200921111 九、發明說明： 【發明所屬之技術領域】 本發明係關於安裝於探針卡之電路基板下面之檢查用構 造體。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection structure mounted under a circuit board of a probe card. [Prior Art]
例如半導體晶圓上所形成之IC、LSI等電子電路之電氣 特性檢查，係例如制㈣電路基板或探狀探針卡來進 行’例如藉由排列於電路基板下面之多根探針與晶圓上電 子電路之各電極塊進行電接觸來進行。 、為吸收電路基板之歪斜或晶圓上電極塊之高低不一等， 或削掉電極塊表面之氧化膜，探針有必要於上下方向具備 彈性或強度。因此’探針應由具備優良導電性等電氣特 r生、及優良彈性等機械特性之材料形成（參照專利文獻])。 [專利文獻1]特開2007-57439號公報 【發明内容】 [發明所欲解決之問題] 疋’近年來’酼著電子電路之圖案微細化，電極塊也 微細化’ 1電極塊之間隔越加狹窄，故探針卡上有必要形 成更微細、間距更小之探針。因此，f尤需要微細且可確保 IT?起之充分收縮量、且可確保充分強度之機械特性 ' < ^針°且’因要求以更高精度進行嚴密檢查，故 才木針之電氣特性也有必要進—步提高。 I在並無該種電氣特性與機械特性都極優異之材 料’該材料之開發並不容易。 131413.doc 200921111 另，現狀之探針卡，雖對檢查用之電氣信號進行有粗略 之阻抗整合’但未對包含有探針部分進行阻抗整合。因 此，檢查時自檢測器傳送至探針之電氣信號會有劣化。為 進行更高精度之嚴密檢查，必須進行更嚴密之阻抗整合。 本發明係#於前述問題而成者，其目的在於提供—種檢 查用構造體，其係具備優異電氣特性及機械特性之探針， 且可嚴密進行阻抗之整合。 [解決問題之技術手段] 為達成刖述目的’本發明係一種檢查用構造體，其特徵 在於其係安I於探針卡之電路基板下面之檢查用構造體， 其具備台座部，安裝於前述台座部下面、由多根探針形成 ^基板狀接觸部，及在前述電路基板下面側保持前述台座 邛之保持部’前述接觸部至少由配線層、絕緣層及彈性層 依序，下在上積層而成，各探針具有由前述接觸部之面内 。P向下方4曲所形成之具有前述配線層、絕緣層及彈 一曰之積層_構’ ^述台座部具備使前述接觸部之探針與 刚述電路基板電路連接之按±下方向設置之多根導電線、 包圍前述各導電線周圍之介電體部、&包圍前述各介電體 周圍且接地之導體部。 本各月因接觸部之探針具備配線層與彈性層，因 此例如於配線層可使用電氣特性優異之材料，於彈性層可 使用機械特性優異之材料，故可#@ & 機械特性之探針。另二：―電氣特性與 Λ 力糟由台座部之由導電線、介電體 導體部形叙㈣結構或帶狀、㈣構，可《進行對 131413.doc 200921111 包含有探針之探針卡整體之阻抗整合。因a，可更高精度 地檢查具有更微細、間距更小之電極之被檢查體。 前述台座部之本體形成以導體形成之前料體部，前述 台座部上形成有包圍前述導體部按上下方向貫通之貫通 孔，前述導電線與前述介電體部也可於前述貫 同 狀安置。 月^接觸部之配線層上，形成有藉由配線與前述探針連 接之多個連接料’前述各導f、㈣與相對應之前述連接 端子形成電性連接。 前述配線層之連接端子之位置’形成有將前述接觸部按 上I方向貫通之貫通孔，前述各導電線可插人前述接觸部 之貫通孔，與前述連接端子形成電路連接。 前述配線層±亦可分開形成為形成有前述多根探針之探 針形成區域及形成有前❹個連接端子之連接端子形成區 域。 前述接觸部與前述台座部之間，介以形成有電子電路之 配線基板’前料電線可貫通前述配線基板上所形成之貫 通孔與如述配線基板之配線形成電路連接。 前述電子回路亦可為使通過前述導電線之電氣信號之雜 訊去除之電路。 前述台座部之下面形成有凹部，前述配線基板之電子電 路亦可收容於該凹部。另，該凹部亦含有貫通孔。 、月〗述接觸部與前述台座部之間，亦可介以絕緣基板，前 述導電線可貫通於前述絕緣基板上所形成之貫通孔。 131413.doc 200921111 别述台座部之各導電線與前述電路基板之接觸部，亦可 設彈性導體部件。 則述檢查用構造體進而具有於前述電路基板之下面側保 持前述台座部之保持部’前述保持部可於同一平面内保持 多個台座部。 ’ 、前^持部可形成為平板狀，多個貫通孔可形成為格子 狀，别述台座料在前述各貫通孔&上方***後將之 止。 剛述台座部係-個亦可藉由支持部安裝於前述電路基板 之下面側。 [發明之效果] 根據本發明’探針卡之探針具有高的電氣特性與機械特 性，且可嚴密進行對探針之阻抗整合，可更高精度地檢查 具有更微細、間距更小之電極之被檢查體。 【實施方式】 以下，對本發明之較佳實施形態進行說明。圖1係具有 本實施形態之檢查用構造體之探針裝置丨之結構之概略示 意圖。 才木針裝置1上設有例如探針卡2及载置作為被檢查 — ΛΙΛ 日日 W之載置台3。探針卡2配置於载置台3之上方。載置台3 係例如可在水平方向及上下方向自由移動之構成，可三維 移動所載置之晶圓W。 探針卡2係具備例如用以傳送檢查用之電氣信號至载置 於載置台3之晶圓W之電路基板10 ’保持並固定該電路基 i31413.doc 200921111 板〇之螺枝11，安裝於電路基板1〇之上面、補強電路基板 之補強板12 ’安裝於電路基板1 〇之下面側、檢查時與晶 圓上之電極塊u接觸使得電路基板丨〇與晶圓w電氣性導 通之檢查用構造體π等。 回路基板10與未圖示之檢測器電路連接，可將從檢測器 發出之檢查用電氣信號傳送至下方之檢查用構造體13。電 路基板ίο係形成為例如略圓盤狀。電路基板之内部形成 有電子電路，電路基板1〇之下面形成有該電子電路之多個 端子10a。 補強板12之外周部之下面’安裝有貫通電路基板10並突 心電路基板1Q下方之支持部14。該支持部14支持檢查用 構造體13。 檢查用構造體13具備多個檢查塊2〇，及保持並固定該等 檢查塊20之作為保持部之保持板21。 檢查塊20如圖2所示具備台座部3〇，及安裝於台座部％ 下面之基板狀接觸部3 i。 台座部30形成為略正方體形狀。例如如圖3所示台座部 3〇之中央形成有四角形凹部之貫通孔A。台座部3〇之本體 3〇a由金屬等導體形成。該本體（導體部）3〇&接地。導體部 3 0a上形成有多個上下方向貫通之圓形貫通孔3此，該各貫 通孔3〇b中***直線狀導通栓40。導通栓40分別多數配置 於例如夾持貫通孔A之兩側。 各導通栓40係例如於如圖4所示中心軸中設有鎢等導電 線40a，該導電線40a之周圍環狀包覆有樹脂等介電體部 131413.doc 200921111 働’成為同轴狀。因此，台座㈣之内部，以如圖4所示 設有包圍各導電線術周圍之介電體部杨，設有包圍該介 電體部40_之導體部逃。由此，台座㈣具備通 通栓4〇對電氣信號進行阻抗調整之同轴結構。 導通栓40，如圖3所示從台座部⑼之導體部術之上下面 突出、，該突出部分未被介電體包覆，導電線術露出。例 導通4G之導電線4Qa之上端部透過具有彈性之作為導 體部件之連接㈣與電路基㈣之端子…連接。連接检 50由例如導電橡料形成。各導通栓之連接栓別貫通上 面基板並保持於該上面基板51上。上面基板⑽成為方 形。上面基板51被嵌人例如設於台座部％上面之凹部 3 0c，安裝於台座部3〇。 接觸部31如圖2所示形成為與台座部30之下面同樣大小 之方形基板狀。接觸部31如圖3所示從下彳主上依序Μ & 線層31a、絕緣層3lb及强,降 d及弹〖生層31c之3層積層構造。接觸部 ^之中央部附近，於下方彎曲形成有多根探針60。因此， 採十60八備配線層Sla、絕緣層爪及彈性層化之处 構。 '口 探針60形成為例如如圖5所示於接觸部η之中央部呈2列 =排料針6G之頂端與另—列探針⑼之頂端相互對向 由此接觸部31之中央部成為探針60之形成區域。 ^觸部31之配線層仏之探㈣之形成區域兩側，藉由配 線與對應探針6〇連接形成多個連接端子61。即，接觸部31 之探針6G之形成區域兩側，係連接端子6!之形成區域。 131413.doc -10- 200921111 各連接端子61之位置上，形成有貫通接觸部3丨之貫通孔 62如圖3所示，貝通孔6；2中***導通栓4〇之導電線4〇a， 導電線40a與連接端子61藉由焊錫等形成電路連接。如 此，各探針60通過連接端子61、導電線4〇a及連接栓5〇， 與電路基板10形成電路連接。 接觸部31之絕緣層31|3係由聚醯亞胺或鐵氟隆（杜邦公司 之註冊商標）等絕緣材料形成。藉由該絕緣層31b使配線層 31a與彈性層3ic絕緣。彈性層31c係由例如橡膠金屬、For example, an electrical characteristic inspection of an electronic circuit such as an IC or an LSI formed on a semiconductor wafer is performed, for example, by a circuit board or a probe card for performing, for example, a plurality of probes and wafers arranged under the circuit substrate. The electrode blocks of the upper electronic circuit are electrically contacted. In order to absorb the skew of the circuit board or the height of the electrode block on the wafer, or to cut off the oxide film on the surface of the electrode block, it is necessary for the probe to have elasticity or strength in the up and down direction. Therefore, the probe should be formed of a material having electrical properties such as excellent electrical conductivity and excellent mechanical properties such as excellent elasticity (see Patent