201041426 六、發明說明： .【發明所屬之技術領域】 本發明係有關一種電燈，特別是關於一種可直接替換傳統 ^ 鶴絲、鹵素或省電燈泡的發光二極體(LED)電燈。 . 【先前技術】 使用直流電LED裝置作為燈芯的LED燈，必須使用電源 轉換器將交流電轉換成直流電供應該直流電LED裝置，因 ^ 此會增加LED燈的成本。此外，電源轉換器很難完全藏放 Ο 在傳統燈泡的標準燈頭内，因此需要另行開發模具製作不 同於傳統燈泡的機構件，不但更增加成本，也增加LED 燈的體積。直流電LED裝置在通電時會產生熱能，故必須 額外設計散熱機構處理這些熱能。若無法有效散熱，高溫 會造成LED的發光效率降低、壽命減少及波長偏移等不利 效果。電源轉換器在將交流電轉換成直流電的過程中，也 Q 會產生熱能，特別是其中的電感與積體電路，高溫也會損 壞此類元件，造成產品無法運作。特別是在高功率的應用 上，例如照明用途的燈具，直流電LED裝置產生的熱能較 高，因此散熱不足而引起的情況更嚴重。有些產品採用多 顆低功率的砲彈型（lamp type)LED，並且使用簡單的橋式 整流電路，以便適應小體積的傳統燈頭。但是低功率的 LED亮度普遍過低，市場接受度有限，而且此類產品往 往因為散熱不佳，光衰現象嚴重。 3 201041426 近年來，使用交流電的led裝置的技術日漸成熟，亮度也 曰益提升，已具有商業利用價值。交流電LED裝置係將 串、並聯的多個LED製作在同一個磊晶片上，此磊晶片封 裝後串聯具有某個電阻值的電阻器，可以直接承受市電如 110伏特或220伏特等高電壓使用，因此省去直流電LED 裝置所需的電源轉換器或整流電路，有效降低成本及減少 電路造成的品質問題。雖然交流電LED裝置方便應用在小 體積的空間内’但是仍有散熱的問題必須處理。尤其是在 商功率的應用上’例如照明用途的燈具，其產生的熱能較 南’如果增設散熱器，會加大LED燈的體積與成本，如果 不幫助交流電LED裝置散熱，又會造成led的發光效率 降低、壽命減少及波長偏移，甚至燒毁LEd磊晶片。 【發明内容】 本發明的目的之一，在於提出一種強化交流電LED裝置散 ❹熱的LED燈。 本發明的目的之一，在於提出/種可直接替換傳統鎢絲、 鹵素或省電燈泡的LED燈。 本發明的目的之一，在於提出/種LED燈的製造方法。 -根據本發明，一種led燈包括含有至少一個交流電led •襄置的燈芯’具有腔室的燈頭，以及導熱絕緣材料填充在 該腔室内，機械性地接觸該燈愁與該燈頭的一個電極。當 該交流電LED裝置通電時，該導減緣材料提供熱通道將 4 201041426 熱能從該燈芯傳導至該電極散熱。 該燈頭可以使用傳統燈泡的燈頭，因此該LED燈可直接插 入一般燈具之燈泡插座，毋需更換原有燈具系統或加裝轉 ' 接器。 * 本發明亦提出數種製造LED燈的方法，其包括焊接電路元 件至燈頭，以及填充導熱絕緣材料到該燈頭的腔室内。該 導熱絕緣材料機械性地接觸燈芯與該燈頭的一個電極。 〇 【實施方式】 圖1係本發明的第一實施例的示意圖。為了凸顯本發明的 特點，此實施例使用小燈泡用的標準燈頭10，其具有電極 12和14供連接交流電源。如本技術領域之具有通常知識 者所熟悉的，電極12係具有螺旋紋外形16的金屬殼，其 内有腔室18。此實施例使用一顆交流電LED裝置20作為 燈芯，其係將交流電LED磊晶片22固定在支架24上，並 Ο 於其上覆蓋封膠26。LED的封裝係習知技術，為了簡化圖 式，此處未繪出交流電LED裝置20的詳細封裝構造。電 阻器30的一端焊接至電極14，另一端藉導線32焊接至 LED裝置20,導線34的兩端分別焊接至電極12及交流電 LED裝置20。此LED燈的等效電路如圖2所示，交流電 v LED蠢晶片22和電阻30係串聯在電極12和14之間。 如本技術領域之具有通常知識者所熟悉的，所謂交流電 LED蟲晶片，含有兩個相反的方向配置的LED並聯在兩 5 201041426 支接腳之間，每一該方向上具有至少一個LED，該兩個相 反的方向配置的LED分別在交流電源的正、負半遇期被點 亮。電阻器30的電阻值R的大小係根據設計需求的電流 ' 值而選擇的。電阻器30也具有保護交流電LED磊晶片 * 22的功能，在連接至電極12和14的交流電源發生突波 時，電阻器30會吸收大部分的突波電壓。回到圖1，本發 明的特點之一，係在腔室18中填充導熱絕緣材料36，其 〇 機械性地接觸支架2 4和電極12，提供熱通道將交流電L E D 磊晶片22因為通電發光產生的熱能傳導至電極12進行散 熱。如本技術領域之具有通常知識者所熟悉的，支架24 通常含有幫助交流電LED磊晶片22散熱的金屬片，因此， 支架24貼在導熱絕緣材料36上，會有良好的熱導效果。 除了幫助交流電LED磊晶片22散熱，導熱絕緣材料36 也幫助電阻器30散熱，因為電阻器30埋在導熱絕緣材料 ❹36中。 導熱絕緣材料36可以選用環氧樹酯，或者導熱粉末，例 如氧化鋁、氮化鋁、氮化硼或其他導熱材料，或者二者的 混合物。表1係使用三種不同導熱材料在圖1的LED燈 中，實際測得的結果。 表1 導熱絕緣 交流電源 LED裝置20的 輸出亮度 連續點亮 材料36 的電壓 消耗功率(W) (lm) 1000小時 6 201041426 環氧樹酯 110V 1 65 無異常 但溫度較高 環氧樹酯+ 氧化銘粉末 110V 1 68 無異常 氧化is粉末 --—.— 110V 1 68 — 無異常 從表1的測試結果可知，採用環氧樹酯的導熱絕緣材料 36，因導熱係數較差，故通電後整體溫度較高；將環氧樹 〇酉旨與導熱粉末混合的導熱絕緣材料36，因導熱效果較佳， 點儿/則》式中無異吊狀況發生；直接使用導熱粉末壓實充填 的導熱絕緣材料36，亦可得到良好導熱效果。整體而言， LED燈可獲得良好的光輸出亮度，連續點亮1〇〇〇小時無 異常!X S也可以選用其他材料作為導熱絕緣材料％，較 佳者，其轉係數介於(^至卿^之間。 傳統燈泡使用的是標準燈頭，例如E12、ei4、Ei7、腿 及E27疋傳統鶴絲燈泡的燈頭，紐16及是傳統齒 素燈/包的燈帛表2係使用標準燈頭El2及e27於圖工的 LED燈中，實際測得的結果。 表2 燈頭10的 種類 ---—---— E12 -------- 交流電源 的電壓 110V 消耗功率(w) ~^------- 1 -——---! 輸出亮度 _(1m) 連續點亮 1000小時 72 無異常 E12 220V 1 nr\ 無異常 E27 110V ~~~-- 1 /[) -------- —――—-- 67 —- 無異常 201041426 E27 220V 1 73 無異常 如表2的内容所示’圖1的LED燈無論是使用常見體積較 小的E12燈頭或是體積較大的E27燈頭，皆可獲得良好的 * 光輸出亮度，而且連續點亮1〇〇〇小時無異常發生，表示 交流電LED磊晶片22產生的熱能有效地傳導至電極12 進行散熱。如圖1所示，此LED燈的大小约與燈頭1〇相同， 〇又具有良好的散熱能力，可以達成習知技術做不到的高功 率應用。在傳統鹵素燈泡的燈頭中，一個電極是枉狀金屬 成，被絕緣物與另—個電極分隔開。某些標準燈頭則是使 用兩根彼此絕緣的針狀電極。不論是傳統鎢絲燈泡、傳統 齒素燈泡的燈頭或其他標準燈頭，都有腔室可以填充導熱 緣材料’因此至少有-個電極可以用來幫助LED燈的燈 散…、因為燈頭的電極是向外曝露的，所以可以提供不 錯的散熱效果。201041426 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to an electric lamp, and more particularly to a light-emitting diode (LED) electric lamp which can directly replace a conventional crane wire, halogen or power-saving bulb. [Prior Art] An LED lamp using a DC LED device as a wick must use a power converter to convert AC power to DC power to supply the DC LED device, which increases the cost of the LED lamp. In addition, it is difficult for the power converter to be completely hidden in the standard lamp holder of the conventional bulb. Therefore, it is necessary to separately develop a mold member that is different from the conventional bulb, which not only increases the cost but also increases the volume of the LED lamp. The DC LED device generates heat when it is energized, so an additional heat sink must be designed to handle this heat. If it is not possible to dissipate heat efficiently, high temperatures can cause adverse effects such as reduced luminous efficiency, reduced lifetime, and wavelength shift of the LED. In the process of converting AC power into DC power, Q also generates heat energy, especially the inductance and integrated circuit. High temperature will also damage such components and make the product inoperable. Especially in high-power applications, such as lighting fixtures, DC LED devices generate higher thermal energy, so the situation caused by insufficient heat dissipation is more serious. Some products use multiple low-power lamp type LEDs and use simple bridge rectifiers to accommodate small, traditional lamp heads. However, the brightness of low-power LEDs is generally too low, and market acceptance is limited, and such products are often severely dissipated due to poor heat dissipation. 3 201041426 In recent years, the technology of LED devices using alternating current has become more and more mature, and the brightness has also been greatly improved, which has commercial value. The alternating current LED device is formed by serially and parallelly connecting a plurality of LEDs on the same epitaxial wafer. After the epitaxial wafer is packaged, a resistor having a certain resistance value is connected in series, and can directly withstand a high voltage such as 110 volts or 220 volts. Therefore, the power converter or rectifier circuit required for the DC LED device is omitted, which effectively reduces the cost and reduces the quality problems caused by the circuit. Although the AC LED device is convenient for use in a small volume of space, the problem of heat dissipation must be dealt with. Especially in the application of commercial power, for example, the lighting used in lighting, the heat generated by the south is more than the south. If the radiator is added, the volume and cost of the LED lamp will be increased. If the AC LED device is not helped to dissipate heat, it will cause LED. Reduced luminous efficiency, reduced lifetime and wavelength shift, and even burned LEd epitaxial wafers. SUMMARY OF THE INVENTION One object of the present invention is to provide an LED lamp that enhances the heat dissipation of an AC LED device. One of the objects of the present invention is to propose an LED lamp that can directly replace a conventional tungsten wire, a halogen or a power saving bulb. One of the objects of the present invention is to propose a method of manufacturing an LED lamp. According to the invention, a LED lamp comprises a wick having at least one alternating current LED device, a lamp cap having a chamber, and a thermally conductive insulating material filled in the chamber to mechanically contact the lamp rim and an electrode of the lamp cap. When the AC LED device is energized, the lead-off material provides a thermal path to conduct heat from the wick to the electrode. The lamp head can use the lamp head of the conventional lamp, so the LED lamp can be directly inserted into the lamp socket of the general lamp without the need to replace the original lamp system or install the adapter. * The present invention also provides several methods of fabricating LED lamps that include soldering circuit components to the lamp cap and filling the thermally conductive insulating material into the chamber of the lamp cap. The thermally conductive insulating material mechanically contacts the wick and an electrode of the base.实施 Embodiments Fig. 1 is a schematic view showing a first embodiment of the present invention. To highlight the features of the present invention, this embodiment uses a standard base 10 for small bulbs having electrodes 12 and 14 for connection to an AC power source. As is well known to those of ordinary skill in the art, the electrode 12 is a metal shell having a spiral profile 16 having a chamber 18 therein. This embodiment uses an AC LED device 20 as the wick that secures the AC LED epitaxial wafer 22 to the bracket 24 and overlies the encapsulant 26 thereon. The LED package is a conventional technique, and the detailed package structure of the AC LED device 20 is not shown here for the sake of simplicity of the drawing. One end of the resistor 30 is soldered to the electrode 14, and the other end is soldered to the LED device 20 by a wire 32. Both ends of the wire 34 are soldered to the electrode 12 and the AC LED device 20, respectively. The equivalent circuit of this LED lamp is shown in Fig. 2. The alternating current v LED stray wafer 22 and the resistor 30 are connected in series between the electrodes 12 and 14. As is well known to those of ordinary skill in the art, so-called alternating current LED insect wafers, LEDs having two opposite directional configurations are connected in parallel between two 5 201041426 legs, each having at least one LED in the direction, The two oppositely configured LEDs are illuminated during the positive and negative half of the AC power source. The magnitude of the resistance value R of the resistor 30 is selected based on the current value required by the design. The resistor 30 also