TW200936663A - Photovoltaic modules with plasticizer-containing films based on polyvinyl acetal having high resistivity - Google Patents
Photovoltaic modules with plasticizer-containing films based on polyvinyl acetal having high resistivity Download PDFInfo
- Publication number
- TW200936663A TW200936663A TW097138011A TW97138011A TW200936663A TW 200936663 A TW200936663 A TW 200936663A TW 097138011 A TW097138011 A TW 097138011A TW 97138011 A TW97138011 A TW 97138011A TW 200936663 A TW200936663 A TW 200936663A
- Authority
- TW
- Taiwan
- Prior art keywords
- plasticizer
- photovoltaic module
- polyvinyl acetal
- module according
- film
- Prior art date
Links
- 239000004014 plasticizer Substances 0.000 title claims abstract description 34
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229920002554 vinyl polymer Polymers 0.000 title claims abstract description 21
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 title claims abstract 8
- 230000009477 glass transition Effects 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 4
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 claims description 3
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229940116351 sebacate Drugs 0.000 claims 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical group [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- WZEFLOBFCQPVHR-UHFFFAOYSA-N bis(8-methylnonyl) cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCCOC(=O)C1CCCCC1C(=O)OCCCCCCCC(C)C WZEFLOBFCQPVHR-UHFFFAOYSA-N 0.000 claims 1
- OJXOOFXUHZAXLO-UHFFFAOYSA-M magnesium;1-bromo-3-methanidylbenzene;bromide Chemical compound [Mg+2].[Br-].[CH2-]C1=CC=CC(Br)=C1 OJXOOFXUHZAXLO-UHFFFAOYSA-M 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 claims 1
- 239000010408 film Substances 0.000 description 47
- 239000010410 layer Substances 0.000 description 24
- 150000001241 acetals Chemical class 0.000 description 15
- -1 polyethylene Polymers 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000006359 acetalization reaction Methods 0.000 description 3
