TW201043889A - Fan filter unit, semiconductor production apparatus, flat panel display production apparatus, and method for producing purified air - Google Patents
Fan filter unit, semiconductor production apparatus, flat panel display production apparatus, and method for producing purified air Download PDFInfo
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- TW201043889A TW201043889A TW099105778A TW99105778A TW201043889A TW 201043889 A TW201043889 A TW 201043889A TW 099105778 A TW099105778 A TW 099105778A TW 99105778 A TW99105778 A TW 99105778A TW 201043889 A TW201043889 A TW 201043889A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F7/00—Ventilation
- F24F7/04—Ventilation with ducting systems, e.g. by double walls; with natural circulation
- F24F7/06—Ventilation with ducting systems, e.g. by double walls; with natural circulation with forced air circulation, e.g. by fan positioning of a ventilator in or against a conduit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/28—Arrangement or mounting of filters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2221/00—Details or features not otherwise provided for
- F24F2221/17—Details or features not otherwise provided for mounted in a wall
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
- Ventilation (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
201043889 六、發明說明： 【發明所屬之技術領域】 本發明係關於1可抑制内部溫度之上升且可將所吸入 之空氣〶度地清淨化之風_、網單元、將該風健網單元設 於外壁面而成之半導體製造装置、平面顯示器（Flat Panel201043889 VI. Description of the Invention: [Technical Field] The present invention relates to a wind that can suppress an increase in internal temperature and can cleanly purify the inhaled air _, a network unit, and set the wind power network unit Semiconductor manufacturing device and flat panel display on the outer wall surface
Display’以下適當地稱為「FpD」）製造裝置及使用該半導 體製造裝置或平面顯示器製造裝置的清淨化空氣之製造方 法。 【先前技術】 通常於製造半導體裝置或液晶顯示器之類的精密電子機 器之情形時’需要實施對半導體元件或液晶元件等進行製 造、組裝、檢查等之各種步驟。 於上述各步驟中’為操作具有微細構造之各種元件，必須 降低環境氣體中之灰塵及化學物質等之濃度，因此，上述步 驟之大部分通常係於料室、即於供給有經風機濾網單元而 '月淨化之空氣之㈣空間内進行(例如參料利文獻1)。 又，為進而提高潔淨室内部之環境氣體空氣之清淨化度， 糸7争至内5又置s又有風機遽網單元之潔淨台（clean bench) ’並於該料0製造半導體或FpD，或者於潔淨室 内所。又置之半導體製造裝置或FpD製造裝置之外壁面上直 接设置風機;»網單it ’並於料|置之㈣製造半導體或 FPD。 099105778 201043889 例如，如圖1之概略剖視圖所 上部外壁面設有風機濾網單元2之^潔淨以之内部配置 製造裝置3，、_置於料室丨切㈣妙置或™ ^ φ 、#之風機濾網單元4而對 工矾進打預〉月淨化之後，藉由構成 一 ^ ^ ^ 〜乳機濾網早兀2之電動風 Ο ❹ 扇、、里由工Μ入口 7而將該預清淨化之空氣5吸入至風機 遽網單元2内’並進而藉由_8對所吸人之預清淨化*氣 進行清淨化，藉此於半導體製造裝置或製料置3之 内部提供含有經提高清淨化度之環境氣體空氣 間10。 7菜工 圖2⑻表示俯視圖1所示之風機據網單元2時之水相. 圖，圖2(b)表示相對於圖1所示之風機濾網單元2之J視 面之垂直剖視圖。 < 兩主表 如圖2⑷、圖2⑻所示構成風機&網單元 係包括：風扇部61，包含多葉送風機等； 動風扇6 制部63 ’包含電源基板、控制基板等；但伴隨+切；及控 之驅動’自該控制部63產生熱，而使=電動風屬6 零件會熱劣化等，且有時電動風户細工制°卩幻之電子 或者製品壽命會變短。 ]] 作會變得不穩定、 特別係如圖3所示，為進而提高裳置内部之、、“ 慮如下態樣：自空氣引入口 7抽吸藉由半導度’有考 FPD製造裳置3内所設之風機&網單元2而^造裝置或 氣，並再錢行清淨化，來物㈣清淨^淨化之空 099105778 抽吸至風 201043889 機濾網單元2内，於該態樣中，因電動風扇6而加熱之空氣 會再次向電動風扇6循環，故對於電動風扇6自身之熱負載 將增大。 於此種情形時，如圖4之概略圖所示，通常採用如下方 法：於收容電動風扇6之護罩11外側（風機濾網單元2之外 側）表面之與控制部63鄰接之位置處透過網眼等而設置開 放部分12，藉由自然對流之散熱而進行冷卻，但原本風機 濾網單元2係具有自空氣引入口 7吸入空氣、並向半導體製 造裝置或FPD製造裝置3之内部空間10排出經濾網8清淨 化之空氣的氣流，故風機濾網單元2内經加熱之空氣難以自 開放部分12藉由自然對流而釋出至外部。 因此，如圖5之概略圖所示，考慮於與開放部分12鄰接 之位置處另外設置冷卻風扇13，而自開放部分12向半導體 製造裝置或FPD製造裝置3之外部強制散熱之方法，但構 成電動風扇6之基板等控制部所產生之微粒子或雜質氣體 易擴散至潔淨室7之内部空間14内，會使於潔淨室1之内 部空間14内另外進行之步驟會受到影響。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利實開平2-17220號公報 【發明内容】 (發明所欲解決之問題） 099105778 6 201043889 於此種狀況下，本發明之目的在於··提供一種可抑制内部 溫度之上升且可將所吸入之空氣高度地清淨化之風機濾網 單元；提供一種設置上述風機濾、網單元而成之半導體製造裝 置或FPD製造裝置；及提供一種使用上述半導體製造裝置 .或FPD製造裝置之清淨化空氣之製造方法。 • (解決問題之手段） 為解決上述技術問題，本發明者等人經銳意研究後，發現 〇 藉由使用如下之風機濾網單元可解決上述問題、即其至少包 述護罩之外緣部；秘上衫氣循環散熱路徑 括有：護罩(casing);空氣吸入用電動風扇，將空氣吸入至 該護罩之内部；平板狀濾網，配置於上述護罩之内部，使藉 由上述空氣吸人用電動風扇而吸人之空氣自—主表面向另 一主表面通過而進行清淨化處理；及空氣循環散熱路徑，與 、及入工氣並進行清淨化處理之路徑相獨立，而設置於上 〇 空氣吸入用電動風扇之控制部， 内配置有構成 即，本發明提供如下者：The display "hereinafter appropriately referred to as "FpD") manufacturing apparatus and a method of manufacturing purified air using the semiconductor manufacturing apparatus or the flat display manufacturing apparatus. [Prior Art] Generally, in the case of manufacturing a precision electronic device such as a semiconductor device or a liquid crystal display, various steps of manufacturing, assembling, inspecting, etc., a semiconductor element or a liquid crystal element are required. In the above steps, in order to operate various components having a fine structure, it is necessary to reduce the concentration of dust, chemicals, and the like in the ambient gas. Therefore, most of the above steps are usually performed in the chamber, that is, through the fan filter. The unit is carried out in the (four) space of the 'purified air (for example, reference 1). In addition, in order to further improve the cleanliness of the ambient gas in the clean room, 糸7 fights to the inside and then installs the clean bench of the fan unit and manufactures the semiconductor or FpD in the material. Or in a clean room. The fan is placed directly on the outer wall surface of the semiconductor manufacturing device or the FpD manufacturing device; the net list is made and the semiconductor or FPD is fabricated. 099105778 201043889 For example, as shown in the schematic cross-sectional view of Fig. 1, the upper outer wall surface is provided with the fan filter unit 2, and the internal configuration manufacturing device 3 is cleaned, and the _ is placed in the chamber (4) or TM ^ φ, # After the fan filter unit 4 is used for pre->month purification, the electric fan 构成 构成 构成 、 、 乳 乳 乳 乳 、 、 、 、 、 、 、 预 预The cleaned air 5 is sucked into the fan unit 2 and is further cleaned by the pre-cleaning gas of the sucker by _8, thereby providing the inside of the semiconductor manufacturing device or the material set 3 Increase the cleanliness of the ambient gas between the air 10 . Fig. 2(8) shows the water phase when the wind turbine unit 2 shown in Fig. 1 is viewed. Fig. 2(b) is a vertical sectional view taken along line J of the fan screen unit 2 shown in Fig. 1. < The two main tables are as shown in Fig. 2 (4) and Fig. 2 (8). The fan unit and the net unit include a fan unit 61 including a multi-blade air blower, and the fan unit 63' includes a power source board, a control board, and the like; The drive is controlled to generate heat from the control unit 63, so that the electric wind 6 component is thermally deteriorated, and the electric wind