201040006 六、發明說明： 【發明所屬之技術領域】 树明涉及—魏抒驗體、贱魏紅及該殼體 製造方法、尤其侧於-縣面具有拉敝之電子裝置殼體、製 造該殼體之模具及殼體製造方法。 " 【先前技術】 ο 隨著電子錢讀賴枝，料者龍子 :咖高。習知電子裝置之殼體之製作方法較常見有模= '型法（IML)，雜方法藉由先在翻設£—軸，然後往模内 >主入熔融之塑敎歸無薄膜_體成型，從崎 之和 體。在置人模具之前可經過預設處理，如在透明之薄^ 上進行印刷以獲得圖案層，如此可使殼體美觀，且薄膜位於 之外層，保護所述印刷之圖案，可使圖案持久。 、、成 因而，目前電子裝置之生產顧主要通過對薄膜上印刷圖案 〇 $設計，以吸個戶眼球。電子裝置殼體之外觀效果不僅為圖 案體現，還可通過加工薄膜表面以增強殼體美觀，習知加工薄膜 ^面時’藉由在注塑成型後’再在殼體表面進行高光、拉絲等工 孩，惟，工藝之增加，提高了殼體之製造成本。 【發明内容】201040006 VI. Description of the invention: [Technical field to which the invention belongs] Shuming involves - Wei Wei's body, Wei Weihong, and the method of manufacturing the casing, especially the electronic device casing with the side of the county Body mold and shell manufacturing method. " [Previous technology] ο With the electronic money reading Laizhi, the material is Longzi: Caga. The manufacturing method of the housing of the conventional electronic device is more common with the mold = 'method (IML), and the hybrid method is firstly turned over by the tumbling, then into the mold > Body shaping, from the body of the Saki. Before the mold is placed, it can be pre-processed, such as printing on a transparent thin film to obtain a pattern layer, so that the shell can be made beautiful, and the film is located on the outer layer to protect the printed pattern and make the pattern last. Therefore, the current production of electronic devices is mainly designed by printing the pattern on the film to attract an eye. The appearance effect of the electronic device casing is not only the pattern embodiment, but also the surface of the film can be processed to enhance the appearance of the casing. It is conventional to process the film surface by 'after injection molding' and then perform high-light, wire drawing, etc. on the surface of the casing. Child, however, the increase in technology has increased the manufacturing cost of the housing. [Summary of the Invention]
JL 上述内容’有必要提供—種表面具有拉絲紋之，且製造 藝簡單，成本低廉之電子裝置殼體。 、 另，有必要提供―種能使電子裝置殼體表面具有拉絲紋 造電子裝置殼體之模具。 、 其次，有必要提供一種所述電子裝置殼體之製造方法。 3 201040006 . 一種電子裝置之殼體，包括一基體層及形成於基體層上之一 薄膜層，所述薄膜層構成該電子裝置殼體之外表層，所述薄膜層 '與該基體層藉由模内注塑一體成型結合，該薄膜層上形成有拉絲 紋，所述拉絲紋為模内注塑成型同時形成於所述薄膜層上。 -種製造電子裝體之模具’包括—母模板及與該母模板 相對應配合的-公模板，所述母模板上開設有一模穴，所述公模 板上凸設有用以與所述模穴配合之模芯，所賴穴内形成有複數 條紋槽’該條紋槽用於將置於模穴内成型之薄膜在其表面形成拉 ° 絲條紋。 一種電子裝置殼體之製造方法，其包括如下步驟： 提供一模具’繩具包括—母模板及與該母模板相對應配合 之公权板’所述母模板上開設有一模穴，所述模穴内形成有複 數條紋槽，職公模板上凸設有㈣與所賴穴配合之模芯； &供一薄膜，將該薄膜置入所述模穴内， 將所述公模與母模合模，所述模芯與模尬合形成一型腔； ❹ 簡述型腔内注讀融歸，該轉與所述賴成型為- 體，且所述薄膜上對應所述條形槽形成拉絲紋； 冷卻，取出所述塑膠與薄膜形成之殼體。 相較習知技術’本電子裝置殼體藉由在模穴崎置條形槽， 從而在注贼射直接在殼體之_表面形成拉雜，無需在殼 體成型後再在殼體表面製作拉絲紋，可節省玉藝步驟，降低製造 殼體之成本，且殼體外觀美觀。 【實施方式】 请參閱® 1，本發明較佳實施例之電子裳置殼體1〇包括一薄 4 201040006 .膜層12及一基體層14，所述薄膜層包覆於所述基體層14上，構 •成該電子裝置殼體之外表層。該_層12為透明材質之薄膜形 成該薄臈層12絲體層w藉由模内注塑一體成型結合，製作 該薄膜層12之材料可以選自為聚碳酸醋（pc)或聚對苯二甲酸乙 -醇醋（PET)等樹脂材料。該薄膜層12上形成有拉絲紋122及 圖案124。所述拉絲紋122呈直條狀並排分佈於鄰近該薄膜層u 之侧緣A模内注塑成型同時薄膜受廢後形成。該拉絲紋122 ❹凸出於細層12表面，每-拉絲紋122之紋寬大約在αΐ毫米内。 所述圖帛124為薄膜層12在注塑成型前在透明薄膜上印刷形成， 且薄膜之具有_ 124之面絲體層14結合，如此圖案124可不 外露在薄膜層12之外表面而可視，很好地保翻案124。所述基 體層14為薄臈層12在注塑成型後由注入之塑膠所形成，該基體 層14之材料可選自為聚乙烯、聚麟、聚碳酸自旨、丙烯睛苯乙婦 -丁二烯共聚合物、聚甲基丙烯酸曱酯或聚對苯二甲酸乙二醇酯等 塑膠中之任一種。 ❹ 請參閱圖2及圖3，製作所述電子裝置之殼體10時，首先提供 -模具20 ’繩包括—母難22及__與歸模板22相對應配 合之一公模板24，所述母模板22上開設有一模穴2以，該模穴222 内表面開設有複數條紋槽224，該條紋槽224呈直條狀分佈於模穴 222内表面之兩侧，每一條形槽224之槽寬小於〇1毫米。所述公模 板24上形成有一模芯242，該模芯242以用於與所述模穴222相配 合。孩公模板24之一侧還開設有一澆道244，該澆道244貫通所述 模心242,用於連接注塑機（未標示）將炼融之塑膠注入以成型。 提供一薄膜層12’該薄膜層12可經過在透明基體膜上印刷圖 5 201040006 •案m、熱顧成形及裁切工藝形成，其形狀配合所述模穴222 、 之形狀。將該薄膜層12置入並定位於所述模穴恐~，薄膜層i2 之外表面緊貼於設有條形槽224之模穴222之内表面。、曰 將所述母模板22與公模板24合模，所述模芯242與模穴222 酉己合形成一型腔246。往該型腔挪内注入炫融之塑膠，於注塑壓 力作用下，注入之塑膠將所述薄膜層12，則薄膜層η上緊貼 槽224之部位將受顧至對應之條形槽级内，從而在 〇 上形成拉絲紋122。所述炫融之塑謬與所述薄膜層η ^ ^體，形成所述殼體10，該注入之_形成所述基 待冷部後’開模取出該殼體1〇。 可以理解，為了加強薄膜層12與基 :::基體層14之前可於薄臈層㈣圖㈣心 粘膠層，再注塑成型基體層14。 可以理解，所述圖案124亦可以省略。 可以理解，所述條紋槽224 :r^ 在模穴货内形=^=於_層12表面’藉由 本電子裝置殼體10藉由在模 在注塑成型中可直_體10之置條形槽224，從而 無需在殼體1G細_雜5 彡餘絲_， 殼體10之製作工蓺 表面㈣拉絲紋，如此可節省 衣步驟降低製造殼體之成本，且殼體外觀美觀。 