201042516 六、發明說明： 【發明所屬之技術領域】 關於一 本發明係關於-_控©板及·造方法 種電容式觸控面板及其製造方法。 、玲、 【先前技術】 、為提昇現代人的便利性，人性化介面曰益深入吾 生活，觸控面板隨之普及各類工商、娛樂 常 Ο ❹ 提款機、手提電腦、行動電話、及導覽系統等。目^，觸$ 波式及光科· _。 細式，式、超音 、，其中’電容式馳秘的原__手域其鱗 碰而發生電容感應，故觸控感紐能十分良好。近來，更因 =pple iPhone產品的開發，進—步帶動電容式觸控面板的風 潮，而應用於小型高單價的消費性電子產品。 第1圖係例示已知電谷式觸控面板的簡化製程。請參閱 1圖，首先提供-素玻璃_η細)入料(步驟sl〇i)，作為沉 積其他導紐制餘；_ __如雜法⑽及微影與 ，刻法，於該基板的邊緣區域上形成對位標記(步驟si〇2)。接 者，為了在基板上形成複數個單元觸控面板，可利用塗佈法， 例如利職鍍法，於其上形成—IT〇 (indium tin Qxide，氧脑 錫)層(步驟sl03)，利用微影及钱刻法令該ιτ〇層形成 ΙΤΟ縱 向電極(步驟趨）；_塗佈法於其上形成—介電層作為絕緣 曰（步驟S105) ’再利用塗佈法於其上形成—ΙΤ〇層（步驟 sl〇6)’利用微衫及蝕刻法令該IT〇層形成EG橫向電極(步驟 祕），利用塗佈法於其上形成一金屬層(步驟⑽）；利用微影 3 201042516 及關法令該金屬層職金屬走_ _(步驟_);利用塗 佈法形成-保護層(步驟sllG)，其材料可為氮化邦陶、氣 氧化矽(SiNxOy) '氧化矽(Si0x)或丙烯酸樹月旨(Ac啡c resin); 利用微影及_法軸開σ(步驟slu)，令 露，得以提供訊號外送的電性連接處；則此等結構形成一電容 式觸控面板而出料(步驟S112)。 /因此，上述no縱向電極、絕緣層、及ιτ〇橫向電極所 形成的電容結構，對於外來導電體(例如手指)觸碰所產生的電 流變化’能精雜算出X軸與Υ轴的位置；而上述金屬走線 係作為訊號導通之用途。因此，須藉由上述步驟s廳至祕 以連接ITO電極與金屬走線。 然而，為了形成精密的ITO電極及金屬走線，在觸控_ 5當中，需有多道光罩絲精密的電極及走線等圖案。舉例 而言’請參考第2圖，其為習知電容摘控面板製程中的光罩 ^意圖’主要表示針對單元面板的光罩設計。如第2圖所 Z ’習知的難面板餘’齡別棚絲ml絲精密的複 =極圖案pl(參考第2 _)及光罩m2定義精密的複數走線 ，案P2(參考第2圖⑽。因此，在上述已知製程中，至少需有 疋義標記、縱向電極、橫向電極及金屬走線等四道光罩， 亦可能另需要㈣保護層開σ的光罩。此外，為了達到ιτ〇 ，極與金屬走鱗確減的目的，在製程#中f借助精度較高 里機台，使得光罩與基板上的對位標記可達顺確對準的效 因此，此製程所耗費的成本甚高，但解析度與 恐有限。 卞又I丨7 職是之故，發明人鋥於以習知技術中，對於對位精確度 、要求較高’需製側案_的光輕錢精度較高的設備， 201042516 而耗費較南成本等問題，經過悉心試驗與研究，並一本鐵而不 捨之精神，終構思出本案「觸控面板及其製造方法」，不僅能 克服上述問題’且依然可達到良好的觸控感應性能，以下為本 案之簡要說明。 【發明内容】 Ο 〇 有鑑於先前技術有關對位精準度的問題，發明人經反覆思 ί後，提出本發_控面板及其製造方法。本發_控面板的 造方法，主制用啊_化透_電層及金屬I，而後去 ，該金屬射專屬於透科電層的圖案，_麵化過程中 準的絲，明加透料電纽金屬顧案的對位 二二!此，本發明的製造方法可充分降低為達對位精準而 =的成本4可達顺優越_位鮮度及_化解析度。 此:本發明_控面板仍具有相纽好_控感應性能。 製迭想在於提供一種觸控面板的製造方法。此 对明形成—咖導電層，形成—金屬層於 —層個組-帛-，則每 該第^：圖案的外緣），以及去除該金屬層之該^圖圖案ί連接於 成於=上她職之_，其巾物導電層係形 較佳地’本發明所提供之該方法，其中 電極的圖案，該第二圖案為複數 /圖木為複數 處。_端係各別連接於該等複數電極的訊號輸出 較佳地’本發明所提供之該方法，其中係利用微影及_ 5 201042516 法以同時圖案化該透明導電層及該金屬層。其中，該微影法顯 示該等圖案於該透明導電層及該金屬層上，該等圖案係經由一 光罩而定義；再者，該蝕刻法去除該透明導電層及該金屬層之 未顯示該等圖案的區域。 較佳地，本發明所提供之該方法，其中該利用微影及蝕刻 法以同時圖案化該透明導電層及該金屬層的過程包含以下步 驟.塗佈一感光材料層於該金屬層上，利用定義該等圖案的該 光罩進行曝光，以於該感光材料層上進行顯影，根據經顯影的 該感光材料層蝕刻該透明導電層及該金屬層，以及去除經顯影 的該感光材料層。 ' 較佳地，本發明所提供之該方法，其中係以一正光阻層作 為該感光材料層而塗佈於該金屬層上，而該光罩係利用一遮光 部以定義該等圖案。 ' 較佳地，本發明所提供之該方法，其中細—負光阻層作 為該感光材料層而塗佈於該金屬層上，該鮮係糊一透光部 以定義該等圖案。 較佳地，本發明所提供之該方法，其中係利用微影及網印 法其中之-以及選雜闕法以去_金屬狀該第一圖 案。其中’由該微影法及該網印法其中之—顯示—保留區於該 金屬層上’該保留區不包括該第—職部分的分佈範圍但至少 包括該第二_部分的分佈範圍；該麵性_法去除該金屬 層之未顯示該保留區的部份。 較佳地，本發騎提供之該方法，其中該微影及選擇 性钱刻法以去除該金屬層之該第__部分的難包含以下 步驟：塗佈-感光材料層於該金屬層上，彻定義該保留區的 -光罩進行曝光，且霞感光材層上進行顯影，根據經顯影的 201042516 該感光材料層以選擇性姓刻該金屬層，以及去除經顯影的該感 光材料層。 人 較佳地，本發明所提供之該方法，其中係以一正光阻層作 為該感光材料層而塗佈於該金屬層上，而該光罩係利用一遮光 部以定義該區域。 較佳地，本發明所提供之該方法，其中係以一負光阻層作 為該感光材料層而塗佈於該金屬層上，而該光罩係利用一透光 部以定義該區域。 Ο201042516 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a capacitive touch panel and a method of manufacturing the same. , Ling, [pre-technical], in order to enhance the convenience of modern people, the humanized interface benefits into my life, and the touch panel has become popular with all kinds of businesses, entertainment, 提 cash machines, laptops, mobile phones, and Navigation system, etc. Eye ^, touch $ wave and light · · _. Fine, style, supersonic, and the 'capacitor type secret __ hand field its scale touch and capacitive sensing, so the touch sense can be very good. Recently, due to the development of the =pple iPhone product, the trend of capacitive touch panels has been driven, and it has been applied to small, high-priced consumer electronics. FIG. 1 illustrates a simplified process of a known electric valley touch panel. Please refer to Fig. 1, firstly provide --glass _η fine) feed (step sl〇i), as deposition of other guides; ___ such as hybrid (10) and lithography, engraving, on the substrate A registration mark is formed on the edge region (step si〇2). In order to form a plurality of unit touch panels on the substrate, a coating method, such as a job plating method, may be used to form an indium tin Qxide layer (step s103). The lithography and the engraving method form the ΙΤΟττ layer to form a vertical electrode (step); the coating method is formed thereon - the dielectric layer is used as the insulating ruthenium (step S105) 're-use coating method to form thereon ΙΤ The ruthenium layer (step sl 〇 6) 'forms the ITO lateral electrode by using a micro-shirt and etching method to form an EG lateral electrode (step secret), and forms a metal layer thereon by a coating method (step (10)); using lithography 3 201042516 and The law of the metal layer metal _ _ (step _); using a coating method to form a protective layer (step sllG), the material may be nitriding state, gas yttrium oxide (SiNxOy) 'yttrium oxide (Si0x) or Acrylic resin; using lithography and _-axis σ (step slu) to provide an electrical connection for signal delivery; then these structures form a capacitive touch panel And discharging (step S112). / Therefore, the capacitance structure formed by the above-mentioned no-longitudinal electrode, insulating layer, and 〇τ〇 lateral electrode can accurately calculate the position of the X-axis and the Υ-axis for the change of the current generated by the contact of the external conductor (for example, a finger); The above metal traces are used for signal conduction. Therefore, the ITO electrode and the metal trace must be connected by the above steps. However, in order to form a precise ITO electrode and a metal trace, in the touch _ 5, a plurality of patterns of precise electrodes and traces of the mask wire are required. For example, please refer to Fig. 2, which is a mask in the conventional capacitor pick-up panel process. The intention is to mainly indicate the mask design for the unit panel. As shown in Fig. 2, the '''''''''''' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Figure (10). Therefore, in the above known processes, at least four masks, such as a 疋 mark, a longitudinal electrode, a lateral electrode, and a metal trace, are required, and a mask of σ σ may be additionally required. Ιτ〇, the purpose of the pole and the metal scale reduction, in the process # f with the higher precision machine, so that the alignment mark on the mask and the substrate can be aligned correctly, so the process costs The cost is very high, but the resolution and fear are limited. 卞I I7 is the reason, the inventor is in the traditional technology, for the accuracy of the alignment, the demand is higher The equipment with high precision of money, 201042516, and the problem of costing more than the south, after careful experimentation and research, and the spirit of perseverance, finally conceived the "touch panel and its manufacturing method", which can not only overcome the above Problem 'and still achieve good touch sensing performance, the following is the basis Brief Description of the Invention [Invention] In view of the problem of the prior art relating to the accuracy of the alignment, the inventor has proposed the present invention, the control panel and the method of manufacturing the same. The main system is _ _ _ _ electric layer and metal I, and then go, the metal shot is exclusively for the pattern of the trans-electrical layer, _ the surface of the quasi-filament, the Ming and the translucent electric metal metal case 22: Thus, the manufacturing method of the present invention can be sufficiently reduced to achieve the accuracy of the alignment and the cost of the 4 can reach the superior _ position freshness and _ resolution. This: the invention _ control panel still has a good contrast _ control Inductive performance. The method of manufacturing a touch panel is to provide a method for manufacturing a touch panel, which is formed by forming a conductive layer of a coffee layer, forming a metal layer on a layer of a layer, and then forming an outer edge of the pattern: And removing the metal layer, the pattern ί is connected to the _, the towel conductive layer is preferably the method provided by the present invention, wherein the pattern of the electrode, the second pattern For the plural / map wood for the plural. The signal output to each of the plurality of electrodes is preferably the method provided by the present invention, wherein the transparent conductive layer and the metal layer are simultaneously patterned by lithography and _ 5 201042516. The lithography method displays the patterns on the transparent conductive layer and the metal layer, and the patterns are defined by a mask; further, the etching removes the transparent conductive layer and the metal layer is not displayed. The area of the pattern. Preferably, the method provided by the present invention, wherein the process of simultaneously patterning the transparent conductive layer and the metal layer by using lithography and etching comprises the steps of: coating a layer of photosensitive material on the metal layer, Exposure is performed using the mask defining the patterns to develop on the photosensitive material layer, etching the transparent conductive layer and the metal layer according to the developed photosensitive material layer, and removing the developed photosensitive material layer. Preferably, the method of the present invention is applied to the metal layer with a positive photoresist layer as the photosensitive material layer, and the photomask utilizes a light shielding portion to define the patterns. Preferably, the method of the present invention, wherein a fine-negative photoresist layer is applied as a layer of the photosensitive material to the metal layer, the fresh paste being a light transmitting portion to define the patterns. Preferably, the method provided by the present invention utilizes the lithography and screen printing methods, and the method of selecting a hybrid method to remove the first pattern. Wherein 'the lithography method and the screen printing method - display - the reserved area on the metal layer'" the reserved area does not include the distribution range of the first part, but at least includes the distribution range of the second part; The facet method removes portions of the metal layer that do not show the reserved area. Preferably, the method provided by the present invention, wherein the lithography and selective etching to remove the __ portion of the metal layer comprises the following steps: coating a photosensitive material layer on the metal layer The mask of the reserved area is completely exposed for exposure, and development is performed on the layer of the photosensitive material. According to the developed 201042516, the layer of the photosensitive material is selectively engraved with the metal layer, and the developed layer of the photosensitive material is removed. Preferably, the method of the present invention provides a method in which a positive photoresist layer is applied to the metal layer as a layer of photosensitive material, and the mask utilizes a light shielding portion to define the region. Preferably, the method of the present invention is applied to the metal layer by using a negative photoresist layer as the photosensitive material layer, and the photomask utilizes a light transmissive portion to define the region. Ο
較佳地，本發明所提供之該方法，其中該利用網印及選擇 性蝕刻法以去除該金屬層之該第一圖案的過程包含以下步 驟：利用網印塗佈-防钱刻材料層於該金屬I上，令該防姓刻 材料層覆蓋於該金騎之該保，選擇性_未經覆蓋的該 金屬層，以及去除該防蝕刻材料層。 本發明之第二才鼻想在☆触一種觸控面板的製造方法。此 製造方法包含以下步驟：提供—基板，形成至少—對位標記 (alignment mark)於該基板的邊緣區域上，形成一第一透明導電 層於該基板上’随化該第—咖導電層以產生沿—第一方向 排列的複錢極’形成-介電層於該數電極上，形成一第 二透明導電層於該介電層上’形成一金屬層於該第二透明導電 層上=_案傾第二翻導電敍屬相令該等層皆 ^生呈沿-第二方向排列的複數電極的—圖案及呈複數走線 的一圖案⑽等走_-齡_胁沿 馳號輸域），及去除該金屬層之呈該特= 極的該圖案。 & 較佳地’本發明所提供之該方法，其中係 法形成該對位標記，並以-光罩定義該對位標記的圖^。/ 7 201042516 ，佳地，本發明所提供之該綠，其中係微影及触刻 ==化該第-透明導電層以產生沿該第—方向排列的該等 複數’並以-光罩定義該等複㈣極的圖案。 ^佳地，本發騎提供之財法，其巾係利賴影及钱刻 化補二翻導電層及該金顧，並以-光罩定義 t第—方向排列的複數電極的該圖案及呈該等複數走線 、“ f二本發明所提供之該方法，其中係利用微影及侧 二:金屬層之呈該等複數電極的該圖案，由該微影法顯示 圖幸屬層上’該保留區不包括呈該等複數電極的該 =的佈_但至少包括呈料複數走__案的分佈 範圍1_法去除該金屬層之未顯示該保留區的部份。 較佳地，本發明所提供之該方法，其中係利用網印及侧 法去除該金屬層之呈該等複數電極的關案，該網印法顯示一 保=^該金屬層上，該保龍不包括呈沿該第二方向排列的 圖案的分佈範圍但至少包括呈該等複數走線的 =案的》佈_’該_法去除該金屬層之未顯示該保留區 的邵份。 較佳地，本發明所提供之該方法，另包含：形成—保護層 於經圖案化的該第二透卿電層及該金屬層上。’、 所提供之財法，其情_微影及侧 屬走線外露。 先罩疋義一開口，該開口令該等金 制、告第三構想在於提供—種驗面板的製造方法。此 衣a / L3町步驟：提供—基板，形成—第-透明 於該基板上’形成—金屬層於該第-透明導電層上，同時圖i 201042516 化該第一透明導電層及該金屬層以令該等層皆產生呈沿一第 一方向排列的複數電極的一圖案、呈複數走線的一圖案^至少 一對位標記，去除該金屬層之呈該等複數電極的該圖案，形成 一介電層於經圖案化的該第一透明導電層及該金屬層上，形成 -第二透明導電層於該介電層上，及圖案化該第二透明導電層 以產生沿一第二方向排列的複數電極。其中，該等第一或第: 方向排列的複數電極的訊號輸出處各別連接於該等走線的一 端。Preferably, the method provided by the present invention, wherein the process of removing the first pattern of the metal layer by screen printing and selective etching comprises the steps of: using a screen printing-anti-etching material layer On the metal I, the anti-surname material layer is covered by the gold riding, the metal layer is selectively covered, and the anti-etching material layer is removed. The second aspect of the present invention is intended to be a method of manufacturing a touch panel. The manufacturing method includes the steps of: providing a substrate, forming at least an alignment mark on an edge region of the substrate, forming a first transparent conductive layer on the substrate to 'compact the first coffee conductive layer Generating a dielectric layer formed on the first direction to form a dielectric layer on the plurality of electrodes, forming a second transparent conductive layer on the dielectric layer to form a metal layer on the second transparent conductive layer. _ The case of the second turn of the conductive genus is such that the layers are formed in a pattern of the plurality of electrodes arranged in the second direction and a pattern of the plurality of traces (10), etc. And removing the pattern of the metal layer in the special layer. & Preferably, the method of the present invention, wherein the alignment mark is formed and the map of the alignment mark is defined by a mask. / 7 201042516 , preferably, the green provided by the present invention, wherein the lithography and the lithography == sizing the first transparent conductive layer to produce the plural numbers arranged along the first direction and defined by a mask The pattern of the complex (four) poles. ^佳地, the financial method provided by the hair ride, the towel is used to make up the shadow layer and the money, and the pattern of the plurality of electrodes arranged in the direction of the t-ray is defined by the mask. According to the method of the present invention, the method provided by the present invention, wherein the pattern is represented by the lithography and the side two: the metal layer, and the pattern is displayed on the layer by the lithography method. 'The reserved area does not include the cloth of the = in the plurality of electrodes - but at least includes the distribution range of the plurality of materials to remove the portion of the metal layer from which the reserved area is not displayed. The method provided by the present invention, wherein the metal layer is removed by the screen printing and the side method, and the screen is displayed on the metal layer, the Baolong does not include Preferably, the distribution of the patterns arranged in the second direction, but at least including the pattern of the plurality of traces, removes the portion of the metal layer that does not show the reserved area. Preferably, The method provided by the present invention further comprises: forming a protective layer on the patterned second transparent The layer and the metal layer. ', the financial method provided, the _ lithography and the side of the line exposed. First cover 疋 Yiyi opening, the opening makes the gold system, the third idea is to provide - test The manufacturing method of the panel. The clothing a / L3 town step: providing a substrate, forming - first - transparent on the substrate 'forming - a metal layer on the first transparent conductive layer, while Figure i 201042516 modifies the first transparent conductive The layer and the metal layer are such that at least one pair of marks are formed in a pattern of a plurality of electrodes arranged in a first direction, and a pattern of a plurality of traces is removed, and the plurality of electrodes are removed from the metal layer. The pattern is formed on the patterned first transparent conductive layer and the metal layer to form a second transparent conductive layer on the dielectric layer, and the second transparent conductive layer is patterned. And generating a plurality of electrodes arranged along a second direction, wherein the signal outputs of the plurality of electrodes arranged in the first or the first direction are respectively connected to one ends of the traces.
較佳地’本發贿提供之該方法，其中係微影及侧 法同時圖案化該第-透明導電層及該金屬層，並以一光罩定義 複數走線的 一保留區於該金屬層上，該保留區不包括呈===Preferably, the method provided by the present bribe, wherein the lithography and the side method simultaneously pattern the first transparent conductive layer and the metal layer, and define a reserved area of the plurality of traces in the metal layer with a mask On, the reserved area does not include the ===
ί :佈捕但至少包括呈該等複數走線的該圖案的分 法去除該金屬層之未顯示該保留區的部份。 法去=屬=:=方法:其中係利用網印_ 保留區於該金屬層上，該佯留^的二圖案’該網印法顯示一 複數電極的該圖案的分該第二方向排列的 該圖案的分佈制包括轉等魏走線的 的部份。條圍該蝴法去除該金屬層之未顯示該保留區 法_上===:^=用微影_ 排列的複數電極的該圖案。 疋義呈沿該第二方向 9 201042516 於，本發’提供之該方法，另包含：形成一保護層 於經圖案化的該第二透明導電層。 本發明所提供“方法，其中係糊微影及侧 該保護層’並以一光罩定義一開 屬走線外露。 人.本^之第四構想在於提供—種觸控面板。此觸控面板包 3〜明V電區及-金屬區。該透明導電區呈現—第一圖案 笫冑案β亥第一圖案係連接於該第一圖案的外緣。該金 =王現該第_贿。其巾，該透明導電區係為經圖案化的 、月¥電層’該透明導電層係與位於該透明導電層之一側的 -金屬層同_行_麵呈現鄕__及該第二圖案；該 金屬區係#由去除賴案化之該金屬層的該第—圖案而形成。 車乂佳地’本發明所提供之該面板，其巾該透明導電層的材 料主要由氧化銦錫組成。 較佳地，本發騎提供之該®板，另包含-基板，位於該 透明導電層的另一側。 較佳地，本發明所提供之該面板，其巾該基板的材料主要 由玻璃或石英組成。 較佳地’本發明所提供之該面板，其巾該第—_為複數 電極的圖案，該等電極皆沿—第—方向排列，而該第二圖案為 複數走線_案’該等複數走線的—端係各別連接於該等複數 電極的訊號輸出處。 在本技術領域中具有通常知識者，經過閱讀本案說明書及 /、圖式，可清楚了解本案所請發明的其他目的及優點。 【實施方式】 10 201042516 本案將可由以下的實施例說_得到充分瞭解，使得熟習 本技藝之人士可以據以完成之’然本案之實施並非可由下列實 施案例而被限制其實施型態。 在本文中’術語「圖案化」意指，在製造觸控面板過程中， 令特定材㈣形鱗定賴的程序，健储_微影及姓刻 法使特定材料層形成圖案的程序。 在本文中’術語「定義」意指，在微影過程中利用光罩決 定特定圖案。以黃光製程(參下所述)為例，若光罩以遮光部定 〇 _案’則_正光_域光材料；若群赠光部定義圖 案，則須以負光阻作為感光材料。 在本文中’術語「黃光製程」泛指在黃光室(yellowroorn) 中進行微影(photolithography)與蝕刻(etching)的過程。當利用 紫外光透過群進行曝糾，其光源通常為汞燈城光而採 Mine (365 nm)、H-line (405 mn)、及 G_line (436 _的紫外光 光譜。經過曝光之後，醜示由光軍所定義的圖案於透明導電 層或金屬層上。接著，可於該感光材料層進行顯影。 〇 _以正光阻為例，經顯影的該感光材料層會呈現上述圖案， 則經顯影的該感光材料層未覆蓋的該透明導電層或金屬層，可 藉由儀刻而去除。而後，去除經顯影的該感光材料層，則該透 明導電層或該金屬層會呈現上述圖案。 簡s之’為製造本發明之觸控面板，主要先形成一透明導 電層及-金屬層，同咖案化該透明導電層及該金屬層，而後 去除該金屬層之專屬於該透明導電層的圖案部分。 先’請參考第3圖’其為完成本發明電容式觸控面板製 私之早X觸控面板配置示意圖。在工業上，完成本發明電容 觸控面板製程時，除了基板1上的對位標記AM之外，所完成 11 201042516 的j數早痛控面板eell魏置在職缸，職 面板cdl經過切割’便可_成_立_控面板。 请參閱第4圖⑻及⑼，其為 ==意圖，一對單元電== n雪i/、利用如第4圖⑻所示之一光罩奶，同時 明導電層及^= 軸化上述透 利用如第4圖(b)所示之另一光罩 P2)，’則H義非專屬於該透明導電層的圖案部分(保留區 P2)則可大大間化光罩M2的設計。 第一較佳實施的詳細過程步參考後敘實施例。 