200937557 九、發明說明： 【發明所屬之技術領域】 本發明係有關於-種向咖、卿用破璃基板以及半導 趙基板等基板供給處理液以實施各種處理之基板處理裝 置。 : 【先前技術】 先前以來’係藉由—邊搬送基板-邊對其表面供給各種 處理液而對基板實施特定之製程處理，例如專利文獻艸 ®肖示有一種裝置’其係於處理槽内-邊搬送藥液處理後之 基板’一邊藉由液體刀以及喷淋喷嘴依次向基板供給沖洗 液進行清洗處理者。在該裝置中，針對搬入之基板，首先 藉由液體刀自搬送方向上游側朝向下游側沿傾斜方向喷出 帶狀（沿與基板搬送方向正交之方向具有寬度之狀態）之沖 洗液’藉此自基&之前端側依次使藥液反應迅速且在基板 之寬度方向上均勻地完成，隨後藉由自喷淋喷嘴喷出之沖 洗液對基板進行最終清洗。 又於專利文獻2中揭示有一種與上述裝置類似之裝 置，其首先藉由液體刀噴出帶狀之沖洗液，自基板之前端 侧起依次且在基板之寬度方向上均句地形成沖洗液之薄膜 (保熹膜）’隨後藉由自高壓喷嘴喷出之沖洗液對基板進行 /月洗處理。該裝置之構成為，液體刀之設置區域由遮蔽物 所被覆，使得高壓喷嘴之喷射壓力不會對上述薄膜之形成 造成影響。 專利文獻1:日本專利特開2004-273984號公報 135404.doc 200937557 專利文獻2:日本專利特開2004-273743號公報 【發明内容】 [發明所欲解決之問題] 在如專利文獻1之先前裝置中，通常自液體喷嘴喷出沖 洗液’並於該狀態下將基板搬入處理槽内而對基板實施清 洗處理。然而，當使沖洗液自液體喷嘴喷出時，會因沖洗 液與搬送輥或處理槽内底部之碰撞而產生霧（霧狀之沖洗 液），從而會導致以下問題。 即，霧亦向基板之搬入口側擴散，從而於液體刀之沖洗 液供給位置之上游侧，霧附著到基板上。於.此情形時，在 原定之處理開始位置（沖洗液供給位置）之上游側，藥液之 一部分被提前置換’因此有可能會破壞基板面内之藥液反 應時間之均勻性。因此，需要事先避免此種問題之發生。 另外’在專利文獻2之構成中，在遮蔽體之内側產生之霧 亦會向沖洗液供給位置之上游側擴散並附著於基板，因此 其情形與上述相同。 本發明係鑒於上述問題而作者，其目的在於抑制在基板 到達特定之液體供給位置以前霧狀之處理液附著至基板 上’籍此提高基板之品質。 [解決問題之技術手段] 為解決上述問題，本發明提供一種基板處理裝置，其具 備處理槽，該處理槽具有將搬入之基板向搬出口搬送之搬 送路徑，在該處理槽内一邊搬送基板一邊向該基板供給處 理液實施特疋之處理，其特徵在於包含：喷嘴構件，其設 135404.doc 200937557 置在上述處理槽之搬人侧，遍及雜人之基板之上表面之 整個寬度，自搬送方向上游側朝向下游側沿相對於垂直方 向傾斜之方向喷出處理液；以及遮蔽板，其配置在自上述 嘴嘴構件嗔出之處理液的軌跡之搬送方向上游側之位置且 . ㉟置在上述搬送路徑之下方，防止霧狀處理液向搬送方向 游側擴散。體而t，上述遮蔽板直立設置在上述處 • 理槽之内底部，且設置成其前端位於上述搬送路徑上之處 理液供給位置附近。 ® 根據此種構成，即使因液體喷嘴噴出之處理液與處理槽 内底部碰撞等而產生霧（霧狀之處理液），亦可藉由遮蔽板 有效地防止霧向基板搬送方向上游側擴散。因此，能夠抑 制霧在基板之搬送路徑上向處理液供給位置之上游侧部分 擴散，從而可減少在基板到達上述供給位置之前霧附著於 基板上之現象。 較好的是，上述裝置更包含擴散防止機構，其防止霧狀 m 處理液經由上述噴嘴構件與上述遮蔽板前端之間隙部分向 上述搬送方向上游側擴散。 根據該構成，能夠可靠地防止霧向上游側擴散，從而能 : 夠更有效地減少霧附著於基板上之現象。 : 更具體而言，上述擴散防止機構係於上述喷嘴構件與上 述遮蔽板前端之間隙部分形成自上述搬送方向上游側流朝 向下游侧之氣流的氣流形成機構。 根據該構成，能夠藉由喷嘴構件與遮蔽板前端之間形成 的亂流來阻止霧向上游侧擴散。 135404.doc 200937557 另外’氣流形成機構只要可生成上述氣流則可使用各種 構成，例如可包括氣體之噴射機構，在上述遮蔽板之上述 搬送方向上游側使氣體自上述喷射機構喷出，籍此形成上 述氣〃 U·’或者亦可包括在上述遮蔽板之上述搬送方向下游 側對上述處理槽内之環境進行抽吸之抽吸機構，藉由上述 抽吸機構對由自上述噴嘴構件喷出之處理液及上述遮蔽板 圍成之空間内之環境進行抽吸，籍此形成上述氣流。 又’作為其他構成，上述擴散防止機構亦可包含可升降 地设置於上述遮蔽板之升降板以及驅動控制該升降板之控 制機構，上述升降板遍及上升位置與下降位置之間可升降 地構成，上述上升位置係其前端位於自上述喷嘴構件喷出 之處理液之軌跡之下方且位於沿上述搬送路徑搬送之基板 之上表面的上方之位置，上述下降位置係上述前端位於搬 送路徑之下方之位置，上述控制機構對上述升降板進行驅 動控制，以使在未向上述處理槽搬入基板時，使上述升降 板配置在上升位置，而在向上述處理槽搬入基板時，使上 述升降板配置在下降位置。 該構成係構成為藉由升降板來開閉喷嘴構件與上述遮蔽 板前端之間隙部分。根據該構成，在未搬入基板時，若在 自喷嘴構件喷出沖洗液之狀態下升降板配置於上升位置， 則沖洗液與升降板聯動而堵塞上述間隙部分，從而與設置 上述氣流形成機構之情形同樣，阻止霧自上述間隙部分向 上游側擴散。 另外，較好的是，上述基板處理裝置包含罩構件，其在 135404.doc 200937557 上述搬送方向上的自上述喷嘴構件起之上游側部分，自其 上方被覆上述搬送路徑。 、，根據該構成，在霧繞至喷嘴構件之上方而擴散至基板搬 ，方向上游側之情形時，可防止該霧附著於基板。因此， 能夠更有效地減少霧附著於基板之現象。 [發明之效果] 根據請求項1〜8之之基板處理裝置，能夠有效地減少如 下之現象：因自喷嘴構件噴出之處理液與處理槽内底部碰 撞而產生之霧（霧狀之處理液）附著於到達特定之處理液 供給位置以前之基板。因此’藉由減少此種霧附著於基板 之現象，可提鬲基板之品質。特別是，根據請求項之 基板處理裝置之構成，能夠有效地阻止霧經由自喷嘴構件 喷出之處理液與遮蔽板前端部之間向上游側擴散，因此， 能夠更有效地減少如上所述之霧附著於基板之現象。又， 根據請求項8之基板處理裝置之構成，在霧繞至喷嘴構件 之上方而向基板搬送方向上游側擴散之情形時，能夠防止 該霧附著於基板。因此，能夠更有效地減少霧附著於基板 之現象。 Ο ❹ 【實施方式】 參照附圖對本發明之較佳實施方式進行說明。 <第一實施方式> 圖1係概略表示本發明之基板處理裝置之剖面圖。該圖 所示之基板處理裝置1 一邊將基板S以水平姿態沿圖中箭頭 方向搬送’ 一邊對在前步驟中實施過藥液處理（例如蚀刻 135404.doc -10· 200937557 處理）之該基板s進行清洗處理。 如圖1所示’基板處理裝置1具有大致密閉之處理室 1〇(相當於本發明之處理槽在該處理室10内，以特定間 隔配備有多個搬送輥14，沿由該等搬送輥14構成之搬送路 徑以水平姿態搬送基板S。 另外’圖中之符號12a表示在處理室10之側壁上形成之 基板S之搬入口 ’符號i 2b表示該基板s之搬出口。又，符 號13a表不用於開閉搬入口 123之搬入口侧閘門（shutter)， 符號13b表不用於開閉搬出口 12b之搬出口侧閘門。該等閘 門13a、13b係沿處理室1〇之侧壁可升降地設置，且構成為 藉由馬達進行開閉驅動。 在處理室10之内部，配備有用於對基板S供給沖洗液（在 本例中為純水，相當於本發明之處理液）之2種液體喷嘴。 具體而言，在緊靠搬入口 12a之附近配備有液體刀16(相當 於本發明之喷嘴構件），在該液體刀16之下游側（在該圖中 為右側）配備有喷淋喷嘴18a、18b。 上述液體刀16係固定於安裝板15上，該安裝板15突出設 置在處理室10之搬入口側壁面。液體刀16由所謂之狹缝噴 嘴構成，該狹縫喷嘴具有在基板3之搬送路徑之寬度方向 (與基板S之搬送方向正交之方向，在該圖中為與紙面正交 之方向）上細長且在其長度方向上連續延伸之細長之喷出 口，該液體刀16係以使噴出口朝向斜下方之狀態配置在搬 送輥14之上部。籍此，自液體刀16，自該搬送方向上游側 朝向下游側相對於垂直方向傾斜朝下地呈帶狀（沿與搬送 135404.doc 200937557 方向正交之方向具有寬度之狀態）對基板s喷出沖洗液。 另外’固定有液體刀16之上述安裝板15兼用作防止霧狀 之沖洗液（以下稱為霧）飛散至基板3之罩構件，在基板3之 搬送方向上的自液體刀16之位置至上述搬入口側之壁面為 止之部分’自上方被覆基板S之搬送路徑。安裝板15之上 游側知部以及寬度方向之端部分別與處理室1 〇之側壁無間 •隙地接合。 另一方面’上述噴淋噴嘴18a、18b夾著搬送輥14而配置 ❿ ⑨上下兩側’例如自呈矩陣狀配置之嘴嘴口分別呈液滴狀 對基板S喷出沖洗液。 另外’如該圖所示，沖洗液係儲存在配置於處理室1〇下 方之儲液箱20内，藉由泵22之作動自儲液箱2〇經由導出管 24導出’並經由自該導出管24分岔之供給管26〜28分別供 給至液體刀16以及各喷淋喷嘴18&、18b。於各供給管 26〜28中分別介設有開閉閥vi〜V3，藉由該等開閉閥 〇 V1〜V3之操作，控制液體刀16等對沖洗液之供給、停止或 者供給量。 在處理室10之内底部設有漏斗狀之回收缽（未圖示），使 用過之沖洗液一邊被該回收缽收集一邊經由回收管30返回 至上述儲液箱20内。亦即，該基板處理裝置i中構成有沖 洗液之供排系統，能夠使沖洗液一邊在儲液箱2〇與液體刀 16等之間循環一邊反覆使用。 在上述處理室10之内底部，進而設有用於阻止霧向上游 側擴散之遮蔽板17，並且在該遮蔽板17之上游側配置有空 135404.doc •12- 200937557 氣喷嘴32(相當於本發明之噴射機構）。 如圖2(a)所$，將遮蔽板17設置在未搬送基板§之狀態 下自液體刀16噴出之沖洗液之軌跡之上游側之位置，且設 置在基板s之搬送路徑（以下簡稱為搬送路徑）上之對基板s 供給沖洗液之供給位置P(參照圓2(b))之下方。該遮蔽板i7 係形成為，自處理室1〇之内底面沿垂直方向筆直地延伸， 且其别端（上端）與沿搬送路徑搬送之基板s之下方接近。 遮蔽板17之寬度方向之兩端分別與處理室10之側壁接 合，藉此，處理室10内之空間被劃分為上游側端之空間Sp 與其下游側之空間，該上游侧端之空間Sp由上述安裝板 15、液體刀16、遮蔽板17以及處理室1〇之侧壁圍成且包括 上述搬入口 12a，經由液體刀16與上述遮蔽板17之前端（上 端）之間搬送基板S。 上述空氣喷嘴32係配置於遮蔽板丨7之附近且配置於處理 室1〇之内底面附近。該空氣噴嘴32由在寬度方向上延伸之 參細長之噴霧喷嘴或者狹縫喷嘴構成，該喷霧喷嘴在其長度 方向上排列有多個圓形之噴出口，該狹縫喷嘴具有在長度 方向上連續地（或者斷續地）延伸之細長之喷出口，且該空 軋喷嘴32係構成為，自遮蔽板17側朝向處理室丨〇之搬入口 12a側之壁面朝斜上方喷射特定壓力之空氣。 如圖1所示’該空氣喷嘴32經由空氣供給管34與空氣供 給源36連接’藉由介設於空氣供給管34中之開閉閥V4之操 作，控制空氣之喷射或停止。 另外，於該基板處理裝置1中設有以CPU等為構成要素 135404.doc 13 200937557 之控制器（相當於本發明之控制機構），且構成為，藉由該 控制器統一地控制搬送輥14之驅動、閘門13a、13b之開閉 切換以及開閉閥V1〜V4之切換等。並且，於該裝置i中， 如圖1所示，在處理室1〇外之上述搬入口 12a之大致上游側 以及處理室10内之上述搬出口 12b附近分別配置有用於檢 測基板S之感測器（稱為第一感測器42、第二感測器44)， 控制器根據該等感測器42、44對基板S之檢測而控制閘門 13a、13b以及開閉閥VI〜V4等之開閉。 其次’對基板處理裝置1對基板S之清洗處理及其作用效 果進行說明。 在該基板處理裝置中，在第一感測器42檢測出基板8之 前，各開閉閥VI〜V3關閉（OFF)，因此液體刀16以及噴淋 噴嘴1 8a、1 8b停止供給沖洗液，與此相反，開閉閥v4打開 (ON)。因此，自空氣噴嘴32喷射特定壓力之空氣，籍此， 如圖2(a)所示’在處理室10内，在被遮蔽板17等劃分而成 之上述空間Sp内空氣對流，並且該空氣經由在液體刀16和 遮蔽板17之前端之間形成的間隙部分〇s朝下游側流動。亦 即’形成自上述空間SP經由上述間隙部分〇s朝向下游側之 空氣流（稱為氣流A)。 繼而’當搬送基板S，而其前端被第一感測器42檢測出 時，開閉閥V1-V3自關閉（OFF)狀態切換至打開（〇%狀 態，籍此，液體刀16以及喷淋喷嘴18a、18b開始噴出沖洗 液。 如上所述，當自各噴嘴16、18a、18b喷出沖洗液時，會 135404.doc -14- 200937557 在處理至1G内產生霧’因此在基板s到達沖洗液供給位置p 之前有可能會在基板s上附著霧，但該中能夠有效地 避免此種問題。 