200916316 九、發明說明： 【發明所屬之技術領域] 持體上之 感光材料 積層體之 用基板係 體（感光性 例如，係 層與保護 通常，係 丨隔離隙而 .感光性樹 [片體在該 丨積層輥使 丨層剝離， •234667 號 本發明係關於將基板，與設置感光材料層於支 長條狀感光性網狀層饋送於一對壓接輥間，使該 層貼附於該基板，以製造感光性積層體之感光性 製造裝置及製造方法。 【先前技術】 例如液晶面板用基板、印刷配線用基板、PDP 將具有感光性樹脂層（感光材料層）之感光性薄片 網狀層）貼附於基板表面而構成。感光性薄片體， 在可撓性塑膠支持體上依順序層合感光性樹脂 膜。 使用於此種感光性薄片體之貼附的製造裝置， 採用將玻璃基板或樹脂基板等基板每隔一設定間 在積層輥間進行搬運，同時將與貼附於該基板之 脂層之範圍相對應的保護膜予以剝離之感光性薄 積層輥（lamination roll)間進行搬運之方式。藉由 感光性薄片貼附於基板後，支持體自感光性樹脂 而製造所望之感光性積層體（參照日本特開2 0 0 2 -公報）。 第12圖及第13圖係’藉由積層輥使感光性薄片體4貼 附於基板2狀態之感光性積層體之剖面圖及平面圖。感光 性薄片體4係形成，在保護膜6所剝離之剝離部份兩端部 200916316 至感光性樹脂層8爲止被切口之加工部位10a、10b，該等 加工部位l〇a、10b間之保護膜6被剝離之狀態，感光性樹 脂層8成爲貼附於基板2之狀態。在此情形，如圖1 3所示， 與自基板2雨端部突出之保護膜6之殘存部份一起使支持 體1 2在箭頭方向剝離，藉以使加工部位1 0a、1 Ob間之僅 有感光性樹脂層8殘存於基板2之狀態使支持體1 2剝離， 而可獲得所望之感光性積層體。 然而，感光性薄片體4，被積層輥加熱、壓接於基板2， 此際，已熔融感光性樹脂層8之一部份自加工部位1 0a、1 Ob 流入於保護膜6與基板2之間，造成保護膜6隔著感光性 樹脂層8黏接於基板2之事態。在此情形，則與保護膜6 之殘存部份一起使支持體1 2無法恰當的予以剝離。 又，發生此種事態時，不僅會製造出不良品之感光性積 層體，殘存之保護膜6會造成基板2等定位精度降低，或 依情形，亦有基板2因而破損之虞。進而，殘存之保護膜 6 —脫落，則造成製造感光性積層體之潔淨室內發生塵埃。 【發明內容】 本發明之目的係提供，在檢查保護膜之剝離狀態，可事 先迴避剝離後步驟中障礙之發生，同時，製造高品質感光 性積層體之感光性積層體之製造裝置及製造方法。 本發明係在支持體上饋送由感光材料層與保護膜依順序 層合所成長條狀感光性網狀層’將對應於該保護膜之剝離 部份與殘存部份之分界位置的加工部位，形成從該保護膜 200916316 至該感光材料層之部份，將該保護膜之該剝離部份剝離 後，與以設定間隔所供給之基板一起在用以加熱該長條狀 感光性網狀層之一對壓接輥間進行連續饋送，該基板間配 置該保護膜之該殘存部份，同時使該剝離部份之該感光材 料層貼附於該基板，接著，將該支持體與該殘存部份之該 保護膜一起進行剝離，而製造使該感光材料層貼附於該基 板之感光性積層體之製造裝置中，其特徵爲， 具備剝離狀態檢査部，其可檢查所製造之該感光性積層 體中該保護膜之剝離狀態，該剝離狀態檢査部具備：剝離 狀態檢測感知器，檢測與該支持體一起從該基板所剝離之 該保護膜之相對於該感光性積層體的剝離狀態， 移動機構，使該剝離狀態檢測感知器沿著該保護膜之該 加工部位移動，及 剝離狀態判定部，根據該剝離狀態檢測感知器所致該剝 離狀態之檢測結果，判定該保護膜的剝離狀態。 又，本發明係在支持體上饋送由感光材料層與保護膜依 順序層合所成長條狀感光性網狀層，將對應於該保護膜剝 離部份與殘存部份的分界位置之加工部位，形成於自該保 護膜至該感光材料層之部份，將該保護膜之該剝離部份剝 離後，與以設定間隔所供給之基板一起，在加熱該長的條 狀感光性網狀層之一對壓接輥間進行連續饋送，在該基板 間配置該保護膜之該殘存部份，同時使該剝離部份之該感 光材料層貼附於該基板，接著，將該支持體與該殘存部份 200916316 之該保護膜一起進行剝離，以製造使該感光材料層貼附於 該基板之感光性積層體，其特徵爲’具有： 使剝離狀態檢測感知器沿著該保護膜之該加工部位移 動，檢測與該支持體一起從該基板所剝離之該保護膜之相 對於該感光性積層體之剝離狀態的檢測步驟’與 根據該剝離狀態檢測感知器所致該剝離狀態之檢測結 果，判定該保護膜之剝離狀態的判定步驟。 在本發明，與保護膜一起自基板剝離支持體後，檢查保 護膜之剝離狀態，而可在剝離後之步驟中’可事先迴避保 護膜於殘存下，有發生之虞之障礙。又，於確認保護膜完 全剝離，進行在後步驟之處理，可迴避殘存之保護膜’或 作業中保護膜之脫落等所致障礙，可製造高品質的感光性 積層體。 由參照圖式之下述適當實施形態例之說明’將可更爲明 瞭上述目的，特徵及效果。 【實施方式】 第1圖係關於本實施形態之感光性積層體之製造裝置2〇 之槪略構成圖，此製造裝置20，係以液晶或有機EL用濾 色片等之製作步驟，進行將由設定之寬尺寸所成長條狀感 光性網狀層22之感光性樹脂層28(詳如後述）熱轉印（貼合） 於玻璃基板24之作業。 第2圖係使用於製造裝置20之長條狀感光性網狀層22 的剖面圖。此長條狀感光性網狀層22係，將可撓性底層膜 -10- 200916316 (支持體）26，感光性樹脂層（感光材料層）28 ’與保護膜30 予以層合而構成。 如第1圖所示，製造裝置20係具備：收容使長條狀感光 性網狀層22回捲成輥狀之感光性網狀層輥23,從感光性網 狀層輥23可饋送該長條狀感光性網狀層22之網狀層饋送 機構32;在所饋送之長條狀感光性網狀層22之保護膜30及 感光性樹脂層28之寬方向形成爲可切斷的2處分界部份的 半厚度切割部位（加工部位）34a、34b(參照第2圖）之加工機 構36;與將一部份具有非黏接部38a之黏接標籤38(參照第 3圖）黏接於保護膜30之標籤黏接機構40。 在標籤黏接機構40之下游，有配設：使長條狀感光性網 狀層22由節奏饋送變更爲連續饋送用之儲存機構42;自長 條狀感光性網狀層22使保護膜30以設定之長度間隔剝離 之剝離機構44 ;使玻璃基板24加熱至設定之溫度的狀態供 給於貼附位置之基板供給機構45;與將藉由該保護膜30之 剝離而暴露之感光性樹脂層28 —體地貼附於該玻璃基板 24之貼附機構46。 在貼附機構4 6中於貼附位置之上游附近，有配設對含有 半厚度切割部位34a，34b之長條狀感光性網狀層22進行 畫面攝影之攝影部47。製造裝置20係根據，攝影部47所 攝影之半厚度切割部位34a，Wb之畫面，計算相對於貼附 機構46之半厚度切割部位34a，34b之位置偏差量，進行 長條狀感光性網狀層22饋送量之修正。 -11 - 200916316 在網狀層饋送機構32之下游附近’配設有：貼附大略使 用完畢之長條狀感光性網狀層22後端；與新使用之長條狀 感光性網狀層22前端的貼附台49。在貼附台49之下游， 爲了控制感光性網狀層輥23之捲繞偏差所致寬方向之偏 差，故配設薄膜端末位置檢測器5 1 °在此’薄膜端末位置 調整，可使網狀層饋送機構3 2於寬方向移動’或附設使輥 組合之位置調整機構。 加工機構36係配置於，收容、回捲於網狀層饋送機構32 之感光性網狀層輥2 3之輥徑計算用之輥對5 0之下游。加 工機構36具備僅以距離Μ(第2圖）離隙之一對圓刃52a、 52b ° 圓刃52a、5 2b行進於長條狀感光性網狀層22之寬方向， 在夾持保護膜30殘存部份30b之設定的2處所之位置形成 半厚度切割部位34a、34b。此外，殘存部份30b前後之保 護膜30，係保護膜30被剝離之剝離部份30a。 如第2圖所示，半厚度切割部位34a、34b，至少有切斷 保護膜30及感光性樹脂層28之必要，實際上，圓刃52a、 5 2b之切入深度係設定以可切入至可撓性底層膜26爲止。 圓刃52a、52b係採用，在並不旋轉而被固定之狀態下，朝 向長條狀感光性網狀層22之寬方向移動來形成半厚度切 割部位3 4 a、3 4b之方式，或不致在該長條狀感光性網狀層 22上滑動而一邊旋轉一邊往該寬方向移動並形成該半厚度 切割部位34a，34b之方式。此半厚度切割部位34a、34b， -12- 200916316 例如除了採用使用到雷射光或超音波之切割方式以替代圓 刃52a' 52b，以外，亦可採用以刀刃，壓切刃（湯姆生 (Thomson)刃）等形成之方式。 半厚度切割部位34a ’ 34b ’係將感光性樹脂層28貼附於 玻璃基板24之際’例如可設定爲’自該玻璃基板24兩端 部進入各1 〇mm內側之位置之方式。此外’玻璃基板24間 保護膜30之殘存部份3Ob，後述在貼附機構46中作爲使感 光性樹脂層2 8如畫框般貼附於該玻璃基板2 4之際之光罩 而作用者。 標籤黏接機構40,係對應於玻璃基板24間而殘留保護膜 30之殘存部份30b，故供給使半厚度切割部位34b處之剝 離部份3 0 a與半厚度切割部位3 4 a處之剝離部份3 0 a爲連 接之黏接標籤3 8。 如第3圖所示，黏接標籤3 8係構成爲長方形，例如，以 與保護膜30相同之樹脂材料所形成。黏接標籤38，在中央 部具有不塗佈黏著劑之非黏接部（含微黏著）3 8 a，同時在此 非黏接部3 8 a兩側，亦即，在該黏接標籤3 8之長邊方向兩 端部，具有：黏接於前方之剝離部份30a的第1黏接部38b， 與黏接於後方之剝離部份30a的第2黏接部38c。 如第1圖所示，標籤黏接機構40具備：將最大7片之黏 接標籤38以設定之每一間隔離隙而爲可貼附之吸附墊54a 〜54g’同時在該吸附墊54a〜54g所致該黏接標籤38之貼 -13- 200916316 附位置，升降自如配置有自下方保持長條狀感光性網狀層 22用之台座56。 儲存機構42具備：爲了吸收上游側長條狀感光性網狀層 22之節奏搬運，與下游側之該長條狀感光性網狀層22之連 續搬運，之速度差，而具備有在箭頭方向爲搖動自如之跳 動 _ 60。 配置於儲存機構42下游之剝離機構44具備：遮斷長條 狀感光性網狀層22饋送側之張力變動，使貼合時張力予以 穩定化用之抽吸圓筒62。在抽吸圓筒62之附近，配置剝離 輥63，同時隔著此剝離輥63自長條狀感光性網狀層22以 銳角之剝離角所剝離之保護膜30，除去殘存部份30b而捲 繞於保護膜捲筒部64。 在剝離機構44之下游側配設，可賦予長條狀感光性網狀 層2 2張力之張力控制機構6 6。張力控制機構6 6係在滾筒 6 8之驅動作用下藉由張力跳動輥7 0之搖動變位，而可調整 長條狀感光性網狀層22之張力。此外，張力控制機構66， 可因應需要使用，或者可不要。 基板供給機構4 5具備：配設成可夾持玻璃基板2 4方式 之基板加熱部（例如，加熱器）74;與將此玻璃基板24於箭頭 Y方向搬運之搬運部76;與檢測玻璃基板24後端部之停止 位置之停止位置檢測感知器7 8。在基板加熱部7 4，可經常 監視玻璃基板24之溫度，在異常時，在搬運部76發生之 停止或警報之同時，發出異常資訊信號而使異常的玻璃基 -14- 200916316 板24在後步驟進行NG排出，在品質管理或生產管理等可 加以活用。在搬運部76，可配設圖未示出之空氣浮出板， 玻璃基板24浮出而在箭頭γ方向搬運。玻璃基板24之搬 運，亦可以輥式輸送機進行。 玻璃基板2 4之溫度測定，以在基板加熱部7 4內或正要 貼附位置進行爲佳。測定方法方面，除了接觸式（例如，熱 電對）以外，亦可爲非接觸式。 貼附機構46具備，在上下配設之同時，加熱至設定之溫 度之橡膠輥（壓接輥）80a、80b。在橡膠輥80a、80b，背輥 8 2a、82b爲滑接。一方之背輥82b，藉由構成輥箝夾部83 之加壓滾筒8 4而擠壓於橡膠輥8 〇 b側。 玻璃基板24係，藉由構成自貼附機構46朝向箭頭Y方 向延伸之搬運路的複數個基板搬運輥90a〜90d而被搬運。 在基板搬運輥90b、90c間，配設有在切斷玻璃基板24間 之長條狀感光性網狀層22，而將感光材料層貼附於玻璃基 板24之感光性積層體24a予以分離的切刀機構48。 在基板搬運輥90d之下游側配置，於層合複數感光性積 層體24a之狀態進行儲存之儲料機94，在此儲料機94，被 切刀機構48所分離之感光性積層體24a被機器人96所移 載。鄰接於儲料機94配置有，將殘存於感光性積層體24a 之可撓性底層膜26與保護膜30之殘存部份30b —起剝離 之剝離部98。剝離部98具有：吸附、保持玻璃基板24之 吸附盤1 02 ’與貼附於以吸附盤丨〇2所保持之玻璃基板24 -15- 200916316 的感光性樹脂層28,而自感光性樹脂層28使可撓性底層膜 26剝離之箝位器1〇〇。 接續於剝離部98配置有，在可撓性底層膜26被剝離之 感光性積層體24b中檢查保護膜30之剝離狀態的剝離狀態 檢査部104。 第4圖表示剝離狀態檢査部1 04之構成。剝離狀態檢査 部1 04具備，使感光性積層體24b由玻璃基板24側所支持 而在箭頭Z方向升降之升降部106,與藉由升降部106而移 動至上升端的感光性積層體24b之前後（相對於爲感光性積 層體24b之搬運方向的箭頭Y方向爲前後），所配設而檢測 保護膜30之剝離狀態的檢測部l〇8a、108b。 檢測部1 〇 8 a、1 0 8 b具備：配設於朝向與箭頭Y方向正交 之方向延伸之基台ll〇a、UOb之導軌112a、112b;與沿著 導軌112a、112b移動之檢查頭114a、114b。檢查頭114a、 1 1 4b具有，由圍繞有可能殘存於感光性積層體24b兩端部 之保護膜30之殘存部份30b的形狀所成拖架1 16a、1 16b ’ 在拖架116a、116b之上部，配設具備複數半導體雷射的半 導體雷射單元118a、1 18b ’在拖架1 16a、1 16b之下部’配 設與半導體雷射單元118a、118b相對向而接收雷射光束之 複數個受光元件120a、120b。 在此情形，導軌1 1 2 a、1 1 2 b及檢查頭1 1 4 a、1 1 4 b構成移 動機構，受光元件1 20a、1 20b構成剝離狀態檢測感知器。 -16 - 200916316 此外，在以上方式所構成之製造裝置20，有網狀層饋送 機構32、加工機構36、標籤黏接機構40、儲存機構42、 剝離機構4 4、張力控制機構6 6以及攝影部4 7配置於貼附 機構46上方，但是與此相反，從該網狀層饋送機構32至 該攝影部47爲止則配置於該貼附機構46下方，長條狀感 光性網狀層22之上下相反而使感光性樹脂層28貼附於玻 璃基板24下側之構成亦可，又，長條狀感光性網狀層22 之搬運路亦可構成爲直線狀。 製造裝置20內，隔著分隔壁122分隔成第1潔淨室124a 與第2潔淨室124b。在第1潔淨室124a，自網狀層饋送機 構32至張力控制機構66均予收容，在第2潔淨室124b， 則收容攝影部47以後之機構。第1潔淨室124a與第2潔 淨室124b係隔著貫通部126而連通。 第5圖表示剝離狀態檢査部1 04之控制電路部件。剝離 狀態檢査部1 0 4具有，在控制半導體雷射單元1 1 8 a、1 1 8 b 之同時，計算藉由受光元件120a、120b所受光之雷射光束 之光量資訊，供給於剝離狀態判定部128之控制部Π0。 又，控制部1 3 0係，控制升降驅動部1 3 2來驅動升降部升 降馬達1 34，在使升降部106升降之同時，控制檢查頭驅動 部1 3 6來驅動頭驅動馬達1 3 8，使檢查頭1 1 4 a、1 1 4b沿著 導軌1 12a、1 12b朝箭頭W方向移動。剝離狀態判定部128 係根據所計算雷射光束之光量資訊，判定自玻璃基板24之 -17- 200916316 保護膜30剝離狀態，其判定結果顯示於判定結果顯示部 140 ° 接著，就以上方式所構成之製造裝置20之動作，說明與 本發明相關之製造方法之關連性。 首先，自安裝於網狀層饋送機構32之感光性網狀層輥23 饋送長條狀感光性網狀層22。長條狀感光性網狀層22被搬 運至加工機構36。 < 在加工機構36係，圓刃52a、52b在長條狀感光性網狀 層22之寬方向移動，使該長條狀感光性網狀層22自保護 膜30切入感光性樹脂層28甚至可撓性底層膜26爲止，形 成僅以保護膜3 0殘存部份3 Ob之寬Μ離隙之半厚度切割部 位3 4a、3 4b (參照第2圖）。藉此，在長條狀感光性網狀層 22，設置夾持殘存部份30b前方之剝離部份30a與後方之 剝離部份30a(參照第2圖）。 此外’殘存部份3 0 b之寬Μ係以長條狀感光性網狀層2 2 (... 並不延伸爲前題，以供給於貼附機構46之橡膠輥80a、8Ob 間的玻璃基板24間之距離爲基準進行設定。又，以寬μ 所形成一組之半厚度切割部位3 4 a、3 4 b，係以貼附於玻璃 基板2 4之感光性樹脂層2 8基準長度之間隔形成於長條狀 感光性網狀層22。 