200919877 九、發明說明： 【發明所屬之技術領域】 本發明是關於多極同軸連接器、效能板（perf〇rmance board)以及測試裝置。更詳細而言，本發明是關於在將同 軸線路結合時所使用的多極同軸連接器、包含該多極同軸 連接器的效能板、以及具備該效能板的測試裝置。 【先前技術】 測試裝置具備測試頭（testhead)，該測試頭產生測試 信號並供給至被測試元件，同時接收於被測試元件中經處 理的測試信號並對被測試元件進行評價。將相對於被測試 元件形成電性連接的元件插槽（socket)，搭載於安裝在測 試頭上的效能板上。安裝於元件插槽上的被測試元^經由 效能板而電性結合於測試頭中所收容的接 (pin electronics board)等。 於下述專利文獻1中記載有一半導體測試裝置，其 傷相對於被測試元件形成電性連接的IC插槽（⑽故拉、)' 且具備安裝於測試頭上的效能板。另外，於下述專利文肩 2中記載有-構造’其藉由將被職元件觀於效能板_ 而將被測試元件及效能板之間可靠地電性連接。再者，j 了述專利文獻3巾記财—構造，其錢接線路的種氣 效能板及測試頭本體之間增加。 、 如上所述之效能板***到被測試元件及測試頭之間( 、造，在更換被測試元件時、變更被測試元件的規格 或者在變更測助料等，可#由更換效能板而對應⑨ 200919877 測試裝置。 因此，對於效能板與接腳介面電路板之間的信號線 路，使用有多個插拔自由的多極同軸連接器。藉此，對廉 於元件品種來更換效能板，從而可對應於各種被测試元^ 的測試。 Γ L寻利文默lj曰本專利特開平H-083934號公報 [專利文獻2]日本專利特開2〇〇5_〇84〇14號公報 [專利文獻3]日本專利特開2〇〇7_〇4〇941號公報 近年來，「SoC (System on Chip，晶片系統）」、「幻 (System in Package ’系統封裝）」、「⑶ large-scale integration，系統大規模整合）」等已 試元件而處理。該種積體電路為大規模、多功能，故鱼 入輸出端子數转常^因此，在_種频電行 試時，效能板與測試頭之間的同軸電_數 = 】於所述同軸電_連接的同軸連接器的接腳數亦必 ϋ的可配置頭上，連接於效能板的同轴連I ==度’則線二:串:二 的線路數料有降。因此’將特定_試頭可對肩 【發明内容】 供=為解決上述問題，作為本發明的第1" 供一種多極同轴連接器，該多極同軸連接器以電; 200919877 件、外殼（housing)、以及彈性導電片， ^有第2 a起韻屏蔽（shield)導體而形成 造，上述外殼保持多個上述導電部件；上性 置在上述外殼與基板之間，並藉 =導電片配 芯線的第i突起部及上述屏蔽導體的第2 ^起部2= =的連接電極精電性連接，且具有電性各向異性的導 ，外’作為本發明的第2形態，提供 ，多極同軸連接器’該多極同軸連接器安裝於包t接腳 ==的:说頭上，且電性連接於上述接腳介面Ϊ: 唬，對自上述被測試元件接收到的測試信號 ^述二頭軸連接器包括導電部件、外殼、以及彈心 片，其中’上述導電部件藉由具有第〗 ====線且具有第2突起部的屏蔽= 1構每，上述外殼簡多個上述導電部件；上述彈性導 電片配置在上述外殼與基板之間並藉由受到按塵 ==_第丨突起部及上述屏蔽導體的第2突起部， 的連接電極進行電性連接’且具有電性各向異 再者，作為本發明的第3形態，提供—種測試裝置， ^皮=轉進行^試’該測試裝置具備測試頭及效能 “ ’上述測試頭包括接冑介面電路板，該接腳介面 200919877 電路板生絲給至觀〗試轉_試信號，錢 收_職信號進行評價；上述效能板包括多極; 轴連接’該多極同轴連接器安裝於上述測試頭上，且= ^連接於接腳介面電路板，上述多極同軸連接器包括：ί ί部件、外殼、以及彈科以，射，上述導電部件1 有號芯線、及包圍上述信號芯線且具200919877 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a multi-pole coaxial connector, a performance board, and a test apparatus. More specifically, the present invention relates to a multi-pole coaxial connector used in joining a coaxial line, a performance board including the multi-pole coaxial connector, and a test apparatus including the performance board. [Prior Art] The test device is provided with a test head which generates a test signal and supplies it to the device under test while receiving the processed test signal in the device under test and evaluating the device under test. A component socket that is electrically connected to the device under test is mounted on a performance board mounted on the test head. The tested component mounted on the component slot is electrically coupled to a pin electronics board or the like in the test head via a performance board. Patent Document 1 listed below discloses a semiconductor test device in which an IC socket ((10) is pulled) that is electrically connected to a device under test and has a performance board mounted on the test head. Further, in the following Patent Document 2, there is described a structure in which the component to be tested and the performance board are reliably electrically connected by viewing the component on the performance board. Furthermore, j describes the patent document 3 towel-finance-structure, and the seed gas performance board of the money connection line and the test head body are increased. The performance board as described above is inserted between the device under test and the test head (made, when the component to be tested is replaced, the specification of the component to be tested is changed, or the test aid is changed, etc., 9 200919877 Test device. Therefore, for the signal line between the performance board and the pin interface circuit board, a multi-pole coaxial connector with multiple plug-in and free plugs is used, thereby replacing the performance board with the component type. It is possible to correspond to the test of various tested elements. Γ L 寻 文 默 l l 专利 专利 专利 专利 H H H - - - - - - - - - - - - - - - - - pat pat pat pat pat pat pat pat pat pat pat pat pat pat pat pat Japanese Patent Laid-Open No. 2〇〇7_〇4〇941, in recent years, "SoC (System on Chip), "System in Package", "(3) large-scale Integration, system large-scale integration) and other tested components. The integrated circuit is large-scale and multi-functional, so the number of fish entering the output terminal is constant. Therefore, in the case of the frequency-frequency test, the coaxial power between the performance board and the test head is ??? The number of pins of the connected coaxial connector is also configurable on the head. The coaxial connection to the performance board is I == degrees. Then the line 2: string: the number of lines of the second is reduced. Therefore, 'the specific _ test head can be shouldered. [Summary of the invention] For solving the above problem, as the first " for a multi-pole coaxial connector of the present invention, the multi-pole coaxial connector is powered; 200919877 pieces, housing (housing), and an elastic conductive sheet, formed by a 2 ath shielded conductor, the outer casing holding a plurality of the conductive members; an upper layer disposed between the outer casing and the substrate, and a conductive sheet Provided that the ith protrusion of the core wire and the connection electrode of the second conductor 2 == of the shield conductor are electrically connected to each other and have electrical anisotropy, and are provided as a second aspect of the present invention. Multi-pole coaxial connector 'The multi-pole coaxial connector is mounted on the package t-pin==: said head, and is electrically connected to the above-mentioned pin interface Ϊ: 唬, the test signal received from the above-mentioned tested component ^ The two-head shaft connector includes a conductive member, a casing, and a core piece, wherein the above-mentioned conductive member is simply configured by a shield having a second protrusion and a shield having a second protrusion. The conductive member; the elastic conductive sheet configuration The connection electrode between the outer casing and the substrate is electrically connected by a connection electrode that receives the second protrusion of the dust-==_the second protrusion and the shield conductor, and the electrical polarity is different. According to a third aspect of the invention, a test device is provided, which is provided with a test head and a performance "The test head includes a connector interface circuit board, and the pin interface 200919877 is provided with a raw circuit board. View the test _ test signal, the money received _ job signal for evaluation; the above performance board includes multi-pole; the shaft connection 'the multi-pole coaxial connector is mounted on the test head, and ^ ^ is connected to the pin interface circuit board, The multi-pole coaxial connector includes: a component, a casing, and an armor, and the conductive member 1 has a core wire and surrounds the signal core wire and has
