200912286 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種光學檢測方法及裝置，特別是關於一 種應用於基板瑕巍檢測的光學檢測方法及裝置。 【先前技術】 基板的瑕疵檢測分析，於產業製程中相當重要，以太陽能 電池板之微裂為例，其發生原因很廣泛，包括原材料瑕窥、製 程中與製程間職運料皆有可能引起微裂，且由於太陽能電 池板的原材料主要祕晶 >；，树晶片其結理容易在内部或表 面造成碎裂’碎制發生對製程設備的影響嚴重，亦會影響太 陽能電池板的發電效率。 目前對於基板贼之檢測大致上包括二種方式，其一為透 過測量基板的電流·電壓特性，其二為透過強級進行表面之 目檢，，然而現行的基紐測方式普赫在有下列缺點： 1.降低製程良率：_電流_電壓特性的方式制微裂， 喊的檢測是於製減出#前，織的處理僅有報廢或降 等級，故已降低製程良率，對製程改善助益不大，而損失已經 發生’直接影響生產當中所投入之材料與人工成本 。此外，微 裂的現象在十分輕微的纽下無法反應於電流_電壓，卻會使 得產品容易於搬運途中碎裂。 大里的漏仏.以目兩的強光燈檢測技術，例如以可見 光作為強光_ ’纟·板瑕財缺生結縣面與内部，且 夕數亚不會牙透整過基板的截面，是以發生於基板結理内部的 200912286 裂痕，強光燈將無法穿透，即利用強光燈的目檢或檢測將會出 現大量漏檢，進而產生檢測效益不佳之問題。 3. 品質掌控不易：電流_電壓特性方式敏感度不足且是製 私後檢測，強光燈檢測容易出現大量漏檢，如此將使得生產線 品質掌控不易’也對製程機台形成潛在的危害@子，例如太陽 能電池板之微裂於製程當中碎裂於機台内部，除了影響產能之 外，也將會對後續產品之品質產生危害。 4. 無法進行統計製程分析：先前技術無法有效紀錄瑕疵 特徵與分類’瑕朗特徵與製程之間關聯性也無法有效收 集，對於製程改善毫無助益。 5·檢測時破片率高：檢_林具良好之獅支擇或透過 人工抓取，使得破片之機率高，造成生產的浪費。 因此，需要一套良好的基板檢測裝置和方法，提高基板 瑕紐測的精度和效益’以改善财基板檢測麟的種種缺 失、’職疋之故’申請人乃經悉心試驗與研究，並一本鐵而不捨 之精神’終構思出本案「基板光學制方法及裝置」，以下為 本案之簡要說明。 … 【發明内容】 本發明之-目的在於提供—種光學檢測方法，用以檢測 -基板之贼’藉㈣基板贼之檢顺分類，提高製程 與降低生產成本。 …為達上述目的’本發明所提供的基板光學檢測方法包含運 运-基板至-光學檢測裝置中，以—光_射該基板，接收該 200912286 被照射之基板所產生的-影像，且其巾該觀受之影像的光波 包含波長7難謂奈米間的任一光波區段，掘取該影像並 分析該影像以產生該基板之瑕疵分析結果。 如上所述的絲光學檢測方法，更包含輸出該械分析結 果’分析該贼的種類與嚴重程度，以及依該瑕_特徵進行 貝料庫之建立的步驟’其中該嚴重程度的分析包括基板之破片 機率與相關辑量分析，而該麵分析包含瑕紅幾何資訊分 析。 本發明之另-目的在於提供—種用以檢測—基板之瑕庇 的光學檢測純’其包含—承餘賴以承載及運送該基板， 光學檢測裝置，以及一檢測分析系統，其中該光學檢測裝置 包含-光學單喊生—光源以簡該基板，—維以上之 陣列接欠感應器單元，用以接收該被照射之基板所產生的一影 像，其中該被接受之影像的光波包含波長7〇〇至15⑻奈米間 的任-光波H段’以及-影像擷取處理單元用以擷取該影像， 而該檢測分析系統包含一資料擷取單元及一運算單元，用以分 析該影像並檢測該基板之瑕疵。 根據上述的構想，光學檢測系統之承載裝置包括一移動平 台以及一支撐平台，該乘載裝置可為X-Y軸縱橫向移動平 台，皮帶式平台，滾輪式平台，氣浮式平台，透明玻璃載台， 上下簍空之輸送裝置，或上述裝置之組合，但並不限於此。 根據本發明的構想，該被檢測之基板可為太陽能電池板或 其他以料基材之元件，包括單晶較陽能電池板、多晶石夕太 陽忐電池板、薄膜太陽能電池板，薄膜光電元件或混合積體電 200912286 路；而該光學檢财法及裝置可檢測之瑕賊象，包括出現於 基板表面及其内部結構之瑕疵。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical detecting method and apparatus, and more particularly to an optical detecting method and apparatus for detecting flaws in a substrate. [Prior Art] The detection and analysis of the defects of the substrate is very important in the industrial process. Taking the micro-cracking of solar panels as an example, the causes are very wide, including the peek of raw materials, the process and the process materials between the process and the process may cause Micro-cracking, and due to the main secret crystal of the solar panel, the tree wafer is easily smashed inside or on the surface. The fragmentation has a serious impact on the process equipment, and will also affect the power generation efficiency of the solar panel. At present, the detection of the substrate thief generally includes two methods, one is to measure the current and voltage characteristics of the substrate, and the other is to perform a visual inspection of the surface through a strong level. However, the current basic measurement method has the following Disadvantages: 1. Reduce the yield of the process: _ current_voltage characteristics of the way to micro-crack, the detection of shouting is before the production minus #, the processing of the weave only scrapped or downgraded, so the process yield has been reduced, the process The improvement is not helpful, and the loss has already occurred 'directly affects the material and labor costs invested in production. In addition, the phenomenon of microcracking cannot be reflected in the current-voltage under a very slight condition, but the product is easily broken during transportation. Dali's leaky sputum. The two glare detection techniques, such as the use of visible light as a strong light _ '纟· 瑕 瑕 瑕 生 生 县 县 县 县 县 县 县 县 县 县 县 , , , , , , , , , , , , , Because of the 200912286 crack that occurs inside the substrate, the strong light will not penetrate, that is, the visual inspection or detection using the strong light will cause a large number of missed inspections, resulting in poor detection efficiency. 3. The quality control is not easy: the current_voltage characteristic mode is not sensitive enough and is the post-private inspection. The high-light detection is prone to a large number of missed inspections, which will make the quality control of the production line difficult. It also poses a potential hazard to the process machine. For example, the micro-crack of the solar panel is broken inside the machine during the process, and in addition to affecting the production capacity, it will also harm the quality of the subsequent products. 4. Unable to perform statistical process analysis: prior art cannot effectively record 瑕疵 Features and classifications ‘The relationship between features and processes cannot be effectively collected, and it is not helpful for process improvement. 5. The high fragmentation rate during the test: the inspection _ the forest has a good lion selection or through manual grasping, which makes the probability of fragmentation high, resulting in waste of production. Therefore, a good set of substrate testing devices and methods is needed to improve the accuracy and effectiveness of substrate testing. In order to improve the lack of financial substrate testing, the applicants are carefully tested and researched. The spirit of the iron and the spirit of the "end of the project" "the substrate optical method and device", the following is a brief description of the case. SUMMARY OF THE INVENTION [The present invention] It is an object of the present invention to provide an optical detecting method for detecting a sorting of a substrate thief's (four) substrate thief, improving the process and reducing the production cost. In order to achieve the above object, the substrate optical detection method provided by the present invention includes a transport-substrate-to-optical detection device, which emits the image generated by the substrate irradiated by the 200912286, and the image is received by the substrate. The light wave of the image of the image of the towel contains any light wave segment between the wavelengths of 7 and is difficult to be called, and the image is extracted and analyzed to produce a 瑕疵 analysis result of the substrate. The silk optical detection method as described above further includes outputting the mechanical analysis result 'analysing the type and severity of the thief, and performing the step of establishing the hopper library according to the 瑕 _ feature, wherein the analysis of the severity includes the substrate Fragmentation probability and related volume analysis, and the face analysis includes blush geometric information analysis. Another object of the present invention is to provide an optical detection pure for detecting a substrate, which includes a bearing for carrying and transporting the substrate, an optical detecting device, and a detection and analysis system, wherein the optical detection The device comprises: an optical single-source-light source for simplifying the substrate, and an array of the above-mentioned array is connected to the sensor unit for receiving an image generated by the illuminated substrate, wherein the received image wave comprises a wavelength of 7 And the image capture processing