201039002 一六、發明說明： 【發明所屬之技術領域】 本發明係提供一種觸控螢幕的製作方法，特別是一種 準確性高且步驟簡單的電容式觸螢幕的控製作方法。 【先前技術】 在現今各式消費性電子產品市場中，個人數位助理 (personal digital assistant’ PDA)、行動電話（mobile Phone ) ο 及筆記型電腦（notebook)等可攜式電子產品乃至於個人 電腦、數位家電系統皆已逐漸使用觸控面板（t〇uchpanel) 作為使用者與電子裝置間之資料溝通介面工具。使用觸控 面板時，使用者可直接透過螢幕上顯示的物件進行操作盥 下達指令，因此可提供使用者更人性化的操作介面。此外 ίίΐίΐ設計皆以輕、薄、短、小為方向，因此在產品 二ίit能節省如按鍵、鍵盤、滑鼠等傳統輸入裝置的 此搭配觸控式面板的顯示裝置已逐漸成為各 式電子產品的關鍵零組件之一。 雷面板依照其俄測方式，可概分為電容式、 與“自具有不同的優缺點 〇 螢幕的χ軸與γ轴的-側設置波動源，通 觸碰日年超音波’並在另—側設置接收源’當使用者 落幕則是在面板四個角 來檢測並利用使用者觸碰後所引起的電容變化 多點觸丄電以;並且可 ”知電容式觸控榮幕至少；===式=得 4 201039002 - 到良好的產品透光率，使得其 體積亦難整合於目前輕薄的下降’且其厚重的 構在製程上更為煩瑣，尤苴，置中。另外多層膜的結 透明基板的兩側，其製程的、難戶、導電薄膜分別位於 【發明内容】 '又尺加提升0 本發明係提供一種雷交k 決習知技術中多層堆疊所產的製作方法，以解 之問題。 生產οσ透光率下降且製程煩雜 ❹ 觸控螢幕的方發明係揭露-種製作 案、複數組沿一第二=二丨；：方向排列之第-導電圖 連接部，其中位於同一組之各第電圖案以及複數個 二導電圖案連接，而各組之第 使得位於同-组之=橋接元件， 鄰之第二導電圖案電性連接。〃橋接疋件與各相 Ο ，發明還提供另一種製作觸控 Ϊ包括下列步驟，首先提供-基板，接著拓 數組沿一第一方向排 t於基板上形成稷 各相鄰係透過各連接部與 度之3 電連接°接著形成複數個具有弧 之絕緣丘，以至少覆蓋住各連接部 上形成複數組沿一第-方向排列之取後在基板 ，接元件，其中 各ίίΠ，此電性絕緣’而各橋接元件係形成於 =絕緣丘上，使得位於同一組之各第二導 橋接元件與各相鄰之第二導電圖案電性連接。〃’、^ 5 201039002 本發明遥提供另一種製作觸控蒂 括下列步驟，首先提供法：該方法包 橋接元件。接荖形忐、t、土 ； 土板上开；成複數個 宴处々& M接者形成複數個具有弧度之絕緣丘，以分別霜 盖住各橋接7C件，並裸露出各橋接 板上形成複數組沿一第一方向排列# Μ ' ^接者於基 组产一m心， 向排第一導電圖案、複數 ：第一方向排列之第二導電圖案以及複數個連接邱， 其中位於同一組之各第-導電圖案係透過其間之各連：邱 ;，鄰之第-導電圖案電性連接，而各;:以; Ο201039002 16. Description of the Invention: [Technical Field] The present invention provides a method for manufacturing a touch screen, and more particularly, a method for controlling a capacitive touch screen with high accuracy and simple steps. [Prior Art] In today's various consumer electronics market, portable digital products such as personal digital assistants (PDAs), mobile phones (phones) and notebooks (notebooks) are even personal computers. The digital home appliance system has gradually used a touch panel (t〇uchpanel) as a data communication interface tool between the user and the electronic device. When using the touch panel, the user can directly operate the 盥 command through the object displayed on the screen, thus providing a more user-friendly operation interface. In addition, ίίΐίΐ designs are light, thin, short, and small. Therefore, the display device with touch panel that has been able to save traditional input devices such as buttons, keyboards, and mice has gradually become a variety of electronic products. One of the key components. According to its Russian measurement method, the Lei panel can be divided into a capacitive type, and with "the advantages and disadvantages of the screen, the χ axis and the γ axis of the screen are set to the side of the wave source, and the touch of the day is supersonic" and in another The side is set to receive the source 'When the user ends, it is detected at the four corners of the panel and the capacitance change caused by the user touches the multi-touch; and the capacitive touch screen is at least; ==式=得4 201039002 - To a good product transmittance, making its volume difficult to integrate into the current thin and light drop' and its thick structure is more cumbersome in the process, especially, centered. In addition, on both sides of the transparent substrate of the multilayer film, the process, the difficult household, and the conductive film are respectively located in the [invention] and the invention is provided by the multi-layer stacking method. Production methods to solve the problem. The production of οσ transmittance is reduced and the process is cumbersome. The invention of the touch screen reveals that the production case, the complex array along a second=two 丨;: the direction of the first-conductivity diagram connection, which are located in the same group The first electrical pattern and the plurality of two conductive patterns are connected, and the groups of the groups are located in the same-group=bridge element, and the adjacent second conductive patterns are electrically connected. The invention also provides another method for manufacturing the touch panel, comprising the steps of: first providing a substrate, and then expanding the array along a first direction to form a substrate on each of the adjacent lines through the respective connecting portions. Electrically connecting with the degree 3, and then forming a plurality of insulating mounds having arcs, at least covering the respective connecting portions to form a plurality of arrays arranged in a first direction, and then connecting the components, wherein each of the components, wherein the electrical properties are Insulating' and each bridging element is formed on the = insulating hill so that each of the second guiding bridging elements in the same group is electrically connected to each adjacent second conductive pattern. 〃', ^ 5 201039002 The present invention provides another method of making a touch styling. The following steps are first provided: the method includes bridging elements. Joint shape, t, soil; open on the soil plate; into a plurality of banquets & M to form a plurality of insulating hills with curvature, to cover each bridge 7C, respectively, and expose the bridge plates Forming a complex array arranged along a first direction # Μ ' ^ 接 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在Each of the first conductive patterns of the same group is interconnected by: Qiu; the adjacent first-conducting patterns are electrically connected, and each;