Document). [Patent Document 1] JP-A-2007-57439, SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] In recent years, the pattern of electronic circuits has been miniaturized, and the electrode blocks have been miniaturized. If the stenosis is narrow, it is necessary to form a probe with a finer and smaller pitch on the probe card. Therefore, f is particularly required to ensure the sufficient shrinkage of the IT and to ensure the mechanical properties of sufficient strength ' < ^ pin ° and 'by the requirements of more precise inspection, so the electrical characteristics of the needle It is also necessary to improve step by step. I do not have such excellent electrical and mechanical properties. The development of this material is not easy. 131413.doc 200921111 In addition, the current probe card has a rough impedance integration for the electrical signal for inspection, but the impedance integration of the probe portion is not performed. Therefore, the electrical signal transmitted from the detector to the probe at the time of inspection may deteriorate. For more rigorous inspection of higher precision, more stringent impedance integration is required. The present invention has been made in view of the above problems, and an object of the invention is to provide a structure for inspection, which is a probe having excellent electrical characteristics and mechanical properties, and which can closely integrate impedance. [Technical means for solving the problem] The present invention is a structure for inspection, which is characterized in that it is an inspection structure under the circuit board of the probe card, and is provided with a pedestal portion and is attached to a substrate-shaped contact portion is formed by a plurality of probes on the lower surface of the pedestal portion, and a holding portion for holding the pedestal on the lower surface side of the circuit board. The contact portion is at least sequentially connected by a wiring layer, an insulating layer, and an elastic layer. The upper layer is formed by laminating, and each probe has an in-plane of the aforementioned contact portion. The pedestal portion having the wiring layer, the insulating layer, and the elastic layer formed by the downward B curve is provided in the θ-down direction in which the probe of the contact portion is connected to the circuit substrate circuit. a plurality of conductive wires, a dielectric body portion surrounding the periphery of each of the conductive wires, and a conductor portion surrounding the ground of each of the dielectric bodies and grounded. Since the probe of the contact portion has the wiring layer and the elastic layer in each month, for example, a material having excellent electrical characteristics can be used for the wiring layer, and a material having excellent mechanical properties can be used for the elastic layer, so that the mechanical properties can be explored. needle. The other two: "Electrical characteristics and the power of the pedestal by the conductive line, the dielectric conductor part of the shape (four) structure or band, (four) structure, can be carried out on 131413.doc 200921111 probe card containing probe Integrated impedance integration. Because of a, the object to be inspected having a finer and smaller pitch electrode can be inspected with higher precision. The body of the pedestal portion is formed with a conductor body portion formed by a conductor, and the pedestal portion is formed with a through hole that surrounds the conductor portion so as to penetrate in the vertical direction, and the conductive wire and the dielectric body portion may be disposed in the same manner. On the wiring layer of the contact portion, a plurality of connecting materials connected to the probe by wiring are formed, and the respective leads f and (4) are electrically connected to the corresponding connecting terminals. The position of the connection terminal of the wiring layer is formed with a through hole penetrating the contact portion in the I direction, and each of the conductive wires is inserted into the through hole of the contact portion, and is electrically connected to the connection terminal. The wiring layer ± may be separately formed as a probe forming region in which the plurality of probes are formed and a connecting terminal forming region in which the first one of the connecting terminals is formed. A wiring board in which an electronic circuit is formed between the contact portion and the pedestal portion is formed by a through hole formed in the wiring board through a through hole formed in the wiring board. The electronic circuit may also be a circuit for removing noise from electrical signals passing through the conductive lines. A concave portion is formed on a lower surface of the pedestal portion, and an electronic circuit of the wiring substrate may be housed in the concave portion. In addition, the recess also includes a through hole. An insulating substrate may be interposed between the contact portion and the pedestal portion, and the conductive wire may penetrate through the through hole formed in the insulating substrate. 