200949341 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種液晶面板’尤指一種將觸控板内建 於液晶面板上且有效整合二者的控制電路，以便在同板、 同端子、且同平面的狀況下出線，以有效簡化製程、降低 成本之液晶面板。 【先前技術】 ❹ 有許多消費性電子產品為強調其操作介面的便利性與 親和力，紛紛採用觸控式介面，所謂的觸控式介面，一般 係在顯示器上安裝一觸控板’該觸控板具有獨立的運算控 制系統，可判斷使用者觸按的座標，提供使用顯示器的控 制系統，作為執行指定功能之依據。 至於顯示器上外掛一觸控板的方式，一種既有技術係 如第九圖所示’主要係在一液晶面板（70)上外掛一電容式 觸控板（80) ’該液晶面板（70)主要係於一上板（71)與一下板 ❹ （72)之間設有一液晶層（73)，該上板（71)、下板（72)係至少 分別包括一玻璃基板（711)(721)、一形成於玻璃基板 (711)(721)相對内側面上的透明電極（71 2)(722)及一貼附 在玻璃基板（711)(721)相對外側面的上偏光板（713)和下偏 光板（723)。 又電容式觸控板（80)主要係於一玻璃基板（81)的一表 面依序形成一透明電極（82)及一絕緣保護層（83)，另於透 明電極（82)的四角落分設電極並分別連接至一控制器（本圖 200949341 中均未示），以便透過電極檢測出使用者手指觸控面板表面 時產生的電流變化，進而由控制器運算出使用者觸控的位 置座標^ 而當前述電容式觸控板（80)整合至液晶面板（7〇)上時 ，係於電容式觸控板（80)的玻璃基板下表面覆設一抗 干擾層（74)，再使用光學膠（本圖中未示）將電容式觸控板 (80)貼附於液晶面板（70)的上偏光板（713)外表面處。 惟前述的組合構造至少存在下列缺點： 1_等同將一獨立的電容式觸控板（8〇)直接整合在液晶 面板（70)上，此種作法將直接增加厚度，不利於小型化的 要求。 2.由於電容式觸控板（8〇)本身亦具備玻璃基板（81)， 其覆設於液晶面板（70)上，勢必直接影響液晶面板（70)的 透光率。 3·又電容式觸控板（80)係透過封裝整合於液晶面板 (70)上’若封裝不當時亦將造成光學上的影響。 為解決前述問題，乃有將觸控板内建在液晶面板上的 相關技術問世’其可行方式包括下列數種： 如第十圖所示，主要係於液晶面板（7〇)上板（71)的外 側面上形成一作動層電極（84)，以構成一電容式觸控板， 如疋構^下’因省略了觸控板原有的玻璃基板，不論是厚 度或重量均可大幅減少。至於整合觸控板以後的液晶面板 其電路部分仍與觸控板各自獨立，如圖所示，觸控板的 電路。卩分係先在一電路板（8〇1)上以表面黏著技術（3(^丁）設 5 200949341 有一控制IC(802)’再令電路板（801)與一軟板（fp〇(8〇3) 壓著連結，並由該軟板（803)壓著於上板（71)的作動層電極 (84)上，使電路板（801)上的控制|C(8〇2)得以接收並處理 作動層電極（84)的訊號。 又液晶面板（70)的電路部分係採用c〇G(Chip 〇n Glass)技術在上板（71)内側面的一端植設有驅動丨c(75)， 並壓著有另一軟板（76) ’該軟板（76)係與驅動丨〇(75)電連 接’並作為液晶面板（70)與外部連接之用。 由上述可知’液晶面板（7〇)在結構上雖已將觸控板整 合其上’但在電氣系統上仍然各自獨立，此種狀況亦分別 出現在各種内建觸控板的觸控面板上，如第--圖所示， 係在上板（71)的外側面上形成作動層電極（84)，該作動層 電極（84)仍與前述方式相同，透過軟板（8〇3)與電路板 (801)上的控制|〇(8〇2)電連接。至於液晶面板（7〇)的電路 部分’係將驢動IC(75)植設在下板（72)的内側面上，並透 過壓著的軟板（76)作外部連結。 又如第十二圖所示液晶面板，其與上述不同處僅在上 板係於内側面上形成作動層電極（84)，其餘構造皆屬 相同。 再如第十三圖所示液晶面板，仍係在上板（71)的内側 面上形成作動層電極（84)，該作動層電極（84)係透過軟板 (803)與電路板（8〇1)上的控制|C(8〇2)電連接。液晶面板 (〇) 4刀則將駆動丨C(75)植設在上板（71)的内側面上，並 透過壓著的軟板（76)作外部連結。 6 200949341 在則述各種内建觸控板的液晶面板中，不論液晶面板 (7〇)的驅動丨C(75)係植設在其上板（71)或下板（72)上，觸 控板的作動層電極（84)係形成在上板（71 )的外側面或内側 面，不變的是：其透過不同的軟板（76)(8〇3)由不同方向出 線。但不論由不同板（上板或下板）或不同軟板及不同方向 出線，都將擴大製品的面積，而提高製造成本。 再者，觸控板的控制|C(802)係採取QFP封裝方式， 其女裝在電路板（8〇1)時採取表面黏著技術（SMT)，當電路 板（801)與軟板（8〇3)結合時則採取壓著方式。另一方面， 液晶面板（7〇)的驅動丨〇（75)係採取COG技術或TAB封裝 方式直接壓著在上板（71)或下板（72)上；故整體而言，觸 控板的控制IC(802)與液晶面板（70)的電路部分不僅各自獨 立’且分別透過不同的技術達成，其製程的複雜度高、工 時勢必因而延長，從而提高生產成本。 【發明内容] 由上述可知，液晶面板在内建觸控板後若未能有效整 合二者的電路部>，勢必衍生提高製程難纟、延長工時及 增加成本等問冑’故有待進一步檢討，並謀求可行的解決 方案。 因此本發明主要目的在提供一種内建觸控板暨整合 電路的液晶面板’其主要係利用液晶面板中的玻璃基板作 為觸控板的基材而將電容式觸控板整合於液晶面板上，另 將液晶面板與觸控板的電路進行整合，使製程得以簡化， 200949341 並有效掌控生產效率，降低成本β 為達成前述目的採取的主要技術手段係於一上板、一 下板之間設有一液晶層，以構成液晶面板；其中： 該上板於其内側面或外側面上形成一透明電極，以構 成一電容式觸控板； 又上板或下板在其中一面的一端上透過c〇G技術分 設一觸控板控制丨c及一面板驅動lc，該觸控板控制丨c、 面板驅動1C除分別與觸控板、液晶面板上的電極連接外 ，並共同連接至一軟板上，供外部連接之用； 利用前述技術除可將觸控板内建於液晶面板以外，亦 有效整合了液晶面板與觸控板的電路部分，以達成同板（同 在上板或同在下板）、同端子、同平面的出線方式，如此不 僅可簡化製程、減少元件（軟板）數量而大幅降低成本。 【實施方式】 關於本發明之第一較佳實施例，請參閱第一圖所示， 主要係於一上板（10)、一下板（20)之間設一液晶層（3〇)而構 成一液晶面板；其中：該上板（10)與下板（2〇)係至少分別 於一玻璃基板（11)(21)的相對内側面上分設有一透明電極 (12)(22);又上板（1〇)長度大於下板（2〇)，進一步而言，並 以一端伸出於下板（20)相對應的一端。 又為在液晶面板上内建一電容式觸控板，本實施例係 於上板（1 0)外側面上形成一作動層電極（4〇)，更具體而言 ’該作動層電極（40)係由透明電極構成，其利用了上板 200949341 (ίο)的玻璃基板(11)作為基材，使作動層電極(4〇)形成於該 玻璃基板（11)的外側面上’以構成一電容式觸控板，由於 省略了觸控板本身的玻璃基板’故整體厚度與重量得以縮 減。而前述玻璃基板（11>的外側面上得進一步形成一絕緣 保護層（Ha「d coat |ayer)(圖中未示），以便對其下層的作動 層電極（40)構成防護。 又請配合參閱第二圖所示，該上板（1〇)的玻璃基板 (11)於犬出於下板（20)—端的内側面上形成數組連接線路 (lay0Ut)(111)〜（113)，各連接線路（111)〜（113)的一端並延 伸至玻璃基板（1 1)的邊緣；再者，該玻璃基板（彳彳）内側面 上於形成前述連接線路（1ΐυ〜（113)的該端上進一步以 C〇G(Chip On G丨ass)技術分別植設一觸控板控制丨〇（51)及 一面板驅動丨C(52)，該觸控板控制丨〇（51)及面板驅動 丨〇（52)並分別與連接線路（111)〜（113)連接，又下板（2〇)之 玻璃基板（21)内側面上的透明電極（22)係透過上、下板 (1 0)(20)間封裝液晶層（3〇)用的框膠（31)(含有銅導電粒子） 與玻璃基板（11)内侧面上的連接線路（113)電連接；又玻璃 基板（1 1)之邊緣處壓著有一軟板（Fp〇(50)，該軟板（50)係 分別與延伸至玻璃基板（11)邊緣的連接線路（112)(113)電 連接’從而透過連接線路（112)(113)與觸控板控制|C(51) 及面板驅動IC(52)連接。 又本實施例中’作為觸控板的作動層電極（4〇)係形成 在玻璃基板（11)的外側面上，為使作動層電極（4 〇)與玻璃 基板（11)内側面上的觸控板控制IC(51)電連接，故除於玻 200949341 璃基板（11)外側面上形成與作動層電極（40)連接的連接線 路（114) ’該連接線路（114)另端並延伸至玻璃基板（I”的 邊緣’隨後令一軟性的橋接電路板（53)以一端壓著於玻璃 基板（11)邊緣處的連接線路（114)上並與其構成電連接，橋 接電路板（53)的另端則壓著於玻璃基板（彳彳）内側面上邊緣 處的連接線路（1 11 )，如此一來，該作動層電極（40)即透過 可撓曲的橋接電路板（53)與觸控板控制|C(51)電連接，至 此’觸控板與液晶面板的電路部分均被整合在上板（彳〇)上 ’且透過同一軟板（50)由同一端出線，作為外部連接之用 〇 又請參閱第三、四圖所示’係本發明第二較佳實施例 ，於本實施例中，仍係在上板（1〇)的玻璃基板（11)外側面 上形成作動層電極（40) ’與前一實施例不同處在於··令下 板（20)長於下板（1〇)，並在其玻璃基板（21)伸出於下板（1〇) 的一端内側面上形成複數連接線路（211 )(21 2)(21 3),又以 COG方式分別植設觸控板控制丨c(5i)及面板驅動丨c(52) ’並令觸控板控制IC(51)及面板驅動|〇(52)分別與前述連 接線路（211)(212)(213)電連接，該玻璃基板（21)於邊緣上 壓著一與連接線路（212)(213)電連接的軟板（5〇)，又玻璃 基板（1 1)外側面上的作動層電極（40)係透過軟性的橋接電 路板（53)與玻璃基板（21)内側面上的連接線路（211)電連接 〇 再請參閱第五、六圖所示’係本發明第三較佳實施例 ’與第一較佳實施例相較大致相同’不同處在於作動層電 200949341 極（40)係形成於玻璃基板（彳彳）的内侧面上，該作動層電極 (40)並位於透明電極（彳2)的内側，而為避免產生電子干擾 ，作動層電極（40)與透明電極（12)之間進一步形成有一絕 緣層（13) »由於本實施例中，該觸控板控制|c(51)、面板 驅動IC(52)仍係透過COG植設於下板（20)之玻璃基板（21) 的内側面上，與前一實施例不同，本實施例並不採用橋接 電路板作電連結，而係令作動層電極（4〇)透過絕緣層（1 3) 上形成的導通孔（130)及上、下板（10)(20)之間原來透過框 ❹ 膠（31)形成的電連接手段與玻璃基板（21)上的觸控板控制 IC(51)電連接。 另請參閱第七、八圖所示’係本發明第四較佳實施例 ’與第三較佳實施例相同，本實施例係將作動層電極（4〇) 形成於上板（10)的玻璃基板（11)内側面上，不同處在令上 板（1 〇)長於下板（20)，並使上板（1 〇)的玻璃基板（11)於伸出 下板（20)的一端内側面上植設觸控板控制|C(51)、面板驅 動IC(52)，其中，下板（20)之玻璃基板（21)内側面上的透 ❹ 明電極（22)係透過上、下板（1 0)(20)間封裝液晶層（30)的框 膠（31)與玻璃基板（11)内侧面上的面板驅動丨〇（52)構成電 連接，而作動層電極（40)則透過絕緣層（13)上形成的導通 孔（130)及利用剝離法（lift off)在透明電極（1 2)上形成的導 通孔（120)與玻璃基板（11)内側面上的觸控板控制丨〇（51)電 連接。 再者’同時植設在玻璃基板（11)内側面上的觸控板控 制IC(51)及面板驅動IC(52)亦透過同一玻璃基板（11)在同 11 200949341 一端所虔著的軟板（50)提供外部電連接之用。200949341 IX. Description of the Invention: [Technical Field] The present invention relates to a liquid crystal panel, in particular to a control circuit in which a touch panel is built in a liquid crystal panel and effectively integrates both, so as to be on the same board and the same terminal. And the same plane, the line is out, to effectively simplify the process, reduce the cost of the LCD panel. [Prior Art] ❹ There are many consumer electronic products that emphasize the convenience and affinity of their operating interfaces. Touch screens are used. The so-called touch interface generally installs a touchpad on the display. The board has an independent computing control system that determines the coordinates touched by the user and provides a control system that uses the display as a basis for performing the specified functions. As for the way in which a touch panel is externally mounted on the display, a prior art system, as shown in the ninth figure, is mainly for attaching a capacitive touch panel (80) to a liquid crystal panel (70) 'the liquid crystal panel (70) The liquid crystal layer (73) is mainly disposed between an upper plate (71) and the lower plate (72), and the upper plate (71) and the lower plate (72) respectively comprise at least one glass substrate (711) (721). a transparent electrode (71 2) (722) formed on the opposite inner side of the glass substrate (711) (721) and an upper polarizing plate (713) attached to the opposite outer side of the glass substrate (711) (721) And the lower polarizer (723). The capacitive touch panel (80) mainly forms a transparent electrode (82) and an insulating protective layer (83) on one surface of a glass