TW201044519A - Sealing device of substrate surface and manufacturing method of organic el panel - Google Patents

Sealing device of substrate surface and manufacturing method of organic el panel Download PDF

Info

Publication number
TW201044519A
TW201044519A TW099103011A TW99103011A TW201044519A TW 201044519 A TW201044519 A TW 201044519A TW 099103011 A TW099103011 A TW 099103011A TW 99103011 A TW99103011 A TW 99103011A TW 201044519 A TW201044519 A TW 201044519A
Authority
TW
Taiwan
Prior art keywords
substrate
film
chamber
sealing material
sheet
Prior art date
Application number
TW099103011A
Other languages
Chinese (zh)
Other versions
TWI421985B (en
Inventor
Tatsuto Kunihiro
Kazuo Takahashi
Yoshifumi Ohta
Original Assignee
Hitachi Plant Technologies Ltd
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd, Sharp Kk filed Critical Hitachi Plant Technologies Ltd
Publication of TW201044519A publication Critical patent/TW201044519A/en
Application granted granted Critical
Publication of TWI421985B publication Critical patent/TWI421985B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/03—After-treatments in the joint area
    • B29C66/034—Thermal after-treatments
    • B29C66/0342—Cooling, e.g. transporting through welding and cooling zone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/746—Joining plastics material to non-plastics material to inorganic materials not provided for in groups B29C66/742 - B29C66/744
    • B29C66/7465—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/843—Machines for making separate joints at the same time in different planes; Machines for making separate joints at the same time mounted in parallel or in series
    • B29C66/8432—Machines for making separate joints at the same time mounted in parallel or in series
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/62—Inert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

To enable to realize lamination in which improvement of tact time is achieved and deterioration of performance of a product is prevented by saving labor of operation. As for a film 13 from film rolls 24a to 24d (Fig.6 (not illustrated)) of a film unwinding mechanism part 14, its cover film 13a (Fig.4 (not illustrated)) is peeled off by a cover film winding mechanism part 15, and sent to an inter-substrate processing mechanism part 16. In the inter-substrate processing mechanism part 16, by a half-cut member 34 and a peel-off tape 36 (Fig.7 (not illustrated)), as expressed in Fig.9 (not illustrated), a sealing material film 5' (Fig.4 (not illustrated)) of the film 13 is peeled off by a prescribed length at a prescribed spacing, and the sheet-like sealing member 5 (Fig.3 (not illustrated)) is formed. The film 13 processed like this is sent to a lamination mechanism part 19, the sheet-like sealing member 5 is heated and crimped to the substrate 1 from a front room 10 and cooled by a substrate cooling mechanism part 30, and a base film 13b (Fig.4 (not illustrated)) of the film 13 is peeled off by a base film winding mechanism part 21.

Description

201044519 六、發明說明： 【發明所屬之技術領域】 本發明係關於有機EL( Electro Luminescence:電致 發光）面板之製造，特別是關於被塗布（被設置）有機EL 元件的基板貼附片（sheet)狀密封材而密封的基板表面之 密封裝置與有機EL面板之製造方法。 Q 【先前技術】 有機EL面板，係於被貼合的2枚基板間複數之有機EL 元件被排列爲縱橫之構成，但於製造相關之有機EL面板時 ，從前係分別以密封材密封這些有機EL元件。 作爲這樣的有機EL面板之製造方法之一從前例，係將 有機EL元件由其上下方向以水濕透過率很小的有機膜挾住 ，由這些有機膜之從有機EL元件的上下面伸出的部分，藉 由進行熱壓接而一體化，以相關的有機膜密封此有機EL元 〇 件，使相關的有機EL元件使用於有機EL面板者（例如參 照專利文獻1 )。 此外，雖非關於有機EL面板的製造，但在處理室內之 真空環境下層積（貼附）膜之技術也被提出（例如，參照 專利文獻2 )。 記載於此專利文獻2的技術，係於基底膜層積光阻膜 者，由被設置於處理室的外側之供給輥往處理室內送入基 底膜，此外，光阻膜也由被設置於處理室的外側之供給輥 . 送入處理室內，於此基底膜上光阻膜藉由加壓輥加熱、加 -5- 201044519 壓而被貼合。此處，貼合於基底膜的光阻膜，由被設置可 自由開閉的快門（shut er )之導入口被導入處理室內。 [先前技術文獻] [專利文獻] [專利文獻1 ]日本專利特開平2 - 1 9 7 0 7 5號公報 [專利文獻2 ]日本專利特開2 0 0 2 - 5 2 6 1 0號公報 【發明內容】 [發明所欲解決之課題] 然而，前述專利文獻1所記載之技術，係於各有機EL 元件，以覆蓋此全體的方式，進行層積者，因爲是如此般 以1層1層有機膜做成層積的有機EL元件，是使用於有機 EL元件的作成者，所以會是耗費手續的作業，相關的層積 加工是在大氣中進行的緣故，會受到周圍環境的影響，會 因混入粉塵，或受到濕氣等的影響，而有導致EL元件之特 性劣化之虞。 對此，在記載於前述專利文獻2的技術，在處理室內 之真空環境下進行層積加工，所以與在大氣中進行層積加 工的場合相比’可以抑制層積時之膜的皴紋的產生，或膜 (亦即，光阻膜）及與其貼合者（亦即基底膜）之間之氣 泡的產生，但這些基底膜或光阻膜是由外部連續導入處理 室內者，所以空氣會由這些之導入口漏入處理室內，導致 在處理室內之真空度降低，另外與此空氣洩漏同時還有濕 -6- 201044519 氣或粉塵等也進入處理室內而使被貼合光阻膜的製品的性 能劣化的問題。 此外，在前述專利文獻2所記載之技術，光阻膜之導 入口設有可自由開閉的快門（shutter )，藉由調整其開閉 狀態，可以極力減低往處理室內之空氣洩漏，但是藉此使 快門成爲接觸於光阻膜的狀態的話，會傷及此光阻膜，對 被層積加工的製品的特性造成不良影響。 〇 本發明之目的在於解消相關的問題，提供可謀求節省 作業的手續提高生產節拍，可以實現防止製品的性能劣化 之層積加工的基板表面之密封裝置與有機EL面板之製造方 法。 [供解決課題之手段] 爲達成前述第1目的，本發明之基板表面之密封裝置 ，特徵爲具備：內藏將薄片狀密封材貼附於基板上的膜貼 Q 合裝置之容積大的處理室、供對處理室搬入該基板之用的 比處理室容積更小的前室、及以膜貼合裝置使薄片狀密封 材被貼附的基板由該處理室內排出之比處理室容積更小的 後室；在前室之基板搬入口側與處理室側、及後室之處理 室側與基板排出口側分別設置閘閥，同時處理室內，包含 基板被搬入、排出時，總是被保持於高真空狀態，膜貼合 裝置，係由：使由前室搬入的基板以特定的間隔搬送的基 ^ 板搬送手段、挾著薄片狀密封材使被設置覆蓋膜與基底膜 . 的特定寬幅的膜捲出複數條之膜捲出機構部、由從膜捲出 201044519 機構部捲出的複數條之分別的膜剝離覆蓋膜而捲 膜捲取機構部、由從以覆蓋膜捲取機構部剝取覆 複數條之各個膜，剝取以基板搬送手段搬送的基 間隔的密封狀密封材之部分，複數條之各個膜之 上形成對應於分別之基板的複數之密封狀密封材 處理機構部、於藉由基板搬送手段由前室搬入的 進行決定基板之先端部與來自基板間處理機構部 應於基板的密封狀密封材的先端的定位之對準機 以基板搬送手段搬送的基板，貼附來自對準機構 條膜之對應於基板的複數之密封狀密封材之貼附 及由來自貼附機構部之基板被貼附薄片狀密封材 之各個膜剝除、捲取基底膜之基底膜捲取機構部 基板搬送手段，以基底膜捲取機構部把複數條膜 被剝取的複數薄片狀密封材被貼附的狀態之基板 室。 此外，本發明之基板表面之密封裝置，特徵 與後室，具有使室內由乾空氣狀態成爲與前述處 等的高真空狀態之用的真空泵。 進而，本發明之基板表面之密封裝置，特徵 理機構部，係由搭載複數膜之表面被處理爲非黏 、使複數膜在其長度方向之特定的間隔被按壓於 之一對按壓板、使以複數之膜之該一對按壓板按 表面的部分之間之前述薄片狀密封材，在其長度 前述基板之間隔進行切割之半切用圓刃、及複數 取的覆蓋 蓋膜後的 板之成爲 在基底膜 之基板間 各基板， 之膜的對 構部，於 部的複數 機構部， 的複數條 所構成， 之基底膜 排出至後 係於前室 理室內相 係基板處 接性之桌 桌的表面 壓於桌的 方向上以 之膜之以 -8- 201044519 該半切用圓刃切割的部分之前述薄片狀密封材由前述基底 膜剝離之膠帶剝離機構所構成。 進而，本發明之基板表面之密封裝置，特徵爲於貼附 機構部與前述基底膜捲取機構部之間，設有冷卻前述基板 之基板冷卻機構部。 爲了達成前述目的，根據本發明之有機電致發光（EL )面板之製造方法，特徵係由以下步驟所構成：打開被設 Q 於容積小的前室的基板搬入口之第1閘閥，把密封劑被塗 布爲框狀而於密封劑之框之內側設有複數之EL (電致發光 )元件之基板，搬入前室內之搬入步驟、基板由基板搬入 口搬入至前室，同時關閉第1閘閥，使前室內成爲高真空 _ 狀態之真空化步驟、打開設於成爲高真空狀態的前室與被 保持於高真空狀態之容積大的處理室之間的第2閘閥，由 前室將基板搬送至處理室內，在基板之往處理室搬送後， 關閉弟2聞閥的搬送步驟、在處理室內，對基板之密封劑 〇 之框內貼附薄片狀密封材之密封材貼附步驟、使容積小的 後室內成爲高真空狀態，打開設於處理室與後室之間的第 3閘閥，使被貼附薄片狀密封材的基板由處理室搬送至後 室的搬送步驟、關閉被設於後室的基板排出口之第3閘閥 ’打開第4閘閥使後室內爲大氣狀態，將後室內之被貼附 薄片狀密封材之基板由基板排出口排出之排出步驟；密封 材貼附步驟係由以下步驟所構成：使由前室搬入的基板以 . 特定的間隔依序搬送的步驟、捲出複數條夾著薄片狀密封 • 材被設置覆蓋膜與基底膜的特定寬幅的膜之步驟、由被捲 -9 - 201044519 出的複數條之膜分別剝離捲取覆蓋膜之步驟、由被剝取覆 蓋膜的複數條膜之各個，剝取成爲被搬送的基板之間隔的 密封狀密封材的部分，在複數條膜之各個之基底膜上形成 分別對應於基板之複數之密封狀密封材之步驟、於由前室 搬入的各基板，進行基板之先端部與膜之對應於基板的密 封狀密封材的先端之位置對準之步驟、於被搬送之基板貼 附複數條之膜之對應於基板之複數密封狀密封材的步驟、 冷卻被貼附複數之密封狀密封材的基板之步驟、由被冷卻 之基板上被貼附薄片狀密封材的複數條膜之各個剝取捲取 基底膜之步驟。 [發明之效果] 根據本發明的話，因爲係使特定寬幅之薄片狀密封材 在減壓（真空）或非活性氣體之氛圍內同時搬送而貼合於 元件玻璃基板者，所以可以防止粉塵的附著或氣泡、皺紋 等的產生，可以藉由膜捲出機構部、覆蓋膜捲取機構部、 基底膜捲取機構部使膜的張力保持一定，可以提高薄片狀 密封材之對元件玻璃基板之貼附精度或薄片狀密封材被貼 附的元件玻璃基板的品質。 此外，在處理室之基板的搬出搬入，係在比此處理室 容積更小的前室或後室進行減壓與大氣壓之變更，所以可 使容積大的處理室內總是保持減壓或者爲非活性氣體的氛 圍狀態，可縮短氛圍狀態的變更所需要的時間，可謀求生 產節拍的提高。 -10- 201044519 【實施方式】 以下，使用圖面說明本發明之實施型態。 圖2係藉由本發明製造之有機EL面板之一具體例之槪 略構成圖，該圖（a)係分解圖，該圖（b)爲擴大顯示該 圖（a)之部分A的平面圖，該圖（c)係該圖（b)之切割 線B-B之總剖面圖，1爲元件玻璃基板、2爲密封玻璃基板 0 、3爲密封劑、4爲有機EL元件、5爲薄片狀密封材。 於圖2 ( a )，於元件玻璃基板1，於其表面沿著其周 邊部有密封劑3 (圖2 ( b ))被形成爲框狀，於此密封劑3 之框的內側之區域複數之有機EL元件4被縱橫排列，且這 些有機EL元件藉由薄片狀密封材5密封。於相關的元件玻 璃基板1，由被設該密封劑3之側起被重疊密封玻璃基板， 被加壓而藉由此密封劑3貼合，而形成有機EL面板。 於圖2(b) 、( c)，有機EL元件4，雖未圖示，但係 G 分別於有機發光層之上下面之一方之面設有陽極（anode )，於另一方之面設有陰極（cathode)之構成，這些陽極 、陰極被連接於設在元件玻璃基板1的表面之訊號線等， 在被設於相關的訊號線等之上的未圖示之絕緣膜上被設有 有機EL元件4。有機EL元件4爲被動型之有機EL元件時， 於元件玻璃基板1之表面被鋪設有縱橫向之掃描線與訊號 線，此有機EL元件4之陽極連接於掃描線，陰極連接於訊 號線。此外，有機EL元件4爲主動矩陣型之有機EL元件時 . ，元件玻璃基板1的表面被縱橫向鋪設掃描線與訊號線， -11 - 201044519 這些掃描線與訊號線之交叉部被設有TFT ( Thin Film Transistor :薄膜電晶體）等之主動元件，TFT之閘極電極 、源極電極分別被連接於掃描線、訊號線，其汲極電極上 被連接著有機EL元件4的陽極。 薄片狀密封材5係由環氧樹脂等熱硬化型之樹脂所構 成者，除了有機EL元件4之陽極或陰極之電極取出線之端 子部以外，係以覆蓋有機EL元件4的方式被貼附而使硬化 。在密封玻璃基板5密接於此被硬化的薄片狀密封材5的狀 態下，藉由密封劑3，被貼合於元件玻璃基板1。 又，作爲構成薄片狀密封材5的樹脂，沒有特別限定 ，只要是環氧樹脂等熱塑性且熱硬化性之樹脂（加熱的話 ’軟化而變成可以加工，但繼續加熱下去的話，會引起化 學反應而硬化的樹脂）的話，不問其樹脂的種類。此外， 於薄片狀密封材5賦予乾燥劑等其他功能亦可。201044519 VI. Description of the Invention: [Technical Field] The present invention relates to the manufacture of an organic EL (Electro Luminescence) panel, and more particularly to a substrate attach sheet (sheet) to which an organic EL element is coated (provided) A sealing device for a substrate surface sealed with a sealing material and a method for producing an organic EL panel. Q [Prior Art] In the organic EL panel, the organic EL elements are arranged in a vertical and horizontal direction between the two substrates to be bonded. However, when manufacturing the related organic EL panels, the organic materials are sealed with a sealing material. EL component. As one of the methods for producing such an organic EL panel, the organic EL element is sandwiched by an organic film having a small water-humidity transmittance in the vertical direction, and the organic film protrudes from the upper and lower surfaces of the organic EL element. In the case of the organic EL element, the organic EL element is sealed by the relevant organic film, and the related organic EL element is used for the organic EL panel (see, for example, Patent Document 1). In addition, a technique of laminating (attaching) a film in a vacuum environment in a processing chamber is also proposed (see, for example, Patent Document 2). According to the technique of Patent Document 2, in the case where the base film is laminated with the photoresist film, the base film is fed into the processing chamber by the supply roller provided outside the processing chamber, and the photoresist film is also disposed in the processing. The supply roller on the outer side of the chamber is fed into the processing chamber, and the photoresist film on the base film is heated by a pressure roller and pressed at a pressure of -5 to 201044519. Here, the photoresist film bonded to the base film is introduced into the processing chamber through an inlet opening of a shutter that is freely opened and closed. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Laid-Open No. Hei 2 - 1 9 7 0 7 5 [Patent Document 2] Japanese Patent Laid-Open No. 2 0 0 2 - 5 2 6 1 0 [ DISCLOSURE OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The technique described in the above-mentioned Patent Document 1 is to laminate the entire organic EL element so as to cover the entire layer. The organic EL device in which the organic film is laminated is used as a developer of the organic EL device, and therefore it is a labor-intensive operation, and the related layering process is performed in the atmosphere, and is affected by the surrounding environment. There is a problem that the characteristics of the EL element are deteriorated due to the incorporation of dust or the influence of moisture or the like. On the other hand, in the technique described in the above-mentioned Patent Document 2, since the lamination processing is performed in a vacuum environment in the processing chamber, it is possible to suppress the crepe of the film at the time of lamination as compared with the case where the lamination processing is performed in the air. Producing, or creating a bubble between the film (ie, the photoresist film) and the person it is attached to (ie, the base film), but these base film or photoresist film is continuously introduced into the processing chamber from the outside, so the air will When the introduction port leaks into the processing chamber, the degree of vacuum in the processing chamber is lowered, and at the same time as the air leakage, wet -6-201044519 gas or dust enters the processing chamber to bond the photoresist film. The problem of performance degradation. Further, in the technique described in Patent Document 2, the inlet of the photoresist film is provided with a shutter that can be opened and closed freely, and by adjusting the opening and closing state, air leakage into the processing chamber can be minimized, but When the shutter comes into contact with the photoresist film, the photoresist film is damaged and adversely affects the characteristics of the product to be laminated. 