CC
多個上述導電部件，上述彈性導電片配置在上述外殼盘】 板之間並藉由受到按壓，而將上述信號芯線的第ι突起苦土 及上述屏蔽導體的第2突起部，與上述基板的連接電極進 行電性連接，且具有電性各向異性的導電性。 再者’上述的發明概要並未列舉出本發明的全部必要 特徵:該些特徵群的次組合（sub_c〇mbinati〇n)亦屬本發 明之範_。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂’下文鱗較讀_，並配麵關辆細說明如 下。 【實施方式】 以下透過發明的實施形態來說明本發明，但以下的 實施形態並不限定巾請專利範圍的發明。另外，於實施形 態中所說_全部特徵組合並不―定是發明的解決手段所 必需。 [實施例1] 圖1是示意性表示下述的配備有插座（receptacle)連a plurality of the conductive members, wherein the elastic conductive sheet is disposed between the outer casing plates and pressed to press the first protrusion of the signal core and the second protrusion of the shield conductor to the substrate The connection electrode is electrically connected and has electrical anisotropy conductivity. Furthermore, the above summary of the invention does not recite all of the essential features of the invention: the sub-combinations of the feature groups (sub_c〇mbinati〇n) are also within the scope of the invention. The above and other objects, features and advantages of the present invention will become more apparent and <RTIgt; </ RTI> <RTIgt; [Embodiment] Hereinafter, the present invention will be described by way of embodiments of the invention, but the following embodiments do not limit the invention of the scope of the invention. In addition, the combination of all features mentioned in the implementation form is not necessarily required for the solution of the invention. [Embodiment 1] Fig. 1 is a view schematically showing a following receptacle connection
200919877 的測試裝置剛的全體構造的示圖。如該圖所示， ^ 1〇〇包括：搬送被測試元件152的處理機150 (handler)、對處理機15〇所搬送的被測試元件…的電 性特性進㈣試的測朗13G、以及對處理機15()與測試 頭130的動作進行綜合控制的主機（咖她刪）⑽。另 外，該些處理機150、測試頭13〇以及主機11〇藉由多芯 的電鏡120而相互結合。 因此’測試頭130在其框體132中收容有多個接腳介 面電路板134。在主機110的指示下，接腳介面電路板134 產生發送至被職元件152的賴信號，同時接收於被測 試元件152中經處理的測試錄，並對被測試元件15 行評價。 又，在測試頭130的上表面上安裝有配備了元件插槽 H0的效能板3〇卜藉由處理機15G所搬送的被測試元件 152經由元件插槽H0而電性連接於測試頭13〇。因此，將 處理機150所搬送的被測試元件152安裝於元件插槽14〇 上，藉此，測試頭130可對該被測試元件152進行消 1試。 另外，在被測試元件152的規格已變更的情況下，戋 者在將被測試元件152更換成其他品種的要求存在的情況 下等，將元件插槽140連同效能板300 一起更換，藉此可 使用同一測試頭130來測式其他被測試元件152。由此， 可提高測試裝置100的利用效率。 圖2疋表示將上述測§式裝置1〇〇中的測試頭的上 部進行局部放大的示圖。如該圖所示，測試頭13〇在其框 200919877 體132巾收容有接腳介面電路板134，該接腳介面電路板 134生成要發送給被職元们52的測試信號，並且根據 自破測試元件1S2接㈣的賴錢來評倾測試元件 152。亦有收容有多個接腳介面電路板的情況。另一方面， 下述的效能板3GG絲於在輔132上表㈣形成的介面 板（interface plate ) 200 上。 介面板200具備板狀的平板本體210及安裝於該平板 本體210上的插塞（plug)連接器222。插塞連接器瓜 、’星由同軸電瘦136及端子板I% *連接於接腳介面電路板 134再者插塞連接器222的每一個中收容有多個連接器 接腳，各連接器接腳獨立地連接於接腳介面電路板I%。 另外’介面板，亦可與作為連接對象的上部的效能板3〇〇 或者下部的接腳介面電路板134相對應，可使用插塞連接 器222或者插座連接器322的任一者。 圖3是安農於如上所述的介面板2〇〇上的效能板· 的立體圖。如該_示，效能板3⑻具備圓板狀的板本體 310及安裝於其上表面Α致巾央處的單—或者多個元件插 槽 140。 板本體310是多層基板，例如可使用電子電路基板用 的材料而形成。作為電子電路基板用的材料，糾周知的 有紙齡^(phenol)基板、紙環氧（ep〇xy)基板、玻璃環氧 基板、氟樹脂基板等’使用具有固定的彎曲剛度（bending stiffness)與絕緣性的材料較佳。再者，該效歧綱具備 单-的το件插槽14G，但亦可安裝有多個元件插槽14〇。 200919877 7G件純MG枝制試树丨52的賴端子電性接 觸的接觸器（_taetGO，具備與被測試元件152的連接端 子1應而配置的連接端子（未圖示），且自上方抵接被測試 疋件152而取得電性連接。另外，在板本體31〇的上表面 - 及/或内層，有作為測試信號的路徑的信號線路34卜342 • 以元件插槽140為中心徑向延伸。 進而，Stg件插槽14〇的周邊形成貫通板本體31〇的 、 通孔343、344。信號線路341、342經由該些通孔343、344 而電性連接於板本體310的下表面。再者，信號線路如、 342亦可為形成於板本體31G上的例如％ ω的特性阻抗 (impedance )的微帶線（micr〇stri line )。 ^線路341'342各_條，但實際上其條數對應 件152的連接端子數而增加，從而形成有數千條以上的多 個信號線路。 圖4疋圖3中所示的效能板3〇()的垂直剖面圖。如該 圖所不，在板本體310㈤下表面周緣部上，安裝有包含插 J 座連接器322的外周部件312。外周部件312加強板本體 31〇的機械強度，同時容易對各部件進行定位。 。。又’在板本體310的下表面周緣部上安裝有插座連接 态322。該插座連接器322配置於通孔343、344的正下方， ‘ f電性連接於通孔343、344的下端。通孔343、344經由 信號線路34卜342而電性連接於元件插槽14〇。因此，元 件插槽140及插座連接器322相互地電性連接著。 如上所述，纽織300 %上表面上具備可安裝被測 11 200919877 試元件152的元件插槽140，並且在效能板3〇〇的下表面 上具備電性連接於元件插槽140的插座連接器322。因此， 自上方安裝於元件插槽140上的被測試元件152的連接端 子可經由插座連接器322而自下表面連接於外部。 圖5是表示與效能板300的插座連接器322相對的介 面板200上的插塞連接器222周圍的局部放大的示圖。如 該圖所示，插塞連接器222與堅固的支持架212 —起固定 於平板本體210上。自插塞連接器222的下方，結合於内 部的連接接腳的同軸電纜136向下方延伸。另外，如下所 述，插塞連接器222的上表面具備相對於效能板3〇〇的插 座連接器322互補的形狀。由此，藉由與插座連接器322 相嵌合而形成電性連接。 如已進行的說明，插塞連接器222連接於接腳介面電 路板134。因此，對於安裝在介面板2⑻上的效能板3〇〇 的元件插槽140上所安裝的被測試元件152，形成有連接 至接腳介面電路板134的信號線路。再者，在由插塞連接 器222及插座連接器322的結合所形成的部位的傳送線路 上，以獲得特定的特姐抗的料形成有成朗軸構造的 内部導體、外部導體。流通於喊接_的信號是從MHz 至GHz頻帶的高頻信號，在測試裝置中會影響測試品質， 因此有必要以真實的波形進行傳送。 圖6是表示將上述插塞連接器222單獨放大後自侧面 看到的狀況的側視圖。如該圖所示，插塞連接器222中， 於中心开>成有形成為一體的外殼41〇。自外殼41〇的上表 12 200919877 面’一對導向銷（guide pin) 420與多個外部導體442向 上方犬出（外部導體442的一部分省略圖示）。 另外，自外殼410的下表面，多個同軸電纜136向下 方延伸。進而’在外殼410的側部，安裝有一對托架 (bracket) 430。在托架430的各個下端附近，形成有在將 插塞連接器222安裝於上述的支持架212上時插通有螺釘 的螺孔414。 圖7是表示自上方俯視圖6所示插塞連接器222的狀 況的俯視圖。如該圖所示’該插塞連接器222的外殼410 疋藉由以托架430而結合的一對外殼片（h〇using piece) 411、413所形成。因此’在外殼片411、413各自的側面 上週期性地形成有凸部412,藉由該凸部的嵌合而相互進 行定位。 另外，在外殼片411、413各自的上表面上，形成有垂 直的多個貫通孔。在貫通孔各自的㈣，收容有同轴插塞 440。 圖8是表示將上述的同軸插塞44〇單獨放大的示圖。 另外，圖9是表示自圖8的紙面的右側方向看到的同轴插 塞440的狀況的示圖。 如以上各圖所7F ’同轴插塞44()包括安裝於同轴電纔 136端部的外部導體442及内部導體444。外部導體自 將同軸魏136端部附延所露出的編包線(braided wire) 135包上並安裝。另-方面，内部導體444 448而電性結合於_轉136的魏137。 13 200919877 根據如上所述的構造， 到同軸插塞440的前端為止 長的特性阻抗被固定地保持 化而得以傳播。 同軸電纜136的同軸構造維持 。因此，遍及同轴插塞440全 ，從而可使高頻信號不產生劣 料蠻在外部導體442的中部，於其外側上形成有稍 SI 2爪祕。藉此，可防止***到外殼片411、化 、貝k孔中的同軸插塞440被同軸電纜136牽引而脫落。A diagram of the overall construction of the test apparatus of 200919877. As shown in the figure, ^1〇〇 includes: a handler 150 that transports the device under test 152, an electrical characteristic of the device under test that is transported by the processor 15A, and a measurement 13G, and A host (10) that comprehensively controls the operations of the processor 15() and the test head 130 (10). In addition, the processor 150, the test head 13A, and the host 11 are coupled to each other by a multi-core electron microscope 120. Therefore, the test head 130 houses a plurality of pin interface boards 134 in its housing 132. At the direction of the host 110, the pin interface board 134 generates a spur signal that is sent to the employed component 152, while receiving the processed test record in the tested component 152, and evaluates the component under test 15. Further, on the upper surface of the test head 130, a performance board 3 equipped with the component slot H0 is mounted, and the device under test 152 carried by the processor 15G is electrically connected to the test head 13 via the component slot H0. . Therefore, the device under test 152 carried by the processor 150 is mounted on the component slot 14A, whereby the test head 130 can perform the test on the device under test 152. Further, in the case where the specification of the device under test 152 has been changed, the component slot 140 is replaced together with the performance board 300 in the case where the requirement to replace the device under test 152 with another type is required. The same test head 130 is used to measure other tested components 152. Thereby, the utilization efficiency of the test apparatus 100 can be improved. Fig. 2A is a view showing a partial enlargement of the upper portion of the test head in the above-described