200950646 九、發明說明： 【發明所屬之技術領域j 本發明涉及一種電子裝置殼體及其製造方法。 * 【先前技術】 * 隨著電子技術之迅速發展，筆記本電腦、移動電話、 個人數位助理（PDA)等電子裝置得到了越來越廣泛地應 用。同時，人們對於電子裝置之外觀要求亦越來越高。電 子裝置殼體一般由金屬或塑膠製成，由於金屬殼體具有強 ❹ 度高、電磁遮罩效果好等特點而被廣泛應用於電子裝置 中。 當採用金屬殼體時’為了防止電磁遮罩影響信號收 發，電子裝置殼體之天線蓋部位通常採用塑膠製造，然後 藉由卡勾卡合或鉚接等方式將塑膠製造之天線蓋固定於 金屬殼體上即可。惟’卡勾卡合及鉚接之方式容易產生間 隙大、易鬆動等缺陷’而影響產品強度。隨著電子產品日 ❹趨輕、薄、短、小之發展趨勢，電子裝置殼體之厚度亦將 越來越趨向於薄型化，當電子裝置殼體之厚度減小到一定 程度，採用卡勾卡合及鉚接之方式容易產生斷裂應力而影 響產品之強度。上述結合方式之缺陷及局限性會伴隨電子 產品薄型化之趨勢愈發突出。 【發明内容】 鑒於上述狀況，有必要提供一種電子裝置殼體及其製 造方法，尤其係一種強度高且適於薄型化設計之電子裝置 般體及其製造方法。 6 200950646 一種電子裝置殼體，包括金屬本體及塑膠天線蓋，該 金屬本體與塑膠天線蓋採用嵌入成型技術一體成型，且該 金屬本體與該塑膠天線蓋結合處形成至少一扣合結構。 • 一種電子裝置殼體之製造方法，包括以下步驟：提供 一金屬本體且該金屬本體之一側邊處形成至少一扣合 部；將該金屬本體作為嵌件，藉由嵌入成型技術將一塑膠 天線蓋與該金屬本體一體成型，同時該金屬本體與該塑膠 天線蓋結合處形成至少一扣合結構。 ❹ 上述電子裝置殼體之金屬本體與塑膠天線蓋之結合 處形成有至少一扣合結構，從而使得金屬本體與塑膠天線 蓋具有較高之結合強度。另，由於嵌入成型技術可以滿足 較為多樣化之產品設計需求，適於製造具有較薄厚度之電 子裝置殼體，同時金屬本體與塑膠天線蓋結合處之扣合結 構可保證較薄之電子裝置殼體具有較高之強度。 【實施方式】 下面將結合附圖及較佳實施例對本發明之電子裝置 ❿ 殼體及其製造方法作進一步之詳細說明。 請參見圖1，所示為本發明較佳實施例之電子裝置殼 體10,其包括一金屬本體11及一塑膠天線蓋12。 金屬本體11大體為一矩形金屬蓋板，其一側邊設置有 複數扣合部110,用以於成型過程中與塑膠天線蓋12緊密 扣合而形成扣合結構。金屬本體11採用合金材料製造，優 選採用鎂合金、銘合金或鈦合金製造。 塑膠天線蓋12大體為一長條狀蓋板，其可成型於金屬 7 200950646 本體11設置有扣合部110之一侧邊處。塑膠天線蓋12之材料 要求與金屬本體11之材料具有較好之融合性，例如具有較 小之縮水率及與金屬本體11之材料近似之線膨脹係數。 * 故，塑膠天線蓋12優選採用液晶高分子聚合物（LCP)、聚 - 苯硫醚（PPS)、聚對苯二曱酸丁二醇酯（PBT)等工程塑料 製造。 請同時參見圖2與圖3,電子裝置殼體10之金屬本體11 與塑膠天線蓋12之結合處貼合緊密，無間隙存在。同時， 〇 為了增強金屬本體11與塑膠天線蓋12之結合強度，其結合 處形成有第一扣合結構13、第二扣合結構14、第三扣合結 構15以及第四扣合結構16。 該電子裝置殼體10之製造方法包括以下步驟： (1) 提供一金屬本體11且金屬本體11之一侧邊處形成 至少一扣合部Π0。提供金屬本體u之方法可為：利用鑄 造、擠出、鍛造、沖壓等各種金屬生產方法製備金屬本體 11 ’優選採用壓鑄方法製備該金屬本體11。扣合部110可採 用數控機床(Computer Number Contro卜CNC)加工形成， 亦可於採用鑄造方式製備金屬本體η之過程中直接形成。 (2) 將金屬本體11作為嵌件，藉由嵌入成型技術將一 塑膠天線蓋12與該金屬本體u—體成型，同時金屬本體工工 與塑膠天綠蓋12結合處形成至少一扣合結構。即將該金屬 本體11作為後件放入射出成型模具之模腔内 ，然後將熔融 之塑膠注入射出成型模具之模腔内，熔融之塑膠與金屬本 體11接合固化即形成塑膠天線蓋12。同時，溶融之塑膠注 8 200950646 入扣合部110内或包覆扣合部110，而於金屬本體與塑膠 天線蓋12之結合處形成該第一扣合結構13、第二扣合結構 14、第三扣合結構15以及第四扣合結構16。 * 可以理解，步驟（1)後，可首先對金屬本體11進行打磨 」 去除毛邊，並對金屬本體11進行化學處理，如微弧氧化、 陽極氧化等’用以於金屬本體11與塑膠天線蓋之結合面 上形成一層接合膜，從而增強其結合力。步驟(2)後，可對 一體成型後之金屬本體11及塑膠天線蓋12進行打磨，去除 © 塑膠天線蓋12之澆口及毛邊。為了使電子裝置殼體1〇之外 形更為美觀，還可對電子裝置殼體10之外表面進行塗裝。 請同時參見圖3與圖4，第一扣合結構13藉由以下方式 形成·採用數控機床於金屬本體11之一側邊處加工形成至 少一階梯孔111，階梯孔111位於電子裝置殼體10内表面一 端之孔徑大於位於電子裝置殼體10外表面一端之孔徑；嵌 入成型時’熔融之塑膠流入階梯孔111中並將階梯孔111充 滿，冷卻後即於金屬本體11與塑膠天線蓋12之結合處形成 ❹ 第一扣合結構13。第一扣合結構13可實現塑膠天線蓋12相 對於金屬本體於X、Y、z三方向上之定位。 請同時參見圖3與圖5,第二扣合結構14藉由以下方式 形成：採用數控機床於金屬本體11之一侧邊處加工形成至 少一卡勾112 ;嵌入成型時’熔融之塑膠包覆該卡勾112， 冷卻後即於金屬本體11與塑膠天線蓋12之結合處形成第 二扣合結構14。第二扣合結構14可實現塑膠天線蓋12相對 於金屬本體於X、Y二方向上之定位。 9 200950646 請同時參見圖3與圖6,第三扣合結構15藉由以下方式 形成··採用數控機床於金屬本體11之一側邊處加工形成至 少一通孔113 ;嵌入成型時，熔融之塑膠流入通孔113内並 ' 將通孔113充滿，冷卻後即於金屬本體11與塑膠天線蓋12 - 之結合處形成第三扣合結構15。第三扣合結構15可實現塑 膠天線蓋12相對於金屬本體11於X、Y、Z三方向上之定位。 請同時參見圖3與圖7,第四扣合結構16藉由以下方式 形成：採用數控機床於金屬本體11之一侧邊處加工形成至 ❹ 少一凸台114，該凸台114上形成有二卡勾1141 ;嵌入成型 時，熔融之塑膠包覆該凸台114之外表面，並包覆二卡勾 1141，冷卻後即於金屬本體11與塑膠天線蓋12之結合處形 成第四扣合結構16。第四扣合結構16可實現塑膠天線蓋12 相對於金屬本體11於X、Υ、Ζ三方向上之定位。 可以理解，階梯孔111、卡勾112、通孔113以及凸台114 除採用數控機床加工形成以外，亦可於採用鑄造方式製備 _ 金屬本體11之過程中直接形成。