〇 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Means for Solving the Problem] In order to achieve the above-described first object, the sealing device for a substrate surface of the present invention is characterized in that it has a large volume of a film-bonding Q-bonding device in which a sheet-like sealing material is attached to a substrate. The chamber, the front chamber having a smaller volume than the processing chamber for loading the processing chamber into the substrate, and the substrate to which the sheet-like sealing material is attached by the film bonding device are discharged from the processing chamber by a smaller volume than the processing chamber a rear chamber; a gate valve is provided on each of the substrate carrying inlet side and the processing chamber side of the front chamber, and the processing chamber side of the rear chamber and the substrate discharge port side, and is always held in the processing chamber, including when the substrate is carried in and discharged; In the high vacuum state, the film bonding apparatus is a substrate transporting means for transporting the substrate carried by the front chamber at a specific interval, and a specific width of the cover film and the base film by the sheet-like sealing material. The film is wound out of a plurality of film unwinding mechanism portions, and a plurality of film peeling cover films which are wound out from the film unwinding 201044519 mechanism portion, and a film take-up mechanism portion and a take-up film take-up mechanism portion Stripping Each of the plurality of films is stripped of a portion of the seal-like sealing material of the base space conveyed by the substrate transfer means, and a plurality of seal-like sealing material processing mechanisms corresponding to the respective substrates are formed on each of the plurality of films, and The substrate transported by the substrate transfer means is carried out by the substrate transfer means in the alignment machine for determining the position of the leading end of the substrate and the positioning of the sealing member of the substrate between the substrate processing means. Attachment of a plurality of seal-like sealing materials corresponding to a substrate of a quasi-mechanism strip film, and a base film take-up mechanism for stripping and winding a base film of each film by which a substrate from the attaching mechanism portion is attached with a sheet-like sealing material In the substrate transfer means, the substrate chamber in a state in which the plurality of sheet-like sealing materials from which the plurality of strips are peeled off is attached by the base film take-up mechanism portion. Further, the sealing device for the surface of the substrate of the present invention has a feature and a rear chamber, and has a vacuum pump for bringing a room from a dry air state to a high vacuum state as described above. Further, in the sealing device for a surface of the substrate of the present invention, the surface of the plurality of films is treated to be non-adhesive, and the plurality of films are pressed against the pressing plate at a specific interval in the longitudinal direction thereof. In the plurality of pressing plates, the sheet-like sealing material between the portions of the pressing surface is cut by a half-cutting edge edge which is cut at intervals of the substrate, and a plurality of sheets which cover the cover film are formed Each of the substrates between the substrates of the base film, the opposite portion of the film, and the plurality of mechanism portions of the portion are formed, and the base film is discharged to the table of the front chamber of the front chamber. The surface is pressed against the table to form a film of -8-201044519. The half-cut portion of the sheet-like sealing material cut by the round blade is composed of the above-mentioned base film peeling tape peeling mechanism. Further, in the sealing device for a substrate surface of the present invention, a substrate cooling mechanism portion for cooling the substrate is provided between the attaching mechanism portion and the base film take-up mechanism portion. In order to achieve the above object, a method for producing an organic electroluminescence (EL) panel according to the present invention comprises the steps of: opening a first gate valve of a substrate carrying inlet provided with a Q having a small volume, and sealing The agent is applied in a frame shape, and a substrate of a plurality of EL (electroluminescence) elements is provided inside the frame of the sealant, and the step of carrying in the front chamber is carried out, and the substrate is carried into the front chamber from the substrate transfer port, and the first gate valve is closed. The front chamber is turned into a high vacuum state vacuuming step, and the second gate valve provided between the front chamber that is in the high vacuum state and the processing chamber that is held in the high vacuum state is opened, and the substrate is transferred from the front chamber. After the substrate is transported to the processing chamber, the transport step of the valve 2 is closed, and the sealant attaching step of attaching the sheet-like sealing material to the frame of the sealant of the substrate in the processing chamber is performed. The small rear chamber is in a high vacuum state, and the third gate valve provided between the processing chamber and the rear chamber is opened, and the substrate to which the sheet-like sealing material is attached is transferred from the processing chamber to the rear chamber, and the conveying step is closed. The third gate valve of the substrate discharge port provided in the rear chamber opens the fourth gate valve to make the rear chamber an atmospheric state, and the discharge step of discharging the substrate to which the sheet-like sealing material is attached in the rear chamber is discharged from the substrate discharge port; The attaching step consists of the steps of sequentially transporting the substrate carried by the front chamber at a specific interval, and winding out a plurality of sheets sandwiching the sheet-like seal. The material is provided with a specific width of the cover film and the base film. The step of the film, the step of peeling off the cover film from the plurality of films of the roll -9 - 201044519, and the plurality of films from which the cover film is peeled off, and peeling off the gap which becomes the substrate to be conveyed a portion of the sealing material, a step of forming a plurality of sealing-like sealing materials corresponding to the plurality of substrates on the base film of each of the plurality of films, and the respective substrates carried in the front chamber, wherein the front end portion of the substrate corresponds to the film a step of aligning the leading ends of the sealing material of the substrate, a step of attaching a plurality of films to the substrate to be conveyed, and a step of sealing the plurality of sealing materials corresponding to the substrate, and cooling is attached Each stripping step of the step of winding the base film hermetically sealing the substrate material, the substrate is cooled by the upper is attached a plurality of film strips of the sheet-shaped sealing material. [Effects of the Invention] According to the present invention, since a specific wide sheet-like sealing material is simultaneously conveyed in a reduced pressure (vacuum) or an inert gas atmosphere and attached to a component glass substrate, dust can be prevented. The adhesion of the air bubbles, wrinkles, and the like can be maintained by the film take-up mechanism portion, the cover film take-up mechanism portion, and the base film take-up mechanism portion, and the sheet-like seal member can be improved on the component glass substrate. The quality of the component glass substrate to which the precision or the sheet-like sealing material is attached is attached. In addition, since the pressure reduction and the atmospheric pressure are changed in the front chamber or the rear chamber which is smaller than the volume of the processing chamber, the substrate in the processing chamber is always decompressed or depressurized. The atmosphere state of the active gas can shorten the time required for the change of the atmosphere state, and the production cycle can be improved. -10-201044519 [Embodiment] Hereinafter, embodiments of the present invention will be described using the drawings. Fig. 2 is a schematic structural view showing a specific example of an organic EL panel manufactured by the present invention, and Fig. 2(a) is an exploded view, and Fig. 2(b) is a plan view showing an enlarged portion A of the figure (a). (c) is a general cross-sectional view of the cutting line BB of the drawing (b), 1 is a component glass substrate, 2 is a sealing glass substrate 0, 3 is a sealing agent, 4 is an organic EL element, and 5 is a sheet-like sealing material. In Fig. 2(a), the component glass substrate 1 is formed in a frame shape with a sealant 3 (Fig. 2(b)) along its peripheral portion, and the area inside the frame of the sealant 3 is plural. The organic EL elements 4 are arranged vertically and horizontally, and these organic EL elements are sealed by the sheet-like sealing material 5. The related element glass substrate 1 is sealed by sealing the glass substrate from the side on which the sealant 3 is provided, and is pressed by the sealant 3 to form an organic EL panel. In FIGS. 2(b) and 2(c), the organic EL element 4 is not shown, but an anode is provided on one of the upper and lower surfaces of the organic light-emitting layer, and the other side is provided on the other surface. In the configuration of a cathode, the anode and the cathode are connected to a signal line provided on the surface of the element glass substrate 1, and are provided with an organic film (not shown) provided on an associated signal line or the like. EL element 4. When the organic EL element 4 is a passive organic EL element, scan lines and signal lines are vertically and laterally coated on the surface of the element glass substrate 1. The anode of the organic EL element 4 is connected to the scanning line, and the cathode is connected to the signal line. Further, when the organic EL element 4 is an active matrix type organic EL element, the surface of the element glass substrate 1 is vertically and horizontally laid with scanning lines and signal lines, -11 - 201044519. The intersections of the scanning lines and the signal lines are provided with TFTs. An active element such as a thin film transistor, a gate electrode and a source electrode of the TFT are connected to a scanning line and a signal line, respectively, and an anode of the organic EL element 4 is connected to the drain electrode. The sheet-like sealing material 5 is made of a thermosetting resin such as an epoxy resin, and is attached to the organic EL element 4 in addition to the terminal portion of the electrode extraction line of the anode or the cathode of the organic EL element 4. And make it hard. When the sealing glass substrate 5 is in close contact with the cured sheet-like sealing material 5, the sealing agent 3 is bonded to the element glass substrate 1. In addition, the resin constituting the sheet-like sealing material 5 is not particularly limited as long as it is a thermoplastic and thermosetting resin such as an epoxy resin (when heated, it is softened and can be processed, but if it continues to be heated, it causes a chemical reaction. If the resin is hardened, the type of the resin is not required. Further, other functions such as a desiccant may be applied to the sheet-like sealing member 5.

圖3係根據本發明之基板表面之密封裝置與有機EL面 板之製造方法之槪略說明圖，6係輥（r ο 11 ) 、7係有機E L 面板’對應於圖2的部分被賦予同一符號而省略重複說明 〇 於該圖，在元件玻璃基板1，幾乎於其表面全體之區 域在未圖示之前步驟有複數之有機EL元件4 (圖2 )被排列 而安裝’此外’以包圍此區域全體的方式，液狀之作爲黏 接劑之密封劑3 (圖2 )被塗布爲框狀。相關的元件玻璃基 板1被搬送至處理室（未圖示）內。 在處理室內’使此元件玻璃基板1的表面之被設置有 -12- 201044519 機EL元件4的區域全體以複數列之薄片狀密封材5覆蓋，且 以分別的薄片狀密封材5覆蓋複數列之有機EL元件的方式 進行，藉由使這些薄片狀密封材5以輥6按壓於元件玻璃基 板1的表面而進行加熱，而於此元件玻璃基板1的表面進行 熱壓接。藉此，元件玻璃基板1的表面上之有機EL元件4全 部以複數之薄片狀密封材5覆蓋而被密封。薄片狀密封材5 係以環氧樹脂爲主成分，如此般藉由層積法被貼附於元件 〇 玻璃基板1之表面上。 此處，於元件玻璃基板1之表面，雖未圖示，但設有 訊號線，有機EL元件4之端子部被連接於此訊號線，但薄 片狀密封材5，以除了此端子部以外覆蓋有機EL元件4的全 面的方式，藉由熱壓接而被貼附。使同時進行這些複數列 之薄片狀密封材5之貼附，謀求貼附的效率化，此外，使 對有機EL元件4配置的配線等導致之凹凸部，不產生氣泡 ，而以薄片狀密封材5覆蓋，所以此薄片狀密封材5的貼附 〇 ，係在處理室內’在真空（減壓）中或者是減壓下進行的 〇 接著，薄片狀密封材5被貼附的元件玻璃基板1由處理 室內搬出，於此元件玻璃基板1，藉由設於其表面的液狀 之密封劑3 (圖2 ) ’而貼合密封玻璃2。接著，藉由紫外 線等使此密封劑3進行硬化，而得到有機E L面板7。 圖1係顯示根據本發明之基板表面之密封裝置與有機 , EL面板之製造方法之一實施型態之槪略構成之圖，8爲密 - 封材貼合裝置、9爲處理室、1〇爲前室、11爲後室、12a〜 -13- 201044519 12d爲閘閥、13爲膜、14爲膜捲出機構部、15爲覆蓋膜捲 取機構部、1 6爲基板間處理機構部、1 7爲膜張力測定機構 部' 18爲對準機構部、19爲層積機構部、20爲基板冷卻機 構部、21爲基底膜捲取機構部。 於該圖，在處理室9內，設有在元件玻璃基板1貼合薄 片狀密封材5的密封材貼合裝置8。接著’分別於處理室9 的入口側設前室1 〇，在出口側設後室1 1，分別於處理室9 '前室10之間設閘閥12b，在處理室9、後室11之間設閘閥 ❹ 12c。此外，分別於前室10之入口設閘閥12a，於後室1 1之 出口設閘閥12d。 處理室9內，總是被保持於減壓（真空的）氛圍狀態 ，或是非活性氣體之氛圍狀態，在未圖示之前步驟被進行 ^ 有機EL元件的安裝或密封劑的塗布等處理的元件玻璃基板 1透過前室10被搬入處理室9內，但是在此元件玻璃基板1 由前步驟搬送過來時，處理室9的入口側之閘閥1 2b、出口 側之閘閥12c關閉而處理室9內爲密封狀態，此外，打開前 U 室10的入口側之閘閥12a使此前室10內爲乾空氣（dry air )的大氣狀態，在此狀態下元件玻璃基板1被搬入前室1 0 內。 又，有機EL元件被安裝，密封材被塗布的元件玻璃基 板1被搬送之直到前室10的入口爲止的路徑，係在乾空氣 之大氣狀態。 此元件玻璃基板1被搬入前室1 〇內時，關閉閘閥1 2a使 前室10內呈爲密閉狀態，該室內藉由設於此之真空泵等， -14 - 201044519 ' 排出乾空氣而變化爲減壓或非活性氣體之氛圍狀態。接著 ，前室10內成爲與處理室9同樣的氛圍下時，處理室9的入 口側之閘閥12b打開而元件玻璃基板1被搬入處理室9內。 結束此搬入時，關閉閘閥12b打開閘閥l2a，前室10等待次 一元件玻璃基板1被搬入。 在處理室9內之密封材貼合裝置8，進行往被搬入的元 件玻璃基板1之薄片狀密封材5之貼附作業，此作業結束時 Q ，打開處理室9的出口側之閘閥1 2 c。此時，後室1 1的出口 側之閘閥1 2d爲關閉狀態，後室1 1內藉由設於此之真空泵 等，使其處在與處理室9內同樣的高真空氛圍下，完成薄 片狀密封材5的貼附的元件玻璃基板1由處理室9被搬送至 後室1 1內。接著，結束此搬送後，關閉處理室9側之閘閥 1 2c，打開出口側之閘閥1 2d而使後室1 1內成爲乾空氣之大 氣狀態，然後’元件玻璃基板1由後室1 1搬出被搬送至供 進行密封玻璃基板2(圖2、圖3)之貼合等之後步驟。 由前步驟，被進行了有機EL元件之安裝或密封劑的塗 布等之元件玻璃基板1依序被搬送至前室1 0，分別依序進 行前述之薄片狀密封材5的貼附處理。 又，製造有機EL元件的場合，在製造步驟中爲了防止 有機EL元件的性能劣化’在減壓或在非活性氣體氛圍下進 行製造。同樣進行’在薄片狀密封材5的貼合中爲了防止 有機EL元件之性能劣化，將密封材貼合裝置8設於處理室9 _ 內，使此處理室9內成爲減壓或非活性氣體的氛圍狀態。 在密封材貼合裝置8，薄片狀密封材5之膜1 3由膜捲出 -15- 201044519 機構部14取出，經過覆蓋膜捲取機構部I5、基板間處理機 構部16、膜張力測定機構部17、對準機構部18而被送入層 積機構部19，在此層積機構部19薄片狀密封材5被貼附於 由前室1 0搬入的元件玻璃基板1。 由膜捲出機構部1 4捲出的膜1 3，爲連續的帶狀，如圖 4所示，係在密封材膜5 ’之一方之面上可剝取地貼附基底 膜13b而在另一方之面可剝取地貼附覆蓋膜13a而成三層構 造。此密封材膜5’如後述般，於每個元件玻璃基板1以基 板間處理機構部16區分，被形成元件玻璃基板1之薄片狀 密封材5。 又，包含薄片狀密封材5的膜13，要具有防濕功能是 困難的，此外要除去吸濕了的薄片狀密封材的水分，必須 要在減壓或非活性氣體氛圍的環境下進行長時間的除去水 分之處理。因此，在以密封材貼合裝置8進行貼合所用之 前面的步驟，膜1 3係移動至周圍被保持乾空氣（露天溫度 =-20 °C以下）或者非活性氣體的環境之房間內，或者使 0 此膜1 3之如後述般被區分的薄片狀密封材5貼合於元件玻 璃基板1的密封材貼合裝置8也配置於處理室9內之減壓或 者非活性氣體氛圍的環境內，膜1 3從膜捲出機構部1 4起直 到薄片狀密封材5被貼合於元件玻璃基板1而由處理室9被 搬出爲止，都在處理室9內。 於圖1，在覆蓋膜捲取機構部15，由從膜捲出機構部 1 4捲出的膜1 3被剝取被貼合於密封材膜5 ’的上側的覆蓋膜 . 13a，在基板間處理機構部16，覆蓋膜13a被剝取的膜13之 -16- 201044519 成爲剝出的密封材膜5 ’依一個個元件玻璃基板1而被區分 成爲薄片狀密封材5，以薄片狀密封材5成爲向下的方式上 下面反轉而被搬送至層積機構部19。 此處，藉由膜張力測定機構部1 7測定膜1 3的張力，使 膜13的張力被調整，此外，藉由對準機構部19’使在膜13 之被區分的薄片狀密封材5正確地對準位置於貼合此之元 件玻璃基板1。 Q 如此進行，被調整位置的薄片狀密封材5之膜13，於 層積機構部19，薄片狀密封材5在元件玻璃基板1的表面， 如圖3所說明的，被熱壓接，以基板冷卻機構部20冷卻在 熱壓接被加熱的元件玻璃基板1。藉由此冷卻，薄片狀密 封材5被強固地貼附於元件玻璃基板1之表面。然後，以基 底膜捲取機構部21使膜13之基底膜13b被剝取，成爲1個1 個薄片狀密封材5被貼合之元件玻璃基板1。如此進行薄片 狀密封材5被貼合之元件玻璃基板1每次被搬送來處理室9 〇 的出口時打開閘閥1 2C，被搬送至後室1 1。 又，在此，針對1個膜1 3進行說明，但複數之膜1 3係 同時同樣地被處理，而如前所述，於元件玻璃基板1同時 被貼附複數之薄片狀密封材5。 如此般，藉由把在元件玻璃基板1貼合薄片狀密封材5 的密封材貼合裝置8設置於減壓或者非活性氣體之氛圍下 之處理室9內，可以防止設於元件玻璃基板1的表面之有機 . EL元件4 (圖2 )之吸濕導致性能的劣化，薄片狀密封材5 也在從膜捲出機構部1 4捲出時起直到被貼附於元件玻璃基 -17- 2010445193 is a schematic explanatory view showing a method of manufacturing a substrate surface sealing device and an organic EL panel according to the present invention, and a 6-series roller (r ο 11 ) and a 7-series organic EL panel 'corresponding to the portion of FIG. 2 are given the same symbol. In the element glass substrate 1, the organic EL element 4 (FIG. 2) having a plurality of organic light elements 4 (FIG. 2) arranged in the vicinity of the surface of the element glass substrate 1 is arranged to surround the area. In a whole manner, the liquid sealant 3 (Fig. 2) as an adhesive is applied in a frame shape. The related component glass substrate 1 is transported into a processing chamber (not shown). In the processing chamber, the entire surface of the EL panel 4 on which the surface of the element glass substrate 1 is provided with -12-201044519 is covered with a plurality of sheet-like sealing members 5, and the plurality of sheets are covered with the respective sheet-like sealing members 5. In the manner of the organic EL element, the sheet-like sealing material 5 is heated by pressing the surface of the element glass substrate 1 with the roller 6, and the surface of the element glass substrate 1 is thermocompression bonded. Thereby, the organic EL element 4 on the surface of the element glass substrate 1 is covered with a plurality of sheet-like sealing members 5 and sealed. The sheet-like sealing material 5 is mainly composed of an epoxy resin, and is thus attached to the surface of the element 〇 glass substrate 1 by a lamination method. Here, on the surface of the element glass substrate 1, although not shown, a signal line is provided, and the terminal portion of the organic EL element 4 is connected to the signal line, but the sheet-like sealing material 5 is covered except for the terminal portion. The overall manner of the organic EL element 4 is attached by thermocompression bonding. When the sheet-like sealing material 5 of the plurality of the plurality of rows is attached, the adhesion is improved, and the uneven portion caused by the wiring or the like disposed on the organic EL element 4 does not generate bubbles, and the sheet-like sealing material is formed. 5, the attachment of the sheet-like sealing material 5 is carried out in a vacuum chamber (under reduced pressure) or under reduced pressure in the processing chamber, and the component glass substrate 1 to which the sheet-like sealing material 5 is attached is attached. The sealing glass 2 is bonded to the component glass substrate 1 by the liquid sealant 3 (FIG. 2) provided on the surface of the component glass substrate 1. Then, the sealant 3 is cured by ultraviolet rays or the like to obtain an organic EL panel 7. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a schematic configuration of a sealing device for a substrate surface and an organic EL panel manufacturing method according to the present invention, wherein 8 is a dense-sealing material laminating device, 9 is a processing chamber, and 1 is a processing chamber. For the front chamber, 11 for the rear chamber, 12a to -13-201044519 12d for the gate valve, 13 for the membrane, 14 for the film unwinding mechanism portion, 15 for the cover film take-up mechanism portion, and 16 for the inter-substrate processing mechanism portion, 1 7 is a film tension measuring mechanism portion 18 is an alignment mechanism portion, 19 is a laminating mechanism portion, 20 is a substrate cooling mechanism portion, and 21 is a base film winding mechanism portion. In the drawing, a sealing material bonding apparatus 8 in which a sheet-like sealing material 5 is bonded to the element glass substrate 1 is provided in the processing chamber 9. Next, a front chamber 1 设 is provided on the inlet side of the processing chamber 9, and a rear chamber 1 is provided on the outlet side. A gate valve 12b is disposed between the processing chamber 9' and the front chamber 10, respectively, between the processing chamber 9 and the rear chamber 11. Set the gate valve ❹ 12c. Further, a gate valve 12a is provided at the inlet of the front chamber 10, and a gate valve 12d is provided at the outlet of the rear chamber 1 1 . In the processing chamber 9, the component is always held in a decompressed (vacuum) atmosphere or an inert gas atmosphere, and is subjected to processing such as mounting of an organic EL element or application of a sealant before a step (not shown). The glass substrate 1 is carried into the processing chamber 9 through the front chamber 10. However, when the element glass substrate 1 is transferred from the previous step, the gate valve 12b on the inlet side of the processing chamber 9 and the gate valve 12c on the outlet side are closed and the processing chamber 9 is closed. In the sealed state, the gate valve 12a on the inlet side of the front U chamber 10 is opened to make the inside of the front chamber 10 an air state of dry air, and the element glass substrate 1 is carried into the front chamber 10 in this state. Further, the organic EL element is mounted, and the path from the element glass substrate 1 to which the sealing material is applied to the inlet of the front chamber 10 is in an atmospheric state of dry air. When the element glass substrate 1 is carried into the front chamber 1 ,, the gate valve 1 2a is closed to close the inside of the front chamber 10, and the chamber is changed by the vacuum pump or the like, -14 - 201044519 ' Ambient state of reduced pressure or inert gas. When the inside of the front chamber 10 is in the same atmosphere as the processing chamber 9, the gate valve 12b on the inlet side of the processing chamber 9 is opened, and the element glass substrate 1 is carried into the processing chamber 9. When this loading is completed, the gate valve 12b is closed to open the gate valve l2a, and the front chamber 10 waits for the next component glass substrate 1 to be carried in. The sealing material bonding apparatus 8 in the processing chamber 9 performs the attaching operation to the sheet-like sealing material 5 of the component glass substrate 1 to be carried in. When the operation is completed, Q, the gate valve 1 of the outlet side of the processing chamber 9 is opened. c. At this time, the gate valve 12d on the outlet side of the rear chamber 1 is in a closed state, and the vacuum chamber or the like in the rear chamber 1 is placed in the same high vacuum atmosphere as in the processing chamber 9, and the sheet is completed. The component glass substrate 1 to which the sealing material 5 is attached is conveyed into the rear chamber 1 1 by the processing chamber 9. After the transfer is completed, the gate valve 1 2c on the processing chamber 9 side is closed, the gate valve 1 2d on the outlet side is opened, and the inside of the rear chamber 1 1 is in an atmospheric state of dry air, and then the component glass substrate 1 is carried out from the rear chamber 1 1 . It is conveyed to the step after performing bonding, such as bonding of the sealing glass substrate 2 (FIG. 2, FIG. 3). In the previous step, the component glass substrate 1 to which the organic EL element is mounted or the sealant is applied is sequentially transferred to the front chamber 10, and the above-described sheet-like sealing material 5 is attached in order. Further, in the case of producing an organic EL element, in order to prevent deterioration of the performance of the organic EL element in the production step, it is produced under reduced pressure or in an inert gas atmosphere. In the same manner, in order to prevent the deterioration of the performance of the organic EL element during the bonding of the sheet-like sealing material 5, the sealing material laminating device 8 is placed in the processing chamber 9 _ to make the inside of the processing chamber 9 a decompressed or inert gas. The state of the atmosphere. In the sealing material bonding apparatus 8, the film 13 of the sheet-like sealing material 5 is taken out by the film winding-out -15-201044519, and passes through the cover film winding mechanism part I5, the inter-substrate processing mechanism part 16, and the film tension measuring mechanism. The portion 17 and the alignment mechanism portion 18 are fed into the laminating mechanism portion 19, and the laminar sealing member 5 is attached to the element glass substrate 1 carried in the front chamber 10 by the laminating mechanism portion 19. The film 13 which is wound up by the film take-up mechanism portion 14 has a continuous strip shape, and as shown in Fig. 4, the base film 13b is peelably attached to one of the faces of the sealing material film 5'. The other side is peelably attached to the cover film 13a in a three-layer structure. The sealing material film 5' is divided into the sheet-like sealing member 5 of the element glass substrate 1 by the inter-substrate processing mechanism portion 16 for each of the element glass substrates 1 as will be described later. Further, the film 13 including the sheet-like sealing material 5 is difficult to have a moisture-proof function, and in addition, the moisture of the moisture-absorbing sheet-like sealing material is removed, and it is necessary to carry out the reaction under a reduced pressure or an inert gas atmosphere. Time to remove moisture treatment. Therefore, in the step before the sealing material bonding apparatus 8 performs the bonding, the film 13 is moved to a room where the surrounding environment is kept dry air (open air temperature = -20 ° C or less) or an inert gas atmosphere. Alternatively, the sealing material bonding apparatus 8 in which the sheet-like sealing material 5 which is divided as described later, which is bonded to the element glass substrate 1, is placed in the decompression or inert gas atmosphere in the processing chamber 9 The film 13 is in the processing chamber 9 from the film unwinding mechanism portion 14 until the sheet-like sealing material 5 is bonded to the device glass substrate 1 and is carried out by the processing chamber 9. In Fig. 1, in the cover film take-up mechanism portion 15, the film 13 which is unwound from the film take-up mechanism portion 14 is peeled off and attached to the upper cover film of the sealant film 5'. 13a, on the substrate In the inter-process mechanism unit 16, the film 13 to which the cover film 13a is peeled off is -16, 445, 145, 149, and the peeling seal film 5' is divided into the sheet-like seal member 5 by the one-piece glass substrate 1, and is sealed in a sheet shape. The material 5 is reversed and conveyed to the laminating mechanism portion 19 in a downward direction. Here, the tension of the film 13 is measured by the film tension measuring mechanism unit 17 to adjust the tension of the film 13, and the sheet-like sealing material 5 distinguished by the film 13 by the alignment mechanism portion 19' is used. Correctly align the position of the component glass substrate 1 to which it is attached. Q, the film 13 of the sheet-like sealing material 5 at the position is adjusted in the laminating mechanism portion 19, and the sheet-like sealing member 5 is thermocompression-bonded on the surface of the element glass substrate 1 as illustrated in FIG. The substrate cooling mechanism unit 20 cools the element glass substrate 1 heated by thermocompression bonding. By this cooling, the sheet-like sealing material 5 is firmly attached to the surface of the element glass substrate 1. Then, the base film take-up mechanism portion 21 peels off the base film 13b of the film 13 to form the element glass substrate 1 to which one sheet-like sealing material 5 is bonded. When the component glass substrate 1 to which the sheet-like sealing material 5 is bonded in this manner is transported to the outlet of the processing chamber 9 每次, the gate valve 1 2C is opened and transported to the rear chamber 1 1 . Here, the description will be given of one film 1 3, but a plurality of films 13 are simultaneously treated in the same manner, and as described above, a plurality of sheet-like sealing members 5 are simultaneously attached to the element glass substrate 1. In this manner, the sealing material bonding apparatus 8 in which the sheet-like sealing material 5 is bonded to the element glass substrate 1 is placed in the processing chamber 9 under a reduced pressure or inert gas atmosphere, thereby preventing the element glass substrate 1 from being disposed. Organic of the surface. The moisture absorption of the EL element 4 (Fig. 2) causes deterioration of performance, and the sheet-like sealing material 5 is also attached from the film unwinding mechanism portion 14 until it is attached to the element glass base -17- 201044519

板1由處理室9被搬出至後室11爲止貼合作業中處於減壓或 者非活性氣體氛圍下之處理室內，所以水分被排出可以防 止其侵入，因此也可以防止薄片狀密封材5的吸濕，可以 防止由於薄片狀密封材5之吸濕導致之性能的劣化。而且 ，在處理室9內，空氣或粉塵被排出’此外’也可以防止 其侵入，所以貼合的有機EL元件4與薄片狀密封材5之間可 以極力抑制氣泡的產生或粉塵的侵入’也可以防止有機ELSince the sheet 1 is carried out from the processing chamber 9 to the rear chamber 11 and is placed in a processing chamber under a reduced pressure or an inert gas atmosphere in the cooperation industry, moisture can be prevented from intruding, so that the sheet-like sealing material 5 can be prevented from being sucked. Wet, deterioration of performance due to moisture absorption of the sheet-like sealing member 5 can be prevented. In addition, in the processing chamber 9, air or dust can be prevented from intruding, and the intrusion of bubbles or the intrusion of dust can be suppressed as much as possible between the organic EL element 4 and the sheet-like sealing material 5 that are bonded together. Can prevent organic EL

面板7 (圖3 )的性能劣化。 H 此外’係於處理室9，分別於其入口側設前室1 〇 ’於 其出口側設後室1 1，來自前步驟的元件玻璃基板1被搬入 處於大氣狀態的前室1 〇內時’在閘閥1 2a，1 2b關閉的狀態 下使前室10內由大氣狀態成爲與處理室9內相同的氛圍狀 態之後，打開閘閥12b搬入處理室9內再度關閉此閘閥12b ，此外，使後室11內由大氣狀態成爲與處理室9內相同氛 圍狀態之後，打開閘閥1 2C使處理室9內之被貼附薄片狀密 封材5的元件玻璃基板1搬出至後室11內’然後，關閉閘閥 U 1 2 c使後室1 1內成爲大氣狀態’打開閘閥1 2 d往外部排出者 ，所以，可使處理室9內保持於減壓或非活性氣體之氛圍 狀態，可以極力縮短供維持相關的氛圍之真空泵等手段之 工作時間，而且前室1 〇及後室1 1 ’可以進行元件玻璃基板 1之搬出搬入或收容，且只要是具有閘閥123，121?可以開閉 的容量即可，與處理室9內的容積相比只要其1/5〜1/1〇倍 程度之充分小的容積即可’因此’由大氣狀態變化至減壓 或者非活性氣體的氛圍狀態所需要的時間或者是相反的狀 -18- 201044519 態變化所需要的時間，與在處理室9進行相關的狀態 的場合所需要的時間相比，可以大幅縮短，可以大幅 對每1個之元件玻璃基板之薄片狀密封材的貼合之作 間。 此外，雖未圖示，但處理室9或前室1 0、後室1 1 設置於周圍被保持在乾空氣或非活性氣體的氛圍狀態 所。 〇 圖5係顯示圖1之密封材貼合裝置8之一具體例之 構成之立體圖，14a 〜14c，15a，15b，16a, 16b，19a， 2 1a，2 lb係驅動馬達，22爲剝取裝置，23爲位置檢測 對應於圖1的部分被賦予相同符號而省略重複說明。 於該圖，4條膜13由藉由驅動馬達14a〜14c驅動 捲出機構部1 4送出，相互平行地且以相同特定的間隔 。其輸送方向，如箭頭（—）所示，與元件玻璃基枝 輸送方向平行，且與其輸送方向爲相反方向。又，這 〇 1 3的輸送，係藉由以膜捲出機構部1 4使這些膜1 3被送 同時這些膜13的覆蓋膜13a (圖4)以藉由驅動馬達15: 驅動的覆蓋膜捲取機構部15捲取，且這些膜13之基 13b (圖4)以藉由驅動馬達21 a, 21b驅動的基底膜捲 構部21捲取，而進行的。又，這些膜13，如後述般， 於來自前室1 〇的元件玻璃基板1的搬入，以圖8所示之 1間歇地輸送。 . 以覆蓋膜捲取機構部1 5剝取了覆蓋膜1 3a (圖4 ) 些膜1 3，於基板間處理機構部1 6，如前所述，使變成 變化 縮短 業時 ，被 之場 全體 2 0 a, 器， 的膜 輸送 η的 些膜 出， .，1 5b 底膜 取機 同步 尺寸 之這 剝出 -19- 201044519 的薄片狀密封材5依一個個元件玻璃基板而被區分’以成 爲這些區分的邊界的方式’剝取特定長度的薄片狀密封材 5。相關的剝取，係藉由藉驅動馬達16a，16b驅動的剝取裝 置22而進行的。 以基板間處理機構部1 6處理的這些膜1 3 ’在膜張力測 定機構部1*7其輸送方向爲朝下’亦即’元件玻璃基板1之 輸送路徑的方向被改變。此時’藉由膜張力測定機構部1 7 測定這些膜1 3的合成張力’因應於此測定結果使膜捲出機 構部14的驅動馬達14a〜14c被控制’藉此而調整這些膜13 的張力。 來自膜張力測定機構部17的膜13被送至對準機構部18 ，在層積機構部19，以膜13之薄片狀密封材5與1個個元件 玻璃基板1之此薄片狀密封材5被貼合的位置一致的方式， 根據CCD攝影機等所構成的位置檢測器23的檢測結果，在 對準機構部18進行膜13的寬幅方向、長度方向（輸送方向 )之位置調整。此位置調整，係使由前室1 〇 (圖1 )搬入 的元件玻璃基板1停止於層積機構部19之前的特定的位置 ，但對於停止於此位置的元件玻璃基板1，以在膜1 3之薄 片狀密封材5的前頭位置成爲特定位置的方式，使膜13移 動於其寬幅方向、長度方向而進行設定者。對準機構部18 ，在元件玻璃基板1與在膜1 3之貼合於此元件玻璃基板i的 薄片狀密封材5之位置關係，如此般地成爲特定的位置關 係時，設定於可以檢測出貼合於次一元件玻璃基板1的薄 片狀密封材5的前頭位置的位置，藉此，藉由調整此前頭 -20- 201044519 位置，可以使停止於特定位置的元件玻璃基板1與貼合於 此的薄片狀密封材5之位置關係設定爲前述之特定的位置 關係。 如此般，元件玻璃基板1與在貼合於此的膜1 3之薄片 狀密封材5的位置關係被設定時，有特定的時間元件玻璃 基板1與膜1 3係處於停止狀態，但此時，在基板間處理機 構部16，在膜13之密封材膜5’之成爲次一區分的邊界之剝 0 取部分位於此位置，此部分藉由基板間處理機構部1 6之剝 取裝置22剝取。藉此，形成次一薄片狀密封材5。 然後，膜1 3與元件玻璃基板1以相同的速度輸送，被 送入藉由驅動馬達19a而動作的層積機構部19，膜13之薄 片狀密封材5藉由熱壓接而被貼合於此元件玻璃基板1。 此熱壓接係藉由膜13之薄片狀密封材5與元件玻璃基 板1連續地移動而進行的，與此同時，次一元件玻璃基板1 由前室10被搬入，如前所述，停止於特定的位置。與此同 〇 時，在層積機構部19膜13之被貼合薄片狀密封材5的元件 玻璃基板1也停止，藉由對準機構部1 8進行對次一元件玻 璃基板1之膜1 3的薄片狀密封材5之位置調整或在基板間處 理機構部1 6之次一薄片狀密封材5的形成，進行往次一元 件玻璃基板1之薄片狀密封材5的貼合。 如此進行，往從前室10依序被搬送的元件玻璃基板1 依序進行薄片狀密封材5的貼合。 膜1 3之薄片狀密封材5被貼合的元件玻璃基板1，以藉 由驅動馬達2 0 a驅動的基板冷卻機構部2 0冷卻後，以藉由 -21 - 201044519 驅動馬達21a,21b驅動的基底膜捲取機構部21剝取膜13之 基底膜13，成爲薄片狀密封材5被貼附的個個之元件玻璃 基板1而被搬送至後室1 1。但是其間，膜1 3與元件玻璃基 板1，伴隨著前述的間歇動作，以圖8所示之尺寸1間歇地 移動。 又，進行以上的動作之密封材貼合裝置8係被設置於 處理室9內，但膜捲出機構部14之驅動馬達14a〜14c等之 各裝置的驅動馬達，被安裝於處理室9的外側。 圖6係擴大顯示圖5之膜捲出機構部14與覆蓋膜捲取機 構部15之構成圖，24a〜24d爲膜輥、25a〜25d爲旋轉軸、 26爲扭矩限制器、27爲膜張力附加輥、28爲壓帶輪、 29a，29b爲驅動馬達、30a〜30d爲覆蓋膜捲取輥、31爲覆蓋 膜剝除輥、32扭矩限制器，對應於圖5的部分賦予相同符 號而省略重複說明。 於該圖，在膜捲出機構部14，於驅動馬達14a之旋轉 軸25a，2個膜13被捲繞爲滾筒狀之膜輥24b,24d隔著特定 的間隔而被安裝著，於驅動馬達14b的旋轉軸25b，也有2 個膜1 3被捲繞爲滾筒狀的膜輥2 4 a，2 4 c隔著特定的間隔而被 安裝著。由這些膜輥24a〜24d分別送出膜13，但由膜輥 24a送出的膜13與從膜輥24b送出的膜13與從膜輥24c送出 的膜13與從膜輥24d送出的膜13分別依此順序且以成爲前 述特定間隔的方式，分別被配置於旋轉軸25a，25b。 這些膜輥24a〜24d係可分別由旋轉軸25a，25b取下，在 膜輥24a〜24d膜13幾乎完全被送出時，可以替換新的膜輥 -22- 201044519 於驅動馬達14c之旋轉軸25c ’設有使來自膜輥24a， 2 4b，2 4 c，2 4 d之膜分別抵接之膜張力附加輥2 7。此外’於各 個這些膜張力附加輥27，以夾住抵接於這些膜張力附加輥 27的膜13的方式，在旋轉軸25d設有4個壓帶輪28。 驅動馬達14a〜14c旋轉時，膜13分別由膜輥24a〜24d 往下方向送出，這些膜13分別藉由膜張力附加輥27與壓帶 〇 輪28而以特定的張力拉緊而移動。此時，藉由膜張力附加 輥27使從膜輥24a〜24d往下方向移動之分別的膜13，轉換 其移動方向成水平方向。 此處，膜輥24a〜24d分別可旋轉地安裝於旋轉軸 2 5 a，2 5b於這些安裝部分別被設有扭矩限制器26。藉由這 些扭矩限制器26，膜輥24a〜24d分別伴隨著旋轉軸25a，25b 之旋轉而一起旋轉送出膜13，但與此同時，膜輥24a〜24d 對旋轉軸25a，25b旋轉而進行膜13之送出張力的調整。 Ο 如此進行，由膜捲出機構部14送出的4條膜13，被送 至覆蓋膜捲取機構部15。 覆蓋膜捲取機構部15，於驅動馬達15a之旋轉軸29a， 2個覆蓋膜捲取輥30b，30d隔著特定的間隔而被安裝著，於 驅動馬達15b的旋轉軸29b，有2個覆蓋膜捲取輥30a,30c隔 著特定的間隔而被安裝著。此外，於旋轉軸29c，4個覆蓋 膜剝除輥3 1 ’以分別抵接由膜捲出機構部丨4送出之分別的 膜13的方式被安裝著。以這些覆蓋膜剝除輥31由這些膜13 剝取覆蓋膜13a ’而被剝取的覆蓋膜13a分別以覆蓋膜捲取 -23- 201044519 輥30a〜30d捲取。 這些覆蓋膜剝除輥31分別可由旋轉軸29a,29b取出， 在膜捲出機構部Μ之膜輥24a〜24d膜13幾乎完全被送出而 替換新的膜輥時，這些覆蓋膜剝除輥3 1也分別由旋轉軸 29a,29b取下’將未捲取覆蓋膜13a的新的覆蓋膜剝除輥31 分別安裝於旋轉軸29a，2 9b，作業員從在膜捲出機構部14 之新的膜輥24a〜24d分別拉出膜13，剝取覆蓋膜13a而安 裝於覆蓋膜剝除輥31後，將這些覆蓋膜13 a捲繞於覆蓋膜 捲取輥30a〜30d。 此外，覆蓋膜捲取輥30a〜30d分別可旋轉地安裝於旋 轉軸29a，2 9b，於這些之安裝部分別被設有扭矩限制器32 。覆蓋膜捲取輥30a〜30 d分別隨著旋轉軸29a，2 9b之旋轉而 一起旋轉而捲取覆蓋膜1 3 a，藉由扭矩限制器3 2附加張力 而捲取。 如此進行，以覆蓋膜剝除輥3 1剝取覆蓋膜1 3 a的4條膜 1 3，如前所述，以特定的間隔平行地被送往基板間處理機 構部1 6 (圖7 )。 又，在圖5所說明的膜張力測定機構部1 7之張力測定 結果’被送至膜捲出機構部14而調整驅動馬達14a〜l4c之 旋轉扭矩，此外，也被送至覆蓋膜捲取機構部15而調整驅 動馬達15a,15b之旋轉扭矩。 圖7係擴大顯示圖5之基板間處理機構部1 6之構成圖’ 33a, 33b爲膜按壓構件、34爲半切構件、35爲剝離輥（ roller) 、36爲剝離帶、37爲帶送出輥、38爲帶捲取輥、 -24- 201044519 ' 39a，39b爲垂下輥，對應於圖5的部分賦予相同符號而省略 重複說明。 於該圖，在基板間處理機構部16，由覆蓋膜捲取機構 部15(圖6)起膜13被送入特定的長度份（膜送入長度） 時，此膜1 3停止，藉由平行於直交膜1 3的排列方向的方向 上延伸的2枚膜按壓構件33 a，3 3b，使這些膜13同時被壓入 未圖示的平面部。藉此，這些膜13之膜按壓構件33 a, 33b Q 間的部分被固定。在這些膜13之根據膜按壓構件33 a，33b 的按壓部分藉由剝取裝置22作用，而如前所述，被剝取區 分薄片狀密封材5的區域之密封材膜5’。 此處，同步於來自前室1〇(圖5)的元件玻璃基板1的 搬入而在膜13之密封材膜5’之剝取部分爲被決定時，在膜 1 3之密封材膜5 ’的剝取部分之間隔及其長度（膜1 3之移動 方向的長度）係以下述方式決定的。 亦即，於圖8，現在元件玻璃基板1之搬送方向的長度 〇 爲L，在此元件玻璃基板1之以薄片狀密封材5覆蓋的密封 區域40之元件玻璃基板1的搬送方向的長度爲L’，而由前 室1 〇搬入的元件玻璃基板1的間隔爲D時，在前後2個元件 玻璃基板1之密封區域40的間隔d成爲d = L-L’ + D。此間隔d 係在膜1 3的密封材膜5 ’的剝取部分的長度。亦即，按壓構 件33a，33b，以挾著此剝取部分的方式，固定膜13。此外 ’此剝取部分的反覆的長度（亦即，膜1 3之膜送入長度） 1爲l = L’ + d = L + D ’成爲元件玻璃基板的搬入之反覆長度。 回到圖7，剝取裝置2 2 ’具備半切構件3 4與剝離帶3 6 -25- 201044519 與剝離輥3 5。半切構件3 4，藉由未圖示的驅動手段’而可 在箭頭A的方向或其相反之箭頭B的方向上移動，剝離輥35 或垂下輥39 a，3 9b，也藉由未圖示的驅動手段，而可以移 動於箭頭A、B方向。剝離輥35與垂下輥39a,39b之移動一 起移動，進而於上下方向也可以移動。亦即，雖未圖示， 例如被設置搭載了半切構件34與剝離輥3 5與垂下輥 3 9a, 3 9b之可在箭頭A、B方向上移動的手段，於此手段， 設有旋轉驅動半切構件34的驅動手段，此外，在此手段之 中可上下移動地被安裝剝離輥35。 在此，半切構件34，由捲取輥38側移動於箭頭A方向 ，同時於在膜13之密封材膜5’的長度d (圖8)之剝取部分 的前後兩側進行切入，從此半切構件34之後藉由同樣以移 動於箭頭A方向的剝離輥35按壓於膜13之剝離帶36，使此 膜I3之密封材膜5’的半切構件34所切入間的部分由膜13剝 離。剝離帶36被貼於送出輥37與捲取輥38之間，在2個垂 下輥39a,3 9b之間往下方垂下，藉由剝離輥35，被按壓於 膜13。 如此進行，在4條膜1 3之薄片狀密封材5之成爲間隔的 部分（亦即圖9所示之薄片狀密封材間隔部42 )被形成時 ，藉由驅動馬達1 6 b的驅動，捲取輥3 8旋轉而捲取剝離帶 3 6。此時，驅動馬達1 6 a不被驅動，送出輥3 7不送出剝離 帶36。因此’在垂下輥39a,39b間，藉由剝離帶36移動至 捲取輥38側’使剝離輥35被抬起離開膜1 3，然後，驅動馬 達1 6 a起動而由送出輥3 7 ’以在捲取輥3 8之剝離帶3 6的捲 -26- 201044519 取速度同樣的速度送出剝離帶36。此外’與此同時’藉由 搭載半切構件34與剝離輥35與垂下輥39 a，3 9b之手段移動 於箭頭B方向，這些半切構件34與剝離輥35與垂下輥 3 9 a，3 9b，直到成爲比膜13更靠捲取輥38側爲止持續移動 往箭頭B方向。 接著，膜按壓構件33a，33b抬起而膜13由固定狀態放 開，在箭頭C方向上僅移動前述長度1時，膜按壓構件 0 33a，33b再度降下而固定膜13，如前所述，藉由剝取裝置 22形成次一薄片狀密封材間隔部42 (圖9)。 藉由以上的動作被反覆進行，以前述之反覆長度1依 序形成密封區域40，於其各個被依序形成薄片狀密封材5 〇 圖9係顯示在圖7之剝取裝置22由膜1 3剝取薄片狀密封 材間隔部的密封材膜5’的動作之圖，34a，34b係半切用圓刃 ，34c爲旋轉軸，41a,41b爲切入，42爲薄片狀密封材間隔 〇 部。 於該圖，半切構件34，分別於平行於箭頭C所示的膜 13的移動方向而配置的旋轉軸34c的兩端部，以等於圖8所 示的長度d的間隔被安裝半切用圓刃34a，34b。相關構成的 半切構件34，藉由其旋轉軸34c藉未圖示的驅動馬達旋轉 驅動，而使半切用圓刃34a，34b旋轉同時移動於與箭頭C所 示的膜13的輸送方向（長邊方向）直交的箭頭A方向，藉 . 此，於膜13之密封材膜5’形成等於其厚度的深度之切入 41 a，41b。 -27- 201044519 另一方面，剝離輥35，由半切構件34之後面’使剝離 帶36藉由在膜13之密封材膜5’之半切用圓刃34a，34b而被形 成的切入41b間的部分抵壓同時移動往箭頭A方向’藉 此，密封材膜5 ’之切入4 1 a, 4 1 b間的部分黏接於剝離帶3 6而 剝離。藉此，被形成薄片狀密封材間隔部42 ’比在密封材 膜5,之薄片狀密封材間隔部42更前面的部分成爲長度L’（ 圖8 )之薄片狀密封材5。 如此進行，在基板間處理機構部1 6 ’於膜1 3上’長度 L，之薄片上密封材5以長度d之間隔依序被形成。 圖1 〇係擴大顯示圖5之層積機構部1 9之構成圖’ 19b，19c爲驅動馬達、43爲附寬幅方向調整用導引之輥、 44a〜44d爲寬幅方向調整用馬達，45a,45b爲熱壓接用輥' 46爲基板搬送用輥、47爲搬送方向變換輥，對應於圖5的 部分賦予相同符號而省略重複說明。 於該圖，在層積機構部1 9由膜張力測定機構部1 7 (圖 5 )往箭頭D所示的朝下方向搬送之膜13分別藉由搬送方向 變換輥47而被變換爲沿著元件玻璃基板1之箭頭E所示的搬 送方向之方向上。被變換方向之這些膜13 ’被搬送至熱壓 接輥45a,45b之間。藉由此方向變換，薄片狀密封材5變成 被配置於在膜1 3之元件玻璃基板1側。 於搬送方向變換輥47之前，設有於各膜以寬幅方向調 整用馬達44a〜44d驅動的附寬幅方向調整用導引之輥43。 這些附寬幅方向調整用導引之輥43，分別於其寬幅方向兩 端部各設有鍔部（未圖示），膜1 3通過此2個鍔部之間。 -28- 201044519 這些寬幅方向調整用馬達44a〜44d及寬幅方向調整用輕43 ，成爲圖5之對準機構部18的寬幅方向之調整手段。此外 ，在搬送方向變換輥47與熱壓接輥45a，45b之間’於各膜 1 3設有位置檢測器23 (但在此僅顯示出1個），檢測出膜 1 3之分別的寬幅方向之位置偏移。因應於其檢測結果’使 寬幅方向調整用馬達44a~44d之中對產生位置偏移的膜13 之該當的寬幅方向調整用馬達44 (寬幅方向調整用馬達 0 44a〜44d之總稱）之附寬幅方向調整用導引之輥43旋轉於 特定的方向，調整該膜13之寬幅方向的位置偏移。 如前所述，藉由對準機構部18(圖5)，使對由前室 1 0 (圖5 )搬入而停止中的元件玻璃基板1之膜1 3的薄片狀 密封材5之位置關係設定爲特定關係時，此膜1 3被搬送， 同時以與此相等的速度也藉由基板搬送輥46搬送元件玻璃 基板1，於此元件玻璃基板1之密封區域40 (圖8 )被重疊 膜1 3之薄片狀密封材5。接著，在相關的狀態下元件玻璃 〇 基板1與膜13被挾入藉由驅動馬達19b，19c而旋轉驅動的熱 壓接用輥45 a，45b之間，進而藉由被加熱，而在元件玻璃 基板1之密封區域40在分別的膜13之薄片狀密封材5被熱壓 接。 如此進行，元件玻璃基板1與在其密封區域40被熱壓 接薄片狀密封材5的膜13係藉由基板搬送輥46而被搬送至 接下來的冷卻步驟。 圖1 1係擴大顯示圖5之基板冷卻機構部2 0與基底膜捲 取機構部21之構成圖，48a，48b爲基板冷卻輥、49爲基底 -29- 201044519 膜剝離輥、50a〜5 0d爲捲取輥、51爲扭矩限制器，52爲基 板搬送馬達’對應於圖5、圖1 0的部分賦予相同符號而省 略重複說明。 於該圖，在基板冷卻機構部20，藉由驅動馬達20a旋 轉驅動的基板冷卻輥48a，48b成對之冷卻輥部被設有2組’ 以分別之冷卻輥部使膜1 3之被貼合薄片狀密封材5的元件 玻璃基板1被挾持於基板冷卻輥48 a，4 8b而被搬送。接著’ 這些基板冷卻輥48 a，48b，係鋼製爲圓筒狀，藉由在其內 部導入、排出冷卻水而在這些基板冷卻輥48 a,48b的內部 設冷卻手段。藉由以藉由此冷卻手段冷卻的基板冷卻輥 48a，4 8b的表面挾入，使膜13與元件玻璃基板1被冷卻。 在層積機構部1 9 (圖1 0 )，例如，在1 〇(TC使薄片狀 密封材5加熱壓接於元件玻璃基板1的密封區域4 0的場合， 薄片狀密封材5黏接於元件玻璃基板1的密封區域40，但是 此外，在此時，此薄片狀密封材5與膜13之基底膜13b之黏 接性也變高，若不冷卻而欲剝離基底膜1 3a的話，薄片狀 密封材5會有在附著於基底膜13b的狀態下由元件剝離基板 1之密封區域40剝離的可能性。 此處，以基板冷卻機構部20使膜13之薄片狀密封材5 在被加熱壓接的狀態使元件玻璃基板1例如冷卻至40 °C程 度，藉以增加薄片狀密封材5之對元件玻璃基板1之黏接性 ，而薄片狀密封材5變得容易由膜1 3之基底膜1 3b剝離。 以基板冷卻機構部20冷卻的此元件玻璃基板1，被搬 送至基底膜捲取機構部2 1，藉由該基底膜剝離輥49，使元 -30- 201044519 件玻璃基板1之密封區域40上被貼合薄片狀密封材5的各個 膜13之基底膜13b被剝離。由分別的膜13剝離的基底膜13b ，分別藉由以驅動馬達21a、21b旋轉驅動的捲取輥50a〜 5 〇d而被捲取。這些捲取輥50a〜5 0d也被設有扭矩限制器 51防止基底膜13b之偏斜的產生。 被除去基底膜13b的元件玻璃基板1，此處變成分離開 者，分別藉由藉著基板搬送馬達52旋轉驅動的基板搬送用 0 輥46而被搬送，由處理室8內被搬出至後室11 (圖5)。 又，在此實施型態，4條特定寬幅之膜1 3係隔著特定 的間隔被使用的’但本發明並不以此爲限，係使用複數條 膜13者。 【圖式簡單說明】 圖1係顯示根據本發明之基板表面的密封裝置與有機 EL面板之製造方法之一實施型態之槪略構成之圖。 〇 圖2係顯示藉由本發明製造之有機EL面板之一具體例 之槪略構成圖。 圖3係顯示根據本發明之基板表面的密封裝置與有機 EL面板之製造方法之槪略說明圖。 圖4係顯示圖1之膜的構成之部分剖面圖。 圖5係顯示圖1之密封材貼合裝置8之一具體例之全體 構成之立體圖。 圖6係擴大顯示圖5之膜捲出機構部與覆蓋膜捲取機構 . 部之構成圖。 -31 · 201044519 圖7係擴大顯示圖5之基板間處理機構部之構成圖。 圖8係說明在圖7之基板間處理機構部形成之薄片狀密 封材間隔部之圖。 圖9係顯示在圖7之剝取裝置由膜剝取薄片狀密封材間 隔部之密封材膜的動作之圖。 圖10係擴大顯示圖5之層積機構部之構成圖。 圖11係擴大顯示圖5之基板冷卻機構部與基底膜捲取 機構部之構成圖。 【主要元件符號說明】 1 :元件玻璃基板 5 :薄片狀密封材 5’ ：密封材膜 8 ’·密封材貼合裝置 9 :處理室 I 0 :前室 II :後室 1 2 a〜1 2 d :閘閥 ":膜（f i 1 m ) 13a :覆蓋膜 13b :基底膜 1 4 :膜捲出機構部 15:覆蓋膜捲取機構部 1 6 :基板間處理機構部 -32- 201044519 1 7 :膜張力測定機構部 1 8 :對準機構部 1 9 :層積機構部 20 :基板冷卻機構部 2 1 :基底膜捲取機構部 22 :剝取裝置 24a 〜24d:膜輕（roll) 0 30a〜30d :覆蓋膜捲取輥 3 1 :覆蓋膜剝除輥 33a,33b :膜按壓構件 34 :半切（half-cut )構件 34a，34b :半切用圓刃 35 :剝離輥（roller ) 3 6 :剝離帶 39a,39b ：垂下輥 〇 40 :密封區域薄片狀密封材間隔部 41a，41b :切入 42 :薄片狀密封材間隔部 43 :附寬幅方向調整用導引之輥 45a,45b :熱壓接用輥 48a,48b :基板冷卻輥 49 :基底膜剝離輥 5 0a〜5 0d :捲取輥 -33-The performance of panel 7 (Fig. 3) is degraded. H is also attached to the processing chamber 9, and the front chamber 1 〇' is provided on the inlet side thereof, and the rear chamber 1 is provided on the outlet side thereof. When the component glass substrate 1 from the previous step is carried into the anterior chamber 1 处于 in the atmospheric state, 'After the gate valves 1 2a, 1 2b are closed, the atmosphere in the front chamber 10 is brought to the same atmosphere as in the processing chamber 9, and then the gate valve 12b is opened and moved into the processing chamber 9 to close the gate valve 12b again. After the atmosphere 11 is in the same atmosphere state as in the processing chamber 9, the gate valve 1 2C is opened, and the component glass substrate 1 to which the sheet-like sealing material 5 is attached in the processing chamber 9 is carried out into the rear chamber 11', and then closed. The gate valve U 1 2 c causes the inside of the rear chamber 1 1 to be in an atmospheric state. The gate valve 1 2 d is opened to the outside. Therefore, the inside of the processing chamber 9 can be maintained in an atmosphere of decompression or inert gas, which can be shortened as much as possible. The operation time of the vacuum pump or the like in the related atmosphere, and the front chamber 1 and the rear chamber 1 1 ' can carry out the loading or unloading of the component glass substrate 1, and the capacity can be opened and closed by the gate valve 123, 121? And processing The volume in the chamber 9 can be as long as the volume required to change from the atmospheric state to the decompressed or inert gas atmosphere, or the opposite, as long as it is a sufficiently small volume of 1/5 to 1/1 〇. The time required for the state change -18-201044519 can be significantly shortened compared to the time required for the state in which the processing chamber 9 is related, and the sheet-like sealing material for each of the component glass substrates can be greatly obtained. The fittings of the work. Further, although not shown, the processing chamber 9, the front chamber 10, and the rear chamber 1 1 are provided in an atmosphere in which the surrounding air is held in dry air or an inert gas. 5 is a perspective view showing a configuration of a specific example of the sealing material laminating device 8 of FIG. 1, 14a to 14c, 15a, 15b, 16a, 16b, 19a, 2 1a, 2 lb drive motor, 22 stripping The device 23 is the same as the portion of the position detection corresponding to FIG. 1 and the same reference numerals will be given thereto, and the overlapping description will be omitted. In the figure, the four films 13 are driven by the drive motors 14a to 14c to drive the take-up mechanism portion 14 to be parallel to each other at the same specific interval. The conveying direction, as indicated by the arrow (-), is parallel to the conveying direction of the component glass base and opposite to the conveying direction. Further, the transport of the crucible 13 is carried out by the film unwinding mechanism portion 14 to feed the film 13 of the film 13 (Fig. 4) to the cover film driven by the drive motor 15: The take-up mechanism portion 15 is taken up, and the base 13b (Fig. 4) of these films 13 is taken up by the base film bobbin portion 21 driven by the drive motors 21a, 21b. Further, these films 13 are transported intermittently as shown in Fig. 8 by carrying in the element glass substrate 1 from the front chamber 1 as described later. The cover film take-up mechanism unit 15 strips the cover film 13a (Fig. 4) and the film 13 is interposed between the inter-substrate processing mechanism unit 1 6 as described above. All of the 20, a, film transport η of some of the film, .. 