201043900 、六、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱裝置；特別是指—種管體式 路型熱管創新結構型態設計者。 【先前技術】 按，由於近年來資訊科技進展迅速，為了追求更高 能的電子裝置’相關業界均致力於半導體製程的改進， 〇於現今製程技術的高細微化程度，使得單一元件中已經 夠包含有眾多電晶體，且令元件之運作速度亦倍數增長 除此之外，為了因應現今各種電子產品輕薄短小化的發 趨勢，故内部元件之設置密度相對提高，然如此卻造成 子產品内部各封裝元件發熱密度越來越高的現象，而電 產品使用後的損壞，大部份即為溫度過高所導致；是以 如何更有效率地將電子產品内部元件所產生的熱散逸至 部，遂成為目前相關業界重要之技術課題。 Q 至於電子產品的散熱結構設計，目前常見者概分為 熱鰭片以及熱管兩種方式或其組合型式；其中所述熱管 式由於較具散熱效率，目前更是使用最普遍的散熱結構 然而，傳統延伸狀之熱管使用上，由於其工作流體 氣體係處於同一空間内且呈彼此相互逆向流動之狀態， 氣、液體二者流動時會相互干擾阻礙，造成須承受額外 阻而導致熱傳量下降、散熱效能不彰之問題與缺弊。 基於此，遂有相關業界研發出另一種迴路型散熱裝 以為因應，所述迴路型散熱裝置主要是創造一種循環導 迴 效 由 能 展 電 子 外 散 型 Ο 與 故 流 置 流 3 201043900 _. 空間，使得工作液與蒸發氣體之流動路徑能夠 -改善前述傳統熱管氣、液體相互逆向流動而徒 題點；惟查，目前習知迴路型散熱裝置之相關 雖有多筆，然綜觀而論，由於考量冷凝液回流 之效率與可行性，使得習知迴路型散熱裝置之 態，多數均採用細徑管體製成其冷凝液回流部 導流區段，以產生虹吸作用，而其冷凝部位、 採用體積空間較大的殼體或管體製成，但如此 習知迴路型散熱裝置普遍存在下述缺點： 〇 1 、因為習知迴路型散熱裝置整體必須由多數 結構體相互組接構成，使得材料、製造、 成本均相對大幅提高，而存在不易量產製 不符較佳產業經濟效益之缺點。 2 、因為組接部位眾多，導致習知迴路型散熱 空狀態的長久維持較傳統熱管更加困難， 位均存在較大的破損機率及隱憂，進而嚴 ^ 路型散熱裝置的構造堅固性與使用壽命。 3 、其細徑型態的冷凝液回流部位及蒸氣導流 侷限了熱傳導量，使得習知迴路型散熱裝 格因此頗受限制，而造成無法應用於某些 之缺憾。 是以，針對上述習知迴路型散熱裝置使用 問題點，如何研發出一種能夠更具理想實用性 ，實有待相關業界再加以思索突破之目標及方 分離，藉以 增流阻之問 前案及技術 至蒸發部位 具體結構型 位以及蒸氣 蒸發部位則 一來，使得 單獨製成的 組立等各項 造與加工、 裝置内部真 其各組接部 重影響到迴 區段’相對 置之最大規 產品結構上 上所存在之 之創新構造 向者。 4 201043900 .. 有鑑於此，發明人本於多年從事相關產品之製造開發 --與設計經驗，針對上述之目標，詳加設計與審慎評估後， 終得一確具實用性之本發明。 【發明内容】 本發明之主要目的，係在提供一種管體式迴路型熱管 ，其所欲解決之問題點，係針對習知迴路型散熱裝置結構 設計上仍舊存在不易量產製造加工、欠缺耐用性以及熱傳 導量頗受侷限等問題點加以思索突破； Ο 本發明解決問題之技術特點，在於所述管體式迴路型 熱管係包括：一迴路型中空管體，包括一管壁以及内部呈 中空且真空狀態之循環空間，該循環空間内填入一工作液 ，且沿其循環路徑依序區分成一蒸發段、一蒸氣導流段、 一冷凝段、一工作液回流段；一第一燒結毛細組織，填滿 於該工作液回流段所屬空間中；一第二燒結毛細組織，設 於該蒸發段管壁呈環狀分佈型態；一第三燒結毛細組織， 設於該冷凝段管壁呈環狀分佈型態，且其中，該第二、第201043900, VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device; in particular, to an innovative structural type designer of a tubular body type heat pipe. [Prior Art] According to the rapid advancement of information technology in recent years, in order to pursue higher-energy electronic devices, the relevant industries are all committed to the improvement of semiconductor manufacturing processes. Due to the high degree of miniaturization of current process technologies, single components are already included. In addition, there are a large number of transistors, and the operating speed of the components is also multiplied. In addition, in order to cope with the trend of light and thin electronic products, the density of internal components is relatively increased, but this causes the internal packaging of the sub-products. The phenomenon that the heat density of the component is getting higher and higher, and the damage of the electrical product after use is mostly caused by the excessive temperature; how to more efficiently dissipate the heat generated by the internal components of the electronic product to the part, It has become an important technical issue in the relevant industry. Q As for the heat dissipation structure design of electronic products, the common ones are divided into two types of heat fins and heat pipes or a combination thereof; wherein the heat pipe type is more commonly used in heat dissipation, however, In the traditional extension of the heat pipe, since the working fluid gas system is in the same space and flows in