200950646 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic device housing and a method of manufacturing the same. * [Prior Art] * With the rapid development of electronic technology, electronic devices such as notebook computers, mobile phones, and personal digital assistants (PDAs) have become more and more widely used. At the same time, people are increasingly demanding the appearance of electronic devices. The electronic device housing is generally made of metal or plastic, and is widely used in electronic devices due to its high strength and good electromagnetic shielding effect. When a metal casing is used, 'in order to prevent the electromagnetic shielding from affecting signal transmission and reception, the antenna cover portion of the electronic device casing is usually made of plastic, and then the plastic antenna cover is fixed to the metal casing by hooking or riveting. It can be physically. However, the manner in which the hooks are engaged and riveted is likely to cause defects such as large gaps and looseness, which affect the strength of the product. As electronic products become lighter, thinner, shorter, and smaller, the thickness of electronic device housings will become thinner and thinner. When the thickness of the electronic device housing is reduced to a certain extent, hooks are used. The manner of snapping and riveting is prone to break stress and affects the strength of the product. The shortcomings and limitations of the above-mentioned combination methods are accompanied by the trend of thinning electronic products. SUMMARY OF THE INVENTION In view of the above circumstances, it is necessary to provide an electronic device housing and a method of manufacturing the same, and more particularly to an electronic device body having a high strength and being suitable for a thin design and a method of manufacturing the same. 6 200950646 An electronic device housing includes a metal body and a plastic antenna cover. The metal body and the plastic antenna cover are integrally formed by insert molding technology, and the metal body and the plastic antenna cover are combined to form at least one fastening structure. A method of manufacturing an electronic device housing, comprising the steps of: providing a metal body and forming at least one fastening portion at one side of the metal body; using the metal body as an insert, inserting a plastic by insert molding technology The antenna cover is integrally formed with the metal body, and the metal body and the plastic antenna cover are combined to form at least one fastening structure.至少 The combination of the metal body of the electronic device housing and the plastic antenna cover is formed with at least one fastening structure, so that the metal body and the plastic antenna cover have a high bonding strength. In addition, since the insert molding technology can meet a variety of product design requirements, it is suitable for manufacturing an electronic device housing having a relatively thin thickness, and the fastening structure of the joint between the metal body and the plastic antenna cover can ensure a thin electronic device housing. The body has a higher strength. [Embodiment] Hereinafter, an electronic device casing and a method of manufacturing the same according to the present invention will be further described in detail with reference to the accompanying drawings and preferred embodiments. Referring to FIG. 1, an electronic device housing 10 according to a preferred embodiment of the present invention includes a metal body 11 and a plastic antenna cover 12. The metal body 11 is generally a rectangular metal cover plate, and a plurality of fastening portions 110 are disposed on one side thereof for tightly engaging the plastic antenna cover 12 during the molding process to form a fastening structure. The metal body 11 is made of an alloy material, preferably made of a magnesium alloy, an alloy or a titanium alloy. The plastic antenna cover 12 is generally a long strip-shaped cover which can be formed on the metal 7 200950646 The body 11 is provided with one side of the fastening portion 110. The material of the plastic antenna cover 12 is required to have a good fusion with the material of the metal body 11, for example, a small shrinkage ratio and a linear expansion coefficient similar to that of the metal body 11. * Therefore, the plastic antenna cover 12 is preferably made of an engineering plastic such as liquid crystal polymer (LCP), polyphenylene sulfide (PPS), or polybutylene terephthalate (PBT). Referring to FIG. 2 and FIG. 3 simultaneously, the joint between the metal body 11 of the electronic device housing 10 and the plastic antenna cover 12 is closely attached, and no gap exists. Meanwhile, in order to enhance the bonding strength between the metal body 11 and the plastic antenna cover 12, the first fastening structure 13, the second fastening structure 14, the third fastening structure 15, and the fourth fastening structure 16 are formed at the joint. The manufacturing method of the electronic device housing 10 includes the following steps: (1) A metal body 11 is provided and at least one fastening portion Π0 is formed at one side of the metal body 11. The method of providing the metal body u may be: preparing the metal body by various metal production methods such as casting, extrusion, forging, stamping, etc. The metal body 11 is preferably prepared by a die casting method. The fastening portion 110 can be formed by a numerical control machine tool (Computer Number Controb CNC), or can be directly formed during the process of preparing the metal body η by casting. (2) using the metal body 11 as an insert, forming a plastic antenna cover 12 and the metal body u by insert molding technology, and forming at least one fastening structure at the joint of the metal body worker and the plastic green cover 12 . That is, the metal body 11 is placed as a rear member into the cavity of the molding die, and then the molten plastic is injected into the cavity of the injection molding die, and the molten plastic is bonded to the metal body 11 to form a plastic antenna cover 12. At the same time, the melted plastic note 8 200950646 enters the fastening portion 110 or covers the fastening portion 110, and the first fastening structure 13 and the second fastening structure 14 are formed at the junction of the metal body and the plastic antenna cover 12. The third fastening structure 15 and the fourth fastening structure 16 . * It can be understood that after step (1), the metal body 11 can be first polished "removing the burrs and chemically treating the metal body 11, such as micro-arc oxidation, anodizing, etc." for the metal body 11 and the plastic antenna cover A bonding film is formed on the bonding surface to enhance the bonding force. After the step (2), the integrally formed metal body 11 and the plastic antenna cover 12 can be polished to remove the gate and the burr of the © plastic antenna cover 12. In order to make the appearance of the electronic device housing 1b more beautiful, the outer surface of the electronic device housing 10 can also be painted. Referring to FIG. 3 and FIG. 4 , the first fastening structure 13 is formed by forming a plurality of stepped holes 111 formed on one side of the metal body 11 by using a numerical control machine tool, and the stepped holes 111 are located in the electronic device housing 10 . The aperture at one end of the inner surface is larger than the aperture at one end of the outer surface of the electronic device housing 10; during the molding, the molten plastic flows into the stepped hole 111 and fills the stepped hole 111, and after cooling, the metal body 11 and the plastic antenna cover 12 are The joint is formed into a first fastening structure 13. The first fastening structure 13 can realize the positioning of the plastic antenna cover 12 in the three directions of X, Y and z with respect to the metal body. Referring to FIG. 3 and FIG. 5 simultaneously, the second fastening structure 14 is formed by processing at least one hook 112 on one side of the metal body 11 by using a numerical control machine tool; The hook 112 forms a second fastening structure 14 at the junction of the metal body 11 and the plastic antenna cover 12 after cooling. The second fastening structure 14 can position the plastic antenna cover 12 in the X and Y directions with respect to the metal body. 9 200950646 Please refer to FIG. 3 and FIG. 6 at the same time, the third fastening structure 15 is formed by the following method: forming at least one through hole 113 at one side of the metal body 11 by using a numerical control machine tool; It flows into the through hole 113 and fills the through hole 113. After cooling, the third fastening structure 15 is formed at the junction of the metal body 11 and the plastic antenna cover 12-. The third fastening structure 15 can realize the positioning of the plastic antenna cover 12 in the three directions of X, Y and Z with respect to the metal body 11. Referring to FIG. 3 and FIG. 7 simultaneously, the fourth fastening structure 16 is formed by machining a side surface of the metal body 11 to at least one boss 114 by using a numerical control machine tool. The boss 114 is formed on the boss 114. The second hook 1141; during the insert molding, the molten plastic covers the outer surface of the boss 114, and is covered with the two hooks 1141. After cooling, the fourth buckle is formed at the joint of the metal body 11 and the plastic antenna cover 12. Structure 16. The fourth fastening structure 16 can realize the positioning of the plastic antenna cover 12 in the three directions of X, Υ and 相对 with respect to the metal body 11. It can be understood that the stepped hole 111, the hook 112, the through hole 113, and the boss 114 can be formed directly in the process of preparing the metal body 11 by using a CNC machine tool.
G 由於電子裝置殼體10之金屬本體11與塑膠天線蓋12 之結合處形成有複數第一扣合結構13、第二扣合結構14、 第三扣合結構15以及第四扣合結構16，從而使得金屬本體 11與塑膠天線蓋12具有較高之結合強度。且由於嵌入成型 技術可以滿足較為多樣化之產品設計需求，適於製造具有 較薄厚度之電子裝置殼體，同時金屬本體11與塑膠天線蓋 12結合處之第一扣合結構13、第二扣合結構14、第三扣合 結構15以及第四扣合結構16可保證較薄之電子裝置殼體 200950646 具有較高之強度。 可以理解，根據產品之設計要求，金屬本體π與塑膠 天線盍12結合處可選用第一扣合結構13、第二扣合結構 14、第三扣合結構15以及第四扣合結構16中之至少一種或 其組合。同時，扣合部110除階梯孔111、卡勾112、通孔n3 以及凸台114以外還可變更為其他結構，以滿足產品多樣 化之結合方式。G, a plurality of first fastening structures 13, a second fastening structure 14, a third fastening structure 15, and a fourth fastening structure 16 are formed at a joint of the metal body 11 of the electronic device housing 10 and the plastic antenna cover 12, Thereby, the metal body 11 and the plastic antenna cover 12 have a high bonding strength. And because the insert molding technology can meet the diversified product design requirements, it is suitable for manufacturing the electronic device housing having a relatively thin thickness, and the first fastening structure 13 and the second buckle at the joint of the metal body 11 and the plastic antenna cover 12 The composite structure 14, the third fastening structure 15 and the fourth fastening structure 16 ensure a relatively high strength of the thin electronic device housing 200950646. It can be understood that, according to the design requirements of the product, the first fastening structure 13 , the second fastening structure 14 , the third fastening structure 15 and the fourth fastening structure 16 can be selected at the joint of the metal body π and the plastic antenna 盍 12 . At least one or a combination thereof. At the same time, the engaging portion 110 can be changed to other structures in addition to the stepped hole 111, the hook 112, the through hole n3, and the boss 114 to satisfy the diversified product combination.
❹ 圖 综上所述，本發明確已符合發明專利要件，爰依法提 出專利申請。惟， 舉凡熟悉本案技藝 效修飾或變化，皆 【圖式簡單說明】 以上所述者僅為本發明之較佳實施例， 之人士，於援依本案發明精神所作之等 應包含於以下之申請專利範圍内。 圖1係本發明電子裝置殼體之立體分解圖。 圖2係本發明電子裝置殼體之立體組装圖。 =3係圖2所示電子裝置殼體另一方向之局部放大圖。 示電子裝置殼體沿1ν-ιν線之局部剖視圖。 斤示電子裝置殼體沿v_v線之局部剖視圖。 示電子裝置殼體沿VI-VI線之局部剖視圖。 系圖3所示電子裝置殼體沿VII领線之局部剖視 10 金屬本體 11 110 塑膠天線蓋 12 13 第二扣合結構 14 11 【主要元件符號說明 電子裝置殼體 扣合部 第一扣合結構 200950646 第三扣合結構 15 第四扣合結構 16 階梯孔 111 卡勾 112 通孔 113 凸台 114 卡勾 1141In summary, the present invention has indeed met the requirements of the invention patent and has filed a patent application in accordance with the law. However, if you are familiar with the modification or change of the technical effects of the present invention, the following is a brief description of the preferred embodiment of the present invention, and the person who is in the spirit of the invention according to the invention should be included in the following application. Within the scope of the patent. 1 is an exploded perspective view of a housing of an electronic device of the present invention. 2 is an assembled, isometric view of the electronic device housing of the present invention. = 3 is a partial enlarged view of the other direction of the electronic device housing shown in FIG. A partial cross-sectional view of the electronic device housing along the line 1ν-ιν. A partial cross-sectional view of the electronic device housing along the line v_v. A partial cross-sectional view of the electronic device housing along line VI-VI. Figure 3 is a partial cross-sectional view of the electronic device housing along the VII collar. 10 Metal body 11 110 Plastic antenna cover 12 13 Second fastening structure 14 11 [Main component symbol description First fastening of the electronic device housing fastening portion Structure 200950646 Third fastening structure 15 Fourth fastening structure 16 Stepped hole 111 Card hook 112 Through hole 113 Boss 114 Card hook 1141
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