即，在該裝置1中，在基板3之搬送路徑上方中位於供給 位置P之上游側之部分之大半部分被安裝板15等被覆，進 而’當自液體刀16噴出沖洗液時，如圖2⑷所示，在該液 體刀16與供給位置p之間形成液幕。因此，如該圖中符號[Technical Field] The present invention relates to a substrate processing apparatus that supplies a processing liquid to a substrate such as a coffee glass, a glass substrate for use, and a semiconductor substrate to perform various processes. [Prior Art] Previously, the substrate was subjected to a specific process treatment by supplying various treatment liquids to the surface thereof by, for example, transferring the substrate. For example, the patent document 艸® shows a device which is attached to the processing tank. - The substrate "after the liquid chemical treatment is carried out", the cleaning liquid is sequentially supplied to the substrate by the liquid knife and the shower nozzle, and the cleaning process is performed. In the apparatus, the liquid-jet blade is first ejected in a strip shape (a state having a width in a direction orthogonal to the substrate transport direction) in the oblique direction from the upstream side toward the downstream side in the transport direction by the liquid blade. The drug solution is rapidly reacted in sequence from the front side of the base & and is uniformly completed in the width direction of the substrate, and then the substrate is finally cleaned by the rinse liquid sprayed from the shower nozzle. Further, in Patent Document 2, there is disclosed a device similar to the above-described device, which firstly ejects a strip-shaped rinsing liquid by a liquid knife, and sequentially forms a rinsing liquid from the front end side of the substrate and uniformly in the width direction of the substrate. The film (film) is then subjected to a monthly wash treatment by a rinse liquid sprayed from a high pressure nozzle. The apparatus is constructed such that the installation area of the liquid knife is covered by the shield so that the injection pressure of the high pressure nozzle does not affect the formation of the film. Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-273984 No. 135404.doc 200937557 Patent Document 2: Japanese Laid-Open Patent Publication No. 2004-273743 [Draft of the Invention] [Problems to be Solved by the Invention] In the prior art as in Patent Document 1 In this case, the rinsing liquid is normally ejected from the liquid nozzle, and in this state, the substrate is carried into the processing tank to perform a cleaning process on the substrate. However, when the rinsing liquid is ejected from the liquid nozzle, mist (a mist-like rinsing liquid) is generated by the collision of the rinsing liquid with the conveying roller or the bottom of the processing tank, which may cause the following problems. That is, the mist is also diffused toward the inlet side of the substrate, and the mist adheres to the substrate on the upstream side of the supply position of the rinse liquid of the liquid knife. In this case, a part of the chemical liquid is displaced in advance on the upstream side of the original processing start position (flushing liquid supply position), and thus it is possible to deteriorate the uniformity of the chemical liquid reaction time in the substrate surface. Therefore, it is necessary to avoid such problems in advance. Further, in the configuration of Patent Document 2, the mist generated inside the shielding body is diffused to the upstream side of the rinsing liquid supply position and adhered to the substrate. Therefore, the same applies to the above. The present invention has been made in view of the above problems, and an object thereof is to suppress the adhesion of a mist-like treatment liquid to a substrate before the substrate reaches a specific liquid supply position, thereby improving the quality of the substrate. [Means for Solving the Problems] In order to solve the above problems, the present invention provides a substrate processing apparatus including a processing tank having a transport path for transporting a loaded substrate to a transfer port, and transporting the substrate while the processing tank is being transported The processing of supplying the processing liquid to the substrate is characterized in that the nozzle member is provided with a nozzle member 135404.doc 200937557 placed on the moving side of the processing tank, and spreads over the entire width of the upper surface of the substrate of the person. The upstream side of the direction is sprayed toward the downstream side in a direction inclined with respect to the vertical direction; and the shielding plate is disposed at a position upstream of the conveying direction of the trajectory of the processing liquid drawn from the nozzle member and is placed at Below the transfer path, the mist-like treatment liquid is prevented from diffusing toward the transport side. And the shielding plate is erected at the bottom of the inside of the space, and is disposed such that the front end thereof is located near the liquid supply position of the transport path. According to this configuration, even if a mist (a mist-like treatment liquid) is generated by a collision of the treatment liquid sprayed from the liquid nozzle with the bottom of the treatment tank, the mist can effectively prevent the mist from diffusing toward the upstream side in the substrate conveyance direction. Therefore, it is possible to suppress the diffusion of the mist on the upstream side portion of the processing liquid supply position on the substrate transport path, and it is possible to reduce