TW200936027A - Two-phase flow cooling device using gravity type capillary pumped loop (CPL) - Google Patents

Abstract

A two-phase flow cooling device using gravity type capillary pumped loop (CPL) is applicable to a high-energy density electronic product such as a mobile digital video recorder (MDVR), the device mainly including: one or more square evaporation units disposed in a parallel manner, wherein the external bottom face areas are correspondingly adhered to a heat source portion, a liquid head and an evaporation head are disposed on two sides of the head and tail portions, and a capillary unit and a plurality of evaporation grooves disposed at the periphery of the capillary unit are disposed therein; an annular channel, disposed and connected between the evaporation head and the liquid head, and; a condenser which may comprise the annular channel and can acts in concert with a cooling fin or connects to a housing to form a heat sink. Then working liquid is filled into the loop. In this way, the aqueous-phase working liquid is capable of flowing into the evaporation units via the liquid head and, by using the capillary absorption force created in the capillary unit, absorbing heat to evaporate into the gaseous phase. The gas can then be directed via the plural evaporation grooves and converged into the evaporation head from which it is introduced into the annular channel via the evaporation unit. Finally, latent heat released by the condenser is used to recover the gaseous phase into the liquid phase flowing into the evaporation units via the liquid head, in which the re-evaporation is carried out after heating, completing a gravity-type natural cyclic heat transfer with enhanced capillary force. Thus, heat dissipation with maximum heat transfer capacity can be achieved without using a fan, and the problems of a conventional bulky and heavy water-pump loop, such as high power wattage and unsatisfactory temperature control over a wide range of temperatures (e.g. from -30DEG C to 60DEG C), can be overcome. The present invention increase the vacuity of the loop up to 1x10-5 torr before filling the working fluid; in addition, it can also attaches a thermal conductive sheet to the external bottom of the evaporation units before correspondingly attaching the evaporation units to the heat source tightly. It also can be equipped with a working liquid storage tank to increase the cooling effect and to comply with the temperature control requirements, such as a wide range of temperature variation from -30 DEG C to 60 DEG C in an MDVR.

Description

200936027 (二）本代表圖之元件符號簡單說明： CPL雙相流散熱裝置2 蒸發部（evaporator) 10 頭側面12 液體頭（Liquidhead ) 13 尾侧面14 蒸汽頭（vapor head) 15 毛細體部（porouswickpart) 16 開口槽161 ❹ 凸緣162 蒸汽導槽（vapor groove ) 17 室腔18 環狀通道20 八、本案若有化學式時，請揭示最能顯示發明特徵的化 學式：（無） 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種重力式毛細泵吸環路（CPL )雙相 ϊΐΐϊί，尤指—種可應用於高能量密度之電子構裝產 車用數位錄影系統（MDVR)上 ：： =VR要求在寬溫·3G t至机之控溫要^足系統如 【先前技術】 ，情況下H = 尺:製術進步下 體電路(IC) +，換言之，單多的電 運作時產生非常大的熱功率，以==¾ 3 200936027 理器（CPU )而言，發熱量從Pentium的20W到Pentium Π的 30W甚至43W，而PentiumlV估計約在150W以上’ CPU 的接面溫度(junction temperature)更可高達150 C ’若不能有 效且迅速的移除CPU所產生的熱量，將使得CPU因熱量累 積溫度甚高而導致當機甚至損壞。目前，為了避免電子元 件因高熱高溫而影響其工作性能甚至損毀，通常都於其上 加裝一散熱鰭片（fm)，並以一軸流風扇強制空氣對流而 增加其熱移除能力，此為傳統電子元件散熱器之架構。一 般而言，單相空氣強制對流熱傳係數與熱傳表面積增加而200936027 (2) Brief description of the symbol of the representative figure: CPL dual-phase flow heat sink 2 Evaporator 10 head side 12 Liquid head 13 tail side 14 vapor head 15 Capillary part (porouswickpart 16 open slot 161 凸缘 flange 162 vapor groove 17 chamber 18 annular channel 20 VIII. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: (none) IX. Invention: [Technical Field] The present invention relates to a gravity-type capillary pumping loop (CPL) biphasic, in particular, to a digital recording system (MDVR) for electronic components of high energy density. ::=VR requires a wide temperature ·3G t to control the temperature of the machine to the system such as [previous technology], in the case of H = rule: the progress of the lower body circuit (IC) +, in other words, a single more electrical operation Produces very large thermal power, in terms of ==3⁄4 3 200936027 processor (CPU), the heat is from 20W of Pentium to 30W or even 43W of Pentium ,, while PentiumlV is estimated to be above 150W' junction temperature of CPU (junction Te Mperature) can be as high as 150 C ’. If the heat generated by the CPU cannot be effectively and quickly removed, the CPU will be damaged even if the heat is accumulated at a high temperature. At present, in order to prevent electronic components from affecting their working performance or even being damaged due to high heat and high temperature, a heat sink fin (fm) is usually added thereto, and an axial flow fan is forced to convect air to increase its heat removal capability. It is the architecture of the traditional electronic component heat sink. In general, single-phase air forced convection heat transfer coefficient and heat transfer surface area increase

❹ 提高。因此，為增加熱傳率，通常都以增加散熱鰭片面積 或使用空氣流量較大的風扇來達成，但增加表面積及空氣 流量所帶來的缺點為體積增大，振動噪音等問題。除了使 用散熱鰭片與風扇來作為散熱裝置以外，尚有空氣衝擊流 冷卻與熱管兩種散熱方式。使用空氣衝擊流冷卻的方式來 作為電子元件的散熱之用，其平均熱對流係數可達 140W/m2- °c甚至更高，雖然此方式可以較一般空冷方式有 ^佳的熱對流係數，但缺點在於需提供一高壓空氣源，不 若一般空冷方式僅需要一風扇來驅動空氣流動即可。另 ^卜’目前最常使用的熱管是一種高熱傳導性的裝置，其 ^熱傳係數可大於l000W/m2_它，它能傳送大量的熱‘， 液體吸收熱量產生相變化而變成蒸氣，將熱量由、發熱 域傳送至低溫的區域，工作流體在熱管中不斷循環"，、、 ，外加任何動力驅使工作流體流動，僅管如此，熱管 Hi傳送熱量的裝置，而非散熱的工具。综“述 散，方式，皆有其致命的缺點，_可以滿足目前 辟敎ΐ =件散熱上的要求，但將無法符合未來電子元件在 此間、熱移除能力以及與忙封裝整合的要求。因 須管式之散熱器亦無法滿足其散熱之需求，而必 、之散熱方式才能達到最佳之熱傳效率。改良的 4 200936027 方法為將液、汽傳送通道分離，並藉由 ㈣她r)，使工作流體產生單方向流動。=刀:： 麵⑵）和熱沈（heatsink )部分因為❹ Improve. Therefore, in order to increase the heat transfer rate, it is usually achieved by increasing the fin area or using a fan having a large air flow rate, but the disadvantages of increasing the surface area and the air flow rate are volume increase, vibration noise, and the like. In addition to the use of heat sink fins and fans as heat sinks, there are two methods of air impingement cooling and heat pipe cooling. Air impingement cooling is used as the heat dissipation for electronic components, and the average thermal convection coefficient can reach 140W/m2-°c or even higher. Although this method can have better thermal convection coefficient than the general air cooling method, The disadvantage is that a high-pressure air source needs to be provided, and instead of a general air-cooling method, only one fan is required to drive the air flow. Another ^ currently used heat pipe is a high thermal conductivity device, its heat transfer coefficient can be greater than l000W / m2 _ it, it can transfer a large amount of heat ', the liquid absorbs heat to produce a phase change and become a vapor, will Heat is transferred from the heating zone to the low temperature zone, and the working fluid circulates continuously in the heat pipe. Any power is used to drive the working fluid to flow. In this case, the heat pipe Hi transmits heat, rather than the heat sinking tool. Comprehensive "dissipation, methods, have their fatal shortcomings, _ can meet the current requirements = heat dissipation requirements, but will not meet the requirements of future electronic components, thermal removal capabilities and integration with busy packaging. Because the heat sink of the tube type can not meet the heat dissipation requirements, the heat dissipation method must achieve the best heat transfer efficiency. The improved 4 200936027 method is to separate the liquid and vapor transfer channels, and by (4) her r ), making the working fluid flow in one direction. = knife:: face (2)) and heat sink (heatsink) part because

=置;ί 象=機構便=I 向ρ ’右熱源的位置較低、熱沈位詈鉍古— ^ 的驅動力主要為液體因受熱形成密度差2J環路巧^ 源和熱沈相對位置呈水平狀態或環路處2… 則循環的驅動力便不能依一般地面上液“ 時：= set; ί 象 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = In the horizontal state or at the loop 2... Then the driving force of the cycle cannot be based on the general ground liquid.

產生的額外浮力(一_為驅以二密$的f化J ❿ ^當力^於·ϋ時，誠體通道中的卫作、^^藉由 Ξ ίΐί ίΓ ’再Λ由蒸ί器内的蒸汽導槽導入氣體通 由液，”，内受熱蒸發，完成==_:广 ;ΓΓ=質的毛細吸力作為環路的驅==為 吸環路（Capllary Pumped L00p)，縮寫為 “cpL”。雙 種藉由工作流體液、汽兩相 3 熱來傳遞熱量，而且不需要外加任何機械 ί浦作ΐ體的作動完全靠内部毛細結構物質的毛細 L作猶環來移熱。由於是靠卫作流體之潛熱來 ϊ ϊ技；由cpl之設計，能輕易由熱源(卿傳 ^至•電腦之外殼附近，再利用箱型風扇（Case an )便可移走超焉量的熱，而遠遠超過常見單相散熱 j如，,、散熱鰭片）的方式所能達到的效果 。此質拳Ϊ、 簡单:熱傳距離遠且不受重力約束、無須任何外加動 力的裝置最刺在-般高價值之電子構裝散熱或人造衛星 士 ’ CPL於驅年應用於挑戰號太空梭更是有其卓越之成 就。以毛細作用力之雙相流環路能有效將熱移除，亦能在 200936027 自然冷凝對流狀況下可移除2 5 W之熱量且保持cpu在9〇 t： 左右。根據此一原理，如果採取強制對流將可有效的將熱 量由箱型風扇（CaseFan )移走。毛細泵吸之雙相流高效 率熱移系統CPL(CaPmary Pumped Lo〇p)主要之四大組件包 含：蒸發器、蒸發頭、冷凝器與冷凝頭。另外，由於必須 利用箱型風扇（CaseFan )作為熱沈散熱之工具，因此舉 凡軸流風扇之風量、系統之阻抗等之影響都必須充分考 慮。CPL系統之熱測試則可由CPU熱模擬測試系統測得， 但如何設計一個更高效率之CPL環路已帶走15〇w以上之 ❹熱量則有賴於毛細結構包括毛細半徑（WickRadius)、毛細 滲透度（Permeability)、冷凝部規格之再改善，此多有賴於 理渝模式之建立。傳統對於電子元件的散熱規劃與管理， 往往都是被歸類於整個封裝程序的最後一環，也就是說電 子兀件在製造、封裝測試完成之後，才考慮到散熱的問 題丄以及如何將散熱裝置與電子元件結合。對於一個要求 不嚴格的應用場合，這樣的規劃方式可以有較低的成本及 不錯的散，效能。但是當面臨封裝尺寸需更加緊緻縮小、 電子元件局性能導致高發熱量以及電子元件處在一高溫惡 劣環境的困境時’舊有的觀念與方式將無法滿足電子元件 在散熱上的要求。因此，便需要一個新的散熱方式與裝置 來解決即將遭遇的問題。 又，2001年9月11日美國九--事件、2002年10月12 曰印尼岑里島恐怖攻擊、2〇〇4年3月^日西班牙火車*** 案及20G5年7月7日英國倫敦地鐵及巴士***案等恐怖攻 擊事件’使歐美危機意識不斷提高，透過安全監控設備可 以有效嚇阻犯罪與蒐集相關證據，因此在恐佈攻擊不斷， 預防犯罪與1集證據需求持績提升情形下，安全監控產品 將持續成長。監視用的數位錄影系統DVR ( Digital vide〇 Recorder ’或稱為數位影像錄放影機）如車用數位錄影系 6 200936027 統（MDVR，Mobile Digital Video Recorder，Mobile DVR )就是一種裝置於車上的小型電腦監控安全系統， 其裝設在國外大型巴士或各小學、高中等之校車上尤其普 遍，其系統共做沿途廣告、說明、警示、播放、網路、衛 星導航等等’是一種安全装置也是一種服務裝置，因此愈 來愈受國外大型巴士獲校車之重視。而由於在MobileDVR 如此緊密之空間内，為了能克服較大之阻抗，本發明因此 針對高能量密度電子機構產品例如MobileDVR等，提出一 種重力式毛細泵吸環路之散熱裝置（CPLCooler )，以達 q 到在無扇下之最大熱傳量之效果。 【發明内容】 本發明主要目的在於提供一種重力式毛細泵吸環路 (CPL )雙相流散熱裝置，供應用於高能量密度之電子構 裝產品上如車用數位錄影系統（MDVR);該毛細泵吸環 路（CPL )主要包含：至少一個蒸發部（evap〇rat〇r )，其 外部底面係對應密貼於一熱源部份如系統主機板之中央處 理器（CPU )上，其頭、尾二侧面上各設一液體頭 (Liquid head )及一蒸汽頭（Vap〇r head)分別供工作液體之 Ο液相％ H·入及Ά相流出’其内部設有一毛細體部（porous wick part )及複數條蒸汽導槽（vap〇r gjoove )設在毛細體 部之外圍；一環狀通道，其佈設且連接在蒸汽頭與液體頭 之間；及一冷凝部，其可包含環狀通道並可配合散熱鰭片 或連接至外殼以形成熱沈部份（heatsink );再於環路中 填入工作流體（workingflui(i)如氟氣烷（Fre〇n );藉 此’液相工作流體可自液體頭流入蒸發部，再藉由毛細體 部之毛細力作用吸附並同時於此吸熱而蒸發成為汽相，再 藉複數條蒸Ά導槽匯流導入蒸汽頭而由蒸發部流出至環狀 通道中流動，再藉由冷凝部釋放出潛熱而回復為液相，再 經由液體頭流入蒸發部内再受熱蒸發，完成一加強其毛細 200936027 作用推力之重力式自然循環的 下之最大熱傳量㈣熱效•，並右、：u以達成在無扇 之笨重、體積龐大且無法k知水泵浦環路 -3〇°C至6(TC)之控溫瓦數及無法献寬溫（如 提供一重力式毛細果吸環路 可設具兩個或以上之蒸發部其衰路（CPL ) e φ = = = = =部凝結之液相工作流體可 ,rPtr:又一目的在於提供一重力式毛細泵吸環路 r rPT、雙ΐ流散巧ί置’其進一步可先將毛細泵吸環路 (> )之真空度提高至lxKT5torr (陶爾，lt〇rr=1厘米采 柱= 再填人X作流體’藉以增進散熱效果 ，而可 滿足系統之控溫要求如MDVR要求在寬溫_3〇它至6〇。匚之 控溫要求。 本發明另一目的在於提供一重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其進一步可在毛細泵吸環路 (CPL )之蒸發部的外部底面上先貼附一散播用導熱片 (spreader) ’再對應密貼於熱源部份如中央處理器’、 (CPU )上，藉以增進散熱效果，而可滿足系統之控溫要 求如MDVR要求在寬溫-30 °c至60°C之控溫要求。 本發明又另一目的在於提供一重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其進一步可在毛細泵吸環路 (CPL )之冷凝部（condenser )及蒸發部（evap〇rat〇i*)之 液體頭（Liquidhead )之間增設一工作流體之儲槽，藉以 增進散熱效果，而可滿足系統之控溫要求如MDVR要求在 寬溫-30 °C至60°C之控溫要求。 【實施方式】 8 200936027 以下結合附圖’對本發明上述的和另外的技術特徵和 優點作更詳細的說明： 參照圖1、2、3所示，其分別係本發明一實施例 (設具一蒸發部）之基本架構及其蒸發部例内部結構之上 視及橫向斷面示意圖。本發明係一種重力式毛細泵吸環路 (CapillaryPumpedLoop ’簡寫為CPL )雙相流散熱裝置 1 ’雙相流移熱方式遠比單相移熱效率高，其特點為利用 工作流體（workingfluid)雙相之間潛熱變化迅速移走大量的 熱源（heatsource)，可應用於高能量密度之電子構裝產品上 ❹如車用數位錄影系統（MDVR，Mobile Digital VideoThe extra buoyancy generated (a _ for the two-figure $ fJ J ❿ ^ When force ^ ϋ ,, the servant in the honest channel, ^ ^ by Ξ ΐ ΐ Γ Λ Λ Λ 蒸 蒸 蒸 蒸 蒸The steam channel is introduced into the gas through the liquid," and the inside is heated and evaporated, and the completion is ==_: wide; ΓΓ = the mass capillary suction is used as the loop drive == is the suction loop (Capllary Pumped L00p), abbreviated as "cpL The two kinds of heat are transferred by the working fluid liquid and the vapor two-phase three heat, and it is not necessary to add any mechanical force to act as the carcass, and the capillary of the internal capillary structure material is used for the heat transfer. It is designed by cpl as the latent heat of the fluid; it can be easily removed from the heat source by the heat source (Qing Chuan ^ to the vicinity of the computer's outer casing, and then use the box fan (Case an) to remove the excess heat. And far more than the common single-phase heat dissipation, such as, heat sink fins, the way it can achieve. This quality is simple and simple: the heat transfer distance is far from gravity and does not require any external power. Sting in the high-value electronic assembly of heat or artificial satellites 'CPL in the year of the drive to the Challenge Space Shuttle It has its outstanding achievements. The double-phase flow loop with capillary force can effectively remove heat. It can also remove 2 5 W of heat under the natural condensation convection condition of 200936027 and keep the cpu at 9〇t: According to this principle, if forced convection is adopted, the heat can be effectively removed by the box fan (CaseFan). The capillary pumping two-phase flow high efficiency heat transfer system CPL (CaPmary Pumped Lo〇p) is the main four The components include: evaporator, evaporation head, condenser and condenser head. In addition, since the box fan (CaseFan) must be used as a tool for heat sinking, the influence of the airflow of the axial fan and the impedance of the system must be sufficient. Consider that the thermal test of the CPL system can be measured by the CPU thermal simulation test system, but how to design a more efficient CPL loop has taken away more than 15 〇w of heat depends on the capillary structure including the capillary radius (WickRadius), The capillary permeability and the improvement of the specifications of the condensing section depend on the establishment of the rational mode. Traditionally, the heat dissipation planning and management of electronic components are often returned. In the last loop of the entire packaging process, that is to say, after the manufacturing and packaging testing of the electronic components, the heat dissipation problem and how to combine the heat sink with the electronic components are considered. For a less demanding application, such an application Planning can have lower cost and good dispersion, performance. But when faced with the need to tighten the package size, the high performance of electronic components, and the high temperature and harsh environment of electronic components, the old concept The method and method will not meet the heat dissipation requirements of electronic components. Therefore, a new heat dissipation method and device are needed to solve the problems that will be encountered. Also, September 11, 2001, the United States, nine events, the October 12, 2002, the terrorist attack in Bali, Indonesia, the March 2004 bombing of the Spanish train, and the London Underground in July 20, 20G5. And terrorist attacks such as bus bombings have made the crisis awareness in Europe and the United States constantly improved. Through security monitoring equipment, it can effectively deter crime and collect relevant evidence. Therefore, in the case of terrorism attacks, crime prevention and the improvement of the evidence demand of one episode, Security monitoring products will continue to grow. DVR (Digital vide〇Recorder ' or digital video recorder) for surveillance, such as digital video recorder for mobile phone 6 200936027 (MDVR, Mobile Digital Video Recorder, Mobile DVR) is a small device mounted on the car. Computer monitoring security system, which is installed in large foreign buses or school buses of all primary and high schools, its system is a total of advertising, instructions, warnings, broadcasts, networks, satellite navigation, etc. It is also a kind of service device, so it is getting more and more attention from foreign large buses. In order to overcome the large impedance in the space where the MobileDVR is so tight, the present invention proposes a gravity-type capillary pumping loop heat sink (CPLCooler) for high energy density electronic mechanism products such as MobileDVR. q The effect of the maximum heat transfer without fan. SUMMARY OF THE INVENTION The main object of the present invention is to provide a gravity-type capillary pumping loop (CPL) dual-phase flow heat sink for supplying high-density electronic components such as a vehicle digital video recording system (MDVR); The capillary pumping loop (CPL) mainly comprises: at least one evaporation portion (evap〇rat〇r), the outer bottom surface of which is closely attached to a heat source portion such as a central processing unit (CPU) of the system motherboard, the head thereof On the side of the tail two, a liquid head and a steam head (Vap〇r head) are respectively provided for the liquid phase of the working liquid, % H·in and Ά phase outflow, and a capillary portion is provided inside (porous a wick part) and a plurality of steam channels (vap〇r gjoove) disposed at a periphery of the capillary portion; an annular passage disposed between the steam head and the liquid head; and a condensation portion including a ring The channel can be matched with a heat sink fin or connected to the outer casing to form a heat sink; the working fluid (workingflui(i) such as fluorine gas (Fre〇n) is filled in the loop; The phase working fluid can flow from the liquid head into the evaporation section, and then borrow The capillary force of the capillary body acts to adsorb and simultaneously evaporate to form a vapor phase, and then a plurality of steaming channels are introduced into the steam head to flow from the evaporation portion to the annular passage, and then released by the condensation portion. The latent heat returns to the liquid phase, and then flows into the evaporation portion through the liquid head to be evaporated by heat, completing a maximum heat transfer under the gravity natural circulation of strengthening the capillary 200936027. (4) Thermal effect, and right, :u to achieve In the absence of fan, heavy and bulky, and can not know the temperature control wattage of the pump loop -3 ° ° C to 6 (TC) and can not provide wide temperature (such as providing a gravity type capillary fruit suction loop can be set Two or more evaporation sections have a decay path (CPL) e φ = = = = = part of the condensed liquid phase working fluid, rPtr: another purpose is to provide a gravity capillary pumping loop r rPT, double ΐ The flow can be arbitrarily set to 'further increase the vacuum of the capillary pumping loop (>) to lxKT5torr (Taul, lt〇rr = 1 cm column = refill X for fluid' to enhance heat dissipation, And can meet the system's temperature control requirements such as MDVR requirements in wide temperature _3 〇 it to 6〇. Temperature control requirements of 匚. Another object of the present invention is to provide a gravity capillary pumping loop (CPL) two-phase flow heat sink, which can further be external to the evaporation section of the capillary pumping loop (CPL) Attached to the bottom surface is a spreader for the spreader, which is then attached to the heat source such as the central processing unit (CPU) to enhance the heat dissipation effect, and meet the temperature control requirements of the system such as MDVR. Temperature control requirements of a wide temperature range of -30 ° C to 60 ° C. Still another object of the present invention is to provide a gravity capillary pumping loop (CPL) two-phase flow heat sink, which can further be in a capillary pumping loop ( A working fluid reservoir is added between the condenser of the CPL and the liquid head of the evaporation section (evap〇rat〇i*) to enhance the heat dissipation effect and meet the temperature control requirements of the system such as MDVR. Temperature control requirements from -30 ° C to 60 ° C are required. [Embodiment] 8 200936027 The above and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings. Referring to Figures 1, 2 and 3, respectively, an embodiment of the present invention is provided. The basic structure of the evaporation section and the schematic view of the internal structure of the evaporation section and the transverse section. The invention relates to a gravity capillary pumping loop (Capillary Pumped Loop [CPL] two-phase flow heat dissipating device 1 'the two-phase flow heat transfer method is far more efficient than the single phase heat transfer, and is characterized by using a working fluid (duplex) The latent heat changes quickly remove a large number of heat sources (heatsource), which can be applied to high-energy density electronic components such as digital video recording systems (MDVR, Mobile Digital Video).