131413.doc 200921111 An elastic conductor member may be provided in the contact portion between each of the conductive wires of the pedestal portion and the circuit board. Further, the inspection structure further includes a holding portion that holds the pedestal portion on a lower surface side of the circuit board. The holding portion can hold a plurality of pedestal portions in the same plane. The front holding portion may be formed in a flat plate shape, and the plurality of through holes may be formed in a lattice shape, and the pedestal material may be inserted after being inserted above the through holes & The pedestal portion can also be attached to the lower surface side of the circuit board by the support portion. [Effects of the Invention] According to the present invention, the probe of the probe card has high electrical and mechanical characteristics, and the impedance integration of the probe can be strictly performed, and the electrode having finer and smaller pitch can be inspected with higher precision. The body to be inspected. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described. Fig. 1 is a schematic view showing the configuration of a probe device 具有 having the structure for inspection of the present embodiment. The wood needle device 1 is provided with, for example, a probe card 2 and a mounting table 3 placed as an inspection-day. The probe card 2 is disposed above the mounting table 3. The mounting table 3 is configured to be movable in the horizontal direction and the vertical direction, for example, and can move the wafer W placed therein three-dimensionally. The probe card 2 is provided with, for example, a circuit board 10 for transmitting an electrical signal for inspection to a wafer W placed on the mounting table 3, and holding and fixing the screw base 11 of the circuit board i1313.doc 200921111 The reinforcing board 12' of the upper surface of the circuit board 1 and the reinforcing circuit board is mounted on the lower side of the circuit board 1 and is in contact with the electrode block u on the wafer during inspection, so that the circuit board 丨〇 and the wafer w are electrically connected. Use the structure π and so on. The circuit board 10 is connected to a detector circuit (not shown), and can transmit an electric signal for inspection from the detector to the inspection structure 13 below. The circuit board ίο is formed, for example, in a substantially disk shape. An electronic circuit is formed inside the circuit board, and a plurality of terminals 10a of the electronic circuit are formed on the lower surface of the circuit board. The lower surface of the outer peripheral portion of the reinforcing plate 12 is attached with a support portion 14 that penetrates the circuit board 10 and protrudes under the circuit board 1Q. This support portion 14 supports the inspection structure 13. The inspection structure 13 includes a plurality of inspection blocks 2, and a holding plate 21 as a holding portion for holding and fixing the inspection blocks 20. As shown in Fig. 2, the inspection block 20 is provided with a pedestal portion 3A and a substrate-like contact portion 3i attached to the lower portion of the pedestal portion. The pedestal portion 30 is formed in a substantially square shape. For example, as shown in Fig. 3, a through hole A having a quadrangular recess is formed in the center of the pedestal portion 3'. The body of the pedestal portion 3〇a is formed of a conductor such as metal. The body (conductor portion) 3〇& is grounded. A plurality of circular through holes 3 penetrating in the vertical direction are formed in the conductor portion 30a, and the linear vias 40 are inserted into the respective through holes 3'b. The conduction plugs 40 are each disposed, for example, on both sides of the through hole