measuring device 1A. As shown in the figure, the test head 13 is in its frame 200919877. The body 132 receives a pin interface circuit board 134, and the pin interface circuit board 134 generates test signals to be sent to the service members 52, and according to self-breaking The test component 1S2 is connected to the test component 152. There are also cases where a plurality of pin interface boards are housed. On the other hand, the performance board 3GG described below is placed on the interface plate 200 formed on the auxiliary 132 on the table (4). The meso panel 200 includes a plate-shaped flat body 210 and a plug connector 222 attached to the flat body 210. Plug connector melon, 'star by coaxial electric thin 136 and terminal board I% * connected to the pin interface circuit board 134 and then plug connector 222 each accommodates a plurality of connector pins, each connector The pins are independently connected to the pin interface board I%. Further, the dielectric panel may correspond to the upper performance board 3 or the lower interface interface board 134 as the connection target, and either the plug connector 222 or the socket connector 322 may be used. Figure 3 is a perspective view of the performance board of Annon on the interface panel 2 as described above. As shown in the figure, the performance board 3 (8) is provided with a disk-shaped board body 310 and a single- or a plurality of component slots 140 attached to the upper surface of the upper surface of the towel. The board body 310 is a multilayer substrate, and can be formed, for example, using a material for an electronic circuit board. As a material for an electronic circuit board, a well-known phenol substrate, a paper epoxy (ep〇xy) substrate, a glass epoxy substrate, a fluororesin substrate, etc. have a fixed bending stiffness. It is preferred to be insulative. Further, the efficacies are provided with a single-sized squirrel slot 14G, but a plurality of component slots 14 亦可 can also be mounted. 200919877 A contactor (_taetGO) that is electrically contacted with the MG terminal of the 7G pure MG branch test shovel 52 (a taeGO) is provided with a connection terminal (not shown) disposed in connection with the connection terminal 1 of the device under test 152, and abuts from above The electrical connection is obtained by the test element 152. In addition, on the upper surface - and / or inner layer of the plate body 31 ,, there is a signal line 34 as a path of the test signal 342 • radially extending around the element slot 140 Further, through holes 343 and 344 are formed in the periphery of the Stg member slot 14A through the board body 31. The signal lines 341 and 342 are electrically connected to the lower surface of the board body 310 via the through holes 343 and 344. Furthermore, the signal lines such as 342 may also be microsecond lines (micr〇stri lines) of characteristic impedances such as % ω formed on the board body 31G. ^ Lines 341'342 are each _ strips, but actually The number of connection terminals of the number of counterparts 152 is increased to form a plurality of signal lines of several thousand or more. Fig. 4 is a vertical sectional view of the performance board 3 () shown in Fig. 3. No, it is mounted on the peripheral portion of the lower surface of the plate body 310 (5). The outer peripheral member 312 of the J-seat connector 322. The outer peripheral member 312 reinforces the mechanical strength of the plate body 31, and at the same time easily positions the components. Further, a socket connection state 322 is mounted on the peripheral portion of the lower surface of the plate body 310. The socket connector 322 is disposed directly under the through holes 343, 344, and is electrically connected to the lower ends of the through holes 343, 344. The through holes 343, 344 are electrically connected to the component slot via the signal line 34 14. Therefore, the component slot 140 and the receptacle connector 322 are electrically connected to each other. As described above, the upper surface of the woven fabric has 300% of the component slot 140 on which the test element 2009 152 test component 152 can be mounted, and The lower surface of the performance board has a socket connector 322 electrically connected to the component slot 140. Therefore, the connection terminal of the device under test 152 mounted on the component slot 140 from above can be via the socket connector 322. Figure 5 is a partially enlarged view showing the vicinity of the plug connector 222 on the interface panel 200 opposite the receptacle connector 322 of the performance board 300. As shown in the figure, the plug connector is shown. 222 and The fixed support frame 212 is fixed to the flat plate body 210. Below the plug connector 222, the coaxial cable 136 coupled to the internal connecting pin extends downward. Further, as described below, the plug connector 222 The upper surface is provided with a complementary shape to the socket connector 322 of the performance board 3. Thereby, an electrical connection is formed by fitting with the socket connector 322. As explained, the plug connector 222 is connected. On the pin interface circuit board 134. Therefore, a signal line connected to the pin interface circuit board 134 is formed for the device under test 152 mounted on the component slot 140 of the performance board 3A mounted on the interface panel 2 (8). Further, on the transmission line of the portion formed by the combination of the plug connector 222 and the receptacle connector 322, an inner conductor and an outer conductor having a stable shaft structure are formed to obtain a specific material for the special sister. The signal circulating in the splicing_ is a high-frequency signal from the MHz to the GHz band, which affects the test quality in the test device, so it is necessary to transmit in a real waveform. Fig. 6 is a side view showing a state in which the plug connector 222 is separately enlarged and seen from the side. As shown in the figure, in the plug connector 222, a housing 41 is formed integrally with the center opening. From the upper surface of the outer casing 41〇12 200919877, a pair of guide pins 420 and a plurality of outer conductors 442 are slid upward (a part of the outer conductor 442 is not shown). In addition, a plurality of coaxial cables 136 extend downward from the lower surface of the outer casing 410. Further, a pair of brackets 430 are attached to the side of the outer casing 410. In the vicinity of each lower end of the bracket 430, a screw hole 414 through which a screw is inserted when the plug connector 222 is attached to the above-described support frame 212 