200912238 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種微型液體冷卻裝置’尤係涉及一種用 於對發熱電子元件進行冷卻之微型液體冷卻裝置，本發明 還涉及該微型液體冷卻裝置所採用之一種微液滴產生器。 【先前技術】 隨著電腦產業之迅速發展，CPU追求高速度化，高功 能化及小型化所衍生之散熱問題越來越嚴重，這在筆記型 電腦等内部空間狹小之電子裝置中更為突出。如果無法將 筆記型電之CPU㈣子元件所產生之熱量及時有效地 散發出去，將極大地影響電子元件之工作性能，同時還會 縮減電子元件之使用壽命，故業界通常採用一冷卻裝置來 對電子元件散熱。 在眾多冷卻技術中，液體冷卻係一種極為有效之冷卻 方5。習知液體冷卻裝置為由吸熱體、散熱體、幫浦及傳 輸官所構狀-回路，該回路巾填充有冷卻液，冷卻液在 吸熱體處做電子元件所產生之，經傳輸管傳至散熱 體後放出熱量。在該幫紅義仙下，冷卻液在回路中 不斷循環’從而_不斷地帶走該電子元件所產生之熱量。 目月液體冷卻裝置已被業者用於桌上型電腦中對 CPU進行散熱，然而由於習知液體冷卻裝置中幫浦所佔用 空間較大’报難適用於内部空間狹小之筆記型電腦内對電 子元件散熱。科’幫浦在運行時還會產生較大Q桑音 200912238 響使用者之聽覺感受。伴隨著筆記型電腦等電子裝置朝向 微型化及高性能化方向設計，發熱量增加之同時冷卻裝置 所能^占據之空間卻在不斷減少。如何設計出能適用於筆記 型電腦内對電子元件進行有效冷卻之新型液體冷卻裝置， 對於業者來說係又一個新的研究課題。 ”貝材料上之電潤濕效應（Electrowetting On Dielectric，EWOD)係一種藉由施加電勢來改變液體表面 張力之可逆現象。圖1A與圖1B為介質上之電潤濕效應之 原理圖。如圖1A所示，下極板10包括一基底u，基底n 上設有下電極層12’該下電極層12被一層絕緣層13覆蓋， 液滴14位於絕緣層13之表面，上電極15***液滴μ之 内部。該上電極15與下電極層12之間藉由電源線連接有 一開關16及一可調電源17，該開關16用於控制電路之斷 開與閉合’該可調電源17絲給下極板1〇與上電極Μ之 間提供施加電壓。當上雜15與下極板1G之間不 ^ 即開關16處於斷開狀態時，該下極板10之絕緣層二之%’ 面為疏水的，鱗液滴14之靜態接觸角為0娜。之^ 1B所示，當開關16閉合時，可調電源17提供〜t如圖 在液滴Μ與下極板1〇之間產生電勢作用，此時，兔壓V ’ 之靜恶接觸角由原來之變化為0(V)，0(ν)<6)液^14 之大小達到—定鱗，<9(V)<9G。，此時絕緣層13°田V 顏親水的。當開關16重新斷開時，即液滴丨之表面 板10之間沒有電勢作用時，液滴14之靜態，、下電極 復到Θ。。上述這種現象稱為介f材料上之電潤^重新回 8 200912238 利用這種介質材料上之電潤濕效應原理，美國杜克大 學（Duck University)之PollackMG等人首先基於介質材 料上之電潤濕效應並採用微機械製作之微電極陣列進行了 微液滴之運動控制，並提出了 “數位微流體（Digitai Microfluidics)，’之概念。美國洛杉磯加州大學 之Cho S K荨人成功地利用EWOD效應對直徑為7〇 # m之 微液滴進行了微液滴之產生、傳輸、混合和***四個基本 操作，並在25V之交流電壓下得到了 250mm/s之微液滴移 動速度（Cho S K, Moon H，Kim C J. Creating, Transporting，BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro liquid cooling device, particularly to a micro liquid cooling device for cooling a heat-generating electronic component, and to a micro-liquid cooling device. A microdroplet generator is used. [Prior Art] With the rapid development of the computer industry, the CPU pursues high speed, and the heat dissipation problem caused by high functionality and miniaturization is becoming more and more serious. This is more prominent in electronic devices with narrow internal space such as notebook computers. . If the heat generated by the CPU (4) sub-component of the notebook type cannot be dissipated in a timely and effective manner, the performance of the electronic component will be greatly affected, and the service life of the electronic component will be reduced. Therefore, the industry usually uses a cooling device to the electronic device. Component heat dissipation. Among many cooling technologies, liquid cooling is an extremely effective cooling method5. The conventional liquid cooling device is configured by a heat absorbing body, a heat dissipating body, a pump, and a transferor. The circuit towel is filled