A. Each of the conductive plugs 40 is provided with a conductive wire 40a such as tungsten in a central axis as shown in FIG. 4, and a dielectric body portion 131413.doc 200921111 働' is coaxially wrapped around the conductive wire 40a. . Therefore, the inside of the pedestal (4) is provided with a dielectric body portion surrounding the periphery of each of the conductive wires as shown in Fig. 4, and a conductor portion surrounding the dielectric portion 40_ is provided. Thus, the pedestal (4) has a coaxial structure in which the electric plug is impedance-adjusted by the plug 4. The conductive plug 40 protrudes from the upper surface of the conductor portion of the pedestal portion (9) as shown in Fig. 3, and the protruding portion is not covered by the dielectric body, and the conductive wire is exposed. For example, the upper end portion of the conductive wire 4Qa passing through the 4G is connected to the terminal (...) of the circuit base (4) through the connection (4) which is a conductor member having elasticity. The connection check 50 is formed of, for example, a conductive rubber. The connection pins of the respective conductive plugs penetrate the upper substrate and are held on the upper substrate 51. The upper substrate (10) is square. The upper substrate 51 is fitted, for example, to a recessed portion 30c provided on the upper portion of the pedestal portion, and is attached to the pedestal portion 3''. The contact portion 31 is formed in a square substrate shape having the same size as the lower surface of the pedestal portion 30 as shown in Fig. 2 . As shown in Fig. 3, the contact portion 31 is formed of a three-layered structure of a layer 3a, an insulating layer 3lb, a strong layer, a d layer, and a green layer 31c. In the vicinity of the central portion of the contact portion ^, a plurality of probes 60 are bent and formed below. Therefore, the wiring layer Sla, the insulating layer claws, and the elastic layering structure are used. The mouth probe 60 is formed, for example, as shown in FIG. 5 in the center portion of the contact portion η in two rows = the tip end of the discharge needle 6G and the tip end of the other column probe (9) are opposed to each other at the center portion of the contact portion 31. It becomes a formation region of the probe 60. On both sides of the formation region of the wiring layer (4) of the contact portion 31, a plurality of connection terminals 61 are formed by connection with the corresponding probes 6〇. That is, both sides of the formation region of the probe 6G of the contact portion 31 are the formation regions of the connection terminals 6!. 131413.doc -10- 200921111 The through hole 62 of the through contact portion 3 is formed at the position of each of the connection terminals 61. As shown in FIG. 3, the conductive wire 4〇a of the via plug 4 is inserted into the beacon hole 6; The conductive line 40a and the connection terminal 61 are electrically connected by solder or the like. Thus, each probe 60 is electrically connected to the circuit board 10 via the connection terminal 61, the conductive wire 4A, and the connection plug 5A. The insulating layer 31|3 of the contact portion 31 is formed of an insulating material such as polyimide or Teflon (registered trademark of DuPont). The wiring layer 31a is insulated from the elastic layer 3ic by the insulating layer 31b. The elastic layer 31c is made of, for example, rubber metal,
BeCu或碳鋼等彈性材料形成。藉由該彈性層3ic，各探針 60在上下方向具有高彈性。 此處，對前述接觸部31之製造方法進行說明。首先，形 成由配線層3 1 a與絕緣層3 1 b所構成之下層基板7〇，及由彈 性層31c所構成之上層基板71。下層基板7〇係藉由在作為 基材之絕緣層31b之下面藉由例如照相平版技術形成特定 圖案之配線層31a而製造。另，上層基板71係由例如電鑄 技術形成。 之後，下層基板70與上層基板71壓接貼合。接著，經由 例如雷射照射裝置B進行雷射加工，沿各探針之形狀刻上 痕跡。然後，藉由例如板狀部件從上層基板71側押壓探針 形成區域，使探針形成區域之一部分向下方彎曲，形成探 針60。另，也可不按前述將下層基板7〇與上層基板？！貼合 形成接觸部31，而在上層基板71上直接蒸鍍絕緣材並在其 上形成電路，形成配線層31a及絕緣層311>。 如圖3所示之台座部3〇之下面與接觸部31之間，介以尤 131413.doc 200921111 絕緣體所構成之絕緣基板8(^絕緣基板8〇係使用與例如接 觸不3 1同樣大小之方形基板。絕緣基板8G上形成有多數個 貝通孔8〇a，於該等貫通孔80a中***導電線40a。於絕緣 基板8〇之中央部’形成對應台座部30之貫通孔A之貫通孔 D。藉由此絕緣基板8〇，使台座部儿之導體部3〇a與接觸部 31絕緣。 如則所述，各檢查塊20係使上部基板51、台座部30、絕 緣基板80及接觸部31一體化而構成。 保持板21係例如形成為圖6所示之平板狀。保持板幻上 形成有四角形狀之多個貫通孔21a按橫縱方向格子狀分 佈。貫通孔21a形成為檢查塊2〇可從上方***其中，台座 部30藉由貫通孔21a之框部21b卡止，檢查塊2。藉由保持板 21保持。 保持板21如圖1所示由支持部14固定。 螺㈣固定於支持部14之簣片91固定於支援部14 ^ = 固疋，各檢查塊20之上部端子（連接栓5〇)與電路基板丨〇之 端子10a形成連接。 接著，對如前述結構之探針裝置】之作用進行說明。首 先’將晶圓W載置於載置台3上後，提升載置台3,使晶圓 W從下方抵住檢查用構造體13。由此，晶圓w之各電極塊 U與對應之各探針60接觸。然後，從檢測器發出之檢查用 電氣信號，通過電路基板10傳送至檢查用構造體Η，通過 連接栓50、導通栓40及探針60,傳送至晶圓…上之各電= 塊U。由此，對晶圓W上之電路進行電氣特性檢查。 