201029137 ' 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種導線架條及其封膠方法與封膠構 造，特別是關於一種能提高單位時間產出量（units per hour，UPH)之導線架條及其封膠方法與封膠構造。 【先前技術】 現今，半導體封裝產業為了滿足各種封裝需求，逐 φ 漸發展出各種不同型式之封裝構造，其中由半導體發晶 圓（wafer)切割而成的矽晶片（chip)通常是先利用打線 (wire bonding)或凸塊(bumping)等適當方式選擇固定在 導線架（leadframe)或基板(substrate)上，接著再利用封裝 膠體封裝包覆保護矽晶片，如此即可完成一半導體封裝 構造的基本架構。一般常見具有導線架之封裝構造包含 小外型封裝（small outline package，SOP)、小外型j形 引腳封裝（small outline J_leaded package，SOJ)、小外型 ❹ 電晶體封裝（small outline transistor，SOT)、寬體小外型 封裝(small outline package (wide-type)，SOW)、雙列直 插式封裝(Dual In-line Package，DIP)、四方扁平封裝 (quad flat package，QFP)及四方形扁平無外引腳封裝 (quad flat non-leaded package ’ QFN)等。目前，為 了符 合量產需求，通常是在一導線架條(leadframe strip)上設 置數個導線架單元，以同時進行數個晶片的固定、電性 連接及封膠等加工程序，最後再切割去除多餘框架，以 4 201029137 便同時製造完成數個具有導線架之封裝構造。 舉例而言，請參照第iA、1B&lc圖所*， -種習則、外贿裝⑽P)構造之導線 膠歧 職的示意圖。如第1A圖所示，一導線架 一外框10、數個輕支㈣、數織 ❹ 鲁 導線架單元13。該外框10、連結支架11及流 ^相互連接，該連結支架n及流道支架12相互垂直 父又排列，以支撑、區隔及定義該數個導線架單元13。 各該導線架單元13具有—晶片承座131、數個内引腳 部132、數個外引腳部133、數個襟桿(dam㈣…及 數個支撐助條(tie bar)l35，該晶片承座131利用該支撐 ^条135連接到該連結支架u(或外框1〇)上。該内引腳 部132連接在該壩桿134上，該外引腳部133連接在該 壤才干及該連結支架11(或外框1〇)之間。再者，每一 該流道支架12及其兩側的二排該導線架單元13共同定 義成一流道分支模塊1〇〇。 如第1A圖所示，在進行封膠前，先將數個晶片14 分別固定在各該晶片承座131上，各該晶片14可利用 數條導線（wire) 15電性連接至該内引腳部132。如第 1B圖所示’在進行封膠時，將具有該晶片14及導線15 的該導線架條1利用轉移模塑成形（transfer m〇lding ) 方式進行處理’其中將該導線架條1夾置在二模具16 之間。此時’該導線架單元13對位於該二模具16共同 形成之一模穴區161中，且該二模具16在一料穴 5 201029137 (well)162位置利用一活塞163將一封裝膠材17壓入 流道部(nmner)164内’直到該封裝膠材17沿數個= 口（sidegate)165注入到各該模穴區161，以包覆保護澆 該晶片承座13卜内引腳部132(如第1A圖所示）、曰各 14及導線15(如第1A圖所示）。 曰日片 如第1C圖所示，在完成封膠後，固化該封裴膠 17，並移除該二模具16。此時，該封裝膠材17對應診 流道部164、侧澆口 165及模穴區161分別形成—淹= 參 膠條m、數個侧澆口膠條172及數個封裝膠體173 其中該流道膠條171包覆在該流道支架12上，且每〜 該流道膠條171在每一分流點A通過二個該侧澆口豚 條172連接二個該封裝膠體173。也就是，在每一讀流 道分支模塊100中，每設置二排該導線架單元13，就 必需在該二排導線架單元13之間設置一組該流道部 164(亦即該流道膠條m)，每一分流點a是以1:2的比 例經由該側澆口 165(亦即該侧澆口膠條172)向兩側連 ❹ 接二個該封裝膠體173。 然而，在此種導線架條1的流道分支模塊100設計 中’每隔二排該導線架單元13就必需設置一個該流道 支架12,以方便後續形成該流道膠條171及侧澆口膠 條172。但是，此種流道支架12與導線架單元13的I:2 排列比例設計具有過爹數量的流道支架12,其相對限 制了該導線架條1讦用以設置該導線架單元13的空 間’亦即相對限制該導線架單元13的總單元數量。結 6 201029137 果’每進行一次封膠製程，僅能在該導線架條丨上形成 有限數量的該封裝膠體173，同時必需浪費不少的該導 線架條1空間，因而導致難以進一步提高該封膠製程的 單位時間產出量（units per hour，UPH) 〇 故’有必要提供一種導線架條及其封膠方法與封膠 構造，以解決習知技術所存在的問題。 【發明内容】 Ο 本發明之主要目的在於提供一種導線架條及其封膠 方法與封膠構造，其中導線架條係設有至少一流道分支 模塊’每一流道分支模塊之各分流點預留區可向兩侧設 置四個導線架單元，進而有利於減少導線架條的流道支 架數量、增加導線架單元的佈局數量、提升導線架條的 空間利用率、增加封膠製程的單位時間產出量(υρΗ)， 並相對降低半導體封裝構造的平均封膠成本。 ❹ 本發明之次要目的在於提供一種導線架條及其封膠 方法與封膠構造，其中每一流道分支模塊之各分流點預 留區利用二侧澆口預留區向兩侧連接二導線架單元，並 進一步利用二連結澆口預留區向外連接另二導線架單 元，進而有利於減少流道支架數量、提升空間利用率、 增加單位時間產出量，並降低平均封膠成本。 本發明之另一目的在於提供一種導線架條及其封膠 方法與封膠構造，其中在完成封膠後，封裝膠材在連結 澆口預留區形成連結澆口連接二相鄰導線架單元，可做 7 201029137 為支撐封裝膠體的臨時性固定肋條，進而有利於提高導 線架條封膠構造的結構強度及其運送便利性。 為達上述之目的，本發明提供一種導線架條，其包 含至少一流道分支模塊’各該流道分支模塊具有一流道 支架、數個第一導線架單元、數個第二導線架單元、數 個第三導線架單元、數個第四導線架單元、數個侧澆口 預留區及數個連結澆口預留區。在各該流道分支模塊 中，該流道支架預留有一流道預留區，該流道預留區具 有數個分流點預留區。各該侧澆口預留區形成在該分流 點預留區與該第一導線架單元之間，及形成在該分流點 預留區與該第二導線架單元之間。各該連結洗口預留區 形成在該第/及第二導線架單元之間，及形成在該第三 及第四導線架單元之間。 再者，本發明提供一種導線架條之封膠方法，其包 含步驟··提供一導線架條’其包含至少一流道分支模 塊’各該流道分支模塊具有一流道支架、數個第一導線 架單元、數個第二導線架單元、數個第三導線架單元及 數個第四導旅架單元；使一熱熔之封裝膠材沿一流道部 流動，該流道部延伸在該流道支架上；使該流道部之封 裝膠材經由數個分流點向兩侧分別流入一侧澆口 ’其分 別注入該第/及第三導線架單元内，以分別形成一第一 封裝膠體及〆第三封裝膠體；以及，使該第一及第三封 装膠體内的封裝膠材分別經由一連結澆口注入一第二 導線架單元及一第四導線架單元，以分別形成一第二封 201029137 裝膠體及一第四封裝膠體。 另外，本發明提供一種導線架條之封膠構造，其包 含一導線架條及一封裝膠材。該導線架條包含至少一流 道分支模塊，各該流道分支模塊具有一流道支架、數個 第一導線架單元、數個第二導線架單元、數個第三導線 架單元及數個第四導線架單元。該封裝膠材包含至少一 流道膠條、數個側澆口膠條、數個連結澆口膠條、數個 第一封裝膠體、數個第二封裝膠體、數個第三封裝膠體 ® 及數個第四封裝膠體。各該流道膠條延伸在該流道支架 上’且各該流道膠條具有數個分流點，各該侧澆口膠條 連接該分流點及該第一封裝膠體，及連接該分流點及該 第三封裝膠體。各該連結澆口膠條連接該第一及第二封 裝膠體’及連接該第三及第四封裝膠體。該第一至第四 封裝膠體分別包覆該第一至第四導線架單元。 在本發明之一實施例中，該第一及第二導線架單元 ❺ 依序平行串接排列在該流道支架的第一侧；該第三及第 四導線架單元依序平行串接排列在該流道支架的第二 側。 在本發明之一實施例中，該侧澆口預留區（或侧澆口 膠條）及該連結澆口預留區（或連結澆口膠條）形成在該 第一導線架單元（或第三導線架單元）之一對角線的兩 端。 在本發明之一實施例中，該侧澆口預留區（或侧澆口 膠條)形成在該第一導線架單元（或第三導線架單元）最 201029137 接近一封裝膠材來源端的角位置上。 在本發明之一實施例中，該侧澆口預留區（或侧澆口 膠條）及連結洗口預留區（或連結洗口膠條)形成在該導 線架條的同一表面。 在本發明之一實施例中，該導線架條之流道支架（的 流道預留區）具有至少一開槽。 在本發明之一實施例中，該導線架條之侧澆口預留 區具有一缺口。 ❿ 在本發明之一實施例中，該導線架條之連結澆口預 留區具有至少一缺口。 在本發明之一實施例中，該第一至第四導線架單元 選自具雙排引腳之導線架單元。 在本發明之一實施例中，該流道部、側澆口及連結 澆口形成在二模具上。 在本發明之一實施例中，在提供該導線架條之步驟 後，另包含：分別在該第一至第四導線架單元上放置至 少一晶片，並使該晶片電性連接該第一至第四導線架單 元0 【實施方式】 為了讓本發明之上述及其他目的、特徵、優點能更 明顯易懂’下文將特舉本發明較佳實施例，並配合所附 圖式，作詳細說明如下。 β月參照第2A、2B及2C圖所示，本發明較佳實施例 201029137 H線架條及其封膠方法與封膠構造主要應用於製造 具^引腳導線架之半導體封裝產品，例如應用於製造 =外型封裝(S〇P)、小外型；形引聊封裝(則）、小外型 電晶體封裝(S0T)、寬體小外型封裝(s〇w)、雙列直插 式封裝(DIP)或其他類似的封裝產品。 請參照第2A圖所示，本發明較佳實施例之導線架 條2係-條狀板體，其通常係由鋼、鐵、銘、鎳或等效 金屬或合金所製成，並經由沖壓(Punching)或其他等效 方法加工形成下列細部構造，其中該導線架條2包含一 外框20、數個連結支架21、至少一流道支架22、數個 第-導線架單元23、數個第二導線架單元24、數個第 三導線架單元25及數個第四導線架單元％。該外框 2〇、連結支架21及流道支架22相互連接，該連結支架 21橫向間隔排列在該外框20 β，該流道支架22縱向 間隔排列在該外框20内，該連結支架21及流道支架 ❹ 22相互垂直交又排列’以支撐、區隔及定義該第一、 第二、第三及第四導線架單元23_26。每一該流道支架 22的一第一侧依序平行串接排列該第一 單元23、24,及每一該流道支架22的_第^= 行串接排列該第三及第四導線架單元25、26，該流道 支架22及第一至第四導線架單元23_26共同定義為至 少一流道分支模塊200。當設置二組或以上之流道分支 模塊200時，各該流道分支模塊200係相互鄰接排列在 該導線架條2之外框20所定義的一範圍内。 201029137 請再參照第2A圖所示，本發明較佳實施例之流道 支架22預留有一流道預留區B，在該流道預留區B之 範圍内具有至少一開槽221，以便在封膠後進行去膠 (dejunk)。該流道預留區B具有數個分流點預留區C， 各該分流點預留區C與相鄰該第一導線架單元23(或第 三導線架單元25)之間分別具有一侧澆口預留區D， 及，在該侧澆口預留區D之範圍内較佳具有一缺口 222,其較佳連通於該第一導線架單元23(或第三導線架 ❹ 單元25)的開槽（未標示）。再者，各該第一及第二導線 架單元23、24之間具有一連結澆口預留區E，在該連 結澆口預留區E之範圍内較佳具有至少一缺口 27，例 如設有二個該缺口 27,其分別連通於該第一及第二導 線架單元23、24的開槽（未標示）。另外，各該第三及 第四導線架單元25、26之間亦具有一連結澆口預留區 E，在該連結澆口預留區E之範圍内同樣具有至少一缺 口 27，例如設有二個該缺口 27，其分別連通於該第三 ® 及第四導線架單元25、26的開槽（未標示）。依據上述 流道分支模塊200的設計，每一該分流點預留區C是以 1:4的比例連接四個導線架單元23-26。 請再參照第2A圖所示，本發明較佳實施例之第一 至第四導線架單元23-26為實質相同的具雙排引腳之導 線架單元，其各自包含一晶片承座、數個内引腳部、數 個外引腳部、數個壩桿及數個支撐助條(未標示），上述 細部構造係實質相同於第1A圖所示之導線架單元13 12 201029137 的細部構可依封裝產料同而做 構造(例如晶片承座），該第-至第四導線2切部分 之細部構造縣以限制本發明。因此H^3_26 予詳細說明該第—至第四導線架單元23 26不再另 造。再者，在進行封膠前，該第之細部構 測皆可用以承载至二晶第四導線架單元 如導線或凸塊)電性連接該晶片28。利㈣當方式(例201029137 ' VI. Description of the invention: [Technical field of the invention] The present invention relates to a lead frame strip, a sealing method thereof and a sealing structure, in particular to a unit of per hour (UPH) The lead frame strip and its sealing method and sealing structure. [Prior Art] Nowadays, in order to meet various packaging requirements, the semiconductor packaging industry has gradually developed various types of package structures. Among them, wafers cut by semiconductor wafers are usually first used. (wire bonding) or bumping or the like is selected to be fixed on a leadframe or a substrate, and then encapsulated to protect the germanium wafer by using an encapsulant, so that the basic structure of a semiconductor package can be completed. Architecture. Generally, a package structure having a lead frame includes a small outline package (SOP), a small outline J_leaded package (SOJ), and a small outline transistor package (small outline transistor). SOT), small outline package (wide-type), SOW, dual in-line package (DIP), quad flat package (QFP) and four Quad flat non-leaded package 'QFN' and so on. At present, in order to meet the mass production requirements, a plurality of lead frame units are usually disposed on a leadframe strip to simultaneously perform processing procedures of fixing, electrically connecting, and sealing a plurality of wafers, and finally cutting and removing the same. The redundant frame, at 4 201029137, simultaneously manufactures several package configurations with lead frames. For example, please refer to the diagrams of the iA, 1B & lc diagrams, - the rules of the rules, the bribery installation (10) P). As shown in Fig. 1A, a lead frame is an outer frame 10, a plurality of light branches (four), and a plurality of weaving lead frame units 13. The outer frame 10, the connecting bracket 11 and the flow are connected to each other. The connecting bracket n and the flow path bracket 12 are arranged perpendicularly to each other to support, partition and define the plurality of lead frame units 13. Each of the lead frame units 13 has a wafer holder 131, a plurality of inner lead portions 132, a plurality of outer lead portions 133, a plurality of dams (dam) and a plurality of tie bars l35. The socket 131 is connected to the joint bracket u (or the outer frame 1) by the support strip 135. The inner lead portion 132 is connected to the dam rod 134, and the outer lead portion 133 is connected to the soil stem and Between the connection brackets 11 (or the outer frame 1 〇), each of the flow path brackets 12 and the two rows of the lead frame units 13 on both sides thereof are collectively defined as a first-class branch module 1〇〇. As shown in the figure, a plurality of wafers 14 are respectively fixed on the wafer holders 131, and the wafers 14 are electrically connected to the inner lead portions 132 by a plurality of wires 15 respectively. As shown in FIG. 1B, when the encapsulation is performed, the lead frame strip 1 having the wafer 14 and the wires 15 is processed by transfer molding, wherein the lead frame strip 1 is processed. Sandwiched between the two molds 16. At this time, the pair of lead frame units 13 are located in a mold cavity region 161 formed by the two molds 16, and the two The tool 16 is pressed into the flow path portion (nmner) 164 by a piston 163 at a position of a cavity 5 at 201029137 (well) 162 until the package adhesive 17 is injected along a number of side gates 165. Each of the cavity regions 161 is coated to protect the wafer holder 13 from the inner lead portion 132 (as shown in FIG. 1A), the cymbal 14 and the lead 15 (as shown in FIG. 1A). As shown in FIG. 1C, after the encapsulation is completed, the sealant 17 is cured, and the two molds 16 are removed. At this time, the encapsulant 17 corresponds to the treatment channel portion 164, the side gate 165, and the cavity. The area 161 is respectively formed with a flooding strip, a plurality of side gate strips 172, and a plurality of encapsulating strips 173, wherein the channel strip 171 is coated on the runner bracket 12, and each of the runners is glued. The strip 171 connects the two encapsulants 173 at each of the diverting points A through the two side gate dolphin 172. That is, in each of the read channel branching modules 100, each of the two rows of the leadframe units 13 is disposed. It is necessary to provide a set of the flow path portions 164 (that is, the flow path rubber strips m) between the two rows of lead frame units 13, and each of the flow dividing points a is in the ratio of 1:2 via the side gates 1 65 (that is, the side gate strip 172) is connected to the two sides of the encapsulant 173. However, in the design of the flow path branching module 100 of the lead frame strip 1 'every second row of the lead frame The unit 13 must be provided with a flow path bracket 12 to facilitate the subsequent formation of the flow channel strip 171 and the side gate strip 172. However, the I:2 arrangement ratio of the flow path bracket 12 and the lead frame unit 13 is designed. The flow path bracket 12 has an excessive number of turns, which relatively limits the space in which the lead frame strip 1 is used to set the lead frame unit 13, that is, the total number of units of the lead frame unit 13 is relatively limited. Knot 6 201029137 If the encapsulation process is performed, only a limited number of the encapsulant 173 can be formed on the lead frame strip, and a large amount of space of the lead frame strip 1 must be wasted, which makes it difficult to further improve the seal. Units per hour (UPH) Therefore, it is necessary to provide a lead frame strip and its sealing method and sealing structure to solve the problems of the prior art. SUMMARY OF THE INVENTION The main object of the present invention is to provide a lead frame strip, a sealing method thereof and a sealing structure, wherein the lead frame strip is provided with at least a first-class branching module, and each shunting point of each channel branching module is reserved. The area can be provided with four lead frame units on both sides, which is beneficial to reducing the number of flow path supports of the lead frame strips, increasing the layout of the lead frame units, increasing the space utilization ratio of the lead frame strips, and increasing the unit time of the sealing process. The output (υρΗ), and relatively reduce the average sealing cost of the semiconductor package construction. The secondary object of the present invention is to provide a lead frame strip, a sealing method thereof and a sealing structure, wherein each of the flow dividing point reserved areas of each flow path branching module uses two side gate reserved areas to connect two wires to both sides The frame unit further utilizes the two joint gate reserved area to connect the other two lead frame units outward, thereby facilitating the reduction of the number of the flow path brackets, improving the space utilization rate, increasing the throughput per unit time, and reducing the average sealing cost. Another object of the present invention is to provide a lead frame strip, a sealing method thereof and a sealing structure. After the sealing is completed, the sealing glue forms a joint gate in the joint reserved area to connect two adjacent lead frame units. , can be done 7 201029137 to support the temporary fixing ribs of the encapsulant, which is beneficial to improve the structural strength and convenient transportation of the lead frame sealing structure. In order to achieve the above object, the present invention provides a lead frame strip comprising at least a first-class branching module. Each of the flow path branching modules has a first-class track bracket, a plurality of first lead frame units, a plurality of second lead frame units, and a plurality of A third lead frame unit, a plurality of fourth lead frame units, a plurality of side gate reserved areas and a plurality of joint gate reserved areas. In each of the flow path branching modules, the flow path support is reserved with a first-class reserved area, and the flow path reserved area has a plurality of distribution point reserved areas. Each of the side gate reserved areas is formed between the branch point reserved area and the first lead frame unit, and is formed between the shunt point reserved area and the second lead frame unit. Each of the joint wash reserve areas is formed between the first and second lead frame units and between the third and fourth lead frame units. Furthermore, the present invention provides a method for sealing a lead frame strip, comprising the steps of providing a lead frame strip comprising at least a first-class branching module. Each of the flow path branching modules has a first-class track support and a plurality of first conductive lines. a shelf unit, a plurality of second lead frame units, a plurality of third lead frame units and a plurality of fourth guide frame units; causing a hot-melt encapsulating material to flow along the first-class track portion, the flow path portion extending in the flow The sealing material of the flow channel portion is caused to flow into the one side gates through the plurality of diverting points to the two sides into the first and third lead frame units respectively to form a first encapsulant And a third encapsulant; and the encapsulants in the first and third encapsulants are respectively injected into a second lead frame unit and a fourth lead frame unit via a joint gate to form a second Seal 201029137 with a colloid and a fourth encapsulant. In addition, the present invention provides a sealant construction for a leadframe strip comprising a leadframe strip and a package adhesive. The lead frame strip includes at least a first-class branch module, each of the flow path branching modules has a first-class track bracket, a plurality of first lead frame units, a plurality of second lead frame units, a plurality of third lead frame units, and a plurality of fourth Lead frame unit. The package adhesive comprises at least a first-class rubber strip, a plurality of side gate strips, a plurality of joint gate strips, a plurality of first encapsulants, a plurality of second encapsulants, a plurality of third encapsulants, and a plurality of A fourth encapsulant. Each of the flow channel strips extends on the flow path brackets and each of the flow channel strips has a plurality of split points, each of the side gate strips connecting the split point and the first encapsulant, and connecting the split point And the third encapsulant. Each of the joint gate strips connects the first and second encapsulants' and connects the third and fourth encapsulants. The first to fourth encapsulants respectively cover the first to fourth lead frame units. In an embodiment of the present invention, the first and second lead frame units are sequentially arranged in parallel in series on the first side of the flow path bracket; the third and fourth lead frame units are sequentially arranged in parallel On the second side of the runner bracket. In an embodiment of the present invention, the side gate reserved area (or side gate strip) and the joint gate reserved area (or the joint gate strip) are formed on the first lead frame unit (or The ends of one of the diagonals of the third lead frame unit). In an embodiment of the present invention, the side gate reserved area (or side gate strip) is formed at an angle of the first lead frame unit (or the third lead frame unit) at most 201029137 close to a source end of a package adhesive. Location. In one embodiment of the invention, the side gate reserve area (or side gate strip) and the joint wash reserve area (or joint wash strip) are formed on the same surface of the wire strip. In an embodiment of the invention, the flow path support of the lead frame strip has at least one slot. In an embodiment of the invention, the side gate reserved area of the lead frame strip has a notch. In one embodiment of the invention, the junction gate retention zone of the leadframe strip has at least one indentation. In one embodiment of the invention, the first to fourth leadframe units are selected from leadframe units having dual rows of pins. In an embodiment of the invention, the flow path portion, the side gate, and the joint gate are formed on the two molds. In an embodiment of the present invention, after the step of providing the lead frame strip, the method further includes: placing at least one wafer on the first to fourth lead frame units respectively, and electrically connecting the first electrical connection to the first to fourth lead frame unit The above-mentioned and other objects, features and advantages of the present invention will become more apparent and understood. as follows. Referring to FIGS. 2A, 2B and 2C, the preferred embodiment of the present invention, the 201029137 H-wire strip, its sealing method and the sealing structure are mainly used for manufacturing a semiconductor package product having a lead frame, such as an application. For manufacturing = exterior package (S〇P), small form factor; shape introduction package (then), small external transistor package (S0T), wide body small package (s〇w), dual in-line Package (DIP) or other similar packaged product. Referring to FIG. 2A, a lead frame strip 2 according to a preferred embodiment of the present invention is a strip-shaped plate body which is usually made of steel, iron, inscription, nickel or an equivalent metal or alloy, and is stamped. (Punching) or other equivalent method is processed to form the following detailed structure, wherein the lead frame strip 2 comprises an outer frame 20, a plurality of connecting brackets 21, at least a first-class bracket 22, a plurality of first-lead frame units 23, and a plurality of Two lead frame units 24, a plurality of third lead frame units 25, and a plurality of fourth lead frame units. The outer frame 2, the connecting bracket 21 and the flow path bracket 22 are connected to each other. The connecting bracket 21 is laterally spaced apart from the outer frame 20 β. The flow path bracket 22 is longitudinally spaced apart in the outer frame 20, and the connecting bracket 21 is arranged. And the runner brackets 22 are perpendicularly arranged and arranged to support, partition and define the first, second, third and fourth lead frame units 23_26. A first side of each of the runner brackets 22 is arranged in parallel in series with the first unit 23, 24, and the third and fourth conductors are arranged in series with each other of the runner bracket 22 The frame units 25, 26, the flow path bracket 22 and the first to fourth lead frame units 23_26 are collectively defined as at least the main branching module 200. When two or more flow path branching modules 200 are provided, each of the flow path branching modules 200 is adjacent to each other within a range defined by the outer frame 20 of the lead frame strip 2. 201029137 Please refer to FIG. 2A again, the flow path bracket 22 of the preferred embodiment of the present invention reserves a first-class reserved area B, and has at least one slot 221 in the range of the reserved area B of the flow path, so that Dejunk is performed after sealing. The flow channel reserved area B has a plurality of distribution point reserved areas C, and each of the divided point reserved areas C and the adjacent first lead frame unit 23 (or the third lead frame unit 25) respectively have one side The gate reserved area D, and preferably within the range of the side gate reserved area D, has a notch 222 which is preferably connected to the first lead frame unit 23 (or the third lead frame unit 25). Slotted (not labeled). Furthermore, each of the first and second lead frame units 23, 24 has a connection gate reserved area E, and preferably has at least one notch 27 in the range of the connection gate reserved area E, for example, There are two notches 27 which are respectively connected to the slots (not labeled) of the first and second lead frame units 23, 24. In addition, each of the third and fourth lead frame units 25 and 26 also has a connection gate reserved area E, and also has at least one notch 27 in the range of the connection gate reserved area E, for example, Two of the notches 27 are respectively connected to the slots (not labeled) of the third and fourth lead frame units 25, 26. According to the design of the flow path branching module 200 described above, each of the branching point reserved areas C connects the four lead frame units 23-26 in a ratio of 1:4. Referring to FIG. 2A again, the first to fourth lead frame units 23-26 of the preferred embodiment of the present invention are substantially identical lead frame units having two rows of pins, each of which includes a wafer holder and a number. The inner lead portion, the plurality of outer lead portions, the plurality of dam bars and the plurality of support bars (not shown), the detailed structure is substantially the same as the detail of the lead frame unit 13 12 201029137 shown in FIG. 1A The configuration may be made in accordance with the package material (e.g., wafer holder), and the first to fourth conductors 2 are cut into sections to limit the present invention. Therefore, H^3_26 will explain in detail that the first to fourth lead frame units 23 26 are not separately manufactured. Moreover, the first detailed portion of the structure can be used to electrically connect the wafer 28 to a second crystal fourth lead frame unit such as a wire or a bump before the sealing is performed. Lee (4) when the way (example
你圖所示，本發日她佳實關之導線架 條的封朦方法係包含下列步驟：提供—導_條2，其 包含至少-流道分支模塊·，各職道分支模塊· 具有-流$支架22、數個第一導線架單元23、數個第 二導線架單元24、數個第三導線架單元25及數個第四 導線架單元26 ;使—熱炫之封裝膠材3沿-流道部41 流動’該流道部41延伸在該流道支架22上；使該流道 «Μ1之封裝膠材3經由數個分流點F向兩侧分別流入 侧澆42其分別注入該第一及第三導線架單元 23 25内以分別形成一第一封裝膠體33及一第三封 裝膠體36 ’以及’使該第—及第三封裝膠體33、36内 的封裝膠材3分別再經由—連結洗口 44注人—第二導 線架單元24及—第四導線架單元26，以分別形成一第 一封裝膠體35及一第四封装膠體37。 請參照第2B圖所示’在提供該導線架條2之步驟 =分別在該第-至第四導線架單元23-26上放置至 夕日曰片28，並使該晶片28電性連接該第一至第四導 13 201029137 線架單元23-26。接著，利用絲# _ _ 百扪用轉移模塑成形 (transfer-molding)方式進行封膠製程。此時本 ’ 較佳實施例之導線架條2係夾置在二模具4之間。讀％ 模具4共同形成-料穴40、-流道部41、、數侧則= 42、數個第一模穴區43、數個連結澆口 44、數個第〜 模穴區45、數個第三模穴區46、數個第四模穴區47二 一活塞48，其中該流道部41並具有該數個分流點开 及 向兩侧連接該數個侧澆口 42。該熱炫之封裝膠材3 置在該料穴40中’並利用該活塞48將該封裝勝材3As you can see in the picture, the sealing method of the lead frame strip of her best-selling day includes the following steps: providing - guide _ strip 2, which includes at least - runner branch module ·, each service branch module · has - Flow $ bracket 22, a plurality of first lead frame units 23, a plurality of second lead frame units 24, a plurality of third lead frame units 25, and a plurality of fourth lead frame units 26; Flowing along the flow path portion 41, the flow path portion 41 extends on the flow path support 22; and the sealing material 3 of the flow path «Μ1 is flowed into the side water 42 through the plurality of distribution points F, respectively. The first and third lead frame units 23 25 respectively form a first encapsulant 33 and a third encapsulant 36 ′ and 'the encapsulant 3 in the first and third encapsulants 33 and 36 respectively Then, the second lead frame unit 24 and the fourth lead frame unit 26 are infused to each other to form a first encapsulant 35 and a fourth encapsulant 37, respectively. Referring to FIG. 2B, the step of providing the lead frame strip 2 is placed on the first to fourth lead frame units 23-26 to the matte spring 28, and the wafer 28 is electrically connected to the first One to fourth guide 13 201029137 Wire frame unit 23-26. Next, the sealing process was carried out by transfer-molding using the wire # _ _ 扪. At this time, the lead frame strip 2 of the preferred embodiment is sandwiched between the two molds 4. The reading % mold 4 is formed together - the pocket 40, the flow path portion 41, the number side = 42, the plurality of first cavity regions 43, the plurality of joint gates 44, the plurality of the first mold cavity regions 45, and the number The third cavity area 46, the plurality of fourth cavity areas 47 and the second piston 48, wherein the flow path portion 41 has the plurality of diversion points open and connects the plurality of side gates 42 to both sides. The hot package adhesive 3 is placed in the pocket 40 and the package is used to utilize the piston 48.
壓 入該流道部41内。在本發明中，該模具4之流道部Μ 對應於該導線架條2之流道支架22的流道預留區b及 開槽221 ;該分流點F對應於該流道支架22的分流點 預留區C ;該侧洗口 42對應於該流道支架22的側洗口 預留區D;該連結澆口 44對應於該連結澆口預留區e; 以及’該第一至第四模穴區43-47分別對應於該第一至 第四導線架單元23-26。 請參照第2C圖所示’在完成封膠後，本發明較佳 實施例之封裝膠材3將固化形成至少一流道膠條31、 數個侧澆口膠條32、數個第一封裝膠體33、數個連結 澆口膠條34、數個第二封裝膠體35、數個第三封裝膠 體36及數個第四封裝膠體37 °因此’本發明較佳實施 例之導線架條2的封膠構造係包含一導線架條2及一封 裝膠材3。該導線架條2包含至少一流道分支模塊200, 各該流道分支模塊200具有一流道支架22、數個第一 201029137 導線架單70 23、數個第二導線架單元24、數個第三導 線架單元25及數個第四導線架單元26。該封裝膠材3 之各流道膠條31延伸在該流道支架22上，且各該流道 膠條31具有數個分流點F，各該側澆口膠條32連接該 分流點F及該第一封裝膠體33 ’及連接該分流點卩及 該第二封裝膠體36。各該連結澆口膠條34連接該第一 及第二封裝膠體33、35，及連接該第三及第四封裝膠 體36、37。該第一至第四封裝膠體33_37分別包覆該第 一至第四導線架單元23-26。在製備該導線架條2的封 膠構造後，本發明可進一步進行去膠/去緯(dejunk/trim) 等程序，如此即可製得數個半導體封裝產品（未繪示）。 該導線架條2的開槽121及缺口 222、27可方便對該流 道膠條31、該側澆口膠條32與該連結澆口膠條34進 行去膠動作。 再者，請參照第2A、2B及2C圖所示，在本發明較 佳實施例中，該侧澆口預留區D(或侧澆口膠條32)及該 連結洗口預留區E(或連結洗口膠條34)係形成在該第一 導線架單元23(或第三導線架單元24)之一對角線的兩 端，且該侧澆口預留區D(或侧澆口膠條32)較佳形成在 該第一導線架單元23(或第三導線架單元24)最接近該 封裝膠材3來源端的角位置上，以便確保該封裝膠材3 順向注入該侧洗口 42，並在填滿該第一導線架單元 23(或第三導線架單元24)之後，才經由該該連結澆口 44注入該第二導線架單元24(或第四導線架單元25)， 15 201029137 »· 藉此相對提高串接封膠的成品率(yield)。另外，該侧洗 預留區D(或侧《堯口膠條μ)及連結洗口預留區e(或 連結洗口膠條34)較佳形成在該導線架條2的同一表 面。藉此，在完成封膠後，該側洗口膠條32與該連結 洗口膠條34將可做為支撑該第三及第四封裝膠體％、 37的臨時性固定肋條，能提高導線架條封膠構造的整 體結構強度，使其在裝箱或運送的過程中不致因重量過 重而彎曲變形，因而增加運送便利性。 6 如上所述，相較於第1A至1C圖之習用導線架條1 之流道分支模塊100具有該流道支架12與導線架單元 13呈1:2的排列比例設計’造成在該導線架條1上僅能 形成有限數量的該導線架單元13等缺點’第2A至2C 圖之本發明之導線架條2的每一流道分支模塊2〇〇利用 設置該側澆口預留區D及連結澆口預留區E，使得各分 流點預留區C可向兩侧連接四個導線架單元23-26，其 具有該流道支架22與導線架單元23_26呈1:4的排列比 參 例設計。例如，在78x250mm的相同尺寸下，習用導線 架條1上最多僅能設置8x28個該導線架單元13，但本 發明之導線架條2上最多則能設置8x36個該導線架單 元23-26。因此，本發明確實能相對減少該導線架條2 的流道支架22數量’同時增加該導線架單元23_26的 佈局數量，進而有效提升該導線架條2的空間利用率， 大幅增加封膠製程的單位時間產出量(UPH)大約28.5% 或更多，並可相對降低半導體封裝構造的平均封膠成 201029137 本ο 制本發明，糾較佳實施例揭露1其並非用以限 之精神和此·#之人士’在不脫離本發明 之保護範可作各财減修飾，因此本發明 圍备視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1B圖 第1C圖 ❹The flow path portion 41 is pressed into the flow path portion 41. In the present invention, the flow path portion 该 of the mold 4 corresponds to the flow path reserved area b and the groove 221 of the flow path support 22 of the lead frame strip 2; the split flow point F corresponds to the shunt of the flow path support 22 a reserved area C; the side wash port 42 corresponds to the side wash reserve area D of the flow path bracket 22; the joint gate 44 corresponds to the joint gate reserved area e; and 'the first to the first The four-mode hole regions 43-47 correspond to the first to fourth lead frame units 23-26, respectively. Referring to FIG. 2C, after the encapsulation is completed, the encapsulant 3 of the preferred embodiment of the present invention will be cured to form at least a first-lasting strip 31, a plurality of side gate strips 32, and a plurality of first encapsulants. 33. A plurality of joint gate strips 34, a plurality of second encapsulants 35, a plurality of third encapsulants 36, and a plurality of fourth encapsulants 37. Thus, the seal of the lead frame strip 2 of the preferred embodiment of the present invention The adhesive structure comprises a lead frame strip 2 and an encapsulant 3 . The lead frame strip 2 includes at least a first-class branch module 200, each of which has a first-class track bracket 22, a plurality of first 201029137 lead frame sheets 70 23, a plurality of second lead frame units 24, and a plurality of third The lead frame unit 25 and the plurality of fourth lead frame units 26. Each of the flow channel strips 31 of the encapsulating material 3 extends on the flow path bracket 22, and each of the flow channel strips 31 has a plurality of split points F, and the side gate strips 32 are connected to the split point F and The first encapsulant 33 ′ and the shunt point 卩 and the second encapsulant 36 are connected. Each of the joint gate strips 34 connects the first and second encapsulants 33, 35 and connects the third and fourth encapsulants 36, 37. The first to fourth encapsulants 33_37 respectively cover the first to fourth lead frame units 23-26. After the sealing structure of the lead frame strip 2 is prepared, the present invention can further perform a process such as dejunk/trim, so that a plurality of semiconductor package products (not shown) can be obtained. The slot 121 and the notches 222, 27 of the lead frame strip 2 facilitate the stripping operation of the channel strip 31, the side gate strip 32 and the joint gate strip 34. Furthermore, please refer to FIGS. 2A, 2B and 2C. In the preferred embodiment of the present invention, the side gate reserved area D (or the side gate strip 32) and the joint wash reserve area E (or the joint cleaning strip 34) is formed at both ends of one diagonal of the first lead frame unit 23 (or the third lead frame unit 24), and the side gate reserved area D (or side pouring) The adhesive strip 32) is preferably formed at an angular position of the first lead frame unit 23 (or the third lead frame unit 24) closest to the source end of the encapsulant 3 to ensure that the encapsulant 3 is injected into the side. The second lead frame unit 24 (or the fourth lead frame unit 25) is injected through the joint gate 44 after the mouth 42 is filled and the first lead frame unit 23 (or the third lead frame unit 24) is filled. ), 15 201029137 »· Thereby increasing the yield of the serial sealant. In addition, the side wash reserve area D (or the side "strip strip" and the joint wash area e (or the joint strip 34) are preferably formed on the same surface of the lead strip 2. Therefore, after the sealing is completed, the side-wash strip 32 and the joint-wash strip 34 can be used as temporary fixing ribs for supporting the third and fourth encapsulants, 37, and the lead frame can be improved. The overall structural strength of the strip sealant structure is such that it does not bend and deform due to excessive weight during the process of packing or transporting, thereby increasing the convenience of transportation. 6 As described above, the flow path branching module 100 of the conventional lead frame strip 1 of FIGS. 1A to 1C has a 1:2 arrangement ratio design of the flow path bracket 12 and the lead frame unit 13 in the lead frame. The strip 1 can only form a limited number of such lead frame units 13 and the like. Each of the flow path branching modules 2 of the lead frame strip 2 of the present invention in the 2A to 2C drawings utilizes the side gate reserved area D and The gate reservation area E is connected, so that each of the distribution point reserved areas C can connect four lead frame units 23-26 to both sides, and the arrangement of the flow path support 22 and the lead frame unit 23_26 is 1:4. Example design. For example, at the same size of 78x250 mm, the conventional wire strip 1 can only be provided with a maximum of 8 x 28 of the lead frame units 13, but the lead frame strip 2 of the present invention can be provided with up to 8 x 36 of the lead frame units 23-26. Therefore, the present invention can relatively reduce the number of the flow path brackets 22 of the lead frame strip 2 while increasing the layout amount of the lead frame unit 23_26, thereby effectively improving the space utilization ratio of the lead frame strip 2, and greatly increasing the sealing process. The unit time output (UPH) is about 28.5% or more, and the average sealing property of the semiconductor package structure can be relatively reduced to 201029137. The invention is disclosed in the preferred embodiment, which is not limited to the spirit and the The 'person of the invention' can be modified without departing from the scope of the invention, and therefore the invention is defined by the scope of the patent application. [Simple diagram of the diagram] Figure 1B Figure 1C Figure ❹
第1A圖：習用導線架條之局部正視圖。 習用導線架條在進行封膠時之局部剖視圖。 筮2A 胃科線架絲完朗膠狀局部正視圖。 本發明較佳實施例之導線架條之局部正視圖。 之局部賴㈣蘭^料録進行封膠時 正視本固發明較佳實施例之導線架條在完成封膠後 10 外框 11連結支架 13導線架單元 132内引腳部 134壩桿 14晶片 16模具 【主要元件符號說明】 1 導線架條 100流道分支模塊 12 流道支架 131晶片承座 U3外引腳部 135支撐助條 15 導線 17 201029137Figure 1A: A partial front view of a conventional lead frame strip. A partial cross-sectional view of a conventional lead frame strip when it is sealed.筮 2A Gastric line frame completes the partial view of the gelatin. A partial elevational view of a leadframe strip in accordance with a preferred embodiment of the present invention. In the case of sealing, the lead frame strip of the preferred embodiment of the present invention is completed. After the sealing is completed, the outer frame 11 is connected to the bracket 13 and the lead frame unit 132 is in the lead portion 134. Mold [main component symbol description] 1 lead frame strip 100 flow path branching module 12 flow path bracket 131 wafer holder U3 outer lead portion 135 support brace 15 lead 17 201029137
161 模穴區 162 料穴 163 活塞 164 流道部 165 側澆口 17 封裝膠材 171 流道膠條 172 侧澆口膠條 173 封裝膠體 2 導線架條 20 外框 200 流道分支模塊 21 連結支架 22 流道支架 221 開槽 222 缺口 23 第一導線架單元 24 第二導線架單元 25 第三導線架單元 26 第四導線架單元 27 缺口 28 晶片 3 封裝膠材 31 流道膠條 32 側澆口膠條 33 第一封裝膠體 34 連結澆口膠條 35 第二封裝膠體 36 第三封裝膠體 37 第四封裝膠體 4 模具 40 料穴 41 流道部 42 侧洗口 43 第一模穴區 44 連結洗口 45 第二模穴區 46 第三模穴區 47 第四模穴區 48 活塞 A 分流點 B 流道預留區 C 分流點預留區 D 側澆口預留區 E 連結澆口預留區 F 分流點 18161 cavity area 162 hole 163 piston 164 flow path 165 side gate 17 package rubber 171 flow strip 172 side gate strip 173 encapsulant 2 lead frame strip 20 outer frame 200 runner branch module 21 joint bracket 22 Flow path bracket 221 Slot 222 Notch 23 First lead frame unit 24 Second lead frame unit 25 Third lead frame unit 26 Fourth lead frame unit 27 Notch 28 Wafer 3 Package adhesive 31 Flow path strip 32 Side gate Strip 33 First encapsulant 34 Joint gate strip 35 Second encapsulant 36 Third encapsulant 37 Fourth encapsulant 4 Mold 40 Hole 41 Flow section 42 Side wash 43 First cavity area 44 Link wash Port 45 second cavity area 46 third cavity area 47 fourth cavity area 48 piston A distribution point B flow path reserved area C distribution point reserved area D side gate reserved area E connection gate reserved area F split point 18