unit is configured to capture the image, and the detection and analysis system includes a data capture unit and an operation unit for analyzing the image and The flaw of the substrate is detected. According to the above concept, the carrying device of the optical detecting system comprises a moving platform and a supporting platform, and the carrying device can be an XY axis vertical and horizontal moving platform, a belt platform, a roller platform, an air floating platform, a transparent glass loading platform. , a transport device that is hollowed up and down, or a combination of the above, but is not limited thereto. According to the concept of the present invention, the substrate to be inspected may be a solar panel or other components of a substrate, including a single crystal solar cell panel, a polycrystalline solar solar panel, a thin film solar panel, and a thin film photovoltaic. The component or hybrid integrated circuit 200912286; and the optical inspection method and the device detectable thief image, including the surface of the substrate and its internal structure.
根據本發明_想，該光學單元可直接產生包含波長7〇〇 至1500奈糊之任—光波區段的麵、賴射該基板，亦可產 全波段的光波，祕照射基板前或關基板後，由—光滤波單 元將700至1500奈米以外的光波加以濾除，使該一維以上之 陣列接收絲料元最後所無的影像係為包含波長7〇〇至 1500奈額之任—光波區段的光波，其中該—維以上之陣列 接收感應H單元可為互補金屬氧化物半導體、感光_合元件、 石申化銦鎵共焦平面、光譜儀或分光感應模組。 根據本發明的構想，該光學單元可配置於該基板的上 方’下方或四周等各個肖度，例如以穿透光的方式照射該基 板’亦可使光源與該基板同軸以反射光的方式照射該基板，或 同時以穿透光與反射光的方式合併·射該基板。 縱上所述’本發明提供一種基板之光學檢測方法及裝置， 在一檢測系統包含光學檢測褒置、檢測分析系統及承載裝 置Ί^/欢測之基板經承載單元運送而進入光學檢測裝置，透 過該光:檢曝置之光學單元、光濾波單元、感應 像元等裝置照射並簡之影像，其後將擷取之 分㈣統之㈣#脉料贿算單元將瑕疫加 以分σ因而本發明相較於習知技術具有如下優點： 、軍、含移_與支撐平台’可有效避免基板於 ^〜韻之發生，而不受⑦晶#原 Z透過特殊光波長之光學檢測，即波長為700 奈 200912286 米間任一光波區段的光波，可有效觀察與檢測基板，請參考第 一圖（A)，一多晶石夕基板1於其位置1〇具有一微裂瑕疵，以 習知技術之可見光照射該基板i，檢測結果如第一圖（B)，但 若以本發明之光學檢測方法及裝置照射之，檢測結果如第—圖 (=)，_可清楚了解本發_較於f知技術，將更能正確 無誤的發現位於基板表面和/或結理内部之瑕疲，且瑕疵的嚴 重程度將可透過影像量化成為判定的指標。 3.透過檢測分析系統’可將瑕疵之特徵資料建立瑕疵之製 备貝料庫，該·據資料庫内容，更是可以成為 慧資本。 換言之，本發械度、可#度與敎性健的基板光 學瑕疲檢齡絲做基板之喊制，並條錄 行分析，之後及時回饋製程設備，因而可確保產品之;;質控 官無疏漏之虞’無論就精簡的生產流程所可能減少的設備投資 與生產線空間的耗費，或者因石I實的瑕麵測與分類成效而使 產品品質穩定與良率提昇，其所縣的製程品昇與成本降 低等實際經濟效益，皆證實本發明存在顯著的進步性與產業利 用性。 如前述本發明之基板光學檢測方法及裝置，得藉由下列實 施例及圖示說明，俾得更深入之了解： 【實施方式】 本發明之技術手段將詳細說明如下，相信本發明之目的、 特徵與特點，當可由此得—深人且具體之了解，然而下列實施 200912286 例與圖示健供參考與說日賴，並_來對本判加以限制。 首先請參閱第二圖（A)’其為本發明之光學檢測裝置之 第一實施例的示意圖，光學檢測裝置2包含一光學單元幻， 其產生一光源20用以照射一基板9以檢測該基板9之瑕疵， 其中該光源20為包含波長700至15〇〇奈米間之任一波長區段 的光波，而該基板9被光源20照射後產生影像9〇，由一一維 以上之陣·收感應器單元23接收，並由—影像擷取處理單 元24擷取之。 請再參閱第二圖（B) ’其為本發明之光學檢測裝置之第 二實施例的示意圖，相較於第二圖（A)，光學檢測裝置2之 光學單元21所產生的光源2〇為全波段的光波，而光學檢測裝 置2更包含一光濾波單元22’用以將光源2〇中波長至15〇〇 奈米以外的光波加以濾除，使照射在基板9的光波波長係為 700至1500奈米之間的光波區段。 、’’’、 請再參閱第二圖（C)’其為本發明之光學檢測襞置之第 三實施例的示意圖’其中該光學單元21所產生的光源2〇為全 波段的光波，並直接照射基板9使其產生影像9〇 ,再以該= 遽波單元22將影像90中波長700至1500奈米以外的光波加 以濾除，使該一維以上之陣列接收感應器單元23接受之影像 90的光波係為波長70〇至1500奈米間的光波區段。 y 此外，於上述各實施例中，該光學單元21係配置於該基 板9的上方，但並不限於此，其亦可配置於基板9的下方戋四 周等其他各種角度，使該光源20例如以穿透光的方式照射該 基板9’或以與該基板9同轴而以反射光的方式照射該笑板9， 200912286 或同日^•以穿透光與反射光的方式照_基板9。 又於上述各實施例中，該一維以上之陣列接收感應器單元 、可為互補金屬氧化物半導體、感光搞合元件、_化鋼嫁共 焦平面、光譜儀或分光感應模組，且值得注意的是，雖然於 案貝紅例中、’ 維以上之陣列接收感應器單元Μ接收到的 光波影像係為波長7〇〇至15⑻奈米間的光波區段，'然而於實 示應用上β亥維以上之陣列接收感應器單元Μ係可接收各 種可見光與不可見光之波長光源，且可完整的接收基板9於各 光波長所呈現之影像9〇。 又於上述各實施例中，影像擷取處理單元24可包含一組 以上之影像取得單元，—組m像處理單元以及—組以上 之影像顯示單元與一影像儲存單元。 立請參閱第三圖’其為本發明之光學檢測系統之實施例的示 意圖’該光學檢測系統3包含承載褒置6用以承載及運送待檢 /貝j之基板9 ’光學檢測裝置2 ’以及一檢測分析系統7用以分 ^由第二圖(斗(〇中的影像擷取處理單元a所擷取和儲存的 影像’以檢測該基板9之贼’該檢測分析系統7包含一資料 擷取單元71以及一運算單元72。 於此光學檢測系統3的實施例中，該承載裝置6包含一移 動平台61以及-支平台62，當基板9由承載裝置6承載及 運送進入光學檢測裝置2前後’移動平台61及支撐平台62將 支撐位於檢測空隙的基板9 ’本案之實施例主要糊滾輪輔助 支撐，實際顧上該機平纟61可為Χ_γ無橫向移動平 口、皮▼式平台、滾輪式平台、氣浮式平台、透明玻璃載台、 11 200912286 基板上下方簍空之輸送裝置或上述機構之組合，而該支樓平台 62可使用滾輪式支撐、氣浮式支撐、透明玻璃支撐或上述機 構之組合。 