201040006 【圖式簡單說明】 圖1係本發明較佳實施方式電子裝置殼體之示意圖。 圖2係制作圖1所示之電子裝置殼體之模具之示意圖。 圖3係制作圖1所示之電子裝置殼體之模具合模注塑時狀態 示意圖。 【主要元件符號說明】 電子裝置殼體 10 模穴 222 薄膜層 12 條紋槽 224 拉絲紋 122 公模板 24 圖案 124 模芯 242 基體層 14 潦道 244 模具 20 型腔 246 母模板 22JL The above contents are necessary to provide an electronic device housing having a brushed surface and a simple manufacturing method and low cost. Further, it is necessary to provide a mold which enables the surface of the electronic device housing to have a wire drawing electronic device housing. Secondly, it is necessary to provide a method of manufacturing the electronic device housing. 3 201040006. A housing of an electronic device comprising a base layer and a film layer formed on the base layer, the film layer forming a surface layer outside the housing of the electronic device, and the film layer and the substrate layer are The in-mold injection molding is integrally formed, and the film layer is formed with a drawing pattern, and the drawing pattern is formed by in-mold injection molding while being formed on the film layer. - a mold for manufacturing an electronic package 'including a mother template and a common template corresponding to the mother template, the mother template having a cavity formed thereon, the male template being convexly disposed to be associated with the cavity In combination with the core, a plurality of strip grooves are formed in the hole. The strip groove is used to form a film formed in the cavity to form a stripe on the surface. A manufacturing method of an electronic device housing, comprising the steps of: providing a mold, a rope comprising: a mother template and a common weight plate corresponding to the mother template, wherein the mother template has a cavity, the mold a plurality of stripe grooves are formed in the hole, and a core of the mate is provided with (4) a core matched with the reliance hole; and a film is provided, the film is placed in the cavity, and the male mold and the female mold are closed The core and the mold are combined to form a cavity; 简 a brief description of the cavity in the cavity, the rotation and the formation are formed into a body, and the film is formed with a drawing pattern corresponding to the strip groove Cooling, taking out the casing formed by the plastic and the film. Compared with the prior art, the electronic device housing has a strip-shaped groove in the cavity, so that the thief shoots directly on the surface of the casing, and it is not necessary to make a drawing on the surface of the casing after the casing is formed. The pattern can save the jade step, reduce the cost of manufacturing the shell, and the appearance of the shell is beautiful. [Embodiment] Please refer to the first embodiment of the present invention. The electronic device housing 1 includes a thin layer 4 201040006. The film layer 12 and a base layer 14 are coated on the base layer 14 . The upper layer is formed outside the casing of the electronic device. The layer 12 is a film of a transparent material, and the wire layer 12 is formed by in-mold injection molding. The material of the film layer 12 can be selected from polycarbonate (polyphenol) or polyterephthalic acid. Resin material such as B-alcohol (PET). A draw pattern 122 and a pattern 124 are formed on the film layer 12. The drawing patterns 122 are formed in a straight strip shape and arranged side by side adjacent to the side edge A of the film layer u by injection molding while the film is discarded. The drawing pattern 122 is protruded from the surface of the fine layer 12, and the width of each of the drawing patterns 122 is approximately within about ΐ mm. The drawing 124 is formed by printing the film layer 12 on the transparent film before injection molding, and the surface