- 239000005340 laminated glass Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- WTTWSMJHJFNCQB-UHFFFAOYSA-N 2-(dibenzylamino)ethanol Chemical compound C=1C=CC=CC=1CN(CCO)CC1=CC=CC=C1 WTTWSMJHJFNCQB-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000000052 vinegar Substances 0.000 description 2
- 235000021419 vinegar Nutrition 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- SSKNCQWPZQCABD-UHFFFAOYSA-N 2-[2-[2-(2-heptanoyloxyethoxy)ethoxy]ethoxy]ethyl heptanoate Chemical compound CCCCCCC(=O)OCCOCCOCCOCCOC(=O)CCCCCC SSKNCQWPZQCABD-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- ABBCSRCJHMUVRA-UHFFFAOYSA-N CCCCOC(COC(CCCCC(O)=O)=O)OCC Chemical compound CCCCOC(COC(CCCCC(O)=O)=O)OCC ABBCSRCJHMUVRA-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- FANBESOFXBDQSH-UHFFFAOYSA-N Ethyladipic acid Chemical compound CCC(C(O)=O)CCCC(O)=O FANBESOFXBDQSH-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 238000001159 Fisher's combined probability test Methods 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 229920001744 Polyaldehyde Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- NCDCLPBOMHPFCV-UHFFFAOYSA-N hexyl hexanoate Chemical group CCCCCCOC(=O)CCCCC NCDCLPBOMHPFCV-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N pentanal Chemical compound CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005401 pressed glass Substances 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10688—Adjustment of the adherence to the glass layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Joining Of Glass To Other Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Description
200936663 六、發明說明: 【發明所屬之技術領域】 本發明係關於利用基於具備高電阻之聚乙烯縮醛的含 增塑劑之薄臈製造光伏打模組。 5 【先前技術】 光伏打模組係由光敏之半導艨層構成,該層具有透明 之包覆料作為抵抗外部效應之保護。作為光敏之半導體 層,可使用單晶太陽電池或受承載之多晶、薄半導體層。 10 薄膜太陽電池模組係由藉由例如蒸發塗布、化學蒸氣沈 積、喷濺、或溼沈積而塗敷於幾肀透明之片板上之光敏之 半導體層構成。 兩種系統通常皆係於破璃平板與一種例如由破璃或 塑膠製造之剛性之後覆蓋平板之間,藉由透明之黏著劑而 15 層合。 透明之黏著劑必須完全封閉該光敏之半導體層及其 電互連’必須係紫外線安定的及灌氣不敏感的,及於層人 ⑬ 製程之後必須完全不含氣泡。 13 作為透明之黏著劑’時常使用熱固性塑製之樹脂或可 20 交聯之以乙烯_乙酸乙烯酯(EVA)為基礎之系統,諸^例 如於德國專利DE 41 22 721 C1或德國專利de 41 28 766 A1中揭示。於未固化之狀態中,可調節此等黏著劑系統到 達致使彼等不含氣泡地封閉太陽電池單位之低黏度。於固 化劑或交聯劑之添加之後,獲得機械性強健的黏著劑層。 25 此等黏著劑系統之一種缺點係,於固化製程之期間,時常 200936663 釋出有化學活性之物質,諸如酸類,其等可能破壞光敏之 半導體層,特定言之薄膜模組。