TW201033553A - Electrical refrigerating drinking fountain for package water - Google Patents

Electrical refrigerating drinking fountain for package water Download PDF

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Publication number
TW201033553A
TW201033553A TW98107910A TW98107910A TW201033553A TW 201033553 A TW201033553 A TW 201033553A TW 98107910 A TW98107910 A TW 98107910A TW 98107910 A TW98107910 A TW 98107910A TW 201033553 A TW201033553 A TW 201033553A
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Taiwan
Prior art keywords
cooling
cooled
water
conductive
cold
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TW98107910A
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Chinese (zh)
Inventor
Mao-Feng Tseng
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Yen Sun Technology Corp
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Application filed by Yen Sun Technology Corp filed Critical Yen Sun Technology Corp
Priority to TW98107910A priority Critical patent/TW201033553A/en
Publication of TW201033553A publication Critical patent/TW201033553A/en

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Abstract

An electrical refrigerating drinking fountain for package water comprises a base, a refrigerating module, package water, and a controlling unit. The base provides a refrigerating space. The refrigerating module comprises a conducting shell placed in the refrigerating space and a refrigerating chip set connects to the conducting shell. A reservoir is formed inside the conducting shell. The package water is placed in the reservoir. The controlling unit comprises a controller provided in the base with electrically connecting the refrigerating chip set.

Description

201033553 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種包裝水飲水機,特別是關於一種以 致冷晶片進行冷卻的電子致冷式包裝水飲水機。 【先前技術】 如中華民國公告第M344461號新型專利「飲水機之水 冷卻裝置」所示之專利案,係揭示第一種習知飲水機,其 係為儲水槽式之飲水機。該習用飲水機通常係設有一壓縮 機、一熱交換槽、一控制器及一冰膽。該壓縮機係用以壓 縮冷媒至一管體内,且該管體係依序於該熱交換槽内形成 一盤狀冷媒管,以及盤繞於該冰膽之外部而形成一冷凝 官,最後再連接至該壓縮機,使得冷媒可於該管體内猶環 流動,該熱交換槽具有一入水口及一出水元件,以將水導 入及導出,並用以使該盤狀冷媒管快速降溫並將熱導出; 該控制器係設置於該熱交換槽之外表面,以調節該熱交換 槽之進水及出水;該冰膽係用以存放飲用水,並透過該冷 凝管冷卻該冰膽内之飲用水。 上述第一種儲水槽式之飲水機係利用該冰膽存放飲 用水,再利用該壓縮機或半導體致冷器對該冰膽進行冷 卻。然而,該種類型之習知飲水機由於添加水時可能導致 灰塵進入槽内,且於使用一段時間後,需對該儲水槽進行 清洗,以維持飲用水之清潔,造成其具有飲用水衛生不易 維持及清洗不便之缺點。再且,其係利用壓縮機進行冷卻, 將不可避免的使用到冷媒,因此當該飲水機廢棄時,可能 201033553 ,該冷媒對魏產生污染及破壞;又,礙於飛航安全之 叙’冷媒等物質禁止攜入飛航機具中,若生產者欲將該 飲水機鐵售至國外,將因為該壓縮機中含有冷媒,而無法 * $用飛航機具進行運送,將造成產^運送讀之缺點。 . 如中華民國公告第M341007號新型專利「專用於飲用 尺1裝谷器之冷卻装置」所示之第二種飲水機,係一種使 用,裝水之飲水機,其包含一基座及一蒸發器。該基座具 ❿ # =錢面以置放—飲时包裝容H,並於該基座内部設 置冷凝組件;該蒸發器係設置於該基座之承載面且連通 二V凝組件,該瘵發器係具有一殼體及至少一導流片,該 殼體之外周面形成-導溫面,該導流片係設置於該殼體内 部以使該殼體内部形成一这迴流道,該这迴流道可供冷 媒循環流動,進而透過該傳導面對該飲用水包裝容器内^ 飲用水進行冷卻作業。於該包裝水耗盡時,僅需替換另一 滿裝包裝水之包裝容器,便可進行飲用。因此,該第二種 ❹ 飲水機可以克服上述第一種飲水機所造成之飲用水衛生不 易維持及清洗不便之缺點。 / 、然、而’上述第二種習知飲水機亦係則壓縮機輸送冷 騎行冷卻’仍具有造成環境公害及運送不便之缺點。 如中華民國公告第165620號新型專利「半導體致冷 飲水機」所示之第三種飲水機,該飲水機係設有一冷卻^ 及-半導體致冷器(或稱致冷晶片)。該冷卻槽内係用 放飲用水;該半導體致冷器係設置於該冷卻槽之槽壁,且 該半導體致冷器具有-致冷面及一散熱面,該致冷面 向該冷卻槽之槽内,該散熱面係朝外。當該半導體致冷器 5 201033553 通電作動後,其致冷面急速降溫,使槽内之水溫降低,並 將交換熱由該散熱面排放。如此,便可克服上述第—種及 第二種飲水機以壓縮機輸送冷媒進行冷卻所造成環境公宝 及運送不便之缺點。 見a口201033553 VI. Description of the Invention: [Technical Field] The present invention relates to a packaged water dispenser, and more particularly to an electronically cooled packaged water dispenser that is cooled by a cryogenic wafer. [Prior Art] The patent case shown in the new patent No. M344461 of the Republic of China, "Water Cooling Device for Water Dispenser" discloses the first conventional water dispenser, which is a water storage type water dispenser. The conventional water dispenser is usually provided with a compressor, a heat exchange tank, a controller and an ice cream. The compressor is used for compressing the refrigerant into a tube body, and the tube system sequentially forms a disc-shaped refrigerant tube in the heat exchange tank, and coils around the outside of the ice shell to form a condensation officer, and finally connects. To the compressor, the refrigerant can flow in the tube body, the heat exchange tank has a water inlet and a water outlet element for introducing and discharging water, and is used for rapidly cooling and heating the disc-shaped refrigerant tube Deriving; the controller is disposed on an outer surface of the heat exchange tank to adjust water inlet and outlet water of the heat exchange tank; the ice cube is used for storing drinking water, and the drinking water is cooled through the condensation tube water. The first type of water storage type water dispenser uses the ice chiller to store drinking water, and the chiller is cooled by the compressor or the semiconductor cooler. However, this type of conventional water dispenser may cause dust to enter the tank due to the addition of water, and after a period of use, the storage tank needs to be cleaned to maintain the cleanliness of the drinking water, making it difficult to have drinking water. The shortcomings of maintenance and cleaning inconvenience. Moreover, it is cooled by a compressor, and the refrigerant is inevitably used. Therefore, when the water dispenser is discarded, it may be 201033553, the refrigerant causes pollution and damage to Wei; and, in hinder, the safety of the flight If the producer wants to sell the water dispenser to foreign countries, the manufacturer