1 5b base film take-off machine synchronous size of the stripping -19-201044519 of the sheet-like sealing material 5 is distinguished by one component glass substrate' The sheet-like sealing material 5 of a specific length is stripped in such a manner as to become the boundary of these divisions. The associated stripping is performed by the stripping device 22 driven by the drive motors 16a, 16b. The film 1 3 ' treated by the inter-substrate processing mechanism portion 16 is changed in the direction in which the film tension measuring mechanism portion 1*7 is conveyed downward (i.e., the conveying path of the element glass substrate 1). At this time, 'the combined tension of the film 13 is measured by the film tension measuring mechanism unit 1'. The drive motors 14a to 14c of the film take-up mechanism unit 14 are controlled by the measurement results, thereby adjusting the film 13 tension. The film 13 from the film tension measuring mechanism unit 17 is sent to the alignment mechanism unit 18, and in the laminating mechanism unit 19, the sheet-like sealing material 5 of the film 13 and the sheet-like sealing material 5 of the one element glass substrate 1 are used. In the manner in which the positions to be bonded are the same, the alignment mechanism unit 18 adjusts the position in the width direction and the longitudinal direction (transport direction) of the film 13 based on the detection result of the position detector 23 constituted by the CCD camera or the like. This position adjustment is such that the component glass substrate 1 carried in from the front chamber 1 〇 (FIG. 1) is stopped at a specific position before the lamination mechanism portion 19, but for the component glass substrate 1 stopped at this position, in the film 1 In the case where the front end position of the sheet-like sealing material 5 of 3 is a specific position, the film 13 is moved in the width direction and the longitudinal direction, and the setting is performed. When the positional relationship between the element glass substrate 1 and the sheet-like sealing material 5 bonded to the element glass substrate i in the film 13 is set to a specific positional relationship as described above, the alignment mechanism unit 18 is set to be detectable. By bonding the position of the front end position of the sheet-like sealing material 5 of the next-component glass substrate 1, by adjusting the position of the front head -20-201044519, the component glass substrate 1 stopped at a specific position can be bonded to The positional relationship of the sheet-like sealing material 5 is set to the aforementioned specific positional relationship. When the positional relationship between the element glass substrate 1 and the sheet-like sealing material 5 of the film 13 bonded thereto is set as described above, the glass substrate 1 and the film 13 are in a stopped state for a specific time. In the inter-substrate processing mechanism portion 16, the stripping portion of the sealing material film 5' of the film 13 which becomes the boundary of the next division is located at this position, and this portion is separated by the stripping device 22 of the inter-substrate processing mechanism portion 16. Stripped. Thereby, the next sheet-like sealing material 5 is formed. Then, the film 13 is transported at the same speed as the element glass substrate 1, and is fed to the laminating mechanism portion 19 that is operated by the drive motor 19a, and the sheet-like sealing material 5 of the film 13 is bonded by thermocompression bonding. This component glass substrate 1 is used. This thermocompression bonding is performed by continuously moving the sheet-like sealing material 5 of the film 13 and the element glass substrate 1, and at the same time, the next element glass substrate 1 is carried in from the front chamber 10, as described above, and stopped. In a specific location. In the same manner, the element glass substrate 1 to which the sheet-like sealing material 5 is bonded to the film 13 of the laminating mechanism portion 19 is also stopped, and the film 1 of the next-component glass substrate 1 is performed by the alignment mechanism portion 18. The positional adjustment of the sheet-like sealing material 5 of 3 or the formation of the sheet-like sealing material 5 of the next processing unit portion 16 is performed, and bonding of the sheet-like sealing material 5 of the next element glass substrate 1 is performed. In this way, the component glass substrate 1 sequentially transferred from the front chamber 10 is sequentially bonded to the sheet-like sealing material 5. The element glass substrate 1 to which the sheet-like sealing material 5 of the film 13 is bonded is cooled by the substrate cooling mechanism unit 20 driven by the driving motor 20 a, and driven by the driving motors 21a, 21b by -21 to 4044519. The base film take-up mechanism unit 21 peels off the base film 13 of the film 13 and transports it to the component glass substrate 1 to which the sheet-like sealing material 5 is attached, and transports it to the rear chamber 1 1 . However, the film 13 and the element glass substrate 1 intermittently move in the size 1 shown in Fig. 8 in accordance with the intermittent operation described above. Further, the sealing material bonding apparatus 8 that performs the above operation is provided in the processing chamber 9, but the driving motor of each of the driving motors 14a to 14c of the film winding mechanism unit 14 is attached to the processing chamber 9. Outside. Fig. 6 is a view showing an enlarged configuration of the film unwinding mechanism portion 14 and the cover film take-up mechanism portion 15 of Fig. 5, 24a to 24d are film rolls, 25a to 25d are rotating shafts, 26 is a torque limiter, and 27 is a film tension. The additional roller, 28 is a pinch roller, 29a, 29b is a drive motor, 30a to 30d are cover film take-up rolls, 31 is a cover film peeling roll, and 32 torque limiter, and the same reference numerals are given to the portions corresponding to those in FIG. Repeat the instructions. In the drawing, the film winding mechanism unit 14 is mounted on the rotating shaft 25a of the drive motor 14a, and the two films 13 are wound into roll-shaped film rolls 24b and 24d so as to be mounted at a predetermined interval. In the rotating shaft 25b of 14b, two film 13 are wound into a roll-shaped film roll 2 4 a, and 2 4 c is attached at a predetermined interval. The film 13 is fed out from the film rolls 24a to 24d. However, the film 13 sent from the film roll 24a and the film 13 sent from the film roll 24b and the film 13 sent from the film roll 24c and the film 13 sent from the film roll 24d are respectively This order is placed on the rotation shafts 25a and 25b, respectively, so as to be the specific intervals described above. These film rolls 24a to 24d can be respectively removed by the rotating shafts 25a, 25b, and when the film rolls 24a to 24d are almost completely fed out, the new film rolls 22 - 201044519 can be replaced with the rotating shaft 25c of the drive motor 14c. A film tension addition roller 27 is provided which abuts the films from the film rolls 24a, 24b, 2 4 c, and 24 d, respectively. Further, in each of the film tension applying rollers 27, four pinch rollers 28 are provided on the rotating shaft 25d so as to sandwich the film 13 abutting against the film tension applying rollers 27. When the drive motors 14a to 14c are rotated, the film 13 is fed downward by the film rolls 24a to 24d, and the film 13 is moved by the film tension applying roller 27 and the pinch roller 28 by a specific tension. At this time, the respective film 13 which is moved downward from the film rolls 24a to 24d by the film tension applying roller 27 is switched in the horizontal direction. Here, the film rolls 24a to 24d are rotatably attached to the rotating shafts 25a, 25b, respectively, and the torque limiters 26 are provided in the mounting portions. By the torque limiters 26, the film rolls 24a to 24d rotate the film 13 together with the rotation of the rotating shafts 25a and 25b, respectively, but at the same time, the film rolls 24a to 24d rotate the rotating shafts 25a and 25b to form a film. 13 to adjust the tension of the delivery. In this manner, the four films 13 fed from the film take-up mechanism unit 14 are sent to the cover film take-up mechanism unit 15. The cover film take-up mechanism unit 15 is attached to the rotary shaft 29a of the drive motor 15a, and the two cover film take-up rolls 30b and 30d are attached at a predetermined interval, and are covered by the rotation shaft 29b of the drive motor 15b. The film take-up rolls 30a, 30c are attached at specific intervals. Further, on the rotating shaft 29c, the four cover film peeling rolls 3 1 ' are attached so as to abut against the respective films 13 fed by the film unwinding mechanism unit 丨4. The cover film 13a from which the cover film stripping roller 31 is peeled off from the film 13 by the film 13 is taken up by the cover film take-up -23-201044519 rolls 30a to 30d, respectively. These cover film peeling rolls 31 can be taken out by the rotating shafts 29a, 29b, respectively, and the cover film peeling rolls 3 are replaced when the film rolls 24a to 24d of the film take-up mechanism portion are almost completely fed out to replace the new film rolls. 1 is also removed from the rotary shafts 29a, 29b, respectively. A new cover film peeling roller 31 that unwinds the cover film 13a is attached to the rotary shafts 29a, 29b, respectively, and the operator is new from the film take-up mechanism portion 14. The film rolls 24a to 24d are respectively pulled out of the film 13, and after the cover film 13a is peeled off and attached to the cover film peeling roll 31, these cover films 13a are wound around the cover film take-up rolls 30a to 30d. Further, the cover film take-up rolls 30a to 30d are rotatably attached to the rotary shafts 29a, 29b, respectively, and the torque limiters 32 are respectively provided at the attachment portions. The cover film take-up rolls 30a to 30d are rotated together with the rotation of the rotary shafts 29a, 29b, respectively, and the cover film 13a is taken up, and the tension is applied by the torque limiter 32. In this manner, the four films 13 of the cover film 13 3 are peeled off by the cover film stripping roller 31, and are sent to the inter-substrate processing mechanism portion 16 in parallel at predetermined intervals (Fig. 7). . In addition, the tension measurement result of the film tension measuring mechanism unit 17 described in FIG. 5 is sent to the film unwinding mechanism unit 14 to adjust the rotational torque of the drive motors 14a to 14c, and is also sent to the cover film winding. The mechanism unit 15 adjusts the rotational torque of the drive motors 15a and 15b. Fig. 7 is a plan view showing the structure of the inter-substrate processing mechanism unit 16 of Fig. 5, 33a, 33b being a film pressing member, 34 being a half-cut member, 35 being a peeling roller, 36 being a peeling tape, and 37 being a tape feeding roller. 38 is a take-up roll, -24-201044519' 39a, 39b is a down roll, and the same reference numerals are given to the portions corresponding to those in Fig. 5, and overlapping description will be omitted. In the figure, in the inter-substrate processing mechanism unit 16, when the film 13 is fed by the cover film take-up mechanism unit 15 (Fig. 6) to a specific length (film feed length), the film 13 is stopped by the film 13 The two film pressing members 33a, 3bb extending in the direction parallel to the direction in which the straight films 13 are arranged are simultaneously pressed into the flat portions (not shown). Thereby, the portions between the film pressing members 33a, 33b Q of these films 13 are fixed. The pressing portions of the film 13 according to the film pressing members 33a, 33b are acted upon by the stripping means 22, and as described above, the sealing film 5' of the region of the sheet-like sealing member 5 is peeled off. Here, when the stripping portion of the sealing material film 5' of the film 13 is determined in synchronization with the loading of the element glass substrate 1 from the front chamber 1 (Fig. 5), the sealing film 5' in the film 13 The interval of the stripping portions and the length thereof (the length of the moving direction of the film 13) are determined in the following manner. That is, in FIG. 8, the length 〇 of the component glass substrate 1 in the transport direction is L, and the length of the component glass substrate 1 in the transport direction of the sealing region 40 covered by the sheet-like sealing material 5 of the component glass substrate 1 is L', and when the interval between the element glass substrates 1 carried in the front chamber 1 is D, the interval d between the sealing regions 40 of the two element glass substrates 1 is d = L - L' + D. This interval d is the length of the stripped portion of the seal film 5' of the film 13. That is, the pressing members 33a, 33b fix the film 13 in such a manner as to be next to the stripping portion. Further, the length of the repetitive portion of the stripping portion (i.e., the film feeding length of the film 13) 1 is l = L' + d = L + D ′ becomes the repetitive length of the loading of the element glass substrate. Referring back to Fig. 7, the stripping device 2 2 ' has a half-cut member 34 and a peeling strip 3 6 -25- 201044519 and a peeling roller 35. The half-cut member 34 can be moved in the direction of the arrow A or the direction of the arrow B opposite thereto by a driving means (not shown), and the peeling roller 35 or the hanging rollers 39a, 3 9b are also not shown. The driving means can be moved in the directions of arrows A and B. The peeling roller 35 moves together with the movement of the hanging rollers 39a, 39b, and is also movable in the vertical direction. In other words, although not shown, for example, a means for arranging the half-cut member 34 and the peeling roller 35 and the hanging rollers 3 9a, 39b to move in the directions of arrows A and B is