester of the component (A) is reacted with 10 to 90 mol% of a compound having a glycidyl group and an isocyanate group-selective functional group with respect to the carboxyl group of the specific polymer. Got it. At this point, the polymerization solution of the specific substance can be used directly. Further, it is preferred to coexist the alcohol-based solvent to suppress gelation during the reaction. Specific examples of the alcohol solvent (hereinafter also referred to as a reaction solvent) include propylene glycol, propylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol ether, diethylene glycol monomethyl ether, and diethylene glycol alone. Ethyl ether, diethyldibutyl ether, methyl cellosolve, butyl cellosolve, ethyl lactate, lactic acid, methanol, ethanol, 1-propanol, 2-propanol, 1-butanol '2-butanol , butanol, cyclohexanol, etc. These solvents may be used singly or in combination of two or more kinds, and specific examples of the glycidyl group added to the carboxyl group of the specific polymer, for example, glycidyl methacrylate, glycidyl acid ester, methyl glycidyl ether, and B Glycidyl ether, allyl condensate ether, 4-tert-butylphenyl glycidyl ether, glycidyl propyl glycidyl-2-methylphenyl ether, glycidyl propyl ether, water-reducing group Polymerization of isopropyl ether, glycidyl butyl ether, glycidyl-tert-tetrapropyl chlorinated phenyl, etc., such as alcohol, monopropyl alcohol, monobutyl ester, tert- chelate, propylene water glycol ether , Glyceryl butyl-21 - 201107367 Ether, 2-biphenyl glycidyl ether, glycidyl-4_methoxyphenyl ether, and the like. Further, specific examples of the compound having an isocyanate group attached to a carboxyl group of a specific polymer, for example, methyl isocyanate, ethyl isocyanate, propyl isocyanate, isopropyl isocyanate, butyl isocyanate, isobutyl isocyanate, ter t · Butyl isocyanate, phenyl isocyanate, 2-toluene isocyanate ' 3-toluene isocyanate, 4-toluene isocyanate, 1-naphthyl isocyanate, cyclohexyl isocyanate, benzyl isocyanate, 2-isocyanate ethyl methacrylate 2-methoxyphenyl isocyanate, 3-methoxyphenyl isocyanate, 4-methoxyphenyl isocyanate, amyl isocyanate, hexyl isocyanate, and the like. The reaction temperature of the carboxyl group of the specific polymer with the compound having a glycidyl group and an isocyanate group-selected functional group for the reaction may be selected from any temperature of from 50 to 160 ° C, preferably from 80 to 140 t. For example, the polyester of the component (A) used in the present invention can be obtained under the conditions of a reaction temperature of from 1 to 10 ° C and a reaction time of from 2 to 48 hours. The solution of the polyester containing the component (A) thus obtained can be used as it is in the preparation of the photosensitive polyester composition for forming a thermosetting film of the present invention. Further, the isolated polyester can be precipitated and reused in a weak solvent such as water, methanol, ethanol, diethyl ether or hexane. < (B) Component> An epoxy compound having two or more epoxy groups as the component (B) of the present invention, for example, tris(2,3-epoxypropyl)trimeric isocyanate, 1,4-butane Alcohol diglycidyl ether, 1,2-epoxy-4-(epoxyethyl) cyclohexanin, glycerol triacetate

-22- 201107367 水甘油醚、二乙二醇二縮水甘油醚' 2，6·二縮水甘油基苯基縮水甘油醚、1，1，3-三〔ρ-(2,3-環氧丙氧基）苯基〕丙烷、1，2 -環己烷二羧酸二縮水甘油酯、4，4’-伸甲基雙（ Ν，Ν-二縮水甘油基苯胺）、3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯、三羥甲基乙烷三縮水甘油醚、雙酚Α二縮水甘油醚及季戊四醇聚縮水甘油醚等。又就易取得性可使用市售之化合物。以下爲其具體例 (商品名），但非限定於此等。YH-434、YH434L (東都化成（股）製）等具有胺基之環氧樹脂；耶波星GT-401、 GT-403、GT-301、GT-302、歇洛吉 2021、歇洛吉 3000 ( 泰歇爾化學工業（股）製）等具有環己烯氧化物構造之環氧樹脂；耶皮可 1001、 1002、 1003、 1004、 1007、 1009、 1010、828 (油化殻環氧（股）（現爲日本環氧械脂（股 ))製）等雙酚A型環氧樹脂；耶皮可807 (油化殼環氧（股）（現爲日本環氧械脂（股））製）等雙酚F型環氧樹脂；耶皮可152、154 (油化殼環氧（股）（現爲日本環氧械脂（股））製）、EPPN 201、202(日本化藥（股）製 )等苯酚酚醛清漆型環氧樹脂；EOCN-102、EOCN-103S 、EOCN-104S ' EOCN- 1 020、EOCN- 1 025、EOCN- 1 027 ( 曰本化藥（股）製）、耶皮可180S75 (油化殼環氧（股） (現爲日本環氧械脂（股））製）等甲酚酚醛清漆型環氧樹脂；提那可EX-252 (那卡歇（股）製）、CY175、 CY177 ' CY179、艾拉爾 C Y -1 8 2、C Y -1 9 2、C Y -1 8 4 ( CIBA-GEIGY A.G製）、那皮庫200、400 (大日本油墨化 -23- 201107367 學工業（股）製）、耶皮可8 71、8 72 (油化殼 (現爲日本環氧械脂（股））製）、E D - 5 6 6 1、歇拉尼（股）製）等脂環式環氧樹脂；提那 EX-612、EX-614、EX-622、EX-411、EX-512 EX-421、EX-313、EX-314、EX-321 (那卡歇等脂肪族聚縮水甘油醚等。又，具有至少2個環氧基之化合物可使用之聚合物。該類聚合物可爲具有環氧基之物無用。前述具有環氧基之聚合物可藉由，例如使基之加成聚合性單體的加成聚合而得。其例如油基丙烯酸酯、縮水甘油基甲基丙烯酸酯與乙酸酯之共聚物、縮水甘油基甲基丙烯酸酯與苯基乙基甲基丙烯酸酯之共聚物等加成聚合聚合酚醛清漆等縮聚合聚合物。又，前述具有環氧基之聚合物可藉由，具分子化合物與環氧氯丙烷、縮水甘油基對甲苯有環氧基之化合物的反應而得。 ~ 該類聚合物之重量平均分子量爲，聚苯乙如 300至 200,000 〇此等具有2個以上環氧基之環氧化合物可| 上組合使用。本發明之熱硬化膜形成用感光性聚酯組成成份的含量，相對於（A )成份之聚酯1 00質量環氧（股） ED-5 662 ( 可 EX-6 1 1、、EX-522、 (股）製）具有環氧基特別限制使用具有環氧，聚縮水甘基甲基丙烯乙烯與2-羥物，或環氧有羥基之高磺酸酯等具烯換算下例 I獨或2種以 :物中（B ) t份較佳爲3 -24- 201107367 至50質量份，更佳爲5至40質量份，特佳爲i〇至30質量份。該比率過小時，會降低自熱硬化膜形成用感光性聚酯組成物形成的硬化膜之溶劑性及耐熱性，又過大時會降低溶劑耐性及保存安定性。 < (C )成份> (C)成份爲’二胺化合物與二羧酸二酐反應而得的含有胺基之羧酸化合物。詳細而言爲，下述式（iii )所表示之二胺化合物1莫耳與下述式（iv)所表示之二羧酸酐 1. 7至2莫耳，較佳爲κ 8至2莫耳反應而得的含有胺基之羧酸化合物。【化1 4】-22- 201107367 Glycidyl ether, diethylene glycol diglycidyl ether ' 2,6 · diglycidyl phenyl glycidyl ether, 1,1,3-tri [ρ-(2,3-epoxypropoxyl) Phenyl]propane, 1,2-cyclohexanedicarboxylic acid diglycidyl ester, 4,4'-extended methyl bis(indole, fluorene-diglycidyl aniline), 3,4-epoxy ring Hexylmethyl-3,4-epoxycyclohexanecarboxylate, trimethylolethane triglycidyl ether, bisphenol hydrazine diglycidyl ether, pentaerythritol polyglycidyl ether, and the like. Commercially available compounds can also be used for ease of availability. The following are specific examples (product names), but are not limited thereto. YH-434, YH434L (Dongdu Chemical Co., Ltd.) and other amine-based epoxy resins; Yeboxing GT-401, GT-403, GT-301, GT-302, Shi Luoji 2021, Shi Luoji 3000 Epoxy resin with cyclohexene oxide structure, such as Taischer Chemical Industry Co., Ltd.; Jupiter 1001, 1002, 1003, 1004, 1007, 1009, 1010, 828 (oiled shell epoxy) ) (now made by Japan Epoxy Resin Co., Ltd.), etc.; bisphenol A type epoxy resin; yuppie 807 (oiled shell epoxy (stock) (now Japanese epoxy resin) ) bisphenol F type epoxy resin; yuppie 152, 154 (oily shell epoxy (stock) (now Japan epoxidized fat (share))), EPPN 201, 202 (Nippon Chemicals Co., Ltd.) )) phenol novolac type epoxy resin; EOCN-102, EOCN-103S, EOCN-104S 'EOCN- 1 020, EOCN- 1 025, EOCN- 1 027 (made by 曰本化药(股)), 耶Pico 180S75 (oiled shell epoxy (stock) (now made by Japan Epoxy Resin)) and other cresol novolac type epoxy resin; Tinaco EX-252 (Nakakushi Co., Ltd.) ), CY175, CY177 'CY179, Lal CY -1 8 2, CY -1 9 2, CY -1 8 4 (manufactured by CIBA-GEIGY AG), Napiku 200, 400 (Daily Ink -23- 201107367 (industry)), Epoxy resin such as yuppie 8 71, 8 72 (oiled shell (now manufactured by Nippon Epoxy Resin Co., Ltd.), ED - 5 6 6 1 , manufactured by Serrani); Tina EX-612, EX-614, EX-622, EX-411, EX-512 EX-421, EX-313, EX-314, EX-321 (Nakakacher and other aliphatic polyglycidyl ether, etc. a polymer which can be used as a compound having at least 2 epoxy groups. Such a polymer can be used as an epoxy group. The above-mentioned epoxy group-containing polymer can be polymerized by, for example, addition polymerization. Addition polymerization of monomers, such as oleyl acrylate, copolymer of glycidyl methacrylate and acetate, copolymer of glycidyl methacrylate and phenylethyl methacrylate a polycondensation polymer such as a novolac polymerized novolac. Further, the above epoxy group-containing polymer can be obtained by using a molecular compound with epichlorohydrin or glycidyl group. A compound having epoxy groups obtained by the reaction - the weight average molecular weight of such polymers, such as polystyrene of 300 to 200,000 square such an epoxy compound having two or more epoxy groups may |. The combination. The content of the photosensitive polyester component for forming a thermosetting film of the present invention is 100 parts by weight of the polyester of the (A) component, epoxide ED-5 662 (EX-6 1 1 , EX-522 , (manufacturing), having an epoxy group, particularly limited to use an epoxy having a polycondensation, a polyglycidyl methacrylic ethylene and a 2-hydroxyl group, or an epoxy having a hydroxyl group, and the like. The two (B) t parts are preferably from 3 to 24 to 201107367 to 50 parts by mass, more preferably from 5 to 40 parts by mass, particularly preferably from i to 30 parts by mass. When the ratio is too small, the solvent property and heat resistance of the cured film formed of the photosensitive polyester composition for forming a thermosetting film are lowered, and when it is too large, the solvent resistance and the storage stability are lowered. <(C) Component> The component (C) is an amine group-containing carboxylic acid compound obtained by reacting a diamine compound with a dicarboxylic acid dianhydride. Specifically, the diamine compound 1 represented by the following formula (iii) and the dicarboxylic anhydride represented by the following formula (iv) are 1.7 to 2 moles, preferably κ 8 to 2 moles. The amine group-containing carboxylic acid compound obtained by the reaction. [化1 4]

{式（iii)及式（iv)中，P及Q各自獨立爲2價有機基 } ° 因此藉由前述式（iii)所表示之二胺化合物與前述式 (iv)所表示之二羧酸反應，可得下述式（2)所表示之化合物。 -25- 201107367 [化1 5】In the formulae (iii) and (iv), P and Q are each independently a divalent organic group. Thus, the diamine compound represented by the above formula (iii) and the dicarboxylic acid represented by the above formula (iv) The reaction gives a compound represented by the following formula (2). -25- 201107367 [化1 5]

HOOCHOOC

(2) {式中，P及Q同前述式（iii)及式（iv)定義}。本發明中二胺化合物及二羧酸二酐可各自僅使用一種，或使用複數種。因此本發明之（C)成份的含有胺基之羧酸化合物非僅爲一種前述式（2 )所表示之化合物，可 .使用複數種。前述p及Q又以各自獨立爲具有環構造之2價有機基爲佳。該環構造如，苯環、脂環、縮合多環式碳化氫。前述式（iii)中，p所具有的環構造較佳爲苯環、碳原子數4至8之脂環、碳原子數7至16之縮合多環式碳化氮因此該類具有環構造之二胺化合物的具體例如T所述 :ρ -伸苯基二胺、m -伸苯基二胺、2,4 -一胺基甲苯、2,5_ 二胺基甲苯、2,6 -二胺基甲苯、2，4 -一甲基-1，3· —胺基本、2,5-二甲基-1,4-二胺基苯、2,3,5，6-四甲基_1，4·一妝基苯、2,4-二胺基苯酚、2,5-二胺基苯酣、4,6·二胺基間苯二酚、2，5 -二胺基安息香酸、3，5 * 一胺基安息香酸、N，N ·— 烯丙基-2,4-二胺基苯胺、N，N-二烯丙基_2,5-二胺基苯胺、 4 -胺基苄基胺、3_胺基苄基胺、2-(4_胺基苯基）乙基胺、2-(3_胺基苯基）乙基胺、丨，5·萘—胺、2,7 -萘—胺、 4,4，-二胺基聯苯、3,4，-二胺基聯苯、3,3’-二胺基聯苯、 -26- 201107367 2,2’-二甲基-4,4’-二胺基聯苯、3,3’-二甲基-4,4’-二胺基聯苯、3,3’-二甲氧基-4,4’-二胺基聯苯、3,3’-二羥基-4,4’-二胺基聯苯' 3,3’-二羥基-4,4’-二胺基聯苯、3,3’-二氟-4,4’-二胺基聯苯、2,2’-三氟甲基-4,4’-二胺基聯苯、3,3’-三氟甲基-4,4’-二胺基聯苯、4,4’-二胺基二苯基甲烷、3,3’-二胺基二苯基甲烷、3,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基醚、3，3’-二胺基二苯基醚、3,4’-二胺基二苯基醚、 4,4’-二胺基二苯基颯、3,3’-二胺基二苯基颯、4,4’-二胺基二苯基胺、3,3’-二胺基二苯基胺、3,4’-二胺基二苯基胺、N-甲基（4,4’_二胺基二苯基）胺、N-甲基（3,3’_二胺基二苯基）、N-甲基（3，4’-二胺基二苯基）胺、4,4’-二胺基二苯甲酮、3，3’-二胺基二苯甲酮、3，4’-二胺基二苯甲酮、 4,4’-二胺基苯醯苯胺、1，2·雙（4-胺基苯基）乙烷、1，2-雙（3-胺基苯基）乙烷、4,4’-二胺基二苯乙炔、1,3-雙（ 4-胺基苯基）丙烷、1，3-雙（3-胺基苯基）丙烷、2,2-雙（ 4_胺基苯基）丙烷、2,2-雙（3-胺基苯基）丙烷、2,2-雙（ 3-胺基_4-甲基苯基）丙烷、2，2-雙（4-胺基苯基）六氟丙烷、2,2-雙（3-胺基苯基）六氟丙烷、2,2-雙（3-胺基-4-甲基苯基）六氟丙烷、1，3-雙（4-胺基苯氧基）丙烷、 1,4-雙（4-胺基苯氧基）丁烷、1，5-雙（4-胺基苯氧基）戊烷、1，6-雙（4-胺基苯氧基）己烷、1,7-雙（4-胺基苯氧基 )庚烷、1，8-雙（4-胺基苯氧基）辛烷、1，9-雙（4-胺基苯氧基）壬烷、1,10-雙（4-胺基苯氧基）癸烷、1，1 1-雙（4-胺基苯氧基）十一烷、1,12-雙（4_胺基苯氧基）十二烷、 -27- 201107367 雙（4·胺基苯基）丙烷二醇酯、雙（4·胺基苯基）丁烷二醇酯、雙（4-胺基苯基）戊烷二醇酯、雙（4-胺基苯基）己烷二醇酯、雙（4-胺基苯基）庚烷二醇酯、雙（4-胺基苯基）辛烷二醇酯、雙（4-胺基苯基）壬烷二醇酯、雙（ 4_胺基苯基）癸烷二醇酯、I,4-雙（4-胺基苯基）苯、1,3-雙（4-胺基苯基）苯、1，4-雙（4-胺基苯氧基）苯、1,3-雙 (4-胺基苯氧基）苯、1,4-雙（4-胺基苄基）苯、1,3-雙（胺基苄基）苯、雙（4-胺基苯基）對苯二甲酸酯、雙（ ·« 3-胺基苯基）對苯二甲酸酯、雙（4-胺基苯基）間苯二甲酸酯、雙（3-胺基苯基）間苯二甲酸酯、1,4-伸苯基雙〔 (4-胺基苯基）甲酮〕、1，4-伸苯基雙〔（3-胺基苯基）甲酮〕、1，3-伸苯基雙〔（4-胺基苯基）甲酮〕、1，3-伸苯基雙〔（3-胺基苯基）甲酮〕、I,4-伸苯基雙（4-胺基苯甲酸酯）、：1，4-伸苯基雙（3-胺基苯甲酸酯）、：1，3-伸苯基雙（4-胺基苯甲酸酯）、1,3-伸苯基雙（3-胺基苯甲酸酯）、1&-(1,4-伸苯基）雙（4-胺基苯醯胺）、 N，N’- ( 1,3-伸苯基）雙（4-胺基苯醯胺）、N,N’- ( 1，4-伸苯基）雙（3-胺基苯醯胺）、N，N’- ( 1，3-伸苯基）雙（3-胺基苯醯胺）、雙-(4-胺基苯基）對苯二甲醯胺、雙-( 3-胺基苯基）對苯二甲醯胺、雙-(4_胺基苯基）間苯二甲醯胺、雙-(3-胺基苯基）間苯二甲醯胺、2,2-雙·〔 4- ( 4-胺基苯氧基）苯基〕丙烷、2,2-雙-〔4- ( 4-胺基苯氧基）苯基〕六氟丙烷、4,4’-雙（4 -胺基苯氧基）二苯基颯、 2,6-二胺基吡啶、2,4-二胺基吡啶、2,4-二胺基-1，3,5-三嗪 -28- 201107367 、2,6-二胺基二苯并呋喃、2,7_二胺基二苯并呋喃、3,6_二胺基二苯并呋喃、2,6_二胺基咔唑、2,7_二胺基咔唑、3,6_ 二胺基昨哩、2,4-二胺基-6-異丙基―丨，3,5-三嗪、2,5 -雙（ 4-胺基本基）-i，3,4-噁二唑、1>4_二胺基環己烷、丨，3_二胺基環己院、雙（4-胺基環己基）甲烷、雙（4_胺基_3_甲基環己基）甲烷等。又’前述式（iv)中’ Q所具有的環構造較佳爲苯環、碳原子數4至8之脂環、碳原子數7至16之縮合多環式碳化氫。Q更佳爲苯環、碳原子數4至8之脂環、碳原子數7至 16之縮合多環式碳化氮。具有該類環構造之二羧酸二酐的具體例如，酞酸酐、偏苯三酸酐 '馬來酸酐、萘二甲酸酐、氫化酞酸酐、甲基-5 -降茨烯-2,3-二羧酸酐、衣康酸酐、四氫酞酸酐等。製造上述（C)成份之化合物時，二胺化合物與二羧酸二酐之反應溫度可選用5至80 °C，較佳爲10至50 °C之任意溫度。前述反應一般係於溶劑中進行。此時所使用的溶劑可爲，不含羥基、胺基等會與酸酐反應之官能基之物無特別限定。例如N，N -二甲基甲醯胺、N，N -二甲基乙醯胺、N -甲基-2-吡咯烷酮、N-乙烯基吡咯烷酮、N-甲基己內醯胺、二甲基咪唑、二甲基亞颯、四甲基尿素、二甲基颯、六甲基亞諷、m -甲酣、7·丁內酯、環己酮、環庚酮、甲基乙基酮、甲基異丁基酮、2 -庚酮·、丙二醇單甲基酸乙酸醋、丙二醇丙基醚乙酸酯、3 -甲氧基丙酸甲酯、2 -甲氧基丙酸 -29- 201107367 甲酯、3 -甲氧基丙酸乙酯、2_甲氧基丙酸乙酯、3_乙氧基丙酸乙酯、2 -乙氧基丙酸乙酯、甲基溶纖劑乙酸酯 '乙基溶纖劑乙酸酯、甲基溶纖劑、乙基溶纖劑、丁基溶纖劑、丙二醇單甲基醚、丙二醇丙基醚、環己醇、乙酸乙酯、乙酸丁酯、乳酸乙酯、乳酸丁酯等。此等溶劑可單獨或混合使用，但就溶解性較佳爲丙二醇單甲基醚、丙二醇單甲基醚乙酸酯、N，N_二甲基乙醯胺、N -甲基-2 -吡咯烷酮、二甲基咪唑。又’既使爲不能溶解含有胺基之羧酸化合物的溶劑，於不會析出聚合反應所生成的該化合物之範圍內，可混合前述溶劑使用。本發明之熱硬化膜形成用聚酯組成物中，（C )成份含量相對於（A)成份之聚酯1〇〇質量份較佳爲3至50質量份，更佳爲5至40質量份。該比率過小時會降低自本發明之熱硬化膜形成用聚酯組成物形成的硬化膜之配向性，又過大時會降低透過率及平坦化型。 < (D )成份> (D )成份之1,2-醌二疊氮化合物爲，具有羥基或胺基中任何一方，或具有羥基及胺基雙方之化合物，此等羥基或胺基（具有羥基及胺基雙方時爲其合計量）中又以使用10至100莫耳％，特佳爲20至95莫耳％的經1，2-醌二疊氮磺酸而酯化，或醯胺化之化合物爲佳。前述具有羥基之化合物如，苯酚、〇-甲酚、m-甲酚、 -30- 201107367 P-甲酚、氫醌、間苯二酚、兒茶酚、掊酸甲酯 '掊酸乙酯、1,3，3_三（4-羥基苯基）丁烷、4,4-異亞丙基二苯酚、 2,2 -雙（4 -羥基苯基）丙烷、1,1-雙（4_羥基苯基）環己烷、4,4’-二羥基苯基楓、4,4-六氟異亞丙基二苯酚、4,4’，4”-三羥基苯基乙烷、1，1，1_三羥基苯基乙烷、4,4’_〔丨_〔 4_ 〔卜（4-羥基苯基）-1-甲基乙基〕苯基〕亞乙基〕雙酚、 2,4-二羥基二苯甲酮、2,3,4-三羥基二苯甲酮、2,2’，4,4’-四羥基二苯甲酮、2,3,4,4’ -四羥基二苯甲酮、2,2’，3,4,4’-五羥基二苯甲酮、2,5 -雙（2 -羥基-5·甲基苄基）甲酯等苯酚化合物' 乙醇、2-丙醇、4-丁醇、環己醇、乙二醇、丙二醇、二乙二醇、二丙二醇、2 -甲氧基乙醇、2-丁氧基乙醇、2-甲氧基丙醇、2-丁氧基丙醇、乳酸乙酯、乳酸丁酯等脂肪族醇類。又，前述含有胺基之化合物如，苯胺、〇-甲苯胺、m- 甲苯胺、P-甲苯胺、4-胺基二苯基甲烷、4-胺基二苯酯、〇 -伸苯基二胺、m -伸苯基二胺、p -伸苯基二胺、4，4 ’ -二胺基苯基甲烷、4,4’-二胺基二苯基醚等苯胺類、胺基環己烷〇又’前述含有羥基及胺基雙方之化合物如，〇_胺基苯酚、m-胺基苯酚、p-胺基苯酚、4_胺基甲酚、2,3_二胺基甲酹、2,4-二胺基苯酚、4,4’_二胺基_4，’_羥基三苯基甲烷、4-胺基_4’，4” -二羥基三苯基甲烷、雙（4-胺基-3-羧基- 5-羥基苯基）醚、雙（4 -胺基-3-羧基-5-羥基苯基）甲烷、 2,2-雙（4-胺基-3-羧基-5·羥基苯基）丙烷、2,2·雙（4_胺 -31 - 201107367 基-3-羧基-5-羥基苯基）六氟丙烷等胺基苯酚類、2-胺基乙醇、3-胺基丙醇、4-胺基環己醇等烷醇胺類。此等I,2-醌二疊氮化合物可單獨或2種以上組合使用。本發明之熱硬化膜形成用感光性聚酯組成物中，（D )成份含量相對於（A)成份100質量份較佳爲5至80質量份、更佳爲8至60質量份，特佳爲10至50質量份。該比率過小時會減少相對於顯像液之溶解速度，而難藉由顯像製圖。又超過100質量份時，短時間曝光將無法充分分解1，2-醌二疊氮化合物，而會降低敏感度，及（D )成份會吸收光而降低硬化膜之透明性。 < (E )成份> 本發明可含有（E)成份用之下述式（3)所表示的雙馬來醯亞胺化合物。 (E )成份之雙馬來醯亞胺化合物可提升平坦化性。【化1 6】 Ο 0(2) In the formula, P and Q are the same as defined in the above formulas (iii) and (iv). In the present invention, the diamine compound and the dicarboxylic dianhydride may each be used singly or in plural. Therefore, the amine group-containing carboxylic acid compound of the component (C) of the present invention is not limited to one compound represented by the above formula (2), and a plurality of kinds can be used. The above p and Q are preferably each independently a divalent organic group having a ring structure. The ring structure is, for example, a benzene ring, an alicyclic ring, or a condensed polycyclic hydrocarbon. In the above formula (iii), p has a ring structure of preferably a benzene ring, an alicyclic ring having 4 to 8 carbon atoms, and a condensed polycyclic carbonized carbon having 7 to 16 carbon atoms. Specific examples of the amine compound are, for example, T: ρ-phenylenediamine, m-phenylenediamine, 2,4-aminoaminotoluene, 2,5-diaminotoluene, 2,6-diaminotoluene 2,4-Methyl-1,3.-amine basic, 2,5-dimethyl-1,4-diaminobenzene, 2,3,5,6-tetramethyl-1,4· One-shot benzene, 2,4-diaminophenol, 2,5-diaminophenylhydrazine, 4,6-diaminoresorcinol, 2,5-diaminobenzoic acid, 3,5 * Monoamine benzoic acid, N,N-allyl-2,4-diaminoaniline, N,N-diallyl_2,5-diaminoaniline, 4-aminobenzylamine, 3-aminobenzylamine, 2-(4-aminophenyl)ethylamine, 2-(3-aminophenyl)ethylamine, hydrazine, 5-naphthyl-amine, 2,7-naphthalene- Amine, 4,4,-diaminobiphenyl, 3,4,-diaminobiphenyl, 3,3'-diaminobiphenyl, -26-201107367 2,2'-dimethyl-4, 4'-Diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethoxy- 4,4'-diaminobiphenyl, 3,3'-dihydroxy-4,4'-diaminobiphenyl '3,3'-dihydroxy-4,4'-diaminobiphenyl, 3 , 3'-difluoro-4,4'-diaminobiphenyl, 2,2'-trifluoromethyl-4,4'-diaminobiphenyl, 3,3'-trifluoromethyl-4 , 4'-diaminobiphenyl, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4 , 4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylanthracene , 3,3'-diaminodiphenylanthracene, 4,4'-diaminodiphenylamine, 3,3'-diaminodiphenylamine, 3,4'-diaminodiphenyl Amine, N-methyl (4,4'-diaminodiphenyl)amine, N-methyl (3,3'-diaminodiphenyl), N-methyl (3,4'- Diaminodiphenyl)amine, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, 3,4'-diaminobenzophenone, 4, 4'-Diaminobenzidine, 1,2 bis(4-aminophenyl)ethane, 1,2-bis(3-aminophenyl)ethane, 4,4'-diamine Diphenylacetylene, 1,3-bis(4-aminophenyl)propyl Alkane, 1,3-bis(3-aminophenyl)propane, 2,2-bis(4-aminophenyl)propane, 2,2-bis(3-aminophenyl)propane, 2,2 - bis(3-amino-4-methylphenyl)propane, 2,2-bis(4-aminophenyl)hexafluoropropane, 2,2-bis(3-aminophenyl)hexafluoropropane , 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane, 1,3-bis(4-aminophenoxy)propane, 1,4-bis(4-aminobenzene) Oxy)butane, 1,5-bis(4-aminophenoxy)pentane, 1,6-bis(4-aminophenoxy)hexane, 1,7-bis(4-amino Phenoxy)heptane, 1,8-bis(4-aminophenoxy)octane, 1,9-bis(4-aminophenoxy)decane, 1,10-bis(4-amine Phenoxy group) decane, 1,1 1-bis(4-aminophenoxy)undecane, 1,12-bis(4-aminophenoxy)dodecane, -27- 201107367 (4.Aminophenyl)propanediol ester, bis(4-aminophenyl)butanediol ester, bis(4-aminophenyl)pentanediol ester, bis(4-aminobenzene) Hexanediol ester, bis(4-aminophenyl)heptanediolate, bis(4-aminophenyl)octanediolate, bis(4-aminobenzene) a decanediol ester, bis(4-aminophenyl)decanediolate, I,4-bis(4-aminophenyl)benzene, 1,3-bis(4-aminophenyl) Benzene, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminobenzyl)benzene, 