G 二同導案係錯位設置且彼此電性絕緣’位 、门、，且之各苐一導電圖案係透過埋臥於各絕緣丘 各橋接元件與各相鄰之第二導電圖案電性連接。 依據本發明所提供之電容式觸控螢幕的製此 製巧二種少層堆疊且高透光率之電容式觸控螢幕，不僅J 程簡早，且能配合各種連接元件的材質進行製作，並提^ 一圓弧之絕緣丘結構，能確保橋接結構之完整， ^ 高產品的良率以及使用壽命。 【實施方式】 請參閱圖1至圖8,圖1至圖8所繪示為本發明中一 種製作電容式觸控螢幕方法的第一實施例。請參閱圖工， 首先提供一基板301。基板301可包括有機材質或益機材 質，例如玻璃、石英、塑膠、樹脂、壓克力或其他&適的 透明材質。接著於基板301上形成一透明導電層（未顯示）， 其可為單層或多層結構，材質包括習知各種透明導電材 質’例如氧化銦鍚(ITO)、氧化銦鋅(IZO)、氧化辞鋁(AZ0)、 氧化鋅鎵(GZO)和氧化銦鎂(Mio)等。 接著如圖1所示’進行一微影暨餘刻製程 (photo-etching-process, PEP)以圖案化該透明導電層，使得 透明導電層在基板301表面同時形成複數組第—導電圖案 303、複數組第二導電圖案307以及複數個連接部305。其 中’各組之第一導電圖案303分別沿著一第一方向309排 6 201039002 列，各組之第二導電圖案3 〇 7分別沿一第二方向3 i i排列。 而位於同一組之各第一導電圖案3〇3係透過其間之各連接 部305與各相鄰之第一導電圖案電性連接且彼此為一體成 型。另外，每一組之第二導電圖案3〇7則與各組之第一導 電圖案303係錯位設置並彼此電性絕緣。 Ο Ο ★如圖1所示，在本發明之實施例當中，第一方向3〇9 與第二方向311為垂直相交，但亦可改變其導電圖案之排 列分布，使第一方向309與第二方向311呈一非垂直之夾 角。而所屬領域中具有通常知識者應可理解，若將該基板 301沿逆時針或順時針旋轉90度所產生之排列，例如使各 ^之，一導電圖案303係沿第二方向3工丄排列，而各組之 = 案3〇7沿第一方向3〇9排列之方式，其仍為本 發明之均專變化與修飾，皆應屬本發明之涵蓋範圍。 隨後於基板301的邊緣形成複數條導線3〇8。直中各 ，線308之一端分別連接各組(行)之第一導電圖案/3〇3與 、息ί (列1之第二導電圖案307 ’另一端延伸至該基板3〇1之 遭緣:以作為後續連接至面板外部的控制電路使用。形成 導線308的步驟，還可包括於基板3〇1的邊緣形成至 =一個對準標記(alignmentmark)31〇，以協助後續面板上各 跡程的疋位彳父準。上述形成導線3〇8與對準標記31〇的步 驟、，應不限於形成第一導電圖案3〇3、第二導電圖案3〇7 與連接部305之後，亦可於第一導電圖案3〇3、第二導電 ，案307與連接部305形成之前或同時形成，或在不影塑 其他製程情況下，設置於其他步驟之間。 曰 v接著請參閱圖2,圖2分為左半部L與右半部尺兩部 左半部L為圖1中區塊A之放大示意圖，而右半部R :、、、—塊A中沿著切線之剖面示意圖，藉此以更清楚 表=本，明細部元件之製作流程。如圖2所示，於基板3的 面形成—光阻層（未顯示）或其他光敏絕緣層，經過對 準標記310之位置校正後對光阻層進行一微影製程，例如 7 201039002 313係分圖案3ΐ3’^各光阻圖案 ^；ί?:,3〇〇5 度範圍t : =c進J J製？未顯示)’其烘烤溫 小時。於烘烤時，各光阻圖者為220C ’亚持續進行約1 得各光阻圖案313分別來:、13會產生一内聚現象，使 值得注意的是，二弧度之絕緣丘315。 ❹ Ο 後皆會被㈣，树日刻製程 烘烤而形成，因此其選用之緣好丘哲3^5係、直f由光阻圖案313 須考慮其持久與辑固性ϋ除了具有光敏性以外，亦 功用。 一釔口性以‘供絕緣丘315穩固與支撐之 除了上述直接以一光阻層來 可= 烟靖程來加以製備成形： 蚀尸久Asa連接σΡ最後再進行一熱回流(reflow)製程， 本^明案分別形成具有弧度之各絕緣丘315。或者， 絕緣丘315還可利用噴墨塗佈_㈣—kg)來 入面ίί絕ί丘315後，接著請參閱圖4，於基板抓上 G 2:阻ί、3η ’光阻層317係採用一剝離脚， 二# un質i接著進行一軟烤(S〇ftbake)製程。並藉由對準 ϋ、隹―之定位以進行一曝光(exp〇sure)步驟，隨後於基板 Γιΐ丁Γ棋烤製程319。特別岐，此烘烤製程319係針 的背部進行烘烤，亦即以熱傳導之方式通過基 來對光阻層317之底部進行加熱。其烘烤之溫度範 H至U〇°C，較佳者為100°C，進行時間約為90秒。 ^後進仃—顯影（devel〇pment)製程與一硬烤（hard bake)製 私，以在光阻層317上形成複數個孔洞321。其中各孔洞 8 201039002 暴露其對應之各絕緣丘315及各第二導電圖案307 St由於在顯影製程之前還具有—對基板底面之 ^烤，319,因此光阻層317所形成之各孔洞321皆具 有一由下而上漸縮的開口結構，並具有一傾斜内壁323, 如圖4所示。在本發明之實施例中，傾斜内壁323與基板 301表面之夾角0係小於9〇度，較佳者為必度^ 0 <9〇 度。 ΟThe G-conductor is misaligned and electrically insulated from each other, and the respective conductive patterns are electrically connected to the adjacent second conductive patterns through the bridging elements of the insulating hills. According to the capacitive touch screen provided by the present invention, two kinds of capacitive touch screens with small stacking and high transmittance are not only J-simplified, but also can be made with materials of various connecting elements. And to mention a circular arc insulation structure, to ensure the integrity of the bridge structure, ^ high product yield and service life. [Embodiment] Please refer to FIG. 1 to FIG. 8. FIG. 1 to FIG. 8 illustrate a first embodiment of a method for fabricating a capacitive touch screen according to the present invention. Referring to the drawing, a substrate 301 is first provided. The substrate 301 may comprise an organic material or a machine material such as glass, quartz, plastic, resin, acrylic or other & suitable transparent material. Then, a transparent conductive layer (not shown) is formed on the substrate 301, which may be a single layer or a multi-layer structure, and the material includes various transparent conductive materials such as indium oxide oxide (ITO), indium zinc oxide (IZO), and oxidation. Aluminum (AZ0), zinc gallium oxide (GZO), and indium magnesium oxide (Mio). Then, as shown in FIG. 1 , a photo-etching-process (PEP) is performed to pattern the transparent conductive layer, so that the transparent conductive layer simultaneously forms a complex array of conductive patterns 303 on the surface of the substrate 301. The second array of conductive patterns 307 and the plurality of connections 305 are complex arrays. The first conductive patterns 303 of each group are respectively arranged along a first direction 309 row 6 201039002, and the second conductive patterns 3 〇 7 of each group are respectively arranged along a second direction 3 i i . The first conductive patterns 3〇3 in the same group are electrically connected to the adjacent first conductive patterns through the respective connecting portions 305 therebetween and are integrally formed with each other. In addition, each of the second conductive patterns 3〇7 is disposed offset from the first conductive patterns 303 of each group and electrically insulated from each other. Ο Ο ★ As shown in FIG. 1 , in the embodiment of the present invention, the first direction 3〇9 and the second direction 311 are perpendicularly intersected, but the arrangement of the conductive patterns may be changed to make the first direction 309 and the first direction The second direction 311 has a non-vertical angle. It should be understood by those of ordinary skill in the art that if the substrate 301 is rotated 90 degrees counterclockwise or clockwise, for example, each of the conductive patterns 303 is arranged in the second direction. And the manner in which each group = case 3〇7 is arranged along the first direction 3〇9, which is still a uniform change and modification of the present invention, is to be covered by the present invention. A plurality of wires 3〇8 are then formed on the edge of the substrate 301. Each of the wires 308 is connected to the first conductive pattern /3〇3 of each group (row) and the other end of the second conductive pattern 307' of the column 1 to the edge of the substrate 3〇1 : used as a control circuit for subsequent connection to the outside of the panel. The step of forming the wire 308 may further include forming an alignment mark 31 边缘 on the edge of the substrate 3〇1 to assist each trace on the subsequent panel The step of forming the wire 3〇8 and the alignment mark 31〇 is not limited to the formation of the first conductive pattern 3〇3, the second conductive pattern 3〇7 and the connection portion 305, and may be The first conductive pattern 3〇3, the second conductive, the case 307 is formed before or at the same time as the connection portion 305, or is disposed between other steps without forming other processes. 曰v then refer to FIG. 2 is divided into a left half L and a right half ruler. The left half L is an enlarged schematic view of the block A in FIG. 1, and the right half R:, , and - a cross-sectional view along the tangent line in the block A, In this way, the production process of the detail component is more clearly shown in the table. As shown in FIG. 2, on the surface of the substrate 3. a photoresist layer (not shown) or other photosensitive insulating layer is subjected to a lithography process after the alignment mark 310 is corrected, for example, 7 201039002 313 is a sub-pattern 3 ΐ 3 ′ each photoresist pattern ^; ί?:, 3〇〇5 degree range t: =c into JJ system? Not shown) 'The baking temperature is small. At the time of baking, each photoresist pattern is 220 C ′ continuation of about 1 to obtain each photoresist pattern 313 respectively: 13 will produce a cohesion phenomenon, so that it is worth noting that the two-radius insulating mound 315. ❹ Ο will be formed by the (4), tree-day process baking, so the choice of the good edge of the Qiu Zhe 3^5 series, straight f by the photoresist pattern 313 must consider its long-lasting and complexity, in addition to photosensitivity In addition, it also works. In addition to the above, the insulating mound 315 is stabilized and supported. In addition to the above, a photoresist layer can be used to form the film: Eclipse is used to connect the σ Ρ and finally a reflow process is performed. The clear cases form respective insulating mounds 315 having a curvature. Alternatively, the insulating mound 315 can also be inked by the inkjet coating _(four)-kg), then refer to FIG. 4, and the G 2: resistive, 3η' photoresist layer 317 is grasped on the substrate. Using a peeling foot, two #un quality i followed by a soft bake (S〇ftbake) process. And by aligning the alignment of ϋ and 以 to perform an exp〇sure step, then the substrate Γ ΐ Γ 烤 。 。. In particular, the baking process 319 is performed by baking the back of the needle, that is, by heating the bottom of the photoresist layer 317 by heat conduction. The baking temperature range is from H to U 〇 ° C, preferably 100 ° C, for about 90 seconds. The post-dump-pment process and a hard bake process are performed to form a plurality of holes 321 on the photoresist layer 317. Each of the holes 8 201039002 exposes its corresponding insulating mound 315 and each of the second conductive patterns 307 St. Since the surface of the substrate is baked before the developing process, the holes 321 formed by the photoresist layer 317 are It has an open structure that tapers from bottom to top and has an inclined inner wall 323 as shown in FIG. In the embodiment of the present invention, the angle 0 between the inclined inner wall 323 and the surface of the substrate 301 is less than 9 degrees, preferably 0 0 < 9 degrees. Ο
接者睛4參閱圖5，於基板301上全面形成一導電薄膜 325。，導電薄膜325可包括各種透明導電材質，例如IT〇、 ΙΖΟ等，或為各種金屬材質，如銅、鋁等。特別的是，本 發明中形成導電薄膜325的步驟，係採用非等向性的沈積 方式，例如一濺鍍(sputtering)或蒸鍍(evaporation)製程。是 以，本發明便可在各孔洞321具有「上小下大」的開口結 構情況下，將導電薄膜325以一具方向性的沈積方式形成 於基板301上，故不論是ITO或是金屬材質所形成的導電 薄膜325’皆只會覆蓋於光阻層317表面以及位於各孔洞 321内之絕緣丘315及第二導電圖案3〇7的部份，且藉由 光阻層317的遮蔽，在孔洞321的倾斜内壁323上並沒有 導電薄膜325的形成。如圖5所示，各導電薄膜325係沿 者相對應之絕緣丘315之弧度而形成，並跨接兩相鄰之第 二導電圖案307a、307b，並使其電性相連。 接者s青參閱圖6 ’剝除光阻層317，例如以適當的清洗 液去除光阻層317。由於孔洞321的傾斜内壁323上並沒 有覆蓋導電薄膜—325 ’部份之光阻層317也因此暴露至外 部環境。因此清洗液可順利接觸光阻層317並將其移除， 連帶移除了覆蓋於光阻層317上的導電薄膜325，但位於 各絕緣丘315上導電薄膜325並未被移除。如此一來，各 組（列）相鄰的第二導電圖案307a、307b便可順利地透過其 間之導電薄膜325而電性連接，使得跨接於各絕緣丘315 上方之導電薄膜325形成了橋接元件327。 9 201039002 ΟReferring to FIG. 5, a conductive film 325 is formed on the substrate 301. The conductive film 325 may include various transparent conductive materials such as IT 〇, ΙΖΟ, etc., or various metal materials such as copper, aluminum, and the like. In particular, the step of forming the electroconductive thin film 325 in the present invention employs an anisotropic deposition method such as a sputtering or evaporation process. Therefore, in the present invention, the conductive film 325 can be formed on the substrate 301 by a directional deposition method in the case where each of the holes 321 has an opening structure of "upper and lower", so whether it is ITO or metal. The formed conductive film 325 ′ only covers the surface of the photoresist layer 317 and the portions of the insulating hill 315 and the second conductive pattern 3 〇 7 in each of the holes 321 , and is shielded by the photoresist layer 317 . The formation of the conductive film 325 is not formed on the inclined inner wall 323 of the hole 321. As shown in FIG. 5, each of the conductive films 325 is formed along the arc of the corresponding insulating mound 315, and is connected to and electrically connected to the two adjacent second conductive patterns 307a, 307b. Referring to Figure 6, the photoresist layer 317 is stripped, for example, by removing the photoresist layer 317 with a suitable cleaning solution. Since the resistive layer 317 which is not covered with the conductive film - 325 ' on the inclined inner wall 323 of the hole 321 is also exposed to the external environment. Therefore, the cleaning liquid can smoothly contact the photoresist layer 317 and be removed, and the conductive film 325 covering the photoresist layer 317 is removed, but the conductive film 325 is not removed on each of the insulating hills 315. In this way, the adjacent second conductive patterns 307a, 307b of each group (column) can be electrically connected through the conductive film 325 therebetween, so that the conductive film 325 spanning over the insulating hills 315 forms a bridge. Element 327. 9 201039002 Ο
方向^列之=驟，即可在基板301之同一側形成兩不同 導電圖案3〇ί數絚(行）第一導電圖案303與複數組（列）第二 3〇3透過各遠杻Α如圖7所示。同組(行）之各第一導電圖案 各第二導電圖/德延伸於第—方向309，而同組(列）之 向311。久株I 307則透過各橋接元件327延伸於第二方 能維持各第t件Γ跨接於各絕緣丘315上，因此仍 性絕ί各如此ίί * 3〇3與各第二導電圖案307彼此電 電圖幸3的偽一來，位於基板301同一侧表面之各第一導 為電第二導電圖案307所形成之佈局，即可作 f幕的感應電極’以分別感應使用者觸碰位 ; 向309與第二方向311兩方向之座桿，拉 以镇測其觸碰位置。 軸度藉 另外，若構成橋接元件327的材質為金屬時，由於 的差異，因此形成橋接元件327之金屬製程並不會影 ，ITO所形成的第一導電圖案3〇3、第二導電圖案3〇7及 建接部305，故可直接進行一習知之圖案化之金屬製程， =取代圖4與圖5之步驟。例如，在圖3形成絕緣丘315 >驟之後，請參閱圖8，於基板301上全面性形成一金 ，329，再直接圖案化此金屬層329，以形成如圖6所示之 各橋接元件327。由於設於各第二導電圖案3〇7間之橋接 疋件327的面積很小，所以不透明的金屬材質並不會影 觸控螢幕的透光率，而且藉由金屬的低電阻又可補償^ 二導電圖案307與各橋接元件327之串接介面， 得到一良好之導電率。 /曰 於本發明之弟一實施例中，亦可先形成第—導電 與連接部，接著形成絕緣丘，最後再形成第二導電圖案^ 橋接元件。請參閱圖9至圖11，為本發明製作電容式 螢幕之方法的第二實施例示意圖。請先參考圖9，首先 供一基板401，接著於基板401上形成複數組沿—第— 向409排列之第一導電圖案403以及複數個連接部4〇5， 201039002 位於同一組之各第一導電圖案403係透過各連 各相鄰之第一導電圖案403電性連接，較佳者 ^ 圖案403與連接部405同時形成。第一導電圖案 接部405的材質包括各種透明導電材質如IT〇笤， 方式與前述相同，在此不再贅述。 ' ’，、形成 隨後形成複數個具有弧度之絕緣丘415，以 二各„之部份。絕緣丘415之形成 = 冋’在此不多做描述。 j A" Ο Ο 接著，在基板401上形成第二導電圖案4〇7與 牛427。形成第二導電圖案407與橋接元件427 可使用前述剝離(lift-off)式光阻的方式來形成，^ ^ ’其差別僅將孔洞321的範圍由丄以2In the direction of the column = step, two different conductive patterns can be formed on the same side of the substrate 301. The first conductive pattern 303 and the second array 3 are transmitted through each other. Figure 7 shows. Each of the first conductive patterns of the same group (row) extends in the first direction 309 and the direction 311 in the same group (column). The long-term I 307 extends through the bridging elements 327 to the second side to maintain the t-th members across the insulating mounds 315, so that each of the remaining layers 305 and the second conductive patterns 307 The first one of the first side of the substrate 301 is a layout formed by the second conductive pattern 307, so that the sensing electrode of the screen can be used to sense the touch position of the user. ; The seatpost in the direction of 309 and the second direction 311 is pulled to test the touch position. In addition, if the material constituting the bridge member 327 is metal, the metal process for forming the bridge member 327 does not affect the difference due to the difference, and the first conductive pattern 3〇3 and the second conductive pattern 3 formed by the ITO are formed. 〇7 and the construction part 305, so that a conventionally patterned metal process can be directly performed, and the steps of FIG. 4 and FIG. 5 are replaced. For example, after forming the insulating mound 315 > in FIG. 3, referring to FIG. 8, a gold, 329 is formed on the substrate 301 in a comprehensive manner, and then the metal layer 329 is directly patterned to form the bridges as shown in FIG. Element 327. Since the area of the bridge element 327 disposed between the second conductive patterns 3〇7 is small, the opaque metal material does not affect the light transmittance of the touch screen, and can be compensated by the low resistance of the metal. The two conductive patterns 307 and the bridging interface of the bridging elements 327 provide a good electrical conductivity. In an embodiment of the present invention, the first conductive portion and the connecting portion may be formed first, then the insulating hills may be formed, and finally the second conductive pattern bridge member may be formed. Please refer to FIG. 9 to FIG. 11 , which are schematic diagrams showing a second embodiment of a method for fabricating a capacitive screen according to the present invention. Referring to FIG. 9 first, a substrate 401 is first provided, and then a first array of conductive patterns 403 and a plurality of connecting portions 4〇5, 201039002 located in the same group are formed on the substrate 401. The conductive pattern 403 is electrically connected through the adjacent first conductive patterns 403. Preferably, the pattern 403 and the connecting portion 405 are simultaneously formed. The material of the first conductive pattern connecting portion 405 includes various transparent conductive materials such as IT〇笤, and the manner is the same as the foregoing, and details are not described herein again. ' ', forming a plurality of insulating ridges 415 having a curvature, followed by two parts. The formation of the insulating mound 415 = 冋 ' is not described here. j A" Ο Ο Next, on the substrate 401 The second conductive pattern 4〇7 and the cow 427 are formed. The formation of the second conductive pattern 407 and the bridging element 427 can be formed by using the aforementioned lift-off type photoresist, and the difference only covers the range of the hole 321 By 丄 2
至!二導電圖案407加上橋接元件J的J 圍，、、'、田郎和a述相同，在此不多做描述。或者，往夂老 ，1〇,圖10為圖9中區域C之放大圖，左半部LTo the second conductive pattern 407, the J-surrounding of the bridging element J is added, and ', Tian Lang and a are the same, and will not be described here. Or, to the old, 1〇, Figure 10 is an enlarged view of the area C in Figure 9, the left half L
之光罩圖案414示意圖(以下詳述)，而右‘；R 透明導電薄膜(未顯示），接著於其上^積— =)圖餘刻製程，其使用'之光罩圖案… 如圖10之左半部L所不。丨士本窗回必 區域4141對雁盔筮一道+先罩圖案414包括四個區域， 4〇5 4143 向内ί出於絕緣丘二 =所: Ξί 不d)。因此，經微影暨蝕刻製程 成第二導電圖案4〇7、橋接元件427、 t圖案仞4與輔助連接部概，係分別對應於 ί罩域’如圖1〇右半部r所示。特別的 疋 ¥電®案4Q4係形成於已存在之第-導電圖 11 201039002 ί Si，係形成於未被絕緣丘415覆 丈钱。卩405上，而呈現一雙層之導雷纟士 成在連 ^出之結構可以確保輔助連接部4〇6與下方 上，此 電性連接而避免其斷線。 ’、連接。卩405之 Ο Ο 此外，第^一導電圖案4〇7與橋接开技 兩個步驟形成，例如當橋接元：m2::可分別於 則可以如上述兩種方式先形成；導電材質時’ 所不’在此不再贅述。 乐實知例之圖8 接著請參考第U圖，利用上怵 上形成第二導電圖案術與橋接元件板401 二導電圖案4Q7與各組之第—導電圖宰 j各組之第 =電性絕緣。各橋接讀427係形成 使得位於同一組之各第二導電圖案4〇7^邑，丘415上’ 427與各相鄰之第二導電圖案407、電性連I、各橋接元件 向於該第-方 微影暨_製程在形成該第—導電n °即’利用 的同時，亦可以於第二方向411形& 3 /、連接部405 導電圖案（圖未示），接著形成絕緣丘，方第二輔助 最後再利用圖！。左半部份L所示光罩/ 相同’ 407、輔助第—導電圖案4〇4 助‘V電圖案 此外，本實施例之第一方向4〇9蛊筮_ 士二 但亦可改變其導電圖案之排列 409與弟二方向411呈一非垂直之失角 使$-方向 另一實施例中，將該基板401沿逆時\ ’在本發明 度，例如使各組之第一導電圖案4〇3 :十或轉90 口弟一方向411延伸， 12 201039002 而各組之第二導電圖案4〇7沿 例的步驟還可包括在其柘从*方白409延伸。本實施 及至少-個的對H〇'的邊緣形_數條導線4〇8 403與連接=如在形成各第一導電圖案 棚與對準棹吃410，I知金屬製程形成複數條導線 設置於其㈣可在不影響其他製程的情況下 於本發明之第三實施例中，亦可以參开彡士杨^立_ ίίΐΐ絕緣丘，最後再同時形成第-導電圖案、ί件邋 ί=;ίί部。請參閱圖12至圖14,為:ί明 ο 3之方法的第三實施例示意圖，其中圖12鱼】 13刀為左+ 口p L與右半部R，右半部尺為左半部l二圖 線EE’之剖面示意圖。請先參考圖12，在一基板5〇1° = =J個橋接元件527，接著於基板5〇1上形成複數個 ί絕ϊ丘515 ’以分別覆蓋住相對應之各橋接元 ί 527 接元件527兩端之部份。構成橋接元 件527的材質可包括透明導電層材質或金屬材質，其形 方式，括習知的曝光與顯影製程。而形成絕緣丘515的 式與前述相同’在此不多贅述。 一接著請參閱圖13’於基板501上形成一透明導電層（未 Q 顯不）’再圖案化該透明導電層以同時形成複數組第一導電 圖案503、複數組第二導電圖案507以及複數個連接部 505 ’各元件的排列方式與位置亦相同於圖7之描述，位於 同一組(行)之各第一導電圖案503係透過其間之各連接部 505與各相鄰之第一導電圖案5〇3電性連接，而各組之第 二導電圖案507則與各組之第一導電圖案503係錯位設置 並彼此電性絕緣。由於基板501表面已形成有複數個橋接 元件527 ’故使得比鄰的各第二導電圖案507c、507d可透 過位於各絕緣丘515下方之橋接元件527彼此電性連接。 如圖14所示’位於同一組之各第〆導電圖案503透過各連 接部505延伸於第一方向509，而位於同一組之各第二導 13 201039002 電圖案507則透過埋臥於各絕緣丘515下方之各橋接元件 527延伸於第二方向511，所形成陣列之偵測電極便能提供 良好的觸控螢幕結構。Schematic of reticle pattern 414 (described in detail below), and right ';R transparent conductive film (not shown), followed by a ^ - - - - - - - - - - - - - - - - - - - The left half L does not. The gentleman's window must return to the area 4141 to the geese 筮 + + hood pattern 414 includes four areas, 4 〇 5 4143 inward ί out of the insulation 丘 = =: Ξί not d). Therefore, the second conductive pattern 4〇7, the bridging element 427, the t pattern 仞4 and the auxiliary connecting portion are respectively subjected to the lithography and etching process, respectively, corresponding to the 罩 hood field as shown in the right half r of FIG. The special 疋 电 ® 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 On the 卩405, a double-layered Thunder is presented in a continuous structure to ensure that the auxiliary connecting portion 4〇6 and the lower portion are electrically connected to avoid disconnection. ',connection.卩 405 Ο Ο In addition, the first conductive pattern 4〇7 is formed in two steps of bridging, for example, when the bridge element: m2:: can be formed separately in the above two ways; No, I won't go into details here. Figure 8 of Le Shizhi Example Next, please refer to Figure U, using the second conductive pattern on the upper cymbal and the second conductive pattern 4Q7 of the bridge element board 401 and the first group of the first conductive pattern of each group. insulation. Each bridge 427 is formed such that each of the second conductive patterns 4 〇 7 邑 邑 on the hills 415 and the adjacent second conductive patterns 407 , the electrical connections I , the bridging elements toward the first - the square lithography _ process can form the first conductive n ° ie, while using, in the second direction 411 shape & 3 /, the connecting portion 405 conductive pattern (not shown), and then form an insulating mound, The second assistant finally reuses the map! . The left half L shows the reticle / the same '407, the auxiliary-conducting pattern 4〇4 helps the 'V electric pattern. In addition, the first direction of the embodiment is 4〇9蛊筮_士二, but it can also change its conductivity. The pattern arrangement 409 and the second direction 411 have a non-perpendicular angle of loss. In another embodiment, the substrate 401 is reversed in the degree of the present invention, for example, the first conductive patterns 4 of the groups. 〇3: Ten or 90-way one-way direction 411 extension, 12 201039002 The steps of the second conductive patterns 4〇7 of each group may further include extending from the square white 409. The present embodiment and at least one pair of H〇's edge-shaped wires 〇8 403 and connection = as in the formation of each of the first conductive pattern sheds and the alignment 棹 eat 410, I know the metal process to form a plurality of wire sets In the third embodiment of the present invention, the fourth embodiment of the present invention may be incorporated in the fourth embodiment of the present invention, and the first and second conductive patterns may be formed at the same time. ; ίί. Referring to FIG. 12 to FIG. 14 , FIG. 12 is a schematic diagram of a third embodiment of the method of FIG. 12 , wherein the fish of FIG. 12 is 13 left for mouth + L p and right half R, and the right half is left half. l Schematic diagram of the second line EE'. Referring first to FIG. 12, a substrate 5〇1° ==J bridge elements 527, and then a plurality of ϊ ϊ 515 ′′ are formed on the substrate 5〇1 to respectively cover the corresponding bridge elements ί 527 Part of both ends of element 527. The material constituting the bridge member 527 may include a transparent conductive layer material or a metal material in a form of a conventional exposure and development process. The form of the insulating mound 515 is the same as that described above, and will not be described here. Referring to FIG. 13 again, a transparent conductive layer (not shown) is formed on the substrate 501. The transparent conductive layer is patterned to simultaneously form a complex array of first conductive patterns 503, a plurality of arrays of second conductive patterns 507, and a plurality of The connecting portions 505' are arranged and arranged in the same manner as in FIG. 7. The first conductive patterns 503 in the same group (rows) are connected to the respective connecting portions 505 and the adjacent first conductive patterns. 5〇3 is electrically connected, and the second conductive patterns 507 of each group are disposed offset from the first conductive patterns 503 of each group and electrically insulated from each other. Since a plurality of bridging elements 527' have been formed on the surface of the substrate 501, the adjacent second conductive patterns 507c, 507d can be electrically connected to each other through the bridging elements 527 located under the insulating mounds 515. As shown in FIG. 14 , each of the second conductive patterns 503 in the same group extends through the respective connecting portions 505 in the first direction 509 , and the second conductive portions 13 in the same group 13 201039002 are patterned through the insulating hills. The bridging elements 527 below the 515 extend in the second direction 511, and the array of detecting electrodes can provide a good touch screen structure.