the phenomenon in which the mist adheres to the substrate before the substrate reaches the supply position. Preferably, the apparatus further includes a diffusion preventing mechanism that prevents the mist-like m treatment liquid from diffusing toward the upstream side in the transport direction via the gap portion between the nozzle member and the tip end of the shield plate. According to this configuration, it is possible to reliably prevent the mist from diffusing to the upstream side, and it is possible to more effectively reduce the phenomenon in which the mist adheres to the substrate. More specifically, the diffusion preventing means is an air flow forming means that forms a flow of air from the upstream side in the transport direction toward the downstream side in a gap portion between the nozzle member and the tip end of the shield plate. According to this configuration, it is possible to prevent the mist from diffusing toward the upstream side by the turbulent flow formed between the nozzle member and the tip end of the shield plate. 135404.doc 200937557 In addition, the airflow forming means can use various configurations as long as the airflow can be generated. For example, a gas jetting mechanism can be used, and gas can be ejected from the jetting mechanism upstream of the transporting direction of the shielding plate. The gas cartridge U·' may further include a suction mechanism for sucking an environment in the processing tank on a downstream side of the shielding plate in the conveying direction, and the suction mechanism is used to eject the nozzle member from the nozzle member. The treatment liquid and the environment in the space enclosed by the shielding plate are sucked, thereby forming the above air flow. Further, as another configuration, the diffusion preventing means may include a lifting plate that is vertically movable on the shielding plate and a control mechanism that drives and controls the lifting plate, and the lifting plate is configured to be movable up and down between the raised position and the lowered position. The rising position is a position at a position above the upper surface of the substrate conveyed along the transport path below the trajectory of the processing liquid ejected from the nozzle member, and the lowering position is a position at which the front end is located below the transport path The control unit drives and controls the lift plate so that the lift plate is placed at the raised position when the substrate is not loaded into the processing tank, and the lift plate is disposed to be lowered when the substrate is loaded into the processing tank. position. This configuration is configured such that the gap between the nozzle member and the tip end of the shield plate is opened and closed by the lift plate. According to this configuration, when the elevating plate is placed at the raised position in a state where the rinsing liquid is ejected from the nozzle member, the rinsing liquid and the elevating plate are interlocked to block the gap portion, and the air flow forming mechanism is provided. Also, the fog is prevented from diffusing from the gap portion to the upstream side. Moreover, it is preferable that the substrate processing apparatus includes a cover member that covers the transport path from above in the upstream side of the nozzle member in the transport direction of 135404.doc 200937557. According to this configuration, when the mist is wound above the nozzle member and diffused to the substrate transfer direction in the upstream direction, the mist can be prevented from adhering to the substrate. Therefore, the phenomenon that the mist adheres to the substrate can be more effectively reduced. [Effects of the Invention] According to the substrate processing apparatuses of the first to eighth embodiments, it is possible to effectively reduce the mist generated by the collision of the treatment liquid ejected from the nozzle member with the bottom portion of the treatment tank (the mist treatment liquid) Attached to the substrate before reaching the specific processing liquid supply position. Therefore, the quality of the substrate can be improved by reducing the phenomenon in which such mist adheres to the substrate. In particular, according to the configuration of the substrate processing apparatus of the request, it is possible to effectively prevent the mist from diffusing to the upstream side between the processing liquid discharged from the nozzle member and the tip end portion of the shielding plate, so that the above-described manner can be more effectively reduced. The phenomenon that fog adheres to the substrate. Further, according to the configuration of the substrate processing apparatus of claim 8, when the mist is wound above the nozzle member and spread toward the upstream side in the substrate transfer direction, the mist can be prevented from adhering to the substrate. Therefore, the phenomenon that the mist adheres to the substrate can be more effectively reduced.