接著’長條狀感光性網狀層2 2，被搬運至標籤黏接機構 40 ’保護膜30之設定之貼附部位被配置於台座56上。在 標籤黏接機構4 0，設定片數之黏接標籤3 8被吸附墊5 4 a〜 -18- 200916316 5 4g所吸附保持，各黏接標籤3 8跨越保護膜30之 30b，一體地黏接於前方剝離部份 30a與後方^ 3 0 a (參照第3圖）。 例如，黏接有7片黏接標籤3 8之長條狀感光 22，如第1圖所示，在隔著儲存機構42防止饋送 動後，被連續地搬運至剝離機構44。在剝離機構 狀感光性網狀層22之可撓性底層膜26被吸附、 吸圓筒62,同時保護膜30殘留有殘存部份30b而 狀感光性網狀層22剝離。此保護膜30係隔著剝离 剝離並被捲繞於保護膜捲筒部64 (參照第1圖）。 在剝離機構44之作用下，保護膜30殘留有殘存 而自可撓性底層膜2 6剝離後，長條狀感光性網狀 張力控制機構66進行張力調整，接著，在攝影茜 以設定之攝影時機進行含有半厚度切割部位3 4 a、 條狀感光性網狀層22之畫面攝影。 通過攝影部47之長條狀感光性網狀層22,在搬 機構46，進行相對於玻璃基板24之感光性樹脂Ji 印處理（貼合）。在此情形，根據攝影部47所攝影 切割部位34a、34b之畫面，在貼附機構46中調 切割部位34a ’ 34b之位置。 在貼附機構46，當初係設定成橡膠輥80a、80b 態，在橡膠輥80a、8Ob間設定之位置長條狀感光 22之半厚度切割部位34a爲經定位之狀態中，長 殘存部份 糾離部份 性網狀層 側張力變 44，長條 保持於抽 自該長條 隹輥63而 :部份3 0 b 層2 2，以 "7中， 34b之長 運至貼附 隊2 8之轉 之半厚度 整半厚度 離隙之狀 性網狀層 條狀感光 -19- 200916316 性網狀層22之搬運暫時被停止。此狀態中，藉由構成基板 供給機構45之基板加熱部74而加熱至所設定溫度之玻璃 基板24前端部以搬運部76搬入橡膠輥80a、80b間時，在 加壓滾筒84之作用背輥82b及橡膠輥80b上升，在橡膠輥 80a、80b間以玻璃基板24及長條狀感光性網狀層22在所 設定之壓機壓力下被夾持。此外，橡膠輥80a、80b係加熱 至設定之貼合溫度。 接著，使橡膠輥80a、80b旋轉，玻璃基板24及長條狀 感光性網狀層22於箭頭Y方向搬運。結果，感光性樹脂層 28被加熱熔融而被轉印（貼合）至玻璃基板24。 此外，貼合條件方面，速度爲l.〇m/min〜10.0m/min，橡 膠輥80a、80b之溫度爲80°C〜150°C，該橡膠輥80a，80b 之橡膠硬度爲40度〜90度，該橡膠輥80a、80b之壓機壓 力（線壓）爲 50N/cm 〜400N/cm。 相對於玻璃基板24使長條狀感光性網狀層22之一片份 之貼合完成時，一面使橡膠輥80a、80b之旋轉停止，一面 使貼合有長條狀感光性網狀層22之玻璃基板24前端部則 被基板搬運輥90a所箝夾。此時，在橡膠輥80a，80b間之 設定位置，配置有半厚度切割部位3 4b。 接著，橡膠輥80b，自橡膠輥80a朝向離隙之方向退避而 解除箝夾，同時基板搬運輥9 0 a之旋轉於低速下再次開始 進行，長條狀感光性網狀層22貼合於玻璃基板24之感光 性積層體於箭頭Y方向僅對應於保護膜30之殘存部份30b -20- 200916316 之寬Μ的距離被搬運，其次之半厚度切割部位3 4 a被 至橡膠輕80a下方附近之設定之位置後’橡膠輕80a、 之旋轉停止。此外，使長條狀感光性網狀層2 2僅在半 切割部位34a、34b間進行搬運處理者，以下稱爲「基 饋送」。 一方面，在前述狀態中，隔著基板供給機構45，其 玻璃基板24朝向貼附位置搬運。以上之動作重覆進行 連續製造感光性積層體。 此際，感光性積層體，各自之端部被第2圖所示保 30之殘存部份30b所覆蓋。因此，感光性樹脂層28被 於玻璃基板24之際，橡膠輥80a、80b並不被該感光 脂層28所污染。 因貼附機構46而貼附感光性樹脂層2 8之玻璃基板 在以貼附機構46使長條狀感光性網狀層22進行基板 送後，一旦在停止狀態時，藉由配設於基板搬運輥90b 間之切刀機構48來切斷玻璃基板24間之長條狀感光 狀層22，而成爲感光性積層體24a。此外，在此感光 層體24a之前後，有殘存部份30b之保護膜30。 被分離之感光性積層體24a，係藉由機器人96暫時 於儲料機94。接著，層合於儲料機94之感光性積層體 在移載於剝離部9 8後，玻璃基板2 4被吸附盤1 0 2所15 保持’端部之可撓性底層膜2 6以箝位器1 0 0把持而自 搬運 80b 厚度 板間 次之 ，可 護膜 轉印 性樹 24， 間饋 、90c 性網 性積 層合 24a， &附、 感光 •21 - 200916316 性積層體24a剝離，可製造僅感光性樹脂層28貼附於玻璃 基板24之感光性積層體24b » 在此，自感光性積層體24a剝離可撓性底層膜26之際， 保護膜3 0之殘存部份3 Ob之一部份並不剝離而有殘存於感 光性積層體24a側之虞。亦即，貼附機構46中，在使長條 狀感光性網狀層22加熱、壓接於玻璃基板24之際，在殘 存部份30b與玻璃基板24之間有已熔融之感光性樹脂層28 流入，造成殘存部份30b黏接於玻璃基板24時，會有殘存 部份30b無法正常地自玻璃基板24剝離之虞。 因此，在剝離部98中可撓性底層膜26被剝離而所製造 之感光性積層體24b，被搬運至剝離狀態檢査部1 〇4，進行 保護膜3 0之剝離狀態之檢査。關於此檢査處理，依照第6 圖所示流程圖加以說明。 剝離狀態檢査部1 04在檢測到感光性積層體24b之搬入 時（步驟S 1 )，配設於剝離狀態檢査部1 〇 4之升降部1 〇 6抵 接於玻璃基板2 4之下面部使感光性積層體2 4 b以吸附等方 式來保持（步驟S 2)。接著，控制部1 3 0係控制升降驅動部 1 3 2來驅動升降部升降馬達1 3 4，在使升降部1 〇 6朝箭頭Z 方向移動使感光性積層體24b上升（步驟S3)。 此外，在剝離狀態檢査部1 04於搬運感光性積層體24b 之輸送器間配設銷（p i η)構件以代替升降部1 〇 6，使銷構件 上升而使感光性積層體24b朝向箭頭Ζ方向移動之方式亦 ° -22- 200916316 感光性積層體24b移動至上升端爲止而停止後，控制部 130驅動半導體雷射單元U8a、118b，輸出雷射光束並導 至受光元件120a、120b(步驟S4)。受光元件120a、120b， 係以經受光之雷射光束之光量作爲電氣信號而供給於控制 部 1 3 0。 一方面’與雷射光束之輸出並行，控制部1 3 0係控制檢 查頭驅動部1 3 6來驅動頭驅動馬達1 3 8，使檢査頭1 1 4 a、 1 14b沿著導軌1 12a、1 12b朝向箭頭W方向移動（步驟S5)。 藉此，自半導體雷射單元1 18a、1 18b所輸出之雷射光束， 係使感光性積層體2 4 b朝箭頭W方向掃猫，同時隔著感光 性積層體24b之兩端部側被導至受光元件1 20a、1 2Ob。 控制部130係，藉由受光元件120a、120b所檢測之雷射 光束之光量資訊以檢查頭114a、114b之每一移動位置計算 (步驟S 6)。在此情形，在每一移動位置，藉由各檢查頭114a、 1 1 4b加上所檢測之光量資訊之値時，感光性積層體24b之 位置在檢測部108a、108b間在箭頭Y方向即使有所偏差， 亦可將因位置偏差所致光量資訊變動之影響抑到最小。 又，亦可相對於移動方向加上光量資訊之値。計算之光量 資訊，則供給於剝離狀態判定部1 28。 檢查頭114a、114b移動至導軌112a、112b之端部爲止在 完成光量資訊之取得後，控制部130，係驅動升降部106 使感光性積層體24b下降（步驟S7)。接著，使檢查頭1 14a、 114b回歸於移動開始前之原點（步驟S 8)。 -23- 200916316 一方面’自控制部1 3 0所供給光量資訊之剝離狀態判定 部1 28 ’根據光量資訊進行感光性積層體24b之剝離狀態之 判定（步驟S9)。在此情形’剝離狀態之判定，係使光量資 訊與設定之臨界値進行大小比較，根據其比較結果來進行。 弟7圖係表不剝離部98中’與可擦性底層膜26 —起殘 存於玻璃基板2 4兩端部之保護膜3 0正常地剝離狀態之感 光性積層體24b。在此情形，自半導體雷射單元1 18a、1 18b 所輸出之雷射光束，僅透過玻璃基板24而以受光元件 120a、120b受光，故剝離狀態用之臨界値則設定於，僅透 過玻璃基板24之雷射光束之光量，與透過殘存有保護膜30 之玻璃基板24的雷射光束之光量間之値，光量資訊在此臨 界値之範圍內時，可判定爲「正常品」。 第8圖係在剝離部9 8中，表示因剝離誤失等不使可撓性 底層膜26剝離之狀態的感光性積層體24a。在此情形，自 半導體雷射單元118a、118b所輸出之雷射光束，係透過可 撓性底層膜26、感光性樹脂層28、保護膜30及感光性積 層體2 4b而藉由受光元件120a、12 0b受光，經受光之雷射 光束之光量衰減，將根據此光量之光量資訊，與以正常狀 態爲基準而設定之該臨界値比較之情形，因不在其範圍 內’故可判定爲「不良品」。 第9圖係表示，在剝離部9 8中，在一方之保護膜3 0與 玻璃基板24之間藉由經熔融之感光性樹脂層2 8流入等， 而使保護膜3 0之一部份爲殘存狀態之感光性積層體24b。 -24- 200916316 在此情形，因藉由殘存之保護膜3 0使得雷射光束之光量衰 減，故若使該臨界値適切地設定，可使其狀態判定爲「不 良品」。 第10圖表示，如第9圖方式殘存著之保護膜30包繞於 玻璃基板24之相反側之狀態的感光性積層體24b。此情形 中，與第9圖之情形同，可判定感光性積層體24b爲「不 良品」。 如上述判定剝離狀態之結果，係顯示於判定結果顯示部 140(步驟S10)，可因應需要操作者以警報音等加以警告。 在步驟S 9中’在判定爲「正常品」之情形（步驟S 1 1)， 感光性積層體24b，係自剝離狀態檢査部1 〇4搬運至其次之 步驟，例如，搬運至，使感光性積層體24b曝光形成設定 之圖型於感光性樹脂層2 8的處理步驟（步驟S 1 2)。一方面， 在判定爲「不良品」之情形，則使感光性積層體24b自剝 離狀態檢査部104排出（步驟S 13)。藉此，可迴避在正常品 有不良品混在其中之事態。 第11圖係其他實施形態之製造裝置2 00之槪略構成圖。 此外’在與第1圖所示製造裝置20相同之構成要素，賦予 相同參照符號，省略其說明。 在製造裝置200，係藉由貼附機構46貼附有長條狀感光 性網狀層22之玻璃基板24，並不被截斷而搬運至冷卻部 202並冷卻後，供給於剝離部204。在剝離部204，藉由推 進器206使玻璃基板24間之長條狀感光性網狀層22朝上 -25- 200916316 方向推升，使保護膜30之剝離成爲容易的狀態後’保護膜 3 0自感光性樹脂層2 8剝離，與支持體2 6 —起以捲繞輥20 8 捲繞。藉此，玻璃基板2 4間分離’而可製造感光性積層體 24b。所製造之感光性積層體24b ’與製造裝置20之情形相 同，藉由剝離狀態檢査部1 04進行保護膜30之剝離狀態之 檢査。 此外，在上述之實施形態，作爲剝離狀態檢測感知器’ 係使用接收雷射光束檢測其光量之受光元件120a、120b’ 例如，亦可使用箝夾感光性積層體24b而檢測厚度之接觸 式厚度檢測感知器。又’亦可利用使用雷射變位計在感光 性積層體24b之端部中檢測高低差之高低差檢測感知器。 又，將自1支感光性網狀層輥23所供給之長條狀感光性 網狀層22貼附於玻璃基板24,而可構成爲所謂製造一標樁 之感光性積層體24b之方式，亦可例如，自2支感光性網 狀層輥或3支以上感光性網狀層輥供給長條狀感光性網狀 層22而貼附於玻璃基板24，構成所謂製造二標樁，三標樁 等感光性積層體24b之方式。 【圖式簡單說明】 第1圖係關於本實施形態之製造裝置的槪略構成圖。 第2圖係關於本實施形態之使用於製造裝置之長條狀感 光性網狀層的剖面圖。 第3圖係黏接標籤黏接於長條狀感光性網狀層之狀態說 明圖。 -26- 200916316 第4圖係剝離狀態檢査部的構成圖。 第5圖係剝離狀態檢査部的控制電路圖。 第6圖係剝離狀態之檢査處理的流程圖。 第7圖係在正常剝離狀態之感光性積層體的說明圖。 第8圖係可撓性底層膜並不剝離之不良狀態的說明圖。 第9圖係殘存著保護膜之一部份之不良狀態的說明圖。 第1 0圖係殘存著保護膜之一部份之不良狀態的說明圖。 , 第11圖係關於其他實施形態之製造裝置的槪略構成圖。 i 第1 2圖係習知技術中在基板貼附感光性薄片體之狀態 之感光性積層體的剖面圖。 第1 3圖係習知技術中，在基板貼附感光性薄片體之狀態 之感光性積層體的平面圖。 【主要元件符號說明】 20、 200 製 造 裝 置 22 長 條 狀 感 光 性網狀層 24 玻 璃 基 板 24a ' 24b 感 光 性 積 層 體 26 可 撓 性 底 層 膜 28 感 光 性 樹 脂 層 30 保 護 膜 30a 剝 離 部 份 30b 殘 存 部 份 34a 、34b 加 工 部 位 -27- 200916316 46 貼 附 機 構 8 0a、 80b 橡 膠 輥 98、 204 剝 離 部 106 升 降 部 108a 、108b 檢 測 部 1 14a > 114b 檢 查 頭 118a ' 118b 半 導 體 雷 射 單 元 120a 、120b 受 光 元 件 128 剝 離 狀 態 判 定 部 130 控 制 部 140 判 定 結 果 顯 示 部200916316 IX. Description of the invention: [Technical field of the invention] A substrate system for a photosensitive material laminate body on a holding body (photosensing, for example, a layer and a protection layer are usually used for the isolation gap. Photosensitive trees The raking layer roll peels off the ruthenium layer, and the present invention relates to feeding a substrate between the substrate and the photosensitive material layer in a strip-shaped photosensitive mesh layer between a pair of crimping rolls, and attaching the layer to the layer A substrate for producing a photosensitive laminate and a method for producing the photosensitive laminate. [Prior Art] For example, a substrate for a liquid crystal panel, a substrate for a printed wiring, and a PDP, a photosensitive sheet having a photosensitive resin layer (photosensitive material layer) The layer) is attached to the surface of the substrate. In the photosensitive sheet, a photosensitive resin film is laminated in this order on the flexible plastic support. In a manufacturing apparatus for attaching such a photosensitive sheet, a substrate such as a glass substrate or a resin substrate is transported between stack rolls at intervals of a setting, and a range of a fat layer attached to the substrate is applied. A method in