1 , 3-bis(aminobenzyl)benzene, bis(4-aminophenyl)terephthalate, bis(·«3-aminophenyl)terephthalate, bis(4- Aminophenyl)isophthalate, bis(3-aminophenyl)isophthalate, 1,4-phenylphenylbis[(4-aminophenyl)methanone], 1 , 4-phenylphenyl bis[(3-aminophenyl)methanone], 1,3-phenylene bis[(4-aminophenyl)methanone], 1,3-phenylene phenyl] (3-aminophenyl)methanone], I,4-phenylphenylbis(4-aminobenzoate), 1,4-phenylphenylbis(3-aminobenzoate) ,: 1,3-phenylene bis(4-aminobenzoate), 1,3-phenylene bis(3-aminobenzoate), 1&-(1,4-phenylene) Bis(4-aminophenylguanamine), N,N'-(1,3-phenylene)bis(4-aminophenylguanamine), N,N'- (1,4-phenylene) Base) double 3-aminophenylguanamine), N,N'-(1,3-phenylene)bis(3-aminophenylguanamine), bis-(4-aminophenyl)terephthalamide , bis-(3-aminophenyl)terephthalamide, bis-(4-aminophenyl)m-xylyleneamine, bis-(3-aminophenyl)m-xylylene hydrazide Amine, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis-[4-(4-aminophenoxy)phenyl]hexafluoropropane, 4,4'-bis(4-aminophenoxy)diphenylphosphonium, 2,6-diaminopyridine, 2,4-diaminopyridine, 2,4-diamino-1,3, 5-triazine-28- 201107367, 2,6-diaminodibenzofuran, 2,7-diaminodibenzofuran, 3,6-diaminodibenzofuran, 2,6_2 Amino carbazole, 2,7-diaminocarbazole, 3,6-diamine, ruthenium, 2,4-diamino-6-isopropyl-oxime, 3,5-triazine, 2,5 - bis(4-amine basic)-i,3,4-oxadiazole, 1>4-diaminocyclohexane, anthracene, 3-diaminocyclohexyl, bis(4-aminocyclohexyl) Methane, bis(4-amino-3-methylcyclohexyl)methane, and the like. Further, the ring structure of 'Q in the above formula (iv) is preferably a benzene ring, an alicyclic ring having 4 to 8 carbon atoms, or a condensed polycyclic hydrocarbon having 7 to 16 carbon atoms. More preferably, Q is a benzene ring, an alicyclic ring having 4 to 8 carbon atoms, and a condensed polycyclic carbonized carbon having 7 to 16 carbon atoms. Specific examples of the dicarboxylic dianhydride having such a ring structure include phthalic anhydride, trimellitic anhydride 'maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, methyl-5-norzene-2,3-dicarboxylic anhydride, Itaconic anhydride, tetrahydrophthalic anhydride, and the like. When the compound of the above (C) component is produced, the reaction temperature of the diamine compound and the dicarboxylic acid dianhydride may be any temperature of 5 to 80 ° C, preferably 10 to 50 ° C. The foregoing reaction is generally carried out in a solvent. The solvent to be used at this time is not particularly limited as long as it does not contain a functional group which reacts with an acid anhydride such as a hydroxyl group or an amine group. For example, N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, N-vinylpyrrolidone, N-methylcaprolactam, dimethyl Imidazole, dimethyl hydrazine, tetramethyl urea, dimethyl hydrazine, hexamethyl succinyl, m-methyl hydrazine, 7 · butyrolactone, cyclohexanone, cycloheptanone, methyl ethyl ketone, A Isobutyl ketone, 2-heptanone, propylene glycol monomethyl vine acetate, propylene glycol propyl ether acetate, methyl 3-methoxypropionate, 2-methoxypropionic acid -29- 201107367 Ester, ethyl 3-methoxypropionate, ethyl 2-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 2-ethoxypropionate, methyl cellosolve acetate 'Ethyl cellosolve acetate, methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether, propylene glycol propyl ether, cyclohexanol, ethyl acetate, butyl acetate, lactic acid Ethyl ester, butyl lactate, and the like. These solvents may be used singly or in combination, but the solubility is preferably propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, N,N-dimethylacetamide, N-methyl-2-pyrrolidone , dimethylimidazole. Further, even if it is a solvent which does not dissolve the amino group-containing carboxylic acid compound, it can be used by mixing the above solvent within the range in which the compound formed by the polymerization reaction is not precipitated. In the polyester composition for forming a thermosetting film of the present invention, the content of the component (C) is preferably from 3 to 50 parts by mass, more preferably from 5 to 40 parts by mass, per part by mass of the polyester of the component (A). . When the ratio is too small, the alignment property of the cured film formed from the polyester composition for forming a thermosetting film of the present invention is lowered, and when it is too large, the transmittance and the planarization type are lowered. < (D) Component> The (1) component of the 1,2-quinonediazide compound is a compound having either a hydroxyl group or an amine group, or a compound having both a hydroxyl group and an amine group, and such a hydroxyl group or an amine group ( Esterified with 1,2-quinonediazidesulfonic acid in the range of 10 to 100 mol%, particularly preferably 20 to 95 mol%, in the total amount of both the hydroxyl group and the amine group, or Aminated compounds are preferred. The aforementioned compound having a hydroxyl group such as phenol, hydrazine-cresol, m-cresol, -30-201107367 P-cresol, hydroquinone, resorcinol, catechol, methyl decanoate, ethyl citrate, 1,3,3_tris(4-hydroxyphenyl)butane, 4,4-isopropylidenediphenol, 2,2-bis(4-hydroxyphenyl)propane, 1,1-double (4_ Hydroxyphenyl)cyclohexane, 4,4'-dihydroxyphenyl maple, 4,4-hexafluoroisopropylidene diphenol, 4,4',4"-trihydroxyphenylethane, 1,1 ,1_trihydroxyphenylethane, 4,4'_[丨_[4_[Bu(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene]bisphenol, 2,4 -dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2,3,4,4'-tetrahydroxy Phenolic compounds such as benzophenone, 2,2',3,4,4'-pentahydroxybenzophenone, 2,5-bis(2-hydroxy-5.methylbenzyl)methyl ester, ethanol, 2- Propanol, 4-butanol, cyclohexanol, ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, 2-methoxyethanol, 2-butoxyethanol, 2-methoxypropanol, 2- Butyloxypropanol, ethyl lactate, butyl lactate and other fats Further, the aforementioned amine group-containing compound such as aniline, oxime-toluidine, m-toluidine, P-toluidine, 4-aminodiphenylmethane, 4-aminodiphenyl ester, oxime-extension Phenyldiamine, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminophenylmethane, 4,4'-diaminodiphenyl ether, anilines, amines The cyclohexane oxime and the above-mentioned compounds containing both a hydroxyl group and an amine group, such as hydrazine-aminophenol, m-aminophenol, p-aminophenol, 4-aminophenol, 2,3-diamine Formamidine, 2,4-diaminophenol, 4,4'-diamino-4, '-hydroxytriphenylmethane, 4-amino-4', 4"-dihydroxytriphenylmethane, double (4-Amino-3-carboxy-5-hydroxyphenyl)ether, bis(4-amino-3-carboxy-5-hydroxyphenyl)methane, 2,2-bis(4-amino-3- Aminophenols such as carboxy-5-hydroxyphenyl)propane, 2,2.bis (4-amino-31-201107367-yl-3-carboxy-5-hydroxyphenyl)hexafluoropropane, 2-aminoethanol, Alkanolamines such as 3-aminopropanol and 4-aminocyclohexanol. These I,2-quinonediazide compounds may be used alone or in combination of two or more. In the photosensitive polyester composition for forming a thermosetting film of the present invention, the content of the component (D) is preferably from 5 to 80 parts by mass, more preferably from 8 to 60 parts by mass, per 100 parts by mass of the component (A). It is 10 to 50 parts by mass. When the ratio is too small, the dissolution rate with respect to the developing solution is reduced, and it is difficult to develop by development. When it exceeds 100 parts by mass, the short-time exposure will not sufficiently decompose the 1,2-quinonediazide compound, which will lower the sensitivity, and the (D) component will absorb light and lower the transparency of the cured film. <(E) Component> The present invention may contain a bismaleimine compound represented by the following formula (3) for the component (E). The (B) component of the bismaleimide compound enhances planarization. [化1 6] Ο 0

(3) (式中，M,爲脂肪族基、含有環式構造之脂肪族基及芳香族基所成群中選出之有機基或此等之群中選出的複數有機基組成之有機基。又可含有酯鍵、醚鍵、醯胺鍵、胺基甲酸乙酯等鍵）。 -32- 201107367 該類雙馬來醯亞胺化合物如，Ν,Ν’-3，3-二苯基甲烷雙馬來醯亞胺、]^,：^’-(3,3-二乙基-5,5-二甲基）-4,4-二苯基-甲烷雙馬來醯亞胺' N，N’-4,4-二苯基甲烷雙馬來醯亞胺、3,3-二苯基颯雙馬來醯亞胺' 4,4-二苯基颯雙馬來醯亞胺、Ν，Ν’-Ρ·二苯甲酮雙馬來醯亞胺、N，N’-二苯基乙烷雙馬來醯亞胺、N，N’-二苯基醚雙馬來醯亞胺、N，N’-(伸甲基二-二四氫苯基）馬來醯亞胺、N，N’-(3-乙基）-4,4-二苯基甲烷雙馬來醯亞胺、：^，>^’-(3,3-二甲基）-4,4-二苯基甲烷雙馬來醯亞胺、N，N’-(3, 3-二乙基）-4，4-二苯基甲烷雙馬來醯亞胺、N，N’-(3,3-二氯）-4,4-二苯基甲烷雙馬來醯亞胺、Ν,Ν’-異佛爾酮雙馬來醯亞胺、N，N’-三嗪雙馬來醯亞胺、Ν,Ν’-二苯基丙烷馬來醯亞胺、N，N’-萘雙馬來醯亞胺、N，N’-m-伸苯基雙馬來醯亞胺、N，N’-5 -甲氧基-1，3-伸苯基雙馬來醯亞胺、2,2-雙（4- (4-馬來醯亞胺苯氧基）苯基）丙烷、2，2-雙（3-氯-4- (4-馬來醯亞胺苯氧基 )苯基）丙烷、2,2-雙（3 -溴-4- (4-馬來醯亞胺苯氧基）苯基）丙烷、2,2 -雙（3 -乙基-4- (4 -馬來醯亞胺苯氧基）苯基）丙烷、2,2-雙（3-丙基_4·( 4-馬來醯亞胺苯氧基）苯基）丙烷、2,2-雙（3-異丙基-4- (4-馬來醯亞胺苯氧基 )苯基）丙烷、2，2 -雙（3 -丁基-4- (4·馬來醯亞胺苯氧基 )苯基）丙烷、2，2 -雙（3 -甲氧基-4- (4_馬來醯亞胺苯氧基）苯基）丙烷、1,1-雙（4- (4 -馬來醯亞胺苯氧基）苯基）乙烷、1，1_雙（3 -甲基-4- (4 -馬來醯亞胺苯氧基）苯基）乙烷、1，1-雙（3-氯-4-(4-馬來醯亞胺苯氧基）苯基 -33- 201107367 )乙烷、1,1-雙（3 -溴(4 -馬來醯亞胺苯氧基）苯基）乙烷、3,3-雙（心（4-馬來醯亞胺苯氧基）苯基）戊烷、 1，1,1，3, 3，3 -六氟- 2,2 -雙（4 -馬來醯亞胺苯氧基）苯基）丙烷、1，1，1,3,3,3-六氟-2,2-雙（3,5-二甲基-4-(4-馬來醯亞胺苯氧基）苯基）丙烷、1，1,1，3,3,3-六氟-2,2-雙（3,5，二溴-4- ( 4-馬來醯亞胺苯氧基）苯基）丙烷、Ν，Ν’-伸乙基二馬來醯亞胺、Ν，Ν’-六伸甲基雙馬來醯亞胺、Ν,Ν’-十二伸甲基雙馬來醯亞胺、Ν,Ν’-m-二甲苯雙馬來醯亞胺、 N，N’-p-二甲苯雙馬來醯亞胺、N，N’-1，3-雙伸甲基環己烷雙馬來醯亞胺、义^-2,4-伸苄基雙馬來醯亞胺、>^，：^’-2,6-伸苄基雙馬來醯亞胺等。此等雙馬來醯亞胺化合物無特別限定爲上述之物。此等可單獨或2種以上之成份倂用。此等馬來醯亞胺中較佳爲2,2-雙（4- ( 4-馬來醯亞胺苯氧基）苯基）丙烷、N，N’-4,4-二苯基甲烷雙馬來醯亞胺、N，N’-(3,3-二乙基-5,5-二甲基）-4,4-二苯基-甲烷雙馬來醯亞胺等芳香族雙馬來醯亞胺。又，此等芳香族雙馬來醯亞胺中，爲了得到更高平坦化性較佳爲分子量1，〇〇〇以下之物。本發明之熱硬化膜形成用感光性聚酯組成物中，（E )成份含量相對於（A )成份之聚酯1 0 〇質量份較佳爲〇 . 5 至5〇質量份’更佳爲1至30質量份，特佳爲2至20質量份。該比率過小時會降低自本發明之熱硬化膜形成用感光性聚酯組成物形成的硬化膜之平坦化性，過大時會降低硬化膜 -34- 201107367 之透過率及使塗膜粗糙。 <溶劑> 本發明之熱硬化膜形成用感光性聚酯組成物多半係以溶解於溶劑之溶液狀態使用。此時所使用的溶劑爲，可溶解（A )成份至（C )成份，必要時使用之（E )成份及/或後述其他添加劑，而具有該類溶解時之溶劑無特別限定其種類及構造等。該類溶劑如，聚合特定聚合物時所使用的溶劑及上述反應溶劑，又如乙酸乙酯、乙酸丁酯等。此等溶劑可單獨或二種以上組合使用。 <其他添加劑> 又’本發明之熱硬化膜形成用感光性聚酯組成物於無損本發明效果下’必要時可含有表面活性劑、液流調整劑、矽烷偶合劑等接著補助劑、顏料、染料、保存安定劑、消泡劑、多價苯酚及多價羧酸等溶解促進劑等。 <熱硬化膜形成用感光性聚酯組成物> 本發明之熱硬化膜形成用感光性聚酯組成物可爲，含有（A)成份之聚酯、（B)成份之具有2個以上環氧基的環氧化合物、（C )成份之含有胺基的羧酸化合物、（c ) 成份之1，2-醌二疊氮化合物，及所希望之（E)成份之雙馬來醯亞胺化合物，以及其他添加劑中一種以上之組成物 -35- 201107367 。一般此等多半係以溶解於溶劑之溶液狀使用。其中本發明之熱硬化膜形成用感光性聚酯組成物較佳如下述之物。〔1〕：基於（A)成份100質量份含有3至50質量份之 (B)成份、3至50質量份之（C)成份、5至80質量份之（ D)成份的熱硬化膜形成用感光性聚酯組成物。〔2〕：基於（A)成份100質量份含有3至50質量份之 (B)成份、3至50質量份之（C)成份、5至80質量份之（ D )成份、溶劑的熱硬化膜形成用感光性聚酯組成物。〔3〕：基於（A)成份1〇〇質量份含有3至50質量份之 (B)成份、3至50質量份之（C)成份、5至80質量份之（ D )成份、0 · 5至5 0質量份之（E )成份的熱硬化膜形成用感光性聚酯組成物》〔4〕：基於（A)成份1〇〇質量份含有3至50質量份之 (B)成份、3至50質量份之（C)成份、5至80質量份之（ D )成份、0 · 5至5 0質量份之（e )成份、溶劑的熱硬化膜形成用感光性聚酯組成物。以溶液狀使用本發明之熱硬化膜形成用感光性聚酯組成物時，添加比率、調製方法等如下詳述。本發明之熱硬化膜形成用感光性聚酯組成物中，能將各成份均勻溶解於溶劑時固體成份之比率無特別限定，可爲1至8 0質量％ ’較佳爲5至6 0質量％，更佳爲1 〇至5 0質量％。該固體成份係指’熱硬化膜形成用感光性聚酯組成物之全部成份去除溶劑後之物。 -36- 201107367 本發明之熱硬化膜形成用感光性聚酯組成物的調製方法無特別限定，該調製方法如，將（A )成份溶解於溶劑後，該溶液以一定比率混合（B )成份、（C )成份、（D )成份及（E)成份，得均勻溶液之方法，或於該調整方法之適當階段另添加混合必要時使用的其他添加劑之方法〇調製本發明之熱硬化膜形成用感光性聚酯組成物時，可直接使用溶劑中藉由聚合反應而得的聚酯溶液。此時同前述將（B )成份、（C )成份、（D )成份、（E )成份等加入該（A)成份溶液中形成均勻溶液時，爲了調整濃度可另追加溶劑。此時生成聚酯之過程中所使用的溶劑可同或不同於調製熱硬化膜形成用感光性聚酯組成物時調整濃度用之溶劑。又以使用孔徑0.2 μιη之濾器等過濾調製後之熱硬化膜形成用感光性聚酯組成物溶液後再使用爲佳。 <塗膜、硬化膜及液晶配向層> 將本發明之熱硬化膜形成用感光性聚酯組成物回轉塗佈 '流動塗佈、輥塗佈、縫隙塗佈' 縫隙加上回轉塗佈、噴墨塗佈、利用印刷等塗佈於基板（例如，矽/二氧化矽被覆基板、氮化矽基板、被金屬，例如鋁、鉬、鉻等被覆之基板、玻璃基板、石英基板、IT 0基板等）或薄膜（例如，三乙醯纖維系膜、聚酯膜、丙烯酸膜等樹脂薄膜）等上方後’以熱板或烤箱等預備乾燥（預烤），可形成塗膜 -37- 201107367 。其後加熱處理該塗膜，形成被膜。該加熱處理條件可採用，例如自溫度70至1 60 °C，時間0.3至60分鐘之範圍內選擇的加熱溫度及加熱時間。加熱溫度及加熱時間較佳爲80至140°C、0.5至10分鐘。又，自熱硬化膜形成用感光性聚酯組成物形成的被膜膜厚例如0.1至30 μηι，可考量所使用的基板段差及光學、電氣性質後適當選擇。後烤時一般係採因溫度140至2 5 0 °C之範圍內選出的加熱溫度下，使用熱板時處理5至30分鐘，使用烤箱時處理 30至90分鐘之方法。、藉由上述條件硬化本發明之熱硬化膜形成用感光性聚酯組成物，可形成基板段差充分平坦化、具有高透明性之硬化膜。對所形成的硬化膜進行摩擦處理，可得液晶材配向層，即具有液晶性之化合物經配向的層用之機能。摩擦處理之條件一般得使用回轉速度3 00至lOOOrpm、運送速度3至2 00mm/秒、擠壓量0.1至1mm之條件。其後使用純水等進行超音波洗淨以去除所生成的殘渣〇將相位差材料塗佈於上述形成之液晶配向層後，將相位差材料光硬化爲液晶狀態，可形成具有光學各向異性之層。相位差材料例如可使用具有聚合性基之液晶單體或含有其之組成物等。 -38- 201107367 形成液晶配向層之基材爲薄膜狀時，適用爲光學各向異性薄膜。又，介有調距器以液晶配向層面對面方式貼合上述所形成的具有液晶配向層之基板2枚後，將液晶注入此等基板之間，得液晶配向之液晶顯示元件。因此本發明之熱硬化膜形成用感光性聚酯組成物適用於各種光學各向異性薄膜、液晶顯示元件。又，因本發明之熱硬化膜形成用感光性聚酯組成物具有至少必要水準之平坦化性，故適用爲形成薄膜晶體管（ TFT )型液晶顯示元件、有機EL元件等各種顯示器之保護膜、平坦化膜、絕緣膜等硬化膜用之材料，特別是適用爲彩色濾光片之保護膜材料、TFT型液晶元件之層間絕緣膜、有機EL元件之絕緣膜等。【實施方式】實施例下面將舉實施例更詳細說明本發明，但本發明非限定於此等實施例。〔實施例所使用的代號〕下面爲實施例所使用之代號的意義。 <聚酯原料> BPDA :聯苯四羧酸二酐 -39- 201107367 HBPDA ： 3,3’-4,4’-雙環己基四羧酸二酐(3) (wherein M is an organic group selected from the group consisting of an aliphatic group, an aliphatic group having a cyclic structure, and an aromatic group or a plurality of organic groups selected from the group. Further, it may contain an ester bond, an ether bond, a guanamine bond or a urethane bond. -32- 201107367 This type of bismaleimide compound such as hydrazine, Ν'-3,3-diphenylmethane bismaleimide,]^,:^'-(3,3-diethyl -5,5-dimethyl)-4,4-diphenyl-methane bismaleimine 'N,N'-4,4-diphenylmethane bismaleimide, 3,3- Diphenyl hydrazine bismaleimide ' 4,4-diphenyl fluorene bismaleimide, hydrazine, Ν'-Ρ·benzophenone bismaleimide, N,N'-II Phenylethane, bismaleimide, N,N'-diphenyl ether, bismaleimide, N,N'-(methylidene-ditetrahydrophenyl)maleimide, N,N'-(3-ethyl)-4,4-diphenylmethane bismaleimide, :^,>^'-(3,3-dimethyl)-4,4-di Phenylmethane bismaleimide, N,N'-(3,3-diethyl)-4,4-diphenylmethane bismaleimide, N,N'-(3,3- Dichloro)-4,4-diphenylmethane bismaleimide, hydrazine, Ν'-isophorone bismaleimide, N,N'-triazine bismaleimide, hydrazine ,Ν'-diphenylpropane maleimide, N,N'-naphthalene bismaleimide, N,N'-m-phenylene bismaleimide, N,N'-5 -methoxy -1,3-phenylene bismaleimide, 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-chloro- 4-(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-bromo-4-(4-maleimidophenoxy)phenyl)propane, 2, 2-bis(3-ethyl-4-(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-propyl-4)(4-maleimide benzene) Oxy)phenyl)propane, 2,2-bis(3-isopropyl-4-(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-butyl- 4-(4·maleimide phenoxy)phenyl)propane, 2,2-bis(3-methoxy-4-(4-maleimidophenoxy)phenyl)propane, 1,1-bis(4-(4-maleimidophenoxy)phenyl)ethane, 1,1-bis(3-methyl-4-(4-maleimide phenoxy) Phenyl)ethane, 1,1-bis(3-chloro-4-(4-maleimidophenoxy)phenyl-33- 201107367) ethane, 1,1-bis(3-bromo) (4-maleimide phenoxy)phenyl) ethane, 3,3-bis(heart (4-maleimidophenoxy)phenyl)pentane, 1,1,1,3 , 3,3 - hexafluoro-2,2 - double (4 -醯iminophenoxy)phenyl)propane, 1,1,1,3,3,3-hexafluoro-2,2-bis(3,5-dimethyl-4-(4-malay) Iminophenoxy)phenyl)propane, 1,1,1,3,3,3-hexafluoro-2,2-bis(3,5,dibromo-4-(4-maleimide) Oxy)phenyl)propane, hydrazine, Ν'-extended ethyl dimaleimide, anthracene, Ν'-hexa-methyl-bis-maleimide, anthracene, Ν'-domemethyl double Maleidin, anthracene, Ν'-m-xylene double malamidine, N,N'-p-xylene double maleimide, N,N'-1,3-double stretch Cyclohexane bis-maleimide, y^^,4-extended benzyl bismaleimide, >^,:^'-2,6-extension benzyl bismaleimide, etc. . These bismaleimide compounds are not particularly limited to the above. These may be used alone or in combination of two or more. Preferred among these maleimides are 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane, N,N'-4,4-diphenylmethane double Aromatic double horses such as maleic imine, N,N'-(3,3-diethyl-5,5-dimethyl)-4,4-diphenyl-methane bismaleimide Yttrium. Further, among these aromatic bismaleimine, in order to obtain higher flatness, the molecular weight is preferably 1 or less. In the photosensitive polyester composition for forming a thermosetting film of the present invention, the content of the (E) component is preferably 〇. 5 to 5 parts by mass of the polyester of the (A) component. 1 to 30 parts by mass, particularly preferably 2 to 20 parts by mass. When the ratio is too small, the flattening property of the cured film formed from the photosensitive polyester composition for forming a thermosetting film of the present invention is lowered, and when it is too large, the transmittance of the cured film -34 to 201107367 is lowered and the coating film is roughened. <Solvent> The photosensitive polyester composition for forming a thermosetting film of the present invention is mostly used in the form of a solution dissolved in a solvent. The solvent to be used at this time is such that the component (A) to the component (C) can be dissolved, and if necessary, the component (E) and/or other additives described later are used, and the solvent in the case of such dissolution is not particularly limited in type and structure. Wait. Such a solvent is, for example, a solvent used for polymerizing a specific polymer and the above-mentioned reaction solvent, such as ethyl acetate, butyl acetate or the like. These solvents may be used alone or in combination of two or more. <Other Additives> Further, the photosensitive polyester composition for forming a thermosetting film of the present invention may contain a secondary agent such as a surfactant, a liquid flow regulator, or a decane coupling agent, if necessary, without impairing the effects of the present invention. A dissolution promoter such as a pigment, a dye, a storage stabilizer, an antifoaming agent, a polyvalent phenol or a polyvalent carboxylic acid. <Photosensitive polyester composition for forming a thermosetting film> The photosensitive polyester composition for forming a thermosetting film of the present invention may have two or more polyesters containing (A) component and (B) component. An epoxy compound of an epoxy group, an amine group-containing carboxylic acid compound of the component (C), a 1,2-quinonediazide compound of the component (c), and a desired (E) component of the double Malayanya One or more of the amine compounds, as well as other additives -35-201107367. Generally, most of these are used in the form of a solution dissolved in a solvent. Among them, the photosensitive polyester composition for forming a thermosetting film of the present invention is preferably as follows. [1]: Forming a thermosetting film containing 3 to 50 parts by mass of the component (B), 3 to 50 parts by mass of the component (C), and 5 to 80 parts by mass of the component (D) based on 100 parts by mass of the component (A) A photosensitive polyester composition is used. [2]: Based on 100 parts by mass of the component (A), it contains 3 to 50 parts by mass of the component (B), 3 to 50 parts by mass of the component (C), 5 to 80 parts by mass of the component (D), and heat hardening of the solvent. A photosensitive polyester composition for film formation. [3]: Containing 3 to 50 parts by mass of (B) component, 3 to 50 parts by mass of (C) component, 5 to 80 parts by mass of (D) component, 0 based on 1 part by mass of the component (A). 5 to 50 parts by mass of the photosensitive polyester composition for forming a thermosetting film of the component (E), [4]: 3 to 50 parts by mass of the component (B) based on 1 part by mass of the component (A), 3 to 50 parts by mass of the component (C), 5 to 80 parts by mass of the component (D), 0.5 to 50 parts by mass of the component (e), and a photosensitive polyester composition for forming a thermosetting film of a solvent. When the photosensitive polyester composition for forming a thermosetting film of the present invention is used in the form of a solution, the addition ratio, the preparation method, and the like are as described in detail below. In the photosensitive polyester composition for forming a thermosetting film of the present invention, the ratio of the solid component when the components are uniformly dissolved in the solvent is not particularly limited, and may be from 1 to 80% by mass, preferably from 5 to 60% by mass. %, more preferably 1 〇 to 50% by mass. The solid content is a substance obtained by removing all the components of the photosensitive polyester composition for forming a thermosetting film. -36-201107367 The preparation method of the photosensitive polyester composition for forming a thermosetting film of the present invention is not particularly limited. For example, after the component (A) is dissolved in a solvent, the solution is mixed at a certain ratio (B). , (C) component, (D) component and (E) component, a method of obtaining a homogeneous solution, or adding a method of mixing other additives as necessary at an appropriate stage of the adjustment method, preparing a thermosetting film of the present invention When a photosensitive polyester composition is used, a polyester solution obtained by a polymerization reaction in a solvent can be used as it is. In this case, when the component (B), the component (C), the component (D), and the component (E) are added to the solution of the component (A) to form a homogeneous solution, a solvent may be additionally added to adjust the concentration. The solvent used in the process of producing the polyester at this time may be the same as or different from the solvent for adjusting the concentration when the photosensitive polyester composition for forming a thermosetting film is prepared. Further, it is preferred to use a solution of the photosensitive polyester composition for forming a thermosetting film after the preparation by using a filter having a pore size of 0.2 μm or the like. <Coating film, cured film, and liquid crystal alignment layer> The photosensitive polyester composition for forming a thermosetting film of the present invention is subjected to a rotary coating 'flow coating, roll coating, slit coating' slit plus spin coating Inkjet coating, application to a substrate by printing or the like (for example, a tantalum/yttria-coated substrate, a tantalum nitride substrate, a substrate coated with a metal such as aluminum, molybdenum, or chromium, a glass substrate, a quartz substrate, or IT) 0 substrate or the like or a film (for example, a resin film such as a triethylene fluorene fiber film, a polyester film, or an acrylic film), etc., and then preliminarily dried (prebaked) by a hot plate or an oven to form a coating film-37- 201107367. Thereafter, the coating film is heat-treated to form a coating film. The heat treatment conditions may be, for example, a heating temperature and a heating time selected from the range of temperature 70 to 1 60 ° C for a period of 0.3 to 60 minutes. The heating temperature and heating time are preferably from 80 to 140 ° C for 0.5 to 10 minutes. Further, the film thickness of the film formed of the photosensitive polyester composition for forming a thermosetting film is, for example, 0.1 to 30 μm, and can be appropriately selected in consideration of the substrate step difference and optical and electrical properties to be used. The post-baking method is generally carried out at a heating temperature selected in the range of 140 to 250 °C, 5 to 30 minutes when using a hot plate, and 30 to 90 minutes when using an oven. By curing the photosensitive polyester composition for forming a thermosetting film of the present invention under the above conditions, a cured film having a sufficiently high flatness and a high transparency can be formed. The resulting cured film is subjected to a rubbing treatment to obtain a liquid crystal material alignment layer, that is, a function of a layer having a liquid crystal compound aligned. The conditions of the rubbing treatment are generally those using a rotation speed of 300 to 1000 rpm, a conveying speed of 3 to 200 mm/sec, and a pressing amount of 0.1 to 1 mm. Thereafter, ultrasonic cleaning is performed by using pure water or the like to remove the generated residue. After the phase difference material is applied to the liquid crystal alignment layer formed as described above, the phase difference material is photohardened into a liquid crystal state to form optical anisotropy. Layer. As the phase difference material, for example, a liquid crystal monomer having a polymerizable group or a composition containing the same can be used. -38- 201107367 When the substrate forming the liquid crystal alignment layer is in the form of a film, it is suitably used as an optically anisotropic film. Further, a liquid crystal display element in which liquid crystal is aligned is obtained by laminating two substrates having the liquid crystal alignment layer formed by the above-described liquid crystal alignment layer in a face-to-face manner, and then injecting liquid crystal between the substrates. Therefore, the photosensitive polyester composition for forming a thermosetting film of the present invention is suitable for use in various optically anisotropic films and liquid crystal display elements. In addition, since the photosensitive polyester composition for forming a thermosetting film of the present invention has at least a required level of planarization, it is preferably used as a protective film for forming various displays such as a thin film transistor (TFT) type liquid crystal display element and an organic EL element. A material for a cured film such as a flattening film or an insulating film is preferably used as a protective film material for a color filter, an interlayer insulating film for a TFT-type liquid crystal device, an insulating film for an organic EL device, or the like. [Embodiment] Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited thereto. [Codes used in the examples] The following are the meanings of the codes used in the examples. <Polyester raw material> BPDA:biphenyltetracarboxylic dianhydride -39- 201107367 HBPDA : 3,3'-4,4'-dicyclohexyltetracarboxylic dianhydride

HBPA:氫化雙酚A ΤΗΡΑ : 1，2,5,6-四氫酞酸酐 B T E A C :苄基三乙基銨氯化物 TPPB ：四苯基鐵溴化物 GMA :縮水甘油基甲基丙烯酸酯 GME :縮水甘油基甲基醚 DTBC :二-tert-丁基甲酚 <聚醯亞胺先驅物及含有胺基之羧酸化合物原料> CBDA :環己烷四羧酸二酐 DA-4P: 1，3 -雙（4 -胺基苯基）苯 DA-1M: 4,4’-雙（4-胺基苯氧基）二苯基颯 TA :偏苯三酸酐 DDS: 4,4’-二胺基二苯基颯 pDA : p-伸苯基二胺 <丙烯酸基共聚物原料> MAA:甲基丙烯酸 MMA :甲基甲基丙烯酸酯 HEM A : 2-羥基乙基甲基丙烯酸酯 CHMI : N-環己基馬來醯亞胺 AIBN :偶氮雙丁腈 -40 - 201107367 <環氧化合物> CEL :泰歇爾化學工業（股）製歇洛吉P-202 1 (製品名）（化合物：3,4-環氧環己烯基甲基-3’，4’-環氧環己烯羧酸酯） <雙馬來醯亞胺化合物> BMI1: N，N’-(3,3-二乙基- 5,5-二甲基）-4,4-二苯基- 甲烷雙馬來醯亞胺 <1，2-醌二疊氮化合物> QD1:藉由1,3,3-三（4-羥基苯基）丁烷 lmol與1，2· 萘醌-2-二疊氮-5-磺醯氯化物 2mol之縮合反應合成的化合物 QD2:藉由α，α，α’-三（4-羥基苯基）-1-乙基-4-異丙基苯 lmol與1，2-萘醌-2-二疊氮-5-磺醯氯化物 2mol之縮合反應合成的化合物。 <溶劑> PGMEA:丙二醇單甲基醚乙酸酯 PGME:丙二醇單甲基醚 DMAc : N，N-二甲基乙醯胺 NMP: N·甲基-2-吡咯烷酮下述合成例所得的聚酯、聚醯亞胺先驅物及丙烯酸基共聚物之數平均分子量及重量平均分子量係使用日本分光 -41 - 201107367 (股）製GPC裝置（Schodex (登記商標）管柱KF8 03 L及 KF8(HL )，以流量lml/分使溶出溶劑四氫呋喃流入管柱中 (管柱溫度4〇°C )進行溶離之條件測定。又，下述數平均分子量（以下稱爲Μη)及重量平均分子量（以下稱爲Mw )係以聚苯乙烯換算値表示。 <合成例1>HBPA: hydrogenated bisphenol A ΤΗΡΑ : 1,2,5,6-tetrahydrophthalic anhydride BTEAC : benzyl triethyl ammonium chloride TPPB : tetraphenyl iron bromide GMA : glycidyl methacrylate GME : shrinkage Glyceryl methyl ether DTBC: di-tert-butyl cresol <polyimine precursor and carboxylic acid compound-containing raw material> CBDA: cyclohexanetetracarboxylic dianhydride DA-4P: 1,3 - Bis(4-aminophenyl)benzene DA-1M: 4,4'-bis(4-aminophenoxy)diphenylsulfonium TA: trimellitic anhydride DDS: 4,4'-diaminodiphenylphosphonium pDA : p-phenylenediamine <acrylic-based copolymer raw material> MAA: methacrylic acid MMA: methyl methacrylate HEM A : 2-hydroxyethyl methacrylate CHMI : N-cyclohexyl horse醯醯 AI AI AI AI AI AI - - - - - - - - - - - - - - - - - 环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧环氧 - - - - - - - - -Epoxycyclohexenylmethyl-3',4'-epoxycyclohexenecarboxylate) <Bismaleimide compound> BMI1: N,N'-(3,3-II Base-5,5-dimethyl)-4,4-diphenyl-methane bismaleimide &lt ; 1,2-quinonediazide compound > QD1: 1 mol of 1,3,3-tris(4-hydroxyphenyl)butane and 1,2·naphthoquinone-2-diazide-5-sulfonate Compound QD2 synthesized by condensation reaction of 2 mol of hydrazine chloride: 1 mol of α,α,α'-tris(4-hydroxyphenyl)-1-ethyl-4-isopropylbenzene and 1,2-naphthoquinone- A compound synthesized by condensation of 2 mol of 2-diazide-5-sulfonyl chloride. <Solvent> PGMEA: propylene glycol monomethyl ether acetate PGME: propylene glycol monomethyl ether DMAc : N,N-dimethylacetamide NMP: N·methyl-2-pyrrolidone obtained by the following synthesis example The number average molecular weight and weight average molecular weight of the polyester, polyimide precursor and acrylic-based copolymer are based on GPC apparatus (Schodex (registered trademark) column KF8 03 L and KF8 manufactured by JASCO Corporation-41 - 201107367 (share). HL), the elution solvent tetrahydrofuran was flowed into the column at a flow rate of 1 ml/min (column temperature: 4 ° C) to determine the conditions for elution. Further, the following number average molecular weight (hereinafter referred to as Μη) and weight average molecular weight (hereinafter) The term "Mw" is expressed in terms of polystyrene 値. <Synthesis Example 1>