131413.doc •12· 200921111 根據前述之實施形態，接觸部3丨之探針6〇係形成為由配 線層3 1 a、絕緣層3 1 b及彈性層3 1 c所構成之3層結構，因探 針60之電氣性導通部分與彈性部分分開，故配線層3U可 使用電阻低之電氣特性優異之材料，彈性層3丨c可使用彈 性高之機械特性優異之材料。其結果，可實現同時具備高 的電氣特性與機械特性之探針。另，台座部3 〇中形成有由 導電線40a、介電體部401)及導體部3〇a構成之帶狀結構， 因設有阻抗調整部，故可嚴密進行包含探針6〇在内之探針 卡2整體之阻抗整合。因此，可高精度檢查具有更微細、 間距更小之電極U之晶圓W。 台座部30之本體作為導體部3〇a，該導體部3〇a上形成有 貫通孔30b，該貫通孔30b中同軸狀***導電栓牝之導電線 4〇a與介電體部40b，可使台座部3〇内形成較簡單之同軸或 帶狀線結構。 另，接觸部31之配線層31a上形成有通過探針6〇之接觸 端子61，該連接端子61之位置上形成有貫通孔62，該貫通 孔62中***導電線4〇a，因導電線4〇a與探針6〇形成電路連 接，故自探針60至回路基板1〇之配線簡潔明瞭。 接觸㈣之配線層31a上，因探針之形成區域與連接端 ^之形成區域彼此分開形成，故配線結構簡明，製造簡 單’可降低成本。 ί觸部31與台座部3G之間介以輯基板80,絕緣基板8 之貫通孔8〇a中貫通有導電線術，因此例如接觸部㈣爸 座部30之導體部3〇a絕緣。由此，例如自接觸㈣傳至導 131413.doc 200921111 體部30a之電氣信號等就不會洩漏，可進行更高精度檢 查。 台座部30之導電線40a與電路基板1〇之接觸部設具有彈 性之連接栓50，故連接栓5〇可吸收例如電路基板10變形或 熱脹冷縮。由此，檢查塊20與回路基板1〇之接觸可安定， 可穩妥地進行電氣特性之檢查。 保持板2 1可於同一平面内保持多個檢查塊2〇，故可使用 夕個檢查塊2 0檢查晶圓w。因此，例如即使有一個檢查塊 20破損’也還可用其他檢查塊2〇進行檢查。此外，各檢查 塊20具有阻抗調整機能，例如對每個各檢查塊2〇調整阻 抗’可更高精度進行晶圓面内之檢查。 另’保持板21上以格子狀形成有多個貫通孔21a，檢查 塊20從上方***貫通孔21a並卡止，故各檢查塊2〇之拆卸 可簡單進行。另，還可只替換破損之檢查塊2〇或接觸部 31° 前述實施形態中’檢查塊20之接觸部3 1與台座部30之 i -· 間’亦可介以具有特定電子電路之配線基板。例如如圖7 所示’在台座部30與絕緣基板80之間介以配線基板丨1()。 例如配線基板11 〇係與接觸部3丨同樣大小之方形基板，例 如配線基板1 1 〇之台座部3 〇側之中央部上形成有電子電路 E。電子電路e係例如去除通過導電線4(^之電氣信號之雜 訊之電路。配線基板110之電子電路E收容於台座部3〇之貫 通孔A内。配線基板u〇之電子電路e兩側形成有多個貫通 孔110a’各貫通孔110&内***有導電線4〇a。導電線通 131413.doc 14- 200921111 過配線基板uo之電子電路E與配線形成電路連接。該等情 形，因各檢查塊20可去除電氣信號之雜訊，故可進行更高 精度之檢查$，例如電子電路賊損時等，替換掉該檢 查塊20即可，電子電路E之替換可簡單進行。 ,另’前述實施例中’設於配線基板11G之電子電路亦可 為使用 '、.；端電阻之阻抗整合電路或使用繼電器之切換電路 等其他機此之電子電路。另，前述實施例中，亦可於台座 部^與接觸部31之間挾持不同機能之多片配線基板。 前述實施形態中，台庙Λ a & 。座#30之導體部30a内形成有貫通 孔30b，該貫通孔3〇b内***且古道泰a 、 ’、有導電線4〇a及介電體部4〇b 之導通检4 0，在台座都^ 由jjy j_、e t 内形成同軸結構，但也可形成苴 他同軸結構。例如如圖8所 八 % 口厓部3 0内設有於中心 轴具有導電線I20a，於 於》亥導電線I20a之周圍包覆介 120b，於該介電體部12扑之 电體4 月圍I覆接地之導體部12〇c:? 同軸狀栓120，亦可形成同轴έ _ ^ J釉、，，口構。该情形，栓120之周圊 之D座部30之本體可由絕缞俨 6緣體121形成。另，如圖9所千 亦可在台座部30之中央配置 " 罝於上下方向延伸之導 130，配置介電體部131以 导笔線 固°茨等電線13 0 ’於該介雷駚 部131之外側對向配置2片板狀導體部n2。此外，今= 形，亦可於例如導電線m與介電體部131之間形成: 導電線130可為於上下方向 成鏠隙， 々间具有彈性者。該愔 導電線⑽可形成為具有z字形之彈簣狀。由如圖所= 造構成為帶狀線。 所不構 以上，參照附圖對本菸 &明之較佳實施形態進行了說明， 131413.doc •15· 200921111 但本發明並不局限於前述實施例。熟悉該項技藝者可明瞭 在申請專利範圍所記載之思想範疇内，可思及各種變更例 或修正例，那等當然亦屬於本發明之技術範圍内。 例如，前述實施形態所記載之檢查用構造體13，具有多 個台座部30，但也可只具有〗個台座部3〇。相關情形，例 如如圖10所示，台座部3〇具有與電路基板1〇同程度之直 徑，外周部由例如支持部14支持。台座部射***有前述 同軸結構或帶狀線結構之多個導電栓4〇。台座部％之下 面’安裝有例如與台座部30之下面同樣大小之絕緣基板 8〇，該絕緣基板80之下面安裝有多個接觸部31。台座部％ 之上面’安裝有例如與台座部3〇之上面同樣大小之上面基 板5 1，支持多個連接栓5〇。根據該實施例，藉由更簡單之 結構丄可進行更高精度之檢查。另，在該實施例中，亦可 於如别述之台座部3〇下面形成凹部，於該凹部收容電子電 路E之方4 ’在絕緣基板8〇與台座部3〇之間介以配線基板 另接觸。P 3 1之探針60之數量或配置並不受前述實施例 限^可Μ選擇。台座部_接觸部31之形狀也不受前 述貫施例限制，可任意選擇。 此外，本發明也適用於被檢查體為除晶_以外之 FPD(平面顯示器）等其他基板之情形。 [產業上的可利用性] 本發明適用於對具有更微 體進行更向精度之電氣特性 細、間距更小之電極之被檢 之檢查。 杳 131413.doc -16· 200921111 【圖式簡單說明j 圖】係探針裝置之結構之概略示意圖。 圖2係檢查塊之結構之立體圖。 圖3係檢查塊之結構之縱斷面圖。 圖锡台座部内之結構之簡化模式 (b)係縱斷面圖。 （a)係杈斷面圖， 圖5係接觸部之立體圖。 _呆持多個檢查塊之保持板之結構之底視圖。 圖7係設有配線基板之檢查塊之縱斷面圖。 圖8係台座部内之其他同轴結構之模式圖，⑷係橫斷面 圓’（b)係縱斷面圖。 圖9係台座部内之帶狀線結構之模式圖，（勾係橫斷面 圖’（b)係縱斷面圖。 圖係台座部為一個之情形之探針裝置之結構之概略示 意圖。 【主要元件符號說明】 1 探針裝置 2 探針卡 10 電路基板 13 檢查用構造體 20 檢查塊 30 台座部 3〇a 導體部 31 接觸部 131413.doc -17 200921111 31a 配線層 31b 絕緣層 31c 彈性層 40 導通栓 40a 導電線 40b 介電體部 60 探針 U 電極塊 W 晶圓 131413.doc -18An elastic material such as BeCu or carbon steel is formed. Each of the probes 60 has high elasticity in the up and down direction by the elastic layer 3ic. Here, a method of manufacturing the contact portion 31 will be described. First, the underlying substrate 7A composed of the wiring layer 31a and the insulating layer 31b, and the overlying substrate 71 composed of the elastic layer 31c are formed. The underlying substrate 7 is produced by forming a wiring layer 31a of a specific pattern by, for example, photolithography under the insulating layer 31b as a substrate. Further, the upper substrate 71 is formed by, for example, electroforming technology. Thereafter, the lower substrate 70 and the upper substrate 71 are pressure-bonded to each other. Then, laser processing is performed by, for example, the laser irradiation device B, and marks are engraved along the shape of each probe. Then, the probe forming region is pressed from the upper substrate 71 side by, for example, a plate member, and one portion of the probe forming region is bent downward to form the probe 60. Alternatively, the lower substrate 7 and the upper substrate may be omitted as described above. ! Bonding The contact portion 31 is formed, and an insulating material is directly vapor-deposited on the upper substrate 71, and a circuit is formed thereon to form a wiring layer 31a and an insulating layer 311. As shown in Fig. 3, between the lower surface of the pedestal portion 3 and the contact