or the product may be shortened in life. ]] will become unstable, especially as shown in Figure 3, in order to improve the interior of the skirt, "considering the following: suction from the air introduction port 7 by semi-conductivity" Set the fan & net unit 2 set in 3 to make the device or gas, and then clean and clean the material, and the object (4) clean and clean the air 099105778 to pump into the wind 201043889 machine filter unit 2, in this state In this case, the air heated by the electric fan 6 circulates again to the electric fan 6, so that the heat load of the electric fan 6 itself increases. In this case, as shown in the schematic diagram of Fig. 4, the following is generally employed. Method: The open portion 12 is provided through a mesh or the like at a position adjacent to the control portion 63 on the outer surface of the shroud 11 of the electric fan 6 (outside the fan filter unit 2), and is cooled by natural convection heat dissipation. However, the original fan filter unit 2 has a flow of air taken in from the air introduction port 7 and discharged to the internal space 10 of the semiconductor manufacturing apparatus or the FPD manufacturing apparatus 3, and the air purified by the filter 8 is cleaned, so the fan filter unit 2 Internally heated air is difficult to self The discharge portion 12 is released to the outside by natural convection. Therefore, as shown in the schematic view of Fig. 5, it is considered that a cooling fan 13 is additionally provided at a position adjacent to the open portion 12, and from the open portion 12 to the semiconductor manufacturing apparatus or A method of forcibly dissipating heat from the outside of the FPD manufacturing apparatus 3, but the fine particles or impurity gases generated by the control unit such as the substrate of the electric fan 6 are easily diffused into the internal space 14 of the clean room 7, and the internal space of the clean room 1 is 14 Further, the steps to be carried out are affected. [Prior Art Document] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open No. Hei 2-17220 (Summary of the Invention) (Problems to be Solved by the Invention) 099105778 6 201043889 Under the circumstances, the object of the present invention is to provide a fan filter unit capable of suppressing an increase in internal temperature and highly purifying the inhaled air; and providing a semiconductor manufacturing device in which the fan filter and the mesh unit are provided. a device or an FPD manufacturing device; and a method of manufacturing purified air using the above semiconductor manufacturing device or FPD manufacturing device. Means for Solving the Problem) In order to solve the above-mentioned technical problems, the inventors of the present invention have found that the above problem can be solved by using the following fan filter unit, that is, it covers at least the outer edge of the shield; The upper jacket air circulation heat dissipation path includes: a casing; an air fan for air suction, and air is sucked into the inside of the shield; a flat screen filter is disposed inside the shield to suck by the air The air that the person uses the electric fan absorbs the air from the main surface to the other main surface for purification treatment; and the air circulation heat dissipation path is independent of the path of entering the process gas and purifying the purification process, and is disposed on the The control unit of the upper air intake fan for electric fan is disposed in the control unit, and the present invention provides the following:
護罩； ’從而完成本發明。 其特徵在於，其至少包括有： 空氣吸入用電動風扇，將The shield; ' thus completes the invention. The utility model is characterized in that it comprises at least: an electric fan for air intake,
過而進行清淨化處理； 理；及 將空氣吸入至該護罩之内部； 其配置於上述護罩之内部，使藉由上述空氣 丨而吸入之空氣自一主表面向另一主表面通 099105778 201043889 空氣循環散熱路徑’與上述吸入空氣並進行清淨化處理之 路徑相獨立，而設置於上述護罩之外緣部； 而於上述空氣循環散熱路徑内配置有構成空氣吸入用電 動風扇之控制部。 (2) 如上述（1)之風機濾網單元，其中，上述空氣循環散熱 路徑係框狀地設置於上述護罩之側部全周。 (3) 如上述（1)或(2)之風機濾網單元，其中，上述空氣循環 散熱路徑係設置於位於上述平板狀濾網之空氣流入側的護 罩壁之内壁面或外壁面上。 (4) 如上述（1)〜（3)中任一項之風機濾網單元，其中，於上 述空氣循環散熱路徑内進而包含空氣循環用電動風扇。 (5) 如上述（1)〜(4)中任一項之風機濾網單元，其整體形狀 係形成為門狀。 (6) —種半導體製造裝置，其特徵在於，其係將如上述（i) 〜（5)中任一項之風機濾網單元設置於外壁面而成者。 (7) 如上述(6)之半導體製造裝置，其中，藉由風機濾網單 几而抽吸空氣之空間、與排出經清淨化之空氣之空間係形成 於半導體製造裝置内之同一空間。 其係將如上述(1)〜 面而成者。 (8) -種FFD製造裝置，其特徵在於，其 (5)中任-項之風機濾網單元設置於外壁面 藉由風機濾網單元 氣之空卩弓7么 間係形成於 (9) 如上述⑻之FPD製造裝置，其中，箱 而抽吸空氣之空間、與排出經清淨化空氣 9 099105778 201043889 FPD製造裝置内之同一空間。 ⑽一種清淨化空氣之製造料’料徵在於，其係藉由 配置於潔淨室内之如上述⑹〜⑼中佐1之半導體製造裝 置或FPD製造裝置，而對空氣進行清淨化處理。 - (發明效果） • 減本發明’於風誠鮮如’㈣人域並進行清淨 化處理之路後相獨立地於護罩之外緣部設置空氣循環散敎 :〇 路徑，且於該路徑内配置空氣循環用電動風扇之控制部，並 且使内部之空氣沿上述循環路徑内#環、冷卻，藉此可提供 -種抑制内部溫度之上升、且防止自電動風扇之控制部所產 生雜質氣體之釋出、可使引人之預清淨化空氣高度地 之風機濾網單元。 〇And purifying and purifying the air; and absorbing air into the inside of the shroud; and arranging the inside of the shroud to allow air taken in by the air shovel to pass from one main surface to the other main surface 099105778 201043889 The air circulation heat dissipation path 'is independent of the path of the suction air and the cleaning process, and is disposed at the outer edge of the shroud; and the control unit constituting the electric fan for air intake is disposed in the air circulation heat dissipation path. . (2) The fan screen unit according to (1) above, wherein the air circulation heat dissipation path is provided in a frame shape on the entire circumference of the side portion of the shroud. (3) The fan screen unit according to (1) or (2) above, wherein the air circulation heat dissipation path is provided on an inner wall surface or an outer wall surface of the shroud wall on the air inflow side of the flat screen. (4) The fan screen unit according to any one of the above (1) to (3), further comprising an air circulating electric fan in the air circulation heat dissipation path. (5) The fan screen unit according to any one of the above (1) to (4), wherein the overall shape is formed in a gate shape. (6) A semiconductor manufacturing apparatus characterized in that the fan screen unit according to any one of the above (i) to (5) is provided on an outer wall surface. (7) The semiconductor manufacturing apparatus according to (6) above, wherein a space for sucking air by a fan filter and a space