substrate (81), and is further divided into four corners of the transparent electrode (82). The electrodes are respectively connected to a controller (not shown in FIG. 200949341), so that the current change generated when the user touches the surface of the panel is detected through the electrodes, and the position coordinates of the user's touch are calculated by the controller. ^ When the capacitive touch panel (80) is integrated on the liquid crystal panel (7〇), an anti-interference layer (74) is disposed on the lower surface of the glass substrate of the capacitive touch panel (80), and then used. An optical glue (not shown in the drawing) attaches the capacitive touch panel (80) to the outer surface of the upper polarizing plate (713) of the liquid crystal panel (70). However, the above-mentioned combined structure has at least the following disadvantages: 1_ equivalent to directly integrating a separate capacitive touch panel (8〇) on the liquid crystal panel (70), this method will directly increase the thickness, which is disadvantageous for miniaturization requirements. . 2. Since the capacitive touch panel (8 inch) itself also has a glass substrate (81), which is coated on the liquid crystal panel (70), it is inevitably directly affecting the light transmittance of the liquid crystal panel (70). 3. The capacitive touch panel (80) is integrated into the liquid crystal panel (70) through the package. If the package is not properly installed, it will also have an optical effect. In order to solve the above problems, there are related technologies in which a touch panel is built in a liquid crystal panel. The possible methods include the following: As shown in the tenth figure, mainly on the upper panel of the liquid crystal panel (7〇) (71) An active layer electrode (84) is formed on the outer side surface to form a capacitive touch panel. For example, the original glass substrate of the touch panel is omitted, and the thickness or weight can be greatly reduced. . As for the LCD panel after the integration of the touchpad, the circuit portion is still independent of the touchpad, as shown in the figure, the circuit of the touchpad. The 卩 先 先 先 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 在一 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 〇 3) pressing the connection and pressing the soft plate (803) against the actuation layer electrode (84) of the upper plate (71), so that the control |C (8〇2) on the circuit board (801) can be received. And processing the signal of the actuating layer electrode (84). The circuit part of the liquid crystal panel (70) is driven by a chip 〇G (Chip 〇n Glass) technology at one end of the inner side of the upper plate (71). ), and pressed with another soft board (76) 'The soft board (76) is electrically connected to the driving port (75)' and is used as a liquid crystal panel (70) for external connection. (7〇) Although the touchpad has been integrated into the structure, it is still independent on the electrical system. This situation also appears on the touch panels of various built-in touchpads, as shown in the figure-- As shown, an actuation layer electrode (84) is formed on the outer side of the upper plate (71). The actuation layer electrode (84) is still in the same manner as described above, and is transmitted through the flexible plate (8〇3) and the circuit board (801). Control| (8〇2) Electrical connection. As for the circuit part of the liquid crystal panel (7〇), the tilting IC (75) is implanted on the inner side of the lower plate (72) and is passed through the pressed soft plate (76). Further, as shown in Fig. 12, the liquid crystal panel has a movable layer electrode (84) formed only on the inner side of the upper plate at the difference from the above, and the rest of the structures are the same. The liquid crystal panel is still formed on the inner side of the upper plate (71) to form an actuation layer electrode (84), and the actuation layer electrode (84) is transmitted through the control plate on the flexible plate (803) and the circuit board (8〇1)|C (8〇2) Electrical connection. Liquid crystal panel (〇) 4 knives will be placed on the inner side of the upper plate (71) and externally connected through the pressed soft plate (76). 6 200949341 In the liquid crystal panel with various built-in touch panels, the driving 丨C(75) of the liquid crystal panel (7〇) is implanted on the upper board (71) or the lower board (72), and the touch is performed. The actuation layer electrode (84) of the plate is formed on the outer side or the inner side of the upper plate (71), and it is unchanged that it passes through different soft plates (76) (8〇3) and exits in different directions. By different boards The upper or lower board) or different soft boards and different directions will expand the area of the product and increase the manufacturing cost. Furthermore, the control of the touchpad|C(802) adopts the QFP package, and its women's wear Surface adhesion technology (SMT) is adopted on the circuit board (8〇1), and when the circuit board (801) is combined with the soft board (8〇3), the pressing method is adopted. On the other hand, the liquid crystal panel (7〇) The driving cymbal (75) is directly pressed on the upper plate (71) or the lower plate (72) by COG technology or TAB packaging; therefore, the touch panel control IC (802) and the liquid crystal panel (70) as a whole The circuit parts are not only independent but also achieved through different technologies, and the complexity of the process is high, and the working hours are bound to be extended, thereby increasing the production cost. SUMMARY OF THE INVENTION As can be seen from the above, if the liquid crystal panel fails to effectively integrate the circuit parts of the two after the built-in touch panel, it is bound to increase the difficulty of the process, extend the working hours, and increase the cost. Review and seek a viable solution. Therefore, the main purpose of the present invention is to provide a liquid crystal panel with a built-in touch panel and an integrated circuit. The main purpose is to integrate the capacitive touch panel into the liquid crystal panel by using the glass substrate in the liquid crystal panel as the substrate of the touch panel. In addition, the LCD panel and the touchpad circuit are integrated to simplify the process. 