provided, and this means is provided with a rotary drive. The driving means of the half-cut member 34 is further provided with the peeling roller 35 being movable up and down in this means. Here, the half-cut member 34 is moved in the direction of the arrow A by the winding roller 38 side, and is cut at the front and rear sides of the stripping portion of the length d (Fig. 8) of the sealing film 5' of the film 13, and is half cut. The member 34 is then pressed against the release tape 36 of the film 13 by the peeling roller 35 which is also moved in the direction of the arrow A, so that the portion between the half-cut members 34 of the sealing film 5' of the film I3 is peeled off by the film 13. The release tape 36 is attached between the delivery roller 37 and the take-up roller 38, and hangs downward between the two vertical rollers 39a and 39b, and is pressed against the film 13 by the peeling roller 35. In this way, when the portion of the sheet-like sealing material 5 of the four films 13 is spaced (that is, the sheet-like sealing material spacer 42 shown in Fig. 9) is formed, by driving the driving motor 16b, The take-up roller 38 rotates to take up the peeling tape 36. At this time, the drive motor 16a is not driven, and the delivery roller 37 does not feed the peeling belt 36. Therefore, 'between the lower rollers 39a, 39b, the peeling belt 36 is moved to the winding roller 38 side', the peeling roller 35 is lifted off the film 13 and then the driving motor 16 a is activated by the feeding roller 3 7 ' The peeling tape 36 is fed at the same speed as the take-up speed of the take-up roll 36 of the take-up roll 38, -26-201044519. Further, 'at the same time' is moved in the direction of the arrow B by means of the half-cut member 34 and the peeling roller 35 and the lowering rollers 39a, 39b, the half-cut member 34 and the peeling roller 35 and the hanging roller 3 9 a, 3 9b, Until the film 13 is closer to the winding roller 38 side, it continues to move in the direction of the arrow B. Then, the film pressing members 33a, 33b are lifted up and the film 13 is released in a fixed state, and when only the length 1 is moved in the direction of the arrow C, the film pressing members 033a, 33b are lowered again to fix the film 13, as described above. The next sheet-like seal material spacer 42 is formed by the stripping device 22 (Fig. 9). By repeating the above operations, the sealing regions 40 are sequentially formed by the above-described reverse length 1, and the sheet-like sealing members 5 are sequentially formed in each of them. FIG. 9 is a peeling device 22 shown in FIG. 3: The operation of peeling off the sealing material film 5' of the sheet-like sealing material partition portion, 34a, 34b are half-cut circular blades, 34c is a rotating shaft, 41a, 41b are cut-in, and 42 is a sheet-shaped sealing material spacer. In the figure, the half-cut member 34 is attached to the both ends of the rotating shaft 34c disposed parallel to the moving direction of the film 13 indicated by the arrow C, and is mounted with a half-cutting edge at intervals equal to the length d shown in FIG. 34a, 34b. The half-cut member 34 of the related configuration is rotationally driven by a drive motor (not shown) by the rotation shaft 34c, and the half-cutting circular blades 34a, 34b are rotated while moving in the conveying direction of the film 13 indicated by the arrow C (long side) Direction) The direction of the arrow A which is orthogonal, by which the sealing film 5' of the film 13 forms a cut 41a, 41b which is equal to the depth of its thickness. -27- 201044519 On the other hand, the peeling roller 35, from the rear surface of the half-cut member 34, causes the peeling tape 36 to be formed between the cut-in 41b by the half-cutting of the sealing film 5' of the film 13 by the rounded edges 34a, 34b. Partially pressing and moving in the direction of the arrow A, the portion of the sealing material film 5' cut into the 4 1 a, 4 1 b is adhered to the peeling tape 36 and peeled off. Thereby, the sheet-like sealing material spacer 42' is formed into a sheet-like sealing material 5 having a length L' (Fig. 8) than a portion of the sealing material film 5 which is further forward of the sheet-like sealing material spacer 42. In this manner, the interlaminar processing mechanism portion 16' is formed on the film 13 by a length L, and the sheet upper sealing members 5 are sequentially formed at intervals of the length d. Fig. 1 shows an enlarged view showing a configuration of a stacking mechanism unit 19 of Fig. 5', 19b, 19c, a drive motor, 43 for a wide-width direction guide roller, and 44a to 44d, for a wide-width adjustment motor. 45a and 45b are the thermocompression bonding rolls '46 as the substrate conveying rollers, and 47 is the conveying direction changing roller, and the same reference numerals are given to the portions corresponding to those in Fig. 5, and the overlapping description will be omitted. In the figure, the film 13 conveyed in the downward direction indicated by the arrow D by the film tension measuring mechanism unit 17 (Fig. 5) in the laminating mechanism unit 19 is converted into a path along the transport direction changing roller 47. In the direction of the transport direction indicated by the arrow E of the element glass substrate 1. These films 13' in the changed direction are conveyed between the thermocompression rolls 45a, 45b. By the change of the direction, the sheet-like sealing material 5 is placed on the element glass substrate 1 side of the film 13. Before the conveyance direction changing roller 47, the wide-width adjustment guiding roller 43 which is driven by the wide-direction adjustment motors 44a to 44d is provided in each film. These wide-width-adjusting guide rollers 43 are respectively provided with crotch portions (not shown) at both end portions in the width direction, and the film 13 passes between the two crotch portions. -28- 201044519 These wide-width adjustment motors 44a to 44d and the wide-direction adjustment light 43 are means for adjusting the width direction of the alignment mechanism portion 18 of Fig. 5 . Further, between the conveyance direction changing roller 47 and the thermocompression bonding rolls 45a and 45b, a position detector 23 is provided in each film 13 (but only one is shown here), and the respective widths of the film 13 are detected. The position of the web is offset. In response to the detection result, the wide-direction adjustment motor 44 (the collective name of the wide-width adjustment motors 0 to 44a to 44d) of the film 13 that is displaced in position among the wide-direction adjustment motors 44a to 44d is used. The guide roller 43 for wide-width direction adjustment is rotated in a specific direction to adjust the positional deviation of the film 13 in the width direction. As described above, the positional relationship of the sheet-like sealing material 5 of the film 13 of the element glass substrate 1 stopped by the front chamber 10 (Fig. 5) is caused by the alignment mechanism portion 18 (Fig. 5). When the film is set to a specific relationship, the film 13 is conveyed, and the component glass substrate 1 is conveyed by the substrate conveyance roller 46 at the same speed as this, and the sealing region 40 (Fig. 8) of the component glass substrate 1 is overlapped. 1 3 sheet-like sealing material 5. Then, in the related state, the element glass substrate 1 and the film 13 are interposed between the thermocompression bonding rolls 45a, 45b which are rotationally driven by the driving motors 19b, 19c, and are further heated by the elements. The sealing region 40 of the glass substrate 1 is thermocompression bonded to the sheet-like sealing material 5 of the respective film 13. In this manner, the element glass substrate 1 and the film 13 which is thermally pressure-bonded to the sheet-like sealing material 5 in the sealing region 40 are transported to the subsequent cooling step by the substrate transfer roller 46. Fig. 11 is a view showing an enlarged configuration of the substrate cooling mechanism portion 20 and the base film take-up mechanism portion 21 of Fig. 5, 48a, 48b being a substrate cooling roller, 49 being a substrate -29 - 201044519, a film peeling roller, 50a to 50d The winding roller, 51 is a torque limiter, and 52 is a substrate conveyance motor. The same reference numerals are given to the portions corresponding to those in FIG. 5 and FIG. 10, and the overlapping description will be omitted. In the figure, in the substrate cooling mechanism unit 20, the substrate cooling rollers 48a and 48b which are rotationally driven by the drive motor 20a are provided in pairs, and the cooling roller unit is provided with two sets of respective cooling roller portions to be attached to the film 13 The element glass substrate 1 of the sheet-like sealing material 5 is carried by being held by the substrate cooling rolls 48a, 48b. Then, the substrate cooling rolls 48a, 48b are made of a steel, and a cooling means is provided inside the substrate cooling rolls 48a, 48b by introducing and discharging cooling water inside. The film 13 and the element glass substrate 1 are cooled by the surface of the substrate cooling rolls 48a, 48b cooled by the cooling means. In the case where the laminating mechanism portion 19 (Fig. 10) is, for example, 1 〇 (TC causes the sheet-like sealing material 5 to be heat-pressure-bonded to the sealing region 40 of the element glass substrate 1, the sheet-like sealing material 5 is adhered to In the sealing region 40 of the element glass substrate 1, the adhesiveness of the sheet-like sealing material 5 and the base film 13b of the film 13 is also high at this time, and if the base film 13a is to be peeled off without cooling, the sheet The sealing material 5 may be peeled off by the sealing region 40 of the component peeling substrate 1 in a state of being adhered to the base film 13b. Here, the sheet-like sealing material 5 of the film 13 is heated by the substrate cooling mechanism portion 20. The state of the pressure bonding causes the component glass substrate 1 to be cooled, for example, to about 40 ° C, thereby increasing the adhesion of the sheet-like sealing material 5 to the component glass substrate 1, and the sheet-like sealing material 5 becomes easily formed by the substrate of the film 13. The film 13b is peeled off. The element glass substrate 1 cooled by the substrate cooling mechanism unit 20 is transferred to the base film take-up mechanism unit 2, and the base film peeling roller 49 is used to make the glass substrate 1 of -30-201044519. Each film 13 of the sheet-like sealing material 5 is bonded to the sealing region 40 The base film 13b is peeled off. The base film 13b peeled off from the respective films 13 is taken up by the take-up rolls 50a to 5d, which are rotationally driven by the drive motors 21a, 21b, respectively. These take-up rolls 50a to 5 0d is also provided with a torque limiter 51 to prevent the deflection of the base film 13b. The component glass substrate 1 from which the base film 13b is removed, which is separated here, is driven by the substrate transport motor 52. The conveyance is carried out by the 0-roller 46, and is carried out from the processing chamber 8 to the rear chamber 11 (Fig. 5). Further, in this embodiment, four specific wide-width films 13 are used at specific intervals. However, the present invention is not limited thereto, and a plurality of strip films 13 are used. [Schematic Description of the Drawings] Fig. 1 is a view showing a method of manufacturing a sealing device for a substrate surface and an organic EL panel according to the present invention. Figure 2 is a schematic view showing a specific example of an organic EL panel manufactured by the present invention. Fig. 3 is a view showing the manufacture of a sealing device and an organic EL panel on the surface of a substrate according to the present invention. A schematic diagram of the method. Figure 4 shows Fig. 5 is a perspective view showing the overall configuration of a specific example of the sealing material laminating device 8 of Fig. 1. Fig. 6 is an enlarged view showing the film unwinding mechanism portion and the cover film roll of Fig. 5. Fig. 7 is an enlarged view showing the configuration of the inter-substrate processing mechanism unit of Fig. 5. Fig. 8 is a view showing the sheet-like sealing material spacer formed by the inter-substrate processing mechanism unit of Fig. 7. Fig. 9 is a view showing an operation of peeling off the sealing material film of the sheet-like sealing material partition portion by the peeling device of Fig. 7. Fig. 10 is a view showing an enlarged configuration of the laminating mechanism portion of Fig. 5. Fig. 11 is a view showing the configuration of the substrate cooling mechanism portion and the base film take-up mechanism portion of Fig. 5 in an enlarged manner. [Description of main component symbols] 1 : Component glass substrate 5 : Sheet-like sealing material 5 ′ : Sealing material film 8 '· Sealing material bonding device 9 : Processing chamber I 0 : Front chamber II : Rear chamber 1 2 a to 1 2 d: gate valve ": film (fi 1 m ) 13a : cover film 13b : base film 14 : film unwinding mechanism portion 15 : cover film take-up mechanism portion 1 6 : inter-substrate processing mechanism portion - 32 - 201044519 1 7 : Membrane tension measuring mechanism unit 18 : Aligning mechanism portion 1 9 : Laminating mechanism portion 20 : Substrate cooling mechanism portion 2 1 : Base film winding mechanism portion 22 : Stripping device 24a to 24d: film roll 0 30a to 30d: cover film take-up roll 3 1 : cover film peeling roll 33a, 33b: film press member 34: half-cut member 34a, 34b: half-cut round blade 35: peeling roll (roller) 3 6 : peeling tape 39a, 39b: hanging roller 〇 40: sealing region sheet-like sealing material partitioning portion 41a, 41b: cutting 42: sheet-like sealing material spacer portion 43: wide-width direction guiding roller 45a, 45b: heat Pressure-bonding rollers 48a, 48b: substrate cooling roller 49: base film peeling roller 5 0a to 5 0d: take-up roller - 33-

