201039432 六、發明說明： 【發明所屬之技術領域】 種於2係關於一種發光二極體封裳結構，特別關於-應用之發光組件、直下式發光模組及顯it;其 【先前技術】 可著科技之進步，發光二極體實為現今日常生活中不 號註产等都Η 2 e的至内照明燈具、車燈、路燈及交通 燈4都疋常見的發光二極體的應用態樣。 請參照圖i所示，— 圖。發光組件1包含义σ r，、且件的局部結構示意 的複數個發光二極體封裝 心置於舍先基板11 結構2包含—發光 # ’發光二極體封裝 …發光二極體晶片4:=他 設發光二極體晶片 =二板22,且反射體24環 之局部光線（如圖中實^圍4光二極體晶片^所產生 21射出，局部光線U R不）可直接由發光二極體晶片 Μ反射而間接地射出/圖中虛線所示）則是經由反射體 然而’仍請參照圖1 片2]射出以及經由反 =’+線直接由發光二極體晶 面積相當集中（如圖 —4接反射所提供的有效照射 應充足的光線時，勢必之擴圓虛線所示），因此若欲供 而增加發光二極體封裝結構2的 201039432 數量以增大出光的面積，不過如此的設計除了導致成本的 提高外，由於在發光基板11上密集地設置發光二極體封 裝結構2，因而導致在發光二極體封裝結構2的正向出光 方向上發生光線過於集中反而造成亮度局部不均勻的問 題。 因此，如何提供一種發光二極體封裝結構及其應用之 發光組件、直下式發光模組及顯示裝置以提升照明亮度、 擴大照射面積且能均勻光線，已成為重要課題之一。 ❹ 【發明内容】 有鑑於上述課題，本發明之目的為提供一種發光二極 體封裝結構及其應用之發光組件、直下式發光模組及顯示 裝置，具有亮度充足、照射面積廣及光線均勻之優點。 為達上述目的，依據本發明之一種發光二極體封裝結 構，其包含至少二發光二極體晶片、一載具、至少一分隔 結構及一反射體。其中，發光二極體晶片承載於載具上； 〇 分隔結構設置於載具上並位於發光二極體晶片之間；而反 射體環設於分隔結構及發光二極體晶片的周圍。 且，依據本發明之一種發光組件，其包含一電路基板 及複數個發光二極體封裝結構，發光二極體封裝結構電性 連接於電路基板，且各個發光二極體封裝結構包含至少二 發光二極體晶片、一載具、至少一分隔結構及一反射體。 . 其中，發光二極體晶片承載於載具上；分隔結構則是設置 - 於載具上並位於發光二極體晶片之間；反射體環設於分隔 5 201039432 結構及發光二極體晶片的周圍。 又，依據本發明之一種直下式發光模組，其包含一底 板及至少一發光組件，發光組件設置於底板上，其中，發 光組件具有一電路基板及與電路基板電性連接的至少一 發光二極體封裝結構。其中，發光二極體封裝結構包含至 少二發光二極體晶片、一載具、至少一分隔結構及一反射 體；發光二極體晶片承載於載具上，分隔結構設置於載具 上並位於發光二極體晶片之間，且反射體環設於分隔結構 及發光二極體晶片的周圍。 又，依據本發明之一種顯示裝置包含一顯示面板及至 少一發光組件係與顯示面板相對而設，其中發光組件包含 一電路基板、複數個發光二極體封裝結構及一反射體，發 光二極體封裝結構係電性連接於電路基板，各發光二極體 封裝結構係包含有至少二發光二極體晶片、一載具、至少 一分隔結構及一反射體。其中，發光二極體晶片承載於載 具上；分隔結構設置於載具上並位於發光二極體晶片之 間；而反射體環設於分隔結構及發光二極體晶片的周圍。 另，依據本發明之一種顯示裝置包含一顯示面板及相 對設置的一直下式發光模組，直下式發光模組具有一底板 及至少一發光組件設置於底板上，發光組件具有一電路基 板及電性連結於電路基板的複數個發光二極體封裝結 構，其中，各發光二極體封裝結構包含至少二發光二極體 晶片、一載具、至少一分隔結構及一反射體，發光二極體 晶片承載於載具上，分隔結構則是設置於載具上並位於發 201039432 光二極體晶片之間，且反射體環設於 體晶片的周圍。 構及發先二極 承上所述，依本發明之一 _ 應用之發光組件、直下式發光模組文::=，其 結構設置於反射體内並介於發光二極體之間：= —極體所產生的光線能夠經由分隔結構的反 -: 射光線的角度，以在使用較少發光 :大出 Ο 〇 到提升照明亮度、擴大照射面積及均=達 之=:、=二種發光二極體封裝結構及其應用 、千直下式發光模組及顯示梦罟At紙# 输提升照射面積’同時因為節省發:極體= 量而降低成本。 位體的使用數 【實施方式】 -種==:式’說明依據本發明較佳實施例之 输及_置:::=發光組件、直下式發 說明。 /、中相同的兀件將以相同的符號加以 請同時參照圖2A與圖2β所示，其 的-種發光二極體封裝結構，圖2β則 〜务明 在此實施例中所揭露的發光二極體料 的2見圖。 發光二極體晶片31、一載具32、 一 匕3至>、二 分隔結構33則是設置㈣具32上，並位於發光1極體晶 7 201039432 片31之間，分隔結構％於靠近發光二極 -面的一端較寬，於靠 體封茗釔構出光 、罪、载具32的一端較窄；及 設於分隔結構33及辂水,Α 反射體34環 偁33及Μ二極體w 毛光—極體晶片31開啟後，局部的光 於發光二極體封裝結構3,如圖2α中實、、'曰^妾射出 光線則會藉由反射的方式離開發光二極裝:局，的 圖2Α中虛線所示。 U冓3 ’如 載具32可為導線架、基板或電路板。舉例來說，告 載具32為-電路板並接收來自外界的一電源時（: 示），由於載具32與發光、、"頒 、知兀一位體日日片w彼此電性連 因此可透過載具32以控制發光二極體晶片31的開關。 分隔結構33及反射體34則是可由反射材質所構成， 其中’反射材質可選自於銀、紹、氧化紹、氧化石夕及其組 合所構成之群組。是以，分隔結構33及反射體％可藉由 反射材質以使發光二極體晶片31所產生的光線（如圖曰2A 中虛線所不）能夠充分地反射至外界，舉例來說，發光二 極體晶片31產生光線後，出光角度較大的光線除了可藉 由反射體34的反射面341以反射至外界外，更可利用分 隔結構33的反射面331而使發光二極體晶片31的出射角 度能夠大幅地增加。 另外，分隔結構33與反射體34除了可為反射材質所 構成外，更可分別在反射面331、341的區域上藉由額外 形成一反射層（圖未顯示）的方式，而使得來自發光二極 體晶片31的光線能夠在到達此些區域後發生反射。且， 201039432 ί:::1、341之大小及形狀則可配合實際需求而改變， 在此雖以—斜㈣例朗反射面33卜34 明’舉例來笱，c & …、并丨民制本發 橢圓曲而 31、341可依實際需要以至少一 至少一拋物曲面或其組合。 盆孕^ ’發光二極體封裝結構3更包含—封裝材料35 ’ 其覆蓋發光二極p a μ。