120°C 下於 PGMEA 241.96g 中使 HBPDA 40.0g ' BPDA 8.23g、HBP A 49.3g、THP A 5.96g、BTEAC 0.18g、TPPB 0-3 3g反應17小時，得特定聚合物之溶液（固體成份濃度 :30.0質量％ ) ( P1 )。所得的特定聚合物之Μη爲1，500,HBPDA 40.0g 'BPDA 8.23g, HBP A 49.3g, THP A 5.96g, BTEAC 0.18g, TPPB 0-3 3g were reacted in PGMEA 241.96g at 120 ° C for 17 hours to obtain a specific polymer solution (solid content). Concentration: 30.0% by mass) (P1). The specific polymer obtained has a Μ of 1,500.

Mw爲 3,43 0。 <合成例2 > 1 1 〇 °C下於合成例1所得的特定聚合物溶液（P 1 ) 252.00g 中使 GMA 18.42g、DTBC 0.057g、PGME 42.99g 反應9小時，得聚酯溶液（固體成份濃度：30.0質量％ ) ( P2 )。所得的聚酯之Μη爲1,260，Mw爲6,880。 <合成例3 > 1 1 〇 °C下於合成例1所得的特定聚合物溶液（P 1 ) 2 5 2.00g 中使 GME 11.16g、PGME 26.05g 反應 9 小時，得聚酯溶液（固體成份濃度：30.0質量％ ) ( P3 )。所得的聚酯之 Μη爲 1,450，Mw爲 5,340。 -42- 201107367 <合成例4 >Mw is 3,43 0. <Synthesis Example 2 > 1 1 In the specific polymer solution (P 1 ) obtained in Synthesis Example 1, 252.00 g of GMA 18.42 g, DTBC 0.057 g, and PGME 42.99 g were reacted for 9 hours to obtain a polyester solution. (solid content concentration: 30.0% by mass) (P2). The obtained polyester had a Μη of 1,260 and a Mw of 6,880. <Synthesis Example 3 > 1 1 GME 11.16 g and PGME 26.05 g were reacted for 9 hours in a specific polymer solution (P 1 ) 2 5 2.00 g obtained in Synthesis Example 1 to obtain a polyester solution (solid) Ingredient concentration: 30.0% by mass) (P3). The obtained polyester had a Μη of 1,450 and a Mw of 5,340. -42- 201107367 <Synthesis Example 4 >

23°C 下於 PGME 60.15g 中使 DA-1M 15.14g、THPA 1 0.6 4 g反應2 4小時，得含有胺基之羧酸化合物溶液（固體成份濃度30.0質量％ ) ( A1 )。使用高速液體色譜法確認所得的含有胺基之羧酸化合物未殘存ΤΗΡ A。 <合成例5>DA-1M 15.14 g and THPA 1 0.6 4 g were reacted in PGME 60.15 g for 24 hours at 23 ° C to obtain an amine group-containing carboxylic acid compound solution (solid content concentration: 30.0% by mass) (A1). It was confirmed by high-speed liquid chromatography that the obtained amino group-containing carboxylic acid compound did not remain as ΤΗΡA. <Synthesis Example 5>

