201000263 九、發明說明： 【發明所屬之技術領域】 本發明财.—種研雜，特贱有種具有彈性微魏構之研磨 【先前技術】 ㈣子晶糊由層化不瞻_成，例如半導體晶_)即是層 ==’當每一個新的材料層被加上時，常需要使研磨或輾磨的步 以使此晶圓平坦化’或是達成其他的目的，而此種研201000263 IX. Description of the invention: [Technical field to which the invention pertains] The invention of the invention is a kind of grinding, and there is a kind of grinding with elastic micro-wei structure [prior art] (4) the sub-crystal paste is not layered, for example The semiconductor crystal_) is the layer == 'When each new material layer is added, it is often necessary to make the grinding or honing step to flatten the wafer' or achieve other purposes.
_.f-g^^_w_hemiealMeehaniealpQlishing，CMJ :於=係由各種不同的薄型材料層所形成，因此必須經過多次的CMP研磨步 驟，才旎將材料層由晶圓的表面均勻去除。 典型的CMP中，係將晶_裝於CMp之載體上，此載體可帶動晶圓旋轉， 墊職設於另-賴上，且此賴亦會帶雜光健動，通常在抛光過 1會於晶圓與拋_之_人化學研魏(sluny)，因此 研磨液產生相互轉德學作用，献與化學研磨射_粒魏物^乍用 2除部L此種研磨方式若遇難面斜整之待紅件，但又 兩達成鋪讀表面-致的平坦㈣，研磨_待紅件雌觸 僅限於一點，待研磨至一定程卢時其 、積i常 度__之絲射會逐漸增加，因此不但會 :斤需的研磨寺間，且研磨塾容易因使用的程度與範圍不平均，而導 ^法長久使用。又，偶若於研磨時遇到表面不平整之待磨工件，伸又需依昭 伏進行—致性的研磨時，既有的研磨墊無法服貼於待磨： 牛表面上，因此…、法達成此種研磨之特殊需求。 有鑒於此，本發明提供_種具有彈性微型結 ， 可充份貼合膽紅件之麵上，明 1此微低構 磨所而的時間且亦可克服不同待磨物之研磨需求，此外微型結構除了可於研 5 201000263 •磨時掃除待磨物表面上的微粒，避免待磨物表面刮 吸水能力，故可於研磨時吸附較多的 微n、有較“ 前技術加以改良者。 所磨液達成較佳之研磨效果，乃針對先 【發明内容】 為解決先前技術之問題，本發明提供—種 研磨塾包含接合面與磨面，接合面係用以於」之:墊。此 以研磨半導體或其他工件，其中磨面具她 =型使:則係用 :合於半導體或其他工件表面，以增力•與_=== 佳之研磨效果。 克服不同待磨物之研磨需求，達成較 可以’具有微型結構’使得磨面 了充伤貼合於半導體或其他工件表面，達成較佳之研磨效果。 得磨面_.f-g^^_w_hemiealMeehaniealpQlishing, CMJ: The = is formed from a variety of different thin material layers, so the CMP polishing step must be repeated to remove the material layer uniformly from the surface of the wafer. In a typical CMP, the crystal is mounted on a carrier of CMp, which can drive the wafer to rotate, and the pad is placed on the other, and this will also carry the stray light, usually after polishing 1 In the wafer and throwing _ _ people chemical research Wei (sluny), so the grinding fluid produces mutual transfer of moral effects, and chemical polishing shot _ grain Wei material ^ 乍 with 2 division L such grinding method if difficult to face oblique The whole thing is waiting for the red piece, but the two finish the surface of the paving--the flatness (4), grinding _ the red female part is limited to a little, and when it is ground to a certain distance, it will gradually become the ray of the __ Increase, so not only: the need to grind the temple, and the grinding enamel is easy to use due to the extent and scope of the use, and the guide method is used for a long time. Moreover, even if the workpiece to be ground is uneven when the surface is encountered during grinding, the extension needs to be carried out according to the invention. When the grinding is performed, the existing polishing pad cannot be applied to the surface to be ground: on the surface of the cow, therefore... The law meets the special needs of such grinding. In view of the above, the present invention provides an elastic micro-junction that can be fully adhered to the surface of the biliary member, and the time of the micro-low-grinding can be overcome and the grinding requirements of different objects to be ground can be overcome. In addition to the micro-structure, it can be used to remove particles on the surface of the object to be ground, and to avoid the ability of the surface of the object to be ground to absorb water. Therefore, more micro-n can be adsorbed during grinding, which is better than the former technology. The grinding liquid achieves a better grinding effect, which is directed to the prior art. SUMMARY OF THE INVENTION In order to solve the problems of the prior art, the present invention provides a polishing pad comprising a joint surface and a grinding surface, the joint surface being used for: a mat. This is to grind a semiconductor or other workpiece, where the grinding mask is her type: it is used: it is combined with the surface of a semiconductor or other workpiece to enhance the force and _=== better grinding effect. Overcoming the grinding requirements of different objects to be abraded, achieving a relatively "microstructure" allows the surface to be adhered to the surface of a semiconductor or other workpiece to achieve a better grinding effect. Grind face
導2ΪΓΓ目的在於提供—種研雜，具有微赌構，可增加磨面盘半 導體或其他工件所接觸之表面積，達成較佳之研磨效果。 磨U 本發明之又一目的在於提供一種研磨且 ^ 的時間，達成較佳之研磨效果。 、有敬4，可㈣研磨所需 本發明之又一目的在於提供一種磨 物之研磨需求，達成較佳之研磨效果。塾〃有微型結構，可克服不同待磨 2明之又-目的在於提供—種研磨墊，微型結構 其他工件之_ ’ 顺彻输工件挪。 故了 又？的在於提供一種_塾，微型結構具有較佳之吸水能力， 故可於時_财的研驗，觀較佳之研磨效果。 【實施方式】 發明係揭露一種具有微型結構之研磨墊，其中所利用到的一些研磨 墊之未4造或處理過程，係利用現有技術來達成，故在下述說明中，並不作 201000263 完整描述。而且下勒文巾之m並未依據實際之_尺寸完整緣製，其 作用僅在表達與本發明特徵有關之示意圖。 第- A _本發_缝之—較佳實施例示_，研雜⑴包含接合面 11與磨面12 ’接合面U係用以黏謬13(感壓膠）接合並固定於一研磨裝置μ 上，而磨面U則係用崎磨半導體或其他工件3〇，其中磨面n具有彈性微型 結構b ’藉此使得磨S 12可充份貼合於半導體或其他工件3味面，如第一 B 圖所不，因此當彈性微型結構15之磨面12與工件3〇之凸起表面接觸時，彈性 ，型結構15與凸起表面所細絲面積會增加⑽，且提錄為密集的施壓力 量’當彈性微型結構15之磨面12與工件3〇之凹陷表面接觸時，彈性微型結構 I5與凹絲崎接觸的表面齡減少(疏），其所提供之賴力量職為鬆散，因 此工件30之研磨表面會因彈性微型結構15的影響，m出現不同的受力方式， 故研磨時不但可節省研磨所f的時間，且亦可克服不同待磨物之研磨需求，達 成較佳之研磨效果。 第二A _第二8 _本發明研雜的微龍構之—較佳實補示意圖， 其中此微型結構係為翻凹槽2卜其凹槽之寬度為約lnm〜觸哗。 第二A圖與第三b圖係本發明研磨墊的微型結構之另一較佳實施例示意 圖，其中此微型結構係由微型發泡22技術所形成，且此微型發泡14技術可為 物理發泡技術或化學發泡技術。 第四A圖與第四b g係本發明研磨塾的微型結構之又—較佳實施例示意 圖’其中此微型結構可為毛雜微频構Μ，其所形成之微型結構大小為約 lnm ΙΟΟμιη，由於毛羽結構具有較佳之吸水能力，故可於研磨時吸附較多的研 磨液，達成較佳之研磨效果。 本發明提供研磨墊的微型結構製作方法之一較佳實施例，其中此微型結構 係由微型發泡技術所製作而成，其製作研磨墊之方法包含以下步驟：提供一樹 知與複數個奈米級顆粒，攪拌奈米級顆粒及樹脂，使得奈米級顆粒均勻的懸浮 刀佈於於樹脂中，固化樹脂以形成一片材，移除奈米級顆粒使得此片材之表 7 201000263 面具有複數健孔’以形成微麵構，其巾，隨樹脂祕除奈綠顆粒的方 法可為加熱法。 本發明提供研磨墊祕麵構製作方法之另—較佳實施例，其中此微型結 構係由微型發泡技術所製作而成，其製作研磨墊之方法包含以下步驟：提供二 樹脂與複數铺顆粒於樹脂中’鹽雌與樹脂，使得鹽顆粒均勻的懸浮分 佈於樹脂中，固化樹脂以形成-片材，移除鹽顆粒，使得片材之表面具有複數 鋪孔’以形成微型結構’其中’可利用加熱法固化樹脂，而利用水溶液將鹽 顆粒移除。 本發明提供研磨塾的微型結構製作方法之又一較佳實施例，其中此微型結 構係由微型發術所製作喊，其製作研聽之方法包含以下步驟：提供一 樹脂與溶劑於樹脂中，溶劑與樹脂為不互溶，且此溶劑可為二甲基甲酿胺（D剛 或其他親水性溶劑，辦概與溶舰合液，使得溶綱⑽分佈於樹脂中， 固化樹脂以形成-片材，移除溶劑’使得片材之表面具有複數個槽孔，以形成 微型結構’其中，可個加熱細化樹脂，而_水溶液將溶劑移除。 本發明提供研磨墊的微型結構製作方法之再—較佳實施例，其製作研磨塾 之方法包含以下步驟：提供-由超細纖維形成之基材，含浸此基材於一樹脂中， 固化此含浸樹脂後之基材以職-片材，研磨此片材之表面，以制狀似毛羽 的微型結構表面’其中可利用加熱法固化樹脂。 本發明提供研磨㈣卿結難作方法之再—難實_，射此微型姓 構係由微型發泡技術所製作喊，其製作研餘之方法包含以下步驟：提供一 樹月_咖難脂中，觀職與發泡航合液，使得發關均勻的分佈於 樹脂中，0化樹脂以形成-片# ’加熱樹脂，使得發泡劑氣化，藉此使得片材 ^表面具有概個抓，以職额頻構，其巾之步驟可與加熱樹 脂之步驟一併執行。 本發明所提供之具有雜觀輯之研磨墊，其巾此微_構可充份貼人 於待磨工件之表面上’明加研斜接觸之表面積，不但可節省研磨所需的時 8 201000263 2，且亦可練關鋪物之研㈣求，此財视轉除了可於研糾掃除待 磨物表面上的雜，避免待磨物表面刮傷外，微型結構具有較佳之吸水能力， 故可於研磨時吸附較多的研磨液，達成較佳之研磨效果。 以=輕縣Μ讀佳實施_已，並相嫌林發狀申請 Γ的描述’對於熟知本技術領域之專門人士應可_及實施，因 佩撕崎卿，職包含在下 【圖式簡單說明】 第一Α圖為一研磨裝置之示意圖。 第一B圖為一研磨墊之彈性微型結構的剖面圖。 第二A圖為一研磨墊之微型凹槽的示意圖。 第二B圖為一研磨墊之微型凹槽的剖面圖。 第三A圖為一研磨墊之微型發泡的示意圖。 第三B圖為一研磨墊之微型發泡的剖面圖。 第四A圖為__研磨墊之毛羽狀微型結構的示意圖。 第四B圖為一研磨墊之毛羽狀微型結構的剖面圖。 【主要元件符號說明】 10 研磨墊 11 接合面 12 磨面 13 黏膠 14 研磨裝置 15 微型結構 21 微型凹槽 22 微型發泡 201000263 221 23 槽孔 毛羽狀微型結構The purpose of Guide 2 is to provide a kind of grinding, which has a micro-gaming structure, which can increase the surface area contacted by the grinding disc semi-conductor or other workpieces, and achieve better grinding effect. Milling U Another object of the present invention is to provide a time of grinding and ^ to achieve a better grinding effect. There is a respect of 4, but (4) grinding requirements Another object of the present invention is to provide a grinding requirement for the abrasive to achieve a better grinding effect.塾〃 There are micro-structures that can overcome different needs to be polished. The purpose is to provide a kind of polishing pad, micro-structure _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ So, again? It is to provide a kind of 塾, the micro-structure has better water absorption capacity, so it can be used in the inspection of time and money to observe the better grinding effect. [Embodiment] The invention discloses a polishing pad having a microstructure, wherein some of the polishing pads used are not made or processed by the prior art, and therefore, in the following description, it is not fully described in 20100026. Moreover, the m of the lower towel is not based on the actual size, and its function is only to express the schematic diagram related to the features of the present invention. -A - _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Above, while the grinding surface U is made of a semiconductor or other workpiece, wherein the grinding surface n has an elastic microstructure b', thereby making the grinding S 12 fully conformable to the semiconductor or other workpieces, such as the first A B figure does not, so when the grinding surface 12 of the elastic microstructure 15 is in contact with the convex surface of the workpiece 3, the area of the filament of the elastic, type structure 15 and the convex surface is increased (10), and is recorded as dense. When the grinding surface 12 of the elastic microstructure 15 is in contact with the concave surface of the workpiece 3, the surface age of the elastic microstructure I5 in contact with the concave wire is reduced (sparse), and the force provided by the workpiece is loose. Therefore, the grinding surface of the workpiece 30 may have different force-receiving modes due to the influence of the elastic micro-structure 15, so that not only the grinding time can be saved, but also the grinding requirements of different objects to be ground can be overcome, and the better is achieved. Grinding effect. The second A _ second 8 _ the micro-dragon structure of the present invention - a preferred real complement diagram, wherein the microstructure is a flip groove 2, the width of the groove is about 1 nm ~ touch. 2A and 3B are schematic views of another preferred embodiment of the microstructure of the polishing pad of the present invention, wherein the microstructure is formed by the micro-foaming 22 technology, and the micro-foam 14 technology can be physical Foaming technology or chemical foaming technology. 4A and 4b are a schematic view of a micro-structure of the abrasive crucible of the present invention, wherein the micro-structure can be a micro-frequency configuration, and the micro-structure formed is about 1 nm ΙΟΟμιη. Since the hairiness structure has better water absorption capacity, more polishing liquid can be adsorbed during grinding to achieve a better grinding effect. The present invention provides a preferred embodiment of a method for fabricating a micro-structure of a polishing pad, wherein the micro-structure is fabricated by micro-foaming technology, and the method for fabricating the polishing pad comprises the steps of: providing a tree and a plurality of nanometers Grade particles, stirring nano-sized particles and resin, so that the nano-sized particles are uniformly suspended in the resin, the resin is cured to form a sheet, and the nano-sized particles are removed so that the sheet has the surface of 2010 20103 The plurality of pores are formed to form a micro-faceted structure, and the method of removing the green particles with the resin may be a heating method. The present invention provides another preferred embodiment of the method for fabricating a polishing pad, wherein the microstructure is fabricated by a micro-foaming technique, and the method of making the polishing pad comprises the steps of: providing a resin and a plurality of particles. In the resin, 'salt and resin, so that the salt particles are uniformly suspended in the resin, the resin is cured to form a sheet, and the salt particles are removed, so that the surface of the sheet has a plurality of perforations to form a microstructure] The resin may be cured by heating, and the salt particles may be removed using an aqueous solution. The present invention provides a further preferred embodiment of the method for fabricating a micro-structure of a polishing crucible, wherein the micro-structure is made by a micro-fabrication system, and the method for making the research comprises the steps of: providing a resin and a solvent in the resin, The solvent and the resin are immiscible, and the solvent may be dimethyl melamine (D or other hydrophilic solvent, and the solution is dissolved in the solvent, so that the sulfonate (10) is distributed in the resin, and the resin is cured to form a sheet. Material, removing the solvent 'so that the surface of the sheet has a plurality of slots to form a microstructure", wherein the resin can be heated to refine the resin, and the aqueous solution removes the solvent. The present invention provides a method for fabricating the microstructure of the polishing pad. Further, in a preferred embodiment, the method for producing a polishing crucible comprises the steps of: providing a substrate formed of ultrafine fibers, impregnating the substrate in a resin, and curing the substrate after the impregnating resin to serve-sheet Grinding the surface of the sheet to form a micro-structured surface resembling a hairy feather. The resin can be cured by heating. The present invention provides a method for grinding (4) difficult to make a difficult method. The structure is made by the micro-foaming technology, and the method for making the research includes the following steps: providing a tree month _ café fat, watching and foaming nautical liquid, so that the hair is evenly distributed in the resin, 0 The resin is formed to form a sheet-heating resin, so that the foaming agent is vaporized, whereby the surface of the sheet has a general grip, and the step of the towel can be performed together with the step of heating the resin. The invention provides a polishing pad with a complex arrangement, and the micro-structure of the towel can be fully attached to the surface of the workpiece to be grounded, and the surface area of the oblique contact can be saved, which not only saves the time required for grinding 8 201000263 2, and can also practice the research of the paving material (4), this financial conversion can be used to eliminate the impurities on the surface of the object to be ground, to avoid scratching the surface of the object to be ground, the micro structure has better water absorption capacity, so It can absorb a large amount of polishing liquid during grinding to achieve a better grinding effect. The description of the application of 轻 , 并 并 并 并 并 并 并 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林And implementation, because of the tears of Takizaki, the job is included in the [Figure BRIEF DESCRIPTION OF THE DRAWINGS The first diagram is a schematic view of a polishing apparatus. The first B is a cross-sectional view of an elastic micro-structure of a polishing pad. The second A is a schematic view of a micro-groove of a polishing pad. A cross-sectional view of a micro-groove of a polishing pad. Figure 3A is a schematic view of a micro-foaming of a polishing pad. Figure 3B is a cross-sectional view of a micro-foaming of a polishing pad. The fourth A-picture is __grinding Schematic diagram of the hairpin-like microstructure of the pad. Figure 4B is a cross-sectional view of the capillary structure of the polishing pad. [Main component symbol description] 10 Abrasive pad 11 Joint surface 12 Grinding surface 13 Adhesive 14 Grinding device 15 Micro structure 21 Miniature Groove 22 Miniature Foaming 201000263 221 23 Slotted Hairpin Microstructure