G 同樣的’本實施例之第一方向509與第二方向511為 垂直相交’但亦可改變其導電圖案之排列分布，使第一方 向509與第二方向511呈一非垂直之夾角。或者，將該基 板501沿逆時針或順時針旋轉9〇度，例如使各組之第一導 電圖案503沿第二方向511延伸，而各組之第二導電圖案 507沿第一方向509延伸。本實施例的步驟還可包括在基 板501的邊緣形成複數條導線5〇8及至少一個的對準標記 510，例如當橋接元件527材質為金屬時，可於一開始形成 橋接元件527時，同時於基板5〇1邊緣形成導線508與對 f標記510’可省卻一道步驟並協助後續微影製程之位置 校正。當然’各條導線508與對準標記510之形成，亦可 在不影響其他製程的情況下，設置於其他步驟之間。 因此’依照本發明第三實施例所完成的電容式觸控螢 幕如圖13與圖14所示，其結構包括一基板501、複數 組第一導電圖案503、複數組第二導電圖案507、複數個連 接部505、複數個橋接元件527以及複數個絕緣丘515，各 ，件白b位於该基板501之同一侧。各絕緣丘515分別覆蓋 ，各橋接元件527，並裸露出各橋接元件527之部份，而 ^連接部505則跨接於各絕緣丘515之上方。其中各絕緣 15並不限於前述製作方法所形成有弧度之丘形絕緣 ，^而巧亦包括各種形狀之絕緣塊。各組第一導電圖案5〇3 二笛亡Ϊ一方向5〇9排列’而各組第二導電圖案507分別 二向511排列。其中位於同一組之各第一導電圖案 〇3 ^透過各連接部5G5與各相鄰之第—導電圖案5〇3電 ，而位於同一組之各第二導電圖案5〇7係透過埋臥 緣丘515下方之各橋接元件527與各相鄰之第二導 冤圖案507電性連接。 14 201039002 與堆積的層數，並解決習知技術中透光ϊΐ 以及製程複雜的問題。 达先率過低 具有1曲ίϊ:製物呈中所使用的絕緣丘構造，由於 =，而產生-圓弧形之橋接結構。如此：；考ΐ丘面 Ο 〇 :裂或是接觸不良的情況發ί稜造成 及使用壽命。 j八八捉内產的良率以 遠垃ί夕ί，*發明考慮到第一導電圖*、第二導電圖安 橋接元件彼此間材質於製程上的相容性，®二二 ;id，式，並適用於各種:接 材質如ττη電f案、第二導電圖案與連接部為透明導電 無，而橋接70件亦為ιτ〇時，由於圖案化的 S直接以相同的蝕刻液進行，因此本 傾斜内壁的孔成橋接件的方式，形成具有 上並：在濺鍍導電薄膜時’孔洞傾斜内壁 導雷n積ί電•膜’因此可直接去除轨層與其上之 阻層^古，到各橋接元件，其中並不會影響到位於光 層了方之各第-導電圖案、第二導電圖案與連接部。 所摇：橋接兀件係為一金屬材質時’除了上述第-實施例 由於層i:明還提供第三實施例之實施方式。 :屬：、ΙΤ〇層八有一蝕刻選擇比，因此當第一導電圖 i屬f二導電圖案與連接部為ΙΤΌ時，而第二導電薄膜為 刑出才質時，便可直接透過一習知圖案化之金屬製程，而 橋接元件，並不會影響第一導電圖案、第二導電圖案 部之形成。且金屬比習知透明薄膜如ΙΤΟ的導電率 多，因此以金屬材質作為橋接元件的材質，可降低 連接電極的電阻值，而大大提升觸控面板之靈敏度。 15 201039002 綜合以上優點，本發明不僅 數高透光率電容式觸控勞幕的單的低層 好之圓弧結構，以確保其橋接結 質你，^供一良 提供一絕佳的使用性。 、° ^ ，使得該製程能G, the first direction 509 and the second direction 511 of the present embodiment are perpendicularly intersected, but the arrangement of the conductive patterns may be changed such that the first direction 509 and the second direction 511 form a non-perpendicular angle. Alternatively, the substrate 501 is rotated 9 degrees counterclockwise or clockwise, for example, the first conductive patterns 503 of the respective groups are extended in the second direction 511, and the second conductive patterns 507 of the respective groups are extended in the first direction 509. The step of the embodiment may further include forming a plurality of wires 5 〇 8 and at least one alignment mark 510 on the edge of the substrate 501. For example, when the bridge member 527 is made of metal, the bridge member 527 can be formed at the same time. Forming the wire 508 at the edge of the substrate 5〇1 and the pair of marks 510' can eliminate a step and assist in the positional correction of the subsequent lithography process. Of course, the formation of the individual wires 508 and the alignment marks 510 can also be set between other steps without affecting other processes. Therefore, the capacitive touch screen according to the third embodiment of the present invention is as shown in FIG. 13 and FIG. 14 , and the structure includes a substrate 501 , a plurality of arrays of first conductive patterns 503 , a plurality of arrays of second conductive patterns 507 , and a plurality of A connecting portion 505, a plurality of bridging members 527, and a plurality of insulating mounds 515, each of which is located on the same side of the substrate 501. Each of the insulating mounds 515 is covered, each bridging element 527, and a portion of each bridging element 527 is exposed, and the connecting portion 505 is bridged over each insulating mound 515. The insulating members 15 are not limited to the arc-shaped insulating formed by the above-described manufacturing method, and include insulating blocks of various shapes. Each of the first conductive patterns 5〇3 is in the direction of 5〇9, and the second conductive patterns 507 are arranged in the two directions 511, respectively. The first conductive patterns 〇3^ located in the same group are electrically connected to the adjacent first conductive patterns 5〇3 through the respective connecting portions 5G5, and the second conductive patterns 5〇7 in the same group are transmitted through the buried edge. The bridging elements 527 below the mound 515 are electrically connected to the adjacent second guiding patterns 507. 14 201039002 With the number of layers stacked, and to solve the problem of light transmission in the prior art and complicated process. The preemption rate is too low. There is 1 curve. The structure of the insulating mound used in the production is due to the fact that the arc-shaped bridge structure is formed. So:; test the noodle Ο 〇: crack or poor contact, resulting in anger and service life. j eight eight catch the yield of the production of the far-reaching ί 夕 ,, * invention considers the first conductive pattern *, the second conductive figure bridging elements are compatible with each other in the process of the process, ® 22; id, And applicable to various types: the material is as ττη electric f, the second conductive pattern and the connecting portion are transparent conductive, and when the bridge 70 is also ιτ〇, since the patterned S is directly carried by the same etching liquid, The hole of the inclined inner wall is formed into a bridge member, and is formed with the upper layer: when the conductive film is sputtered, the hole is inclined, and the inner wall is guided by the lightning-conducting electric film. Therefore, the rail layer and the resist layer thereon can be directly removed. Each of the bridging elements does not affect each of the first conductive patterns, the second conductive patterns, and the connecting portions located on the optical layer. Shake: When the bridging element is made of a metal material 'In addition to the above-described first embodiment, the embodiment of the third embodiment is also provided. : genus: ΙΤ〇 layer 八 has an etching selection ratio. Therefore, when the first conductive pattern i belongs to the f-conducting pattern and the connecting portion is ΙΤΌ, and the second conductive film is punitive, it can directly pass through a habit. The patterned metal process is known, and the bridging elements do not affect the formation of the first conductive pattern and the second conductive pattern portion. Moreover, since the metal has a higher electrical conductivity than a conventional transparent film such as tantalum, the metal material is used as a material of the bridge member, which can lower the resistance value of the connection electrode and greatly improve the sensitivity of the touch panel. 15 201039002 Combining the above advantages, the present invention not only has a single low-level circular arc structure of a high transmittance capacitive touch screen, but also ensures that it bridges the quality, and provides a good usability. , ° ^, so that the process can
細上所述’本發明確已符合發明專利之要 提出申請專利。惟，以上所述者僅係本發明之較隹^依法 式，本發明之範圍並不以上述實施方式爲限，舉凡&施方 案技藝之人士援依本發明之精神所作之等效修飾&悉本 皆應涵蓋於以下申請專利範圍内。 _燹化， 【圖式簡單說明】As described above, the invention has indeed been filed in accordance with the invention patent. However, the above description is only for the purpose of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to modify the equivalent of <RTIgt; It should be covered in the scope of the following patent application. _燹化, [Simple description]
容式觸趣骜 圖1至圖8所繪示為本發明中一種製作電 幕方法的第一實施例。 圖9至圖11所繪示為本發明中一種製作電 幕方法的第二實施例。 圖12至圖14所緣示為本發明中一種製作 螢幕方法的第三實施例。 【主要元件符號說明】 301,401,501 基板 414 區域 303,403,503 第一導電圖案 4141,4142 4143,4144 404 輔助第一導電圖案 315,415,515 一製程 孔祠 305,405,505 連接部 317 406 輔助連接部 319 307,407,507 第二導電圖案 321 308,408,508 導線 323 Ο 16 201039002 309,409,509 第一方向 325 導電薄膜 310,410,510 對準標記 327,427,527 橋接元件 311,411,511 第二方向 329 金屬層 313 光阻圖案容式触骜 Figure 1 to Figure 8 show a first embodiment of a method of fabricating a screen in accordance with the present invention. 9 to 11 illustrate a second embodiment of a method of fabricating a screen in accordance with the present invention. 12 to 14 illustrate a third embodiment of a method of fabricating a screen in accordance with the present invention. [Main component symbol description] 301, 401, 501 substrate 414 area 303, 403, 503 first conductive pattern 4141, 4142 4143, 4144 404 auxiliary first conductive pattern 315, 415, 515 a process aperture 305, 405, 505 connection portion 317 406 auxiliary connection portion 319 307, 407, 507 second conductive pattern 321 308, 408, 508 wire 323 Ο 16 201039002 309,409,509 First direction 325 Conductive film 310,410,510 Alignment mark 327,427,527 Bridge element 311,411,511 Second direction 329 Metal layer 313 Resistive pattern
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