实施 实施 BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of the present invention will be described with reference to the accompanying drawings. <First Embodiment> Fig. 1 is a cross-sectional view schematically showing a substrate processing apparatus of the present invention. The substrate processing apparatus 1 shown in the figure performs the chemical liquid treatment (for example, etching 135404.doc -10·200937557 processing) on the substrate S while carrying the substrate S in the horizontal direction in the direction of the arrow in the figure. Perform cleaning treatment. As shown in Fig. 1, the substrate processing apparatus 1 has a substantially sealed processing chamber 1 (corresponding to the processing tank of the present invention, a plurality of conveying rollers 14 are disposed at predetermined intervals in the processing chamber 10, along which the conveying rollers are The transfer path of the configuration 14 transports the substrate S in a horizontal posture. Further, the reference numeral 12a in the figure indicates the entrance of the substrate S formed on the side wall of the processing chamber 10, and the symbol i 2b indicates the transfer port of the substrate s. Further, the symbol 13a The table is not used for the opening and closing side shutter of the opening and closing port 123, and the symbol 13b is not used for the opening and closing port of the opening and closing port 12b. The gates 13a and 13b are arranged to be lifted and lowered along the side wall of the processing chamber 1 The inside of the processing chamber 10 is provided with two types of liquid nozzles for supplying a flushing liquid (in this example, pure water, which corresponds to the processing liquid of the present invention) to the substrate S. Specifically, a liquid blade 16 (corresponding to the nozzle member of the present invention) is provided in the vicinity of the carry-in port 12a, and a shower nozzle 18a is provided on the downstream side (the right side in the figure) of the liquid blade 16 18b. Above The body blade 16 is fixed to the mounting plate 15, and the mounting plate 15 is protruded from the side wall surface of the processing chamber 10. The liquid blade 16 is constituted by a so-called slit nozzle having a transport path on the substrate 3. An elongated discharge port which is elongated in the width direction (the direction orthogonal to the conveyance direction of the substrate S, which is orthogonal to the plane of the drawing in the drawing) and continuously extends in the longitudinal direction thereof, and the liquid blade 16 is sprayed In the state in which the outlet is inclined downward, the upper portion of the conveyance roller 14 is disposed, and the liquid blade 16 is inclined downward from the upstream side toward the downstream side in the conveyance direction toward the downstream side (in the direction of conveyance 135404.doc 200937557) In the state in which the orthogonal direction has a width, the rinsing liquid is ejected to the substrate s. Further, the mounting plate 15 to which the liquid knives 16 are fixed serves as a cover member for preventing the mist-like rinsing liquid (hereinafter referred to as a mist) from scattering to the substrate 3. The portion from the position of the liquid blade 16 to the wall surface on the inlet side in the transport direction of the substrate 3 'the transport path from the upper substrate S. The upstream side of the mounting plate 15 and the width The end portions of the direction are respectively joined to the side walls of the processing chamber 1 无 without gaps. On the other hand, the shower nozzles 18a and 18b are disposed on the upper and lower sides of the transport roller 14 (for example, the nozzles are arranged in a matrix shape). The mouth sprays the rinsing liquid on the substrate S in the form of droplets. In addition, as shown in the figure, the rinsing liquid is stored in the liquid storage tank 20 disposed under the processing chamber 1 , and the liquid is pumped by the pump 22 The tanks 2 are led out via the outlet pipe 24 and supplied to the liquid knife 16 and the respective shower nozzles 18 & 18b via the supply pipes 26 to 28 branched from the outlet pipe 24, respectively. The opening and closing valves vi to V3 are provided, and the supply, stop, or supply amount of the rinsing liquid by the liquid knife 16 or the like is controlled by the operation of the opening and closing valves 〇V1 to V3. A funnel-shaped recovery crucible (not shown) is provided at the bottom of the processing chamber 10, and the used rinse liquid is returned to the reservoir tank 20 via the recovery pipe 30 while being collected by the recovery crucible. That is, the substrate processing apparatus i is provided with a supply and discharge system for the washing liquid, and the flushing liquid can be used repeatedly while circulating between the liquid storage tank 2 and the liquid knife 16 or the like. A shielding plate 17 for preventing the mist from diffusing toward the upstream side is further provided in the bottom portion of the processing chamber 10, and an air 135404.doc • 12-200937557 air nozzle 32 is disposed on the upstream side of the shielding plate 17 (corresponding to the present Invented spray mechanism). As shown in Fig. 2(a), the shielding plate 17 is disposed at the upstream side of the trajectory of the rinsing liquid ejected from the liquid lance 16 in a state where the substrate is not conveyed, and is disposed at the transport path of the substrate s (hereinafter referred to as The supply path P (refer to the circle 2 (b)) is supplied to the substrate s on the transfer path. The shielding plate i7 is formed to extend straight from the inner bottom surface of the processing chamber 1 in the vertical direction, and the other end (upper end) is adjacent to the lower side of the substrate s transported along the transport path. Both