200949341 Effectively control the production efficiency and reduce the cost. The main technical means for achieving the above objectives is to provide a liquid crystal between the upper plate and the lower plate. a layer to form a liquid crystal panel; wherein: the upper plate forms a transparent electrode on the inner side or the outer side thereof to form a capacitive touch panel; and the upper or lower plate transmits c〇G on one end of one of the sides The technology is divided into a touch panel control panel and a panel driver lc. The touch panel controller 丨c and the panel driver 1C are respectively connected to the electrodes on the touch panel and the liquid crystal panel, and are connected to a soft board. For external connection; in addition to the above technology, the touch panel can be built outside the liquid crystal panel, and the circuit part of the liquid crystal panel and the touch panel is effectively integrated to achieve the same board. (same as the upper board or the same lower board), the same terminal, the same plane outlet mode, which not only simplifies the process, reduces the number of components (soft board) and greatly reduces the cost. [Embodiment] Regarding the first preferred embodiment of the present invention, please refer to the first figure, which is mainly composed of a liquid crystal layer (3〇) between an upper plate (10) and a lower plate (20). a liquid crystal panel; wherein: the upper plate (10) and the lower plate (2) are respectively provided with a transparent electrode (12) (22) on opposite inner sides of a glass substrate (11) (21); The upper plate (1 inch) has a length greater than the lower plate (2 turns), and further, one end protrudes from the corresponding end of the lower plate (20). In addition, a capacitive touch panel is built in the liquid crystal panel. In this embodiment, an actuation layer electrode (4〇) is formed on the outer surface of the upper panel (10), and more specifically, the actuation layer electrode (40) The structure is composed of a transparent electrode, which uses the glass substrate (11) of the upper plate 200949341 as a substrate, and the actuation layer electrode (4) is formed on the outer surface of the glass substrate (11) to constitute a Since the capacitive touch panel omits the glass substrate of the touch panel itself, the overall thickness and weight are reduced. On the outer side of the glass substrate (11), an insulating protective layer (Ha "d coat | ayer" (not shown) is further formed to protect the lower layer of the operating layer electrode (40). Referring to the second figure, the glass substrate (11) of the upper plate (1) forms an array connection line (lay0Ut) (111) to (113) on the inner side surface of the dog from the end of the lower plate (20), each of which Connecting one end of the lines (111) to (113) and extending to the edge of the glass substrate (11); further, the inner side of the glass substrate (彳彳) is formed at the end of the connecting line (1ΐυ~(113)) Further, a touch panel control unit (51) and a panel driver 丨C (52) are separately built by C〇G (Chip On G丨ass) technology, and the touch panel controls 丨〇(51) and panel driving.丨〇 (52) is connected to the connection lines (111) to (113), respectively, and the transparent electrode (22) on the inner side of the glass substrate (21) of the lower plate (2) is transmitted through the upper and lower plates (1 0 (20) The sealant (31) (containing copper conductive particles) for encapsulating the liquid crystal layer (3) is electrically connected to the connection line (113) on the inner side of the glass substrate (11) Further, at the edge of the glass substrate (11), a flexible board (Fp〇(50) is electrically pressed, and the flexible board (50) is electrically connected to the connecting line (112) (113) extending to the edge of the glass substrate (11), respectively. 