200932078 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種絲_元件攝取多區域影像方法及其装 置’尤指-種利用光學感測元件對應一待測工件表面進行非接觸 之擷取影像之方法及其裝置。 【先前技術】 〇 -般電子產品之製程，由於精密度攸關日後產品之良疏，因 此必須在製程中對於許多細微之部分進行檢測，例如在玻璃基板 引腳接合製程(OLB，Outer Lead Bonding)上，或是任何電子產品製 程中之微細接合(BOND)之部位。 前述所謂「OLB」’主要係指將已構裝IC的軟性基板與玻璃 基板以異方性導電膜(ACF)作接合之製程。是知，由於軟性基板 (FPC)以及與玻璃基板引腳接合製程(〇LB)之技術逐漸純熟，而引 ◎ 腳接合製程(〇LB)中，往往存在許多生產變數並須藉由檢測，方能 得知軟性基板及玻璃基板引腳結合後之位移偏差量、導電粒子壓 痕及壓痕良好顆粒數計算，才能達到產品良率之提升。而引腳接 合製程(OLB)，其構裝上在接腳或接觸均採取相當細微化與細間距 化，因此檢測並不容易，而目前產業界對於引腳接合製程(〇LB)， 其構裝壓合主要係藉由光學顯微鏡逐點檢驗，然而若採取逐一檢 測’不但耗時費力’效率也有限，更由於檢測之標準不一，而影 響品質之穩定性。再者，由於軟性基板(FPC)之固性較低，容易隨 熱漲冷縮等物理變化而變形以及偏差，而導致其加工與檢測不易。 200932078200932078 IX. Description of the Invention: [Technical Field] The present invention relates to a method for absorbing a multi-region image of a silk-component, and a device thereof, in particular, a non-contacting use of an optical sensing element corresponding to a surface of a workpiece to be tested Method and device for capturing images. [Prior Art] The process of 电子-like electronic products, because of the precision of the products in the future, it is necessary to detect many subtle parts in the process, such as the glass substrate pin bonding process (OLB, Outer Lead Bonding). ), or the part of the fine bond (BOND) in any electronic product process. The term "OLB" as used herein mainly refers to a process in which a flexible substrate on which an IC is mounted and a glass substrate are bonded by an anisotropic conductive film (ACF). It is known that since the flexible substrate (FPC) and the technology of the lead bonding process (〇LB) with the glass substrate are gradually becoming more sophisticated, in the foot bonding process (〇LB), there are often many production variables and must be detected by the method. It can be known that the displacement deviation of the flexible substrate and the glass substrate after the pin is combined, the conductive particle indentation and the number of good indentation particles can be calculated to achieve an improvement in product yield. The pin bonding process (OLB) has a relatively fine and fine pitch on the pins or contacts, so the detection is not easy. At present, the industry is concerned with the pin bonding process (〇LB). The press-fit is mainly by point-by-point inspection by optical microscopy. However, if the test is performed one by one, it is not only time-consuming and laborious, but also has limited efficiency, and the quality of the test is affected by the different standards. Further, since the flexible substrate (FPC) has a low solidity, it is easily deformed and deviated with physical changes such as heat expansion and contraction, which makes processing and detection difficult. 200932078
雖然在各種檢測技術中，目前已知之先前技術，有利用所謂 非接觸之細’其主要是藉由複數光學細元件，對於-個待測 ^件(^括製程巾讀料、核私是完紅產品，以下統稱為待 測工件，分別由不同之角度__功上所需驗_位之X 轴(寬）、作(物物瑕_粒之長度、寬度）。然_於該待測 工件之待測部㈣例如瑕疲部位)之厚度(或稱2轴之高度），仍然欠 缺-精準之測量，而導致無法確實求得待測工件之實際座標或尺 寸。 不〆 雖然有如第一圖所示，利用傾斜角度對於該待測工件（5 ) 之待測部位（5 1)之鄰邊呈現灰階影像(例如斜照之陰影）（5 2 )’計算該待測雜（5 )之高度。然補傾斜角度受到許多不 規則之變數影響’因此所呈現之灰階影像（5 2 )並不容祕確。 因此仍然難以取得精準之待_位（5丄）之高度值，進而不容 易檢測出待測工件之瑕疵。 ^ 【發明内容】 有鑑於先前技術之問題，本發明設計一種得以利用單一光學 感測元件，利用覆疊影像以及多重對焦擷取其光學影像；然後計 算焦距，由多重多層之光學影像中選取一較佳之焦距，並經由計 算取得以及其距離值，並與其鄰近之部位比較出一清晰之影像以 及差值，而由該差值計算該待測元件之待測部位之求其2軸(即待 測工件於平躺於工作台時之厚度）。藉由此種自動對焦計算出最佳 之焦距距離值(相對越近，顯示其突出之顆粒越接近光學感測元 6 200932078 件），因此可以求得待測元件之待測部位精密之光學影像以及其影 像所呈現之數值。 本發明解決先前問題所使用之技術手段，係分別以方法以及 裝置呈現’就該方法而言’係本發明係關於一種光學感測元件攝 取多區域影像方法及其裝置，絲藉由單—絲細元件分別對 應-待測轉表面之複數單元區域，做分腦取其光學影像； 以該光學制元件分卿概單元區域難，哺#影像以及多 〇重触娜其絲影像；記錄其躲各單元_讀麟形成之 光學影像’並且轉換為電子職哺ώ，並且記錄各單元區域對 焦過程之焦點距離值；並選取各單元區域巾最佳焦距之電子訊號 值以及焦距距離值作為鮮，並且與該單元區域鄰邊區域之焦距 相比車乂’以差值之比較，換算待測工件於該單元區域之瑕疯或是 標準狀態。