ends of the shielding plate 17 in the width direction are respectively joined to the side walls of the processing chamber 10, whereby the space in the processing chamber 10 is divided into the space Sp of the upstream side end and the space of the downstream side thereof, and the space Sp of the upstream side end is The mounting plate 15, the liquid blade 16, the shielding plate 17, and the side wall of the processing chamber 1 are surrounded by the transfer port 12a, and the substrate S is transferred between the liquid blade 16 and the front end (upper end) of the shielding plate 17. The air nozzles 32 are disposed in the vicinity of the shielding plate 7 and are disposed in the vicinity of the inner bottom surface of the processing chamber 1A. The air nozzle 32 is composed of a slender spray nozzle or a slit nozzle extending in the width direction, and the spray nozzle has a plurality of circular discharge ports arranged in the longitudinal direction thereof, the slit nozzle having a longitudinal direction An elongate discharge port that is continuously (or intermittently) extended, and the air-rolling nozzle 32 is configured to eject a specific pressure of air from the side of the shield plate 17 toward the side of the transfer port 12a of the process chamber. . As shown in Fig. 1, the air nozzle 32 is connected to the air supply source 36 via the air supply pipe 34. By the operation of the opening and closing valve V4 interposed in the air supply pipe 34, the injection or stop of the air is controlled. Further, the substrate processing apparatus 1 is provided with a controller (corresponding to the control mechanism of the present invention) having a CPU or the like as a component 135404.doc 13 200937557, and is configured to collectively control the conveying roller 14 by the controller. The drive, the switching of the shutters 13a and 13b, and the switching of the on-off valves V1 to V4. Further, in the device i, as shown in FIG. 1, sensing for detecting the substrate S is disposed on the substantially upstream side of the transfer port 12a outside the processing chamber 1 and in the vicinity of the transfer port 12b in the processing chamber 10, respectively. The controller (referred to as a first sensor 42 and a second sensor 44) controls the opening and closing of the gates 13a and 13b and the opening and closing valves VI to V4 according to the detection of the substrate S by the sensors 42 and 44. . Next, the cleaning process of the substrate S by the substrate processing apparatus 1 and the effect thereof will be described. In the substrate processing apparatus, before the first sensor 42 detects the substrate 8, the respective opening and closing valves VI to V3 are turned off (OFF), so that the liquid blade 16 and the shower nozzles 18a and 18b stop supplying the rinse liquid, and In contrast, the opening and closing valve v4 is opened (ON). Therefore, air of a specific pressure is ejected from the air nozzle 32, whereby air convection is performed in the space Sp divided by the shielding plate 17 or the like in the processing chamber 10 as shown in Fig. 2(a), and the air The flow portion 〇s flowing between the liquid knife 16 and the front end of the shielding plate 17 flows toward the downstream side. That is, an air flow (referred to as airflow A) formed from the space SP toward the downstream side via the gap portion 〇s. Then, when the substrate S is conveyed and the front end thereof is detected by the first sensor 42, the opening and closing valves V1 - V3 are switched from the OFF state to the ON state (〇% state, whereby the liquid knife 16 and the shower nozzle 18a, 18b start to eject the rinsing liquid. As described above, when the rinsing liquid is ejected from each of the nozzles 16, 18a, 18b, 135404.doc -14 - 200937557 will generate a mist in the treatment to 1G", thus reaching the rinsing liquid supply at the substrate s It is possible to attach a mist to the substrate s before the position p, but this problem can be effectively avoided. That is, in the device 1, the portion on the upstream side of the supply position P in the upper side of the transport path of the substrate 3 Most of the cover is covered by the mounting plate 15 or the like, and further, when the rinsing liquid is ejected from the liquid lance 16, as shown in Fig. 2 (4), a liquid curtain is formed between the liquid knives 16 and the supply position p. Therefore, the symbol as in the figure
Ml所示，能夠有效地防止來自搬送路徑上方之霧向沖洗 液供給位置P之上游側擴散。 又，在搬送路徑之下方，由於如上所述在供給位置 下方設置有遮蔽板17，因此能夠防止在處理室内底面產生 之霧向供給位置p之上游側擴散。而且，自空氣喷嘴32喷 射空氣，從而在液體刀16與遮蔽板17之間隙部分〇s中形成 有自上述空間Sp朝向下游側之氣流A，其結果，能夠阻止 霧經由該間隙部分0s向上游侧擴散。具體而言，如該圖中 符號M2所示，能夠有效地防止自處理室内底面沿遮蔽板 17上升之霧或者與搬送輥14碰撞而在供給位置p附近產生 之霧經由上述間隙部分〇s向上游側擴散。因此，能夠防止 在基板S到達供給位置p之前在該基板s上附著霧之問題。 繼而’當搬入口側閘門13a打開，基板s被搬入至處理室 10内並到達供給位置P時，液體刀16喷出之沖洗液伴隨著 基板S之搬送，自基板s之前端側依次遍及整個寬度方向而 供給’藉此使藥液反應迅速且在基板3之寬度方向上均句 地完成。 135404.doc 15 200937557 另外，在如上所述基板S通過供給位置p之過程中，基板 S上之該供給位置P之上游側之部分被安裴板丨5等自其上方 被覆，且在液體刀16和基板S之間形成有液幕β又，在基 板S之下方，如圖2(b)所示，藉由自空氣噴嘴32喷射之空 氣形成沿基板s之下表面自上游側朝向下游側之氣流Α，其 結果，能夠防止霧向供給位置Ρ之上游側擴散。因此能夠 有效地防止霧附著到基板S上之供給位置ρ之上游側部分。 並且，當基板S通過液體刀16之位置後，繼而對基板8之 上表面以及下表面供給自喷淋噴嘴18a、i8b噴出之大量沖 洗液，藉此對基板S進行最終清洗。繼而，當進一步搬送 基板S，而第二感測器44檢測出基板8之前端聘，開閉閥1 自打開（ON)狀態切換至關閉（0FF)狀態，籍此，停止自液 體刀16噴出沖洗液，進而，#第二感測器44檢測出基板s 之後端時，使開閉閥V2、V3分別自打開（〇N)狀態切換至 關閉（OFF)狀態，藉此，停止自喷淋喷嘴18a、i8b喷出沖 洗液。藉此，對基板S之一系列清洗處理結束。 如上所述，在上述基板處理裝置1中，能夠有效地防止 在基板S到達液體刀丨6之沖洗液供給位置p之前在該基板s 上附著霧之情況。因此，能夠有效地防止此種因霧之附著 造成之問題，即，能夠有效地防止下述事態之產生：在基 板S到達供給位置P以前，在其上游側位置霧附著至基板s 上，從而藥液反應局部提前結束，其結果，藥液處理之均 勻性受到影響。