is formed. Fig. 7 is a plan view showing a state in which the plug connector 222 shown in Fig. 6 is seen from above. As shown in the figure, the outer casing 410 of the plug connector 222 is formed by a pair of outer casing pieces 411, 413 joined by a bracket 430. Therefore, the convex portions 412 are periodically formed on the respective side faces of the outer shell sheets 411 and 413, and are positioned by the fitting of the convex portions. Further, on the upper surface of each of the outer shell sheets 411 and 413, a plurality of vertical through holes are formed. A coaxial plug 440 is housed in each of the through holes (4). Fig. 8 is a view showing the above-described coaxial plug 44A separately enlarged. Further, Fig. 9 is a view showing a state of the coaxial plug 440 as seen from the right side direction of the paper surface of Fig. 8. The 7F' coaxial plug 44() as shown in the above figures includes an outer conductor 442 and an inner conductor 444 attached to the end of the coaxial motor 136. The outer conductor is packaged and mounted from a braided wire 135 exposed by the end of the coaxial Wei 136. In another aspect, the inner conductor 444 448 is electrically coupled to the Wei 137 of the _ turn 136. 13 200919877 According to the configuration as described above, the characteristic impedance to the front end of the coaxial plug 440 is fixedly maintained and propagated. The coaxial configuration of the coaxial cable 136 is maintained. Therefore, the entire coaxial plug 440 is spread so that the high-frequency signal does not cause inferior material in the middle of the outer conductor 442, and a slight SI 2 claw is formed on the outer side thereof. Thereby, it is possible to prevent the coaxial plug 440 inserted into the outer casing piece 411, the hole, and the hole to be pulled by the coaxial cable 136 to fall off.
圖仞是表示自板本體310側俯視插座連接器322時所 看到的外觀的俯視圖。如該圖所示，插座連接器322豆有 規則排列著的多錄容孔512，且具有由絕緣性樹脂&形 成的外殼510、及上述收容孔512各自所收容的導電部件 540 (參照圖15)。另外，在外殼51〇上，將一部分收容孔 512換成在將外殼51〇固定於板本體31〇上時所要使用的 螺孔530。進而，在外殼51〇上，形成有在其他部件上進 行安裝時用於定位的導向銷520。 圖11疋表示將形成於外殼510上表面上的收容孔512 放大的示圖。如該圖所示，收容孔512各自包括形成為同 軸狀的外侧的收容孔515及内侧的收容孔517。在收容孔 515、517中’具備嵌入有下述的外部導體61〇、内部導體 620而可保持固定的構造。在收容孔515、517各自的底部， 可以看到使作為嵌合對象的插塞連接器222的外部導體 442及内部導體444自下表面插通的導向孔51卜513的一 部分。 外侧的環狀的收容孔515具有八角形的内面形狀，其 200919877 收容並保持下述的導電部件540的外部導體610〇另—方 面，内側的收容孔517具有矩形的内面形狀，其收容並保 持下述的内部導體620。藉此，在外殼510的内部，外部 導體610及内部導體620各自在彼此分開的狀態下進行定 位，從而形成有維持同轴構造的特定的特性阻抗。 圖12是表示自下方仰視插座連接器322時所看到的外 觀的仰視圖。如該圖所示，在外殼510的下表面上，*** 有同軸插塞440的外部導體442及内部導體444，且規則 地排列有同軸狀的導向孔511、513。導向孔511、513的 排列對應於插塞連接器222中的同轴插塞440的排列。另 外’在外殼510的下表面上，螺孔530的一端亦開口。進 而，亦形成有與插塞連接器222的導向銷420相喪合的導 向孔550。 圖13是表示將形成於外殼510下表面上的導向孔 511、513放大的立體圖。如該圖所示，在自下侧（插塞連 接益222側）觀察外殼51〇時’在外殼51〇的下表面上， 規則地排列有以同心狀開口的導向孔51丨、513，且具有可 將作為嵌合對象的插塞連接器222侧的外部導體 部導體444 一邊引導一邊喪入的構造。…體2及内 此處，各導向孔511、513的每一個均具有在外殼 的底面最寬、越往裏越窄的錐狀的内面形狀。藉此，在結 合有插塞連接器222的情況下，可將其外部導體442及内 σ|5導體444順利地導入。而且，將已***的外部導體442 及内部導體444定位於特定的位置，且與插座連接器您 15 200919877 側的外部導體610及内部導體62〇的接觸部6i4、幻4 (參 照圖15)良好地接觸。 圖Η是示意性表示插座連接器322的相對於板本體 310的安裝構造的侧視圖。如該圖所 安裝?能板3⑻的板本體310的下表面。3接;插3座 連接裔322的外殼51〇的上表面與板本體310的下表面之 間’夾持有彈性導電片560。 又，於外殼510的上表面上，導電部件54〇的本體部 612 622 (參照圖15 )的上端突出。該些本體部612、622 經由彈性導電片560而抵接於板本體31〇的下方。再者， 在彈性導電片560上，形成有導向孔565，其中插通有外 设510的導向銷520。藉此，外殼510及彈性導電片56〇 被相互定位。 再者，在板本體310上，形成有導向孔311，其中插 通有外殼510的導向銷520。另外，亦形成有螺孔313，其 中插通有插通到外殼51〇的螺孔530中的螺釘（未圖示）。 再者’圖中，將外殼510及彈性導電片560相互分離 地描繪出。然而，在實際使用上，將彈性導電片56〇作為 插座連接器322的一部分而抵接於外殼51〇的上表面。 圖15是表示安裝於板本體310上的插座連接器322 的電性構造的分解立體圖。於該圖中，取出並描繪有作為 電子信號的路徑的板本體310、彈性導電片560、外部導體 610以及内部導體620 ’省略外殼510的圖示。另外，為了 表示出板本體310的上表面而描繪了兩塊。 16 200919877 如該圖所示，在插座連接器322中，形成於板本體3i〇 上表面上的信號線路342經由貫通板本體31〇的通孔 344、345而與板本體310的下表面相連。在板本體31〇的 下表面上，通孔345單獨露出。相對於此，如圖中虛線p 所示，通孔344與包圍通孔345的導體所形成的環形圖案 (ring pattern) 346結合。由此，在板本體31〇的下表面上 形成同袖構造。 重疊於板本體下表面的彈性導電片560包括：在 與通孔345相對的位置上所形成的導電區域Μ4、以及在 與環形圖案346相對的區域上所形成的多個導電區域 562。V電區域562、564連續地形成至圖上看不到的彈性 導電片560的上表面為止。因此，在彈性導電片刷的上 表面密著於板本體310的下表面時，如圖中虛線z所示， 導電區域562接觸到環形圖案346而導通，導電區域⑽ 連接到通孔345而導通。導電區域562、564彼此 不導通。 ϋ 再者，在上述實施形態中，在板本體310的下表面上 形成導電性的環形圖案346。然而，亦可使形成於通孔345 周圍的通孔344直接抵接於彈性導電片的導電區域 562而連接。藉此，亦可簡化板本體31〇的製造過程。 另外，舉一例來說，彈性導電片56〇是在矽橡膠等的 彈性材料中於上下方向上埋入有多個金屬絲狀導體而形 成。又，根據需要，可僅在導電區域562、564的部分具有 導電性。導電區域562、564通過彈性導電片56〇的正面與 200919877 通狀態的產品、以及在受到 ’僅限於使被按壓的區域的 背面而形成，具有經常處於導 下述的導電部件540等按墨時 正面與背面導通的產品。 在彈性導電片560的下矣而v , ^ ,, ^ J卜表面上’分別配置有導電部件 540的外部導體610及内部6 1 口丨等體620。外部導體610包括： 在插座連接322已連接於掩变、由 史丧於插塞連接器222時，接觸到豆 外部導體442的一對接艋卹 π㈣觸4 614、以及自上方支持上述接The figure is a plan view showing an appearance seen when the socket connector 322 is viewed from the side of the board body 310. As shown in the figure, the socket connector 322 has a plurality of recording holes 512 which are regularly arranged, and has a casing 510 formed of an insulating resin & and a conductive member 540 accommodated in each of the receiving holes 512 (refer to the figure). 15). Further, on the casing 51, a part of the receiving hole 512 is replaced with a screw hole 530 to be used when the casing 51 is fixed to the plate body 31. Further, on the casing 51, a guide pin 520 for positioning when mounted on another member is formed. Fig. 11A is an enlarged view showing a receiving hole 512 formed on the upper surface of the outer casing 510. As shown in the figure, each of the accommodation holes 512 includes a housing hole 515 formed on the outer side and a housing hole 517 on the inner side. The receiving holes 515 and 517 have a structure in which the outer conductor 61 下述 and the inner conductor 620 described below are fitted and held. At the bottom of each of the receiving holes 515, 517, a portion of the guide hole 51 513 through which the outer conductor 442 and the inner conductor 444 of the plug connector 222 to be fitted are inserted from the lower surface can be seen. The outer annular receiving hole 515 has an octagonal inner surface shape, and the outer conductor 610 of the conductive member 540 is accommodated and held in 200919877. The inner receiving hole 517 has a rectangular inner surface shape, and is accommodated and held. The inner conductor 620 described below. Thereby, inside the outer casing 510, the outer conductor 610 and the inner conductor 620 are each positioned in a state of being separated from each other, thereby forming a specific characteristic impedance for maintaining the coaxial configuration. Fig. 12 is a bottom plan view showing the appearance when the receptacle connector 322 is viewed from below. As shown in the figure, on the lower surface of the casing 510, the outer conductor 442 and the inner conductor 444 of the coaxial plug 440 are inserted, and coaxial guide holes 511, 513 are regularly arranged. The arrangement of the guide holes 511, 513 corresponds to the arrangement of the coaxial plugs 440 in the plug connector 222. Further, on the lower surface of the outer casing 510, one end of the screw hole 530 is also opened. Further, a guide hole 550 which is in contact with the guide pin 420 of the plug connector 222 is formed. Fig. 13 is an enlarged perspective view showing guide holes 511, 513 formed on the lower surface of the outer casing 510. As shown in the figure, when the outer casing 51 is viewed from the lower side (the side of the plug connection benefit 222), 'on the lower surface of the outer casing 51', the guide holes 51, 513 which are concentrically opened are regularly arranged, and The outer conductor portion conductor 444 on the side of the plug connector 222 that is a fitting target has a structure in which it is guided while being guided. In the body 2 and the inside, each of the guide holes 511 and 513 has a tapered inner surface shape which is widest at the bottom surface of the outer casing and narrower toward the inner side. Thereby, when the plug connector 222 is bonded, the outer conductor 442 and the inner σ|5 conductor 444 can be smoothly introduced. Moreover, the inserted outer conductor 442 and the inner conductor 444 are positioned at a specific position, and are in good contact with the contact portion 6i4 and the phantom 4 (refer to FIG. 15) of the outer conductor 610 and the inner conductor 62 of the socket connector 15 200919877 side. Ground contact. FIG. 2 is a side view schematically showing a mounting configuration of the receptacle connector 322 with respect to the board body 310. The lower surface of the plate body 310 of the energy board 3 (8) is mounted as shown in the figure. 3 is connected; the elastic conductive sheet 560 is sandwiched between the upper surface of the outer casing 51 of the connecting body 322 and the lower surface of the plate body 310. Further, on the upper surface of the casing 510, the upper end of the main body portion 612 622 (see Fig. 15) of the conductive member 54 is protruded. The body portions 612 and 622 abut against the lower surface of the plate body 31〇 via the elastic conductive sheet 560. Further, on the elastic conductive sheet 560, a guide hole 565 is formed in which the guide pin 520 of the outer casing 510 is inserted. Thereby, the outer casing 510 and the elastic conductive sheets 56 are positioned to each other. Further, on the plate body 310, a guide hole 311 in which the guide pin 520 of the outer casing 510 is inserted is formed. Further, a screw hole 313 is formed in which a screw (not shown) inserted into the screw hole 530 of the casing 51 is inserted. Further, in the figure, the outer casing 510 and the elastic conductive sheet 560 are drawn apart from each other. However, in actual use, the elastic conductive sheet 56 is abutted against the upper surface of the outer casing 51A as a part of the receptacle connector 322. FIG. 15 is an exploded perspective view showing an electrical structure of the receptacle connector 322 attached to the board body 310. In the figure, the board body 310, the elastic conductive sheet 560, the outer conductor 610, and the inner conductor 620' which are paths for taking out electronic signals are taken out and the housing 510 is omitted. In addition, two pieces are depicted in order to show the upper surface of the plate body 310. 16 200919877 As shown in the figure, in the receptacle connector 322, the signal line 342 formed on the upper surface of the board body 3i is connected to the lower surface of the board body 310 via the through holes 344, 345 passing through the board body 31. On the lower surface of the plate body 31A, the through holes 345 are separately exposed. On the other hand, as shown by a broken line p in the figure, the through hole 344 is combined with a ring pattern 346 formed by a conductor surrounding the through hole 345. Thereby, the same sleeve structure is formed on the lower surface of the plate body 31A. The elastic conductive sheet 560 overlapping the lower surface of the board body includes a conductive region Μ4 formed at a position opposing the through hole 345, and a plurality of conductive regions 562 formed on a region opposing the annular pattern 346. The V electrical regions 562, 564 are continuously formed up to the upper surface of the elastic conductive sheet 560 which is not visible on the drawing. Therefore, when the upper surface of the elastic conductive sheet brush is adhered to the lower surface of the plate body 310, as shown by the broken line z in the figure, the conductive region 562 is in contact with the annular pattern 346 to be turned on, and the conductive region (10) is connected to the through hole 345 to be turned on. . The conductive regions 562, 564 are not electrically connected to each other. Further, in the above embodiment, a conductive annular pattern 346 is formed on the lower surface of the plate body 310. However, the through holes 344 formed around the through holes 345 may be directly connected to the conductive regions 562 of the elastic conductive sheets to be connected. Thereby, the manufacturing process of the board body 31A can also be simplified. Further, as an example, the elastic conductive sheet 56 is formed by embedding a plurality of wire-shaped conductors in the vertical direction in an elastic material such as ruthenium rubber. Further, it is possible to have conductivity only in portions of the conductive regions 562, 564 as needed. The conductive regions 562, 564 are formed by the front surface of the elastic conductive sheet 56A and the product of the state of 200919877, and when subjected to the "restricted only to the back surface of the pressed region", and the conductive member 540 which is often guided to the following is pressed. Products with front and back conduction. The outer conductor 610 of the conductive member 540 and the inner body 620 of the conductive member 540 are respectively disposed on the lower surface of the elastic conductive sheet 560 and v, ^, and ^J. The outer conductor 610 includes: a pair of contact shirts π (four) contacts 4 614 that are in contact with the bean outer conductor 442 when the socket connection 322 has been connected to the muting, and is supported by the above.
