200935991 九、發明說明： , 【發明所屬之技術領域】 一種降低設置成 且藉由產品外殼 一種印刷電路板及設置方法，特別指 本’卻能大幅提高印刷電路板組裝效率， 直接進行散熱的印刷電路板結構。 【先前技術】 拜科技進步所賜’現有的電器產品逐漸朝向輕薄、小 _型化的方向發展，例如在於顯示器方面，由於液晶顯示器 的需求日增，其技術進步可謂一日千里，也連帶影響周邊 產業的篷勃發展，例如液晶顯示器中最關鍵的液晶顯示模 組（LCM，Liquid Crystal Display Module)。 目前的液晶顯示模組是以發光二極體（LED)為背光光 源，因為發光二極體本身具備堅固、耐用的優點，且在長 期改良後，目前的高亮度發光二極體所發出的亮度已直逼 參傳統光源，不僅作為一般照明的功用，亦已逐漸推廣到任 - 何需要光源的領域中。又因為液晶顯示模組的輕巧設計， 該液晶顯示模組必須配合具備良好彎曲度的印刷電路 板’並採取模組化設計，以方便生產製程。 然而’由於發光二極體的亮度增加，相對使其消耗功 率以及產生熱量大幅提升，使傳統發光二極體的印刷電路 板設計不敷使用，而必須革新散熱設計。 傳統具備良好彎曲度的軟質印刷電路板（Fpe 200935991200935991 IX. Description of the invention: , [Technical field to which the invention pertains] A printing circuit board and a setting method which are reduced in size and provided by a product casing, in particular, a printing which can greatly improve the assembly efficiency of a printed circuit board and directly dissipate heat Board structure. [Prior Art] Thanks to advances in science and technology, 'the existing electrical products are gradually moving toward a thin, small-sized direction. For example, in terms of displays, the demand for liquid crystal displays is increasing, and its technological progress can be described as a thousand miles, and it also affects the surrounding industries. The development of the bonnet, such as the most critical liquid crystal display module (LCM) in liquid crystal displays. The current liquid crystal display module uses a light-emitting diode (LED) as a backlight source, because the light-emitting diode itself has the advantages of being strong and durable, and after long-term improvement, the brightness of the current high-brightness light-emitting diode is emitted. It has been directly involved in the traditional light source, not only as a function of general lighting, but has also been gradually extended to any field where light source is required. Because of the lightweight design of the liquid crystal display module, the liquid crystal display module must be matched with a printed circuit board having good curvature and modularized to facilitate the production process. However, due to the increase in the brightness of the light-emitting diodes, the power consumption and the heat generation are greatly increased, so that the printed circuit board design of the conventional light-emitting diode is insufficient, and the heat-dissipation design must be innovated. Traditional soft printed circuit board with good bending (Fpe 200935991
Flexible Pr.nted Circuit,或稱 FM!C， FiexibieFlexible Pr.nted Circuit, or FM!C, Fiexibie
Materia! lntercc)nnect ―伽⑴咖），雖然具有極佳 的考曲度，但其導熱性相當差，不適用在高熱量的發光二 極體上。且該軟質印刷電路板的材料不符環保要求，又具 有易燃性質，雖可增加材料厚度來改善耐燃性，但產品的 彎曲度會因此降低。Materia! lntercc) nnect - gamma (1) coffee), although it has excellent test curvature, its thermal conductivity is quite poor, and it is not suitable for high-heat LEDs. Moreover, the material of the flexible printed circuit board is inconsistent with environmental requirements and has flammable properties. Although the material thickness can be increased to improve the flame resistance, the bending of the product is reduced.
而另一種印刷電路板是玻璃纖維板（FR4，FhMAnother printed circuit board is fiberglass (FR4, FhM)
Retardant4)，其導熱效果、彎曲度皆不及軟質印刷電路 板，故不適合作為液晶顯示模組的用途。 因此，目前常見的液晶 採取鋁基板設計方式，如圖 顯示模組印刷電路板結構，是 1所示，其至少包括有一基板Retardant 4), its thermal conductivity and curvature are not as good as soft printed circuit boards, so it is not suitable for use as a liquid crystal display module. Therefore, the current common liquid crystal adopts an aluminum substrate design method, as shown in the figure, the printed circuit board structure of the module is shown in FIG. 1, which includes at least one substrate.