因此，由於能夠避免上述事態之產生從 而相應地能夠對基板S更均勻地實施藥液處理，進而能夠 135404.doc -16- 200937557 提高基板之品質》 另外，在上述實施方式申係構成為，在處理室1〇之内底 面附近配置有空氣喷嘴32，自遮蔽板17側朝向處理室1〇之 搬入口側之壁面朝斜上方噴射空氣，但如圖3所示，亦可 構成為，將空氣噴嘴32配置於搬入口 12a之上方，使空氣 喷嘴32直接朝向液體刀16與遮蔽板17之間喷射特定壓力之 空氣’從而形成上述氣流A。根據該構成，具有如下之優 點：能夠抑制空氣之壓力損失，從而能夠效地防止霧侵入 至上述空間Sp内。 <第二實施方式> 圖4是概略表示第二實施方式之基板處理裝置1之主要部 分之剖面圖。 第二實施方式之基板處理裝置1與第一實施方式之不同 之處在於’取代上述空氣噴嘴32而設置了抽吸嘴4〇(相當 於本發明之抽吸機構）。即’如該圖所示，在遮蔽板17之 下游侧且自液體刀16喷出之沖洗液之軌跡之上游側之位置 配置有抽吸嘴40。 抽吸嘴40係在寬度方向上延伸之細長狀且在其長度方向 上排列有多個圓形抽吸口之吸嘴。該抽吸嘴40經由未圖示 之抽吸用配管以及開閉閥與負壓發生器連接，且構成為， 對應於上述控制器對開閉閥之控制而在抽吸狀態與抽吸停 止狀態之間切換。 在第二實施方式之基板處理裝置1中，抽吸嘴40與自液 體刀16等開始喷出沖洗液同步地開始對處理室1〇進行抽 135404.doc •17- 200937557 吸。亦即，藉由對在自液體刀16噴出之 :::成的空間内之環境進行抽吸，排出該空間::Γ 二=吸而在液體刀16與遮蔽板17之上述間隙部分 广成自上述空間Sp内朝向下游側之氣流a 霧經由間隙部分〇s向上游側擴散。 止 於如此之第二構成中，亦可防止霧向上述供給位置卜 :游:則擴散1而能夠獲得與第一實施方式相同之如下效As indicated by M1, it is possible to effectively prevent the mist from the upper side of the transport path from diffusing toward the upstream side of the rinse liquid supply position P. Further, since the shielding plate 17 is provided below the supply position as described above, it is possible to prevent the mist generated on the bottom surface of the processing chamber from being diffused toward the upstream side of the supply position p. Further, air is ejected from the air nozzle 32, so that the airflow A from the space Sp toward the downstream side is formed in the gap portion 〇s of the liquid blade 16 and the shielding plate 17, and as a result, the fog can be prevented from being upstream via the gap portion 0s. Side diffusion. Specifically, as shown by the symbol M2 in the figure, it is possible to effectively prevent the mist rising from the bottom surface of the processing chamber along the shielding plate 17 or the mist generated in the vicinity of the supply position p from colliding with the conveying roller 14 via the gap portion 〇s upward. The side of the swim spread. Therefore, it is possible to prevent the problem of fogging on the substrate s before the substrate S reaches the supply position p. Then, when the inlet side gate 13a is opened and the substrate s is carried into the processing chamber 10 and reaches the supply position P, the rinse liquid discharged from the liquid blade 16 is transported along with the substrate S, and the entire front end side of the substrate s is sequentially applied throughout. The supply is made in the width direction, whereby the chemical solution is quickly reacted and completed uniformly in the width direction of the substrate 3. 135404.doc 15 200937557 In addition, in the process of the substrate S passing through the supply position p as described above, the portion on the upstream side of the supply position P on the substrate S is covered by the ampoule plate 5 or the like from above, and in the liquid knife A liquid curtain β is formed between the substrate 16 and the substrate S. Below the substrate S, as shown in FIG. 2(b), the air ejected from the air nozzle 32 is formed along the lower surface of the substrate s from the upstream side toward the downstream side. As a result of the air flow, it is possible to prevent the mist from diffusing toward the upstream side of the supply position Ρ. Therefore, it is possible to effectively prevent the mist from adhering to the upstream side portion of the supply position ρ on the substrate S. Then, after the substrate S passes through the position of the liquid blade 16, the upper surface and the lower surface of the substrate 8 are supplied with a large amount of the washing liquid sprayed from the shower nozzles 18a, i8b, whereby the substrate S is finally cleaned. Then, when the substrate S is further transported, and the second sensor 44 detects the front end of the substrate 8, the on-off valve 1 is switched from the ON state to the OFF state, thereby stopping the flushing from the liquid knife 16 The liquid, and further, when the second sensor 44 detects the rear end of the substrate s, the opening and closing valves V2 and V3 are respectively switched from the open (〇N) state to the closed (OFF) state, whereby the self-spraying nozzle 18a is stopped. , i8b sprays the rinse solution. Thereby, one series of cleaning processing of the substrate S is completed. As described above, in the substrate processing apparatus 1, it is possible to effectively prevent the mist from adhering to the substrate s before the substrate S reaches the rinse liquid supply position p of the liquid blade 6. Therefore, it is possible to effectively prevent such a problem caused by the adhesion of the mist, that is, it is possible to effectively prevent the occurrence of a situation in which the mist adheres to the substrate s at the upstream side position before the substrate S reaches the supply position P, thereby The reaction of the drug solution is terminated prematurely, and as a result, the uniformity of the treatment of the drug solution is affected. Therefore, it is possible to prevent the occurrence of the above-described situation, and accordingly, it is possible to more uniformly perform the chemical treatment on the substrate S, and it is possible to improve the quality of the substrate by 135404.doc -16 - 200937557. Further, in the above embodiment, the configuration is An air nozzle 32 is disposed in the vicinity of the inner bottom surface of the processing chamber 1A, and air is ejected obliquely upward from the shielding plate 17 side toward the wall surface of the processing chamber 