will not be able to use the aircraft to transport it, which will result in the production of the transport. The shortcomings. A second type of water dispenser, as shown in the Republic of China Bulletin No. M341007, "Cooling Device for Drinking Ruler 1 Tamper", is a water dispenser that uses water and contains a pedestal and an evaporation device. Device. The pedestal has a ❿#=money surface for placing and sipping, and has a condensing component inside the pedestal; the evaporator is disposed on the bearing surface of the pedestal and communicates with the two-V condensing component, the raft The hairline has a casing and at least one baffle, and the outer circumferential surface of the casing forms a temperature guiding surface, and the baffle is disposed inside the casing to form a return passage inside the casing. The return passage can be circulated by the refrigerant, and the cooling operation of the drinking water in the drinking water packaging container can be performed through the conduction. When the package water is exhausted, it is only necessary to replace another packaging container filled with packaged water to drink. Therefore, the second type of water dispenser can overcome the shortcomings of the above-mentioned first type of water dispenser that the sanitary water is not easy to maintain and inconvenient to clean. / 然然, and the above-mentioned second conventional water dispenser is also a compressor that delivers cold riding and cooling, which still has the disadvantage of causing environmental pollution and inconvenience in transportation. For example, the third type of water dispenser shown in the new patent "Semiconductor Cooling Water Dispenser" of the Republic of China Announcement No. 165620 is provided with a cooling device and a semiconductor cooler (or a cryogenic wafer). The cooling tank is provided with drinking water; the semiconductor refrigerator is disposed on the groove wall of the cooling tank, and the semiconductor refrigerator has a cooling surface and a heat dissipating surface, and the cooling surface faces the cooling tank Inside, the heat dissipation surface is facing outward. When the semiconductor cooler 5 201033553 is energized, its cooling surface is rapidly cooled, the water temperature in the tank is lowered, and the exchange heat is discharged from the heat dissipating surface. In this way, it is possible to overcome the shortcomings of the above-mentioned first type and the second type of water dispenser which are caused by the cooling of the refrigerant delivered by the compressor and the inconvenience of transportation. See a mouth

Ο 惟,上述第三種儲水槽飲水機仍具有第一種飲水機之 飲用水衛生不易維持及清洗不便的缺點。該第三種儲水槽 飲水機係將該半導體致冷ϋ設置於該冷卻槽之槽壁,以^ 用該冷卻槽作為料介㈣騎肖水進行冷卻。 再且’該第二種使用包裝水之飲水機,其包襞水係以 導熱效果不佳之歸包裝容料行包t,並無設置具有良 好傳導;I質構件之儲水槽等。0此,即使欲將致冷晶片結 合於包裝核錢崎冷卻,料服冷媒造成環境公害之 問^亦將因為無良好傳導介質之因素而不易將致冷晶片 結合於包裝水飲水機。 【發明内容】 本發明係提供一種電子致冷式包裝水飲水機,本發明 ,主要目_姐冷W可結合於包裝水飲水機進行冷 p =免使用冷媒對飲用水進行冷卻而造成環境公害。 '月之_人要目的係讓使用者可即時享用冰冷之飲 用水。 肖目的’本發騎運狀技術手段及藉 由該技射&所能相之魏包含有: ’係包含一基座、一致 該基座係設有一致冷空 -種電子致冷式包裝水飲水機 冷模組、-包裝水及—控制單元。 201033553 間;該致冷模組係包含—料殼體及—致冷晶月組,續傳 導殼體係設置於該致冷空間内,該傳導殼體係形成有一容 置槽,該致冷晶肢係結合於該傳導殼體; 置於該料㈣之容置·雜鮮元係包含-控: 器,該控㈣係设置於該基座,城㈣㈣與該致冷晶 片組電性連接。藉此’本發财有效降低環境公害並提高 使用便利性。惟 However, the above-mentioned third type of water storage tank still has the disadvantage that the drinking water of the first type of drinking fountain is not easy to maintain and inconvenient to clean. The third type of water storage device is configured to dispose the semiconductor refrigerating crucible on the groove wall of the cooling trough, and use the cooling trough as a material to cool the water. Further, the second type of water dispenser using packaged water has a packaged material package t which has a poor heat conduction effect, and is not provided with a good conductivity; a water storage tank of an I-type member. 0, even if the cooling chip is to be combined with the packaging nuclear kisaki cooling, the environmental pollution caused by the refrigerant will not easily combine the cooling wafer with the packaging water dispenser because there is no good conductive medium. SUMMARY OF THE INVENTION The present invention provides an electronic refrigeration type packaging water dispenser, the present invention, the main purpose _ sister cold W can be combined with a packaging water dispenser for cold p = free of refrigerant to cool the drinking water to cause environmental pollution . The purpose of the month is to allow users to enjoy instant drinking water. Xiao's 'this is a riding technique and the technology that can be used to make it include: 'The system consists of a base, and the base is provided with a uniform cold-type electronic refrigeration package. Water dispenser cold module, - packaging water and - control unit. 201033553; the refrigeration module comprises a material shell and a cooling crystal moon group, and a continuous conduction shell is disposed in the cooling space, the conductive shell is formed with a receiving groove, the cooling crystal limb system The conductive housing is coupled to the material (4); the control unit (4) is disposed on the base, and the city (4) (4) is electrically connected to the cooling chip group. This is a good way to reduce environmental pollution and improve ease of use.

【實施方式】 ▲為讓本發明之上述及其他目的、特徵及優點能更明顯 易1*董下文特舉本發明之較佳實施例,並配合所附圖式, 作詳細說明如下: ▲本發明主要係針對包裝水飲水機之冷卻系統進行設 。十改良’使得致冷晶#可結合於該包裝讀水機進行冷 卻’而不需利用壓縮機輸送冷媒對飲用水進行冷卻。 明參照第1至3圖所示,本發明第一實施例之電子致 冷式包裝水飲水機係包含-基座1、-致冷模組2、-加熱 模Ί 3 控制單元4及一第一包裝水5。該致冷模組2、 力。口熱模組3及控制單元4皆係設置於該基座1,且該控制 單疋4係分別與該致冷模組2及加熱模組3電性連接,以 控制該致冷模組2及加熱模組3之作動;該第一包裝水5 係容置於該基座1。 明參照第2及3圖所示,本發明第一實施例之基座1 係設有一致冷空間u、一容置空間12、一供水組件13及 一保冷蓋體14。該致冷空間11係位於該容置空間12之上 201033553 方,且該基座1朝向該致冷空間u之表面係設有斷熱材 質,以提升該致冷空間η之保冷效果;該致冷空間u係 供容置該第一包裝水5,且該第一包裝水5係設有一出水 閥51,使用者可直接透過該出水閥51取用飲用水,本實 施例還設置有一供水組件13以方便使用者取用飲用水。該 供水組件13係包含二出水元件131(如第i及2圖所示)、 一接口 132及數個管件I%。該二出水元件131係設置於 該基座1之外表面,該接口 132係朝向該致冷空間n,以 供該第一包裝水5之出水閥51結合;該管件133係用以將 接口 132連接至其中一出水元件ι31,以及由該接口 ι32 先連接經過該加熱模組3後,再連接至另一出水元件131, 使得使用者可以分別由該二出水元件131取用熱水及冷 水,該保冷蓋體14係用以蓋合封閉該致冷空間n,且該 保冷蓋體14較佳係以不易導熱之斷熱材質製成,以增加該 致冷空間11之保溫性。 請參照第3及4圖所示,本發明第一實施例之致冷模 組2係包含一傳導殼體21及一致冷晶片組22。該傳導殼 體21較佳係由金屬等導熱材質製成。舉例而言,本實施例 係選擇以鋁作為該傳導殼體21之材質,該傳導殼體21係 设置於該致冷空間11内;該傳導殼體21係於一底板211 之四個側緣分別設置一傳導部212、一卡擋部213及二側 板214所共同構成。使得該底板211、傳導部212、卡擋部 213及側板214係共同圍繞形成該容置槽215,由該容置槽 215供該第一包裝水5容置。如第3圖所示,該卡擋部213 之底端較佳係低於該傳導部212之底端,使得該底板211 201033553 與一水平面係形成一傾斜角;該卡擋部213係設有一限位 口 216 ’以於該第一包裝水5置入該致冷空間11時,該第 一包裝水5之出水閥51可卡合限位於該限位口 216,並利 用該卡檔部213擋止該第一包裝水5脫出;該傳導部212 之厚度較佳係大於該側板214之厚度,以提高該傳導殼體 21之保冷效果。 請參照第3及4圖所示,本發明第一實施例之致冷晶 片組22係設置於該傳導殼體21之傳導部212,且較佳係 位於該容置槽215外,並連通至該基座χ外之空間,以避 免影響該第一包裝水5之放置。該致冷晶片組22係包含一 致冷傳導塊221、一致冷晶片222、一散熱片223、一散熱 扇224、一保護元件225及一熱敏元件226。該致冷傳導塊 221及散熱片223較佳係選擇以導熱性佳之金屬材質製 成,該致冷傳導塊221之一面係直接貼附於讓傳導部212 上,再於該致冷傳導塊221之另一面設置該致冷晶片222; 該致冷晶片222係具有一致冷面222a及一散熱面222b, 且該致冷晶片222之致冷面222a係朝向該致冷傳導塊 221,該散熱面222b係背向該致冷傳導塊221,再將該散 熱片223設置於該致冷晶片222之散熱面222b;該散熱片 223之另一面可以设置該散熱扇224,以幫助該散熱片223 散熱;該保護元件225較佳係罩蓋於該致冷晶片組22,以 避免該致冷晶片組22受到撞擊而損壞;該熱敏元件226 係設置於該致冷傳導塊221,並與該控制單元4電性連接, 以感應該致冷傳導塊221之溫度並傳送至該控制單元4作 為控制之參數,可避免該致冷傳導塊221之溫度過低,而 201033553 浪費過多能源。如此,該致冷晶片222便可透過該散熱片 223及散熱扇224進行散熱’而將冷度透過該致冷傳導塊 221傳導至該傳導部212。 β奮參照第3圖所示,本發明第一實施例之加熱模組3 係設置於該基座1之容置空間12内,並透過該管件133 將飲用水導引經過該加熱模組3進行加熱及儲存,並連通 至其一出水元件U1,以供該使用者透過該出水元件κι 取用熱水。 凊參照第3及4圖所示,本發明第一實施例之控制單 元4係包含一微動開關41及至少一控制器42,該微動開 關41係具有一觸動端411 ,該微動開關41係設置於該基 座1。舉例而言,本實施例之微動開關41係穿過該傳導殼 體21之底板211 ’使得該觸動端411係凸出於該底板211 並朝向該容置槽215 ;舉例而言,本實施例係選擇設置一 控制器42,該控制器42係與該致冷模組2、加熱模組3 及微動關41電性連接,賤過賴動關41傳送訊號 至該控制1 42 ’並進-步利用該控制$ 42控制該致冷模 組2及加誠組3之作動。或者,該控制單元4亦可嗜略 该微動開關41之設置,而直接透過手動或遙控等方式操作 該控制|§ 42控繼致冷模組2及加熱模組3之作動。 清再參照第3及4圖所示,於使用本發明之電子致冷 式包裝水飲水麟,當料—包裝水5被置人紐冷空間 11 ntumc 5之重量雜抵該微動關41之觸 動端411 ’便可直接透過該微動開關41傳送訊號至該控制 器42,並由該控制器42控制該致冷模組2及加熱模組3 201033553 進行冷卻及加熱之動作,而不需再另行開啟開關驅動該致 冷模組2及加熱模組3,可有效提升使用便利性。該致冷 晶片組22啟動後,可將冷度傳導至該傳導殼體21之傳導 部212,當該傳導部212之厚度大於該二侧板214之厚度 時,该致冷晶片222所傳導至該傳導部212之冷度較不易 散失,可提咼整體保冷效果。而該第一包裝水5之出水閥 51可限位於該卡擋部213之限位口 216,並連接至該接口 132,使得該第一包裝水5内之飲用水輸送至該管件133, 而連通到出水元件131,或者先經過該加熱模組3加熱後 再輸送至該出水元件131,使得使用者可飲用冰水或熱 水。當該卡擋部213之底端係低於該傳導部212之底端, 因此,當該第一包裝水5中之飲用水即將耗盡時,該飲用 水可順者該底板211之傾斜而向該出水閥51流動,可避免 該第一包裝水5中殘餘過多之飲用水,形成無法由該出水 閥51流出而造成浪費。當該致冷空間η中之第—包裝水 5内的飲用水耗盡形成低於預定重量時,該微動開關41 並未受到抵壓,便可透過該控制器42直接關閉該致冷晶片 組22及加熱模組3,而不會浪費或損耗能源,亦可有效提 升使用便利性。 請再參照第5及6圖所示,係本發明第二較佳實施 例,在本實施例當中,該基座1另設有一預冷空間15及一 保冷板16。該預冷空間15係位於該容置空間12之下方, 以供容置第二包裝水5’,且該基座1朝向該預冷空間15 之表面係設有斷熱材質’以提升該預冷空間15之保冷效 果;該保冷板16係用以蓋合封閉該預冷空間ι5,且該保 —11 — 201033553 冷板16較佳係以不易導熱之斷熱材質製成,如此,可以增 加該預冷空間15之保溫性;該保冷板16朝向該預冷空間 15之一側係设有一預冷槽161,該預冷槽161係供承放第 一包裝水5,使传拉開該保冷板π之同時,可使該第二 包裝水5移離該預冷空間15,以便使用者拿取更換。本實 施例之控制單元4較佳係另包含一控制器42,,且該控制 器42’較佳係設置於該基座i靠近該預冷空間15處。 請再參照第6及7圖所示,在本實施例當中,該飲水 機係另包含一預冷晶片組6。該預冷晶片組6與該控制單 元4之控制器42’電性連接,以利用該控制器42,控制該預 冷晶片組6之作動,該預冷晶片組6較佳係設置於該基座 1 ’且該預冷晶片組6之一侧係朝向該預冷空間15,舉例 而έ,本實施例之預冷晶片組6係連接於該預冷空間15 及5亥基座1外之外部空間之間。該預冷晶片組6係包令— 預冷晶片61、一預冷傳導塊62、一預冷鰭片a、一預冷 風扇64、一散熱籍片65、一散熱風扇66、至少'—保護元 件67及一感溫元件68,舉例而言’本實施例係設置二個 保護元件67、67’。該預冷晶片61與該致冷晶片222相同 具有一致冷面61a及一散熱面61b ’該預冷晶片61係設置 於該基座1 ’且該預冷晶片61之致冷面61a係朝向該預冷 空間15 ’於該預冷晶片61之致冷面61a依序設有該預冷 傳導塊62、預冷,鰭片63、預冷風扇64及其中一保護元件 67;該預冷晶片61之散熱面61b係朝向該基座1外之外部 空間,且於該預冷晶片61之散熱面61b依序亦設有該散熱 鰭片65、散熱風扇66及另一保護元件67,;該感溫元件 —12 — 201033553 68係與該控制單元4之控制器42,電性連接,並設置於該 保護元件67 ’且係位於該保護元件67及預冷風扇64之 間,以感應該預冷風扇64所吹出之冷空氣的溫度並傳送至 • 該控制器42’作為控制之參數,可避免該預冷空間15之溫 度過低,而浪費過多能源。如此,該預冷晶片61便可透過 該散熱鲒片65及散熱風扇66進行散熱’而將冷度透過該 預冷傳導塊62、預冷鰭片63及預冷風扇64吹入該預冷空 間15中,使該預冷空間15中之第二包裝水5,可以透過該 ® 預冷風扇64所吹出之冷空氣進行預冷。其餘構件與第一實 施例相同,於此不再贅述。 s位於該致冷空間;Q中之第一包裝水5内之飲用水耗 盡時,僅需將該第一包裝水5移除,再由該預冷空間15 中將已預冷之第二包裝水5,取出並置放於該致冷空間u 中,便可以使該飲用水快速達到預定冷度,而不需較長等 待時間便可飲用到冰冷之飲水。 鲁 如上所述,本發明之電子致冷式包裝水飲水機,由於 δ又置有該傳導殼體21及致冷晶片組22,且該傳導殼體21 • 係圍繞包覆位於該容置空間犯内之第一包裝水5,由於 該傳導殼體21與該第-包裝水5之接觸面積較大,使得該 致2晶片組22可透過該傳導殼體21將冷度快速傳導至該 第包裝水5 ’進而使得該致冷晶片組Μ可良好的結合於 包裝水飲水機’而不需使用冷媒進行冷卻,如此,可避免 產生環境公害。再且’透過該微動_ 41之設置,使得使 用者不需手動操作該控制器42控制該致冷模組2及加熱模 、卫3之作動’因此可有效提升使用便利性。再且,本發明 —13 — 201033553 還可以在該預冷空間15絲置m水5,,並 該預冷晶片組6對第二包裝水5,進行預冷,如此,可以縮 短更換該第—包裝水5後,等待該第二包裝水5,達到預定 冷度之冷卻時間。 训頂叱The above and other objects, features, and advantages of the present invention will be made apparent by the appended claims. The invention is mainly for the cooling system of the packaged water dispenser. The ten improvement 'so that the cold crystal # can be combined with the packaging water machine for cooling' without the need to use a compressor to deliver the refrigerant to cool the drinking water. Referring to Figures 1 to 3, the electronically refrigerated packaging water dispenser of the first embodiment of the present invention comprises a base 1, a cooling module 2, a heating module 3, a control unit 4, and a first A package of water 5. The refrigeration module 2, the force. The heat module 3 and the control unit 4 are disposed on the base 1 , and the control unit 4 is electrically connected to the cooling module 2 and the heating module 3 respectively to control the cooling module 2 . And the heating module 3 is operated; the first packaging water 5 is placed on the base 1. Referring to Figures 2 and 3, the susceptor 1 of the first embodiment of the present invention is provided with a uniform cold space u, an accommodating space 12, a water supply unit 13, and a cold-keeping cover 14. The cooling space 11 is located at 201033553 square above the accommodating space 12, and the susceptor 1 is provided with a heat-dissipating material facing the surface of the cooling space u to enhance the cooling effect of the cooling space η; The cold space u is for accommodating the first package water 5, and the first package water 5 is provided with a water outlet valve 51. The user can directly access the drinking water through the water outlet valve 51. In this embodiment, a water supply assembly is further disposed. 13 to facilitate users to access drinking water. The water supply unit 13 includes two water discharge members 131 (shown in Figures i and 2), an interface 132, and a plurality of tubes 1%. The two water outlet elements 131 are disposed on the outer surface of the base 1. The interface 132 is directed toward the refrigeration space n for the water outlet valve 51 of the first package water 5 to be coupled; the tube member 133 is used to connect the interface 132. The water outlet component ι31 is connected to the water outlet component ι31, and the interface ι32 is first connected to the water outlet component 3, and then connected to the other water outlet component 131, so that the user can respectively take hot water and cold water from the two water outlet components 131. The cold sealing cover 14 is used for closing and closing the cooling space n, and the cold sealing cover 14 is preferably made of a heat-dissipating material that is not easily thermally conductive to increase the heat retention of the cooling space 11. Referring to Figures 3 and 4, the cooling module 2 of the first embodiment of the present invention comprises a conductive housing 21 and a uniform cold wafer group 22. The conductive shell 21 is preferably made of a heat conductive material such as metal. For example, in this embodiment, aluminum is selected as the material of the conductive housing 21, and the conductive housing 21 is disposed in the cooling space 11; the conductive housing 21 is attached to the four side edges of a bottom plate 211. A conductive portion 212, a blocking portion 213 and two side plates 214 are not provided together. The bottom plate 211, the conductive portion 212, the blocking portion 213 and the side plate 214 are formed around the accommodating groove 215, and the first packaging water 5 is received by the accommodating groove 215. As shown in FIG. 3, the bottom end of the blocking portion 213 is preferably lower than the bottom end of the conducting portion 212, such that the bottom plate 211 201033553 forms an oblique angle with a horizontal plane; the blocking portion 213 is provided with a The limiting port 216 ′ is configured such that when the first packaging water 5 is placed in the cooling space 11 , the water outlet valve 51 of the first packaging water 5 can be locked to the limiting port 216 , and the card locking portion 213 is utilized. The first package water 5 is prevented from coming off; the thickness of the conductive portion 212 is preferably greater than the thickness of the side plate 214 to improve the cooling effect of the conductive housing 21. As shown in FIGS. 3 and 4, the cooling chip set 22 of the first embodiment of the present invention is disposed on the conductive portion 212 of the conductive housing 21, and is preferably located outside the receiving groove 215 and connected to The space outside the base is to avoid affecting the placement of the first packaged water 5. The refrigerant chip group 22 includes a refrigerant conduction block 221, a uniform cold wafer 222, a heat sink 223, a heat dissipation fan 224, a protection element 225, and a heat sensitive element 226. Preferably, the cooling conductive block 221 and the heat sink 223 are made of a metal material having good thermal conductivity. One surface of the cooling conductive block 221 is directly attached to the conductive portion 212, and then the cooling conductive block 221 is attached. The cooling chip 222 is provided with a uniform cold surface 222a and a heat dissipation surface 222b, and the cooling surface 222a of the cooling wafer 222 faces the cooling conduction block 221, and the heat dissipation surface The heat sink 223 is disposed on the heat dissipating surface 222b of the refrigerating wafer 222. The heat dissipating fan 224 can be disposed on the other side of the heat dissipating fin 223 to help dissipate the heat sink 223. The protective element 225 is preferably covered by the cooling chip set 22 to prevent the cold chip group 22 from being damaged by impact; the heat sensitive element 226 is disposed on the cooling conductive block 221, and the control The unit 4 is electrically connected to sense the temperature of the refrigerant conduction block 221 and is transmitted to the control unit 4 as a parameter of control, so that the temperature of the refrigerant conduction block 221 is prevented from being too low, and 201033553 wastes excessive energy. Thus, the cooled wafer 222 can conduct heat through the heat sink 223 and the heat dissipation fan 224 to conduct coldness through the refrigerant conduction block 221 to the conductive portion 212. As shown in FIG. 3, the heating module 3 of the first embodiment of the present invention is disposed in the accommodating space 12 of the susceptor 1 and guides drinking water through the heating module 3 through the tube member 133. Heating and storing, and communicating to one of the water outlet elements U1, for the user to take hot water through the water outlet element κι. Referring to Figures 3 and 4, the control unit 4 of the first embodiment of the present invention includes a micro switch 41 and at least one controller 42 having a touch end 411, the micro switch 41 being set On the base 1. For example, the micro switch 41 of the embodiment passes through the bottom plate 211 ′ of the conductive housing 21 such that the touch end 411 protrudes from the bottom plate 211 and faces the receiving groove 215 ; for example, the embodiment A controller 42 is selected to be electrically connected to the cooling module 2, the heating module 3 and the micro-switch 41, and the signal is transmitted to the control 1 42 ' The operation of the refrigeration module 2 and the Jiacheng group 3 is controlled by the control $42. Alternatively, the control unit 4 may also enjoy the setting of the micro switch 41, and directly operate the control through the manual or remote control mode, and control the operation of the cooling module 2 and the heating module 3. Referring again to Figures 3 and 4, in the use of the electronically-cooled packaging water drinking water of the present invention, when the material-packaging water 5 is placed in the cold space 11 ntumc 5, the weight of the micro-motion is 41 The terminal 411' can directly transmit signals to the controller 42 through the micro switch 41, and the controller 42 controls the cooling module 2 and the heating module 3 201033553 to perform cooling and heating operations without further The opening switch drives the refrigeration module 2 and the heating module 3, which can effectively improve the convenience of use. After the cooling chip set 22 is activated, the coldness can be transmitted to the conductive portion 212 of the conductive housing 21. When the thickness of the conductive portion 212 is greater than the thickness of the two side plates 214, the cooled wafer 222 is conducted to The coldness of the conducting portion 212 is less likely to be lost, and the overall cooling effect can be improved. The water outlet valve 51 of the first package water 5 can be limited to the limiting port 216 of the blocking portion 213 and connected to the interface 132, so that the drinking water in the first packaging water 5 is delivered to the tube member 133. It is connected to the water discharge element 131, or is heated by the heating module 3 and then sent to the water discharge element 131, so that the user can drink ice water or hot water. When the bottom end of the blocking portion 213 is lower than the bottom end of the conducting portion 212, when the drinking water in the first packaged water 5 is about to be exhausted, the drinking water can be inclined by the bottom plate 211. When the water is discharged to the water outlet valve 51, excessive drinking water remaining in the first packaged water 5 can be avoided, and waste can be prevented from flowing out of the water discharge valve 51. When the drinking water in the first package water 5 in the cooling space η is depleted to form less than a predetermined weight, the micro switch 41 is not pressed, and the cooling chip set can be directly closed through the controller 42. 22 and heating module 3, without wasting or losing energy, can also effectively improve the convenience of use. Referring to Figures 5 and 6, there is shown a second preferred embodiment of the present invention. In the present embodiment, the base 1 is further provided with a pre-cooling space 15 and a cold-preserving plate 16. The pre-cooling space 15 is located below the accommodating space 12 for accommodating the second packaged water 5', and the susceptor 1 is provided with a heat-dissipating material toward the surface of the pre-cooling space 15 to enhance the pre-cooling space. The cooling effect of the cold space 15 is used to cover and close the pre-cooling space ι5, and the cold plate 16 is preferably made of a heat-dissipating material that is not easy to conduct heat, so that it can be added The pre-cooling space 15 is provided with a pre-cooling groove 161 facing one side of the pre-cooling space 15, and the pre-cooling groove 161 is for holding the first packaging water 5 so as to be pulled away. While the cold plate π is being maintained, the second package water 5 can be moved away from the pre-cooling space 15 for the user to take and replace. The control unit 4 of the present embodiment preferably further includes a controller 42, and the controller 42' is preferably disposed adjacent to the pre-cooling space 15 of the base i. Referring again to Figures 6 and 7, in the present embodiment, the water dispenser further includes a pre-cooled wafer set 6. The pre-cooling chip set 6 is electrically connected to the controller 42' of the control unit 4 to control the operation of the pre-cooling chip set 6 by the controller 42, and the pre-cooling chip set 6 is preferably disposed on the base. One side of the pre-cooling chip group 6 is oriented toward the pre-cooling space 15. For example, the pre-cooling chip group 6 of the present embodiment is connected to the pre-cooling space 15 and 5 Between external spaces. The pre-cooled chip set 6 is a pre-cooled wafer 61, a pre-cooled conductive block 62, a pre-cooled fin a, a pre-cooling fan 64, a heat-dissipating fin 65, a cooling fan 66, at least 'protection Element 67 and a temperature sensing element 68, for example, are provided with two protective elements 67, 67'. The pre-cooling wafer 61 has a uniform cold surface 61a and a heat dissipating surface 61b as the cooling fin 222. The pre-cooling wafer 61 is disposed on the susceptor 1' and the cooling surface 61a of the pre-cooling wafer 61 faces the The pre-cooling space 15' is provided with the pre-cooling conductive block 62, the pre-cooling, the fin 63, the pre-cooling fan 64 and one of the protective elements 67 in the cooling surface 61a of the pre-cooling wafer 61; the pre-cooling wafer 61 The heat dissipating surface 61b faces the outer space outside the susceptor 1 , and the heat dissipating fins 65 , the heat dissipating fan 66 and the other protective element 67 are sequentially disposed on the heat dissipating surface 61 b of the pre-cooling chip 61; The temperature component 12-1233 is electrically connected to the controller 42 of the control unit 4 and disposed between the protection component 67 and the pre-cooling fan 64 to sense the pre-cooling. The temperature of the cold air blown by the fan 64 is transmitted to the controller 42' as a parameter of control to prevent the temperature of the pre-cooling space 15 from being too low, thereby wasting excessive energy. In this manner, the pre-cooling chip 61 can be cooled by the heat-dissipating fins 65 and the heat-dissipating fan 66, and the coldness is blown into the pre-cooling space through the pre-cooling conductive block 62, the pre-cooling fins 63, and the pre-cooling fan 64. In step 15, the second packaged water 5 in the pre-cooling space 15 is precooled by the cold air blown by the ® pre-cooling fan 64. The remaining components are the same as in the first embodiment and will not be described again. s is located in the refrigeration space; when the drinking water in the first packaged water 5 in Q is exhausted, only the first packaged water 5 needs to be removed, and then the second pre-cooled space 15 is pre-cooled. The packaged water 5 is taken out and placed in the refrigerating space u, so that the drinking water can quickly reach the predetermined coldness, and the cold drinking water can be drunk without a long waiting time. As described above, in the electronically-cooled packaging water dispenser of the present invention, the conductive housing 21 and the cooling chip group 22 are disposed in the δ, and the conductive housing 21 is disposed around the accommodating space. The first packaged water 5 in the smear, because the contact area of the conductive housing 21 and the first package water 5 is large, so that the 2 wafer group 22 can quickly transmit the coldness to the first through the conductive housing 21. The packaged water 5' in turn allows the cooled wafer stack to be well bonded to the packaged water dispenser without the need for cooling with a refrigerant, thus avoiding environmental hazards. Further, by the setting of the jog_41, the user does not need to manually operate the controller 42 to control the operation of the refrigerating module 2 and the heating module and the illuminator 3, thereby effectively improving the usability. Furthermore, the present invention - 13 - 201033553 can also wire m water 5 in the pre-cooling space 15, and the pre-cooling chip set 6 pre-cools the second packaging water 5, so that the replacement of the first can be shortened - After the water 5 is packaged, the second packaged water 5 is awaited to reach a predetermined cooling time. Training

雖然本發明已利系上述較佳實施例揭示,然其並非用 以限定本發明’任何熟習此技藝者在不脫離本發明之精神 和範圍之内’相對±述實齡m行各種更動與修改仍屬本 發明所保護之技術齡,因此本發明之保魏圍當視後附 之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖:本發明第-實施例之電子致冷式包裝水飲水機 之外觀立體圖。 第2圖:本發明第一實施例之電子致冷式包裝水飲水機 之立體圖。 第3圖:本明第一實施例之電子致冷式包裝水飲水機 之剖視圖。 第4圖··本發明第一實施例之致冷模组的立體分解圖。 第5圖:本發明第二實施例之電子致冷式包裝水飲水機 之立體圖。 第6圖:本發明第二實施例之電子致冷式包裝水飲水機 之剖視圖。 第7圖.本發明第一實施例之致冷模組的立體分解圖。 【主要元件符號說明】 〔本發明〕 201033553While the present invention has been described in connection with the preferred embodiments of the present invention, it is not intended to limit the scope of the invention. It is still the technical age protected by the present invention, and therefore the scope of the patent application scope of the present invention is subject to the definition of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the appearance of an electronically-cooled packaging water dispenser according to a first embodiment of the present invention. Fig. 2 is a perspective view of an electronically-cooled packaged water dispenser according to a first embodiment of the present invention. Fig. 3 is a cross-sectional view showing the electronically-cooled packaged water dispenser of the first embodiment of the present invention. Fig. 4 is an exploded perspective view showing the refrigeration module of the first embodiment of the present invention. Fig. 5 is a perspective view of an electronically-cooled packaged water dispenser according to a second embodiment of the present invention. Figure 6 is a cross-sectional view showing an electronically-cooled packaged water dispenser of a second embodiment of the present invention. Fig. 7 is an exploded perspective view showing the refrigeration module of the first embodiment of the present invention. [Description of main component symbols] [Invention] 201033553

1 基座 12 容置空間 131出水元件 133管件 15 預冷空間 161預冷槽 21 傳導殼體 212傳導部 214侧板 216限位口 221致冷傳導塊 222a致冷面 223散熱片 225保護元件 3 加熱模組 41 微動開關 42控制器 5 第一包裝水 51出水閥 61 預冷晶片 61b散熱面 63 預冷鰭片 65 散熱鰭片 67 保護元件 68 感溫兀件 11 致冷空間 13 供水組件 132 接口 14保冷蓋體 16保冷板 2 致冷模組 211底板 213卡擋部 215容置槽 22 致冷晶片組 222致冷晶片 222b散熱面 224散熱扇 226熱敏元件 4 控制單元 411觸動端 42’控制器 5’第二包裝水 6 預冷晶片組 61a致冷面 62預冷傳導塊 64 預冷風扇 66散熱風扇 67’保護元件 —15 —1 pedestal 12 accommodating space 131 water outlet element 133 pipe fitting 15 pre-cooling space 161 pre-cooling tank 21 conductive housing 212 conducting portion 214 side plate 216 limiting port 221 cooling conduction block 222a cooling surface 223 fin 225 protection element 3 Heating module 41 Micro switch 42 Controller 5 First package water 51 Water outlet valve 61 Pre-cooled wafer 61b Heat sink surface 63 Pre-cooling fin 65 Heat sink fin 67 Protection element 68 Temperature sensor element 11 Cooling space 13 Water supply unit 132 Interface 14 cold cover body 16 cold plate 2 refrigeration module 211 bottom plate 213 blocking portion 215 receiving groove 22 cooling chip group 222 cooling chip 222b heat dissipation surface 224 heat dissipation fan 226 thermal element 4 control unit 411 touch end 42' control 5' second package water 6 pre-cooled wafer set 61a cooling surface 62 pre-cooling conductive block 64 pre-cooling fan 66 cooling fan 67' protection element - 15 -

Claims (1)

201033553 七、申請專利範圍: 1、 一種電子致冷式包裝水飲水機,係包含: 一基座’係設有一致冷空間; * 冷模組’係包含一傳導殼體及一致冷晶片組,該傳 ^ 導喊體係設置於該致冷空間内,該傳導殼體係形成有一 各置槽,該致冷晶片組係結合於該傳導殼體; 一包裝水,係容置於該傳導殼體之容置槽内;及 φ 一控制單元,係包含一控制器,該控制器係設置於該基 座,且該控制器係與該致冷晶片組電性連接。 2、 依申請專利範圍第1項所述之電子致冷式包裝水飲水 機’其中該控制單元另設有與該控制器電性連接之一微 動開關’該微動開關係具有一觸動端,且該觸動端係朝 向該容置槽。 3、 依申請專纖圍第1或2項所述之電子致冷式包裝水飲 水機’其中該傳導殼體係於一底板之四個 ❹ 一傳導部、一卡擋部及二側板所共同構成,該底板°、傳 導部、卡擋部及侧板係共同圍繞形成該容置槽,且該致 , 冷晶片組係結合於該傳導部。 . 4、依申請專利範圍第1或2項所述之電子致冷式包裝水飲 水機,其中該傳導殼體之底板與一水平面形成一傾斜 角。 5、 依申請專利範圍第3項所述之電子致冷式包裝水飲水 機,其中該傳導殼體之底板與一水平面形成一傾斜角。 6、 依申請專利範圍第3項所述之電子致冷式包裝水飲水 —16 - 201033553 機,其中該傳導部之厚度係大於該侧板之厚声。 β 8 9 10 ❹ • 11 12 、依申請專利範圍第i或2項所述之電子致冷心 水機’其中該致冷晶片組係包含一致冷傳導塊、一7 = 晶片、一散熱片及一散熱扇,該致冷傳導塊之一致冷 於該傳導殼體,該致冷晶片具有-致冷面及:結合 且該致冷晶>1之致冷面储合於該致冷傳導塊之、^ 面’該散糾係設置於該致冷晶片之散熱面,且二 扇係設置於該散熱片。 …、 、依申請專·圍第7顧叙電子致冷式包袭水飲水 機’其中該致冷晶片組另包含與該控制單元電性連接之 一熱敏元件,且該熱敏元件係設置於該致冷傳導塊。 、依申請補範目帛3項所述之電子致冷式包裝水飲水 機,其中該包裝水係設有-its糊,且該卡擋部係設有 限位口,且該出水閥係限位於該限位口内。 ’依申請專利範圍第1或2項所述之電子致冷式包襄水飲 k機其中該基座另包含-保冷蓋體,該保冷蓋體係用 以蓋合封閉該致冷空間,且該保冷蓋體係以斷熱材質製 成0 依申請專利範圍第1或2項所述之電子致冷式包裝水飲 水機,其中該致冷晶片組係位於該容置槽外。 一種電子致冷式包裝水飲水機,係包含: 基座,係6又有一致冷空間及一預冷空間.; 一致冷模組,係包含一傳導殼體及一致冷晶片組該傳 ^殼體係設置於該致冷空間内,該傳導殼體係形成有一 谷置槽’該致冷晶片組係結合於該傳導殼體; —17 — 201033553 一包裝水,其容置於該傳導殼體之容置槽内; 一預冷晶片組,係設置於該基座,且該預冷晶片組之_ 侧朝向該預冷空間;及 4 —控解元,係包含至少—控㈣,該㈣器係設置於 * 錄座,且該控制11係與紐冷晶#組及預冷晶片組電 性連接。 ’ 13、依_請專·圍第12項之電子致冷式包裝水飲水 ❿ 機’其+該控制單元錢有無姉H電性連接之一微 動開關,該微動_係具有—觸動端,且該觸動端係朝 向該容置槽。 U、依申請專赚圍第!2或η項所述之電子致冷式包裝水 飲水機’其中該傳導殼體係於一底板之四個側緣分別設 置-傳導部一卡擋部及二侧板所共同構成,該底板、 傳導部、卡擋部及側板係共同圍繞形成該容置槽,且該 致冷晶片組係結合於該傳導部。 ❹ I5、依申請專利範圍第12或13項所述之電子致冷式包裝水 飲水機,其中該預冷晶片組另包含一預冷晶片、一預冷 • 傳導塊、一預冷鰭片及一預冷風扇,該預冷晶片係具有 一致冷面及一散熱面’該預冷晶片之致冷面上係依序設 置該預冷傳導塊、預冷鰭片及預冷風扇。 16、依申請專利範圍第15項所述之電子致冷式包裝水飲水 機,其中該預冷晶片組另包含一保護元件及一感溫元 件,該保護元件係罩蓋於該預冷風扇,該感溫元件係與 該控制單元電性連接且係位於該保護元件及該預冷風 扇之間。 —18 — 201033553 17、 依申料麵圍第14項·之電子致 機,其中該預冷晶片組另包含一預冷晶片、—St 塊、-預冷鰭狀-預冷風扇,該預冷^係具有 冷面及-散熱面,該預冷晶片之致冷面上係依序設置該 預冷傳導塊、預冷鰭片及預冷風扇。 μ Ο 18、 ^料職®第U顧叙f子料式包裝水飲水 機,其中該預冷晶片組另包含一散熱續片及—散熱 ^且於_冷^之散熱面魏賴㈣散熱錯片 散熱風扇。 夂 依申请專利範圍第12或I3項所述之電子致冷式包 ^機,其中該基座另包含—保冷板,該保冷板係用以 20、^朗該預冷空間,且該保冷板係以斷熱材質製成。 依申睛專利19項所述之電子致冷式 機,其中該保冷板朝向該預冷空間之-側係設^預冷 槽。 % 一 19 一201033553 VII. Patent application scope: 1. An electronic refrigeration type packaging water dispenser, comprising: a pedestal 'with uniform cold space; * a cold module' comprising a conductive shell and a uniform cold chip set. The transmission system is disposed in the refrigerating space, the conductive housing is formed with a plurality of slots, the cooling chip set is coupled to the conductive housing; a package of water is received in the conductive housing The φ-control unit includes a controller, the controller is disposed on the pedestal, and the controller is electrically connected to the chilled chip set. 2. The electronically-cooled packaging water dispenser according to claim 1, wherein the control unit is further provided with a micro switch electrically connected to the controller, wherein the micro-opening relationship has a touch end, and The touch end faces the receiving groove. 3. The electronically-cooled packaging water dispenser according to claim 1 or 2, wherein the conductive shell is connected to a four-layer conductive portion, a card stop portion and two side plates of a bottom plate. The bottom plate, the conductive portion, the latching portion, and the side plate are collectively formed around the receiving groove, and the cold chip assembly is coupled to the conductive portion. 4. The electronically refrigerated packaged water dispenser of claim 1 or 2, wherein the bottom plate of the conductive housing forms an oblique angle with a horizontal plane. 5. The electronically refrigerated packaged water dispenser of claim 3, wherein the bottom plate of the conductive housing forms an oblique angle with a horizontal plane. 