for discharging the purified air are formed in the same space in the semiconductor manufacturing apparatus. It will be the same as (1) above. (8) A FFD manufacturing apparatus, characterized in that the fan filter unit of any one of (5) is disposed on the outer wall surface and is formed by the air filter unit of the fan filter unit (9) The FPD manufacturing apparatus according to the above (8), wherein the space for sucking air in the tank is the same space as that in the FPD manufacturing apparatus for discharging the purified air 9 099105778 201043889. (10) A manufacturing material for purifying air, which is obtained by purifying air by a semiconductor manufacturing apparatus or an FPD manufacturing apparatus as described in the above (6) to (9) disposed in a clean room. - (Effects of the Invention) • Reduce the air circulation of the invention in the outer edge of the shroud: the path of the wind in the human body and the cleansing treatment. The control unit for the air circulation electric fan is disposed, and the internal air is cooled and looped along the circulation path, thereby providing an increase in the internal temperature and preventing the generation of the impurity gas from the control portion of the electric fan. The release of the fan filter unit that allows the pre-cleaning of the air to be highly purified. 〇
又，根據本發明，可提供一種將上逃風機渡網單元設置於 外壁面而成之半導體製造裝置、FpD製造裳置1可提供一 種使用上述半導體製造裝置或FpD 之製造方法。 …之清淨化空氣 【實施方式】 首先，說明本發明之風機據網單元。 本發明風機遽網單元之特徵在於至 入用電動風扇，將空氣吸人至該護罩之内二氣吸 配置於上述護罩之内部，使藉由上述空氣吸入反^慮網， 吸入之空氣自一主表t動風扇而 表面通過而進行清淨化處 099105778 201043889 理；空氣循環散熱路徑’與上述吸入空氣並進行清淨化處理 之路徑相獨立地，設置於上述護罩之外緣部；且於上述空氣 循環散熱路徑内配置有構成上述空氣吸入用電動風扇之控 制部。 以下，根據圖式’說明本發明之風機濾網單元之實施形態。 圖6至圖10係表示本發明風機濾網單元之第1態樣（以下 稱為本發明之FFU(Fan Filter Unit)之態樣I)之圖，圖η至 圖13係表示本發明風機濾網單元之第2態樣（以下稱為本發 明之FFU之態樣II)之圖。 如圖6(a)之護罩11中與兩主表面垂直之剖視圖所示，本 發明之FFU之態樣！係將構成電動風扇6之風扇部61及平 板狀渡網8於護罩η中與主表面水平之方向上相並排而配 置於護罩11内，又，如圖11(a)之護罩u與兩主表面垂直 之剖視圖所示，本發日狀訓《態樣㈣將構成電動風扇 6之風扇部61及平板狀濾網8柃護罩u中與兩主表面垂直 之方向上相並排而配置於護罩1丨内。本發明之FFU之態樣 I與FFU之態樣Π之不同點僅為風屬部61與平板狀慮網8 之配置，除此以狀主要構成為共通，因此以下主要係根據 本發明之FFU之雜I ’而說明本發明之風機濾網單元。 圖6係說明本發明之卿之態樣！之圖，圖6⑷係構成風 H網單元2之護罩11中與兩t表面垂直之剖視圖，圖6(b) 係風機濾網單兀2之下表面（清淨化空氣之排出面）側之圖， 099105778 10 201043889 圖6(c)係風機濾網單 俜風機请網輩-〇 表面側水平剖視圖，圖6(d) 係風機4卿70 2之讀圖（透視圖）。 8，則要其㈣至少可收納下述平板狀濾網 u=?別限制’可列舉例如長方體形狀等。於護 至2__、橫5QQm ，、大小較佳為縱500 mm 七七 ^5〇〇咖至2〇〇〇麵、高度5〇麵至2〇〇腿 左右。 0 工乳吸入用電動風扇6係將空氣抽吸至護罩u内並使其 通過下述平板狀濾、網8後排出者，如圖6(e)所示，該空氣吸 入用電動風扇6至少包含風扇部61、馬達部62及控制部63。 此處，風扇部61只要可抽吸空氣並將抽吸之空氣供給至 平板㈣網8而使其通過，則並不受特觀制，例如可列舉 多葉送風機、及螺槳風扇等。 又’控制部63係具有使風扇驅動、停止之功能者，具體 ❹而言，其由電源基板、控制基板等所構成。 另一方面，平板狀遽網8只要可將藉由電動風扇6而抽吸 之空氣高度地清淨化，則並不受特別限制，可列舉作為集塵 過濾器之高效率粒子空氣濾器（HEPA，ffigh Effidency Particulate Air Filter)、超高空氣效過濾器（ULpA，他以 L〇w Penetration Air Filter)、及於内部填充活性碳或離子交換樹 月旨等而成之化學過濾器等。可將上述各種濾網積層、或並列 而使用，該情形時，可自上述各種濾網中選擇一種或兩種以 099105778 11 201043889 上作為平板狀濾網8。 熱=:至⑻所示，於護罩U之外緣部設有空氣循環散 其===:，狀態之構造， 元2之外部環境氣體接觸，如網單 護罩11之側部全周。 α斤丁其可框狀地設置於 又於本發明之咖之態樣I中，如圖__ 氣循環散熱路徑15設置於位於平板_==' =空 的護罩壁18之外辟 之工軋机入側 之立體峨視二表側之圖’圖7(d)係風機 進而，於本發明之卿之態樣 空氣循環散熱路徑15 …所不’可將 側的護罩壁心 平板狀遽網8之空氣流入 元2 m °此處’圖8⑷係構成風機遽網單 11 11中與兩主表面垂直之剖視圖，圖係 制單元2之下表面(清淨化空氣之排出面)側之圖，圖幾 係風機濾網單元2夕μ矣而也丨^ () 2之立频透::一之圖’圖曝風齡網單元 於圖6、圖7、圖8中，路徑15之各角部為直角， 099105778 12 201043889 慮路徑内空氣之循環性(壓力損失)後，則路徑15之各角部 車乂仏為平緩之曲線狀。又，由於路徑15之角部個數越少則 路枚内之空氣之循環性(壓力損失)越高，故如圖6、圖7、 圖8所不，較佳為將角部設為四處、或將角部設為0個(路 钇15為圓形）。於圖6所示之態樣中，係將路徑15設置於 又罩1之側，故於圖6所示之態樣中，當路徑丨5之角部 為平緩之曲線狀或者路徑15為圓形時，較佳為護罩u之角 部亦係平緩之曲線狀或整體為圓形。 如圖6所不’當將空氣循環散熱路徑15框狀地設置於護 罩11之側部全周時、或如圖8所示，設置於位於平板狀渡 網8之空氣流入側的護罩壁18之内壁面時，不會使構成風 機遽網單S2之護罩u中與兩主表面垂直之方向的厚度增 加故相對於半導體製造裝置或FpD製造裝置之壁面等， 〇 可不形成餐之厚度（凸部）而設置風機_單元2，可 省空間化。 工氣循％、散熱路彳& 15内之控制部63附近之空氣循環速度 較佳為^至h5 m/秒，更佳為1.5至2.G m/秒，進而更: 為2,〇至2,5 m/秒。於本發明之風機滤網單元中，藉由使介 氣之循環速度處於上述範圍内，可對控制部63 二 卻從而抑制溫度场。 項冷 空嶋散熱路徑15内之空氣並不受特別限制， 佐為經铽淨室等而預清淨化之空氣。 099105778 13 201043889 ^ ίρυ 於本發明 成空氣吸入用 並排配置及收容 之態樣1中，如圖6(a)、圖6(c)所示，構 ^動風扇6之風扇部61及平板狀濾網8均係 平。如此，藉於護罩内，而與護罩11之兩主表面成水 可減小構將風扇部61與平板狀濾網8並排地配置， 2之護罩11中與兩主表面垂直之 故相對於半導體製造裝置或FPD製造裝置 可不形成額外之厚度（凸部）而設置，而可實現省 』構成風機濾網單元 方向上的厚度， 專之壁面， 空間化。 另一方面，七D同_ 園6(C)所示’構成空氣吸入用電動風扇6之 才工制部63係收衮於六角 令於工軋循環散熱路徑15内。此時，就上述 省空間化之觀點 > 娜鮎而δ 如圖6(c)等所示’較佳為控制部63 亦相對於風扇部61及平板狀I網8，而於護罩11中與兩主 表面水平之方向並排地配置。 ;本么月之；pj?U之態樣I中，如圖6(a)至⑷所示，經由 空氣引入口 7而透過風扇部61抽吸至護罩u内之空氣，係 通過平板狀濾網8而進行清淨化處理’藉此將清淨化度提高 之環境氣體空氣9排出至風機濾網單元2之外部（半導體製 造裳置或FPD製造裝置等之内部空間等）。 如圖6(a)、（b)、（d)等所示，藉由將設有空氣引入口 7之 面設為與平板狀濾網8之清淨化空氣排出面相同之面’當將 風機濾網單元2設ί於半導體製造装置或FPD製造裝置等 時’可使半導體製造裝置或FPD製造裝置等之裝置内部之 °"1〇5778 14 201043889 空氣循環變得容易。另一方面，如圖9(a)至⑷分別與圖咖 至⑻對比後所示’亦可將㉔〜口 7設置於位於平板狀 渡網8之空氣流人綱護罩壁〇卜壁面，於該情形時，當將 本發明之風機濾網單元安裝於半導體製造裝置或卿製造 ‘裝置等之外壁面時，可將半導體製造裝置或FpD製造裝置 * 料部之空氣容易地吸人至風_肩單元内。 圖U)⑻至⑷係與圖6⑻至(d)分別對應之圖，其係表示圖 (〇 6所示風«網單元2中之循環散熱路徑15内之空氣流動 之圖。 如圖ίο⑷至⑷所示，於配置有電動風扇6之控制部63 之空氣循環散熱路徑15内，經控制部63所排出之熱而加熱 之循環空氣17係藉由自然對流而於路徑15内循環。此時， 如圖1〇(c)所* ’亦可於路徑15 Θ設置包含螺紫風扇或多葉Moreover, according to the present invention, it is possible to provide a semiconductor manufacturing apparatus in which an upper blower fan unit is provided on an outer wall surface, and an FpD manufacturing apparatus 1 can provide a manufacturing method using the above semiconductor manufacturing apparatus or FpD. Clear air purification system [Embodiment] First, the wind turbine data unit of the present invention will be described. The air blower unit of the present invention is characterized in that an electric fan is used, and air is sucked into the shield, and two air suctions are disposed inside the shield, so that the air is sucked into the air through the air, and the air is sucked in. The air circulation heat dissipation path 'is disposed at the outer edge of the shroud independently of the path of the intake air and the cleaning treatment, since the main surface is moved by the fan and the surface is passed through; A control unit that constitutes the air intake electric fan is disposed in the air circulation heat dissipation path. Hereinafter, an embodiment of the fan screen unit of the present invention will be described based on the drawings. 