201011278 •九、發明說明： 【發明所屬之技術領域】 本發明係有關一種物體缺陷之量測方法及其裝置，尤指一 種利用以角度偏向法與CCD感測裝置待測物之表面與内部缺陷 量測者。 【先前技術】 由於工業的快速發展，使得各種精密加工產業急遽增加， ❹而加工物件的表面平整度與缺陷，也曰益要求精細。近年來， 各種研究加工物件的粗糙度的專題報告，有不斷增加的趨勢。 粗糙度的量測可分為接觸式量測與非接觸式量測，以傳統 型探針式輪廓儀量測工物件時，往往會破壞待測物之表面，加 上探針尺寸的關係請參看參考文獻ΠΗ2]，使得其解析度受到 一疋的限制。另外’非接觸式量測係以光學方法量測工物件之 表面粗糙度，由於不會對待測物表面造成破壞，且具有可較佳 ❹的解析度以及即時性量測的優點，所以非接觸式量已經成為業 界的主流趨勢。 請參看參考文獻[3]，於1969年J. Hodgkinson提出 一個新的 拍照方法用來⑽出成對的鍍膜光學平面，可以應用在λ/1〇 或更好的表面上。在曝光期間藉由慢慢改變平面之間的分隔 線干涉圖形變化會被記錄由於透光值所對應的高度誤差幾乎 是線性的，因此可在從大量干涉圖形的透光樣本中決定出表面 缺陷。 201011278 • 請參看參考文獻[4]，於1972年R. A. Sprague首度提出利用 空間相干性光在一個透鏡的成像平面附近形成干涉斑點圖案， 當把粗縫和光照度來做比較時，將會發現表面粗糙與斑點的對 比度有關，表面適合於0.05到25|am(2-1000-iain.)標準粗糙範 圍。然而，這個方式有兩個限制條件：丨.粗糙度必須是在高度 (必須小於光照量的15%波長）上，由波長取得的一小部分的波 長。2.表面高度必須呈高斯分佈。 ❹ 清參看參考文獻[5]，同年Elbaum等人也提出了進一步的 論點[5]’包含利用由有限的同調長度的光形成斑點圖案並測量 •其對比度。也藉由縮短光的同調長度去得到少量的斑點，並且 •使用這項特點來減少斑點所帶給人困擾的效應。更揲討在不同 波長下所形成的遠場斑點圖案之間的相互關係，並說明它與粗 糙度的相關性。 請參看參考文獻[6]，1984年J. 0· P〇rteus及StevenC. ❿Seitel [6]提出具有受照的光點尺寸之雷射損失極限比例是已 知的效應。當損失由缺陷所控制時，光點尺寸比例會被歸因為 損失機率的50%之傳統定義的極限。藉由重新定義在⑽等級（絕 對損失起始），將會獲得與光點無關的結果。值。這個方法牵涉 到損耗頻率數據之加權最小平方擬合法，這個方法有三個參數 分佈總合代表内部缺陷損耗特性。在數據中的光點尺寸效應藉 由刻度轉換（可應用擬合之前的總合）來模擬。直接與反向轉換 是由高斯和top-hat空間強度輪廓，可以指出測試後部的好處。 201011278 '最後提出三個應用在2. 7-μπι的多層膜，證明一般兩個參數衰減 總合不適當性。最後提取不同的缺陷強度，區分不同的缺陷分 類，而且討論在起始不確定性的表示式。 請參看參考文獻[7]，於1997年，Takayuki Okamoto及 Ichirou Yamaguchi [7]提出藉由即時性全像術產生的非線性空 間濾波方法結果，運用在提高週期性圖案的缺陷。他們利用上 述特點（提高週期性圖案的缺陷）提出即時性的光學系統。實驗 Θ方法是利用欲探查的週期性圖案的傅立葉轉換來讀取被寫入在 BR(bacteriorhodopsin)膜中的一個筆直和同位置的光栅。因為 . 光柵的繞射效率決取於讀取光的強度，只有缺陷的分量會被選 * 擇性的繞射及成像。這個系統是可應用在移動的物體上。實驗 結果顯示出在具有150μπι像素定位光罩（用在液晶顯示上）中有 ΙΟμπι—樣大小增加的缺陷。 請參看參考文獻[8]，1998年Zu-HanGu[8]使用的方法類似 A角度記憶線（angular memory line)的方法，來摘測在粗糙表面 ❹ 幾何形狀的微小變化，實驗方法是在不同的觀察角度使用影像 擷取裝置來拍斑點圖片，以測量角度相關性。實驗結果顯示出 遠場相干函數對粗糙的表面幾何的微小局部變化相當靈敏，會 採用其中斑點空間相關性而不是待測物整體的平均值。當極化 光從真空中（其中使用這表面的一部分是一個薄電介質層，其沉 積在玻璃基板上及另一個部分除了局部性的缺陷’不然其餘都 跟先前的一樣）入射在粗糙的表面，可以測量由1D任意的粗糙表 201011278 面所散射之遠場斑點散射角度交叉相關函數。利用斑點製圖的 工具來做待測物缺陷的檢驗，將可以想像其中的靈敏度特性的 應用。 請參看參考文獻[9]，2000年Luis Miguel Sanchez-Brea 等人[9]提出一個光學技術用在這個金屬線（直徑5〇 — 2〇〇〇 μΐϋ ’被用在表面品質控制的線上系統）上的表面缺陷的技術檢 測。這個技術是基於當光線在一個傾斜的角度入射到金屬線 ❹上，使得散射圓錐體的光強度變化。 另外相關技術更包括下列的專利前案： (1) 專利公開第200427980號『透明基板端面部之檢查裝置 及檢查方法』’當透明基板之顯示面板基板1〇載置於旋轉台21 時’則以與顯示面板基板1〇之端面部呈對向配置的端面照明部 39間歇地照射光線。沿著顯示面板基板1〇表面所照射之光線， 係藉下部反射鏡42往顯示面板基板1〇之端面部反射。該端面 ❹部及其附近部分’係以影像擷取裝置攝影機36拍攝，且依據所 獲得之影像資料之各像素的影像濃度，來檢測出顯示面板基板 10之端面部的缺陷。 (2) 專利公開第200527321號『缺陷檢查方法』，其係提供 一種缺陷檢查方法’其可按照圖案之密度自動地設定具有相應 於缺陷部分之尺寸之缺陷檢測靈敏度的尺寸判定區域，進 行缺陷檢查。其包含第1步驟，其基於參照圖像資料，對於複 數個方向計測圖案之寬度’並將上述參照圖像資料變換為相應 201011278 •於上述圖案對於上述各方向之寬度的亮度，製作對應於上述各 方向之複數個掃描圖像資料；第2步驟，其比較上述複數個掃 描圖像資料，並自該等掃描圖像資料選出為最小之亮度的最小 7C度，製作寬度圓像資料；第3步驟，其基於被檢查圖像資料與 上述參照圖像資料抽出缺陷部分，並將對於上述圖案之寬度成 為最小亮度之方向測定上述缺陷部分之尺寸變換為亮度，製 作缺陷尺寸圖像資料；以及第4步驟，其基於上述缺陷尺寸 〇圖像資料與上述寬度圖像資料，進行對於上述缺陷部分之缺 陷判定。 (3) 專利公開第200813421號『表面檢查裝置』，其對反覆 圖案之複數種類的缺陷能確保充分的檢測感度。該表面檢 查裝置具備：用以照明形成於被檢物體20之表面的反覆圖案， 並測定反覆圖案之形狀變化所引起之正反射光L2之強度變化 的機構（13〜15);以直線偏光照明反覆圖案，且將反覆圖案之反 ❹覆方向與直線偏光之振動面之方向所形成的形成角度設定成傾 斜的角度，並測定反覆圖案之形狀變化所引起之正反射光L2之 偏光狀態之變化的機構（13〜15);及根據正反射光L2之強度變 化與偏光狀態的變化，以檢測反覆圖案之缺陷的機構15。 (4) 專利公開第200804758『表面檢查裝置』其具備：將直 線偏光L1照射於形成有反覆圖案之晶圓1〇表面之照明光學系 統30、用以保持晶圓之對準載台2〇、用以拍攝來自晶圓10 表面之反射光的像之攝影光學系統40、用以儲存藉由攝影光學 9 201011278 •系統40所拍攝的影像之影像儲存部5卜對儲存於影 Η之影料行既定影像處理以檢測岐覆= 像處理部52、以及用以輸出影像處理部52之影像處理結果: 影像輸出部53;其中，係將第2偏光板43之透射轴之方位設定 成相對第1偏光板32之透射轴傾斜45度。 ° (5)專利公開第200811433號『表面檢查裝置』，其具備： 照明機構，係以直線偏光照射形成於被檢測物體表面之反覆 ❹圖案；設定機構，係將該直線偏光之入射面在該表面的方向與該 反覆圖案之反覆方向所構成之角度設定為〇以外的既定值；抽 出機構，係抽出自該反覆圖案往正反射方向產生之光中、與該直 線偏光之振動面垂直的偏光成分；受光機構，係接收以該抽出機 構抽出之光，並輸出該正反射光的光強度；以及檢測機構，係 根據自該受光機構輸出之該正反射光的光強度，來檢測該反 覆圖案的缺陷；該設定機構，係將該直線偏光之入射面在該表 ❹面的方向與該反覆圖案之反覆方向所構成之角度，設定成來自 該表面之正常部分的光強度與來自該表面之缺陷部分之光強 度的差成為最大。 (6)專利公開第200741199號『表面撿查裝置及表面檢查方 法』，其在於降低底層之影響，良好地進行表面之重複圖案的缺 陷檢查。其特徵在於具備：機構13,用來對受檢物體2〇之表面 的重複圖案照射照明光L1;機構11、12,用來將含照明光之照射 方向及表面之法線1Α的入射面於表面之方向與重複圖案之重 201011278 •複方向所形成的角度設定為0以外之既定值；受光機構14,當照 射照明光時，接受來自重複圖案所產生之正反射光，然後將該正 反射光之光強度資訊輸出；以及檢測機構15,根據從受光機 構所輸出之資訊，來檢測重複圖案之缺陷。又，入射面於表 面之方向與重複方向所形成的角度少、照明光之照射方向與表 面之法線所形成的角度、照明光之波長λ、以及重複圖案之 間距ρ係滿足條件式（λ/【2cos(0.sinp)】>ρ)。 爹 （Ό專利公開第200745538『缺陷檢測裝置』，其具有於一 軸方向掃瞄被檢測體之表面圖像而取得之照相機，且照相機之 輸出傳送至控制部3之圖像取得電路。藉圖像取得電路分隔拍 攝開始觸發、掏取開始像素位置及擷取結束像素位置取得從照 相機取得之圖像資料，而僅作成缺陷區域之圖像，以進行圖像 處理等。根據本缺陷檢測裝置，可從基板等被檢測=快2 挑選必要之資訊，而快速執行檢測。 、、 ❿ 上述專利前案皆非以角度偏向法與影像擁取裝置做表面與 内部缺陷的量測；反觀，本發明架構上係結合表面電漿共振強 度檢測技術與角度偏向法，再以擷取影像方式分析待_表面 或内部之缺陷。當光束入射於待測物件上時，會因待測物表面 的尚低變化，造成穿透或反射的光束有微小的角度改變量，使 得光強度因偏離共振角附近的角度而變大或變小， 取 裝置練缺陷光強影像，與標準面之影像相比，即可得到待測 物之缺陷與形貌。因而使待測物可做超光滑表面的高解析度量 201011278 -測或高表面變化的低解析度檢測，具有快速即時、簡易操作、 非接觸、大範圍、高靈敏度及抗空氣擾動的高穩定性檢測等優 勢，因此，本發明與上述專利前案所採用之技術手段及達成功 效皆有所不同，故本發明足以與上述專利前案做一有效的區別。 參考文獻： 1. 2.201011278 • Nine, invention description: [Technical field of invention] The present invention relates to a method and device for measuring object defects, in particular to a surface and internal defect of an object to be tested by an angle deflection method and a CCD sensing device Measurer. [Prior Art] Due to the rapid development of the industry, various precision processing industries are rapidly increasing, and the surface flatness and defects of processed objects are also demanding. In recent years, various special reports on the roughness of processed objects have been increasing. The measurement of roughness can be divided into contact measurement and non-contact measurement. When measuring the workpiece with the traditional probe profiler, the surface of the object to be tested is often destroyed. See reference ΠΗ 2], so that its resolution is limited. In addition, the non-contact measurement system optically measures the surface roughness of the workpiece, and does not cause damage to the surface of the object to be tested, and has the advantages of better resolution and immediate measurement, so non-contact The volume has become the mainstream trend in the industry. See reference [3]. In 1969, J. Hodgkinson proposed a new photographing method for (10) paired coated optical planes that can be applied to λ/1〇 or better surfaces. Interference pattern changes during the exposure by slowly changing the separation line between the planes will be recorded. Since the height error corresponding to the light transmission value is almost linear, surface defects can be determined in the light-transmitting samples from a large number of interference patterns. . 201011278 • Please refer to reference [4]. In 1972, RA Sprague first proposed the use of spatially coherent light to form an interference speckle pattern near the imaging plane of a lens. When comparing the rough and illuminance, the surface will be found. Roughness is related to the contrast of the spots, and the surface is suitable for a standard roughness range of 0.05 to 25 | am (2-1000-iain.). However, there are two limitations to this approach: 粗糙度. Roughness must be a fraction of the wavelength taken at the wavelength (which must be less than 15% of the wavelength of the light). 