opposite directions to each other, the gas and the liquid will interfere with each other when flowing, causing an additional resistance to be caused, resulting in a decrease in heat transfer. The problem of poor heat dissipation performance and shortcomings. Based on this, there is another loop-type heat sink that has been developed by the relevant industry. The loop-type heat sink is mainly to create a loop-conducting effect. The energy-expanding electron-external-type and the current-flowing current 3 201043900 _. The flow path of the working fluid and the boil-off gas can be improved - the conventional reverse heat flow of the conventional heat pipe and the liquid is improved. However, although there are many related laws of the conventional circuit type heat sink, it is comprehensively Considering the efficiency and feasibility of condensate recirculation, most of the conventional circuit-type heat sinks are made of small diameter pipe body to make the condensate return part flow guiding section to generate siphoning effect, and the condensation part is adopted. A housing or a tube body having a large volume is formed, but the conventional circuit type heat dissipating device generally has the following disadvantages: 〇1, because the conventional circuit type heat dissipating device as a whole must be composed of a plurality of structural bodies that are assembled to each other, so that the material The manufacturing and cost are relatively large, and there are shortcomings that the mass production system is not inferior to the better industrial economic benefits. 2, because of the large number of assembly parts, the long-term maintenance of the conventional loop-type heat dissipation state is more difficult than the traditional heat pipe, the position has a large probability of damage and hidden worries, and the structural robustness and service life of the strict heat dissipation device . 3. The condensate recirculation portion and the vapor diversion of the fine-diameter type limit the heat conduction, which makes the conventional circuit-type heat-dissipating device constrained, and it cannot be applied to some defects. Therefore, in view of the above-mentioned problem of the use of the conventional loop type heat sink, how to develop a kind of object that can be more ideal and practical, and to wait for the relevant industry to think about the breakthrough and the separation, so as to increase the flow resistance before the case and technology The specific structural position of the evaporation site and the vapor evaporation site are the same, so that the individual fabrication and processing, the internal components of the device, and the various components of the device are heavily affected to the opposite section. The innovative constructs that exist on the top. 4 201043900 .. In view of this, the inventor has been engaged in the manufacture and development of related products for many years -- and design experience, and after detailed design and careful evaluation of the above objectives, the invention has finally become practical. SUMMARY OF THE INVENTION The main object of the present invention is