which a corresponding protective film is conveyed between a photosensitive thin lamination roll which is peeled off. After the photosensitive sheet is attached to the substrate, the support is used to produce a photosensitive laminate from a photosensitive resin (see JP-A-2000). Fig. 12 and Fig. 13 are a cross-sectional view and a plan view of a photosensitive laminate in which the photosensitive sheet 4 is attached to the substrate 2 by a build-up roll. The photosensitive sheet 4 is formed, and the processed portions 10a and 10b which are notched at the end portions of the peeling portion from the peeling portion of the protective film 6 from 200916316 to the photosensitive resin layer 8 are protected between the processed portions 10a and 10b. In a state in which the film 6 is peeled off, the photosensitive resin layer 8 is attached to the substrate 2. In this case, as shown in Fig. 13, together with the remaining portion of the protective film 6 projecting from the rain end portion of the substrate 2, the support 1 2 is peeled off in the direction of the arrow, whereby only the processing portion 10a, 1 Ob is When the photosensitive resin layer 8 remains on the substrate 2, the support 1 2 is peeled off, and the desired photosensitive laminate can be obtained. However, the photosensitive sheet 4 is heated and pressure-bonded to the substrate 2 by the laminating roller, and a part of the molten photosensitive resin layer 8 flows into the protective film 6 and the substrate 2 from the processed portion 10a, 1 Ob. In the meantime, the protective film 6 is adhered to the substrate 2 via the photosensitive resin layer 8. In this case, the support body 12 cannot be properly peeled off together with the remaining portion of the protective film 6. Further, when such a situation occurs, not only a photosensitive laminate of defective products is produced, but also the remaining protective film 6 causes a decrease in the positioning accuracy of the substrate 2 or the like, and depending on the case, the substrate 2 may be damaged. Further, when the remaining protective film 6 is detached, dust is generated in the clean room where the photosensitive laminate is produced. SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing apparatus and a manufacturing method for producing a photosensitive laminated body of a high-quality photosensitive laminated body by inspecting a peeling state of a protective film in advance, thereby avoiding occurrence of an obstacle in a post-peeling step. . In the present invention, a strip-shaped photosensitive mesh layer which is formed by sequentially laminating a photosensitive material layer and a protective film on a support, and a processing portion corresponding to a boundary position between the peeled portion and the remaining portion of the protective film, Forming a portion from the protective film 200916316 to the photosensitive material layer, peeling off the peeled portion of the protective film, and heating the long photosensitive photosensitive layer together with the substrate supplied at a predetermined interval Continuously feeding between a pair of pressure rollers, wherein the remaining portion of the protective film is disposed between the substrates, and the photosensitive material layer of the peeling portion is attached to the substrate, and then the support and the remaining portion are attached The protective film is peeled off together to produce a photosensitive laminate in which the photosensitive material layer is attached to the substrate, and is characterized in that it has a peeling state inspection unit that can inspect the photosensitive property produced. a peeling state of the protective film in the laminated body, the peeling state inspection unit including a peeling state detecting sensor, and detecting a peeling of the protective film from the substrate together with the support a peeling state of the photosensitive laminate, a moving mechanism that moves the peeling state detecting sensor along the processing portion of the protective film, and a peeling state determining unit that detects a peeling state detection result by the sensor based on the peeling state The peeling state of the protective film was determined. Further, in the present invention, a strip-shaped photosensitive mesh layer which is formed by sequentially laminating a photosensitive material layer and a protective film on a support, and a processing portion corresponding to a boundary position between the peeled portion of the protective film and the remaining portion is fed onto the support. Forming a portion from the protective film to the photosensitive material layer, peeling off the peeled portion of the protective film, and heating the long strip-shaped photosensitive mesh layer together with the substrate supplied at a predetermined interval Continuously feeding between the pressure roller, disposing the remaining portion of the protective film between the substrates, and attaching the photosensitive material layer of the peeling portion to the substrate, and then supporting the support body The protective film of the remaining portion 200916316 is peeled off together to produce a photosensitive laminate in which the photosensitive material layer is attached to the substrate, and is characterized by: having: processing the peeling state detecting sensor along the protective film Moving the part, detecting a step of detecting the peeling state of the protective film from the substrate together with the support with respect to the photosensitive laminate; and detecting the sensor according to the peeling state The state of peeling of the detection result, the determination of the protective film is peeled state decision step. In the present invention, after the support is peeled off from the substrate together with the protective film, the peeling state of the protective film is inspected, and in the step after peeling, the protective film can be prevented from remaining in advance, and the obstacle is likely to occur. In addition, it is confirmed that the protective film is completely peeled off, and the treatment in the subsequent step is performed to avoid the obstacle caused by the remaining protective film ’ or the protective film falling during the operation, and a high-quality photosensitive laminate can be produced. The above objects, features and effects will become more apparent from the following description of the preferred embodiments of the drawings. [Embodiment] FIG. 1 is a schematic configuration diagram of a manufacturing apparatus 2 for a photosensitive laminate according to the present embodiment, and the manufacturing apparatus 20 is a manufacturing step of a liquid crystal or an organic EL color filter. The photosensitive resin layer 28 (described later in detail) of the strip-shaped photosensitive mesh layer 22 which is formed in a wide size is thermally transferred (bonded) to the operation of the glass substrate 24. Fig. 2 is a cross-sectional view of the long photosensitive