6 to 10 are views showing a first aspect of the fan screen unit of the present invention (hereinafter referred to as an aspect I of the FFU (Fan Filter Unit) of the present invention), and Figs. 11 to 13 show the fan filter of the present invention. A diagram of a second aspect of the network element (hereinafter referred to as the aspect II of the FFU of the present invention). As shown in the cross-sectional view perpendicular to the two main surfaces in the shield 11 of Fig. 6(a), the aspect of the FFU of the present invention! The fan portion 61 and the flat-shaped crossing net 8 constituting the electric fan 6 are disposed in the shroud 11 in the horizontal direction of the main surface of the shroud η, and are placed in the shroud 11 as shown in Fig. 11(a). As shown in the cross-sectional view perpendicular to the two main surfaces, the present invention (4) aligns the fan portion 61 constituting the electric fan 6 and the flat screen filter 8 in the direction perpendicular to the two main surfaces. It is placed in the shield 1丨. The aspect of the FFU of the present invention differs from the aspect of the FFU only in the arrangement of the wind portion 61 and the flat panel 8. In addition, the main configuration is common, and therefore the following is mainly based on the FFU of the present invention. The fan filter unit of the present invention will be described. Figure 6 is a view showing the state of the present invention! Fig. 6(4) is a cross-sectional view of the shroud 11 constituting the wind H net unit 2 perpendicular to the surface of the two t, and Fig. 6(b) is a side of the lower surface of the fan filter unit 2 (the discharge surface of the clean air) Figure, 099105778 10 201043889 Figure 6 (c) is a fan filter single fan fan network generation - 〇 surface side horizontal section view, Figure 6 (d) is the fan 4 Qing 70 2 reading (perspective view). 8. In the case of (4), at least the following flat-shaped filter screen can be accommodated, and the shape of the rectangular parallelepiped can be exemplified. Protected to 2__, horizontal 5QQm, the size is preferably 500 mm, 7 7 ^ 5 〇〇 to 2 〇〇〇, height 5 〇 to 2 〇〇 leg. The electric fan 6 for sucking in the milk sucks air into the shroud u and passes it through the flat-shaped filter and net 8 described later, and the electric fan 6 for air intake is shown in Fig. 6(e). At least the fan unit 61, the motor unit 62, and the control unit 63 are included. Here, the fan unit 61 is not particularly limited as long as it can suck air and supply the sucked air to the flat plate (four) net 8, and examples thereof include a multi-blade air blower and a propeller fan. Further, the control unit 63 has a function of driving and stopping the fan, and specifically, it is constituted by a power source substrate, a control board, and the like. On the other hand, the flat mesh 8 is not particularly limited as long as the air sucked by the electric fan 6 can be highly purified, and a high-efficiency particle air filter (HEPA, which is a dust collecting filter) is exemplified. Ffigh Effidency Particulate Air Filter), ultra-high air efficiency filter (ULpA, which uses L〇w Penetration Air Filter), and a chemical filter filled with activated carbon or ion exchange tree. The above various screens may be laminated or used in parallel. In this case, one or two of the above various screens may be selected as the flat screen 8 on 099105778 11 201043889. Heat =: to (8), the outer edge of the shield U is provided with air circulation scattered ===:, the state of the structure, the external environment gas contact of the element 2, such as the side of the net single shield 11 all week . The α jin can be arranged in a frame shape in the aspect I of the present invention, as shown in the figure __ The gas circulation heat dissipation path 15 is disposed outside the shield wall 18 located on the flat plate _==' = empty Figure 3 (d) is a fan of the side of the workpiece rolling mill. Figure 7 (d) is a fan. Further, in the aspect of the present invention, the air circulation heat dissipation path 15 can be used to flatten the side of the shield wall. The air inflow of the net 8 is 2 m ° here. Figure 8 (4) is a cross-sectional view of the fan stencil 11 11 perpendicular to the two main surfaces, and the lower surface of the unit 2 (the discharge surface of the clean air) Figure, Figure is a fan filter unit 2 矣μ矣 and also 丨 ^ () 2 of the vertical frequency:: a map 'Figure exposed wind age network unit in Figure 6, Figure 7, Figure 8, path 15 Each corner is a right angle, 099105778 12 201043889 After considering the circulation of the air in the path (pressure loss), the ruts at each corner of the path 15 are gently curved. Further, since the number of corner portions of the path 15 is smaller, the circulation (pressure loss) of the air in the road segment is higher. Therefore, as shown in Figs. 6, 7, and 8, it is preferable to set the corner portion to four places. Or set the corner to 0 (the roller 15 is circular). In the aspect shown in FIG. 6, the path 15 is disposed on the side of the cover 1, so in the aspect shown in FIG. 6, when the corner of the path 丨5 is a gentle curve or the path 15 is a circle. In the case of shape, it is preferable that the corner portion of the shield u is also a gently curved shape or a circular shape as a whole. As shown in Fig. 6, when the air circulation heat dissipation path 15 is frame-arranged on the entire circumference of the side portion of the shroud 11, or as shown in Fig. 8, the shroud is disposed on the air inflow side of the flat-shaped crossing net 8. When the inner wall surface of the wall 18 is not increased in thickness in the direction perpendicular to the two main surfaces of the shield u constituting the fan screen S2, the surface of the semiconductor manufacturing apparatus or the FpD manufacturing apparatus may not be formed. The fan unit 2 is provided with a thickness (protrusion) to save space. The air circulation speed in the vicinity of the control portion 63 in the process cycle %, the heat dissipation path & 15 is preferably from 0 to h5 m/sec, more preferably from 1.5 to 2. G m/sec, and further more: 2, 〇 Up to 2,5 m/s. In the fan screen unit of the present invention, by setting the circulation speed of the dielectric within the above range, the temperature of the temperature can be suppressed by the control unit 63. The air in the cooling space 15 is not particularly limited, and is preliminarily purified by a clean room or the like. 099105778 13 201043889 ^ ίρυ In the aspect 1 of the side-by-side arrangement and accommodation for