此外,某些塑製之樹脂於 若干年後由於紫外線照射之結果,趨於生成氣泡或分層。 對於熱固性黏著劑系統之一種可選擇方案係以聚乙 稀縮駿類(諸如自夾層玻璃之製造而已為吾人所知之聚乙 稀丁搭(PVB))為基礎之含增塑劑之薄膜之使用。太陽 電池單元係以一層或一層以上之PVB薄膜覆蓋,及該等薄 膜係於提高之磨力及溫度下以合適之覆蓋材料黏合成為 層壓物。 使用PVB薄膜以製造太陽電池模組之方法係已為吾 人所知的’例如自德國專利DE 40 26 165 C2、德國專利DE 42 278 60A1、德國專利DE 29 237 70 C2、德國專利DE35 38 986 C2、或美國專利us 4,321,418。PVB薄膜於太陽電 池模乡且中作為層合之安全玻璃之使用係例如於德國專利 DE 20 302 045 U1、歐洲專利现1617487 A1、及德國專利 DE 35 389 86 C2中揭示。然而,此等文獻未包含關於使用 之PVB薄膜之機械、化學、及電之性質之資訊。 隨著光敏之半導體層之逐漸提高之效率及太陽電池 模組之全球之分布,黏著劑薄膜之電性質特定言之變成愈 來愈重要。於該模組之整個壽命期間内,於極端之氣候條 件(諸如熱帶之溫度、高溼度、或強烈之紫外線照射)下, 亦必須避免半導體層之電荷之損失或甚至短路。根據CEI 61215 ’光伏打模組係經歷多種試驗(溼熱試驗、溼漏洩 電流試驗)’俾能降低模組之漏洩電流。為了達到此目的, 該等黏著劑薄膜必須具有儘可能高之電阻。 4 25 200936663 【發明内容】 目的 本發明目的因此係提供基於具備高電阻之聚乙烯縮醛 5 的含增塑劑之薄膜以製造光伏打模組。 令人驚訝地,吾人已發現具有較高玻璃轉移溫度Tg之 薄膜具有較高電阻。不欲受理論正確性所限制,此係歸因 於玻璃狀或高度黏稠環境中較低之離子遷移率。 ❿ 10 發明内容 本發明之標的因此係光伏打模組,其包含一下列各者 組成之層壓物: a) 透明之前包覆料; b) —層或一層以上之光敏之半導體層; 15 C)至少一層之以聚乙烯縮醛為基礎之含增塑劑的薄 膜;及 d)後包覆料; © 其中以聚乙烯縮醛為基礎之含增塑劑的薄膜c)具有至 少20°C之玻璃轉移溫度Tg。 2〇 根據本發明所用薄膜之玻璃轉移溫度Tg在各情況下 較佳係至少 22°C、24°C、26°C、27°C、30°C 或 35°C。可將 40°C指定為玻璃轉移溫度Tg之最高值。 以聚乙烯縮醛為基礎之含增塑劑的薄膜的玻璃轉移溫 度Tg主要係由所用增塑劑之含量及極性或塑化效果決 25 定。因此,該薄膜之電阻可以簡單方式經由增塑劑調整。 200936663 根據本發明所用薄膜較佳在85%RH之周 23。〇下呈現至少1Ε+11Ω*厘米,較佳係至少5Ε+11Ω*厘^, 較佳係*1Ε+12Ω厘米,較隹係5Ε+12Ω*厘米,較佳係 1Ε+13Ω厘米,較佳係5Ε+13Ω*厘米,較佳係iE+i4y厘米 5 之電阻。該薄膜之任何位置,特別係模組之邊緣區域應達 到這些值。 ‘ 基於含增塑劑之聚乙烯縮醛之薄膜較佳包含藉由丁醛 縮酸·化聚乙細醇所獲得之未經交聯之聚乙稀縮丁搭(PVB)。 .亦可能使用已交聯聚乙烯縮醛,特別係已交聯聚乙烯 10 縮丁醛(PVB)。適合的已交聯聚乙烯縮醛係描述於(例如)Ερ 1527107 Β1及WO 2004/063231 Α1(含羧基之聚乙稀縮醛之 熱自交聯)、EP 1606325 A1(經與聚醛交聯之聚乙烯縮醛)及 WO 03/020776 A1(經與乙醛酸交聯之聚乙烯縮醛)中。將這 些專利申請案之揭示内容以引用方式整個併入本文中。 15 亦可利用具有5-10個碳原子之其他或額外醛(如(例如) 戊醛)進行縮醛化。 在本發明範圍内亦可利用已水解乙酸乙烯酯/乙烯共 > 聚物之三元共聚物作為聚乙烯醇。這些化合物通常水解至 98%以上並包含1至10重量%乙烯基單元(例如,Kuraray 20 Europe GmbH 之“Exceval”類型)。 聚乙烯縮醛除了縮搭單元之外亦另包含由乙酸乙烯酯 與乙烯醇產生之單元。根據本發明所用之聚乙稀縮搭較佳 具有低於21重量% ’低於18重量% ’低於16重量%或最 佳係低於14重量❶/〇之聚乙烯醇含量。該聚乙稀醇含量不應 低於12重量%〇 25 200936663 聚乙酸乙烯酯含量較佳係低於5重量%,較佳係低於3 重量%,最佳係低於2重量%。可由聚乙烯醇含量及剩餘乙 酸酯含量計算縮醛化程度。 根據本發明所需薄膜之高電阻可藉由增塑劑之類型及 5 /或用量調整。 該等薄膜較佳具有最高26重量%,更佳係最高24重 量% ’且最佳係最高22重量%之增塑劑含量;基於薄膜加 工性之故’增塑劑含量應不低於15重量%。根據本發明薄 膜或光伏打模組可包含一或多種增塑劑。 〇 根據本發明特別適合者為以式1〇〇X〇/(C+H)表示之極 性低於/等於9.4之增塑劑,其中〇、C及Η代表個別分子 中氧、碳及氫原子之數目。下表顯示根據本發明可應用之 增塑劑及其根據式1〇〇X〇/(C+H)之極性值。 