web layer 22 used in the manufacturing apparatus 20. The long-length photosensitive mesh layer 22 is formed by laminating a flexible underlayer film -10-200916316 (support) 26, a photosensitive resin layer (photosensitive material layer) 28', and a protective film 30. As shown in Fig. 1, the manufacturing apparatus 20 is provided with a photosensitive mesh layer roll 23 for accommodating the long photosensitive web layer 22 into a roll shape, which can be fed from the photosensitive mesh layer roll 23 The mesh layer feeding mechanism 32 of the strip-shaped photosensitive mesh layer 22; the two sides of the protective film 30 and the photosensitive resin layer 28 of the fed long-length photosensitive mesh layer 22 are formed to be cuttable The processing mechanism 36 of the half-thickness cutting portion (machining portion) 34a, 34b (refer to FIG. 2) of the boundary portion; and the bonding label 38 (refer to FIG. 3) which has a portion of the non-adhesive portion 38a The label bonding mechanism 40 of the protective film 30. Downstream of the label bonding mechanism 40, there is a configuration in which the long photosensitive photosensitive layer 22 is changed from a rhythm feed to a storage mechanism 42 for continuous feeding; and the protective film 30 is formed from the long strip-shaped photosensitive mesh layer 22. a peeling mechanism 44 that is peeled off at a set length; a substrate supply mechanism 45 that is supplied to the attaching position in a state where the glass substrate 24 is heated to a set temperature; and a photosensitive resin layer that is exposed by peeling off the protective film 30 28 is attached to the attachment mechanism 46 of the glass substrate 24 . In the attaching mechanism 46, near the upstream of the attaching position, there is disposed an imaging unit 47 for performing a screen image on the long photosensitive web layer 22 including the half-thickness cutting portions 34a and 34b. The manufacturing apparatus 20 calculates a positional deviation amount with respect to the half thickness cutting portions 34a and 34b of the attaching mechanism 46 based on the screen of the half thickness cutting portions 34a and Wb photographed by the photographing unit 47, and performs a long strip-shaped photosensitive mesh. Correction of the amount of feed of layer 22. -11 - 200916316 In the vicinity of the downstream of the mesh layer feeding mechanism 32, 'the rear end of the long strip-shaped photosensitive mesh layer 22 is attached; and the newly used long strip photosensitive web layer 22 is attached. Attachment table 49 at the front end. Downstream of the attachment table 49, in order to control the deviation of the width direction caused by the winding deviation of the photosensitive mesh layer roller 23, the film end position detector 5 1 ° is disposed at this end of the film end position adjustment, so that the net can be adjusted. The layer feeding mechanism 32 moves in the width direction or attaches a position adjusting mechanism that combines the rollers. The processing mechanism 36 is disposed downstream of the roller pair 50 for accommodating and rewinding the roll diameter of the photosensitive mesh layer roller 23 of the mesh layer feeding mechanism 32. The processing mechanism 36 is provided with only one of the distance Μ (Fig. 2) of the relief, the rounded edges 52a, 52b, the rounded edges 52a, 5 2b, which travel in the width direction of the elongated photosensitive mesh layer 22, and the protective film is held. The positions of the two locations of the 30 remaining portions 30b are formed into half-thickness cutting portions 34a and 34b. Further, the protective film 30 before and after the remaining portion 30b is a peeling portion 30a from which the protective film 30 is peeled off. As shown in Fig. 2, the half-thickness cutting portions 34a and 34b are required to cut at least the protective film 30 and the photosensitive resin layer 28. Actually, the cutting depths of the rounded edges 52a and 52b are set so as to be cuttable. The flexible underlayer film 26 is completed. The rounded edges 52a and 52b are formed by moving in the width direction of the long-length photosensitive mesh layer 22 in a state of being fixed without being rotated, thereby forming a half-thickness cutting portion 3 4 a, 3 4b, or not The semi-thickness photosensitive mesh layer 22 is slid and moved in the width direction while rotating to form the half thickness cut portions 34a and 34b. The half-thickness cutting portion 34a, 34b, -12-200916316, for example, in addition to the use of a laser or ultrasonic cutting method instead of the round blade 52a' 52b, may also be used with a blade, a cutting edge (Thomson (Thomson) ) The way in which the blade is formed. When the photosensitive resin layer 28 is attached to the glass substrate 24, the half-thickness dicing portion 34a' 34b' can be set, for example, to a position from the both end portions of the glass substrate 24 to the inner side of each 〇mm. In addition, the remaining portion 3Ob of the protective film 30 between the glass substrates 24 is used as a mask for attaching the photosensitive resin layer 28 to the glass substrate 24 as a picture frame in the attaching mechanism 46, which will be described later. . The label bonding mechanism 40 retains the remaining portion 30b of the protective film 30 corresponding to the glass substrate 24, so that the peeling portion 30a at the half thickness cutting portion 34b and the half thickness cutting portion 3 4a are supplied. The stripped portion 30 a is the attached adhesive label 38. As shown in Fig. 3, the adhesive label 38 is formed in a rectangular shape, for example, formed of the same resin material as the protective film 30. The adhesive label 38 has a non-adhesive portion (including micro-adhesive portion) 3 8 a which is not coated with an adhesive at the central portion, and is on both sides of the non-adhesive portion 38 a, that is, at the adhesive label 3 Both ends of the longitudinal direction of 8 have a first adhesive portion 38b that is adhered to the front peeling portion 30a, and a second adhesive portion 38c that is adhered to the rear peeling portion 30a. As shown in Fig. 1, the label bonding mechanism 40 is provided with a maximum of seven sheets of adhesive labels 38 to be attached to each of the spacers to be attached to the adsorption pads 54a to 54g' at the same time. The adhesive tape 38 is attached to the adhesive label 38. The position of the adhesive label 38 is attached to the pedestal 56 for holding the long strip-shaped photosensitive mesh layer 22 from below. The storage mechanism 42 is provided with a speed difference between the long-length photosensitive web layer 22 on the downstream side and the speed in the direction of the arrow in order to absorb the rhythm transport of the upstream long strip-shaped photosensitive mesh layer 22 For shaking, _ 60. The peeling mechanism 44 disposed downstream of the storage mechanism 42 is provided with a suction cylinder 62 for