with a cooling liquid, and the cooling liquid is generated by the electronic component at the heat absorbing body, and is transmitted to the heat transfer body to the circuit. Heat is released after the heat sink. Under the gang, the coolant circulates continuously in the loop, thus continually removing the heat generated by the electronic components. The moon liquid cooling device has been used by the industry to dissipate the CPU in the desktop computer. However, due to the large space occupied by the pump in the conventional liquid cooling device, it is difficult to apply to the electronic computer in the notebook computer with a small internal space. Component heat dissipation. The section of the gang will also generate a large Q Sanyin 200912238 when it is running. With the design of electronic devices such as notebook computers in the direction of miniaturization and high performance, the amount of heat generated increases while the space occupied by the cooling device is decreasing. How to design a new liquid cooling device that can be used for effective cooling of electronic components in a notebook computer is another new research topic for the industry. "Electrowetting On Dielectric (EWOD) is a reversible phenomenon that changes the surface tension of a liquid by applying an electric potential. Figure 1A and Figure 1B are schematic diagrams of the electrowetting effect on a medium. As shown in FIG. 1A, the lower plate 10 includes a substrate u, and the substrate n is provided with a lower electrode layer 12'. The lower electrode layer 12 is covered by an insulating layer 13, the droplets 14 are located on the surface of the insulating layer 13, and the upper electrode 15 is inserted into the liquid. The inside of the drop μ is connected between the upper electrode 15 and the lower electrode layer 12 via a power line with a switch 16 and an adjustable power supply 17 for controlling the opening and closing of the circuit. An applied voltage is applied between the lower plate 1 〇 and the upper electrode 。. When the upper electrode 15 and the lower plate 1G are not in the open state, the insulating layer 2 of the lower plate 10 is '%' The surface is hydrophobic, and the static contact angle of the scale droplet 14 is 0 Na. As shown in Fig. 1B, when the switch 16 is closed, the adjustable power source 17 provides ~t as shown in the droplet Μ and the lower plate 1〇. The potential effect is generated. At this time, the static contact angle of the rabbit pressure V ' changes from 0 to 0 (V), 0 (ν) < 6) The size of the liquid ^14 reaches - scale, <9(V)<9G. At this time, the insulating layer 13°V is hydrophilic. When the switch 16 is