has the function of protecting the AC LED epitaxial wafer *22, and the resistor 30 absorbs most of the surge voltage when a surge occurs in the AC power source connected to the electrodes 12 and 14. Returning to Fig. 1, one of the features of the present invention is to fill the chamber 18 with a thermally conductive insulating material 36 that mechanically contacts the bracket 24 and the electrode 12 to provide a hot path for the alternating current LED to be wafer 22 due to energization. The thermal energy is conducted to the electrode 12 for heat dissipation. As is well known to those of ordinary skill in the art, the bracket 24 typically contains a metal sheet that assists in dissipating heat from the AC LED epitaxial wafer 22. Thus, the bracket 24 is attached to the thermally conductive insulating material 36 for good thermal conductivity. In addition to helping the AC LED epitaxial wafer 22 to dissipate heat, the thermally conductive insulating material 36 also assists in dissipating heat from the resistor 30 because the resistor 30 is buried in the thermally conductive insulating material ❹36. The thermally conductive insulating material 36 may be selected from epoxy resins, or thermally conductive powders such as alumina, aluminum nitride, boron nitride or other thermally conductive materials, or a mixture of the two. Table 1 shows the actual measured results using the three different thermally conductive materials in the LED lamp of Figure 1. Table 1 Output of the thermally conductive insulated AC power LED device 20 The brightness of the continuous lighting material 36 is the power consumption (W) (lm) 1000 hours 6 201041426 Epoxy resin 110V 1 65 No abnormality but higher temperature Epoxy resin + oxidation Ming powder 110V 1 68 No abnormal oxidation is powder -----.—110V 1 68 — No abnormality From the test results of Table 1, it can be known that the thermal conductive insulation material 36 using epoxy resin has poor thermal conductivity, so the overall temperature after electrification The heat-conducting insulating material 36, which is mixed with the heat-conducting powder, has a better heat-conducting effect, and no different hanging condition occurs in the point/spot type; the heat-conductive insulating material directly filled with the heat-conducting powder is compacted. 36, can also get good thermal conductivity. Overall, the LED lamp can obtain good light output brightness, and it can be continuously lit for 1 hour without abnormality! XS can also use other materials as the thermal conductive insulating material%. Preferably, the conversion coefficient is between (^至卿) ^Between. Traditional bulbs use standard lamp heads, such as E12, ei4, Ei7, legs and E27 疋 traditional crane bulbs, neon 16 and traditional guillotine lamp / bag lamp 2 Table 2 uses standard lamp holder El2 And the actual measured result of the e27 in the LED light of the drawing. Table 2 Types of the lamp cap-------- E12 -------- AC power supply voltage 110V Power consumption (w) ~ ^------- 1 -——---! Output brightness _(1m) Continuous lighting for 1000 hours 72 No abnormality E12 220V 1 nr\ No abnormality E27 110V ~~~-- 1 /[) -- ------ ————-- 67 —- No abnormality 201041426 E27 220V 1 73 No abnormality as shown in Table 2 'The LED lamp of Figure 1 uses either the smaller E12 lamp head or the volume The larger E27 lamp head can obtain good * light output brightness, and no abnormality occurs after continuous lighting for 1 hour, indicating that the heat generated by the AC LED epitaxial wafer 22 is effective. The ground is conducted to the electrode 12 for heat dissipation. As shown in Fig. 1, the size of the LED lamp is about the same as that of the lamp holder, and the heat dissipation capability is good, which can achieve high power applications which cannot be achieved by conventional techniques. In the lamp head of a conventional halogen bulb, one electrode is made of a beryllium metal and is separated from the other by the insulator. Some standard lamp caps use two needle electrodes that are insulated from each other. Whether it is a traditional tungsten filament bulb, a traditional horn bulb or other standard lamp cap, there is a chamber that can be filled with a thermal conductive edge material. Therefore, at least one electrode can be used to help the LED lamp to dissipate... because the electrode of the lamp cap is It is exposed to the outside, so it can provide a good cooling effect.
Jgj 1 的led燈可以使用各種製程來製造。在一實施例中， 斤有的電路元件焊接後，再填充導熱絕緣材料36到 腔室18 Φ 道 、、 導熱絕緣材料36的用量填充至其接觸支架24 ' 的底部為I 1 、 … 匈此，可以略微增加至超過支架24底部的平面， * 如果選用$ @ / 衣氧祕酯或環氧樹酯與導埶粉末的混合物作為 如::緣:料％，則在其注入腔室;8後加熱予以固化。 k用導熱粉末作為導熱絕緣材料36，則在其填入腔室 8 201041426 體、主入、其緊實。也可以將導熱粉末混合矽膠成為膠 焊接導18後加熱予㈣化。在另―實施例中，先 'm^Ury 1阻器30至電極12和14 ’然後填充導熱 •祕純 腔室18中，導線32及34的尾端露出導熱 絶緣材料3R 1 外’再將LED裝置20貼在導熱絕緣材料36 的上表面，备级、 後焊接導線32及34至LED裝置2〇。如果需 Ο要固化導熟絕緣材料36，可以在貼附LED裝置20以前或 以後加熱執行。 可以選用内含較多[ED數量的交流電LED磊晶片22來提 内LED燈的亮度。圖3係幾種交流電led磊晶片22的示 思、圖’第一種係在兩支接腳之間並聯兩串方向相反的 LED ’每一串包含兩個以上的LED ;第二種係在兩支接腳 之間串聯兩對以上的LED對，每一對LED對含有兩個方向 Q 相反的LED並聯在一起；第三種係五個以上的LED配置成 橋式結構。這些都已經有商品化的產品可以選用。 圖4係本發明的第二實施例的示意圖。此實施例的燈芯包 含電路板28及其上的交流電LED裝置20，交流電LED 装置20含有至少一個交流電LED磊晶片22。串聯電阻器 38改為安裝在電路板28上，並藉導線34及32將電路板 28連接在電極12和14之間。電路板28可以選用強化玻 續纖維(FR4)或金屬基板(IMS)的元件；交流電LED裝置 20和串聯電阻器38可以選用表面安裝型元件（SMD)，使 9 201041426 用表面黏著技術（SMT)安裝在電路板28上。因為電阻器38 係焊接在電路板28上，因此可以使用可變電阻器增加應 用的彈性，例如方便調整通過交流電LED裝置20的電流 • 值。在製造此LED燈時，先將交流電LED裝置20和串聯 • 電阻器38焊接在電路板28上，再與燈頭10接合。在一 實施例中，先焊接導線34及32至電極12及14與電路板 28，再填充導熱絕緣材料36到腔室18内，導熱絕緣材料 ❹ 36的量填充至其接觸電路板28的底部為止，可以略微增 加至超過電路板28底部的平面，需要的話，再將導熱絕 緣材料36加熱固化。在另一實施例中，先焊接導線34及 32至電極12和14，然後填充導熱絕緣材料36到腔室18 中，導線32及34的尾端露出導熱絕緣材料36外，再將 電路板28貼在導熱絕緣材料36的上表面，最後焊接導線 32及34至電路板28，需要的話，導熱絕緣材料36可以 ❹ 在貼附電路板28以前或以後加熱固化。導熱絕緣材料36 的選用和製作與圖1的實施例相同。如本技術領域之具有 通常知識者所熟悉的，電路板28的底部通常含有幫助散 熱的金屬層，因此，電路板28貼在導熱絕緣材料36上， ' 會有良好的熱導效果。 • 接合燈芯與燈頭10以後，再加上燈罩40。燈罩40可以選 用玻璃蓋、塑膠蓋、環氧樹酯或矽膠。如果選用玻璃蓋或 塑膠蓋，可以使用膠合、卡榫或螺牙等機械方式將其接合 201041426 在燈頭10的末端上。如果選用環氧樹酿或矽膠，則將其 塗佈在燈芯上，其用量足夠完全包住電路板28及其上的 所有元件，需要的話’予以加熱固化。燈罩40作為保嘴 蓋，防止水氣、灰塵或外力施加在LED燈的内部元件上。 • 燈罩40亦有光學元件的功能’可透過霧化、幾何形狀役 計等方式產生各種所需的光學效果。燈罩40的霧狀結構 可以利用喷砂、蝕刻、靜電粉體塗裝、塗佈;ε夕膠、喷K ❹射出成型方式製作。表3係幾種不同材質的燈罩4〇實於 測得的結果。 表3Jgj 1's led lights can be manufactured using a variety of processes. In one embodiment, after the circuit components of the battery are soldered, the thermally conductive insulating material 36 is filled into the chamber 18 Φ, and the amount of the thermally conductive insulating material 36 is filled to the bottom of the contact holder 24' as I 1 , ... , can be slightly increased to the plane beyond the bottom of the bracket 24, * If the choice of $ @ / oxime ester or epoxy resin and the conductive powder as the:: edge: material%, then in the chamber; 8 After heating, it is cured. k uses a thermally conductive powder as the thermally conductive insulating material 36, and then fills the chamber 8 201041426, the main inlet, and the compaction. It is also possible to mix the thermal conductive powder into a gel to weld the lead 18 and then heat it to the (four). In another embodiment, the 'm^Ury 1 resistor 30 to the electrodes 12 and 14' are then filled in the heat-conducting secret chamber 18, and the ends of the wires 32 and 34 are exposed to the thermally conductive insulating material 3R 1 ' The LED device 20 is attached to the upper surface of the thermally conductive insulating material 36, and the bonding wires 32 and 34 are soldered to the LED device 2A. If the conductive insulating material 36 is to be cured, it can be heated before or after the LED device 20 is attached. It is possible to use an ED number of alternating current LED epitaxial wafer 22 to increase the brightness of the LED lamp. Figure 3 is a schematic diagram of several AC led LED chips 22, the first type is two parallel strings of LEDs in parallel between two pins. Each string contains more than two LEDs; Two pairs of LED pairs are connected in series between the two pins, and each pair of LEDs is connected in parallel with LEDs having opposite directions Q; the third system is configured with a bridge structure of five or more LEDs. These are already commercially available products. Figure 4 is a schematic illustration of a second embodiment of the present invention. The wick of this embodiment includes a circuit board 28 and an alternating current LED device 20 thereon, and the alternating current LED device 20 includes at least one alternating current LED epitaxial wafer 22. The series resistor 38 is instead mounted on the circuit board 28 and the circuit board 28 is connected between the electrodes 12 and 14 by wires 34 and 32. The circuit board 28 can be selected from the components of the reinforced fiber (FR4) or the metal substrate (IMS); the alternating current LED device 20 and the series resistor 38 can be selected from surface mount components (SMD), so that the surface adhesion technology (SMT) of 9 201041426 is used. Mounted on circuit board 28. Since the resistor 38 is soldered to the circuit board 28, a variable resistor can be used to increase the flexibility of the application, e.g., to facilitate adjustment of the current through the AC LED device 20. In manufacturing the LED lamp, the