'Therefore, it is connected to the touch panel control|C(51) and the panel driving IC (52) through the connecting line (112) (113). In this embodiment, the actuating layer electrode (4〇) as the touch panel is formed. On the outer side surface of the glass substrate (11), in order to electrically connect the actuation layer electrode (4 〇) to the touch panel control IC (51) on the inner side of the glass substrate (11), the glass substrate is replaced by a glass substrate 200911. a connection line (114) connected to the actuation layer electrode (40) is formed on the outer side surface. 'The connection line (114) is terminated at the other end and extends to the edge of the glass substrate (I" and then a flexible bridge circuit board (53) The other end of the bridge circuit board (53) is pressed against the connection line (114) at the edge of the glass substrate (11) and is electrically connected thereto. The other end of the bridge circuit board (53) is pressed against the edge of the inner side surface of the glass substrate (彳彳). Connecting the line (1 11 ), such that the actuation layer electrode (40) passes through the flexible bridge circuit board (53) The touchpad control|C(51) is electrically connected, so that the circuit parts of the 'touchpad and the liquid crystal panel are integrated on the upper board (彳〇) and the same end is taken out through the same soft board (50) as For the purpose of external connection, please refer to the third and fourth figures, which is the second preferred embodiment of the present invention. In this embodiment, it is still on the outer side of the glass substrate (11) of the upper plate (1 〇). The formation of the actuation layer electrode (40) ' differs from the previous embodiment in that the lower plate (20) is longer than the lower plate (1 〇) and protrudes from the lower plate (1 〇) on the glass substrate (21) thereof. A plurality of connecting lines (211) (21 2) (21 3) are formed on the inner side of one end, and the touch panel control 丨c(5i) and the panel driving 丨c(52)' are respectively arranged by the COG method and the touch panel is made The control IC (51) and the panel driver | 〇 (52) are electrically connected to the connection lines (211) (212) (213), respectively, and the glass substrate (21) is pressed against the edge of the connection line (212) (213). The electrically connected flexible board (5〇) and the actuating layer electrode (40) on the outer side of the glass substrate (1 1) pass through the connecting line between the flexible bridge circuit board (53) and the inner side of the glass substrate (21). The circuit (211) is electrically connected. Referring to the fifth and sixth figures, the third preferred embodiment of the present invention is substantially the same as the first preferred embodiment. The difference is that the operating layer is 200949341. Is formed on the inner side of the glass substrate (彳彳), and the actuation layer electrode (40) is located inside the transparent electrode (彳2), and to avoid electronic interference, the actuation layer electrode (40) and the transparent electrode ( 12) An insulating layer (13) is further formed between the top surface (20). In this embodiment, the touch panel control |c(51) and the panel driving IC (52) are still implanted in the glass of the lower plate (20) through the COG. On the inner side surface of the substrate (21), unlike the previous embodiment, the present