Recorder，MobileDVR )等，用以移除系統之熱源部分如 系統主機板之中央處理器（CPU)所產生之熱；又在液相 與汽相共存的狀態’兩相間幾無溫度差存在，依熱能吸故 或放出的方向而從液相變回汽相或從汽相變回液相，前者 為蒸發過程，後者為凝結過程，而依此概念所發展出來的 熱輸送裝置’稱之為毛細泵吸環路（CPL)。本發明重力式 CPL雙相流散熱裝置1主要包含：至少一蒸發部 (evaporator ) 10、一環狀通道20及一冷凝部30，且藉由蒸 發部10、環狀通道20及冷凝部30構成一毛細泵吸環路 ' ® ( CPL ) ’而環路中則填入工作流體（worj^ng f[uid )如良 氯烧（Freon )。 該蒸發部（evaporator) 10可為一方形殼體，以具良好 導熱效果之金屬如鋁合金製成，其外部底面11作為傳熱 面，供可對應密貼於一熱源部份如系統主機板之中央處理 器CPU (圖未示）上以藉熱傳導而移除該中央處理器 (CPU )因作業所產生之熱至蒸發部（evap0rat〇r ) 1〇上； 其頭側面12上設一液體頭（Liquidhead ) 13供液相工作液 體40a流入蒸發部10内’其尾側面η上設一蒸汽頭（vap〇r head) 15供蒸發後之汽相工作液體40b流出蒸發部10。該 9 200936027 蒸發部10之内部設有至少一毛細體部（p〇rous wick part) 16 及複數條蒸汽導槽（vaporgroove) 17，該毛細體部16内部 具有毛細結構及作用功能，可由高密度且具滲透度之聚乙 烯或燒結銅粉（sinter powder)組成，其毛細孔徑可為 1.05xl0_5m，而其滲透度為6xl〇.10m2。該複數條蒸汽導槽 (vapor groove ) 17係設在毛細體部％之外圍，設計理念上 對於如何增加整體毛細泵吸環路（CPL )的驅動力，必須 由增加毛細壓差及減少整個環路壓降兩方面來考量，一方 面為了需要較小的毛細孔徑（p0r〇us radius)來吸附冷凝之液 ❹作液體4〇a到達蒸發器10上内表面加熱，一方面亦須 f慮^採用較〃、隸所造成王作㈣在蒸發㈣内部多孔 毛細體部16内流動所造成的流阻(fl〇w增大等間 題，因此便採用了複數條蒸汽導槽17的設計，使 因吸收熱量而蒸發的汽相工作液體4〇b 工 心車用數位錄影系統(二之 凝部30主要係設在環狀通道20上，也就暑捲 道20可‘作冷凝管，而其 ^環狀^ 之蒸汽頭15排出之、、“曰工你：：食:二糸用以移除由蒸發器10 作液體4%二目，二4乍2:ob:熱量’使該汽相二 體頭13流\ 1Α …成液相工作液體40a並經由液 空間而改車2位錄影系統（MDVR)之内部 環狀通道20 =如=部傳導體鄉 示）上，並人( 所不）或一局部（如圖9所 -己口散熱鰭片32 (如圖9、18所示）或使傳 200936027 導^ , i或散熱韓片32連接至MDVRi外殼體（圖未 上，藉以形成熱沈部份（heatsink )以有效移除環狀 通道20内汽相工作液體4〇b之熱量；換言之，冷^兕 =便較簡單，為了減少餘，所有環狀 ^ 凝管，且皆為平滑且導熱性極佳之設計。又冷田2 巧用mobileDVR現有之外殼以鋁擠型成為中 ’、 Ϊ = 有足夠的能力將由蒸發器⑴所ίΪί ‘ ❹ 魯 發部相工作流體40a可自液體頭13流入蒸 於此吸熱i力作用吸附並同時 = 釋放出潛熱而回復為液相工作流體40a， 流ί蒸發部10内再受熱蒸發，完成-加強 戶,力之i力式自然循環的移熱作帛，藉以達成 巧:之3〇笨；、m積龐大且無法解決高瓦數 恤（如-30 C至60。〇之控溫的問題。 舞裝ΐ力式毛細泵吸環路（CPL )雙相流散 Ϊΐ置1 W考慮真空問題，因為真空度不佳會造成非凝 Ϊ氣，也會影響冷凝部30與蒸發部10的熱傳性 :特=之控制溫度，因此對於系統真空度要求 環路設計上須減少_的使用，以減少不必 二般設計真空度的規格為ιχι〇·5_ (陶爾，歷 填ί二t目：於1厘米汞柱商cm_Hg柱高），亦即在尚未 4〇之前，1明之毛細杲吸環路（CPL )内 ^以月匕夠降低至lxl0- torr (陶爾）為佳，而一大氣 登為760 torr (陶爾）。 又蒸發部（evaporator) 1〇設計成一方形殼體，乃是為 200936027 配合電子發熱元件（如CPU )的幾何形狀，而其尺寸可設 為50mmx50mmx20mm以合乎Intel公司之Pentium IV單晶片 (single chip )，或設為 105 mm x 162 mm x 24 mm 以合乎雙 CPU之需求。 參照圖4-8所示，其分別係本發明之蒸發部另一實施 例内部結構之上視、橫向斷面、正視斷面、及所使用毛細 體部及組裝毛細體部後之示意圖（且標示參考用尺寸）。 本實施例之蒸發部（evap〇rat〇r ) 10之内部設有至少一毛細 ❹ 體部（porouswickpart) 16及複數條蒸汽導槽 (vapor groove ) 17，而毛細體部16及複數條蒸汽導槽17之間的結 構型態並不特別限制’其中該蒸發部（evap〇rat〇r ) 1〇之殼 體内部之上、下面可分別設置複數條蒸汽導槽（vapor ^r=ve ) 17如圖4、5所示’並在上、下面兩排複數條蒸 Η導槽π之間^成一室腔18供設置一相對應形狀之毛細體 示’使該毛細體部16可夹設在上、下兩排複 17之間如圖8所示；而毛細體部16上設有-J二;IX %叉開口槽16i，供液相工作流體40a可由液 部ί内ί (ί^:，部並經由開口槽161而流入毛細體 時參照圖4·8戶斤示），俾可藉由毛細體部 士艚4〇Γ，爯鼓吸附並同時於此吸熱而蒸發成為汽相工作 細蒸汽導槽17匯流導入蒸汽頭15排 緣162，藉以i止=口= 161之開口端處設有擋止用凸 力作用吸附而回4 = ^體伽因毛細體部16之毛細 (設具二紐部），其分聽本發明另—實施例 圃。太音渝伽夕去及其蒸發部之局部透視及分解之示意 ^ = ¾細果吸環路叫之雙相流散 η®失千彳，日二赞°卩10以對應於二電子發熱元件如CPU ’、 〜二蒸發部1〇相對於環狀通道20係採用並 12 200936027 聯排列方式，也就是二蒸發部10之液體頭13是連接至相 之環狀通道20，使藉由冷凝部30凝結之液相工作流體 可同時由各液體頭13進入各蒸發部1〇内。又本實^ ^ 凝部30並不限制如圖9所示之局部結構，該冷凝部3〇可^ 用傳導體31包覆在環狀通道2〇之全部如圖18所示，並可配 合散熱鰭片32 (如圖9、18所示）或使傳導體31及)二拼 熱鰭片32連接至MDVR之外殼體（圖未示）上。又，1實 施例之蒸發部1 〇之内部設有至少一毛細體部（p〇r〇us part ) 16及複數條蒸汽導槽（vap〇rgr〇〇ve) 17，而 ❹部16及複數條蒸汽導槽17之間的結構型態並不特別限剎， (ο—0 1〇之殼體内部之下緣面可佈設 複數條蒸’飞導槽（vapor groove) 17如圖1〇、η所示，並在 下緣面之複數條蒸汽導槽17之上方形成一室腔18^設置一 細體部16如圖U所示，使該毛細體部16可 在複數條蒸汽導槽17上方；而毛細體部16上設有一 向液體頭13之開口槽161，供液相工作流體40a可由液體 = 13”蒸發部10内部並經由開口槽161而流人毛細體部 π(，時參照圖10、U所示），俾可藉由毛細u 翁、作用吸附並同時於此吸熱而蒸發成為汽相工作 擊流體40b ’再藉複數條蒸汽導槽17匯流導入蒸 i二毛ί體部16在開口槽161之開口端處設有擋止用凸 f i62，藉以擋止液相工作流體40a因毛細體部16之毛細 力作用吸附而回流向液體頭13。 參照囷12-15所示，其分別係圖9之蒸發部另一實施 歹部透視、分解、局部立體及分解示意圖。本實施例 f 毛細栗吸環路（CPL)之雙相流散熱裝置2設具 一蒸發邛10以對應於二電子發熱元件如CPU (圖未示）， ϋ圖9所示雙相流散熱裝置2之_主要不同係在於蒸 發邛10之内部結構；本實施例之蒸發部10之内部設有一毛 13 200936027Recorder, MobileDVR, etc., to remove the heat generated by the system, such as the heat generated by the central processing unit (CPU) of the system board; and in the state where the liquid phase and the vapor phase coexist, there is no temperature difference between the two phases. The heat energy is taken from the liquid phase to the vapor phase or from the vapor phase to the liquid phase. The former is the evaporation process, the latter is the condensation process, and the heat transfer device developed according to this concept is called capillary. Pumping loop (CPL). The gravity type CPL dual-phase flow heat dissipation device 1 of the present invention mainly comprises: at least one evaporation unit 10, an annular passage 20 and a condensation portion 30, and is constituted by the evaporation portion 10, the annular passage 20 and the condensation portion 30. A capillary pumping loop ' ® ( CPL ) ' is filled with a working fluid (worj^ng f[uid ) such as Freon. The evaporator 10 can be a square casing made of a metal having a good heat conducting effect, such as an aluminum alloy, and the outer bottom surface 11 serves as a heat transfer surface for being closely attached to a heat source portion such as a system motherboard. The central processing unit CPU (not shown) removes the heat generated by the central processing unit (CPU) by the heat transfer to the evaporation portion (evap0rat〇r) 1〇; the liquid is disposed on the head side 12 The liquid head liquid 13a flows into the evaporation portion 10, and a steam head (n) is disposed on the trailing side η of the liquid head 40 for the evaporated vapor phase working liquid 40b to flow out of the evaporation portion 10. The inner portion of the evaporation portion 10 is provided with at least one capillary portion 16 and a plurality of vapor grooves. The capillary portion 16 has a capillary structure and an action function inside, and can be high-density. The composition is made of polyethylene or sintered sinter powder, and has a capillary diameter of 1.05×10 −5 m and a permeability of 6×10·10 m 2 . The plurality of vapor grooves 17 are disposed on the periphery of the capillary portion, and the design concept is to increase the capillary pressure difference and reduce the entire ring for how to increase the driving force of the overall capillary pumping loop (CPL). The road pressure drop is considered in two aspects. On the one hand, in order to require a small capillary diameter (p0r〇us radius) to adsorb the condensed liquid, the liquid 4〇a reaches the inner surface of the evaporator 10 for heating, and on the other hand, it must be considered. The flow resistance caused by the flow of the inner porous capillary portion 16 in the evaporating (4) is increased by the use of the sputum, and the design of the plurality of steam channels 17 is adopted. The vapor phase working liquid evaporating due to the absorption of heat 4〇b The digital video system for the work car (the second condensation portion 30 is mainly disposed on the annular passage 20, and the heat roller 20 can be used as a condensation tube, and ^The ring head of the steam head 15 is discharged, "Complete you:: food: two to remove the liquid from the evaporator 10 as 4% binocular, two 4 乍 2: ob: heat' to make the vapor phase Two body head 13 flow \ 1 Α ... into liquid phase working liquid 40a and changed to a 2-bit video system via liquid space MDVR) internal annular channel 20 = as shown in the = part of the conductor body), and people (none) or a part (as shown in Figure 9 - the heat sink fins 32 (as shown in Figures 9, 18) or Connecting the 200936027 guide, i or the heat sink Korean 32 to the MDVRi outer casing (not shown, thereby forming a heatsink to effectively remove the heat of the vapor phase working liquid 4〇b in the annular passage 20; In other words, cold ^ 兕 = is relatively simple, in order to reduce the rest, all the ring ^ condensate tube, and both are smooth and excellent thermal conductivity design. And cold field 2 skillfully use the mobileDVR existing shell with aluminum extrusion into the ' , Ϊ = sufficient capacity to be used by the evaporator (1) 工作 Ϊ 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁 鲁In the evaporation part 10, the heat is evaporated again, and the completion-enhancement of the household, the force of the force of the natural circulation of the heat transfer, to achieve a clever: 3 stupid; m accumulation and can not solve the high wattage shirt ( Such as -30 C to 60. The problem of temperature control of the 。. Dance-type capillary pumping loop (CPL) two-phase Dispersion 1 W considers the vacuum problem, because the vacuum is not good, it will cause non-condensing gas, and it will also affect the heat transfer of the condensation part 30 and the evaporation part 10: the control temperature of the special = therefore the loop of the system vacuum The design must reduce the use of _ to reduce the size of the vacuum that does not have to be designed in the same way as ιχι〇·5_ (Taul, fill the tw two t mesh: at 1 cm Hg quotient cm_Hg column height), that is, not yet 4 Before the cockroaches, the inside of the capillary suction loop (CPL) is better than the lxl0-torr (Taul), and the atmosphere is 760 torr (Tayl). The evaporator 1〇 is designed as a square casing for the geometry of 200936027 with electronic heating elements (such as CPU), and its size can be set to 50mmx50mmx20mm to meet Intel's Pentium IV single chip. Or set to 105 mm x 162 mm x 24 mm to meet the needs of dual CPUs. 4-8, which are schematic views of the internal structure of the other embodiment of the evaporation portion of the present invention, the upper cross section, the front cross section, and the used capillary portion and the assembled capillary portion (and Mark the reference size). The interior of the evaporation portion (evap〇rat〇r) 10 of the present embodiment is provided with at least one capillary body part 16 and a plurality of vapor grooves 17, and the capillary portion 16 and the plurality of vapor guides. The structural form between the grooves 17 is not particularly limited to a plurality of vapor guide grooves (vapor ^r=ve ) which are respectively disposed above and below the inside of the casing of the evaporation portion (evap〇rat〇r). As shown in Figures 4 and 5, and between the upper and lower rows of the plurality of steaming guide grooves π, a chamber 18 is provided for providing a correspondingly shaped capillary body so that the capillary portion 16 can be sandwiched between The upper and lower rows 17 are as shown in FIG. 8; and the capillary portion 16 is provided with -J 2; IX % fork opening groove 16i, for the liquid phase working fluid 40a to be liquid portion ί ί (ί^: When the part flows into the capillary through the opening groove 161, referring to Fig. 4·8, the 俾 can be 毛 毛 毛 毛 毛 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附 吸附The steam guiding channel 17 is merged and introduced into the exhausting edge 15 of the steam head 15, so that the opening end of the port = 161 is provided with a blocking convex force to absorb and return 4 = ^ body gamma The capillary of the capillary portion 16 (provided with a two-joint portion) is divided into another embodiment of the present invention. The partial perspective and decomposition of the Taiyin 渝 夕 及其 and its evaporation section ^ = 3⁄4 fine fruit suction loop called the two-phase flow η 失 失 彳 彳 日 日 日 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以The CPU ', the two evaporation sections 1 〇 are arranged in relation to the annular passage 20 and 12 200936027, that is, the liquid head 13 of the two evaporation sections 10 is connected to the annular passage 20 of the phase, so that the condensation section 30 is provided. The condensed liquid phase working fluid can be simultaneously introduced into each of the evaporation portions 1 by the respective liquid heads 13. Further, the solid portion 30 does not limit the partial structure shown in Fig. 9. The condensation portion 3 can be covered with the conductor 31 in the annular passage 2, as shown in Fig. 18, and can be matched. The heat sink fins 32 (shown in Figures 9 and 18) or the conductors 31 and the two heat sink fins 32 are connected to an outer casing (not shown) of the MDVR. Further, in the evaporation portion 1 of the first embodiment, at least one capillary portion (16) and a plurality of vapor guide grooves (vap〇rgr〇〇ve) 17 are provided, and the crotch portion 16 and the plural are provided. The structural form between the steam guiding grooves 17 is not particularly limited to a brake. (The lower inner surface of the housing of the ο—0 1〇 may be provided with a plurality of steaming 'vapor grooves' 17 as shown in FIG. A chamber 18 is formed above the plurality of steam channels 17 on the lower edge surface. A thin portion 16 is disposed as shown in FIG. U so that the capillary portion 16 can be above the plurality of steam channels 17. The capillary portion 16 is provided with an opening groove 161 of the liquid head 13 for allowing the liquid phase working fluid 40a to flow from the inside of the liquid = 13" evaporation portion 10 and through the opening groove 161 to flow the capillary portion π (refer to the figure) 10, U shows), the crucible can be evaporated by the capillary u, the action and simultaneously absorb heat to become the vapor phase working blowdown fluid 40b' and then borrow a plurality of steam guides 17 to merge and introduce the steamed i bristles. A blocking protrusion f i62 is provided at the open end of the opening groove 161, thereby blocking the liquid working fluid 40a from being affected by the capillary force of the capillary portion 16. It is attached to the liquid head 13. Referring to Figure 12-15, it is a perspective view of another embodiment of the evaporation portion of Fig. 9 for perspective, decomposition, partial solidification and decomposition. This embodiment f capillary pumping loop (CPL) The two-phase flow heat dissipating device 2 is provided with an evaporation crucible 10 to correspond to a two-electron heating element such as a CPU (not shown), and the two-phase flow heat dissipating device 2 shown in FIG. 9 mainly differs in the evaporation crucible 10 Internal structure; the inside of the evaporation portion 10 of the embodiment is provided with a hair 13 200936027

G 細體部（porous wick part) 16及複數條蒸汽導槽（vapor groove ) 17，其中該蒸發部（evaporator) i〇之殼體（可為 一鋁擠型體）内部之下緣面可形成圓弧形並佈設複數條蒸 汽導槽（vaporgroove) 17如圖13-15所示，使圓弧形下緣 面之複數條蒸汽導槽17上方形成一室腔18供設置一相對應 形狀之毛細體部16如圖13-15所示，使該毛細體部16可嵌 設在複數條蒸汽導槽17上方；而毛細體部16上設有一朝向 液體頭13之開口槽161，供液相工作流體4〇a可由液體頭 13流入蒸發部1〇内部並經由開口槽16ι而流入毛細體部16 内部，俾可藉由毛細體部16之毛細力作用吸附並同時於此 吸熱而蒸發成為汽相工作流體4〇b，再藉複數條蒸汽導槽 17匯流導入蒸汽頭15排出；又毛細體部16在開口槽161之 開口端處設有擋止用凸緣162，藉以擋止液相工作流體 4〇a因毛細體部16之毛細力作用吸附而回 成所示，其係圖”二蒸發部採串形 ^二蒸發部之局部立體示意圖。本實施例之重力式毛細 1環路（CPL)之雙相流散熱裝置係設具 ’ =’也就是其毛細體部（p。麵wiekpar〇 16及22 >飞導槽（vaporgroove) Π的長度較大，使 ，條蒸 環狀通道2G可呈㈣排列方式以對應相斜於 『二(圖未示），也就是該蒸發部相對於J 如 J液體頭（13)及一蒸汽頭（15)，而誃篆路却、具 長度較大的長度向同時對應密貼2電^部 牛如CPU上（圖未示），以藉轨僂導 子發熱 J = 因作#所產生之熱2 :該發 發熱讀其對_之移除效果比 =於二電子 200936027 散播H Ζ V,不’ Η其f本發明蒸發部之外部底面上設-本發明之作為傳熱面之橫向斷面示意圖。 (1、，f ί式及環路（CPL )之雙相流散熱裝置 一I# # ^一$可在其蒸發部1〇的外部底面n上先貼附 MDVP 4導…、片SPreader) 5〇 ’再對應密貼於熱源部份如 淮也&系統主機板6〇之中央處理器（CPU) 61上，藉以增 、、w ”、效果，而可滿足系統之控溫要求如MDVR要求在寬 他·30 °C至60°C之控溫要求。 Οa porous wick part 16 and a plurality of vapor grooves 17, wherein the lower edge of the inner casing of the evaporator (which may be an aluminum extruded body) may be formed The circular arc shape and a plurality of vapor grooves (vaporgroove) 17 are formed as shown in FIG. 13-15, and a plurality of chambers 18 are formed above the plurality of steam guiding grooves 17 of the arc-shaped lower edge surface for setting a capillary of a corresponding shape. The body portion 16 is as shown in Figs. 13-15, so that the capillary portion 16 can be embedded above the plurality of steam guiding grooves 17, and the capillary portion 16 is provided with an opening groove 161 facing the liquid head 13 for liquid phase operation. The fluid 4〇a can flow into the interior of the evaporation portion 1 through the liquid head 13 and flow into the inside of the capillary portion 16 through the opening groove 16i, and the crucible can be adsorbed by the capillary force of the capillary portion 16 and simultaneously evaporate to form a vapor phase by the endothermic heat. The working fluid 4〇b is further flowed into the steam head 15 by a plurality of steam guiding channels 17; and the capillary portion 16 is provided with a blocking flange 162 at the open end of the opening groove 161, thereby blocking the liquid working fluid 4〇a is returned by the capillary force of the capillary body 16 and is shown as Figure 2 is a partial perspective view of the two evaporating sections of the evaporating section. The two-phase flow heat dissipating device of the gravity type capillary 1 loop (CPL) of the present embodiment is provided with a '=', that is, a capillary portion thereof (p The surface of the wiekpar〇16 and 22 >vaporgroove has a large length, so that the stripped vapor channel 2G can be arranged in a (four) arrangement so that the corresponding phase is inclined to the second (not shown), that is, The evaporation portion is opposite to J such as J liquid head (13) and a steam head (15), but the length of the road is long, and the length of the length is corresponding to the close contact with the electric motor such as the CPU (not shown). The heat generated by the guide rail J J = 因 因 因 因 因 因 因 2 2 2 2 2 2 2 2 2 2 2 2 2 2 = = = = = = = = = = = = = = = = = = = = = = = = = = = The outer bottom surface is provided with a schematic cross-sectional view of the heat transfer surface of the present invention. (1, f ί type and loop (CPL) dual-phase flow heat sink I I # # ^一$ can be in its evaporation section 1〇's external bottom surface n is attached with MDVP 4 guide..., piece SPreader) 5〇' and then attached to the heat source part such as Huaiy & system main board 6〇 On the processor (CPU) 61, by increasing the sum, w ′, and effect, it can meet the temperature control requirements of the system, such as the MDVR requirement for temperature control from 30 ° C to 60 ° C.

參照圖18所示，其係圖9所示實施例之冷凝部另一實 > j立體示意圖。本實施例重力式毛細泵吸環路（CPL ) 雙相流散熱裝置之規格如下： 1、CPL 之材料：鋁（Aimninujjj)或銅（c〇pper ) ^、蒸發部：45X45X23.5 mm3 & 45X45X23.5 mm3 4 ’ 冷凝部：8ψ 蒸汽頭：8 mm 液體頭：8 mm 6、 毛細體部：具渗透度之聚乙稀（porousp〇iyethylene ) 7、 毛細有效孔徑（Porous Effect Radius ) ： 10'4 m~ ΙΟ'5 m 8、 渗透度（Porous Permeability ) ： 6X1 O'10 m2 9、 工作流體（WorkingFluid ):氟氣烧（Freon ) 1〇、環路真空度（System Vacuum ) ： 10'4~10'5 TorrReferring to Fig. 18, it is a perspective view of another solid portion of the condensing portion of the embodiment shown in Fig. 9. The specifications of the gravity capillary pumping loop (CPL) of the present embodiment are as follows: 1. Material of CPL: aluminum (Aimninujjj) or copper (c〇pper) ^, evaporation section: 45X45X23.5 mm3 & 45X45X23.5 mm3 4 ' Condensing part: 8ψ Steam head: 8 mm Liquid head: 8 mm 6. Capillary part: Porous p〇iyethylene 7. Porous Effect Radius : 10 '4 m~ ΙΟ'5 m 8. Porous Permeability: 6X1 O'10 m2 9. Working Fluid (FingerFluid): Freon 1 〇, System Vacuum : 10' 4~10'5 Torr

11、 最大熱量（Qmax ) : l〇〇W11, the maximum heat (Qmax): l〇〇W

12、 系統熱阻抗（System Thermal Resistance ) ： 0.3 °C /W 13、 系統作業溫度 Tcpu (System Operation Temperature) : 7012, System Thermal Resistance: 0.3 °C / W 13, system operating temperature Tcpu (System Operation Temperature): 70

°C°C

14、 環境溫度（Ambient temperature ) : 40°C 再參照圖19、20所示，其分別係圖18所示實施例另設 具一工作液體儲槽之分解立體及組合立體示意圖。本發明 進一步可在毛細泵吸環路（CPL )之冷凝部（condenser ) 15 200936027 30及蒸發部（evaporator) 10之液體頭（Uquidhead ) 13之 間增設一工作流體40之儲槽70，藉以增進散熱效果，而可 滿足系統之控溫要求如MDVR要求在寬溫·3〇 °C至60°C之 控溫要求；因此本實施例與圖18所示實施例之不同為本實 施例又加上一個儲槽70以作為環路之控溫用，當蒸汽由蒸 汽頭15進入冷凝部30時，隨即在此釋放出潛熱，完成移熱 的目的’本實施例設計的要點為確保冷凝部3〇出口為次冷 態（subcooled)。本實施例之規格如下： I、 CPL 之材料：紹（Aluminum )或銅（Copper ) ❹ 2、蒸發部：45X45X23.5 mm3 & 45X45X23.5 mm3 3、 冷凝部：8ψ 4、 蒸汽頭：8mm 5、 液體頭：8mm 6、 毛細體部：具滲透度之聚乙稀（porous p〇iyethylene ) 7、 毛細有效孔徑（Porous Effect Radius ) : 10*4 m〜10 5 m 8、 滲透度（Porous Permeability ) : 6X10'10m2 9、 工作流體（WorkingFluid ):氟氣烷（Freon ) 10、 環路真空度（System Vacuum ) ： ΙΟ^-ΙΟ'5 Torr14. Ambient temperature: 40 °C Referring again to Figs. 19 and 20, respectively, the embodiment shown in Fig. 18 is further provided with an exploded three-dimensional and combined perspective view of a working liquid storage tank. The present invention further provides a storage tank 40 for the working fluid 40 between the condenser 15 15360027 30 of the capillary pumping loop (CPL) and the liquid head 13 of the evaporator 10, thereby enhancing The heat dissipation effect can meet the temperature control requirements of the system, such as the temperature control requirement of the MDVR requirement at a wide temperature of 3 ° C to 60 ° C; therefore, the difference between the embodiment and the embodiment shown in FIG. 18 is The previous storage tank 70 is used for temperature control of the loop. When the steam enters the condensation portion 30 from the steam head 15, the latent heat is released therefrom, and the purpose of heat transfer is completed. The point of design of this embodiment is to ensure the condensation portion 3. The 〇 exit is subcooled. The specifications of this embodiment are as follows: I. Materials of CPL: Aluminum or Copper ❹ 2. Evaporation: 45X45X23.5 mm3 & 45X45X23.5 mm3 3. Condensation: 8ψ 4. Steam head: 8mm 5. Liquid head: 8mm 6. Capillary part: Porous p〇iyethylene 7. Porous Effect Radius: 10*4 m~10 5 m 8. Permeability (Porous Permeability ) : 6X10'10m2 9. Working Fluid (FingerFluid): Fluorane (Freon) 10, Loop Vacuum (System Vacuum) : ΙΟ^-ΙΟ'5 Torr

II、 最大熱量（Qmax ) : l〇〇WII. Maximum heat (Qmax): l〇〇W

❿ 12、系統熱阻抗（System Thermal Resistance ) : <0.95 °C /W 13、 系統作業溫度 Tcpu(SystemOperationTemperature) : 70❿ 12, System Thermal Resistance: <0.95 °C /W 13, system operating temperature Tcpu (SystemOperationTemperature): 70

°C°C

14、 環境溫度（Ambient temperature ) : -25 °C 〜70°C 15、 儲槽（Reservoir ) : 30 X 30 X 20 mm3 16、 適用：mobile DVR (車用數位錄影系統MDVR ) 以上所示僅為本發明之較佳實施例，對本發明而言僅 是說明性的，而非限制性的。本專業技術人員理解，在本 發明權利要求所限定的精神和範圍内可對其進行許多改 200936027 ^修改，甚至等效變更，但都將“本發明的保護範圍 【囷式簡單說明】 本發明—實施例（設具—蒸發部）之基本架構立體 之蒸發部（eVapG論）—實施例内部結構之 ί發部之内部結構橫向斷面示意圖。 €> 示參考用二;『蒸發部之内部結構橫向斷面示意圖。（標 示參:蒸發部之内部結構正視斷面示意圖。（標 所示蒸發部之毛細體部立體示意圖。（標示參 組裝體4『蒸發部之内部結構橫向斷面示意圖。（已 明另一實施例(設具二蒸發部且並聯排列)之 裝毛細Ξ部)中蒸發部内部結構之局部立體示意圖。（已組 圖15係圖14之分解示意圖。 蒸發部採串聯排列時形成-較長蒸發部之 17 200936027 圖17係本發明蒸發部之外部底面上設一散播用導熱片 (spreader)作為傳熱面之橫向斷面示意圖。 圖18係圖9所示實施例之冷凝部另一實施例立體示意圖。 圖19係圖18所示實施例另設具一工作液體儲槽之分解立體 示意圖。 圖20係圖19所示實施例之組合立體示意圖。 【主要元件符號說明】 CPL雙相流散熱裝置1、 蒸發部（evaporator) 1〇 0 頭侧面12 尾侧面14 毛細體部16 凸緣162 室腔18 冷凝部30 散熱鰭片32 液相工作液體40a 散播用導熱片50 中央處理器（CPU ) 61 外部底面11 液體頭（Liquid head ) 13 蒸汽頭（vapor head) 15 開口槽161 蒸汽導槽（vaporgroove) 17 環狀通道20 傳導體31 工作液體40 汽相工作液體40b 主機板60 儲槽7014. Ambient temperature: -25 °C ~70 °C 15. Reservoir: 30 X 30 X 20 mm3 16. Applicable: mobile DVR (Digital Video Recording System MDVR) The preferred embodiments of the present invention are intended to be illustrative and not restrictive. A person skilled in the art understands that many modifications, even equivalent modifications, may be made within the spirit and scope of the invention as defined by the appended claims. - Embodiment (Equipment - Evaporation Section) Basic Structure Stereo Evaporation Section (eVapG Theory) - Schematic diagram of the internal structure of the internal structure of the internal structure of the embodiment. €> Schematic diagram of the transverse section of the internal structure. (Indicating the internal structure of the evaporation section is a schematic view of the cross section. (The head is a three-dimensional diagram of the capillary part of the evaporation section. (Showing the lateral section of the internal structure of the evaporation part 4) (The partial internal schematic view of the internal structure of the evaporation portion in the other embodiment (the two-evaporating portion and the parallel arrangement) is shown. (Figure 15 is an exploded view of Figure 14. The evaporation portion is connected in series. Forming - Long Evaporation Portion 17 200936027 Figure 17 is a cross section of a heat transfer surface of a heat transfer surface on the outer bottom surface of the evaporation portion of the present invention. Figure 18 is a perspective view showing another embodiment of the condensing portion of the embodiment shown in Figure 9. Figure 19 is an exploded perspective view showing the working fluid storage tank of the embodiment shown in Figure 18. Figure 20 is a schematic view of Figure 19 A schematic diagram of the combination of the embodiments. [Description of the main components] CPL dual-phase flow heat sink 1, evaporator 1〇0 head side 12 tail side 14 capillary part 16 flange 162 chamber 18 condensation part 30 heat sink fin Sheet 32 Liquid phase working fluid 40a Heat spreader for spreading 50 Central processing unit (CPU) 61 External bottom surface 11 Liquid head 13 Vapor head 15 Open groove 161 Vapor channel (vaporgroove) 17 Annular channel 20 Conductor 31 Working fluid 40 Vapor phase working fluid 40b Motherboard 60 Storage tank 70

Claims (1)