AC LED device 20 and the series resistor 38 are first soldered to the circuit board 28 and then engaged with the lamp cap 10. In one embodiment, the wires 34 and 32 are first soldered to the electrodes 12 and 14 and the circuit board 28, and the thermally conductive insulating material 36 is filled into the chamber 18. The amount of thermally conductive insulating material 36 is filled to the bottom of the contact circuit board 28. Up to now, it can be slightly increased to a plane beyond the bottom of the circuit board 28, and if necessary, the thermally conductive insulating material 36 is heated and cured. In another embodiment, the wires 34 and 32 are first soldered to the electrodes 12 and 14, and then the thermally conductive insulating material 36 is filled into the chamber 18. The ends of the wires 32 and 34 are exposed to the thermally conductive insulating material 36, and the circuit board 28 is placed. The upper surface of the thermally conductive insulating material 36 is attached, and finally the wires 32 and 34 are soldered to the circuit board 28. If necessary, the thermally conductive insulating material 36 can be heat cured before or after the circuit board 28 is attached. The selection and fabrication of the thermally conductive insulating material 36 is the same as in the embodiment of FIG. As is well known to those of ordinary skill in the art, the bottom of circuit board 28 typically contains a layer of metal that aids in dissipating heat, and therefore, board 28 is attached to thermally conductive insulating material 36, which has a good thermal conductivity. • After the wick and the base 10 are joined, the shade 40 is added. The cover 40 can be a glass cover, a plastic cover, an epoxy resin or silicone. If a glass or plastic cover is used, it can be joined by mechanical means such as gluing, cassette or threading 201041426 at the end of the base 10. If an epoxy tree or silicone is used, it is applied to the wick in an amount sufficient to completely enclose the board 28 and all of the components thereon, and if necessary, heat cured. The lamp cover 40 serves as a mouthpiece cover to prevent moisture, dust or external force from being exerted on the internal components of the LED lamp. • The lampshade 40 also has the function of an optical component to produce a variety of desired optical effects through atomization, geometrical service, and the like. The mist-like structure of the globe 40 can be produced by sand blasting, etching, electrostatic powder coating, coating, ε 胶, and K ❹ injection molding. Table 3 shows the results of the lampshade 4 of several different materials. table 3
表3的内容顯示，不論燈罩40採用玻螭蓋、勉 m卜 主修盖、環氧 樹醋或石夕膠’皆可獲得良好的光輸出’點亮測試中亦無I • 常發生，表示通電後交流電LED磊晶片22產生的熱妒有 - 效透過導熱絕緣材料36及電極12傳導至外部，並未因為 加封燈罩40而明顯影響散熱。 圖5係本發明的第三實施例的示意圖。此led燈的燈#勺 11 201041426 含交流電LED裝置20、電路板28及導熱件50。交流電 LED裝置20、電阻器38和電路板28與圖4的實施例相同， 導熱件50的一端具有盤面貼在電路板28的底部表面上， ' 另一端埋入導熱絕緣材料36中。導熱件50的軸向長度介 • 於0. 1至10公分之間，較佳者為0. 5至3. 0公分，利用 其埋入導熱絕緣材料36的深淺來調整交流電LED裝置20 的高度。導熱件50係由高導熱率的材料製成，例如銅或 ® 其他金屬，其形狀為柱狀、片狀或其他形狀。燈罩40選 用玻璃蓋或塑膠蓋。此LED燈的製程，係先將導線34及 32焊接到電極12及14，然後將導熱絕緣材料36注入腔 室18中，導線34及32的尾端露出導熱絕緣材料36外， 將導熱件50的一端***導熱絕緣材料36中，需要的話， 加熱固化導熱絕緣材料36,再將已經安裝交流電LED裝置 20及電阻器38的電路板28焊接在導熱件50的盤面上， ° 焊接導線34及32到電路板28，最後將燈罩40接合到燈 頭10的末端上。 如果要提高LED燈的亮度，可以使用更多交流電LED裝置 20串聯、並聯或串並聯。例如圖6所示的多磊晶片燈芯， 係在電路板28的焊墊52及54之間並聯三排交流電LED 裝置20，每一排含有三個交流電LED裝置20。如果每一 個交流電LED裝置20的功率為1瓦的話，則此燈芯可以 達到9瓦。 12 201041426 圖4、圖5及圖6的燈芯係將交流電LED裝置20貼在電路 板28上，也可以改為在電路板28上封裝交流電磊晶片 2 2 ’其係將交流電蟲晶片2 2的裸晶直接貼在電路板2 8 ' 上，打線後再覆蓋封膠26。 • 圖7係本發明的第四實施例的示意圖，除了電阻器30以 外，增加一個安裝在電路板28上的電阻器38串聯至電阻 器30及交流電LED裝置20。電路板28、電阻器38及交 ❹ 流電LED裝置20可以作成一個模組，電阻器38的電阻值 大小係配合交流電LED裝置20設計的，電阻器30及燈頭 10是另一個模組。不同模組的結合可以得到不同規格的 LED燈。例如使用相同的電阻器30及燈頭10模組，只要 搭配不同的燈芯及電阻器38模組，就可以製造不同亮度 或電流值的LED燈。電阻器38也可以採用可變電阻器， 根據需求調整其電阻值。 〇 ^ 圖8係本發明的第五實施例的示意圖，交流電LED裝置20 焊接在導熱件50的盤面上，導熱件50的另一端埋入導熱 絕緣材料36中，利用其埋入導熱絕緣材料36中的深淺來 調整交流電LED裝置20的高度。表4係比較導熱件50使 _ 用銅柱及銅片的效果。 