embodiment does not use a bridge circuit board for electrical connection, but the conduction layer electrode (4 〇) is conductively formed through the insulating layer (13). The electrical connection means formed by the frame glue (31) between the hole (130) and the upper and lower plates (10) (20) is electrically connected to the touch panel control IC (51) on the glass substrate (21). Referring to the seventh and eighth embodiments, the fourth preferred embodiment of the present invention is the same as the third preferred embodiment. In this embodiment, the actuation layer electrode (4〇) is formed on the upper plate (10). On the inner side of the glass substrate (11), the upper plate (1 〇) is longer than the lower plate (20), and the glass substrate (11) of the upper plate (1 于) is extended at one end of the lower plate (20). On the inner side, a touch panel control|C (51) and a panel driving IC (52) are implanted, wherein the transparent electrode (22) on the inner side of the glass substrate (21) of the lower plate (20) is transmitted through the upper surface. The sealant (31) encapsulating the liquid crystal layer (30) between the lower plate (10) (20) and the panel drive port (52) on the inner side of the glass substrate (11) are electrically connected, and the actuation layer electrode (40) Passing through the via hole (130) formed on the insulating layer (13) and the via hole (120) formed on the transparent electrode (12) by lift-off and the touch on the inner side of the glass substrate (11) The board control 丨〇 (51) is electrically connected. Furthermore, the touch panel control IC (51) and the panel driving IC (52) which are simultaneously implanted on the inner side of the glass substrate (11) are also passed through the same glass substrate (11) at the same side as the 11 200949341. (50) Provide external electrical connections.
由上述說明可瞭解本發明各種可行實施例的具體實現 方式，惟必須進一步說明的是··前述各實施例的觸控板係 由單層的作動層電極所構成，在該等基礎的教示下，對於 所屬技術領域具有通常知識者應可輕易理解，並得輕易地 置換為由雙層作動層電極所構成的觸控板。例如在上板玻 璃基板的内側面或外側面上形成兩作動層電極，兩作動層 電極並形成有一絕緣層；除此以外，兩作動層電極並可分 別形成於上板玻璃基板的内側面及外側面上。 由上述可知，本發明不僅達成將觸控板内建於液晶面 目的同時亦有效地進一步整合觸控板與液晶面板 的電路#分’其令二者的電路部分位於同—板（上板或下板 )且透過同一媒介（軟板）由同一方向出線’藉此可降低 直接材料費用與生產成本；又傳統的觸控板㈣j|c係採 :QFP封裝方式，其安裝至電路板時採取表面黏著技術 夕MT) §電路板與軟板結合時則採取壓著方式，而涉及 的加工程序’本發明則令觸控板控制1C與面板 驅動1C相同採咖方式植設於同—玻璃基板上 大幅簡化製程、減少加工程序，進而降低成本。 【圖式簡單說明】 一.係本發明第一較佳實施例的上視平面圖。 係本發明第-較佳實施例的後視平面圖。 第四圖.係本發明第一較佳實施例的上視平面圖。 係本發明第二較佳實施例的前視平面圖。 12 200949341 第^圖.係本發明第三較佳實施例的上視平面圖。 第八圖.係本發明第三較佳實施例的前視平面圖。 第七圖·：係本發明第四較佳實施例的上視平面圖。 第八囷：係本發明第四較佳實施例的後視平面圖。 第九圖.係在液晶面板上直接外掛觸控板的示意圖。 第十圖·係-種内建觸控板的液晶面板之上視平面圖 第十—囷：係又一種内建觸控板的液晶面板 面圖。 現千 第十二圖：係再-種内建觸控板的液晶面板之上視平 面圖。 第十二圖：係另—種内建觸控板的液晶面板之上視平 面圖。 【主要元件符號說明】 (1〇)上板 (111)〜（114)連接線路 (13)絕緣層 (20)下板 (30)液晶層 (40)作動層電極 (51)觸控板控制丨c (53)橋接電路板 (71>上板 (711)(721)玻璃基板 (11) (21)玻璃基板 (12) (22)透明電極 (120)(130)導通孔 (211)〜（21 3)連接線路 (31)框膠 (50)軟板 (52)面板驅動IC (70)液晶面板 (72)下板 (712)(722)透明電極 13 200949341The specific implementation of various possible embodiments of the present invention can be understood from the above description, but it must be further explained that the touch panel of the foregoing embodiments is composed of a single layer of operating layer electrodes, under the teachings of the basics. It should be easily understood by those having ordinary knowledge in the art, and can be easily replaced with a touch panel composed of double-layer actuation layer electrodes. For example, two active layer electrodes are formed on the inner side