名稱 縮寫 100xO/(C+H) 二-2-乙基己基癸二酸醋 (DOS) 5.3 二-2-乙基己基己二酸酉旨 (DOA) 6.3 二-2-乙基己基醜酸酯 (DOP) 6.5 己一酸^一己基醋 (DHA) 7.7 癸二酸二丁基酯 (DBS) 7.7 二-2-丁氧癸-酸酯 (DBES) 9.4 ϋ二㉟己酸酯 (3G8) 9.4 1,2-ϊ衣己烧一緩酸-異壬基醋 (DINCH) 5.4 適合性稍差者為下列增塑劑: 15 200936663 名稱 縮寫 100xO/(C+H) 三乙二醇雙-正庚酸酯 3G7 10.3 四乙二醇雙-正庚酸酯 4G7 10.9 二-2-丁氧基··乙基己二酸酉旨 DBEA 11.5 一 _2_ 丁氧基-乙氧基-乙基己 二酸酯 DBEEA 12.5 聚乙烯縮醛薄膜對玻璃之黏性通常藉由添加黏著力調 Ο ❹ 15 整劑如(例如)W〇 03/033583 A1中所揭示之有機酸之鹼金 屬及/或鹼土金屬鹽調整。結果乙酸鉀及/或乙酸鎂係特別適 合的。 此外,I乙烯縮醛經常包含源自製造製程之無機酸之 鹼金屬及/或鹼土金屬鹽,如(例如)氯化鈉。 因為鹽亦對電阻具有影響,因此較佳係使用具有低於 50=,更佳係具有低於3〇 ppm,最佳係具有低於2〇鹏 之以聚乙烯祕為基礎之含增塑劑的薄膜。此 _之適當清洗製程及利用特別有效之 技者已知之有機酸之鎮、⑽顿例 電阻可㈣膜之水含量而定之離子遷移率並因此 夕之添加所影響。以聚乙浠祕為基 包含一重—係 118 258 Β1 λ w〇 02/102591 A1 > 8 200936663 EP 1 118 258 B1 或 EP 387 148 B1 中。 光伏打模組之層合作用經由熔融該等薄膜而發生,致 使以該等薄膜獲得光敏之半導體層之不含氣泡並且不含波 狀起伏之圍壁(enclosure)。 5
10 15 ❹ 20 '在根據本發明光伏打模組之一種不同形式中,將光敏 半導體層塗布於包覆料d)(例如藉由蒸發塗布、化學氣相沈 積、喷濺或濕沈積)並藉由薄膜c)接合至透明之前包覆料a)。 在另一變化形式中,將光敏半導體層塗布於透明之前 包覆料a)並藉由薄膜c)接合至後包覆料d)。 或者,光敏半導體層可嵌入兩薄膜狀間並依此方式 接合至包覆料a)及d)。 以聚乙烯縮搭為基礎之含增塑劑的薄膜的厚度通常為 〇·38、0.51、0.76、hl4、152 或 2 28 職。 在層壓製軸間’根據本發明所㈣轉滿出現在光 敏半導體層或其電互連處之空隙。 透明之前包覆料a)通常係由破璃或ΡΜΜΑ組成。根據 伏打模組之後包覆料d)(所謂背板)可由玻璃、塑 膠或金屬或其複合物組成,該等支撐物中一者 ^亦可將料包祕中之—或兩纽計成層壓玻璃(即由 =兩:玻璃面板與至少一個PVB薄膜製成之層壓物)或 /、有乳體空隙之隔離玻璃。自祕,亦可能組合這些方法。 使用不需具有任何‘質:可 便用早日日、多晶或非晶質系統。 布於光敏半導體層係直接塗 纽無柄裝。基於崎,複合物係由 9 25 200936663 5 ❹ 15 ❹ 20 25 支撐物(例如後包覆料)與光敏半導體層及透明之前包覆料 利用至少一夾於其間之根據本發明以聚乙烯縮醛為基礎之 含增塑劑的薄膜組裝而成並藉由此薄膜在較高溫度下接 合。或者,可將光敏半導體層可塗布於作為支撐物之透明 之前包覆料並藉由至少一夾於其間之根據本發明以聚乙烯 縮醛為基礎之含增塑劑的薄膜接合至後包覆料。 在有或無事先製造一預層壓物的情況下,可使用熟諸 此技者已知方法層壓因此獲得之複合物。 所謂壓熱製程係在近10至15巴之較高壓力及13〇至 145 C之溫度下進行近2小時的時間。真空袋或真空環方 法,例如根據EP 1 235 683 B1者係在近200毫巴及130至 145°C下操作。 真空層壓器較佳係用於製造根據本發明之光伏打模 組。其係由可加熱及可排空室組成,其中層壓玻璃可在 30-60分鐘内層壓。已證明〇〇1至3〇〇毫巴之低壓及1〇〇 至2〇〇。(:,最佳係130_160。〇之溫度具實際價值。 或者’可在至少一對滚筒之間60至150°C之溫度下將 如上述般組裝而成之複合物壓合成根據本發明模組。此類 設備已知係用於製造層壓玻璃且在具有兩個壓合裝置之設 備中離第一壓合裝置處通常具有至少一個加熱通道上游或 下游。 又本發明之另一主題係玻璃轉移溫度Tg為炱少20°C之 以聚乙歸縮酸為基礎之含增塑劑的薄膜用於製造光伏打模 組之用途。 根據本發明光伏打模組可用作建築物壁面元件、天台 200936663 區、冬季花園外蓋、隔音牆、陽台或欄杆元件或作為窗戶 區之組件。 1 【實施方式】 5 測量锃序 該薄膜之玻璃轉移溫度之測定係藉由示差掃描熱量法 (DSC)根據DIN 53762利用10K/分鐘之加熱速率在_5〇。〇至