表4 導熱件的 交流電源 LED裝置20的 輸出亮度 連續點亮 型態 的電壓 消耗功率(W) ㈣ 1000小時 13 201041426The contents of Table 3 show that no good light output can be obtained in the lighting test regardless of whether the lampshade 40 is made of a glass cover, a 主m main repair cover, an epoxy tree vinegar or a Shiyue gum. After the power is turned on, the heat generated by the AC LED epitaxial wafer 22 is transmitted to the outside through the thermally conductive insulating material 36 and the electrode 12, and the heat dissipation is not significantly affected by the sealing of the lamp cover 40. Figure 5 is a schematic view of a third embodiment of the present invention. The light of the LED lamp #spoon 11 201041426 includes an alternating current LED device 20, a circuit board 28 and a heat conducting member 50. The AC LED device 20, the resistor 38 and the circuit board 28 are the same as the embodiment of Fig. 4. One end of the heat conducting member 50 has a disk surface attached to the bottom surface of the circuit board 28, and the other end is embedded in the thermally conductive insulating material 36. The axial length of the heat conducting member 50 is between 0.1 and 10 cm, preferably 0.5 to 3.0 cm, and the height of the alternating current LED device 20 is adjusted by the depth of the thermally conductive insulating material 36. . The heat conducting member 50 is made of a material having a high thermal conductivity, such as copper or other metal, which is in the shape of a column, a sheet or the like. The cover 40 is provided with a glass cover or a plastic cover. The process of the LED lamp is to first solder the wires 34 and 32 to the electrodes 12 and 14, and then inject the heat conductive insulating material 36 into the chamber 18. The tail ends of the wires 34 and 32 are exposed outside the heat conductive insulating material 36, and the heat conductive member 50 is One end is inserted into the thermally conductive insulating material 36, if necessary, the thermally conductive insulating material 36 is heated and cured, and the circuit board 28 on which the alternating current LED device 20 and the resistor 38 have been mounted is soldered to the surface of the heat conducting member 50, ° soldering wires 34 and 32 To the circuit board 28, the lamp cover 40 is finally joined to the end of the lamp cap 10. If you want to increase the brightness of the LED lights, you can use more AC LED devices 20 in series, parallel or series and parallel. For example, the multi-leaf wafer wick shown in FIG. 6 is connected in parallel with three rows of alternating current LED devices 20 between pads 52 and 54 of circuit board 28, each row containing three alternating current LED devices 20. If the power of each of the AC LED devices 20 is 1 watt, the wick can reach 9 watts. 12 201041426 The wick of FIG. 4, FIG. 5 and FIG. 6 attaches the alternating current LED device 20 to the circuit board 28, and may instead package the alternating current epitaxial wafer 2 2 on the circuit board 28, which is an alternating current worm wafer 2 2 The bare crystal is directly attached to the circuit board 2 8 ', and then the sealing tape 26 is covered after the wire is applied. Figure 7 is a schematic illustration of a fourth embodiment of the present invention with the addition of a resistor 38 mounted on circuit board 28 in series to resistor 30 and AC LED device 20 in addition to resistor 30. The circuit board 28, the resistor 38 and the alternating current LED device 20 can be formed as a module. The resistance value of the resistor 38 is designed in conjunction with the AC LED device 20. The resistor 30 and the lamp holder 10 are another module. Different modules can be combined to obtain LED lamps of different specifications. For example, using the same resistor 30 and the lamp cap 10 module, LED lamps of different brightness or current values can be manufactured by using different wicks and resistors 38 modules. Resistor 38 can also employ a variable resistor to adjust its resistance as needed. Fig. 8 is a schematic view showing a fifth embodiment of the present invention. The alternating current LED device 20 is soldered to the surface of the heat conducting member 50, and the other end of the heat conducting member 50 is embedded in the thermally conductive insulating material 36, and the thermally conductive insulating material 36 is buried therein. The depth of the medium adjusts the height of the alternating current LED device 20. Table 4 compares the effect of the heat conducting member 50 with the copper post and the copper piece. Table 4 AC power supply of the heat-conducting part Output brightness of the LED device 20 Continuously lit Type of voltage Power consumption (W) (4) 1000 hours 13 201041426