surface or the outer side surface of the upper glass substrate, and the two operating layer electrodes are formed with an insulating layer; in addition, the two operating layer electrodes may be respectively formed on the inner side surface of the upper glass substrate and On the outside side. It can be seen from the above that the present invention not only achieves the purpose of further integrating the touch panel into the liquid crystal surface, but also effectively integrates the circuit of the touch panel and the liquid crystal panel, so that the circuit portions of the two are located on the same board (upper board or Lower board) and the same medium (soft board) from the same direction to exit 'this can reduce direct material costs and production costs; and traditional touchpad (four) j | c series: QFP package, when installed to the board Take the surface adhesion technology MT MT) § When the circuit board is combined with the soft board, the pressing method is adopted, and the processing procedure involved is 'the invention makes the touch panel control 1C and the panel driving 1C the same method of picking coffee in the same glass The substrate is greatly simplified, the processing procedure is reduced, and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS 1. A top plan view of a first preferred embodiment of the present invention. A rear plan view of a first preferred embodiment of the present invention. Figure 4 is a top plan view of a first preferred embodiment of the present invention. A front plan view of a second preferred embodiment of the present invention. 12 200949341 Fig. 4 is a top plan view of a third preferred embodiment of the present invention. Figure 8 is a front plan view of a third preferred embodiment of the present invention. Figure 7 is a top plan view of a fourth preferred embodiment of the present invention. Eighth 囷: a rear plan view of a fourth preferred embodiment of the present invention. The ninth figure is a schematic diagram of directly attaching the touch panel to the liquid crystal panel. Figure 10 - Top view of the LCD panel with built-in touch panel Tenth - 囷: A side view of a liquid crystal panel with a built-in touch panel. Thousands Twelfth Figure: A top view of a liquid crystal panel with a built-in touchpad. Figure 12: A top view of a liquid crystal panel with another built-in touch panel. [Main component symbol description] (1〇) upper plate (111) to (114) connection line (13) insulation layer (20) lower plate (30) liquid crystal layer (40) actuation layer electrode (51) touch panel control c (53) Bridge circuit board (71 > upper board (711) (721) glass substrate (11) (21) glass substrate (12) (22) transparent electrode (120) (130) via hole (211) ~ (21 3) Connection line (31) Frame glue (50) Soft board (52) Panel drive IC (70) Liquid crystal panel (72) Lower board (712) (722) Transparent electrode 13 200949341
(713)上偏光板 (7 3)液晶層 (7 5)驅動IC(713) Upper polarizing plate (7 3) Liquid crystal layer (7 5) Driving IC
(80) 電容式觸控板 (802)控制 IC (81) 玻璃基板 (83)絕緣保護層 (723)下偏光板 (74)抗干擾層 (76)軟板 (801)電路板 (803)軟板 (82)透明電極 (84)作動層電極(80) Capacitive touch panel (802) control IC (81) Glass substrate (83) Insulation protective layer (723) Lower polarizer (74) Anti-interference layer (76) Soft board (801) Circuit board (803) Soft Plate (82) transparent electrode (84) actuating layer electrode
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