re-opened, the surface plate 10 of the droplet is When there is no potential between the action, the static of the droplet 14 and the lower electrode are restored to the enthalpy. The above phenomenon is called the electro-flow on the material of the f-return 8 200912238 The principle of electrowetting effect on the dielectric material is utilized. PollackMG et al. of Duck University in the United States first carried out the motion control of micro-droplets based on the electrowetting effect on dielectric materials and micro-electrode arrays fabricated by micro-mechanics, and proposed "digital microfluidics (Digitai Microfluidics), the concept of '. The Cho SK people at the University of California, Los Angeles, successfully used the EWOD effect to perform four basic operations of generating, transmitting, mixing, and splitting microdroplets of diameter 7 μm, and at 25V AC voltage. Obtained a droplet movement speed of 250 mm/s (Cho SK, Moon H, Kim C J. Creating, Transporting,
Cutting， and Merging Liquid Droplets by Electrowetting-Based Actuation for Distal Microfluidic Circuits [J]. Journal of Microelectromechanical Systems, 2003, 12(1):70-80.)。可見，基於介質材料上之電潤濕效應係一 種十分有效之微流體控制技術。 【發明内容】 有鑒於此，有必要提供一種佔用體積小且具有較佳冷 卻性能之微型液體冷卻裝置，該微型液體冷卻裝置同時還 具有較好之靜音效果。 本發明還提供一種該微型液體冷卻裝置所採用之微液 滴產生器。 一種微液滴產生器，包括一第一極板及蓋設於該第一 極板上之一第二極板，其中該第一極板上設有複數呈間隔 分佈之條形之控制電極，該微液滴產生器對應所述控制電 接之與另一端分別設有至少一進液口與至少一出液 200912238 口，該第二極板上設有複數呈間隔分佈之條形之參考電 極’所述控制電極與參考電極對應呈交叉狀排列並藉由— 控制電路電連接，藉由所述控制電路規律性地在控制電極 與參考電極之間施加電壓，將自進液口進入到微液滴產生 為之冷卻液產生出液滴並沿至少一路控制電極向出液口運 動0 一種微型液體冷卻裝置，包括至少一吸熱體、至少_ 散熱體、一微液滴產生器及複數傳輸管，該等傳輸管將該 至少一吸熱體、至少一散熱體及微液滴產生器串接形成至 少-回路，所述回路中填充有一定量冷卻液，其中該微液 滴產生器包括一第一極板及蓋設於該第一極板上之一第二 極板，第一極板上設有複數呈間隔分佈之條形之控制電 極，該第二極板上設有複數呈間隔分佈之條形之參考電 ^ ’所述㈣電極與參考電極呈交叉狀剩域由一控制 %路％連接，藉由所述控制電路規律性地在控制電極與參 考電極之間施加電壓，驅動冷卻液在所述至少一回路中 環流動。 與習知液體冷卻裝置相比，本發明之微型液冷散熱裝 置中採m魅生n來對冷卻液進行傳輸。該微液滴 ^生器製作工藝簡單，適合進行微型化設計，可用於内部 1較小之電子裝肋對電子元件進行冷卻。賴液滴產 ^中卓極板上所设之控制電極與第二極板上所設之 :考電極呈父又翻’藉由外接之控制電路在所述控制電 極與參考電極之舰律性地施加電壓，可實現同時對液滴 200912238 進行多路傳輸，冷卻液之聽4大，從而使微魏體冷卻 裝置具有較佳之冷卻錄。另外，該微賴鼓@中，對 冷卻液傳輸未採用像幫浦這類機械傳動件，故呈 之 靜音效果。 < 【實施方式】 本發明曰在將基於介質材料上之電潤濕效應一 體控制技術應用於微型液體冷卻裝置中。 心 1 μ 如圖2所示為本發明微型液體冷卻裝置其中一較 佳實施例之立體組裝示意圖。該微型液體冷卻裝置2〇〇包 括-吸熱體20、-散熱體30、-微液滴產生器4〇及複數 傳輸管50。該吸熱體20、散熱體3〇及微液滴產生器4〇藉 由該等傳輸管50串接而形成一回路，該回路中填充有冷卻 液（圖未示）。該吸熱體20與一發熱電子元件熱連接並吸 收其所產生之熱量，該散熱體3〇用於對流經其内部之冷卻 液進行冷卻。在微液滴產生器4〇之驅動作用下，冷卻液在 該回路中循環流動，從而源源不斷地將吸熱體20所吸收之 熱量帶走。 該吸熱體20用於貼設在一發熱電子元件（圖未示）之 表面以吸收其所產生之熱量。在本實施例中，該吸熱體20 為一長方體塊狀之吸熱塊。該吸熱體20包括一上蓋21與 —底座22 ’該底座22内設有供冷卻液流經之流道（圖未 不）’該流道之入口及出口分別藉由傳輸管50與微液滴產 生器40及散熱體3〇相連通。該吸熱體20並不局限於圖2 令所示之形狀及結構，可根據不同之散熱需求，對該吸熱 11 200912238 體20進行合理地設計。 該散熱體30用於對經吸熱體20加熱後之冷卻液進行 冷卻。本實施例中，該散熱體3〇為一散熱器，其包括一基 座31及設於該基座31上之複數散熱片32。該基座31内 亦設有供冷卻液流經之流道（圖未示），該基座31内之流 道之入口及出口藉由傳輸管50分別與吸熱體2〇及微液滴 產生為40相連通。該基座31之流道内還可設置各種散熱 結構如散熱柱等以增加散熱體30與冷卻液間之換熱效 率。經基座31之流道之入口流入基座31内之冷卻液與散 熱體30進行熱交換，冷卻液被降低溫度後流向吸熱體2〇。 該散熱體30並不局限於圖2中所示之形狀及結構，該散熱 體30還可為其他之形狀及結構。例如用於筆記型電腦内 時，該散熱體30可為設於顯示幕背面 之一設有流道之冷卻 該微液滴產生器40包括一下極板 上之一上極板44、連接於下極板 如圖3及圖4所示’該微液 42、盍設於該下極板42上之一 42與上極板44間之相應之控制電路（圖未示兩支稽 件46以及第一、第二端蓋48、49。Cutting, and Merging Liquid Droplets by Electrowetting-Based Actuation for Distal Microfluidic Circuits [J]. Journal of Microelectromechanical Systems, 2003, 12(1): 70-80.). It can be seen that the electrowetting effect based on the dielectric material is a very effective microfluidic control technique. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a micro liquid cooling device that is small in size and has better cooling performance, and the micro liquid cooling device also has a good mute effect. The present invention also provides a micro liquid droplet generator for use in the micro liquid cooling device. A micro-droplet generator includes a first plate and a second plate disposed on the first plate, wherein the first plate is provided with a plurality of control electrodes spaced apart in a strip shape. The microdroplet generator is provided with at least one liquid inlet and at least one liquid outlet 200912238 corresponding to the other end of the control electric connection, and the second electrode plate is provided with a plurality of reference electrodes spaced apart in a strip shape. The control electrode and the reference electrode are arranged in a cross shape and are electrically connected by a control circuit. The control circuit regularly applies a voltage between the control electrode and the reference electrode to enter the micro inlet. The droplets are generated such that the coolant produces droplets and moves along at least one of the control electrodes toward the liquid outlet. A micro-liquid cooling device comprising at least one heat sink, at least a heat sink, a micro-droplet generator and a plurality of transfer tubes The transfer tube connects the at least one heat absorbing body, the at least one heat sink and the microdroplet generator in series to form at least a loop, wherein the loop is filled with a certain amount of coolant, wherein the microdroplet generator includes a first a plate and a second plate disposed on the first plate, wherein the first plate is provided with a plurality of control electrodes arranged in spaced stripes, and the second plate is provided with a plurality of spaced intervals The strip reference voltage ^ 'the (four) electrode and the reference electrode are crossed, and the remaining domain is connected by a control % path %, and the control circuit regularly applies a voltage