表Γ發㈣—實施儀電容式面板製程的 ^上視圖(粗(d)表示本發明第—實施例製程之部分結 構上視圖。該製程具有步驟如下： 入斜步Z1G1、：錢可湘縣較低但透光紐的—素玻璃 〆，、、、形成其他導電材料的基板K請參考第6圖(b))。 與蝕塗佈法(eGatingw物麟法，以及微影 去/ 板1的邊緣區域上形成對位標記AM (請泉 考第6圖⑻）。 ότ刹2 S 1G3 ·為了在基板1上形成複數個單元觸控面板， ° ·」I佈法，例如利用賴法，於其上形成—IT0_Umtin 0X1 e，氧化銦錫)層（第一透明導電層2)。 步驟S 104:利用微影及餘刻法令該IT〇層（第一透明 s 2)形成ιτο縱向電極(請參考第6圖⑽。 步驟S 105.利用塗佈法於其上形成一介電層作為絕緣層。 步驟S 106:利用塗佈法於其上形成另一 ΙΤ〇層（第二透明 12 201042516 導電層）。 步驟S 107 : _塗佈法(例如轉法)於其上形成一金屬 層3 〇 ^驟S隊利用微影及蚀刻法同時圖案化該ιτ〇層（第二 及金屬層3而形成複數横向電極及複數走線的圖 案((请參考第6圖(C)))。 Ο Ο =驟SK)9 :個㈣錄觀，_性絲金屬層之該 杈向電極圖案而留下金屬走線4 (請參考第6圖⑹）。 俾U〇 ·視製程實施之需要，可再利用塗佈法形成一 =濩層(其材料可為氮化石夕、氮氧化石夕、氧化石夕或丙稀賴脂 寺）。 步驟S111 .利用微影及姓刻法令該保護層形成開口，令 以金屬走線的輸域外露，聰轉供訊號外送的電性連接 處。 步驟sm :所形成的各單元電容式觸控面板，可經進一 步處理(例如分割各單元)而出料。 ⑷至實施例之較佳製程，請進-步參考第7圖 :、f本發明第—實關中形成第6 _)單元面板結 =，細正絲進行曝絲料例，其剖面線段 邊緣破韻石英作為—基板1，可先在該基板1的 ^==對傾記鳩(請娜6陶，在製程中用 材料可利用濺鍍法在基板1平面上沉積透明導電 ㈣導電性佳、及面電阻低等特色，通常作為該透明導電 13 201042516 層的材料。 製程令該第一透明導電層2形成沿-第-方 向排列的複數電極。以形成縱向電極為例， = =正光阻)層塗佈於該第一透明導 = 第：的_行曝光，令該感光‘ 層之後(如第7圖(c)所示），而 感先材料 成縱向電極。 ^化抑—_導電層2以形 透明導電層2上，可利㈣鑛法塗佈-介電層5 作為絕緣層(如第7嶋所示） :"Μ 用濺鍍法塗佈另一透明導電# ^；I a上，可利 德於1卜居 作為一第二透明導電層2a，然 料(例如導電性及延展性皆佳的銘)而形 、魏郷二透明_ 2a及該金屬 ^案/ * ^及#刻法’可在黃光製程中形成精密的導電 志的St地、可先以—光罩定義欲使該第二透明導電層2&形 成的圖案1為_第—圖案(例如複數橫向電極的圖案)及一第 :ΞΪ(::ΓΓ數金屬走線的圖案)，而該第二圖案連接於該第 ’光罩可定義複數電極及複數走線的 / i數電極可呈一第二方向排列，該等複數走線 的-4係各別連接於該等電極的訊號輸出處。 "以形成橫向電極及其連接的金屬走線為例，可先塗佈-感 光材料層4a利用又義該等橫向電極及金屬走線圖案η的光 罩Ml進行曝光(請參考第*圖⑷)，且令該感光材料層如進行 顯影(如第7 ®(e)所示）° _影_感光材料層4a會呈現上 述圖案，麵影的該感光材㈣4a覆蓋該第二透明導電層2a 14 201042516 及該金屬層3 (如第7圖(骑示）。而後，去除經顯影的該感光 材料層4a(如第7 _所示），則該第二透明導電層％及該金 屬層3二者皆呈現上述橫向電極及金屬走線圖案朽。 由於經過上述過程之後，該金屬層3 _具有該第一圖案 及該第二圖案’為去除專屬於該第二透明導電層^的該第一 圖案，可利用微影法或網印法以及選擇性敍刻法去除該金屬芦 3的該第-圖案，以產生呈現該第二圖案的金屬層3。 Ο 〇 較佳地，在微影過程中，可利用一光罩奶 .以保留該金屬層3的第二_參考第 伴記 P2 *包括該第—圖案部分的分佈範圍，但至少包括該 案部分的分佈範圍。具體而言，可塗= =IS 行曝光且於感光材料層6進行顯 據經顯影的該感光材料層6以選擇性 一)H L之未顯示該保留區P2的部份(如第7 _所 ，去賴金顧3呈現複 秩向電極的圖案邛分。而後，去除經 (如第7圖①所示）。因此 貝满观先材枓層6 金屬声3不呈㈣楚 _上述過程’經選擇性蝕刻的該 該金口一圖案’但至少包括該第二圖案。因此’ 技術簡化許多的縣，Γ 使用較先前 精準度的問題。了㈣此光罩的製作成本，且解決對位 =於上述保留區P2可為十 準度與高解析度要求對位精 保留區P2。歸^ 使關卩法(®未示)決定該 刻油墨)而成為一防蝕刻:：:印塗佈防蝕刻材料(例如防蝕 料層僅覆蓋於該金屬在該金屬層上，而該防侧材 屬層的該保留區，則選擇性地截刻未經該防 15 201042516 侧材料«蓋㈣金制，錢絲贿 =1=圖案。因此，此過程亦可明^ 皁的成本，而仍旎產生精密的金屬圖案。 =上述有關第—實施例的製程所製得的電容式觸控面 -方二t第—方向及—第二方向排列的複數電極，該第 二方向可呈相互垂直的關係，可藉以感應X車由 =_、觸控位置。例如’第—層的複數電極可為縱向電極， f二層的電極可為橫向電極。此外，該等複數走線可精確地連 接於該等複數橫向電極的城輸歧，崎低橫向f極至 邊緣區域的走線阻抗。 黑一> 實施例 第8圖表示本發明第二實施例的電容式觸控面板製程的 &程圖；第9 表示本發明第二實施靖程之部分結 構上視圖。該製程具有步驟如下： w 步驟S201 :首先可利用一素玻璃入料，作為形成其他 電材料的基板1。 步驟S202 :利用塗佈法(c〇ating)，例如猶法，於該& 上形成一 ITO層（第一透明導電層2)。 步驟S2〇3 :利用塗佈法於其上形成一金屬層3。 步驟S204 :利用微影及姓刻法，同時圖案化該ιτ〇層（第 -透明導電層2)及該金屬層3，以同時產生ΙΤ〇橫向電極0、金 屬圖案及至少-個對位標記AM等圖案(請參考第9圖⑷）。 步驟S2〇5 :利用微影及姓刻法，選擇性去除該金屬層3 之該橫向電極_而留下金屬走線4 (請參考第9圖⑽。 步驟S 206:利用塗佈法於其上形成一介電層作為絕緣層。 步驟S 2〇7:利用塗佈法於其上形成另一 IT〇層（第二透明 16 201042516 導電層2a)。 步驟S 208 :利用微影及蝕刻法圖案化該jjQ層（第二透明 導電層2a)而形成複數縱向電極(請參考第9圖⑽。 步驟S 209 :視製程實施之需要，可再利用塗佈法形成一 保護層(其材料同上文所述）。 步驟S 210 :利用微影及蝕刻法令該保護層形成開口，令 上述金屬走線的輸出處外露’則得以提供訊號外送的電性連接 處0 Ο Ο 步驟S211 :所形成的各單元電容式觸控面板可經進一步 處理而出料。 有關本發明第二實施例之較佳製程，請進一步參考第1〇 圖⑻至①’其為本發明第二實施射形成第9 _單元面板 的剖面示意圖’係以正光阻進行曝光顯影為例，其剖面線 以A-A’表示。 ,' 、，首先可先以玻璃或石英作為—基板卜刊㈣鍵法在基 板平面上沉積透明導電材料(較佳為氧化銦錫），而形成-透明 斗t電1，作為一第一透明導電層2。然後，於其上沉積金屬材 列紹)而形成一金屬層3(如第1〇圖⑻所示）。 ㈣2成呈第—方向制的複數電極、其連接的金屬走線以 及該金黃光製__案化該第—翻導電層2 電極，在“，該第一方向排列的複數電極為橫向 本綠n 先中，可以同—光狄義該等橫向電極、金屬 料記的圖案而進行曝光，且可令一感光材 ίο圖_=、、明導電層2及該金屬層3上進行顯影(如第 示），:!：==___ 1G_ 级先材枓層4(如第1〇圖(d)所示），則該第一透明 17 201042516 B'问电極、金屬走線及至少 無須另外使用定義對位標 導電層2及該金屬層3皆呈現該等橫向電極 一個對位標記的圖案。在此過程中，無須另$ 記的其他光罩，即可形成對位標記。 為去除該金屬層3中專屬於該第—透明導電層2的圖案， 可利用微紐或_卩細及_錄耻， 3呈現該等複數電極_铸份，以訂魏金屬親的金圖屬案層 “較佳地，同第-實施例之敘述，在微影過程中，可利用一 定義-保留區P2(參考第4圖⑽。該保留區p2不包 線圖案的分佈範圍。具體而言，可塗 5亥光罩M2進行曝光且於感光材料層 ^等複數k向電極圖案的分佈範圍，但至少包括該等金屬走 可塗佈一感光材料層6，利用ί : a portion of the pattern of the metal layer that does not exhibit the reserved area is removed by a method that includes at least the pattern of the plurality of traces. Method = genus =: = method: wherein the screen printing _ reserved area on the metal layer, the second pattern of the ^ ^ ^ the screen printing method shows a pattern of a plurality of electrodes arranged in the second direction The distribution of the pattern includes the portion of the transition that waits for the Wei trace. The strip is removed by the butterfly method to remove the metal layer. The pattern is not shown. _Up===:^=The pattern of the plurality of electrodes arranged by the lithography _. The method of providing a protective layer along the patterned second transparent conductive layer is provided by the method of the present invention. The present invention provides a "method in which a paste lithography and a side of the protective layer" is defined by a mask to expose an open trace. The fourth idea of the present invention is to provide a touch panel. The panel package 3~ Ming V electrical area and the metal area. The transparent conductive area presents a first pattern, and the first pattern is connected to the outer edge of the first pattern. The transparent conductive region is a patterned, monthly electrical layer, the transparent conductive layer and the metal layer on one side of the transparent conductive layer are the same as the _ row _ surface and the first a second pattern; the metal region is formed by removing the first pattern of the metal layer. The panel provided by the present invention has a transparent conductive layer mainly composed of indium oxide. Preferably, the board provided by the present rider further comprises a substrate disposed on the other side of the transparent conductive layer. Preferably, the panel provided by the present invention has a material of the substrate. It is composed of glass or quartz. Preferably, the panel provided by the present invention has the towel The patterns of the plurality of electrodes are arranged in the -first direction, and the second pattern is a plurality of traces - the 'ends of the plurality of traces are connected to the signal outputs of the plurality of electrodes. Other objects and advantages of the invention claimed in the present invention can be clearly understood by reading the present specification and/or the drawings. [Embodiment] 10 201042516 The present invention can be fully obtained from the following embodiments. It is understood that the person skilled in the art can accomplish this. However, the implementation of the present case