to provide a tubular loop type heat pipe, and the problem to be solved is that the structural design of the conventional circuit type heat sink is still difficult to mass-produce and manufacture, and lacks durability. And the problem that the heat conduction amount is limited, and the like, the present invention solves the problem. The technical feature of the present invention is that the tube-type loop type heat pipe system comprises: a first-loop type hollow pipe body, including a pipe wall and the interior is hollow and a circulating space in a vacuum state, the circulating space is filled with a working fluid, and sequentially divided into an evaporation section, a vapor guiding section, a condensation section, and a working fluid recirculation section along the circulation path thereof; a first sintered capillary structure Filling a space corresponding to the recirculation section of the working fluid; a second sintered capillary structure disposed in the annular distribution pattern of the evaporation section; a third sintered capillary structure disposed on the wall of the condensation section Shape distribution, and wherein, the second, the
Q 三燒結毛細組織之一端與第一燒結毛細組織相連接；藉此 創新獨特設計，使本發明對照先前技術而言，大致可達到 如下之優點： 其一、與傳統熱管相較而言，本發明能夠大幅提昇熱傳導 效益，達到散熱效能更佳之實用進步性。 其二、與習知迴路型散熱裝置相較而言，本發明能夠達到 更易製造加工、真空更易長久保持、可以大管徑製 造而能加大工作液、蒸氣之流量與效率、應用涵蓋 領域更廣泛等實用進步性及較佳產業經濟效益。 5 201043900 .【實施方式】 … 請參閱第1圖所示，係本發明管體式迴路型熱管之較 佳實施例，惟此等實施例僅供說明之用，在專利申請上並 不受此結構之限制；所述管體式迴路型熱管A係包括下述 構成： 一迴路型中空管體10，其包括有一管壁11以及形成於 該管壁11内部呈中空且真空狀態之一循環空間12，該循環 空間12内填入一工作液13 (如純水），且該循環空間12沿 其循環路徑依序區分成一蒸發段14、一蒸氣導流段15、一 0 冷凝段16、一工作液回流段17 ; 一第一燒結毛細組織20，係以填滿之型態固定設置於 該迴路型中空管體10之工作液回流段17所屬空間中； 一第二燒結毛細組織30，設於該迴路型中空管體10之 蒸發段14管壁11内側呈環狀分佈之型態，且令該第二燒結 毛細組織30之一端與該第一燒結毛細組織20相連接； 一第三燒結毛細組織40，設於該迴路型中空管體10之 冷凝段16管壁11呈環狀分佈之型態，且令該第三燒結毛細 組織40之一端與該第一燒結毛細組織20相連接者。 其中，如第1圖所示，該迴路型中空管體10係為單一 ◎管體所彎曲構成之一體成型態樣者。 其中，如第1圖所示，該迴路型中空管體10整體可設 為外徑相等之型態者。復如第2圖所示之迴路型中空管體 10B ，其係為蒸發段14、蒸氣導流段15、冷凝段16三者之 外徑（W1 )相等、而該工作液回流段17之外徑（W2 )則設 為相對較小之管徑差異化型態者。 其中，如第1圖所示，該迴路型中空管體10之整體可 設成一口字形循環態樣，構成該工作液回流段17與蒸發段 14、冷凝段16之間具有轉角部位18，並令填滿於該工作液 回流段17之第一燒結毛細組織20二端進一步延伸超過該轉 6 201043900 •角部位18。 -- 其中，如 16所對應的管 一步提昇該冷 藉由上述 如下： 請參第1 係以其迴路型 預定之發熱源 —燒結毛細組 熱成而產生液 於该工作液回 ’故蒸氣19會 流動，接著， 離該發熱源6〇 用’使得蒸氣 該工作液13將 而導引至該工 藉由該第一燒 Q 再度導引回流 至此而完成·— 氣體流動區段 其中，該 工作液回流段 細組織70 ;此 設有所述溝槽 ，則為該蒸發 實施態樣。 第1圖所米，該迴路型中空管體1〇之冷凝段 壁11外部姐可增設有若干散熱片50 , ^以進 凝段16之散熱冷卻效率。 曰 結構組成設計，茲就本發明之使用狀態說明 圖所示，所述管體式迴路型熱管A使用上， 中空管體10之蒸發段14管壁η外部抵靠於一 60 (如CPU )’當聚集於該蒸發段14所設第 ，3〇之工作液13接收來自於該發熱源6〇之 氣相之相變化時，即轉變成蒸氣19，此時由 4 17具有填滿狀態的第一燒結毛細組織2〇 朝空間通暢、壓力較小的蒸氣導流段15方向 蒸氣19會隨著該蒸氣導流段15之導引來到遠 之冷凝段16，藉由該冷凝段16之冷卻降溫作 19冷凝轉變回液態之工作液13態樣，接著， 會顺著該冷凝段16所設第三燒結毛細組織40 作液回流段17所設第一燒結毛細組織20，復 結毛細組織2〇的毛細導引作用，將工作液13 至該該蒸發段14所設第二燒結毛細組織30， 個散熱循環過程；藉此俾可構成一種液體與 相分離且交互循環之迴路型熱管結構。 迴路型中空管體1〇之蒸發段14、冷凝段16、 17任至少其中一者之管壁11並設有溝槽狀毛 如第3圖所揭，該工作液回流段之管壁11 狀毛細組織70之實施態樣；又如第4圖所揭 段14之管壁11設有所述溝槽狀毛細組織之 7 201043900 • 如第5圖所示，該迴路型中空管體ι〇的至少蒸發段14 -管壁11係可全部或局部側打扁而形成有一承靠平面汕^藉 由該承靠平面80的設置，以利於該發熱源6〇達到平穩且大 面積之組靠效果’而能獲得較佳熱傳導效益者。 又如第6圖所示，其中該第一燒結毛細組織2〇，亦可 設於該迴路型中空管體10之工作液回流段17兩端臨近該蒸 發段14與冷凝段16連接處；且其中，該工作液回流段π兩 端之間未設有所述第一燒結毛細組織2〇之區段，係設為管 徑介於0. 5〜3. 5mm之間的細管型態，進而界定形成有一虹吸 〇管段90 ;藉由所述虹吸管段90的設計，使得該工作液回流 段17的最大長度規格能夠再進一步擴增而達到相同工作液 13回流導引效果，藉此，以令該管體式迴路型熱管a能夠 有更大規格之實施型態以因應更多元之使用需求者。 