150 C之溫度區間中進行。利用第一加熱坡,接著進行冷卻 ❹ 坡,接著進行第二加熱坡。玻璃轉移溫度的位置係根據DIN 1〇 51007由結合第二加熱升溫速率之量得曲線決定。Dm中點 (Tg DIN)係定義為水平線在半階高度處與所量得曲線之交 點。步階高度係定義為與所量得曲線在玻璃轉變前後之基 線中間正切之兩交點的垂直距離。 該薄膜流動行為之測定係根據IS〇 1133於適合儀器, 15 例如獲自G0ttfert公司MI2型之儀器上以融熔流動指數(融 溶質量流率:MFR)形式進行。MFR值係在i〇〇°c及M(rc 下以2 mm喷嘴及21.6公斤之重量負荷定出並以每1〇分鐘 之克數(克/10分鐘)表示。 該薄膜體積電阻之測量係根據DIN IEC 60093在所界 20 定之溫度及週遭濕度(231:及85%RH)下調理該薄膜達至少 24小時後於這些條件下進行。對於該測量之執行係使用獲 自Fetronic GmbH公司302 132型之平板電極及獲自
Amprobe公司之電阻測量儀器ISO_Digi 5kv。測試電壓係 2.5 k V,施加測試電壓後直到獲得所量得數據之等待時間係 25 60秒。為保證測量電極之平板與薄膜間充分接觸,該薄膜 11 200936663 之表面粗糙度Rz在根據DIN ΕΝ ISO 4287測量時應不大於 10微米;即PVB薄膜之原始表面若需要必須在電阻測量前 藉由再熱壓(thermal reembossing)而使其平滑。 聚乙烯縮醛之聚乙烯醇及聚乙酸乙烯酯含量係根據 5 ASTMD 1396-92測得。金屬離子含量之分析係藉由原子吸 收光譜儀(AAS)進行。 該·#薄膜之水或水分含量係藉由Karl Fisher方法測 得。為在潮濕條件下模擬潮濕行為,將該薄膜事先儲存在 象 23 C及85%RH下24小時。該方法可在未經層壓膜及已層 10 壓光伏打模組上隨離該薄膜邊緣之距離而變地進行。 實例 製造表1所列組成之混合物並測試其玻璃轉移溫度 Tg、流動性及電阻。 15 DBEEA係指二-2-丁氧基-乙氧基_乙基己二酸酯 DBEA係指二-2-丁氧基-乙基己二酸酯 3G8係指三乙二醇雙_2·乙基己酸酯 Mowital PVB係指高黏度聚乙烯縮丁醛,其黏度為 60-90毫帕(根據DIN 53〇15以溶於乙水 -溶液在抓下量得);聚乙烯醇含量:20(3 ί量50:水)聚之乙5酸。 乙烯酯含量:Μ重量% ;縮醛化程度:78 6%。 、,具有中增塑劑含量之標準薄膜(對照實例丨)顯然呈現 對光伏打應用而言太低之電阻。具有高 混合物_例2)確實具有高流動性,但亦=玻。 25 移溫度Tg及因此極低之電阻。 12 200936663 降低增塑劑含量(實例1)使玻璃轉移溫度及電阻顯著 增加。此與利用低極性之增塑劑增加流動性相比(實例2相 對於實例1)可獲得進一步改善。 實例1及2顯示電阻之改善可藉由根據本發明所用具 有較高玻璃轉移溫度Tg之薄膜達到。此類型之薄膜係適合 用於光伏打應用中。 ❿ ❹ 13 200936663
〇
¥ m + W m ro Ο) 〇 n 〇 00 〇 1 1 〇 ο • 寸 CN (N ^H + W ¥ 〇 id m \〇 〇 r<| 〇 〇〇 O 1—H I Ο r-H Ο <Ν Ο ο m CN <N o + PQ CO ο Os CN 〇\ Ό r-H I 卜· τ-Η m ο ι-H OO 寸 « ^H l—H |®ζ + w l/^\ in m CN ΓΝΐ I---«· m 〇\ <Ν 1> ΙΟ cs (N 1 ι> <Ν ο Ο od OO i—H Φ Φ Ο 〇 _ !B㈣ mH _ mW • lfh<l Jmil ηβη «1fh>t cifhj ηβη \1qiJ ηΒη t.lfh>l ψπ β墩 P α ο CN o 'Ο >r 'O τ—Η CN i—H CN /**N PQ < w Ρη P^ Pm Q > Oj < ♦1 φΗ Μ h-l OO 〇 m PQ Μ PQ 厕 -IV ΛίΠΙ < H 〇 Q Q 蘅 τ*®1* w 蘅 蘅 斟 #: iu*t m 剷 剷 η 赳 絮r 繫Γ 坡 邋 t|sP 200936663 【圖式簡單說明】 無。 【主要元件符號說明】 5 無。 〇 10 〇 15
Claims (1)
- 200936663 七 申請專利範圍: 1. 一種光伏打模組,其包 a)透明之前包覆料; 下列各者所組成之層壓物: St層以ΐ之光敏之半導體層; 包覆〔歸縮駿為基礎之含增塑劑的薄膜;及 ❹ i有至^㈣祕為基礎之含增塑劑的薄膜c) 、具有至J 20C之玻螭轉移溫度τ§。 2. if 利範圍第1項之光伏打模組,其特徵在於該以 ’、.·酸為基礎之含增塑劑的薄膜e)具有 % 之增塑劑含量。 3.根據申料利範圍第!項或第2項之光伏打模、组,其特徵 在於該聚乙烯縮醛具有低於21重量%之聚乙烯醇含量。 ❹ 4.根據申請專利範圍第1至3項中任一項之光伏打模組,其 特徵在於該聚乙稀縮酸具有低於5重量%之聚乙酸乙稀酉旨 含量。 5.根據申請專利範圍第1至4項中任一項之光伏打模組,其 特徵在於使用一種或多種化合物作為增塑劑,該等化合物 之以式100 X 0/(C + H)(其中〇、C、及Η代表於個別之 分子中之氧、碳、及氳原子之數目)表示之極性係低於/ 等於9.4。 200936663 6.根據申請專利範圍第1至5項中任一項之光伏打模組,其 特徵在於使用一或多種選自下列各者之群之化合物作為 增塑劑:二-2-乙基己基癸二酸酯、二-2-乙基己基己二酸 酯、二-2-乙基己基酞酸酯、己二酸二己基酯、癸二酸二丁 基酯、二-2-丁氧基-乙基癸二酸酯、1,2-環己烷二羧酸二異 壬基酯及三乙二醇雙-2-乙基己酸酯。 ❹ 7.根據申請專利範圍第1至6項中任一項之光伏打模組,其 特徵在於該以聚乙烯縮醛為基礎之含增塑劑的薄膜包含 低於50 ppm之金屬離子。 8.根據申請專利範圍第1至7項中任一項之光伏打模組,其 特徵在於該以聚乙烯縮醛為基礎之含增顰劑的薄膜包含 0.001至5重量%之Si〇2。 Q 9.根據申請專利範圍第1至8項中任一項之光伏打模組,其 特徵在於使用聚乙烯縮丁醛作為聚乙烯縮醛。 10.—種玻璃轉移溫度Tg為至少20°c之以聚乙烯縮醛為基礎 之含增塑劑的薄膜用於製造光伏打模組之用途。 17 200936663 四、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明·· 無。 〇 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式: 無。
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DE102007000816A DE102007000816A1 (de) | 2007-10-05 | 2007-10-05 | Photovoltaikmodule mit weichmacherhaltigen Folien auf Basis von Polyvinylacetal mit hohem spezifischen Widerstand |
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US (1) | US20100193023A1 (zh) |
EP (1) | EP2195854A2 (zh) |
JP (1) | JP2010541268A (zh) |
CN (1) | CN101933161B (zh) |
DE (1) | DE102007000816A1 (zh) |
RU (1) | RU2471267C2 (zh) |
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-
2007
- 2007-10-05 DE DE102007000816A patent/DE102007000816A1/de not_active Withdrawn
-
2008
- 2008-10-03 TW TW097138011A patent/TW200936663A/zh unknown
- 2008-10-06 CN CN2008801101500A patent/CN101933161B/zh not_active Expired - Fee Related
- 2008-10-06 JP JP2010527468A patent/JP2010541268A/ja active Pending
- 2008-10-06 US US12/680,139 patent/US20100193023A1/en not_active Abandoned
- 2008-10-06 EP EP08837750A patent/EP2195854A2/de not_active Ceased
- 2008-10-06 WO PCT/EP2008/063303 patent/WO2009047221A2/de active Application Filing
- 2008-10-06 RU RU2010117653/04A patent/RU2471267C2/ru not_active IP Right Cessation
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CN101933161B (zh) | 2012-11-07 |
US20100193023A1 (en) | 2010-08-05 |
WO2009047221A3 (de) | 2010-05-20 |
JP2010541268A (ja) | 2010-12-24 |
RU2010117653A (ru) | 2011-11-10 |
RU2471267C2 (ru) | 2012-12-27 |
WO2009047221A2 (de) | 2009-04-16 |
EP2195854A2 (de) | 2010-06-16 |
DE102007000816A1 (de) | 2009-04-09 |
CN101933161A (zh) | 2010-12-29 |
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