Claims (1)

201044519 七、申請專利範圍： 1·一種基板表面之密封裝置，其特徵爲 具備··內藏將薄片狀密封材貼附於基板上的膜貼合裝 置之處理室、供對該處理室搬入該基板之用的比該處理室 容積更小的前室、及以該膜貼合裝置使該薄片狀密封材被 貼附的該基板由該處理室內排出之比該處理室容積更小的 後室； 在該前室之基板搬入口側與處理室側、及該後室之處 理室側與基板排出口側分別設置閘閥，同時該處理室內， 包含基板被搬入、排出時，總是被保持於高真空狀態， 該膜貼合裝置，係由： 使由該前室搬入的該基板以特定的間隔搬送的基板搬 送手段、 挾著薄片狀密封材使被設置覆蓋膜與基底膜的特定寬 幅的膜捲出複數條之膜捲出機構部、 由從該膜捲出機構部捲出的該複數條之分別的膜剝離 該覆蓋膜而捲取的覆蓋膜捲取機構部、 由從以該覆蓋膜捲取機構部剝取該覆蓋膜後的該複數 條之各個膜，剝取以該基板搬送手段搬送的該基板之成爲 間隔的該密封狀密封材之部分，該複數條之各個膜之在該 基底膜上形成對應於分別之該基板的複數之該密封狀密封 材之基板間處理機構部' ( 於藉由該基板搬送手段由該前室搬入的各該基板，進 行決定該基板之先端部與來自該基板間處理機構部之該膜 -34- 201044519 ' 的對應於該基板的該密封狀密封材的先端的定位之對準機 構部、 於以該基板搬送手段搬送的該基板，貼附來自該對準 機構部的該複數條膜之對應於該基板的複數之該密封狀密 封材之貼附機構部、及 由來自該貼附機構部之該基板被貼附該薄片狀密封材 的該複數條之各個膜剝除、捲取該基底膜之基底膜捲取機 Q 構部 所構成， 該基板搬送手段，以該基底膜捲取機構部把該複數條 膜之該基底膜被剝取的複數薄片狀密封材被貼附的狀態之 該基板排出至該後室。 2 .如申請專利範圍第1項之基板表面之密封裝置，其 中 於前述前室與前述後室，具有使室內由乾空氣狀態成 〇 爲與前述處理室內相等的高真空狀態之用的真空栗。 3.如申請專利範圍第1或2項之基板表面之密封裝置， 其中 前述基板處理機構部，係由 搭載前述複數膜之表面被處理爲非黏接性之桌、 使前述複數膜在其長度方向之特定的間隔被按壓於該 桌的表面之一對按壓板、 使以前述複數之膜之該一對按壓板按壓於該桌的表面 的部分之間之前述薄片狀密封材，在其長度方向上以前述 -35- 201044519 基板之間隔進行切割之半切用圓刃、及 前述複數之膜之以該半切用圓刃切割的部分之前述薄 片狀密封材由前述基底膜剝離之膠帶剝離機構 所構成。 4. 如申請專利範圍第1、2或3項之基板表面之密封裝 置，其中 於前述貼附機構部與前述基底膜捲取機構部之間’設 有冷卻前述基板之基板冷卻機構部。 0 5. —種有機電致發光（EL)面板之製造方法，其特徵 係由以下步驟所構成： 打開被設於容積小的前室的基板搬入口之第1閘閥， 把密封劑被塗布爲框狀而於該密封劑之框之內側設有複數 之EL (電致發光）元件之基板，搬入該前室內之搬入步驟 > 該基板由該基板搬入口搬入至該前室，同時關閉該第 1閘閥，使該前室內成爲高真空狀態之真空化步驟、 υ 打開設於成爲高真空狀態的該前室與被保持於高真空 狀態之容積大的處理室之間的第2閘閥，由該前室將該基 板搬送至該處理室內’在該基板之往該處理室搬送後，關 閉該第2閘閥的搬送步驟、 在該處理室內，對該基板之該密封劑之框內貼附薄片 狀密封材之密封材貼附步驟、 使容積小的後室內成爲高真空狀態，打開設於該處理 室與該後室之間的第3閘閥，使被貼附該薄片狀密封材的 -36- 201044519 該基板由該處理室搬送至該後室的搬送步驟、 關閉被設於該後室的基板排出口之第3閘閥，打開第4 閘閥使該後室內爲大氣狀態，將該後室內之被貼附該薄片 狀密封材之該基板由該基板排出口排出之排出步驟； 該密封材貼附步驟係由以下步驟所構成： 使由該前室搬入的該基板以特定的間隔依序搬送的步 驟、 捲出複數條夾著該薄片狀密封材被設置覆蓋膜與基底 膜的特定寬幅的膜之步驟、 由被捲出的該複數條之膜分別剝離捲取該覆蓋膜之步 驟、 由被剝取該覆蓋膜的該複數條膜之各個’剝取成爲被 搬送的該基板之間隔的該密封狀密封材的部分’在該複數 條膜之各個之該基底膜上形成分別對應於該基板之複數之 該密封狀密封材之步驟、 於由該目U室搬入的各該基板’進丫了該基板之先_部與 該膜之對應於該基板的該密封狀密封材的先端之定位之步 驟、 於被搬送之該基板貼附該複數條之膜之對應於該基板 之該複數密封狀密封材的步驟、 冷卻被貼附該複數之密封狀密封材的該基板之步驟、 由被冷卻之該基板上被貼附該薄片狀密封材的該複數 條膜之各個剝取捲取該基底膜之步驟、及 使該薄片狀密封材被貼附之該基板排出至該後室之步 驟。 -37-201044519 VII. Patent application scope: 1. A sealing device for a substrate surface, comprising: a processing chamber for a film bonding device for attaching a sheet-like sealing material to a substrate, for carrying the processing chamber into the processing chamber a front chamber having a smaller volume than the processing chamber for the substrate, and a back chamber having a smaller volume than the processing chamber discharged from the processing chamber by the film bonding apparatus to which the sheet-like sealing material is attached A gate valve is provided on each of the substrate carrying inlet side and the processing chamber side of the front chamber, and the processing chamber side of the rear chamber and the substrate discharge port side, and is always held in the processing chamber when the substrate is carried in and discharged. In the high vacuum state, the film bonding apparatus is a substrate conveying means for conveying the substrate carried by the front chamber at a specific interval, and a specific width of the cover film and the base film is set next to the sheet-like sealing material. a film unwinding mechanism portion of the plurality of strips, and a cover film take-up mechanism portion that is wound by the respective films of the plurality of strips wound from the film take-up mechanism portion and wound up cover The winding mechanism unit strips each of the plurality of films after the cover film, and strips the portion of the sealed sealing material that is interposed between the substrates conveyed by the substrate transfer means, and the respective films of the plurality of strips are An inter-substrate processing mechanism portion ′ corresponding to the plurality of sealing seal members of the respective substrates is formed on the base film (each of the substrates carried in the front chamber by the substrate transfer means determines the leading end portion of the substrate) The alignment mechanism portion of the film-34-201044519' corresponding to the substrate from the processing mechanism portion of the substrate is attached to the substrate conveyed by the substrate transfer means The plurality of strips from the alignment mechanism portion are attached to the plurality of the sealing member of the sealing member corresponding to the substrate, and the substrate from the attaching mechanism portion is attached to the sheet-like sealing member Each of the plurality of strips is formed by stripping and winding a base film reeling machine Q of the base film, and the substrate transporting means applies the base of the plurality of strips by the base film take-up mechanism The substrate in the state in which the plurality of flaky sealing materials are peeled off is discharged to the back chamber. The sealing device of the substrate surface according to claim 1, wherein the front chamber and the rear chamber have A vacuum pump for making a high-vacuum state in a state in which a dry air is equal to the above-mentioned processing chamber. 3. The sealing device for a substrate surface according to claim 1 or 2, wherein the substrate processing mechanism portion is a surface on which the surface of the plurality of films is processed to be non-adhesive, and the plurality of films are pressed against a surface of the table at a specific interval in the longitudinal direction thereof to press the plate, and the plurality of films are formed a sheet-shaped sealing material which is pressed between a pair of pressing plates and a portion of the surface of the table, and a half-cutting edge blade which is cut at intervals of the -35-201044519 substrate in the longitudinal direction thereof, and the plurality of films The half-cut portion of the sheet-like sealing material cut by the round blade is composed of the tape peeling mechanism in which the base film is peeled off. 4. The sealing device for a substrate surface according to the first, second or third aspect of the invention, wherein a substrate cooling mechanism portion for cooling the substrate is provided between the attaching mechanism portion and the base film take-up mechanism portion. A method for producing an organic electroluminescence (EL) panel, comprising the steps of: opening a first gate valve provided in a substrate carrying inlet of a small chamber having a small volume, and applying a sealant to a substrate having a plurality of EL (electroluminescence) elements disposed inside the frame of the sealant, and a step of loading into the front chamber. The substrate is carried into the front chamber by the substrate transfer inlet, and the substrate is closed. The first gate valve causes the front chamber to be in a vacuum state in a high vacuum state, and opens a second gate valve provided between the front chamber that is in a high vacuum state and the processing chamber that is held in a high vacuum state. The front chamber transports the substrate to the processing chamber. After the substrate is transferred to the processing chamber, the second gate valve is closed. In the processing chamber, a sheet is attached to the sealing agent of the substrate. a sealing material attaching step of the sealing material, a high vacuum state in a small chamber, and opening a third gate valve provided between the processing chamber and the rear chamber to attach the sheet-like sealing material to -36 - 201044519 The substrate is transported to the rear chamber by the processing chamber, the third gate valve of the substrate discharge port provided in the rear chamber is closed, the fourth gate valve is opened, and the rear chamber is in an atmospheric state, and the rear chamber is attached. a step of discharging the substrate of the sheet-like sealing material discharged from the substrate discharge port; the sealing material attaching step comprises the steps of: sequentially transporting the substrate carried in the front chamber at a specific interval; a step of rolling out a plurality of sheets of a cover film and a base film of a base film, and peeling off the film from the plurality of films which are wound up, respectively, and stripping the film Each of the plurality of strips of the cover film is stripped to a portion of the seal-like seal member that is separated by the substrate to be conveyed, and is formed on the base film of each of the plurality of strips respectively corresponding to the substrate a plurality of steps of sealing the sealing material, wherein each of the substrates carried in the U-chamber is positioned to be positioned at a front portion of the substrate and a front end of the sealing seal of the film corresponding to the substrate a step of attaching the plurality of films corresponding to the plurality of sealed sealing materials on the substrate to the substrate to be transferred, and cooling the substrate to which the plurality of sealed sealing materials are attached, and cooling the substrate The step of stripping the plurality of strips of the sheet-like sealing material to which the sheet-like sealing material is attached, and the step of discharging the substrate to which the sheet-like sealing material is attached is discharged to the back chamber. -37-
TW099103011A 2009-02-05 2010-02-02 A sealing device for a substrate surface, and a method for manufacturing the organic electroluminescent panel TWI421985B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009024948A JP5326098B2 (en) 2009-02-05 2009-02-05 Substrate surface sealing device and organic EL panel manufacturing method