6. The electronically-cooled packaged water drinking water according to item 3 of the patent application scope, wherein the thickness of the conducting portion is greater than the thick sound of the side plate. β 8 9 10 ❹ • 11 12 , the electronic chiller according to the scope of the patent application of item i or 2, wherein the refrigerant chip set comprises a uniform cold conducting block, a 7 = wafer, a heat sink and a cooling fan, the cooling conduction block is uniformly cooled by the conductive housing, the refrigerating wafer has a -cooling surface and: the cooling surface of the cooling crystal > 1 is stored in the cooling conduction block The surface is disposed on the heat dissipation surface of the refrigerant chip, and the two fans are disposed on the heat sink. ...,, according to the application, the fourth-mentioned electronic refrigeration type water-injection water dispenser, wherein the cooling chip set further comprises a thermal element electrically connected to the control unit, and the thermal element is set In the cooling conduction block. The electronic refrigeration type packaging water dispenser according to claim 3, wherein the packaging water system is provided with a -its paste, and the card blocking portion is provided with a limiting port, and the water outlet valve is located at a limit Inside the limit port. The electronically-cooled water-contained beverage machine according to claim 1 or 2, wherein the base further comprises a cold-retaining cover system for closing and closing the cooling space, and The chilling cover system is made of a heat-dissipating material. The electronically-cooled packaging water dispenser according to claim 1 or 2, wherein the cooling chip set is located outside the accommodating groove. An electronically cooled packaging water dispenser comprises: a pedestal, the system 6 has a uniform cold space and a pre-cooling space. The uniform cooling module comprises a conductive shell and a uniform cold chip set. The system is disposed in the refrigerating space, the conductive shell is formed with a trough groove, the refrigerated wafer set is coupled to the conductive shell; 17-201033553 a package of water, which is accommodated in the conductive shell a pre-cooled chip set is disposed on the pedestal, and the _ side of the pre-cooled chip set faces the pre-cooling space; and 4 - the control element includes at least - (4), the (four) device It is set on the * recording base, and the control 11 series is electrically connected to the Newcooling # group and the pre-cooling chip set. '13, according to _ please specializes around the 12th item of electronic refrigeration packaging water drinking water machine 其 'the + control unit money has no 姊 H electrical connection one of the micro switch, the fretting _ has - touch end, and The touch end faces the receiving groove. U, according to the application to earn a full profit! The electronically-cooled packaging water dispenser of item 2 or n, wherein the conductive shell is respectively disposed on four side edges of a bottom plate, and the conductive portion, the latching portion and the two side plates are combined, the bottom plate and the conductive plate are The receiving portion, the blocking portion and the side plate are collectively formed around the receiving groove, and the cooling chip assembly is coupled to the conducting portion. The electronically refrigerated packaging water dispenser of claim 12, wherein the pre-cooled wafer set further comprises a pre-cooled wafer, a pre-cooling conductor block, a pre-cooled fin, and A pre-cooling fan has a uniform cold surface and a heat dissipating surface. The pre-cooling surface of the pre-cooling wafer is sequentially provided with the pre-cooling conductive block, the pre-cooling fin and the pre-cooling fan. The electronically refrigerated packaging water dispenser according to claim 15, wherein the pre-cooling chip set further comprises a protection component and a temperature sensing component, the protection component is covered by the pre-cooling fan. The temperature sensing element is electrically connected to the control unit and is located between the protection element and the pre-cooling fan. —18 — 201033553 17. According to the electronic device of claim 14, wherein the pre-cooled wafer set further comprises a pre-cooled wafer, a St-block, a pre-cooled fin-pre-cooling fan, and the pre-cooling The system has a cold surface and a heat dissipating surface, and the pre-cooling conductive block, the pre-cooling fin and the pre-cooling fan are sequentially disposed on the cooling surface of the pre-cooled wafer. μ Ο 18, ^Materials® U 叙 f f sub-packaged water dispenser, wherein the pre-cooled chip set further includes a heat sink and heat sink ^ and the heat sink surface of the heat sink (four) heat dissipation error A cooling fan. The electronic refrigeration type package according to claim 12 or claim 3, wherein the base further comprises a cold plate, the cold plate is used for 20, the pre-cooling space, and the cold plate is used. Made of heat-dissipating material. The electronic refrigerator according to claim 19, wherein the cold plate is provided with a pre-cooling groove toward the side of the pre-cooling space. % one 19 one
TW98107910A 2009-03-11 2009-03-11 Electrical refrigerating drinking fountain for package water TW201033553A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI650518B (en) * 2017-01-26 2019-02-11 美是德實業有限公司 Drinking water device heat dissipation method and module thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI650518B (en) * 2017-01-26 2019-02-11 美是德實業有限公司 Drinking water device heat dissipation method and module thereof

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