201006647 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種鏡片、鏡片陣列及其製造方法，尤其 ' 涉及一種壓印成型之鏡片、鏡片陣列及其製造方法。 ’【先前技術】 目前，鏡片通常係於透光基板兩侧以壓印成型光學部 (請參見 The Novel Fabrication Method and Optimum Tooling Design Used for Microlens Arrays » Proceedings of 〇 the 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems ； January 18-21,2006, Zhuhai，China)之方式生產。壓印成型係指先將液態或塑性 變形材料塗敷於基板上’再以壓印模具壓印成型。請參閱 圖13，當鏡片之兩個表面806與808均為光學表面時，一 般採用於基板80之兩侧802與804分別壓印成型。此時， 基板80之厚度決定了鏡片之厚度。 然，於手機鏡頭尺寸微小化之發展趨勢下，鏡片亦需 要越來越薄。目前，可藉由透光基板之薄化技術來減小基 板之厚度，從而減小鏡片之厚度。但薄化基板不但製程良 率低，價格高且具有易彎曲、破裂等低機械強度特性，於 壓印製程中亦不能承受其壓力。 【發明内容】 有鑑於此，有必要提供一種輕薄型之鏡片、鏡片陣列 及其製造方法。 一種鏡片陣列之製造方法，其包括以下步驟：提供一 201006647 2基板，其具有相對之第—表面與第二表面；钱刻該透 先基板之弟—表面形成複轉列排佈之凹槽，·形成-光阻 層於每個凹槽之底面，利用曝光顯影之方法去除預定區域 光阻’使該底面露出部分表面，成為非光學區，於該非光 學區形成遮光膜’·去除每個凹槽内殘留之光阻，形成光學 區於該光學區加-成型材料，壓印成型第一光學部，並201006647 IX. Description of the Invention: The present invention relates to a lens, a lens array and a method of manufacturing the same, and more particularly to an embossed lens, a lens array and a method of manufacturing the same. '[Prior Art] Currently, lenses are usually embossed on both sides of a light-transmissive substrate to form an optical part (see The Novel Fabrication Method and Optimum Tooling Design Used for Microlens Arrays » Proceedings of 〇the 1st IEEE International Conference on Nano/Micro Produced by Engineered and Molecular Systems; January 18-21, 2006, Zhuhai, China). Embossing refers to the application of a liquid or plastically deformable material to a substrate, which is then stamped by an imprinting mold. Referring to Figure 13, when both surfaces 806 and 808 of the lens are optical surfaces, they are typically stamped on both sides 802 and 804 of substrate 80, respectively. At this time, the thickness of the substrate 80 determines the thickness of the lens. However, under the trend of miniaturization of the size of the lens of the mobile phone, the lens needs to be thinner and thinner. At present, the thickness of the substrate can be reduced by thinning the light-transmissive substrate, thereby reducing the thickness of the lens. However, the thinned substrate not only has low process yield, high price, and low mechanical strength such as being bendable and cracked, and cannot withstand the pressure in the imprint process. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a thin and light lens, a lens array, and a method of manufacturing the same. A method for manufacturing a lens array, comprising the steps of: providing a 201006647 2 substrate having a first surface and a second surface; the surface of the transparent substrate is formed by a groove of the surface of the substrate; Forming a photoresist layer on the bottom surface of each of the grooves, and removing the predetermined area photoresist by exposure and development to expose the bottom surface to a portion of the surface to become a non-optical region, forming a light-shielding film in the non-optical region. Residual photoresist in the groove, forming an optical zone in the optical zone plus-forming material, embossing the first optical part, and
固化第-光學部之成型材料；於透光基板之f—表面上於 每個凹槽四周形成切割道。 一種鏡片’其包括―透光基板，該透S基板具有相對 之第-表面與第二表面，該透光基板之第一表面設有一凹 槽該凹槽之底面设有—第一光學部與一遮光膜，該遮光 膜圍繞設置於該第一光學部週邊。 一種鏡片陣列，包括一透光基板，該透光基板具有相 對之第一表面與第二表面，該透光基板之第一表面設有複 數陣列排佈之凹槽，每個凹槽之底面設有一第一光學部與 ❿一遮光膜，該遮光膜圍繞設置於該第一光學部週邊。 相較於先前技術，由於該鏡片陣列或鏡片之第一光學 部係於凹槽之底面上形成之，所形成之鏡片陣列或鏡片較 於透光基板之第一表面上形成第一光學部之鏡片更薄，且 由於透光基板並不是整塊進行薄化，凹槽四周未薄化之區 域可同時承受壓印過程中之壓力，避免了鏡片製程中透光 基板之彎曲與破裂。 【實施方式】 下面將結合附圖，對本發明實施例作進一步之詳細說 7 201006647 明。 請參閱圖1、圖1:1、圖 • # 之製造方法包括以下步驟.發明鏡片陣列100或鏡 .之第一表面與第二表面; 槽；暴扳之第-表面形成複數陣列排佈之凹 形成-光阻層於每個凹槽之底面 ❹：:除::區域光阻，使該底面露出部分表面= 予&於該非光學區形成遮光膜； 去除每個凹槽内殘留之光阻，形成光學區，於該 區加一成型材料，塵印成型第一光學 部之成型材料； ^ 屢印成型第二光學部於該透光基板之第 一光學部同光軸之位置； ，、乂第 於透光基板之第一表面上於每個凹槽四周形成切割 道； 。 形成一黏著層於透光基板之第一表面上每個切判道 圍成之區域； 沿著該切割道切割該透光基板形成各個鏡片。 下面將結合圖2至圖12對鏡片陣列10〇或鏡片2〇〇之 製造方法進行詳細描述。 如圖2所示’首先提供一透光基板10，該透光基板10 之材料係一種透光材料，例如玻璃，優選地，可為穿透率 大於95%之光學玻璃。該透光基板10具有兩個相對之表 201006647 面，即第一表面102與第二表面104。 於第一表面102藉由蝕刻方法形成複數陣列排佈之凹 槽11，該敍刻方法可為物理性触刻，如濺射飯刻（Sputter Etching)、離子束钱刻（Ion Beam Etching);化學性钱刻，如 電漿化學#刻（Plasma Chemical Etching);或物理、化學複 合I虫刻，如反應性離子姓刻（Reactive Ion Etching)。 利用裂缝塗佈（Slit Coating)或者自轉式塗佈法或其他 塗佈法於每個凹槽11之底面112形成光阻層13，光阻層 ® 13可為負光阻，亦可為正光阻。 藉由具有預定圖案之光罩（圖未示）對光阻層13進行紫 外光照射曝光。如果使用負光阻，例如聚異戊二烯 (polyisoprene)，由於負光阻對紫外光敏感，曝光部分將不 溶於顯影劑。 請參閱圖3，使用顯影劑後，將未曝光之負光阻溶解， 留下被曝光之負光阻132。凹槽11之底面112露出部分表 •面，形成非光學區14。 請參閱圖4，利用現有之鑛膜技術，例如藏鍍法，於非 光學區14上鍍一層遮光材料，例如鉻，形成遮光膜60,遮 光膜60用於減少雜散光。遮光膜60至少覆蓋如圖3所示 之非光學區14。遮光膜60之厚度小於負光阻132之厚度。 請參閱圖5，利用一種可溶解負光阻但與遮光材料鉻無 反應之溶劑，例如丙酮溶液，溶解如圖4所示之負光阻 132，露出鏡片成型區16。 然後於鏡片成型區16利用壓印模具壓印成型第一光學 201006647 部。 成型過程請參閱圖6至圖12。請參閱圖6，該壓印模 具20由-種能透過紫外光之材料製成，其具有複數與凹槽 11相對應之凸出部2。2,每個凸出部皿具有—成型腔 2022’用於成型鏡片之光學部形狀。本實施例中，該成型 腔2022之形狀為内凹之球面。 首先於鏡片成型區16加一成型材料18，該光學成型材 料18為熱塑性材料或熱固性材料，且此時呈液態或溶融 態，光學成型材料18受熱或受紫外光照射後可固化。 請參閱圖7,將壓印模具2〇對準成型材料18進行壓 印。然後，篡外光自模具20向成型材料18照射，使成型 材料18固化。 清參閱圖8，固化完成後，脫去壓印模具2〇，每個凹 槽11之底面112上形成有第一光學部3〇。 請參閱圖9,壓印成型第二光學部4〇於該透光基板1〇 ❹之第二表面104與該第一光學部3〇同光轴之位置。 請參閱圖10’於該第一表面102上於每個凹槽u四周 形成切割道12，其可藉由鐳射切割裝置或刀具切割形成。 請參閱圖11’於該透光基板10之第一表面1〇2上每個 切割道12所圍成之區域藉由塗佈方法形成一黏著層17，即 形成鏡片陣列100。該黏著層17之作用在於使透光基板1〇 可黏合多片具有光學元件之基板，形成多層光學元件結構 後’再整體進行切割。該光學元件可為複數感光器（CMOS 或者CCD)或者複數透鏡。 201006647 請參閱圖12 ’沿著該切割道12切割該透光基板1〇形 成單個鏡片200。The molding material of the first optical portion is cured; and a dicing street is formed around each groove on the f-surface of the light-transmitting substrate. A lens comprising: a light transmissive substrate having a first surface and a second surface, wherein the first surface of the light transmissive substrate is provided with a recess and the bottom surface of the recess is provided with a first optical portion and A light shielding film is disposed around the periphery of the first optical portion. An array of lenses includes a transparent substrate having a first surface and a second surface opposite to each other, and the first surface of the transparent substrate is provided with a plurality of rows of grooves, and the bottom surface of each groove is provided There is a first optical portion and a first light shielding film, and the light shielding film is disposed around the periphery of the first optical portion. Compared with the prior art, since the first optical portion of the lens array or the lens is formed on the bottom surface of the groove, the formed lens array or lens forms a first optical portion on the first surface of the transparent substrate. The lens is thinner, and since the transparent substrate is not thinned, the un-thinned area around the groove can simultaneously withstand the pressure during the imprinting process, thereby avoiding the bending and cracking of the transparent substrate in the lens manufacturing process. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. Please refer to FIG. 1, FIG. 1:1, and FIG. #. The manufacturing method includes the following steps: inventing the first surface and the second surface of the lens array 100 or the mirror; the groove; the first surface of the violent panel forms a plurality of arrays a concave-formed photoresist layer on the bottom surface of each of the grooves:: except:: area photoresist, such that the bottom surface is exposed to a portion of the surface = & a light-shielding film is formed in the non-optical region; removing residual light in each of the grooves Blocking, forming an optical zone, adding a molding material to the region, and forming a molding material of the first optical portion by dust printing; ^ repeatedly printing the second optical portion at a position of the first optical portion of the transparent substrate and the optical axis; And forming a cutting path around each groove on the first surface of the transparent substrate; Forming an adhesive layer on each of the first surface of the light-transmissive substrate; the light-transmissive substrate is cut along the scribe line to form each lens. A method of manufacturing the lens array 10A or the lens 2A will be described in detail below with reference to Figs. 2 to 12 . As shown in Fig. 2, a transparent substrate 10 is first provided. The material of the transparent substrate 10 is a light transmissive material such as glass, preferably an optical glass having a transmittance of more than 95%. The light transmissive substrate 10 has two opposing surfaces 201006647, namely a first surface 102 and a second surface 104. Forming a plurality of arrays of grooves 11 on the first surface 102 by etching, the sculpt method may be physical lithography, such as Sputter Etching, Ion Beam Etching; Chemical money engraving, such as Plasma Chemical Etching; or physical, chemical compound I insect engraving, such as Reactive Ion Etching. The photoresist layer 13 is formed on the bottom surface 112 of each of the recesses 11 by a slit coating or a spin coating method or other coating method. The photoresist layer 13 may be a negative photoresist or a positive photoresist. . The photoresist layer 13 is exposed to ultraviolet light by a photomask (not shown) having a predetermined pattern. If a negative photoresist, such as polyisoprene, is used, the exposed portion will be insoluble in the developer due to the negative photoresist being sensitive to ultraviolet light. Referring to Figure 3, after the developer is used, the unexposed negative photoresist is dissolved leaving the exposed negative photoresist 132. The bottom surface 112 of the recess 11 exposes a portion of the surface to form a non-optical zone 14. Referring to Fig. 4, a masking film 60 is formed on the non-optical region 14 by using a conventional mineral film technique, such as a plating method, to form a light-shielding film 60 for reducing stray light. The light shielding film 60 covers at least the non-optical zone 14 as shown in FIG. The thickness of the light shielding film 60 is smaller than the thickness of the negative photoresist 132. Referring to Fig. 5, a negative photoresist 124 as shown in Fig. 4 is dissolved by a solvent which dissolves the negative photoresist but is non-reactive with the light-shielding material chromium, such as acetone, to expose the lens forming region 16. The first optical 201006647 portion is then stamped in the lens forming zone 16 using an imprinting mold. See Figure 6 through Figure 12 for the molding process. Referring to FIG. 6, the imprinting mold 20 is made of a material that can transmit ultraviolet light, and has a plurality of protrusions 2 corresponding to the grooves 11. 2. Each of the protruding pieces has a molding cavity 2022. 'The shape of the optics used to shape the lens. In this embodiment, the shape of the molding cavity 2022 is a concave spherical surface. First, a molding material 18 is applied to the lens forming region 16, which is a thermoplastic material or a thermosetting material, and is in a liquid or molten state at this time, and the optical molding material 18 is cured by being heated or irradiated with ultraviolet light. Referring to Figure 7, the imprinting mold 2 is aligned to the molding material 18 for imprinting. Then, the external light is irradiated from the mold 20 to the molding material 18 to cure the molding material 18. Referring to Fig. 8, after the curing is completed, the imprinting mold 2 is removed, and the first optical portion 3 is formed on the bottom surface 112 of each of the recesses 11. Referring to FIG. 9, the embossed second optical portion 4 is disposed at a position where the second surface 104 of the transparent substrate 1 is aligned with the optical axis of the first optical portion 3. Referring to Fig. 10', a scribe line 12 is formed on each of the grooves u on the first surface 102, which can be formed by laser cutting means or cutter cutting. Referring to Fig. 11', an adhesive layer 17 is formed by a coating method on a region surrounded by each of the dicing streets 12 on the first surface 1'2 of the transparent substrate 10, i.e., the lens array 100 is formed. The adhesive layer 17 functions to allow the light-transmissive substrate 1 to bond a plurality of substrates having optical elements to form a multilayer optical element structure, and then cut the whole. The optical component can be a complex photoreceptor (CMOS or CCD) or a complex lens. 201006647 Referring to Figure 12, the light transmissive substrate 1 is cut along the scribe line 12 to form a single lens 200.
相較於先前技術，由於該鏡片陣列100或鏡片2〇〇之 第一光學部30係於凹槽11之底面112上形成之，所形成 之鏡片陣列100或鏡片200較於透光基板1〇之第一表面 1〇2上形成第一光學部之鏡片更薄，且由於透光基板1〇並 不是整塊進行薄化’凹槽n四周未薄化之區域可同時承受 壓印過程中之壓力’避免了鏡片陣列1〇〇或鏡片2〇〇之製 程中透光基板10之彎曲與破裂。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 Ο 圖1係本發明實施例鏡片之製造方法流程圖。 圖2至圖12係本發明實施例鏡片製造方法之過程示意 圖0 圖係先前技術鏡片之結構示意圖。 【主要元件符號說明】 表面 806、808 基板 80、10 兩側 802、804 凹槽 11 11 201006647 光阻層 鏡片陣列 鏡片 Λ 第一表面 第二表面 底面 負光阻 非光學區 ^切割道 遮光膜 鏡片成型區 模具 凸出部 成型腔 第一光學部 ^第二光學部 黏著層 成型材料 13 100 200 102 104 112 132 14 12 60 16 20 202 2022 30 40 17 18 12Compared with the prior art, since the first optical portion 30 of the lens array 100 or the lens 2 is formed on the bottom surface 112 of the groove 11, the formed lens array 100 or the lens 200 is thinner than the transparent substrate 1 The lens forming the first optical portion on the first surface 1〇2 is thinner, and since the transparent substrate 1 is not thinned, the area around the groove n is not thinned, and can be simultaneously subjected to the imprint process. The pressure 'avoids the bending and cracking of the transparent substrate 10 in the process of the lens array 1 or the lens 2 . In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a method of manufacturing a lens according to an embodiment of the present invention. 2 to 12 are schematic views showing the process of the lens manufacturing method of the embodiment of the present invention. Fig. 0 is a schematic view showing the structure of the prior art lens. [Main component symbol description] Surface 806, 808 Substrate 80, 10 Both sides 802, 804 Groove 11 11 201006647 Photoresist layer lens array lens Λ First surface Second surface bottom surface Negative photoresist non-optical area ^ Cutting path opaque lens Molding zone mold projection molding cavity first optical portion ^ second optical portion adhesive layer molding material 13 100 200 102 104 112 132 14 12 60 16 20 202 2022 30 40 17 18 12