此外本發明之基板光學檢測方法的實施方式，包含下 列步弥’财餘置6運送基板9至光學檢測裝置2中，以光 源20照射該基板9，該一維以上之陣列接收感應器單元^接 收該被照射之基板9所產生的影像9〇，其中额接受之影像 的光波包^長至15〇〇奈米_任—光波區段，以影像 擷取處理單元24擷取馳触之影像，並以㈣分析系統7 的資料擷取單元71和運算單元72分_影像以產生該基板9 之瑕疵分析結果。 於上述實施财，資觸取單元71係用簡取基板9之 影像90的待分析資料，該待分析雜可包括影像資訊、光學 分析資訊、高度分析資訊、厚度分析魏或其組合，而基板9 之瑕巍的資訊包括人眼無法觀察之位於基板内部結構之瑕症 資訊，位於表面人眼不易觀察之瑕疲資訊及人眼可輕易觀測之 瑕症資訊，此外，運算單元72用以分析該待分析資料，並輪 出該待分析資料經分析後的一瑕疵分析結果，其後可再分析該 瑕疵的種類與嚴重程度，並依其特徵分別給予類別，進而儲存 於-資料庫巾’其巾嚴重程度分析包括基板之破㈣率與_ 統計量分析資訊，種類資訊則包含瑕疵之幾何資訊分析。於上 述步驟之後，該基板9將再透過承載裝置6運送至下個工作站。 此外，於本發明上述基板光學檢測裝置及方法的各實施 例中，該基板9例如為一太陽能電池板，其可包括單晶矽太陽 12 200912286 能電池板，多晶教陽能電池板，或薄m太陽能電池板，而里 他以石夕為基材之元件例如財為基材之太陽能電池板，薄膜光 包元件，或混合積體電路等元件，亦可使用本發明裝置及方法 來檢測。 、綜上所述，藉_等實闕當可說日林發明之基板光學 檢測裝置及方法’確可朝械之有效檢測，進崎到降低生 產成本及提紐品品料功效，因喊f知之技術相較具有顯 著之進步性。 ’' 雖然本發明已以數個較佳實施例揭露如上，然其並非用 j限定本個’任何熟習此技藝者，在不麟本發明之精神和 範圍内田可作些許之更動與潤飾，因此本發明之保護範圍當 視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第一圖⑷.一具有微裂瑕苑之多晶石夕基板的影像圖； 第一圖⑻：以習知技術檢測第一圖⑷之基板瑕疵的檢測 結果影像圖； 第-圖（C):以本發明之光學檢測方法及裝置檢測第一圖（a) 之基板瑕疵的檢測結果影像圖； 第-圖（A):本發明之光學檢測裝置之第一實施例的示意圖； 第一圖（B).本發明之光學檢測裝置之第二實施例的示意圖； 第一圖（C)·本發明之光學檢測裝置之第三實施例的示意圖； 以及 第二圖：本發明之光學檢測系統之實施例的示意圖。 13 200912286 【主要元件符號說明】 1 多晶矽基板 10 瑕疵位置 2 光學檢測裝置 20 光源 21 光學單元 22 光濾波單元According to the present invention, the optical unit can directly generate a surface including any wavelength band of 7 〇〇 to 1500 Å, and illuminate the substrate, and can also generate light waves of the entire wavelength band, and the substrate is irradiated before or after the substrate. After that, the light wave of 700 to 1500 nm is filtered out by the optical filter unit, so that the image of the one-dimensional or more array receiving the silk element is not included in the wavelength of 7〇〇 to 1500. The light wave of the optical wave segment, wherein the array receiving the sensing H unit may be a complementary metal oxide semiconductor, a photosensitive element, a stellite indium gallium confocal plane, a spectrometer or a spectroscopic sensing module. According to the concept of the present invention, the optical unit can be disposed on the lower side of the substrate, such as below or around, such as illuminating the substrate by penetrating light. The light source can also be illuminated coaxially with the substrate to reflect light. The substrate is combined or irradiated with the light and the reflected light at the same time. In the above, the present invention provides an optical detecting method and apparatus for a substrate, wherein a substrate including an optical detecting device, a detecting and analyzing system, and a carrying device is transported by the carrying unit into the optical detecting device, Through the light: the exposed optical unit, the optical filtering unit, the sensing pixel, and the like illuminate the simplified image, and then the sub-divided (four) unified (four) # pulse bribe computing unit divides the plague into σ Compared with the prior art, the invention has the following advantages: the military, the shifting _ and the supporting platform' can effectively avoid the occurrence of the substrate in the rhyme, without being optically detected by the special crystal wavelength of the 7 crystal# original Z, ie The light wave of any light wave segment with a wavelength of 700 nm 200912286 meters can effectively observe and detect the substrate. Please refer to the first figure (A). A polycrystalline substrate 1 has a micro-crack at its position 1 to The visible light of the prior art illuminates the substrate i, and the detection result is as shown in the first figure (B). However, if the optical detection method and apparatus of the present invention are used for illumination, the detection result is as shown in the first figure (=), _ _Compared with f knowing technology On the severity of the more correct discovery of the substrate surface and / or internal flaw knot fatigue management, and defect will be quantifiable indicators to determine the transmission image. 3. Through the detection and analysis system, the characteristic data of the 瑕疵 can be established into the 贝 制 贝 , , , , , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In other words, the mechanical degree of the mechanical degree, the degree of the optical integrity of the substrate, and the sturdyness of the substrate are made by the substrate, and the line is analyzed, and then the process equipment is timely returned, thereby ensuring the product; No omissions, no matter the equipment investment and production line space that may be reduced by the streamlined production process, or the product quality stability and yield improvement due to the actual surface measurement and classification results of the stone I, the process of the county The actual economic benefits such as product upgrade and cost reduction have confirmed that the present invention has significant advancement and industrial utilization. The method and apparatus for optically detecting the substrate of the present invention can be further understood by the following embodiments and illustrations: [Embodiment] The technical means of the present invention will be described in detail below, and the object of the present invention is believed to be Features and characteristics, when it can be obtained - deep and specific understanding, but the following implementation of the 200912286 example and the illustration of the health supply reference and said, and _ to limit this judgment. Referring first to FIG. 2A, which is a schematic view of a first embodiment of an optical detecting device of the present invention, the optical detecting device 2 includes an optical unit phantom that generates a light source 20 for illuminating a substrate 9 to detect the After the substrate 9, the light source 20 is a light wave containing any wavelength band between 700 and 15 nanometers, and the substrate 9 is illuminated by the light source 20 to generate an image 9 〇. The receiving sensor unit 23 receives and is captured by the image capturing processing unit 24. Referring to FIG. 2(B), which is a schematic diagram of a second embodiment of the optical detecting device of the present invention, the light source 2 generated by the optical unit 21 of the optical detecting device 2 is compared to the second drawing (A). The optical detecting device 2 further includes an optical filtering unit 22' for filtering out light waves of a wavelength other than 15 nanometers in the light source 2, so that the wavelength of the light wave irradiated on the substrate 9 is A section of light between 700 and 1500 nm. ''', please refer to the second figure (C), which is a schematic diagram of a third embodiment of the optical detecting device of the present invention, wherein the light source 2 generated by the optical unit 21 is a full-wavelength light wave, and Directly illuminating the substrate 9 to generate an image 9 〇, and filtering the light wave having a wavelength of 700 to 1500 nm in the image 90 by the 遽 chopping unit 22, so that the one-dimensional array receiving sensor unit 23 accepts The light wave of the image 90 is a light wave section having a wavelength between 70 〇 