=14的本體部612。另外，本體部612是具有八角形 面形狀的筒狀部件，例如藉由將金屬板壓 而製造。 進而’本體部6i2的上端大致平坦，但具有向上方突 出的多個突起部616。在使具有該突起部616的本體部612 的上端，自下方抵接於彈性導電片56〇的情況下，如圖中 虛線Y所，，密著於彈性導電片料電區域泌而相 互導通。藉此’形成有自形成於板本體上表面 路342至外部導體610的連續的電性連接。利用上述多^ 突起部616而於多個部位連接。另外，由於不存在先前的 引線端子（，圖示），故可改善所要傳賴錢的傳送品 質，且可更高密度地排列多個導電部件54〇。 再者’外部導體610 $直徑大於同軸插塞44〇的外部 導體442的直徑。另外，接觸部614具有隨著靠近前端（下 端）而相互接近的傾斜。藉此，在接觸部上連接有同軸插 塞440的情況下，彈性抵接於同軸插塞44〇的内部導體 444 ’從而形成良好的電性結合。 18 200919877 又，於該實施形態中，將外部導體610的本體部612 =剖面形狀設為A角形，但剖面形狀並不限於此，亦可為 ’、角形或圓形’而，在將板狀的材料壓製加卫成筒狀時， 八角形的筒狀部件的設計及加工均會變得容易。 ^而’料部導體61〇進行壓製加工而成形出筒狀時 ，對接面即使不嚴密地密著，亦可獲得磁性屏蔽效果。但 f ’較佳情形是在對接面上形成互娜狀的凹凸部，且以 方式而形成。藉此’自對接面的間隙向外部的 導電；制’且插座連接器322上的鄰接配置著的 導電縣540相互的串擾得以抑制。 體。内#導體62G成為同軸連接器的中心導 内部導於外部導體610的内侧而安裝，該 ^時接觸:塞=座連接器322連接於插塞連接器 觸部似、以及自上的内部導體444的一對接 本體部622且有μ 3 部624的本體部622。另外， 板進行壓f成平剖面形狀，例如，藉由將金屬 具有向上;==部622的上端大致平坦’但 上端自下方抵接於^導有電^=的本體部防的 X所示，密荖#湿道的匱況下，如圖中虛線 通。藉此、，形成於板而相互f 導體62G連續的電性連接。藉由上述突起部 200919877 存在先前的引線端子（未圖示），從而可改善所要傳送的信 號的傳送品質。 再者，外部導體610及内部導體620均使上述突起部 616、626 ’又入彈性導電片56〇而抵接。藉此，使外部導體 610及内部導體62〇與導電區域562、564密著且使上述 • 抵接部位的·連接可靠，_抑制接觸電_上升。 再者，在上述實施形態中，將安裝於效能板3〇〇的板 本體310的插座連接器322作為同軸電子零件的例進行了 說明。但是，亦可將對應於板本體31〇下表面的具有同軸 構造的導體圖案的基板作為同軸電子零件而例示。進而， 亦可舉出_魏的端面作為雜t子零件的例。 圖16是對安裝於板本體310的插座連接器322的一個 特定剖面的圖。如該圖所示，對於插座連接器322的下表 面，藉由與在導向孔311 _看到的外部導體61〇的接觸 614父叉的線Si所切斷的剖面顯示於圖17中。 圖17是表示圖16所示的剖面&中的安裝於板本體 31〇上的插座連接器322的電性連接構造的剖面圖。如該 ®所示’外殼510藉由相互緊固的螺栓3〇5及螺母3〇7而 固定於板本體31G上。再者，可代替螺栓3G5及螺母3〇7 而使用柳釘（rivet)尊的敛合部件來緊固。. 在外殼510的内部，自外殼51〇的上表 的外部導體610的突起部616按麗彈性導電片56〇而使1 彈性變形。藉此，外部導體⑽及彈性導電片密著; 一起，且形成有接觸電阻低的電性連接。 20 200919877 區域562在其上表面__ 子L 344，進而’通孔344連接於板本體31〇上表面的仲 ，路342。由此’形成自外部導體61〇至信號線路％心Body portion 612 of =14. Further, the main body portion 612 is a tubular member having an octagonal shape, and is manufactured, for example, by pressing a metal plate. Further, the upper end of the main body portion 6i2 is substantially flat, but has a plurality of protruding portions 616 that protrude upward. When the upper end of the main body portion 612 having the projection portion 616 is brought into contact with the elastic conductive sheet 56A from below, as shown by a broken line Y in the figure, the electrically conductive sheet material is adhered to each other and electrically connected to each other. Thereby, a continuous electrical connection is formed from the upper surface 342 of the board body to the outer conductor 610. The plurality of protrusions 616 are connected to each other at a plurality of locations. Further, since the previous lead terminals (not shown) are not present, the quality of the transfer to be transferred can be improved, and the plurality of conductive members 54 can be arranged at a higher density. Further, the outer conductor 610 has a diameter larger than the diameter of the outer conductor 442 of the coaxial plug 44A. Further, the contact portion 614 has an inclination close to each other as approaching the front end (lower end). Thereby, in the case where the coaxial plug 440 is connected to the contact portion, the inner conductor 444' of the coaxial plug 44A is elastically abutted to form a good electrical bond. 18 200919877 In this embodiment, the main body portion 612 of the outer conductor 610 has a cross-sectional shape of an A-angle, but the cross-sectional shape is not limited thereto, and may be ', an angle or a circle', and a plate shape is used. When the material is pressed and reinforced into a cylindrical shape, the design and processing of the octagonal tubular member becomes easy. When the material portion conductor 61 is pressed and formed into a tubular shape, the magnetic shield effect can be obtained even if the butt surface is not closely adhered. However, f' is preferably formed by forming mutually concave and convex portions on the abutting faces. Thereby, the cross-talk from the abutting surface to the outside is electrically conductive; and the crosstalk of the conductive preamplifiers 540 disposed adjacent to each other on the receptacle connector 322 is suppressed. body. The inner conductor #62 is mounted as a center conductor of the coaxial connector and is mounted inside the outer conductor 610. The contact is: the plug connector 322 is connected to the plug connector, and the inner conductor 444 is upper. The pair is connected to the body portion 622 and has a body portion 622 of the μ 3 portion 624. In addition, the plate is pressed into a flat cross-sectional shape, for example, by having the metal upward; the upper end of the == portion 622 is substantially flat, but the upper end abuts against the X of the body portion that is electrically controlled from below, Under the condition of the wet channel, the dotted line in the figure. Thereby, they are formed on the board and electrically connected to each other with the conductors 62G. With the above-mentioned protrusion portion 200919877, there is a previous lead terminal (not shown), whereby the transmission quality of the signal to be transmitted can be improved. Further, both the outer conductor 610 and the inner conductor 620 abut the projections 616, 626' again into the elastic conductive sheets 56. Thereby, the outer conductor 610 and the inner conductor 62 are adhered to the conductive regions 562 and 564, and the connection of the abutting portion is made reliable, and the contact electric_rise is suppressed. Furthermore, in the above embodiment, the socket connector 322 attached to the board body 310 of the performance board 3A has been described as an example of a coaxial electronic component. However, a substrate having a coaxial conductor pattern corresponding to the lower surface of the plate body 31 may be exemplified as a coaxial electronic component. Further, an example in which the end face of the wei is used as a sub-t component may be mentioned. Fig. 16 is a view showing a specific cross section of the receptacle connector 322 attached to the board body 310. As shown in the figure, the cross section of the lower surface of the receptacle connector 322, which is cut by the line Si of the parent fork, which is in contact with the outer conductor 61 of the guide hole 311_, is shown in Fig. 17. Fig. 17 is a cross-sectional view showing the electrical connection structure of the receptacle connector 322 attached to the board body 31A in the section & The outer casing 510 as shown in the ® is fixed to the plate body 31G by bolts 3〇5 and nuts 3〇7 which are fastened to each other. Further, instead of the bolt 3G5 and the nut 3〇7, the rivet fitting member can be used for fastening. Inside the outer casing 510, the projection 616 of the outer conductor 610 of the upper surface of the outer casing 51 is elastically deformed by the elastic conductive sheet 56. Thereby, the outer conductor (10) and the elastic conductive sheet are adhered together; and an electrical connection having a low contact resistance is formed together. 20 200919877 The region 562 is on its upper surface __ sub L 344, and further the 'via' 344 is connected to the secondary path 342 of the upper surface of the plate body 31. Thus 'formed from the outer conductor 61〇 to the signal line % heart
圖18是對安裝於板本體31〇的插座連接器切的其他 特定，的圖。如該圖所示’對於插座連接器322 “表 面，藉由與在導向孔511内侧看到的外部導體61〇的接觸 部614不交又且與圖16所示的線&正交的線&所切斷的 剖面，顯示於圖19表示中。 圖19是表示圖18所示的剖面&的安裝於板本體31〇 的插座連接器322的電性連接構造的剖面圖。如該圖所 示，在外殼510的内部，自外殼51〇的上表面向上方突出 的外部導體610及内部導體620的突起部616、626分別按 壓彈性導電片560而使其彈性變形。 此處，如圖中所示，於外部導體61〇及内部導體620 上未形成有接觸部614、624的部分上，當形成外殼51〇 的樹脂中***了外部導體610的情況下，上述樹脂的一部 分會沒入到接觸部614的内侧’從而抵接於外部導體610 及内部導體620的下端。因此’藉由對螺栓3〇5及螺母307 的緊固，使得外部導體610及内部導體620經由外殼510 而向彈性導電片560按壓。如此，在插座連接器322中， 螺栓305、螺母307及外殼510協動而形成相對於導電部 件540的按壓部。 再者，迴繞於外部導體610及内部導體620前端面的 21 200919877 樹脂形成連結部519,該連結部519使形成内側導向孔5i3 的樹脂與外殼510連結。藉此，可由—次過程而使整個外 殼510形成為一體。 由此’外部導體610及内部導體62〇盥 密著在一起，且形成接觸電阻低的電性連接。從而，形成 有自插座連接器322至板本體310的信號路徑。該錢路 徑構造且維持一定的特定阻抗，故可使高頻信號 低祕地傳播。另外，由於以多個突起部616與突起部必 而連接，故無需先前㈣_子（未圖示），其結果可改盖 所要傳送的錢的傳送品質，1可更高密度地排列。 另外’在多數情況下，外部導體61〇連接於包含上述 #號路㈣電路的基準電位，亦即接地電位。而且，外部 j <510的本體部犯形成為筒狀’且在與上述信號傳播 方1正交的各剖面上包圍内部導體62〇。藉此，阻止上述 ^虎路，亡的向外部的電磁輻射以及向内部進入雜音。因 此在提南了插座連接器322的導電部件54〇的密度的情 況下，防止串擾特性降低。 η =是表示其他實施形態的插座連接11 322中使用的 腿塞發片561的特性的示意性剖面圖。如該圖所示，該 4 Μ1為使導電材料分散於所有的絕緣性彈性材 料中的構造。但分散密度低，可看作絕緣體。 六缴1旦疋，在自表面受到按壓而產生了彈性壓縮變形時， Ϊ域密度變高’且僅限於受到按壓的 電阻變低。因此，如圖中所示，在受到外部導體 22 200919877 610及内部導體620的按壓時，僅限於被按壓的區域匸成 為導電性。另外’與被按壓的區域C相互之間未進行按壓 =區域A維持非導通性。因此，藉由外部導體61〇及内部 導體620所形成的導電性的區域c在非導電性的區域a的 作用下相互絕緣。 再者，亦可使用各向異性導電片來作為具有與上述彈 性導電片561類似的特性的其他部件，上述各向異性導電 片為在矽橡膠片等的片狀彈性體中，埋設有向其厚度方向 延伸的夕個金屬纖維的構造。各向異性導電片一方面在其 f度方向上具有高的導電性，另一方面在其面方向上具有 尚的絕緣性。因此’可—方面將自正面與背面相對爽持各 向異性導電片的導電部件540及板本體310相互連接，另 一方面使排列於各向異性導電片的面方向上的外部導體 610及内部導體620相互絕緣。 圖21是表示使用圖2〇所示的彈性導電片561所形成 的插座連接器322的電性連接構造的分解立體圖。如已進 行的說明，該插座連接器322中使用的彈性導電片561僅 限於受到按壓而彈性變形的區域A發揮導電性 。因此，如 圖中所不，彈性導電片561上，在受到外部導體61〇及内 部導體620的上端面按壓的區域上，形成有圖中黑色圓點 所示的導電性的區域A。 、在彈性導電片561的上表面上，已形成的導電性的區 域接觸到板本體310下表面的環形圖案346及通孔345而 形成電性連接。因此’形成自外部導體610及内部導體620 23 200919877 至板本體310連續的同轴狀信號路徑。 另外，根據上述構造，即使在彈性導電片561的内部 亦維持有同軸構造。因此，來自插座連接器322及板本體 310之間極微小的縫隙中的電磁輻射亦會降低。從而，插 座連接器322中的串擾特性得以提高，故亦有助於連接器 的高密度化。 #以上，使用實施形態說明了本發明，但本發明的技術 乾圍並不限定於上述實施形態巾記制賴。本領域技術 人員顯然瞭解，可對上述實施形態進行多種變更或改良。 由申請專利範圍中的記制確可知，經上述變更或改良後 的形態亦可包含於本發明的技術範圍，此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是示意性表示測試裝置1〇〇的全體構造的示圖。 圖2^表示將測試頭13〇局部放大的示圖。 圖3疋效能板300的立體圖。 圖4疋效能板300的垂直剖面圖。 圖5 ^表示將插塞連接器222的周圍局部放大的示圖。 圖6是表示將插塞連接器瓜單獨放大後自側面看到 的狀況的侧視圖。 圖7疋表不自上方俯視插塞連接器222的狀況的俯視 圖8 ^表示將同軸插塞440單獨放大的示圖。 圖疋表示自與紙面正交的方向看到的同軸插塞440 24 200919877 的狀況的示圖。 圖10是表示自板本體310侧看到的插座連接器322 的狀況的俯視圖。 圖11是表示將形成於外殼510上表面上的收容孔 515、517放大的示圖。 圖12是表示自下立仰視插座連接器322的狀況的仰視 圖。 圖13是表示將形成於外殼510下表面上的導向孔 511、513放大的示圖。 圖14是示意性表示插座連接器322的相對於板本體 310的安裝構造的示圖。 圖15是表示安裝於板本體310上的插座連接器322 的電性構造的分解立體圖。 圖16是安裝於板本體310的插座連接器322的一個特 定剖面的圖。 圖口是表示圖16所示剖面上的插座連接器322的内 部構造的剖面圖。 圖18是對安裝於板本體310的插座連接器322的其他 特定刻面的圖。 圖19疋表示圖a所示剖面上的插座連接器^^^的内 部構造的剖面圖。 圖2〇是表示彈性導電片561的其他構造的示意性剖面 圖。 圖21是表示其他實施形態的插座連接器322的電性構 25 200919877 造的分解立體圖。 【主要元件符號說明】 100:測試裝置 110 :主機 120 :電纜 130 :測試頭 132 :框體 134:接腳介面電路板 135 :編包線 136 :同軸電纜‘ 137 :芯線 138 :端子板 140 :元件插槽 150 ··處理機 152 :被測試元件 200 :介面板 210 :平板本體 212 :支持架 222:插塞連接器 300 :效能板 305 :螺栓 307 :螺母 310 :板本體 311、511、513、550、565 :導向孔 26 200919877 312 :外周部件 313、530 :螺孔 322、323 :插座連接器 341、342 :信號線路 343、344、345 :通孔 346 :環形圖案 410、 510 :外殼 411、 413 :外殼片 412 :凸部 414 :螺孔 420、520 :導向銷 430 :托架 440 :同轴插塞 442 :外部導體 444 :内部導體 446 :卡止爪 448 :中繼導體 512、515、517 :收容孔 519 :連結部 540 :導電部件 560、561 :彈性導電片 562、564 :導電區域 610 :外部導體 612、622 :本體部 27 200919877 614、624 :接觸部 616、626 :突起部 620 :内部導體 S! 、 S2 :線 A、C:區域 Z :虛線Fig. 18 is a view showing another specific view of the socket connector attached to the board body 31A. As shown in the figure, 'the surface of the socket connector 322' is not intersected by the contact portion 614 of the outer conductor 61 看到 seen inside the guide hole 511 and is orthogonal to the line & The cut section is shown in Fig. 19. Fig. 19 is a cross-sectional view showing the electrical connection structure of the receptacle connector 322 attached to the board body 31A of the section & As shown in the figure, in the inside of the casing 510, the outer conductors 610 and the projections 616 and 626 of the inner conductor 620 projecting upward from the upper surface of the casing 51 are respectively elastically deformed by pressing the elastic conductive sheets 560. As shown in the figure, on the portions of the outer conductor 61 and the inner conductor 620 where the contact portions 614 and 624 are not formed, in the case where the outer conductor 610 is inserted into the resin forming the outer casing 51, a part of the above resin is not present. The inner side of the contact portion 614 is brought into contact with the lower ends of the outer conductor 610 and the inner conductor 620. Therefore, the outer conductor 610 and the inner conductor 620 are caused to pass through the outer casing 510 by fastening the bolts 3〇5 and the nuts 307. Pressing on the elastic conductive sheet 560 In this way, in the socket connector 322, the bolt 305, the nut 307, and the outer casing 510 cooperate to form a pressing portion with respect to the conductive member 540. Further, the resin is wound around the outer conductor 610 and the front end surface of the inner conductor 620. In the joint portion 519, the resin forming the inner guide hole 5i3 is coupled to the outer casing 510. Thereby, the entire outer casing 510 can be integrally formed by the secondary process. Thus, the outer conductor 610 and the inner conductor 62 are closely attached. Together, and forming an electrical connection with low contact resistance, thereby forming a signal path from the socket connector 322 to the board body 310. The money path is constructed and maintains a certain specific impedance, so that the high frequency signal can be made low-key In addition, since the plurality of protrusions 616 and the protrusions are necessarily connected, the previous (four)_sub (not shown) is not required, and as a result, the transmission quality of the money to be transmitted can be changed, and 1 can be arranged at a higher density. In addition, in most cases, the outer conductor 61 is connected to the reference potential including the above-mentioned circuit of ##4, that is, the ground potential. Moreover, the body portion of the external j < 510 is morphed. It is a tubular shape and surrounds the inner conductor 62A in each of the cross sections orthogonal to the signal propagation side 1. Thereby, the above-mentioned electromagnetic radiation to the outside and the internal noise are prevented. In the case of the density of the conductive member 54A of the receptacle connector 322, the crosstalk characteristic is prevented from being lowered. η = is a schematic cross-sectional view showing the characteristics of the leg plug hair piece 561 used in the socket connector 11 322 of the other embodiment. As shown in the figure, the 4 Μ 1 is a structure in which a conductive material is dispersed in all of the insulating elastic materials, but the dispersion density is low