TW201022045A - Method of fabricating printhead assembly - Google Patents

Abstract

A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Description

201022045 * 九、發明說明 1 【發明所屬之技術領域】 本發明關於印表機，特別是關於噴墨印表機。 【先前技術】 申請人已發展出廣範圍的印表機，其使用頁寬列印頭 ’而非傳統的往復列印頭設計。頁寬設計增加列印速率， 0 因爲列印頭不須橫越頁面往復運動以沉積一列影像。頁寬 列印頭單純地沉積墨水在媒介上，因爲其高速地運動通過 。此等列印頭已能夠以每分鐘約60頁的速率執行全彩（ full color) 1 600 dpi的列印，習知的噴墨印表機無法獲得 該等速率。 以此等速率列印會快速地消耗墨水，此會造成須有足 夠墨水供給列印頭的問題。不僅是流率較高，而且相較於 饋給墨水至相對小之往復式列印頭，頁寬列印頭須沿著其 整個長度分佈墨水。 通常使用黏性膜將整合有電路的列印頭附接至墨水歧 管。希望將此附接製程最佳化，以提供最水墨水滲漏的列 印頭組合體。 【發明內容】 在第一態樣中，本發明提供一種列印頭組合體，包含 模製墨水歧管’具有複數的墨水出口，其界定在歧管 201022045 結合表面內； 一或更多列印頭積體電路，每一列印頭積體電路具有 ’ —或更多墨水入口，其界定在列印頭結合表面內；和 黏劑膜，夾在該歧管結合表面和該一或更多列印頭結 合表面之間，該膜具有界定在其內的複數墨水供給孔，每 一墨水供給孔對齊墨水出口和墨水入口， 其中，至少該歧管結合表面包含聚合體塗層，該聚合 體塗層塞住該模製墨水歧管內的縫隙。 _ 第一態樣的列印頭組合體藉由塞住模製墨水歧管內的 顯微模製縫隙，而有利地使墨水滲漏最小化。 選擇性地，該等縫隙是由用於製造該墨水歧管之模製 製程所產生的無用縫隙。即使使用高公差模製工具，通常 也不可避免一些無用的顯微縫隙。 選擇性地，因爲該聚合體塗層塞住該等縫隙，所以該 歧管結合表面實質地平坦。平坦的歧管結合表面有利地使 經過結合表面內之模製縫隙的墨水滲漏最小化。 Ο 選擇性地，以該聚合體塗層塗覆該模製墨水歧管整體 。因此，在該模製墨水歧管內之所有縫隙（包括各墨水供 給流道間的內部縫隙）可都被塞住。 選擇性地，該聚合體塗層選自聚合體群組，該聚合體 群組由聚醯亞胺、聚酯、環氧樹脂、聚四氟乙烯、矽氧烷 、和液晶聚合體組成。該聚合體塗層通常和用於形成模製 墨水歧管之聚合體不同。 選擇性地，該聚合體塗層包含無機或有機添加物，用 -6 - 201022045 於提供下列特性其中之一或更多，該等特性包括可濕潤性 * 、黏劑結合強度、和抗刮傷能力。因此，聚合體塗層除了 具有塞住縫隙的主要功能之外，聚合體塗層可有利地具有 多種功能，例如矽顆粒可倂入聚合體塗層內，以改善耐用 性、抗刮傷能力、和可濕潤性等。 選擇性地，藉由浸漬、噴灑塗覆、或旋轉塗覆而將該 聚合體塗層施加至該模製墨水歧管。 Φ 選擇性地，複數列印頭積體電路沿著該墨水供給歧管 的縱向範圍端對端地毗連。本案申請人已在倂入此案做參 考之交互參考專利案和專利申請案中，描述用於製造列印 頭的該配置。 選擇性地，該複數列印頭積體電路界定頁寬列印頭。 選擇性地，沿著該列印頭結合表面縱向延伸之墨水供 給通道界定複數墨水入口。選擇性地，複數墨水供給孔對 齊一個墨水供給通道，該複數墨水供給孔中的每一個，沿 • 著該墨水供給通道縱向地間隔開。 在第二態樣中，提供一種頁寬印表機，包含如上所述 之靜止的列印頭組合體。 在第三態樣中，提供一種用於噴墨列印頭的模製墨水 歧管，該墨水歧管具有用於附接一或更多列印頭積體電路 的歧管結合表面，該等列印頭積體電路的每一者，接收來 自界定在該結合表面內之一或更多墨水出口的墨水，其中 ’至少該歧管結合表面包含聚合體塗層’該聚合體塗層塞 住在該模製墨水歧管內的縫隙。 201022045 在第四態樣中’提供—種製造列印頭組合體的方法， 該方法包含下列步驟： (a) 提供模製墨水歧管’該模製墨水歧管具有用於 附接一或更多列印頭積體電路的歧管結合表面’該結合表 面具有界定在其內的複數墨水出口’該結合表面具有由模 製製程而產生的複數縫隙； (b) 以聚合體塗層塗覆至少該歧管結合表面，藉此 塞住該等縫隙；和 _ (c) 將一或更多列印頭積體電路結合至該歧管結合 表面。 選擇性地，因爲該聚合體塗層塞住該等縫隙，所以該 歧管結合表面實質地平坦。 選擇性地，該塗覆步驟以該聚合體塗層塗覆該模製墨 水歧管整體。 選擇性地，該聚合體塗層塞住界定在該墨水歧管內之 各墨水供給流道間的內部縫隙。 n 選擇性地，該聚合體塗層選自聚合體群組，該聚合體 群組由聚醯亞胺、聚酯、環氧樹脂、聚四氟乙烯、矽氧烷 、和液晶聚合體組成。 選擇性地，該聚合體塗層包含無機或有機添加物，用 於提供下列特性其中之一或更多，該等特性包括可濕潤性 、黏劑結合強度、和抗刮傷能力。 選擇性地，該塗覆步驟包括：浸漬、噴灑塗覆、或旋 轉塗覆其中任一。 -8- 201022045 選擇性地，該塗覆步驟利用包含有機溶劑的聚合體塗 * 層溶液。 選擇性地，控制該塗覆步驟’以提供具有預定厚度的 聚合體塗層。藉由例如浸漬時間和聚合體的黏性等參數’ 可控制聚合體塗層的厚度。 選擇性地，該結合步驟包含： 將黏劑膜結合至該歧管結合面；和 Φ 將該列印頭積體電路結合至該黏劑膜。 選擇性地，該黏劑膜是積層膜’其包含夾在第一和第 二黏劑層之間的中央聚合體膜。 在第五態樣中，提供一種結合列印頭組合體，包含一 或更多列印頭積體電路，該積體電路結合至模製墨水供給 歧管之歧管結合表面，其中，該歧管結合表面包含聚合體 塗層，該聚合體塗層塞住在該模製墨水歧管內的複數縫隙 0 【實施方式】 槪要 圖1顯示將本發明具體化的印表機2。印表機的主體 4支撐在後面的媒介饋給盤14，和在前面的樞轉面6。圖 1顯示樞轉面6關閉，使得顯示螢幕8在其直立的觀察位 置。控制鈕1 0從螢幕8的側邊延伸，以方便操作者邊觀 看螢幕時邊輸入。爲了列印，從饋給盤14內的媒介疊12 抽出單一片體，並饋給通過列印頭（隱藏在印表機內）。 -9- 201022045 將已列印的片體1 6輸送穿過已列印媒介出口槽1 8。 圖2顯示樞轉前面6打開，以顯露印表機2的內部。 t 打開印表機的前面，暴露了設置在內部的列印頭匣96。列 印頭匣96被匣嚙合凸輪20固定定位。凸輪20將列印頭 匣96向下推，以確保墨水耦合器（稍後描述）完全嚙合 且列印頭積體電路（ICs )(稍後描述）被正確地定位鄰 接紙饋給路徑。凸輪20被釋放槓桿24手動地致動。前面 6不能關閉，且因此印表機不能操作，直到釋放桿24被向 @ 下推以完全嚙合凸輪。關閉樞轉面6以使印表機接點22 嚙合匣接點1 04。 圖3顯示印表機2的樞轉面6打開，且移除列印頭匣 96。因爲樞轉面6向前傾斜，所以使用者可向上拉匣釋放 槓桿24，以解除凸輪20的嚙合。此允許抓著匣96上的把 手26向上拉。上游墨水耦合器11 2A和下游墨水耦合器 11 2B脫離印表機的導管142，此將於下文更詳細地描述。 進行相反的步驟可安裝未使用過的新匣。新匣以未塡注的 ❹ 狀態運輸和販售，所以爲了使印表機預備供列印，主動射 流系統（下文描述）使用下游栗，以用墨水塡注匣和列印 頭。 在圖4中，已移除印表機2的外殼以顯露其內部。大 的墨水罐60具有四個分離的儲庫供全部四種不同墨水用 。墨水罐60本身是可更換的匣，其耦合至開關閥66 (見 圖6)的印表機上游。也有貯槽92供泵62從匣96抽出墨 水。參考圖6詳細描述印表機射流系統。簡言之，墨水從 -10- 201022045 罐60流經上游墨水管線84而至開關閥66，且流至印表機 導管142上。如圖5所示’當設置有匣96時，泵62 (被 馬達196驅動）可將墨水抽進液晶聚合體（LCP )模組64 (見圖6、圖17-20)，使得列印頭積體電路68(再度參 考圖6、圖17-2 0 )被毛細作用塡注。泵62所多抽出的墨 水被饋給至貯槽92，該貯槽92容置在墨水罐60。 因爲所用接點的數目，所以匣接點1 〇 4和印表機接點 φ 22之間的全部連接器力相對地高。在所示的實施例中，全 部的接點力是45牛頓，此荷重足以使匣撓曲變形。暫時 參考圖30，其顯示底盤模組100的內部構造。圖3所示的 支承表面28示意地顯示在圖30中。以箭頭代表印表機接 點作用在匣接點104上的壓縮荷重，同樣地，以箭頭代表 在支承表面28的反作用力。爲維持匣96的構造整體性， 底盤模組1〇〇具有結構性構件30，其在連接器力的平面延 伸。爲了保持反作用力作用在連接器力的平面內，底盤也 φ 具有接觸肋32，其抵壓著支承表面28。此將結構性構件 30上的荷重保持完全地壓縮，以使匣的勁性最大化，並使 任何的撓性最小化。 列印引擎管線 列印引擎管線是印表機處理接收自外部來源並輸出至 列印頭供列印之列印資料的參考。2004年1 2月20日申請 之USSN 1 1/014769 ( RRC001US )案中詳細描述列印引 擎管線，茲將該內容倂入做參考。 -11 - 201022045 射流系統 傳統的印表機依賴列印頭、匣、和墨水管線內的構造 和組件，以避免射流問題。一些共通的射流問題爲未塡注 的或乾掉的噴嘴、排氣的泡泡產物、和因交互污染而顏色 混合。避免這些問題之印表機組件的最佳化設計是，射流 控制的被動方法。通常，噴嘴致動器本身是用於改善這些 缺點的唯一主動組件，但是在企圖改善這些問題時，此常 @ 常不足夠，且/或浪費許多墨水。因爲供給列印頭積體電 路之墨水導管的長度和複雜性，所以該問題在頁寬列印頭 更嚴重。 藉由發展出供印表機用的主動射流系統，申請人已解 決此問題。USSN 11/677049案（我們的案號爲SBF 006US )詳細描述了數個此等系統，茲將其內容倂入做參考。圖 6顯示主動流射系統之單一泵實施例其中之一，其適合使 用在本說明書所述之列印頭。 @ 圖6所示的流射結構是只供一種顏色用的單一墨水管 線。彩色印表機具有供每一顏色墨水用的分離管線（和當 然分離的墨水罐60)。如圖6所示，此結構具有在LCP 模組64下游的單一泵62、和在LCP模組64上游的開關 閥66。LCP模組藉由黏性積體電路附接膜174 (見圖25 ) 支撐列印頭積體電路68。無論什麼時候關掉印表機的電源 ，開關閥66都會將墨水罐60內的墨水和列印頭積體電路 68相隔離。此防止在列印頭積體電路68的任何顏色混合 -12- 201022045 於非做動期間到達墨水罐60。這些議題在交互參考的 USSN 11/677049案（我們的案號爲SBF 006US)說明書中 有更詳細的討論。 墨水罐60具有排出氣泡點壓力調節器72，其用以維 持噴嘴處墨水內相對恆定的流體靜力負壓力。在共同申請 (co-pending)之 USSN 1 1 /6403 5 5 案（我們的案號爲 RMC00 7US)內，更廣泛地描述墨水庫內的氣泡點壓力調 φ 節器’茲將該案倂入做參考。但是爲了此描述，將調節器 72顯示成氣泡出口 74，該氣泡出口 74浸在罐60之墨水 中且藉由密封的導管76通氣至大氣，該導管76延伸至空 氣入口 78。當列印頭積體電路68消耗墨水時，罐60內的 壓力下降，直到在氣泡出口 74的壓力差將空氣吸入罐內 。此空氣在墨水內形成氣泡，該氣泡上升至罐的頭部空間 。此壓力差是氣泡點壓力，且將取決於氣泡出口 74的直 徑（或最小的尺寸）和在該出口處墨水彎液面的拉普拉斯 • 壓力。該拉普拉斯壓力會阻止空氣進入。 氣泡點調節器使用氣泡點壓力，以保持出口處的流體 靜力壓力大致恆定（當空氣的凸出彎液面形成氣泡且上升 至墨水罐內的頭部空間時，有些微的波動）。該氣泡點壓 力是於浸在墨水中之氣泡出口 74產生氣泡所需要的。如 果出口處的流體靜力壓力在氣泡點，則不管罐內墨水已被 消耗了多少，墨水罐內的流體靜力壓力分布圖（pressure profile )也已知。當墨水位準下降至該出口時，罐內墨水 表面處的壓力會朝氣泡點壓力減少。當然，一旦暴露了出 -13- 201022045 口 74 ’則頭部空間連通至大氣，且負壓力消失。在墨水位 準到達氣泡出口 74以前，應再塡充墨水罐、或更換（如 果該墨水罐是匣型式）。 墨水罐60可爲能再充塡的固定庫、可更換的匣、或 (如倂入做參考之RRC 001 US所揭露的）可再充塡的匣。 爲了防範微粒積垢，墨水罐60的出口 80具有粗的過濾器 82。在耦合至列印頭卡匣處，系統也使用細的過濾器。因 爲過濾器具有有限的壽命，所以藉由簡單的更換墨水匣或 列印頭匣來更換過濾器，對使用者特別地方便。如果過濾 器是分離的可消耗物件，則有賴使用者的勤勉以定期更換 當氣泡出口 74處在氣泡點壓力，且開關閥66打開時 ，則噴嘴處的流體靜力壓力也恆定且小於大氣壓力。但是 如果開關閥66已關閉一段時間，則排氣的氣泡可形成在 LCP模組64或列印頭1C 68中，其改變噴嘴處的壓力。201022045 * IX. INSTRUCTION DESCRIPTION 1 Technical Field of the Invention The present invention relates to a printer, and more particularly to an inkjet printer. [Prior Art] Applicants have developed a wide range of printers that use a pagewidth printhead instead of a conventional reciprocating printhead design. The page width design increases the print rate, 0 because the print head does not have to traverse the page to reciprocate to deposit a list of images. Page Width The print head simply deposits ink on the media because it moves at high speed. These printheads have been capable of performing full color 1 600 dpi printing at a rate of about 60 pages per minute, which is not available with conventional inkjet printers. Printing at this rate will quickly consume ink, which can cause problems with sufficient ink supply to the print head. Not only is the flow rate high, but the page width printhead must distribute ink along its entire length as compared to feeding the ink to a relatively small reciprocating print head. A circuit-integrated printhead is typically attached to the ink manifold using a viscous film. It is desirable to optimize this attachment process to provide a printhead assembly with the most water ink leakage. SUMMARY OF THE INVENTION In a first aspect, the present invention provides a printhead assembly comprising a molded ink manifold having a plurality of ink outlets defined within a manifold 201022045 bonding surface; one or more prints a header integrated circuit having one or more ink inlets defined in the print head bonding surface; and an adhesive film sandwiched between the manifold bonding surface and the one or more columns Between the printhead bonding surfaces, the film has a plurality of ink supply apertures defined therein, each ink supply aperture being aligned with the ink outlet and the ink inlet, wherein at least the manifold bonding surface comprises a polymeric coating, the polymeric coating The layer plugs the gap in the molded ink manifold. The first aspect of the printhead assembly advantageously minimizes ink leakage by plugging the micromolded slits within the molded ink manifold. Optionally, the gaps are useless gaps created by the molding process used to fabricate the ink manifold. Even with high tolerance molding tools, some useless microscopic gaps are often inevitable. Optionally, the manifold bonding surface is substantially flat because the polymer coating plugs the gaps. The flat manifold engaging surface advantageously minimizes ink leakage through the molding gaps in the bonding surface.选择性 Optionally, the molded ink manifold is coated with the polymer coating as a whole. Therefore, all the slits in the molded ink manifold (including the internal slits between the respective ink supply flow paths) can be plugged. Optionally, the polymeric coating is selected from the group of polymers consisting of polyimine, polyester, epoxy, polytetrafluoroethylene, decane, and liquid crystal polymers. The polymer coating is typically different than the polymer used to form the molded ink manifold. Optionally, the polymeric coating comprises an inorganic or organic additive, one or more of the following characteristics are provided by -6 - 201022045, including wettability*, adhesive strength, and scratch resistance. ability. Thus, in addition to the primary function of the polymeric coating to plug the gap, the polymeric coating can advantageously have a variety of functions, such as the ruthenium particles can be incorporated into the polymeric coating to improve durability, scratch resistance, And wettability, etc. Optionally, the polymeric coating is applied to the molded ink manifold by dipping, spray coating, or spin coating. Φ Optionally, the complex print head integrated circuits are contiguously end to end along the longitudinal extent of the ink supply manifold. The applicant of the present application has described this configuration for manufacturing a print head in the cross-reference patent and patent application filed hereby incorporated by reference. Optionally, the complex print head integrated circuit defines a pagewidth printhead. Optionally, a plurality of ink inlets are defined along the ink supply channels extending longitudinally of the printhead bonding surface. Optionally, the plurality of ink supply apertures align one ink supply channel, each of the plurality of ink supply apertures being longitudinally spaced along the ink supply channel. In a second aspect, a page width printer is provided comprising a stationary print head assembly as described above. In a third aspect, a molded ink manifold for an inkjet printhead having a manifold bonding surface for attaching one or more printhead integrated circuits is provided, Each of the print head integration circuits receives ink from one or more ink outlets defined in the bonding surface, wherein 'at least the manifold bonding surface comprises a polymer coating' that is plugged with the polymer coating A gap in the molded ink manifold. 201022045 In a fourth aspect, a method of manufacturing a printhead assembly is provided, the method comprising the steps of: (a) providing a molded ink manifold having the attached ink manifold for attaching one or more a manifold bonding surface of a multi-stack integrated circuit 'the bonding surface having a plurality of ink outlets defined therein' having a plurality of slits created by a molding process; (b) coating with a polymer coating At least the manifold joins the surface, thereby plugging the gaps; and _(c) bonding one or more printhead integrated circuits to the manifold bond surface. Optionally, the manifold bonding surface is substantially flat because the polymer coating plugs the gaps. Optionally, the coating step coats the molded ink manifold as a whole with the polymer coating. Optionally, the polymeric coating plugs an internal gap defined between each of the ink supply channels within the ink manifold. n Optionally, the polymeric coating is selected from the group of polymers consisting of polyimide, polyester, epoxy, polytetrafluoroethylene, decane, and liquid crystal polymers. Optionally, the polymeric coating comprises an inorganic or organic additive for providing one or more of the following characteristics, including wettability, adhesive strength, and scratch resistance. Optionally, the coating step comprises: dipping, spray coating, or spin coating any. -8- 201022045 Optionally, the coating step utilizes a polymer coating solution comprising an organic solvent. Optionally, the coating step is controlled to provide a polymeric coating having a predetermined thickness. The thickness of the polymer coating can be controlled by parameters such as immersion time and viscosity of the polymer. Optionally, the bonding step comprises: bonding an adhesive film to the manifold bonding surface; and Φ bonding the print head integrated circuit to the adhesive film. Optionally, the adhesive film is a laminated film' which comprises a central polymeric film sandwiched between the first and second adhesive layers. In a fifth aspect, a combined printhead assembly is provided, comprising one or more printhead integrated circuits coupled to a manifold bond surface of a molded ink supply manifold, wherein the The tube bonding surface comprises a polymer coating which is plugged into a plurality of slits 0 in the molded ink manifold. [Embodiment] Fig. 1 shows a printer 2 embodying the present invention. The main body 4 of the printer supports the media feed tray 14 at the rear and the pivoting surface 6 at the front. Figure 1 shows the pivoting face 6 closed so that the display screen 8 is in its upright viewing position. The control button 10 extends from the side of the screen 8 to allow the operator to input while viewing the screen. For printing, a single sheet is withdrawn from the stack 12 of feed trays 14 and fed through a printhead (hidden in the printer). -9- 201022045 The printed sheet 16 is conveyed through the printed medium exit slot 18. Figure 2 shows the pivoting front 6 open to reveal the interior of the printer 2. t Open the front of the printer and expose the print head 匣96 that is set inside. The print head cartridge 96 is fixedly positioned by the 匣 engaging cam 20. The cam 20 pushes the print head 匣 96 downward to ensure that the ink coupler (described later) is fully engaged and the print head integrated circuits (ICs) (described later) are correctly positioned to the adjacent paper feed path. The cam 20 is manually actuated by the release lever 24. The front face 6 cannot be closed, and therefore the printer cannot be operated until the release lever 24 is pushed down @ to fully engage the cam. The pivoting face 6 is closed to engage the printer contact 22 with the splicing point 104. Figure 3 shows that the pivoting face 6 of the printer 2 is open and the printhead 匣 96 is removed. Since the pivoting face 6 is inclined forward, the user can pull the release lever 24 upward to release the engagement of the cam 20. This allows the handle 26 on the catch 96 to be pulled up. The upstream ink coupler 11 2A and the downstream ink coupler 11 2B are separated from the catheter 142 of the printer, as will be described in more detail below. Perform the reverse steps to install unused new ones. The new raft is shipped and sold in an unrecognized ❹ state, so in order to prepare the printer for printing, the active jet system (described below) uses a downstream pump to inject the sputum and print head with ink. In Figure 4, the outer casing of the printer 2 has been removed to reveal its interior. The large ink tank 60 has four separate reservoirs for all four different inks. The ink tank 60 itself is a replaceable cassette that is coupled upstream of the printer of the switching valve 66 (see Figure 6). There is also a sump 92 for pump 62 to draw ink from 匣96. The printer jet system is described in detail with reference to FIG. Briefly, ink flows from the -10-201022045 tank 60 through the upstream ink line 84 to the switching valve 66 and to the printer conduit 142. As shown in Figure 5, when 匣96 is provided, pump 62 (driven by motor 196) draws ink into liquid crystal polymer (LCP) module 64 (see Figures 6, 17-20), causing the print head The integrated circuit 68 (again with reference to Fig. 6, Fig. 17-2 0) is referred to by capillary action. The ink drawn from the pump 62 is fed to the sump 92, which is housed in the ink tank 60. Because of the number of contacts used, all of the connector forces between the contacts 1 〇 4 and the printer contacts φ 22 are relatively high. In the illustrated embodiment, the total contact force is 45 Newtons, which is sufficient to deflect the 匣 deflection. Referring briefly to Figure 30, the internal construction of the chassis module 100 is shown. The bearing surface 28 shown in Figure 3 is shown schematically in Figure 30. The compression load acting on the splicing point 104 is represented by an arrow, and likewise the reaction force on the support surface 28 is represented by an arrow. To maintain the structural integrity of the crucible 96, the chassis module 1 has a structural member 30 that extends in the plane of the connector force. In order to maintain the reaction force acting in the plane of the connector force, the chassis also has contact ribs 32 which press against the support surface 28. This keeps the load on the structural member 30 fully compressed to maximize the stiffness of the crucible and minimize any flexibility. Print engine pipeline The print engine pipeline is a reference for the printer to process print data that is received from an external source and output to the printhead for printing. The print engine pipeline is described in detail in USSN 1 1/014769 (RRC001US), filed on February 20, 2004, the disclosure of which is incorporated herein by reference. -11 - 201022045 Jet Systems Traditional printers rely on the construction and components in the printhead, cymbal, and ink lines to avoid jet problems. Some common jet problems are unfilled or dry nozzles, bubble products of the exhaust, and color mixing due to cross-contamination. The optimized design of the printer components to avoid these problems is a passive method of jet control. In general, the nozzle actuator itself is the only active component for improving these shortcomings, but this is often not enough and/or wasted a lot of ink when attempting to improve these problems. This problem is more severe in page width printheads because of the length and complexity of the ink conduits supplied to the printhead integrated circuit. The applicant has solved this problem by developing an active jet system for printers. USSN 11/677049 (our case number is SBF 006US) describes several of these systems in detail and the contents are hereby incorporated by reference. Figure 6 shows one of the single pump embodiments of an active flow system suitable for use with the printheads described herein. @ The flow pattern shown in Figure 6 is a single ink line for only one color. The color printer has a separation line (and an ink tank 60 that is naturally separated) for each color ink. As shown in FIG. 6, this configuration has a single pump 62 downstream of the LCP module 64 and a switching valve 66 upstream of the LCP module 64. The LCP module supports the print head integrated circuit 68 by a viscous integrated circuit attachment film 174 (see Fig. 25). Whenever the power to the printer is turned off, the on-off valve 66 isolates the ink in the ink tank 60 from the print head integrated circuit 68. This prevents any color mixing -12-201022045 at the printhead integrated circuit 68 from reaching the ink tank 60 during the non-action. These issues are discussed in more detail in the cross-referenced USSN 11/677049 (our case number is SBF 006US). The ink tank 60 has a discharge bubble point pressure regulator 72 for maintaining a relatively constant hydrostatic negative pressure within the ink at the nozzle. In the case of co-pending USSN 1 1 /6403 5 5 (our case number is RMC00 7US), the bubble point pressure adjustment in the ink reservoir is more widely described. For reference. For purposes of this description, however, regulator 72 is shown as a bubble outlet 74 that is immersed in the ink of canister 60 and vented to the atmosphere by a sealed conduit 76 that extends to air inlet 78. When the print head integrated circuit 68 consumes ink, the pressure in the can 60 drops until the pressure difference at the bubble outlet 74 draws air into the can. This air forms bubbles in the ink which rise to the head space of the can. This pressure differential is the bubble point pressure and will depend on the diameter (or smallest dimension) of the bubble outlet 74 and the Laplace pressure of the ink meniscus at the outlet. This Laplace pressure will prevent air from entering. The bubble point regulator uses the bubble point pressure to keep the hydrostatic pressure at the outlet substantially constant (slight fluctuations when the convex meniscus of the air forms bubbles and rises to the head space in the ink tank). This bubble point pressure is required for bubble generation at the bubble outlet 74 immersed in the ink. If the hydrostatic pressure at the outlet is at the bubble point, the hydrostatic pressure profile within the ink tank is known regardless of how much ink has been consumed in the tank. When the ink level drops to the exit, the pressure at the surface of the ink in the tank decreases toward the bubble point. Of course, once the -13-201022045 port 74' is exposed, the head space is connected to the atmosphere and the negative pressure disappears. The ink tank should be refilled or replaced (if the tank is in the 匣 type) before the ink level reaches the bubble outlet 74. The ink tank 60 can be a refillable fixed bank, a replaceable cartridge, or a refillable cartridge (as disclosed in RRC 001 US, incorporated herein by reference). In order to prevent particulate deposits, the outlet 80 of the ink tank 60 has a thick filter 82. The system also uses a thin filter at the coupling to the print head cartridge. Since the filter has a limited life, it is particularly convenient for the user to replace the filter by simply replacing the ink cartridge or the print head cartridge. If the filter is a separate consumable item, it depends on the user's diligence to periodically replace when the bubble outlet 74 is at the bubble point pressure, and the on-off valve 66 is open, then the hydrostatic pressure at the nozzle is also constant and less than atmospheric pressure. . However, if the switching valve 66 has been closed for a period of time, air bubbles from the exhaust may be formed in the LCP module 64 or the print head 1C 68, which changes the pressure at the nozzle.

同樣地，因每日溫度變化而致氣泡的膨脹和收縮，可改變 G 開關閥66下游墨水管線84內的壓力。類似地，在非做動 期間，因爲自溶液跑出的溶解氣體，所以墨水罐內的壓力 會改變。 從LCP 64至泵62的下游墨水管線86可包括墨水感 應器88，該墨水感應器88連接至用於泵的電子控制器90 。感應器88感測下游墨水管線86內是否有墨水存在。在 另一實施例中，系統可設有感應器88，且可將泵62建構 成就每一不同作業運轉適當的期間。此可能因增加墨水浪 -14- 201022045 費而不利地影響作業成本。 ' 泵62饋給進入貯槽92 (當以向前的方向泵送時）。 貯槽92物理性地定位在印表機內，以比列印頭1C 68位 在較低的位置。此允許下游墨水管線86內的墨水柱在待 命期間懸吊在LCP 64，藉此在列印頭LCP 64處產生流體 靜力負壓力。在噴嘴處的負壓力將墨水彎液面向內抽且禁 止顔料混合。當然，蠕動性泵62需停止在打開狀態，以 φ 使LCP 64和貯槽92內之墨水出口之間呈流體連通。 在非作動期間，在不同顔料之墨水管線之間會有壓力 差。再者，在噴嘴板上的紙灰麈或其他微粒，會將墨水從 一噴嘴毛細吸引至另一噴嘴。藉由每一墨水管線間之些微 壓力差的驅動，在印表機非作動時，會發生顔料混合。開 關閥66將墨水罐60和列印頭1C 68的噴嘴相隔離，以防 止顏料混合的情形向上延伸至墨水罐60。一旦墨水罐內的 墨水受到不同顏料的污染，是不能恢復的，且必須更換。 • 蓋體94是列印頭維護站，其在待命期間將噴嘴密封 ，以避免列印頭1C 68脫水，且蓋體94遮蔽噴嘴板以防 止紙灰塵和其他微粒。也將蓋體94建構成用以擦拭噴嘴 板，以移除已乾燥的墨水和其他污染物。當墨水溶劑（通 常是水）蒸發時，會發生列印頭1C 68脫水，且增加墨水 的黏性。如果墨水黏性太高，則墨水噴射致動器難以噴射 墨水液滴。萬一蓋體密封產生洩漏，則在關掉電源或待命 期間之後再作動印表機時，已脫水的噴嘴是個問題。 上述的問題在印表機的作業壽命期間並非不常見，且 -15- 201022045 其可由圖6所示相對簡單的射流結構有效地改善。該射& 結構亦允許使用者初始地塡注印表機、在移除該射流結構 前先停止塡注印表機、或使用簡單的排解疑難協定將印表 機恢復至已知的列印預備狀態。在上述參考案USSN 11 /6 77049 (我們的案號SBF00 6US)中，詳細描述數個 這些狀況的例子。 列印頭匣 列印頭匣96顯示在圖7至圖16A中。圖7顯示匣96 在其組合和完整的形態。匣的區塊被包覆在匣底座100和 底座蓋102之間。底座100的窗口暴露匣接點104，該等 匣接點1 04接收來自印表機中列印引擎控制器的資料。 圖8和9顯示匣96扣合在保護套98上。保護套98 防止對電性接點1 04和列印頭1C 68 (見圖1 0 )的損害接 觸。使用者能抓住匣96的頂部，並在裝設到印表機內之 前才移除保護套98。 圖1 0顯示列印頭匣96的下側和背部（相對於紙饋給 方向）。列印頭接點1 04是在可撓印刷電路板1 〇 8上的傳 導性墊，該可撓印刷電路板圍繞著弧形支撐表面（在下文 關於LCP模組的描述中討論），而至列印頭1C 68 —側的 —列導線接合1 1 0。列印頭IC 6 8另一側是紙遮罩1 〇 6， 以預防和媒介基板直接接觸。 圖1 1顯示列印頭匣96的下側和前側。匣的前側具有 在二端的二墨水耦合器112A、112B，每一墨水耦合器具 201022045 有四個匣閥114。當匣設置在印表機內時，墨水耦合器 * 1 12A、112B嚙合相配合的墨水供給介面（下文更詳細描 述）。墨水供給介面具有印表機導管142，其嚙合並打開 匣閥114。其中之一的墨水耦合器11 2A是上游墨水耦合 器，而其他的是下游耦合器112B。上游耦合器112A建立 列印頭1C 68和墨水供給源60 (見圖6 )之間的流體連通 ，而下游耦合器112B則連接至貯槽92 (見圖6)。 φ 圖12顯示列印頭匣96的各種視圖。匣96的平面視 圖也顯示圖1 4、1 5、1 6所示之剖面視圖的位置。 圖13是匣96的分解立體圖。LCP模組64附接至匣 底座100的下側。可撓印刷電路板108附接至LCP模組 64的下側，且圍繞一側以暴露列印頭接點1 〇4。入口歧管 及過濾器116和出口歧管118附接至底座100的頂部。入 口歧管及過濾器116藉由彈性連接器120連接至LCP入口 122，同樣地，LCP出口 124藉由另一組彈性連接器120 φ 連接至出口歧管1 18。底座蓋102從頂部包覆底座1〇〇內 的入口和出口歧管，且可移除的保護套98扣合在底部， 以保護接點1 04和列印頭1C (見圖1 1 )。 入口及過濾器歧管 圖1 4是沿著圖1 2之線1 4_ 1 4的放大視圖，其顯示經 由上游耦合器112A的其中一個匣閥114至LCP模組64 的流體路徑。匣閥114具有彈性套筒126，其被偏壓進入 和固定閥構件128密封嚙合的狀態。印表機導管142 (見 -17- 201022045 圖16 )藉由壓縮彈性套筒126使其離開固定閥構件128而 打開匣閥114，且允許墨水沿著入口及過濾器歧管116的 ^ 頂部向上流至頂部通道138，該頂部通道138導通至上游 過濾器室132。上游過濾器室132具有由過濾器薄膜130 所界定的一壁部。墨水通過過濾器薄膜130進入下游過濾 器室134，且流出至LCP入口 122。已過濾之墨水從LCP 入口 122沿著LCP主通道136饋給進入列印頭ic (未示 )。 β 現在參考圖15描述入口及過濾器歧管116的特殊構 造特徵和優點。圖15的分解立體圖最適於例示入口及過 濾器歧管U6的袖珍設計。有多方面的設計幫助達成該袖 珍形式。首先，匣閥靠在一起地配置，此係藉由脫離自行 密封墨水閥的傳統結構而達成。以前的設計也使用彈性構 件偏壓進入與固定構件密封嚙合，但是彈性構件不是實心 形狀（墨水繞其流動）就是隔膜形式（墨水流經隔膜）。 在匣耦合器中，匣閥很方便在安裝時就自動地打開， @ 此藉由耦合器而最容易且最便宜地提供。在該耦合器，一 個閥具有彈性構件，該彈性構件被剛性構件嚙合在另一個 閥上。如果彈性構件呈膈膜形式，則其經常在張力作用下 貼抵中央剛性構件。此提供有效率的密封，且要求相對低 的公差。但是此亦要求彈性元件具有廣的周圍安裝。彈性 體的寬度在所欲的耦合力、密封的整體性、和所用彈性體 的材料性質之間折衷。 如圖16所清楚顯示者，本發明的匣閥114使用彈性 -18- 201022045 套筒126，其在殘留壓力作用下，壓抵固定閥構件128而 ' 密封。當匣設置在印表機內且印表機閥142的導管末端 148進一步壓縮套筒126時，閥114被打開。套環146解 除固定閥構件128的密封，以將LCP 64連接進入印表機 射流系統（見圖6)，經由上游和下游墨水耦合器112A、 112B。將套筒的側壁建構成向外凸出，因爲向內變形會造 成流動障礙。如圖16所示，套筒126具有環繞其中段的 φ 一線相對脆弱部，以促進及引導挫曲步驟。此減少將匣嚙 合於印表機所需的力，且確保套筒向外挫曲。 將耦合器建構成解除匣和印表機的耦合時無滴液，當 從印表機相上拉匣時，彈性套筒126推套環146以壓抵固 定閥構件128而將其密封。一旦套筒126已密封閥構件 128 (藉此密封耦合器的匣側），密封套環146和匣一起 上升，此解除套環146和導管末端148的密封。當密封被 破壞時，橫越套環和導管末端148之間的空隙形成墨水彎 • 液面。固定閥構件128之末端的形狀引導彎液面朝其底部 表面的中間前進，而非形成一點。在固定閥構件1 2 8之圓 形底部的中間，彎液面被迫和現在幾乎水平的底部表面分 離。爲了獲得可能的最低能量狀態，表面張力驅使彎液面 脫離固定閥構件128。使彎液面表面積最小化的偏壓是強 的’所以該分離很完全，且幾乎沒有（如果有的話）墨水 殘留在匣閥114上。任何殘留的墨水，不足以在拋棄匣之 B丨J形成會滴漏或沾污的液滴。 當新的匣設置在印表機內時，導管150內的空氣會被 -19- 201022045 挾帶進入墨水流152內，且被匣所吸納。有鑑於此，入口 歧管和過濾器組合體具有高氣泡容許量。往回參考圖15, 墨水流經固定閥構件128的頂部，，且流入頂部通道138 。做爲入口歧管116的最高點，頂部通道可捕捉（收集） 氣泡。但是氣泡仍然會流入過濾器入口 158。在此情況中 ，過濾器組合體本身可容許氣泡。 在過濾器膜130上游側上的氣泡會影響流率，氣泡有 效率地減少過濾器膜130之髒側上的濕潤表面積。過濾器 膜具長矩形狀，所以即使相當可觀數目的氣泡被抽入過濾 器的髒側，還保留足夠大的濕潤表面積以所要求的流率過 濾墨水。此對本發明所提供之高速率作業很重要。 當上游過濾器室132內的氣泡不能橫越過過濾器膜 130時，因加熱除去氣體而致的氣泡，會在下游過濾器室 134內產生氣泡。過濾器出口 156位在下游過濾器室134 的底部，且和上游過濾器室132內的入口 158呈斜對角， 以使氣泡在任一室內對流率的影響最小化。 供每一顏料用的過濾器膜130直立且緊密地並列疊積 。分隔壁162局部地界定在一側上的上游過濾器室132’ 且局部地界定在另一側上鄰接顏料的下游過濾器室134。 因爲過濾器室很薄（因袖珍設計），所以過濾器膜1 3 0能 被推抵住下游過濾室134的相對壁。此有效率地減少過濾 器膜130的表面，因此其不利於使流率最大化。爲了預防 此現象，下游過濾器室134的該相對壁具有一系列的間隔 肋160，以保持膜130和壁分離。 201022045 將過濾器入口和出口設置在斜對角落，也可在系統的 ' 起始塡注期間，幫助清除系統的空氣。 爲了減少微粒污染列印頭的風險，在下一分隔壁162 熔接至第一分隔壁之前，過濾器膜130先熔接至第一分隔 壁的下游側。以此方式，在熔接製程期間折斷的任何過濾 器膜130小片，都是在過濾器膜130的「髒」側上。Similarly, the pressure in the ink line 84 downstream of the G-switch valve 66 can be varied due to the expansion and contraction of the bubble due to daily temperature changes. Similarly, during non-actuation, the pressure inside the ink tank changes because of the dissolved gas that escapes from the solution. The downstream ink line 86 from the LCP 64 to the pump 62 can include an ink sensor 88 that is coupled to an electronic controller 90 for the pump. The sensor 88 senses the presence of ink in the downstream ink line 86. In another embodiment, the system can be provided with an inductor 88 and the pump 62 can be constructed to achieve a suitable period of operation for each different job. This may affect the operating cost by increasing the ink wave -14- 201022045. The pump 62 feeds into the sump 92 (when pumping in the forward direction). The sump 92 is physically positioned within the printer at a lower position than the print head 1C 68. This allows the ink column within the downstream ink line 86 to be suspended at the LCP 64 during standby, thereby creating a hydrostatic negative pressure at the printhead LCP 64. The negative pressure at the nozzle draws the ink meniscus inward and prevents pigment mixing. Of course, the peristaltic pump 62 needs to be stopped in an open state to provide fluid communication between the LCP 64 and the ink outlets in the sump 92. There is a pressure differential between the ink lines of different pigments during non-action. Furthermore, paper ash or other particles on the nozzle plate will draw ink from one nozzle capillary to the other. By the slight differential pressure between each ink line, pigment mixing occurs when the printer is not operating. The on-off valve 66 isolates the ink tank 60 from the nozzles of the print head 1C 68 to prevent the pigment mixing from extending up to the ink tank 60. Once the ink in the ink tank is contaminated with different pigments, it cannot be recovered and must be replaced. • The cover 94 is a printhead maintenance station that seals the nozzle during standby to avoid dewatering of the printhead 1C 68, and the cover 94 shields the nozzle plate from paper dust and other particulates. The cover 94 is also constructed to wipe the nozzle plate to remove dried ink and other contaminants. When the ink solvent (usually water) evaporates, the print head 1C 68 dehydrates and increases the viscosity of the ink. If the ink viscosity is too high, it is difficult for the ink jet actuator to eject ink droplets. In the event of a leak in the cover seal, the dewatered nozzle is a problem when the printer is turned off after the power is turned off or during standby. The above problems are not uncommon during the life of the printer, and -15-201022045 can be effectively improved by the relatively simple jet structure shown in FIG. The shot & structure also allows the user to initially inject the printer, stop the printer before removing the jet structure, or restore the printer to a known print using a simple troubleshooting protocol Ready state. An example of several of these conditions is described in detail in the above-referenced USSN 11 /6 77049 (our case number SBF00 6US). The print head 匣 print head 匣 96 is shown in Figures 7 to 16A. Figure 7 shows the 匣96 in its combination and intact morphology. The block of the crucible is wrapped between the crucible base 100 and the base cover 102. The window of the base 100 exposes the splicing points 104, which receive data from the print engine controller in the printer. Figures 8 and 9 show that the 匣 96 is snapped onto the protective cover 98. The protective cover 98 prevents damage to the electrical contacts 104 and printhead 1C 68 (see Figure 10). The user can grasp the top of the cymbal 96 and remove the protective cover 98 before installing it into the printer. Figure 10 shows the lower side and back of the print head cartridge 96 (relative to the paper feed direction). The print head contact 104 is a conductive pad on the flexible printed circuit board 1 〇 8 that surrounds the curved support surface (discussed below in the description of the LCP module) to The print head 1C 68 - the side-column wire is joined to 1 1 0. The other side of the print head IC 6 8 is a paper mask 1 〇 6 to prevent direct contact with the media substrate. Figure 11 shows the underside and front side of the print head cartridge 96. The front side of the crucible has two ink couplers 112A, 112B at the two ends, and each ink coupling device 201022045 has four helium valves 114. When the crucible is placed in the printer, the ink coupler * 1 12A, 112B engages the mating ink supply interface (described in more detail below). The ink supply interface has a printer conduit 142 that engages and opens the helium valve 114. One of the ink couplers 11 2A is the upstream ink coupler, and the other is the downstream coupler 112B. The upstream coupler 112A establishes fluid communication between the printhead 1C 68 and the ink supply source 60 (see Figure 6), while the downstream coupler 112B is coupled to the sump 92 (see Figure 6). φ Figure 12 shows various views of the print head cartridge 96. The plan view of 匣96 also shows the position of the cross-sectional view shown in Figures 14, 4, and 16. FIG. 13 is an exploded perspective view of the crucible 96. The LCP module 64 is attached to the underside of the cymbal base 100. The flexible printed circuit board 108 is attached to the underside of the LCP module 64 and surrounds one side to expose the print head contacts 1 〇4. An inlet manifold and filter 116 and outlet manifold 118 are attached to the top of the base 100. The inlet manifold and filter 116 are coupled to the LCP inlet 122 by a resilient connector 120, and similarly, the LCP outlet 124 is coupled to the outlet manifold 1 18 by another set of resilient connectors 120 φ. The base cover 102 covers the inlet and outlet manifolds in the base 1 from the top, and a removable protective sleeve 98 snaps over the bottom to protect the contacts 104 and the print head 1C (see Figure 11). Inlet and Filter Manifold Figure 14 is an enlarged view along line 1 4 - 14 of Figure 12 showing the fluid path through one of the helium valves 114 of the upstream coupler 112A to the LCP module 64. The weir valve 114 has an elastomeric sleeve 126 that is biased into a state of sealing engagement with the fixed valve member 128. The printer conduit 142 (see -17-201022045, Figure 16) opens the helium valve 114 by compressing the elastomeric sleeve 126 away from the fixed valve member 128 and allowing ink to pass up the inlet and the top of the filter manifold 116. Flows to the top channel 138, which is conducted to the upstream filter chamber 132. The upstream filter chamber 132 has a wall portion defined by the filter membrane 130. The ink passes through the filter membrane 130 into the downstream filter chamber 134 and out to the LCP inlet 122. The filtered ink is fed from the LCP inlet 122 along the LCP main channel 136 to the print head ic (not shown). β The specific construction features and advantages of the inlet and filter manifold 116 will now be described with reference to FIG. The exploded perspective view of Figure 15 is best suited to illustrate the compact design of the inlet and filter manifold U6. There are many aspects of design to help achieve this pocket form. First, the helium valves are placed together, which is achieved by the conventional structure of the self-sealing ink valve. Previous designs have also used elastic members to bias into sealing engagement with the stationary member, but the resilient member is either not solid (the ink flows around it) or the diaphragm (the ink flows through the diaphragm). In the 匣 coupler, the 匣 valve is easily opened automatically during installation, @ which is the easiest and cheapest to provide by the coupler. In the coupler, a valve has an elastic member that is engaged by the rigid member on the other valve. If the elastic member is in the form of a aponeurizing film, it often abuts against the central rigid member under tension. This provides an efficient seal and requires relatively low tolerances. However, this also requires a wide surrounding installation of the elastic element. The width of the elastomer is a compromise between the desired coupling force, the integrity of the seal, and the material properties of the elastomer used. As clearly shown in Fig. 16, the helium valve 114 of the present invention uses an elastic -18-201022045 sleeve 126 which is pressed against the fixed valve member 128 under residual pressure to 'seal. When the crucible is disposed within the printer and the catheter end 148 of the printer valve 142 further compresses the sleeve 126, the valve 114 is opened. Collar 146 releases the seal of fixed valve member 128 to connect LCP 64 into the printer jet system (see Figure 6) via upstream and downstream ink couplers 112A, 112B. The side walls of the sleeve are constructed to project outwardly because the inward deformation creates a flow barrier. As shown in Figure 16, the sleeve 126 has a φ line of relatively fragile portions around the midsection thereof to facilitate and guide the buckling step. This reduction will force the force required to engage the printer and ensure that the sleeve is deflected outward. When the coupler is constructed to uncouple the printer from the printer, there is no dripping. When pulled from the printer phase, the elastic sleeve 126 pushes the collar 146 to press against the fixed valve member 128 to seal it. Once the sleeve 126 has sealed the valve member 128 (by thereby sealing the crotch side of the coupler), the seal collar 146 and the weir rise together, which releases the seal of the collar 146 and the catheter tip 148. When the seal is broken, the gap between the collar and the end 148 of the conduit forms an ink bend level. The shape of the end of the fixed valve member 128 guides the meniscus toward the middle of its bottom surface rather than forming a point. In the middle of the rounded bottom of the fixed valve member 1 28, the meniscus is forced to separate from the now almost horizontal bottom surface. In order to obtain the lowest possible energy state, the surface tension drives the meniscus out of the fixed valve member 128. The bias that minimizes the surface area of the meniscus is strong' so the separation is complete and there is little, if any, ink remaining on the helium valve 114. Any residual ink is not enough to form a droplet that will drip or stain when it is discarded. When a new crucible is placed in the printer, the air in the duct 150 is carried by the -19-201022045 into the ink stream 152 and is absorbed by the crucible. In view of this, the inlet manifold and filter assembly have a high bubble tolerance. Referring back to Figure 15, the ink flows through the top of the fixed valve member 128 and into the top channel 138. As the highest point of the inlet manifold 116, the top channel captures (collects) bubbles. However, the bubble will still flow into the filter inlet 158. In this case, the filter assembly itself can tolerate air bubbles. The bubbles on the upstream side of the filter membrane 130 affect the flow rate, and the bubbles effectively reduce the wetted surface area on the dirty side of the filter membrane 130. The filter membrane has a long rectangular shape so that even a significant amount of air bubbles are drawn into the dirty side of the filter, leaving a sufficiently large wetted surface area to filter the ink at the desired flow rate. This is important for the high rate operation provided by the present invention. When air bubbles in the upstream filter chamber 132 cannot traverse the filter membrane 130, air bubbles due to heat removal of the gas may generate bubbles in the downstream filter chamber 134. The filter outlet 156 is at the bottom of the downstream filter chamber 134 and is diagonally opposite the inlet 158 in the upstream filter chamber 132 to minimize the effect of air bubbles on the convection rate in either chamber. The filter film 130 for each pigment is erected and closely juxtaposed. The dividing wall 162 partially defines an upstream filter chamber 132' on one side and partially defines a downstream filter chamber 134 that abuts the pigment on the other side. Because the filter chamber is thin (due to pocket design), the filter membrane 130 can be pushed against the opposite wall of the downstream filter chamber 134. This effectively reduces the surface of the filter membrane 130, so it is disadvantageous in maximizing the flow rate. To prevent this, the opposing wall of the downstream filter chamber 134 has a series of spaced ribs 160 to keep the membrane 130 and wall apart. 201022045 Set the filter inlet and outlet in diagonally opposite corners to help clear the system's air during the system's initial injection. In order to reduce the risk of particles contaminating the print head, the filter film 130 is first welded to the downstream side of the first partition wall before the next partition wall 162 is welded to the first partition wall. In this manner, any of the filter membranes 130 that are broken during the welding process are on the "dirty" side of the filter membrane 130.

φ LCP模組/可撓印刷電路板/列印頭1C 圖17-33顯示LCP模組64、可撓印刷電路板108、和 列印頭1C 68組合體。圖17是附接有可撓印刷電路板108 和列印頭1C 68之LCP模組64的下側透視圖。LCP模組 64經由埋頭孔166、168固定至匣底座1〇〇。孔168是橢 圓形孔，以適應在熱膨脹係數方面的未匹配，而不必彎曲 LCP。列印頭1C 68端對端地配置在沿著LCP模組64縱 向的線上。可撓印刷電路板1 08導線接合在列印頭1C 68 φ 的一邊緣。可撓印刷電路板108也固定至在列印頭1C邊 緣和在匣接點1 04邊緣的LCP模組。將可撓印刷電路板的 兩邊緣固定，以使可撓印刷電路板緊緊地保持在弧形支撐 表面17〇(見圖19)。此確保可撓印刷電路板不會以比特 定最小的半徑更緊地彎曲，藉此降低穿過可撓印刷電路板 之傳導性軌跡折斷的風險。 圖18是圖17所示***區塊A的放大視圖。其顯示沿 著可撓印刷電路板1 〇 8之側邊的導線接合接點1 64線、和 列印頭IC68的線。 201022045 圖19是LCP模組/可撓印刷電路板/列印頭1C組合體 的立體分解圖，其顯示每一組件的下側。圖20是另一分 解立體圖，此次顯示各組件的上側。LCP模組64具有密 封至其下側的液晶聚合體（LCP )通道模組1 76。列印頭 1C 68藉由黏性1C附接膜174附接至通道模組176下側。 在LCP通道模組176上側的是LCP主通道184。這些連通 至LCP模組64中的墨水入口 122和墨水出口 124。在 LCP主通道184底部處的是墨水供給流道182，其連通至 列印頭1C 68。黏性1C附接膜1 74具有一系列雷射鑽出供 給孔1 86，所以每一列印頭1C 68的附接側和墨水供給流 道182呈流體連通。下文將參考圖31至33詳細描述黏性 1C附接膜的構造特徵。 LCP模組64具有凹部1 78，以容置可撓印刷電路板 108上之驅動電路中的電子組件180。爲了最佳的電性效 率和作業，可撓印刷電路板1 08上匣接點1 04應靠近列印 頭1C 68。但是爲了保持鄰接列印頭的紙路徑是直的而不 是弧形或彎曲，匣接點104需要在匣96的側面上。在可 撓印刷電路板內的傳導性路徑稱爲軌跡。當可撓印刷電路 板必須繞著角落彎曲時，軌跡會產生裂痕且破壞連接。爲 了解決此問題，軌跡在該彎曲處之前需先分叉，然後在該 彎曲處之後再會合。如果分叉段的分支產生裂痕，則由其 他的分支保持連接。不幸的是，將軌跡一分爲二然後再結 合在一起，會增加電磁干擾問題，此問題在電路中產生雜 訊。 -22- 201022045 將軌跡變寬一點並非有效的解決之道，因爲較寬的軌 * 跡並未大幅提昇防止裂痕的能力。一旦軌跡內開始產生裂 痕，裂痕會相對地快且容易地傳播遍及整個寬度。小心控 制彎曲半徑可更有效使軌跡裂痕最小化，此可使橫越過可 撓印刷電路板之彎曲處的軌跡數目最小化。 頁寬列印頭出現額外的複雜性，因爲必須在相對短時 間內發射大陣列的噴嘴。一次發射許多噴嘴，使得系統承 Φ 受大的電流負荷。此可經由電路產生高位準的電感，其會 造成電壓驟降，而電壓驟降不利於作業。爲了避免此問題 ，可撓印刷電路板具有一系列電容，其在噴嘴發射順序期 間放電，以將電流負荷釋放在其餘的電路上。因爲需要保 持通過列印頭1C之紙路徑是直的，傳統的方式是將電容 附接至匣側面上之接點附近的可撓印刷電路板上。不幸的 是，電容產生額外的軌跡，該等軌跡增加可撓印刷電路板 之彎曲區段產生裂痕的風險。φ LCP Module / Flexible Printed Circuit Board / Print Head 1C Figures 17-33 show an LCP module 64, a flexible printed circuit board 108, and a print head 1C 68 assembly. 17 is a bottom perspective view of the LCP module 64 with the flexible printed circuit board 108 and the print head 1C 68 attached. The LCP module 64 is secured to the crucible base 1 via countersunk holes 166,168. The aperture 168 is an elliptical aperture to accommodate mismatch in thermal expansion coefficient without having to bend the LCP. The print head 1C 68 is disposed end to end along a line along the longitudinal direction of the LCP module 64. The flexible printed circuit board 108 is wire bonded to an edge of the print head 1C 68 φ. The flexible printed circuit board 108 is also attached to the LCP module at the edge of the print head 1C and at the edge of the splicing point 104. The edges of the flexible printed circuit board are secured so that the flexible printed circuit board is held tightly against the curved support surface 17 (see Figure 19). This ensures that the flexible printed circuit board does not bend more tightly with a minimum radius of the bit, thereby reducing the risk of breaking through the conductive track of the flexible printed circuit board. Figure 18 is an enlarged plan view of the insertion block A shown in Figure 17. It shows the wires joining the contacts 1 64 lines and the print head IC 68 along the sides of the flexible printed circuit board 1 〇 8 . 201022045 Figure 19 is an exploded perspective view of the LCP module/flexible printed circuit board/print head 1C assembly showing the underside of each component. Fig. 20 is another exploded perspective view showing the upper side of each component this time. The LCP module 64 has a liquid crystal polymer (LCP) channel module 176 sealed to its underside. The print head 1C 68 is attached to the underside of the channel module 176 by a viscous 1C attachment film 174. On the upper side of the LCP channel module 176 is the LCP main channel 184. These are connected to the ink inlet 122 and the ink outlet 124 in the LCP module 64. At the bottom of the LCP main channel 184 is an ink supply flow path 182 that communicates to the print head 1C 68. The viscous 1C attachment film 1 74 has a series of laser drilled supply holes 186 such that the attachment side of each of the print heads 1C 68 is in fluid communication with the ink supply flow path 182. The structural features of the viscous 1C attachment film will be described in detail below with reference to Figs. The LCP module 64 has a recess 1 78 for receiving electronic components 180 in the drive circuitry on the flexible printed circuit board 108. For optimum electrical efficiency and operation, the flexible contact printed circuit board 108 should be close to the print head 1C 68. However, in order to keep the paper path adjacent to the printhead straight rather than curved or curved, the splicing point 104 needs to be on the side of the cymbal 96. The conductive path within the flexible printed circuit board is referred to as the trajectory. When a flexible printed circuit board has to be bent around a corner, the trajectory can crack and break the connection. To solve this problem, the trajectory needs to be forked before the bend and then rejoined after the bend. If the branches of the bifurcation segment are cracked, the other branches remain connected. Unfortunately, splitting the track into two and then combining them increases the electromagnetic interference problem, which creates noise in the circuit. -22- 201022045 Widening the trajectory is not an effective solution, as the wider track does not significantly increase the ability to prevent cracks. Once cracks begin to appear in the trajectory, the cracks propagate relatively quickly and easily throughout the width. Careful control of the bend radius minimizes trajectory cracking, which minimizes the number of traces across the bend of the flexible printed circuit board. The page width printhead presents additional complexity because large arrays of nozzles must be launched in a relatively short time. Many nozzles are fired at one time, causing the system to withstand large current loads. This can result in a high level of inductance through the circuit, which can cause a voltage dip, and a voltage dip is not conducive to the operation. To avoid this problem, the flexible printed circuit board has a series of capacitors that discharge during the nozzle firing sequence to release the current load on the remaining circuitry. Since it is necessary to keep the paper path through the print head 1C straight, the conventional method is to attach a capacitor to the flexible printed circuit board near the joint on the side of the crucible. Unfortunately, the capacitors create additional tracks that increase the risk of cracking in the curved sections of the flexible printed circuit board.

• 藉由將電容180 (見圖20)安裝成緊密鄰接列印頭1C 68以減少軌跡破裂的機會，可解決上述問題。藉由將電容 和其他組件容置在LCP模組64的凹部內，可將紙路徑保 持線性。列印頭1C 68和紙遮罩172安裝至匣96之前面 (相對於饋給方向），其下游之可撓印刷電路板108的相 對平坦表面使卡紙的風險降至最低。 將接點和可撓印刷電路板的其餘組件隔離，可使延伸 經過彎曲區段的軌跡數目最小化。此可增加可靠度，因爲 其減少發生裂痕的機會。將電路組件設置在列印頭1C旁 -23- 201022045 邊’意涵匣需要較寬的邊緣，且此不利於袖珍設計。但是 此結構所提供的優點，比稍微寬之匣的任何缺點更重要。 ^ 首先’接點可較大，因爲沒有來自組件的軌跡行經各接點 之間和圍繞各接點。因爲具有較大的接點，所以連接較可 靠’且更能夠處理匣接點和印表機側之接點間的製造不準 確問題。此問題在本案特別重要，因爲依賴使用者準確地 將匣***以匹配接點。 第二，導線接合至列印頭1C側面之可撓印刷電路板 n 的邊緣，未受有殘留應力且不會試著自彎曲半徑剝離。可 撓印刷電路板被固定至電容和其他組件處的支撐構造，所 以在製造期間較容易形成至列印頭1C的導線連接，且當 其未被用於固定可撓印刷電路板時較不易產生裂痕》 第三，電容更靠近列印頭1C的噴嘴，所以放電電容 所產生的電磁干擾降至最小。 圖2 1是列印頭匣96之下側的放大圖，其顯示可撓印 刷電路板1 08和列印頭1C 68。可撓印刷電路板1 〇8的導 φ 線接合接點164，平行於在黏性1C附接膜174之下側上的 列印頭1C 68的墊。圖22顯示除去圖21的列印頭1C 68 和可撓印刷電路板，以顯露供給孔1 86。該等孔配置成四 縱向列，每一列輸送一種特殊顏色的墨水，且每一列對齊 在每一列印頭1C背後的單一通道。 圖23顯示除去黏性1C附接膜174之LCP通道模組 176的下側。此暴露墨水供給流道182，其連接至形成在 通道模組176另一側內的LCP主通道184 (見圖20)。應 -24- 201022045 瞭解當黏性1C附接膜1 74黏附至定位時，其局部界定供 給流道1 82。也應瞭解附接膜必須準確地定位，因爲個別 的供給流道182必須和雷射鑽穿膜174的供給孔186對齊 〇 圖24顯示除去LCP通道模組之LCP模組的下側，此 暴露陣列的肓穴部200。當以墨水塡注匣時，盲穴部200 含有空氣’以阻尼任何壓力脈衝。此於下文更詳細討論。 列印頭1C附接膜 雷射切除膜 暫時參考圖31至33,更詳細描述黏性1C附接膜。膜 174被雷射鑽穿且捲繞在捲筒198上，以方便倂入列印頭 匣96內。爲了處理和儲存，膜174在任—側有二保護襯 料（典型爲聚對苯二甲酸二乙酯（PET )襯料其中之 —是現有襯料188B，其在雷射穿孔之前就附接至膜；另 # 一保護襯料是置換襯料192，其在鑽孔作業之後取代現有 襯料1 88A。 顯示在圖32之雷射鑽削膜174的區段，移除一些現 有襯料188B以暴露供給孔186。在膜另一側上的置換襯 料192’是在雷射鑽出供給孔ι86之後取代現有襯料ι88Α 〇 圖33A至33C詳細顯示如何藉由射切除法來製造膜 174。圖33A詳細顯示在雷射鑽孔之前，膜的積層構造。 中央腹板190典型爲聚醯亞胺膜且提供積層所需的強度。 -25- 201022045 腹板190夾在第一和第—黏劑層1 94A和ι 94b之間，黏劑 層典型爲環氧樹脂層。第一黏劑層194八用於結合至液晶· 聚合體通道模組1 76。第二黏劑層1 94B用於結合至列印 頭積體電路68。第—黏劑層194 a的熔點溫度通常比第二 黏劑層194B的熔點溫度低至少1(Γς。如同下文更詳細的 描述’此溶化溫度的差異改善列印頭積體電路附接製程的 控制’且結果改善膜174在使用中的效能。 爲了儲存和處理膜’以襯料188A和188B分別覆蓋每 魯 —黏劑層194A和194B。中央腹板19〇的厚度典型爲2〇 至100微米（通常約爲50微米）。每—黏劑層194A和 194B的厚度典型爲1〇至5〇微米（通常約爲25微米）。 參考圖33B’從襯料188A所界定之膜的側面執行雷 射鑽削。孔1 86鑽穿第一襯料1 88A、環氧樹脂層i94A及 194B、和中央腹板19〇。孔186在襯料ι88]Β內某處終止 ’所以襯料188B可比襯料i88A厚（例如襯料188A可爲 10-20微米厚’襯料188B可爲3〇_1〇〇微米厚）。 _ 然後移除在雷射進入側上的有孔襯料1 8 8 A，並以置 換襯料192取代，以提供圖33c所示的膜封裝。然後將膜 封裝纏繞在捲筒198 (見圖31)上，以在附接之前先儲存 和處理。當組合列印頭匣時，從捲筒198拉出適當長度、 移除親料、並將膜174附接至液晶聚合體通道膜組丨76的 下側’使得孔186對準正確的墨水供給流道182 (見圖25 )° 雷射鑽削是用於在聚合體膜內界定孔的標準方法。雷 -26- 201022045 射鑽削的問題在於鑽削位置內和周圍會沉積含炭的煙灰 197(見圖33B和33C)。可容易處理在保護性襯料周圍 的煙灰，因爲在雷射鑽削後經常會置換襯料。但是沉積在 實際供給孔1 86內和周圍的煙灰1 97，有潛在性的問題。 在結合期間，當膜被壓縮在液晶聚合體通道膜組176和列 印頭積體電路68之間時，煙灰可被移位。任何被移位的 煙灰197代表一種手段。顆粒可藉由該手段進入墨水供給 系統，且潛在性地阻塞列印頭積體電路68內的噴嘴。再 者，煙灰非常地快速，且無法藉由習知的超音波和/或異 丙醇（IPA )洗滌技術移除。 從雷射鑽削膜174的分析，本案申請人已觀察到煙灰 197通常呈現在膜174的雷射進入側（亦即環氧樹脂層 194A和中央腹板190 )，但是通常不會出現在膜174的雷 射出口側（亦即環氧樹脂層1 94B )。 • 雙通過雷射切除膜 在2008年3月17日申請的第US 12/04937 1號美國 申請案（其內容倂入本文做參考）中，申請人描述雙通過 雷射切除的墨水供給孔186消除大部份的煙灰沉積197, 包括在膜之雷射進入側上的煙灰沉積197。雙通過雷射切 除用的起始點是顯示在圖33 A中的膜。• The above problem can be solved by mounting the capacitor 180 (see Figure 20) in close proximity to the print head 1C 68 to reduce the chance of trajectory cracking. The paper path can be kept linear by accommodating capacitors and other components within the recesses of the LCP module 64. The print head 1C 68 and the paper cover 172 are mounted to the front face of the cymbal 96 (relative to the feed direction), and the relatively flat surface of the flexible printed circuit board 108 downstream thereof minimizes the risk of paper jams. Isolating the contacts from the rest of the flexible printed circuit board minimizes the number of tracks that extend through the curved section. This increases reliability as it reduces the chance of cracking. Setting the circuit components next to the print head 1C -23- 201022045 The edge means that a wider edge is required, which is not conducive to the pocket design. However, the advantages offered by this structure are more important than any disadvantage of being slightly wider. ^ First, the contacts can be larger because there are no traces from the components passing between and around the contacts. Because of the larger contacts, the connection is more reliable and more capable of handling manufacturing inaccuracies between the contacts of the splicing and printer sides. This issue is particularly important in this case because it relies on the user to accurately insert 匣 to match the joint. Second, the wire is bonded to the edge of the flexible printed circuit board n on the side of the print head 1C without being subjected to residual stress and does not try to peel off from the bending radius. The flexible printed circuit board is fixed to the support structure at the capacitor and other components, so that it is easier to form the wire connection to the print head 1C during manufacturing, and is less prone to be produced when it is not used to fix the flexible printed circuit board. Cracks Third, the capacitor is closer to the nozzle of the print head 1C, so the electromagnetic interference generated by the discharge capacitor is minimized. Figure 21 is an enlarged view of the lower side of the print head cartridge 96 showing the flexible printed circuit board 108 and the print head 1C 68. The conductive φ line of the flexible printed circuit board 1 接合 8 is joined to the contact 164, parallel to the pad of the print head 1C 68 on the lower side of the viscous 1C attachment film 174. Figure 22 shows the removal of the print head 1C 68 and the flexible printed circuit board of Figure 21 to reveal the supply apertures 186. The holes are arranged in four longitudinal columns, each column conveying a particular color of ink, and each column is aligned with a single channel behind each of the print heads 1C. Figure 23 shows the underside of the LCP channel module 176 with the viscous 1C attachment film 174 removed. This exposed ink supply flow path 182 is coupled to the LCP main channel 184 (see Figure 20) formed in the other side of the channel module 176. It should be understood that when the viscous 1C attachment film 1 74 is adhered to the position, it partially defines the supply flow path 182. It should also be understood that the attachment film must be accurately positioned because the individual supply flow path 182 must be aligned with the supply aperture 186 of the laser drilled through film 174. Figure 24 shows the underside of the LCP module with the LCP channel module removed, this exposure The crotch portion 200 of the array. When spotted with ink, the blind spot 200 contains air ' to dampen any pressure pulses. This is discussed in more detail below. Print Head 1C Attachment Film Laser Cut-Off Film Referring briefly to Figures 31 through 33, the viscous 1C attachment film is described in more detail. The film 174 is drilled through the laser and wound onto a roll 198 for easy entry into the print head 匣96. For processing and storage, the film 174 has a second protective lining on the side-side (typically a polyethylene terephthalate (PET) lining therein - which is the existing lining 188B that is attached to the laser prior to perforation Membrane; another # a protective lining is a replacement lining 192 that replaces the existing lining 1 88A after the drilling operation. Shown in the section of the laser drilling film 174 of Figure 32, some of the existing lining 188B is removed. The supply aperture 186 is exposed. The replacement liner 192' on the other side of the membrane replaces the existing liner ι88 after the laser drills the supply aperture ι86. Figures 33A through 33C show in detail how the membrane 174 can be fabricated by shot cutting. Figure 33A shows in detail the laminated construction of the film prior to laser drilling. The central web 190 is typically a polyimide film and provides the strength required for lamination. -25- 201022045 The web 190 is sandwiched between the first and the first The adhesive layer is typically an epoxy layer between the agent layers 1 94A and ι 94b. The first adhesive layer 194 is used for bonding to the liquid crystal polymer channel module 1 76. The second adhesive layer 1 94B is used for Bonded to the print head integrated circuit 68. The melting temperature of the first adhesive layer 194a is generally higher than the second viscosity The melting point temperature of layer 194B is at least 1 (Γς. As described in more detail below, 'this difference in melting temperature improves the control of the printhead integrated circuit attachment process' and results in improved film 174 performance in use. The treatment film' covers each of the adhesive layers 194A and 194B with linings 188A and 188B, respectively. The thickness of the central web 19 turns is typically from 2 Å to 100 microns (typically about 50 microns). Each adhesive layer 194A and The thickness of 194B is typically from 1 〇 to 5 〇 microns (typically about 25 microns). Laser drilling is performed from the side of the film defined by lining 188A with reference to Figure 33B'. Hole 186 is drilled through the first lining 1 88A , epoxy layer i94A and 194B, and central web 19〇. Hole 186 terminates somewhere in the lining ι88]Β so the lining 188B can be thicker than the lining i88A (for example, the lining 188A can be 10-20 microns thick The lining 188B can be 3 〇 1 〇〇 micron thick. _ The perforated lining 1 8 8 A on the laser entry side is then removed and replaced with a replacement lining 192 to provide the arrangement shown in Figure 33c. Film package. The film package is then wrapped around a roll 198 (see Figure 31) for storage and prior to attachment. When the head cartridge is combined, the proper length is pulled from the reel 198, the parent is removed, and the film 174 is attached to the underside of the liquid crystal polymer channel film stack 76 so that the holes 186 are aligned correctly. Ink supply flow path 182 (see Figure 25) ° Laser drilling is a standard method for defining holes in a polymer film. Ray-26- 201022045 The problem with shot drilling is the deposition of charcoal in and around the drilling location. Ash 197 (see Figures 33B and 33C). The soot around the protective lining can be easily handled because the lining is often replaced after laser drilling. However, the soot 97 deposited in and around the actual supply aperture 186 has potential problems. During bonding, the soot can be displaced as the film is compressed between the liquid crystal polymer channel film set 176 and the printhead integrated circuit 68. Any displaced soot 197 represents a means. Particles can enter the ink supply system by this means and potentially block the nozzles within the printhead integrated circuit 68. Moreover, soot is very fast and cannot be removed by conventional ultrasonic and/or isopropanol (IPA) washing techniques. From the analysis of the laser-drilled film 174, the Applicant has observed that the soot 197 is typically present on the laser entry side of the film 174 (i.e., the epoxy layer 194A and the central web 190), but typically does not appear in the film. The laser exit side of 174 (ie, epoxy layer 1 94B). • The dual application of the laser-removed ink supply aperture 186 by the laser in the U.S. Patent Application Serial No. U.S. Patent Application Serial No. Most of the soot deposits 197 are eliminated, including soot deposits 197 on the laser entry side of the membrane. The starting point for dual laser removal is the film shown in Figure 33A.

在第一步驟中，第一孔185是雷射從襯料188A所界 定之膜的側面鑽削而成。孔185鑽穿襯料188A、環氧樹 脂層194A及194B、和中央腹板190。孔185在襯料188B -27- 201022045 內某處終止。第一孔185的尺寸小於所欲墨水供給孔186 。第一孔185的每一長度和寬度尺寸通常比所欲墨水供給 · 孔186的長度和寬度尺寸小約10微米。從圖34A可看到 ，第一孔185有煙灰197沉積在第一襯料188A、第一環 氧樹脂層194A、和中央腹板190上。 在第二步驟中，再以雷射鑽削將第一孔185鑽孔擴大 (絞孔），以提供具有所欲尺寸的墨水供給孔186。鑽孔 擴大的製程產生非常少的煙灰，且結果的墨水供給孔186 φ 因此具有如圖3 4B所示的乾淨側壁。 最後，並參考圖34C，用置換襯料192取代第一襯料 188A以提供膜封裝。膜封裝預備纏繞至捲筒198上，且 後續用於將列印頭積體電路68附接至液晶聚合體通道膜 組176。如果希望的話。此階段也可置換第二襯料188B。 比較圖33 C和34C所示的膜可瞭解，雙雷射切除法比 單純雷射切除法提供的膜1 74具有更乾淨的墨水供給孔 186。因此，膜更適合用於將列印頭積體電路68附接至液 © 晶聚合體通道膜組1 76，所不會被不想要的煙灰沉積污染 墨水。 列印頭積體電路附接製程 模具附接膜174的改善 參考圖19和20可瞭解，列印頭積體電路附接製程是 列印頭製造的重要階段。在積體電路附接製程中，被雷射 鑽削之膜1 74的第一黏劑表面，剛開始時先黏至液晶聚合 -28- 201022045 體通道膜組1 76的下側，然後列印頭積體電路68結合至 * 膜174之相反的第二黏劑表面。膜174在每一側具有環氧 樹脂黏劑層194A和194B，黏劑層在施加熱和壓力下熔化 和結合。 因爲液晶聚合體通道膜組1 76具有非常差的熱傳導性 ’所以在每一結合製程期間，必須經由膜1 74的第二表面 提供施加熱，該第二表面未接觸液晶聚合體通道模組。 Φ 從每一列印頭積體電路6 8之定位和列印頭積體電路 之供給墨水的兩項觀點，結合製程的控制對於最佳化的列 印頭效能是重要的。使用先前技藝之膜174 (如第US 2007/0206056號美國申請案所描述者，其倂入本文做參考 )附接列印頭積體電路之步騾的典型順序，示意地顯示在 圖35A-D的縱剖面中。參考圖35A，膜174初始地對齊液 晶聚合體通導模組176，所以墨水供給孔186適當地對準 界定在歧管結合表面175中的墨水出口。如上所述，墨水 參 出口採取墨水供給流道182的形式。第一黏劑層194A面 對歧管結合表面175，而保護性襯料188B保護膜的相反 側。 參考圖35B’藉由加熱塊3〇2施加熱和壓力，而將膜 174結合至歧管結合表面175。矽氧樹脂橡膠墊3〇〇將加 熱塊3 02和膜親料188B分離，以防止在結合期間對膜 1 74的任何損壞。在結合期間’加熱第一環氧樹脂層i 94 a 至其熔化溫度’並將其結合至液晶聚合體通道模組丨76的 結合表面175。 -29- 201022045 如圖35C所不，然後將襯料18SB從膜174撕掉，以 顯露第二環氧樹脂層194B。其次，列印頭積體電路68對 · 齊預備用於第二結合步驟的膜174。圖35C例示一些問題 ，該等問題典型地顯示在第~結合步驟中。因爲先前技藝 之膜中的環氧樹脂層194A和194B相同，所以該兩層在第 一結合步驟期間都熔化了。因爲許多理由，所以第二環氧 樹脂層1 94B的熔化是個問題。首先，—些環氧樹脂黏劑 199被從第二環氧樹脂層194B擠壓出來，且沿著雷射鑽 參 削的墨水供給孔1 8 6排列。此減少墨水供給孔丨8 6的面積 ，藉此增加完成之列印頭組合體內的墨水流動阻力。在一 些情況中，墨水供給孔186也可能在結合製程期間變成完 全阻塞，此爲非常不希望的情況。 圖36B顯示其中一個墨水供給孔186遭受「擠出」環 氧樹脂之問題的實際照片。外周圍壁3 1 0顯示雷射鑽削孔 186的原始尺寸。周圍壁310內的淡色材料312是黏劑， 該黏劑是在結合至液晶聚合體通道模組176期間，被擠壓 參 進入墨水供給孔186內。最後，由周圍壁314所界定的中 央黑色區域顯示在結合後，墨水供給孔186的有效截面積 。在此例子中，雷射鑽削之原始墨水供給孔1 86的尺寸爲 400微米χ130微米。在結合且擠出環氧樹脂以後’這些尺 寸減少爲340微米X80微米。除了有增加墨水流動阻力的 重大問題以外，墨水供給孔186之模糊不清的邊緣對第二 結合步驟是個問題，因爲列印頭積體電路6 8必須準確對 齊墨水供給孔186。在自動的列印頭製造中，特定的對齊 -30- 201022045 裝置使用光學組件以定位每一墨水供給孔1 86的質 • 。當每一墨水供給孔186的邊緣因擠壓出的環氧樹 糊不清時，難以確定每一質量中心的光學位置。結 可能產生對齊誤差。 熔化之第二環氧樹脂層1 94B的第二個問題是 喪失一些其整體的構造整合性。結果，膜174傾向 下陷進入界定在液晶聚合體通道模組176中的墨水 φ 道182內。圖35C例示膜174在第一結合步驟之後 部198。本案申請人創造「***（tenting )」一詞 此現象。因爲第二黏劑層194B的結合表面195喪 坦度，所以「***（tenting )」特別地成爲問題。 氧樹脂的「擠出」問題導致第二黏劑層194B內的 化，使得該喪失的平坦度更加惡化。「***」和第 層194B內之厚度變化的組合，減少了其結合表面 接觸面積，且導致在第二結合步驟的問題。 • 在第二結合步驟中，顯示在圖35D內，加熱每 頭積體電路68至約250 °C，然後準確地定位在第二 194B上。列印頭積體電路68準確對齊膜174，確 供給通道218設置在其對應的墨水供給孔186上方 218和噴嘴69呈流體連通。在縱向剖面的圖35D 示一個墨水供給通道218，雖然（從圖25可瞭解） 列印頭積體電路68可具有多列墨水供給通道。 因爲環氧樹脂「擠出」，所以原始厚度約25 第二黏劑層1 94B，在某些區域的厚度可能減少至5 量中心 脂而模 果’更 膜174 鼓起或 供給流 的下陷 以描述 失其平 因爲環 厚度變 二黏劑 195的 一列印 黏劑層 保墨水 :通道 中，顯 ，每一 微米的 〜10微 -31 - 201022045 米。第二黏劑層194 B中厚度的此等大幅變化，會導致列 印頭積體電路歪斜位移，其中，列印頭積體電路68的一 _ 端相對於另一端上升。此情況顯然是不希望出現的，且會 影響列印品質。不平坦之結合表面1 95的另一問題是，通 常需要約5秒之相對長的結合時間，且每一列印頭積體電 路68需要被壓入第二黏劑層194B相對地遠。 在黏劑膜1 74內發生「***」之列印頭組合體所相關 的最重要問題是，膜所提供的密封可能不完美。本案申請 @ 人已硏發一種滲漏測試，以決定列印頭組合體內膜1 74所 提供之密封的效率。在此測試中，先將列印頭組合體浸在 9 0 °C的墨水中一個禮拜。在墨水浸泡和沖洗以後，以1 〇 kPa的空氣塡注列印頭組合體的一個顏料通道，並測量空 氣從該顏料通道滲漏的速率。滲漏的產生可能是因爲空氣 (經由膜174)傳輸至列印頭內其他顏料通道、或因爲空 氣直接喪失至大氣。在此測試中，使用美國公告第US 2007/0206056號案所述之積體電路附接膜而製造的典型列 〇 印頭組合體，具有每分鐘約3 00立方毫米或更大的的滲漏 速率。 鑑於上述問題，申請人已硏發出改良的列印頭積體電 路附接製程，其使該等問題最小化。2008年3月17日申 請的美國第12/049373號案描述改良的列頭積體電路附接 製程，其內容倂入本文做參考。改良的列頭積體電路附接 製程，基本上和圖35A-D相關的上述步驟相同。但是膜 174的設計減少第一結合步驟的相關問題，且同等重要地 -32- 201022045 減少第二結合步驟所相關的連帶問題。膜1 74仍然包含中 ' 央彈性（體）腹板190，其夾在第一和第二黏劑層194A 和194B之間。（爲了方便，膜174的對應零件具有和上 文之描述相同的符號）。但是對照先前的膜設計，膜中的 第一和第二環氧樹脂層194A和194B有區別。特別是環氧 樹脂層194A的熔化溫度比第二環氧樹脂層194B的熔化溫 度至少低1 (TC。熔化溫度的差異通常是至少20 °C或至少 φ 30°C。例如第一環氧樹脂層194A的熔化溫度可在80至 130 °C的範圍內，而第二環氧樹脂層194 B的熔化溫度可在 140至180 °C的範圍內。熟悉技藝者能輕易地選擇滿足這 些準則的黏劑膜（例如環氧樹脂膜）。適合用在積層膜 174內的黏劑膜爲日立（Hitachi)公司的DF-XL9環氧樹 脂膜（具有約120°C的熔化溫度）和日立（Hitachi)公司 的DF-470環氧樹脂膜（具有約16(TC的熔化溫度）。 因此，可控制第一結合步驟（圖35B所例示），以在 φ 將第一黏劑層194A結合至液晶聚合體通道模組176的結 合表面195期間，第二黏劑層194B不會熔化。加熱塊 302的溫度通常匹配第一黏劑層194A的熔化溫度。因此 使第一黏劑層的「擠出」最小化或完全消除。再者，在結 合製程期間，發生最少或沒有「***」。 參考圖3 7A，顯示使用膜174之已結合的液晶聚合體/ 膜組合體。對照圖35C所示的組合體，可看到膜174內已 無發生「***」，且第二黏劑層194B具有均勻的平坦度 和厚度。圖36A顯示在使用膜174結合至液晶聚合體通道 -33 · 201022045 模組1 7 6以後，一個墨水供給孔1 8 6的實際照片。相較於 圖3 6B所示的墨水供給孔，大幅地改善墨水供給孔1 86的 界定，且可以看到沒有發生「擠出」環氧樹脂。因此沒有 不利地增加經過圖3 6 A所示之孔的墨水流動阻力，且可以 最小的誤差執行孔之質量中心的光學位置。 再者，因爲第一結合步驟的相關問題已最小化，所以 第二結合步驟所相關的連帶問題也最小化。如圖3 7 A所示 ，第二黏劑層194B具有平坦的結合表面195，且具有最 小的厚度變化。因此大幅改善列印頭積體電路位移和結合 ，所以可使用約1秒之相對短的結合時間。圖3 7 A所示的 平坦結合表面195，也意涵著列印頭積體電路68不須被壓 入第二黏劑層194B很遠才能提供充分的結合強度，且附 接製程較不可能產生歪斜的列印頭積體電路68。 參考圖37B，由改良之列印頭積體電路附接步驟所產 生的列印頭組合體，具有圍繞每一墨水供給孔186的優良 密封，主要是因爲沒有「***」和環氧樹脂「擠出」的關 係。在申請人的上述滲漏測試中，相較於圖3 5 D所示的列 印頭組合體，圖3 7 B所示的列印頭組合體顯現明顯地 3000摺疊的改善。在浸泡於90 °C墨水中達一個禮拜以後 ，當灌入10 kPa的空氣時’所測得關於圖37B所示之列 印頭組合體的滲漏率爲每分鐘約0.1立方毫米。 液晶聚合體通道模組176的改善 如上所述’積體電路附接製程涉及將雷射鑽削過之膜 -34- 201022045 174的第一黏劑表面’結合至液晶聚合體通道模組176的 下側。然後，將列印頭積體電路6 8結合至膜1 7 4之相反 的第二黏劑表面。雖然膜174中的上述改善幫助使從液晶 聚合體通道模組1 76和列印頭積體電路68間之結合的滲 漏最小化，但是液晶聚合體通道模組1 7 6內的模製不規則 ，仍然會提供不希望出現之墨水滲漏的來源。特別地，液 晶聚合體通道模組1 76內的顯微模製縫隙（例如裂縫、槽 φ 、刻痕、孔等）對液晶聚合體通道模組1 76和列印頭積體 電路6 8之間的密封有不利的影響。這些模製的縫隙是潛 在性的墨水滲漏源。 如圖3 8所示，模製縫隙3 5 0 (爲了清楚，所以誇大地 顯示）可發生在液晶聚合體通道模組176的結合表面和/ 或在各墨水供給流道182之間的內部。在兩種狀況中的任 一種，如果縫隙350沒有被積體電路附接製程塞住或密封 ，則可能發生墨水滲漏和/或顔料混合。 9 圖39顯示一種製程，其中以聚合體塗層352塗覆液 晶聚合體通道模組1 76。在附接任何的列印頭積體電路68 以前，整個液晶聚合體模組64 (包括密封在其下側的液晶 聚合體通道模組176)浸漬在聚合體塗層溶液354中。此 產生被塗覆的液晶聚合體通道模組，其中所有的縫隙350 被聚合體塗層3 52塞住。以聚合體塗層352塞住表面縫隙 ，改善結合表面175的輪廓，該結合表面175結合至黏劑 膜1 7 4的一側。特別地，藉由使表面不平最小化，如圖40 所示的結果已結合列印頭組合體，在液晶聚合體通道模組 -35- 201022045 1 76和黏劑膜1 74之間具有改善的密封。 再者，塞住液晶聚合體通道模組1 76內的內部縫隙， _ 使液晶聚合體通道模組176內各顏料間的相互污染最小化 〇 可使用任何適當的製程（例如浸漬、噴灑塗覆、或旋 轉塗覆），來施加聚合體塗層352。如圖39所示，液晶聚 合體模組64整個浸漬在聚合體塗層溶液中，該溶液包括 分散或溶解在適當溶劑（例如有機溶劑）中的聚合體。在 @ 乾燥、加熱、或暴露至紫外線時，聚合體可硬化。 聚合體塗層可包括任何合適的聚合體，例如聚醯亞胺 、聚酯（譬如PET )、環氧樹脂、聚烯（譬如聚乙烯、聚 丙烯、聚四氟乙烯）、矽氧烷（譬如聚二甲基矽氧烷）、 或液晶聚合體。各聚合體的組合和/或共聚合體也可用作 適合的塗層聚合體。聚合體塗層通常包括和液晶聚合體通 道模組1 76不同的聚合體材料。 再者’可選擇聚合體塗層352、或聚合體塗層352可 ◎ 包含添加物，以提供具有所欲之表面特性的液晶聚合體通 道模組176。例如聚合體塗層可包含黏劑添加物，以改善 對膜174的結合。取代地（或附加地），聚合體塗層可包 含添加物，以改善墨水供給流道的表面特性，例如增加可 濕潤性。取代地（或附加地），聚合體塗層可包含添加物 ，以改善液晶聚合體通道模組】7 6整體的耐用性，例如抗 刮痕添加物（譬如矽顆粒）。 -36- 201022045 促進墨水供給至列印頭1C末端 ' 圖25顯示列印頭1C 68，其重疊在穿透黏性1C附接 膜174的墨水供給孔186上’膜174重疊在LCP通道模組 176下側內的墨水供給通道182上。藉由附接膜174將鄰 接的列印頭1C 68端對端地設置在LCP通道模組176的底 部上。在各鄰接列印頭1C 68的接合處’其中一個IC 68 具有成列噴嘴的「滴下三角形（dr〇P triangle)」206部 φ 。該等噴嘴從其餘噴嘴陣列22〇中的對應列位移，此允許 一個列印頭1C的列印邊緣接續鄰接列印頭1C的列印。藉 由位移噴嘴的滴下三角形206 ’不管各噴嘴是否在相同的 1C上或在不同1C上之接合處的任一側’鄰接噴嘴之間的 間隔都保持不變。此需要鄰接列印頭1C 68的相對精確定 位，且使用基準記號204以達此目標。此製程可能很耗時 間，但可避免在所列印的影像中產生人爲的結果。 不幸的是，相對於其餘陣列220中之噴嘴區塊’一些 噴嘴在列印頭1C 68的末端可能會缺乏墨水。例如噴嘴 222可由二墨水供給孔的墨水供給。墨水供給孔224是最 靠近的。但是如果從噴嘴至孔224的左側有障礙或特別大 的需求，則供給孔226也靠近噴嘴222，所以這些噴嘴不 太可能會發生因缺乏墨水而未塡注的情形。 相對地，如果墨水供給孔216不是供設於相鄰1C 6 8 之間連接處的「額外」墨水供給孔2 1 0之用’則在列印頭 1C 68末端的噴嘴214只和墨水供給孔216呈流體連通。 「具有額外墨水供給孔2 1 0」亦即沒有噴嘴離墨水供給孔 -37- 201022045 太遙遠以致該等噴嘴會有缺乏墨水的風險。 墨水供給孔208 ' 210兩者是由共同的墨水供給流道 212所饋給。墨水供給流道212具有供給二孔的能力，因 爲供給孔208只具有噴嘴至其左側，且供給孔210只具有 噴嘴至其右側。因此，經過供給流道2 1 2的全部流率約略 等於只饋給一個孔的供給流道。 圖25也特寫墨水供給源（四通道）內通道（顏料） 數目和列印頭1C 6 8內五通道2 1 8的不一致。在列印頭I c 6 8背後之第三和第四通道2 1 8，由相同的墨水供給孔1 8 6 供給。這些供給孔被稍微放大，以使兩通道2 1 8間有距離 〇 此原因在於列印頭1C 68是製造供使用於廣範圍的印 表機和列印頭結構。這些可具有五個顏料通道-一青色、洋 紅色、黃色、黑色和紅外（infrared )顏料-…但是其他的 印表機（例如本設計）可只爲四通道印表機，而其餘的仍 然可只爲三通道（青色CC、洋紅色MM'和黃色Y)。有 鑑於此’單一顏料通道可被饋給至列印頭1C通道其中的 兩個通道。列印引擎控制器（PEC )微處理器可容易地將 此適應於被送至列印頭1C的列印資料。再者，供給相同 的顏料至ic內的二噴嘴列，可提供用於死噴嘴（dead nozzle )補償之多餘噴嘴的地位。 壓力脈衝 當流入列印頭的墨水突然停止時，產生尖銳峰値的墨 -38- 201022045 水壓力，此現象會發生在列印工作結束時或在一頁的末端 ' 。由於保管人的高速率，所以頁寬列印頭在作業期間需要 高流率供給墨水。因此，在墨水管線內至噴嘴的墨水質量 相對地大，且以可觀的速率運動。 突然地結束列印工作'或單純地在列印頁的末端，都 要求此相對快速流動的相對高容積墨水立即停止。但是突 然擷取墨水動量會升高墨水管線內的衝擊波。LCP模組64 φ (見圖19)具有特殊勁度，且當管線內的墨水柱進行靜止 時，LCP模組64幾乎沒有提供撓性。由於墨水管線內無 任何順從性，所以衝擊波可超過拉普拉斯壓力（在噴嘴開 口之墨水的表面張力所提供的壓力，其用以將墨水保留在 噴嘴室內），且淹沒列印頭1C 68的前表面。如果噴嘴被 淹沒，則墨水可不噴射，且人爲造成的結果顯現在列印中 〇 當噴嘴發射率和墨水管線的共振頻率匹配時，墨水內 # 會產生共振脈衝。再者，因爲界定墨水管線的勁性構造， 所以用於一種顏色之大部分噴嘴同時發射，會在墨水管線 內產生標準波或共振脈衝。此可導致噴嘴氾濫（或被淹沒 )，或相反地，如果拉普拉斯壓力超過，則因爲在峰値之 後的壓力降，噴嘴未塡注。 爲了解決此問題，LCP模組64併入有脈衝阻尼器， 以從墨水管線移除壓力峰値。阻尼器可爲封閉的氣體容積 ’其可被墨水壓縮。在另一實施例中，阻尼器可爲墨水管 線的柔順性區段，其可彈性地撓區並吸收壓力脈衝。 -39- 201022045 爲了使設計複雜性降至最低並保留袖珍的形式，本發 明使用可壓縮的氣體容積，以阻尼壓力脈衝。以小容積的 氣體可獲得利用氣體壓縮而阻尼壓力脈衝。此保有袖珍設 計，同時避免墨水壓力內瞬間峰値所致的任何噴嘴淹沒。 如圖24和26所示，脈衝阻尼器並不是單一的氣體容 積供墨水內的脈衝壓縮，而是沿著LCP模組64的長度分 布的陣列穴部200。運動經過長形列印頭（例如頁寬列印 頭）的壓力脈衝，可在墨水流動管線內的任何點被阻尼。 @ 但是當脈衝通過列印頭1C內的噴嘴時，不管脈衝是否稍 後在阻尼器處消散，脈衝會使噴嘴被淹沒。藉由將多個脈 衝阻尼器倂入墨水供給導管且緊鄰噴嘴陣列，任何壓力峰 値在其會造成有害淹沒氾濫的地點都會被阻尼。 在圖26中可看到空氣阻尼穴部200配置成四列，每 —列穴部直接位在LCP通道模組176內之LCP主通道184 上方。主通道184內之墨水中的任何壓力脈衝，直接作用 在穴部200內的空氣上，並快速地逸散。 ◎ 列印頭塡注 現在特別參考示於圖27之LCP通道模組176，來描 述塡注匣。藉由從射流系統（見圖6)的泵施加至主通道 出口 232的吸力，墨水會塡注LCP通道模組176。主通道 184被墨水注滿，然後墨水供給流道182和列印頭1C 68 藉由毛細作用自行塡注。 主通道184相對地長且細。再者，如果空氣穴部200 -40- 201022045 是用於阻尼墨水內的壓力脈衝，則空氣穴部200必須保持 ' 未塡注。此對塡注過程可能會有問題，在塡注過程中可藉 由毛細作用而輕易地注滿穴部200、或者主通道184可能 因爲被困住的空氣而無法完全塡注。爲確保LCP通道模組 176完全塡注，主通道184在出口 232之前的下游端具有 壩228。爲確保LCP模組64內的空氣穴部200不塡注， 空氣穴部200具有開口，且開口具有銳利的上游邊緣，以 φ 引導墨水彎液面不向上行經穴部的壁。 參考圖28A、28B和29A至29C詳細描述匣的這些方 面。這些圖示意地例示塡注過程。圖28A、28B顯示如果 沒有壩在主通道內可能會發生的問題，而圖29 A至29 C顯 示壩2 2 8的功能。 圖28A、28B是穿過LCP通道模組176的其中一主通 道184和通道之頂部內空氣穴部200管線的剖面示意圖。 墨水238被抽送經過入口 230，且沿著主通道184的底板 φ 流動。應注意的是前進的彎液面和通道184底板具有陡峭 的接觸角，此使墨水流23 8的前端部略成球狀。當墨水到 達通道184末端時，墨水位準上升，且球狀前端在其餘墨 水流之前先接觸通道的頂部。如圖28B所示，通道184未 能完全塡注，且空氣現在被困住。此空氣袋會保留且干擾 列印頭的作業。墨水阻尼特徵被改變，且空氣可爲墨水障 礙。 在圖29A至29C中，通道184在下游端具有壩228。 如圖29 A所示，墨水流23 8聚集在壩22 8的後面，且朝通 -41 - 201022045 道的頂部上升。壩228在頂部具有銳利邊緣240，做爲彎 液面固定點。前進的彎液面被釘（附著pin )在此錨240 ' ，所以當墨水位準在此頂部邊緣上方時，墨水不會馬上單 純地流過壩2 2 8 » 如圖29B所示，突出的彎液面使墨水上升，直到墨水 注滿通道184至頂部。由於墨水將穴部密封成分離的空氣 袋，所以在壩228處的突出墨水彎液面脫離銳利頂部邊緣 24 0，並塡充通道184的末端及墨水出口 232(見圖29C) φ 。精確定位銳利頂部邊緣240，使得墨水彎液面凸出直到 墨水塡充至通道184的頂部，但是不允許墨水凸出太多以 致墨水接觸末端空氣穴部242的一部分。如果彎液面接觸 且固定至末端空氣穴部2 42的內部，則該末端空氣穴部 242可能被墨水塡注。據此，壩的高度和其在穴部下的位 置是嚴密地被控制。壩228的弧形下游表面，確保沒有進 —步的錨點（anchor point )可允許墨水彎液面跨越間隙 至穴部242。 0 LCP用於保持穴部200未被塡注的另一機構是穴部開 口的上游和下游邊緣。如圖28A、28B和29A至29C所示 ，所有的上游邊緣具有弧形過渡面234而下游邊緣236是 銳利的。沿著通道184頂部前進的墨水彎液面，可釘在銳 利的上游邊緣’然後藉由毛細作用向上運動進入穴部。在 上游邊緣的的過渡表面（特別是弧形過渡表面234)移除 銳利邊緣所提供的強錨點。 類似地’申請人的努力已發現，如果穴部200已被一 -42- 201022045 些墨水不利地塡充，則銳利的下游邊緣236可促進去除塡 ' 注。如果印表機被撞擊、搖動或傾斜，或射流系統因任一 理由而必須逆流，則穴部200可能完全或局部塡注。當墨 水再以其正常的方向流動時，銳利的下游邊緣23 6幫助將 彎液面拉回至自然錨點（亦即銳利角落）。以此方式，運 動墨水彎液面經過LCP通道模組176的管理，是用於正確 地塡注匣的機制。 φ 本文已藉由只做爲例子的方式描述本發明。此領域的 熟悉技藝者可認知未脫離寬廣發明槪念之精神和範圍的變 化和修飾。據此，附圖所描述和顯示的實施例，只能嚴謹 地認爲例示用，而絕非對本發明的限制。 【圖式簡單說明】 參考附圖且藉由只做爲例子的方式描述本發明的各實 施例。附圖爲’· • 圖1是將本發明具體化之印表機的側前方透視圖； 圖2顯示圖1之印表機，且前面在打開位置； 圖3顯示圖2之印表機，且除去列印頭匣； 圖4顯示圖3之印表機’且除去外殼體； 圖5顯示圖3之印表機，且除去外殼體，但安裝有列 印頭匣； 圖6是印表機射流系統的耶意代表； 圖7是列印頭匣的前上方透視圖； 圖8是在其保護套內之列印頭匣的前上方透視圖； -43- 201022045 圖9是除去其保護套之列印頭匣的前上方透視圖； 圖1 0是列印頭匣的前下方透視圖； 圖1 1是列印頭匣的後下方透視圖； 圖1 2顯示列印頭匣各側的視圖； 圖13是列印頭匣的立體分解圖； 圖14是穿過列印頭匣之墨水入口耦合器的橫向剖面 > 圖15是墨水入口和過濾器組合體的分解立體圖； φ 圖16是嚙合有印表機閥之匣閥的剖面視圖； 圖1 7是L C P模組和可撓P C B的透視圖； 圖18是圖17所示***區塊A的放大視圖； 圖1 9是LCP模組/可撓印刷電路板/列印頭1C組合體 的下方立體分解圖； 圖20是LCP模組/可撓印刷電路板/列印頭1C組合體 的上方立體分解圖； 圖21是LCP模組/可撓印刷電路板/列印頭1C組合體 ❿ 之下側的放大視圖： 圖22顯示除去圖2 1的列印頭1C和可撓印刷電路板 後的放大圖； 圖23顯示除去圖22之列印頭1C附接膜後的放大圖 > 圖24顯示除去圖23之LCP通道膜組後的放大圖； 圖25顯示列印頭1C具有重疊在墨水供給流道上之背 面通道和噴嘴； -44- 201022045 圖26是LCP模組/可撓印刷電路板/列印頭1C組合體 * 之橫向放大透視圖； 圖27是LCP通道模組的平面視圖； 圖28A、28B是LCP通道模組無壩時塡注的剖面示意 圖， 圖29A、29B、29C是LCP通道模組具有壩時塡注的 剖面示意圖； φ 圖30是LCP模組具有接觸力和反應力位置的橫向放 大透視圖； 圖31顯示1C附接膜的捲筒； 圖32顯示各襯料之間的1C附接膜的剖面； 圖33A-C是顯示傳統雷射鑽削附接膜之各階段的局部 剖面視圖； 圖34A-C是顯示雙雷射鑽削附接膜之各階段的局部剖 面視圖； Φ 圖35A-D是示意之列印頭積體電路附接製程的縱向剖 面； 圖3 6A和3 6B是在第一結合步驟以後，在兩不同附接 膜內之墨水供給孔的照片； 圖37A和3 7B是示意之列印頭積體電路附接製程的縱 向剖面； 圖38示意地顯示在模製墨水歧管內具有誇大之縫隙 的列印頭積體電路.； 圖39示意地顯示施加聚合體塗層至模製墨水歧管的 -45- 201022045 製程；和 圖40示意地顯示具有已塞住之縫隙的列印頭組合體 【主要元件之符號說明】 2 :印表機 4 :主體 6:樞轉面 _ 8 :顯示螢幕 1 〇 :控制鈕 12 :媒介叠 1 4 :饋給盤 1 6 :已列印片體 18 :出口槽 20 :凸輪 2 2 :接點 參 24 :釋放槓桿 26 :把手 2 8 :支承表面 3 0 :結構性構件 32 :接觸肋 6 0 :墨水罐 62 :泵 64 :液晶聚合體（LCP )模組 -46 - 201022045 66 :關閉閥 ' 68 :列印頭積體電路（1C ) 69 :噴嘴 72 :調節器 74 :氣泡出口 7 6 :密封的導管 78 :空氣入口 _ 80 :出口 82 :過濾器 84 :上游墨水管線 8 6 :下游墨水管線 88 :感應器 90 :電子控制器 92 :貯槽 94 :蓋體 φ 96 :(列印頭）匣 98 :保護套 100 :匣底座（底盤模組） 102 :底座蓋 1 0 4 :匣接點 1 〇 4 :匣接點 1 0 6 :紙遮罩 108 :可撓印刷電路板 1 1 〇 :導線接合 -47 201022045 112A.上游墨水稱合器 1 12B :下游墨水耦合器 ‘ 1 1 4 :匣閥 1 1 6 :入口歧管及過濾器 1 1 8 :出口歧管 120 :彈性連接器 122 :液晶聚合體（LCP )入口（墨水入口） 124 :液晶聚合體（LCP )出口（墨水出口） φ 1 2 6 :彈性套筒 1 2 8 :固定閥構件 1 3 0 :過濾器膜 1 3 2 :上游過濾器室 134 :下游過濾器室 136 :液晶聚合體（LCP )通道 1 3 8 :頂部通道 142 :導管（印表機閥） 〇 146 :套環 148 :導管末端 150 :導管 1 5 2 :墨水流 156 :過濾器出口 1 5 8 :過濾器入口 160 :間隔肋 162 :分隔壁 -48- 201022045 164 :導線接合接點 1 6 6 :埋頭孔 1 6 8 :埋頭孔 170 :弧形支撐表面 1 7 2 :紙遮罩 174 :黏性積體電路（1C)附接膜 175 :歧管結合表面 φ 176 :液晶聚合體（LCP )通道模組 178 :凹部 1 8 0 :電子組件 182 :墨水供給流道 184 :液晶聚合體（LCP )主通道 1 8 5 :第一孔 1 86 :(所欲的墨水供給孔），（雷射鑽出）供給孔 188A :現有襯料 Φ 188B :現有襯料 190 :中央腹板 192 :置換襯料 194A :第一黏劑層 194B :第二黏劑層 1 9 5 ·結合表面 1 9 6 :馬達 1 9 7 :煙灰 1 9 8 :捲筒（下陷部） -49- 201022045 199 ： 壞 氧 樹 200 ： 穴 部 204 ： 基 準 記 206 ： 滴 下 三 208 ： ( 墨 水 210 ： ( 墨 水 212 ： ( 墨 水 214 ： 噴 嘴 216 ： ( 墨 水 2 18： 通 道 220 ： 噴 嘴 陣 222 ： 噴 嘴 224 ： ( 墨 水 226 ： ( 墨 水 228 ： ISls m 230 ： 入 □ 232 ： 主 通 道 234 ： 弧 形 過 23 6 ： 下 游 邊 23 8 : 墨 水 ( 240 : 銳 利 邊 300 : 墊 302 :加熱塊 脂黏 號 角形 )供給孔 )供給孔 )供給流道 )供給孔 列 )供給孔 )供給孔 出口 渡面 緣 流） 緣 201022045In the first step, the first aperture 185 is a laser drilled from the side of the film defined by the lining 188A. Hole 185 is drilled through lining 188A, epoxy resin layers 194A and 194B, and central web 190. Hole 185 terminates somewhere within lining 188B-27-201022045. The first aperture 185 is smaller in size than the desired ink supply aperture 186. Each length and width dimension of the first aperture 185 is typically about 10 microns smaller than the desired length and width dimension of the ink supply aperture 186. As can be seen from Fig. 34A, the first hole 185 has soot 197 deposited on the first lining 188A, the first epoxy resin layer 194A, and the center web 190. In the second step, the first hole 185 is bored (stretched) by laser drilling to provide an ink supply hole 186 having a desired size. The enlarged process of drilling results in very little soot, and the resulting ink supply aperture 186 φ thus has a clean sidewall as shown in Figure 34B. Finally, and referring to Figure 34C, the first liner 188A is replaced with a replacement liner 192 to provide a film package. The film package is pre-wound onto the roll 198 and is subsequently used to attach the printhead integrated circuit 68 to the liquid crystal polymer channel film set 176. If you wish. The second lining 188B can also be replaced at this stage. Comparing the films shown in Figures 33 and 34C, it is understood that the dual laser ablation method has a cleaner ink supply aperture 186 than the membrane 1 74 provided by the simple laser ablation method. Therefore, the film is more suitable for attaching the print head integrated circuit 68 to the liquid crystal channel film set 1 76 without contaminating the ink by unwanted soot deposition. Print Head Integral Circuit Attachment Process Improvements to Die Attachment Film 174 Referring to Figures 19 and 20, the printhead integrated circuit attachment process is an important stage in the manufacture of printheads. In the integrated circuit attachment process, the first adhesive surface of the laser drilled film 1 74 is initially adhered to the lower side of the liquid crystal polymerization -28-201022045 body channel film group 1 76, and then printed. The header integrated circuit 68 is bonded to the opposite second adhesive surface of the * film 174. The film 174 has epoxy resin adhesive layers 194A and 194B on each side, and the adhesive layer is melted and bonded under application of heat and pressure. Because the liquid crystal polymer channel film set 176 has very poor thermal conductivity', during each bonding process, application of heat must be provided via the second surface of the film 174, which is not in contact with the liquid crystal polymer channel module. Φ From the point of view of the positioning of each of the print head integrated circuits 68 and the supply of ink to the print head integrated circuit, the control of the process is important for optimizing the performance of the print head. A typical sequence of steps for attaching a print head integrated circuit is shown schematically in Figure 35A using a prior art film 174 (as described in US Application No. US 2007/0206056, incorporated herein by reference). In the longitudinal section of D. Referring to Figure 35A, film 174 is initially aligned with liquid crystal polymer pass module 176 such that ink supply aperture 186 is properly aligned with the ink outlet defined in manifold bonding surface 175. As described above, the ink inlet port takes the form of an ink supply flow path 182. The first adhesive layer 194A faces the manifold bonding surface 175 and the protective backing 188B protects the opposite side of the film. The film 174 is bonded to the manifold bonding surface 175 by applying heat and pressure to the heating block 3〇2 with reference to Fig. 35B'. The silicone rubber pad 3 分离 separates the heating block 302 from the film parent 188B to prevent any damage to the film 1 74 during bonding. The first epoxy resin layer i 94 a to its melting temperature is heated during bonding and bonded to the bonding surface 175 of the liquid crystal polymer channel module 丨 76. -29- 201022045 As shown in Fig. 35C, the lining 18SB is then peeled off from the film 174 to reveal the second epoxy layer 194B. Next, the print head integrated circuit 68 pairs the film 174 for the second bonding step. Figure 35C illustrates some of the problems that are typically shown in the first to combined steps. Since the epoxy layers 194A and 194B in the prior art film are the same, the two layers are melted during the first bonding step. Melting of the second epoxy resin layer 1 94B is a problem for many reasons. First, some epoxy adhesive 199 is extruded from the second epoxy layer 194B and arranged along the ink supply holes 186 of the laser drill. This reduces the area of the ink supply aperture 86, thereby increasing the resistance to ink flow within the finished printhead assembly. In some cases, the ink supply aperture 186 may also become completely blocked during the bonding process, which is a highly undesirable condition. Fig. 36B shows an actual photograph of one of the ink supply holes 186 suffering from the problem of "extruding" the epoxy resin. The outer peripheral wall 310 shows the original dimensions of the laser drilling hole 186. The light colored material 312 in the surrounding wall 310 is an adhesive that is squeezed into the ink supply aperture 186 during bonding to the liquid crystal polymer channel module 176. Finally, the central black area defined by the surrounding wall 314 shows the effective cross-sectional area of the ink supply aperture 186 after bonding. In this example, the original ink supply aperture 186 for laser drilling is 400 microns χ 130 microns. These dimensions were reduced to 340 microns x 80 microns after bonding and extruding the epoxy. In addition to the significant problem of increasing ink flow resistance, the ambiguous edges of the ink supply aperture 186 are a problem for the second bonding step because the printhead integrated circuit 68 must accurately align the ink supply apertures 186. In automated printhead manufacturing, the specific alignment -30-201022045 device uses optical components to locate the quality of each ink supply port 186. When the edge of each ink supply hole 186 is unclear due to the extruded epoxy, it is difficult to determine the optical position of each center of mass. The junction may have an alignment error. A second problem with the molten second epoxy layer 1 94B is the loss of some of its overall structural integrity. As a result, the film 174 tends to sink into the ink φ 182 defined in the liquid crystal polymer channel module 176. Figure 35C illustrates film 174 after portion 198 of the first bonding step. The applicant in this case created the term “tenting”. Since the bonding surface 195 of the second adhesive layer 194B is smeared, "tenting" is particularly problematic. The "extrusion" problem of the oxyresin causes the inside of the second adhesive layer 194B to deteriorate the flatness of the loss. The combination of the "bump" and the thickness variation in the first layer 194B reduces the bonding surface contact area and causes problems in the second bonding step. • In a second bonding step, shown in Figure 35D, each integrated circuit 68 is heated to about 250 °C and then accurately positioned on the second 194B. The print head integrated circuit 68 accurately aligns the film 174 such that the supply channel 218 is disposed above its corresponding ink supply aperture 186 218 in fluid communication with the nozzle 69. An ink supply channel 218 is shown in Figure 35D in a longitudinal section, although (as can be appreciated from Figure 25) the printhead integrated circuit 68 can have multiple columns of ink supply channels. Because the epoxy resin is "extruded", the original thickness is about 25 second adhesive layer 1 94B. In some areas, the thickness may be reduced to 5 cents of the center fat and the mold is 'more film 174 bulging or the supply stream is depressed. The description loses its flatness because the thickness of the ring becomes two layers of adhesive 195. The ink layer of the adhesive layer: in the channel, is visible, each micron is ~10 micro-31 - 201022045 m. Such a large change in thickness in the second adhesive layer 194B causes a skew displacement of the print head integrated circuit in which one end of the print head integrated circuit 68 rises relative to the other end. This situation is clearly undesirable and can affect print quality. Another problem with the uneven bonding surface 1 95 is that a relatively long bonding time of about 5 seconds is typically required, and each column of the integrated head circuit 68 needs to be pressed relatively far into the second adhesive layer 194B. The most important issue associated with the "bumping" printhead assembly within the adhesive film 1 74 is that the seal provided by the film may not be perfect. The application for this case @人 has issued a leak test to determine the efficiency of the seal provided by the inner membrane 1 74 of the print head assembly. In this test, the print head assembly was first immersed in ink at 90 ° C for one week. After the ink is soaked and rinsed, a pigment channel of the print head assembly is injected with 1 kPa of air and the rate at which air leaks from the pigment channel is measured. Leakage may be caused by air (via membrane 174) being transported to other pigment channels within the printhead, or because air is lost directly to the atmosphere. In this test, a typical tantalum head assembly made using the integrated circuit attachment film described in U.S. Publication No. US 2007/0206056 has a leakage of about 300 cubic millimeters per minute or more. rate. In view of the above, applicants have issued an improved print head integrated circuit attachment process that minimizes such problems. U.S. Patent Application Serial No. 12/049,373, filed on March 17, 2008, which is incorporated herein by reference, is incorporated herein by reference. The improved in-line integrated circuit attachment process is substantially the same as the above-described steps associated with Figures 35A-D. However, the design of the membrane 174 reduces the problems associated with the first bonding step, and equally important -32-201022045 reduces the associated problems associated with the second bonding step. Membrane 1 74 still contains a central elastic (body) web 190 sandwiched between first and second adhesive layers 194A and 194B. (For convenience, the corresponding parts of the film 174 have the same symbols as described above). However, the first and second epoxy layers 194A and 194B in the film differed from the previous film design. In particular, the melting temperature of the epoxy layer 194A is at least 1 lower than the melting temperature of the second epoxy layer 194B (TC. The difference in melting temperature is usually at least 20 ° C or at least φ 30 ° C. For example, the first epoxy resin The melting temperature of layer 194A may range from 80 to 130 ° C, while the melting temperature of second epoxy layer 194 B may range from 140 to 180 ° C. Those skilled in the art can readily select those that meet these criteria. Adhesive film (for example, epoxy film). The adhesive film suitable for use in the laminated film 174 is Hitachi's DF-XL9 epoxy film (having a melting temperature of about 120 ° C) and Hitachi (Hitachi). The company's DF-470 epoxy film (having a melting temperature of about 16 (TC). Therefore, the first bonding step (illustrated in Fig. 35B) can be controlled to bond the first adhesive layer 194A to the liquid crystal polymerization at φ. During the bonding surface 195 of the body channel module 176, the second adhesive layer 194B does not melt. The temperature of the heating block 302 generally matches the melting temperature of the first adhesive layer 194A. Thus "extruding" the first adhesive layer Minimized or completely eliminated. Again, during the combined process With or without "bumping" occurs. Referring to Figure 3A, a bonded liquid crystal polymer/membrane assembly using film 174 is shown. Referring to the assembly shown in Figure 35C, it can be seen that no "uplift" has occurred in film 174. And the second adhesive layer 194B has uniform flatness and thickness. Fig. 36A shows the actual operation of an ink supply hole 186 after the film 174 is bonded to the liquid crystal polymer channel -33 · 201022045 module 176. The photo. Compared with the ink supply hole shown in Fig. 36B, the definition of the ink supply hole 186 is greatly improved, and it can be seen that no "extruding" of the epoxy resin occurs. Therefore, there is no disadvantageous increase in FIG. The ink flow resistance of the hole is shown, and the optical position of the center of mass of the hole can be performed with minimal error. Furthermore, since the problem associated with the first bonding step has been minimized, the associated problem associated with the second bonding step is also minimal. As shown in Fig. 37A, the second adhesive layer 194B has a flat bonding surface 195 and has a minimum thickness variation, thereby greatly improving the displacement and bonding of the print head integrated circuit, so that about 1 can be used. The relatively short bonding time of seconds. The flat bonding surface 195 shown in Fig. 37A also means that the printing head integrated circuit 68 does not have to be pressed into the second adhesive layer 194B to provide sufficient bonding strength. And the attaching process is less likely to produce a skewed print head integrated circuit 68. Referring to Figure 37B, the printhead assembly produced by the improved printhead integrated circuit attachment step has a supply around each ink supply. The excellent sealing of the holes 186 is mainly due to the absence of "bumping" and the "extrusion" of the epoxy resin. In the applicant's above leak test, compared to the print head assembly shown in Fig. 35D, The printhead assembly shown in Figure 3B shows a significant improvement in the 3000 fold. After a week of immersion in ink at 90 ° C, the leak rate of the print head assembly shown in Fig. 37B was measured to be about 0.1 mm 3 per minute when 10 kPa of air was poured. Improvement of Liquid Crystal Polymer Channel Module 176 As described above, the 'integrated circuit attachment process involves bonding the first adhesive surface of the laser-drilled film-34-201022045 174 to the liquid crystal polymer channel module 176. Lower side. Then, the print head integrated circuit 68 is bonded to the opposite second adhesive surface of the film 174. Although the above improvements in the film 174 help minimize leakage from the combination between the liquid crystal polymer channel module 176 and the printhead integrated circuit 68, the molding in the liquid crystal polymer channel module 176 is not The rules will still provide an undesired source of ink leakage. In particular, microscopic molding slits (e.g., cracks, grooves φ, scores, holes, etc.) in the liquid crystal polymer channel module 176 are applied to the liquid crystal polymer channel module 176 and the print head integrated circuit 68. The seal between them has an adverse effect. These molded gaps are potential sources of ink leakage. As shown in Fig. 38, the molding slits 350 (shown exaggerated for clarity) may occur at the bonding surface of the liquid crystal polymer channel module 176 and/or between the respective ink supply channels 182. In either of the two conditions, ink leakage and/or pigment mixing may occur if the slit 350 is not plugged or sealed by the integrated circuit attachment process. 9 Figure 39 shows a process in which a liquid crystal polymer channel module 176 is coated with a polymer coating 352. Prior to attaching any of the print head integrated circuits 68, the entire liquid crystal polymer module 64 (including the liquid crystal polymer channel module 176 sealed on its underside) is immersed in the polymer coating solution 354. This produces a coated liquid crystal polymer channel module in which all of the slits 350 are plugged by the polymer coating 352. The surface gap is blocked by the polymer coating 352 which improves the contour of the bonding surface 175 which is bonded to one side of the adhesive film 174. In particular, by minimizing surface irregularities, the results shown in Figure 40 have been combined with the print head assembly, with improved between the liquid crystal polymer channel module -35-201022045 1 76 and the adhesive film 1 74. seal. Furthermore, the internal gaps in the liquid crystal polymer channel module 176 are plugged, _ minimizing mutual contamination between the pigments in the liquid crystal polymer channel module 176, and any suitable process (e.g., dipping, spray coating) can be used. Or spin coating) to apply the polymer coating 352. As shown in Fig. 39, the liquid crystal polymer module 64 is entirely immersed in a polymer coating solution comprising a polymer dispersed or dissolved in a suitable solvent such as an organic solvent. The polymer can harden when @dried, heated, or exposed to ultraviolet light. The polymeric coating can include any suitable polymer, such as polyimine, polyester (such as PET), epoxy, polyene (such as polyethylene, polypropylene, polytetrafluoroethylene), decane (such as Polydimethyl siloxane, or liquid crystal polymer. Combinations and/or copolymers of the various polymers can also be used as suitable coating polymers. The polymer coating typically comprises a different polymeric material than the liquid crystal polymer channel module 176. Further, the optional polymer coating 352, or polymer coating 352, can include additives to provide a liquid crystal polymer channel module 176 having desired surface characteristics. For example, the polymeric coating can include an adhesive additive to improve bonding to film 174. Alternatively (or in addition), the polymeric coating may contain additives to improve the surface characteristics of the ink supply flow path, e.g., to increase wettability. Alternatively (or in addition), the polymeric coating may comprise additives to improve the overall durability of the liquid crystal polymer channel module, such as scratch resistant additives such as ruthenium particles. -36- 201022045 Promoting ink supply to the end of the print head 1C' Figure 25 shows the print head 1C 68, which overlaps the ink supply hole 186 penetrating the viscous 1C attachment film 174. The film 174 overlaps the LCP channel module. The ink in the lower side of 176 is supplied to the passage 182. Adjacent print heads 1C 68 are disposed end-to-end on the bottom of the LCP channel module 176 by attachment film 174. At the junction of each adjacent print head 1C 68, one of the ICs 68 has a "dr〇P triangle" 206 portion φ of the array of nozzles. The nozzles are displaced from corresponding ones of the remaining nozzle arrays 22, which allow the printing edge of one of the printing heads 1C to continue printing adjacent to the printing head 1C. The spacing between the adjacent nozzles by the drop nozzles of the displacement nozzles 206' regardless of whether the nozzles are on the same 1C or on either side of the joint at 1C remains the same. This requires a relatively fine determination of the adjacent printhead 1C 68 and the use of the reference mark 204 to achieve this goal. This process can be time consuming, but avoids artificial results in the printed images. Unfortunately, some nozzles may lack ink at the end of the print head 1C 68 relative to the nozzle blocks in the remaining array 220. For example, the nozzle 222 can be supplied by the ink of the two ink supply holes. The ink supply holes 224 are the closest. However, if there is an obstacle or a particularly large demand from the nozzle to the left side of the hole 224, the supply hole 226 is also close to the nozzle 222, so that these nozzles are less likely to be uninjected due to lack of ink. In contrast, if the ink supply hole 216 is not for the "extra" ink supply hole 2 1 0 provided at the junction between the adjacent 1C 6 8 , the nozzle 214 at the end of the printing head 1C 68 is only the ink supply hole. 216 is in fluid communication. "There is an additional ink supply port 2 1 0", that is, there is no nozzle away from the ink supply hole -37- 201022045 so that there is a risk of lack of ink in the nozzles. Both of the ink supply holes 208' 210 are fed by a common ink supply flow path 212. The ink supply flow path 212 has the ability to supply two holes because the supply hole 208 has only the nozzle to the left side thereof, and the supply hole 210 has only the nozzle to the right side thereof. Therefore, the total flow rate through the supply flow path 2 1 2 is approximately equal to the supply flow path fed only to one hole. Figure 25 also shows the inconsistency between the number of channels (pigments) in the ink supply source (four channels) and the five channels 2 1 8 in the print head 1C 6 8 . The third and fourth passages 2 1 8 behind the print head I c 6 8 are supplied by the same ink supply holes 1 8 6 . These supply holes are slightly enlarged to provide a distance between the two channels 2 1 8 because the print head 1C 68 is manufactured for use in a wide range of printer and print head structures. These can have five pigment channels - one cyan, magenta, yellow, black, and infrared pigments -... but other printers (such as this design) can only be four-channel printers, while the rest can still be Only three channels (cyan CC, magenta MM' and yellow Y). In view of this, a single pigment channel can be fed to two of the channels of the print head 1C. The Print Engine Controller (PEC) microprocessor can easily adapt this to the printed material that is sent to the print head 1C. Furthermore, supplying the same pigment to the two nozzle rows in the ic provides the status of redundant nozzles for dead nozzle compensation. Pressure pulse When the ink flowing into the print head suddenly stops, it produces a sharp peak of ink -38- 201022045 water pressure, which occurs at the end of the printing job or at the end of a page. Due to the high rate of the custodian, the pagewidth printhead requires a high flow rate to supply ink during the job. Therefore, the ink mass to the nozzle in the ink line is relatively large and moves at a considerable rate. Suddenly ending the printing job' or simply at the end of the printed page, this relatively fast-flowing relatively high volume ink is required to stop immediately. However, suddenly extracting the momentum of the ink will increase the shock wave in the ink line. The LCP module 64 φ (see Figure 19) has a special stiffness and the LCP module 64 provides little flexibility when the ink column in the line is stationary. Since there is no compliance in the ink line, the shock wave can exceed the Laplace pressure (the pressure provided by the surface tension of the ink at the nozzle opening, which is used to retain the ink in the nozzle chamber) and flood the print head 1C 68 The front surface. If the nozzle is submerged, the ink may not be ejected, and the artificial result appears in the printing. 〇 When the nozzle emissivity matches the resonance frequency of the ink line, the inside of the ink produces a resonance pulse. Furthermore, because of the rigid configuration of the ink line, most of the nozzles for one color are simultaneously emitted, producing standard or resonant pulses in the ink line. This can cause the nozzle to flood (or be submerged), or conversely, if the Laplace pressure is exceeded, the nozzle is not licked because of the pressure drop after the peak. To address this issue, the LCP module 64 incorporates a pulsation damper to remove the pressure peaks from the ink line. The damper can be a closed gas volume 'which can be compressed by the ink. In another embodiment, the damper can be a compliant section of the ink tube that flexibly flexes and absorbs pressure pulses. -39- 201022045 To minimize design complexity and retain a compact form, the present invention uses a compressible gas volume to dampen pressure pulses. With a small volume of gas, it is possible to use a gas compression to dampen the pressure pulse. This keeps the pocket design while avoiding any nozzle flooding caused by momentary peaks in the ink pressure. As shown in Figures 24 and 26, the pulsation damper is not a single gas volume for pulse compression within the ink, but rather an array pocket 200 distributed along the length of the LCP module 64. Pressure pulses that move past a long print head (such as a page wide print head) can be damped at any point within the ink flow line. @ But when the pulse passes through the nozzle in the print head 1C, the pulse will cause the nozzle to be submerged regardless of whether the pulse is later dissipated at the damper. By plunging a plurality of pulse dampers into the ink supply conduit and in close proximity to the nozzle array, any pressure peaks are damped at locations where they can cause unwanted flooding. It can be seen in Figure 26 that the air damming pockets 200 are arranged in four rows, each of which is located directly above the LCP main channel 184 within the LCP channel module 176. Any pressure pulse in the ink in the main channel 184 acts directly on the air within the pocket 200 and dissipates quickly. ◎ Print Head Note Now, refer to the LCP channel module 176 shown in Figure 27 to describe the focus. The ink will inflate the LCP channel module 176 by the suction applied to the main channel outlet 232 from the pump of the fluidic system (see Figure 6). The main channel 184 is filled with ink, and then the ink supply flow path 182 and the print head 1C 68 are self-injected by capillary action. Main channel 184 is relatively long and thin. Furthermore, if the air pockets 200-40-201022045 are used to damp the pressure pulses within the ink, the air pockets 200 must remain 'unmarked. This pairing process may be problematic, the hole 200 may be easily filled by capillary action during the beating process, or the main channel 184 may not be fully immersed by the trapped air. To ensure that the LCP channel module 176 is fully focused, the main channel 184 has a dam 228 at the downstream end prior to the outlet 232. To ensure that the air pockets 200 within the LCP module 64 are not in focus, the air pockets 200 have openings and the openings have sharp upstream edges that direct the ink meniscus to the wall of the acupoints. These aspects of the crucible are described in detail with reference to Figs. 28A, 28B and 29A to 29C. These figures schematically illustrate the injection process. Figures 28A, 28B show the problems that may occur if there are no dams in the main channel, while Figures 29A through 29C show the function of the dams 2 28 . 28A, 28B are cross-sectional views through one of the main passages 184 of the LCP passage module 176 and the inner air pocket portion 200 of the passage. Ink 238 is drawn through inlet 230 and flows along bottom plate φ of main passage 184. It should be noted that the advancing meniscus and the bottom surface of the channel 184 have a steep contact angle which causes the front end of the ink stream 23 8 to be slightly spherical. As the ink reaches the end of channel 184, the ink level rises and the ball front contacts the top of the channel before the rest of the ink flow. As shown in Figure 28B, the channel 184 is not fully immersed and the air is now trapped. This air bag retains and interferes with the job of the print head. The ink damping characteristics are altered and the air can be an ink barrier. In Figs. 29A to 29C, the passage 184 has a dam 228 at the downstream end. As shown in Fig. 29A, the ink stream 23 8 collects behind the dam 22 8 and rises toward the top of the passage -41 - 201022045. The dam 228 has a sharp edge 240 at the top as a fixed point for the meniscus. The advancing meniscus is nailed (attached to the pin) at this anchor 240', so when the ink level is above the top edge, the ink does not simply flow through the dam 2 2 8 » as shown in Figure 29B, protruding The meniscus raises the ink until the ink fills the channel 184 to the top. Since the ink seals the pockets into separate air pockets, the protruding ink meniscus at the dam 228 exits the sharp top edge 24 0 and fills the end of the channel 184 and the ink outlet 232 (see Figure 29C) φ . The sharp top edge 240 is precisely positioned such that the ink meniscus protrudes until the ink fills the top of the channel 184, but does not allow the ink to bulge too much to cause the ink to contact a portion of the end air pocket 242. If the meniscus contacts and is fixed to the inside of the end air pocket portion 42, the end air pocket portion 242 may be inked. Accordingly, the height of the dam and its position under the pocket are tightly controlled. The curved downstream surface of the dam 228 ensures that there is no further anchor point that allows the ink meniscus to span the gap to the pocket 242. Another mechanism by which the LCP is used to keep the pockets 200 unfocused is the upstream and downstream edges of the pocket openings. As shown in Figures 28A, 28B and 29A through 29C, all of the upstream edges have curved transition faces 234 and the downstream edges 236 are sharp. The ink meniscus that advances along the top of the channel 184 can be nailed to the sharp upstream edge' and then moved upward into the cavity by capillary action. The transition surface at the upstream edge (especially the curved transition surface 234) removes the strong anchor points provided by the sharp edges. Similarly, Applicant's efforts have found that if the pockets 200 have been undesirably impaired by some of the inks, the sharp downstream edges 236 may facilitate the removal of the 塡' annotation. If the printer is impacted, shaken, or tilted, or the jet system must flow back for any reason, the pocket 200 may be completely or partially licked. When the ink is again flowing in its normal direction, the sharp downstream edge 23 6 helps pull the meniscus back to the natural anchor point (i.e., the sharp corner). In this manner, the movement of the ink meniscus through the management of the LCP channel module 176 is a mechanism for proper sputum injection. φ The invention has been described herein by way of example only. Those skilled in the art will recognize variations and modifications that do not depart from the spirit and scope of the broad inventive concept. The embodiments described and illustrated in the drawings are to be considered as illustrative and not restrictive. BRIEF DESCRIPTION OF THE DRAWINGS [0007] Embodiments of the present invention are described by way of example only with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side front perspective view of a printer embodying the present invention; FIG. 2 shows the printer of FIG. 1 with the front in an open position; FIG. 3 shows the printer of FIG. And the print head is removed; FIG. 4 shows the printer of FIG. 3 and the outer casing is removed; FIG. 5 shows the printer of FIG. 3, and the outer casing is removed, but the print head is mounted; FIG. 6 is a print Figure 7 is a front upper perspective view of the print head cartridge; Figure 8 is a front upper perspective view of the print head cartridge in its protective cover; -43- 201022045 Figure 9 is to remove the protection The front upper perspective view of the print head ;; Figure 10 is the front lower perspective view of the print head ;; Figure 1 1 is the lower rear perspective view of the print head ;; Figure 1 2 shows the print head 匣 side Figure 13 is an exploded perspective view of the print head cartridge; Figure 14 is a transverse cross-section of the ink inlet coupler through the print head cartridge. Figure 15 is an exploded perspective view of the ink inlet and filter assembly; Figure 16 is a cross-sectional view of the 匣 valve engaged with the printer valve; Figure 17 is a perspective view of the LCP module and the flexible PCB; Figure 18 is the Figure 17 An enlarged view of the inserted block A; FIG. 19 is a bottom exploded view of the LCP module/flexible printed circuit board/printing head 1C assembly; FIG. 20 is an LCP module/flexible printed circuit board/printing head Figure 1 is an enlarged view of the lower side of the LCP module / flexible printed circuit board / print head 1C assembly :: Figure 22 shows the removal of the print head 1C of Figure 21 Fig. 23 shows an enlarged view of the print head of the print head 1C of Fig. 22; Fig. 24 shows an enlarged view of the LCP channel film group of Fig. 23; Fig. 25 shows the print Head 1C has a back channel and nozzle that overlaps the ink supply flow path; -44- 201022045 Figure 26 is a horizontal enlarged perspective view of the LCP module/flexible printed circuit board/print head 1C assembly*; Figure 27 is an LCP channel Figure 28A, 28B is a schematic cross-sectional view of the LCP channel module without dam, Figure 29A, 29B, 29C is a schematic cross-sectional view of the LCP channel module with dam; φ Figure 30 is the LCP mode A set of laterally enlarged perspective views of the position of contact force and reaction force; Figure 31 shows the 1C attachment film Figure 32 shows a section of the 1C attachment film between the linings; Figures 33A-C are partial cross-sectional views showing stages of a conventional laser drilling attachment film; Figures 34A-C show dual laser drills A partial cross-sectional view of each stage of the spliced film; Φ Figures 35A-D are longitudinal cross-sections of the illustrated printhead integrated circuit attachment process; Figures 3A and 3BB are after the first bonding step, in two different Photograph of the ink supply aperture in the attachment film; Figures 37A and 3B are longitudinal cross-sections of the illustrated printhead integrated circuit attachment process; and Figure 38 is a schematic illustration of the column having an exaggerated gap in the molded ink manifold Print head integrated circuit; Fig. 39 schematically shows a -45-201022045 process for applying a polymer coating to a molded ink manifold; and Fig. 40 schematically shows a print head assembly having a plugged gap [mainly Symbol description of components] 2: Printer 4: Main body 6: Pivot surface _ 8: Display screen 1 〇: Control button 12: Media stack 1 4: Feed tray 1 6: Printed sheet 18: Exit slot 20 : Cam 2 2 : Contact point 24 : Release lever 26 : Handle 2 8 : Support surface 3 0 : Structural member 32 : Contact rib 6 0 : Ink tank 62 : Pump 64 : Liquid crystal polymer (LCP ) module - 46 - 201022045 66 : Close valve ' 68 : Print head integrated circuit (1C ) 69 : Nozzle 72 : Regulator 74 : Air bubble Outlet 7 6 : Sealed conduit 78 : Air inlet _ 80 : Outlet 82 : Filter 84 : Upstream ink line 8 6 : Downstream ink line 88 : Sensor 90 : Electronic controller 92 : Slot 94 : Cover φ 96 :( Print head) 匣 98 : Cover 100 : 匣 base (chassis module) 102 : Base cover 1 0 4 : 匣 contact 1 〇 4 : 匣 contact 1 0 6 : Paper cover 108 : Flexible printed circuit board 1 1 〇: Wire Bonding - 47 201022045 112A. Upstream Ink Blend 1 12B : Downstream Ink Coupler ' 1 1 4 : 匣 Valve 1 1 6 : Inlet Manifold and Filter 1 1 8 : Outlet Manifold 120 : Elastic Connector 122: Liquid crystal polymer (LCP) inlet (ink inlet) 124: Liquid crystal polymer (LCP) outlet (ink outlet) φ 1 2 6 : Elastic sleeve 1 2 8 : Fixed valve member 1 3 0 : Filter membrane 1 3 2 : upstream filter chamber 134 : downstream filter chamber 136 : liquid crystal polymer (LCP ) channel 1 3 8 : top channel 142 : conduit (printer valve) 146: collar 148: catheter tip 150: conduit 1 5 2 : ink stream 156: filter outlet 1 5 8 : filter inlet 160: spacer rib 162: partition wall - 48 - 201022045 164 : wire joint contact 1 6 6 : countersunk hole 1 6 8 : countersunk hole 170 : curved support surface 1 7 2 : paper mask 174 : viscous integrated circuit (1C) attachment film 175 : manifold bonding surface φ 176 : liquid crystal polymer (LCP) Channel module 178: recess 1 80: electronic component 182: ink supply channel 184: liquid crystal polymer (LCP) main channel 1 8 5: first hole 1 86: (desired ink supply hole), (laser) Drilling) Supply Hole 188A: Existing Lining Φ 188B: Existing Lining 190: Central Web 192: Displacement Lining 194A: First Adhesive Layer 194B: Second Adhesive Layer 1 9 5 · Bonding Surface 1 9 6 : Motor 1 9 7 : Ash 1 9 8 : Reel (sag) -49- 201022045 199 : Bad oxygen tree 200 : Hole 204 : Reference 206 : Drop three 208 : ( Ink 210 : ( Ink 212 : ( Ink 214 : Nozzle 216 : (Ink 2 18: Channel 220 : Nozzle 222 : Nozzle 224 : ( Ink 226 : (Ink 228 : ISls m 230 : In □ 232 : Main channel 234 : Curved over 23 6 : Downstream side 23 8 : Ink (240 : Sharp edge 300 : Pad 302 : Heat block grease ridge angle ) Supply hole ) Supply Hole) supply flow channel) supply hole row) supply hole) supply hole outlet surface flow edge) edge 201022045

3 1 2 :淡色材料 3 14 :周圍壁 3 50 :(模製）縫隙 3 52 :(聚合體）塗層3 1 2 : light color material 3 14 : surrounding wall 3 50 : (molding) gap 3 52 : (polymer) coating

Claims (1)

201022045 十、申請專利範圍 1 · 一種製造列印頭組合體的方法，該方法包含下列 步驟： (a )提供模製墨水歧管，該模製墨水歧管具有用於 附接一或更多列印頭積體電路的歧管結合表面，該結合表 面具有界定在其內的複數墨水出口，該結合表面具有由模 製製程而產生的複數縫隙； (b) 以聚合體塗層塗覆至少該歧管結合表面，藉此 塞住該等縫隙；和 (c) 將一或更多列印頭積體電路結合至該歧管結合 表面。 2. 如申請專利範圍第1項所述製造列印頭組合體的 方法，其中因爲該聚合體塗層塞住該等縫隙，所以該歧管 結合表面實質地平坦。 3. 如申請專利範圍第1項所述製造列印頭組合體的 方法，其中該塗覆步驟以該聚合體塗層塗覆該模製墨水歧 管整體。 4. 如申請專利範圍第1項所述製造列印頭組合體的 方法，其中該聚合體塗層塞住界定在該墨水歧管內之各墨 水供給流道間的內部縫隙。 5 .如申請專利範圍第1項所述製造列印頭組合體的 方法，其中該聚合體塗層選自聚合體群組，該聚合體群組 由聚醯亞胺、聚酯、環氧樹脂、聚四氟乙烯、砂氧院、和 液晶聚合體組成。 -52- 201022045 6 .如申請專利範圍第1項所述製造列印頭組合體的 方法’其中該聚合體塗層包含無機或有機添加物，用於提 供下列特性其中之一或更多，該等特性包括可濕潤性、黏 劑結合強度、和抗刮傷能力。 7 ·如申請專利範圍第1項所述製造列印頭組合體的 方法’其中該塗覆步驟包括：浸漬、噴灑塗覆、或旋轉塗 覆其中任一。 8 .如申請專利範圍第7項所述製造列印頭組合體的 方法’其中該塗覆步驟利用包含有機溶劑的聚合體塗層溶 液。 9.如申請專利範圍第7項所述製造列印頭組合體的 方法’其中控制該塗覆步驟，以提供具有預定厚度的聚合 體塗層。 1 0.如申請專利範圍第1項所述製造列印頭組合體的 方法，其中該結合步驟包含： 將黏劑膜結合至該歧管結合面：和 將該列印頭積體電路結合至該黏劑膜。 11. 如申請專利範圍第1 〇項所述製造列印頭組合體 的方法，其中該黏劑膜是積層膜，其包含夾在第一和第二 黏劑層之間的中央聚合體膜。 12. —種結合列印頭組合體，包含一或更多列印頭積 體電路’該積體電路結合至模製墨水供給歧管之歧管結合 表面，其中，該歧管結合表面包含聚合體塗層，該聚合體 塗層塞住在該模製墨水歧管內的複數縫隙。 -53-201022045 X. Patent Application No. 1 - A method of manufacturing a print head assembly, the method comprising the steps of: (a) providing a molded ink manifold having one or more columns for attachment a manifold bonding surface of the integrated circuit, the bonding surface having a plurality of ink outlets defined therein, the bonding surface having a plurality of slits created by a molding process; (b) coating at least the polymer coating A manifold joins the surface thereby plugging the slits; and (c) bonding one or more printhead integrated circuits to the manifold bond surface. 2. A method of making a printhead assembly as claimed in claim 1, wherein the manifold bonding surface is substantially flat because the polymer coating plugs the gaps. 3. The method of making a printhead assembly of claim 1, wherein the coating step coats the molded ink manifold with the polymer coating. 4. The method of making a printhead assembly of claim 1, wherein the polymer coating plugs an internal gap defined between respective ink supply channels within the ink manifold. 5. The method of manufacturing a print head assembly according to claim 1, wherein the polymer coating is selected from the group consisting of polyimine, polyester, epoxy. , PTFE, sand oxide, and liquid crystal polymer composition. The method of manufacturing a print head assembly as described in claim 1, wherein the polymer coating layer comprises an inorganic or organic additive for providing one or more of the following characteristics, Other properties include wettability, adhesive bond strength, and scratch resistance. 7. The method of manufacturing a print head assembly as claimed in claim 1, wherein the coating step comprises: dipping, spray coating, or spin coating. 8. The method of manufacturing a print head assembly according to claim 7, wherein the coating step utilizes a polymer coating solution containing an organic solvent. 9. The method of manufacturing a print head assembly according to claim 7, wherein the coating step is controlled to provide a polymer coating having a predetermined thickness. The method of manufacturing a print head assembly of claim 1, wherein the bonding step comprises: bonding an adhesive film to the manifold bonding surface: and bonding the print head integrated circuit to The adhesive film. 11. The method of making a printhead assembly of claim 1, wherein the adhesive film is a laminate film comprising a central polymeric film sandwiched between the first and second adhesive layers. 12. A combined printhead assembly comprising one or more printhead integrated circuits 'which are coupled to a manifold bond surface of a molded ink supply manifold, wherein the manifold bond surface comprises an aggregate A bulk coating that plugs a plurality of slits within the molded ink manifold. -53-