1A. However, as shown in FIG. The nozzle 32 is disposed above the carry-in port 12a, and the air nozzle 32 is caused to directly eject a specific pressure of air between the liquid blade 16 and the shield plate 17 to form the airflow A. According to this configuration, it is possible to suppress the pressure loss of the air and effectively prevent the mist from entering the space Sp. <Second Embodiment> Fig. 4 is a cross-sectional view schematically showing a main part of a substrate processing apparatus 1 according to a second embodiment. The substrate processing apparatus 1 of the second embodiment is different from the first embodiment in that a suction nozzle 4 is provided instead of the air nozzle 32 (corresponding to the suction mechanism of the present invention). That is, as shown in the figure, the suction nozzle 40 is disposed at a position on the downstream side of the shield plate 17 and upstream of the locus of the rinse liquid discharged from the liquid blade 16. The suction nozzle 40 is a nozzle which is elongated in the width direction and has a plurality of circular suction ports arranged in the longitudinal direction thereof. The suction nozzle 40 is connected to the negative pressure generator via a suction pipe (not shown) and an opening and closing valve, and is configured to be between the suction state and the suction stop state in response to the controller controlling the opening and closing valve. Switch. In the substrate processing apparatus 1 of the second embodiment, the suction nozzle 40 starts pumping the processing chamber 1 in synchronization with the start of the discharge of the rinsing liquid from the liquid lance 16 or the like. That is, the space is discharged by suctioning the environment in the space formed by the liquid knife 16 from:::: Γ 2 = suction and the gap between the liquid knife 16 and the shielding plate 17 is widely distributed. The mist a from the inside of the space Sp toward the downstream side is diffused toward the upstream side via the gap portion 〇s. In the second configuration as described above, it is possible to prevent the fog from being diffused to the supply position, and to spread the first one, and to obtain the same effect as the first embodiment.
果，即.能夠防止在基板S到達供給位置p之前 板S上》 町考主基 亦P第一實施方式與第二實施方式之共同點在於，均 具有作為本發明之擴散防止機構之氣流形成機構，該氣流 形成機構用於在上述間隙部分08内形成自上游側流朝向T 游側之氣流A，但在第一實施方式中，氣流形成機構係藉 由自空氣噴嘴32喷射空氣來形成氣流a，而在第二實施方 式中’氣流形成機構係藉由抽吸嘴4〇對環境之抽吸來形成 氣流A 〇 <第三實施方式> 圖5係概略表示第三實施方式之基板處理裝置1之主要部 分之剖面圖。 第三實施方式之基板處理裝置1與第一實施方式之在構 成上之不同點在於’代替上述空氣喷嘴32而設有閘門 41(相當於本發明之升降板）。 閘門41係簡單地對液體刀16與遮蔽板17之間的上述間隙 部分Os進行開閉。該閘門41可升降地設置在上述遮蔽板17 I35404.doc -18- 200937557 之上游側之面上，且構成為，藉由未圖示之馬達而受到升 降驅動’並且藉由上述控制器而受到開閉控制。 閘門41係遍及上升位置與下降位置之間可升降地構成， 上述上升位置係其上端（前端）位於自液體刀Μ喷出之處理 液之軌跡下方且位於沿搬送路徑搬送之基板3之上表面之 上方之位置（圖中之實線位置），上述下降位置係其上端位 於搬送路徑之下方之位置，具體而言，該閘門41之上端位 於與遮蔽板17之上端大致相同高度之位置（圖中之虛線位 置）即，在自液體刀16喷出沖洗液之狀態下將閘門41配 置於上升位置，籍此使自液體刀16喷出之沖洗液（液幕）與 該閘門41聯動而將液體刀16與遮蔽板17之上述間隙部分… 封閉。亦即，在該實施方式中，由上述閘門41等構成本發 明之擴散防止機構。 在該第二實施方式之基板處理裝置1中，在自液體刀16 等開始嗔出沖洗液後直至基板S被搬入為止之期間，閘門 • 41係配置在上升位置，液體刀16與遮蔽板17之間隙部分〇s 如上所述般被閘門41封閉。籍此，能夠防止霧經由該間隙 部分Os向上游侧（空間Sp)擴散。 因此，在如此之第二構成中，亦可抑制霧向上述供給位 置P之上游側擴散’從而能夠有效地防止在基板S到達供給 位置P以前霧附著至基板S之問題。 另外’當基板S搬入至處理室1〇内時，閘門41配置在下 降位置，從而能夠容易地搬送基板S。 然而’上述各基板處理裝置1僅係本發明之基板處理裝 135404.doc • 19· 200937557 置之較佳實施方式之示例，在不脫離本發明宗旨之範圍内 可適當變更其具體構成。In other words, it is possible to prevent the first embodiment from being in contact with the substrate S before the substrate S reaches the supply position p. The first embodiment and the second embodiment have the same feature in that the airflow is formed as the diffusion preventing mechanism of the present invention. The airflow forming mechanism is configured to form the airflow A from the upstream side toward the T-side in the gap portion 08, but in the first embodiment, the airflow forming mechanism forms the airflow by injecting air from the air nozzle 32. a, in the second embodiment, the 'airflow forming mechanism forms a gas flow A by sucking the suction nozzle 4 to the environment. Third Embodiment> FIG. 5 is a schematic view showing the substrate of the third embodiment. A cross-sectional view of a main portion of the processing apparatus 1. The substrate processing apparatus 1 of the third embodiment is different in configuration from the first embodiment in that a shutter 41 (corresponding to the elevating plate of the present invention) is provided instead of the air nozzle 32. The shutter 41 simply opens and closes the gap portion Os between the liquid knife 16 and the shield plate 17. The shutter 41 is provided on the upper surface side of the shielding plate 17 I35404.doc -18- 200937557 so as to be lifted and lowered, and is configured to be lifted and driven by a motor (not shown) and received by the controller. Open and close control. The gate 41 is configured to be movable up and down between a rising position and a lowering position, wherein the upper end (front end) is located below the track of the processing liquid ejected from the liquid blade and is located on the upper surface of the substrate 3 conveyed along the conveying path. The position above (the solid line position in the figure) is the position where the upper end is located below the transport path, and specifically, the upper end of the shutter 41 is located at substantially the same height as the upper end of the shield plate 17 (Fig. In the state in which the liquid lance 16 discharges the rinsing liquid, the shutter 41 is placed at the raised position, whereby the