200949963 六、發明說明： 【發明所屬之技術續域】 技術領域 '$ I發㈣有關於種具有透光部之電元件之密封方法 有透光部之電元件，特別是有關於-種具有透光部之 電元件之挽封方法、具有透光部之電元件及適用於前述密 封方法之熱硬化性樹脂組成物，可構造成電元件内之電裝 _ 以效地找保護’具有優異的壽命特性，並構造成有效 —1地進行光的流入，具有優異的裝置特性者，可改善電元件 - 之強度，特別是，適用於本發明之密封用熱硬化性樹脂組 成物係黏度低’具有能適用在〇DF(〇ne Drop Fill)步驟(液晶 滴入步驟），塗佈量的控制容易，塗佈速度亦快速等製程上 的優點，用在製程的費用少，可縮短硬化時間，光穿透度 特f生優異’亦可適用在頂部發射(Top emission)方式之顯示 15器’可截斷密封時流入面板之内部之氣體及水分，亦可適 ❷ 用在採用彩色濾光片之面板，在元件無劣化之狀態下可製 作元件’硬化溫度低，可有效地保護不耐熱之物質，同時 實現足夠的接著強度及防止著色等之特性，製造成本低， 且經濟性優異。 20 C 椅】 背景技術 一般，OLED或集成該元件之顯示器面板、LED或集成 該元件之顯示器面板、或者是如太陽電池般之電元件係具^ 有透光部，使其内部所存在之電裝置所產生之光線朝外部 3 200949963 傳遞’或射卜部的錢傳遞至㈣部所存在之 等兩種中任一者係於進行光堍值 、置其 或透光者，在製造具有如此中而發光或吸光 士 w古收 電裝置及透光部之電元件之過 包括有將上部輯構件及下部密封構件密封之料 來說，對於作為前述電元件之-之顯示器 凡件 f之顯^面板係與現㈣顯_面板相 1〇 15 2〇 比，可以較薄的厚度製作面板，在製作面板時製程上的 容易性佳，以具有作為下_世代顯示器之可挽性顯示器之 製程上的適合性，因此作為下-世次顯示器而受到矚目。 又’ OLED顯不器非常明亮，且具有優異的彩色對比(⑽㈣ 及寬廣的視野角度(viewing angle)，具備高亮度及輕量性 (重量輕）、低的驅動電壓等很多長處。 惟’ 〇LED元件對水分極弱，金屬電極與有機物EL層 間之接觸面㈣水分的_而造成_，金屬電極與氧及 水分反應而容易劣化’藉此特生暗點(缝8_、像素毅 紋(pixel shrinkage)等，有使產率降低之缺點。 為解決如此課題，而創作一種在元件製造時使用之密 封方法，該方法在製作元件時，沿著元件的外部，在框架 (frame)形態下塗佈樹脂組成物，將除氣組成物安裝在元件 的上面，以製作元件者，在框架(fmme)形態下在元件的外 部塗佈樹脂組成物來製作元件時，在硬化反應時所產生的 氣體會流入面板内部’不能形成完善的密封，造成暗點(dark spot)、像素皺紋(pixel shrinkage)等衍生，不研究開發出透 200949963 ’ 明除氣物質，就無法適用頂部發射(Top emission)方式。 - 又’使用紅色(Red)、綠色（Green)、藍色(Blue)三種發 光物質而製造之0LED元件，藍色（Blue)的壽命與紅色 (Red)、綠色(Green)相比壽命較短，在顯示器的使用時間増 5加時，因藍色像素(Blue pixel)的劣化，而會觀察到有影像 殘留之現象。 為解決如此課題，而創作一種技術，即，將三種發光 0 物質形成為3層’或者是將三種發光物質溶解在溶媒後製作 几件，使其發出白光(white light)，通過彩色濾光片，以實 10現紅色(Red)、綠色(Green)、藍色(Blue)者。惟，如此製作 元件時，廣為使用之光硬化型樹脂組成物係使光源通過彩 . 色渡光片而到達組成物者’使得組成物不能吸收UV，而不 • ' 能適用。 由如此層面來看時，對於將具有透光部之多種電元件 15能有效地密封之技術開發以及藉此製造劃時代地改善耐久 φ 性之電元件之開發需求仍然迫切。 t發明内容:J 發明概要 發明欲解決之課題 20 因此’本發明之目的係於提供一種具有透光部之電元 件之密封方法及具有透光部之電元件，其構造成有效地保 護電元件内之電裝置，具有優異的壽命特命，使光的流入 有效地進行’具有優異的裝置特性，可改善電元件之強度， 特別是可適用於〇DF(One Drop Fill)步驟，具有塗佈量之控 5 200949963 制容易，塗佈速度亦快速等製程上的優點，使花費在製程 的費用少，可縮短硬化時間，光穿透度特性優異，亦適用 於頂部發射(Top emission)方式之顯示器，可截斷密封時流 入面板内部之氣體及水分，亦適用於採用彩色濾光片之面 5板，可在元件無劣化之狀態下製作元件，硬化溫度低，可 有效地保護不耐熱之物質，可同時實現足夠的接著強度及 防止著色等特性，製造成本低，且經濟性佳。 又，本發明之另一目的係於提供一種密封用熱硬化性 樹脂組成物，其黏度低，適用於〇DF(〇neDr〇pFm)步驟， 1〇具有塗佈量之控制容易，塗佈速度亦快速等製程上的優 點，使花費在製程的費用少，可縮短硬化時間，光穿透度 特〖生優異，亦適用於頂部發射（T〇p emissi〇n)方式之顯示 器，可戴斷密封時流入面板内部之氣體及水分，亦適用於 採用衫色濾光片之面板，可在元件無劣化之狀態下製作元 15件，硬化溫度低，可有效地保護不耐熱之物質，同時可實 現足夠的接著強度及防止著色等特性，製造成本低，且緩 濟性佳。 用以解決課題之手段 為達成前述目的，本發明係提供一種具有透光部之電 2〇 7L件之φ封方法，其係將下部密封構件與上部密封構件接 合而形成之具有透光部之電元件密封之方法，包含有以下 步驟，即：⑷以熱硬化性樹脂組成物全面地塗佈於上部密 封構件之接合前最終下面或下部密封構件之接合前最终上 面，（b)在將上部密封構件之塗佈面與下部密封構件之最终 200949963 上面或上部密封構件之最終下面與下部密封構件之 相接之狀態下將上部密封構件與下部密封構件接合 對前述業已接合之結合體加熱，使熱硬化性樹脂組成 化〇 5 &，本發明係提供-種具有透光部之電元件，其包含 有下部密封構件；與前述下部密封構件相隔之狀態下而位 於前述下部密封構件之上部之上部密封構件；位於前述下 2密封構件與前述上部密封構件之間之電it件；及充填於 前述上部密封構件與前述下部密封構件之接合面之間，且 1〇將前述電元件包圍在内，將前述上部密封構件與前述下部 密封構件接合之熱硬化性樹脂組成物之硬化體層，且使前 述熱硬化性樹脂組成物之硬化體層形成透光部之部分或全 部。 又，本發明係提供一種密封用熱硬化性樹脂組成物， 15其係於電元件或光元件之密封用樹脂組成物中，包含有： ⑻環氧樹脂25〜90重量份；⑻熱硬化劑9 7〇重量份；及，（c) 硬化促進劑0.1〜5重量份，且黏度為1〇_3〇〇〇cps(25C>c下)。 發明效果 依本發明之具有透光部之電元件及如此電元件之密対 20方法，構成為有效地保護電元件内之電裝置，具有優異之 壽命特性，且構成為有效地進行光之流入，具有優異之元 件特性，可改善電元件的強度，特別是，適用於本發明之 密封用熱硬化性樹脂組成物係黏度低，具有適用於OPF (One Drop Fill)步驟，塗佈量的控制容易，塗佈速度亦快速 7 200949963 等製程上的優點，因此在製程上之費用少，可縮短硬化時 間，光穿透特性佳’亦適用於頂部發射(T〇p emission)方式 之顯示器’截斷密封時流入面板内部之氣體及水分，亦可 適用於採用彩色濾光片之面板，可在元件無劣化之狀態下 5製作元件，硬化溫度低，有效地保護不对熱之物質，同時 實現足夠的接著強度及防止著色等之特性，具有製造成本 低且經濟性優異之效果。 10 15 又，本發明之密封用熱硬化性樹脂組成物係黏度低， 具有適用於ODF(〇ne Drop Fill)步驟，塗佈量之控制容易， 塗佈速度亦快等製程上之優點，因此製程上的費用少，可 縮短硬化時間’光穿透特性佳，亦可適用於頂部發射啊 emission)方式之顯示器密封時流人面板内部之氣體 及水分，亦可適用於採用彩色濾光片之面板，可在元件不 劣化之狀態下製作元件，硬化溫度低，可有效地保護不耐 熱之物質，同時實現足_接著強歧防止著色等特性， 製造成本似赠縣，特狀料上㈣ 密封構件皆為坡璃之元件 牛及下4 填之型離之雷、 續於具有將别述構件接著充 填之U之電7"件或光元件密封時特別有效。 [圖式簡單說明] ==發明一實施型態之顯示器元件之模式圖。 【實施實施型態之密封方法之製程圖。 用以實施發明之形離 本發明係有關於一 ”有透先部之電元件之密封方 20 200949963 法’更詳而言之’在將下部密封構件與上部密封構件接合 而形成之具有透光部之電元件之密封方法中，包含有下列 步驟，即：（a)將熱硬化性樹脂組成物全面地塗佈在上部密 封構件之接合前最終下面或下部密封構件之接合前最終上 5面；（b)在上部密封構件之塗佈面與下部密封構件之最終上 面、或上部密封構件之最終下面與下部密封構件之塗佈面 相接之狀態下將上部密封構件與下部密封構件接合；及(c) 對前述業已接合之結合體加熱’使熱硬化性樹脂組成物硬 化0 即，前述具有透光部之電元件係—種電元件，即 10 由發光、吸光或透光，以達成電元件之目的者，在内部有 ϋ成發光或吸光或透光之電裝置存在，具有構造成在如此 f裝置與外部之間進行透光之透光部，其外部具有藉下部 密封構件與上部密封構件而密封之構造。與此有關之具體 15例，諸如有0腳、咖本身（此時，電極或發光層等即為 〇 電裝置）’或集成其等而形成單—面板之顯示ϋ面板(此時、， _或LED4即為電裝置）’或利用其等之信號燈 (此時，OLED細D等即為電裝置），或太陽電池(特別是染 料感應式太陽電池)細胞單元之子模組(此時，太 單元等即為電裝置），或將其等集成之太陽電池模此ς 太^池子模組等即為電装置），或光連結端、時 之中心模組等。 卞战八等 結 構件為了讀的構成’在下部密封構件或上部密封 構件或，、等兩側上形成所要求之電裝置最後將其等 9 200949963 合，此時，上部密封構件係因應需要，在其下面形颜要 求之裝置’形成上部密封構件之接合前最終下面(也有不形 成任何物的型態），以及，下部密封構件亦同樣形成下„ 封構件之接合前最終上面，之後在其等上部密封構件之接 5合前最終下面或下部密封構件之接合前最終上面全面地塗 - 佈熱硬化性樹脂組成物。此時，透過前述全面塗佈，内部 — 的電裝置藉樹脂組成物而呈完全氣密之狀態。 在此，前述熱硬化性樹脂組成物，較佳的是包含有（a) 環氧樹脂25~90重量份；（b)熱硬化劑9〜7〇重量份；及(c)硬 © 1〇化促進劑〇.1〜5重量份，且黏度為10〜3000cps(25tT)時， 因為可得龍的熱硬化溫度及高減，在硬化齡巾㈣ 置的毀損達到最少，容易進行塗佈作業，所以為佳。 即，本發明之密封用熱硬化性樹脂組成物係於25。〇下 具有10〜30〇〇cps的黏度，較佳的是1〇〇〜2 〇〇〇cps，更佳的是 15 100〜1，000cps之黏度時，在將密封用熱硬化性樹脂組成物塗 佈在密封構件時，具有可進行〇DF(〇ne Drop Π11)步驟，塗 ❹ 佈ΐ的控制容易，且塗佈速度亦快速等製程上的優點花 費在製程上的費用亦少’可縮短硬化時間。 又，本發明所適用之前述密封用熱硬化性樹脂組成物 20係連同環氧樹脂在内分散有熱硬化劑、硬化促進劑之低黏 度之樹脂組成物，且選擇性地可更含有耦合劑或氧化防止 劑0 詳細說明本發明密封用熱硬化性樹脂組成物所使用之 成分。 10 200949963 、⑴環氧樹脂：適用於本發明之密封用熱硬化性樹脂組 • j物之環氧樹脂乃可舉出有雙盼A型環氧樹脂、雙紛F型環 ，A 1化雙5^型環氧細旨、脂環式環氧樹脂、芳香族 - s氧樹脂1清漆樹脂型、二環戊二烯型環氧樹脂等為例，、 5巧具有環氧基之化合物可單獨或混合使用。又，前述具 有被氧基之化合物之黏度係以i 00~ i 000cps為佳。 (2)熱硬化劑：通常只要是可使用在用以將環氧樹脂執 ❹ 硬化者即可使用，並無特別限定。以具體例而言，可使用 樓胺一乙樓四胺、N_胺基乙基娘嗪、二胺基二苯 -1〇基I烧、己二酸二醯肼等之聚胺系硬化劑；鄰苯二甲酸針、 ⑸氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、甲基四氫鄰笨二 曱酸肝、甲基六氫鄰苯二甲酸針、甲基納迪克(刪㈣缝) 酐·#之酸if硬化劑；紛越清漆樹脂型硬化劑；三。惡院三 伸乙基硫醇等之聚硫醇硬化劑；苯甲基二甲胺、2,4,6-三 15 (-甲基胺基甲基）笨盼等之第三胺化合物；2—甲基味唾、2 參 基:4—甲基咪峻、卜苯曱基—2-甲基味唾等之.米唾 -物專又亦可使用其他固體分散型之潛在性硬化劑 或封入微型膠囊之潛在性硬化劑等。 ⑶硬化促進劑：以硬化促進劑而言，可使用4級錄鹽、 20 4級鎏鹽、各種金屬鹽、味吐、y級胺等。以具體例而言， 對於4級㈣，可舉四甲基溴麟、四丁基溴驗為例，對 於4級鎏鹽’可舉四苯基漠化鱗、四丁基漠化鱗等為例對 於金屬鹽’可舉辛酸鋅、辛酸錫等為例，對於味唾，可舉】 苯甲基―2〜甲基咪唾、1-苯甲基-2-苯基咪嗤、2- 11 200949963 乙基一 4 一甲基味β坐專為例’以3級胺而言，則可舉笨甲基 二曱胺等為例。 (4)耦合劑：作為耦合劑，例如有矽烷耦合劑 '鈦酸酿 系耦合劑、鋁酸酯系耦合劑、矽化合物等，其等耦合劑可 5單獨或混合使用。含有耦合劑時，可提昇樹脂組成物之接 著性，具有減少黏度之效果’本發明之密封用熱硬化性樹 脂組成物係含有〇.001至5重量份，較佳的是重量份 者為佳。 (5)氧化防止劑：為了藉於本發明之密封用熱硬化性樹 ❿ 10脂組成物防止熱硬化時之氧化劣化，而進一步提高硬化物 之耐熱安定性時，可添加氧化防止劑。前述氧化防止劑乃 可使用笨酚系、硫系、磷系氧化防止劑等。以具體例而言， 可舉二丁基羥基甲苯、2,6—二一四一丁基—對甲酚（以下稱 為ΒΗΤ)等之苯酚系氧化防止劑、酼基丙酸衍生物等之硫系 15 酸化防止剤、碟酸三苯酯、9，10 —二氫一9—氧—1〇—峨菲 —10—氧化物（以下稱為HCA)等之磷系氧化防止劑等為 例，前述氧化防止劑可單獨或混合2種以上使用，在本發明 © 之密封用熱硬化性樹脂組成物中含有〇 至5重量份，較 佳的是含有0.01至0.5重量份為佳。 20 如此本發明之密封方法，適用於OLED元件或集成該元 件之面板時，因為可將其效果極大化，所以較佳。即，如 第1圖至第3圖顯示其具體例般，前述電元件係-種將含有 下板基材以及在該下板基材上堆疊之陽極(正極）、發光層及 陰極（負極）之下部密封構件與上部密封構件接合而成之有 12 200949963 5 e 10 15 9 20 塗你^件，前述(a)步驟為U熱硬化,_料成物全面地 面牛上部密封構件之—面或下部密封構件之陰極（負㈤ 前述⑼步驟是在將上部密封構件之塗佈面與下 =封構件之陰極（負極)面、或上部密封構件之—面與下部 之塗佈面相接之狀態下將上部密封構件及下部密 構件接合之步驟’前述(e)步驟係對前述已接Α之社人體 =^熱硬化性樹餘成物硬化之步驟，崎其等㈣ 後可製作如第1圖般之有機發光元件。 在此’前述下部密封構件係於下板基材上依序具備陽 極(正極）、發光層及陰極（負極)者，較佳的是，可追加地含 有電洞注人層（HIL)、電洞傳輸層（HTL)、電付人層（eil)、 或電子傳輸層（肌）。前述下板基材上所形成之陽極（正 極）、發光層、陰極（負極）、電洞注入層鼠）、電洞傳輸層 WL)、電子注入層（EIL)或電子傳輸層(etl)之形成可經由 通常的方法進行者。 又，較佳的是，如前述，本發明之密封方法係於將下 部密封構件與上部密封構件接合以將元件密封之方法中， 藉液晶滴人(One Drop Filling)步驟而將前述密封雜硬化 性樹脂組成物全面地塗佈於上部密封構件之—面或下部密 封構件之一面，將前述上部密封構件與下部密封構件接 合，且對前«已接合之上部密封構件與下部密封構件加 熱’使前述密封用熱硬化性樹脂組成物硬化者。 以一具體例來說，本發明之0LED元件之密封方法，較 佳的是，含有利用0DF步驟(有利於製程特性）而將前述熱硬 13 200949963 化性樹脂組成物全面地塗佈於上部密封構件之 1構件之陰極（負極）面之步驟。進行如此塗佈之後"，進^ 兩密封構件之接合，這可以通常的接合方法進行，較佳^ 10 15 Ϊ :=晴與下部密封構件之接合係於氮環境氣體 下較佳的疋l0t〇rr以下，更佳的是納〇订以下之真空严 境氣體中進㈣，對於清淨度及防止污染之方面來= 佳。尤其在製作0LED時，如前述，在上部密封 面與下部密封構件之陰極（負極)面，或上部密封構件之2 與下:密封構件之塗佈面相接之狀態下將上部密封構件與 下部密封構件接合，這可以在氮環境氣體下，較佳的是 10 t〇rr以下，更佳的是J0-7t〇rr以下之真空環境氣體中進行。 在如此接合步驟之後進行熱硬化步驟，該步驟是對前 述業已接合之上部密封構件或下部密封構件（其等之結合 體)加熱’使㈣用熱硬化性樹脂組成物硬化者為前述: 成物時，適合的熱硬化溫度係以75^12(rc範圍内者為佳。 又，因應所需，可在上部密封構件之下面周緣、或下 部密封構件之上面麟追加地塗佈光硬化輯脂組成物或 玻璃料。以與此有關之具體例來說，針對OLED步驟，乃如 第2至3圖所示者。經由如此方式進行電裝置之氣密外，亦 可以另外的材料將電元件之周緣氣密化，以滿足電元件所 需之其他特性者。 即，如圖所示’ OLED時，可利用通常的塗佈方法，較 佳的疋利用網版印刷步驟（有利於精密性及作業性）而將公 知之光硬化性樹脂組成物或玻璃料塗佈在上部密封構件之 20 200949963 -面周緣或下部密封構件之陽極(正極)、發光層及陰極(負 極)積層面之周緣。 將前述光硬化性樹脂組成物塗佈在密封構件之周緣 時，可與前述熱硬化同時，或依序進行光硬化步驟，以安 5定度觀點來看’在光硬化後再熱硬化者為佳。前述光乃可 使用可使光硬化性樹脂組成物硬化之光，以具體例而言， 可使用紫外線。又，將玻璃料塗佈於密封構件之周緣時， 為了燒成玻璃料粉末，可使用雷射。經由如此加熱，使前 述密封用熱硬化性樹脂組成物硬化，形成硬化體，上部密 1〇封構件與下部密封構件之間被前述硬化體氣密充填而接著 者。 本發明所使用之前述光硬化性樹脂組成物係以含有⑴ 環氧樹脂50〜90重量份、（2)光引發劑01~5重量份、（3)無機 充填劑1~40重量份及(4)耦合劑0.^5重量份為佳更可選擇 15地含有（5)間隔件丨〜20重量份及光酸發生劑0.001〜1重量份。 本發明之光硬化性樹脂組成物係藉具有5 000~ 150,000Cps (25t下），較佳的是具有1〇 〇〇〇〜1〇〇 〇〇〇印8之黏 度（25°C下）’具有可進行網版印刷步驟，可將製程時間縮 短’可節省製程上所花費之費用之長處。 20 (1)環氧樹脂組成物：作為可適用於本發明光硬化性樹 脂組成物之環氧樹脂組成物，乃可使用廣泛使用之芳香族 環氧樹脂、脂環式環氧樹脂、或可使用其等之混合物。以 前述芳香族環氧樹脂而言，可使用聯苯型、雙酚A型、雙酚 F型、酚醛清漆樹脂型、二環戊二烯型環氧樹脂，亦可使用 15 200949963 其等混合物。 (2) 光引發劑：可適用於本發明之光硬化性樹脂組成物 之光引發劑，只要是可藉光將前述環氧樹脂硬化者，即無 特別限制。以前述光引發劑之具體例而言，可舉芳香族重 5氮鑌鹽、芳香族鎏鹽、芳香族碘鋁鹽、芳香族婆紹鹽、芳 ' 環稀金屬衍生物化合物及鐵芳烴系化合物等為例。較佳的 - 是，可使用芳香族鎏鹽，其具體例乃可舉芳香族鎏六氟磷 酸鹽化合物、芳香族鎏六氟銻酸鹽化合物等為例。 (3) 無機充填劑：作為可適用於本發明光硬化性樹脂組 © 10成物之無機充填劑，可使用滑石（talc)、二氧化矽、氧化鎂、 雲母（mica)、蒙脫石、氧化紹、石墨、氧化鈹（berymum oxide)、氮化紹、碳化♦、模來石（mumte)、石夕等之板狀或 球形的無機充填劑、或將取代基導入前述無機充填劑且直 徑或長軸為0.1至20ym之無機充填劑。添加在樹脂組成物 15之無機充填劑係均等地分散在硬化後組成物之内部，不僅 可將作用在組成物之應力分散，強化接著力，亦具有有效 地防止侵入組成物内部而擴散之水分，使水分穿透特性提 〇 昇之效果。 (4) 耦合劑：可適用在本發明之光硬化性樹脂組成物之 20耦合劑係可單獨或混合使用矽烷系或鈦系耦合劑 、矽化合 物。較佳的是’以一分子内含有烷氧基矽烷及二縮水甘油 醚之矽烷耦合劑為佳。 (5) 間隔件·_可適用於本發明之光硬化性樹脂組成物之 Μ隔件只要是硬化後可維持的面板厚度者，即無特別 16 200949963 限制，以可將吨切度轉在㈣㈣、較佳的是Μ μ m者為佳。間，件之型態係包括球形或圓木形等，間隔件 之型態亦只要是可將面板之厚度維持—定者，即無特別限 制。 (6)光酸發生劑：作盔π、* m 作為可適用於本發明之光硬化性樹脂 組成物之光酸發生劑，σ i β 计 '、要瓦可藉曝光產生路易斯酸或布 Φ 10 15 20 氏酸之物時’即無特別限定’可使用有機雜等之硫化鹽 系化合物、鋤鹽等之鏽系化合物。較佳㈣，可使用苯二 甲酿亞胺三1甲續酸鹽、二硝苯甲基曱苯績酸鹽、確酸正 癸醋、萘醯亞胺三氟甲續酸鹽、二苯基祕鹽、六氣璘酸 鹽、六㈣《、六_酸鹽、二苯基對甲氧基苯基婆酸 乱甲械鹽、-本基對甲苯轉三氟甲俩鹽、二苯基對 異丁基苯祕三㈣韻鹽、三笨基以㈣㈣^ 基婆六㈣酸鹽、三苯基鎏三”俩鹽、二丁基 氟磺酸鹽及其等混合物。 ' — 又，本發明係提供具有透光部之電元件，其包含有. 下部密封構件；與前述下部密封構件相隔之狀態下位於前 述下部密封構件之上部之上部密封構件；位於前述下部密 封構件與上《封構件之間之電元件；及，域於前述上 部密封構件及下部密封構件之接著面之間，且將前述電元 件包圍，使前述上部密封構件與下部密封 化性樹脂組成物之硬化體層，又， 者之…、硬 又前述熱硬化性樹脂組成 物之硬化體層具有形成前述透光部之1分或全部之構 成0 17 200949963 在此，具有前述透光部之電元件及其内部所含之電元 件係如前述，且對於與此有關之具體例，前述元件可舉 OLED、LED或純感應式太陽電池等為例，制是，以一 具體例而言，如第！圖所示之〇LED具有藉熱硬化性樹脂組 5成物之硬化體而在形成無空隙之狀態下被充填接著之上冑 - 密封構件與下部密封構件，可具有優異之壽命特性。 又在此，本發明之電元件可更包含有光硬化性樹脂 ，’且成物硬化㈣緣，其充填在前述上部密封構件與下部密 封構件之接著面之_麟，且包_賴硬傾樹触 〇 1〇成物層，該光硬化性樹脂組成物硬化體周緣可經由第2至3 圖所提示之方法等形成者。 引述之本發明之具有透光部之電元件乃可經由前述< 本發明之具有透光部之電元件之密封方法而製作者，特別 是在前述電元件為QLED時，可具有如第！圖至第3_示之 15最終構成，如此構成係可經由第2至3圖之製造方法製作者 為佳。此時，前述電元件係一種有機發光二極體，其係由 下板基材、堆叠於該下板基材上且具有陽極(正極）、發光層 〇 及陰極（負極)之下部密封構件、及上部密封構件接合而構成 者，較佳的是，前述下部密封構件係於下板基材之上，可 2〇追加地含有電洞注入層（HIL)、電洞傳輸層（肌）、電子注 入層（EIL) '或電子傳輸層（ETL)。 如此，有機發光二極體係使如此電元件之上部密封構 :及下部密封構件藉熱硬化性樹脂組成物之硬化體充填接 者而形成無空隙之狀態，而提昇耐久性，因此為佳。 18 200949963 另外，前述電元件之下部密封構件及上部密封構件皆 為玻璃為佳，藉此，可確保強度及安定性。 以下為了理解本發明而提示較佳之實施例，但下述實 施例只是舉例說明本發明者，本發明之範圍不限定於下述 5 實施例者。 [實施例] 實施例1-6 :埶砀化性榭脂細占物之贺诰200949963 VI. Description of the invention: [Technical field to which the invention pertains] Technical field '$I hair (4) There is a method for sealing an electric component having a light transmitting portion, and an electric component having a light transmitting portion, in particular, The sealing method of the electric component of the optical portion, the electrical component having the light transmitting portion, and the thermosetting resin composition suitable for the sealing method can be configured to be excellent in electrical equipment in the electrical component. The life characteristics are configured to effectively carry out the inflow of light, and the device has excellent device characteristics, and the strength of the electric component can be improved. In particular, the thermosetting resin composition for sealing of the present invention has a low viscosity. The utility model has the advantages that it can be applied to the 〇DF (filling step) step (liquid crystal dropping step), the coating amount is easy to control, the coating speed is also fast, and the like, and the process cost is small, and the hardening time can be shortened. The light transmittance is excellent. It can also be applied to the top emission method. The display device 15 can cut off the gas and moisture flowing into the panel when it is sealed. It can also be used in color filter. The panel of the light sheet can be fabricated in a state where the component is not deteriorated, and the hardening temperature is low, which can effectively protect the heat-resistant material, achieve sufficient bonding strength and prevent coloring, etc., and has low manufacturing cost and excellent economy. . 20 C Chair] In general, an OLED or a display panel incorporating the component, an LED or a display panel integrated with the component, or an electrical component such as a solar cell has a light transmitting portion, so that the internal electricity is present The light generated by the device is transmitted to the outside 3 200949963, or the money transmitted to the (fourth) portion is transmitted to the pupil value, placed or transmitted, and is manufactured in such a manner The light-emitting or light-absorbing light-receiving device and the electrical component of the light-transmitting portion include a material for sealing the upper member and the lower sealing member, and for the display device of the above-mentioned electrical component Compared with the current (four) display panel, the panel can be made with a thinner thickness, and the process is easy to manufacture when manufacturing the panel, so as to have a process as a pullable display of the next-generation display. Suitability, so it is attracting attention as a next-generation display. Also, the OLED display is very bright and has excellent color contrast ((10)(4) and wide viewing angle. It has many advantages such as high brightness and light weight (light weight), low driving voltage, etc. The LED element is extremely weak to moisture, and the contact surface between the metal electrode and the organic EL layer (4) causes moisture _, and the metal electrode reacts with oxygen and moisture to be easily degraded 'by this special dark spot (slit 8_, pixel Yi (pixel) Shrinkage), etc., has the disadvantage of reducing the yield. To solve such a problem, a sealing method is used in the manufacture of components, which is applied along the outside of the component and in the form of a frame when the component is fabricated. A cloth resin composition in which a degassing composition is mounted on a member of a member to produce a component, and a resin composition is produced by coating a resin composition on the outside of the component in a frame form (fmme). Will flow into the inside of the panel 'can not form a perfect seal, resulting in dark spots, pixel shrinkage (pixel shrinkage) and other derivatives, do not research and develop through the 200949963 ' Ming degassing substances, It is impossible to apply the Top emission method. - Also use 'OLED components made of red, green, and blue luminescent materials, blue life and red (Red) ), green (Green) has a shorter life span, and when the display time of the display is 増5, the phenomenon of image sticking is observed due to the deterioration of the blue pixel. A technique in which three kinds of luminescent substances are formed into three layers 'or three kinds of luminescent substances are dissolved in a solvent to make several pieces, so that they emit white light, and pass through a color filter to make a real red color ( Red), green, and blue. However, when the device is fabricated in this way, the widely used photocurable resin composition allows the light source to pass through the color. The material does not absorb UV, and does not