TW201007223A - Color filter substrate and method of making the same - Google Patents

Color filter substrate and method of making the same Download PDF

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TW201007223A
TW201007223A TW97130780A TW97130780A TW201007223A TW 201007223 A TW201007223 A TW 201007223A TW 97130780 A TW97130780 A TW 97130780A TW 97130780 A TW97130780 A TW 97130780A TW 201007223 A TW201007223 A TW 201007223A
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layer
light
forming
substrate
shielding pattern
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TW97130780A
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Chinese (zh)
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TWI370271B (en
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Chun-Ming Huang
Hsien-Ching Chiu
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Chunghwa Picture Tubes Ltd
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Abstract

The present invention provides a method of making a color filter substrate. The method includes forming a black matrix on a substrate, forming a bank layer on the black matrix and forming a plurality of color filter layers. The black matrix has a plurality of first openings exposing a part of the substrate. The wall layer has a plurality of second openings exposing a part of the black matrix. Each color filter layer respectively covers the substrate exposed by each first opening.

Description

201007223 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種彩色滤光基板及其製造方法 【先前技術】201007223 IX. Description of the Invention: [Technical Field] The present invention relates to a color filter substrate and a method of manufacturing the same [Prior Art]

彩色滤光片(Color Filter)是液晶顯示裝置中 的關鍵性零組件之-,其品質的好壞對液晶顯示=要 彩表現具有決定性的影響。傳統於基板上製作彩的色 之方法雖有多種’但以顏料分散法為主流,亦^利^片 光阻塗佈於玻璃,再經軟烤、曝光、顯影、硬烤等製〉色 複製作而成,但此方法對於顏料的利用率極低,且其=重 複雜,不易降低成本。為解決上述問題,而有噴墨印刷裎 (Ink-jet Printing)法的問世,喷墨印刷法係以一噴H 程,將RGB三原色顏料直接注入遮光圖案層Color Filter is a key component in liquid crystal display devices, and its quality has a decisive influence on the liquid crystal display = color performance. There are many methods for making colors on a substrate. However, the pigment dispersion method is the mainstream, and the photoresist is applied to the glass, and then soft baked, exposed, developed, hard baked, etc. Made of this method, but the method has very low utilization rate of pigments, and its weight is complicated, and it is not easy to reduce the cost. In order to solve the above problems, there is an inkjet printing (Ink-jet Printing) method in which an inkjet printing method directly injects RGB three primary color pigments into a light shielding pattern layer by a single jet process.

Matrix,BM)所構成之開口中,以完成顏料之塗佈,此法 可增加彩色光阻的使用率、減少無塵室空間並簡化製程, 故較之於㈣彩色濾光狀製造方較具成本競爭力。 請參考第1圖至第4圖,第1圓至第4圖為習知製作 -彩色濾、光基板之方法示意圖。首先,提供—基板12,例 如透明玻璃基板,然後形成—遮光層14於基板以面上。 之後,利用-光罩16來對遮光| 14進行一曝光製程,以 圖案化遮光層14。接著,如第2圖所示,進行一顯影製程, 201007223 以移除未被圖案化之遮光層14,以形成一遮光圖案層18 與複數個開口 20。然後,如第3圖所示,利用進行一噴墨 (Ink-jet)製程’分別將具有紅色漿料、綠色漿料以及藍色漿 料的彩色濾光層22喷塗於相對應之各開口 20中。然後, 如第4圖所示,於遮光圖案層π表面上再形成一由氧化姻 錫(indium tin oxide, ITO)或氧化銦鋅(indium zinc oxide, IZO)所構成的透明導電層24。最後形成複數個間隙物26 ❹ 於遮光圖案層18上方之透明導電層24上,進而完成一彩 色濾光基板10的結構。值得注意的是,利用喷墨製程製作 彩色遽光層22時,其遮光圖案層18的膜厚往往需高於彩 色濾光層22之尚度,以避免相鄰次晝素(sub-pixei)之彩色 濾光層22的顏料墨滴互相污染。 然而’為了維持液晶面板的間隙(Cell Gap)之均一性並 ❹ 符合特定的規格’遮光圖案層與間隙物(ph〇t〇spacer)的總 咼度必須固定。但如前所述,由於利用喷墨製程製作彩色 遽光層時’為了避免相鄰次晝素之顏料墨滴互相污染,因 此必須提高遮光圖案層的厚度,至少為2微米以上, 將造成間隙物之高度因而縮短,使得間隙物之彈性變 差,造成面板組立(cell assembly)製程的良率下降。 