200936027 十、申請專利範圍·· 1、一種重力式毛細泵吸環路（CPL )雙相流散熱裝置， 係應用於高能量密度之電子構裝產品上如車用數位影 $錄影系統（MDVR);其係包含：至少一蒸發部、 一環狀通道及一冷凝部，藉以構成一毛細泵吸環路 (CPL ) ’而環路中並填入工作流體，其中： ，發部，係一以具導熱效果之金屬製成之殼體，其外 部底面作為傳熱面，供可對應密貼於一熱源部份以藉 熱傳導而移除該熱源；其頭側面上設一液體頭供液相200936027 X. Patent application scope · 1. A gravity-type capillary pumping loop (CPL) dual-phase flow heat sink for high-energy density electronic components such as digital video recording system (MDVR) The system comprises: at least one evaporation portion, an annular passage and a condensation portion, thereby forming a capillary pumping loop (CPL), and the working fluid is filled in the loop, wherein: a housing made of metal having a heat conducting effect, the outer bottom surface serving as a heat transfer surface for being closely attached to a heat source portion to remove the heat source by heat conduction; a liquid head is provided on the head side for the liquid phase 工，液體流入蒸發部内，其尾侧面上設一蒸汽頭供蒸 發後之汽相工作液體流出蒸發部，其内部設有至少一 毛細體部及複數條蒸汽導槽，該毛細體部具有毛細結 構及作用，該複數條蒸汽導槽係設在毛細體部之外 圍； 環=通道，係佈設在蒸發器之外部且連接在蒸汽頭與 液體頭之間； :主要係設在環狀通道上，藉以形成熱沈部份 e=smk )用以移除由蒸發器之蒸汽頭排出之汽相 2 的熱量，使該汽相工作液體可凝結成液相工 作液體並經由液體頭流入蒸發部内； ί上ίϊ構’液相工作流體可自液體頭流入蒸發部内 由毛細體部之毛細力作用吸附並同時於此吸 為汽相卫作流體，再藉複數條蒸汽導槽匯 :釋放狀通道流動，再藉由冷凝 泣X 熱而回復為液相工作流體，再經由液體頭 =7、、發.{5内再受熱蒸發，完成一自然循環的移熱作 用0 範圍第1 _述之重力式毛細泵吸環路 雙相流散熱裝置，其中該毛細泵吸環路可設 2 200936027 具兩個或以上之蒸發部，且該等蒸發部係採用並聯排 列方式設置在環狀通道上，使各蒸發部之液體頭是連 接至相同之環狀通道上，使藉由冷凝部凝結之液相工 作流體可同時由各液體頭進入各蒸發部内。 3、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該蒸發部可為一方形 殼體。 4、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該蒸發部係以鋁製 β 成。 ^ 5、如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該毛細體部可利用高 密度且具滲透度之聚乙烯或燒結銅粉（sinterpowder)組 成。 6、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該毛細體部之毛細孔 徑可為1.05xl(T5m，其滲透度為6χ1〇Λη2。 7、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該毛細泵吸環路 φ ( CPL )之真空度以降低至lxl〇-5 torr (陶爾）為 佳。 8、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該工作流體為氟氯烷 (Freon )。 9、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該複數條蒸汽導槽係 佈設在蒸發部之殼體内部的下緣面上。 10、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該複數條蒸汽導槽係 20 200936027 佈設在蒸發部之殼體内部的圓弧形下緣面上。 11、 如申請專利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該冷凝部可利用熱傳 導體包覆在環狀通道之全部或一局部上，且熱傳導體 上並可設置散熱鰭片。 12、 如申請專利範圍第11項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該熱傳導體可為車用 數位影像錄影系統（MDVR )之外殼。 13、 如申請專利範圍第1項所述之重力式毛細泵吸環路 ( CPL )雙相流散熱裝置，其中該毛細體部上設有一 朝向液體頭之開口槽，供液相工作流體可由液體頭流 入蒸發部内部並經由開口槽而流入毛細體部内部。 14、 如申請專利範圍第13項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其中該毛細體部在開口槽 之開口端處設有擂止用凸緣，藉以擋止液相工作流體 回流向液體頭。 15、 如申請權利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其進一步可在蒸發部的外 部底面上貼附一散播用導熱片（spreader)。 ⑩ 16、如申請權利範圍第1項所述之重力式毛細泵吸環路 (CPL )雙相流散熱裝置，其進一步可在毛細泵吸環 路（CPL)之冷凝部及蒸發部之液體頭之間設置一工 作流體之儲槽。 21The liquid flows into the evaporation portion, and a steam head is disposed on the tail side thereof for vaporizing the vapor phase working liquid to flow out of the evaporation portion, and the inside thereof is provided with at least one capillary portion and a plurality of steam guiding grooves, and the capillary portion has a capillary structure And the plurality of steam channels are arranged on the periphery of the capillary portion; the ring=channel is disposed outside the evaporator and connected between the steam head and the liquid head; the main system is disposed on the annular passage. The heat sink portion e=smk is formed to remove the heat of the vapor phase 2 discharged from the steam head of the evaporator, so that the vapor phase working liquid can be condensed into a liquid phase working liquid and flow into the evaporation portion via the liquid head; The liquid phase working fluid can flow from the liquid head into the evaporation portion and is adsorbed by the capillary force of the capillary body and simultaneously sucked into the vapor phase fluid, and then borrows a plurality of steam channels to sink: the release channel flows, Then, it is returned to the liquid phase working fluid by condensing the X heat, and then through the liquid head = 7, and the hair is reheated by the heat in the 5th cycle to complete the heat transfer of a natural cycle. 0 Scope 1 _ The gravity type capillary Pump The suction loop two-phase flow heat dissipation device, wherein the capillary pumping loop can be set to 2 200936027 with two or more evaporation portions, and the evaporation portions are arranged in a parallel arrangement on the annular passage to make each evaporation portion The liquid head is connected to the same annular passage so that the liquid phase working fluid condensed by the condensation portion can simultaneously enter the respective evaporation portions from the respective liquid heads. 3. The gravity-type capillary pumping loop (CPL) dual-phase flow heat sink according to claim 1, wherein the evaporation portion can be a square housing. 4. The gravity-type capillary pumping loop (CPL) two-phase flow heat dissipating device according to claim 1, wherein the evaporation portion is made of aluminum β. ^ 5. A gravity-type capillary pumping loop (CPL) two-phase flow heat sink according to claim 1, wherein the capillary portion can utilize high density and permeability polyethylene or sintered copper powder ( Sinterpowder) composition. 6. The gravity capillary pumping loop (CPL) two-phase flow heat dissipating device according to claim 1, wherein the capillary portion has a capillary diameter of 1.05xl (T5m, and the permeability is 6χ1〇Λη2). 7. A gravity-type capillary pumping loop (CPL) two-phase flow heat dissipating device as described in claim 1, wherein the capillary pumping loop φ (CPL) vacuum is reduced to lxl〇-5 Torr is preferred. 8. A gravity-type capillary pumping loop (CPL) two-phase flow heat sink as described in claim 1 wherein the working fluid is fluorocarbon (Freon). The gravity-type capillary pumping loop (CPL) two-phase flow heat dissipating device according to claim 1, wherein the plurality of steam guiding channels are disposed on a lower edge surface inside the casing of the evaporation portion. The gravity-type capillary pumping loop (CPL) two-phase flow heat dissipating device according to claim 1, wherein the plurality of steam channel guides 20 200936027 are disposed on a lower arc-shaped lower edge of the casing of the evaporation portion. 11. Gravity capillary pump as described in claim 1 a double-phase flow heat sink of the suction loop (CPL), wherein the condensation portion may be coated on all or a part of the annular passage by using a heat conductor, and the heat dissipation fin may be disposed on the heat conductor. The gravity capillary pumping loop (CPL) two-phase flow heat dissipating device according to Item 11, wherein the heat conductor can be a casing of a digital video recording system (MDVR) for a vehicle. A gravity-type capillary pumping loop (CPL) dual-phase flow heat dissipating device, wherein the capillary portion is provided with an open groove facing the liquid head, wherein the liquid working fluid can flow from the liquid head into the interior of the evaporation portion and through the open groove Flowing into the interior of the capillary portion. 14. A gravity-type capillary pumping loop (CPL) dual-phase flow heat sink according to claim 13 wherein the capillary portion is provided at the open end of the open slot. The flange is used to block the liquid phase working fluid from flowing back to the liquid head. 15. The gravity capillary pumping loop (CPL) two-phase flow heat dissipating device according to claim 1, further in the evaporation portion of A diffuser for spreading is attached to the bottom surface of the portion. 10 16. A gravity-type capillary pumping loop (CPL) dual-phase flow heat sink according to claim 1 of the invention, which is further capable of pumping capillary A working fluid reservoir is disposed between the condensation portion of the loop (CPL) and the liquid head of the evaporation portion.