air intake of the present invention, as shown in Figs. 6(a) and 6(c), the fan portion 61 of the fan 6 and the flat filter are constructed. The net 8 is flat. Thus, by means of the inside of the shield, water is formed on both main surfaces of the shield 11 to reduce the arrangement of the fan portion 61 and the flat screen 8 side by side. 2 The shield 11 is perpendicular to the two main surfaces. The semiconductor manufacturing apparatus or the FPD manufacturing apparatus can be disposed without forming an additional thickness (protrusion), and the thickness in the direction of the fan filter unit can be realized, and the wall surface and space can be made. On the other hand, the manufacturing unit 63 constituting the air intake electric fan 6 shown in Fig. 7 and Fig. 6(C) is housed in the hexagonal cooling path 15 of the work rolling cycle. At this time, in view of the above-mentioned space saving, > Na, and δ, as shown in Fig. 6(c) and the like, it is preferable that the control unit 63 is also opposed to the fan unit 61 and the flat I mesh 8, and is in the shield 11 The middle is arranged side by side with the horizontal direction of the two main surfaces. In the aspect I of the month; in the aspect I of the pj?U, as shown in Figs. 6(a) to (4), the air sucked into the shield u through the fan portion 61 via the air introduction port 7 passes through the flat plate shape. The screen 8 is subjected to a cleaning treatment process, whereby the ambient gas 9 having improved cleaning degree is discharged to the outside of the fan screen unit 2 (inside of a semiconductor manufacturing apparatus or an FPD manufacturing apparatus or the like). As shown in Fig. 6 (a), (b), (d) and the like, the surface provided with the air introduction port 7 is set to be the same as the clear air discharge surface of the flat screen 8 When the screen unit 2 is provided in a semiconductor manufacturing apparatus or an FPD manufacturing apparatus, it is possible to make the air circulation of the inside of the apparatus such as the semiconductor manufacturing apparatus or the FPD manufacturing apparatus easy. On the other hand, as shown in Fig. 9(a) to (4), respectively, in comparison with Fig. 2 to (8), the 24~ port 7 can also be placed on the wall of the airflow shield wall of the flat-shaped crossing net 8, In this case, when the fan screen unit of the present invention is mounted on a wall surface of a semiconductor manufacturing apparatus or a manufacturing apparatus or the like, the air of the semiconductor manufacturing apparatus or the FpD manufacturing apparatus* can be easily sucked into the wind. _ within the shoulder unit. Fig. U) (8) to (4) are diagrams respectively corresponding to Figs. 6 (8) to (d), which are diagrams showing the flow of air in the circulating heat dissipation path 15 in the wind unit 2 shown in Fig. 6. As shown in Fig. ίο(4) (4) In the air circulation heat dissipation path 15 in which the control unit 63 of the electric fan 6 is disposed, the circulating air 17 heated by the heat discharged from the control unit 63 is circulated in the path 15 by natural convection. , as shown in Figure 1 (c) * can also be set in the path 15 包含 contains a spiral violet fan or multi-leaf
送風機等之空氣循制電域扇16，藉此使路徑15内之空 氣17之循環速度提高。 又，當將圖7麻之風_網單元2安裝於料體製造弟 置或製造裝置等〇卜㈣設置於料室内之情形時， 上述護罩壁18之㈣㈣會成為與潔淨室之内部環境氣靡 接觸之面，因此空氣循環散熱路徑15與料室之内部環移 氣體接觸之面積亦增加。而且，通常潔淨室内係藉由空㈣ 進行溫度管理，故可進喊高空氣於空氣 内循環之冷卻效率。 099105778 15 201043889 圖11至圖13絲示本發明之FFU之態樣π之圖。 如^所述，本發明之觸之態樣11係將構成電動風屬6 之風扇部6!與平板㈣網8於構成風機濾網單元2之護罩 11中與兩主表面垂直之方向並排而配置於護罩“内者。 圖11表示將空氣循環散熱路徑15框狀地設置於護罩u 之侧部全周而成之風機濾網單元，_ u(a)係相對於風機濾 網單元2之兩主表面之垂直剖視圖，圖剛係風機渡網: 元2之上表面侧水平剖視圖，圖11(幻係風機濾網單元2之 立體圖（透視圖）。 又，圖12表示將空氣循環散熱路徑15設置於位於平板狀 濾網8之空氣流入側的護罩壁18之外壁面上而成之風機濾 網單元，除了空氣循環散熱路徑I5之設置位置以外，圖12(幻 至圖12(c)係與圖li(a)至圖ii(c)分別對應之圖。 圖13表示空氣循環散熱路徑15設置於位於平板狀渡網8 之空氣流入側的護罩壁18之内壁面上之狀態，圖i3(a)至圖 13(c)除空氣循環散熱路徑15之設置位置以外，其餘分別與 圖11(a)至圖11(c)相對應。 於本發明之FFU之態樣II中，護罩11之形狀只要為其内 部至少可收納平板狀濾網8之形狀，則其並不受特別限制， 例如可列舉長方體形狀等。於護罩具有長方體狀之形狀之情 形時’其大小較佳為縱500 mm至2000 mm、橫500 mm至 2000 mm、高度 50 mm 至 200 mm 左右。 099105778 16 201043889 關；構成風屬部61之風扇之種類、控制部63之構成、平 板狀遽網8夕能w γ , 怒払、將空氣抽吸至護罩内並進行清淨化之態 ^工氣#環散熱路徑15内之空氣循環之態樣、空氣循環 政熱路彳二15内之空氣之循環速度等，則與上述本發明之 FFU之祕1中所制之内容相同。 如圖14所示，上述態樣1及態樣II所例示之本發明風機 ;慮、、祠單7L之整體形狀亦可為門狀。於該情形時，藉由於風機The air such as a blower circulates the electric area fan 16, whereby the circulation speed of the air 17 in the path 15 is increased. Further, when the wind _ net unit 2 of Fig. 7 is attached to the material manufacturing device or the manufacturing device or the like (4), the (4) (4) of the shroud wall 18 becomes the internal environment of the clean room. The gas contact surface, and therefore the area of the air circulation heat dissipation path 15 in contact with the inner annular gas of the chamber also increases. Moreover, in the clean room, the temperature is managed by the air (four), so that the cooling efficiency of circulating high air in the air can be called. 099105778 15 201043889 Figures 11 to 13 show a diagram of the aspect FF of the FFU of the present invention. As described in the above, the touch pattern 11 of the present invention will constitute the fan portion 6 of the electric wind genus 6 and the flat plate (four) net 8 side by side in the direction perpendicular to the two main surfaces of the shield 11 constituting the fan filter unit 2. In the case of the shroud, the fan filter unit is formed by arranging the air circulation heat dissipation path 15 in the frame on the side of the side of the shroud u, and the _u(a) is relative to the fan screen unit 2 A vertical cross-sectional view of the two main surfaces, the figure is a wind turbine crossing net: a horizontal cross-sectional view of the upper surface side of the element 2, and a perspective view of the magical fan filter unit 2 (perspective view). Moreover, FIG. 12 shows that the air is circulated for heat dissipation. The path 15 is disposed on the outer wall surface of the shroud wall 18 on the air inflow side of the flat screen 8, except for the position where the air circulation heat dissipation path I5 is disposed, FIG. 12 (phantom to FIG. 12 ( c) is a view corresponding to each of Figs. l(a) to ii(c). Fig. 13 shows that the air circulation heat dissipation path 15 is provided on the inner wall surface of the shroud wall 18 on the air inflow side of the flat web 8 State, Figures i3(a) to 13(c) except for the position where the air circulation heat dissipation path 15 is set, Corresponding to Fig. 11(a) to Fig. 11(c), respectively, in the aspect II of the FFU of the present invention, the shape of the shield 11 is as long as it can accommodate at least the shape of the flat screen 8 in its interior. It is not particularly limited, and examples thereof include a rectangular parallelepiped shape, etc. When the shield has a rectangular parallelepiped shape, the size thereof is preferably 500 mm to 2000 mm in length, 500 mm to 2000 mm in width, and 50 mm to 200 mm in height. 