between the control electrode and the reference electrode to drive the coolant A ring flows in the at least one circuit. Compared with the conventional liquid cooling device, the micro-liquid cold heat dissipating device of the present invention transmits the cooling liquid. The micro-droplet is simple in fabrication process and suitable for miniaturization design, and can be used for cooling the electronic components inside the smaller electronic ribs. The control electrode provided on the plate of the Lai droplets and the second electrode plate are provided: the test electrode is turned over by the parent and turned over by the control circuit of the external control circuit at the control electrode and the reference electrode. When the voltage is applied to the ground, the droplets 200912238 can be multiplexed at the same time, and the coolant is heard 4 times, so that the micro-wet body cooling device has a better cooling record. In addition, the micro-drum drum@中 has a silent transmission effect on the coolant transmission without using a mechanical transmission member such as a pump. <Embodiment of the Invention The present invention is applied to a micro-liquid cooling device using an electrowetting effect-based one-body control technique based on a dielectric material. Heart 1 μ As shown in Fig. 2, a perspective view of a preferred embodiment of the micro liquid cooling device of the present invention is shown. The micro liquid cooling device 2 includes a heat absorbing body 20, a heat sink 30, a micro droplet generator 4A, and a plurality of transfer tubes 50. The heat absorbing body 20, the heat dissipating body 3, and the micro-droplet generator 4 are connected in series by the transfer tubes 50 to form a circuit filled with a cooling liquid (not shown). The heat absorbing body 20 is thermally coupled to a heat generating electronic component and absorbs heat generated therefrom, and the heat radiating body 3 is used for cooling the coolant flowing through the inside thereof. Under the driving action of the micro-droplet generator 4, the cooling liquid circulates in the circuit, so that the heat absorbed by the heat absorbing body 20 is continuously taken away. The heat absorbing body 20 is for attaching to a surface of a heat-generating electronic component (not shown) to absorb the heat generated by the heat-absorbing body 20. In this embodiment, the heat absorbing body 20 is a heat block having a rectangular parallelepiped shape. The heat absorbing body 20 includes an upper cover 21 and a base 22'. The base 22 is provided with a flow passage through which the coolant flows (not shown). The inlet and the outlet of the flow