TW200942827A - Multi-layer probe group and its manufacturing method - Google Patents
Multi-layer probe group and its manufacturing methodInfo
- Publication number
- TW200942827A TW200942827A TW97112719A TW97112719A TW200942827A TW 200942827 A TW200942827 A TW 200942827A TW 97112719 A TW97112719 A TW 97112719A TW 97112719 A TW97112719 A TW 97112719A TW 200942827 A TW200942827 A TW 200942827A
- Authority
- TW
- Taiwan
- Prior art keywords
- reinforcement layer
- insulation reinforcement
- layer
- probe group
- manufacturing
- Prior art date
Links
Abstract
The present invention relates to a multi-layer probe group and its manufacturing method for providing the use of electrical testing, which applies a microfilm process in a substrate to manufacture plural cantilever probes. The multi-layer probe group includes the following: an insulation reinforcement layer which is disposed on the substrate and formed into at least two openings connected to circuits; at least two conductive members which are respectively disposed in the openings of the insulation reinforcement layer, and also covered and supported by the insulation reinforcement layer; at least two cantilever probes of which each respectively has one beam member and one pinpoint member. The beam members are respectively connected with the conductive members, and local surface of at least one beam member is tightly supported and leaned on the insulation reinforcement layer; the pinpoint member is connected to the beam member; the stability of the cantilever probe structure by being tightly supported and leaned on the insulation reinforcement layer will be better.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97112719A TW200942827A (en) | 2008-04-08 | 2008-04-08 | Multi-layer probe group and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97112719A TW200942827A (en) | 2008-04-08 | 2008-04-08 | Multi-layer probe group and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200942827A true TW200942827A (en) | 2009-10-16 |
TWI391670B TWI391670B (en) | 2013-04-01 |
Family
ID=44868824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97112719A TW200942827A (en) | 2008-04-08 | 2008-04-08 | Multi-layer probe group and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200942827A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112444650A (en) * | 2019-08-30 | 2021-03-05 | 普罗-2000有限公司 | Probe head for testing display panel |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI572867B (en) * | 2015-06-05 | 2017-03-01 | Mpi Corp | Probe module with feedback test function (2) |
US11959941B2 (en) | 2021-12-27 | 2024-04-16 | Industrial Technology Research Institute | Probe card |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW583395B (en) * | 2002-03-13 | 2004-04-11 | Scs Hightech Inc | Method for producing micro probe tips |
US7640651B2 (en) * | 2003-12-31 | 2010-01-05 | Microfabrica Inc. | Fabrication process for co-fabricating multilayer probe array and a space transformer |
TWI276805B (en) * | 2005-11-10 | 2007-03-21 | Mjc Probe Inc | Probe of probe card and manufacturing method thereof |
-
2008
- 2008-04-08 TW TW97112719A patent/TW200942827A/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112444650A (en) * | 2019-08-30 | 2021-03-05 | 普罗-2000有限公司 | Probe head for testing display panel |
Also Published As
Publication number | Publication date |
---|---|
TWI391670B (en) | 2013-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |