200952134 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種光源裝置，特別涉及一種具有發光二 .極體晶片等固態發光元件之光源裝置。 .【先前技術】 目前，發光二極體（Light Emitting Diode，LED)已經被 廣泛應用到很多領域，在此，一種新型發光二極體可參見 Daniel A. Steigerwald 等人於文獻 IEEE Journal on Selected Topics in Quantum Electronics, Vol. 8，No.2, March/April 2002 中之 Illumination With Solid State Lighting Technology 一文。發光二極體一般可發出特定波長之光，例如可見光， 但是發光二極體所接收能量之大部分被轉換為熱量，其餘 部分之能量才被真正轉換為光能。因此，發光二極體發光 所產生之熱量必須被疏散掉以保證發光二極體之正常運 作。 φ 如圖1所示，一種光源裝置10，其包括一殼體11，一 個光源模組12及一個燈罩13。該光源模組12設置於該殼 體11中，且該燈罩13設置於該光源模組12之上方以保護 該光源模組12。該光源模組12包括：一個印刷電路板 (Printed Circuit Board，PCB) 121、設置於該印刷電路板 121 上之一個金屬線路層122與複數個發光元件123(如，發光 二極體晶片），以及覆蓋該發光元件123之封裝體124。該 複數個發光元件123與該金屬線路層122電性連接。然而， 該複數個發光元件123所產生之熱量不能及時有效之從該 7 200952134 殼體li中排除，進而降低了該複數個發光元件123之發光 效率。由此可見，有必要提供一種散熱效率較高之光源裝 置。 '【發明内容】 以下將以實施例說明一種散熱效率較高之光源裝置。 一種具有發光二極體晶片之光源裝置，其包括··一個 絕^體、一個導熱體、一個金屬導電I、複數個發光二極 ❹體晶片、金屬線以及一個透明封裝體。該絕緣體具有一個 第一表面及一個與該第一表面相對之第二表面於第二表 面上形成有複數個第一通孔。該導熱體與該絕緣體之第一 表面緊密接合，且該導熱體具有暴露於該絕緣體之第一通 孔之部分。該金屬導電層設置於該絕緣體之第二表面上， 且具有與該第一通孔相貫通之第二通孔。該複數個發光二 極體晶片設置於該導熱體之暴露於該絕緣體之第一通孔之 部分上以與該導熱體熱連接。該複數個發光二極體晶片分 ©別藉由該金屬線與該金屬導電層形成電連接。該透明封裝 體設置於該絕緣體之第二表面上，用以覆蓋該複數個發光 二極體晶片與該金屬線。 與先前技術相比’該光源裝置中之發光二極體晶片直 接設置於導熱體上並且與導熱體形成良好之熱連接，故發 光一極體晶片發光時產生之熱量可直接傳導至導熱體，再 由導熱體將吸收到之熱量傳導至外部，從而降低了發光二 極體晶片之溫度’提高了光源裝置之散熱效率，以及發光 二極體晶片之發光效率與使用壽命。另，該金屬導電層形 200952134 成於該絕緣體上，使得與該光源裝置電性連接之外部電路 位於該光源裝置之上方；發光二極體晶片與其下方之導熱 體熱性連接，使得該光源裝置之導熱方向向下，從而有效 之避開了外部電路，進而減小了該光源裝置之熱阻，提高 •了其散熱效能。 【實施方式】 下面結合附圖對本發明作進一步之詳細說明。 Λ 請參見圖2，本發明第一實施例提供之一種光源裝置 ❹ 20，其包括絕緣體21，導熱體22，金屬導電層23，複數個 發光二極體晶片24，金屬線25，及透明封裝體26。 該絕緣體21具有一個第一表面211以及一個與該絕緣 體21之第一表面211相對之第二表面212,於第二表面212 上形成有複數個第一通孔2101該絕緣體21所用材料可為 塑膠，例如聚對苯二醯對苯二胺（Polyphthalamide，ΡΡΑ)， 液晶聚合物（Liquid crystal polymer，LCP)等。 ❹ 該導熱體22為一長方體結構，其具有一個上表面 221、一個與該上表面221相對之下表面222，以及設置於 該上表面221與下表面222之間之侧面223。該導熱體22 之上表面221及侧面223與該絕緣體21緊密接合。 該絕緣體21局部覆蓋該導熱體22之上表面221，以使 該導熱體22之上表面221有部分暴露於該絕緣體21之第 一通孔2101，並使該導熱體22與該絕緣體21形成複數個 容置槽27。該導熱體22之下表面222暴露於空氣中。 該導熱體22所用材料可為銅、鋁等具有較好導熱性能 9 200952134 之金屬，或矽、陶瓷等非金屬導熱物質。 金屬導電層23設置於該絕緣體21之第二表面212上， 且具有與該第一通孔21〇1相貫通之第二通孔23〇2。該金屬 .導電層23為平板狀，即不具有彎折處，從而使其於受到較 .大外力作用時不會由其自身應力變化較大導致斷裂等情況 發生，提高了金屬導電層23之可靠度。 該金屬導電層23藉由嵌入式射出成型技術 ❺（insert-molding)分別設置於該絕緣體21之第二表面 上，且該導熱體22、該絕緣體21與該金屬導電層23藉由 嵌入式射出成型技術形成一體結構，以保證金屬導電層幻 與導熱體22之間具有良好之電絕緣性能，以及導熱體 與絕緣體21之間具有良好之熱傳導性能。 複數個發光二極體晶片24分別設置於該複數個容置槽 27中，具體的，每個發光二極體晶片24設置於該導熱體 22之暴露於該絕緣體21之第二表面212之部分，從而實現 ❹與該導熱體22熱連接。在此，每個發光二極體晶片24之 正負極藉由兩條金屬線25與金屬導電層23形成電連接。 發光二極體晶片24可藉由黏合方式與導熱體22形成 熱連接，例如於發光二極體晶片24與導熱體22之間設置 有銀膠、導電膠、非導電膠等黏膠。當然，發光二極體晶 片24也可藉由其他方式與導熱體22形成熱連接，例如共 晶方式（Eutectic Bonding)。 可理解的是’為了使該光源裝置2〇發出白光，該複數 個發光二極體晶片24可包括至少一個藍光發光二極體晶 200952134 片、至少一個紅光發光二極體晶片以及至少一個綠發光二 極體晶片，該三種不同顏色之發光二極體晶片24發出之光 組合後可形成白光。 • 透明封裝體26設置於絕緣體21之第二表面212上， •其用以覆蓋該發光二極體晶片24與該金屬線25,可避免該 發光一極體晶片24用該金屬線25被外界水氣相接觸而被 氧化。該透明封裝體26之外表面260可為平面、凸曲面或 ❹凹曲面’以改變發光二極體晶片24發出之光線經由外表面 260出射之角度，從而可改變光源裝置2〇之照射範圍及光 型。由於該透明封裝體2(5内具有複數個晶片結構，因此， 該透明封裝體26具有混光效果。 該透明封裝體26中還可設置有光波長轉換物質，使該 光源裝置20產生所需要之光顏色，例如螢光粉。若該透明 封裝體26中摻雜有黃色螢光粉，發光二極體晶片24發出 =藍光經由該透明封裝體26出射時，有部分藍光被轉換為 ©黃光，未被轉換之藍光與轉換得到之黃光結合後將形成白BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device, and more particularly to a light source device having a solid-state light-emitting element such as a light-emitting diode chip. [Prior Art] At present, Light Emitting Diode (LED) has been widely used in many fields. Here, a new type of light-emitting diode can be found in Daniel A. Steigerwald et al. in the IEEE Journal on Selected Topics. In Quantum Electronics, Vol. 8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology. A light-emitting diode generally emits light of a specific wavelength, such as visible