23°C 下於 PGME 48.71g 中使 DA-4P 10.23g、THPA 10.64g反應24小時，得含有胺基之羧酸化合物溶液（固體成份濃度30.0質量％ ) ( A2 )。使用高速液體色譜法確認所得的含有胺基之羧酸化合物未殘存ΤΗΡA。 <合成例6 > 120°C 下於 PGMEA 175.7g 中使 BPDA 40.0g、HBPA 35.3g、ΤΗΡΑ 3.3 1 g ' BTEAC 0.77g 反應 19 小時，得特定聚合物之溶液（固體成份濃度：3 0.0質量％ )所得的特定聚合物之Μη爲1,1〇〇，Mw爲2,5 8 0。UOt：下於該特定聚合物之溶液 25 2.00g 中使 GMA 18.42g、DTBC 0.057g、PGME 42.99g反應9小時，得聚酯溶液（固體成份濃度：30.0質量 % ) ( P4)。所得的聚酯之Μη爲1，5 80，Mw爲7,540。 <合成例7> 23°C 下於 NMP 66.4g 中使 CBDA 17.7g、pDA 10.2g 反應 -43- 201107367 24小時，得聚醯亞胺先驅物溶液（固體成份濃度30.0質量 % ) ( P5 )。所得的聚醯亞胺先驅物之Mw爲5,8 00，Mw爲 1 2,500 〇 <合成例8 > 所使用的單體成份爲MAA 10.9g、CHMI 35.3g、 HEMA 2 5.5g、MMA 2 8.3g，所使用的自由基聚合引發劑爲 AIBN 5g，溫度6(TC至l〇〇°C下於溶劑PGMEA 150g中使此等聚合反應，得丙烯酸基共聚物溶液（固體成份濃度： 40.0質量％) ( P6 )。所得的丙烯酸基共聚之溶液的Μη爲 3,800，Mw爲 6,700。 <實施例1至5及比較例1至5> 依表1所示組成調製實施例1至5及比較例1至5之各組成物，再評估自該組成物形成之硬化膜的平坦化性、溶劑耐性、配向性、耐熱性、圖型形成性及透過率。 -44 - 201107367 表1 (Α诚份※ 之溶液(S) (Β)成份 (g) (c)成份 (g) (D诚份 (g) (E戚份 (g) 溶劑 (g) 實施例1 Ρ2 20 CEL 1.2 A1 3.0 QD1 2. 1 PGME 14.5 實施例2 Ρ2 20 CEL 1.2 A1 3.0 QD1 2. 1 BMI1 0.3 PGME 1 5.4 實施例3 Ρ2 20 CEL 1.2 A1 3.0 QD2 2. 1 BMI1 0.3 PGME 15.4 實施例4 Ρ3 20 CEL 1.2 A1 3.0 QD1 2. 1 BMI1 0.3 PGME 15.4 實施例5 Ρ2 20 CEL 1.2 A2 3.0 QD1 2. 1 BMI1 0.3 PGME 1 5.4 比較例1 Ρ1 20 CEL 1.2 A1 3.0 QD1 2. 1 一 PGME 14.5 比較例2 Ρ2 20 CEL 1.2 A1 3.0 一 PGME 8,2 比較例3 Ρ4 20 CEL 1.2 A1 3.0 QD1 2. 1 PGME 14.5 比較例4 Ρ5 20 CEL 1.2 QD1 2. 1 一 NMP 1 3.9 比較例5 Ρ6 20 CEL 1.6 QD1 2.4 - PGMEA 24.0 ※卩丨：特定聚合物溶液，P2至P4:聚酯溶液，P5:聚醯亞胺先驅物溶液，P6 :丙烯酸基共聚物溶液〔評估平坦化性〕使用旋塗機將實施例1至實施例5及比較例1至比較例5 之各組成物塗佈於高〇.5μιη、線幅寬1 Ομιη、線間空間50μιη 之段差基板（玻璃製）後，熱板上以1 1 〇°C預烤1 20秒，形成膜厚2.8μπι之塗膜。膜厚係使用FILMETRICS公司製F20 測定。以23 0°C加熱該塗膜30分鐘，形成膜厚2.5μηι之硬化膜。測定段差基板線上及空間上之塗膜的膜厚差（參考圖 !)，利用平坦化率（DOP ) =1〇〇χ〔 1-Γ塗膜之膜厚差（ μηι) /段差基板之高度（〇·5μηι) }〕式求取平坦化率。 -45- 201107367 〔評估圖型形成性〕使用旋塗機將實施例1至實施例5及比較例1至比較例5 之各組成物塗佈於玻璃基板後，熱板上以1 1 〇°C預烤1 20秒，形成膜厚2.8μηι之塗膜。使用FILMETRICS公司製F20測定膜厚。介有具有1 Ομηι之線與空間圖型之圖罩，使用佳能 (股）製紫外線照射裝置PLA-600FA以100mJ/cm2照射量將3 6 5 nm之光強度爲5.5mW/cm2的紫外線照射於該塗膜。其後浸漬於0.2質量％之氫氧化四甲基銨（以下稱爲TMAH )水溶液中60秒，再以超純水流水洗淨20秒。使用光學顯微鏡觀察所得的線與空間圖型，結果可得同圖罩設計之圖型者視爲〇，圖型未解像者及顯像時溶解者視爲X。〔評估溶劑耐性〕使用旋塗機將實施例1至實施例5及比較例1至比較例5 之各組成物塗佈於矽電路板後，熱板上以1 00 °C預烤1 20秒，形成膜厚2.8μηι之塗膜。使用FILMETRICS公司製F20測定膜厚。其後於熱板上以23 0 °C後烤該塗膜30分鐘，形成膜厚2.5μηι之硬化膜。將該硬化膜浸漬於PGMEA或ΝΜΡ中60秒後，各自以 l〇〇°C乾燥60秒，再測定膜厚。PGMEA或ΝΜΡ浸漬後膜厚無變化者視爲〇，浸漬後膜厚會減少者視爲X。〔評估光透過率（透明性）〕 -46- 201107367 使用旋塗機將實施例1至實施例5及比較例1至比較例5 之各組成物塗佈於石英基板後，熱板上以100°C預烤120秒，形成膜厚2·8μηι之塗膜。使用FILMETRICS公司製 F20 測定膜厚。將該塗膜浸漬於0.2質量％之ΤΜΑΗ水溶液中60 秒後，以超純水流水洗淨20秒，其後使用佳能（股）製紫外線照射裝置PLA-600FA以5 00mJ/cm2照射量照射3 65nm之光強度爲5.5 m W/cm2的紫外線。其後於熱板上以23 0 °C後烤該塗膜30分鐘，形成硬化膜。使用紫外線可視分光光度計（島津製作所（股）製 SHIMADSU UV-25 50型號）測定該硬化膜於波長400nm時之透過率。〔評估配向性〕使用旋塗機將實施例1至實施例5及比較例1至比較例5 之各組成物塗佈於ITO基板後，熱板上以l〇〇t：預烤120秒，形成膜厚2.8μηι之塗膜。使用FILMETRICS公司製 F20 測定膜厚。其後於熱板上以230°C後烤該膜30分鐘，形成硬化膜。以回轉速度300rpm、運送速度l〇mm/秒、擠壓量 0.45mm對該硬化膜進行摩擦處理。以純水超音波洗淨摩擦處理後之基板5分鐘。使用旋塗機將液晶單體形成的相位差材料塗佈於該基板後，熱板上以1 00 °C預烤40秒後再以 55 °C預烤30秒，形成膜厚1.1 μιη之塗膜。氮環境下以 2,OOOmJ將該基板曝光。以偏向板挾持所得的基板，再以 -47- 201107367 目視確認配向性。將基板傾斜45度時相對於未傾斜時光的透過性會明顯變化者視爲◦，未變化者視爲X。〔評估耐熱性〕使用旋塗機將實施例1至實施例5及比較例1至比較例5 之各組成物塗佈於石英基板後’熱板上以1 00 °c預烤1 20秒，熱板上再以2 3 0 °C後烤3 0分鐘’形成硬化膜。使用 FILMETRICS公司製 F20測定膜厚。其後於熱板上以23 0°C 焙燒硬化膜6 0分鐘’再測定膜厚’算出後烤後之膜厚變化率。又確認爲具有耐熱性之硬化膜的條件較佳爲’具有至少膜厚變化率未達± 5 %之性能。〔評估結果〕上述評估結果如下述表2所示。表2 平坦化率 (%) 溶劑耐性配向性耐熱性圖型形成透過率 PGMEA NMP 實施例1 81 〇〇〇一 2% 〇 91% 實施例2 83 〇〇〇 -2% 〇 91% 實施例3 83 〇〇〇一 3% 〇 9 0% 實施例4 83 〇〇〇 -2% 〇 91% 實施例5 80 〇〇〇 -1% 〇 8 8% 比較例1 80 〇〇〇 -2% X 9 0% 比較例2 85 〇〇〇 -2% X 9 5% 比較例3 80 〇〇〇 -18% X 8 8% 比較例4 40 〇〇〇 -1% X 6 5% 比較例5 88 〇〇 X -0· 5% 〇 9 3% -48- 201107367 實施例1至實施例5可形成圖型，具有較高平坦化率及耐熱性，相對於P G Μ E A、Ν Μ P均具有耐性。又任何一種均具有良好配向性，高溫焙燒後均可達成較高透過率（透明性）。比較例1爲，未曝光部也會溶解於顯像液無法形成圖型。比較例2爲，曝光部未溶解於顯像液無法形成圖型。比較例3爲，耐熱性較低也無法形成圖型》比較例4爲，平坦化率較低也無法形成圖型。又，比較例5爲，可形成圖型且具有良好的平坦化率、耐熱性、溶劑耐性及透過率，但配向性較差。如上述般，本發明之熱硬化膜形成用感光性聚酯組成物爲’形成硬化膜時可使用丙二醇單甲基醚乙酸酯等二元醇系溶劑。又可以鹼顯像液形成圖型，且所得的硬化膜可得優良的光透過性、溶劑耐性、耐熱性、平坦化性及配向性任何良好性能。〔產業上利用可能性〕本發明之熱硬化膜形成用感光性聚酯組成物非常適合使用爲光學各向異性薄膜及液晶顯示元件之液晶配向層，又適用爲薄膜晶體管（TFT)型液晶顯示元件、有機EL元件等各種顯示器中形成保護膜、平坦化膜、絕緣膜等硬化膜之材料’特別是形成TFT型液晶元件之層間絕緣膜、彩 -49- 201107367 色濾光片之保護膜、有機EL元件之絕緣膜等之材料。【圖式簡單說明】圖1爲，將熱硬化性聚酯組成物塗佈於段差基板時所形成的硬化膜模式圖。圖2爲，使用先前技術之液晶配向層（a )與使用本發明之熱硬化膜形成用感光性聚酯組成物之液晶配向層（b )的對比模式圖。DA23P 10.23 g and THPA 10.64 g were reacted in 48.71 g of PGME at 23 ° C for 24 hours to obtain an amine group-containing carboxylic acid compound solution (solid content concentration: 30.0% by mass) (A2). It was confirmed by high-speed liquid chromatography that the obtained amino group-containing carboxylic acid compound did not remain as ΤΗΡA. <Synthesis Example 6 > 40.0 g of BPDA, 35.3 g of HBPA, and 3.31 g of BTEAC 0.77 g were reacted in PGMEA 175.7 g at 120 ° C for 19 hours to obtain a specific polymer solution (solid content concentration: 3 0.0 Mass %) The specific polymer obtained has a Μη of 1,1〇〇 and a Mw of 2,580. UOt: GMA 18.42 g, DTBC 0.057 g, and PGME 42.99 g were reacted for 9 hours in a solution of the specific polymer 25 2.00 g to obtain a polyester solution (solid content concentration: 30.0% by mass) (P4). The obtained polyester had a Μη of 1,580 and a Mw of 7,540. <Synthesis Example 7> CBDA 17.7 g and pDA 10.2 g were reacted at 43 ° C for 23 hours at 23 ° C to obtain a polyamidene precursor solution (solid content concentration: 30.0% by mass) (P5) . The obtained polybendimimine precursor had Mw of 5,800 and Mw of 1,2,500 Å. Synthesis Example 8 > The monomer components used were MAA 10.9 g, CHMI 35.3 g, HEMA 2 5.5 g, MMA 2 8.3g, the radical polymerization initiator used is AIBN 5g, and the polymerization reaction is carried out in a solvent PGMEA 150g at a temperature of TC to 10 ° C to obtain an acrylic-based copolymer solution (solid content concentration: 40.0 mass) %) (P6) The obtained acrylic-based copolymerized solution had a Tn of 3,800 and a Mw of 6,700. <Examples 1 to 5 and Comparative Examples 1 to 5> Compositions 1 to 5 were prepared according to the composition shown in Table 1 and compared. For each of the compositions of Examples 1 to 5, the planarization property, solvent resistance, alignment property, heat resistance, pattern formation property, and transmittance of the cured film formed from the composition were evaluated. -44 - 201107367 Table 1 (Peace Parts ※ Solution (S) (Β) Ingredients (g) (c) Ingredients (g) (D Cheng (g) (E) (g) Solvent (g) Example 1 Ρ 2 20 CEL 1.2 A1 3.0 QD1 2 1 PGME 14.5 Example 2 Ρ 2 20 CEL 1.2 A1 3.0 QD1 2. 1 BMI1 0.3 PGME 1 5.4 Example 3 Ρ 2 20 CEL 1.2 A1 3.0 QD2 2. 1 BMI1 0.3 PGME 15.4 Example 4 Ρ 3 20 CEL 1. 2 A1 3.0 QD1 2. 1 BMI1 0.3 PGME 15.4 Example 5 Ρ2 20 CEL 1.2 A2 3.0 QD1 2. 1 BMI1 0.3 PGME 1 5.4 Comparative Example 1 Ρ1 20 CEL 1.2 A1 3.0 QD1 2. 1 PGME 14.5 Comparative Example 2 Ρ2 20 CEL 1.2 A1 3.0-PGME 8,2 Comparative Example 3 Ρ4 20 CEL 1.2 A1 3.0 QD1 2. 1 PGME 14.5 Comparative Example 4 Ρ5 20 CEL 1.2 QD1 2. 1 One NMP 1 3.9 Comparative Example 5 Ρ6 20 CEL 1.6 QD1 2.4 - PGMEA 24.0 ※卩丨: specific polymer solution, P2 to P4: polyester solution, P5: polyimide precursor solution, P6: acrylic-based copolymer solution [evaluation of planarization] Example 1 was applied using a spin coater Each of the compositions of Example 5 and Comparative Example 1 to Comparative Example 5 was applied to a stepped substrate (made of glass) of 〇5. ηη, a line width of 1 Ομηη, and an interline space of 50 μm, and the hot plate was 1 1 〇°. C pre-bake for 1 20 seconds to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The coating film was heated at 23 ° C for 30 minutes to form a cured film having a film thickness of 2.5 μm. Measure the film thickness difference of the coating film on the stepped substrate line and space (refer to Fig.!), and use the flattening ratio (DOP) = 1 〇〇χ [1-膜 coating film thickness difference (μηι) / step height of the substrate (〇·5μηι) }〕 Equation to obtain the flattening rate. -45-201107367 [Evaluation of Pattern Formability] Each of the compositions of Examples 1 to 5 and Comparative Examples 1 to 5 was applied to a glass substrate using a spin coater, and then 1 1 〇° on a hot plate. C pre-bake for 1 20 seconds to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. A mask having a line and space pattern of 1 Ομηι is used, and ultraviolet light having a light intensity of 5.5 mW/cm 2 of 365 nm is irradiated with a laser irradiation apparatus PLA-600FA manufactured by Canon (s). The coating film. Thereafter, it was immersed in an aqueous solution of 0.2% by mass of tetramethylammonium hydroxide (hereinafter referred to as TMAH) for 60 seconds, and then washed with ultrapure water for 20 seconds. The resulting line and space pattern is observed using an optical microscope, and the result can be regarded as 〇 for the pattern of the mask design, and X for the pattern unresolved and the solvant for the image. [Evaluation of Solvent Resistance] Each of the compositions of Examples 1 to 5 and Comparative Examples 1 to 5 was applied to a ruthenium circuit board using a spin coater, and then pre-baked at 100 ° C for 1 20 seconds on a hot plate. A coating film having a film thickness of 2.8 μm was formed. The film thickness was measured using F20 manufactured by FILMETRICS. Thereafter, the coating film was baked at 23 ° C for 30 minutes on a hot plate to form a cured film having a film thickness of 2.5 μm. The cured film was immersed in PGMEA or mash for 60 seconds, and then dried at 100 ° C for 60 seconds, and the film thickness was measured. PGMEA or bismuth film thickness after immersion is regarded as 〇, and the film thickness after immersion is reduced as X. [Evaluation of Light Transmittance (Transparency)] -46-201107367 Each of the compositions of Examples 1 to 5 and Comparative Examples 1 to 5 was applied to a quartz substrate using a spin coater, and then 100 on a hot plate. Pre-bake at °C for 120 seconds to form a coating film having a film thickness of 2·8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The coating film was immersed in a 0.2% by mass aqueous solution of ruthenium for 60 seconds, and then washed with ultrapure water for 20 seconds, and then irradiated with an ultraviolet irradiation apparatus PLA-600FA manufactured by Canon Co., Ltd. at an irradiation dose of 500 mJ/cm 2 . The light intensity at 65 nm is ultraviolet light of 5.5 mW/cm2. Thereafter, the coating film was baked at 23 ° C for 30 minutes on a hot plate to form a cured film. The transmittance of the cured film at a wavelength of 400 nm was measured using an ultraviolet visible spectrophotometer (SHIMADSU UV-25 50 model manufactured by Shimadzu Corporation). [Evaluation of Orientation] Each of the compositions of Examples 1 to 5 and Comparative Examples 1 to 5 was applied onto an ITO substrate by a spin coater, and then pre-baked for 120 seconds on a hot plate at 10 μt. A coating film having a film thickness of 2.8 μm was formed. The film thickness was measured using F20 manufactured by FILMETRICS. Thereafter, the film was baked at 230 ° C for 30 minutes on a hot plate to form a cured film. The cured film was subjected to a rubbing treatment at a rotational speed of 300 rpm, a transport speed of 10 mm/sec, and an extrusion amount of 0.45 mm. The substrate after the rubbing treatment was washed with pure water ultrasonic for 5 minutes. The phase difference material formed by the liquid crystal monomer was applied to the substrate by a spin coater, and then prebaked at 100 ° C for 40 seconds on a hot plate, and then prebaked at 55 ° C for 30 seconds to form a coating having a film thickness of 1.1 μm. membrane. The substrate was exposed at 2,000 mJ in a nitrogen atmosphere. The obtained substrate was held by a deflecting plate, and the alignment was visually confirmed by -47 to 201107367. When the substrate is tilted by 45 degrees, the transmittance with respect to the untilted light is significantly changed, and the unchanged person is regarded as X. [Evaluation of heat resistance] Each of the compositions of Examples 1 to 5 and Comparative Examples 1 to 5 was applied to a quartz substrate using a spin coater, and then prebaked at 100 ° C for 1 20 seconds on a hot plate. The hot plate was baked at 2 30 ° C for 30 minutes to form a cured film. The film thickness was measured using F20 manufactured by FILMETRICS. Thereafter, the cured film was fired at 230 ° C for 60 minutes on the hot plate to measure the film thickness again, and the film thickness change rate after baking was calculated. Further, it is preferable that the condition of the cured film having heat resistance is 'having a performance of at least a film thickness change rate of less than ± 5%. [Evaluation Results] The above evaluation results are shown in Table 2 below. Table 2 Flattening Rate (%) Solvent Resistance Alignment Heat Resistance Pattern Formation Transmittance PGMEA NMP Example 1 81 2% 〇 91% Example 2 83 〇〇〇-2% 〇91% Example 3 83 〇〇〇 3% 〇 9 0% Example 4 83 〇〇〇-2% 〇91% Example 5 80 〇〇〇-1% 〇8 8% Comparative Example 1 80 〇〇〇-2% X 9 0% Comparative Example 2 85 〇〇〇-2% X 9 5% Comparative Example 3 80 〇〇〇-18% X 8 8% Comparative Example 4 40 〇〇〇-1% X 6 5% Comparative Example 5 88 〇〇 X -0· 5% 〇9 3% -48- 201107367 Examples 1 to 5 can be formed into a pattern, have a high flatness and heat resistance, and are resistant to PG EA EA and Ν Μ P. Any one of them has a good alignment property, and a high transmittance (transparency) can be achieved after high-temperature baking. In Comparative Example 1, the unexposed portion was also dissolved in the developing liquid and the pattern could not be formed. In Comparative Example 2, the exposed portion was not dissolved in the developing liquid, and the pattern could not be formed. In Comparative Example 3, the heat resistance was low and the pattern could not be formed. In Comparative Example 4, the flatness was low and the pattern could not be formed. Further, in Comparative Example 5, it was possible to form a pattern and have a good flatness, heat resistance, solvent resistance and transmittance, but the alignment was inferior. As described above, the photosensitive polyester composition for forming a thermosetting film of the present invention may be a glycol-based solvent such as propylene glycol monomethyl ether acetate when the cured film is formed. Further, the alkali developing solution can be formed into a pattern, and the obtained cured film can have excellent light transmittance, solvent resistance, heat resistance, flatness, and alignment properties. [Industrial Applicability] The photosensitive polyester composition for forming a thermosetting film of the present invention is suitably used as an optically anisotropic film and a liquid crystal alignment layer of a liquid crystal display element, and is also suitable for a thin film transistor (TFT) type liquid crystal display. A material for forming a cured film such as a protective film, a planarizing film, or an insulating film in various displays such as a device and an organic EL device, in particular, an interlayer insulating film for forming a TFT-type liquid crystal device, a protective film for a color filter of 49-201107367 color filter, A material such as an insulating film of an organic EL element. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a cured film formed by applying a thermosetting polyester composition to a step substrate. Fig. 2 is a schematic view showing a comparison between a liquid crystal alignment layer (a) of the prior art and a liquid crystal alignment layer (b) using the photosensitive polyester composition for forming a thermosetting film of the present invention.