Publications (2)

Publication Number Publication Date
TW201044519A true TW201044519A (en) 2010-12-16
TWI421985B TWI421985B (en) 2014-01-01

Family

ID=42542116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099103011A TWI421985B (en) 2009-02-05 2010-02-02 A sealing device for a substrate surface, and a method for manufacturing the organic electroluminescent panel

Country Status (5)

Country Link
JP (1) JP5326098B2 (en)
KR (1) KR101287360B1 (en)
CN (1) CN102326449B (en)
TW (1) TWI421985B (en)
WO (1) WO2010090223A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550328B (en) * 2011-06-29 2016-09-21 三星顯示器有限公司 Substrate sealing apparatus and method of sealing substrate using the same
TWI587555B (en) * 2013-03-29 2017-06-11 Dainippon Printing Co Ltd Component manufacturing method and component manufacturing apparatus
TWI655797B (en) * 2014-03-19 2019-04-01 日商琳得科股份有限公司 Laminated sheet for electronic component packaging and method of manufacturing electronic device

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5990745B2 (en) 2011-05-31 2016-09-14 株式会社Ｊｏｌｅｄ Manufacturing method of joined body and joined body
JP5189194B2 (en) * 2011-09-05 2013-04-24 ミカドテクノス株式会社 Vacuum heating joining apparatus and vacuum heating joining method
KR101318177B1 (en) * 2011-11-29 2013-10-16 주식회사 에스에프에이 Encapsulation apparatus for OLED pannel
KR101306609B1 (en) * 2011-11-29 2013-09-11 주식회사 에스에프에이 Plasma generator and encapsulation apparatus for OLED pannel having the same
KR101838756B1 (en) 2011-12-22 2018-03-15 엘지디스플레이 주식회사 Encapsulating method for organic electric light emission device
US9905811B2 (en) 2012-08-07 2018-02-27 Joled Inc. Production method for joined body
US9252390B2 (en) 2012-08-07 2016-02-02 Joled Inc. Production method for joined body, and joined body
JP6135062B2 (en) 2012-08-07 2017-05-31 セイコーエプソン株式会社 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE MANUFACTURING METHOD, ELECTRONIC DEVICE
JP6066054B2 (en) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 Organic EL sealing device, sealing roll film manufacturing device, and organic EL sealing system
JP6015422B2 (en) * 2012-12-21 2016-10-26 コニカミノルタ株式会社 Manufacturing method and manufacturing apparatus of organic electroluminescence panel
CN103077910A (en) * 2012-12-25 2013-05-01 王奉瑾 Dynamic isolation module for semiconductor integration and manufacture production line
CN103050417B (en) * 2012-12-25 2015-10-28 王奉瑾 For the dynamic seal (packing) module in semiconductor Integrated manufacture production line
KR102069851B1 (en) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 Delamination apparatus and inline thermal imaging system
CN108393577A (en) 2013-12-02 2018-08-14 株式会社半导体能源研究所 Display device and its manufacturing method
KR102241849B1 (en) 2014-09-24 2021-04-20 삼성디스플레이 주식회사 Apparatus for manufacturing display apparatus and method of manufacturing display apparatus
CN105984745A (en) * 2015-02-09 2016-10-05 住化电子材料科技（无锡）有限公司 Device and method for manufacturing film laminate
JP6559758B2 (en) * 2017-12-01 2019-08-14 住友化学株式会社 Manufacturing method of electronic device
CN108839352B (en) * 2018-07-03 2023-10-03 华玻视讯(珠海)科技有限公司 Multistage film laminating machine for protecting IR holes of display glass screen
KR102534660B1 (en) * 2018-07-26 2023-05-25 주식회사 좋은에너지기술 Laminating method using laminating apparatus for substrate
KR102552270B1 (en) 2018-11-22 2023-07-07 삼성디스플레이 주식회사 Peeling method for mother protective film and manufacturing method for the organic light emitting display apparatus
CN114516444B (en) * 2022-03-04 2023-11-14 江苏创源电子有限公司 Film pasting device and film pasting method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001010005A (en) * 1999-06-30 2001-01-16 Hitachi Techno Eng Co Ltd Film pasting method
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6695030B1 (en) * 2002-08-20 2004-02-24 Eastman Kodak Company Apparatus for permitting transfer of organic material from a donor web to form a layer in an OLED device
JP2004146184A (en) * 2002-10-24 2004-05-20 Konica Minolta Holdings Inc Apparatus for manufacturing organic el element
US20060145603A1 (en) * 2003-06-25 2006-07-06 Yoshio Taniguchi Organic electroluminescence element, process for fabricating the same and electrode film
CN100531485C (en) * 2003-06-25 2009-08-19 东海橡胶工业株式会社 Organic electroluminescence element, process for fabricating the same and electrode film
JP4820536B2 (en) * 2003-06-25 2011-11-24 彬雄 谷口 Method for manufacturing organic electroluminescence device
JP4417734B2 (en) * 2004-01-20 2010-02-17 株式会社アルバック In-line vacuum processing equipment
JP4111200B2 (en) * 2005-03-15 2008-07-02 株式会社日立プラントテクノロジー Film laminating method and apparatus
JP4107316B2 (en) * 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー Board bonding equipment
JP2007112073A (en) * 2005-10-24 2007-05-10 Hitachi Plant Technologies Ltd Film sticking device
JP4378711B2 (en) * 2006-03-29 2009-12-09 株式会社日立プラントテクノロジー Humidity management method and humidity management system for organic EL panel manufacturing equipment
JP2008050638A (en) * 2006-08-23 2008-03-06 Toray Advanced Film Co Ltd Method of manufacturing metallized plastic film base material, and vacuum film deposition apparatus
JPWO2008032526A1 (en) * 2006-09-15 2010-01-21 コニカミノルタホールディングス株式会社 Method for producing flexible sealing film and organic electroluminescence device using the same
WO2008102695A1 (en) * 2007-02-21 2008-08-28 Ulvac, Inc. Resin film forming device, resin film forming method, display, manufacturing device for display, and manufacturing method for display
JP4881789B2 (en) * 2007-05-16 2012-02-22 株式会社Ｈａｒｍｏｎｉｃ Ｕｎｉ−Ｂｒａｉｎ Organic electroluminescence device manufacturing method and organic electroluminescence device manufacturing apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550328B (en) * 2011-06-29 2016-09-21 三星顯示器有限公司 Substrate sealing apparatus and method of sealing substrate using the same
TWI587555B (en) * 2013-03-29 2017-06-11 Dainippon Printing Co Ltd Component manufacturing method and component manufacturing apparatus
TWI655797B (en) * 2014-03-19 2019-04-01 日商琳得科股份有限公司 Laminated sheet for electronic component packaging and method of manufacturing electronic device

Also Published As

Publication number Publication date
CN102326449B (en) 2014-06-11
JP5326098B2 (en) 2013-10-30
CN102326449A (en) 2012-01-18
WO2010090223A1 (en) 2010-08-12
JP2010182530A (en) 2010-08-19
KR20110111535A (en) 2011-10-11
TWI421985B (en) 2014-01-01
KR101287360B1 (en) 2013-07-23

Similar Documents

Publication Publication Date Title
TWI421985B (en) A sealing device for a substrate surface, and a method for manufacturing the organic electroluminescent panel
JP2018085541A (en) Peeling device
KR101628185B1 (en) Sealing apparatus for organic el, manufacturing apparatus for sealing roll film, and sealing system for organic el
JP4415126B2 (en) Laminating film laminating equipment
CN109843549B (en) Resin film pasting system for shaped panel
JP6403159B2 (en) Film vacuum laminating equipment
JP2009194064A (en) Apparatus and method for sticking adhesive film to substrate
WO2016017807A1 (en) Method for handling display cell having flexible thin film structure
KR20070055216A (en) Apparatus and method for sticking polarizer to substrate
JP2007261188A (en) Laminator
JP2010212590A (en) Laminating apparatus and laminating method of solar cell
JP2013123915A (en) Method of plastering film material and device of plastering film material
JP2983253B2 (en) Vacuum laminator
JP3546346B2 (en) Vacuum type laminator apparatus and method
JP2012133098A (en) Substrate assembling device
WO2011039894A1 (en) Liquid crystal display manufacturing apparatus and liquid crystal display manufacturing method
JP2018129383A (en) Sheet sticking device and sticking method
JP2013038290A (en) Sheet sticking device and sheet sticking method
JP5393290B2 (en) Web processing apparatus and electronic device manufacturing method
JP6269674B2 (en) Manufacturing method and manufacturing apparatus of organic electroluminescence element
JP6179058B2 (en) Optical display device production system
TW201317130A (en) Sheet manufacturing apparatus
JP3225183U (en) Support device
WO2013146265A1 (en) Method for continuously manufacturing optical display panel, continuous manufacturing system for same, exchange method, and delivery device
JP6098644B2 (en) Organic EL light emitting module manufacturing system and organic EL light emitting module manufacturing method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees