TW201018896A - Method and device using a critical angle method combined with CCD for measuring object defect - Google Patents

Method and device using a critical angle method combined with CCD for measuring object defect Download PDF

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TW201018896A
TW201018896A TW97144042A TW97144042A TW201018896A TW 201018896 A TW201018896 A TW 201018896A TW 97144042 A TW97144042 A TW 97144042A TW 97144042 A TW97144042 A TW 97144042A TW 201018896 A TW201018896 A TW 201018896A
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image
scanning beam
tested
light
defect
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TW97144042A
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Chinese (zh)
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TWI388817B (en
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Ming-Hong Qiu
Zhen-Qin Lin
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Univ Nat Formosa
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Abstract

The present invention relates to method and a device using a critical angle method combined with a CCD for measuring object defect, wherein a non-defective unit is placed on the optical path between an optical scanning means and a multiple-reflection prism sensor, and then the optical scanning means emits a scanning beam for penetrating or reflecting from the non-defective unit and incident onto the multiple-reflection prism sensor; when the scanning beam is incident onto the multiple-reflection prism sensor, a rotating means rotates the multiple-reflection prism sensor to adjust the scanning beam close to the critical angle so as to be used as a benchmark light intensity; then an image capture device is used to capture the benchmark light intensity as a benchmark image. Also, the optical scanning means emits a scanning beam for penetrating or reflecting from a DUT (device under test) and incident onto the multiple-reflection prism sensor, thus making the scanning beam generate a small angle change to deviate from the original angle so as to result in light intensity variation. Afterwards, the image capture device is used to capture surface light intensity of the DUT as a test image, and a computing means compares the benchmark image and the test image in order to obtain defect information of the DUT.

Description

201018896 — r 二.·,: .-一 * 六、發明說明: 【發明所屬之技術領域】 本發明係有關一種臨界角法結合CCJ)作物件缺陷量測之方法 及裝置,尤指一種結合擷取影像技術與臨界角法技術,俾能量測 出待測物之表面與内部缺陷資訊者 【先前技術】 由於工業的快速發展,使得各種精密加工產業急遽增加,而 β加工物件的表面平整度與缺陷,也日益要求精細。這些年來,各 種研究加工物件的粗糙度的專題報告,有不斷增加的趨勢。 按,物件粗糙度量測大致上可分為接觸式量測與非接觸式量 ’貝J 一種,以傳統型探針式輪麻儀來說,常常在測量時破壞了待測 物表面,也因為探針尺寸的關係,如參考文獻以][2]所示,使得 解析度受舰制。轉細式量_絲方法量面粗糙度, 並不會對細物域破壞,也可提料錯的着度以及具有即時 ❾性的量曝點’所以已經縣线趨勢。以下是—些光學法量測 表面粗糖度的文獻回顧。 於1969年’I. j. Hodgkinson如參考文獻[3]提出一個新的拍 照方法用來描繪出成對的鑛膜光學平面,可以應用在λ/10或更好 的表面上。在曝光期間藉由慢慢改變平面之間的分隔線,干涉圖 形變化會被記錄由於透光值所對應的高度誤差幾乎是線性的,因 此可在從大量干涉圖形的透光樣本中決定出表面缺陷。 於1972年的時候,R· A· Sprague如參考文獻[4]首度提出利 用空間相干性光在一個透鏡的成像平面附近形成干涉斑點圖案, 201018896 , -.i-.; —··'' aw a. Λ .a -· -.-.-... .· .· ... =:J s·.,^ I ..VJ-.a.Hti»·.!!..·:·.^^ . _ _ -當把粗縫和光照度來做比較時,將會發現表面粗縫與斑點的對比 度有關,表面適合於0. 05到25μπι(2-1000-μίη·)標準粗綠範圍。然 而,這個方式有兩個限制條件:1·粗糙度必須是在高度(必須小 於光照量的15%波長)上,由波長取得的一小部分的波長。2.表面 兩度必須呈高斯分佈。 1984年,J. 0· Porteus 及 Steven C· Seitel 如參考文獻 [5],提出具有受照的光點尺寸之雷射損失極限比例是已知的效 應。當損失由缺陷所控制時,光點尺寸比例會被歸因為損失機率 ❹的5G%之倾定義的紐。藉由重新定義桃等級⑽對損失起 始)’將會獲得與光點無關的結果。在這裡發表一個方法,此法為 了要得到光學表面(此面屬於脈衝雷射輕射)的損耗初雖。這個 方法牽涉到損細率數據之加權最小平方擬合法,這個方法有三 個參數刀佈總合代表内部缺陷損耗特性。在數據中的光點尺寸效 應藉由刻度轉換(可應用擬合之前的總合)來模擬。直接與反向轉 換是由高斯和top-hat空間強度輪廓,可以指出測試後部的好處。 ❿最後提出三個應用在2. 7,的多層膜,證明—般兩個參數衰減總 合不適當性。最後提取不_缺_度,區分不_缺陷分類, 而且时論在起始不確定性的表示式。 於贿年 ’ Takayuki Okamoto 及 lchirou Yamaguchi(如參 考文獻[6],提出藉由即時性全像術產生的非線性空職波方法結 果’運用在提南週期性圖案的缺陷。他們利用上述特點(提高週期 性圖案的缺陷)提出即時性的光學系統。實驗方法是利用欲探査的 週期f生圖案的傅立葉轉換來讀取被寫入在_%如感此細) 膜中的個筆直和同位置的光栅。因為光栅的繞射效率決取於讀 201018896 ......................................... ...…'.·.*—_________ ' ).·---=·.“. . wm-:y=·-•二·υ~=Λ.ί·ί ·.. η- ^..^一.·^· — _ 取^的強度,只有缺陷的分量會被選擇性的繞射及成像。這個系 統是可應用在移動的物體上。實驗結果顯示出在具有15〇聊像素定 位光罩(用在液晶顯示上)中有1〇_一樣大小增加的缺陷。 8年,Zu-Han Gu如參考文獻[7],使用的方法類似角度記 憶線(angular memory line)的方法,來制在粗糙表面幾何形狀 的微小變化,實驗方法是在不同的觀察角度使用CCD來拍斑點圖 片’以測量角度相關性。實驗結果顯示出遠場相干函數對粗糖的 表面幾何的微小局部變化相當錄,會採用其中斑點㈣相關性 而不疋待測物整體的平均值。當極化光從真空中(其中使用 的-部分是-個薄電介質廣,其沉積在玻璃基板上及另一個部分 除了局部性的缺陷’不然其餘娜先前的—樣)人射在粗链的表 面"T以測置由1D任意的粗糙表面所散射之遠場斑點散射角度交 叉相關函數。利用斑點製圖的工具來做待測物缺陷的檢驗,將可 以想像其中的靈敏度特性的應用。 再於2000年,Luis Miguel Sanchez-Brea等人如參考文獻 ⑩[8] ’提出一個光學技術用在這個金屬線(直徑50 - 2000 μιη,被 用在表面品質控制的線上系統)上的表面缺陷的技術檢測。這個技 術是基於當光線在一個傾斜的角度入射到金屬線上,使得散射圓 錐體的光強度變化。 另外’與本發明相關之技術包括下列的專利前案: (1)專利公開第200427980號『透明基板端面部之檢查裝置及 檢查方法』’當透明基板之顯示面板基板10載置於旋轉台21時, 則以與顯示面板基板10之端面部呈對向配置的端面照明部39間 歇地…、射光線。沿著顯示面板基板10表面所照射之光線,係藉下 201018896 jy-—, ———机一一 一―一一一—一 之端面部反射。該端面部及其附201018896 - r II.·,: .-一*, invention description: [Technical field of invention] The present invention relates to a critical angle method combined with CCJ) method and apparatus for measuring defects of crop parts, especially a combination of 撷Taking image technology and critical angle method, 俾 energy to measure the surface and internal defect information of the object to be tested [Prior Art] Due to the rapid development of industry, various precision processing industries are rapidly increasing, and the surface flatness of β-processed objects is Defects are also increasingly demanding. Over the years, various special reports on the roughness of processed objects have been increasing. According to the measurement of the roughness of the object, it can be roughly divided into a contact type measurement and a non-contact type, and in the case of the conventional probe type wheel type, the surface of the object to be tested is often destroyed during the measurement. Because of the size of the probe, as shown in the reference [2], the resolution is subject to shipbuilding. The fine-grained amount _ silk method surface roughness, does not damage the fine object domain, but also can raise the degree of error and the amount of exposure with immediate ambiguity. The following is a literature review of some optical methods for measuring surface roughness. In 1969, I. J. Hodgkinson proposed a new method of photographing as described in reference [3] to depict pairs of ore film optical planes that can be applied to λ/10 or better surfaces. By slowly changing the separation line between the planes during exposure, the interference pattern changes are recorded. Since the height error corresponding to the light transmission value is almost linear, the surface can be determined from the light-transmitting samples of a large number of interference patterns. defect. In 1972, R. A. Sprague first proposed the use of spatial coherence light to form an interference spot pattern near the imaging plane of a lens, as in reference [4], 201018896, -.i-.; —··' Aw a. Λ .a -· -.-.-... .. . . . =:J s·.,^ I ..VJ-.a.Hti»·.!!..::· .^^ . _ _ - When comparing the slash and the illuminance, it will be found that the surface sulcus is related to the contrast of the spot, and the surface is suitable for the 0. 05 to 25μπι(2-1000-μίη·) standard coarse green range. . However, there are two limitations to this approach: 1. Roughness must be a fraction of the wavelength at the height (which must be less than 15% of the wavelength of the light). 2. Surface The two degrees must be Gaussian. In 1984, J. 0. Porteus and Steven C. Seitel, as reference [5], proposed that the laser loss limit ratio with the illuminated spot size is a known effect. When the loss is controlled by the defect, the spot size ratio is attributed to the 5G% of the loss probability ❹. By redefining the peach level (10) for the beginning of the loss), results will be obtained that are independent of the spot. Here is a method for obtaining the loss of the optical surface (this surface belongs to pulsed laser light). This method involves a weighted least squares fit of the loss rate data. This method has a total of three parameter knives representing the internal defect loss characteristics. The spot size effect in the data is simulated by scale conversion (the sum before the fit can be applied). Direct and reverse conversion is a Gaussian and top-hat spatial intensity profile that can point out the benefits of testing the back. Finally, three multilayer films were applied in 2.7, which proved that the total attenuation of the two parameters was not appropriate. Finally, the extraction is not _ _ _ degree, the difference is not _ defect classification, and the time is in the expression of the initial uncertainty. In the year of bribery ' Takayuki Okamoto and lchirou Yamaguchi (as in [6], the results of the nonlinear null-wave method produced by instant holography] are used in the defects of the periodic pattern of Tynan. They use the above characteristics ( Improving the defects of the periodic pattern) The instant optical system is proposed. The experimental method is to use the Fourier transform of the period f-pattern to be probed to read the straight and same position written in the film of _%. Raster. Because the diffraction efficiency of the grating is determined by reading 201018896 ....................................... .. ......'.·.*—_________ ' ).·---=·.". . wm-:y=·-•二·υ~=Λ.ί·ί ·.. η- ^ ..^一··^· — _ Take the intensity of ^, only the components of the defect will be selectively diffracted and imaged. This system can be applied to moving objects. The experimental results show that there are 15 像素 pixels The positioning mask (used on the liquid crystal display) has a defect of the same size. For 8 years, Zu-Han Gu, as in reference [7], uses a method similar to the angular memory line method. To make small changes in the geometry of the rough surface, the experimental method is to use the CCD to shoot the spot image at different viewing angles to measure the angular correlation. The experimental results show that the far-field coherence function is quite small for the local variation of the surface geometry of the raw sugar. Record, will use the speckle (four) correlation and not the average value of the whole object to be tested. When the polarized light is from vacuum (the part used is - a thin dielectric, which is deposited on the glass substrate and another part) apart from The partial defect 'other than the previous one's - the other person's shot on the surface of the thick chain "T to measure the cross-correlation function of the far-field spot scattering angle scattered by the arbitrary rough surface of 1D. Using the tool of spot mapping The test of the defect of the object to be tested will be able to imagine the application of the sensitivity characteristics. In 2000, Luis Miguel Sanchez-Brea et al., Ref. 10 [8] ' proposed an optical technique for this metal wire (diameter 50). - 2000 μιη, a technical test for surface defects on surface quality controlled in-line systems. This technique is based on the fact that light is incident on the wire at an oblique angle, causing the light intensity of the scattering cone to change. The related art of the present invention includes the following patents: (1) Patent Publication No. 200427980 "Inspection apparatus and inspection method for the end surface of a transparent substrate" "When the display panel substrate 10 of the transparent substrate is placed on the rotary table 21, The end surface illumination portion 39 disposed opposite to the end surface portion of the display panel substrate 10 intermittently emits light. The surface of the display panel substrate 10 is illuminated. Of light, by the Department 201018896 jy--, --- machine one hundred eleven - one thousand one hundred and eleven end portion of the reflector and is attached to the end portion.

Hi鏡42往_面板基板1〇 彡像触裝踢職36減,且鱗輯得之影像 缺陷 、的衫像遭度’來檢測出顯示面板基板10之端面部的 ⑵專利公開第200527321號『缺陷檢查方法』,其係提供— =陷,查方其可按照圖案之密度自動地設定具有相應於缺 陷。Ρ分之尺寸之缺陷檢測靈敏度的尺寸判定區域,進行缺陷 ❹檢i °其包含第1娜,其基於參關像#料,躲複數個方向 计測瞧之寬度,並將上述參簡像雜變換為城於上述圖案 $於上述各方向之寬度的亮度,製作對應於上述各方向之複數個 掃描圖像㈣:第2步驟,其比較上述複數瓣描圖像資料,並 自t等掃描圖像資料選出為最小之亮度的最小亮度,製作寬度圖 像貝料;第3步驟,其基於被檢查圖像資料與上述參照圖像資料抽 出缺陷部並將對於上述_之寬度成為最小亮度之方向測定 上述缺陷部分之尺寸變換為亮度,製作缺陷尺寸圖像資料; ❹以及第4步驟,其基於上述缺陷尺寸圖像資料與上述寬度圖像資 料,進行對於上述缺陷部分之缺陷判定。 (3)專利公開第200813421號『表面檢查裝置』,其對反覆圖 案之複數種類的缺陷能確保充分的檢測感度。該表面檢查装 置具備:用以照明形成於被檢物件2〇之表面的反覆圖案,並測定反 覆圖案之形狀變化所引起之正反射光L2之強度變化的機構 G3〜15);以直線偏光照明反覆圖案,且將反覆圖案之反覆方向與 直線偏光之振動面之方向所形成的形成角度設定成傾斜的角度, 並測定反覆圖案之形狀變化所引起之正反射光L2之偏光狀態之變 201018896 ____— _____ _ ·~. · ~ -=?.·= *...^ILS^S- ^ 化的麵(13〜15);及根據正反射紐之強度變化態的變 化,以檢測反覆圖案之缺陷的機構15。 ⑷專利公開第2_〇4758『表面檢查裝置』其具備:將直線 偏光L1黯於形成有反覆圖案之晶圓1()表面之_光學系統 30、用以保持晶圓1〇之對準載台2〇、用以拍攝來自晶圓ι〇表面 之反射光的像之攝縣學纽4Q、用以儲存藉由攝影鮮系統4〇 所拍攝的影像之影像贿部5卜觸存於影像儲存部51之影像進 行既定影像處咖_出反覆_雜之影像處理部52、以 及用以輸出影像處理部52之影像處理結果之影像輸出部犯;其中 之 係將第2偏光板43之透射軸之方位設定成相對第)偏光板犯 透射軸傾斜45度。 ⑸專利公開第2GG811433號『表面檢錢置』,其具備:照明 機構,係以直線偏光照射形成於被檢測物件表面之反覆圖案;=定 機構’係將該直線偏光之人射面在該表面的方向與該反覆圖案之 反覆方向所構成之㈣設定為(UX外的既定值;抽出機構,係抽出 粵自該反覆_往正反射方向產生之光中、與該直線偏光之振動面 垂直的偏光成分;受光機構,係接收以該抽出機構抽出之光,並輸 出該正反射杨綠度;缝制機構,係根據自較光機構輸 出之該正反射光的光強度,來檢測該反覆圖案的缺陷;該設定 機構,係將該直線偏光之入射面在該表面的方向與該反覆圖案之 反覆方向所構成之角度,設定成來自該表面之正常部分的光強度 與來自該表面之缺陷部分之光強度的差成為最大。 (6)專利公開第200741199號『表面檢查裝置及表面檢查方 去』’其在於降低底層之影響,良好地進行表面之重複圖案的缺陷 201018896 —--* ' _______丨 t ^ . . _ " .ρΊΠ-.- - ..-^ «· Λ. SSO-Z. : . -Λί.ΟΛ-. ... ... 檢查。其特徵在於具備:機構ΐ3,用來對受檢物件2〇之表面的重複 圖案照射照明光L1;麵η、12,用來將含照明光之照射方向及表 面之法線1Α的人射面於表面之方向與重複圖案之重複方向所形成 的角度設找G以权蚊值;受錢構14,當麟酬光時,接 受來自重複圖案所產生之正反射光然後將該正反狀之光強度 資訊輸出;以及檢測機構15,根據從受光機構所輸出之資訊,來 檢測重複_之缺陷人射面於表面之方向與重複方向所 形成的角度φ、照明光之照射方向與表面之法線所形成的角度 0、照日月光之波長λ、以及重複圖案之間距ρ係滿足條件式u/ •【2cos(0.sin9))】 >p;)o (Ό專利公開第200745538『缺陷檢測裝置』,其具有於一軸 方向掃·檢測體之表關像而取得之照相機,且照相機之輸出 傳送至控制部3之圖像取得電路。細像取得電路分隔拍攝開始 觸發、操取開始像素位置及擷取結束像素位置,取得從照相機取得 之圖像資料,而僅作成缺陷區域之圖像,以進行圖像處理等。根 ❹據本缺陷檢測裝置,可從基板等被檢測體快速挑選必要之資 訊,而快速執行檢測。 a上述專利前案皆非以角度偏向法與影像擷取裝置做表面與内 部缺陷的量測;反觀,本㈣係為—種高精度表面_度及形貌 輪廓的量測技術,架構上以CQ)擷轉像結合臨界㈣度檢測技 術方式。當光束入射於待測物件上時,會因待測物件表面的高低 變化,造成穿透或反射的光束有微小的角度改變量,使得光強度 因偏離臨界角附近的角度而變大或變小,以CCD梅取缺陷光強影 像,與標準影像相比,即可得到待測物之缺陷與形貌。因架構^ 201018896 檢測應用上的靈活選擇性,使待測物件可做超光滑表面的高解析 度量測或回表面變化的低解析度檢測,具有非接觸、大範圍、高 靈敏度及抗空氣擾動的高穩定性檢測優勢。 有鑑於此,本發明與上述專利前案所採用之技術手段及達成 功效皆有所不同,故本發明足以與上述專利前案做一有效的區別。 參考文獻: [1] J. Garratt and M. Mills, Measurement of the roughness of supersmooth surfaces using e stylus instrument”,加0^7, ® 7,13-20,1996.The Hi-mirror 42 detects the end face of the display panel substrate 10 by the image sensor of the panel substrate 1 and the image of the image of the display panel substrate 10 (2) Patent Publication No. 200527321 The defect inspection method, which provides - = trap, can be automatically set to correspond to the defect according to the density of the pattern. The size determination area of the defect detection sensitivity of the size of the minute, and the defect detection i ° includes the first Na, which is based on the reference image #, and hides the width of the 瞧 in several directions, and confuses the above-mentioned parameters Converting to the brightness of the width of the above-mentioned pattern $ in the above directions, creating a plurality of scanned images (four) corresponding to the above-mentioned respective directions: a second step of comparing the plurality of image data of the plurality of flaps, and scanning the image from t and the like The image is selected to be the minimum brightness of the minimum brightness, and the width image is prepared. In the third step, the defect is extracted based on the image data to be inspected and the reference image data, and the width of the width is minimized. The size of the defect portion is measured to be converted into brightness, and the defect size image data is created. In the fourth step, the defect determination for the defective portion is performed based on the defect size image data and the width image data. (3) Patent Publication No. 200813421 "Surface inspection apparatus" which ensures sufficient detection sensitivity for a plurality of types of defects of the repeated pattern. The surface inspection apparatus includes: a mechanism G3 to 15) for illuminating a reverse pattern formed on the surface of the object to be inspected, and measuring a change in intensity of the specular reflected light L2 caused by a change in the shape of the inverted pattern; The pattern is reversed, and the angle formed by the direction of the reverse pattern and the direction of the plane of the linearly polarized light is set to an oblique angle, and the change of the polarization state of the specular reflected light L2 caused by the shape change of the reverse pattern is measured 201018896 ____ — _____ _ ·~. · ~ -=?.·= *...^ILS^S- ^ Surface (13~15); and according to the change of the intensity of the regular reflection, to detect the reverse pattern Defective institution 15. (4) Patent Publication No. 2_4758 "Surface inspection apparatus" is provided with an optical system 30 for aligning the linearly polarized light L1 on the surface of the wafer 1 () on which the reverse pattern is formed, and for maintaining the alignment of the wafer 1 2 〇, the image of the photographic county 4Q used to capture the reflected light from the surface of the wafer, the image used to store the image taken by the photographic system 4 触 触 触 触 触 影像 影像 影像 影像The image of the portion 51 is subjected to a predetermined image processing unit 52, and an image output unit for outputting the image processing result of the image processing unit 52; wherein the transmission axis of the second polarizing plate 43 is used. The orientation is set to be inclined by 45 degrees with respect to the transmission axis of the polarizing plate. (5) Patent Publication No. 2 GG811433 "surface inspection money setting", which is characterized in that: an illumination mechanism is a reverse pattern formed on a surface of an object to be detected by linear polarized light irradiation; and a fixed mechanism is a surface on which the person who linearly polarizes the light is incident on the surface The direction of the reverse direction of the reverse pattern is set to (4) is set to a predetermined value outside the UX; the extraction mechanism extracts the light from the reverse _ to the direction of the regular reflection, perpendicular to the vibration plane of the linearly polarized light. a light-receiving component; the light-receiving mechanism receives the light extracted by the extracting mechanism, and outputs the specular reflection greenness; and the sewing mechanism detects the repetitive pattern according to the light intensity of the specular reflected light output from the light-receiving mechanism a setting mechanism for setting an angle formed by a direction of the linearly polarized incident surface in a direction of the surface and a reverse direction of the reverse pattern to a light intensity from a normal portion of the surface and a defective portion from the surface The difference in light intensity is maximized. (6) Patent Publication No. 200741199 "Surface inspection device and surface inspection side" is to reduce the influence of the bottom layer, which is good. The defect of repeating the surface of the surface 201018896 —-** _______丨t ^ . . _ " .ρΊΠ-.- - ..-^ «· Λ. SSO-Z. : . -Λί.ΟΛ-. The inspection is characterized in that: the mechanism ΐ3 is configured to illuminate the repetitive pattern of the surface of the object to be inspected by the illumination light L1; the surfaces η and 12 are used for the illumination direction and surface of the illumination-containing light. The normal angle of the person's face in the direction of the surface and the repeating direction of the repeating pattern is set to find the G value of the mosquito; the money is constructed, and when the light is received, the positive reflection from the repeated pattern is accepted. The light then outputs the positive and negative light intensity information; and the detecting mechanism 15 detects the angle φ formed by the direction of the surface of the defective person's surface on the surface and the repeating direction according to the information outputted from the light receiving mechanism, and the illumination The angle formed by the direction of illumination of the light and the normal to the surface 0, the wavelength λ of the moonlight, and the distance between the repeating patterns satisfy the conditional u/ • [2cos(0.sin9))] >p;)o ( Ό Patent Publication No. 200745538 "Defect Detection Device", which has a surface image of a sample in a single axis direction The camera is obtained, and the output of the camera is transmitted to the image acquisition circuit of the control unit 3. The fine image acquisition circuit separates the imaging start trigger, the operation start pixel position, and the capture end pixel position, and acquires image data acquired from the camera. Only the image of the defect area is created for image processing, etc. According to the defect detecting device, the necessary information can be quickly selected from the substrate such as the substrate, and the detection can be quickly performed. The deflection method and the image capturing device are used to measure the surface and internal defects. In contrast, the (4) system is a measurement technique for high-precision surface _ degree and shape contour, and the structure is based on CQ) 撷 rotation image combined with critical (four) degrees. Detection technology. When the light beam is incident on the object to be tested, the light beam of the penetrating or reflected light beam has a slight angular change due to the change of the surface of the object to be tested, so that the light intensity becomes larger or smaller due to the angle near the critical angle. The CCD is used to take the defect light intensity image, and the defect and morphology of the object to be tested can be obtained compared with the standard image. Due to the flexible selectivity of the architecture ^ 201018896 detection application, the object to be tested can be used for high-resolution measurement of ultra-smooth surface or low-resolution detection of surface change, with non-contact, wide range, high sensitivity and anti-air disturbance. The advantage of high stability detection. In view of the above, the technical means and the effect achieved by the present invention are different from those of the above patents, so the present invention is sufficiently effective to distinguish from the above patents. References: [1] J. Garratt and M. Mills, Measurement of the roughness of supersmooth surfaces using e stylus instrument", plus 0^7, ® 7,13-20, 1996.

[2] J. M. Bennett and J. H. Dancy, "Stylus profiling instrument for measuring statistical properties of smooth optical surface", Applied Optics, 20, 1785-1802, 1981.[2] J. M. Bennett and J. H. Dancy, "Stylus profiling instrument for measuring statistical properties of smooth optical surface", Applied Optics, 20, 1785-1802, 1981.

[3] I. J. Hodgkinson, uk Method for Mapping and Determining the Surface Defects Function of Pairs Coated Optical Flats Applied Optics, 8,1373-1378, 1969. ❺ [4] Robert A. Sprague, “Surface roughness measurement using white light speckle tt, Applied Optics, 11, 2811-2816, 1972.[3] IJ Hodgkinson, uk Method for Mapping and Determining the Surface Defects Function of Pairs Coated Optical Flats Applied Optics, 8, 1373-1378, 1969. ❺ [4] Robert A. Sprague, “Surface roughness measurement using white light speckle tt , Applied Optics, 11, 2811-2816, 1972.

[5] J. 0. Porteus and Steven C. Seitel, MAbsolute onset of optical surface damage using distributed defect ensembles” , Applied Optics, 23, 3796-3805, 1984.[5] J. 0. Porteus and Steven C. Seitel, MAbsolute onset of optical surface damage using distributed defect ensembles” , Applied Optics, 23, 3796-3805, 1984.

[6] Takayuki Okamoto and Ichirou Yamaguchi,“Real-time enhancement of defects in periodic patterns by use of a bacteriorhodopsin filmM , Optics Letters, 22, 337-339, 1997.[6] Takayuki Okamoto and Ichirou Yamaguchi, "Real-time enhancement of defects in periodic patterns by use of a bacteriorhodopsin filmM, Optics Letters, 22, 337-339, 1997.

[7] Zu-Han Gu, H Detection of a small defect on a rough surface", 201018896 t.— -·,-=!=·=·. 了二-二二.工 ·»··«ίίιϋ·»=ι. ----. ·Γ s.;·; .·.·..»_ .. : ϋ i·· ‘ 二-i«.二 ν_=··τ 丄 * Optics Letters, 23, 494-496, 1998.[7] Zu-Han Gu, H Detection of a small defect on a rough surface", 201018896 t.— -·,-=!=·=·. Two-two. Worker·»··«ίίιϋ·» =ι. ----. ·Γ s.;·;;..·..»_ .. : ϋ i·· ' 二-i«.二ν_=··τ 丄* Optics Letters, 23, 494 -496, 1998.

[8] Luis Miguel Sanchez-Brea, Philip Siegmann, Maria Aurora Rebollo, and Eusebio Bernabeu, “Optical technique for the automatic detection and measurement of surface defects on thin metallic wiresM , Applied Optics, 39, 539-545, 2000. 【發明内容】 本發明之目的在於提供一種臨界角法結合CCD作物件缺陷量 測之方法及裝置,由於採用架構於檢測應用上具有靈活選擇性, ® 使待測物件可做超光滑表面的高解析度量測或高表面變化的低解 析度檢測,因而具有非接觸、大範圍、高靈敏度、檢測快速即時、 高精密、簡易操作以及抗空氣擾動的高穩定性檢測等諸多的優勢。 為達成上述功效,本發明採用之技術手段係將良品置於光學 掃瞄手段與多次反射稜鏡感測器之間的光路上,再以光學掃瞄手 段發出一掃瞄光束穿透或反射良品後至多次反射稜鏡感測器中, 當掃瞄光束入射至多次反射稜鏡感測器時’以旋轉手段轉動多次 〇反射稜鏡感測器,使掃瞄光束調整靠近至臨界角以作為基準面的 光強度,再以影像擷取裝置擷取基準面光強度以作為基準影像, 並以光學掃晦手段發出掃瞒光束穿透或反射一待測物而入射至該 多次反械贼測ϋ ’使掃喊束產倾小肖度變細偏離原本 角度以造成光強度的變化,而以影細取裝置擁取待測物表面光 強度以作為測試影像,再以運算手段將基準影像與測試影 比對’俾能得到待測物之缺陷資訊者。 ’ 【實施方式】 壹·本發明基本技術特徵 201018896 t.· ---------- 'Wir,i"a->sga.itej.-"ir» -νη ^ 11 ................ | 丨 _________ ___ . "^ 一―一——一™——:…....... 1.1本發明之方法特徵 請參看第七至九圖所示’本發明主要係將嫩影像技術與臨 界角法技術結合,當光束入射於待測物⑽時,會因待測物⑽ 表面的高低變化’造成穿透或反射的光束有微小㈣度改變量, 使光強度因偏離臨界角附近的角度而變大或變小,再以榻取影像 技術擷取缺陷光強影像,再與標準面影像相比,即可得到待測物 (la)之缺陷與形貌,為達上述功效,本發明係提供—光學掃猫手 段(10)、一多次反射稜鏡感測器(2〇)、一用以驅動該多次反射稜 ❺鏡感測器(20)改變角度的旋轉手段(3〇)、一影像擷取裝置(4〇)及 一運算手段(50)。 請參看第五至七圖所示,本發明之具體方法係將一良品(1)置 於光學掃瞄手段(10)與多次反射稜鏡感測器(2〇)之間的光路上, 再以光學掃瞄手段(10)發出一掃瞄光束穿透或反射良品(丨)後至 多次反射稜鏡感測器(20)中。當掃瞄光束入射至多次反射稜鏡感 測器(20)時,再以旋轉手段(30)轉動多次反射稜鏡感測器(2〇)的 φ 角度,使掃瞄光束之入射角調整至靠近臨界角以作為基準面的光 強度’再以該影像擷取裝置(4〇)擷取該基準面光強度以作為基準 影像。 再請參看第七至九圖所示,再使光學掃瞄手段(1〇)發出掃瞄 光束穿透或反射一待測物(la)而入射至多次反射稜鏡感測器(2〇) _,使掃瞄光束產生微小角度變化而偏離原本角度以造成光強度 的變化’再以影像擷取裝置(40)擷取待測物(ia)表面光強度以作 為測試影像。 請參看第七至九圖所示,以該運算手段(50)將該基準影像與 201018896 行比對,進而得到 =寺徵中,多次反射稜鏡感測器⑽之較佳實施例可為— 二形稜鏡感測器。另該影像娜裝置⑽)之較佳實施例可為— 電何麵合元件CCD。 1.2本發明之裝置特徵 請參看第七至九圏所示,本發明主要係將摘取影像技術與臨 界角法技術做結合,當光束入射於待測物(⑻時,會因制物 高侧化’造成穿透歧_光束有微小㈣度改變 量’使光強度因偏祕界細近的角度而變Α或變小,再以揭取 影像技術缺陷光強影像,再與鮮面影像相比,即可得到待 測物⑽之缺陷與雜,為達上述功效,其包括—光學掃猫手段 〇〇)、-影像娜裝置(40)、-旋轉手段⑽)、一多次反射稜鏡 感測器(20)及-運算手段(50),兹將本發明具體結構形態詳細陳 述如后: 請參看第一至三圓所示,本發明之光學掃瞄手段(1〇)主要係 ❾用來發出-掃瞒光束’並以影像娜裝置⑽)來擁取待測物(⑷ 之光強影像。而且多次反射稜鏡感測器(2〇)可以設置在旋轉手段 (30)上,藉由旋轉角度而可調整多次反射稜鏡感測器(2〇)的角 度,當掃瞄光束穿透或反射一良品(1)而入射至多次反射稜鏡感測 器(20)時,藉由旋轉手段(30)轉動多次反射棱鏡感測器(2〇),使 入射之掃猫光束罪近至臨界角以作為基準面的光強度,並以影像 擷取裝置(40)擷取基準面光強度,用以作為基準影像。 另外,再以掃瞄光束穿透或反射一待測物(la)而入射至多次 反射稜鏡感測器(20)中,使掃瞄光束產生微小角度變化而偏離原 12 201018896 *' ... - —AaA-/··^: -r..·^ =-1-= --T^y-y-si·1— J ^ ._. 一〜_____________________________ ______^ 本角度以造成光強度的變化,因研㈣像她裝置⑽)來擷取 待測物(la)光強度,以作為測試影像。 請參看第-至三圖所示,再運用運算手段⑽將基準影像與 測試影像進行比對’進而可以得到待測物(la)之缺陷資訊。 上述裝置基本特徵巾’多次反射稜鏡感卿⑽係為一四邊 形稜鏡感測器。該影像擷取裝置(4〇)係為一電荷搞合元件CCd。 貳•本發明具體實施例 ^ 2.1光學掃瞄手段第一種實施例 請參看第七圖所示,於本實施例中係為一種穿透式透明物件 ϊ測技術,為達此目的,其包括一用以發出掃瞄光束的雷射光源 (11)、一用以擴大掃瞄光束的第一透鏡(12)、一用以組絕該掃瞄 光束之反射光返回至該雷射光源(π)的光阻隔器(13)、一用以濾 除雜散光源的空間濾波器(14)、一偏極板(15)及一檢偏板(16)。 空間濾波器(14)係介置於光阻隔器(13)與該第一透鏡(12)之間。 另偏極板(15)係介置於該第一透鏡(12)與該待測物(la)之間,其 Ο 透光軸與X軸平行,以供該掃瞄光束入射而穿透該待測物(la)。 又,檢偏板(16)係用來調整掃瞄光束透光軸方位角,使掃瞄光束 之強度調整至影像擷取裝置(4〇)可以解析的程度。 2. 2光學掃瞄手段第二種實施例 請參看第八圖所示,於本實施例中係為一種垂直入射反射式 量測技術,為達此目的,其包括用以發出該掃瞄光束的雷射光源 (11)、一用以擴大掃瞄光束的第一透鏡(12)、一用以組絕該掃瞄 光束之反射光返回至該雷射光源(11)的光阻隔器(13)、一的空間 濾波器(14)、一偏極板(15)、一偏極分光鏡(17)、一四分之一波 13 201018896 ~ 、.尨^1"”·-*1^ ’ 1 a 丨.丨 lrlT *--1 ιρ· I τη*· ...........-^-r- -r-.....r .. , .1 — ·>由—_ -...»- ----------^· -------.· —— a*. · —........—·Λ^ ·~~ T ’ .泣··*---一.. 一.---- . • 片(18)及一檢偏板(16)。 再請參看第八圖所示,本發明係以雷射光源(11)發出作為掃 瞄光束的雷射光源(11),且空間濾波器(14)係介置於該光阻隔器 (13)與該第一透鏡(12)之間,用來濾除雜散光源。另,偏極板(15) 介置於第一透鏡(12)與待測物(ia)之間,使其偏極在y方向。並 以偏極分光鏡(17)反射掃瞄光束,再以四分之一波片(18)使掃瞄 光束成為圓偏極光,在透過透光軸與γ軸平行的檢偏板(16)來調 整掃瞄光束之出射強度,並使掃瞄光束經一第二透鏡(12〇)聚焦, ® 再由待測物(la)反射沿原光路返回至第二透鏡(12〇),並再次通過 四分之一波片(18)而成為水平偏極光,再經偏極分光鏡穿透 而入射至多次反射稜鏡感測器(2〇)中,再調整旋轉手段(30)之角 度,使掃瞄光束之入射角靠近臨界角,並經第三透鏡(121)成像於 影像擷取裝置(40)上,再由運算手段(50)來分析該待測物(la)之 缺陷。 2. 3光學掃瞒手段第三種實施例 ❹ 請參看第九圖所示,於本實施例中係為一種斜向入射反射式 量測技術,為達此目的,其包括一用以發出掃瞄光束的雷射光源 (11)、一用以擴大掃瞄光束的第一透鏡(12)、一用以組絕該掃瞄 光束之反射光返回至該雷射光源(11)的光阻隔器(13)、一空間濾 波器(14)、一偏極板(15)及一檢偏板(16)。 於本實施例中,係以雷射光源(11)發出掃瞄光束,空間濾波 器(14)係介置於光阻隔器⑽與第一透鏡(12)之間,以供掃瞄光 束入射以濾除錄光源。且偏極板⑽介置於該制物〇a)與該 多次反射稜鏡感測器(20)之間,該偏極板(15)透光轴與χ軸平行, 201018896 此一也一丄一—- _ 匕‘ 丨.一1. 〜 _ 以供該掃瞒光击棘+ 一一一——————一 疋术针向入射該待測物(la)。另,檢偏板(16)介置於 多:二反射稜鏡感測_)_賴取裝置⑽之間,且檢偏板(16) 透光軸與X軸平行’用以調整掃瞒光束之出射強度,並使掃瞒光 束之入射角靠近臨界角,再經一第二透鏡⑽)成像於該影像榻取 裝置(4())上’再由該運算手段⑽)分析該待測物(la)之缺陷。 2. 4雙軸移動平台的實施例 4參看第七至九騎*,為選擇待_㈤所欲量測之部 ❻位故本發明更包括一供該待測物(la)置放的雙轴移動平台 ⑽)’再以該運算手段⑽)肋控繼雙轴鑛平台⑽往X或γ 軸方向移動’以控制擷取該待測物(la)所需掃猫的資料,而可緣 出量測結果。 2· 5運算手段的實施例 々睛參看第五至七圖所示,本發明於一種具體實施例中,該運 算手4又(50)係為-電腦(50a),其包含一用以操取由該影賴取裝 置(40)所提供之影像的影像_取卡(圖中未示),及一分析軟體, 魯°亥刀析軟體用以將基準影像與測試影像相比’再經過電腦(5〇a)分 析影像,即可得到待測物(la)之缺陷資訊。 參·本發明之原理 3· 1待測物之光線偏向推導 當光線入射至具有微小内部偏移角的透明平板待測物〇a)如 第-圖所示。内部偏移角為《,在第—界面的人射角為①,第二界 面反射角為t。根據幾何光學理論,偏向角度可寫成 β~θα^θη-α (1) 如第二圖所示,假設光線垂直入射於第一界面,即〜=〇、 15 201018896 l=sm (㈣ηα)在這裡的”為平板之折射率。所以偏向角度又可重寫為 β = sin'^wsinaj-a * (« -1)α (2) 從上式可知,角度偏向是正比於内部偏移I當我們已知平板的 折射率’就可以藉由測量0角可經由公式得到制物㈤内部偏移 角α 0 3.2·待測物表面高度變化和偏向角度之關係 由第二圖中得知,測試光束入射於待測物(la),當待測物(la) 表面有_變化時,造成光路偏移原來路徑方向,形成+减‘ 角度偏移量。在錄置巾’雜光先人射至制物⑽再折射出 去。若待測物(la)的表面(平面i與平面2)互相平行時,透射出 去的絲不會產生肖度的偏移,若制物㈤_表關產生以 的角度,則會分別形成+滅的偏向角度變化量。此現象可由第 二圖的幾何關係圖推導出來。㈣〜岭―*,其巾α為待測 物(la)内部偏移的角度,當第二面的斜率為正時,我們定義“值為 正,反之,則or為負。Θ,2為出射角,„為待測物(la)的折射率,& ❿為每單位掃描的移動距離’ ΔΛ為每單位掃描的高度變化。已知々和 «幾乎是維持一個線性關係◊因此表面高度差可寫成 bh--adx , (3) 故掃描此平板,即可求出每一個位置上的从值,而求出待測 平板之缺陷或傾斜角度。 4 3· 3入射角a與外角0推導 當雷射光從空氣(其折射率功=1. 〇〇〇3)中以角度β入射到折射 率/¾ (=1. 51509)之直角稜鏡,如第三圖所示,可以求得0和鏡内 入射角q之間的關係,以及折射角&及入射角q關係,根據 16 201018896 一._丨丨 | -. _ . ... -—-----------w〜二一 定律可寫岭_個枝:——- ⑷ ⑸ ⑹ ⑺ ⑻ (9) «, sin^j =„2 sin^ nisin^ = «2 sine 移項第(4)式,可得折射角02及入射Μ關係: θ2 V «2 , 移項第(5)式’可得法線與入射光線夾角與外角^關係 Θ =sin_1 ,2sin0、 ~~»Γ. 又巧=45。+0, 把CO式代入(8)式可得入射角3與外角0關係式 ?, = 45° + sin->^2 3.4臨界角與全反射原理 如第三圖所示,當光線由光密介質/7!(折射率較大的介1 % 入射光疏介質/¾ (折射率較小的介質),稱之為内反射,在内反 ❿ 的情況下,折射光會較偏離法線,即入射角朴於折射角4。所 當^射角繼續增大時,之後將會使得折射角先達到90。,折射角 90°時所對應的人耗我們稱之麟界知,而任何大於臨 ^光線,都只會妓射_,看销騎絲,此現象稱^ 反射。 ' 根據(4)式’我們把θ丨改為《,再把《=9〇。、直 Λ (吐515〇9)、空氣折射率心屬3)代入⑷式即兄可得至 ^«41.317° 〇 所以根據第⑼可知,人射角W,故會產生全反射現象。 17 201018896 ..............................______________________ 一. 11 -----, |___^.. 一一 ..-_—·丨一 ... _ " '»W*l···" — 11111 1,1 —^「-1. l_—^»»_W:.:;......一 根據P極化光的Fresnel equations可知其反射係數為: _ n2 cos θλ - nx cos ρ η2 cos θχ + «, cos θ% (10) 其中◊為反射係數’ Λ為折射率較大的介質,处為折射率較小 的介質,Θ為入射角,為折射角。 反射率&疋義為反射係數絕對值的平方即為·· Ά2 (id 上式為一次反射之反射率。 Ο 若為兩次反射時,則兩次反射率心為反射係數平方之絕對值 平方即為: 〜=卜%丨 (12) 我們把直角稜鏡拆射率(/^=1. 51509)、空氣折射率及(=1. 〇〇〇3) 以及入射角^取30。到45。的範圍先後代入⑹、(1〇)、(11)式,可 得到第四圖。我們發現在臨界角41. 317。近附的反射率變化是最靈 敏的。 ❹ 再考慮兩次反射之反射率,一樣把直角棱鏡折射率〇 =1.51509)、空氣折射率以及入射角^取3〇。到45。的範圍先後代入 (6)、(10)、(11)、(12)式,可得到第五圖。觀察第四圖、第五圖 可知,經過兩次反射的反射率對角度的變化會比一次反射的變化 來的明顯’亦可增加反射次數以增加角度量測解析度。 根據(9)式,在/¾ =1. 51509、/¾ =1. 〇〇〇3的條件下,令 0,=^41.317°,可得到外角〜_5.585。。我們把0角度範圍取_丨4。到-4 °、/21=1. 51509、及=1· 〇〇〇3 先後代入(9)、(6)、(10)、(11)、(12) 式可得到第六圖。 201018896 - 再觀察第六圖在臨界角所對應的外角-5· 585。附近的反射率 變化是最靈敏的。所以我們取外角-5. 585。附近的角度來做量測。 由於光強度值是外角θ的函數,外角變化μ又與偏向角a成正 比,而根據公式(2),0角又與《角成正比,以及根據公式 ⑶’因此我們可以利用光強度變化量叫2的值’來求出待 測之平行板的傾角《,或求出此平行板的表面或内部缺陷M。 的值可由影像擷取裝置(4〇)量測之,分別記錄經待測物(ia)(平 行板)與標準平板後之光強度值,取出其間影像擷取裝置(4〇)影 ® 像之光強度差值,即可快速獲得待測物(la)缺陷資訊。 3.5待測物件缺陷和臨界角強度之關係 首先’先將未有刮痕之待測物(la)放置於多次反射稜鏡感測 器(20)與偏極板(15)(其透光軸與x軸平行)之間,然後轉動旋轉 手段(30)(Rotation Stage),調整光線靠近臨界角,為基準面的 強度,由影像擷取裝置(4〇)拍攝其影像,當作基準影像。之後再 把未有刮痕之待測物(la)換成有刮痕(缺陷)之待測物(la),光線 ❷入射至缺陷待測物(la),產生光線偏移,使得光線入射至感測器 會偏離原本的角度,而造成光強度上升或下降,之後再由影像擷 取裝置(40)拍攝其影像,當作測試影像,利用電腦⑽儲存圖 片,再將測試影像與基準影像相比,即可知道待測物(la)缺陷。 肆•本發明之實驗例 4· 1本發明採用之光學元件及儀器介紹: (1) 雷射光源(11):係為波長632. 8nm之系統光源。 (2) Isolator光阻隔器(13):避免一個系統的反射光返回雷射, 造成雷射損傷。 201018896 «一,.,*···*^·^^·***»***··'·.—·^·.^·—·!,-. ________ --- η- ____ _ _'._...... ,__ 1 —,,,*!_ --------------------------------------5ϋ.ΐί4Ϊ.—.-.i-=*--->S=·—- (3) Spatial Filter空間濾波器(14):使其在物鏡焦距上以便濾 除雜散光源。 (4) 第一透鏡(12)、第二透鏡(12〇)及第三透鏡(121):可擴大光束 或是聚焦光點。 (5) (PL)Polarizer偏極板(15):可調整其角度,以改變光偏極方 向。 (6) Rotation Stage旋轉手段(3〇):可改變角度的平台。 (7) Ant(Analyzer檢偏板(16):可調整其角度,以改變光強度大 ❹小。[8] Luis Miguel Sanchez-Brea, Philip Siegmann, Maria Aurora Rebollo, and Eusebio Bernabeu, "Optical technique for the automatic detection and measurement of surface defects on thin metallic wires M, Applied Optics, 39, 539-545, 2000. The object of the present invention is to provide a method and a device for measuring the defect of a CCD crop part by a critical angle method. Because of the flexible selectivity of the structure for the detection application, the high resolution of the object to be tested can be made into an ultra-smooth surface. Low-resolution detection of measurement or high surface change, thus having many advantages such as non-contact, wide range, high sensitivity, fast and instant detection, high precision, easy operation, and high stability detection against air disturbance. The technical means adopted by the invention is to place the good product on the optical path between the optical scanning means and the multiple reflection 稜鏡 sensor, and then emit a scanning beam by the optical scanning means to penetrate or reflect the good product to the multiple reflections. In the 稜鏡 sensor, when the scanning beam is incident on the multiple reflection 稜鏡 sensor, Rotate the 〇reflector sensor a plurality of times to adjust the scanning beam to the critical angle as the reference surface light intensity, and then use the image capturing device to capture the reference surface light intensity as the reference image, and use the optical broom The means sends a broom beam to penetrate or reflect a sample to be measured and is incident on the plurality of anti-theft thieves to detect ϋ 'make the sweeping beam to a small angle and deviate from the original angle to cause a change in light intensity, and The device takes the surface light intensity of the object to be tested as a test image, and then compares the reference image with the test image by the operation means to obtain the defect information of the object to be tested. [Embodiment] 基本·The basic technical features of the present invention 201018896 t.· ---------- 'Wir,i"a->sga.itej.-"ir» -νη ^ 11 .............. .. | 丨_________ ___ . "^ 一一一一一一—————————— 1.1 The characteristics of the method of the present invention can be seen in Figures 7 to 9 'The main body of the invention will The combination of tender image technology and critical angle technique, when the beam is incident on the object to be tested (10), will cause penetration or reflection due to the change of the surface of the object (10). The beam has a slight (four) degree of change, so that the light intensity becomes larger or smaller due to the angle near the critical angle, and then the image of the defect light is captured by the image capturing technique, and then compared with the standard surface image, The defect and the shape of the object to be tested (la), in order to achieve the above effects, the present invention provides an optical scanning method (10), a multi-reflection sensor (2), and a driving device. The secondary reflection prism sensor (20) changes the angle of rotation (3〇), an image capture device (4〇), and an operation means (50). Referring to Figures 5-7, the specific method of the present invention places a good product (1) on the optical path between the optical scanning means (10) and the multiple reflection 稜鏡 sensor (2 〇). Then, the optical scanning means (10) sends out a scanning beam to penetrate or reflect the good (丨) to the multiple reflection 稜鏡 sensor (20). When the scanning beam is incident on the multi-reflection 稜鏡 sensor (20), the φ angle of the reflection 稜鏡 sensor (2〇) is rotated by the rotation means (30) to adjust the incident angle of the scanning beam. The reference light intensity is taken as the reference image by the image capturing device (4 〇) near the critical angle as the light intensity of the reference surface. Referring again to Figures 7 to 9, the optical scanning means (1〇) emits a scanning beam to penetrate or reflect an object to be tested (la) and is incident on the multi-reflection sensor (2〇). _, the scanning beam is caused by a slight angle change and deviates from the original angle to cause a change in light intensity. Then the image capturing device (40) extracts the surface light intensity of the object to be tested (ia) as a test image. Referring to the seventh to ninth diagrams, the reference image is compared with the 201018896 row by the computing means (50), and the preferred embodiment of the multiple reflection 稜鏡 sensor (10) can be obtained. — Dimorphic sensor. Another preferred embodiment of the image device (10) can be an electrical component CCD. 1.2 The device features of the present invention are shown in the seventh to ninth. The present invention mainly combines the image picking technique with the critical angle method. When the light beam is incident on the object to be tested ((8), it will be caused by the high side of the object. The 'transparence of the ray _ beam has a small (four) degree of change' to make the light intensity become smaller or smaller due to the closer angle of the sacred boundary, and then to extract the image of the image defect light intensity, and then with the fresh image In comparison, the defects and impurities of the object to be tested (10) can be obtained, which can achieve the above-mentioned effects, including - optical scanning means 〇〇), - image photographic device (40), - rotating means (10), and multiple reflections 稜鏡The sensor (20) and the operation means (50), the specific structural form of the present invention will be described in detail as follows: Please refer to the first to third circles, the optical scanning means (1) of the present invention is mainly used. Used to emit a -broom beam' and use the image sensor (10) to capture the object to be tested ((4) light intensity image. And the multiple reflection 稜鏡 sensor (2〇) can be set on the rotating means (30) The angle of the multi-reflection 稜鏡 sensor (2〇) can be adjusted by rotating the angle when the beam is scanned Passing or reflecting a good product (1) and incident on the multi-reflection 稜鏡 sensor (20), rotating the multi-reflection prism sensor (2〇) by rotating means (30), making the incident cat's beam sin The critical angle is used as the light intensity of the reference surface, and the reference surface light intensity is taken as the reference image by the image capturing device (40). In addition, the scanning beam penetrates or reflects a sample to be tested ( La) is incident on the multi-reflection 稜鏡 sensor (20), causing the scanning beam to change slightly from the original 12 201018896 *' ... - AaA-/··^: -r..·^ =-1-= --T^yy-si·1—J ^ ._. One ~_____________________________ ______^ This angle causes the change in light intensity, and the research (4) like her device (10)) draws the object to be tested (la ) Light intensity as a test image. Please refer to the figure-to-three, and then use the calculation method (10) to compare the reference image with the test image to obtain the defect information of the object (la). The basic feature of the above device is that the multiple reflections of the sensor (10) are a quadrilateral 稜鏡 sensor. The image capturing device (4〇) is a charge engaging element CCd. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT 2.1 Optical scanning means The first embodiment is shown in the seventh figure. In this embodiment, it is a transmissive transparent object speculating technology. To achieve this, it includes a laser source (11) for emitting a scanning beam, a first lens (12) for expanding the scanning beam, and a reflected light for omitting the scanning beam to return to the laser source (π) a light blocker (13), a spatial filter (14) for filtering out stray light sources, a polarizing plate (15) and an analyzer (16). A spatial filter (14) is interposed between the light blocker (13) and the first lens (12). The polarizing plate (15) is interposed between the first lens (12) and the object to be tested (1), and the transmission axis is parallel to the X axis, so that the scanning beam is incident and penetrates the Test object (la). Moreover, the analyzer (16) is used to adjust the azimuth of the transmission beam transmission axis so that the intensity of the scanning beam is adjusted to the extent that the image capturing device (4〇) can be resolved. 2. 2 optical scanning means, the second embodiment is shown in the eighth figure, in this embodiment is a vertical incidence reflection type measuring technology, for this purpose, which includes to emit the scanning beam a laser source (11), a first lens (12) for expanding the scanning beam, and a light blocker for returning the reflected light of the scanning beam to the laser source (11) (13) ), a spatial filter (14), a polarizing plate (15), a polarizing beam splitter (17), a quarter wave 13 201018896 ~ , .尨^1""·-*1^ ' 1 a 丨.丨lrlT *--1 ιρ· I τη*· ...........-^-r- -r-.....r .. , .1 — ·> By -_ -...»- ----------^· -------.· —— a*. · —........—·Λ^ ~~ T ' . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The light source (11) emits a laser light source (11) as a scanning beam, and a spatial filter (14) is interposed between the light blocker (13) and the first lens (12) for filtering In addition to stray light sources. In addition, the polarizing plate (15) is placed in the first through (12) Between the object to be tested (ia), make it polarized in the y direction, and reflect the scanning beam with a polarizing beam splitter (17), and then use the quarter wave plate (18) to make the scanning beam. To become a circularly polarized light, the output of the scanning beam is adjusted by an analyzer (16) that is parallel to the γ axis through the transmission axis, and the scanning beam is focused by a second lens (12〇). The reflection of the measuring object (la) returns to the second lens (12〇) along the original optical path, and passes through the quarter-wave plate (18) again to become horizontally polarized light, and then penetrates through the polarizing beam splitter to enter the multiple reflection. In the 稜鏡 sensor (2〇), the angle of the rotating means (30) is adjusted so that the incident angle of the scanning beam approaches the critical angle, and is imaged on the image capturing device (40) via the third lens (121). Then, the defect of the object to be tested (1) is analyzed by the operation means (50). 2. The third embodiment of the optical broom means ❹ See the ninth figure, which is a kind of oblique in this embodiment. To the incident reflective measurement technique, for this purpose, it comprises a laser light source (11) for emitting a scanning beam, and a first transparent light for expanding the scanning beam. (12) a light blocker (13) for resetting the reflected light of the scanning beam to the laser light source (11), a spatial filter (14), a polarizing plate (15) and a The detecting plate (16). In this embodiment, the scanning light beam is emitted by the laser light source (11), and the spatial filter (14) is interposed between the light blocking device (10) and the first lens (12). The scanning beam is incident to filter out the recording source. And the polarizing plate (10) is interposed between the workpiece 〇a) and the multiple reflection 稜鏡 sensor (20), and the transmission axis of the polarizing plate (15) is parallel to the χ axis, 201018896丄一— _ 匕' 丨. A 1. _ _ for the broom to hit the spine + one by one --- - a needle is incident on the object (la). In addition, the analyzer (16) is placed between the two: two reflections 稜鏡 sensing _) _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The exiting intensity, and the incident angle of the broom beam is close to the critical angle, and then imaged on the image reclining device (4()) via a second lens (10), and then the object to be tested is analyzed by the computing means (10) (la) Defects. 2. 4 embodiment of the biaxial mobile platform refers to the seventh to nine rides*, in order to select the desired position to be measured by the _(f), the present invention further includes a pair for the object to be tested (la) The axis moving platform (10))' is further controlled by the operation means (10) to control the biaxial ore platform (10) to move in the X or γ axis direction to control the data of the cat to be extracted for the object to be tested (la), and the edge is Out of the measurement results. Embodiments of the second computing means, as shown in the fifth to seventh embodiments, in one embodiment, the computing hand 4 (50) is a computer (50a), which includes a Taking the image of the image provided by the image capture device (40), the card (not shown), and an analysis software, the software is used to compare the reference image with the test image. The computer (5〇a) analyzes the image to obtain the defect information of the object to be tested (la).参· Principles of the Invention 3·1 Light Derivation of the Object to Be Measured When the light is incident on the transparent flat object to be tested (a) having a small internal offset angle, as shown in the first figure. The internal offset angle is ", the angle of incidence of the person at the first interface is 1, and the angle of reflection of the second interface is t." According to the theory of geometric optics, the deflection angle can be written as β~θα^θη-α (1) As shown in the second figure, it is assumed that the light is perpendicularly incident on the first interface, ie ~=〇, 15 201018896 l=sm ((4)ηα) is here "is the refractive index of the plate. So the deflection angle can be rewritten as β = sin'^wsinaj-a * (« -1)α (2) From the above formula, the angle deviation is proportional to the internal offset I when we It is known that the refractive index of the plate can be obtained by the formula by measuring the 0 angle. (5) Internal offset angle α 0 3.2· The relationship between the surface height change of the object to be tested and the deflection angle is known from the second figure. When incident on the object to be tested (la), when the surface of the object to be tested (la) has a change of _, the optical path is offset from the original path direction, forming a + minus 'angle offset. In the recording towel, the stray light is shot by the ancestors. The product (10) is refracted again. If the surface of the object to be tested (la) (plane i and plane 2) are parallel to each other, the transmitted filament does not have a slight shift, if the workpiece (5) _ The angle will form the amount of deviation of the deviation angle of + ext. This phenomenon can be derived from the geometric relationship diagram of the second figure. (4) ~ ridge - *, whose towel α is the angle of the internal offset of the object to be tested (la). When the slope of the second side is positive, we define "the value is positive, otherwise, or is negative." Θ, 2 is the exit angle, „ is the refractive index of the object to be tested (la), & ❿ is the moving distance per unit scan' ΔΛ is the height change per unit scan. It is known that 々 and «almost maintain a linear relationship ◊ Therefore, the surface height difference can be written as bh--adx, (3). Therefore, by scanning the plate, the slave value at each position can be found, and the defect or tilt angle of the plate to be tested can be obtained. 4 3· 3 incident angle a and the outer angle 0 are derived when the laser light is incident from the air (its refractive index function = 1. 〇〇〇3) at an angle β to a right angle 折射率 of the refractive index /3⁄4 (=1. 51509), as shown in the third figure. , can obtain the relationship between 0 and the incident angle q in the mirror, and the relationship between the angle of refraction & the angle of incidence q, according to 16 201018896 a._丨丨| -. _ . ... ------- ------ w ~ two law can write ridge _ branch: --- (4) (5) (6) (7) (8) (9) «, sin^j = „2 sin^ nisin^ = «2 sine shift item (4) Equation, the refraction angle 02 and the incident Μ relationship can be obtained: θ2 V «2 , the shift term (5) can be obtained from the angle between the normal and the incident ray and the outer angle ^ Θ = sin_1 , 2sin0, ~~» Γ. . +0, Substituting CO for equation (8) gives the relationship between incident angle 3 and external angle 0?, = 45° + sin->^2 3.4 Critical angle and total reflection principle as shown in the third figure, when the light is Light-tight medium / 7! (1% of the refractive index is larger than the incident medium / 3⁄4 (the medium with a smaller refractive index), which is called internal reflection. In the case of internal ❿, the refracted light will deviate from the method. The line, that is, the angle of incidence is simple at the angle of refraction 4. When the angle of the shot continues to increase, the angle of refraction will first reach 90. The angle corresponding to the angle of 90° is consumed by us. Anything greater than Lin ^ ray, will only shoot _, look at the pin tying wire, this phenomenon is called ^ reflection. ' According to (4) formula we change θ 丨 to ", then "=9 〇., straight Λ ( Spit 515〇9), the air refractive index is 3) Substitute (4) is the brother can get to ^«41.317 ° 〇 Therefore, according to the (9), the human angle W, it will produce total reflection. 17 201018896 ..............................______________________ One. 11 -----, |___^.. One by one. .-_—·丨一... _ "'»W*l···" — 11111 1,1 —^"-1. l_-^»»_W:.:;...... According to the Fresnel equations of P-polarized light, the reflection coefficient is: _ n2 cos θλ - nx cos ρ η2 cos θχ + «, cos θ% (10) where ◊ is the reflection coefficient ' Λ is a medium with a large refractive index, It is a medium with a small refractive index, and Θ is the angle of incidence, which is the angle of refraction. The reflectivity & 疋 is the square of the absolute value of the reflection coefficient is · 2 (id is the reflectivity of the primary reflection. Ο If In the case of two reflections, the square of the absolute value of the square of the reflection coefficient is the square of the reflection coefficient: ~= 卜%丨(12) We take the right angle 稜鏡 split rate (/^=1. 51509), air refractive index And (=1. 〇〇〇3) and the incident angle ^ take 30. to 45. The range is substituted into (6), (1〇), (11), and the fourth picture can be obtained. We found the critical angle 41. 317 The nearby reflectance change is the most sensitive. ❹ Consider the reflectance of the two reflections, and refract the right-angle prism. Rate 〇=1.51509), air refractive index and incident angle ^3 〇. To the range of 45. Substituting (6), (10), (11), (12), can get the fifth picture. Observe the fourth As shown in the figure and the fifth figure, the reflectance of the two reflections will be more obvious than the change of the primary reflection. The number of reflections can also be increased to increase the angular measurement resolution. According to the formula (9), at /3⁄4 =1. 51509, /3⁄4 =1. Under the condition of 〇〇〇3, let 0,=^41.317°, get the outer angle ~_5.585. We take the angle range of 0 from _丨4 to -4 °, /21=1. 51509, and=1· 〇〇〇3 The sixth figure can be obtained by substituting (9), (6), (10), (11), (12). 201018896 - Then observe the sixth picture The change in reflectance near the critical angle is -5·585. The change in reflectivity is the most sensitive. So we take the external angle - 5.585. The angle is measured nearby. Since the light intensity value is a function of the external angle θ, the outer angle The change μ is proportional to the deflection angle a, and according to the formula (2), the 0 angle is proportional to the "angle", and according to the formula (3) 'so we can use the value of the light intensity change called 2" The inclination angle of the parallel plate to be tested is determined, or the value of the surface or internal defect M of the parallel plate is determined by the image capturing device (4〇), and the object to be tested (ia) is recorded separately (parallel plate) ) The light intensity value after the standard flat panel is taken out, and the light intensity difference between the image capturing device (4〇) image is taken out to quickly obtain the defect information of the object to be tested (la). 3.5 Relationship between the object defect and the critical angle strength of the object to be tested Firstly, the undetected object (la) is placed on the multi-reflection 稜鏡 sensor (20) and the polarizing plate (15) (the light transmission Between the axis and the x-axis, then rotate the rotation means (30) (Rotation Stage) to adjust the light close to the critical angle, which is the intensity of the reference surface. The image is taken by the image capture device (4〇) as the reference image. . Then, the undetected object (la) is replaced with a scratch (defect) object (la), and the light ray is incident on the defect object (la), causing a light shift to make the light incident. When the sensor deviates from the original angle, the light intensity rises or falls, and then the image is taken by the image capturing device (40) as a test image, and the computer (10) is used to store the image, and then the test image and the reference image are used. In contrast, the defect of the object to be tested (la) can be known.肆•Experimental Example of the Invention 4. 1 Introduction to the optical components and instruments used in the present invention: (1) Laser light source (11): a system light source having a wavelength of 632.8 nm. (2) Isolator light blocker (13): Prevents the reflected light of one system from returning to the laser, causing laser damage. 201018896 «一,.,*···*^·^^·***»***··'·.—·^·.^·—·!,-. ________ --- η- ____ _ _ '._...... ,__ 1 -,,,*!_ ------------------------------- -------5ϋ.ΐί4Ϊ.—.-.i-=*--->S=·-- (3) Spatial Filter spatial filter (14): make it focus on the focal length of the objective lens Stray light source. (4) The first lens (12), the second lens (12 〇), and the third lens (121): the light beam or the focused spot can be enlarged. (5) (PL) Polarizer polarizer (15): The angle can be adjusted to change the direction of the light pole. (6) Rotation Stage rotation (3〇): A platform that can change the angle. (7) Ant (Analyzer analyzer board (16): The angle can be adjusted to change the light intensity to a small size.

A (8) i WaveplateC四分之一波片(18):光經過此波片,會變成圓 偏極光。 (9) 影像擷取裝置(40):用來拍攝待測物(丨幻的工具。 (10) 多次反射棱鏡感測器(20):在臨界角附近做為微小角度感測 之用,其反射次數大於一次。 ❹ 4.2以臨界角法結合CCD作缺陷量測之實驗架構 本實驗例整個穿透式光學系統架構如第七圖所示,第八圖為 反射式垂直入射小面積量測架構,第九圖為反射式斜向入射測量 大面積架構。主要可分成三個部份:(A)光源部份,(幻光路架構 與(C)信號處理部份。 (A) 掃瞄光束,該光源為雷射光源(11)。 (B) 光路架構,其包括: 一個光阻隔器(13)(IS〇lat〇r)以避免—個系統的反射光返回 雷射。從光阻隔器(13)的出來光入射至空間濾波器(14)(Spatial 20 201018896 "~ί*^Β8^^ ιιι_· I I m l ji τη mir-TM m i !_ ' filter)和透鏡(12)(Lens)擴大光束。擴束光經由一偏極板 (15) (其透光軸平行於X轴),然後入射至靠近臨界角情形之多次 反射棱鏡感測器(20) ’即可使用旋轉手段(30)(R〇tati〇n stage) 來調整多次反射稜鏡感測器(20)(即平形四邊形稜鏡)的入射角, 再由影像擷取裝置(40)偵測結果。 (C)信號處理包括:影像擷取裝置(4〇)、電腦(5〇a)、檢偏板 (16) Ant:可旋轉檢偏板(16)來調整影像擷取裝置(4〇)的光強度以 避免CCD亮度飽和。 •影像擷取裝置(40)、電腦(5〇a):利用電腦(5〇a)儲存強度影像當 做基準影像。在表面的量測當中,把一待測物(la)放置在偏極板 (15)和多次反射稜鏡感測器(2〇)之間,而測試面是朝向擴束光。 通過平板的光入射至多次反射稜鏡感測器(2〇)。因此,測試影像 由影像_取裝置(40)記錄下來,然後由電腦(5〇a)儲存。對照測試 以及基準影像顯示出在強度變化圖形中顯示著缺陷訊息,同時也 正比於表面高度。 ❹ 4.3穿透式對透明待測物量測 本發明係以臨界角原理為基礎再經過一些巧妙的光路安排, 用影像擁取裝置(40)拍攝待測物(ia)之缺陷光強影像。如第七圖 所示,以雷射當光源,入射經由一個光阻隔器(13) (Is〇lat〇r) 以避免一個系統的反射光返回雷射,從光阻隔器(13)的出射光入 射至空間濾波器(14) (Spatial filter)和透鏡(12)擴大光束, 經過偏極板(15)PL (Polarizer)(其透光轴與x轴平行),入射至 待測物(la) (Sample),可利用雙軸移動平台(6〇)選擇欲量測之部 位,光線經由多次反射稜鏡感測器(2〇),旋轉手段(3〇)(R〇tati⑽ 21 201018896 • _丨 11 — T 1~ii ... I |- — .. __A (8) i WaveplateC quarter-wave plate (18): Light passes through this wave plate and becomes a circular aurora. (9) Image capture device (40): used to capture the object to be tested (the tool for illusion. (10) Multi-reflection prism sensor (20): for small angle sensing near the critical angle, The number of reflections is greater than one time. ❹ 4.2 Experimental structure of the defect measurement by the critical angle method combined with CCD This experimental example shows the entire transmissive optical system architecture as shown in the seventh figure, and the eighth figure shows the small area measurement of the reflective vertical incidence. Architecture, the ninth is a large-area architecture for reflective oblique incidence measurement. It can be divided into three parts: (A) the light source part, (the phantom path structure and (C) signal processing part. (A) the scanning beam The light source is a laser source (11). (B) An optical path architecture comprising: a light blocker (13) (IS〇lat〇r) to avoid returning the reflected light of a system to the laser. The outgoing light of (13) is incident on the spatial filter (14) (Spatial 20 201018896 "~ί*^Β8^^ ιιι_· II ml ji τη mir-TM mi !_ 'filter) and lens (12) (Lens) Enlarge the beam. The beam expands through a polarizer (15) (the transmission axis is parallel to the X axis) and then incidents near the critical angle. Reflective prism sensor (20) 'You can use the rotating means (30) (R〇tati〇n stage) to adjust the angle of incidence of the multi-reflective 稜鏡 sensor (20) (ie, the flat quadrilateral 稜鏡), and then The result is detected by the image capturing device (40). (C) Signal processing includes: image capturing device (4〇), computer (5〇a), analyzer (16) Ant: rotatable analyzer (16) ) Adjust the light intensity of the image capture device (4〇) to avoid saturation of the CCD brightness. • Image capture device (40), computer (5〇a): Use the computer (5〇a) to store the intensity image as the reference image. In the measurement of the surface, a test object (la) is placed between the polarizing plate (15) and the multiple reflection 稜鏡 sensor (2 〇), and the test surface is toward the beam expanding light. The light is incident on the multi-reflection sensor (2〇). Therefore, the test image is recorded by the image capture device (40) and then stored by the computer (5〇a). The control test and the reference image show the intensity. The change graph shows the defect message and is also proportional to the surface height. ❹ 4.3 Transmissive versus transparent test object measurement The present invention is based on the critical angle Based on some ingenious optical path arrangement, the image capturing device (40) is used to capture the defect light intensity image of the object to be tested (ia). As shown in the seventh figure, the laser is used as a light source and incident through a light blocker. (13) (Is〇lat〇r) to prevent the reflected light of one system from returning to the laser, the light emitted from the light blocker (13) is incident on the spatial filter (14) (Spatial filter) and the lens (12) Through the polarizing plate (15) PL (Polarizer) (the transmission axis is parallel to the x-axis), it is incident on the object to be tested (la) (Sample), and the two-axis mobile platform (6〇) can be used to select the measurement. Part, light passes through multiple reflections 稜鏡 sensor (2〇), rotation means (3〇) (R〇tati(10) 21 201018896 • _丨11 — T 1~ii ... I |- — .. __

Mage)使入射角達到靠近臨界角產生靈敏的光強度變化,出射出^ 來的光線由於光強度太強,加入檢偏板(16) (Anaiyzer) ANt »調 整其透光軸方位角,使光強度調整至影像擷取卡能解析的光強度 範圍,再經由影像擷取裝置(40)拍攝其影像,最後由電腦(5〇a)來 分析待測物(la)之缺陷。把基準影像即未有缺陷之待測物(la)與 測試影像即有缺陷之待測物(la)相比,再經過電腦(5〇a)分析軟體 分析影像,即可得到待測物(la)之缺陷。以電腦(5〇a)控制掃瞄xy 雙軸移動平台(60),擷取所有掃瞄的資料,並繪出量測結果。 4.4垂直入射反射式量測 如第八圖所示,以雷射當光源,入射經由一個光阻隔器(13) (Isolator)以避免一個系統的反射光返回雷射,從光阻隔器(η) 的出射光入射至空間濾波器(14) (Spatial filter)和第一透鏡 (12)擴大光束,經過偏極板(15)PL (Polarizer)(其透光轴與y 轴平行)’使其偏極在y方向。經一偏極分光鏡(丨7)pBS (Polarization Beam splitter)反射後,再經一四分之一波片 ❹ (18)(¾ Wave plate),使此光成圓偏極光,先經第二透鏡(12) 聚焦,經待測物(la)(Sample)反射沿原路徑返回第二第一透鏡 (12)),再一次通過四分之一波片(18)而成水平偏極光,因此再經 PBS穿透’入射多次反射棱鏡,調整旋轉平台(Rotation stage) 使其入射角靠近臨界角’其出射強度可藉由旋轉檢偏板(16)ANt (Analyzer)調整之。然後經第三透鏡(121)成像在影像擷取裝置 (40)上’經由影像擷取裝置(40)拍攝其影像,最後由電腦(5〇a)來 分析待測物(la)之缺陷。把基準影像即未有缺陷之待測物(1&)盘 測試影像即有缺陷之待測物(la)相比’再經過電腦(5〇a)分析軟體 22 201018896 w’ " "' "' "ΓΓ~ ^ ....., . .,,1,. IIILl—U III Fg^w^w~^· ill l.l _ ... ______ ' 分析影像,即可得到待測物(la)之缺陷。以電腦(50a)控制掃瞄Xy 雙軸移動平台(60),擷取所有掃瞄的資料,並繪出量測結果。 4.5斜向入射反射式量測 如第九圖’可利用雙軸移動平台(60)選擇欲量測之部位,同 樣以雷射光源(11)入射經由一個光阻隔器(13;) (Is〇lai:〇r;)以避 免一個系統的反射光返回雷射,從光阻隔器(13)的出射光入射至 空間濾波器(14) (Spatial filter)和第一透鏡(12)擴大光束。 斜向入射待測物(la)(Sample),經過偏極板(15)PL (P〇larizer) ❹(其透光触x辦行),人射至乡次反麵_卿⑽,調整 旋轉手段(30)(R〇tati〇n Stage)使其入射角靠近臨界角,其出射 強度可藉由旋轉檢偏ANt (Analyzer)調整之。然後經第二第一 透鏡(12)成像在影像操取裝置(4〇)上,經由影像擷取裝置(4〇)拍 攝其影像,最後由電腦(50a)來分析待測物(la)之缺陷。把基準影 像即未有缺陷之制物(⑻細試影像即有祕之制物⑽相 比’再經過電腦(5〇a)分析軟體分析影像,即可得到待測物(la)之 ❹缺陷。 陸•結論 因此,藉由上述技術特徵的建置,本發明係採用架構於檢測 應用上具有靈活選擇性,使待測物件可做超光滑表面的高解析度 =測或高表面變化的低解析度檢測,因而具有非接觸、大範圍、 〜靈敏度决速即時、尚精密、簡易操作以及抗空氣擾動的高穩 定性檢測等諸多的特點。 b以上所述’僅為本發明之一可行實施例,並非用以限定本發 明之專利範圍,凡舉依據下列申請專利範圍所述之内容、特徵以 23 201018896 /精神而4之其他變化的等效實施,皆應包含於本發明之專利 範圍内本發明之方法及其機構除上述優點外,並深具產業之 利用^ ’可有狀善習崎產生之敝,而頭具體狀於申請 ,利範圍之特徵’未見於同類物品,故而具實用性與進步性,已 符。發明專利要件,爰依法具文提出申請,謹請釣局依法核予 專利,以維護本申請人合法之權益。 【圖式簡單說明】Mage) makes the incident angle close to the critical angle to produce a sensitive light intensity change. The light emitted from the light is too strong. Add the analyzer (16) (Anaiyzer) ANt » adjust the azimuth of the transmission axis to make the light The intensity is adjusted to the range of light intensity that can be resolved by the image capture card, and then the image is captured by the image capture device (40), and finally the defect of the object to be tested (1a) is analyzed by a computer (5〇a). Comparing the reference image, that is, the undefective object to be tested (la) with the test image, that is, the defective object (la), and then analyzing the software analysis image by computer (5〇a), the object to be tested can be obtained ( La) defects. Control the scanning xy dual-axis mobile platform (60) with a computer (5〇a), capture all the scanned data, and plot the measurement results. 4.4 Vertical incidence reflection type measurement As shown in the eighth figure, with laser as the light source, incident through a light blocker (13) (Isolator) to avoid the return of a system of reflected light to the laser, from the light blocker (η) The exiting light is incident on the spatial filter (14) (Spatial filter) and the first lens (12) to enlarge the beam, and is deflected by a polarizing plate (15) PL (Polarizer) whose transmission axis is parallel to the y-axis. Extremely in the y direction. After being reflected by a polarizing beam splitter (丨7) pBS (Polarization Beam Splitter), it is then subjected to a quarter-wave plate (18) (3⁄4 Wave plate) to make the light into a circular apolar light, first through the second The lens (12) is focused, returned to the second first lens (12) along the original path by the sample (la) (Sample), and horizontally polarized by the quarter wave plate (18) again. The PBS is then passed through the 'incident multiple reflection prism, and the Rotation stage is adjusted so that the incident angle is close to the critical angle'. The emission intensity can be adjusted by rotating the analyzer (16) ANt (Analyzer). Then, the image is captured by the third lens (121) on the image capturing device (40). The image is captured by the image capturing device (40), and finally the defect of the object to be tested (1a) is analyzed by the computer (5〇a). The reference image, that is, the undefective test object (1&) test image, the defective test object (la) is compared with the 'computer (5〇a) analysis software 22 201018896 w' """'"ΓΓ~ ^ ....., . .,,1,. IIILl—U III Fg^w^w~^· ill ll _ ... ______ 'Analyze the image to get the object to be tested (la) Defects. The computer (50a) controls the scanning Xy biaxial mobile platform (60), captures all the scanned data, and plots the measurement results. 4.5 Oblique incident reflection measurement As shown in the ninth figure, the position to be measured can be selected by using the biaxial moving platform (60), and the laser light source (11) is also incident through a light blocker (13;) (Is〇 Lai: 〇r;) to prevent a system of reflected light from returning to the laser, the outgoing light from the light blocker (13) is incident on the spatial filter (14) (Spatial filter) and the first lens (12) to expand the beam. Obliquely incident on the object to be tested (la) (Sample), passing through the polarizing plate (15) PL (P〇larizer) ❹ (the light transmissive touch x do), the person shoots the town to the opposite side _ Qing (10), adjust the rotation The means (30) (R〇tati〇n Stage) has its incident angle close to the critical angle, and its exit intensity can be adjusted by the rotational deflection ANt (Analyzer). Then, the second first lens (12) is imaged on the image capturing device (4〇), the image is captured by the image capturing device (4〇), and finally the computer (50a) analyzes the object to be tested (1a). defect. The reference image, that is, the undefective product ((8) the fine-test image, that is, the secret object (10) compared to the computer (5〇a) analysis of the software analysis image, the defects of the object (la) can be obtained. Lu. Conclusion Therefore, with the above technical features, the present invention employs a structure that is flexible in detection applications, so that the object to be tested can be made ultra-smooth surface with high resolution = high or high surface variation. The resolution detection has many features such as non-contact, wide range, sensitivity, instant accuracy, simple operation, high stability detection against air disturbance, etc. b. The above description is only one of the feasible implementations of the present invention. For example, the scope of the patents of the present invention is not limited to the scope of the invention, and the equivalents of other changes in the scope of the following claims are to be included in the scope of the patent of the present invention. In addition to the above advantages, the method and the mechanism of the present invention have deep use of the industry's ability to produce a good shape, and the head is specific to the application, and the feature of the range is not found in the same kind. Products, and therefore progress of practicality, have met patent disclosure requirements, Yuan legally dead letter application, may wish to catch nuclear Patent Law Office, in order to protect the legitimate interest in the present applicant.] [Brief Description of the drawings

第-圖係本發明光經過待測物之偏向角度示意圖。 第-圖係本發__傾斜之高度差與角度偏向祕示意圖。 第二圖係本發明光線入射直角稜鏡光路之示意圖。 第四圖係本發明一次反射之反射率對應入射角0的關係示意圖。 第五圖係本發明兩次反射之反射率對應入射角0的關係示意圖。 第六圖係本發明兩次反射之反射率對應外角0的關係示意圖。 第七圖係本發明第一種光學掃瞄手段之架構示意圖。 第八圖係本發明第二種光學掃瞄手段之架構示意圖。 第九圖係本發明第三種光學掃瞄手段之架構示意圖。 【主要元件符號說明】 (1)良品 (la)待測物 (10)光學掃瞄手段 (11)雷射光源 (12)第一透鏡 (121)第三透鏡 (14)空間濾波器 (16)檢偏板 (18)四分之一波片 (120)第二透鏡 (13)光阻隔器 (15)偏極板 (17)偏極分光鏡 (20)多次反射棱鏡感測器 24 201018896 • (30)旋轉手段 (40)影像擷取手段 (50)運算手段(50) (50a)電腦 (60)雙軸移動平台 25The first figure is a schematic diagram of the deflection angle of the light passing through the object to be tested. The first picture is a schematic diagram of the height difference and angle deviation of the __ tilt. The second figure is a schematic diagram of the light incident at right angles of the present invention. The fourth figure is a schematic diagram showing the relationship between the reflectance of the primary reflection of the present invention and the incident angle 0. The fifth figure is a schematic diagram showing the relationship between the reflectance of the two reflections of the present invention corresponding to the incident angle 0. The sixth figure is a schematic diagram showing the relationship between the reflectance of the two reflections of the present invention and the external angle 0. The seventh figure is a schematic diagram of the structure of the first optical scanning means of the present invention. The eighth figure is a schematic diagram of the structure of the second optical scanning means of the present invention. The ninth drawing is a schematic diagram of the structure of the third optical scanning means of the present invention. [Description of main component symbols] (1) Good product (la) Object to be tested (10) Optical scanning means (11) Laser light source (12) First lens (121) Third lens (14) Spatial filter (16) Checking plate (18) Quarter wave plate (120) Second lens (13) Light blocker (15) Polar plate (17) Polarizing beam splitter (20) Multi-reflecting prism sensor 24 201018896 • (30) Rotating means (40) Image capturing means (50) Computing means (50) (50a) Computer (60) Dual-axis moving platform 25

Claims (1)

201018896 m· Jf·-------=^---V^I«BgB«lltMWlilir· . . :«-&quot;___L, pii&quot;I..1 ..... .^.-..-1,, I, rT1~~ ... -— I i mu i ^ -' -t ------- • 七、申請專利範圍: 1· 一種臨界角法結合CCD作物件缺陷量測之方法,其包括: 提供一光學掃瞄手段、一多次反射稜鏡感測器、一用以驅動 該多次反射稜鏡感測器改變角度的旋轉手段、一影像擷取裝置及 一運算手段; 將一良品置於該光學掃瞄手段與該多次反射棱鏡感測器之間 的光路上; © 以該光學掃瞄手段發出一掃瞄光束穿透或反射該良品後至該 多次反射稜鏡感測器’當該掃瞄光束入射至該多次反射稜鏡感測 器時’以該旋轉手段轉動該多次反射稜鏡感測器,使該掃瞄光束 調整靠近至臨界角以作為一基準面光強度; 再以該影像類取裝置擷取該基準面光強度作為一基準影像; 以該光學掃瞎手段發出一掃瞄光束穿透或反射一待測物而入 射至該多次反射稜鏡感測器,使該掃瞄光束產生微小角度變化而 偏離原本角度以造成光強度的變化; © 再以該影像擷取裝置擷取該待測物表面光強度以作為一測試 影像;及 ⑽_+段_基轉像能賴影像断輯,並依據 比對結果產生該待測物之缺陷資訊。 2·如4求項第1項所述之物件缺陷量測之方法,其中,所提 供之該光學掃瞄手段包括: 一雷射光源,其用以發出該掃瞄光束; -光阻隔器’狀組絕該細光束之反射光返回至該雷射光 源; .26 201018896 -透鏡’用以擴大該掃瞒光束; 一用以滤除雜散光源的空間濾波器 該第-透鏡H 心置於献阻隔器與 -偏極板’其介置於該透鏡與該侧物之間 軸平灯’以供該掃晦光束入射而穿透該待測物;及、 、χ 一檢偏板’肋調整該掃喊束透光軸方位角,使 束之強度調整至該影像操取裝置可以解析的程度。w 先 3·如請求項第1顧述之·缺陷制之方法, 供之該光學掃瞄手段包括: 、 吓捉 一用以發出該掃瞄光束的雷射光源; 一用以組絕反射光返回至該雷射光源的光阻隔器; 一用以擴大該掃瞄光束的第一透鏡; 一用以濾除雜散光源的空間濾波器,其介置於該光阻隔器與 該第一透鏡之間; 一介置於該第一透鏡與該待測物之間的偏極板,使其偏極在y ❹方向; 一偏極分光鏡,用以反射該掃瞄光束; 一四分之一波片,用以使該掃瞄光束成為圓偏極光; 一檢偏板,其透光轴與Y軸平行,用以調整該掃瞄光束之出 射強度,並使該掃瞄光束經一第二透鏡聚焦,再由該待測物反射 沿原光路返回至該第二透鏡,並再次通過該四分之一波片而成為 水平偏極光,再經該偏極分光鏡穿透而入射至該多次反射稜鏡感 測器中,再調整該旋轉手段之角度,使該掃瞄光束之入射角靠近 臨界角,並經第三透鏡成像成像於該影像擷取裝置上,再由該運 .27 201018896 ~~1-. 算手段來分析該待測物之缺陷。 一 4.如凊求項第1項所述之物件缺陷量測之方法,其中,所提 供之該光學掃猫手段包括: 一用以發出該掃瞄光束的雷射光源; 一光阻隔器’其可供該掃瞄光束入射以組絕反射光返回至該 雷射光源; 一第一透鏡,其用以將穿透該光阻隔器該掃瞄光束予以擴大; 一空間濾波器,其介置於該光阻隔器與該透鏡之間,可供該 掃瞄光束入射以濾除雜散光源; 一偏極板,其介置於該待測物與該多次反射稜鏡感測器之 間,該偏極板透光軸與x軸平行,以供該掃瞄光束斜向入射該待 測物;及 一檢偏板,其介置於該多次反射稜鏡感測器與該影像擷取裝 置之間,該檢偏板透光軸與X軸平行,用以調整該掃瞄光束之出 射強度,並以該旋轉手段使該掃瞄光束之入射角靠近臨界角,再 ❹經一第二透鏡成像於該影像擷取裝置上,而由該運算手段分析該 待測物之缺陷。 5‘如請求項第1項所狀物件缺陷制之方法,其更包括提 供-供該制物或該良品置放的雙軸移動平台,⑽控制該待測 物所欲量測之部位,再以該運算手段來控制該雙軸移動平台往X 或Y軸方向移動,以控制擷取該待測物掃瞄的資料。 &gt;、6.如請求項第丨項所述之物件缺陷制之方法,其中,該掃 瞒光束入射於該待測物且該待測物件的兩表面間具有高度變化 時’會使由該掃晦光束之光路偏移原來路徑方向,而形成+々或一々 28 201018896201018896 m· Jf·-------=^---V^I«BgB«lltMWlilir· . . :«-&quot;___L, pii&quot;I..1 ..... .^.-. .-1,, I, rT1~~ ... - I I mu mu ^ -' -t ------- • VII. Patent application scope: 1. A critical angle method combined with CCD crop defect The method includes the following steps: providing an optical scanning means, a plurality of reflection 稜鏡 sensors, a rotation means for driving the multiple reflection 稜鏡 sensor to change an angle, an image capturing device, and a Calculating means; placing a good product on the optical path between the optical scanning means and the multi-reflecting prism sensor; © emitting a scanning beam by the optical scanning means to penetrate or reflect the good product to the plurality of times The reflection 稜鏡 sensor 'when the scanning beam is incident on the multi-reflection 稜鏡 sensor' rotates the multi-reflection 稜鏡 sensor by the rotation means to adjust the scanning beam to a critical angle Taking the reference surface light intensity as a reference image; and using the optical broom means to emit a scan beam penetration or reflection The object to be tested is incident on the multi-reflection sensor, causing the scanning beam to change a slight angle and deviate from the original angle to cause a change in light intensity; © the image capturing device to extract the object to be tested The surface light intensity is used as a test image; and (10)_+ segment_base image can be image-broken, and the defect information of the object to be tested is generated according to the comparison result. The method of measuring the defect of the object according to Item 1, wherein the optical scanning means comprises: a laser light source for emitting the scanning beam; - a light blocker' The reflected light of the beamlet is returned to the laser source; .26 201018896 - lens 'to expand the broom beam; a spatial filter for filtering out stray light source Providing a barrier and a polarizing plate that is placed between the lens and the side of the shaft to illuminate the object to pass through the object to be tested; and, χ an analyzer plate rib Adjusting the azimuth of the sweeping beam transmission axis to adjust the intensity of the beam to the extent that the image manipulation device can resolve. w First 3 · The method of claim 1 according to the claim, the optical scanning means includes:, a scary light source for emitting the scanning beam; Returning to the light blocker of the laser light source; a first lens for expanding the scan beam; a spatial filter for filtering out the stray light source, the medium block being disposed between the light blocker and the first lens a polarizing plate disposed between the first lens and the object to be tested, having a polarization pole in a y ❹ direction; a polarizing beam splitter for reflecting the scanning beam; one quarter a wave plate for making the scanning beam a circularly polarized light; an analyzer plate having a transmission axis parallel to the Y axis for adjusting an exiting intensity of the scanning beam and causing the scanning beam to pass through a second The lens is focused, and then reflected by the object to be tested returns to the second lens along the original optical path, and passes through the quarter-wave plate again to become horizontally polarized light, and then penetrates through the polarizing beam splitter to enter the plurality of In the secondary reflection 稜鏡 sensor, the angle of the rotation means is adjusted to make the scanning beam Angle of incidence close to the critical angle, and the third lens image imaged by the image capturing means, and then by the transport .27 201 018 896 ~ 1- calculation means to analyze the defects of the test object. The method of measuring the defect of the object according to Item 1, wherein the optical brushing means comprises: a laser light source for emitting the scanning beam; a light blocker' The scan beam is incident to return the reflected light to the laser source; a first lens is used to expand the scan beam through the light blocker; a spatial filter is interposed Between the photo-blocker and the lens, the scanning beam is incident to filter out the stray light source; a polarizing plate is interposed between the object to be tested and the multi-reflection sensor The polarizing plate of the polarizing plate is parallel to the x-axis, so that the scanning beam is obliquely incident on the object to be tested; and an analyzer is interposed between the multi-reflection sensor and the image. Between the devices, the transmission axis of the analyzer is parallel to the X-axis, and the emission intensity of the scanning beam is adjusted, and the incident angle of the scanning beam is brought close to the critical angle by the rotating means, and then The two lenses are imaged on the image capturing device, and the computing device analyzes the defect of the object to be tested . 5' The method of claim 1, wherein the method further comprises: providing a biaxial moving platform for the product or the product to be placed, and (10) controlling a portion to be measured by the object to be tested, and then The operation means is used to control the movement of the biaxial moving platform in the X or Y axis direction to control the data captured by the object to be tested. The method of claim 12, wherein the broom beam is incident on the object to be tested and the height of the object between the objects to be tested is changed by The light path of the broom beam is offset from the original path direction, and forms +々 or one 々28 201018896 的角度偏移1: ’其_、式為# ,該續該姻-個線性二= 測物二υί關^—=一 ’再以該_光束择描該待 或傾斜角度。錄上的喊,進而求出該待測物之缺陷 7·如明求項第丨項所述之物件缺陷量測之方法,其中, 像,取,置擷取酬試影像及絲糊㈣光酿值後,經運算 ⑩手段運算即可得出光強度變化量'值以及該待測物的缺陷資訊。 8.如凊求項第1項所述之物件麵制之絲,其中,所提 供之該多次反射稜鏡感測器係為一平行四邊形稜鏡感測器。 ★ 9.如請求項第1項所述之物件缺陷量測之方法,其中,該運 算手段係為一電腦,其包含一用以擷取該影像擷取裝置所提供之 影像的影像娜卡,及-分析軟體,該分析軟_崎該基準影 像與測試影像相比,再經過電腦分析影像,即可得到該待測物之 缺陷資訊。 ® 1〇·如請求項第1項所述之物件缺陷量測之方法,其中,該影 像擷取裝置係為一電荷輕合元件CCD。 11· 一種臨界角法結合CCD作物件缺陷量測之裝置’其包括: 一光學掃瞄手段,其用以發出一掃瞄光束; 一影像擷取裝置; 一旋轉手段’其具旋轉角度功能; 一多次反射稜鏡感測器,其設置於該旋轉手段上,其中,該 掃瞄光束穿透或反射一良品而入射至該多次反射稜鏡感測器時, 藉由該旋轉手段轉動該多次反射稜鏡感測器,使該掃瞄光束靠近 29 201018896 —~1 &quot; .................. 一——— 至臨界角以作為基準面的光強度,並以該影像擷取裝置擷取該基 準面光強度作為基準影像,再以該掃瞄光束穿透或反射一待測物 而入射至該多次反射棱鏡感測器,使該掃瞄光束產生微小角度變 化而偏離原本角度以造成光強度的變化,而可以該影像擷取裝置 擷取該待測物光強度,以作為測試影像;及 運算手段,其用以將該基準影像與該測試影像進行比對, 進而得到該待測物之缺陷資訊。 12. 如凊求項第丨1項所述之物件缺陷量測之装置,其中,該 ®光學掃猫手段包括: 一雷射光源,其用以發出該掃瞄光束; 一光阻隔器,用以組絕該掃瞄光束之反射光返回至該雷射光 源; 一透鏡,用以擴大該掃瞄光束; 用以處除雜散光源的空間遽波器,其介置於該光阻隔器與 該透鏡之間; ' 〇 一偏極板,其介置於該透鏡與該待測物之間,其透光軸與x 軸平行,以供該掃瞄光束入射而穿透該待測物; 一檢偏板,用以調整該掃瞄光束透光軸方位角,使該掃瞄光 束之強度調整至該影像擷取裝置可以解析的程度。 13. 如請求項第η項所述之物件缺陷量測之裝置,其中,該 光學掃猫手段包括: 一用以發出該掃瞄光束的雷射光源; 一用以組絕反射光返回至該雷射光源的光阻隔器; 一用以擴大該掃瞄光束的第一透鏡; 201018896 -.- --------- — • —_濾除雜散光源的賴舰器, 該透鏡之間; 一介置於該第一透鏡與該待測物之間的偏極板,使其偏極在y 方向; 一偏極分光鏡,用以反射該掃瞄光束; 一四分之一波片,用以將該掃瞄光束成為圓偏極光; 一檢偏板,其透光軸與Y軸平行,用以調整該掃瞄光束之出 射強度,並使該掃瞄光束經一第二透鏡聚焦,再由該待測物反射 β沿原光路返回至該第二透鏡,並再次通過該四分之一波片而成為 水平偏極光’再_偏極分规親^射至鮮次反射梭鏡感 測器中,再調整轉平台之角度,使該触光束之人㈣靠近臨 界角’並經第三透鏡成像成像於該影像擷取裝置上,再由該運算 手段來分析該待測物之缺陷。 14.如凊求項第11項所述之物件缺陷量測之裝置,其中,該 光學掃瞄手段包括: Q 一用以發出該掃瞄光束的雷射光源; 一光阻隔器’其可供該掃瞄光束入射以組絕反射光返回至該 雷射光源; 一第一透鏡,其用以將穿透該光阻隔器該掃瞄光束予以擴大; 一空間滤波器’其介置於該光阻隔器與該透鏡之間,可供該 掃瞄光束入射以濾除雜散光源; 一偏極板’其介置於該待測物與該多次反射稜鏡感測器之 間’該偏極板透光轴與χ轴平行,以供該触絲斜向入射該待 測物; 31 201018896The angular offset 1: ‘the _, the formula is #, the continuation of the marriage-a linear two = the measurement object υ 关 ^ ^ - = a </ RTI> then use the _ beam to select the to-be or tilt angle. The shouting on the record, and then the defect of the object to be tested is determined. 7. The method for measuring the defect of the object described in the item of the first item, wherein, the image is taken, the image is taken and the silk paste is printed. After the brewing value, the value of the light intensity change amount and the defect information of the object to be tested can be obtained by the operation of the operation 10 . 8. The object surface wire of claim 1, wherein the multi-reflective 稜鏡 sensor is a parallelogram 稜鏡 sensor. The method of measuring the defect of the object according to the first item of claim 1, wherein the computing device is a computer, and the image comprises a video card for capturing an image provided by the image capturing device. And the analysis software, the analysis soft _ aki the reference image and the test image, and then through the computer analysis of the image, the defect information of the test object can be obtained. The method of measuring the defect of an object according to the above item 1, wherein the image capturing device is a charge coupled component CCD. 11. A critical angle method in combination with a CCD crop defect measurement device comprising: an optical scanning means for emitting a scanning beam; an image capturing device; a rotating means 'having a rotation angle function; a plurality of reflection 稜鏡 sensors disposed on the rotating means, wherein the scanning beam penetrates or reflects a good product and is incident on the multiple reflection 稜鏡 sensor, and the rotating means rotates the Multiple reflections of the 稜鏡 sensor, so that the scanning beam is close to 29 201018896 —~1 &quot; .................. One — to the critical angle as a reference The light intensity of the surface is captured by the image capturing device as the reference image, and the scanning beam is incident on the multi-reflecting prism sensor by penetrating or reflecting an object to be tested. The scanning beam generates a slight angle change and deviates from the original angle to cause a change in the light intensity, and the image capturing device can capture the light intensity of the object to be tested as a test image; and an operation means for using the reference The image is compared with the test image, Further, the defect information of the object to be tested is obtained. 12. The device for measuring the defect of an object according to Item 1, wherein the optical scanning device comprises: a laser source for emitting the scanning beam; and a light blocker for Returning the reflected light of the scanning beam to the laser light source; a lens for expanding the scanning beam; and a spatial chopper for removing the stray light source, the medium is placed in the light blocker Between the lenses; a 偏-polar plate, which is interposed between the lens and the object to be tested, and has a transmission axis parallel to the x-axis for the scanning beam to enter and penetrate the object to be tested; An analyzer for adjusting the azimuth of the transmission beam of the scanning beam to adjust the intensity of the scanning beam to a degree that the image capturing device can resolve. 13. The apparatus for measuring object defect according to claim n, wherein the optical sweeping means comprises: a laser source for emitting the scanning beam; and a group for rejecting reflected light to return to the a light blocker for a laser source; a first lens for expanding the scan beam; 201018896 -.- --------- — • —__ A filter for filtering stray light sources, the lens a polarizing plate disposed between the first lens and the object to be tested, having a polarization pole in the y direction; a polarizing beam splitter for reflecting the scanning beam; a quarter wave a sheet for turning the scanning beam into a circularly polarized light; an analyzer having a transmission axis parallel to the Y axis for adjusting an exit intensity of the scanning beam and passing the scanning beam through a second lens Focusing, and then the object reflection β returns to the second lens along the original light path, and passes through the quarter wave plate again to become horizontal polarized light 're-polarization splitting to the fresh reflection shuttle In the mirror sensor, adjust the angle of the rotating platform so that the person touching the beam (four) approaches the critical angle 'and passes through the third lens The imaging is imaged on the image capturing device, and the calculation means is used to analyze the defect of the object to be tested. 14. The device for measuring the defect of an object according to Item 11, wherein the optical scanning means comprises: Q: a laser light source for emitting the scanning beam; a light blocker' The scanning beam is incident to return the reflected light to the laser source; a first lens is used to expand the scanning beam through the optical blocker; a spatial filter is disposed in the light Between the blocker and the lens, the scanning beam is incident to filter out the stray light source; a polarizing plate is disposed between the object to be tested and the multiple reflection sensor. The plate transmission axis is parallel to the χ axis for obliquely incident the object to be tested; 31 201018896 ❺ 一檢偏板,其介置_多 置之間’該檢偏板透光轴與X軸平行,用以調整該掃瞎光束之出 射強度,並使該掃猫光束之入射角靠近臨界角,經〆第二透鏡成 像於該影像娜裝置上,再由該·手段分析該制物之缺陷。 15·如吻求項第11項所述之物件缺陷量測之褒置,其更包括 一供該制物置放的雙軸移動平台,躲選擇婦_所欲量測 之雜再以该運算手段用以控制該雙轴移動平台往X或Υ轴方 向移動,以控制擷取該待測物所需掃瞄的資料。 &quot;16.如凊求項第丨丨項所述之物件缺陷量測之裝置,其中,該 $人反射稜鏡細II係為—平行四邊形稜賊·。 • *17·如睛求項第11項所述之物件缺陷量測之裝置,其中,該 係為—電腦,其包含—用以擷取由該影像擷取裝置所提 ^ ν像的影_取卡,及_分析軟體’該分析軟體用以將該基 仏’、’像與_影像概’雜㈣齡㈣像,即可得到該 物之缺陷資訊。 坦18.如4求項第11項所述之物件缺陷量測之裝置,其中,該 办像擁取1置係為-電荷耦合元件CCD。 32❺ an analyzer, the interposer _ between the two sets the transmission axis of the analyzer parallel to the X axis, used to adjust the exit intensity of the broom beam, and the incident angle of the sweeping cat beam is close to the critical angle The second lens is imaged on the image forming device, and the defect of the product is analyzed by the means. 15. The device for measuring the defect of the object described in Item 11 of the Kiss Item, further comprising a biaxial moving platform for placing the product, hiding the selected person and measuring the mixed matter by the operation means It is used to control the movement of the biaxial moving platform to the X or the x-axis to control the data required for the scanning of the object to be tested. &quot;16. The apparatus for measuring the defect of an object according to the item 凊 丨丨 , , , , , , , , , , , , , , , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 *17. The apparatus for measuring the defect of an object according to Item 11 of the present invention, wherein the system is a computer, which comprises - for capturing a shadow of the image of the image taken by the image capturing device. The card is taken, and the analysis software is used to obtain the defect information of the object by using the image of the image, the image, and the image of the image. The device for measuring the defect of the object according to Item 11, wherein the image is taken as a charge coupled device CCD. 32
TW97144042A 2008-11-14 2008-11-14 Method and device for measuring the defect of the CCD object by the critical angle method TWI388817B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467227B (en) * 2012-04-12 2015-01-01 Univ Nat Formosa Three-dimensional microscope device and method using the same
TWI473963B (en) * 2011-03-04 2015-02-21 Univ Nat Formosa One-dimensional laser-scanning profilometer and method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI664586B (en) * 2018-03-22 2019-07-01 National Taiwan Normal University Method for defect inspection of transparent substrate through complex defect diffractionwavefront

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI473963B (en) * 2011-03-04 2015-02-21 Univ Nat Formosa One-dimensional laser-scanning profilometer and method
TWI467227B (en) * 2012-04-12 2015-01-01 Univ Nat Formosa Three-dimensional microscope device and method using the same

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