blocking the tension fluctuation on the feed side of the long photosensitive web layer 22 and stabilizing the tension at the time of bonding. In the vicinity of the suction cylinder 62, the peeling roller 63 is disposed, and the protective film 30 peeled off from the long-length photosensitive mesh layer 22 at an acute angle peeling angle is separated by the peeling roller 63, and the remaining portion 30b is removed and rolled. Wrap around the protective film roll portion 64. A tension control mechanism 66 that can supply the tension of the long photosensitive web layer 2 2 is disposed on the downstream side of the peeling mechanism 44. The tension control mechanism 6 6 can adjust the tension of the long photosensitive web layer 22 by the rocking displacement of the tension dancer roller 70 under the driving action of the roller 68. Further, the tension control mechanism 66 may be used as needed or may not be required. The substrate supply mechanism 45 includes a substrate heating unit (for example, a heater) 74 that can hold the glass substrate 24, a transport unit 76 that transports the glass substrate 24 in the arrow Y direction, and a detection glass substrate. The stop position detecting sensor 78 of the stop position of the rear end portion of the 24th portion. In the substrate heating unit 704, the temperature of the glass substrate 24 can be constantly monitored. When an abnormality occurs, the abnormality information signal is emitted while the conveyance unit 76 is stopped or alarmed, and the abnormal glass base-14-200916316 board 24 is behind. The step is to perform NG discharge, and it can be used in quality management or production management. An air floating plate (not shown) may be disposed in the conveying portion 76, and the glass substrate 24 floats and is conveyed in the direction of the arrow γ. The transport of the glass substrate 24 can also be carried out by a roller conveyor. It is preferable that the temperature of the glass substrate 24 is measured in the substrate heating portion 74 or at the position to be attached. In terms of the measurement method, in addition to the contact type (for example, a thermoelectric pair), it may be non-contact type. The attaching mechanism 46 is provided with rubber rolls (crimping rolls) 80a and 80b which are heated to a set temperature while being disposed above and below. In the rubber rollers 80a, 80b, the back rollers 8 2a, 82b are slidably connected. The one side back roller 82b is pressed against the rubber roller 8 〇 b side by the pressure roller 84 which constitutes the roller jaw portion 83. The glass substrate 24 is conveyed by a plurality of substrate conveyance rollers 90a to 90d constituting a conveyance path extending from the attachment mechanism 46 toward the arrow Y. Between the substrate conveyance rollers 90b and 90c, a long photosensitive web layer 22 between the glass substrates 24 is disposed, and the photosensitive material layer is attached to the photosensitive laminate 24a of the glass substrate 24 to be separated. Cutter mechanism 48. The stocker 94 which is disposed in the state in which the plurality of photosensitive laminates 24a are stacked is disposed on the downstream side of the substrate conveyance roller 90d, and the photosensitive layered body 24a separated by the cutter mechanism 48 is placed in the stocker 94. The robot 96 is transferred. Adjacent to the stocker 94, a peeling portion 98 that peels off the flexible underlayer film 26 remaining in the photosensitive laminated body 24a and the remaining portion 30b of the protective film 30 is disposed. The peeling portion 98 has a suction disk 102' that adsorbs and holds the glass substrate 24, and a photosensitive resin layer 28 attached to the glass substrate 24-15-200916316 held by the adsorption cartridge 2, and a self-photosensitive resin layer. 28 A clamper 1 for peeling off the flexible underlayer film 26. In the peeling portion 98, a peeling state inspection portion 104 for inspecting the peeling state of the protective film 30 in the photosensitive laminate 24b from which the flexible underlayer film 26 is peeled off is disposed. Fig. 4 shows the configuration of the peeling state inspection unit 104. The peeling state inspection unit 104 includes the lifter portion 106 that supports the photosensitive laminate 24b on the glass substrate 24 side and that moves up and down in the arrow Z direction, and the photosensitive laminate 24b that has been moved to the rising end by the lifter 106. (The front and rear directions of the arrow Y in the conveyance direction of the photosensitive laminated body 24b are the front and rear sides), and the detection parts 10a and 108b which detect the peeling state of the protective film 30 are arrange|positioned. The detecting unit 1 〇 8 a and 1 0 8 b are provided with guide rails 112a and 112b disposed on the bases 〇a and U0b extending in the direction orthogonal to the arrow Y direction, and inspections for movement along the guide rails 112a and 112b. Heads 114a, 114b. The inspection heads 114a, 1 14b have a tray 1 16a, 1 16b ' in the shape of a residual portion 30b surrounding the protective film 30 which may remain at both end portions of the photosensitive laminate 24b in the trays 116a, 116b. In the upper part, a semiconductor laser unit 118a, 1 18b' having a plurality of semiconductor lasers is disposed at a lower portion of the carriages 1 16a and 16b to be disposed opposite to the semiconductor laser units 118a and 118b to receive a plurality of laser beams. Light receiving elements 120a, 120b. In this case, the guide rails 1 1 2 a, 1 1 2 b and the inspection heads 1 1 4 a and 1 1 4 b constitute a moving mechanism, and the light receiving elements 1 20a and 1 20b constitute a peeling state detecting sensor. -16 - 200916316 Further, in the manufacturing apparatus 20 constituted by the above aspect, there are a mesh layer feeding mechanism 32, a processing mechanism 36, a label bonding mechanism 40, a storage mechanism 42, a peeling mechanism 44, a tension control mechanism 66, and photography. The portion 47 is disposed above the attaching mechanism 46, but is disposed below the attaching mechanism 46 from the mesh layer feeding mechanism 32 to the photographing portion 47, and the elongated photosensitive mesh layer 22 is disposed. The photosensitive resin layer 28 may be attached to the lower side of the glass substrate 24 in the up-and-down direction, and the transport path of the long-length photosensitive mesh layer 22 may be linear. The manufacturing apparatus 20 is partitioned into a first clean room 124a and a second clean room 124b via a partition wall 122. In the first clean room 124a, the mesh layer feeding mechanism 32 and the tension control mechanism 66 are housed, and in the second clean room 124b, the mechanism after the image capturing unit 47 is housed. The first clean room 124a and the second clean room 124b communicate with each other via the penetration portion 126. Fig. 5 shows the control circuit component of the peeling state inspection unit 104. The peeling state inspection unit 104 has a light amount information of the laser beam received by the light receiving elements 120a and 120b while controlling the semiconductor laser units 1 18 8 and 1 1 8 b, and supplies the peeling state determination. The control unit 部0 of the unit 128. Further, the control unit 1300 controls the elevation drive unit 133 to drive the elevation unit lift motor 34, and controls the head drive unit 136 to drive the head drive motor 1 3 8 while raising and lowering the lift unit 106. The inspection heads 1 1 4 a, 1 1 4b are moved in the direction of the arrow W along the guide rails 1 12a, 1 12b. The peeling state determining unit 128 determines the peeling state of the protective film 30 from the -17-200916316 of the glass substrate 24 based on the calculated light amount information of the laser beam, and the determination result is displayed on the determination result display unit 140°. The operation of the manufacturing apparatus 20 will explain the relevance of the manufacturing method related to the present invention. First, the elongated photosensitive mesh layer 22 is fed from the photosensitive mesh layer roller 23 mounted to the mesh layer feeding mechanism 32. The elongated photosensitive mesh layer 22 is transported to the processing mechanism 36. < In the processing mechanism 36, the rounded edges 52a and 52b are moved in the width direction of the long photosensitive network layer 22, and the long photosensitive network layer 22 is cut into the photosensitive resin layer 28 from the protective film 30 or even The flexible underlayer film 26 is formed with a half thickness cut portion 3 4a, 3 4b (see Fig. 2) which is only a wide gap of the remaining portion 3 Ob of the protective film 30. Thereby, the peeling portion 30a in front of the remaining portion 30b and the peeling portion 30a on the rear side are provided in the long photosensitive web layer 22 (see Fig. 2). In addition, the 'remaining portion of the hollow portion is a long strip of photosensitive network layer 2 2 (... does not extend to the premise, to supply the glass between the rubber rolls 80a, 8Ob of the attaching mechanism 46) The distance between the substrates 24 is set as a reference. Further, the half thickness cutting portions 3 4 a, 3 4 b formed by the width μ are attached to the photosensitive resin layer 28 of the glass substrate 24 for the reference length. The space is formed in the long-length photosensitive mesh layer 22. Next, the long-length photosensitive mesh layer 22 is transported to the label bonding mechanism 40. The attached portion of the protective film 30 is placed on the pedestal 56. In the label bonding mechanism 40, the set number of bonding labels 38 is adsorbed and held by the adsorption pads 5 4 a~ -18- 200916316 5 4g, and each bonding label 38 spans 30b of the protective film 30, one. The ground is bonded to the front peeling portion 30a and the rear portion of the ground 30a (refer to Fig. 3). For example, 7 strips of adhesive strips 38 of the adhesive label 38 are adhered, as shown in Fig. 1, in the gap After the storage mechanism 42 prevents the feeding, it is continuously conveyed to the peeling mechanism 44. The flexible underlayer film 26 of the peeling mechanism-like photosensitive mesh layer 22 is When the cylinder 62 is adsorbed and sucked, the remaining portion 30b remains in the protective film 30, and the photosensitive network layer 22 is peeled off. The protective film 30 is peeled off by peeling and is wound around the protective film roll portion 64 (refer to First, the protective film 30 remains and is peeled off from the flexible underlayer film 26 by the peeling mechanism 44, and the long-length photosensitive mesh tension control mechanism 66 adjusts the tension, and then photographs进行 The screen photographing of the half-thickness cutting portion 34a and the strip-shaped photosensitive web layer 22 is performed at the set photographing timing. The long photosensitive photosensitive web layer 22 of the photographing unit 47 is relatively moved by the transport mechanism 46. The photosensitive resin Ji of the glass substrate 24 is printed (bonded). In this case, the position of the cut portion 34a' 34b is adjusted in the attaching mechanism 46 based on the screen of the cut portions 34a and 34b of the photographing unit 47. The attaching mechanism 46 is initially set to the rubber roller 80a, 80b state, and the half-thickness cutting portion 34a of the long strip photosensitive 22 is set in the position set between the rubber rollers 80a and 8Ob, and the long remaining portion is corrected. Partial reticular layer side tension change 44 The strip is held from the strip roll 63: part 3 0 b layer 2 2, transported by the length of "7, 34b to the thickness of the half of the thickness of the attached team 28 8 The reticular layer strip-shaped photosensitive -19-200916316 The transport of the reticular layer 22 is temporarily stopped. In this state, the front end of the glass substrate 24 is heated to the set temperature by the substrate heating unit 74 constituting the substrate supply mechanism 45. When the conveyance unit 76 is moved between the rubber rollers 80a and 80b, the back roller 82b and the rubber roller 80b are moved by the pressure roller 84, and the glass substrate 24 and the elongated photosensitive mesh layer are interposed between the rubber rollers 80a and 80b. 22 is clamped under the set press pressure. Further, the rubber rolls 80a, 80b are heated to a set bonding temperature. Next, the rubber rolls 80a and 80b are rotated, and the glass substrate 24 and the elongated photosensitive mesh layer 22 are conveyed in the arrow Y direction. As a result, the photosensitive resin layer 28 is heated and melted and transferred (bonded) to the glass substrate 24. Further, in terms of the bonding conditions, the speed is l. 〇m/min to 10.0 m/min, the temperature of the rubber rolls 80a, 80b is 80 ° C to 150 ° C, and the rubber hardness of the rubber rolls 80a, 80b is 40 degrees - At 90 degrees, the press pressure (linear pressure) of the rubber rolls 80a, 80b is 50 N/cm to 400 N/cm. When the bonding of one of the long photosensitive web layers 22 is completed with respect to the glass substrate 24, the rotation of the rubber rolls 80a and 80b is stopped, and the long photosensitive web layer 22 is bonded thereto. The front end portion of the glass substrate 24 is clamped by the substrate conveyance roller 90a. At this time, a half-thickness cut portion 34b is disposed at a set position between the rubber rolls 80a, 80b. Then, the rubber roller 80b is retracted from the rubber roller 80a in the direction of the relief, and the clamping is released, and the rotation of the substrate conveyance roller 90a starts again at a low speed, and the long photosensitive web layer 22 is bonded to the glass. The photosensitive laminate of the substrate 24 is conveyed only in the direction of the arrow Y corresponding to the width