portion 31, an insulating substrate 8 composed of an insulator of 131131.doc 200921111 is used (the insulating substrate 8 is used in the same size as, for example, the contact is not 31). A plurality of through-holes 8a are formed in the insulating substrate 8G, and the conductive wires 40a are inserted into the through-holes 80a. The through-holes A of the corresponding pedestal portions 30 are formed in the central portion ' of the insulating substrate 8'. In the hole D, the conductor portion 3A of the pedestal portion is insulated from the contact portion 31 by the insulating substrate 8A. As described above, each of the inspection blocks 20 is such that the upper substrate 51, the pedestal portion 30, the insulating substrate 80, and The holding portion 21 is formed in a flat plate shape as shown in Fig. 6. The plurality of through holes 21a having a quadrangular shape are formed in a lattice shape in the horizontal and vertical directions. The through hole 21a is formed in the shape of a flat plate. The inspection block 2 is insertable from above, and the pedestal portion 30 is locked by the frame portion 21b of the through hole 21a, and the inspection block 2 is held by the holding plate 21. The holding plate 21 is fixed by the support portion 14 as shown in Fig. 1 . The snail (4) is fixed to the support portion 14 and the cymbal 91 is fixed to the support portion 14 ^ = solid state, the upper terminal (connection plug 5A) of each inspection block 20 is connected to the terminal 10a of the circuit board 。. Next, the action of the probe device having the above configuration will be described. First, the wafer W will be described. After being placed on the mounting table 3, the mounting table 3 is lifted, and the wafer W is pressed against the inspection structure 13 from below. Thereby, the electrode blocks U of the wafer w are in contact with the corresponding probes 60. Then, The electrical signal for inspection emitted from the detector is transmitted to the inspection structure 通过 via the circuit board 10, and is transmitted to the respective electric power of the wafer by the connection plug 50, the conduction plug 40, and the probe 60. The electrical characteristics of the circuit on the wafer W are checked. 131413.doc • 12· 200921111 According to the above embodiment, the probe 6 of the contact portion 3 is formed by the wiring layer 3 1 a and the insulating layer 3 1 b. And the three-layer structure composed of the elastic layer 3 1 c is separated from the elastic portion by the electrically conductive portion of the probe 60. Therefore, the wiring layer 3U can use a material having excellent electrical characteristics with low electric resistance, and the elastic layer 3丨c can use elasticity. High-quality materials with excellent mechanical properties. A probe having high electrical and mechanical characteristics, and a band-like structure including a conductive wire 40a, a dielectric portion 401) and a conductor portion 3〇a is formed in the pedestal portion 3, and an impedance adjusting portion is provided. Therefore, the impedance integration of the entire probe card 2 including the probe 6〇 can be strictly performed. Therefore, the wafer W having the finer and smaller pitch electrode U can be inspected with high precision. The main body of the pedestal portion 30 serves as a conductor portion 3a, and a through hole 30b is formed in the conductor portion 3a, and the conductive wire 4a and the dielectric portion 40b of the conductive plug are coaxially inserted into the through hole 30b. A relatively simple coaxial or stripline structure is formed in the pedestal portion 3A. Further, a contact terminal 61 through the probe 6 is formed on the wiring layer 31a of the contact portion 31, and a through hole 62 is formed in the position of the connection terminal 61. The conductive line 4〇a is inserted into the through hole 62 due to the conductive line. 4〇a and the probe 6〇 form a circuit connection, so the wiring from the probe 60 to the circuit substrate 1〇 is simple and clear. In the wiring layer 31a of the contact (4), since the formation region of the probe and the formation region of the connection terminal are formed separately from each other, the wiring structure is simple and the manufacturing is simple, which can reduce the cost. Between the contact portion 31 and the pedestal portion 3G, the substrate 80 is interposed, and the conductive hole is penetrated through the through hole 8〇a of the insulating