2. The surface height must be Gaussian. ❹ See references [5]. In the same year, Elbaum et al. proposed further arguments [5]' including the use of light with a limited coherence length to form a speckle pattern and measure its contrast. A small number of spots are also obtained by shortening the coherence length of the light, and • this feature is used to reduce the nuisance effect of the spots. It is also to discuss the interrelationship between the far-field speckle patterns formed at different wavelengths and to explain its correlation with the roughness. See Ref. [6], 1984 J. 0·P〇rteus and Steven C. ❿ Seitel [6] suggesting that the laser loss limit ratio with the illuminated spot size is a known effect. When the loss is controlled by a defect, the spot size ratio is attributed to the traditionally defined limit of 50% of the probability of loss. By redefining the (10) level (absolute loss start), results unrelated to the spot will be obtained. value. This method involves a weighted least squares fit of the loss frequency data. This method has a total of three parameter distributions representing the internal defect loss characteristics. The spot size effect in the data is modeled by a scale conversion that can be applied before the fit. Direct and reverse conversion is a Gaussian and top-hat spatial intensity profile that can point out the benefits of testing the back. 201011278 'Lastly proposed three multilayer films applied in 2. 7-μπι, which proved that the general two-parameter attenuation is not suitable. Finally, different defect strengths are extracted, different defect classifications are distinguished, and the expression of the initial uncertainty is discussed. See reference [7]. In 1997, Takayuki Okamoto and Ichirou Yamaguchi [7] proposed the results of nonlinear spatial filtering methods produced by instant holography to improve the defects of periodic patterns. They use the above features (improving the defects of periodic patterns) to propose an instant optical system. The experimental method is to use a Fourier transform of the periodic pattern to be probed to read a straight and co-located grating written in a BR (bacteriorhodopsin) film. Because the diffraction efficiency of the grating depends on the intensity of the read light, only the components of the defect are selectively diffracted and imaged. This system is applicable to moving objects. The experimental results show that there is a defect in the size of the 光μπι-like size in the 150 μm pixel positioning mask (used on the liquid crystal display). Please refer to reference [8]. In 1998, Zu-HanGu [8] used a method similar to the angle memory line method to extract small changes in the geometry of the rough surface. The experimental method is different. The viewing angle uses an image capture device to take a speckle image to measure angular correlation. The experimental results show that the far-field coherence function is quite sensitive to small local variations in the rough surface geometry, and the spatial correlation of the spots is used instead of the average of the whole object to be tested. When polarized light is applied from a vacuum (where a portion of the surface is a thin dielectric layer deposited on the glass substrate and another portion except for local defects), otherwise the rest is incident on the rough surface, The far field speckle scattering angle cross-correlation function scattered by the 1D arbitrary coarse surface 201011278 surface can be measured. Using the tool of spot mapping to test the defects of the object to be tested, one can imagine the application of the sensitivity characteristics. Please refer to the reference [9]. In 2000, Luis Miguel Sanchez-Brea et al. [9] proposed an optical technique for this metal wire (diameter 5〇-2〇〇〇μΐϋ ' is used in the on-line system for surface quality control) Technical detection of surface defects on. This technique is based on the fact that light is incident on the wire ridge at an oblique angle, causing the light intensity of the scattering cone to change. In addition, the related art includes the following patents: (1) Patent Publication No. 200427980 "Inspection device and inspection method for the end surface of a transparent substrate" 'When the display panel substrate 1 of the transparent substrate is placed on the rotary table 21' The end surface illumination portion 39 disposed opposite to the end surface portion of the display panel substrate 1 is intermittently irradiated with light. The light irradiated along the surface of the display panel substrate 1 is reflected by the lower mirror 42 toward the end surface of the display panel substrate 1A. The end face portion and its vicinity are taken by the image capturing device camera 36, and the defect of the end face portion of the display panel substrate 10 is detected based on the image density of each pixel of the obtained image data. (2) Patent Publication No. 200527321 "Defect Inspection Method" which provides a defect inspection method which automatically sets a size determination region having defect detection sensitivity corresponding to the size of a defective portion in accordance with the density of the pattern, and performs defect inspection . The method includes a first step of measuring the width of the pattern for the plurality of directions based on the reference image data and converting the reference image data into a corresponding 201011278. The brightness of the width of the pattern in the respective directions is corresponding to the above. a plurality of scanned image data in each direction; in the second step, comparing the plurality of scanned image data, and selecting a minimum 7 C degree of minimum brightness from the scanned image data to create a width circular image data; a step of extracting a defective portion based on the image data to be inspected and the reference image data, and measuring the size of the defective portion into a brightness in a direction in which the width of the pattern becomes the minimum brightness, thereby producing a defect size image data; In the fourth step, based on the defect size 〇 image data and the width image data, defect determination for the defective portion is performed. (3) Patent Publication No. 200813421 "Surface inspection device" which ensures sufficient detection sensitivity for a plurality of types of defects of the reverse pattern. The surface inspection apparatus includes means (13 to 15) for illuminating a reverse pattern formed on the surface of the object to be inspected, and measuring a change in intensity of the specular reflected light L2 caused by a change in shape of the reverse pattern; The pattern is reversed, and the angle formed by the direction of the reverse coating of the reverse pattern and the direction of the plane of the linearly polarized light is set to an oblique angle, and the change of the polarization state of the specular reflected light L2 caused by the shape change of the reverse pattern is measured. The mechanism (13 to 15); and the mechanism 15 for detecting the defect of the reverse pattern based on the change in the intensity of the specular reflected light L2 and the change in the polarization state. (4) Patent Publication No. 200804758 "Surface inspection apparatus" includes: an illumination optical system 30 that irradiates the linearly polarized light L1 to the surface of the wafer 1 on which the reverse pattern is formed, and an alignment stage for holding the wafer, a photographic optical system 40 for capturing an image of reflected light from the surface of the wafer 10, an image storage portion 5 for storing images captured by the photographic optics 9 201011278 • System 40, and a shadow line stored in the image The predetermined image processing is used to detect the image processing unit 52 and the image processing result for outputting the image processing unit 52. The image output unit 53 is configured to set the orientation of the transmission axis of the second polarizing plate 43 to be relatively first. The transmission axis of the polarizing plate 32 is inclined by 45 degrees. (5) Patent Publication No. 200811433, "surface inspection device", comprising: an illumination mechanism for irradiating a reverse ridge pattern formed on a surface of a detected object with linearly polarized light; and a setting mechanism for arranging the incident surface of the linearly polarized light The angle formed by the direction of the surface and the direction in which the reverse pattern is reversed is set to a predetermined value other than 〇; and the extracting means extracts the polarized light perpendicular to the vibrating surface of the linearly polarized light in the light generated by the reverse pattern in the direction of the normal reflection. a light receiving unit that receives the light extracted by the extracting mechanism and outputs the light intensity of the regular reflected light; and a detecting mechanism that detects the repeated pattern based on the light intensity of the regular reflected light output from the light receiving unit The setting mechanism is configured to set an angle formed by the direction of the incident surface of the linearly polarized light in a direction of the surface of the surface and an overlapping direction of the reverse pattern to a light intensity from a normal portion of the surface and from the surface The difference in light intensity of the defective portion is maximized. (6) Patent Publication No. 200741199, "Surface inspection apparatus and surface inspection method", which reduces the influence of the underlayer and satisfactorily performs defect inspection of the repeated pattern of the surface. The invention is characterized in that: a mechanism 13 for illuminating the repetitive pattern of the surface of the object to be inspected with illumination light L1; and means for illuminating the illumination surface containing the illumination light and the normal surface of the surface The direction of the surface and the weight of the repeating pattern 201011278 • The angle formed by the complex direction is set to a predetermined value other than 0; the light receiving mechanism 14 receives the specular reflected light generated from the repeating pattern when the illumination light is illuminated, and then the regular reflection The light intensity information output; and the detecting mechanism 15 detects the defect of the repeating pattern based on the information output from the light receiving mechanism. Further, the angle formed by the incident surface on the surface and the repeating direction is small, the angle between the illumination light irradiation direction and the normal of the surface, the wavelength λ of the illumination light, and the distance between the repeated patterns ρ satisfy the conditional expression (λ) /[2cos(0.sinp)]>ρ).缺陷 Ό Ό 2007 2007 45 45 45 45 45 45 45 45 45 45 45 45 45 45 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 2007 Obtaining the circuit-separated imaging start trigger, capturing the start pixel position, and capturing the pixel position to obtain the image data acquired from the camera, and forming only the image of the defective area for image processing or the like. According to the defect detecting device, From the substrate and the like to be detected = fast 2 to select the necessary information, and quickly perform the detection. 、, ❿ The above patents are not measured by the angle bias method and the image capturing device for surface and internal defects; in contrast, the architecture of the present invention The upper system combines the surface plasma resonance intensity detection technology and the angle deflection method, and then analyzes the surface or internal defects by the image capture method. When the light beam is incident on the object to be tested, the surface of the object to be tested is still low. , causing the transmitted or reflected beam to have a slight angular change, such that the light intensity becomes larger or smaller due to the angle near the resonance angle. Taking the device to practice the defect light intensity image, the defect and the shape of the object to be tested can be obtained compared with the image of the standard surface. Therefore, the object to be tested can be made into a high-resolution measurement of the ultra-smooth surface 201011278-measured or high surface change Low-resolution detection, with the advantages of fast instant, easy operation, non-contact, wide range, high sensitivity and high stability detection against air disturbance. Therefore, the technical means and the effects achieved by the present invention and the above patents are both The difference is different, so the invention is sufficient to make an effective difference from the above patents. References: 1. 2.
3. 4. 5. J. Garratt and M. Mills, “Measurement of the roughness of supersmooth surfaces using a stylus instrument” ， Nanotechnology, 7, 13-20, (1996). J. M. Bennett and J. H. Dancy, “Stylus profiling instrument for measuring statistical properties of smooth optical surface^ , Applied Optics, 20, 1785(1981). J. Hodgkinson, “A Method for Mapping and Determining the Surface Defects Function of Pairs Coated Optical Flats “， Applied Optics , 8, 1373-1378(1969). Robert A. Sprague, “Surface roughness measurement using white light speckle w, Applied Optics pp. 2811-2816, 1972. M. Elbaum, M. King, and M. Greenebaum, J. Opt. Soc. Am. 62, 732A, 1972 6. ❹7. 8. J. 0. Porteus and Steven C. Seitel, “Absolute onset of optical surface damage using distributed defect ensembles M , Applied Optics, 23, 3796- 3805(1984)3. 4. 5. J. Garratt and M. Mills, “Measurement of the roughness of supersmooth surfaces using a stylus instrument”, Nanotechnology, 7, 13-20, (1996). JM Bennett and JH Dancy, “Stylus profiling instrument For measuring statistical properties of smooth optical surface^ , Applied Optics, 20, 1785 (1981). J. Hodgkinson, “A Method for Mapping and Determining the Surface Defects Function of Pairs Coated Optical Flats”, Applied Optics, 8, 1373-1378 (1969). Robert A. Sprague, "Surface roughness measurement using white light speckle w, Applied Optics pp. 2811-2816, 1972. M. Elbaum, M. King, and M. Greenebaum, J. Opt. Soc. Am. 62, 732A, 1972 6. ❹ 7. 8. J. 0. Porteus and Steven C. Seitel, “Absolute onset of optical surface damage using distributed defect ensembles M , Applied Optics, 23, 3796-3805 (1984)
Takayuki Okamoto and Ichirou Yamaguchi, “Real-time enhancement of defects in periodic patterns by use of a bacteriorhodopsin filraH , OPTICS LETTERS, 22, 337-339 (1997). Zu-Han Gu, ” Detection of a small defect on a rough surface” , OPTICS LETTERS y 23, 1998 494-496 (1998).Takayuki Okamoto and Ichirou Yamaguchi, "Real-time enhancement of defects in periodic patterns by use of a bacteriorhodopsin filraH , OPTICS LETTERS, 22, 337-339 (1997). Zu-Han Gu, " Detection of a small defect on a rough surface , OPTICS LETTERS y 23, 1998 494-496 (1998).
Luis Miguel Sanchez-Brea, Philip Siegmann, Maria Aurora Rebollo, and Eusebio Bernabeu, “Optical technique for the automatic detection and measurement of surface defects on thin metallic wires" , APPLIED OPTICS, 39, 539-545 (2000) 【發明内容】 本發明之目的在於提供一種物體缺陷之量測方法及其裝 12 201011278 •置，主要將擷取影像技術與表面電漿共振技術結合，以量測待 測物之表面形貌、缺陷、平整度以及平行度，不僅具備光學量 測精度佳及簡化光學系統以降低成本等之特點，而且可以不須 由專業人員操作即可達到快速量測之目的。 為達成上述功效’本發明採用之技術手段係將良品置於光 學掃瞄手段與角度感測器之間的光路上，以光學掃瞄手段發出 掃瞄光束穿透或反射该良品後至角度感測器，當掃瞒光束入 ❹射至角度感測器時，以旋轉手段轉動該角度感測器，使掃瞄光 束達到共振角而產生表面電漿共振現象，以作為基準面光強 度，再以影像擷取手段擷取基準面光強度以作為基準影像，以 光學掃瞄手段發出該掃瞄光束穿透或反射一待測物，當掃瞄光 束入射至角度感測器時，藉由待測物表面或内部缺陷使該掃猫 光束偏離共振角而產生制物錢度，相影賴取手段擁取 待測物表面光強度以作為測試影像，以運算手段將基準影像與 ❹測試影像進行比對，進而得到待測物之缺陷資訊者。 【實施方式】 壹·本發明基本技術特徵 1.1方法基本技術特徵 請參看第五至七圖所示，本發明主要係將擷取影像技術與 表面電聚共振技術結合，以量測待測物⑴之表面形貌、缺陷、 平整度以及平行度，而可應用於精密工業之量測用途上，為達 上述功效，其包括提供一光學掃瞄手段（10)、一角度感測器 •13 201011278 -(20)、一用以驅動角度感測器（20)之旋轉手段（30)、一影像擷 取手段（40)及一運算手段（50)。 請參看第一至三圖所示，將一良品（la)置於該光學掃瞄手 段（10)與該角度感測器（2〇)之間的光路上，以該光學掃瞄手段 (10)發出一掃瞄光束穿透或反射該良品（la)後至該角度感測器 (20) ’當該掃瞄光束入射至該角度感測器（2〇)時，以該旋轉手 段（30)轉動該角度感測器（2〇)，使該掃瞄光束達到共振角而產 ❹生表面電漿共振現象，以作為基準面光強度。 請參看第五至七圖所示，以該影像擷取手段（4〇)擷取該基 準面光強度以作為基準影像，再以該光學掃瞄手段（1〇)發出該 掃瞄光束穿透或反射一待測物（1)，當該掃瞄光束入射至該角度 感測器（20)時，藉由該待測物（1)表面或内部缺陷使該掃瞄光束 偏離共振角而產生待測物（1)光強度。 請參看第五至七圖及附件一、附件二所示，再由該影像擷 ❾取手段（40)擷取該待測物（1)表面光強度以作為測試影像，並以 «亥運算手段（5〇)將該基準影像與該測試影像進行比對，進而得 到該待測物（1)之缺陷資訊。 上述方法基本技術特徵中，該影像擷取手段（4〇)之較佳實 施例係為一電荷耦合元件CCD。另該角度感測器（2〇)係為一包含 鍍有四層膜厚的角度感測器（20)SPR(angular sens〇〇，如第三 圖所示。 1. 2裝置基本技術特徵 201011278 • 請參看第五至七圖所示，本發明主要係將擷取影像技術與 表面電漿共振技術結合’以量測待測物之表面形貌、缺陷、平 整度以及平行度’而可應用於精密工業之量測用途上，為達上 述功效’其包括一光學掃瞒手段（10)、一影像擷取手段（4〇)、 一旋轉手段（30)、一角度感測器（20)及一運算手段（5〇)。 請參看第五至七圖所示’上述之光學掃瞄手段（1〇)用以發 出一掃瞄光束。該角度感測器（20)設置於該旋轉手段（3〇)上， ❹其中，該掃瞄光束穿透或反射一良品（la)而入射至該角度感測 器（20)時，藉由該旋轉手段（30)轉動該角度感測器（2〇)使該掃 猫光束達到共振角以產生表面電漿共振現象，以作為基準面光 強度，並以該影像擷取手段（40)擷取該基準面光強度作為基準 影像，再於該掃瞄光束穿透或反射一待測物（1)而入射至該角度 感測器（20)時，藉由該待測物（1；)表面或内部缺陷使該掃瞄光束 偏離共振角而產生待測物（1)光強度，再以該影像擷取手段（4〇) ❹擷取該待測物（1)光強度，以作為測試影像，另該運算手段（5〇) 用以將該基準影像與該測試影像進行比對，進而得到該待測物 (1)之缺陷資訊。 上述裝置基本技術特徵中，該影像擷取手段（40)之較佳實 施例係為一電荷搞合元件CCD。另該角度感測器（20)係為-包含 鍵有四層膜厚的肖度感測H (2G)SPR(angular sensor )，如第三 圖所示。 采*本發明具體技術特徵 15 201011278 2.1光學掃瞄手段第一種實施 請參看第五圖所示，本發明光學掃瞄手段（10)第一種具體 實施例係採用穿透式對透明待測物（1)量測，以發出一用以掃瞄 之光源，其包栝： —雷射光源（11) ’其用以發出該掃瞄光束； 一光阻隔器（12)，其用以組絕反射光返回至該雷射光源 (11); 0 一透鏡（13)，其用以擴大該掃瞄光束； 一空間濾波器（H)，其介置於該光阻隔器（12)與該透鏡（13) 之間； 一偏極板（15)，其介置於該透鏡（13)與該待測物（1)之間， 其透光軸與X軸平行，用以供該掃瞄光束入射而穿透該待測物 ⑴；及 一檢偏板（16)，用以調整該掃瞄光束透光軸方位角，用以 ❹使該掃瞒光束之強度調整至該影像擷取手段（40)可以解析的程 度。 2· 2光學掃瞄手段第二種實施 請參看第六圖所示，本發明光學掃瞄手段（1〇)第二種具體 實施例係採用垂直入射反射式量測 ’以發出一用以掃晦之光 源，其包括： 一用以發出該掃瞄光束的雷射光源（11); 一用以組絕反射光返回至該雷射光源（11)的光阻隔器 201011278 -(12)； -用以擴大該掃瞄光束的第一透鏡(13a); 一介置於該光阻隔器⑽與該魏⑽之間的空間濾波器 (14)； -介置於該第-透鏡⑽與該待測物⑴之間光路上的偏 極板（15)，其透光軸與Y轴平;^于； -偏極分紐（1Ό，Μ將由钱極板⑽取射之該掃 Α瞄光束予以反射； Ο -四分之-波片⑽’用岐由該偏極分光鏡（⑺所反射 之該掃瞒光束成為-圓偏極光，經該待測物⑴反射沿原路徑返 回後’再-次通過該四分之-波片而成水平偏極光，再經該偏 極分光鏡穿透入射該角度感測器（20)，而可調整旋轉手段（3〇) 使該掃瞄光束之入射角為共振角；及 一檢偏板（16)，其可供旋轉來調整掃瞄光束的強度，而可 ❹將該掃瞄光束透過一第二透鏡（13b)成像在該影像擷取手段（4〇) 上，經由該影像擷取手段（40)拍攝其光強之該測試影像，再由 該運算手段（50)來分析該待測物（1)之缺陷。 2.3光學掃瞄手段第三種實施 請參看第七圖所示，本發明光學掃猫手段（10)第三種具體 實施例係採用斜向入射反射式量測，以發出一用以掃瞄之光 源，其包括： 一用以發出該掃瞄光束的雷射光源（11); 17 201011278 • 一用以組絕反射光返回至該雷射光源（11)的光阻隔器 (12)； 一用以擴大該掃瞄光束的第一透鏡（13a); 一介置於該光阻隔器（12)與該透鏡（13)之間的空間濾波器 (14)； 一介置於該第一透鏡（13a)與該待測物（丨）之間光路上的偏 極板（15)，該偏極板（15)之透光軸與γ軸平行，再將該掃瞄光 〇束斜向入射該待測物（1)，經過該偏極板〇5)入射至該角度感測 器（20)中，調整該旋轉手段（30)使其入射角為共振角；及 檢偏板（16)，其可供力疋轉該檢偏板（16)來調整該掃瞄光 束的出射強度’而可透過-第二透鏡（13)成像在該影像擷取手 段（40)上，經由該影像擷取手段（4〇)來擷取該待測物〇)的該測 試影像，再由該運算手段（50)來分析該待測物（1)之缺陷。 2.4雙轴移動平台的實施 ❹ 月參看第五至七圖所示，為選擇待測物（1)所欲量測之部 位，故本發明更包括一供該待測物⑴置放的雙轴移動平台Luis Miguel Sanchez-Brea, Philip Siegmann, Maria Aurora Rebollo, and Eusebio Bernabeu, "Optical technique for the automatic detection and measurement of surface defects on thin metallic wires", APPLIED OPTICS, 39, 539-545 (2000) The object of the present invention is to provide a method for measuring the defect of an object and a device thereof. The invention mainly combines the image capturing technology with the surface plasma resonance technology to measure the surface topography, defects and flatness of the object to be tested. And the parallelism not only has the characteristics of good optical measurement accuracy and simplifying the optical system to reduce the cost, but also can achieve the purpose of rapid measurement without the need of professional operation. To achieve the above-mentioned effects, the technical means adopted by the present invention The good product is placed on the optical path between the optical scanning means and the angle sensor, and the scanning beam is transmitted by the optical scanning means to penetrate or reflect the good product to the angle sensor, and when the broom beam is injected into the beam When the angle sensor is rotated, the angle sensor is rotated by rotating the mirror beam to reach a resonance angle. The surface plasma resonance phenomenon is used as the reference surface light intensity, and the reference surface light intensity is taken as the reference image by the image capturing means, and the scanning beam is transmitted or reflected by the optical scanning means to reflect or reflect the object to be tested. When the scanning beam is incident on the angle sensor, the sweeping cat beam is deviated from the resonance angle by the surface or internal defect of the object to be tested to generate the manufacturing cost, and the image capturing the surface light intensity of the object to be tested is used as a test. The image is compared with the ❹ test image by an arithmetic means to obtain the defect information of the object to be tested. [Embodiment] 基本· The basic technical features of the present invention 1.1 The basic technical features of the method, please refer to the fifth to seventh figures. The invention mainly combines the image capturing technology with the surface electro-convergence resonance technology to measure the surface topography, defects, flatness and parallelism of the object to be tested (1), and can be applied to the measurement application of the precision industry. In order to achieve the above effects, it comprises providing an optical scanning means (10), an angle sensor, 13 201011278 - (20), a rotating means for driving the angle sensor (20) (30) , an image capturing means (40) and an arithmetic means (50). Referring to Figures 1 to 3, a good product (la) is placed in the optical scanning means (10) and the angle sensor On the optical path between (2〇), a scanning beam is emitted by the optical scanning means (10) to penetrate or reflect the good (la) to the angle sensor (20) 'When the scanning beam is incident on In the angle sensor (2〇), the angle sensor (2〇) is rotated by the rotating means (30) to cause the scanning beam to reach a resonance angle to generate a surface plasma resonance phenomenon as a reference. Surface light intensity. Referring to the fifth to seventh figures, the reference surface light intensity is taken as the reference image by the image capturing means (4〇), and the scanning beam beam is transmitted by the optical scanning means (1〇). Or reflecting a test object (1), when the scan beam is incident on the angle sensor (20), the scan beam is deviated from the resonance angle by the surface or internal defect of the object (1) Test object (1) Light intensity. Please refer to the fifth to seventh figure and the annexes I and II, and then the image capturing means (40) extracts the surface light intensity of the object to be tested (1) as a test image, and uses the method of "hai" ( 5〇) Aligning the reference image with the test image to obtain defect information of the test object (1). In a basic technical feature of the above method, a preferred embodiment of the image capturing means (4A) is a charge coupled device CCD. In addition, the angle sensor (2〇) is an angular sensor (20) SPR (angular sens〇〇) plated with four layers of film thickness, as shown in the third figure. 1. 2 device basic technical features 201011278 • Please refer to the fifth to seventh figures. The present invention mainly combines the image capturing technology with the surface plasma resonance technology to measure the surface topography, defects, flatness and parallelism of the object to be tested. In the measurement application of the precision industry, in order to achieve the above effects, it includes an optical broom means (10), an image capturing means (4), a rotating means (30), and an angle sensor (20). And an arithmetic means (5〇). Please refer to the above-mentioned optical scanning means (1〇) shown in Figures 5 to 7 for emitting a scanning beam. The angle sensor (20) is arranged at the rotating means ( 3)), wherein the scanning beam penetrates or reflects a good product (la) and is incident on the angle sensor (20), the angle sensor is rotated by the rotating means (30) (2) 〇) Let the sweeping cat beam reach the resonance angle to generate surface plasma resonance phenomenon as the reference surface light intensity And the image capturing means (40) captures the reference surface light intensity as a reference image, and when the scanning beam penetrates or reflects an object to be tested (1) and is incident on the angle sensor (20) And the surface of the object to be tested (1;) causes the scanning beam to deviate from the resonance angle to generate the light intensity of the object to be tested (1), and then the image capturing means (4〇) is used to take the The light intensity of the object (1) is used as a test image, and the calculation means (5〇) is used to compare the reference image with the test image to obtain defect information of the object to be tested (1). In a basic technical feature, the preferred embodiment of the image capturing means (40) is a charge engaging component CCD. The angle sensor (20) is a sense of the sense that the key has four layers of film thickness. Measure H (2G) SPR (angular sensor), as shown in the third figure. The specific technical features of the present invention 15 201011278 2.1 Optical scanning means The first implementation, please refer to the fifth figure, the optical scanning means of the present invention (10) The first specific embodiment uses a penetrating type to measure the transparent object (1) to emit a use. The source of the scan, the package: - a laser source (11) 'which emits the scan beam; a light blocker (12) for rejecting the reflected light back to the laser source (11) 0 a lens (13) for expanding the scanning beam; a spatial filter (H) interposed between the optical blocker (12) and the lens (13); a polarizing plate ( 15) is interposed between the lens (13) and the object to be tested (1), and has a transmission axis parallel to the X axis for allowing the scanning beam to enter and penetrate the object to be tested (1); An analyzer (16) is configured to adjust the azimuth of the transmission beam transmission axis to adjust the intensity of the broom beam to a degree that the image capturing means (40) can be analyzed. 2. 2 optical scanning means, the second embodiment, please refer to the sixth figure, the second embodiment of the optical scanning device (1) of the present invention uses a normal incidence reflection type measurement to emit a a light source comprising: a laser light source (11) for emitting the scanning beam; a light blocker 201011278-(12) for emitting reflected light back to the laser light source (11); a first lens (13a) for expanding the scanning beam; a spatial filter (14) interposed between the optical blocker (10) and the Wei (10); - interposed between the first lens (10) and the to-be-tested The polarizing plate (15) on the optical path between the objects (1) has a transmission axis and a y-axis flat; ^; - a partial pole split (1 Ό, which is reflected by the sweeping beam that is taken by the money plate (10) ; Ο - quarter-wave plate (10)' is used by the polarizing beam splitter (the broom beam reflected by (7) becomes a round-polar apolar light, and the object (1) is reflected back along the original path after the 're-passing The quarter-wave plate is horizontally polarized, and then penetrates the angle sensor (20) through the polarizing beam splitter, and the rotating means (3〇) can be adjusted to make the sweep The incident angle of the aiming beam is a resonance angle; and an analyzer (16) is rotatable to adjust the intensity of the scanning beam, and the scanning beam is imaged through the second lens (13b) in the image The image capturing means (40) captures the test image of the light intensity by means of the image capturing means (4), and the defect of the object to be tested (1) is analyzed by the calculating means (50). The third embodiment of the aiming means, as shown in the seventh figure, the third embodiment of the optical scanning cat means (10) of the present invention adopts oblique incident reflection type measurement to emit a light source for scanning. The utility model comprises: a laser light source (11) for emitting the scanning beam; 17 201011278 • a light blocker (12) for returning reflected light to the laser light source (11); a first lens (13a) for scanning the light beam; a spatial filter (14) interposed between the light blocker (12) and the lens (13); a medium disposed between the first lens (13a) and the a polarizing plate (15) on the optical path between the objects (丨), the transmission axis of the polarizing plate (15) is parallel to the γ axis, and then the scanning is performed The light beam is obliquely incident on the object to be tested (1), and is incident into the angle sensor (20) through the polarizing plate 5), and the rotating means (30) is adjusted to make the incident angle a resonance angle; An analyzer (16) is operative to rotate the analyzer (16) to adjust an exit intensity of the scan beam and to transmit through the second lens (13) to image capture means (40) The test image of the object to be tested is captured by the image capturing means (4〇), and the defect of the object to be tested (1) is analyzed by the computing means (50). 2.4 Implementation of the biaxial mobile platform ❹ Referring to the fifth to seventh figures, in order to select the part to be measured (1), the present invention further includes a dual axis for the object to be tested (1) mobile platform
()再乂》亥運算手段（5〇)用以控制該雙軸移動平台（6〇)往X 或Y軸方向移動’以控制擷取該待測物⑴所需掃猫的資料，而 可繪出量測結果。 2. 5運算手段的實施 清f看第五至七圖所示，本發明於一種具體實施例中，該 運算手K50)係為一電腦（5〇a)，其包含一用以操取由該影像操 18 201011278 取手段(40)置所提供之影像的影像操取卡（圖中未示），及一分 析軟體肖刀析軟體用以將該基準影像與測試影像相比，再經 過電腦（5Ga)分析影像，即可得到該制物⑴ 圖及附件二所示。 參•本發明應用原理 3.1幾何光學原理 ❾ L射至具有微小内部偏移角的透0月平板（待測物（1)) 如第一圖所示。且令内部偏移角為α，在第一界面的入射角為 11第一界面折射角為〜。根據幾何光學理論，偏向角度可寫 成 3 = θη+θι2-α ⑴() 乂 乂 亥 亥 运算 运算 运算 运算 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥Draw the measurement results. 2. 5 implementation of the operation means clear f see the fifth to seventh figure, the present invention in a specific embodiment, the operation hand K50) is a computer (5〇a), which contains a The image manipulation 18 201011278 takes the means (40) to provide the image manipulation card of the image provided (not shown), and an analysis software software for comparing the reference image with the test image, and then passing the computer (5Ga) Analyze the image to obtain the product (1) and the annex 2.参•Application principle of the invention 3.1 Geometric optics principle ❾L shot to the transparent plate with the slight internal offset angle (the object to be tested (1)) as shown in the first figure. And the internal offset angle is α, and the incident angle at the first interface is 11 and the first interface has an angle of refraction of ~. According to the theory of geometric optics, the deflection angle can be written as 3 = θη+θι2-α (1)
如第二圖所示，假設光線垂直入射於第一界面，W ^Sin-Vina)在這裡的”為平板之折射率。所以偏向角度又可重 _寫為 和如—Asin+a,, ⑵ /從上式可知’角度偏向是正比於内部偏移角。當我們已知 待測物⑴的折射率，就可以藉由測量々角可經由公式得到待測 物（1)内部偏移角 由第二圖中顯示出測試光束入射於待測物⑴，當待測物 表面有Μ的變化時，造成光路偏移原來路複方向，形成+錢 的角度偏移量。在此裝置中，雷射光先入射至待測物⑴件再折 19 201011278 射出去°若待测物⑴件的表面（平面1與平面2)互相平行時， 透射出去的光線不會產生角度的偏移，若待測物（1)件的兩表面 間產生±«的角度，則會分別形成+0或__0的偏向角度變化量。 此現象可由圖2的幾何關係圖推導出來。心sin>sinaU„，其 中《為待測物（1)内部偏移的角度，當第二面的斜率為正時，我 們定義《值為正，反之，則α為負。&為出射角，”為待測物 的折射率，&為每單位掃描的移動距離，M為每單位掃描的高 ❹度變化。已知幾乎是維持一個線性關係。因此表面高度差 可寫成 Ah=-adx (3)。 故掃描此平板’即可求出每一個位置上的ΔΑ值，而求出待 測平板之缺陷或傾斜角度。 3.2表面電漿共振原理 本發明使用四層角度感測器（20)SPR以KR組態為例，如第 三圖所示。其中”！，〜’《3，《4分別代表介質1—稜鏡（priSm)、 ❹介質2、介質3 (金屬）、介質4—空氣（air)之折射率。根據SPR 理論，當入射呈稜鏡的角度θ為共振角心，將可激發表面電漿 波。平行至界面的電場強度分量可寫成As shown in the second figure, it is assumed that the light is incident perpendicularly on the first interface, and W ^Sin-Vina) here is the refractive index of the flat plate. Therefore, the deflection angle can be written as and as - Asin+a, (2) From the above equation, the angle deviation is proportional to the internal offset angle. When we know the refractive index of the object (1), we can obtain the internal offset angle of the object to be tested (1) by measuring the angle. The second figure shows that the test beam is incident on the object to be tested (1). When there is a change in the surface of the object to be tested, the optical path is offset from the original direction of the road, forming an angular offset of + money. In this device, The incident light is incident on the object to be tested (1) and then folded. 19 201011278 Shooting out. If the surface of the object to be tested (1) (plane 1 and plane 2) is parallel to each other, the transmitted light will not be angularly offset. If the angle of ±« is generated between the two surfaces of the object (1), the amount of change in the deflection angle of +0 or __0 is respectively formed. This phenomenon can be derived from the geometric relationship diagram of Fig. 2. The heart sin>sinaU„, For the angle of the internal offset of the object to be tested (1), when the slope of the second side is positive, I We define "the value is positive, and vice versa, then α is negative. & is the exit angle, "is the refractive index of the object to be tested, & is the moving distance per unit scan, M is the high twist change per unit scan. It is known that almost a linear relationship is maintained. Therefore, the surface height difference can be Write Ah=-adx (3). Therefore, scan the plate to find the value of ΔΑ at each position, and find the defect or tilt angle of the plate to be tested. 3.2 Surface Plasma Resonance Principle The present invention uses four layers of angle The sensor (20) SPR takes the KR configuration as an example, as shown in the third figure. , ~' "3, "4 represents the refractive index of medium 1 - 稜鏡 (priSm), tantalum medium 2, medium 3 (metal), medium 4 - air (air). According to the SPR theory, when the incident angle θ is the resonant angular center, the surface plasma wave can be excited. The electric field strength component parallel to the interface can be written as
Vising )=^=^〇 g3g4 ¢3+^4Vising )=^=^〇 g3g4 ¢3+^4
K (4) 這裡的it。及心分別為在空氣中的波向量以及在SPR狀況下之波 向量，&及&分別為介質3 (金屬）、空氣之介電常數。其中心又 可寫成：K (4) here it. The heart is the wave vector in the air and the wave vector in the SPR condition. & and & are the dielectric constants of the medium 3 (metal) and air, respectively. The center can be written as:
1 «1 1^3 1/21 (5) 根據Fresnel’ s equation，P極化光和S極化光所造成的反射 20 · 201011278 -係數可寫成 而且d34 = r»，'2 以 l + r^4eak^ ，t=p，s (6) 係表示由介質2、3及4層反射的反射係數 。介Kt為從介質…間反射的反射係數；咖3分別為介 質2、介質3之厚度；，可表示S或P極化光；符號舄可表示為 ⑵叫卜™，⑺在⑹式令，1 «1 1^3 1/21 (5) According to Fresnel's equation, reflection caused by P-polarized light and S-polarized light 20 · 201011278 - The coefficient can be written as and d34 = r», '2 to l + r ^4eak^ , t=p, s (6) represents the reflection coefficient reflected by the layers 2, 3 and 4. Kt is the reflection coefficient reflected from the medium... The coffee 3 is the thickness of the medium 2 and the medium 3 respectively; it can represent S or P polarized light; the symbol 舄 can be expressed as (2) called Bu, (7) in (6),
為由介質ζ·(·/·)中，沿著z方向傳播的波向量，可表示成下列的 式子 h(y)=〜(Ί _wi2 sin2 X . (8) 假設反射係數a^34及/^234可分別改寫為咕34 = /^34 3及r/234 = 〆*。這 裡今、&分別為P、S極化光所引起的相位，此外，P、s偏振光 的反射率分別為〜=|#34|2，α=|434|2。 舉例說明，如第三圖，四層角度感測器（2Q)SPR(BK7稜鏡-鈦Ti-金All-空氣）的條件參數如下：4=2.5蘭，ί/3=44.3謂，入射 ®波長A = 632·8腦，介電常數分別為BK-7稜鏡（q =«,2)，鈦 Ti〇2=«22)，金 Au〇3=/i32)，空氣〇4=«42)，其中9=(1.51509)2， q =-3.84 + 12.5/ ’ q =-12 + 1.26/，ε4 =(1.0003)2 [2]。將這些參數代入（4)〜（8) 式，所得心對入射角0圖如圖4所示。因為只有在Ρ偏極光才會 激發表面電漿共振，且共振角（4=43.85。）位於最小反射率值\， 此時光強度為最弱，即\=〇，如圖4所示，我們可以選擇最佳 金膜厚度及靠近4之入射角去找出反射率之中的最大斜率，其 • 21 201011278 '反射靈敏度也是最大。 由於光強度值是入射角0的函數，入射角變化从又與偏向角 β成正比，而根據公式⑵，θ角又與α角成正比，以及根據公式 (3)从=-地’因此’本發明可以利用光強度變化量^^的值，來 求出待測之平行板的傾角《，或求出此平行板的表面或内部缺 陷从。Μ,的值可由影像擷取裝置感測器量測之，分別記錄經待 測物（1)(平仃板）與標準平板後之光強度值’取出其間影像擷 ❹取裝置影像之光強度差值，即可快速獲得待測物⑴缺陷資訊。 3. 3待測物件缺陷和表面電漿共振強度之關係The wave vector propagating along the z direction from the medium ζ·(·/·) can be expressed as the following expression h(y)=~(Ί _wi2 sin2 X . (8) Assuming the reflection coefficient a^34 and /^234 can be rewritten as 咕34 = /^34 3 and r/234 = 〆*. Here, & respectively, the phase caused by P, S polarized light, in addition, the reflectivity of P, s polarized light They are respectively ~=|#34|2,α=|434|2. For example, as shown in the third figure, the condition of four-layer angle sensor (2Q) SPR (BK7稜鏡-Titanium Ti-Gold All-Air) The parameters are as follows: 4 = 2.5 blue, ί / 3 = 44.3, incident ® wavelength A = 632 · 8 brain, dielectric constant BK-7 稜鏡 (q = «, 2), titanium Ti 〇 2 = « 22 ), gold Au 〇 3 = / i32), air 〇 4 = « 42), where 9 = (1.51509) 2, q = -3.84 + 12.5 / ' q = -12 + 1.26 /, ε4 = (1.0003) 2 [ 2]. Substituting these parameters into equations (4) to (8), the resulting center-to-incidence angle 0 is shown in Fig. 4. Because only the auroral polarization will excite the surface plasma resonance, and the resonance angle (4=43.85.) is at the minimum reflectance value\, then the light intensity is the weakest, ie \=〇, as shown in Figure 4, we can Select the optimal gold film thickness and the incident angle close to 4 to find the maximum slope among the reflectivity. 21 201011278 'The reflection sensitivity is also the largest. Since the light intensity value is a function of the incident angle 0, the incident angle change is again proportional to the deflection angle β, and according to equation (2), the θ angle is again proportional to the angle α, and from the formula (3) from =-ground 'so' The present invention can use the value of the change amount of the light intensity to determine the inclination angle of the parallel plate to be tested, or to find the surface or internal defect of the parallel plate. Μ, the value can be measured by the image capturing device sensor, respectively recording the light intensity value of the object (1) (flat plate) and the standard plate after taking out the light intensity of the image capturing device image The difference can quickly obtain the defect information of the object to be tested (1). 3. 3 relationship between object defect and surface plasma resonance intensity
首先將未有刮痕之待測物（1)放置於角度感測器（20)SPR 與偏極板（15)(其透光軸與χ軸平行）之間，然後轉動旋轉手段 (30)(Rotati〇n Stage)，調整光線靠近共振角，為基準面的強 度，由影像摘取裝置（4〇)拍攝其影像，當作基準影像。之後再 把未有刮痕之待測物⑴換成有刮痕（缺陷)之待測物⑴，光線 ❹入射至缺陷待測物⑴，產生光線偏移，使得紐人射至角度感 測器（20)會偏離原本的角度，而造成光強度上升或下降，之後 再由影像擷取裝置（40)拍攝其影像，當作測試影像，利用電腦 (50a)儲存圖片，我們把測試影像與基準影像相比，即可得知 測物（1)之缺陷資訊。 、 3.4系統架構原理 A·穿透式對透明待測物董測： 請參看第五圖所示，首先以表面電裝共振原理為基礎再經 22 201011278 •過一些巧妙的光路安排，用影像擷取裝置（4〇)拍攝待測物d) 之缺陷光強影像。以He-Ne雷射當雷射光源（11)，入射經由一 個光阻隔器（12) (Isolator)以避免一個系統的反射光返回雷 射光源（11)，從光阻隔器（12)的出來光入射至空間濾波器（μ) (Spatial filter)和透鏡（13)擴大光束，經過偏極板（15)pL (Polarizer)(其透光轴與X軸平行）’入射至待測物，可 利用雙袖移動平台（60)選擇待測物（1)欲量測之部位，光線經由 ❹角度感測器（20)(SPR Sensor) ’ 旋轉手段（3〇)(R〇tati〇n Stage) 使入射角達到共振角產生表面電漿共振現象，折射出來的光線 由於光強度太強’加入檢偏板（16) (Analyzer) ΑΝΐ，調整其透 光轴方位角’使光強度調整至影像擷取卡能解析的光譯度 Β.垂直入射反射式量測： 請參看第六圖所示，以He-Ne雷射當雷射光源（11)，入射 經由一個光阻隔器（12) (Isolator)以避免一個系統的反射光 返回雷射光源（11) ’從光阻隔器（12)的出來光入射至空間濾波 ❹ 器（14) (Spatial filter)和透鏡（13)擴大光束，經過偏極板 (15)PL (Polarizer)(其透光軸與y軸羊行），使其偏極在y 方向。經一偏極分光鏡 PBS(17)( Polarization Beam splitter) 反射後’再經一四分之一波片（18)(¾ Waveplate)，使此光成 圓偏極光’經待測物（1)反射沿原路徑返回，再一次通過四分之 一波片（18)而成水平偏極光，因此再經偏極分光鏡pbs(17)穿 透’入射角度感測器（20)SPR，調整旋轉手段（30)(Rotation 23 201011278 • Stage)使其入射角為共振角，其出射強度可藉由旋轉檢偏板 (16)ANt (Analyzer)調整之。然後經透鏡〇3)成像系統成像在 影像擷取裝置（40)上，經由影像擷取裝置（4〇)拍攝其影像，最 後由電腦（50a)來分析待測物（1)之缺陷。把基準影像（未有缺陷 之待測物（1))與測試影像（有缺陷之待測物〇))相比，再經過電 腦分析軟體分析影像’即可得到待測物（丨）之缺陷。以電腦（5 〇 a ) 控制掃瞄xy雙軸移動平台（60)，擷取所有掃瞄的資料，而可繪 I出量測結果。 ❹ C.斜向入射反射式量測： 請參看第七圖所示，可利用雙軸移動平台（6〇)選擇待測物 (1)欲量測之部位，同樣以He_Ne雷射當雷射光源（11)，入射經 由-個光阻隔器（12) (Isolator)以避免一個系統的反射光返 回雷射，從光阻隔器（12)的出來光入射至空間滤波器（14) (Spatial filter)和透鏡（13)擴大光束。斜向入射待測物 ❹（1) ’經過偏極板（15)PL(p〇iarizer)(其透光軸與χ袖平行）， 入射角度感測器（20)SPR，調整旋轉手段（30)(R〇tati〇n Si;age) 使其入射角為共振角’其出射強度可藉由旋轉檢偏板（16)Mt (Analyzer)調整之。然後經透鏡（13)成像系統成像在影像擷 取裝置（40)上’經由影像擷取裝置（4〇)拍攝其影像，最後由電 腦（50a)來分析待測物（1)之缺陷。把基準影像（未有缺陷之待測 物（1))與測試影像（有缺陷之待測物（丨））相比，再經過電腦分析 軟體分析影像，即可得到待測物（1)之缺陷。 24 201011278 肆•本發明之實驗例 清參看第五圖所示，係為本發明光學量測架構，以測量玻 其:先以標準面(未有缺陷)來當做基準’所得的影像擷 ▲K象如附件-所示，之後再把有缺陷的玻璃換上 去’用影像掏取裳置⑽拍下來缺陷影像，如附件二所示。再 乂連續拍下基準影像與缺陷影像，並可把時間平均以得到更準 確的結果。比照附件一上圖及下圖，從中可以觀察到上圖與下 ❹圖的光強度麵差異，其中也麵光強大小與顧、高度差成 正比。我們把測試影像（有缺陷影像者）減掉基準影像，經過 電腦分析軟體分析，即可得到待測物⑴的缺陷，如第八圖及附 件二所示。再將此待測物⑴放到光學顯微鏡下量測，其結果如 附件二所示，經由比對可見第八圖與附件二互相符合。' 伍•本發明應用範固 (a) 在光學及精密器械製造業與電機及電子機械器材業方面 ❹’可顧在玻料板、光學面、讀、轉鑛職面、光學元 件表面與内部等的表面形貌、平整度、氣泡或缺陷量測與檢驗， 以及LCD面板玻璃缺陷檢測。 (b) 在機械製造業與模具製造業方面，可應用在表面缺陷 光滑與粗糙的檢測。 量 測 00在醫療器材製造業方面’可應用於樣本外表與内部輪廊 25 201011278 ' 陸•結論 因此，藉由上述技術特徵的建置，本發明確實具有下列所 述之特點： 1.本發明係光束經制物件，所造成測㈣束的角度偏 移，而得到其相對應之待測物理量’如粗糖度、高度差、或折 射率之變化，利用影像操取裝置大面積影像操取，而得到待測 物件表面之輪廓、粗糙度、或内部細微結構。 〇 2.本發明系赫構與原理簡單，故成本較為低廉。 3. 本發明測量的範圍和解析度皆蚊於系統的選用，故可任 意調整量測範圍以及解析度。 4. 本發明待測物件可選用透明和非透明樣本，適用性極佳， 並可適用於各型的精密度樣本，應用性廣泛。 5. 本發明非破壞性、非接觸性，故不需任何表面處理、即時 性量測與大量測範圍之表面形貌粗糙度檢測技術，可觀察物體 ❿粗糙度、表面輪廓、折射率變化、與系統的對準、定位、校正、 安裝等功能。 6. 本發明可觀察物體表面或結構的排列分佈、與異樣分析。 可作為生物科技的組織、細胞、基因、蛋白質···等及時觀測， 對樣品也不會產生任何破壞與毒性，故可做為活體試驗。可做 為半導體、光電、精密製造、生醫產業之製程中物件表面粗輪、 輪廓、鍍膜厚度之量測。 以上所述，僅為本發明之一可行實施例，並非用以限定本 26 201011278 =:3.:圍，凡舉依據下列申請專利範圍所迷之内容 之專=為之其他變化的等效實施，皆應包含 具產業之利用性，^ 除上述優點外，並深 界定於卜善習用所產生之缺失，而且所^ 與進步I S，徵’未見於同類物品，故而= 鈞局依法按奎°發明專利要件，爰依法具文提出申請，謹請 專利’以維護本申請人合法之權益。 © 【圖式簡單說明】 :一圖係本發明光經過待測物之偏向角度示意圖。 :圖係本發明待測面傾斜之高度差與角度偏向關係示意圖。 第一圖係本發明四層紐組態之角度感測器spR示意圖》 第四圖係本發明反射率對應入射角的關係圖。 第五圓係本發明第一種具體實施示意圖。 第六圖係本發明第二種具體實施示意圖。 ❹第七圖係本發明第三種具體實施示意圖。 第八圖係本發明電腦分析後之待測物缺陷影像示意圖。 附件一：上圖為本發明基準影像示意畫面，下圖為本發明測試 影像示意晝面。 附件一：係以光學顯微鏡拍攝的玻璃缺陷影像。 【主要元件符號說明】 (1)待測物 （la)良品 (10)先學掃瞄手段（11)雷射光源 .27 201011278 ' (12)光阻隔器 (13a)第一透鏡 (14)空間濾波器 (16)檢偏板 (18)四分之一波片 (30)旋轉手段 (50)運算手段 k (60)雙轴移動平台 (13)透鏡 (13b)第二透鏡 (15)偏極板 (17)偏極分光鏡 (20)角度感測器 (40)影像擷取手段 (50a)電腦 ❿ 28 .First, the undetected object (1) is placed between the angle sensor (20) SPR and the polarizing plate (15) (the transmission axis is parallel to the axis), and then the rotation means (30) (Rotati〇n Stage), adjust the light close to the resonance angle as the intensity of the reference surface, and take the image by the image picking device (4〇) as the reference image. Then, the undetected object (1) is replaced with a scratch (defect) object to be tested (1), and the light ray is incident on the defect object (1), causing a light shift, so that the new person hits the angle sensor. (20) It will deviate from the original angle, causing the light intensity to rise or fall. Then the image capture device (40) will take the image, use it as a test image, use the computer (50a) to store the image, and we will test the image and benchmark. Compared with the image, the defect information of the object (1) can be known. 3.4 System Architecture Principle A·Transmissive for transparent test object Dong measurement: Please refer to the fifth figure, first based on the surface electrical assembly resonance principle and then through 22 201011278 • After some clever light path arrangement, use the image撷Take the device (4〇) to capture the defect light intensity image of the object to be tested d). The He-Ne laser is used as the laser source (11), incident through a light blocker (12) (Isolator) to prevent a system of reflected light from returning to the laser source (11), from the light blocker (12) The light is incident on the spatial filter (μ) (Spatial filter) and the lens (13) to enlarge the beam, and is incident on the object to be tested through the polarizer plate (15) pL (Polarizer) (the transmission axis is parallel to the X axis). Use the double-sleeve mobile platform (60) to select the part to be tested (1) to be measured, and the light is transmitted via the ❹ angle sensor (20) (SPR Sensor) 'Rotary means (3〇) (R〇tati〇n Stage) The incident angle is brought to the resonance angle to generate the surface plasma resonance phenomenon. The refracted light is too strong. The light is added to the analyzer (16) (Analyzer), and the transmission axis azimuth is adjusted to adjust the light intensity to the image. The optical translation of the card can be resolved. Vertical incidence reflection measurement: Please refer to the sixth figure, with He-Ne laser as the laser source (11), incident through a light blocker (12) (Isolator ) to avoid a system of reflected light returning to the laser source (11) 'light incident from the light blocker (12) To the spatial filter (14) (Spatial filter) and the lens (13) to expand the beam, passing through the polarizer (15) PL (Polarizer) (the transmission axis and the y-axis sheep line), making it polarized in the y direction . After being reflected by a polarizing beam splitter PBS (17) (Polarization Beam Splitter), it is then subjected to a quarter-wave plate (18) (3⁄4 Waveplate) to make the light into a circular apolar light' (subject) (1) The reflection returns along the original path, and once again passes through the quarter-wave plate (18) to form horizontally polarized light. Therefore, the polarizing beam splitter pbs (17) penetrates the 'incident angle sensor (20) SPR to adjust the rotation. Means (30) (Rotation 23 201011278 • Stage) makes its incident angle a resonance angle, and its exit intensity can be adjusted by rotating the analyzer (16) ANt (Analyzer). Then, the imaging system is imaged on the image capturing device (40) through the lens 〇3), the image is captured by the image capturing device (4〇), and finally the defect of the object to be tested (1) is analyzed by the computer (50a). Comparing the reference image (the undefective object to be tested (1)) with the test image (the defective object to be tested), and then analyzing the image by computer analysis, the defect of the object to be tested (丨) . Use the computer (5 〇 a ) to control the scanning xy dual-axis mobile platform (60), extract all the scanning data, and draw the measurement results. ❹ C. Oblique incident reflection measurement: Please refer to the seventh figure, you can use the two-axis mobile platform (6〇) to select the object to be tested (1) to measure, also use He_Ne laser as laser The light source (11) is incident through a light blocker (12) (Isolator) to prevent the reflected light of one system from returning to the laser, and the light from the light blocker (12) is incident on the spatial filter (14) (Spatial filter) And the lens (13) enlarges the beam. Oblique incident object ❹(1) 'passes the polarizing plate (15) PL (p〇iarizer) (the transmission axis is parallel to the crotch sleeve), the incident angle sensor (20) SPR, adjusts the rotation means (30 (R〇tati〇n Si;age) makes its incident angle a resonance angle', and its exit intensity can be adjusted by rotating the analyzer (16) Mt (Analyzer). Then, the image is captured by the lens (13) imaging system on the image capturing device (40). The image is captured by the image capturing device (4), and finally the computer (50a) analyzes the defect of the object to be tested (1). Comparing the reference image (the undead object (1)) with the test image (the defective object (丨)), and then analyzing the image by computer analysis, the object to be tested (1) can be obtained. defect. 24 201011278 肆• The experimental example of the present invention is shown in the fifth figure, which is the optical measurement architecture of the present invention, for measuring the optical image: the image obtained by using the standard surface (without defects) as the reference 撷▲K As shown in the attachment - then replace the defective glass with the image taken by the image capture (10), as shown in Annex 2. Then take the reference image and the defect image continuously and average the time to get more accurate results. Comparing the above figure and the following figure, the difference in light intensity between the upper and lower images can be observed, and the intensity of the surface light is proportional to the difference between the height and the height. We subtract the reference image from the test image (the defective image) and obtain the defect of the object to be tested (1) after computer analysis software analysis, as shown in Figure 8 and Annex 2. The object (1) to be tested is placed under an optical microscope, and the results are shown in Annex 2. The eighth and second parts of the comparison can be seen through the comparison. 'Wu·This application of the application of Fan Gu (a) in the optical and precision equipment manufacturing and electrical and electronic machinery industry ❹ 'in the glass plate, optical surface, reading, transfer job, optical components surface and internal Surface topography, flatness, bubble or defect measurement and inspection, and LCD panel glass defect detection. (b) In the mechanical manufacturing and mold manufacturing industries, it can be applied to the detection of smooth and rough surface defects. Measurement 00 in the medical device manufacturing industry can be applied to the sample appearance and internal gallery 25 201011278 'Lu. Conclusion Therefore, with the above technical features, the present invention does have the following characteristics: 1. The present invention The light beam is passed through the object, and the angle of the beam is measured (4), and the corresponding physical quantity to be tested is obtained, such as the change of the raw sugar content, the height difference, or the refractive index, and the large-area image is taken by the image manipulation device. The contour, roughness, or internal fine structure of the surface of the object to be tested is obtained. 〇 2. The invention is simple in structure and principle, so the cost is relatively low. 3. The range and resolution of the measurement of the present invention are both selected by the system, so the measurement range and resolution can be arbitrarily adjusted. 4. The object to be tested of the invention can be selected from transparent and non-transparent samples, has excellent applicability, and can be applied to various types of precision samples, and has wide applicability. 5. The invention is non-destructive and non-contact, so it does not require any surface treatment, instantaneous measurement and surface measurement roughness detection technology of a large number of measurement ranges, and can observe the roughness, surface profile and refractive index change of the object. , alignment with the system, positioning, calibration, installation and other functions. 6. The present invention can observe the arrangement and the distribution of the surface or structure of the object. It can be used as a biotechnology organization, cell, gene, protein, etc., and it will not cause any damage or toxicity to the sample, so it can be used as a living test. It can be used as a measurement of the surface rough wheel, contour and coating thickness of the workpiece in the process of semiconductor, optoelectronic, precision manufacturing and biomedical industries. The above description is only one of the possible embodiments of the present invention, and is not intended to limit the equivalent implementation of the other contents of the content of the following claims. All should include the use of industry, ^ In addition to the above advantages, and deep definition of the lack of the use of Bu Shan, and the progress of IS, the sign 'not found in the same kind of goods, so = 钧 according to the law according to the ° ° Invent the patent requirements, and file an application in accordance with the law, and ask the patent to protect the legal rights of the applicant. © [Simple description of the diagram]: A diagram is a schematic diagram of the deflection angle of the light passing through the object to be tested. : The diagram is a schematic diagram showing the relationship between the height difference and the angle deviation of the slope of the surface to be tested of the present invention. The first figure is a schematic diagram of the angle sensor spR of the four-layer configuration of the present invention. The fourth figure is a relationship diagram of the reflectance of the present invention corresponding to the incident angle. The fifth circle is a schematic diagram of the first embodiment of the present invention. Figure 6 is a schematic view of a second embodiment of the present invention. Figure 7 is a schematic view of a third embodiment of the present invention. The eighth figure is a schematic diagram of the defect image of the object to be tested after the computer analysis of the present invention. Annex I: The above figure is a schematic image of the reference image of the present invention, and the following figure is a schematic view of the test image of the present invention. Annex I: Glass defect images taken with an optical microscope. [Main component symbol description] (1) Test object (la) good product (10) Learn scanning method first (11) Laser light source. 27 201011278 ' (12) Light blocker (13a) first lens (14) space Filter (16) analyzer plate (18) quarter wave plate (30) rotation means (50) operation means k (60) biaxial moving platform (13) lens (13b) second lens (15) bias Plate (17) polarized beam splitter (20) angle sensor (40) image capture means (50a) computer ❿ 28 .