light, but most of the energy received by the light-emitting diode is converted into heat, and the rest of the energy is actually converted into light energy. Therefore, the heat generated by the light-emitting diode must be evacuated to ensure the normal operation of the light-emitting diode. As shown in Fig. 1, a light source device 10 includes a housing 11, a light source module 12 and a lamp cover 13. The light source module 12 is disposed in the housing 11 and the light cover 13 is disposed above the light source module 12 to protect the light source module 12. The light source module 12 includes a printed circuit board (PCB) 121, a metal circuit layer 122 disposed on the printed circuit board 121, and a plurality of light emitting elements 123 (eg, light emitting diode chips). And a package 124 covering the light emitting element 123. The plurality of light emitting elements 123 are electrically connected to the metal wiring layer 122. However, the heat generated by the plurality of light-emitting elements 123 cannot be effectively removed from the casing 2009li, thereby reducing the luminous efficiency of the plurality of light-emitting elements 123. Thus, it is necessary to provide a light source device with higher heat dissipation efficiency. [Explanation] A light source device having high heat dissipation efficiency will be described below by way of examples. A light source device having a light-emitting diode wafer, comprising: a body, a heat conductor, a metal conductive I, a plurality of light-emitting diode chips, a metal wire, and a transparent package. The insulator has a first surface and a second surface opposite the first surface, and a plurality of first through holes are formed on the second surface. The heat conductor is in intimate engagement with the first surface of the insulator, and the heat conductor has a portion that is exposed to the first through hole of the insulator. The metal conductive layer is disposed on the second surface of the insulator and has a second through hole penetrating the first through hole. The plurality of light emitting diode chips are disposed on a portion of the heat conductor exposed to the first through hole of the insulator to be thermally connected to the heat conductor. The plurality of light-emitting diode wafers are electrically connected to the metal conductive layer by the metal wires. The transparent package is disposed on the second surface of the insulator to cover the plurality of LED chips and the metal line. Compared with the prior art, the light-emitting diode wafer in the light source device is directly disposed on the heat conductor and forms a good thermal connection with the heat conductor, so that heat generated when the light-emitting one-pole wafer emits light can be directly transmitted to the heat conductor. Then, the heat transferred from the heat conductor to the outside, thereby lowering the temperature of the light-emitting diode wafer, improves the heat dissipation efficiency of the light source device, and the luminous efficiency and service life of the light-emitting diode chip. In addition, the metal conductive layer shape 200952134 is formed on the insulator such that an external circuit electrically connected to the light source device is located above the light source device; the light emitting diode chip is thermally connected to the heat conductor below the light source device, so that the light source device The heat conduction direction is downward, which effectively avoids the external circuit, thereby reducing the thermal resistance of the light source device and improving the heat dissipation performance. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. Referring to FIG. 2, a light source device 20 according to a first embodiment of the present invention includes an insulator 21, a heat conductor 22, a metal conductive layer 23, a plurality of LED chips 24, a metal wire 25, and a transparent package. Body 26. The insulator 21 has a first surface 211 and a second surface 212 opposite to the first surface 211 of the insulator 21. The second surface 212 is formed with a plurality of first through holes 2101. The insulator 21 may be made of plastic. For example, polyphthalamide (polyphthalamide), liquid crystal polymer (LCP), and the like. The heat conductor 22 is a rectangular parallelepiped structure having an upper surface 221, a lower surface 222 opposite the upper surface 221, and a side surface 223 disposed between the upper surface 221 and the lower surface 222. The upper surface 221 and the side surface 223 of the heat conductor 22 are in close contact with the insulator 21. The insulator 21 partially covers the upper surface 221 of the heat conductor 22 such that the upper surface 221 of the heat conductor 22 is partially exposed to the first through hole 2101 of the insulator 21, and the heat conductor 22 and the insulator 21 form a plurality A receiving slot 27 is provided. The lower surface 222 of the heat conductor 22 is exposed to the air. The material used for the heat conductor 22 may be a metal having good thermal conductivity, such as copper or aluminum, or a non-metallic heat conductive material such as tantalum or ceramic. The metal conductive layer 23 is disposed on the second surface 212 of the insulator 21 and has a second through hole 23〇2 extending through the first through hole 21〇1. The metal conductive layer 23 has a flat shape, that is, does not have a bent portion, so that when it is subjected to a relatively large external force, it does not cause a large change due to a large change in its own stress, and the metal conductive layer 23 is improved. Reliability. The metal conductive layer 23 is respectively disposed on the second surface of the insulator 21 by insert-molding, and the heat conductor 22, the insulator 21 and the metal conductive layer 23 are embedded by the embedded layer. The molding technique forms a unitary structure to ensure good electrical insulation between the metal conductive layer and the heat conductor 22, and good thermal conductivity between the heat conductor and the insulator 21. A plurality of LED chips 24 are respectively disposed in the plurality of accommodating grooves 27 . Specifically, each of the LED chips 24 is disposed on a portion of the heat conductor 22 exposed to the second surface 212 of the insulator 21 . Thereby, the thermal connection between the crucible and the thermal conductor 22 is achieved. Here, the positive and negative electrodes of each of the light-emitting diode wafers 24 are electrically connected to the metal conductive layer 23 by two metal wires 25. The light-emitting diode chip 24 can be thermally connected to the heat conductor 22 by bonding, for example, a silver paste, a conductive paste, a non-conductive glue or the like is disposed between the light-emitting diode wafer 24 and the heat conductor 22. Of course, the LED array 24 can also be thermally connected to the heat conductor 22 by other means, such as Eutectic Bonding. It can be understood that 'in order for the light source device 2 to emit white light, the plurality of light emitting diode chips 24 may include at least one blue light emitting diode crystal 200952134 chip, at least one red light emitting diode chip and at least one green color. The light-emitting diode chip, the light emitted by the three different color light-emitting diode chips 24, can form white light. The transparent package 26 is disposed on the second surface 212 of the insulator 21, and is used to cover the LED chip 24 and the metal line 25, so as to prevent the light-emitting diode wafer 24 from being externally used by the metal wire 25. It is oxidized by contact with water vapor. The outer surface 260 of the transparent package 26 can be a flat surface, a convex curved surface or a concave curved surface ′ to change the angle of the light emitted by the light-emitting diode wafer 24 through the outer surface 260, thereby changing the illumination range of the light source device 2 and Light type. Since the transparent package 2 has a plurality of wafer structures, the transparent package 26 has a light mixing effect. The transparent package 26 may further be provided with a light wavelength conversion substance to enable the light source device 20 to be generated. The color of the light, such as a phosphor powder. If the transparent package 26 is doped with yellow phosphor, the LED chip 24 emits light. When the blue light is emitted through the transparent package 26, part of the blue light is converted to yellow. Light, unconverted blue light combined with converted yellow light will form white
一個藍光發光 演色性之白光。 二極體晶片，且搭配黃 光。此外，若該複數個 i二極體（near UV LED) 螢光粉則可產生超高A blue light illuminates the white light of color rendering. Diode wafer with yellow light. In addition, if the plurality of i-diode (near UV LED) phosphors can produce ultra-high
、矽樹脂或其 11 200952134 他電絕緣之透明材料。當然，該透明封裝體26中也可進- 乂刀成有擴政粒子’例如二氣化石夕微粒，用以散射該發光 二極體晶片24發出之光線。 ，優選的，該光源裝置20還包括一個反光杯28,該反光 .杯28設置於該絕緣體21之第二表面212上，並將該透明 封裳體26收谷於該反光杯28内，該透明封裝體％之侧壁 261與該反光杯28相接觸。該複數個發光二極體晶片％ ❹發出之光線經由該容置槽27之開***出，人射至該透明封 襄體26之側壁261上之光線可經由反光杯28反射並從該 透明封裒體26之開口細射出，從而提高了發光二極體晶 片24之出光效率。 可理解的是’藉由嵌入式射出成型技術可使該導熱體 22、絕緣體21、金屬導電層23及反光杯28形成一體結構， 其將大幅提升該光源裝置20之可靠度。 由於發光二極體晶片24直接設置於該導熱體22上並 ©且與該導熱體22形成良好之熱連接，故該發光二極體晶片 24發光時產生之熱量可直接傳導至該導熱體22，再由該導 熱體22將吸收到之熱量傳導至外部系統，從而降低了該發 光二極體晶片24之溫度，提高了該光源裝置2〇之散熱效 率’以及s亥發光一極體晶片24之發光效率與使用壽命。 請參見圖3,於本實施例中，該複數個發光二極體晶片 24之間之電連接可是串聯、並聯或混聯。該複數個發光二 極體晶片24分別藉由兩條金屬線25與金屬導電層23形成 電連接。且將該複數個發光二極體晶片24分成複數個組， 12 200952134 每兩個發光二極體晶片24為一組。該一組中之兩個發光二 極體晶片24相互並聯，不同組之間之發光二極體晶片24 藉由金屬導電層23相互串聯。從而形成先並聯後串聯之混 ^聯結構。 * 當然，該複數個發光二極體晶片24之電連接方式也不 限於先並聯後串聯之混聯結構，也可為串聯、並聯或其他 混聯結構，因此發光二極體晶片24之間之電路設計更具彈 ©性。 請參見圖4,本發明第二實施例提供之一種光源裝置 40，本實施例與第一實施例結構基本相同，其包括絕緣體 41，導熱體42,金屬導電層43,複數個發光二極體晶片44, 金屬線45，及透明封裝體46。 本實施例與第一實施例不同之處在於，該絕緣體41具 有一個第一通孔411，該導熱體42具有一個與該第一通孔 411相對應之第二通孔421，該第一通孔411與該第二通孔 ❹421組合成通孔4120。 熱管（heat pipe) 424内埋於該通孔4120中，且使熱管 424之蒸發端4241内埋於該通孔4120内，熱管424之冷凝 端4242則暴露於空氣中，這樣設置可使本發明之光源裝置 40具有更好之導熱性。 請參見圖5,本發明第三實施例提供之一種光源裝置 50，本實施例與第一實施例結構基本相同，其包括絕緣體 51，導熱體52,金屬導電層53,複數個發光二極體晶片54， 金屬線55，及透明封裝體56。 13 200952134 本實施例與第一實施例不同之處在於，該導熱體52具 有複數個貫穿導熱體52之上表面521及下表面522之通孔 590。每個該通孔590包括一個第一圓柱孔5901及一個第 •二圓柱孔5902，該第一圓柱孔5901形成於該導熱體52之 *上表面521且向該導熱體52内延伸，該第二圓柱孔5902 形成於該導熱體52之下表面522且向該導熱體52内延伸， 且該第二圓柱孔5902之孔徑大於該第一圓柱形孔5901之 義孔徑。 該絕緣體51之部分結構填充該複數個通孔590，且由 於該第二圓柱孔5902之孔徑大於該第一圓柱形孔5901之 孔徑，因此，這種設置可提高導熱體52與絕緣體51之接 觸可靠度。 請參見圖6,本發明第四實施例提供之一種光源裝置 60，本實施例與第一實施例結構基本相同，其包括絕緣體 61，導熱體62,金屬導電層63,複數個發光二極體晶片64， ❹金屬線65，及透明封裝體66。 本實施例與第一實施例不同之處在於，該導熱體62包 括有缺口 691，該缺口 691設置於該導熱體62之周緣處， 且與該導熱體62之第二表面622相接。 該絕緣體61中之部分結構填充該缺口 691，以提高導 熱體62與絕緣體61之接觸可靠度。且該導熱體62之底面 積大於絕緣體之底面積，可藉增加導熱體之底面積以增加 導熱效率。 請參見圖7,本發明第五實施例提供之一種光源裝置 14 200952134 70，本實施例與第一實施例結構基本相同，其包括絕緣體 71，導熱體72,金屬導電層73,複數個發光二極體晶片74, 金屬線75，及透明封裝體76。 • 本實施例與第一實施例不同之處在於，該絕緣體71具 1有複數個收容槽710。 該導熱體72包括複數個承載部7201及一個與該複數 個承載部7201相對之支撐部7202。該支撐部7202設置於 _該絕緣體71中且與該收容槽710相對，該承載部7201嵌 於該收容槽710中且具有部分暴露於該絕緣體71之第二表 面 712。 該導熱體72或嵌設或藉由嵌入式射出成型技術與該 絕緣體71緊密接合。 該金屬導電層73嵌設於該絕緣體71中，且與該導熱 體72相分離。 每個該承載部721上承載有一個發光二極體晶片74, ❹使得該發光二極體晶片74與該導熱體72熱連接。 請參見圖8,本發明第六實施例提供之一種光源裝置 80，本實施例與第一實施例結構基本相同，其包括絕緣體 81，導熱體82,金屬導電層83,複數個發光二極體晶片84， 金屬線85，及透明封裝體86。 本實施例與第一實施例不同之處在於，該導熱體82由 複數個獨立之導熱體單元8201之組合而成。 該複數個發光二極體晶片84分別設置於該複數個容置 槽87中，具體的，每個發光二極體晶片84設置於該導熱 15 200952134 體單元8201之暴露於該絕緣體81之第二表面812之部分， 從而實現與該導熱體82熱連接。 請參見圖9,本發明第七實施例提供之一種光源裝置 • 90，本實施例與第一實施例結構基本相同，其包括絕緣體 • 91，導熱體92,金屬導電層93,複數個發光二極體晶片94, 金屬線95，及透明封裝體96。 本實施例與第一實施例不同之處在於，該導熱體92之 0暴露於該容置槽97底部之部分上設置有一導熱貼片 (Submount)99，該導熱貼片99與該導熱體92之間可藉由黏 合方式或共晶方式接合，該導熱貼片99所用材料可為矽、 氣化銘、氧化艘、二氧化妙、類鐵石（Diamond like Carbon)、 陶兗銘基板（Ceramic Aluminim substrate)等。 發光二極體晶片94藉由形成於發光二極體晶片94之 正負電極上之金屬凸塊98(例如：金凸塊、錫球等）覆晶封 裝（Flip chip)於導熱貼片99上，且該導熱貼片99上具有線 〇路層，該導熱貼片99之線路層與金屬導電層93打線連接。 可理解的是，該光源裝置90之下方可直接與散熱板或 散熱鰭片相連接，減少了印刷電路板（Printed Circuit Board， PCB)或玻璃纖維板（FR4)之使用，從而降低了該光源裝置90 之熱阻’使該光源裝置90導熱效果更好。 综上所述，本發明碟已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式’自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 16 200952134 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1為一種現有光源裝置之截面示意圖。 圖2為本發明第一實施例提供之光源裝置之截面示意 圖3為圖2所示光源裝置之發光二極體晶片相互串並 聯之示意圖。 © 圖4為本發明第二實施例提供之光源裝置之截面示意 圖。 圖5為本發明第三實施例提供之光源裝置之截面示意 圖。 圖6為本發明第四實施例提供之光源裝置之截面示意 圖。 圖7為本發明第五實施例提供之光源裝置之截面 園。 ❹ 圖8為本發明篦丄香#, 圖。 、實施例提供之光源裝置之截面示意 4本發明第七實施例提供之光源裝置之截面示意 【主要元件符號說明】 光源裝置 殼體 光源模組 10 11 12 2〇 ' 40 > 50 ' 60、70 ' 80 ' 90 燈罩 17 13 121200952134 印刷電路板 金屬線路層 發光元件 * 封裝體 • 絕緣體 導熱體 金屬導電層 ❹ 發光二極體晶片 金屬線 透明封裝體 第一表面 第二表面 第一通孔 上表面 下表面 Q 侧面 容置槽 第二通孔 外表面 反光杯 侧壁 通孔 熱管 蒸發端 122 123 124 21 、 41 、 51 、 61 、 71 、 81 、 91 22、 42、52、62、82 23、 43、53、63、73、83、93 24 ' 44 、 54 、 64 、 74 、 84 、 94 25、 45、55、65、75、85、95 26、 46 Λ 56、66、76、86、96 211 212、622、712、812 2101 、 411 221 、 521 222、522 223 27 、 87 、 97 2302、421 260 28 261 4120、590 424 4241 18 200952134 冷凝端 4242 第一圓柱形孔 5901 第二圓柱孔 5902 缺口 691 導熱體 72 收容槽 710 承載部 7201 、 721 支撐部 7202 導熱體單元 8201 導熱體 92 導熱貼片 99 金屬凸塊 98 19, enamel resin or its 11 200952134 he is electrically insulating transparent material. Of course, the transparent package 26 can also be smashed into expanded particles, such as two gas fossil particles, for scattering the light emitted by the LED wafer 24. Preferably, the light source device 20 further includes a reflector cup 28 disposed on the second surface 212 of the insulator 21 and surrounding the transparent sealing body 26 in the reflector cup 28, The side wall 261 of the transparent package % is in contact with the reflector cup 28. The light emitted from the plurality of LEDs is emitted through the opening of the receiving groove 27, and the light that is incident on the side wall 261 of the transparent sealing body 26 can be reflected by the reflective cup 28 and sealed from the transparent cover. The opening of the body 26 is finely projected, thereby improving the light extraction efficiency of the LED array 24. It can be understood that the thermal conductor 22, the insulator 21, the metal conductive layer 23 and the reflector cup 28 can be integrally formed by the embedded injection molding technique, which will greatly improve the reliability of the light source device 20. Since the light-emitting diode chip 24 is directly disposed on the heat-conducting body 22 and forms a good thermal connection with the heat-conducting body 22, the heat generated when the light-emitting diode chip 24 emits light can be directly transmitted to the heat-conducting body 22 Then, the heat conductor 22 conducts the absorbed heat to the external system, thereby lowering the temperature of the light-emitting diode wafer 24, improving the heat dissipation efficiency of the light source device 2, and the s-light emitting body wafer 24 Luminous efficiency and service life. Referring to FIG. 3, in the embodiment, the electrical connection between the plurality of LED chips 24 may be serial, parallel or hybrid. The plurality of light emitting diode chips 24 are electrically connected to the metal conductive layer 23 by two metal wires 25, respectively. And dividing the plurality of LED chips 24 into a plurality of groups, 12 200952134, each of the two LED chips 24 being a group. Two of the light emitting diode chips 24 in the set are connected in parallel with each other, and the light emitting diode chips 24 between the different groups are connected in series with each other by the metal conductive layer 23. Thereby, a hybrid structure in which the first parallel connection and the series connection are formed is formed. * Of course, the electrical connection manner of the plurality of LED chips 24 is not limited to the hybrid structure of the parallel connection and the series connection, and may be a series, parallel or other hybrid structure, so that the LEDs 24 are between the LEDs. The circuit design is more elastic. Referring to FIG. 4, a light source device 40 according to a second embodiment of the present invention is substantially the same as the first embodiment, and includes an insulator 41, a heat conductor 42, a metal conductive layer 43, and a plurality of light emitting diodes. Wafer 44, metal lines 45, and transparent package 46. The first embodiment is different from the first embodiment in that the insulator 41 has a first through hole 411, and the heat conductor 42 has a second through hole 421 corresponding to the first through hole 411. The hole 411 and the second through hole 421 are combined into a through hole 4120. A heat pipe 424 is buried in the through hole 4120, and the evaporation end 4241 of the heat pipe 424 is buried in the through hole 4120, and the condensation end 4242 of the heat pipe 424 is exposed to the air. The light source device 40 has better thermal conductivity. Referring to FIG. 5, a light source device 50 according to a third embodiment of the present invention is substantially the same as the first embodiment, and includes an insulator 51, a heat conductor 52, a metal conductive layer 53, and a plurality of light emitting diodes. Wafer 54, metal line 55, and transparent package 56. 13 200952134 This embodiment differs from the first embodiment in that the heat conductor 52 has a plurality of through holes 590 penetrating the upper surface 521 and the lower surface 522 of the heat conductor 52. Each of the through holes 590 includes a first cylindrical hole 5901 and a second cylindrical hole 5902. The first cylindrical hole 5901 is formed on the upper surface 521 of the heat conductor 52 and extends into the heat conductor 52. The second cylindrical hole 5902 is formed on the lower surface 522 of the heat conductor 52 and extends into the heat conductor 52, and the second cylindrical hole 5902 has a larger aperture than the first cylindrical hole 5901. A portion of the structure of the insulator 51 fills the plurality of through holes 590, and since the aperture of the second cylindrical hole 5902 is larger than the aperture of the first cylindrical hole 5901, the arrangement improves the contact between the thermal conductor 52 and the insulator 51. Reliability. Referring to FIG. 6, a light source device 60 according to a fourth embodiment of the present invention is substantially the same as the first embodiment, and includes an insulator 61, a heat conductor 62, a metal conductive layer 63, and a plurality of light emitting diodes. The wafer 64, the base metal wire 65, and the transparent package 66. The present embodiment is different from the first embodiment in that the heat conductor 62 includes a notch 691 disposed at a periphery of the heat conductor 62 and contacting the second surface 622 of the heat conductor 62. A part of the structure of the insulator 61 fills the notch 691 to improve the contact reliability of the heat conductor 62 and the insulator 61. Moreover, the bottom surface of the heat conductor 62 is larger than the bottom area of the insulator, and the bottom surface area of the heat conductor can be increased to increase the heat conduction efficiency. Referring to FIG. 7, a light source device 14 200952134 70 according to a fifth embodiment of the present invention is substantially the same as the first embodiment, and includes an insulator 71, a heat conductor 72, a metal conductive layer 73, and a plurality of light emitting diodes. The polar body wafer 74, the metal line 75, and the transparent package 76. The difference between this embodiment and the first embodiment is that the insulator 71 has a plurality of receiving slots 710. The heat conductor 72 includes a plurality of carrying portions 7201 and a supporting portion 7202 opposite to the plurality of carrying portions 7201. The support portion 7202 is disposed in the insulator 71 opposite to the receiving slot 710. The receiving portion 7201 is embedded in the receiving slot 710 and has a second surface 712 partially exposed to the insulator 71. The heat conductor 72 is either inlaid or intimately coupled to the insulator 71 by an embedded injection molding technique. The metal conductive layer 73 is embedded in the insulator 71 and is separated from the heat conductor 72. Each of the carrying portions 721 carries a light emitting diode wafer 74 such that the light emitting diode wafer 74 is thermally coupled to the heat conductor 72. Referring to FIG. 8, a light source device 80 according to a sixth embodiment of the present invention is substantially the same as the first embodiment, and includes an insulator 81, a heat conductor 82, a metal conductive layer 83, and a plurality of light emitting diodes. Wafer 84, metal lines 85, and transparent package 86. This embodiment differs from the first embodiment in that the heat conductor 82 is composed of a combination of a plurality of independent heat conductor units 8201. The plurality of LED chips 84 are respectively disposed in the plurality of accommodating grooves 87. Specifically, each of the illuminating diode chips 84 is disposed on the heat conducting 15 200952134 body unit 8201 and exposed to the insulator 81. Portion of surface 812 to achieve thermal connection with the thermal conductor 82. Referring to FIG. 9, a light source device of the seventh embodiment of the present invention is substantially the same as the first embodiment, and includes an insulator, a heat conductor 92, a metal conductive layer 93, and a plurality of light-emitting diodes. A polar body wafer 94, a metal line 95, and a transparent package 96. The difference between the present embodiment and the first embodiment is that a portion of the heat conductor 92 exposed to the bottom of the receiving groove 97 is provided with a heat-conductive patch (Submount) 99, and the heat-conducting patch 99 and the heat-conducting body 92. The bonding can be performed by bonding or eutectic. The material of the thermal conductive sheet 99 can be enamel, gasification, oxidized, oxidized, diamond like carbon, ceramic Aluminim. Substrate). The light-emitting diode chip 94 is flip-chip mounted on the heat-conductive patch 99 by a metal bump 98 (for example, a gold bump, a solder ball, or the like) formed on the positive and negative electrodes of the light-emitting diode wafer 94. The thermal conductive patch 99 has a wire routing layer, and the circuit layer of the thermal conductive patch 99 is wire-connected to the metal conductive layer 93. It can be understood that the light source device 90 can be directly connected to the heat dissipation plate or the heat dissipation fins, thereby reducing the use of a printed circuit board (PCB) or a fiberglass board (FR4), thereby reducing the light source device. The thermal resistance of 90 makes the light source device 90 more thermally conductive. In summary, the disc of the present invention has met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, which is not intended to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a conventional light source device. 2 is a schematic cross-sectional view of a light source device according to a first embodiment of the present invention. FIG. 3 is a schematic view showing a light-emitting diode chip of the light source device of FIG. Fig. 4 is a schematic cross-sectional view showing a light source device according to a second embodiment of the present invention. Fig. 5 is a schematic cross-sectional view showing a light source device according to a third embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing a light source device according to a fourth embodiment of the present invention. Fig. 7 is a cross-sectional view of a light source device according to a fifth embodiment of the present invention. ❹ Figure 8 is a view of the musk # of the present invention. Sectional representation of the light source device provided by the embodiment. FIG. 4 is a cross-sectional view of a light source device according to a seventh embodiment of the present invention. [Main component symbol description] Light source device housing light source module 10 11 12 2〇' 40 > 50 ' 60. 70 ' 80 ' 90 lampshade 17 13 121200952134 printed circuit board metal circuit layer light-emitting element* package body • insulator thermal conductor metal conductive layer 发光 light-emitting diode wafer metal wire transparent package first surface second surface first through-hole upper surface Lower surface Q Side accommodating groove Second through hole Outer surface Reflector side wall Through hole Heat pipe evaporation end 122 123 124 21 , 41 , 51 , 61 , 71 , 81 , 91 22 , 42 , 52 , 62 , 82 23 , 43 , 53, 63, 73, 83, 93 24 ' 44 , 54 , 64 , 74 , 84 , 94 25 , 45 , 55 , 65 , 75 , 85 , 95 26 , 46 Λ 56 , 66 , 76 , 86 , 96 211 212, 622, 712, 812 2101, 411 221, 521 222, 522 223 27, 87, 97 2302, 421 260 28 261 4120, 590 424 4241 18 200952134 condensing end 4242 first cylindrical hole 5901 second cylindrical hole 5902 notch 691 Thermal Conductor 72 Containment 7201 bearing portion 710, the supporting portion 721 7202 8201 thermally conductive heat conductor unit 92 of heat conducting patches 99 metal bumps 9819