may not be restricted by the following implementation cases. In this article, the term 'patterning' means that in the process of manufacturing a touch panel. , a procedure for making a specific material (four) shape, a procedure for forming a pattern of a specific material layer. As used herein, the term "definition" means that a reticle is used to determine a particular pattern during lithography. Take the yellow light process (refer to the following) as an example. If the reticle is defined by the light-shielding part, the _ positive light _ domain light material; if the group light-sharing definition pattern, the negative light resistance should be used as the light-sensitive material. As used herein, the term "yellow process" generally refers to the process of photolithography and etching in a yellowroorn. When the ultraviolet light is transmitted through the group for exposure correction, the light source is usually mercury light, and the ultraviolet light spectrum of Mine (365 nm), H-line (405 mn), and G_line (436 _. After exposure, the ugly display The pattern defined by Guangjun is on the transparent conductive layer or the metal layer. Then, the photosensitive material layer can be developed. 〇_ In the case of positive photoresist, the developed photosensitive material layer will exhibit the above pattern, and then developed. The transparent conductive layer or metal layer not covered by the photosensitive material layer can be removed by etching. Then, after the developed photosensitive material layer is removed, the transparent conductive layer or the metal layer can exhibit the above pattern. In order to manufacture the touch panel of the present invention, a transparent conductive layer and a metal layer are mainly formed first, and the transparent conductive layer and the metal layer are treated together, and then the metal layer is removed and belongs to the transparent conductive layer. The pattern portion. First, please refer to FIG. 3, which is a schematic diagram of the configuration of the early X touch panel for completing the capacitive touch panel manufacturing of the present invention. In the industry, the process of the capacitive touch panel of the present invention is completed except for the substrate 1. of In addition to the mark AM, the completed 11 201042516 j number early pain control panel eell Wei set the in-service cylinder, the job board cdl has been cut 'can be _ _ vertical _ control panel. Please refer to Figure 4 (8) and (9), which is == Intent, a pair of unit electricity == n snow i /, using a mask milk as shown in Figure 4 (8), while the conductive layer and ^ = axisization of the above-mentioned utilization as shown in Figure 4 (b) The other reticle P2), 'H' is not exclusively assigned to the pattern portion of the transparent conductive layer (reserved area P2), and the design of the reticle M2 can be greatly improved. The detailed process steps of the first preferred embodiment refer to the following embodiments. Table Γ (4)—The upper view of the capacitive panel process of the implement (thickness (d) shows a partial structure view of the process of the first embodiment of the present invention. The process has the following steps: into the ramp step Z1G1: Qian Kexiang County Refer to Figure 6(b)) for a substrate K with a lower but transparent light-colored glass crucible, and other conductive materials. The eclipse coating method (eGatingw method, and the lithography removal/formation of the edge region of the plate 1 is formed on the edge mark AM (please refer to Fig. 6 (8)). ότ刹2 S 1G3 · In order to form a complex number on the substrate 1 The unit touch panel, the "I" method, for example, uses a Lai method to form an -IT0_Umtin 0X1e, indium tin oxide layer (first transparent conductive layer 2) thereon. Step S104: forming a vertical electrode by using the lithography and the residual method to form the ITO layer (first transparent s 2) (refer to FIG. 6 (10). Step S105. Forming a dielectric layer thereon by using a coating method As an insulating layer. Step S106: forming another ruthenium layer (second transparent 12 201042516 conductive layer) thereon by a coating method. Step S107: _ coating method (for example, transfer method) forming a metal thereon Layer 3 S^Step S team simultaneously lithographically and etched the ιτ〇 layer (the second and metal layers 3 to form a plurality of lateral electrodes and a plurality of traces (see Figure 6 (C))) Ο Ο = SK SK) 9 : (4) Recording, the metal layer of the _ silk layer leaves the metal trace 4 (see Figure 6 (6)). 俾U〇·See the need for process implementation The coating method may be used to form a layer of ruthenium (the material may be nitrite, oxynitride, oxidized stone or propyl lysate). Step S111. Using the lithography and surname to order the protective layer Forming an opening to expose the transmission area of the metal trace, and switching to the electrical connection for the signal. Step sm: Capacitance of each unit formed The touch panel can be discharged by further processing (for example, dividing each unit). (4) For the preferred process of the embodiment, please refer to FIG. 7 in advance: f, forming the sixth _) unit in the first-reality of the invention The panel knot =, the fine silk is subjected to the example of the exposed wire, and the edge of the section line is broken as quartz - as the substrate 1, and the ^== pair of the substrate 1 can be first placed on the substrate 1 (Please Na 6 Tao, the material used in the process) The transparent conductive (four) conductive material and low surface resistance can be deposited on the plane of the substrate 1 by sputtering, and the material is usually used as the material of the layer of the transparent conductive 13 201042516. The process makes the first transparent conductive layer 2 form along the -first a plurality of electrodes arranged in the direction. For example, a vertical electrode is formed, and a == positive photoresist layer is applied to the first transparent conductive layer = the first row of the exposure, so that the photosensitive layer is formed (as shown in Fig. 