and 1500 nm. In the above embodiments, the optical unit 21 is disposed above the substrate 9. However, the present invention is not limited thereto, and may be disposed at other various angles such as the lower side of the substrate 9, such as the light source 20, for example. The substrate 9' is irradiated with light, or is coaxial with the substrate 9 to illuminate the smiley plate 9 by reflection of light, 200912286 or the same day, and the substrate 9 is irradiated with light and reflected light. In the above embodiments, the one-dimensional array receiving sensor unit may be a complementary metal oxide semiconductor, a photosensitive bonding component, a _ steel married confocal plane, a spectrometer or a spectroscopic sensing module, and it is worth noting that However, in the case of the case, the image of the light received by the array receiving sensor unit 维 is a light wave segment between wavelengths of 7 〇〇 to 15 (8) nm, however, the application of β is applied. The array receiving sensor unit above Heavi can receive various wavelength sources of visible light and invisible light, and can completely receive the image 9 of the substrate 9 at each wavelength of light. In the above embodiments, the image capture processing unit 24 may include more than one set of image acquisition units, a group m image processing unit, and an image display unit and an image storage unit. Please refer to the third figure, which is a schematic view of an embodiment of the optical detection system of the present invention. The optical detection system 3 includes a carrying device 6 for carrying and transporting the substrate 9 to be inspected/the optical detecting device 2' And a detection and analysis system 7 for dividing the image by the second image (the image captured and stored by the image capture processing unit a in the file to detect the thief of the substrate 9). The detection analysis system 7 includes a data. The capturing unit 71 and an arithmetic unit 72. In the embodiment of the optical detecting system 3, the carrying device 6 comprises a moving platform 61 and a supporting platform 62, and the substrate 9 is carried by the carrying device 6 and transported into the optical detecting device. 2 Before and after the 'mobile platform 61 and the support platform 62 will support the substrate 9 in the detection gap'. The embodiment of the present invention mainly supports the auxiliary roller, and the actual consideration of the machine can be Χ γ without lateral movement flat, skin ▼ platform, Roller platform, air floating platform, transparent glass stage, 11 200912286 substrate upper and lower hollow conveyor or a combination of the above mechanisms, and the platform platform 62 can use roller support, air floating The support, the transparent glass support or the combination of the above-mentioned mechanisms. In addition, the embodiment of the substrate optical detection method of the present invention comprises the following steps: the transport substrate 9 is transported into the optical detecting device 2, and the substrate 9 is illuminated by the light source 20, The one-dimensional array receiving sensor unit receives the image 9 generated by the illuminated substrate 9, wherein the light wave of the image received by the image is extended to 15 nanometers. The capture processing unit 24 captures the image of the touch, and divides the image by the data capture unit 71 and the operation unit 72 of the analysis system 7 to generate the analysis result of the substrate 