層41 ’該基板層41上表面疊置有一導熱絕緣層42，該導 熱絕緣層42上表面疊置有一導電層43，在該導電層α 的上表面設置有一防焊油墨層44，最後於該防焊油墨層 44的上表面設置有一發光二極體45，並使該發光二極體 45與導電層43形成電性連接。所述導電^ 43為銅箔等 具有良好導電性的材料，以對發光二極體45提供所需電 路；該防焊油墨層44作為發光二極體45與導電層43之 間的絕緣阻隔，避免短路發生；該導熱絕緣層42具有良 好的導熱效果，並將發光二極體45與導電層43的熱量傳 導到基板層41上消散；而該基板層41主要為鋁基板，用 200935991 來作為散熱之用。 . 藉此完成之傳統鋁基板液晶顯示模組，在使用時係將 ‘基板層41貼附在液晶顯示器的外殼3上，並以螺絲 等方式鎖固。 然而，前述鋁基板結構，因基板層41的設計而導致 彎曲度下降，且增加產品厚度與製作成本。而基板層Ο 本身雖具有散熱效果，但受限於本身面積，當發光二極體 麟數里再增加時，現有基板層41的效果即嫌不足，且該基 ，板層41阻隔導熱絕緣層42與外殼3的連接，使熱量無法 有效傳導到外殼3上，反而浪費了外殼3魔大的散熱面 積。故前述鋁基板結構仍非良善的產品，而必須加以改良。 有鑑於此，本案發明人即構思解決之方法，以減化產 品結構同時改善舊有裝置的裝配問題，經由長期研發與實 驗後、.’、ft成功研發元成本件液晶顯示器的印刷電路板及 ® 設置方法。 • 【發明内容】 ' 本發明的主要目的即在提供一種印刷電路板，其具有 良好的散熱特性’又可維持良好的彎曲度’符合環保，不 易燃燒’且價格低廉，容易使用。 本發明的另一目的即在提供一種印刷電路板，其結構 簡單，去除傳統鋁基板設計的不當問題，故能降低成本， 200935991 卻大幅提高產品的功能。 本發明的再一目的即在提供一種印刷電路板設置方 法其可減化液晶顯示器的組裝流程，方便生產工作，且 能維持良好的散熱特性。 本發月的他一目的即在提供一種印刷電路板設置方 法’其可應用在任何印刷電路板領域，而㉟善盡散熱之功 效者。 可達成前述目的之印刷電路板及設置方法，其主要包 括有電路板扁置與一自黏性導熱層《該電路板裝置包括 有一導熱絕緣層，該導熱絕緣層上表面疊置有一導電層，在 邊導電層的上表面設置有一防焊油墨層，最後於該防焊油墨 層的上表面設置有一發光二極體，並使該發光二極體與導電 層形成電性連接。而該自黏性導熱層則設置在導熱絕緣層 底部，並黏貼於該夕卜㉟。藉此，該發光二極體以及導電層的 熱量得經由導熱絕緣層、自黏性導熱層傳導到外殼上消 散，以大幅降低該印刷電路板的溫度，使該印刷電路板可裝 置更高功率或高亮度的發光二極體。 【實施方式】 請參閱圖1所示’本發明 置方法，所述印刷電路板包括 性導熱層2 ’該電路板裝置1 係提供一種印刷電路板及設 有一電路板裝置1與一自黏 提供產品所需的功能，而該 200935991 自黏性導熱層2則作為將電路板裝置1快速定位到液晶顯 示器外般3的功能。 • 該電路板裝置1包括有一導熱絕緣層11 ’該導熱絕緣 層11上表面疊置有一導電層12,在該導電層的上表面設 置有一防焊油墨層1 3，最後於該防焊油墨層1 3的上表面設 置有一發光二極體14,並使該發光二極體14與導電層12形 成電性連接。而該自黏性導熱層2則設置在導熱絕緣層11 • 底部，並黏貼於該外殼3。藉此，該發光二極體14以及導 • 電層12的熱量得經由導熱絕緣層11、自黏性導熱層2傳導 到外殼3上消散，以大幅降低該印刷電路板的溫度，使該印 刷電路板可裝置更高功率或高亮度的發光二極體14。 該導熱絕緣層11為具有導熱效果的絕緣薄膜，或其它 具有導熱效果的薄膜材料。該導電層12為銅箔，或其它導 電效果良好的材料，其上佈設有電路，以便與其它電子零件 • 連接，取得控制該發光二極體14的功能。該防焊油墨層13 ' 作為發光二極體14與導電層12之間的絕緣阻隔，避免短 - 路發生。 請參閱圖2所示，前述自黏性導熱層2包括以下成份： ^ ^ 40%-48% ； 二氧化矽20% ; 石夕油混合物29%-37% ;以及 200935991 架橋劑3%。 前述矽油混合物進一步界定如下： * 矽油 ; 二曱基矽油 15%-20%;以及 苯基矽油7%。 藉由以上成份，該生膠用來形成本發明的主體，使其 成為質軟的固態物質，該二氧化矽則用來強化主體結構， 麝 使主體不易毁損，該矽油混合物則用來產生所需的黏著 ' 性’並由各種矽油比例的變化來改變主體的硬度，以適應 不同場合的需要’而該架橋劑則用來促成各成份的組合。 因此，該自黏性導熱層2具有良好的黏著性，可方便 將電路板裝置1定位於外殼3上，又因其本身成份的特 性，該自黏性導熱層2亦具有良好的導熱性，可將熱量經 由外殼3排除。當然，為增加固定性，該外殼3與電路板 ® 裝置1之間更可以螺絲3 1等方式進一步固定。 ' 藉由前述說明，本發明相較於傳統的印刷電路板，更 ' 具備下表所列之優點： 功能 F?C FR4 產呂基板 導熱效果 完全不散熱 完全不散熱 最好 (有鋁板尺寸 限制） —寸 中 彎曲度 不行 不行 —_!格 中 本發明 ~~ (直接導熱至外 殼上） 次薄 10 200935991 阻燃 不阻燃 一般 最好 最好 環保 不環保 不環保 次好 最好 - 上列詳細說明係針對本發明之一可行實施例之具體 說明，惟該實施例並非用以限制本發明之專利範圍，凡未 脫離本發明技藝精神所為之等效實施或變更，均應包含於 本案之專利範圍中。 【圖式簡單說明】 A 請參閱以下有關本發明一較佳實施例之詳細說明及 , 其附圖，將可進一步.瞭解本發明之技術内容及其目的功 效；有關該實施例之附圖為： 圖1為本發明的結構示意圖； 圖2為本發明的自黏性導熱層之成份比例圖；以及 圖3為習用鋁基板的結構示意圖。 主要元件符號說明 飜 1 - 12 14 3 41 43 45 電路板裝置 導電層 發光二極體 外殼 基板層 導電層 發光二極體 11 導熱絕緣層 13 防焊油墨層 2 自黏性導熱層 31 螺絲 42 導熱絕緣層 44 防焊油墨層 11a conductive layer 42 is disposed on the upper surface of the substrate 41. The conductive layer 43 is disposed on the upper surface of the conductive layer 42. A solder resist layer 44 is disposed on the upper surface of the conductive layer α. A light-emitting diode 45 is disposed on the upper surface of the solder resist ink layer 44, and the light-emitting diode 45 is electrically connected to the conductive layer 43. The conductive material 43 is a material having good conductivity, such as a copper foil, to provide a desired circuit to the light emitting diode 45; the solder resist ink layer 44 serves as an insulating barrier between the light emitting diode 45 and the conductive layer 43. The short circuit is prevented from occurring; the thermal conductive layer 42 has a good heat conduction effect, and the heat of the light-emitting diode 45 and the conductive layer 43 is transmitted to the substrate layer 41 to be dissipated; and the substrate layer 41 is mainly an aluminum substrate, which is used as 200935991. For heat dissipation. The conventional aluminum substrate liquid crystal display module thus completed is attached to the substrate 3 of the liquid crystal display by the substrate layer 41 and is locked by screws or the like. However, the aforementioned aluminum substrate structure causes a decrease in the degree of curvature due to the design of the substrate layer 41, and increases the thickness of the product and the manufacturing cost. The substrate