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Claims

201107367 七、申請專利範圍： 1 . 一種熱硬化膜形成用感光性聚酯組成物，其特徵爲含有（A)成份、（B)成份、（C)成份及（D)成份 (A) 成份：含有下述式（1)所表示的構造單位之聚酯，與具有縮水甘油基及異氰酸酯基中選出的官能基之化合物反應而得的被修飾之聚酯 (B) 成份：具有2個以上環氧基之環氧化合物 (C )成份：二胺化合物與二羧酸二酐反應而得的含有胺基之羧酸化合物 (D )成份：1,2-苯醌二疊氮化合物【化1】 / HOOC COOH \ -T—Ο—C—A—C—Ο—B—4- (1 ) \ 〇〇 ) (式中’ A爲脂環式骨架或於脂肪族骨架鍵結4個鍵結鍵之4價有機基，B爲脂環式骨架或於脂肪族骨架鍵結2個鍵結鍵之2價有機基）。 2 ·如申請專利範圍第1項之熱硬化膜形成用感光性聚酯組成物’其中前述含有式（1)所表示的構造單位之聚酯爲’使含有下述式（i)所表示的四羧酸二酐之四羧酸二酐成份’與含有下述式（π )所表示的二醇化合物之二醇成份反應而得的聚醋， -51 - 201107367 【化2】201107367 VII. Patent application scope: 1. A photosensitive polyester composition for forming a thermosetting film, which comprises (A) component, (B) component, (C) component and (D) component (A) component: A modified polyester (B) comprising a polyester having a structural unit represented by the following formula (1) and a compound having a functional group selected from a glycidyl group and an isocyanate group: having two or more rings Oxygen-containing epoxy compound (C) component: an amine group-containing carboxylic acid compound (D) obtained by reacting a diamine compound with a dicarboxylic acid dianhydride: 1,2-benzoquinonediazide compound [Chemical 1] / HOOC COOH \ -T—Ο—C—A—C—Ο—B—4- (1 ) \ 〇〇) (wherein A is an alicyclic skeleton or four bond bonds in an aliphatic backbone bond) The tetravalent organic group, B is an alicyclic skeleton or a divalent organic group in which two bonding bonds are bonded to the aliphatic skeleton). (2) The photosensitive polyester composition for forming a thermosetting film according to the first aspect of the invention, wherein the polyester containing the structural unit represented by the formula (1) is 'having a formula represented by the following formula (i) Polyester obtained by reacting a tetracarboxylic dianhydride component of tetracarboxylic dianhydride with a diol component containing a diol compound represented by the following formula (π), -51 - 201107367 [Chem. 2]

{式（i)及（ii)中，A及B同前述式（1)之定義}° 3.如申請專利範圍第1或2項之熱硬化膜形成用感光性聚酯組成物，其中前述式（1)中，A爲下述式（A-1) 至（A-8)所表示之基中選出的至少一種基’ B爲下述式（ B-1)至（B-5)所表示之基中選出的至少一種基，【化3】 XX w (A-1 ) (Α-2) (Α-3) (A·4) (A-δ) (Α-6)In the formula (i) and (ii), A and B are the same as the above formula (1). The photosensitive polyester composition for forming a thermosetting film according to claim 1 or 2, wherein the aforementioned In the formula (1), A is at least one selected from the group represented by the following formulas (A-1) to (A-8), and B is a group of the following formulas (B-1) to (B-5). At least one group selected from the group, [Chemical 3] XX w (A-1 ) (Α-2) (Α-3) (A·4) (A-δ) (Α-6)

【化4】【化4】

4.如申請專利範圍第1至3項中任何一項之熱硬化膜形成用感光性聚酯組成物，其中前述（Α )成份之被修飾 -52- 201107367 的聚酯爲，具有聚苯乙烯換算下1，000至30,000之重量平均分子量。 5 ·如申請專利範圍第1至4項中任何一項之熱硬化膜形成用感光性聚酯組成物，其中前述（C )成份爲，二胺化合物1莫耳與二羧酸二酐1.7至2莫耳反應而得的含有胺基之羧酸化合物。 6. 如申請專利範圍第1至5項中任何一項之熱硬化膜形成用感光性聚酯組成物，其中基於前述（A)成份100質量份，各自含有3至50質量份之前述（B)成份、3至5〇質量份之前述（C)成份、5至80質量份之前述（D)成份。 7. 如申請專利範圍第〗至5項中任何一項之熱硬化膜形成用感光性聚酯組成物，其中另含有（E )成份用之雙馬來醯亞胺化合物。 8. 如申請專利範圍第6項之熱硬化膜形成用感光性聚酯組成物，其中基於前述（A )成份1〇〇質量份，含有0.5 至5 0質量份之如申請專利範圍第7項之（E )成份。 9 · 一種硬化膜，其特徵爲自如申請專利範圍第1至8 項中任何一項之熱硬化膜形成用感光性聚酯組成物形成。 10· —種液晶配向層，其特徵爲使用如申請專利範圍第1至8項中任何一項之熱硬化膜形成用感光性聚酯組成物而得。 -53-4. The photosensitive polyester composition for forming a thermosetting film according to any one of claims 1 to 3, wherein the polyester of the aforementioned (Α) component is modified to have a polystyrene of -52 to 201107367 The weight average molecular weight of 1,000 to 30,000 is converted. The photosensitive polyester composition for forming a thermosetting film according to any one of claims 1 to 4, wherein the component (C) is a diamine compound 1 molar and a dicarboxylic acid dianhydride 1.7 to An amine group-containing carboxylic acid compound obtained by a molar reaction. 6. The photosensitive polyester composition for forming a thermosetting film according to any one of the above-mentioned items (1), wherein each of the above-mentioned (A) components contains 3 to 50 parts by mass each of the above (B) The component, 3 to 5 parts by mass of the aforementioned (C) component, and 5 to 80 parts by mass of the aforementioned (D) component. 7. The photosensitive polyester composition for forming a thermosetting film according to any one of claims 1-5 to 5, which further comprises a bismaleimide compound for the component (E). 8. The photosensitive polyester composition for forming a thermosetting film according to item 6 of the patent application, wherein the content of the above-mentioned (A) component is from 0.5 to 50 parts by mass, as in the seventh item of the patent application scope. (E) component. A cured film which is formed by a photosensitive polyester composition for forming a thermosetting film according to any one of claims 1 to 8. A liquid crystal alignment layer which is obtained by using a photosensitive polyester composition for forming a thermosetting film according to any one of claims 1 to 8. -53-