細·較為㈣之灯與綠⑩制品質之精準 度本發明可讀泛細於行動電話機、電視、電腦螢幕等各種 〇不同面積具有LCD之電子產品之構裝驅動IC之檢測。藉此可提 升檢測品質與檢測之效率。 【實施方式】 以下藉由®式之輔助’說日月本發明之内容、特點以及實施例， 俾使貴審查委S對於本創作有更進—步之了解。 本發明係關於-種光學感測元件攝取多區域影像方法，請參 閱第-圖之待取件立體圖、本發明之平面示意圖以及第四圖之 流程圖所示，係包括： 200932078Although in the various detection techniques, the prior art known at present, there is the use of so-called non-contact fines, which are mainly by a plurality of optical fine components, for a test piece (including a process towel reading, nuclear private is finished) Red products, hereinafter collectively referred to as the workpiece to be tested, are respectively from different angles __ work on the X-axis (width) of the required _ position, for (the length of the object 瑕 _ grain, width). The thickness of the workpiece to be tested (4), such as the fatigued portion (or the height of the 2 axes), is still lacking - accurate measurement, which makes it impossible to determine the actual coordinates or dimensions of the workpiece to be tested. Although, as shown in the first figure, the grayscale image (for example, the shadow of the oblique image) is displayed on the adjacent side of the portion (5 1) of the workpiece to be tested (5) by using the tilt angle (5 2 ) The height of the measurement (5). However, the tilt angle is affected by many irregular variables', so the grayscale image (5 2 ) presented is not secret. Therefore, it is still difficult to obtain the height value of the _ bit (5 丄), and it is not easy to detect the flaw of the workpiece to be tested. SUMMARY OF THE INVENTION In view of the problems of the prior art, the present invention is designed to utilize a single optical sensing element to capture an optical image thereof using overlay images and multiple focus; then calculate the focal length, and select one of the multiple layers of optical images. Preferably, the focal length is obtained by calculation and the distance value thereof, and a clear image and a difference are compared with the adjacent portion, and the difference between the part to be tested of the device to be tested is calculated from the difference. Measure the thickness of the workpiece when lying on the table. By using this autofocus to calculate the optimal focal length distance value (the closer the closer, the closer the protruding particles are to the optical sensing element 6 200932078), so that the precise optical image of the part to be tested of the device to be tested can be obtained. And the value presented by the image. The technical means for solving the previous problems of the present invention are respectively presented by the method and the device. The present invention relates to a method for capturing multi-regional image of an optical sensing element and a device thereof, and the wire is made of a single wire. The thin components respectively correspond to the complex unit area of the surface to be measured, and the optical image is taken by the brain; the optical component is divided into regions, the image is difficult, the image is repeated, and the Naxis image is recorded; Each unit_reads the optical image formed by Lin' and converts it into an electronic job, and records the focus distance value of the focusing process in each unit area; and selects the electronic signal value and the focal length distance value of the best focal length of each unit area as fresh, And compared with the focal length of the adjacent region of the unit region, the ruth is compared with the difference, and the workpiece to be tested is converted into a mad or standard state in the unit region. The accuracy of the lighter and the lighter (four) and the quality of the green 10 product can be detected by the invention. The invention can be applied to the detection of various types of electronic components such as mobile phones, televisions, computer screens and the like. This improves the quality of inspection and the efficiency of detection. [Embodiment] The following is a description of the contents, features, and embodiments of the present invention by the aid of the ® formula, so that the review committee S can have a more advanced understanding of the creation. The present invention relates to a method for capturing a multi-region image by an optical sensing element. Please refer to the perspective view of the object to be taken in the first drawing, the schematic plan view of the present invention, and the flow chart of the fourth figure, including: 200932078
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Hi學！^件⑴分騎應-待測工件⑵表面 之複數單元區域（21)〜广 光學影IΓ· 可贿次分別攝取其 工域（21)〜（2 3)可以為該待測 玻璃基板測是否瑕蘇之部分，例如軟性基摩c)與 土 5曰曰圓片之間之引腳接合製程(〇LB)之檢 中瑕疵與否之部分。、以該光學感測元件⑴分別對第-單元區域（21)對焦 時’以覆疊影像以及多重對_取其絲影像； … 記錄其對於該第-單元區域（2工）之對焦所形成之光學影 像，並且麵輕子職而触，並且記錄各單元區域對舞 過程之焦點距離值； Λ 於該第-單元輯（2 i)縣―最餘距之許訊號值以 及焦距距離值； E、 對第二單元區域（22)進行以覆疊影像以及多重對焦揭取 〇 影像；依此類推各取得光學影像，並且轉換為電子訊=而輸 出’並且記錄各單元區域（2 1)〜（2 3 )對焦過程^焦點 距離值；於採樣多點之後為建立一標準值； F、 以該各單元區域（2 1)〜（2 3)所建立之標準值，分別與 各單元區域（2 1)〜（2 3 )鄰邊區域（2 4)〜（2 6 ) 之對焦過程之距離值相比較，以差值之比較，換算該待則工 件（2 )於該單元區域（2 1)〜（2 3 )之瑕疵或是標準狀 態’並且計算出該單元區域（2 1 )〜（2 3 )之Z輪厚产。 而藉由計算該Z軸厚度之後，可以配合平面照射即可獲得知 200932078 〜（2 3)之體 χ軸/γ軸(即長/寬），測得該單元區域（2工 積。 請參閱 至於本發明之光學制元件攝取多區域影像之裝置 第二圖，配合第四圖所示，包括： 〇Hi learning! ^Parts (1) sub-riding should be - the workpiece to be tested (2) the multi-unit area of the surface (21) ~ wide optical shadow I Γ · bribes respectively to ingest its work area (21) ~ (2 3) can be measured for the glass substrate to be tested The part of the sputum, such as the part of the pin bonding process (〇LB) between the soft base motor c) and the earth 5 曰曰 wafer. When the optical sensing element (1) focuses on the first unit area (21), respectively, the image is overlapped and the image is multi-paired. The image is formed by focusing on the first unit area (2). The optical image, and the face of the lighter touch, and record the focus distance value of each unit area to the dance process; Λ in the first-unit series (2 i) county - the most remaining distance signal value and the focal length distance value; E, the second unit area (22) is used to overlay the image and the multi-focus to extract the image; and so on, each obtains the optical image, and converts to electronic information = and outputs 'and records each unit area (2 1)~ (2 3) focus process ^ focus distance value; after sampling multiple points to establish a standard value; F, the standard value established by each unit area (2 1) ~ (2 3), respectively, and each unit area ( 2 1) ~(2 3 ) The distance values of the focusing process of the adjacent side regions (2 4) to (2 6 ) are compared, and the workpiece (2) is converted to the unit region by the comparison of the difference values (2 1 ) ~ (2 3 ) or standard state ' and calculate the cell area ( 2 1) ~ (2 3) Z wheel thick production. After calculating the thickness of the Z-axis, the body axis/γ axis (ie, length/width) of the known 200932078~(2 3) can be obtained by the plane illumination, and the cell area is measured (2 product. See The second diagram of the apparatus for taking multi-region images of the optical component of the present invention, as shown in the fourth figure, includes:
單一光學感測元件⑴，用以分別對應一待測工件（2 面之複數單元區域（21)〜（2 3)麻光學影像；各個光學感 測讀（1)可以為具树祕二極_光元件之絲揭影器’’， 且各個光學感測元件⑴設—自動對焦感測器⑽％腑)°(1 1)’對於待測待測工件⑵形成自動對焦(光學變焦）。且各個 光學感測轉（；L )設-㈣單元（i 2 )崎概絲感測元 件（1)形成鶴。且絲學_元件（i )為具有—個以上之 晶胞（13)之感測器元件，以擷取覆疊影像以及多重對焦之光 學影像之資料，並且轉換為電子訊號。 -光學影像處理單元（i 4 )，連醜光學_元件（丄）， 並用以接收該光學影像，並處對該電子訊號進行處理；且該光學 影像處理單元（1 4 )設有-比鮮元（i 5 ):用以比較該各光 學影像所產生之電子簡：；且由該電子訊射求其最佳焦狀態下 之焦距距離值。 請參閱第五圖所示，顯示本創作可以廣泛使用於各種製程中 微細之接合(BOND)狀態’例如在局部之位置對焦之後，所獲得最 清晰之光學影像。並且可以量測出該接合(B〇ND)之邊緣尺寸(面向 圖式為X軸），以及其高度值(面向圖式為2軸）。 綜上所述，本發明確實符合產業利用性，且未於申請前見於 9 200932078 刊物或公敝，縣為絲所域'，且具有物 合可專利之要件，爰依法提出專利申請。 隨’符 惟上述所陳，為本發明產業上一較佳實施例，舉凡依本創作 申請專利範圍所作之均等變化，皆屬本案柝求標的之範疇。 200932078 【圖式簡單說明】 第一圖係先前技術之立體示意圖 第二圖係本發明待測工件立體示意圖 第三圖係本發明之裝置平面示意圖 第四圖係本發明之流程示意圖 第五圖係本發明效果示意圖 _ 【主要元件符號說明】 ❹ (1):單一光學感測元件 (1 1):自動對焦感測器 (1 2 ):驅動單元 (1 3).晶胞 (1 4 ):光學影像處理單元 (1 5 ):比較單元 (2 ):待測工件 0 (2 1):第一單元區域 (2 2 ):第二單元區域 (2 3):第三單元區域 (24)〜（2 6):鄰邊區域 (5 ):待測工件 (5 1):待測部位 (5 2 ):灰階影像 11a single optical sensing component (1) for respectively corresponding to a workpiece to be tested (a plurality of unit regions (21) to (2 3) hemp optical images of 2 sides; each optical sensing read (1) may be a tree bipolar _ The optical element of the optical component is defibrated, and each of the optical sensing elements (1) is provided - an autofocus sensor (10)% 腑) (1 1)' forms an autofocus (optical zoom) for the workpiece to be tested (2). And each optical sensing turn (;L) is set to - (four) unit (i 2 ), and the wire sensing element (1) forms a crane. And the wire_component (i) is a sensor element having more than one unit cell (13) for capturing information of the overlay image and the multi-focus optical image, and converting it into an electronic signal. An optical image processing unit (i 4) for illuminating the optical image and receiving the optical image for processing the electronic signal; and the optical image processing unit (14) is provided with Element (i 5 ): for comparing the electronic simplification generated by the optical images; and determining the focal length distance value in the best focus state by the electronic signal. Referring to the fifth figure, it can be seen that the creation can be widely used in various processes in the fine bonding (BOND) state, for example, after focusing at a local position, the sharpest optical image obtained. And the edge size of the joint (B〇ND) (the X-axis for the drawing) and its height value (the 2-axis for the drawing) can be measured. In summary, the present invention is indeed in line with the industrial applicability, and is not found in the publication of 2009 20097878 or the public money before the application, the county is the silk domain, and has the patentable requirements, and the patent application is filed according to law. According to the above description, it is a preferred embodiment of the industry of the present invention, and the equal changes made by the patent application scope of the present invention are all within the scope of the claim. The first diagram is a perspective view of the prior art. The second diagram is a perspective view of the workpiece to be tested according to the present invention. The third diagram is a schematic diagram of the apparatus of the present invention. The fourth diagram is the fifth diagram of the flow diagram of the present invention. Schematic diagram of the effect of the present invention _ [Description of main component symbols] ❹ (1): single optical sensing component (1 1): autofocus sensor (1 2 ): driving unit (1 3). unit cell (1 4 ): Optical image processing unit (1 5 ): comparison unit (2): workpiece to be tested 0 (2 1): first unit area (2 2 ): second unit area (2 3): third unit area (24) ~ (2 6): adjacent area (5): workpiece to be tested (5 1): part to be tested (5 2 ): grayscale image 11