rinsing liquid (liquid curtain) ejected from the liquid lance 16 is interlocked with the shutter 41. The gap portion ... of the liquid knife 16 and the shield plate 17 is closed. That is, in this embodiment, the above-described shutter 41 or the like constitutes the diffusion preventing means of the present invention. In the substrate processing apparatus 1 of the second embodiment, the shutter 41 is placed at the rising position, and the liquid blade 16 and the shielding plate 17 are disposed from the liquid blade 16 or the like until the substrate S is carried in. The gap portion 〇s is closed by the shutter 41 as described above. Thereby, it is possible to prevent the mist from diffusing to the upstream side (space Sp) via the gap portion Os. Therefore, in the second configuration as described above, it is possible to suppress the mist from diffusing toward the upstream side of the supply position P, and it is possible to effectively prevent the problem that the mist adheres to the substrate S before the substrate S reaches the supply position P. Further, when the substrate S is carried into the processing chamber 1A, the shutter 41 is placed at the lowering position, so that the substrate S can be easily transported. However, the above-described respective substrate processing apparatuses 1 are merely examples of the preferred embodiment of the substrate processing apparatus 135404.doc, 19, 200937557 of the present invention, and the specific configuration thereof can be appropriately changed without departing from the scope of the invention.
例如，關於遮蔽板17之具體構成，只要能夠防止霧向上 游側擴散，則其具體形狀等並不僅限定於上述實施方式QFor example, the specific configuration of the shielding plate 17 is not limited to the above-described embodiment Q as long as it can prevent the mist from spreading to the upstream side.
例如，在實施方式中’遮蔽板丨7之寬度方向兩側係與處理 至10之側壁無間隙地接合，但在對基板S之處理影響較小 之清^/下，亦可在遮蔽板17之寬度方向之兩側與處理室1〇 之側壁之間形成稍許之間隙。此點對於安裝板15亦同樣。 又，在上述實施方式中，將遮蔽板17設置成其上端（前 端）位於沖洗液供給位置P之下方，但無須嚴格地位於供給 位置P之下方，只要是在供給位置p之附近，則亦可位於其 上游側或下游側。但，若要在供給位置？之上游側可靠地 防止霧之附著，則優先使遮蔽板17之上端在沖洗液軌跡之 上游側位於上述供給位置p處或其下游侧。 牡上迷各實施方式中，說明了將本發明適用於對 基板S進行清洗處理之基板處理裝们之例子，但理所當然 僅限定於清洗處理，亦可適用於進行藥液 處之基板處理裝置。又，在實施方式中，說明了將本發 明適用於-邊水平搬送基板s 一邊進行處理 置1中之情形，但理所當然地，本發明亦可2 斜搬送基板S-邊對基板8進行處理之基 ^ 一邊傾 【圖式簡單說明】 裝置。 一實施方式） 圖1係概略表示本發明之基板處理裝置（第 之整體構成之剖面圖。 I35404.doc •20· 200937557 圖2(a)、圖2(b)係圖1中 m , a ^ 要口P刀之放大圖，表示液體刀 、近之具體構成’其中，圖2( ) * 0 . 固表不開始嘴出沖洗液之後 且搬入基板前之狀態，圖以μ矣 圃2(b)表不開始搬入基板之後之狀 態。 圖3係概略表示基板處理裝置（第一實施方式之變形例） 之剖面圖。 圖4係表示本發明之基板處理裝置（第二實施方式）之液 體刀附近之構成之主要部分之剖面圖。For example, in the embodiment, the sides of the shielding plate 7 in the width direction are joined to the side walls of the processing to 10 without gaps, but in the case where the processing of the substrate S is less affected, the shielding plate 17 may be used. A slight gap is formed between the two sides of the width direction and the side walls of the processing chamber 1 . This is also the same for the mounting plate 15. Further, in the above embodiment, the shielding plate 17 is disposed such that its upper end (front end) is located below the rinsing liquid supply position P, but need not be strictly below the supply position P, as long as it is near the supply position p. It may be located on its upstream side or downstream side. But, what if you want to be in the supply position? When the upstream side reliably prevents the adhesion of the mist, the upper end of the shield plate 17 is preferentially located at the supply position p or the downstream side thereof on the upstream side of the rinsing liquid trajectory. In each of the embodiments, the present invention has been described as being applied to a substrate processing apparatus for cleaning the substrate S. However, it is of course limited to the cleaning treatment, and may be applied to a substrate processing apparatus for performing a chemical liquid. Further, in the embodiment, the case where the present invention is applied to the horizontal transfer substrate s while the processing is performed is described. However, the present invention can naturally handle the substrate 8 by obliquely transporting the substrate S-side. Base ^ One side tilt [simplified diagram] device. 1 is a cross-sectional view showing an overall configuration of a substrate processing apparatus according to the present invention. I35404.doc • 20· 200937557 Fig. 2(a) and Fig. 2(b) are diagrams of m and a in Fig. 1. The magnified view of the mouth P knife indicates the liquid knife, the specific composition of the near one. Among them, Fig. 2 ( ) * 0 . The solid table does not start the state after the mouth rinses out and moves into the substrate, the figure is μ矣圃2 (b Fig. 3 is a cross-sectional view schematically showing a substrate processing apparatus (a modification of the first embodiment). Fig. 4 is a liquid knife showing a substrate processing apparatus (second embodiment) of the present invention. A cross-sectional view of the main part of the nearby structure.
圖5係表示本發明之基板處理裝置（第三實施方式）之液 體刀附近之構成之主要部分之剖面圖。 【主要元件符號說明】 1 基板處理裝置 10 處理室 14 搬送輥 16 液體刀 17 遮蔽板 18a、18b 喷淋喷嘴 32 空氣喷嘴 S 基板 135404.doc • 21 ·Fig. 5 is a cross-sectional view showing the main part of the configuration of the vicinity of the liquid lance of the substrate processing apparatus (third embodiment) of the present invention. [Main component symbol description] 1 Substrate processing device 10 Processing chamber 14 Transfer roller 16 Liquid knife 17 Masking plate 18a, 18b Spray nozzle 32 Air nozzle S Substrate 135404.doc • 21 ·