apply. From this point of view, the technology for effectively sealing a plurality of electrical components 15 having a light-transmitting portion can be effectively used to manufacture an electrical component that is epoch-making to improve durability. Development needs SUMMARY OF THE INVENTION The present invention is directed to providing a sealing method for an electrical component having a light transmitting portion and an electrical component having a light transmitting portion, which are configured to be effective The electric device in the protection electrical component has an excellent life expectancy, and the light inflow is effectively performed. The device has excellent device characteristics and can improve the strength of the electrical component, and is particularly applicable to the DropDF (One Drop Fill) step. Control of coating amount 5 200949963 Easy to manufacture, fast coating speed and other advantages in process, cost less in the process, shorten hardening time, excellent light transmittance, and also suitable for top emission The display of the mode can cut off the gas and moisture flowing into the panel inside the seal, and is also suitable for the surface plate using the color filter. The component can be fabricated without deterioration of the component, and the curing temperature is low, and the heat resistance can be effectively protected. The material can achieve sufficient bonding strength and coloring resistance at the same time, and has low manufacturing cost and good economy. Further, another object of the present invention is to provide a thermosetting resin composition for sealing which has a low viscosity and is suitable for use in a 〇DF (〇neDr〇pFm) step, and has a controllable coating amount and a coating speed. It also quickly and has the advantages of the process, so that the cost of the process is small, the hardening time can be shortened, the light transmittance is excellent, and the display is also suitable for the top emission (T〇p emissi〇n) display. The gas and moisture that flow into the inside of the panel during sealing are also suitable for the panel with the shirt color filter. The component can be fabricated in the state of no deterioration of the component, and the curing temperature is low, which can effectively protect the heat-resistant material. Achieving sufficient bonding strength and preventing coloring and the like, the manufacturing cost is low, and the retardation is good. Means for Solving the Problem In order to achieve the above object, the present invention provides a φ sealing method for an electric 2〇7L member having a light transmitting portion, which is formed by joining a lower sealing member and an upper sealing member. The method of sealing an electric component includes the steps of: (4) applying a thermosetting resin composition to the upper portion of the upper sealing member before joining, and finally bonding the lower or lower sealing member to the final surface, (b) at the upper portion Engaging the upper sealing member and the lower sealing member in a state in which the coated surface of the sealing member and the final sealing member of the lower sealing member are in contact with the lower sealing member and the lower sealing member. The thermosetting resin composition 〇5 &, the present invention provides an electric component having a light transmitting portion, comprising a lower sealing member; and being located above the lower sealing member in a state of being spaced apart from the lower sealing member An upper sealing member; an electric piece between the lower second sealing member and the upper sealing member; and filled in a hardened layer of a thermosetting resin composition in which the upper sealing member and the lower sealing member are bonded to each other between the joint surface of the upper sealing member and the lower sealing member; The hardened body layer of the thermosetting resin composition forms part or all of the light transmitting portion. Moreover, the present invention provides a thermosetting resin composition for sealing, and 15 is a resin composition for sealing of an electric component or an optical component, comprising: (8) 25 to 90 parts by weight of an epoxy resin; (8) a thermal curing agent 9 7 parts by weight; and, (c) 0.1 to 5 parts by weight of the hardening accelerator, and having a viscosity of 1 〇 3 〇〇〇 cps (25 C > c). Advantageous Effects of Invention According to the present invention, an electric component having a light transmitting portion and a method of sealing the electric component 20 are configured to effectively protect an electric device in the electric component, have excellent life characteristics, and are configured to efficiently perform light inflow. It has excellent component characteristics and can improve the strength of the electrical component. In particular, the thermosetting resin composition for sealing which is suitable for use in the present invention has low viscosity, and has an OPF (One Drop Fill) step and a coating amount control. Easy, coating speed is also fast 7 200949963 and other process advantages, so the cost of the process is less, the hardening time can be shortened, and the light transmission characteristics are good. 'It is also suitable for the top emission (T〇p emission) display' truncation The gas and moisture flowing into the inside of the panel during sealing can also be applied to the panel using the color filter, and the component can be fabricated in the state where the component is not deteriorated, the curing temperature is low, and the substance which is not hot is effectively protected, and at the same time, sufficient is achieved. Then, the strength and the characteristics of preventing coloring and the like have an effect of low manufacturing cost and excellent economy. Further, the thermosetting resin composition for sealing of the present invention has a low viscosity, and has an advantage of being suitable for an ODF (Dne Drop Fill) step, an easy control of a coating amount, and a coating speed, and the like. The cost of the process is small, the hardening time can be shortened, the light penetration property is good, and the gas and moisture inside the panel are sealed when the display is sealed, and the panel can be applied to the color filter. The component can be fabricated without deterioration of the component, the curing temperature is low, and the heat-resistant substance can be effectively protected, and at the same time, the characteristics of the foot and the strong dissimilarity are prevented from being colored, and the manufacturing cost is similar to that of the county, the special material (4) the sealing member It is especially effective for the component of the glazed glaze and the slab of the lower 4, which are continued to be sealed with the U<7" or optical component of the U which is to be filled with the other components. [Simple description of the drawing] == A schematic diagram of a display element of an embodiment is invented. [Processing diagram of the sealing method of the implementation type. The invention is directed to the invention of a "perforated electrical component sealing 20" 200949963 method 'more specifically' formed by joining the lower sealing member with the upper sealing member The sealing method of the electric component includes the steps of: (a) applying the thermosetting resin composition to the entire surface of the upper sealing member before joining the final sealing member or the lower sealing member. (b) engaging the upper sealing member with the lower sealing member in a state where the coated surface of the upper sealing member and the final upper surface of the lower sealing member, or the lower surface of the upper sealing member is in contact with the coated surface of the lower sealing member; And (c) heating the bonded body as described above to cure the thermosetting resin composition, that is, the electric component having the light transmitting portion, that is, the electric component, that is, 10 is illuminated, absorbed, or transmitted to achieve The purpose of the electrical component is to have an internal electrical device that emits light or absorbs light or transmits light, and has a light transmitting portion configured to transmit light between the device and the outside, such as the light transmitting portion. There is a configuration in which the lower sealing member and the upper sealing member are sealed. The specific 15 cases related thereto are, for example, a 0-foot, a coffee itself (in this case, an electrode or a light-emitting layer, etc.) or integrated therein. Form a single-panel display panel (in this case, _ or LED4 is an electrical device)' or use its signal light (at this time, OLED fine D is the electric device), or solar cells (especially dye sensing) Solar cell) sub-module of cell unit (at this time, the unit is the electric device), or the solar cell module integrated with it, or the solar cell module, or the optical connection, At the time of the center module, etc.. In order to read the structure of the eight-equivalent structural member, the required electrical device is formed on the lower sealing member or the upper sealing member or the other side, and finally, 9 200949963 The upper sealing member is, as needed, the lower part of the device required to form the upper sealing member before the joining (there is also a form in which no material is formed), and the lower sealing member also forms the lower sealing member. Above before the final engagement, then after 5 before engagement of the upper sealing member and the like which is above the final coating fully engaged before the final or below the lower seal member - cloth thermosetting resin composition. At this time, through the above-described overall coating, the internal electric device is completely airtight by the resin composition. Here, the thermosetting resin composition preferably contains (a) 25 to 90 parts by weight of the epoxy resin; (b) 9 to 7 parts by weight of the heat curing agent; and (c) hard © 1〇 When the accelerator is 11 to 5 parts by weight and the viscosity is 10 to 3000 cps (25 tT), since the heat hardening temperature and the high reduction of the dragon can be obtained, the damage in the hardened age towel (4) is minimized, and the coating operation is easy. So it is better. That is, the thermosetting resin composition for sealing of the present invention is at 25. The underarm has a viscosity of 10 to 30 〇〇 cps, preferably 1 〇〇 2 〇〇〇 cps, more preferably 15 100 〜 1,000 cps, when the thermosetting resin composition for sealing is used When it is applied to the sealing member, it has the step of performing 〇DF (〇ne Drop Π11), the control of coating the fabric is easy, and the coating speed is also fast, and the advantages in the process are less expensive in the process. Hardening time. Further, the thermosetting resin composition 20 for sealing to which the present invention is applied is a low-viscosity resin composition in which a thermosetting agent and a curing accelerator are dispersed together with an epoxy resin, and optionally contains a coupling agent. Or Oxidation Preventive Agent 0 The components used in the thermosetting resin composition for sealing of the present invention will be described in detail. 10 200949963, (1) Epoxy Resin: It is suitable for the thermosetting resin group for sealing of the present invention. The epoxy resin of the j material is exemplified by a double-presence A type epoxy resin and a double F-type ring, and A 1 double 5^ type epoxy resin, alicyclic epoxy resin, aromatic-s oxy resin 1 varnish resin type, dicyclopentadiene type epoxy resin, etc., and 5 compounds having epoxy groups can be used alone. Or mixed use. Further, the viscosity of the compound having an oxy group is preferably 00 to 1,000 cps. (2) Thermosetting agent: It is usually used as long as it can be used for curing the epoxy resin, and is not particularly limited. As a specific example, a polyamine-based hardener such as a floor amine, a tetraamine, an N-aminoethylantazine, a diaminodiphenyl-1 fluorenyl I, or a diazide adipate can be used. ; phthalic acid needle, (5) hydrogen phthalic anhydride, hexahydrophthalic anhydride, methyl tetrahydro acid stearidate, methyl hexahydrophthalic acid needle, methyl nadic (deletion (4) Sewing) Anhydride · #acid if hardener; more than varnish resin type hardener; a polythiol hardener such as triethyl thiol; a third amine compound such as benzyl dimethylamine or 2,4,6-tri-15 (-methylaminomethyl); - Methyl savory saliva, 2 ginseng: 4-methyl mirram, benzoquinone - 2-methyl saponin, etc.. Rice sap - can also use other solid dispersion type of latent hardener or encapsulation A potential hardener for microcapsules, etc. (3) Hardening accelerator: In the case of the hardening accelerator, a grade 4 salt, a 20 grade barium salt, various metal salts, a taste syrup, a y-amine, or the like can be used. For a specific example, for the fourth grade (four), four methyl bromide and tetrabutyl bromide can be used as an example, and for the fourth grade bismuth salt, tetraphenyl desertification scale and tetrabutyl desertification scale can be used. For example, the metal salt may be exemplified by zinc octoate or tin octylate. For the taste of saliva, benzyl -2- 2 methyl sulphate, 1-benzyl-2-phenyl hydrazine, 2- 11 200949963 Ethyl 4-methyl-methyl β-seat is used as an example. For the case of a tertiary amine, an example of a methylenediamine can be mentioned. (4) Coupling agent: As the coupling agent, for example, a decane coupling agent 'titanate brewing coupling agent, an aluminate coupling agent, an anthraquinone compound, or the like can be used, and the coupling agent can be used singly or in combination. When the coupling agent is contained, the adhesion of the resin composition can be improved, and the viscosity is reduced. The thermosetting resin composition for sealing of the present invention contains 0.001 to 5 parts by weight, preferably preferably by weight. . (5) Oxidation preventing agent: In order to prevent oxidative degradation during thermal curing by the thermosetting resin 10 composition for sealing of the present invention, and further improving the heat resistance stability of the cured product, an oxidation preventing agent may be added. As the oxidation preventing agent, a phenol-based, sulfur-based, phosphorus-based oxidation inhibitor or the like can be used. Specific examples thereof include a phenolic oxidation preventing agent such as dibutylhydroxytoluene or 2,6-di-tetra-butyl-p-cresol (hereinafter referred to as hydrazine), and a mercaptopropionic acid derivative. As an example of the phosphorus-based oxidation preventing agent such as antimony, acidification, antimony, triphenyl- 9-oxo- 1 fluorene-deca- 10-oxide (hereinafter referred to as HCA) The above-mentioned oxidation preventing agent may be used singly or in combination of two or more kinds, and it is preferable that the sealing thermosetting resin composition of the invention contains 〇 to 5 parts by weight, preferably 0.01 to 0.5 parts by weight. 20 The sealing method of the present invention is preferably applied to an OLED element or a panel in which the element is integrated, since the effect can be maximized. That is, as shown in FIGS. 1 to 3, the above-described electric component is an anode (positive electrode), a light-emitting layer, and a cathode (negative electrode) which will contain a lower substrate and a stacked on the lower substrate. The lower sealing member is joined to the upper sealing member. 12 200949963 5 e 10 15 9 20 Applying the workpiece, the above step (a) is U-thermal hardening, and the material is a comprehensive surface of the upper surface of the upper sealing member or The cathode of the lower sealing member (negative (5)) The step (9) is a state in which the coated surface of the upper sealing member and the cathode (negative electrode) surface of the lower sealing member or the coated surface of the upper sealing member are joined to the coating surface of the lower portion. The step of joining the upper sealing member and the lower dense member is as follows: the step (e) is a step of hardening the residual body of the above-mentioned enthalpy of the human body = ^ thermosetting tree, and after the fourth (4), the first step can be made. In the above-mentioned lower sealing member, the anode (positive electrode), the light-emitting layer, and the cathode (negative electrode) are sequentially provided on the lower substrate, and it is preferable to additionally include a hole injection. Human layer (HIL), hole transport layer (HTL), electric payer layer (eil), or electron transport layer (muscle). The anode (positive electrode), the light-emitting layer, the cathode (negative electrode), the hole injection layer WL, the electron transport layer formed on the lower plate substrate, and the electron injection layer The formation of an layer (EIL) or an electron transport layer (etl) can be carried out by a usual method. Further, preferably, as described above, the sealing method of the present invention is a method of joining a lower sealing member and an upper sealing member to seal the element, and the aforementioned sealing dope is hardened by a One Drop Filling step. The resin composition is entirely applied to one side of the upper or lower sealing member of the upper sealing member, and the upper sealing member is joined to the lower sealing member, and the front «joined upper sealing member and lower sealing member are heated' The thermosetting resin composition for sealing is cured. In a specific example, the sealing method of the OLED device of the present invention preferably comprises applying the thermosetting 13 200949963 chemical resin composition to the upper portion by using the 0DF step (which is advantageous for process characteristics). The step of the cathode (negative electrode) side of the member of the member. After such coating, <, the joining of the two sealing members, which can be carried out by a usual joining method, preferably ^ 10 15 Ϊ : = the bonding between the clear and the lower sealing member is preferably 氮10t under a nitrogen atmosphere Below 〇rr, it is better to order the following vacuum to enter the gas (4), which is good for cleanliness and pollution prevention. In particular, when the OLED is fabricated, as described above, the upper sealing member and the lower portion are placed in a state where the upper sealing surface and the cathode (negative electrode) surface of the lower sealing member, or the upper sealing member 2 and the lower: coating surface of the sealing member are in contact with each other. The sealing member is joined, which can be carried out under a nitrogen atmosphere, preferably 10 t rr or less, more preferably in a vacuum atmosphere of J0-7 t rr or less. After such a bonding step, a thermal hardening step is performed which heats the above-mentioned bonded upper sealing member or lower sealing member (the combination thereof) to cure the (four) thermosetting resin composition as described above: The suitable heat curing temperature is preferably 75^12 (in the range of rc. Further, depending on the need, the light hardening grease may be additionally applied to the lower periphery of the upper sealing member or the upper surface of the lower sealing member. The composition or the glass frit. For the specific example related thereto, the OLED step is as shown in Figures 2 to 3. By performing the airtightness of the electric device in this manner, it is also possible to use another material for the electrical component. The periphery is hermetically sealed to meet other characteristics required for electrical components. That is, as shown in the figure of 'OLED, the usual coating method can be utilized, and the preferred ruthenium printing step (for precision and Workability), a known photocurable resin composition or glass frit is applied to the upper sealing member 20 200949963 - anode (positive electrode), luminescent layer and cathode (negative electrode) layer of the peripheral or lower sealing member When the photocurable resin composition is applied to the periphery of the sealing member, the photohardening step may be performed simultaneously with the thermal hardening or sequentially, and the heat is cured after the photohardening. It is preferable to use a light which hardens the photocurable resin composition, and as a specific example, ultraviolet rays can be used. When the glass frit is applied to the periphery of the sealing member, the glass is fired. By using the laser, the sealing thermosetting resin composition is cured to form a hardened body, and the hardened body is filled with the hardened body between the upper dense sealing member and the lower sealing member. The photocurable resin composition used in the present invention contains (1) epoxy resin 50 to 90 parts by weight, (2) photoinitiator 01 to 5 parts by weight, (3) inorganic filler 1 to 40 parts by weight, and (4) The coupling agent is preferably 0.5 parts by weight, and more preferably 15 (5) spacer 丨 20 parts by weight and photoacid generator 0.001 to 1 part by weight. The photocurable resin composition of the present invention Borrowing with 5 000~ 150,000 Cps (25t Preferably, it has a viscosity of 1 〇〇〇〇 1 to 1 ( 8 (at 25 ° C) 'has a screen printing step, which can shorten the process time' and saves the process cost. 20 (1) Epoxy resin composition: As an epoxy resin composition which can be applied to the photocurable resin composition of the present invention, a widely used aromatic epoxy resin or alicyclic epoxy resin can be used. A resin or a mixture thereof may be used. For the aromatic epoxy resin, a biphenyl type, a bisphenol A type, a bisphenol F type, a novolak type resin, or a dicyclopentadiene type epoxy resin may be used. It is also possible to use the mixture of 15 200949963. (2) Photoinitiator: A photoinitiator which can be applied to the photocurable resin composition of the present invention, as long as it can cure the epoxy resin by light, that is, no special limit. Specific examples of the photoinitiator include an aromatic heavy 5 nitridinium salt, an aromatic sulfonium salt, an aromatic iodine aluminum salt, an aromatic oxazo salt, an aryl 'ring rare metal derivative compound, and an iron aromatic hydrocarbon system. Compounds and the like are exemplified. Preferably, an aromatic sulfonium salt can be used, and specific examples thereof include an aromatic hexafluorophosphate compound and an aromatic hexafluoroantimonate compound. (3) Inorganic filler: As an inorganic filler which can be applied to the photocurable resin group of the present invention, talc, cerium oxide, magnesium oxide, mica, montmorillonite, a plate-like or spherical inorganic filler of oxidized, graphite, berymum oxide, nitriding, carbonized ♦, mumte, shixi, etc., or introduced into the aforementioned inorganic filler and having a diameter Or an inorganic filler having a long axis of 0.1 to 20 μm. The inorganic filler added to the resin composition 15 is uniformly dispersed in the interior of the cured composition, and not only the stress acting on the composition is dispersed, but also the adhesion force is enhanced, and the moisture which intrudes into the inside of the composition is effectively prevented from diffusing. , so that the water penetration characteristics of the effect of soaring. (4) Coupling agent: The coupling agent which can be applied to the photocurable resin composition of the present invention can be used alone or in combination with a decane-based or titanium-based coupling agent or a ruthenium compound. Preferably, the decane coupling agent containing alkoxydecane and diglycidyl ether in one molecule is preferred. (5) Spacer _ The spacer which can be applied to the photocurable resin composition of the present invention is only required to have a panel thickness which can be maintained after hardening, that is, there is no special 16 200949963 limit, so that the tonnage can be switched to (4) (4) Preferably, Μ μ m is preferred. The type of the member includes a spherical shape or a round shape, and the type of the spacer is also required to maintain the thickness of the panel, that is, there is no particular limitation. (6) Photoacid generator: used as a π, * m as a photoacid generator which can be applied to the photocurable resin composition of the present invention, σ i β meter, and can be used to generate a Lewis acid or cloth by exposure. In the case of 10 15 20 acid, it is not particularly limited, and a rust-based compound such as an organic heterocyclic sulfide compound or a phosphonium salt can be used. Preferably, (4), it is possible to use benzodiamine tris-1,5-diphenyl phthalate, di-n- benzyl phthalate, sulphuric acid, naphthyl imine trifluoromethane, diphenyl Secret salt, six gas citrate, six (four) ", hexa-acid salt, diphenyl-p-methoxyphenyl-poic acid salt, - base p-toluene trifluoromethane salt, diphenyl pair Isobutyl benzene secret three (four) rhyme salt, three stupid base to (four) (four) ^ base Po six (tetra) acid salt, triphenyl sulfonium three salt, dibutyl fluorosulfonate and the like and other mixtures. '- Again, the present invention Providing an electric component having a light transmitting portion, comprising: a lower sealing member; a sealing member located above an upper portion of the lower sealing member in a state of being spaced apart from the lower sealing member; being located at the lower sealing member and the upper sealing member And an electrical component between the upper sealing member and the lower sealing member, and surrounding the electric component to form a hardened layer of the upper sealing member and the lower sealing resin composition, The hardened layer of the hard thermosetting resin composition has a shape The configuration of the light-transmitting portion is one or a part of the above-mentioned light. Here, the electric component having the light transmitting portion and the electric component included in the light-transmitting portion are as described above, and the specific components related to the above may be mentioned. An example of an OLED, an LED, or a purely inductive solar cell is as follows. In a specific example, the 〇LED shown in the figure has a hardened body formed of a thermosetting resin group 5 and forms a void-free layer. In the state of being filled, the upper sealing member and the lower sealing member may have excellent life characteristics. Here, the electric component of the present invention may further comprise a photocurable resin, and the hardened (four) edge of the object is formed. Filling the lining of the upper surface of the upper sealing member and the lower sealing member, and enclosing the layer of the hardened resin, the periphery of the hardened body of the photocurable resin composition can be through the second to third figures The method of presenting the method, etc., is described. The electric component having the light transmitting portion of the present invention can be produced by the sealing method of the electric component having the light transmitting portion according to the present invention, in particular, the electric component is QLED can have The figure is shown in the third to the fifth embodiment, and the configuration is preferably made by the manufacturing method of the second to third embodiments. In this case, the electric component is an organic light emitting diode, which is a lower plate. The substrate is stacked on the lower substrate and has an anode (positive electrode), a light-emitting layer 〇, a cathode (negative electrode) lower sealing member, and an upper sealing member. Preferably, the lower sealing member is On the lower substrate, the hole injection layer (HIL), the hole transport layer (muscle), the electron injection layer (EIL) or the electron transport layer (ETL) may be additionally included. Thus, the organic light-emitting layer 2 The pole system is such that the upper portion of the electric component is sealed and the lower sealing member is formed by a hardened body of the thermosetting resin composition to form a void-free state, thereby improving durability, and therefore it is preferable. 18 200949963 Both the lower sealing member and the upper sealing member of the element are preferably glass, whereby strength and stability can be ensured. In the following, in order to understand the present invention, the preferred embodiments are presented, but the following examples are merely illustrative of the inventors, and the scope of the present invention is not limited to the following five embodiments. [Examples] Example 1-6: Deuterated rouge fines