本發明之優點： I /、【先前技術】所提傳統熱管相較而言，本發明藉 &其液·體與氣體流動區段相分離且交互循環之迴路結 構5史計’能夠消除傳統熱管氣、液體相互逆流干擾阻 礙之問題點，俾可大幅提昇熱傳導之效益，進而達到 散熱效能更佳之實用進步性。 2 '若與【先前技術】所提習知迴路型散熱裝置相較而言 ’本發明可達到如下優點： (1)由於本發明之迴路型中空管體具體實現上可藉 &單一管體彎曲構成一體型態，故構件數量以及組接 部位均可精簡至最少最簡化之狀態，故可達到更易製 造加工、製造成本大幅降低之進步性與較佳產業經濟 效益。 由於本發明之迴路型中空管體具體實現上可藉 8 201043900 由單一管體 最少狀態， 最低，故真 用、使用壽 (3 )由於 填滿型態之 結構體，此 斷面較大仍 大管徑製造 流量與效率 0 用進步性。 (4 )本發 流段以及蒸 最大長度規 更為提昇， 管體式迴路 )大於200mm 、各種電腦 多元廣泛之 臂曲構成一體型態， 因此内部真空環境被 $狀態更容易長久保 命更長之優點進步性 本發明之工作液回流 第—燒結毛細組織作 種填滿型態的燒結毛 然具有極佳虹吸作用 熱·#管體，藉此而能 ’達到提昇迴路型散 明所揭管體式迴路型 七^又均可以較大管徑 格·可擴張程度較習知 使得應用涵蓋領域更 型熱管將可應用於毛 之各種散熱環境如： 散熱模組等產品結構 貫用進步性及較佳產 故組接部位可精簡至 破壞之機率相對降至 持而具有更加堅固而才 〇 段所屬空間中是採用 為導引工作液回流之 細組織設計，縱使橫 ’故吾人將能夠以較 加大工作液、蒸氣之 熱裝置散熱效能之實 熱管由於其工作液回 製造，故熱管的整體 迴路型散熱裝置能夠 加廣泛，本發明所揭 細回流長度（或高度 LED車燈、LED路燈 上，而具有適用性更 業利用效益。 上述實施例所揭示者係藉以具體說明本發明，且文中 5ί特定：術語進行說明’當不能以此限定本發明之專 利犯圍，热悉此項技術領域之人士當可在瞭解本發明之精 神與原則後對其進行變更與修改而達到等效之目的，而此 等十更/、修改白應涵蓋於如后所述之申請專利範圍所界 定範_中。 9 201043900 【圖式簡單說明】 -第1圖：本發明結構較佳實施例之平面剖視圖。 第2圖：本發明結構另一實施例之平面剖視圖。 第3圖：本發明之工作液回流段管壁設有溝槽狀毛細組織 之實施例平面剖視圖。 第4圖：本發明之蒸發段管壁設有溝槽狀毛細組織之實施 例平面剖視圖。 第5圖：本發明之蒸發段管壁打扁形成有平靠面之實施例 立體圖。 第6圖：本發明之工作液回流段形成有虹吸管段之實施例 平面剖視圖。 【主要元件符號說明 ] 管體式迴路型熱管 A 迴路型中空管體 1 0 迴路型中空管體 1 0 管壁 1 1 循環空間 1 2 工作液 1 3 蒸發段 1 4 蒸氣導流段 1 5 冷凝段 1 6 工作液回流段 1 7 轉角部位 1 8 蒸氣 1 9 第一燒結毛細組織 2 0 第二燒結毛細組織 3 0 第三燒結毛細組織 4 0 散熱片 5 0 發熱源 6 0 溝槽狀毛細組織 7 0 承靠平面 8 0 虹吸管段 9 0 10One end of the Q-sintered capillary structure is connected to the first sintered capillary structure; thereby, the innovative and unique design enables the present invention to substantially achieve the following advantages over the prior art: First, compared with the conventional heat pipe, The invention can greatly improve the heat conduction efficiency and achieve the practical progress of better heat dissipation performance. Secondly, compared with the conventional loop type heat dissipating device, the invention can achieve easier manufacturing and processing, the vacuum can be more easily maintained for a long time, can be manufactured with a large diameter, can increase the flow rate and efficiency of the working fluid and the steam, and the application covers the field. Extensive and practical progress and better industrial economic benefits. 5 201043900 . [Embodiment] Please refer to FIG. 1 , which is a preferred embodiment of the tubular loop type heat pipe of the present invention, but the embodiments are for illustrative purposes only, and are not applicable to the patent application. The tube-type loop type heat pipe A includes the following structure: The one-circuit type hollow tube body 10 includes a tube wall 11 and a circulation space 12 formed in the hollow and vacuum state inside the tube wall 11 The circulating space 12 is filled with a working fluid 13 (such as pure water), and the circulating space 12 is sequentially divided along its circulation path into an evaporation section 14, a vapor guiding section 15, a 0 condensation section 16, and a working a liquid-sintering section 17; a first sintered capillary structure 20 is fixedly disposed in a space of the working fluid recirculation section 17 of the loop-type hollow tubular body 10 in a filled state; a second sintered capillary structure 30 is provided The inner side of the tube wall 11 of the evaporation section 14 of the loop-type hollow tube body 10 has an annular distribution pattern, and one end of the second sintered capillary structure 30 is connected to the first sintered capillary structure 20; Sintered capillary structure 40, disposed in the loop type hollow tube The wall 11 of the condensation section 16 of the body 10 is in the form of an annular distribution, and one end of the third sintered capillary structure 40 is connected to the first sintered capillary structure 20. Here, as shown in Fig. 1, the loop-type hollow tubular body 10 is a single body in which the tubular body is bent to constitute a one-piece molding. Here, as shown in Fig. 1, the loop type hollow tubular body 10 as a whole can be set to have the same outer diameter. The loop-type hollow tubular body 10B shown in FIG. 2 is equal to the outer diameter (W1) of the evaporation section 14, the vapor guiding section 15, and the condensing section 16, and the working fluid recirculation section 17 The outer diameter (W2) is set to a relatively small pipe diameter differential type. Wherein, as shown in FIG. 1 , the whole of the loop-type hollow tubular body 10 can be arranged in a shape of a loop, and the corner portion 18 of the working fluid returning section 17 and the evaporation section 14 and the condensation section 16 is formed. And the two ends of the first sintered capillary structure 20 filled in the working fluid return section 17 are further extended beyond the turn 6 201043900 • angular portion 18 . -- Among them, the tube corresponding to 16 is raised in one step by the following: Please refer to the first part of the heat source of the circuit type - the sintered capillary group is heated to produce liquid in the working fluid back to the vapor 19 Will flow, and then, from the heat source 6, use 'to make the steam the working fluid 13 will be guided to the work by the first burn Q to guide the return flow again to complete the gas flow section, the work The liquid recirculation section fine structure 70; this groove is provided, which is the evaporation implementation. In the first figure, the outer section of the loop type hollow tube body 1 can be provided with a plurality of fins 50, which are used for the heat dissipation cooling efficiency of the condensing section 16.曰Structural composition design, as shown in the state of use diagram of the present invention, the tubular loop type heat pipe A is used, and the evaporation section 14 of the hollow pipe body 10 is externally abutted against a 60 (such as a CPU) 'When the working liquid 13 collected in the evaporation section 14 receives the phase change from the gas phase of the heat source 6〇, it is converted into the vapor 19, and at this time, the 4 17 has a filled state. The first sintered capillary structure 2 is directed toward the ventilating section 16 in the direction of the vapor guiding section 15 which is fluent in the space, and is guided by the vapor guiding section 15 by the condensation section 16 Cooling and cooling is performed as a working liquid 13 in a liquid state, and then a third sintered capillary structure 40 is provided along the condensation section 16 as a first sintered capillary structure 20 of the liquid reflux section 17, and the capillary structure is reconstituted. 