【發明内容】 _ 本發明之主要目的在於提供一種彩色濾光基板及其製造方 6 201007223 法χ有助於&向間隙物之高度,避免面板組立之良率降低。 為達上述之目的,本發賴供—種彩色縣基板之製造方 法首先’提供-基板。接著,形成一遮光圖案層於基板上,遮 光圖案層具有複數個第一開口,並曝露出部份之基板。然後,形 成一擋牆層於遮光圖案層上,擋牆層具有複數個第二開口,並曝 露出箱遮光圖案層。之後,形成複數個彩色濾光層分別覆蓋於 © 各第一開口所曝露出之基板上。 為達上述之目的,本酬提供_郷色濾光基板。其包括一 基板、-遮光圖案層、一播牆層以及複數個彩色滤光層。遮光圖 案層δ又置於基板上,且遮光圖案層具有複數個第一開口,並曝露 出。卩伤基板。擋牆層設置於遮光圖案層上,且擋牆層具有複數個 第—開〇’並曝露出部份遮光圖案層。彩色滤光層分別設置於各 _ 第一開口所曝露出之基板上。 本發明藉由縮減遮光圖案層之厚度,可提升間隙物高度。並 且,藉由另於遮光圖案層上形成擋牆層,以有效區隔各彩色濾光 層。 【實施方式】 請參考第5圖至第8圖,第5圖至第8圖係為本發明一實施 * 丨之彩色濾光基板之製造方法示意圖,其中第8圖為本發明彩色 7 201007223 遽光基板之剖面示意圖。如第5圖所示,提供一基板1〇2,例如: 玻璃基板等之透明基板,然後利用一成膜與微影製程 (Photolithographic process)形成一遮光圖案層 1〇4 於基板 ι〇2 上。 其中,形成遮光圖案層104之材料係可_負型光阻材料或正型 光阻材料’例如負型的黑色光阻’作為具有良好遮光效果並且 遮光圖案層104具有複數個第一開口 1〇6曝露出部份之基板ι〇2, 讓背光源之光線得以通過。在本較佳實施财,麟遮光之遮光 ⑩ ®案層104 ’其厚度係約略介於1.2微米⑽)至L6微米之間,但 本發明並穩於此,研依實際需求做姉應之調整。 接著’如第6 ®所示’再彻—成麟郷製卿成一擔牆 層108於遮光圖案層1〇4上。其中,擒牆層1〇8具有複數個第二 開口 no曝露出部份之遮光圖案層104,其厚度係約略介於02微 米至1.5微米之間,以使擋牆層1〇8加上遮光圖案層1〇4的總厚 ❹ m'達2 «(㈣以上’以避免相鄰各次畫素之彩色遽光 層(未不於第6圖中)互相混合,造成汙染。此外,形成擋牆層1〇8 之材料係可獅如黑色光阻或彩色光崎料等之貞型光阻材料或 正型光阻材料。 之後,如第7圖所示,形成複數個彩色濾光層112分別覆蓋 於各第—開口 106所曝露出之基板102上。其中,形成彩色滤光 層u2之方法可為一喷墨㈣姻製程或一微影製程,並且形成彩 . 色’慮光層112之材料係可選自彩色細材料及彩色漿料,可根據 8 201007223 ^ 12之方法來決定。此外,本較佳實施例之彩色 ^層m可包含有個紅色紅單元、複數個騎滤光單元 ”複數個藍色遽光單元、複數個青色(Cyan)濾光單元、複數個洋紅 ,_鱗臟單元、複數個黃色(她順光單元等,視加、減 混色等佈局設計而定。而擋牆層1〇8與遮光圖案層1〇4則可用來 將各紅色濾光單元、各綠㈣解元錢藍色觀單元等之次晝 素區隔開來,以清楚呈現所顯示之畫面。 此外’本發明形成彩色滤光層⑴之步驟與形成播牆層⑴8 之步驟亦可於同-步驟中進行。例如,當利用微影製程於基板1〇2 形成彩色濾、光層112時,部份之彩色滤光層112即可設置於遮 光圖案層1〇4上’用來當作擋牆層1〇8。但值得注意的是在本發 月中,形成作為檔牆層1〇8之彩色濾光層112之材料係與其相鄰 之彩色濾光層112之形成材料不同。例如:於基板1〇2上形成紅 _ 色濾光單元時,可同時於與紅色濾光單元不相鄰之遮光圖案層104 上形成紅色濾光單元以作為擋牆層1〇8,然後依照形成紅色濾光單 疋之方式依序於基板102上與遮光圖案層1〇4上形成綠色濾光單 元以及藍色濾光單元。 接著,如第8圖所示,於形成彩色濾光層112之後,可形成 一透明電極層114,例如氧化銦錫(ΙΤΟ)或氧化銦鋅(ΙΖ〇)等之透明 導電氧化物(Transparent Conductive Oxide, TCO),以及配向臈’覆 * 蓋遮光圖案層、檔牆層1〇8以及彩色濾光層112,其中透明電 201007223 極層114係電性連接至液晶面板的共通電極(圖未示),至此即完成 本發明之彩色濾光基板100。但本發明並不限於此,可於形成透明 電極層114之後,於透明電極層114上形成複數個間隙物 116(spacers),其中各間隙物116分別位於各第二開口 11()内之透 明電極層114上,且擋牆層108係圍繞各間隙物116。 值得注意的疋,為了維持液晶面板之間隙具有均一性並符合 〇 所需的規格,本發明係藉由縮減遮光圖案層104之厚度至約略介 於1.2微米(em)至1.6微米之間,以增加透明電極層114與薄膜 電晶體基板(圖未示)間之距離,亦即能有效提高設置於其間之間隙 物116的南度。並且’本發明更藉由另於遮光圖案層1〇4上形成 具有開口之獅層1G8,使擋牆層1G8不堆·間_ 116與遮光 圖案層104之間’而是圍繞間隙物116的周目。如此,本發明不 僅可有效增加擋牆層108與遮光圖案層1〇4的厚度來區隔各彩色 _ ;慮光層112避免混合汙染,亦可避免縮減間隙物116之高度,而 提升間隙物m之彈性。因此,本發明所製造出之彩色滤光 1〇〇將可避免液晶面板組立之良率下降。 。土 此外,本發明並稀於透㈣極賴設置於_物與 案層之間。請參考第9圖’第9圖係為本發明彩色濾光基板之另 -實施樣態_面示意圖。如第9 _示,本發明村於 色遽光層112之後,先於遮光圖案層1〇4上形成複數個間/ .116,使間隙物116分別位於各第二開口則内之遮光圖案層收 201007223 上’並且使擋赌層l〇8 ®繞於各間隙物11ό之周圍。然後再於彩 色濾光層112、擋牆層108、遮光圖案層1〇4以及間隙物116上覆 蓋一透明電極層114 〇 综合上述說明,如第8圖所示,藉由本發明彩色濾光基板 之製造方法可製造出一種彩色濾光基板1〇〇,其包含有一基 板1〇2、-遮光圖案層1〇4、-擋牆層1〇8以及複數個彩色滤光層 ❹ 112。其中,遮光圖案層104設置於基板102上,且遮光圖案層1〇4 具有複數個第一開口 106曝露出部份基板1〇2,可用於區隔各彩色 遽光層112且遮蔽背光源之光線,使液晶面板之各畫素分別得以 清楚顯示。遮光圖案層104之材料可為負型光阻材料及正型光阻 材料。擋牆層108設置於遮光圖案層1〇4上,且擋牆層1〇8具有 複數個第一開口 11〇曝露出部份遮光圖案層1〇4。擔牆層1〇8之材 料可為黑色光阻或彩色光阻材料等之負型光阻材料或正型光阻材 _ 料。彩色濾光層112則分別設置於各第一開口 106所曝露出之基 板102上,且彩色濾光層112包含有複數個紅色濾光單元、複數 個綠色濾光單元與複數個藍色濾光單元等之濾光單元。 此外’彩色濾光基板1〇〇之遮光圖案層104、擋牆層ι〇8以 及彩色滤光層112上可另覆蓋有一透明電極層114,電性連接至液 晶面板之共通電極。並且,位於擋牆層108之各第二開口 11〇内 之透明電極層114上另分別設置有一間隙物116,使擋牆層1〇8圍 繞各間隙物116。值得注意的是,擋牆層108之第二開口 11〇大小 201007223 係以曝露出可設置間隙物116之大小為主。另外,如第9圖所示, 間隙物116亦可設置於透明電極層Π4與遮光圖案層1〇8之間, 且位於第二開口 110内。 綜上所述,本發明提供於基板上兩階段形成遮光圖案層與擋 牆層之方法,於避免彩色濾光層互相污染或混合之情況下,有助 於提高間隙物之高度’而可增加間隙物之彈性,以避免面板組立 ❹ 良率下降。 以上所述僅為本發明之較佳實施例,凡依本發明申請專利範 圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖至第4圖為習知製作一彩色濾光基板之方法示意圖。 第5圖至第8圖係為本發明一實施例之彩色遽光基板之製造方法 ® 示意圖。 第9圖係為本發明彩色濾光基板之另一實施樣態的剖面示意圖。 