7(c) Show), and the material is first formed into a longitudinal electrode. ^ 抑 — _ _ conductive layer 2 on the shape of transparent conductive layer 2, can be (4) ore coating - dielectric layer 5 as an insulating layer (as shown in Figure 7): " 涂布 coated by sputtering a transparent conductive # ^; I a, Kelly in 1 Buju as a second transparent conductive layer 2a, then (for example, the conductivity and ductility are good) and shape, Wei Wei two transparent _ 2a and the The metal ^ case / * ^ and #刻法' can form a precise conductive St. ground in the yellow light process, and the pattern 1 formed by the second transparent conductive layer 2 & a pattern (for example, a pattern of a plurality of lateral electrodes) and a first: ΞΪ (:: a pattern of a plurality of metal traces), and the second pattern is connected to the first mask to define a plurality of electrodes and a plurality of traces/i The plurality of electrodes may be arranged in a second direction, and the -4 series of the plurality of traces are respectively connected to the signal output of the electrodes. " Taking the metal traces forming the lateral electrodes and their connections as an example, the photosensitive material layer 4a may be first coated with the mask M1 of the lateral electrodes and the metal trace pattern η (refer to the figure *) (4)), and the photosensitive material layer is subjected to development (as shown in Fig. 7(e)). The image-sensitive material layer 4a exhibits the above pattern, and the photosensitive material (4) 4a of the mask covers the second transparent conductive layer. 2a 14 201042516 and the metal layer 3 (as shown in Fig. 7 (riding). Then, after removing the developed photosensitive material layer 4a (as shown in Fig. 7), the second transparent conductive layer % and the metal layer The two lateral electrodes and the metal trace pattern are both formed. The first pattern may be removed by a lithography method or a screen printing method and a selective patterning method to remove the first pattern of the metal reed 3 to produce a metal layer 3 exhibiting the second pattern. 〇 〇 preferably, in micro In the process of shadowing, a reticle milk can be utilized to retain the second layer of the metal layer 3 The companion P2* includes the distribution range of the first pattern portion, but at least includes the distribution range of the portion of the pattern. Specifically, the photosensitive material can be exposed to the photosensitive material layer 6 by the exposure of the ==IS line. Layer 6 selects the portion of the reserved region P2 that is not selected by HL (eg, the seventh _, the tribute to the 3 shows the pattern of the complex rank electrode. Then, the removal is performed (eg, Figure 7 Illustrated). Therefore, the smear layer 6 metal sound 3 is not (four) _ the above process 'selectively etched the gilt pattern' but at least includes the second pattern. Therefore 'technology simplifies many County, Γ Use the problem of the previous accuracy. (4) The manufacturing cost of the mask, and solve the alignment = in the above reserved area P2 can be ten precision and high resolution requires the alignment fine retention area P2. The 卩 method (® not shown) determines the ink at the moment and becomes an etch-resistant:::print-coated anti-etching material (for example, the anti-corrosion layer covers only the metal on the metal layer, and the anti-side material layer The reserved area is selectively cut without the protection of the 15 201042516 side material «cover (four) gold Money bribe = 1 = pattern. Therefore, this process can also explain the cost of soap, but still produce a precise metal pattern. = Capacitive touch surface made by the above-mentioned process of the first embodiment - square two a plurality of electrodes arranged in the first direction and the second direction, wherein the second direction may be perpendicular to each other, thereby sensing the X vehicle by =_, the touch position. For example, the plurality of electrodes of the first layer may be longitudinal electrodes The electrodes of the second layer of f may be lateral electrodes. In addition, the plurality of traces may be accurately connected to the cross-sectional impedance of the plurality of lateral electrodes, and the trace impedance of the lateral f-pole to the edge region is low. 8 is a view showing a process of a capacitive touch panel process according to a second embodiment of the present invention; and a ninth embodiment showing a partial structure of a second embodiment of the present invention. The process has the following steps: w Step S201: First, a single glass feed can be utilized as the substrate 1 for forming other electrical materials. Step S202: An ITO layer (first transparent conductive layer 2) is formed on the & using a coating method such as JAP. Step S2〇3: A metal layer 3 is formed thereon by a coating method. Step S204: simultaneously patterning the ιτ〇 layer (the first transparent conductive layer 2) and the metal layer 3 by using a lithography and a surname method to simultaneously generate the ΙΤ〇 lateral electrode 0, the metal pattern, and the at least one alignment mark. AM and other patterns (please refer to Figure 9 (4)). Step S2〇5: selectively removing the lateral electrode _ of the metal layer 3 by using a lithography and a surname method while leaving the metal trace 4 (refer to FIG. 9(10). Step S206: using a coating method A dielectric layer is formed as an insulating layer. Step S 2〇7: another IT layer (second transparent 16 201042516 conductive layer 2a) is formed thereon by a coating method. Step S208: using lithography and etching The jjQ layer (the second transparent conductive layer 2a) is patterned to form a plurality of vertical electrodes (refer to FIG. 9 (10). Step S 209: a protective layer may be formed by a coating method according to the needs of the process (the material is the same as above) Step S210: using a lithography and etching method to form the opening of the protective layer, and exposing the output of the metal trace to provide an electrical connection for the signal to be sent out. Ο Step S211: formed Each unit of the capacitive touch panel can be processed by further processing. For a preferred process of the second embodiment of the present invention, please refer to FIG. 1(8) to 1' for the second embodiment of the present invention. _The cross-sectional view of the unit panel is carried out with positive photoresist For example, in light development, the hatching is indicated by A-A'. , ', first, a transparent conductive material (preferably indium tin oxide) is deposited on the substrate plane by using glass or quartz as the substrate. And forming a transparent transparent dielectric 1 as a first transparent conductive layer 2. Then, a metal layer is deposited thereon to form a metal layer 3 (as shown in Fig. 1 (8)). a plurality of electrodes of a first direction, a metal trace connected thereto, and an electrode of the first conductive layer 2, wherein the plurality of electrodes arranged in the first direction are lateral green It can be exposed to the pattern of the horizontal electrode and the metal material, and can be developed on a photosensitive material, the conductive layer 2 and the metal layer 3 (as shown). ,:!:==___ 1G_-level material layer 4 (as shown in Figure 1 (d)), then the first transparent 17 201042516 B' asks for electrodes, metal traces and at least no additional definition The positional conductive layer 2 and the metal layer 3 each exhibit a pattern of alignment marks of the lateral electrodes. In the process, no additional The other masks of $ can be used to form the alignment mark. In order to remove the pattern of the metal layer 3 exclusive to the first transparent conductive layer 2, the micro- or _ _ _ _ shame can be used, 3 presenting such The plurality of electrodes_castings are in the form of a gold-plated layer of the bismuth metal. "Preferably, as described in the first embodiment, a definition-reserved area P2 can be utilized in the lithography process (refer to FIG. 4 (10) The reserved area p2 does not cover the distribution range of the line pattern. Specifically, it can be coated with a 5 ray mask M2 for exposure and a distribution range of the plurality of k-direction electrode patterns in the photosensitive material layer, but at least including the metal Coating a photosensitive material layer 6, using
:上述選擇性侧，去除該金朗3呈現複數橫向電極的圖案 一刀而後’去除經顯影的該感光材料層6 (如第1〇圖⑼所 =)。因此，經過上述過程’經選擇性_的該金屬層3不且 ^該等複數橫向電極的圖案，但至少包括該等複數走線的圖 ”。因此，該金屬層3可形成精密的複數金屬走線，卻僅需使 用較先前技術簡化料的光罩，可節省此鮮的製作成本，且 解決高對位精準度與高解析度要求的問題。 同第一實施例之敘述，亦可使用網印法決定該保留區 可明顯節省製造光罩的成本，而仍能產生精密的金屬走線 接著，可利用濺鍍法塗佈一介電層5作為絕緣層(如第1〇 圖(h)所示）。而後，在該介電層5上，可利用濺鍍法塗佈另一 透明導電層作為一第二透明導電層2a (如第1〇_所示），以 18 201042516 形成沿一第二方向的電極。以形成縱向電極為例，可先將一感 光材料層7塗佈於該第二透明導電層2aJi，以定義該等縱向 電極圖案的光罩進行曝光，令該感光材料層7進行顯影(如第 10圖①所示）’以及根據該顯影進行蝕刻(如第1〇圖化)所示) 且去除該感光材料層之後(如第10圖(1)所示)，則圖案化該第二 透明導電層2a以形成縱向電極。 Ο ❹ 、|、-「'丨地，刊用弟二貫施例之製程所製得的電容式觸控面 ’由於在形成下層面板結構時，可_共關案化透 2 2及金屬層3，而製作該等沿第—方向排觸複數電極 ，可大大節省另外製作對位 才:己AM叫間及成本。此外，同第一實施例所述，利 的先罩或改_印法而娜性_金騎2，卩 :，亦可節省製作金屬走線的成本，並有準確的自= 至少包ί此明製造方法所製得的電容式觸控面板， 裳一透明導電區(呈現—第一圖案及一第二圖案，該 接於該第一圖案的外緣)及-金屬區(呈現該ΐ 位於該透明導電層之-侧以 板另包含較佳地’該面 電電:=行動電 ===結構)及-層複數厶走線= 電極而作為訊號導通結構）。由於行動手機等小 19 201042516 型電子產σ°°乡採直立式難螢幕，因麟等金屬走線通常連接 於橫向ITO電極以降低邊緣區域的阻抗。 本發明之觸控面_製造方法’亦可製造具有雙層透 明導電層與金屬層結構賴控面板，以制於翻高效能的電 容式觸控Φ板’例如Apple跑哪所_的投料電容式觸控 面板大型的f：谷式觸控面板或者雙面(DIT〇帥e)的電容式觸 控面板。具體而言’除了有—層金屬走線連接於橫向電極之 外另可利用同時圖案化透明導電層與金屬層等過程，令另一 層的金屬走線連接於縱向電極，亦可降低在縱向電極 的阻抗。 綜上所述’本發明觸控面板及其製造方法，至少具有以下 特色： 1. 本發明觸控面板賴造方法，可達_案化過程巾自我對準 2效果’可製得崎度高的翻電極_及金肢線，卻無 舄使用精度特別高的機台。 2. 控面板的製造方法，亦可在進行上述選擇性姓刻金 心二⑽_進行微影法或者利用成本更低的網 非屬餘刻的區域，且無需在此部分製程中製作對位 t故可大大節省f知製程中所耗費的成本。 3· trfr板穌雜低，卻仍财難的翻電極及走 用=員當良好的觸控感應性能，故可更為普遍應 用於各類電子或資訊產品。 據上論結’本發明實為— 明，深具發展價值。惟‘述敎進步之發 而ρ，考僅為本發明之最佳實施例 申^^丨=以之限定本發明所實施之範圍。即大凡依本發明 申叫專利卿斤作之均等變化與修飾，皆應仍屬於本發明專利 20 201042516 涵蓋之範圍内，謹請貴審查委員明 鐘’並祈惠准 ’是所至禱。 Ο: on the selective side, the pattern of the plurality of lateral electrodes is removed after the removal of the pattern, and then the developed photosensitive layer 6 is removed (as shown in Fig. 1 (9)). Therefore, through the above process, the metal layer 3 of the selective mode does not include the pattern of the plurality of lateral electrodes, but at least includes the pattern of the plurality of traces. Therefore, the metal layer 3 can form a precise complex metal. The wiring is only required to use the reticle of the prior art simplification material, which can save the fresh manufacturing cost and solve the problem of high alignment accuracy and high resolution requirements. It can also be used in the description of the first embodiment. The screen printing method determines that the reserved area can obviously save the cost of manufacturing the mask, and still can produce precise metal traces. Then, a dielectric layer 5 can be coated as an insulating layer by sputtering (such as the first figure (h). And then, on the dielectric layer 5, another transparent conductive layer can be coated by sputtering as a second transparent conductive layer 2a (as shown in FIG. 1) to form an edge along 18 201042516 An electrode in a second direction. Taking a longitudinal electrode as an example, a photosensitive material layer 7 may be first applied to the second transparent conductive layer 2aJi, and a photomask defining the longitudinal electrode patterns is exposed to expose the photosensitive material. Layer 7 is developed (as shown in Figure 10) And after etching (as shown in FIG. 1) according to the development and removing the photosensitive material layer (as shown in FIG. 10 (1)), patterning the second transparent conductive layer 2a to form a vertical electrode Ο ❹,|,-"'The capacitive touch surface made by the process of using the second embodiment of the publication' is due to the fact that when the underlying panel structure is formed, it can be used to turn over 2 2 and metal. Layer 3, and the production of the plurality of electrodes along the first direction, can greatly save the additional production of the alignment: the AM call and the cost. In addition, as described in the first embodiment, the benefit of the first cover or change Fauna's sex_金骑2,卩:, can also save the cost of making metal traces, and have accurate self-contained at least the capacitive touch panel made by the manufacturing method, a transparent conductive area (presenting - a first pattern and a second pattern, the outer edge of the first pattern) and a metal region (presenting the side of the transparent conductive layer on the side of the board further comprising a preferably - the surface of the electric := action electric === structure) and - layer complex number 厶 trace = electrode and as signal conduction structure). Because mobile phone etc. small 19 20104251 The 6-type electronic product σ°° is a vertical-type hard-to-screen screen. The metal traces such as Lin are usually connected to the lateral ITO electrode to reduce the impedance of the edge region. The touch surface _ manufacturing method of the present invention can also be manufactured with double-layer transparency. The conductive layer and the metal layer structure are controlled by the control panel to make a high-performance capacitive touch Φ board, such as the Apple-running capacitive touch panel, a large f: valley touch panel or double-sided ( DIT 〇 handsome e) capacitive touch panel. Specifically, in addition to the layer of metal traces connected to the lateral electrodes, the process of simultaneously patterning the transparent conductive layer and the metal layer can be utilized to make the other layer of metal go. The wire is connected to the longitudinal electrode, and the impedance of the electrode in the vertical direction can also be reduced. In summary, the touch panel of the present invention and the method for manufacturing the same have at least the following features: 1. The touch panel of the present invention can be used up to _ The self-alignment 2 effect of the process towel can produce a high-scraping electrode and a gold-stretched line, but it has no use of a machine with a particularly high precision. 2. The manufacturing method of the control panel can also be performed in the above-mentioned selective surrogate gold core 2 (10) _ lithography method or use the lower cost network is not a residual area, and there is no need to make a registration in this part of the process Therefore, it can greatly save the cost of knowing the process. 3. trfr board is low, but it is still difficult to flip the electrode and walk. With good touch sensing performance, it can be more commonly used in various electronic or information products. According to the above conclusion, the invention is practical and clear, and has profound development value. However, the description of the present invention is only a preferred embodiment of the present invention, and the scope of the present invention is limited thereto. That is to say, according to the invention, the equal change and modification of the patent application of the patent should be still within the scope of the patent of the invention 20 201042516, and I would like to ask your reviewer to sing and pray for it. Ο
【圖式簡單說明】 第1圖：f知電容式觸控面板製㈣流程圖。 第2圖⑻及(b):習知電容式觸控面板製程令 :圖㈣成本發明電容式觸控面板製程之單元觸二 第一4圖⑻及⑻··本發龍容式觸控面板製財的較佳實施光 罩示意圖。 、 第5圖：本發明第-實施例的電容式觸控面板製程的流程圖。 第6圖⑻至⑹：本發明第一實施例製程之部分結構上視圖。 第7圖⑻至:本發明第一實施例中形成第6圖(d)的剖面示 意圖。 第8圖.本發明第一實施例的電容式觸控面板製程的流程圖。 第9圖(a)至(c):本發明第二實施例製程之部分結構上視圖。 第1〇圖(a)至(1):本發明第二實施例中形成第9圖⑹的剖面示 意圖。 【主要元件符號說明】 第1圓 sl〇l、sl02、sl03、sl04、sl〇5、sl06、sl〇7、sl08、sl09、 sllO、sin、sll2 步驟 第2圓(a)、⑼ ml、m2 光罩 pl 複數電極圖案 p2 複數走線圖案 第3圖 21 201042516 1 基板 AM 對位標記 cell 單元觸控面板 第4圖⑻、（b)[Simple description of the diagram] Figure 1: f knows the capacitive touch panel system (four) flow chart. Figure 2 (8) and (b): Conventional capacitive touch panel manufacturing process: Figure (4) Cost of the invention capacitive touch panel process unit touch two first 4 (8) and (8) · · this hair dragon touch panel A schematic diagram of a preferred implementation of a light shield. FIG. 5 is a flow chart showing the process of the capacitive touch panel of the first embodiment of the present invention. Fig. 6 (8) to (6) are partial structural views of a process of the first embodiment of the present invention. Fig. 7 (8) to Fig. 6 is a cross-sectional view showing the formation of Fig. 6(d) in the first embodiment of the present invention. Fig. 8 is a flow chart showing the process of the capacitive touch panel of the first embodiment of the present invention. Fig. 9 (a) to (c) are partial structural views of a process of a second embodiment of the present invention. Figs. 1(a) to (1) are cross-sectional views showing the ninth drawing (6) in the second embodiment of the present invention. [Description of main component symbols] The first circle sl1, sl02, sl03, sl04, sl5, sl06, sl7, sl08, sl09, sllO, sin, sll2 Step 2nd circle (a), (9) ml, m2 Photomask pl Complex electrode pattern p2 Complex trace pattern Fig. 3 21 201042516 1 Substrate AM alignment mark cell unit touch panel Figure 4 (8), (b)
Ml、M2 光罩 P1 複數電極及複數走線的圖案 P2 保留區 第5圖 S101' S102、S103、S104、S105、S106、S107、S108、S109、 siio、sm、sii2 步驟 第6圖(a)至(d) 1 基板 2 第一透明導電層 3 金屬層 4 金屬走線 A-A， 剖面線段 AM 對位標記 第7圖(a)至(j) A-A， 剖面線段 1 基板 2 第一透明導電層 2a 第二透明導電層 3 金屬層 4 感光材料層 4a 感光材料層 5 介電層 6 第8圖 感光材料層 S201、S202、S203、S204、S205、S206、S207、S208、S209、 S210、S211 步驟 22 201042516 第9圖 1 基板 2 第一透明導電層 3 金屬層 4 金屬走線 A-A’ 剖面線段 第10圖 1 基板 2 第一透明導電層 2a 第二透明導電層 3 金屬層 4 感光材料層 5 介電層 6 感光材料層 7 感光材料層M1, M2 reticle P1 complex electrode and pattern of complex traces P2 reserved area Fig. 5 S101' S102, S103, S104, S105, S106, S107, S108, S109, siio, sm, sii2 Step 6 (a) To (d) 1 substrate 2 first transparent conductive layer 3 metal layer 4 metal trace AA, section line AM alignment mark 7 (a) to (j) AA, section line 1 substrate 2 first transparent conductive layer 2a Second transparent conductive layer 3 Metal layer 4 Photosensitive material layer 4a Photosensitive material layer 5 Dielectric layer 6 Photograph material layer S201, S202, S203, S204, S205, S206, S207, S208, S209, S210, S211 Step 22 201042516 Figure 9 1 substrate 2 first transparent conductive layer 3 metal layer 4 metal trace A-A' section line segment 10 Figure 1 substrate 2 first transparent conductive layer 2a second transparent conductive layer 3 metal layer 4 photosensitive material layer 5 Dielectric layer 6 photosensitive material layer 7 photosensitive material layer
23twenty three