2 〇 capillary guiding action, the working fluid 13 is set to the second sintered capillary structure 30 of the evaporation section 14 , a heat dissipation cycle process; thereby forming a liquid and phase separation and alternating circulation loop type heat pipe structure . The tube wall 11 of at least one of the evaporation section 14 and the condensation section 16, 17 of the loop-type hollow tubular body 1 is provided with a groove-like hair. As shown in FIG. 3, the wall 11 of the working fluid recirculation section The embodiment of the capillary structure 70; and the wall 11 of the section 14 as shown in Fig. 4 is provided with the grooved capillary structure 7 201043900 • As shown in Fig. 5, the loop type hollow tube body ι At least the evaporation section 14 - the wall 11 of the crucible can be flattened on all or part of the side to form a bearing plane 藉 by the arrangement of the bearing plane 80, so that the heat source 6 〇 can reach a stable and large area group Those who can achieve better heat transfer benefits by the effect'. As shown in FIG. 6 , the first sintered capillary structure 2 〇 can also be disposed at the end of the working fluid returning section 17 of the loop-type hollow tubular body 10 adjacent to the junction of the evaporation section 14 and the condensation section 16; 5毫米的细管型,,,,,,,,,,,,,,,,,,,,,,,,,,, Further defining a siphon tube segment 90; by designing the siphon tube segment 90, the maximum length specification of the working fluid recirculation portion 17 can be further expanded to achieve the same working fluid 13 reflux guiding effect, thereby The tubular loop type heat pipe a can be of a larger specification to meet the needs of more users. Advantages of the present invention: I /, [Prior Art] Compared with the conventional heat pipe mentioned in the present invention, the present invention can eliminate the traditional structure by separating and circulating the liquid structure and the gas flow section. The problem that the heat pipe gas and the liquid cross-flow interference hinder, the enthalpy can greatly improve the heat transfer benefit, and thus achieve the practical progress of better heat dissipation performance. 2 'Compared with the conventional loop type heat sink device proposed in [Prior Art], the present invention can achieve the following advantages: (1) Since the loop type hollow tube body of the present invention can be realized by a single tube The body bending constitutes an integral type, so the number of components and the assembly parts can be reduced to a minimum and the most simplified state, so that the progress of manufacturing and manufacturing, the manufacturing cost can be greatly reduced, and the industrial economic benefit is better. Since the loop type hollow tube body of the present invention can be realized by the minimum state of the single tube body, the lowest, so the true use and the service life (3) are still