of the remaining portion 30b -20-200916316 of the protective film 30, and the second half of the thickness cutting portion 3 4 a is near the lower side of the rubber light 80a. After the set position, the rubber light 80a is stopped. Further, the long-length photosensitive mesh layer 2 2 is transported only between the half-cut portions 34a and 34b, and is hereinafter referred to as "base feed". On the other hand, in the above state, the glass substrate 24 is conveyed toward the attaching position via the substrate supply mechanism 45. The above operation is repeated to continuously manufacture the photosensitive laminate. At this time, the photosensitive laminates are covered by the remaining portions 30b of the guaranty 30 shown in Fig. 2, respectively. Therefore, when the photosensitive resin layer 28 is applied to the glass substrate 24, the rubber rolls 80a, 80b are not contaminated by the photosensitive layer 28. The glass substrate to which the photosensitive resin layer 28 is attached by the attaching mechanism 46 is subjected to substrate transfer by the attaching mechanism 46, and is placed on the substrate when it is in a stopped state. The cutter mechanism 48 between the conveyance rollers 90b cuts the long photosensitive layer 22 between the glass substrates 24 to form the photosensitive laminate 24a. Further, after the photosensitive layer body 24a, there is a protective film 30 of the remaining portion 30b. The separated photosensitive laminate 24a is temporarily placed on the stocker 94 by the robot 96. Next, after the photosensitive laminate laminated on the stocker 94 is transferred to the peeling portion 98, the glass substrate 24 is held by the suction disk 102 and the end portion of the flexible underlayer film 26 is clamped. Positioner 1 0 0 control and self-transport 80b thickness board second, film transfer tree 24, feed-in, 90c network laminate 24a, & attached, photosensitive • 21 - 200916316 layered body 24a stripping The photosensitive laminate 24b to which the photosensitive resin layer 28 is attached only to the glass substrate 24 can be produced. Here, when the flexible underlayer film 26 is peeled off from the photosensitive laminate 24a, the remaining portion of the protective film 30 is 3 One of the Ob portions is not peeled off and remains on the side of the photosensitive laminate 24a. In the attaching mechanism 46, when the long photosensitive web layer 22 is heated and pressure-bonded to the glass substrate 24, a molten photosensitive resin layer is present between the remaining portion 30b and the glass substrate 24. When the remaining portion 30b is adhered to the glass substrate 24, the residual portion 30b may not be peeled off from the glass substrate 24 normally. Therefore, the photosensitive laminate 24b which is produced by peeling off the flexible underlayer film 26 in the peeling portion 98 is transported to the peeling state inspection portion 1A, and the peeling state of the protective film 30 is checked. This check processing will be described in accordance with the flowchart shown in FIG. When the peeling state inspection unit 104 detects the loading of the photosensitive laminate 24b (step S1), the lifting portion 1?6 disposed in the peeling state inspection portion 1?4 abuts on the lower surface of the glass substrate 24 The photosensitive laminate 2 4 b is held by adsorption or the like (step S 2 ). Then, the control unit 1380 controls the elevation drive unit 1 3 2 to drive the elevation unit lift motor 1 3 4, and moves the lift unit 1 〇 6 in the arrow Z direction to raise the photosensitive layered body 24b (step S3). Further, in the peeling state inspection unit 104, a pin (pi) member is disposed between the conveyors for transporting the photosensitive laminated body 24b, instead of the lifting and lowering unit 1〇6, the pin member is raised, and the photosensitive laminated body 24b is directed toward the arrow Ζ When the photosensitive laminate 24b is moved to the rising end and stopped, the control unit 130 drives the semiconductor laser units U8a and 118b, and outputs the laser beam to the light receiving elements 120a and 120b (steps). S4). The light receiving elements 120a and 120b are supplied to the control unit 130 as an electric signal by the amount of light of the laser beam subjected to light. On the one hand, in parallel with the output of the laser beam, the control unit 130 controls the inspection head driving unit 136 to drive the head driving motor 138, so that the inspection heads 1 1 4 a, 1 14b are along the guide rail 12 12a, 1 12b moves in the direction of the arrow W (step S5). Thereby, the laser beam outputted from the semiconductor laser units 1 18a and 1 18b causes the photosensitive layered body 24 b to sweep the cat in the direction of the arrow W while being blocked by the both end sides of the photosensitive layered body 24b. It is guided to the light receiving elements 1 20a and 1 2Ob. The control unit 130 calculates the light amount information of the laser beam detected by the light receiving elements 120a and 120b by each of the moving positions of the inspection heads 114a and 114b (step S6). In this case, at each movement position, when the detected light amount information is added by each of the inspection heads 114a and 1 14b, the position of the photosensitive laminated body 24b is even in the direction of the arrow Y between the detecting portions 108a and 108b. If there is a deviation, the influence of the change in the amount of light information due to the positional deviation can be minimized. Moreover, it is also possible to add the amount of light information to the moving direction. The calculated light amount information is supplied to the peeling state determining unit 1 28. After the inspection heads 114a and 114b are moved to the ends of the guide rails 112a and 112b, the control unit 130 drives the elevation unit 106 to lower the photosensitive layered body 24b (step S7). Next, the inspection heads 1 14a, 114b are returned to the origin before the start of the movement (step S8). -23-200916316 The peeling state determination unit 1 28 ' of the light amount information supplied from the control unit 130 performs the determination of the peeling state of the photosensitive layered body 24b based on the light amount information (step S9). In this case, the determination of the peeling state is performed by comparing the light amount information with the set threshold value, and based on the comparison result. The figure 7 shows the photosensitive laminate 24b which is in a state in which the protective film 30 at both end portions of the glass substrate 24 is normally peeled off from the erasable underlayer portion 26 in the peeling portion 98. In this case, the laser beam outputted from the semiconductor laser units 1 18a and 1 18b is transmitted through the glass substrate 24 and received by the light receiving elements 120a and 120b. Therefore, the threshold for the peeling state is set to be transmitted through only the glass substrate. When the amount of light of the laser beam of 24 is between the amount of light passing through the laser beam of the glass substrate 24 in which the protective film 30 is left, and the amount of light information is within the critical range, it can be judged as "normal product". In the peeling portion 98, the photosensitive layered product 24a in a state in which the flexible underlayer film 26 is not peeled off due to peeling loss or the like is shown in Fig. 8 . In this case, the laser beam output from the semiconductor laser units 118a and 118b passes through the flexible underlayer film 26, the photosensitive resin layer 28, the protective film 30, and the photosensitive layered body 24b, and is received by the light receiving element 120a. 12b receives light, and the amount of light of the laser beam subjected to light is attenuated, and the information based on the amount of light of the light amount is compared with the threshold set by the normal state, because it is not within the range, so it can be judged as " Defective product." Fig. 9 is a view showing a part of the protective film 30 in the peeling portion 98 by flowing between the one of the protective film 30 and the glass substrate 24 by the molten photosensitive resin layer 28. It is a photosensitive laminated body 24b in a residual state. -24- 200916316 In this case, since the amount of light of the laser beam is attenuated by the remaining protective film 30, if the threshold value is appropriately set, the state can be judged as "defective". Fig. 10 is a view showing a photosensitive laminated body 24b in a state in which the protective film 30 remaining in the form of Fig. 9 is wrapped around the opposite side of the glass substrate 24. In this case, as in the case of Fig. 9, it can be determined that the photosensitive laminate 24b is "defective". The result of the above-described determination of the peeling state is displayed on the determination result display unit 140 (step S10), and the operator can be warned by an alarm sound or the like in response to the need. In the case where it is determined as "normal product" in step S9 (step S1 1), the photosensitive laminated body 24b is transported from the peeling state inspection unit 1 〇4 to the next step, for example, conveyed to sensitize The layered body 24b is exposed to form a pattern of the pattern of the photosensitive resin layer 28 (step S12). On the other hand, when it is determined as "defective product", the photosensitive laminated body 24b is discharged from the peeling state inspection unit 104 (step S13). In this way, it is possible to avoid the situation in which a defective product is mixed in a normal product. Fig. 11 is a schematic structural view of a manufacturing apparatus 200 of another embodiment. The same components as those of the manufacturing apparatus 20 shown in Fig. 1 are denoted by the same reference numerals, and their description will be omitted. In the manufacturing apparatus 200, the glass substrate 24 to which the long-length photosensitive mesh layer 22 is attached by the attaching mechanism 46 is conveyed to the cooling unit 202 without being cut off, cooled, and then supplied to the peeling portion 204. In the peeling portion 204, the elongated photosensitive web layer 22 between the glass substrates 24 is pushed up by the pusher 206 in the direction of the upper -25 - 200916316, and the peeling of the protective film 30 is made easy. 0 is peeled off from the photosensitive resin layer 28, and wound up by the winding roller 20 8 together with the support body 6 6 . Thereby, the photosensitive substrate 22b can be produced by separating the glass substrates 24 from each other. The photosensitive laminate 24b' manufactured is the same as the manufacturing apparatus 20, and the peeling state inspection unit 104 performs inspection of the peeling state of the protective film 30. Further, in the above-described embodiment, the light-receiving elements 120a and 120b' that detect the amount of light by using the received laser beam as the peeling state detecting sensor' can be used, for example, to measure the thickness of the contact thickness by using the photosensitive layered body 24b. Detect the sensor. Further, a height difference detecting sensor for detecting a height difference in the end portion of the photosensitive laminated body 24b by using a laser displacement meter can be used. Moreover, the long-length photosensitive mesh layer 22 supplied from one photosensitive mesh layer roll 23 is attached to the glass substrate 24, and the photosensitive laminated body 24b of a standard pile can be comprised. For example, the long photosensitive photosensitive layer 22 may be supplied from two photosensitive mesh layer rolls or three or more photosensitive mesh layer rolls, and attached to the glass substrate 24 to form a so-called two-standard pile, three standards. The form of the photosensitive laminate 24b such as a pile. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic block diagram of a manufacturing apparatus of the present embodiment. Fig. 2 is a cross-sectional view showing a long photosensitive liquid layer used in a manufacturing apparatus of the present embodiment. Fig. 3 is a view showing a state in which the adhesive label is adhered to the long photosensitive web layer. -26- 200916316 Fig. 4 is a configuration diagram of the peeling state inspection unit. Fig. 5 is a control circuit diagram of the peeling state inspection unit. Fig. 6 is a flow chart showing the inspection process of the peeling state. Fig. 7 is an explanatory view of a photosensitive laminate in a normal peeling state. Fig. 8 is an explanatory view showing a state in which the flexible underlayer film is not peeled off. Fig. 9 is an explanatory view showing a state of failure in which a part of the protective film remains. Fig. 10 is an explanatory diagram showing a state of failure in which a part of the protective film remains. Fig. 11 is a schematic structural view of a manufacturing apparatus according to another embodiment. i is a cross-sectional view of a photosensitive laminate in a state in which a photosensitive sheet is attached to a substrate in a conventional technique. Fig. 13 is a plan view showing a photosensitive laminate in a state in which a photosensitive sheet is attached to a substrate in a conventional technique. [Description of main components] 20, 200 Manufacturing apparatus 22 Long photosensitive web layer 24 Glass substrate 24a ' 24b Photosensitive laminate 26 Flexible underlayer film 28 Photosensitive resin layer 30 Protective film 30a Exfoliated portion 30b Remaining Portion 34a, 34b Machining part -27- 200916316 46 Attachment mechanism 80a, 80b Rubber roller 98, 204 Peeling portion 106 Lifting portion 108a, 108b Detection portion 1 14a > 114b Inspection head 118a ' 118b Semiconductor laser unit 120a, 120b light receiving element 128 peeling state determining unit 130 control unit 140 determination result display unit
-28--28-