以如下述表1所示之組成製造密封用熱硬化性樹脂舨 成物。 Ο 厂熱硬化性樹脂‘成物之組成（重量份) η 環氧樹脂 熱硬化劑 硬化你 ' 100MF YL983U CELLOXIDE 202 IP Epikote 152 MH-700 EMI-24 -- K61B 實施例1 9 37 0 0 53 1 〇^' 實施例2 9 37 0 0 52 2 ----- 0 實施例3 9 37 0 0 52 0 2 實施例4 0 38 r 1〇 0 50 2 0 實施例5 0 23 23 0 52 2 〇 實施例6 0 Γ 〇 19 29 50 2 0 — EPOLIGHT 100MF :脂肪族縮水甘油醚化合物（KY〇EISHA) YL983U :雙酚F型環氧樹脂（日本艾波吉思公司） CELLOXIDE 2021P :脂環式環氧樹脂(Daicd Chemical 她如％ Ud ) Epikote 152 :甲酚一清漆樹脂型環氧樹脂（日本艾波吉思公司） 15 ⑻：液状脂環式酸無水物硬化剤（新日本理化公司） EMI _ 24 :咪唑類硬化促進剤（Air pr〇ducts公司） K61B :胺類硬化促進劑（AirPr〇ducts&司） 測定以前述實施例〖_ 6製造之熱硬化性樹脂組成物各 20自的光穿透度、接著強度、黏度及硬化性，各示於下述表2。 1.光穿透度測定：光穿透度之測定係利用撒布器 19 200949963 (dispenser)將熱硬化性組成物以同一間隙塗佈在塗佈面全 面，以於50mmx50mmx0.7mm之透明玻璃基材（三星康寧精 密玻璃公司、製品名稱：Eagle 2000)之上形成約20//m之厚 度。在100°C之烤盤上硬化1小時之後，使用Reference玻璃 5 基材(三星康寧精密玻璃公司、製品名稱：Eagle 2000)，測 定光通過基材時之透射率，測定機器是使用大塚公司之光 譜分析機器之MCPD-3000，並在380至780nm之波長範圍 内’按塗佈有前述熱硬化性組成物之玻璃基材之6點分別測 疋透射率所得到之波長範圍内之平均值。 10 2.接著強度之測定：在將5〇mmx50mmxl.lmm之玻璃作 為下板之基材上以直徑2mm大小滴落熱硬化性樹脂組成物 之後，將上板與下板接合後，在10CTC之烤盤上硬化丨小時 後’使用T字型夾具(Instron公司、製品名稱：Stud set)，以 接著強度測定器（Instron公司、製品名稱：UTM-5566)測定。 15 3·黏度之測定：黏度係利用黏度測定器（商品名稱：A thermosetting resin composition for sealing was produced in the composition shown in Table 1 below.厂 Factory thermosetting resin' composition (parts by weight) η Epoxy resin hardening agent hardens you '100MF YL983U CELLOXIDE 202 IP Epikote 152 MH-700 EMI-24 -- K61B Example 1 9 37 0 0 53 1 〇^' Example 2 9 37 0 0 52 2 ----- 0 Example 3 9 37 0 0 52 0 2 Example 4 0 38 r 1〇0 50 2 0 Example 5 0 23 23 0 52 2 〇 Example 6 0 Γ 〇 19 29 50 2 0 — EPOLIGHT 100MF: aliphatic glycidyl ether compound (KY〇EISHA) YL983U: bisphenol F type epoxy resin (Japan Aibogis) CELLOXIDE 2021P: alicyclic ring Oxygen resin (Daicd Chemical, she is such as % Ud) Epikote 152: cresol-clear resin type epoxy resin (Japan Aibojisi) 15 (8): Liquid alicyclic acid anhydrate hardened 剤 (Nippon Chemical and Chemical Co., Ltd.) EMI _ 24: imidazole-based hardening-promoting hydrazine (Air pr〇ducts) K61B: amine-based hardening accelerator (AirPr〇ducts & Division) The light-hardening resin composition manufactured by the above-mentioned Example 〖6 was measured for light penetration of each of 20 The transparency, adhesion strength, viscosity, and hardenability are shown in Table 2 below. 1. Measurement of light transmittance: The measurement of light transmittance is carried out by using a spreader 19 200949963 (dispenser) to coat the thermosetting composition on the coated surface with the same gap to cover a transparent glass substrate of 50 mm x 50 mm x 0.7 mm. (Samsung Corning Precision Glass Company, product name: Eagle 2000) formed a thickness of about 20 / / m. After hardening on a baking tray at 100 ° C for 1 hour, the transmittance of the light passing through the substrate was measured using a Reference glass 5 substrate (Samsung Corning Precision Glass Co., Ltd., product name: Eagle 2000), and the measuring machine was operated by Otsuka Corporation. The MCPD-3000 of the spectroscopic analysis machine, and in the wavelength range of 380 to 780 nm, the average value in the wavelength range obtained by measuring the transmittance of the glass substrate coated with the thermosetting composition described above. 10 2. Measurement of the strength: After the thermosetting resin composition was dropped on a substrate having a thickness of 2 mm on a substrate of 5 mm×50 mm×1.1 mm, the upper plate and the lower plate were joined, and then 10 CTC was used. After the baking pan was hardened for a few hours, it was measured using a T-shaped jig (Instron, product name: Stud set), followed by a strength measuring instrument (Instron, product name: UTM-5566). 15 3·Determination of viscosity: Viscosity is measured by viscosity meter (trade name:
Brook Field viscometer)，而對熱硬化性組成物〇.5g測定顯示 接近80%之扭力矩時之黏度。 4.硬化性：令於l〇〇°C之烤盤上熱硬化性組成物以1小 時可硬化的時候為Good，而在前述硬化條件下硬化不夠充 2〇 分時，則為Not good。 20 200949963 [表2] 光穿透度 (%) 接著強度 (kgf/cm2 ) 黏度 (cps ) 硬化性 實施例1 98.85 97 372 Good 實施例2 99.16 117 459 Good 實施例3 99.24 115 332 Good 實施例4 99.29 146 381 Good 實施例5 99.27 Γ 110 225 Good 實施例6 99.46 94 584 Good 由前述表2之結果可確認到，本發明之實施例丨至6之密 封用熱硬化性樹脂組成物係適於密封，並具有優異的物性。 實施例7至11 :光硬化性榭脂細成物之製造 [表3] 光硬化性樹脂組成物之組成（重量份） 壞虱樹脂 光引發劑 無機充填劑 耦合劑 YL983U NC7300L SP170 P-3 KBM403 實施例7 61 12 0.8 20 0.2 實施例8 66 12 2.4 20 0.2 實施例9 58 10 1.4 30 0.2 實施例10 62 12 1.4 24 0.2 實施例11 62 12 1.8 25 0.2 YL983U:雙酚F型環氧樹脂（日本艾波機思公司） NC7300L :聯苯型環氧樹脂（日本化藥公司） SP170 :陽離子聚合引發劑（旭電化公司） P-3 :無機充填劑、滑石（曰本塔爾克公司） KBM4〇3 .梦炫耗合劑（信越公司） Φ 測定前述實施例7至11所製造之光硬化性樹脂組成物 之各光穿透度、水分穿透度、接著強度、熱安定性及黏度， 各示於下述表4。 1 ·水分穿透度之測定.利用桿塗器，而在聚對苯二甲 酸乙二酯薄膜之表面塗佈光硬化性樹脂組成物成為 21 200949963 50mmx50mmx0.1mm大小之後，照射6000mJ/cm2之UV，在 80°C之烤盤上硬化1小時後，以ASTM F1249之方法且在 37.8°C、l〇〇%RH之條件下以水分穿透度測定器（製品名 稱：PERMATRAN-W3/33)測定24小時之水分穿透度。 5 2.接著強度之測定：在50mmx50mmxl.lmm之下板玻璃 基材上以直徑5mm大小滴落光硬化性樹脂組成物之後，上 板是準備與下板同一大小之玻璃基材，將上板與下板接合 後，照射6000mJ/cm2之UV，在80°C之烤盤上硬化1小時後， 使用T字型夾具(Instron公司、製品名稱：Studset)，以接著 10 強度測定器（Instron公司、製品名稱：UTM-5566)測定。 3. 熱安定性之測定：利用桿塗器，而在業經脫模處理 之聚對苯二甲酸乙二酯薄膜之表面形成光硬化性樹脂組成 物為50mmx50mmx0.1mm大小之後，照射6000mJ/cm2之 UV，在80°C之烤盤上硬化1小時後所得到之塗膜中將一部 15 分切斷’利用微差掃描熱析儀(TA公司、製品名稱：DSC)， 測定光硬化性樹脂組成物之玻璃轉移溫度(Tg)。 4. 光穿透度之測定：光穿透度之測定係利用桿塗器（bar applicator)，將熱硬化性樹脂組成物塗佈在5〇mmX50mmx 0.7mm之透明玻璃基材（三星康寧公司、製品名稱：Eagle 20 2000)之上形成20μιη，且在l〇〇°C的烤盤上硬化1小時後，並 使用對照玻璃基材（三星康寧公司、製品名：Eagle 2000)， 測定光通過基材時之透射率，測定儀器是使用大琢公司之 光譜分析機器之MCPD-3000，在380至780nm之波長範圍 内，依照塗佈有前述熱硬化性樹脂組成物之玻璃基材之6點 200949963 - 分別測定透射率而所得到之波長範圍内之平均值。 . 5.黏度之測定：利用黏度測定器（商品名稱：Brook Field viscometer)，而對樹脂組成物0.5g測定顯示接近80%之扭力 矩時之黏度。 5 [表4] 光穿透度 (g/m2day) 接著強度 (kgf/cm2) 玻璃轉移溫度 (τε) 黏度 (cps) 實施例7 5.34 115.71 110 27,915 實施例8 5.14 136.5 120 27,168 實施例9 4.52 70.52 118 98,000 實施例10 4.87 108.11 117 54,895 實施例11 4.78 113.77 116 53,012 由前述表4之結果乃可確認到，本發明之實施例了至^ 之光硬化性樹脂組成物係適於使用目的，亦具有優異之物 10 性者。 實施例12 :顯示器元件之_ _ 準備含有下板基材、以及在其上積層之陽極(正極）、發 光層（紅色、綠色、藍色面發光)及陰極（負極)之下部密封構 件、和上部密封構件。利用〇DF步驟，而在下部密封構件 I5之陰極（負極）面全面塗佈前述實施例！之熱硬化性樹月旨組成 物。除此外，另外利用網版印刷步驟，將光硬化性樹脂組 成物塗佈在上部密封構件之周緣。在上部密封構件之塗佈 面與下部进封構件之塗佈面相接之狀態下將上部密封構件 與下部密封構件在氮環境氣體下1().w之真空環境氣體中 接合。在已接合之上部密封構件及下部密封構件昭射 _〇mW之UV ’使光硬健樹脂組成物硬化之後，'以 23 200949963 80C加熱，將熱硬化性樹脂組成物硬化，製造顯示器元件， 在第2圖顯示製程圖（在第2圖中，（1):陽極(正極）蒸鍍步驟、 (2) ·發光體（紅色、綠色、藍色面發光）、（3):陰極（負極） 蒸鑛步驟、（4):彩色濾光片成膜步驟、（5)光硬化樹脂塗佈 5步驟、（6):密封用熱硬化樹脂塗佈步驟(ODF步驟：以一定 ， 間隔塗佈在基板全面）、（7):接合後之熱硬化步驟、（a):撒 - 布器、（b).熱硬化性組成物、（c):加熱(heating))。 實施例13 :顯示器元件之密封 使用玻璃料代替前述實施例12之光硬化性樹脂之外， © 10其餘以同一方法進行密封，在第3圖顯示製程圖（第3圖中， (1):陽極(正極）蒸鍍步驟、（2):發光體(紅色、綠色、藍色 面發光）、（3):陰極（負極）蒸鍍步驟、（4):玻璃料塗佈及前 燒成（可塑性）步驟、（5)彩色濾光片成膜步驟、（6):熱硬化 樹脂塗佈步驟(ODF步驟：以一定間隔塗佈在基板全面）、 15 (7):接合後之熱硬化步驟、（a):撒净器、（b):熱硬化性組 成物、（c):加熱(heating))。 前述實施例12及實施例13所製造之元件具有如第1圖 之構造’在光穿透度、水分穿透度、接著強度及熱安定性 面上全部都很優異，基本上可防止發生上部密封構件及下 20部密封構件之發光體接觸而造成損傷者。 【围式簡單說明】 第1圖係本發明一實施型態之顯系器元件之模式圖。 第2圖係本發明一實施型態之密封方法之製程圖。 第3圖係本發明一實施型態之密封方法之製程圖。 24 200949963 【主要元件符號說明】 1下板玻璃基材 5熱硬化性樹脂組成物 2陽極(正極） 6彩色濾光片 3發光層 7玻璃料或光硬化型樹脂組成物 4陰極(負極） 8上板玻璃基材Brook Field viscometer), while the thermosetting composition 〇.5g was measured to show a viscosity close to 80% of the torque. 4. Sturability: It is Good when the thermosetting composition on the baking sheet of l° ° C is harden when it is hardened for 1 hour, and is not good when it is hardened by 2 minutes under the above-mentioned hardening conditions. 20 200949963 [Table 2] Light transmittance (%) Next strength (kgf/cm2) Viscosity (cps) Hardenability Example 1 98.85 97 372 Good Example 2 99.16 117 459 Good Example 3 99.24 115 332 Good Example 4 99.29 146 381 Good Example 5 99.27 Γ 110 225 Good Example 6 99.46 94 584 Good It can be confirmed from the results of the above Table 2 that the thermosetting resin composition for sealing of Examples 丨 to 6 of the present invention is suitable for sealing. And has excellent physical properties. Examples 7 to 11: Production of photocurable blush fines [Table 3] Composition of photocurable resin composition (parts by weight) Gangrene resin photoinitiator Inorganic filler coupling agent YL983U NC7300L SP170 P-3 KBM403 Example 7 61 12 0.8 20 0.2 Example 8 66 12 2.4 20 0.2 Example 9 58 10 1.4 30 0.2 Example 10 62 12 1.4 24 0.2 Example 11 62 12 1.8 25 0.2 YL983U: bisphenol F type epoxy resin ( Japan Aibo Machine Co., Ltd.) NC7300L: Biphenyl type epoxy resin (Nippon Chemical Co., Ltd.) SP170: Cationic polymerization initiator (Asahi Kasei Co., Ltd.) P-3: Inorganic filler, talc (曰本塔尔克) KBM4 〇3. Mengxuan consumption agent (Shin-Etsu Co., Ltd.) Φ The light transmittance, water penetration, adhesion strength, thermal stability and viscosity of the photocurable resin composition produced in the above Examples 7 to 11 were measured. Shown in Table 4 below. 