larger due to the filled structure. Large pipe diameter manufacturing flow and efficiency 0 are progressive. (4) The current flow section and the steaming maximum length gauge are more improved, the tube type circuit is larger than 200mm, and the various arm types of various computers form an integral type, so the internal vacuum environment is more likely to last longer and longer. Progressive working fluid of the present invention reflows the first-sintered capillary structure to fill the type of sintered hair with excellent siphoning heat · #管体, thereby being able to achieve the lifting loop type of exposed tube loop Types of seven can be larger than the diameter of the pipe. The degree of expansion can be applied to the application of the field. More heat pipes will be applied to various heat dissipation environments such as: Thermal modules and other product structures are progressive and better. Therefore, the assembly site can be reduced to the probability of damage to the holding and is more sturdy, and the space in which the segment is located is designed to guide the flow of the working fluid, even if the cross will be able to work harder. The solid heat pipe of the heat dissipation performance of the liquid and steam heat device can be widely manufactured due to the working fluid, so that the overall circuit type heat sink of the heat pipe can be widely distributed. The flow length (or the height of the LED headlights, the LED streetlights, and the applicability is more useful. The embodiments disclosed in the above embodiments are used to specifically illustrate the present invention, and the description is in the text: The patents of the inventions are well-known to those skilled in the art and can be changed and modified to achieve the equivalent purpose after understanding the spirit and principles of the invention, and such 9 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Fig. 3 is a plan sectional view showing an embodiment in which a groove-like capillary structure is provided on a wall of a working fluid recirculation section of the present invention. Fig. 4 is a view showing an embodiment in which a wall portion of a wall portion of a wall portion of the evaporation section of the present invention is provided with a grooved capillary structure. Fig. 5 is a perspective view showing an embodiment in which the wall of the evaporating section of the present invention is flattened to form a flat surface. Fig. 6 is a view showing an embodiment of the working fluid reflow section of the present invention in which a siphon section is formed. Sectional view. [Main component symbol description] Tube type loop type heat pipe A Circuit type hollow pipe body 1 0 Circuit type hollow pipe body 1 0 Pipe wall 1 1 Circulating space 1 2 Working fluid 1 3 Evaporation section 1 4 Vapor flow Section 1 5 Condensation section 1 6 Working fluid Reflow section 1 7 Corner part 1 8 Vapor 1 9 First sintered capillary structure 2 0 Second sintered capillary structure 3 0 Third sintered capillary structure 4 0 Heat sink 5 0 Heat source 6 0 Groove Grooved capillary structure 7 0 bearing plane 8 0 siphon section 9 0 10