passage are respectively passed through the transfer tube 50 and the micro droplets. The generator 40 and the heat sink 3 are connected to each other. The heat absorbing body 20 is not limited to the shape and structure shown in FIG. 2, and the heat absorbing body 11 200912238 can be reasonably designed according to different heat dissipation requirements. The heat sink 30 is for cooling the coolant heated by the heat absorbing body 20. In this embodiment, the heat sink 3 is a heat sink, and includes a base 31 and a plurality of heat sinks 32 disposed on the base 31. The base 31 is also provided with a flow passage (not shown) through which the coolant flows, and the inlet and the outlet of the flow passage in the base 31 are respectively generated by the transfer tube 50 and the heat absorbing body 2 and the micro droplets. Connected to 40 phases. Various heat dissipation structures such as heat dissipation columns may be disposed in the flow path of the base 31 to increase the heat exchange efficiency between the heat sink 30 and the coolant. The coolant flowing into the susceptor 31 through the inlet of the flow path of the susceptor 31 exchanges heat with the heat radiating body 30, and the coolant is cooled to a temperature, and then flows to the heat absorbing body 2''. The heat sink 30 is not limited to the shape and structure shown in Fig. 2. The heat sink 30 may have other shapes and configurations. For example, when used in a notebook computer, the heat sink 30 can be cooled by providing a flow path on one of the back surfaces of the display screen. The micro-droplet generator 40 includes an upper plate 44 on the lower plate and is connected to the lower plate. As shown in FIG. 3 and FIG. 4, the micro-liquid 42 and the corresponding control circuit disposed between one of the 42 and the upper plate 44 of the lower plate 42 (the two parts are not shown) 1. Second end caps 48, 49.
12 200912238 層424。該下基板421可蛊 ^ 力y 了為—破璃基板或一矽基板，在本 ΐ二自^下基板421為—破璃基板。該下基板421上 控制電極4端向右延伸之複數條形之控制電極422，該等 二面P22相互平仃亚間隔有—舰離。控制電極422 極4'22 2有’丨電層423，該介電層423係藉由在控制電 =\之表面沉積一層絕緣材料所形成。該介電層423之 表面覆盍有—層很薄疏水材料作為疏水層似。 5月繼績參照圖3，該下搞μ 士 控制電極42w ；^84™5上對絲一 5線428，所述引線428之内端與 用控制電極422連接，其外端延伸至下極板42之外側 外部之控制電路相連接。除與控制電路相連接之部 位外，所述引線428之表面亦覆蓋有一介電層。 構及^ 6所7^’該上極板44亦為—長方體板狀結 基板441、複數條形之參考電極撕、-介 2=3及一疏水層物（圖6所示）。該上基板441可 :璃基板或-梦基板’在本實施例中，該上基板扣 2破璃基板。該等參考電極442互相平行且間隔有—定 卞所述參考電極442之表面覆蓋有-層介電層443， H443係藉由在參考電極442之表 材料似介電層443之表面覆蓋有一層报薄之疏水 2 =水層444。該上基板祕上對絲一參考電極 如有-引線445,所述引、線445之内端與相應之 ^ 442相連接，料端延伸至上基板441之外側用來與 σ之控制電路相連接。除與控制電路相連接之部位外， 13 200912238 ..所述引線445之表面亦覆蓋有—層介電層。 . 如圖7所示’當上極板44蓋設於下極板42上時，上 • 極板44之參考電極442與下極板42之控制電極422呈十 字交叉排列’從而在該等控制電極422與參考電極* 重疊之位置形成複數控制區45。 