9. The 71 series uses the image to be analyzed of the image 90 of the substrate 9, and the sample to be analyzed may include image information, optical analysis information, height analysis information, thickness analysis Wei or a combination thereof, and the information after the substrate 9 includes the human eye. Unexplained information on the internal structure of the substrate, which is located on the surface of the human eye that is difficult to observe, and information on the symptoms that can be easily observed by the human eye. In addition, the arithmetic unit 72 analyzes the information. Analyze the data, and take out the analysis result of the analyzed data to be analyzed, and then analyze the type and severity of the cockroach, and then assign the categorization according to its characteristics, and then store it in the data towel. The severity analysis includes the breaking rate of the substrate and the statistical analysis information, and the type information includes the geometric information analysis. After the above steps, the substrate 9 will be transported through the carrying device 6 to the next workstation. In various embodiments of the above-described substrate optical detecting device and method, the substrate 9 is, for example, a solar panel, which may include a single crystal germanium 12 200912286 energy panel, a polycrystalline solar panel, or a thin m solar cell. The board, and the components of the solar-powered substrate, such as a solar panel, a thin film optical package component, or a hybrid integrated circuit, can also be detected by using the apparatus and method of the present invention. In summary, by means of _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Knowing technology is significantly more progressive. Although the present invention has been disclosed above in several preferred embodiments, it is not intended to limit the art to anyone skilled in the art, and in the spirit and scope of the present invention, the field may be modified and retouched. The scope of the invention is defined by the scope of the appended claims. [Simple description of the figure] The first picture (4). An image of a polycrystalline substrate with a micro-cracked garden; the first figure (8): an image of the detection result of the substrate 第一 of the first figure (4) detected by a conventional technique; Fig. (C): image detection result of the substrate 第一 of the first figure (a) is detected by the optical detecting method and apparatus of the present invention; Fig. (A): First embodiment of the optical detecting device of the present invention BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1B is a schematic view showing a second embodiment of the optical detecting device of the present invention; FIG. 1C is a schematic view showing a third embodiment of the optical detecting device of the present invention; and a second drawing: A schematic of an embodiment of an optical detection system of the present invention. 13 200912286 [Description of main component symbols] 1 Polycrystalline germanium substrate 10 瑕疵 position 2 Optical detection device 20 Light source 21 Optical unit 22 Optical filter unit
23 一維以上之陣列接收感應器單元 24 影像擷取處理單元 9 基板 90 影像 3 光學檢測系統 6 承載裝置 61 移動平台 62 支撐平台 7 檢測分析系統 71 擷取單元 72 運算單元 1423 One-dimensional array receiving sensor unit 24 Image capture processing unit 9 Substrate 90 Image 3 Optical detection system 6 Carrier device 61 Mobile platform 62 Support platform 7 Detection and analysis system 71 Capture unit 72 Operation unit 14