、201039432 VI. Description of the invention: [Technical field of the invention] The invention relates to a light-emitting diode sealing structure, in particular to an application light-emitting component, a direct-type lighting module and a display device; With the advancement of technology, the light-emitting diodes are the application patterns of the common light-emitting diodes, such as the interior lighting, the lights, the street lamps and the traffic lights, which are not in the daily life. . Please refer to Figure i, - Figure. The light-emitting component 1 includes a sense σ r , and a plurality of light-emitting diode package cores schematically illustrated by the partial structure of the component are placed on the substrate 1 . The structure 2 includes a light-emitting light emitting diode package (light-emitting diode package 4): = He sets the light-emitting diode chip = two plates 22, and the local light of the ring of the reflector 24 (as shown in the figure, the photo-diode of the photodiode is generated by 21, the local light UR is not) can be directly emitted by the light-emitting diode The body wafer is reflected indirectly and indirectly/shown by the dotted line in the figure), but it is emitted through the reflector, but still see the film 2 in Fig. 1 and the area of the crystal of the LED is directly concentrated via the reverse = '+ line (eg Figure 4 shows that the effective illumination provided by the reflection should be sufficient for the light, which is bounded by the dotted line. Therefore, if you want to increase the number of 201039432 of the LED package structure 2 to increase the area of the light, but In addition to the cost increase, the light-emitting diode package structure 2 is densely disposed on the light-emitting substrate 11 , so that the light in the forward light-emitting direction of the light-emitting diode package structure 2 is excessively concentrated and causes bright Local inhomogeneities problems. Therefore, how to provide a light-emitting diode package structure and a light-emitting component thereof, a direct-type light-emitting module, and a display device to improve illumination brightness, expand an illumination area, and uniform light have become one of important topics. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a light emitting diode package structure and a light emitting component thereof, a direct type light emitting module, and a display device, which have sufficient brightness, wide illumination area, and uniform light. advantage. To achieve the above object, a light emitting diode package structure according to the present invention comprises at least two light emitting diode chips, a carrier, at least one partition structure and a reflector. The light emitting diode chip is carried on the carrier; the 分隔 partition structure is disposed on the carrier and located between the light emitting diode wafers; and the reflector ring is disposed around the partition structure and the light emitting diode chip. According to the present invention, a light emitting device includes a circuit substrate and a plurality of light emitting diode package structures, the light emitting diode package structure is electrically connected to the circuit substrate, and each of the light emitting diode package structures includes at least two light emitting devices. A diode chip, a carrier, at least one partition structure, and a reflector. Wherein, the light emitting diode chip is carried on the carrier; the partition structure is disposed on the carrier and located between the light emitting diode wafers; the reflector ring is disposed on the partition 5 201039432 structure and the light emitting diode chip around. Moreover, a direct-lit light-emitting module according to the present invention includes a bottom plate and at least one light-emitting component, and the light-emitting component is disposed on the bottom plate, wherein the light-emitting component has a circuit substrate and at least one light-emitting diode electrically connected to the circuit substrate Polar body package structure. The light emitting diode package structure comprises at least two light emitting diode chips, a carrier, at least one partition structure and a reflector; the light emitting diode chip is carried on the carrier, and the partition structure is disposed on the carrier and located Between the light-emitting diode wafers, and the reflector ring is disposed around the partition structure and the light-emitting diode wafer. Moreover, a display device according to the present invention includes a display panel and at least one light emitting component disposed opposite to the display panel, wherein the light emitting component comprises a circuit substrate, a plurality of light emitting diode package structures, and a reflector, and the light emitting diode The body package structure is electrically connected to the circuit substrate, and each of the light emitting diode package structures comprises at least two light emitting diode chips, a carrier, at least one partition structure and a reflector. The light emitting diode chip is carried on the carrier; the partition structure is disposed on the carrier and located between the light emitting diode chips; and the reflector ring is disposed around the partition structure and the light emitting diode chip. In addition, a display device according to the present invention includes a display panel and a correspondingly disposed light-emitting module. The direct-lit light-emitting module has a bottom plate and at least one light-emitting component disposed on the bottom plate, and the light-emitting component has a circuit substrate and electricity. The plurality of LED packages are connected to the circuit substrate, wherein each of the LED packages comprises at least two LED chips, a carrier, at least one partition structure and a reflector, and the LEDs The wafer is carried on the carrier, and the partition structure is disposed on the carrier and located between the 201039432 photodiode wafer, and the reflector ring is disposed around the body wafer. According to the invention, the light-emitting component and the direct-lighting module of the invention are arranged in the reflector and interposed between the light-emitting diodes: - The light generated by the polar body can pass through the inverse of the separation structure: the angle of the light to be used in the use of less light: large out Ο 提升 to increase the brightness of the illumination, enlarge the illumination area and both = =, = two Light-emitting diode package structure and its application, thousands of direct-lit light-emitting modules and display nightmare At paper #transfer to enhance the irradiation area' while reducing costs by saving hair: polar body = quantity. The number of use of the body [Embodiment] - The type ==: Formula 'Describes the transmission and the _:::= illuminating component according to the preferred embodiment of the present invention, and the direct type is described. The same components will be given the same symbols. Please refer to FIG. 2A and FIG. 2β simultaneously, the light-emitting diode package structure thereof, and FIG. 2β is the light disclosed in this embodiment. 2 of the diode material is shown in the figure. The light-emitting diode chip 31, a carrier 32, a 匕3 to >, and two partition structures 33 are disposed on the (4) member 32 and located between the light-emitting diodes 7 201039432 and the partition structure % close to each other. The end of the light-emitting diode-face is wider, the light is closed by the body, the sin, the end of the carrier 32 is narrower; and the partition structure 33 and the hydrophobic water are provided, and the reflector 34 is surrounded by the ring 33 and the second pole. Body w - After the polar body chip 31 is turned on, the local light is emitted from the LED package structure 3, as shown in Fig. 2α, and the light emitted from the lens is removed from the light-emitting diode by reflection: The bureau, shown in the dotted line in Figure 2Α. U冓3' such as carrier 32 can be a leadframe, substrate or circuit board. For example, when the carrier 32 is a circuit board and receives a power source from the outside (: display), since the carrier 32 is illuminated with light, and the body is connected to each other, the body is electrically connected to each other. Therefore, the carrier 32 can be passed through to control the switching of the LED chip 31. The partition structure 33 and the reflector 34 may be made of a reflective material, wherein the 'reflective material' may be selected from the group consisting of silver, sulphur, oxidized, oxidized stone, and combinations thereof. Therefore, the partition structure 33 and the reflector % can be reflected by the reflective material so that the light generated by the light-emitting diode wafer 31 (not shown by the broken line in FIG. 2A) can be sufficiently reflected to the outside, for example, the light-emitting two After the polar body wafer 31 generates light, the light having a larger light exiting angle can be reflected by the reflecting surface 341 of the reflector 34 to the outside, and the reflecting surface 331 of the partitioning structure 33 can be used to make the light emitting diode chip 31. The exit angle can be greatly increased. In addition, the partition structure 33 and the reflector 34 can be formed of a reflective material, and can be formed by separately forming a reflective layer (not shown) on the regions of the reflective surfaces 331, 341, respectively. The light of the polar body wafer 31 can be reflected after reaching such areas. Moreover, the size and shape of 201039432 ί:::1, 341 can be changed according to actual needs. However, the example is — oblique (four) 朗 反射 反射 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 33 The elliptical curvature 31 and 341 can be at least one parabolic curved surface or a combination thereof according to actual needs. The potentiated diode package 3 further comprises an encapsulating material 35' which covers the light-emitting diode p a μ. ,
㈣隔結構33。封聚材料35的 "、0 k於％氧樹脂（epoxy)、矽膠（silicon)、高分 及其組。所構成的群組。為使發光二極體晶片Η所產生 的光線能射出至外界’封裝材料35必須具有透光性，且 由於不同的發光二極體晶片31具有不同的色光，為調整 出射光線的顏色，封裝材料35内更可摻雜螢光體3如，另 外，在封裝材料35内亦可摻雜擴散體鳩以使來自發光 二極體晶片31的出光角度能更為寬廣。 " 發光-極體封裝結構3除了具有上述的態樣外，亦可 如圖3A及3B所示’其中，圖3A及邛所示的發光二極 體晶片31之數量及分隔結構33a、33b的配置均不同於上 述的實施例’舉例來說，在圖3A與圖3B中的發光二極體 晶片31數量分別為三個與四個，且實際上，發光二極體 晶片31的數量可依據實際需要而改變，另外，就發光二 極體晶片31之排列方式而言，在此雖以相互對稱為例， 不過在實際的應用上，發光二極體封裝結構3a、3b中的發 光一極體晶片31並未限定為對稱的排列方式。 值得注意的是，在圖3A及3B中所示的分隔結構33a、 33b分別將發光二極體封裝結構3a、3b的内部區域劃分為 9 201039432 二部^及四部分，且分隔結構33a、33b與載具％之間， 可依實際需要以組裝或拼接等方式組成，而再就分隔結構 33a、33b與反射體34之間來說，以圖从及犯所示的實 施例為例’分隔結構33a、33b與其對應的反射體34為— 體成型的結構體H村依實際需要以將此些分隔結 33a、33b藉由黏貼或卡合等方式以連結於與其對應的反射 當然’在圖3A與圖3B中的發光二極體封裝結構七、 3b亦包含有封裝材料35，且其中也摻雜有螢光體 散體36b。 '、倾 請再參照圖4所示，其為本發明較佳實施例之另一種 發光二極體封裝結構3。的示意圖。其與上述發光二極體封 衣…構3的差別在於本實_之分隔結構…之反射面 331c以及反射體34c之反射面34U係為曲面。藉由曲面 的设计，將可改變發光二極體封裝結構3(：所產生的光形鱼 ^實施狀發光二極體縣結構3所產生的光形係為不 同的’進而達到Μ的光形設計。值得—提的是，曲面的 反射面331c及341c你雲盈么—丄 而要的不冋係可為凹面或凸面，於 此並不加以限制。 ' 另外，本發明更同時揭露一種發光組件，盆中 ==為側邊式人光的發光組件，亦^直下式發光的 ♦先』件’以下’將以圖5與圖6則分別 組件態樣。 卜」们心九 電 請參照圖5所示，本發明之—種發光組件4包含一 10 201039432 路基板41及稷數個發光二極 ^ ^ 封裝結構3，且每個發光二 極體封裝結構3電性連接於電 电塔悬扳41 ’其中，如圖2Α 所不，發光二極體封贳社媸1 —人 ， -7Λ y\j 一 /^3& •月吞 ，具32、至少一分隔結構％、一反射體％及 31、一…… 構3包含至少二發光二極體晶片 封 裝材料35，封裝材料35覆蓋發 -〇. , t 復蛊毛先—極體晶片31及分隔結 = 體封裝結構3已於上詳述，於此不再 Ο 在：實：例中’所述之發光組件4係可例如為一種側 /入、’的&光師’發光二極體縣結構3所產生的光 形（如圖5中之橢圓虛線所示）係往發光二極體封裝結構 的兩側發出分佈，因此發光組件4整體所產生的光線分 佈較習知（如目！）的光線分佈平均，混光距離也可有效 縮短。 〜此外，電路基板41更設有至少—導線（圖未顯示）， 藉以控制發光二極體晶片31的開關。 〇 圖6為本發明之另—種實施例，本實_係揭露―種 直下式發光模組5包含-底板51及至少—個發光組件4。 在圖6所示的直下式發光模組5中，發光組件*的電路其 板41設置於底板51上，換言之，電路基板41上二 二極體封裝結構3藉由電路基板41以與底板51連結:並 請同時-併參 2Α射，發光二極體封裝結構3°包含 至少二發光二極體晶片3卜一載具32、至少一分隔結： • 33、一反射體34及一封裝材料35。由於發光二極體封裝 結構3及發光組件4已於上詳述，於此不再贅述。 衣 201039432 其中，底板51的材質可選自於金屬、合金、高分子 及其組合所構成的群組；另外，發光組件4所對應的電路 基板41更整合為單一電路板，如此，可簡化直下式 模組5的組裝流程。 天 當直下式發光模組5開啟時，由於點亮的發光二極體 :片31會叫產生熱能，所產生的熱能可藉由散熱效果 較佳的底板5!而逸散，藉以可確保直下式發光模組5不 會在南溫環境下操作，因此可有助於延長直 5的使用壽命並確保其可靠度。 知尤稹、、且 請參照圖7所示，本發明之一種顯示裝置6 示及-直下式發光模組5。直下式發光模組5㈣ 不面板61相對而設，其中，直下式發光模組5呈有ϋ底 板51及設置在底板51上的至少-發光組件4,二4 路^電:ί板41及複數個發光二極體封裝結構 更二來；2發先二極體封裝結構3彼此電性連接， 更相末说，發光二極體封裝結構 包含至少二發光二極體晶片31、—载具％二:“，其 結構33、-反射體34及一封裝材料％。 〃 一分隔 本實施例所示的顯示面板61可 板’換言之，於此所揭露的顯 千面减不面 一此 u 丁 nj Pand Display)’此外’顯示面板61亦可為 — 面板，換言之，所揭雪% # ,、、、 種液日日减不 极换口之所揭路的顯不裝置6為平 Crystal Display Apparatus, LCD) ^ ^ ^ n ( qWd 與圖6所示，由於直下式發光额5中的^^^(4) partition structure 33. ", 0 k of the encapsulation material 35 is in % epoxy, silicon, high score and its group. The group formed. In order to enable the light generated by the light-emitting diode chip to be emitted to the outside, the package material 35 must have light transmissivity, and since different light-emitting diode chips 31 have different color lights, in order to adjust the color of the emitted light, the packaging material In the 35, the phosphor 3 can be doped, for example, and the diffuser can be doped in the encapsulating material 35 to make the light exiting angle from the LED wafer 31 wider. " The light-emitting body package structure 3 can have the above-described aspects, as shown in Figs. 3A and 3B, wherein the number of the LED chips 31 and the partition structures 33a, 33b shown in Figs. 3A and 3B The configuration is different from the above embodiment. For example, the number of the light emitting diode chips 31 in FIGS. 3A and 3B is three and four, respectively, and in fact, the number of the light emitting diode chips 31 can be In addition, as for the arrangement of the light-emitting diode chips 31, the mutual alignment is referred to as an example, but in practical applications, the light-emitting diodes in the LED package structures 3a, 3b are The polar body wafer 31 is not limited to a symmetrical arrangement. It is to be noted that the partition structures 33a, 33b shown in FIGS. 3A and 3B respectively divide the inner region of the light emitting diode package structures 3a, 3b into two parts and four parts, and the partition structures 33a, 33b. Between the vehicle and the vehicle, it can be assembled or spliced according to actual needs, and the separation between the partition structures 33a, 33b and the reflector 34 is taken as an example. The structure 33a, 33b and its corresponding reflector 34 are formed by the body of the structure H. According to actual needs, the partitions 33a, 33b are attached to the corresponding reflections by means of adhesion or snapping. The light-emitting diode package structures 7 and 3b of 3A and FIG. 3B also include an encapsulation material 35, and are also doped with a phosphor dispersion 36b. Referring again to Figure 4, there is shown another LED package structure 3 in accordance with a preferred embodiment of the present invention. Schematic diagram. The difference from the above-described light-emitting diode package structure 3 is that the reflection surface 331c of the partition structure of the present embodiment and the reflection surface 34U of the reflector 34c are curved surfaces. By the design of the curved surface, the light-emitting diode package structure 3 (the light-shaped fish generated by the light-emitting diode structure 3 is different) can be changed to further achieve the light shape of the light-emitting diode. Design. It is worth mentioning that the reflective surfaces 331c and 341c of the curved surface are sturdy. The desired shackles can be concave or convex, which is not limited thereto. In addition, the present invention simultaneously discloses a luminescence. The components, the basin == is the side-mounted human light emitting component, and the direct-lighting ♦ first "pieces below" will be in the form of components in Figure 5 and Figure 6. As shown in FIG. 5, the light-emitting assembly 4 of the present invention comprises a 10 201039432 circuit substrate 41 and a plurality of light-emitting diode packages 3, and each light-emitting diode package structure 3 is electrically connected to the electric tower. Suspended 41 ' Among them, as shown in Figure 2Α, the light-emitting diodes are sealed 1 - person, -7 Λ y \j a / ^ 3 & • month swallow, with 32, at least one partition structure %, a reflector % and 31, a structure 3 comprises at least two light-emitting diode package materials 35, packaging material 35 Covering hair-〇., t 蛊 先 先 极 极 极 及 及 及 及 及 及 = = = = = = = = = = = = = = = = = = = = = = = = = = For example, a light pattern generated by a side-in, '&optical' light-emitting diode structure 3 (shown by an elliptical dotted line in FIG. 5) is distributed to both sides of the light-emitting diode package structure. Therefore, the light distribution generated by the whole of the light-emitting component 4 is averaged according to the conventional light distribution, and the light-mixing distance can be effectively shortened. In addition, the circuit substrate 41 is further provided with at least a wire (not shown). The switch of the LED chip 31 is controlled. FIG. 6 is another embodiment of the present invention. The present disclosure discloses that the direct-type lighting module 5 includes a bottom plate 51 and at least one light-emitting assembly 4. In the direct-type light-emitting module 5 shown in FIG. 6, the circuit 41 of the light-emitting component* is disposed on the bottom plate 51. In other words, the diode package structure 3 on the circuit substrate 41 is connected to the bottom plate 51 via the circuit substrate 41. : Please also - and participate in 2 shots, the LED package structure 3 ° contains The second light-emitting diode chip 3 is a carrier 32, at least one of the partitions: • 33, a reflector 34 and a package material 35. Since the light-emitting diode package structure 3 and the light-emitting component 4 have been described in detail above, The material of the bottom plate 51 may be selected from the group consisting of metals, alloys, polymers, and combinations thereof; in addition, the circuit substrate 41 corresponding to the light-emitting assembly 4 is more integrated into a single circuit board. In this way, the assembly process of the direct-type module 5 can be simplified. When the sky-light type light-emitting module 5 is turned on, the light-emitting diodes of the light-emitting diodes are called to generate heat energy, and the generated heat energy can be dissipated by heat dissipation. The preferred bottom plate 5! is dissipated, thereby ensuring that the direct-lit lighting module 5 does not operate in a southerly environment, thereby contributing to extending the life of the straight 5 and ensuring its reliability. Referring to FIG. 7, a display device 6 of the present invention shows a direct-lit light-emitting module 5. The direct-type light-emitting module 5 (4) is not disposed opposite to the panel 61. The direct-lit light-emitting module 5 has a bottom plate 51 and at least a light-emitting component 4 disposed on the bottom plate 51, two or four channels: a plate 41 and a plurality The LED package structure is further connected to each other; the second diode package structure 3 is electrically connected to each other, and more specifically, the LED package structure comprises at least two LED chips 31, which are % of the carrier 2: ", its structure 33, - reflector 34 and a package material%. 〃 A display panel 61 shown in this embodiment can be plated. In other words, the disclosed surface is not reduced. Nj Pand Display) 'External' display panel 61 can also be - panel, in other words, the revealing snow % #,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, , LCD) ^ ^ ^ n ( qWd and Figure 6, due to ^^^ in the direct-lit luminous amount 5
Panel Disnhv、，一一 料面顯示裝置（Flat 12 201039432 由其中的分隔結構33以使發光二極體晶片31所產生的光 :^圖2Α中虛線所示）可分別藉由分隔結構％的反射 體34的反射面341以射出，心使發光二 極體封裝結構3可具有較廣的出光角度，故 匕：組5而s ’其提供至顯示面板61的光源可具有： ^度且均勾性較佳的特性，進而提升顯示裝置6的視覺 ❹ 應二t::牛依二發光二極體封裝結構及其 么士構-署於、“ 式發先核組及顯示裝置藉由將分隔 、一口 口又；反射體内並介於發光二極體之間，藉以使發光 的光線能夠經由分隔結構的反射而增乂出 到以在使用較少發光二極體的前提下亦可達 時，也因為『7^廣大照射面積及均勾光線的效果，同 目的。 體的使用數置而達到降低成本的 〇 轉’而非為限制性者。任何未脫離 應包含於後附之申請專利範圍中。 〗艾更均 圖式簡單說明】圖1為—示意圖’顯示習知發光二極體封農結Panel Disnhv, a one-surface display device (Flat 12 201039432 by the partition structure 33 such that the light generated by the LED chip 31: as shown by the dashed line in Fig. 2) can be reflected by the partition structure %, respectively The reflecting surface 341 of the body 34 is emitted, and the light-emitting diode package structure 3 can have a wider light-emitting angle. Therefore, the light source provided to the display panel 61 can have: ^ degrees and both hooks. Better characteristics, and thus improve the visual ❹ of the display device 6 二2:: Niuyi two-light diode package structure and its sorcerer--", the first-generation nuclear group and display device will be separated by a mouthful; the reflector is interposed between the light-emitting diodes, so that the light of the light can be amplified by the reflection of the partition structure to reach the time when the light-emitting diode is used. , also because of the "7 ^ the vast area of the irradiation and the effect of the light hook, the same purpose. The use of the body to achieve the cost reduction of the transfer' is not a restriction. Any application that should not be included in the attached patent In the range. DESCRIPTION OF FIG. 1 is a - schematic view of 'show a conventional light-emitting diode sealed junction AGRICULTURAL
意圖；圖2A 構的 不 裝結構的示意圖； #本發明較佳實施例之—種發光二極體封 13 201039432 .圖2B為依據圖2A之-種發光二極體封裝結構的俯視 圖； 圖3A為依據本發明較佳實施例之一種發光二極 裝結構的俯視圖； 于 圖3B為依據本發明較佳實施例之另—種發 封裝結構的俯視圖； — 遞本發日月健實施狀p觀光二極體封 衣、，吉構的示意圖； =為依縣㈣較佳實_之—_邊式發光 日、j不思圖； =為依據本發明較佳實施例之一種直下式發 w不思圖；以及 圖。圖7為依據本發明較佳實施例之—種顯示裝置的示意 【主要元件符號說明】 I ' 4 :發光組件 II :發光基板 ;、3、3a、3b、3C:發光二極體封裝結構 、31 :發光二極體晶片 22 :基板 24 ' 34 ' 34 C :反射體 32 :載具 33、33a、33b、33c :分隔結構 14 201039432 331、331c、341、341c :反射面 34、34c :反射體 35 :封裝材料 36a :螢光體 36b :擴散體 41 :電路基板 5:直下式發光模組 51 :底板 Ο 6 :顯示裝置 61 :顯示面板2A is a schematic view of a structure of a light-emitting diode package according to the preferred embodiment of the present invention; FIG. 2B is a plan view of a light-emitting diode package structure according to FIG. 2A; FIG. FIG. 3B is a plan view of a light emitting diode package structure according to a preferred embodiment of the present invention; FIG. 3B is a top view of another type of package structure according to a preferred embodiment of the present invention; A schematic diagram of a diode seal, a schematic structure; = is a county (four) better _ _ _ edge type illuminating day, j does not think; = is a direct type according to a preferred embodiment of the present invention Think; and map. 7 is a schematic view of a display device according to a preferred embodiment of the present invention. [Main component symbol description] I ' 4 : light-emitting component II: light-emitting substrate; 3, 3a, 3b, 3C: light-emitting diode package structure, 31: light-emitting diode wafer 22: substrate 24' 34' 34 C: reflector 32: carrier 33, 33a, 33b, 33c: partition structure 14 201039432 331, 331c, 341, 341c: reflecting surface 34, 34c: reflection Body 35: package material 36a: phosphor 36b: diffuser 41: circuit substrate 5: direct type light emitting module 51: bottom plate Ο 6: display device 61: display panel
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