•從表4的測試結果可知，增加銅柱或銅片的設計可以讓交 .流電LED裝置20通電產生的熱能更快速傳導至外部，獲 得良好的光輸出亮度，連續點亮1〇〇〇小時無異常發生。 在一製造此LED燈的方法中，先將導線34及電阻器如 〇焊接到電極12及14，然後將導熱絕緣材料％注入腔室 I8中’導線34及32的尾端露出導熱絕緣材料36外，將 導熱件50的一端***導熱絕緣材料36 t，需要的話，加 熱固化導熱絕緣材料36,再將交流電LED裝置2〇焊接在• From the test results in Table 4, the design of the copper column or copper piece can increase the heat energy generated by the power supply of the galvanic LED device 20 to the outside, and obtain good light output brightness, and continuously illuminate 1〇〇〇. No abnormalities occurred during the hour. In a method of fabricating the LED lamp, the wires 34 and resistors are first soldered to the electrodes 12 and 14, and then the thermally conductive insulating material % is injected into the chamber I8. The trailing ends of the wires 34 and 32 expose the thermally conductive insulating material 36. In addition, one end of the heat conductive member 50 is inserted into the heat conductive insulating material 36 t, if necessary, the heat conductive insulating material 36 is heated and cured, and then the alternating current LED device 2 is soldered.
導熱件50的盤面上，然後焊接導線34及32到交流電LED 裝置20的接腳，最後將燈罩40接合到燈頭1〇的末端上。 在不同的實施例中，也可以在導熱件50***導熱絕緣材 〇料36以前先將交流電LED裝置20焊接在導熱件50的盤 面上。 圖9係本發明的第六實施例的示意圖，使用具有穿孔60 的電路板28 ’導熱件50的一端在電路板28的上方，另一 •端經過穿孔60埋入導熱絕緣材料36中，交流電led裝置 2〇焊接在導熱件5〇露出的一端上。導熱件50具有片狀結 構56及侧翼58，片狀結構56的轴向長度介於0.1至10 Λ刀之間’較佳者介於0.5至3.0公分之間，側翼58介於 201041426 交流電LED裝置20與電路板28之間。交流電led裝置 20的接腳66藉焊錫68焊接至電路板28的貫孔62，焊錫 70將電路板28的貫孔64焊接至電極12。貫孔62及64 可以改用盲孔或其他結構，這些是電路板的習知技術。電 '阻器30焊接在電極14及電路板28之間，因此電阻器3〇 與交流電LED裝置20串聯在電極12和14之間。電路板 28可以選用強化玻璃纖維或金屬基板的元件。較佳者，電 0路板28也機械性地接觸導熱絕緣材料％。在不同的實施 例中，也可以將電阻器30改為焊接在電路板28上的電阻 器，或增加在電路板28上的電阻器與電阻器3〇串聯，如 前述的實施例一樣。需要的話，可以加裝燈罩，這些和前 述的實施例一樣。在製造此LED燈時，先將電阻器3〇焊 接至電極14及電路板28，再將電路板28焊接至電極12， 》然後從穿孔60將導熱絕緣材料36填入腔室18中，將導 熱件的一端穿過穿孔60埋入導熱絕緣材料36中，最後焊 接交流電LED裝置20。需要的話，加熱固化導熱絕緣材 料36。 圖10係本發明的第七實施例的示意圖，使用具有金屬基 板的電路板28貼在導熱絕緣材料36上。這種電路板28 具有鋁層72、鋼層76及導熱層74介於二者之間，散熱能 力高於強化玻璃纖維基板。交流電LED裝置20以COB 封裴結構焊接在電路板28上，焊錫將電路板28焊接至電 15 201041426 極12 ’電阻器30焊接在電極14及電路板28之間，因此 電阻器30與交流電LED裝置20串聯在電極12和14之 間。在不同的實施例中’也可以將電阻器30改為焊接在 電路板28上的電阻器’或增加在電路板28上的電阻器與 電阻器30串聯，如前述的實施例一樣。需要的話，可以 加裝燈罩，這些和前述的實施例一樣。此LED燈的製造方 法係先焊接電阻器3 0至電極14，再將導熱絕緣材料3 6填 G 入腔室18中’然後將電阻器30焊接至電路板28，以及焊 接電路板28至電極12，最後在電路板28上封裝交流電 LED裝置20。需要的話，加熱固化導熱絕緣材料％。在 封裝交流電LED裝置20時，先將交流電LED磊晶片22 焊接在電路板28上，然後打上接合線，再塗佈封膠加。 如果加裝燈罩的話，也可以免除施加封膠26。 〇在上述各實施例中，根據實際的應用，採用的交流電㈣ 裝置20’其功率介於0.3至⑺之間，較佳者為mw， 選擇50至50000歐姆的電阻器30或邛。交流電led裝 置20的使用電壓介於12至240伏特之間，如果使用單一 交流電LED裝置20的話，則其使用電驗據交流電源選 擇為m伏特或220伏特者；如果串聯多個交流電led裝 •置的話，則其使用的電壓可以選用較低者，例如12伏 特。 雖然上述各實施例的交流電㈣^ 2〇僅例示炮彈型元 16 201041426 件及塑料引線晶片載体封裝結構(PLCC)、表面黏著封裝結 構(SMD)、及直接晶片載板封裝結構(COB)，但是其他各 種不同型態或封裝的交流電LED裝置亦可適用本發明。 【圖式簡單說明】 - 圖1係本發明的第一實施例的示意圖； 圖2係圖1的LED燈的等效電路的示意圖； 圖3係幾種交流電LED磊晶片的示意圖； 〇 圖4係本發明的第二實施例的示意圖； 圖5係本發明的第三實施例的示意圖； 圖6係多蠢晶片燈芯的不意圖， 圖7係本發明的第四實施例的示意圖； 圖8係本發明的第五實施例的示意圖； 圖9係本發明的第六實施例的示意圖；以及 圖10係本發明的第七實施例的示意圖。 〇 【主要元件符號說明】 10 燈頭 12 電極 14 電極 16 螺旋紋外形 18 腔室 20 燈芯 22 交流電LED蠢晶片 17 201041426 24 支架 26 封膠 30 電阻器 32 導線 • 34 導線 36 導熱絕緣材料 38 電阻器 〇 40燈罩 50 導熱件 52 焊墊 54 焊墊 56 軸向片 58 側翼 60 穿孔 ❹62貫孔 64 貫孔 66 接腳 68 焊錫 焊鍚 70On the disk surface of the heat conducting member 50, the wires 34 and 32 are then soldered to the pins of the AC LED device 20, and finally the lamp cover 40 is joined to the end of the lamp cap 1 . In various embodiments, the alternating current LED device 20 can also be soldered to the face of the heat conductive member 50 before the thermally conductive member 50 is inserted into the thermally conductive insulating material. Figure 9 is a schematic view of a sixth embodiment of the present invention, using a circuit board 28 having a perforation 60. One end of the heat conducting member 50 is above the circuit board 28, and the other end is buried in the thermally conductive insulating material 36 through the through hole 60, alternating current The led device 2 is soldered to the exposed end of the heat conducting member 5 . The heat conducting member 50 has a sheet-like structure 56 and a side wing 58. The axial length of the sheet-like structure 56 is between 0.1 and 10 borings, preferably between 0.5 and 3.0 cm, and the side flaps 58 are between 201041426 AC LED devices. 20 is between the circuit board 28. The pin 66 of the alternating current LED device 20 is soldered to the through hole 62 of the circuit board 28 by solder 68, and the solder 70 solders the through hole 64 of the circuit board 28 to the electrode 12. The vias 62 and 64 can be replaced with blind vias or other structures which are well known in the art of circuit boards. The electrical resistor 30 is soldered between the electrode 14 and the circuit board 28 such that the resistor 3 is connected in series with the alternating current LED device 20 between the electrodes 12 and 14. The circuit board 28 can be selected from reinforced glass fibers or metal substrates. Preferably, the circuit board 28 is also mechanically in contact with the thermally conductive insulating material. In various embodiments, resistor 30 can also be replaced with a resistor soldered to circuit board 28, or a resistor added to circuit board 28 can be connected in series with resistor 3, as in the previous embodiment. If necessary, a lampshade can be added, which is the same as the previously described embodiment. In the manufacture of the LED lamp, the resistor 3 is first soldered to the electrode 14 and the circuit board 28, and then the circuit board 28 is soldered to the electrode 12, and then the thermally conductive insulating material 36 is filled into the chamber 18 from the through hole 60. One end of the heat conducting member is buried in the thermally conductive insulating material 36 through the through hole 60, and finally the alternating current LED device 20 is soldered. If necessary, the thermally conductive insulating material 36 is heated and cured. Figure 10 is a schematic view of a seventh embodiment of the present invention, which is attached to a thermally conductive insulating material 36 using a circuit board 28 having a metal substrate. The circuit board 28 has an aluminum layer 72, a steel layer 76 and a heat conductive layer 74 interposed therebetween, and has a higher heat dissipation capability than the reinforced glass fiber substrate. The AC LED device 20 is soldered to the circuit board 28 in a COB package structure, and the solder solders the circuit board 28 to the power 15 201041426. The pole 12' resistor 30 is soldered between the electrode 14 and the circuit board 28, so the resistor 30 and the AC LED Device 20 is connected in series between electrodes 12 and 14. In a different embodiment, the resistor 30 can also be replaced with a resistor </ RTI> soldered onto the circuit board 28 or a resistor added to the circuit board 28 in series with the resistor 30, as in the previous embodiment. If necessary, a lampshade can be added, which is the same as the previous embodiment. The LED lamp is manufactured by first soldering the resistor 30 to the electrode 14, filling the thermally conductive insulating material 36 into the chamber 18, then soldering the resistor 30 to the circuit board 28, and soldering the circuit board 28 to the electrode. 12. Finally, the AC LED device 20 is packaged on the circuit board 28. If necessary, heat cure the heat conductive insulating material by %. When the AC LED device 20 is packaged, the AC LED epitaxial wafer 22 is first soldered to the circuit board 28, and then the bonding wires are applied, and then the sealing tape is applied. If the lamp cover is added, the application of the sealant 26 can also be dispensed with. In the above embodiments, the alternating current (four) device 20' is used with a power of between 0.3 and (7), preferably mw, and a resistor 30 or 50 of 50 to 50,000 ohms, depending on the actual application. The alternating current LED device 20 is used between 12 and 240 volts. If a single alternating current LED device 20 is used, it is selected to be m volts or 220 volts using an electrical power source; if multiple alternating current LEDs are connected in series, If it is set, the voltage used can be the lower one, for example 12 volts. Although the alternating current (four)^2 of the above embodiments only exemplifies the shell type 16 201041426 and the plastic lead wafer carrier package structure (PLCC), the surface mount package structure (SMD), and the direct wafer carrier package structure (COB), Other various types of AC LED devices of different types or packages may also be suitable for use in the present invention. BRIEF DESCRIPTION OF THE DRAWINGS - Figure 1 is a schematic view of a first embodiment of the present invention; Figure 2 is a schematic diagram of an equivalent circuit of the LED lamp of Figure 1; Figure 3 is a schematic diagram of several alternating current LED epitaxial wafers; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a schematic view of a third embodiment of the present invention; FIG. 6 is a schematic view of a multi-studded wafer wick, and FIG. 7 is a schematic view of a fourth embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 9 is a schematic view of a sixth embodiment of the present invention; and FIG. 10 is a schematic view of a seventh embodiment of the present invention. 〇【Main component symbol description】 10 Lamp cap 12 Electrode 14 Electrode 16 Helical profile 18 Chamber 20 Wick 22 AC LED stupid wafer 17 201041426 24 Bracket 26 Sealing 30 Resistor 32 Conductor • 34 Conductor 36 Thermally Conductive Material 38 Resistor 〇 40 lampshade 50 heat conductor 52 pad 54 pad 56 axial piece 58 side wing 60 perforation ❹ 62 through hole 64 through hole 66 pin 68 solder pad 70