TW201016293A - Separator for separating a mixture of liquid and gas and apparatus for processing a substrate including the separator - Google Patents

Separator for separating a mixture of liquid and gas and apparatus for processing a substrate including the separator Download PDF

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TW201016293A
TW201016293A TW098130290A TW98130290A TW201016293A TW 201016293 A TW201016293 A TW 201016293A TW 098130290 A TW098130290 A TW 098130290A TW 98130290 A TW98130290 A TW 98130290A TW 201016293 A TW201016293 A TW 201016293A
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Taiwan
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gas
liquid
separator
separation tank
mixture
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TW098130290A
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Chinese (zh)
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TWI367776B (en
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Jeong-Seon Kim
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Semes Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0042—Degasification of liquids modifying the liquid flow
    • B01D19/0052—Degasification of liquids modifying the liquid flow in rotating vessels, vessels containing movable parts or in which centrifugal movement is caused
    • B01D19/0057—Degasification of liquids modifying the liquid flow in rotating vessels, vessels containing movable parts or in which centrifugal movement is caused the centrifugal movement being caused by a vortex, e.g. using a cyclone, or by a tangential inlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/77—Liquid phase processes
    • B01D53/78—Liquid phase processes with gas-liquid contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Separating Particles In Gases By Inertia (AREA)

Abstract

In a separator for separating a liquid component from a liquid-gas mixture, the separator includes a separation box having an inlet at a top portion, a filter unit positioned under the inlet in the separation box, a gas discharger and a liquid discharger positioned at a bottom portion of the separation box. The liquid-gas mixture is provided into the separation box through the inlet and the filter unit filters the liquid component from the mixture. The gas discharger is configured such that a closed end portion faces the filter unit and at least one gas outlet is arranged on a sidewall of the gas discharger. The gas component and the liquid component of the mixture are discharged out of the separation box through the gas outlet and liquid discharger, respectively. The liquid component is efficiently separated from the liquid-gas mixture without any increase of equipment space.

Description

201016293 TW5636PA 丨 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種分離氣體和液體至其各自部分 的分離器與包括此分離器用於處理基板的裝置。且本實施 例特別是有關於一種當處理基板後要排出處理溶液和注 入氣體的混合物時，用於分離氣體-液體混合物至各自氣 體部分和液體部分的分離器，而處理基板的裝置包括此分 離器。 【先前技術】 一平面顯示器（flat panel display FPD)裝置包括液 晶顯示器（liquid crystal display LCD)裝置、電漿顯示 器（plasma display panel PDP)裝置以及有機發光顯示器 (organic light-emitting display 0LED)裝置。 上述的平面顯示器包括顯示影像的顯示面板，此顯示 面板主要係基於玻璃基板來製造。 舉例來說，顯示面板一般係經由各種基本處理來產生 的，例如是沉積處理，蝕刻處理，光蝕刻處理，清洗處理 以及檢驗處理。 在上述基本處理中，蝕刻處理和清洗處理係在基板位 於適當位置的處理室中執行。而在處理室中，用於蝕刻處 理或清洗處理的處理溶液係藉由溶液喷洗來喷出至基板 上。 在蝕刻處理和清洗處理的傳統裝置中，氣體注入器位 於溶液喷洗之上，且用來驅動處理溶液至基板上的驅動氣 201016293,201016293 TW5636PA 丨 VI. Description of the Invention: [Technical Field] The present invention relates to a separator for separating gas and liquid to respective portions thereof and a device comprising the separator for processing a substrate. And the present embodiment relates in particular to a separator for separating a gas-liquid mixture to a respective gas portion and a liquid portion when a mixture of a treatment solution and an injection gas is to be discharged after processing the substrate, and the apparatus for processing the substrate includes the separation. Device. [Prior Art] A flat panel display FPD device includes a liquid crystal display (LCD) device, a plasma display panel (PDP) device, and an organic light-emitting display (OLED) device. The above flat panel display includes a display panel for displaying an image, and the display panel is mainly manufactured based on a glass substrate. For example, display panels are typically produced via various basic processes, such as deposition processing, etching processing, photo etching processing, cleaning processing, and inspection processing. In the above basic processing, the etching process and the cleaning process are performed in a processing chamber in which the substrate is located. In the processing chamber, the processing solution for the etching treatment or the cleaning treatment is sprayed onto the substrate by solution spray washing. In a conventional apparatus for etching and cleaning, the gas injector is located above the solution spray and is used to drive the processing solution to the driving gas on the substrate 201016293,

I < 1 WDOJO^A 體係朝向基板注入。因此處理溶液和驅動氣體的喷洗混合 物濺激於處理室中。 處理溶液和驅動氣體的喷洗混合物可能於處理室中 汙染基板，因此需要將此喷洗混合物從處理室中排出。真 空泵藉由排出管連結至處理室，且真空泵將噴洗混合物藉 由排出管從處理室中排出。 然而當喷洗混合物被供應至真空泵後，此真空泵可能 因為喷洗混合物中的處理溶液而損壞。因此需要在提供喷 ❹洗混合物至真空泵前將喷洗混合物中的處理溶液從喷洗 混合物中分離。 【發明内容】 本創新概念的實施例提供一種用於分離處理溶液和 驅動氣體混合物至各自處理溶液和驅動氣體部分的分離 器。 本創新概念的實施例提供一種包括上述分離器用於 ❿處理基板之裝置。 根據一些創新概念的實施例，提供一種裝置包括：具 有位於頂端的入口的分離箱，位於分離箱入口下方的過濾 單元，位於分離箱底部的氣體排出器以及位於分離箱底部 的液體排出器。藉由入口提供氣體-液體混合物至分離箱 且過濾單元從氣體-液體混合物中過濾出液體部分。以封 閉端部分面向過濾單元的方式安裝氣體排出器，且安裝至 少一個氣體出口於氣體排出器的側壁。氣體-液體混合物 的氣體部分則藉由此氣體出口從分離箱中排出。氣體-液 5 201016293I < 1 WDOJO^A system is injected toward the substrate. Therefore, the spray mixture of the treatment solution and the drive gas is splashed in the treatment chamber. The spray mixture of the treatment solution and the drive gas may contaminate the substrate in the processing chamber, and thus the spray mixture needs to be discharged from the processing chamber. The vacuum pump is coupled to the processing chamber by a discharge tube, and the vacuum pump discharges the spray mixture from the processing chamber through the discharge tube. However, when the spray mixture is supplied to the vacuum pump, the vacuum pump may be damaged by the treatment solution in the spray mixture. It is therefore necessary to separate the treatment solution in the spray mixture from the spray mixture prior to providing the spray mixture to the vacuum pump. SUMMARY OF THE INVENTION An embodiment of the inventive concept provides a separator for separating a processing solution and a driving gas mixture to respective processing solutions and driving gas portions. An embodiment of the inventive concept provides an apparatus comprising the above separator for processing a substrate. According to some embodiments of the innovative concept, an apparatus is provided comprising: a separation tank having an inlet at the top end, a filtration unit located below the inlet of the separation tank, a gas ejector at the bottom of the separation tank, and a liquid ejector at the bottom of the separation tank. A gas-liquid mixture is supplied to the separation tank through the inlet and the filtration unit filters out the liquid portion from the gas-liquid mixture. The gas ejector is mounted with the closed end portion facing the filter unit and at least one gas outlet is installed to the side wall of the gas ejector. The gas portion of the gas-liquid mixture is then withdrawn from the separation tank by means of the gas outlet. Gas-liquid 5 201016293

TW5636PA _ 〇物的液體部分則藉由此液體排出口從分離器中排 出。 在此實％例中，氣體出口的位置較高於分離箱底部表 面。 一在此實施例中，過濾單元包括：擁有具有第—直徑的 一第孔的第一多孔平面，和擁有具有比第一直徑小的 第二直徑，—些第二孔的第二多孔平面且第二多孔平面 位於第-多孔平面下方，此種相對結構使得分離箱的内部 二間可分割成較小的次空間。 _ 在此實知例中，第一孔總和面積相對於入口截面積的 比值約介於1·丨至丨· 5範圍，且第二孔總和面積相對於入 口截面積的比值約介於1.0至1.2範圍。 在此實施例中，第一孔的第一直徑約為入口直徑的 0· 1至0. 3倍，且第二孔的第二直徑約為第一孔第一直徑 的0. 7至0. 9倍。 在此實施例中，過濾單元包括至少一過濾薄板其介於 第一和第一多孔平面之間，且此過濾薄板具有細微纖維 ❹ 絲。 在此實施例中’分離箱更包括：位於侧壁的開口，用 於關閉開口的蓋子’用於密封介於蓋子和分離箱開口周圍 間隙的密封部件，第一和第二多孔平面以及介於第一和第 二多孔平面間的過濾薄板則藉由開口來裝入或移出分離 器。 在此實施例中，分離箱更包括從開口沿著其側壁内部 延展的第一和第二導執溝槽，將第一和第二多孔平面板入 6 201016293The liquid portion of the TW5636PA _ sputum is discharged from the separator by means of the liquid discharge port. In this example, the gas outlet is located higher than the bottom surface of the separation tank. In this embodiment, the filter unit includes: a first porous plane having a first hole having a first diameter, and a second porous having a second diameter smaller than the first diameter, the second holes The plane and the second porous plane are located below the first porous plane. This relative structure allows the interior of the separation box to be divided into smaller subspaces. _ In this embodiment, the ratio of the total area of the first hole to the cross-sectional area of the inlet is about 1·丨 to 丨·5, and the ratio of the total area of the second hole to the cross-sectional area of the inlet is about 1.0 to 1.2 Scope. 1至0. The first diameter of the first hole is 0. 7 to 0. The first diameter of the first hole is 0. 7 to 0. 9 times. In this embodiment, the filter unit includes at least one filter sheet interposed between the first and first porous planes, and the filter sheet has fine fiber crepe. In this embodiment, the 'separation box further includes: an opening at the side wall, a cover for closing the opening' for sealing a seal member between the cover and the gap around the opening of the separation box, the first and second porous planes and the The filter sheet between the first and second porous planes is loaded or removed from the separator by an opening. In this embodiment, the separation box further includes first and second guide grooves extending from the opening along the inside of the side walls thereof, and the first and second perforated planes are plated into 6 201016293

t t 1 VV^UJUrAV 第一和第二溝槽且各別地導引至分離箱。例如，第一導執 溝槽的寬度係大於第一多孔平面的厚度差不多約lmm至 3mm，且第二導執溝槽的寬度係大於第二多孔平面的厚度 差不多約lmm至3醜。 在此實施例中，分離箱包括位於底部的凹陷部分以及 連接至分離箱凹陷部分的液體排出器。 在此實施例中，分離箱底部係從中央部分向周圍部分 傾斜，且液體排出器係連接至分離箱底部的周圍部分。 ® 在此實施例中’氣體排出器具有圓柱體狀，且一些氣 體出口係安裝於圓柱體氣體排出器環繞封閉端部分的周 圍表面’域些氣體出口以相同間隙距離隔開，而此間隙 距離約為圓柱體氣體排出器圓周長的0.07至〇.1倍。 根據本發明創新概念的一些實施例來提供一種處理 j板的裝置。此裝置包括：用於處理基板的處理室處理 =中位於基板上方的液體喷洗器，處理室中位於液體喷洗 器上方的氣體喷洗器，以及藉由供應管連接至處理室的分 離器。液體噴洗器喷出處理溶液至基板上且氣體喷洗器噴 出處理氣體至處理室的整個内部空間。分離器從氣體—溶 液，合物（s〇lution_gas mixture)中分離出處理溶液和處 :氣體，且藉由供應管從處理室提供氣體溶液混合物至 刀離器例如，分離器包括：包括於其頂端部分連接至供 應官的入口之分離箱，位於分離箱入口下用來從氣體溶 液混σ物中過濾出處理溶液部分的過濾單元，位於分離箱 底部的氣體排出器，且此氣體排出器的封閉第一端部分正 對過渡早7L，安裝至少一氣體出口於氣體排出器側壁，以 7 201016293t t 1 VV^UJUrAV The first and second grooves are individually guided to the separation box. For example, the width of the first guide groove is greater than the thickness of the first porous plane by about 1 mm to 3 mm, and the width of the second guide groove is greater than the thickness of the second porous plane by about 1 mm to 3 ug. In this embodiment, the separation box includes a recessed portion at the bottom and a liquid ejector connected to the recessed portion of the separation box. In this embodiment, the bottom of the separation box is inclined from the central portion toward the surrounding portion, and the liquid ejector is connected to the peripheral portion of the bottom of the separation box. In this embodiment, the 'gas ejector has a cylindrical shape, and some of the gas outlets are mounted on the peripheral surface of the cylindrical gas ejector surrounding the closed end portion. The gas outlets are separated by the same gap distance, and the gap distance is It is about 0.07 to 〇.1 times the circumference of the cylindrical gas ejector. An apparatus for processing a j-board is provided in accordance with some embodiments of the inventive concept of the present invention. The apparatus includes: a process chamber process for processing a substrate = a liquid sprayer located above the substrate, a gas sprayer located above the liquid sprayer in the process chamber, and a separator connected to the process chamber by a supply tube . The liquid sprayer ejects the treatment solution onto the substrate and the gas sprayer ejects the process gas to the entire interior of the processing chamber. The separator separates the treatment solution and the gas from the gas-solution mixture, and supplies the gas solution mixture from the processing chamber to the knife separator by the supply tube. For example, the separator includes: a separation tank connected to the inlet of the supply officer at the top end, a filtration unit for filtering the portion of the treatment solution from the gas solution mixture, and a gas ejector at the bottom of the separation tank, and the gas ejector The closed first end portion is 7L ahead of the transition, and at least one gas outlet is installed on the side wall of the gas ejector to 7 201016293

TW5636PA 的卢：：離器底部的第一液體排出器。氣體-溶液混合物 =處，體部分藉由氣體出口來排至分離器外，且氣體_ 合液t* S物的處理溶液部份則藉由液體排出 離器外。 。在實％例中，裝置更包括連接至分離器外相對氣體排 出器第4的第—端的真空栗，所以真空壓力藉由真空栗 產生且經由分離器供應至供應管。 在實施例中’裝置更包括連接至處理室底端的第二液 體排出ϋ。處理室巾殘存在底部的處理溶液之剩餘溶液藉 由第一液體排出器排至處理室外。 在實施例中，第一液體排出器係連接至第二液體排出 盗，所以來自氣體-溶液混合物藉由過濾單元過濾出的液 體部分經由第二液體排出器排出至裝置外。 根據本發明創新概念的一些實施例，當從處理室排出 LG混合物時，藉由分離器可有效率的過濾出LG混合物中 的液體部分L，如此可避免真空泵由於LG混合物中的液體 部分L所造成的損壞。 除此之外，第二多孔平面、一些過濾薄板以及第一多 孔平面可被連續地堆疊在分離箱，且可將過濾單元安裝在 分離箱，則藉由第一多孔平面、過濾薄板以及第二多孔平 面了連續的過;慮LG混合物中的液體部分L。接著藉由氣體 排出器的氣體出口排出LG混合物中的氣體部分G至分離 箱外。LG混合物中的液體部分l可聚積在分離箱的底部， 且可經由液體排出器將此液體部分L排出至分離箱外。且 可分離LG混合物至各自的液體部分L和氣體部分G而不 201016293 « ' 1 w jujorM. 增加分離箱的體積。也就是說，可縮減用於分離箱的裝置 空間，如此可簡單的安裝用於分離的裝置於分離箱周圍。 過濾單元更包括可從分離箱簡單的安裝或移出的過 濾薄板，則已使用過的過濾薄板可從過濾單元中移出。然 後將新的過濾薄板耦接至過濾單元，且過濾單元包括重新 安裝至分離箱的新過濾薄板。也就是說，可簡單的實施用 於分離箱的過濾薄板的替換來促進分離箱的保養。 ❹【實施方式】 接下來將詳細的敘述各種實施例與一些實施例繪示 其中的對應圖式。然而，本發明可實施成各種不同形式， 不應受所提出的實施例所侷限。更確切的說，提供這些實 施例是為了使揭露的内容更加的完善與完整，且這些實施 例將完整傳達本發明的範圍至該領域中具有通常知識 者。圖式中，部位和階層的大小和相對大小為了清楚表達 而有所誇大。 ® 可明瞭當元件或階層與另一元件或階層的關連為 「上」、「連接至」或「耦接至」時，它可為直接在上面、 連接至或耦接至其它元件或階層，也可能存在中介元件或 階層。相對的，當元件與另一元件或階層的關連為「直接 在上面」、「直接連接至」或「直接耦接至」時，沒有中介 元件或階層存在。全文相同數字指向相同元件。文中使用 的術語「和/或」包括一個或多個表列關聯元件的任一或 全部組合。 可明瞭雖然術語第一、第二、第三…等可使用於描述 201016293 TW5636PA 1 * ， 各種元件、成分、區域、階層和部分，這些術語不應為限 制。這些術語只是用來區別一元件、成分、區域、階層和 部分與另一元件、成分、區域、階層和部分。因此描述於 後的第一元件、成分、區域、階層和部分可為第二元件、 成分、區域、階層和部分而不會違反本發明的技術。 空間相對術語，例如是「在下面」、「下」、「較低」、 「上」、「較高」等等，可用於不費力的描述來敘述一元件 或特徵與另一元件或特徵的關係為如圖所說明。可明瞭空 間相對術語被預期為包括除了圖中所示使用或操作裝置 @ 方向外的不同方向。例如5若圖中的裝置係颠倒’元件描 述為在其它元件或特徵「下」或「在下面」，則為其它元 件或特徵的「上」方。因此示範術語「下」可同時包括上 和下的方向。裝置可朝向其它方向（旋轉90°或於其它方位） 且本文中的空間相對描述可相應說明。 本文中所使用的術語只是用來描述特定實施例的目 的，且不預期為限制本發明。已經使用的單數形式「一」、 「此」和「該」被預期為也包括複數形式，除非上下文清 Ο 楚的指出其它意思。可更明瞭的是，當在本說明書中使用 術語「包括」和「包含」，清楚指明指定特徵、整體、步 驟、操作、元件或成分的存在，但不排除一個或一個以上 的其它特徵、整體、步驟、操作、元件、成分或其群體的 存在或附加。 本說明書描述的實施例與參照截面圖說明係概要說 明理想化的實施例（和中間架構）。就其本身而言，說明形 狀的變動結果（例如是製造技術或誤差）係可預期的。因 201016293 i w^ujur/ΛLu of TW5636PA: The first liquid ejector at the bottom of the separator. At the gas-solution mixture = where the body portion is discharged to the outside of the separator by the gas outlet, and the portion of the treatment solution of the gas-to-liquid t*S is discharged outside the separator. . In the real example, the apparatus further includes a vacuum pump connected to the fourth end of the gas discharger outside the separator, so that the vacuum pressure is generated by the vacuum pump and supplied to the supply pipe via the separator. In an embodiment the apparatus further includes a second liquid discharge port connected to the bottom end of the processing chamber. The remaining solution of the treatment solution remaining in the bottom of the treatment chamber is discharged to the outside of the treatment chamber by the first liquid discharger. In an embodiment, the first liquid ejector is coupled to the second liquid venting, so that the portion of the liquid from the gas-solution mixture filtered by the filtration unit is discharged to the outside of the apparatus via the second liquid ejector. According to some embodiments of the inventive concept, when the LG mixture is discharged from the processing chamber, the liquid portion L in the LG mixture can be efficiently filtered by the separator, so that the vacuum pump can be avoided due to the liquid portion L in the LG mixture. Damage caused. In addition, the second porous plane, some of the filter sheets, and the first porous plane may be continuously stacked in the separation box, and the filter unit may be installed in the separation box, by the first porous plane, the filter sheet And the second porous plane is continuously passed; the liquid portion L in the LG mixture is considered. The gas portion G in the LG mixture is then discharged to the outside of the separation tank by the gas outlet of the gas ejector. The liquid portion 1 in the LG mixture can be accumulated at the bottom of the separation tank, and this liquid portion L can be discharged to the outside of the separation tank via the liquid ejector. And the LG mixture can be separated to the respective liquid portion L and gas portion G without 201016293 « ' 1 w jujorM. Increase the volume of the separation tank. That is to say, the space of the apparatus for the separation box can be reduced, so that the means for separating can be simply installed around the separation box. The filter unit further comprises a filter sheet that can be easily installed or removed from the separation box, and the used filter sheet can be removed from the filter unit. The new filter sheet is then coupled to the filter unit and the filter unit includes a new filter sheet that is reinstalled into the separation box. That is to say, the replacement of the filter sheets for the separation box can be simply implemented to promote the maintenance of the separation box. [Embodiment] Next, various embodiments and some embodiments will be described in detail to illustrate the corresponding drawings. However, the invention may be embodied in a variety of different forms and should not be limited by the embodiments presented. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and these embodiments will fully convey the scope of the invention to those of ordinary skill in the art. In the drawings, the size and relative size of the parts and layers are exaggerated for clarity. ® can be used to connect directly to, connect to or couple to other components or classes when the relationship between a component or a layer and another component or layer is "up", "connected" or "coupled". There may also be intermediaries or classes. In contrast, when the relationship between a component and another component or class is "directly on", "directly connected" or "directly coupled to", no intervening component or hierarchy exists. The same reference numerals refer to the same elements. The term "and/or" as used herein includes any and all combinations of one or more of the associated elements. It will be understood that although the terms first, second, third, etc. may be used to describe 201016293 TW5636PA 1 * , the various elements, components, regions, classes, and sections are not intended to be limiting. These terms are only used to distinguish one element, component, region, layer Therefore, the first element, component, region, layer, and portion described herein may be the second element, component, region, layer, and portion without departing from the invention. Spatially relative terms such as "below", "below", "lower", "upper", "higher", etc., may be used to describe one element or feature and another element or feature in an effortless description. The relationship is as illustrated. It will be appreciated that spatially relative terms are intended to include different orientations in addition to the orientation of the device used or operated in the figure. For example, if the device in the figures is reversed, the element is described as "under" or "below" other elements or features, and is the "upper" side of the other element or feature. Therefore, the demonstration term "lower" can include both the up and down directions. The device may be oriented in other directions (rotated 90° or in other orientations) and the spatial relative description herein may be correspondingly described. The terminology used herein is for the purpose of describing the particular embodiments, The singular forms "a", "the", "the" and "the" are used and are intended to include the plural, unless the context clearly indicates otherwise. It will be understood that the terms "including" and "comprising" are used in the specification to the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The existence or addition of steps, operations, components, components or groups thereof. The embodiments described in the specification and the reference cross-sectional illustrations are illustrative of idealized embodiments (and intermediate architectures). For its part, it is expected that the result of the change in shape (for example, manufacturing techniques or errors) will be expected. Because 201016293 i w^ujur/Λ

此’實施例不應被理解為用以限制某區域為特定形 是應包括從該特定形狀所衍生的變形，例如是製造上的誤 差。例如，圖示為矩形的植入區域，基本上其邊^是= 具有圓角或曲角的舰，及/紐人濃度的梯度並不是非曰 黑即白地從植入區域改變成非植入區域。同樣的，由植入 形成的埋設區域可能在介於埋設區域和進行植入的表面入 之間的區域會產生-些植人。因此於圖式令說明的區=係 本質上的概要且它們的形狀不被預期為說明裝置範圍的 真實形狀，也不被預期為限制本發明的範圍。 除非另有定義，否則使用於本說明書中的所有術語， (包括技術和科技術語）對該領域中具有通常知識者而古 具有相同意義。可明瞭的是’此類定義於_般使用字：的 術語，應該被解釋為具有與該相關領域上下文中前後一致 的意義，且除非說明書有特別定義，否則不被理解成理想 化或過於細致。 接下來將詳細的說明實施例與參考的對應圖式。 第1圖係根據本發明實施例來說明用於分離氣體和 液體混合物至各自部分的分離器的詳細透視圖。第2圖係 說明繪示於第1圖的分離器的戴面圖。 參考第1和第2圖，根據本發明實施的分離器丨〇〇包 括：分離箱110 ’過濾單元120，氣體排出器13〇和液體 排出器140。 在實施例中，分離箱110可包括入口 ，藉由入口 111可k供具有液體部分L和氣體部分G的氣體-液體混合 物（之後稱之為LG混合物）。供應管150可連接至入口 hi 11 201016293This 'embodiment' should not be taken to limit a particular shape to include a deformation derived from the particular shape, such as a manufacturing error. For example, it is illustrated as a rectangular implanted area, basically the side of which is = ship with rounded corners or curved corners, and the gradient of the / neon concentration is not changed from non-black and white to non-implanted region. Similarly, the buried area formed by the implant may create some implants between the buried area and the surface into which the implant is implanted. Therefore, the regions in the drawings are intended to be illustrative of the nature of the invention and are not intended to limit the scope of the invention. Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as those of ordinary skill in the art. It is clear that the term "such as defined in the use of words" should be interpreted as having the same meaning as in the context of the relevant field, and is not understood to be idealized or too detailed unless the specification is specifically defined. . Next, the corresponding drawings of the embodiment and the reference will be described in detail. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a detailed perspective view showing a separator for separating a gas and a liquid mixture to respective portions, in accordance with an embodiment of the present invention. Fig. 2 is a perspective view showing the separator shown in Fig. 1. Referring to Figures 1 and 2, a separator 实施 according to the present invention includes a separation tank 110' filter unit 120, a gas ejector 13A and a liquid ejector 140. In the embodiment, the separation tank 110 may include an inlet through which the gas-liquid mixture (hereinafter referred to as LG mixture) having the liquid portion L and the gas portion G may be supplied. Supply pipe 150 can be connected to the entrance hi 11 201016293

TW5636PA ! » , 且經由供應管15 〇提供LG混合物至分離箱11 〇。可經由分 離箱110提供真空壓力至供應管150。 在實施例中’過濾單元120可位於分離箱11 〇中鄰近 入口 111的分離箱底部115。LG混合物可從入口 U1流至 過濾單元120且過濾單元120可從LG混合物中過濾或分 離出液體部分L。 特別的是，當LG混合物流經（pass through)過濾單 元120 ’ LG混合物中的氣體部分g可穿過（pass thr〇ugh) 過濾單元120因而可在過濾單元120下流動（drift)，同❿ 時藉由過濾單元120可過濾出LG混合物中的液體部分L， 且此液體部分L可滴至（drop onto)分離箱110的分離箱 底部115。液體部分l的密度係大於氣體部分g的密度， 如此LG混合物中的液體部分L可積聚（accumulated)在分 離箱110的分離箱底部115。 在實施例中，過濾單元120可包括第一多孔平面 和第二多孔平面124。第一多孔平面122可位於分離箱110 的側壁内，且第二多孔平面124可位於第一多孔平面122❿ 下、分離箱110的側壁18〇内。如此藉由第一和第二多孔 平面122和124可將分離箱110的内部空間分成較小的次 空間。因此，經由入口 1U供應“混合物至分離箱11〇 需經過第一和第二多孔平面122和丨24。 可安裝一些第一孔123至第一多孔平面122，且也可 安裝一些第二孔125至第二多孔平面124，則LG混合物藉 由過濾單元120於過濾處理時可流經（pass thr〇ugh)第— 和第二孔123和125。藉由過濾單元12〇的過濾處理中， 12 201016293 LG混合物除了第一和第二孔12 3和12 5外，將碰撞第一和 第二多孔平面的表面，將可過濾出LG混合物中具有較高 密度的液體部分L，並收集此液體部分L於每一個第一和 第一多孔平面122和124。接著LG混合物中的液體部分l 經由第一和第二孔123和125可積聚在分離箱no的分離 箱底部115。 之後將參照第3圖來更詳細的描述過濾單元12〇。 第3圖係說明繪示於第2圖過濾單元部分的透視圖。 ❹ 參照第3圖，第一孔123的總和面積相對入口 ^ 11的 牙透邛为面積的比值（稱之為第一面積比值）可變動於約 1. 1至約1.5的範圍。當全部第一孔123相對入口 ιη的 面積比值小於1. 1，則供應管】5〇的真空壓力將趨向實質 減少，此將造成供應至分離箱11〇的LG混合物減少，而 當面積比值大於1.5,將很難於第一多孔平面122收集到 LG混合物中的液晶部分[。 目此全部第-孔123相對於人口 lu的面積比值可介 於約1. 1至約1. 5範圍。在本發明中，面積比值可介於約 1 · 1至約1. 3的範圍。 除此之外田第一孔123的第一直徑pi相對入口 111 =直控的比值（稱之為第一直徑比值）小於約〇1，則lg混 &amp;物报難流過⑴qw thmigh)分離箱⑴，此將大大減少 ^應管150的真空壓力。而當第一直徑比值大於約0.3, 立絲於第-多孔平面122中收集到㈣合物中的液體 至0. 3的範圍。舉例來 因此第一直徑最好介於約〇. i 13 201016293TW5636PA ! » , and the LG mixture is supplied to the separation tank 11 via the supply pipe 15 . Vacuum pressure can be supplied to the supply pipe 150 via the separation tank 110. In an embodiment, the filter unit 120 may be located in the separation tank bottom 115 of the separation tank 11 adjacent to the inlet 111. The LG mixture can flow from the inlet U1 to the filtration unit 120 and the filtration unit 120 can filter or separate the liquid portion L from the LG mixture. In particular, when the LG mixture passes through the filter unit 120', the gas portion g in the LG mixture can pass through the filter unit 120 and thus can float under the filter unit 120, The liquid portion L in the LG mixture can be filtered by the filter unit 120, and the liquid portion L can be dropped onto the separation tank bottom 115 of the separation tank 110. The density of the liquid portion 1 is greater than the density of the gas portion g such that the liquid portion L in the LG mixture can accumulate at the bottom 115 of the separation tank of the separation tank 110. In an embodiment, the filtration unit 120 can include a first porous plane and a second porous plane 124. The first porous plane 122 can be located within the sidewall of the separation box 110, and the second porous plane 124 can be located below the first porous plane 122, within the sidewall 18 of the separation box 110. The inner space of the separation box 110 can be divided into smaller sub-spaces by the first and second porous planes 122 and 124. Therefore, the supply of the mixture to the separation tank 11 via the inlet 1U is required to pass through the first and second porous planes 122 and 丨24. Some of the first holes 123 may be installed to the first porous plane 122, and some second may be installed. From the hole 125 to the second porous plane 124, the LG mixture can pass through the filtering unit 120 during the filtering process to pass through the first and second holes 123 and 125. The filtering process by the filtering unit 12〇 Medium, 12 201016293 LG mixture, in addition to the first and second holes 12 3 and 12 5 , will collide with the surfaces of the first and second porous planes, which will filter out the liquid portion L having a higher density in the LG mixture, and This liquid portion L is collected in each of the first and first porous planes 122 and 124. The liquid portion 1 in the LG mixture can then accumulate in the separation tank bottom 115 of the separation tank no via the first and second holes 123 and 125. The filter unit 12A will be described in more detail later with reference to Fig. 3. Fig. 3 is a perspective view showing a portion of the filter unit shown in Fig. 2. ❹ Referring to Fig. 3, the total area of the first hole 123 is relative to the entrance ^ 11 tooth 邛 is the ratio of the area (called the first An area ratio may vary from about 1.1 to about 1.5. When the ratio of the area of all of the first holes 123 to the inlet η is less than 1. 1, the vacuum pressure of the supply tube 5 趋 will tend to decrease substantially, which will The LG mixture supplied to the separation tank 11〇 is reduced, and when the area ratio is greater than 1.5, it will be difficult to collect the liquid crystal portion in the LG mixture in the first porous plane 122. [There are all the first-holes 123 relative to the population lu The range of the area may be in the range of from about 1.1 to about 1.5. In the present invention, the area ratio may range from about 1:1 to about 1.3. The ratio of the diameter pi to the inlet 111 = direct control (referred to as the first diameter ratio) is less than about 〇1, then the lg mixture &amp; report is difficult to flow through the (1) qw thmigh separation box (1), which will greatly reduce the The range of the liquid in the (tetra) compound is in the range of 0.3 to the range of 0.3. The first diameter is preferably between about 〇. i 13 201016293

TW5636PA 則第一孔123的第一 說，當入口 111的直徑約為200mm 直徑可約為30mm。 穿、岛r對的基於避免1(；混合物穿過第一孔123後直接 有thFGUgh)第二孔125的理由，第二孔125可擁 浐擊第：孔123的第一直徑D1之第二直徑D2，如此可 :擊:J孔平面125。因此在LG混合物流過第一謂 八L 、第-夕孔平面124中收集LG混合物中的液體部 、^的疋’第二孔125的第二直徑D2相對第一孔123 的第一直徑Di的比值（稱之為第二直徑比值）可介於約〇7❹ =.9的範圍。例如，第一孔123的第一直徑叫為約3〇麵， 則第一孔125的第二直徑D2可約為25mm。 於修改後的實施例中，可間隔的安裝相對第二多孔平 面124中第二孔125的第一多孔平面122中第一請。 則即使LG^合物穿過第—孔123 面⑵而不會直接流過第二孔125。然後可擊於 面124上收集LG混合物中的液體部分[。 ⑩ 由於可女裝第二多孔平面124於分離箱11〇中第一多 孔平面122下，且第_多孔平面124可有與第一多孔平面 122相同㈣積’則第二孔125的面積總合相對入口⑴ 的截面積的比值（稱之為第二面積比值）可介於約丨〇至 1.2的範圍。因此第二面積比值可小於第一面積比值。在 此實鉍例中，第二孔的總和面積實質上可相同於入口 m 的截面積。 在實施例中，過濾單元120更可包括至少一個包括細 14 201016293 1 ' 1 vv jujur 微纖維絲的過濾、薄板126，且可***此過濾薄板126至第 一和第二多孔平面122和124中間。例如，過濾薄板126 可包括非梭織物’且由於纖維絲的細微交叉因此具有一些 微小細孔。在本實施例中’過濾薄板126可包括彼此交叉 的聚丙烯絲。 在實施例中，可***一些過濾薄板126於第一和第二 多孔平面122和124中間。例如，可堆疊八到十二個過漁 薄板126於第一和第二多孔平面丨22和124中間。此過濾 φ薄板126根據其物質特性具有彈性特質。本實施例中，可 加壓介於第一和第二多孔平面122和124中的一定數量個 過滤薄板12 6。 因此更可藉由過濾薄板126的微小細孔來過濾出lg 混合物中的液體部分L，且收集此液體部分L於過濾薄板 126上。接著藉由過濾薄板！26也可獲得lg混合物中的液 體部分L或此液體部分l可聚積在分離箱11〇的分離箱底 部115。也就是說，更可藉由過濾單元12〇的過濾薄板126 ❹來過濾LG混合物中的液體部分l。 冨使用於過濾單元120中的過濾薄板126超過適當的 使用期限，LG混合物甲的液體部分L可充滿於過濾薄板 126中的微小細孔，則過濾薄板126將不可再過濾lg混合 物中的液體部分L。因此在過遽薄板12 6超過使用期限後 可使用新的過濾薄板126來取代舊的。 為了利於過滤薄板126的更換，分離箱11 〇可包括位 於第一邊117的一開口 112,如此可從分離箱i〖〇中藉由 開口 112安裝或移出包括第一和第二多孔平面122和124 15 201016293TW5636PA is the first of the first hole 123. When the inlet 111 has a diameter of about 200 mm, the diameter can be about 30 mm. The second and second holes 125 may be slammed by the second hole 125, which is the second diameter of the first diameter D1 of the hole 123, based on the reason that the second pair 125 of the pair of islands is avoided (the mixture directly passes through the first hole 123). Diameter D2, so: Hit: J hole plane 125. Therefore, the second diameter D2 of the liquid portion of the LG mixture, the second diameter D2 of the second hole 125 of the LG mixture, and the first diameter Di of the first hole 123 are collected in the LG mixture flowing through the first octet L, the first-hole plane 124. The ratio (referred to as the second diameter ratio) may be in the range of about ❹7❹ = .9. For example, the first diameter of the first hole 123 is called about 3 〇, and the second diameter D2 of the first hole 125 may be about 25 mm. In a modified embodiment, the first of the first porous planes 122 of the second aperture 125 in the second porous planar surface 124 is spaced apart from the first one. Then, even if the LG compound passes through the first hole 123 surface (2), it does not directly flow through the second hole 125. The liquid portion of the LG mixture can then be collected on face 124. 10 because the second porous plane 124 of the women's wear can be under the first porous plane 122 in the separation box 11 , and the first porous plane 124 can have the same (four) product as the first porous plane 122. The ratio of the total area to the cross-sectional area of the inlet (1) (referred to as the second area ratio) may range from about 丨〇 to 1.2. Therefore, the second area ratio may be smaller than the first area ratio. In this embodiment, the summed area of the second holes may be substantially the same as the cross-sectional area of the inlet m. In an embodiment, the filter unit 120 may further comprise at least one filter, sheet 126 comprising a thin 14 201016293 1 ' 1 vv jujur microfiber filament, and insertable into the filter sheet 126 to the first and second porous planes 122 and 124 intermediate. For example, the filter sheet 126 may comprise a non-woven fabric&apos; and has some tiny pores due to the slight intersection of the filaments. In the present embodiment, the filter sheet 126 may include polypropylene filaments that cross each other. In an embodiment, a plurality of filter sheets 126 may be inserted intermediate the first and second porous planes 122 and 124. For example, eight to twelve overfishing sheets 126 can be stacked intermediate the first and second perforated planes 22 and 124. This filtered φ thin plate 126 has elastic properties depending on its material properties. In this embodiment, a certain number of filter sheets 12 6 interposed between the first and second porous planes 122 and 124 may be pressurized. Therefore, the liquid portion L in the lg mixture can be filtered by the fine pores of the filter sheet 126, and the liquid portion L is collected on the filter sheet 126. Then by filtering the sheet! The liquid portion L in the lg mixture can also be obtained 26 or the liquid portion 1 can be accumulated in the bottom portion 115 of the separation tank 11〇. That is to say, the liquid portion 1 in the LG mixture can be filtered by the filter sheet 126 过滤 of the filter unit 12〇.冨 The filter sheet 126 used in the filter unit 120 exceeds the appropriate lifespan, and the liquid portion L of the LG mixture A can be filled with tiny pores in the filter sheet 126, so that the filter sheet 126 will not be able to filter the liquid portion of the lg mixture. L. Therefore, a new filter sheet 126 can be used in place of the old one after the overlying sheet 12 6 has exceeded its useful life. In order to facilitate replacement of the filter sheet 126, the separation box 11 can include an opening 112 at the first side 117 such that the first and second porous planes 122 can be mounted or removed from the separation box i by the opening 112. And 124 15 201016293

TW5636PA J Λ 和過濾薄板126的過濾單元i2〇。 之後將參照第4和第5圖來更詳細的描述過滤薄板 126的更換。 第4圖係說明正在安裝分離箱110中過濾、單元120的 戴面圖，且第5圖係說明已完成完裝至分離箱110的過濾 單元120的載面圖。 參照第4和第5圖’第一和第二導軌溝槽可從開口 112延伸至側壁内’且可各別的將第-和第二多孔平面122 和124篏入至第-和第二導轨溝槽113和ιΐ4。也就是說， 可沿著第-和第二導執溝槽113和114導引第一和第二多 孔平面122和124至分離箱11〇。 然而’可用下述方式來更換過濾薄板126。首先可插 入過濾薄板126 S第一和第二多孔平面122和124中，且 可^著導轨溝槽113和114加壓拉出此過濾薄板126至分 離相11〇外。因此也可—起拉出過濾薄板126以及第一和 第二多孔平面122和124至分離箱110外。 +接著可採用表面無沾附LG混合物的液體部分L的過 濾、薄板來更換已飽和的過遽薄板126，且此更換過的過滤 薄板了被第矛口第一多孔平面122和124二者力σ壓。之後 可將第一和第二多孔平面122和124連同此更換過的過濾 薄板126沿著導執溝槽113和114嵌人至分離箱11〇。 在實施例中，導軌溝槽113和114的寬度W可各別的 大於第一和第二多孔平面122和124的厚度例如是 至約3ππη。 因此第—和第二多孔平面122和124可輕微且垂直的 201016293, I f l W JXJ^ur rv 各別於導執溝槽U3和1H中移動，且因此過濾薄板i26 可更被加壓至第一和第二多孔平面122和124中間。於是 當從分離箱no令拉出第一和第二多孔平面122和124 % ’可避免過濾薄板126和第一和第二多孔平面〗22和丨24 分離。 因此僅藉由將已嵌合或已分開的第一和第二多孔平 面122和124經由導軌溝槽113和114安裝至/移出從分 離箱no,即可簡單的更換過渡、薄板126，因此加速過濾 φ 薄板126的更換。 *分，H 100更可包括蓋子17〇和密封構件16〇。當將 第-和第二多孔平面122和124與過滤薄板126 一起嵌入 至分離器、100’可藉由蓋子170關閉開口 112且可***密 封構件160至分離箱110與蓋子Π0中。密封構件160可 选封分離箱110的内部空間，使之與分離箱11〇的外部隔 例中’可設計蓋子17G為具有與開π112㈣ 且可藉由螺栓經由密封構件⑽的媒介關緊 密封特性的件160可包括相對便宜且具有相對良好 ㈣特I·生的橡膠%&lt;。密封構件16〇更可包括 = 橡膠環(Vlt°n Hng)，且可將梦環或氟 ^用於包括強酸特性液體部分L的LG混合物中。 内過濾、單=二氣體排出管130可包括位於分離箱110 132^ 第二多孔平面124下的第一端部分 且第一端部分132可向外延伸穿過分離以1〇的分 17 201016293TW5636PA J Λ and filter unit i2 of filter sheet 126. The replacement of the filter sheet 126 will be described in more detail later with reference to Figures 4 and 5. Fig. 4 is a view showing the surface of the filtration unit 120 in the separation tank 110, and Fig. 5 is a view showing the surface of the filtration unit 120 which has been completed to the separation tank 110. Referring to Figures 4 and 5, 'the first and second rail grooves may extend from the opening 112 into the side wall' and the first and second porous planes 122 and 124 may be individually inserted into the first and second Rail grooves 113 and ΐ4. That is, the first and second porous planes 122 and 124 can be guided to the separation box 11A along the first and second guide grooves 113 and 114. However, the filter sheet 126 can be replaced in the following manner. First, the first and second porous planes 122 and 124 of the filter sheet 126 S can be inserted, and the filter sheets 113 and 114 can be pressed to pull the filter sheet 126 out of the separation phase 11 . It is therefore also possible to pull out the filter sheet 126 and the first and second porous planes 122 and 124 to the outside of the separation box 110. + then the saturated ruthenium sheet 126 can be replaced with a filter, sheet of liquid portion L having no surface adhering LG mixture, and the replaced filter sheet is etched by the first lance first porous planes 122 and 124 Force σ pressure. The first and second perforated planes 122 and 124 can then be embedded into the separation box 11A along the guide grooves 113 and 114 along with the replaced filter sheets 126. In an embodiment, the widths W of the rail grooves 113 and 114 may each be greater than the thickness of the first and second porous planes 122 and 124, for example, to about 3ππη. Therefore, the first and second porous planes 122 and 124 can be slightly and vertically moved by 201016293, I fl W JXJ^ur rv , respectively, in the guide grooves U3 and 1H, and thus the filter sheet i26 can be more pressurized to The first and second porous planes 122 and 124 are intermediate. Thus, when the first and second porous planes 122 and 124%' are pulled out from the separation box, the separation of the filter sheet 126 and the first and second porous planes 22 and 24 can be avoided. Therefore, the transition, sheet 126 can be simply replaced by simply attaching or detaching the first and second perforated planes 122 and 124 that have been fitted or separated to and from the separation box no via the rail grooves 113 and 114. Accelerate the replacement of the φ thin plate 126. *, H 100 may further include a cover 17 〇 and a sealing member 16 〇. When the first and second porous planes 122 and 124 are embedded with the filter sheet 126 to the separator, 100', the opening 112 can be closed by the cover 170 and the sealing member 160 can be inserted into the separation box 110 and the lid Π0. The sealing member 160 optionally seals the inner space of the separation box 110 so as to be in the outer compartment of the separation box 11 '. The designable cover 17G has a sealing property of π112 (4) and can be closed by the medium of the sealing member (10) by bolts. The piece 160 can include a relatively low cost and a relatively good (four) special rubber %&lt;. The sealing member 16 can further include a rubber ring (Vlt°n Hng), and a dream ring or fluorine can be used in the LG mixture including the strong acid characteristic liquid portion L. The inner filtration, single = two gas discharge tube 130 can include a first end portion located below the second porous plane 124 of the separation tank 110 132 and the first end portion 132 can extend outwardly through the separation of 1 17 17 201016293

TW5636PA 離箱底部115 ’以致氣體排出管130包括分離箱110外的 第二端部分133。第-端部分132於分離箱11〇的内部可 為封，形癌’且第二端部分133則可於分離箱11〇外為開 放形態。本實施例中，藉由另外的罩板134可封閉第-端 4刀132°不然’該領域中具有通常知識者可輕易的於製 造氣體排出器13G時’將第—端部分132塑造為封閉形態。 在實施例中’至少有一個氣體出口 136位於分離箱 110内氣體排出H 130第一端部分132周圍的出口表面 上此合物中的氣體部分G可通過過濾單元且於過❿ 濾皁το 120下流動（drift)，且此氣體部分G可流進氣體 出口 136以經由氣體排出器1別排至分離箱11 〇外。 在實施例中，氣體出口 136的位置較高於分離箱11〇 的^離箱底部115,如此LG混合物的液體部分L可流經過 漶單元120且聚積在分離箱HQ的分離箱底部〖π，避免 此液體部分L流進氣體出口 136。 參考第6圖來更詳細的描述氣體排出器13〇。 第6圖係說明繪示於第2圖的氣體排出器裝置的截面❹ 圖。 參考第6圖，可安裴一些氣體出口 136於圓柱體氣體 排出器130的周圍表面上，且氣體出口 136可藉由相同的 間隙距離g來分割成不同的空間。 當介於氣體出口 136的間隙距離g小於圓柱體氣體排 出器130圓周長的〇. 〇7倍，介於氣體出口 136的剩餘周 圍表面是如此的小以致於當藉由氣體排出器13〇排出 混合物中的氣體部分（^時，氣體排出器13〇可能損壞。相 18 201016293 • ' 1 wj〇j〇r/\ 對的，當介於氣體出口 136的間隙距離§係大於圓柱體氣 體排出器130圓周長（circumferentiai丨丨狀）的約〇^ 倍，則較難經由氣體出口 136排出LG混合物中的氣體部 分G。 因此介於氣體出口 136的間隙距離可介於圓柱體氣 體排出器130圓周長的約〇. 〇7倍到約〇 1倍。 例如，可安裝氣體出口 136於圓柱體氣體排出器13〇 的周圍表面，如此可量測相對圓柱體氣體排出器13〇中心 ❹軸的氣體出口 136間隙距離g的角距（angular distance)。在實施例中，介於氣體出口 136的間隙距離g 相對圓柱體氣體排出器130的中心軸可約為30。，如此可 設計介於氣體出口 136剩餘部分的周圍表面成具有中心角 約30°的扇形。 在實施例中，液體排出器140可位於分離箱11〇的分 離箱底部115中鄰近氣體排出器130的位置。藉由液體排 出器140’可排出積聚於分離箱no中分離箱底部lb上 β的LG混合物中液體部分l至分離箱ho外。 既然LG混合物中的液體部分l相較於LG混合物中的 氣體部分G具有較高的密度，且液體部分l的排出量較少 於氣體部分G的排出量，則液體排出器14〇具有較小於氣 體排出器130的直徑。 參照第7和第8圖來更詳細的說明液體排出器140。 第7圖係說明根據本發明第一實施例來耦接分離箱 的液體排出器的截面圖，且第8圖係說明根據本發明第二 實施例來耦接分離箱的截面圖，而液體排出器係顯示於第 19 201016293 TW5636PA , 2圖。 參照第7圖’嵌壁部分1丨6可位於分離箱no的分離 箱底部115上，且嵌壁部分116的底部表面可較低於分離 箱110的分離箱底部115的表面。如此則可於分離箱u〇 的嵌壁部分116中收集位於分離箱底部115上的lg混合 物的液體部分L。 液體排出器140可連接至嵌壁部分116。因此可經由 液體排出器140排出位於嵌壁部分116中的LG混合物的 液體部分L至分離箱11〇外。 〇 參照第8圖，分離箱110的分離箱底部115可從中央 部分以一預先定義的傾斜角α向周圍部分118傾斜，且液 體排出器140可不經過嵌壁部分直接流過底部。因此[卩 混合物中的液體部分L可因為傾斜角α向下流至分離箱底 部115的周圍部分ι18，而經由液體排出器14〇排出液體 部分L至分離箱11〇外。 在本發明的實施例中，分離箱底部115的周圍部分 118可被分割出開口 U2。然而，該領域中具有通常知識❹ 者也可設計出鄰近周圍部分118的開口 112。 例如，於修改分離箱11()的總和體積和形狀以最小化 分離箱110的情況下，可決定傾斜角α。本發明實施例中， 傾斜角α可介於約3。至5。的範圍。 因此了連續的堆疊第二多孔平面12 4、一些過濾、薄板 以及第一多孔平面122於分離箱11〇中，再安裝過濾 單元120至分離箱11 〇中。於是LG混和物可向下流動經 過分離箱110中的過濾單元12〇，且藉由第一多孔平面 20 201016293 122、過遽薄板126以及第二多孔平面124可連續的過濾 出LG混和物中的液體部分L。再藉由氣體排出器13〇的氣 體出口 136可排出lg混合物中的氣體部分G至分離箱π0 外。LG混和物中的液體部分L可聚積在分離箱11〇的分離 箱底部115 ’且藉由液體排出器14〇排出此液體部分[至 分離箱110外。因此可分離LG混合物至各別的液體部分L 和氣體部分G而不用增加分離箱11〇的體積。 也就是說，可減少用於分離箱110的裝置空間且可更 ©輕鬆的安裝環繞分離箱11〇中用於分離器1〇〇的其它裝 置。 第9圖係說明用於處理包括繪示於第丨圖裝置的基板 的裝置的概圖。 參照第9圖’根據本發明創新概念的實施例來處理基 板的裝置1000可包括處理t 200,用則專送基板的傳送單 兀300，用於提供處理溶液至基板上的液體喷洗器，The TW5636PA is off the bottom 115 of the tank so that the gas discharge pipe 130 includes the second end portion 133 outside the split tank 110. The first end portion 132 may be sealed inside the separation box 11A, and the second end portion 133 may be in an open configuration outside the separation box 11. In this embodiment, the first end 4 knife 132 can be closed by the additional cover plate 134. Otherwise, the person skilled in the art can easily shape the first end portion 132 to be closed when manufacturing the gas ejector 13G. form. In the embodiment, 'at least one gas outlet 136 is located on the outlet surface around the first end portion 132 of the gas discharge H 130 in the separation tank 110. The gas portion G in the mixture can pass through the filtration unit and filter the soap το 120 The lower portion is floated, and this gas portion G can flow into the gas outlet 136 to be discharged to the separation tank 11 via the gas ejector 1 . In an embodiment, the position of the gas outlet 136 is higher than the bottom 115 of the separation tank 11 , so that the liquid portion L of the LG mixture can flow through the crucible unit 120 and accumulate at the bottom of the separation tank of the separation tank HQ [π, This liquid portion L is prevented from flowing into the gas outlet 136. The gas ejector 13A will be described in more detail with reference to Fig. 6. Fig. 6 is a cross-sectional view showing the gas ejector device shown in Fig. 2. Referring to Fig. 6, a plurality of gas outlets 136 can be mounted on the peripheral surface of the cylindrical gas ejector 130, and the gas outlets 136 can be divided into different spaces by the same gap distance g. When the gap distance g between the gas outlets 136 is less than 圆周. 7 times longer than the circumference of the cylindrical gas ejector 130, the remaining peripheral surface between the gas outlets 136 is so small that it is discharged by the gas ejector 13 Part of the gas in the mixture (the gas ejector 13 〇 may be damaged. Phase 18 201016293 • ' 1 wj〇j〇r / \ Yes, when the gap distance between the gas outlet 136 is greater than the cylindrical gas ejector 130 times the circumference of the circle, it is more difficult to discharge the gas portion G in the LG mixture via the gas outlet 136. Therefore, the gap distance between the gas outlets 136 can be between the circumference of the cylindrical gas ejector 130 The length is about 7 times to about 1 time. For example, a gas outlet 136 can be installed on the peripheral surface of the cylindrical gas ejector 13A, so that the gas relative to the center axis of the cylindrical gas ejector 13 can be measured. The outlet 136 has an angular distance of gap g. In an embodiment, the gap distance g between the gas outlets 136 may be about 30 with respect to the central axis of the cylindrical gas ejector 130. The peripheral surface of the remainder of the gas outlet 136 is in the shape of a sector having a central angle of about 30. In an embodiment, the liquid ejector 140 can be located adjacent the gas ejector 130 in the bottom 115 of the separation tank of the separation tank 11A. The liquid portion 1 of the LG mixture accumulated in β at the bottom lb of the separation tank in the separation tank no can be discharged by the liquid ejector 140' to the outside of the separation tank ho. Since the liquid portion 1 in the LG mixture is compared with the gas in the LG mixture The portion G has a higher density, and the discharge amount of the liquid portion 1 is smaller than the discharge amount of the gas portion G, and the liquid ejector 14 〇 has a smaller diameter than the gas ejector 130. Referring to Figures 7 and 8 The liquid ejector 140 is explained in more detail. Fig. 7 is a cross-sectional view showing a liquid ejector coupled to a separation box according to a first embodiment of the present invention, and Fig. 8 is a view illustrating coupling according to a second embodiment of the present invention. A cross-sectional view of the separation box, and the liquid ejector is shown in Fig. 19 201016293 TW5636PA, Fig. 2. Referring to Fig. 7 'the recessed portion 1 丨 6 may be located on the bottom 115 of the separation box of the separation box no, and the wall portion 116 bottom The surface may be lower than the surface of the separation tank bottom 115 of the separation tank 110. Thus, the liquid portion L of the lg mixture located on the bottom 115 of the separation tank may be collected in the recessed portion 116 of the separation tank u. It is connected to the wall portion 116. Therefore, the liquid portion L of the LG mixture located in the wall portion 116 can be discharged to the outside of the separation box 11 via the liquid ejector 140. Referring to Fig. 8, the bottom 115 of the separation box 110 of the separation box 110 can be The central portion is inclined toward the peripheral portion 118 at a predetermined inclination angle α, and the liquid ejector 140 can flow directly through the bottom portion without passing through the wall portion. Therefore, the liquid portion L in the mixture can flow downward to the peripheral portion ι 18 of the bottom portion 115 of the separation tank 115 due to the inclination angle α, and the liquid portion L is discharged to the outside of the separation tank 11 via the liquid discharger 14. In an embodiment of the invention, the peripheral portion 118 of the split box bottom 115 can be split into the opening U2. However, those having ordinary knowledge in the art can also design openings 112 adjacent to the surrounding portion 118. For example, in the case of modifying the total volume and shape of the separation box 11() to minimize the separation box 110, the inclination angle α can be determined. In an embodiment of the invention, the tilt angle α may be between about 3. To 5. The scope. Therefore, the second porous flat surface 12 4, some of the filtration, the thin plate, and the first porous flat surface 122 are successively stacked in the separation tank 11 , and the filtration unit 120 is installed in the separation tank 11 . The LG mixture can then flow downward through the filter unit 12〇 in the separation tank 110, and the LG mixture can be continuously filtered by the first porous plane 20 201016293 122, the overlying sheet 126 and the second porous plane 124. The liquid portion L in the middle. The gas portion G in the lg mixture can be discharged to the outside of the separation tank π0 by the gas outlet 136 of the gas ejector 13〇. The liquid portion L in the LG mixture can be accumulated in the bottom 115' of the separation tank of the separation tank 11 and discharged from the liquid discharge unit 14 to the outside of the separation tank 110. Therefore, the LG mixture can be separated to the respective liquid portion L and gas portion G without increasing the volume of the separation tank 11〇. That is, the device space for the separation box 110 can be reduced and other devices for the separator 1〇〇 in the surrounding separation box 11 can be more easily installed. Figure 9 is a diagram showing an overview of a device for processing a substrate including the device shown in the first drawing. Referring to Figure 9, an apparatus 1000 for processing a substrate in accordance with an embodiment of the inventive concept of the present invention may include a process t 200 for transporting a substrate to a liquid sprayer for providing a processing solution to the substrate,

用，提供處理氣體至基板上的氣體噴洗器5〇〇以及用於分 離氣體液體混和物至各別的液體部分和氣分的 器 100。 第Θ圖中的分離器1〇〇可具有如參照第工至第8圖所 的π離器之相同架構。如此第9圖中相同標諸符號代 曰不於第1至第8圖中相同元件，且將，忽略相同元件的 咩細描述。 的向a在實施例中處理室_可提供具有足夠放置基板S 上^間’且在此内部空間可執行各種加工於基板s 如’基板8可包括用於液晶顯示器（liquid crystal 21 201016293 TW5636PA ' , display LCD)裝置的薄膜電晶體（thin film transistor TFT)玻璃基板和濾光板（color filter CF)玻璃基板，和 半導體基板（例如是用於積體電路裝置的晶片）。 在實施例中，傳送單元300可位於處理室200的底部 部分，且當從處理室200裝入/移出基板S時，基板S可 位於傳送單元300上。也就是說，藉由傳送單元300可傳 送基板S至/出處理室200。例如，傳送單元300可包括於 處理室200中垂直基板S的傳送方向之水平延伸的軸 310，和一些以相同間距耦接軸31〇的滾輪32〇。 ❹ 在實施例中’液體喷洗器400可位於處理室200較高 部分中基板S的上方。可從處理室2〇〇的外部提供處理溶 液L至液體喷洗器400，且於處理室2〇〇内喷灑至基板s 上。 例如，處理溶液L可包括於處理室2〇〇中用來蝕刻處 理或清洗處理的去離子水、硫酸水溶液、鹽酸水溶液以及 過氧化氫水溶液。 在實施例中，傳送單元300可用預先定義的處理角度❹ 傾斜基板S，如此喷洗至基板s上方的處理溶液可因為處 理角度在基板S上向下流動，以增加處理基板s的效率。 例如，基板S的處理角度相對於處理室2〇〇的水平處理室 底部220表面可介於約3。到6。的範圍。 在實施例中，氣體噴洗器5〇〇可位於處理室2〇〇内液 體喷洗器400上面。可藉由氣體噴洗器5〇〇喷出處理氣體 G至處理室20G的整個内部空間。在實施例中，可安裝氣 體噴洗器500至處理室200的處理室頂部21〇。 22 201016293 因此可從液體喷洗器400上的較高部分向下喷出處 理氣體G至處理室200的處理室底部220，如此從液體喷 洗器400喷出的處理溶液L可藉由處理氣體G的驅動而朝 向基板S流動。 因此處理溶液L和處理氣體G可於處理室200内彼此 混合，以產生於處理室200流動的氣體-液體混合物。當 特殊處理完成後，可裝載另一基板至處理室200，而此新 基板可能會被處理室200中流動的LG混合物所汙染。 ❹ 在實施例中，可鄰近處理室200安裝分離器100且可 藉由供應管150連接分離器100至處理室200。因此可藉 由供應管150提供處理室200的LG混合物至分離器100， 且於分離器100中分離LG混合物至各別的液體部分L和 氣體部分G。 例如，既然LG混合物可流動於處理室200中，供應 管150可連接至處理室200的較高部分。可安裝供應管150 至處理室頂部210或處理室200中鄰近處理室頂部210的 ❹處理室側壁230。在本實施例中，可安裝供應管150至處 理室200中鄰近處理室頂部210的處理室側壁230，以利 裝置1000的組裝。 分離器100可包括：連接至其位於頂端部分的供應管 150之分離箱110，位於分離箱110内供應管150下的過 濾單元120，且此過濾單元120過濾出經由供應管150提 供至分離箱110的LG混合液中的液體部分L，位於分離箱 110中過濾單元120下的底部部分的氣體排出器130，其 中氣體排出器130的封閉第一端部分可正向過濾單元120 23 201016293For use, a gas scrubber 5 that provides a process gas to the substrate and a device 100 for separating the gas liquid mixture to the respective liquid portion and gas fraction. The separator 1〇〇 in the figure may have the same structure as the π-offer as described with reference to the eighth to eighth figures. Thus, the same reference numerals in the FIG. 9 are not the same as those in the first to eighth embodiments, and a detailed description of the same elements will be omitted. In the embodiment, the processing chamber _ can be provided with sufficient placement of the substrate S and can perform various processing on the substrate s such as 'the substrate 8 can be included for the liquid crystal display (liquid crystal 21 201016293 TW5636PA ' , a display film) device, a thin film transistor (TFT) glass substrate and a color filter (CF) glass substrate, and a semiconductor substrate (for example, a wafer for an integrated circuit device). In an embodiment, the transfer unit 300 may be located at a bottom portion of the process chamber 200, and when the substrate S is loaded/removed from the process chamber 200, the substrate S may be located on the transfer unit 300. That is, the substrate S can be transferred to/from the processing chamber 200 by the transfer unit 300. For example, the transfer unit 300 may include a horizontally extending shaft 310 in the transfer direction of the vertical substrate S in the process chamber 200, and some of the rollers 32A coupled to the shaft 31A at the same pitch. ❹ In an embodiment, the liquid sprayer 400 can be located above the substrate S in the upper portion of the processing chamber 200. The treatment solution L can be supplied from the outside of the treatment chamber 2 to the liquid sprayer 400, and sprayed onto the substrate s in the treatment chamber 2A. For example, the treatment solution L may be included in the treatment chamber 2, deionized water for etching treatment or cleaning treatment, aqueous sulfuric acid solution, aqueous hydrochloric acid solution, and aqueous hydrogen peroxide solution. In an embodiment, the transfer unit 300 may tilt the substrate S with a predetermined processing angle ,, so that the processing solution sprayed onto the substrate s may flow downward on the substrate S due to the processing angle to increase the efficiency of processing the substrate s. For example, the processing angle of the substrate S may be about 3 with respect to the surface of the horizontal processing chamber bottom 220 of the processing chamber 2〇〇. To 6. The scope. In an embodiment, the gas jet 5 can be located above the liquid sprayer 400 in the processing chamber 2 . The processing gas G can be ejected by the gas sprayer 5 to the entire internal space of the processing chamber 20G. In an embodiment, the gas sprayer 500 can be installed to the processing chamber top 21 of the process chamber 200. 22 201016293 Therefore, the processing gas G can be ejected from the upper portion of the liquid rinsing device 400 to the processing chamber bottom 220 of the processing chamber 200, so that the processing solution L ejected from the liquid rinsing device 400 can be processed by the processing gas The driving of G flows toward the substrate S. Thus, the treatment solution L and the process gas G can be mixed with each other in the process chamber 200 to produce a gas-liquid mixture flowing in the process chamber 200. When the special treatment is completed, another substrate can be loaded to the processing chamber 200, and this new substrate may be contaminated by the LG mixture flowing in the processing chamber 200. ❹ In an embodiment, the separator 100 can be mounted adjacent to the processing chamber 200 and the separator 100 can be coupled to the processing chamber 200 by a supply tube 150. Thus, the LG mixture of the process chamber 200 can be supplied to the separator 100 by the supply pipe 150, and the LG mixture can be separated in the separator 100 to the respective liquid portion L and gas portion G. For example, since the LG mixture can flow in the processing chamber 200, the supply tube 150 can be coupled to a higher portion of the processing chamber 200. The supply tube 150 can be mounted to the processing chamber top 210 or the processing chamber side 200 adjacent to the processing chamber top 210. In the present embodiment, the supply tube 150 can be installed to the processing chamber sidewall 230 adjacent the processing chamber top 210 in the processing chamber 200 to facilitate assembly of the device 1000. The separator 100 may include a separation tank 110 connected to a supply pipe 150 at a top end portion thereof, a filtration unit 120 located under the supply pipe 150 in the separation tank 110, and the filtration unit 120 is filtered out to be supplied to the separation tank via the supply pipe 150. The liquid portion L in the LG mixture of 110 is located in the bottom portion of the gas ejector 130 under the filter unit 120 in the separation tank 110, wherein the closed first end portion of the gas ejector 130 is forward filter unit 120 23 201016293

TW5636PA 且藉由氣體排出器130可排出LG混合液中的氣體部分g 至^離箱110外，以及包括位於分離箱110的底部部分鄰 近氣體排出器130的第一液體排出器14〇，且可藉由第一 液體排出器140排出LG混合物中的液體部分L至分離箱 110 外。 在本實施例中，氣體排出器130可設計成圓柱狀且可 包括用來封閉過濾單元120下圓柱體第一端部分的額外罩 板134，和位於圓柱體周圍表面中鄰近罩板134的一些氣 體出口 1264G混合物中的氣體部分流向氣體出口 126 以被排出至分離箱110外。 真空泵600可安裝至氣體排出器13〇中位於分離箱 11〇外的第二端部分，以加速經由供應管15〇提供混合 物至分離箱11 〇。 特別的是，可藉由真空泵6〇〇產生真空壓力且經由氣 體排出器130和分離箱ι10供應至供應管15〇。且既然於 參照第1至第8圖所描述架構的過濾單元12〇可被用以最 小化真空壓力的減損，藉由分離箱11〇中的過濾單元12〇❹ 將可不會減損真空壓力。 如上所述，用於分離LG混合物至液體部分L和氣體 部分G的分離器1〇〇可位於處理室2〇〇和真空泵6〇〇之 間，如此可避免真空泵600因為LG混合物的液體部分匕 而造成損壞。 襄置1000更包括連接至處理室200的處理室底部22〇 的第二液體排出器700。處理溶液可從液體噴洗器4〇〇提 供至基板S上以處理基板s，而剩餘的處理溶液可殘存在 24 處理室200處理室底部220上。藉由第二液體排出器700 可排出剩餘的處理溶液至處理室200外。 在實施例中，藉由第二液體排出器700排出的剩餘處 理溶液可收集於另外的收集器（沒有晝出），且可用於再供 應至液體喷洗器400以再產生剩餘的處理溶液。 因此藉由分離器100可有效率的從LG混合物分離出 液體部分L，且於裝置1000中可再產生已分離的液體部分 L ° ❹ 根據本發明概念的一些實施例，當可從處理室中排出 LG混合物，可藉由分離器有效率的分離出LG混合物中的 液體部分L，如此可有效率的避免真空泵因為LG混合物中 的液體部分L而造成損壞。 前述說明係說明實施例，且不被解釋為限制其範圍。 雖然已說明一些實施例，該領域中具有通常知識者將很容 易的察覺在這些實施例中不經由實質上背離本發明的優 點和新穎技術的許多修改係可能的。因此所有此類修改被 參預期仍包含於本發明定義的權利範圍内。在權利範圍中， 預期結構附加功能的句子包括為應用敘述功能描述的架 構，且不僅是包括架構上相同也包括相同架構。因此可明 瞭前述說明各種實施例不被解釋為限制權利範圍為特定 揭露實施例，且揭露實施例和其它實施例的修改被預期為 包括於下述權利範圍的範圍内。 【圖式簡單說明】 從詳細實施内容與對應非表示為限制的第1至第10 25 201016293TW5636PA and the gas eliminator 130 can discharge the gas portion g in the LG mixture to the outside of the tank 110, and includes a first liquid ejector 14A located adjacent to the gas ejector 130 at the bottom portion of the separation tank 110, and The liquid portion L in the LG mixture is discharged to the outside of the separation tank 110 by the first liquid discharger 140. In the present embodiment, the gas ejector 130 may be designed in a cylindrical shape and may include an additional cover plate 134 for closing the first end portion of the lower portion of the cylinder of the filter unit 120, and some adjacent to the cover plate 134 in the peripheral surface of the cylindrical body. The gas portion of the gas outlet 1264G mixture flows to the gas outlet 126 to be discharged outside the separation tank 110. The vacuum pump 600 can be mounted to a second end portion of the gas ejector 13A located outside the separation tank 11 to accelerate the supply of the mixture to the separation tank 11 through the supply pipe 15. Specifically, the vacuum pressure can be generated by the vacuum pump 6 且 and supplied to the supply pipe 15 经由 via the gas ejector 130 and the separation tank ι 10 . And since the filter unit 12A of the structure described with reference to Figs. 1 to 8 can be used to minimize the impairment of the vacuum pressure, the filter unit 12 in the separation tank 11〇 will not detract from the vacuum pressure. As described above, the separator 1 for separating the LG mixture to the liquid portion L and the gas portion G can be located between the processing chamber 2A and the vacuum pump 6A, so that the vacuum pump 600 can be avoided because of the liquid portion of the LG mixture. And caused damage. The housing 1000 further includes a second liquid ejector 700 coupled to the bottom 22 of the processing chamber of the processing chamber 200. The treatment solution can be supplied from the liquid sprayer 4 to the substrate S to process the substrate s, and the remaining treatment solution can remain on the processing chamber bottom 220 of the processing chamber 200. The remaining treatment solution can be discharged to the outside of the processing chamber 200 by the second liquid ejector 700. In an embodiment, the remaining treatment solution discharged by the second liquid ejector 700 can be collected in an additional collector (without scooping) and can be used to re-feed to the liquid squirt 400 to regenerate the remaining treatment solution. Thus, the liquid portion L can be efficiently separated from the LG mixture by the separator 100, and the separated liquid portion L can be regenerated in the apparatus 1000. According to some embodiments of the inventive concept, when it is available from the processing chamber By discharging the LG mixture, the liquid portion L in the LG mixture can be efficiently separated by the separator, so that the vacuum pump can be effectively prevented from being damaged by the liquid portion L in the LG mixture. The foregoing description is illustrative of the embodiments and is not to be construed as limiting. Although a few embodiments have been described, it will be readily apparent to those skilled in the art that many modifications are possible in the embodiments without departing from the advantages and novel techniques of the invention. All such modifications are therefore intended to be included within the scope of the invention as defined by the invention. In the scope of the rights, the sentence of the structure-added function is expected to include the architecture described for the application narrative function, and includes not only the same architecture but also the same architecture. It is to be understood that the foregoing description of the invention is not to be construed as a limitation of the scope of the invention. [Simple description of the schema] From the detailed implementation content and the corresponding non-representation as the limit 1st to 10th 25 201016293

1 W5636PA J ， 圖可更清楚的理解實施例，實施例則描述於實施内容。 第1圖係根據本發明實施例說明用於分離氣體和液 體混合物至其各別部分的詳盡透視圖。 第2圖係說明繪示於第1圖的分離器之截面圖。 第3圖係說明繪示於第2圖中過濾單元一部分之透視 圖。 第4圖係說明正在安裝至分離箱的過濾單元ι2〇之截 面圖。 第5圖係說明已完全安裝至分離箱的過濾單元120之參 戴面圖。 第6圖係說明繪示於第2圖中分離器的氣體排出器之 截面圖。 第7圖係說明繪示於第2圖中分離器的液體排出器之 載面圖。 第8圖係說明繪示於第2圖中分離器的液體排出器之 截面圖。 第9圖係說明用來處理包括第1圖繪示的分離器的基❺ 板的裝置之概圖。 【主要元件符號說明】 100 :分離器 110 :分離箱 111 :入口 112 :開口 2010162931 W5636PA J , the figure can more clearly understand the embodiment, and the embodiment is described in the implementation. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a detailed perspective view showing the separation of gases and liquid mixtures to their respective parts in accordance with an embodiment of the present invention. Fig. 2 is a cross-sectional view showing the separator shown in Fig. 1. Figure 3 is a perspective view showing a portion of the filter unit shown in Figure 2. Figure 4 is a cross-sectional view showing the filter unit ι2 正在 being mounted to the separation box. Figure 5 is a cross-sectional view showing the filter unit 120 that has been completely mounted to the separation box. Fig. 6 is a cross-sectional view showing the gas ejector of the separator shown in Fig. 2. Fig. 7 is a plan view showing the liquid discharger of the separator shown in Fig. 2. Figure 8 is a cross-sectional view showing the liquid ejector of the separator shown in Figure 2. Fig. 9 is a schematic view showing an apparatus for processing a substrate including the separator of Fig. 1. [Description of main component symbols] 100: Separator 110: Separation tank 111: Entrance 112: Opening 201016293

ι · 1 VV^VJJUr/A 113 114 115 116 117 118 120 122 φ 123 124 125 126 130 132 133 134 ⑩ 136 140 150 160 170 200 210 220 230 第一導執溝槽 第二導軌溝槽 分離箱底部 嵌壁部分 第一邊 周圍部分 過濾單元 第一多孔平面 第一孔 第二多孔平面 第二孔 過濾薄板 氣體排出器 第一端部分 第二端部分 罩板 氣體出口 液體排出器 供應管 密封構件 蓋子 處理室 處理室頂部 處理室底部 處理室側壁 27 201016293 , 1W5636HA V ' ' 300 :傳送單元 310 :軸 320 :滾輪 400 :液體喷洗器 500 :氣體喷洗器 600 :真空泵 700 :第二液體排出器 1000 :裝置 ⑩ι · 1 VV^VJJUr/A 113 114 115 116 117 118 120 122 φ 123 124 125 126 130 132 133 134 10 136 140 150 160 170 200 210 220 230 First guide groove second guide groove groove separation box bottom Wall portion first side surrounding portion filter unit first porous plane first hole second porous plane second hole filter sheet gas ejector first end portion second end portion cover plate gas outlet liquid ejector supply tube sealing member cover Treatment chamber treatment chamber top treatment chamber bottom treatment chamber side wall 27 201016293 , 1W5636HA V ' ' 300 : transfer unit 310 : shaft 320 : roller 400 : liquid sprayer 500 : gas sprayer 600 : vacuum pump 700 : second liquid discharger 1000: device 10

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Claims (1)

201016293 ( » 1 τ» »/V^/V/Ι^'ί-V 七、申請專利範圍： 1. 一種分離器，用以從一氣體-液體混合物中分離出 一液體部分，該分離器包括： 一分離箱，包括： 一入口，位於該分離箱頂端部分，藉由該入口 供應該氣體-液體混合物至該分離箱； 一過濾單元，位於該分離箱中該入口下，該過濾單元 從該氣體-液體混合物中過濾出該液體部分； Φ 一氣體排出器，位於該分離箱的一底部部分，以使該 氣體排出器的一封閉端部分面向該過濾單元，且至少一氣 體出口安裝於該氣體排出器的一側壁，藉由該氣體出口排 出該氣體-液體混合物中的一氣體部分至該分離箱外；以 及 一液體排出器，位於該分離箱的該底部部分，藉由該 液體排出器排出該氣體-液體混合物中的該液體部分至該 分離箱外。 ❹ 2.如申請專利範圍第1項所述之分離器，其中該氣 體出口的位置高於該分離箱中該底部的一表面。 3.如申請專利範圍第1項所述之分離器，其中該過 滤單元包括： 一第一多孔平面，藉由該第一多孔平面安裝一 些具有一第一直徑的第一孔； 一第二多孔平面，一些具有小於該第一直徑的 一第二直徑之第二孔安裝於該第二多孔平面，該第二多孔 平面位於該第一多孔平面下，於此架構下該分離箱的内部 29 201016293 TW5636PA 空間被分割為細小的次空間。 4.如申請專利範圍第1 -孔的總和面積相對於該==離器’其中該第 至約1.5的範圍，且該第二沿截面積的比值介於約1.1 截面積的比值介於約1.0至約目對於該入口的 -孔的該第項所述之分離器，其中該第 倍，且該第二二:直至約❶.3 約0. 7至約〇.9倍。 ^弟孔的5亥第一直徑的 ❹ 濟單!.包=請專利範圍第3項所述之分離器，其中該過 濾早兀包括至少一過渡薄板***於該第-和該第二多孔 平面之間’該過濾薄板具有細微纖微絲。 7·如申請專利範圍第6項所述之 離箱更包括·· 〇 Ϋ 5衾刀 一開口’位於其側壁； 一蓋子，用於封閉該開口；以及 Q 一密封部件，用於密封介於該蓋子與該分離箱開 口周圍的間隙，該第一和第二多孔平面以及***於該第一 與该第二多孔平面之間的該過濾薄板經由該開口安裝至 或移出從該分離箱。 &lt; # 8.如申請專利範圍第7項所述之分離器其中該分 離鈿更包括從該開口沿著該分離箱側壁内延伸的一第一 和一第二導軌溝槽’該第一和該第二多孔平面嵌入至該第 -和該第二溝槽’且該第—和該第二多孔平面被各別地導 入至该分離箱。 30 201016293 , 1 W3〇J〇i?A 9.如申請專利範圍第8項所述之分離器，其中★亥第 -導執溝槽的—寬度係較大於該第—多孔平面的—厚产 ’且該第二導執溝槽的一寬度係較大“ 弟一夕孔+面的一厚度約1咖至3mm。 雜10.如申請專利範圍第1項所述之分離器，其中該分 離相包括位於該分離箱中該底部部分㈣壁部分H液 體排出器係連接至該分離箱中該嵌壁部分。 11.如申請專利範圍第Μ所述之分離器，其中該分 =中該底部部分係從該分離箱中間部分向分離箱周圍 ^傾斜’且該液藝出器係連接至該分離箱巾該底 分的該周圍部分。 _ 12.如申請專利範圍第Μ所述之分離器，其中該氣 ，出器具有—圓柱體的形狀且該些氣體出口安裝至該 ，極體讀排出II環繞該封閉端部分的周圍表面，且以該 柱體氣體排出器的一圓周長的約〇 〇7至約〇1倍的相 5的間隙距離隔開該些氣體出口。 —種用於處理一基板的裝置，包括： —處理室，該基板於該處理室中被處理； —液體喷洗器，位於該處理室内該基板的上方，該液 噴洗器喷出一處理溶液至該基板上； —氣體喷洗器，位於該處理室内該液體喷洗器上方， 該氣體嘴洗时出一處理氣體至該處理室中一整 空間； &quot; 分離器，經由一供應管連接至該處理室，該分離器 從氣體'溶液混合物中分離該處理溶液和該處理氣體， 31 201016293 該氣體-溶液混合物經由該供應管從該處理室提供至該分 離器，該分離器包括： 一分離箱，包括位於該分離箱頂端部分連結至 供應管的一入口； 一過濾單元，位於該分離箱中該入口下方，該 過濾單元從該氣體-溶液混合物中過濾出該處理溶液部 分； 一氣體排出器，位於該分離箱的一底部部分， 該氣體排出器的一封閉第一端部分具有正向該過濾單元 ❿ 的架構，且至少一氣體出口係安裝至該氣體排出器的一侧 壁，該氣體-溶液混合物中處理氣體部分經由氣體出口被 排出至分離箱外；以及 一第一液體排出器，位於該分離箱的該底部部 分，且該氣體-溶液混合物中的該處理溶液部分經由該液 體排出器被排出至該分離箱外。 14. 如申請專利範圍第13項所述之裝置，更包括一 連接至分離箱外相對該氣體排出器中該第一端部分的一 〇 第二端部分之真空泵，以藉由該真空泵產生一真空壓力且 經由該分離箱提供該真空壓力至該供應管。 15. 如申請專利範圍第13項所述之裝置，更包括一 連接至該處理室中一底部部分的一第二液體排出器，殘存 在該處理室内該底部部分上的該處理溶液中一剩餘溶液 經由該第二液體排出器排出至處理室外。 16. 如申請專利範圍第15項所述之裝置，其中該第 一液體排出器係連接至該第二液體排出器，以致於從該氣 32 201016293 , ,1 W^bJbHA ' 體-溶液混合物中過濾出的該溶液部分經由該第二液體排 出器排出至該裝置外。201016293 ( » 1 τ» »/V^/V/Ι^'ί-V VII. Patent application scope: 1. A separator for separating a liquid portion from a gas-liquid mixture, the separator comprising : a separation tank comprising: an inlet located at a top end portion of the separation tank, the gas-liquid mixture being supplied to the separation tank through the inlet; a filtration unit located in the separation tank under the inlet, the filtration unit from the Filtering the liquid portion in the gas-liquid mixture; Φ a gas ejector located at a bottom portion of the separation tank such that a closed end portion of the gas ejector faces the filter unit, and at least one gas outlet is mounted thereto a side wall of the gas ejector through which a gas portion of the gas-liquid mixture is discharged to the outside of the separation tank; and a liquid ejector located at the bottom portion of the separation tank by the liquid ejector Discharging the liquid portion of the gas-liquid mixture to the outside of the separation tank. ❹ 2. The separator of claim 1, wherein the gas outlet is located A separator of the bottom portion of the separation tank. The separator of claim 1, wherein the filter unit comprises: a first porous plane, and the first porous plane is mounted by the first porous plane a first hole having a first diameter; a second porous plane, a second hole having a second diameter smaller than the first diameter is mounted to the second porous plane, the second porous plane being located In the first porous plane, the interior of the separation box 29 201016293 TW5636PA space is divided into small sub-spaces under this framework. 4. As claimed in the patent scope, the sum-area area of the first hole is relative to the == disconnector' a range from the first to about 1.5, and the ratio of the second cross-sectional area is between about 1.1 and the cross-sectional area is between about 1.0 and about the separator of the item of the inlet for the inlet, wherein the The first time, and the second two: up to about ❶.3 about 0.7 to about 〇.9 times. ^The second diameter of the 5 hole of the brother of the hole ! !!. Package = please refer to the third paragraph of the patent scope a separator, wherein the filtering includes at least one transition sheet inserted in the first - and the Between the two porous planes, the filter sheet has fine microfilaments. 7. The separator according to claim 6 includes: · 〇Ϋ 5 衾 an opening 'located on its side wall; Closing the opening; and Q a sealing member for sealing a gap between the cover and the opening of the separation box, the first and second porous planes being inserted into the first and second porous planes The filter sheet is mounted to or removed from the separation box via the opening. The separator of claim 7 wherein the separation device further comprises the opening from the opening along the side wall of the separation box. Extending a first and a second rail groove 'the first and second porous planes are embedded into the first and second trenches' and the first and second porous planes are individually Imported to the separation box. 30 201016293 , 1 W3〇J〇i?A 9. The separator of claim 8 wherein the width of the channel is greater than the thickness of the first porous plane. And the width of the second guide groove is larger. The thickness of the second hole is about 1 to 3 mm. The separator according to claim 1, wherein the separation The phase includes a bottom portion (four) wall portion H in the separation tank, and a liquid ejector is connected to the wall portion in the separation box. 11. The separator according to the scope of the patent application, wherein the portion = the bottom portion The portion is inclined from the middle portion of the separation box to the periphery of the separation box and the liquid art device is connected to the peripheral portion of the bottom portion of the separation box. _ 12. The separator according to the scope of the patent application Wherein the gas, the outlet has a cylindrical shape and the gas outlets are mounted thereto, the polar body read discharge II surrounds the peripheral surface of the closed end portion, and is about a circumference of the cylindrical gas ejector 〇〇7 to about 1 times the gap distance of phase 5 to separate the gas outlets - A device for processing a substrate, comprising: - a processing chamber, the substrate being processed in the processing chamber; - a liquid sprayer located above the substrate in the processing chamber, the liquid sprayer ejecting a Processing the solution onto the substrate; - a gas sprayer located above the liquid sprayer in the processing chamber, the gas nozzle washing out a process gas to a whole space in the processing chamber; &quot; separator, via a supply a tube connected to the processing chamber, the separator separating the processing solution and the processing gas from a gas 'solution mixture, 31 201016293 via which the gas-solution mixture is supplied from the processing chamber to the separator, the separator comprising : a separation tank comprising an inlet connected to the supply pipe at a top end portion of the separation tank; a filtration unit located below the inlet in the separation tank, the filtration unit filtering out the treatment solution portion from the gas-solution mixture; a gas ejector located at a bottom portion of the separation tank, a closed first end portion of the gas ejector having a forward filter list The structure of the element, and at least one gas outlet is mounted to a side wall of the gas ejector, the portion of the gas in the gas-solution mixture is discharged to the outside of the separation tank via the gas outlet; and a first liquid ejector is located The bottom portion of the separation tank, and the portion of the treatment solution in the gas-solution mixture is discharged to the outside of the separation tank via the liquid ejector. 14. The apparatus of claim 13 further comprising a A vacuum pump connected to a second end portion of the first end portion of the gas ejector opposite the separation tank to generate a vacuum pressure by the vacuum pump and to supply the vacuum pressure to the supply pipe via the separation tank. The device of claim 13, further comprising a second liquid ejector connected to a bottom portion of the processing chamber, a residual solution remaining in the processing solution on the bottom portion of the processing chamber It is discharged to the outside of the processing chamber via the second liquid discharger. 16. The device of claim 15 wherein the first liquid ejector is coupled to the second liquid ejector so as to be from the gas 32 201016293 , , 1 W^bJbHA 'body-solution mixture The filtered portion of the solution is discharged to the outside of the device via the second liquid ejector. 參 33Reference 33
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2529672C1 (en) * 2013-07-09 2014-09-27 Шлюмберже Текнолоджи Б.В. Multi-phase separator-grinder

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440607B (en) * 2011-12-13 2014-06-11 Vacuum Elimination Device and Method
CN102720549B (en) * 2012-06-20 2015-04-08 河北省电力勘测设计研究院 Vacuum energy vortex steam condenser
CN104174188B (en) * 2014-08-08 2015-09-30 西北工业大学 A kind of water hole depassing unit
KR101817215B1 (en) * 2016-03-16 2018-01-11 세메스 주식회사 Pump and apparutus for supplying fluid
CN108786283B (en) * 2018-08-31 2023-10-10 中冶北方（大连）工程技术有限公司 Three-stage gas-liquid separation system for mineral separation and dehydration operation
KR102221258B1 (en) * 2018-09-27 2021-03-02 세메스 주식회사 Apparatus for Dispensing Chemical
KR102168831B1 (en) * 2018-12-10 2020-10-22 주식회사 포스코 Filtering apparatus for automatically discharging waste liguid
CN110685892B (en) * 2019-10-31 2021-09-03 福雪莱冷暖设备(东莞)有限公司 Diaphragm vacuum pump
KR102375491B1 (en) * 2020-05-22 2022-03-17 주식회사 티에스티이 Vacuum Suction Device for Cell Smear
CN111569560B (en) * 2020-05-26 2021-06-25 江苏双旭动力科技有限公司 Expansion energy-releasing steam-water separator
KR102613617B1 (en) * 2023-02-13 2023-12-14 주식회사 어반트리 sustainable antimicrobial dust collector

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61106324A (en) * 1984-10-25 1986-05-24 Advantest Corp Ic handling unit
JPS61197206A (en) * 1985-02-27 1986-09-01 Toyoda Gosei Co Ltd Preparation device for rubber material
JPH02120675A (en) * 1988-10-31 1990-05-08 Nippon Telegr & Teleph Corp <Ntt> Method for measuring electric signal
JP3140624B2 (en) * 1993-12-28 2001-03-05 日本電熱計器株式会社 Device for collecting mist flux
JP3769114B2 (en) * 1997-11-07 2006-04-19 九州電力株式会社 Gas turbine performance deterioration prevention device
JP2004016842A (en) * 2002-06-12 2004-01-22 Tsudakoma Corp Mist recovering apparatus
WO2008036849A2 (en) * 2006-09-22 2008-03-27 Applied Materials, Inc. Particle trap / filter for recirculating a dilution gas in a plasma enhanced chemical vapor deposition system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2529672C1 (en) * 2013-07-09 2014-09-27 Шлюмберже Текнолоджи Б.В. Multi-phase separator-grinder

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