substrate 8. Therefore, for example, the conductor portion 3〇a of the contact portion (4) of the damasty portion 30 is insulated. Thereby, for example, the electrical signal transmitted from the contact (4) to the body 131a of the guide 131413.doc 200921111 is not leaked, and a higher-precision inspection can be performed. The contact portion 50 of the conductive portion 40a of the pedestal portion 30 and the circuit board 1b is provided with an elastic connecting plug 50. Therefore, the connecting plug 5A can absorb, for example, deformation or thermal expansion and contraction of the circuit board 10. Thereby, the contact between the inspection block 20 and the circuit substrate 1A can be stabilized, and the inspection of electrical characteristics can be performed steadily. The holding plate 2 1 can hold a plurality of inspection blocks 2 in the same plane, so that the wafer w can be inspected using the inspection block 20. Therefore, for example, even if one of the inspection blocks 20 is broken, it can be inspected by other inspection blocks 2〇. Further, each of the inspection blocks 20 has an impedance adjustment function, for example, the adjustment of the impedance of each of the inspection blocks 2 can perform inspection in the wafer surface with higher precision. Further, a plurality of through holes 21a are formed in a lattice shape on the holding plate 21, and the inspection block 20 is inserted into the through hole 21a from above and locked, so that the removal of each inspection block 2 can be easily performed. In addition, it is also possible to replace only the damaged inspection block 2〇 or the contact portion 31°. In the above embodiment, the 'contact portion 31 of the inspection block 20 and the i-· between the pedestal portion 30' may also be wired with a specific electronic circuit. Substrate. For example, as shown in FIG. 7, the wiring board 丨1() is interposed between the pedestal portion 30 and the insulating substrate 80. For example, the wiring board 11 is a square substrate having the same size as the contact portion 3, and for example, an electronic circuit E is formed on the center portion of the side of the pedestal portion 3 of the wiring substrate 1 1 . The electronic circuit e is, for example, a circuit that removes noise passing through the electrical signal of the conductive wire 4 (the electrical circuit E of the wiring substrate 110 is housed in the through hole A of the pedestal portion 3). Both sides of the electronic circuit e of the wiring substrate u〇 Each of the plurality of through holes 110a' is formed with a through hole 110& and a conductive wire 4a is inserted therein. The conductive wire is connected to the electronic circuit E of the wiring substrate uo and is connected to the wiring forming circuit. Each of the inspection blocks 20 can remove the noise of the electrical signal, so that a higher precision inspection can be performed, for example, when the electronic circuit is damaged, and the inspection block 20 can be replaced, and the replacement of the electronic circuit E can be easily performed. In the above-described embodiment, the electronic circuit provided on the wiring substrate 11G may be an electronic circuit using an impedance integrated circuit of a terminal resistance or a switching circuit using a relay, etc. In the foregoing embodiment, A plurality of wiring boards having different functions can be held between the pedestal portion and the contact portion 31. In the above embodiment, the through hole 30b is formed in the conductor portion 30a of the pedestal a & 〇b interpolation And Gu Daotai a, ', has a conductive line 4〇a and a dielectric body 4〇b conduction test 40, in the pedestal ^ formed by jjy j_, et coaxial structure, but can also form a coaxial coaxial structure. For example, as shown in FIG. 8, the occlusion portion of the occupant portion 30 is provided with a conductive line I20a on the central axis, and the dielectric layer 120b is wrapped around the "Electrical conductor line I20a", and the electric body portion of the dielectric body portion 12 is swept in April. The conductor portion 12〇c of the surrounding I is grounded: the coaxial plug 120 can also form a coaxial έ _ _ _ glaze, and the mouth structure. In this case, the body of the D seat 30 of the circumference of the bolt 120 can be completely closed. 