layer itself has a heat dissipation effect, but is limited by its own area. When the number of LEDs is increased, the effect of the existing substrate layer 41 is insufficient, and the substrate layer 41 blocks the thermal conductive layer. The connection of the 42 to the outer casing 3 prevents the heat from being effectively conducted to the outer casing 3, but wastes the heat dissipation area of the outer casing 3. Therefore, the aforementioned aluminum substrate structure is still not a good product, and must be improved. In view of this, the inventor of the present invention conceived a solution to reduce the product structure and improve the assembly problem of the old device. After long-term research and development, the company successfully developed the printed circuit board of the liquid crystal display device. ® setting method. • SUMMARY OF THE INVENTION The main object of the present invention is to provide a printed circuit board which has good heat dissipation characteristics and maintains good curvature. It is environmentally friendly, is not easily burned, and is inexpensive and easy to use. Another object of the present invention is to provide a printed circuit board which has a simple structure and removes the problem of improper design of a conventional aluminum substrate, thereby reducing the cost, and 200935991 greatly improves the function of the product. Still another object of the present invention is to provide a printed circuit board setting method which can reduce the assembly process of the liquid crystal display, facilitate the production work, and maintain good heat dissipation characteristics. One of his goals for this month is to provide a printed circuit board setup method that can be applied to any printed circuit board area, and that 35 is effective in cooling. A printed circuit board and a mounting method capable of achieving the foregoing purposes, comprising: a circuit board flat and a self-adhesive heat conducting layer. The circuit board device includes a thermally conductive insulating layer, and a conductive layer is stacked on the upper surface of the thermally conductive insulating layer. A solder resist ink layer is disposed on the upper surface of the edge conductive layer, and finally a light emitting diode is disposed on the upper surface of the solder resist ink layer, and the light emitting diode is electrically connected to the conductive layer. The self-adhesive thermally conductive layer is disposed on the bottom of the thermally conductive insulating layer and adhered to the surface 35. Thereby, the heat of the light emitting diode and the conductive layer is dissipated through the thermally conductive insulating layer and the self-adhesive heat conducting layer to the outer casing to substantially reduce the temperature of the printed circuit board, so that the printed circuit board can be installed with higher power. Or a high-brightness LED. [Embodiment] Referring to the method of the present invention, the printed circuit board includes a thermally conductive layer 2'. The circuit board device 1 provides a printed circuit board and is provided with a circuit board device 1 and a self-adhesive device. The function required for the product, and the 200935991 self-adhesive thermal conductive layer 2 functions as a function of quickly positioning the circuit board device 1 to the outside of the liquid crystal display. The circuit board device 1 includes a thermally conductive insulating layer 11'. The upper surface of the thermally conductive insulating layer 11 is superposed with a conductive layer 12, and a solder resist ink layer 13 is disposed on the upper surface of the conductive layer, and finally the solder resist layer is formed. A light-emitting diode 14 is disposed on the upper surface of the first light-emitting diode 14 , and the light-emitting diode 14 is electrically connected to the conductive layer 12 . The self-adhesive heat conducting layer 2 is disposed on the bottom of the thermally conductive insulating layer 11 and adhered to the outer casing 3. Thereby, the heat of the light-emitting diode 14 and the conductive layer 12 is transmitted to the outer casing 3 via the thermally conductive insulating layer 11 and the self-adhesive heat-conducting layer 2 to dissipate the heat to greatly reduce the temperature of the printed circuit board. The circuit board can be equipped with a higher power or high brightness LED 14. The thermally conductive insulating layer 11 is an insulating film having a heat conducting effect, or other film material having a heat conducting effect. The conductive layer 12 is a copper foil or other material having a good electrical conduction effect, and is provided with an electric circuit for connection with other electronic parts to obtain a function of controlling the light-emitting diode 14. The solder resist ink layer 13' serves as an insulating barrier between the light-emitting diode 14 and the conductive layer 12 to prevent short-circuit occurrence. Referring to FIG. 2, the self-adhesive heat conducting layer 2 includes the following components: ^ ^ 40% - 48%; cerium oxide 20%; Shi Xi oil mixture 29% - 37%; and 200935991 bridging agent 3%. The foregoing emu oil mixture is further defined as follows: * eucalyptus oil; diterpene eucalyptus oil 15%-20%; and phenyl eucalyptus oil 7%. By the above ingredients, the raw rubber is used to form the main body of the present invention to be a soft solid substance, and the cerium oxide is used to strengthen the main structure, so that the main body is not easily damaged, and the eucalyptus mixture is used to produce The adhesive 'sex' is required and the hardness of the body is changed by various ratios of eucalyptus to suit the needs of different occasions. The bridging agent is used to promote the combination of components. Therefore, the self-adhesive thermal conductive layer 2 has good adhesion, and the circuit board device 1 can be conveniently positioned on the outer casing 3. The self-adhesive thermal conductive layer 2 also has good thermal conductivity due to its own composition. Heat can be removed via the outer casing 3. Of course, in order to increase the fixing property, the outer casing 3 and the circuit board ® device 1 can be further fixed by means of a screw 3 or the like. By the foregoing description, the present invention has the advantages listed in the following table compared with the conventional printed circuit board: Function F?C FR4 Lu base substrate heat conduction effect is completely no heat dissipation, no heat dissipation is best (with aluminum plate size limit) ) - The bending in the inch is not enough - _! The invention in the grid ~ ~ (direct heat conduction to the outer casing) The second thin 10 200935991 Flame retardant is not flame retardant generally best environmentally friendly not environmentally friendly not environmentally friendly best - above DETAILED DESCRIPTION OF THE INVENTION The detailed description of the present invention is not intended to limit the scope of the invention, and the equivalents of the embodiments of the present invention should be included in the present invention. In the scope of patents. BRIEF DESCRIPTION OF THE DRAWINGS The following is a detailed description of a preferred embodiment of the present invention and the accompanying drawings, which will further illustrate the technical contents of the present invention and the purpose of the present invention; 1 is a schematic structural view of the present invention; FIG. 2 is a compositional ratio diagram of a self-adhesive thermally conductive layer of the present invention; and FIG. 3 is a schematic structural view of a conventional aluminum substrate. Main component symbol description 飜1 - 12 14 3 41 43 45 Circuit board device Conductive layer Light-emitting diode Housing substrate Conductive layer Light-emitting diode 11 Thermal conductive layer 13 Solder-proof ink layer 2 Self-adhesive heat-conducting layer 31 Screw 42 Heat conduction Insulation layer 44 solder resist ink layer 11