and can be regarded as an insulator. When the surface is pressed and the elastic compression deformation occurs due to pressing from the surface, the density of the crucible is increased, and the resistance to be pressed is lowered. Therefore, as shown in the figure, when pressed by the outer conductor 22 200919877 610 and the inner conductor 620, only the pressed region is made conductive. Further, the pressing area C is not pressed with each other. The area A maintains non-conductivity. Therefore, the conductive region c formed by the outer conductor 61 and the inner conductor 620 is insulated from each other by the non-conductive region a. Further, an anisotropic conductive sheet may be used as another member having characteristics similar to those of the above-described elastic conductive sheet 561, and the anisotropic conductive sheet is embedded in a sheet-like elastic body such as a ruthenium rubber sheet. The structure of the metal fiber extending in the thickness direction. On the one hand, the anisotropic conductive sheet has high conductivity in the f-direction and on the other hand has excellent insulation in the surface direction. Therefore, the conductive member 540 and the plate body 310 which are opposite to the anisotropic conductive sheet from the front surface and the back surface are connected to each other, and the outer conductor 610 and the inner portion are arranged in the surface direction of the anisotropic conductive sheet. The conductors 620 are insulated from each other. Fig. 21 is an exploded perspective view showing the electrical connection structure of the receptacle connector 322 formed using the elastic conductive sheet 561 shown in Fig. 2B. As described above, the elastic conductive sheet 561 used in the receptacle connector 322 is limited to the conductive region A which is elastically deformed by pressing. Therefore, as shown in the figure, on the elastic conductive sheet 561, a conductive region A indicated by a black dot in the figure is formed in a region pressed by the upper end faces of the outer conductor 61 and the inner conductor 620. On the upper surface of the elastic conductive sheet 561, the formed conductive region contacts the annular pattern 346 and the through hole 345 of the lower surface of the plate body 310 to form an electrical connection. Thus, a coaxial signal path formed from the outer conductor 610 and the inner conductor 620 23 200919877 to the board body 310 is formed. Further, according to the above configuration, the coaxial structure is maintained even inside the elastic conductive sheet 561. Therefore, electromagnetic radiation from a very small gap between the receptacle connector 322 and the board body 310 is also reduced. Thereby, the crosstalk characteristics in the socket connector 322 are improved, which also contributes to the high density of the connector. Although the present invention has been described using the embodiments, the technical scope of the present invention is not limited to the above-described embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the embodiments described above. It is to be understood that the above-described changes or modifications may be included in the technical scope of the present invention, and the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view schematically showing the overall configuration of a test apparatus 1A. Fig. 2 is a view showing a partial enlargement of the test head 13A. 3 is a perspective view of the performance board 300. 4 is a vertical cross-sectional view of the performance board 300. FIG. 5 is a partially enlarged view showing the periphery of the plug connector 222. Fig. 6 is a side view showing a state in which the plug connector melon is separately enlarged and seen from the side. Fig. 7 is a plan view showing a state in which the plug connector 222 is not overlooked from above. Fig. 8 is a view showing a single enlarged view of the coaxial plug 440. Figure 疋 shows a view of the condition of the coaxial plug 440 24 200919877 seen from the direction orthogonal to the plane of the paper. FIG. 10 is a plan view showing the state of the receptacle connector 322 seen from the side of the board body 310. Fig. 11 is an enlarged view showing the receiving holes 515, 517 formed on the upper surface of the outer casing 510. Fig. 12 is a bottom view showing the state of the socket connector 322 from the bottom standing. Fig. 13 is an enlarged view showing guide holes 511, 513 formed on the lower surface of the outer casing 510. Fig. 14 is a view schematically showing a mounting configuration of the receptacle connector 322 with respect to the board body 310. FIG. 15 is an exploded perspective view showing an electrical structure of the receptacle connector 322 attached to the board body 310. Figure 16 is a view showing a specific cross section of the receptacle connector 322 attached to the board body 310. The drawing port is a cross-sectional view showing the internal structure of the receptacle connector 322 in the cross section shown in Fig. 16. Figure 18 is a view of other specific facets of the receptacle connector 322 mounted to the board body 310. Figure 19 is a cross-sectional view showing the internal structure of the receptacle connector of the cross section shown in Figure a. Fig. 2A is a schematic cross-sectional view showing another configuration of the elastic conductive sheet 561. Fig. 21 is an exploded perspective view showing the electrical structure 25 200919877 of the receptacle connector 322 according to another embodiment. [Main component symbol description] 100: Test device 110: Host 120: Cable 130: Test head 132: Frame 134: Pin interface circuit board 135: Package wire 136: Coaxial cable '137: Core wire 138: Terminal plate 140: Component slot 150 ··Processor 152 : Tested component 200 : Interface panel 210 : Flat body 212 : Support frame 222 : Plug connector 300 : Performance board 305 : Bolt 307 : Nut 310 : Plate body 311 , 511 , 513 550, 565: guide hole 26 200919877 312: outer peripheral member 313, 530: screw hole 322, 323: socket connector 341, 342: signal line 343, 344, 345: through hole 346: annular pattern 410, 510: housing 411 413: outer casing piece 412: convex portion 414: screw hole 420, 520: guide pin 430: bracket 440: coaxial plug 442: outer conductor 444: inner conductor 446: locking claw 448: relay conductor 512, 515 517: receiving hole 519: connecting portion 540: conductive member 560, 561: elastic conductive sheet 562, 564: conductive region 610: outer conductor 612, 622: body portion 27 200919877 614, 624: contact portion 616, 626: protrusion 620: inner conductor S!, S2: line A, C: area Z: dotted line