6 The edge body 121 is formed. In addition, as shown in FIG. 9, the guide 130 extending in the up-and-down direction may be disposed in the center of the pedestal portion 30, and the dielectric body portion 131 may be disposed to connect the wire to the wire. The two plate-shaped conductor portions n2 are disposed opposite to each other on the outer side of the dielectric ridge portion 131. Further, a shape of the present invention may be formed between the conductive wire m and the dielectric portion 131, for example, the conductive wire 130 may be The upper and lower directions are crevices, and the turns are elastic. The 愔 conductive line (10) can be formed into a zigzag shape, which is formed as a strip line as shown in the figure. The preferred embodiment of the present invention is described with reference to the accompanying drawings, but the present invention is not limited to the foregoing embodiments. The person skilled in the art will be aware of the scope of the patent application. In the scope of the present invention, it is a matter of course that the present invention is also within the technical scope of the present invention. For example, the inspection structure 13 described in the above embodiment has a plurality of pedestal portions 30, but It is also possible to have only one pedestal section 3〇. In other cases, for example, as shown in Fig. 10, the pedestal portion 3 has a diameter similar to that of the circuit board 1, and the outer peripheral portion is supported by, for example, the support portion 14. The pedestal portion is inserted with a plurality of conductive plugs 4 of the aforementioned coaxial structure or strip line structure. An insulating substrate 8A having the same size as the lower surface of the pedestal portion 30 is attached to the lower surface of the pedestal portion, and a plurality of contact portions 31 are mounted on the lower surface of the insulating substrate 80. The upper substrate 5 of the same size as the upper surface of the pedestal portion 3 is mounted on the upper portion of the pedestal portion, and supports a plurality of connection plugs 5'. According to this embodiment, a more accurate inspection can be performed by a simpler structure. Further, in this embodiment, a recessed portion may be formed on the lower surface of the pedestal portion 3, which is not described, and the side 4' in which the electronic circuit E is housed in the recessed portion is provided with a wiring substrate between the insulating substrate 8'' and the pedestal portion 3''. Another contact. The number or configuration of the probes 60 of P 3 1 is not limited by the foregoing embodiments. The shape of the pedestal portion_contact portion 31 is also not limited by the above-described embodiments, and can be arbitrarily selected. Further, the present invention is also applicable to the case where the object to be inspected is another substrate such as an FPD (Planar Display) other than the crystal. [Industrial Applicability] The present invention is applicable to inspection of an electrode having finer electrical properties and finer pitch with smaller precision.杳 131413.doc -16· 200921111 [Simple diagram of diagram j diagram] is a schematic diagram of the structure of the probe device. Fig. 2 is a perspective view showing the structure of the inspection block. Figure 3 is a longitudinal sectional view showing the structure of the inspection block. Simplified mode of structure in the seat of the Tuxi pedestal (b) is a longitudinal section view. (a) A cross-sectional view of the system, and Fig. 5 is a perspective view of the contact portion. _ A bottom view of the structure of the holding plate holding multiple inspection blocks. Fig. 7 is a longitudinal sectional view showing an inspection block provided with a wiring board. Fig. 8 is a schematic view showing another coaxial structure in the pedestal portion, and (4) is a cross-sectional circle '(b) is a longitudinal sectional view. Fig. 9 is a schematic view showing the structure of the strip line in the pedestal portion, and (b) is a cross-sectional view (b) is a longitudinal sectional view. The schematic diagram of the structure of the probe device in the case where the pedestal portion is one. Explanation of main component symbols] 1 Probe device 2 Probe card 10 Circuit board 13 Inspection structure 20 Inspection block 30 Base portion 3〇a Conductor portion 31 Contact portion 131413.doc -17 200921111 31a Wiring layer 31b Insulation layer 31c Elastic layer 40 conductive plug 40a conductive wire 40b dielectric body 60 probe U electrode block W wafer 131413.doc -18