1·Measurement of water permeability. The surface of the polyethylene terephthalate film is coated with a photocurable resin composition by a bar coater to become a 21 200949963 50 mm x 50 mm x 0.1 mm size, and irradiated with a UV of 6000 mJ/cm 2 . After hardening for 1 hour on a baking tray at 80 ° C, the water permeability tester (product name: PERMATRAN-W3/33) was tested by the method of ASTM F1249 and at 37.8 ° C, 10% RH. The water penetration of 24 hours was measured. 5 2. Determination of the strength: After dropping the photocurable resin composition on a plate glass substrate at a diameter of 5 mm under 50 mm x 50 mm x 1.1 mm, the upper plate is a glass substrate of the same size as the lower plate, and the upper plate is placed. After bonding to the lower plate, UV was irradiated at 6000 mJ/cm2, and hardened on a baking plate at 80 ° C for 1 hour, and then a T-shaped jig (Instron, product name: Studset) was used, followed by a 10-strength measuring device (Instron Corporation). , product name: UTM-5566) determination. 3. Determination of thermal stability: using a bar coater, and forming a photocurable resin composition on the surface of the release-treated polyethylene terephthalate film to have a size of 50 mm x 50 mm x 0.1 mm, and irradiating 6000 mJ/cm 2 UV, one part of the coating film obtained after hardening on a baking sheet at 80 ° C for 1 hour was cut off by 15 minutes. Using a differential scanning calorimeter (TA company, product name: DSC), the photocurable resin was measured. The glass transition temperature (Tg) of the composition. 4. Measurement of light transmittance: The measurement of light transmittance is carried out by using a bar applicator to coat a thermosetting resin composition on a transparent glass substrate of 5 mm x 50 mm x 0.7 mm (Samsung Corning, Product name: Eagle 20 2000) formed 20 μm, and hardened on a baking tray of 1 ° C for 1 hour, and using a control glass substrate (Samsung Corning, product name: Eagle 2000), the light pass base was measured. The transmittance of the material, the measuring instrument is MCPD-3000 using the spectral analysis machine of Otsuka Corporation, in the wavelength range of 380 to 780 nm, according to the glass substrate coated with the above thermosetting resin composition, 6:200949963 - The average value in the wavelength range obtained by measuring the transmittance. 5. Measurement of viscosity: A viscosity measuring device (trade name: Brook Field viscometer) was used, and the viscosity of the resin composition of 0.5 g was measured to show a torque close to 80%. 5 [Table 4] Light transmittance (g/m2day) Next strength (kgf/cm2) Glass transition temperature (τε) Viscosity (cps) Example 7 5.34 115.71 110 27,915 Example 8 5.14 136.5 120 27,168 Example 9 4.52 70.52 118 98,000 Example 10 4.87 108.11 117 54,895 Example 11 4.78 113.77 116 53,012 From the results of the above Table 4, it was confirmed that the photocurable resin composition of the embodiment of the present invention is suitable for the purpose of use, and has Excellent thing 10 sex. Embodiment 12: Display element_ _ Preparing a lower sealing material, and an anode (positive electrode), a light-emitting layer (red, green, blue-surface light-emitting) and a cathode (negative electrode) underlying layer, and a sealing member Upper sealing member. The foregoing embodiment is fully coated on the cathode (negative electrode) side of the lower sealing member I5 by the 〇DF step! The composition of the thermosetting tree is a composition. Further, in addition, a photocurable resin composition is applied to the periphery of the upper sealing member by a screen printing step. The upper sealing member and the lower sealing member are joined to each other in a vacuum atmosphere gas of 1 ().w under a nitrogen atmosphere in a state where the coating surface of the upper sealing member is in contact with the coating surface of the lower sealing member. After the upper sealing member and the lower sealing member have been joined, the UV-hardening resin composition is cured, and then heated at 23 200949963 80C to cure the thermosetting resin composition to produce a display element. Figure 2 shows the process diagram (in Figure 2, (1): anode (positive) evaporation step, (2) · illuminant (red, green, blue), (3): cathode (negative) Steaming step, (4): color filter film forming step, (5) photo-curing resin coating step 5, (6): sealing thermosetting resin coating step (ODF step: coating at a certain interval The substrate is comprehensive), (7): thermal hardening step after bonding, (a): sprinkler, (b) thermosetting composition, (c): heating. Example 13: Sealing of display element Using a glass frit instead of the photocurable resin of the above-mentioned Example 12, the rest of the seal was sealed in the same manner, and the process chart was shown in Fig. 3 (Fig. 3, (1): Anode (positive electrode) vapor deposition step, (2): illuminant (red, green, blue surface luminescence), (3): cathode (negative electrode) vapor deposition step, (4): glass frit coating and pre-firing ( (plasticity) step, (5) color filter film forming step, (6): thermosetting resin coating step (ODF step: coating on the substrate at regular intervals), 15 (7): thermal hardening step after bonding (a): a spreader, (b): a thermosetting composition, and (c): heating. The elements manufactured in the above-mentioned Embodiments 12 and 13 have the structure as shown in Fig. 1 which are excellent in light transmittance, moisture permeability, adhesion strength and thermal stability, and substantially prevent the upper portion from being generated. The illuminant of the sealing member and the lower 20 sealing members are in contact with each other to cause damage. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a display element of an embodiment of the present invention. Fig. 2 is a process diagram of a sealing method according to an embodiment of the present invention. Fig. 3 is a process diagram of a sealing method according to an embodiment of the present invention. 24 200949963 [Description of main components] 1 lower glass substrate 5 thermosetting resin composition 2 anode (positive electrode) 6 color filter 3 light-emitting layer 7 glass frit or photo-curable resin composition 4 cathode (negative electrode) 8 Upper plate glass substrate
(1)陽極(正極)蒸鑛步驟 ⑵發光體(紅色、綠色、藍色面發光) ⑶陰極(負極)蒸鍍步驟 (4)彩色濾光片成膜步驟(第2圖)或玻璃料塗佈及前燒成步驟(第 3圖） ⑶光硬化型樹脂塗佈(第2圖)或彩色濾光片成膜步驟(第3圖） (6) 熱硬化樹脂塗佈步驟(〇dF步驟：以一定間隔塗佈在基板全 面） (7) 接合後之熱硬化步驟 ⑻撒布器 (b) 熱硬化組成物 (c) 加熱(heating) 25(1) anode (positive electrode) steaming step (2) illuminant (red, green, blue surface illuminating) (3) cathode (negative electrode) vapor deposition step (4) color filter film forming step (Fig. 2) or frit coating Cloth and pre-baking step (Fig. 3) (3) Photocurable resin coating (Fig. 2) or color filter film forming step (Fig. 3) (6) Thermosetting resin coating step (〇dF step: Coating on the substrate at regular intervals) (7) Thermal hardening step after bonding (8) Spreader (b) Heat hardening composition (c) Heating 25