【主要元件符號說明】 10 彩色濾光基板 12 基板 14 遮光層 16 光罩 18 遮光圖案層 20 開口 22 彩色濾光層 24 透明電極層 12 201007223 26 間隙物 102 基板 106第一開口 110 第二開口 114 透明電極層 100 104 108 112 116 彩色濾光基板 遮光圖案層 擋牆層 彩色渡光層 間隙物Matrix, BM) is used to complete the coating of pigments. This method can increase the use of color resists, reduce the space of clean room and simplify the process. Therefore, it is more suitable than (4) color filter manufacturing. Cost competitiveness. Please refer to FIG. 1 to FIG. 4 , and the first to fourth figures are schematic diagrams of a conventional method for producing a color filter and a light substrate. First, a substrate 12, such as a transparent glass substrate, is provided, and then a light shielding layer 14 is formed on the surface of the substrate. Thereafter, the light-shielding film 14 is subjected to an exposure process using the mask 16 to pattern the light-shielding layer 14. Next, as shown in Fig. 2, a developing process, 201007223, is performed to remove the unpatterned light-shielding layer 14 to form a light-shielding pattern layer 18 and a plurality of openings 20. Then, as shown in FIG. 3, a color filter layer 22 having a red paste, a green paste, and a blue paste is sprayed on each of the corresponding openings by performing an ink-jet (Ink-jet) process. 20 in. Then, as shown in Fig. 4, a transparent conductive layer 24 made of indium tin oxide (ITO) or indium zinc oxide (IZO) is formed on the surface of the light-shielding pattern layer π. Finally, a plurality of spacers 26 are formed on the transparent conductive layer 24 above the light shielding pattern layer 18, thereby completing the structure of a color filter substrate 10. It is worth noting that when the color light-emitting layer 22 is formed by the ink-jet process, the film thickness of the light-shielding pattern layer 18 tends to be higher than that of the color filter layer 22 to avoid adjacent sub-pixei. The pigment ink droplets of the color filter layer 22 are contaminated with each other. However, in order to maintain the uniformity of the gap of the liquid crystal panel (Cell Gap) and to conform to a specific specification, the total thickness of the light-shielding pattern layer and the spacer (ph〇t〇 spacer) must be fixed. However, as described above, when the color light-emitting layer is formed by the ink-jet process, in order to avoid contamination of the pigment droplets of the adjacent secondary pigments, it is necessary to increase the thickness of the light-shielding pattern layer to at least 2 μm, which will cause a gap. The height of the object is thus shortened, so that the elasticity of the spacer is deteriorated, resulting in a decrease in the yield of the panel assembly process. SUMMARY OF THE INVENTION The main object of the present invention is to provide a color filter substrate and a manufacturer thereof. 6 201007223 The method contributes to the height of the spacer and avoids the decrease in the yield of the panel assembly. In order to achieve the above object, the manufacturing method of the substrate for the color county is first provided with a substrate. Next, a light-shielding pattern layer is formed on the substrate, the light-shielding pattern layer has a plurality of first openings, and a portion of the substrate is exposed. Then, a barrier layer is formed on the light shielding pattern layer, the barrier layer has a plurality of second openings, and the box shielding pattern layer is exposed. Thereafter, a plurality of color filter layers are formed to cover the substrate exposed by each of the first openings. For the above purposes, this reward is provided with a 郷 color filter substrate. The utility model comprises a substrate, a light shielding pattern layer, a wall layer and a plurality of color filter layers. The mask layer δ is again placed on the substrate, and the light-shielding pattern layer has a plurality of first openings and is exposed. Bruise the substrate. The retaining wall layer is disposed on the light shielding pattern layer, and the retaining wall layer has a plurality of first opening-openings and exposing a portion of the light shielding pattern layer. The color filter layers are respectively disposed on the substrates exposed by the respective first openings. The invention can increase the height of the spacer by reducing the thickness of the light shielding pattern layer. Moreover, each of the color filter layers is effectively partitioned by forming a barrier layer on the light-shielding pattern layer. [Embodiment] Please refer to FIG. 5 to FIG. 8 , and FIG. 5 to FIG. 8 are schematic diagrams showing a method of manufacturing a color filter substrate according to an embodiment of the present invention, wherein FIG. 8 is a color 7 201007223 of the present invention. Schematic diagram of the light substrate. As shown in FIG. 5, a substrate 1〇2, for example, a transparent substrate such as a glass substrate, is provided, and then a light-shielding pattern layer 1〇4 is formed on the substrate ι2 by a film formation and photolithographic process. . Wherein, the material forming the light-shielding pattern layer 104 is a negative-type photoresist material or a positive-type photoresist material 'for example, a negative-type black photoresist' as having a good light-shielding effect and the light-shielding pattern layer 104 has a plurality of first openings 1〇 6 Expose part of the substrate ι〇2 to allow the light from the backlight to pass. In the preferred implementation, the thickness of the shading 10® layer 104' is approximately between 1.2 micrometers (10) and L6 micrometers, but the invention is stable here, and the research is adjusted according to actual needs. . Then, as shown in the 6th ®, the stencil is formed into a wall layer 108 on the light-shielding pattern layer 1〇4. Wherein, the sidewall layer 1〇8 has a plurality of second openings no exposed portions of the light-shielding pattern layer 104, and the thickness thereof is approximately between 02 micrometers and 1.5 micrometers, so that the barrier layer 1〇8 is shielded from light. The total thickness ❹ m' of the pattern layer 1〇4 is up to 2 «((4) or more' to avoid the color grading layers of adjacent pixels (not in Fig. 6) mixing with each other, causing pollution. The material of the wall layer 1〇8 is a 光-type photoresist material or a positive-type photoresist material such as a black photoresist or a color ray-baked material. Thereafter, as shown in FIG. 7, a plurality of color filter layers 112 are formed respectively. Covering the substrate 102 exposed by each of the first openings 106. The method for forming the color filter layer u2 may be an inkjet process or a lithography process, and forming a color-coloring layer 112. The material may be selected from the color fine material and the color paste, and may be determined according to the method of 8 201007223 ^ 12. In addition, the color layer m of the preferred embodiment may include a red red unit and a plurality of riding filter units. "A plurality of blue neon units, a plurality of Cyan filter units, a plurality of magenta, _ Dirty unit, a plurality of yellow (she goes to the light unit, etc., depending on the layout design such as addition and subtraction, etc.) The barrier layer 1〇8 and the light-shielding pattern layer 1〇4 can be used to set each red filter unit and each green (4) The sub-differentiation area of the blue element of the solution is separated to clearly show the displayed picture. In addition, the steps of forming the color filter layer (1) and the step of forming the wall layer (1) 8 may be the same. In the step, for example, when the color filter and the light layer 112 are formed on the substrate 1〇2 by the lithography process, a part of the color filter layer 112 can be disposed on the light-shielding pattern layer 1〇4 The retaining wall layer 1 〇 8. However, it is worth noting that in the present month, the material forming the color filter layer 112 as the barrier layer 1 〇 8 is different from the material forming the adjacent color filter layer 112. For example, for example. When a red-color filter unit is formed on the substrate 1〇2, a red filter unit can be formed on the light-shielding pattern layer 104 not adjacent to the red filter unit to serve as the barrier layer 1〇8, and then formed according to the formation. The red filter is formed on the substrate 102 and forms a green color on the light-shielding pattern layer 1〇4. The color filter unit and the blue filter unit. Next, as shown in FIG. 8, after the color filter layer 112 is formed, a transparent electrode layer 114 such as indium tin oxide or indium zinc oxide may be formed. 〇), etc. Transparent Conductive Oxide (TCO), and a matching 臈'-cover* cover light-shielding pattern layer, a barrier layer 1〇8, and a color filter layer 112, wherein the transparent layer 201007223 pole layer 114 is electrically The color filter substrate 100 of the present invention is connected to the common electrode (not shown) of the liquid crystal panel. However, the present invention is not limited thereto, and a plurality of transparent electrode layers 114 may be formed on the transparent electrode layer 114 after forming the transparent electrode layer 114. Spacers 116, wherein the spacers 116 are respectively located on the transparent electrode layer 114 in each of the second openings 11 (), and the barrier layer 108 surrounds the spacers 116. It is noted that in order to maintain the uniformity of the gap of the liquid crystal panel and conform to the specifications required for the ruthenium, the present invention reduces the thickness of the light-shielding pattern layer 104 to approximately between 1.2 micrometers (em) and 1.6 micrometers. Increasing the distance between the transparent electrode layer 114 and the thin film transistor substrate (not shown) can effectively increase the southness of the spacer 116 disposed therebetween. And the invention further forms the lion layer 1G8 having an opening on the light-shielding pattern layer 1〇4, so that the barrier layer 1G8 is not stacked between the _116 and the light-shielding pattern layer 104 but surrounds the spacer 116. Zhou Mu. Thus, the present invention can not only effectively increase the thickness of the retaining wall layer 108 and the light-shielding pattern layer 1〇4 to distinguish the respective colors _; the light-proof layer 112 avoids mixing pollution, and can also avoid reducing the height of the spacers 116 and lifting the spacers. The elasticity of m. Therefore, the color filter 1 manufactured by the present invention can avoid the drop in the yield of the liquid crystal panel assembly. . In addition, the present invention is also sparsely placed between the object and the layer. Please refer to Fig. 9 and Fig. 9 is a schematic view showing another embodiment of the color filter substrate of the present invention. As shown in the ninth embodiment, after the color light-emitting layer 112 of the present invention, a plurality of spaces / .116 are formed on the light-shielding pattern layer 1〇4, and the spacers 116 are respectively located in the light-shielding pattern layers in the second openings. Close the 201007223 and make the gambling layer l〇8® around the gaps 11ό. Then, the transparent filter layer 114 is covered on the color filter layer 112, the barrier layer 108, the light-shielding pattern layer 1〇4, and the spacer 116. The above description is integrated. As shown in FIG. 8, the color filter substrate of the present invention is used. The manufacturing method can produce a color filter substrate 1A, which comprises a substrate 1, 2, a light-shielding pattern layer 1〇4, a barrier layer 1〇8, and a plurality of color filter layers 112. The light-shielding pattern layer 104 is disposed on the substrate 102, and the light-shielding pattern layer 1〇4 has a plurality of first openings 106 exposing a portion of the substrate 1〇2, which can be used to separate the color light-emitting layers 112 and shield the backlight. The light causes the pixels of the liquid crystal panel to be clearly displayed. The material of the light-shielding pattern layer 104 may be a negative-type photoresist material and a positive-type photoresist material. The retaining wall layer 108 is disposed on the light shielding pattern layer 1〇4, and the retaining wall layer 1〇8 has a plurality of first openings 11〇 exposing a portion of the light shielding pattern layer 1〇4. The material of the wall layer 1〇8 may be a negative photoresist material such as a black photoresist or a color photoresist material or a positive photoresist material. The color filter layer 112 is respectively disposed on the substrate 102 exposed by each of the first openings 106, and the color filter layer 112 includes a plurality of red filter units, a plurality of green filter units, and a plurality of blue filters. A filter unit such as a unit. Further, the light-shielding pattern layer 104, the barrier layer ι8, and the color filter layer 112 of the color filter substrate 1 may be covered with a transparent electrode layer 114 electrically connected to the common electrode of the liquid crystal panel. Moreover, a spacer 116 is further disposed on the transparent electrode layer 114 in each of the second openings 11 of the retaining wall layer 108, so that the retaining wall layer 1〇8 surrounds the spacers 116. It should be noted that the second opening 11 挡 size 201007223 of the retaining wall layer 108 is mainly exposed to the size of the configurable spacer 116. In addition, as shown in FIG. 9, the spacer 116 may be disposed between the transparent electrode layer Π4 and the light shielding pattern layer 1〇8 and located in the second opening 110. In summary, the present invention provides a method for forming a light-shielding pattern layer and a barrier layer on two stages on a substrate, which can increase the height of the spacers while avoiding contamination or mixing of the color filter layers. The elasticity of the spacers to avoid a decrease in the yield of the panel stack. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should fall within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 4 are schematic views showing a method of fabricating a color filter substrate. 5 to 8 are schematic views showing a method of manufacturing a color light-emitting substrate according to an embodiment of the present invention. Figure 9 is a schematic cross-sectional view showing another embodiment of the color filter substrate of the present invention. [Main component symbol description] 10 color filter substrate 12 substrate 14 light shielding layer 16 photomask 18 light shielding pattern layer 20 opening 22 color filter layer 24 transparent electrode layer 12 201007223 26 spacer 102 substrate 106 first opening 110 second opening 114 Transparent electrode layer 100 104 108 112 116 color filter substrate light-shielding pattern layer retaining wall layer color light-passing layer spacer

❹ 13❹ 13

Claims (1)

201007223 十、申請專利範固: 1. 一種彩色濾光基板之製造方法,包含: 提供一基板; 形成一遮光圖案層於該基板上,該遮光圖案層具有複數個第一 開口,並曝露出部份之該基板; 形成一擋牆層於該遮光圖案層上,該擋牆層具有複數個第二開 口,並曝露出部份該遮光圖案層;以及 ® 形成複數個彩色濾光層,以分別覆蓋於各該第一開口所曝露出 之該基板上。 2. 如申請專利範圍第1項所述之製造方法,更包含於形成該等彩色 遽光層之後’形成一透明電極層覆蓋該遮光圖案層、該擋牆層 以及該等彩色遽光層。 φ 3·如申請專利範圍第2項所述之製造方法,更包含於形成該透明電 極層之後,形成複數個間隙物(Spacers)分別位於各該第二開口内 之該透明電極層上,且該擋牆層係圍繞各該間隙物。 4.如申請專利範圍第1項所述之製造方法,更包含於形成該等彩色 遽光層之後’形成複數個間隙物(SpacerS)分別位於各該第二開口 内,且該擋牆層係圍繞各該間隙物。 . 5.如申請專利範圍第4項所述之製造方法,更包含於形成該等間隙 201007223 物之後’形成-透明電極層覆蓋該遮光圖案層、該推牆層、該 等彩色濾光層以及該等間隙物。 6.如申請專利範圍第丨項所述之製造方法,其中形成該遮光圖案 層、該擋牆層與該等彩色濾'光層之方法為一微影製程 (Photolithographic process) » ❹7.如申請專利範圍第6項所述之製造方法,其中形成該遮光圖案層 之材料係選自負型光阻材料及正型光阻材料。 8. 如申請專利_第6撕述之製造方法,其巾職賴牆層之材 料係選自負型光阻材料、正型光阻材料及彩色光阻材料。 9. 如申請補細第丨猶狀製造綠,其帽财縣色滤光 層之方法包含有一喷墨(Ink_jet)製程。 1G.如申請專利範圍第丨項所述之製造方法,其中形成該等彩色滤 光層之方法包含有一微影製程(ph〇t〇l池〇graphic p阳eess)。 U.如申睛專利細第】項所述之製造方法,其中形成該等彩色遽 光層之步驟與形成該擋牆層之步驟係於同一步驟中進行。 如申請專利範圍第u項所述之製造方法,其中形成該撞牆層之 材料係與相鄰於靖牆層之該轉㈣光層之形成材料不同。 201007223 13.—種彩色渡光基板,包含: 一基板; 一遮光圖案層,設置於基板上,該遮光圖案層具有複數個第一 開口,並曝露出部份該基板; 一擋牆層,設置於該遮光圖案層上,且該擋牆層具有複數個第 二開口,並曝露出部份該遮光圖案層;以及 複數個彩色濾光層,分別設置於各該第一開口所曝露出之該基 板上。 14. 如申請專利範圍第13項所述之彩色濾光基板,另包含有一透明 電極層,覆蓋於該遮光圖案層、該擋牆層以及該等彩色濾光層 上。 15. 如申請專利範圍第13項所述之彩色濾光基板,另包含有複數個 間隙物,分別設置於各該第二開口内。 十一、圖式: 16201007223 X. Patent application: 1. A method for manufacturing a color filter substrate, comprising: providing a substrate; forming a light shielding pattern layer on the substrate, the light shielding pattern layer having a plurality of first openings, and exposing the portion a portion of the substrate; forming a barrier layer on the light shielding pattern layer, the barrier layer having a plurality of second openings and exposing a portion of the light shielding pattern layer; and forming a plurality of color filter layers to respectively Covering the substrate exposed by each of the first openings. 2. The manufacturing method according to claim 1, further comprising forming a transparent electrode layer covering the light shielding pattern layer, the barrier layer, and the color light-emitting layer after forming the color light-emitting layer. The manufacturing method of claim 2, further comprising forming a plurality of spacers on the transparent electrode layer in each of the second openings after forming the transparent electrode layer, and The retaining wall layer surrounds each of the spacers. 4. The manufacturing method of claim 1, further comprising forming a plurality of spacers (SpacerS) in each of the second openings after forming the color light-emitting layer, and the barrier layer is Around each of the spacers. 5. The manufacturing method of claim 4, further comprising forming a transparent electrode layer covering the light shielding pattern layer, the push wall layer, the color filter layers, and the like after forming the gap 201007223 These spacers. 6. The manufacturing method according to claim 2, wherein the method of forming the light shielding pattern layer, the barrier layer and the color filter 'light layer is a Photolithographic process » ❹ 7. If applying The manufacturing method according to Item 6, wherein the material for forming the light shielding pattern layer is selected from the group consisting of a negative photoresist material and a positive photoresist material. 8. The method of claim 7, wherein the material of the towel wall layer is selected from the group consisting of a negative photoresist material, a positive photoresist material, and a color photoresist material. 9. If you apply for a fine, the method of making a green filter, the method of the captive color filter layer includes an inkjet (Ink_jet) process. 1G. The method of manufacturing of the invention, wherein the method of forming the color filter layer comprises a lithography process (ph〇t〇l 〇graphic p ees). U. The manufacturing method according to the invention, wherein the step of forming the color light-emitting layer and the step of forming the barrier layer are performed in the same step. The manufacturing method according to claim 5, wherein the material forming the wall layer is different from the material forming the rotating (four) light layer adjacent to the wall layer. 201007223 13. A color light-emitting substrate comprising: a substrate; a light-shielding pattern layer disposed on the substrate, the light-shielding pattern layer having a plurality of first openings, and exposing a portion of the substrate; a barrier layer, setting On the light-shielding pattern layer, the barrier layer has a plurality of second openings, and a portion of the light-shielding pattern layer is exposed; and a plurality of color filter layers are respectively disposed on the first openings. On the substrate. 14. The color filter substrate of claim 13, further comprising a transparent electrode layer covering the light shielding pattern layer, the barrier layer, and the color filter layers. 15. The color filter substrate of claim 13, further comprising a plurality of spacers disposed in each of the second openings. XI. Schema: 16
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* Cited by examiner, † Cited by third party
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CN110618555A (en) * 2019-09-26 2019-12-27 京东方科技集团股份有限公司 Display substrate, manufacturing method thereof and display device
CN110928027A (en) * 2019-11-27 2020-03-27 南京中电熊猫平板显示科技有限公司 Color film substrate and manufacturing method thereof

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TWI557486B (en) * 2014-12-31 2016-11-11 鴻海精密工業股份有限公司 Thin film transistor substrate, method of manufacturing same and a display panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110618555A (en) * 2019-09-26 2019-12-27 京东方科技集团股份有限公司 Display substrate, manufacturing method thereof and display device
CN110928027A (en) * 2019-11-27 2020-03-27 南京中电熊猫平板显示科技有限公司 Color film substrate and manufacturing method thereof

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