TW200919883A - Opto-electronic semiconductor chip with quantum-well structure - Google Patents
Opto-electronic semiconductor chip with quantum-well structure Download PDFInfo
- Publication number
- TW200919883A TW200919883A TW097135404A TW97135404A TW200919883A TW 200919883 A TW200919883 A TW 200919883A TW 097135404 A TW097135404 A TW 097135404A TW 97135404 A TW97135404 A TW 97135404A TW 200919883 A TW200919883 A TW 200919883A
- Authority
- TW
- Taiwan
- Prior art keywords
- quantum well
- layer
- well layer
- component
- layers
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 171
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 103
- 230000004888 barrier function Effects 0.000 claims description 44
- 229910052738 indium Inorganic materials 0.000 claims description 33
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 31
- 230000005670 electromagnetic radiation Effects 0.000 claims description 29
- 230000005855 radiation Effects 0.000 claims description 29
- 229910002704 AlGaN Inorganic materials 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 39
- 239000002800 charge carrier Substances 0.000 description 14
- 239000002019 doping agent Substances 0.000 description 8
- 230000003595 spectral effect Effects 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910003363 ZnMgO Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007044439.9A DE102007044439B4 (de) | 2007-09-18 | 2007-09-18 | Optoelektronischer Halbleiterchip mit Quantentopfstruktur |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200919883A true TW200919883A (en) | 2009-05-01 |
Family
ID=40260641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097135404A TW200919883A (en) | 2007-09-18 | 2008-09-16 | Opto-electronic semiconductor chip with quantum-well structure |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102007044439B4 (de) |
TW (1) | TW200919883A (de) |
WO (1) | WO2009036730A2 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102315344A (zh) * | 2010-07-09 | 2012-01-11 | Lg伊诺特有限公司 | 发光器件、发光器件封装和包括其的发光*** |
CN102751393A (zh) * | 2011-04-20 | 2012-10-24 | 新世纪光电股份有限公司 | 发光二极管结构 |
TWI584495B (zh) * | 2015-06-18 | 2017-05-21 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor components |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009015569B9 (de) | 2009-03-30 | 2023-06-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
DE102009040438A1 (de) * | 2009-07-24 | 2011-01-27 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper mit einer Quantentopfstruktur |
DE102012217681A1 (de) * | 2012-09-27 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zum Betreiben eines optoelektronischen Bauteils |
DE102013104351B4 (de) | 2013-04-29 | 2022-01-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterschichtenfolge und Verfahren zum Betreiben eines optoelektronischen Halbleiterchips |
CN105226145B (zh) * | 2014-06-23 | 2019-05-31 | 中国科学院物理研究所 | 量子阱结构、发光二极管外延结构及发光二极管 |
DE102016101046A1 (de) * | 2016-01-21 | 2017-07-27 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102019100625A1 (de) * | 2019-01-11 | 2020-07-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauelement mit mehrfach-quantentopfstruktur und optoelektronische halbleitervorrichtung |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3226070B2 (ja) * | 1993-10-04 | 2001-11-05 | キヤノン株式会社 | 半導体光素子 |
GB2298735A (en) * | 1995-03-08 | 1996-09-11 | Sharp Kk | Semiconductor device having a miniband |
FR2747485B1 (fr) | 1996-04-15 | 1998-05-15 | France Telecom | Structure a puits quantiques notamment pour composants actifs en onde guidee insensibles a la polarisation et de grande puissance de saturation et composant comprenant cette structure |
US5719894A (en) | 1996-09-25 | 1998-02-17 | Picolight Incorporated | Extended wavelength strained layer lasers having nitrogen disposed therein |
JP3854693B2 (ja) * | 1996-09-30 | 2006-12-06 | キヤノン株式会社 | 半導体レーザの製造方法 |
JP3433038B2 (ja) * | 1997-02-24 | 2003-08-04 | 株式会社東芝 | 半導体発光装置 |
US6570179B1 (en) * | 1998-01-14 | 2003-05-27 | Mp Technologies, Llc | III-V semiconductors separate confinement superlattice optoelectronic devices |
JPH11251685A (ja) | 1998-03-05 | 1999-09-17 | Toshiba Corp | 半導体レーザ |
FR2784515B1 (fr) * | 1998-10-07 | 2000-11-10 | Commissariat Energie Atomique | Laser a semiconducteur a spectre de gain accordable |
DE19955747A1 (de) | 1999-11-19 | 2001-05-23 | Osram Opto Semiconductors Gmbh | Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur |
US6897484B2 (en) * | 2002-09-20 | 2005-05-24 | Sharp Kabushiki Kaisha | Nitride semiconductor light emitting element and manufacturing method thereof |
US20040179566A1 (en) * | 2003-03-11 | 2004-09-16 | Aharon El-Bahar | Multi-color stacked semiconductor lasers |
JP4412918B2 (ja) | 2003-05-28 | 2010-02-10 | シャープ株式会社 | 窒化物半導体発光素子及びその製造方法 |
WO2005020396A1 (ja) | 2003-08-26 | 2005-03-03 | Sony Corporation | GaN系III−V族化合物半導体発光素子及びその製造方法 |
US7138648B2 (en) | 2003-12-17 | 2006-11-21 | Palo Alto Research Center Incorporated | Ultraviolet group III-nitride-based quantum well laser diodes |
KR100649749B1 (ko) * | 2005-10-25 | 2006-11-27 | 삼성전기주식회사 | 질화물 반도체 발광 소자 |
-
2007
- 2007-09-18 DE DE102007044439.9A patent/DE102007044439B4/de active Active
-
2008
- 2008-08-29 WO PCT/DE2008/001445 patent/WO2009036730A2/de active Application Filing
- 2008-09-16 TW TW097135404A patent/TW200919883A/zh unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102315344A (zh) * | 2010-07-09 | 2012-01-11 | Lg伊诺特有限公司 | 发光器件、发光器件封装和包括其的发光*** |
CN102315344B (zh) * | 2010-07-09 | 2015-11-25 | Lg伊诺特有限公司 | 发光器件、发光器件封装和包括其的发光*** |
CN102751393A (zh) * | 2011-04-20 | 2012-10-24 | 新世纪光电股份有限公司 | 发光二极管结构 |
TWI584495B (zh) * | 2015-06-18 | 2017-05-21 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor components |
Also Published As
Publication number | Publication date |
---|---|
WO2009036730A3 (de) | 2009-08-06 |
DE102007044439B4 (de) | 2022-03-24 |
WO2009036730A2 (de) | 2009-03-26 |
DE102007044439A1 (de) | 2009-03-19 |
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