099105778 16 201043889 OFF; the type of the fan constituting the wind portion 61, the configuration of the control unit 63, the flat-shaped cymbal net 8 能 w w γ, roaring, pumping air into the shield and purifying it ^ The air circulation state in the air circulation path 15 and the air circulation speed in the air circulation political heat circuit 15 are the same as those in the above-mentioned FFU secret 1 of the present invention. 14 shows the fan of the present invention as exemplified in the above aspect 1 and the aspect II; the overall shape of the 7L can be a gate shape. In this case, the fan is used.
處網单7C設置握持部19等，使其亦兼具門之功能，而當將 風機濾，’周單元設置於半導體製造裝置或FPD製造裝置等之 外壁時’可削減半導體製造裝置或FPD製造裝置等之構成 V件數又，可減少面向外部之開口數，而可提高裝置内部 之二氣π /爭性。特別係藉由將本發明之FFIJ之態樣I之風 機;慮’周單元的整體形狀設為Η狀，可提供進而薄型之η狀風 機滤·網單元。 〇於本發明之風機遽網單元2中，如圖6(a)至(d)及圖u⑷ ()斤例示與藉由平板狀濾、網8而將由空氣吸入用電動 扇所吸入之空氣進行清淨化之路徑相獨立，於護罩11 "卜緣u工氣循環散熱路徑15 ’並於該空氣循環散熱 路徑15内配置構成電動風扇6之控制部63,藉此可在不受 上述清淨化之氣流之影響下使控制部63 之環境氣體循環 而有效地進行散熱、冷卻。又，可防止自構成電動風扇6 之基板等之控制部63所產生之微粒子或雜質氣體擴散至風 099105778 17 201043889 機濾網單元2之外部空間（潔淨室之内部空間等）。 如此，本發明風機濾網單元可抑制内部溫度之上升且可將 所吸入之空氣高度地清淨化，因此例如藉由將本發明之風機 濾網單元設置於外壁面，可提供較佳之半導體製造裝置或 FPD製造裝置，又，藉由將本發明之風機濾網單元設置於外 壁面，亦可提供較佳之潔淨台。 其次，說明本發明之半導體製造裝置或FPD製造裝置。 本發明之半導體製造裝置或FPD製造裝置之特徵在於， 將本發明之風機濾網單元設置於外壁面上。 圖15表示將本發明之風機濾網單元2設置於側面上之半 導體製造裝置或FPD製造裝置3,風機濾網單元2之設置位 置可如圖15所示，為半導體製造裝置或FPD製造裝置3之 側面，亦可為上表面。 又，如圖15所示，風機濾網單元2之整體形狀為門狀， 且亦兼具門之功能，藉此當將該風機濾網單元2設置於半導 體製造裝置或FPD製造裝置上時，可削減半導體製造裝置 或FPD製造裝置之構成零件數，且可減少面向外部之開口 數，提高半導體製造裝置或FPD製造裝置内部之空氣清淨 性。 於本發明之半導體製造裝置或FPD製造裝置中，風機濾 網單元之運轉條件與上述條件相同。 如圖15所示，本發明之半導體製造裝置或FPD製造裝置 099105778 18 201043889 中其内部所形成之空間係藉由風機濾網單元而抽吸空氣之 空間，同時係排出清淨化之空氣之空間，藉此可使半導體製 造裝置或FPD製造裝置内部之空氣循環，並使環境氣體空 氣進而清淨化。The network unit 7C is provided with the grip portion 19 and the like so as to have the function of a door. When the fan is filtered and the 'week unit is installed on the outer wall of the semiconductor manufacturing device or the FPD manufacturing device, the semiconductor manufacturing device or the FPD can be cut. The number of V-pieces of the manufacturing apparatus and the like can reduce the number of openings facing the outside, and can improve the two-gas π/content of the inside of the device. In particular, the wind turbine of the FFIJ aspect of the present invention can be provided with a thinner η-shaped air filter unit. In the fan unit 2 of the present invention, as shown in Figs. 6(a) to (d) and Fig. 4(4), the air sucked by the electric fan for air intake by the flat filter or the net 8 is carried out. The clearing and purifying paths are independent, and the control unit 63 constituting the electric fan 6 is disposed in the air-conditioning heat-dissipating path 15 in the shroud 11 " Under the influence of the gas flow, the ambient gas of the control unit 63 is circulated to efficiently dissipate heat and cool. Further, it is possible to prevent the fine particles or the impurity gas generated from the control unit 63 of the substrate or the like constituting the electric fan 6 from diffusing into the external space (the internal space of the clean room, etc.) of the wind filter unit 2 of the wind 099105778 17 201043889. Thus, the fan screen unit of the present invention can suppress the rise of the internal temperature and can highly purify the inhaled air, so that a preferred semiconductor manufacturing apparatus can be provided, for example, by providing the fan screen unit of the present invention on the outer wall surface. Alternatively, the FPD manufacturing apparatus can provide a better cleaning station by arranging the fan screen unit of the present invention on the outer wall surface. Next, a semiconductor manufacturing apparatus or an FPD manufacturing apparatus of the present invention will be described. The semiconductor manufacturing apparatus or the FPD manufacturing apparatus of the present invention is characterized in that the fan screen unit of the present invention is provided on an outer wall surface. Fig. 15 shows a semiconductor manufacturing apparatus or FPD manufacturing apparatus 3 in which the fan screen unit 2 of the present invention is disposed on the side surface, and the fan screen unit 2 is disposed at a position as shown in Fig. 15, which is a semiconductor manufacturing apparatus or an FPD manufacturing apparatus 3. The side can also be the upper surface. Moreover, as shown in FIG. 15, the overall shape of the fan screen unit 2 is a door shape and also functions as a door, whereby when the fan screen unit 2 is placed on a semiconductor manufacturing apparatus or an FPD manufacturing apparatus, The number of components of the semiconductor manufacturing apparatus or the FPD manufacturing apparatus can be reduced, and the number of openings facing the outside can be reduced, and the air purification property inside the semiconductor manufacturing apparatus or the FPD manufacturing apparatus can be improved. In the semiconductor manufacturing apparatus or the FPD manufacturing apparatus of the present invention, the operating conditions of the fan screen unit are the same as those described above. As shown in FIG. 15, the space formed in the semiconductor manufacturing apparatus or the FPD manufacturing apparatus of the present invention 099105778 18 201043889 is a space for sucking air by a fan filter unit, and simultaneously discharging a space for purifying the clean air. Thereby, the air inside the semiconductor manufacturing apparatus or the FPD manufacturing apparatus can be circulated, and the ambient gas air can be further purified.
本發明之半導體製造裝置或FPD製造裝置係使用本發明 .之風機濾網單元，故可抑制風機濾網單元内部之溫度上升， 且可於高度清淨化之空氣環境下穩定地製造半導體及FPD 耸。 Ό 又，藉由將本發明之風機濾網單元設置於外壁面，亦可提 供較佳之潔淨台。於該情形時，風機濾網單元設置於外壁面 之態樣等係與上述本發明之半導體製造裝置或FPD製造裝 置相同。將外壁面設置本發明之風機濾網而成的潔淨台設置 於潔淨室内，且於潔淨台内部收容既存之半導體製造裝置或 FPD製造裝置等，或者收容本發明之半導體製造裝置或FPD vQ 製造裝置等，藉此可於高度清淨化之空氣環境下穩定地製造 半導體及FPD等。 於將具有圖15所示形態之風機濾網單元(護罩為縱1630 mm、橫770 mm、深度160 mm之長方體狀，且空氣循環散 熱路徑之空氣流動方向之長度（空氣於空氣循環散熱路徑内 每循環1周之距離）為4810 mm，相對於空氣流動方向之垂 直截面積（空氣循環散熱路徑之截面積）為1500 mm2)設置於 外壁面之半導體製造裝置中，使風機濾網單元作動，且在自 099105778 19 201043889 平板狀濾網排出的清淨化空氣之排出速度為0.3 m/秒、空氣 循環散熱路徑之控制部附近之空氣之流速為1.6 m/秒之條 件下進行運轉時，於周圍之環境氣體溫度為50°C之環境 下，空氣循環散熱路徑中之控制基板正上方空間之溫度僅上 升至56.5°C。相對於此，使用外壁面設置有不具有上述空氣 循環散熱路徑的風機濾網單元之同樣半導體製造裝置，且同 樣地進行運轉時，於周圍之環境氣體溫度為50°C之環境 下，控制基板正上方空間之溫度則上升至75.1°C。 其次，說明本發明之清淨化空氣之製造方法。 本發明之清淨化空氣之製造方法之特徵在於，藉由配置於 潔淨室内的本發明之半導體製造裝置或FPD製造裝置，而 對空氣進行清淨化處理。 如圖16所示，於潔淨室1内部設置外壁面設置有風機濾 網單元2之半導體製造裝置或FPD製造裝置3,且於藉由配 置於潔淨室1頂部之風機濾網單元4而對空氣進行預清淨化 之空間内，使半導體製造裝置或FPD製造裝置3中所設置 之風機濾網單元2作動，對半導體製造裝置或FPD製造裝 置3内之空氣進行清淨化處理，藉此可向半導體製造裝置或 FPD製造裝置3内供給清淨化空氣。 又，將外壁面設有本發明風機濾網單元之潔淨台配置於潔 淨室内，且於潔淨台内部收容既存之半導體製造裝置或FPD 製造裝置等，或者收容本發明之半導體製造裝置或FPD製 099105778 20 201043889 造裝置等，使設置於該等裝置之風機濾網單元作動，對裝置 内部之空氣進行清淨化處理，藉此亦可向半導體製造裝置或 FPD製造裝置内部供給清淨化空氣。 (產業上之可利用性） _ 根據本發明，可提供一種能夠抑制内部溫度之上升且可將 . 所吸入之空氣高度地清淨化之風機濾網單元，又，可提供一 種設置有上述風機濾網單元之FPD製造裝置及使用該半導 ^ 體製造裝置或FPD製造裝置之清淨化空氣之製造方法。 【圖式簡單說明】 圖1係表示通常之半導體製造裝置或FPD製造裝置之構 成之圖。 圖2係表示通常之風機濾網單元之構成之圖。 圖3係表示通常之半導體製造裝置或FPD製造裝置之構 成之圖。 Q 圖4係表示設置有具有開放部之風機濾網單元部之半導 體製造裝置或FPD製造裝置之圖。 圖5係表示設置有具有開放部及冷卻風扇之風機濾網單 ' 元之半導體製造裝置或FPD製造裝置之圖。 圖6係表示本發明風機濾網單元之一例之圖。 圖7係表示本發明風機濾網單元之一例之圖。 圖8係表示本發明風機濾網單元之一例之圖。 圖9係表示本發明風機濾網單元之一例之圖。 099105778 21 201043889 圖ίο係表示本發明風機濾網單元之一例之圖。 圖11係表示本發明風機濾網單元之一例之圖。 圖12係表示本發明風機濾網單元之一例之圖。 圖13係表示本發明風機濾網單元之一例之圖。 圖14係表示本發明風機濾網單元之一例之圖。 圖15係表示本發明半導體製造裝置或FPD製造裝置之一 例之圖。 圖16係表示本發明清淨化空氣之製造方法之圖。 【主要元件符號說明】 1 潔淨室 2 風機濾網單元 3 半導體製造裝置或FPD製造裝置 4 風機濾網單元 5 預清淨化之空氣 6 電動風扇 61 風扇部 62 馬達部 63 控制部 7 空氣引入口 8 濾網 9 經清淨化之空氣 10 作業空間 099105778 22 201043889 11 護罩 12 開放部分 13 冷卻風扇 14 潔淨室之内部空間 15 空氣循環散熱路徑 16 空氣循環用電動風扇 17 循環空氣 18 護罩壁 19 握持部 ❹ 099105778 23The semiconductor manufacturing apparatus or the FPD manufacturing apparatus of the present invention uses the fan filter unit of the present invention, so that the temperature rise inside the fan screen unit can be suppressed, and the semiconductor and the FPD can be stably manufactured in a highly clean air environment. . Further, by providing the fan screen unit of the present invention on the outer wall surface, a better clean table can be provided. In this case, the aspect in which the fan screen unit is provided on the outer wall surface is the same as that of the above-described semiconductor manufacturing apparatus or FPD manufacturing apparatus of the present invention. A clean table in which the fan screen of the present invention is provided on the outer wall surface is installed in the clean room, and the existing semiconductor manufacturing device, FPD manufacturing device, or the like is housed in the clean table, or the semiconductor manufacturing device or the FPD vQ manufacturing device of the present invention is housed. In this way, semiconductors, FPDs, and the like can be stably manufactured in a highly cleaned air environment. The fan screen unit having the shape shown in Fig. 15 (the shield is a rectangular parallelepiped shape of 1630 mm in length, 770 mm in width, and 160 mm in depth, and the length of the air flow direction of the air circulation heat dissipation path (air circulation path in the air circulation) The distance per one cycle per cycle is 4810 mm, and the vertical cross-sectional area with respect to the air flow direction (the cross-sectional area of the air circulation heat dissipation path) is 1500 mm 2 ) is disposed in the semiconductor manufacturing device of the outer wall surface to activate the fan filter unit And when the discharge speed of the purge air discharged from the flat filter of 099105778 19 201043889 is 0.3 m/sec, and the flow rate of the air near the control section of the air circulation heat dissipation path is 1.6 m/sec, In the environment where the ambient gas temperature is 50 ° C, the temperature in the space directly above the control substrate in the air circulation heat dissipation path only rises to 56.5 ° C. On the other hand, in the same semiconductor manufacturing apparatus in which the fan screen unit which does not have the above-mentioned air circulation heat-dissipation path is provided in the outer wall surface, and the operation is performed similarly, the control substrate is provided in the environment where the surrounding ambient gas temperature is 50 degreeC. The temperature in the space above it rises to 75.1 °C. Next, a method of producing the purified air of the present invention will be described. The method for producing purified air according to the present invention is characterized in that the air is subjected to a purification treatment by the semiconductor manufacturing apparatus or the FPD manufacturing apparatus of the present invention disposed in a clean room. As shown in FIG. 16, a semiconductor manufacturing apparatus or an FPD manufacturing apparatus 3 provided with a fan screen unit 2 on the outer wall surface is provided inside the clean room 1, and the air is supplied to the air by the fan filter unit 4 disposed at the top of the clean room 1. In the space where the pre-purification is performed, the fan filter unit 2 provided in the semiconductor manufacturing apparatus or the FPD manufacturing apparatus 3 is operated to purify the air in the semiconductor manufacturing apparatus or the FPD manufacturing apparatus 3, thereby enabling the semiconductor to be cleaned. Purified air is supplied into the manufacturing apparatus or the FPD manufacturing apparatus 3. Further, the clean table in which the fan screen unit of the present invention is provided on the outer wall surface is disposed in the clean room, and the existing semiconductor manufacturing device, FPD manufacturing device, or the like is housed in the clean table, or the semiconductor manufacturing device of the present invention or the FPD system 099105778 is housed. 20 201043889 A device or the like that operates a fan screen unit provided in the devices to clean the air inside the device, thereby supplying clean air to the inside of the semiconductor manufacturing device or the FPD manufacturing device. (Industrial Applicability) According to the present invention, it is possible to provide a fan filter unit capable of suppressing an increase in internal temperature and highly purifying the inhaled air, and further providing a fan filter provided The FPD manufacturing apparatus of the net unit and the manufacturing method of the purified air using the semi-conductor manufacturing apparatus or the FPD manufacturing apparatus. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the configuration of a general semiconductor manufacturing apparatus or an FPD manufacturing apparatus. Fig. 2 is a view showing the configuration of a conventional fan filter unit. Fig. 3 is a view showing the configuration of a general semiconductor manufacturing apparatus or an FPD manufacturing apparatus. Q Fig. 4 is a view showing a semiconductor manufacturing apparatus or an FPD manufacturing apparatus provided with a fan screen unit portion having an open portion. Fig. 5 is a view showing a semiconductor manufacturing apparatus or an FPD manufacturing apparatus provided with a fan filter unit having an opening portion and a cooling fan. Fig. 6 is a view showing an example of the fan screen unit of the present invention. Fig. 7 is a view showing an example of the fan screen unit of the present invention. Fig. 8 is a view showing an example of the fan screen unit of the present invention. Fig. 9 is a view showing an example of the fan screen unit of the present invention. 099105778 21 201043889 Fig. 1 is a view showing an example of a fan filter unit of the present invention. Figure 11 is a view showing an example of the fan screen unit of the present invention. Fig. 12 is a view showing an example of the fan screen unit of the present invention. Fig. 13 is a view showing an example of the fan screen unit of the present invention. Fig. 14 is a view showing an example of the fan screen unit of the present invention. Fig. 15 is a view showing an example of a semiconductor manufacturing apparatus or an FPD manufacturing apparatus of the present invention. Fig. 16 is a view showing a method of producing purified air of the present invention. [Main component symbol description] 1 Clean room 2 Fan filter unit 3 Semiconductor manufacturing device or FPD manufacturing device 4 Fan filter unit 5 Pre-cleaned air 6 Electric fan 61 Fan unit 62 Motor unit 63 Control unit 7 Air introduction port 8 Filter 9 Cleaned air 10 Working space 099105778 22 201043889 11 Shroud 12 Open part 13 Cooling fan 14 Clean room internal space 15 Air circulation heat dissipation path 16 Air circulation electric fan 17 Circulating air 18 Shield wall 19 Holding Department ❹ 099105778 23
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009051888A JP5507095B2 (en) | 2009-03-05 | 2009-03-05 | Fan filter unit, semiconductor manufacturing apparatus, flat panel display manufacturing apparatus, and method of manufacturing purified air |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201043889A true TW201043889A (en) | 2010-12-16 |
Family
ID=42689221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099105778A TW201043889A (en) | 2009-03-05 | 2010-03-01 | Fan filter unit, semiconductor production apparatus, flat panel display production apparatus, and method for producing purified air |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5507095B2 (en) |
| KR (1) | KR20100100660A (en) |
| CN (1) | CN101825118A (en) |
| TW (1) | TW201043889A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101616274B1 (en) * | 2015-10-15 | 2016-04-28 | 서현교 | Turbo blower with waterproofing and dampproofing function |
| JP7485963B2 (en) * | 2021-10-28 | 2024-05-17 | ダイキン工業株式会社 | Ceiling-mounted air conditioner |
| CN114472363B (en) * | 2022-02-15 | 2023-06-02 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Gas bath system for semiconductor equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0544216U (en) * | 1991-11-26 | 1993-06-15 | 松下電器産業株式会社 | Automotive air purifier |
| JP3342531B2 (en) * | 1993-04-13 | 2002-11-11 | 東京エレクトロン株式会社 | Semiconductor manufacturing air filter device and semiconductor processing apparatus provided with air filter device |
| JP4166359B2 (en) * | 1999-03-25 | 2008-10-15 | 松下エコシステムズ株式会社 | Fan filter unit |
| JP4260588B2 (en) * | 2003-09-22 | 2009-04-30 | ウシオ電機株式会社 | High voltage pulse generator and discharge excitation gas laser apparatus equipped with high voltage pulse generator |
-
2009
- 2009-03-05 JP JP2009051888A patent/JP5507095B2/en active Active
-
2010
- 2010-03-01 TW TW099105778A patent/TW201043889A/en unknown
- 2010-03-04 KR KR1020100019359A patent/KR20100100660A/en not_active Application Discontinuation
- 2010-03-05 CN CN201010130239A patent/CN101825118A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100100660A (en) | 2010-09-15 |
| JP5507095B2 (en) | 2014-05-28 |
| CN101825118A (en) | 2010-09-08 |
| JP2010203725A (en) | 2010-09-16 |
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