layer 14 of the film having 144 is combined, so that the pattern 124 can be exposed without being exposed on the outer surface of the film layer 12, which is good. Land insurance turned over 124. The base layer 14 is formed by injecting plastic after injection molding, and the material of the base layer 14 can be selected from the group consisting of polyethylene, polylin, polycarbonate, and acrylonitrile-butyl Any of a plastic such as an olefin copolymer, polymethyl methacrylate or polyethylene terephthalate. Referring to FIG. 2 and FIG. 3, when the housing 10 of the electronic device is manufactured, firstly, a mold 20' is provided, and the female mold 22 and the __ are matched with the return template 22, and the male template 24 is matched. A die hole 2 is defined in the mother die plate 22, and a plurality of stripe grooves 224 are formed on the inner surface of the cavity plate 222. The stripe groove 224 is distributed in a straight strip on both sides of the inner surface of the cavity 222, and each slot 224 is grooved. The width is less than 〇1 mm. A male core 242 is formed on the male mold plate 24 for mating with the mold cavity 222. A runner 244 is also provided on one side of the child template 24, and the runner 244 extends through the core 242 for connecting an injection molding machine (not shown) to inject the fused plastic for molding. A film layer 12' is provided. The film layer 12 can be formed by printing a pattern on the transparent substrate film, which is formed by a molding process and a cutting process, and which is shaped to match the shape of the cavity 222. The film layer 12 is placed and positioned in the cavity, and the outer surface of the film layer i2 is in close contact with the inner surface of the cavity 222 in which the strip groove 224 is provided.曰 The mother template 22 is clamped with the male template 24, and the core 242 and the cavity 222 are combined to form a cavity 246. Injecting the plastic into the cavity, under the action of the injection pressure, the injected plastic layer will be the film layer 12, and the portion of the film layer η which is closely attached to the groove 224 will be taken into consideration in the corresponding strip-shaped groove level. Thus, a draw pattern 122 is formed on the crucible. The spliced plastic raft and the film layer are η^^ formed to form the casing 10, and after the injection forms the cold portion, the casing 1 is opened and opened. It can be understood that the base layer 14 is injection molded in order to reinforce the film layer 12 and the base ::: base layer 14 before the thin layer (4) of the core layer. It can be understood that the pattern 124 can also be omitted. It can be understood that the stripe groove 224: r^ is in the shape of the cavity product = ^ = on the surface of the layer 12 by the electronic device housing 10 by the mold in the injection molding can be straight The groove 224, so that the surface of the casing 10 is not required to be drawn in the casing 1G, the surface of the casing 10 is drawn (4), so that the cost of manufacturing the casing can be reduced, and the appearance of the casing is beautiful. 201040006 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a housing of an electronic device according to a preferred embodiment of the present invention. 2 is a schematic view of a mold for fabricating the housing of the electronic device shown in FIG. 1. Fig. 3 is a schematic view showing the state in which the mold of the electronic device shown in Fig. 1 is molded by injection molding. [Main component symbol description] Electronic device housing 10 Cavity 222 Film layer 12 Stripe groove 224 Drawing pattern 122 Male template 24 Pattern 124 Core 242 Base layer 14 Channel 244 Mold 20 Cavity 246 Parent template 22