請繼續參照圖3，該第―、第二端蓋48、49對應設於 :極板似之第—、第二凹槽你、427内，其中該第一端 蓋48上設有-進液口 ’該第二端蓋49上設有—出液口。 所舰液口包括-入口端481及多個出口端，其中進液口 之母出口^刀別與下極板42上相應之—控制電極似之 右端相對。所述出液口包括多個入口端491及-個出口 端，其中出液口之每一入口端491分別與下極板42上相應 之一控制電極422之左端相對。所述進液口之入口端481 及出口端之形狀與所述出液口之出口端及入口端舰之形 狀相對應，圖3中僅示進液口之入口端481及出液口之入 口端491。為防止冷卻液從第二端蓋49所設出液口之各入 口端491回流，還可在出液口之每一入口端491内設—個 單向閥。 該兩支撐件46均為狹長之板體，其設於下極板42與 上極板44之間以用於支樓上極板44。本實施例中，該兩 支樓件46為與上、下極板44、42相分離之板體。可以理 解地’該兩支撐件牝亦可與上極板44或者下極板42 —體 成型。 如圖3與圖5所示，將微液滴產生器4〇之各部件組裝 14 200912238 在一起時’該兩支撐件46設於下極板42上並位於下極板 42之控制電極422之兩側，該上極板44蓋設於該兩支撐 件46上，從而在下極板42與上極板44之間於對應每一控 制电極422之位置形成用於傳輸液滴之一液滴通道43(圖 6) °下極板42與上極板44上之引線428、445分別延伸至 下極板42與上極板44之外侧，以便於將引線428、445之 外端與外部之控制電路電連接。所述下極板42、上極板44 及支樓件46之間可直接粘合或藉由設置安裝孔再由螺絲 鎖合之方式固定在一起。該兩支撐件46對上極板44進行 支樓之同時還將微液滴產生器4〇之兩側進行密封。該第 ―、第二端蓋48、49分別收容於下極板42兩端所設第_、 第二凹槽426、427内並將上極板44夾設於該第一、第二 ^蓋48、49之間。所述下極板42與第一、第二端蓋48、 4 9之間可直接枯合或藉由設置安裝孔再由螺絲鎖合之方式 口疋在一起，仗而將微液滴產生器4〇之兩端密封。該第 、第二端蓋48、49安裝至下極板42兩端之第―、第一 凹槽426、427内時，第一端蓋48所設進液口之各出口端 分別與下極板42上相應之控制電極422之右端相對，而第 二端蓋49所設出液口之各入口端491則分別與下極板幻 上相應之控制電極422之左端相對，亦即每一液滴通道们 之右端與第一端蓋48上所設進液口之一出口端相對，其左 知則與弟一端蓋49上所設出液口之一入口端491相對 如圖2所示’將微型液體冷卻裴置2〇〇組裝在_起時， 藉由傳輸管50將微液滴產生器4〇、吸熱體2〇及散熱體邓 15 200912238 =從而形成—回路，在該回路中充入一定 液该冷部液為可電解、可極化、 液體。在本實施例中，該丰tb力或f電之 器 々部液為去離子水。微液滴產生 422夢由私14之參考電極442及下極板42之控制電極 制♦二線與外部之控制電路進行電連接。該外接之控 極板44上之任-參考電 之夕上之多個控制電極422與下極板44上 電極似舆參考電極二==广在所述控制 用。該外接之控制電路採用電區45產生電勢作 :Γ::之時，先後順序進===: 電路中之_制，該外接之控 方去及大小之控制方法物常規之控制方法。 沿下==至圖8(:所示，液滴之產生過程為（僅以液滴 為例）中央之其中，_ 422e產生出來 液口 i入先，從微液滴產生器40之第一端蓋你所設進 =之入口端進入到微液滴產生器40之冷卻液將合 制電極422之右端；當冷卻液 曰二 時，藉由外接之控制電路對控制電極处與= 用，由2間施加―糕，從而在控制區45a產生電勢作 濕效應，與該控制區45a相接觸之冷卻液之 角變小表現為冷卻液之表面張力之 4加之祕達到—定值時，冷卻液會沿控制電極 16 200912238 422c向左運動（圖8A所示）；冷卻液運動至與控制區 之邊緣相接觸時，對控制電極422c與參考電極442a之間 施加電壓之同時對控制電極422c與參考電極442b之間亦 施加同樣之電壓’從而使冷卻液沿控制電極422(；繼續向左 運動（圖8B所示）；當冷卻液運動至與控制區45c之邊緣 接觸時’對控制電極微與參考電極條之間施加電壓 之同時取消控制電極422c與參考電極44%之間所施加之 電壓，冷卻液將在控制區45b處斷開，從而形成液滴D (圖 8C所示）。 如圖SC至圖SE所示’液滴D之傳輪過程為（僅以上 述產生出之液滴D沿下極板42之控制電極徽運動為 例）.當產生出之液滴D運動至與控制區45d之邊緣相接 觸對控制電極422c與參考電極彻之間施加電壓之 Γ爾制電極似與參考電極♦之間所施加之電 仗而使液滴D由控制區45c運動到押制區 〆 滴D運動至與控制區必 工卜，备液 違緣相接觸時’對控制電極422c ^考=條之間施加錢之同時取消控㈣極422c 二H % °彻之間所施加之電壓，從而使液滴D由，制 :45運動到控制區運動 左側邊緣時，_綱極422e^之 第二端D因具有—定逮度會輯向左運動並沿 上，、控制電極422c之左 進入到第二端蓋49内。 為相對之人口端49lc 圖从至圖犯中僅示出液滴D產生並沿下極板42之 17 200912238 電極422嗜輸過程，可㈣解地，藉由外接之 可同時產=他控制電極422與參考電極442進行控制， 加單位時_細咖輸量。422傳輪攸而増 ^參照圖2,微型液體冷卻系統·工作時，吸 料卜於—發熱電子元件（圖未示）上。利用外接之 律性侧下極板42之控制電細與上極板 ’考电極442之接通或斷開，從而實現液滴之產生並 使j液滴通道43向左傳輸。液滴傳到控制電極似之最 左端％•因具有-定速度會繼續向前運動，並經第二端蓋奶 ^出液口之入口端491流入到該第二端蓋49内。藉由控 |私路進仃規律性之循環控制’就可以不斷地將從第一端 ^48進入之冷卻液產生出液滴並沿控制電極傳輸到第二 ，蓋49内’ A而將第二端蓋49内之冷卻液壓出並經傳輸 & 50机向吸熱體20。冷卻液在吸熱體2〇内與吸熱體2〇 發生熱交換，被加熱之冷卻液經傳輸f 5Q流向散教體3〇， 冷卻液經散鐘30冷卻後再轉鮮5Q流向微液滴產生 器40’並經微液滴產生器4〇之第一端蓋48所設進液口流 回至微液滴產生H 40内，從而完成—次循環流動。 該微型液體冷卻系統2〇〇中，由吸熱體2〇、散熱體3〇、 微液滴產生器40及傳輸管50串接形成一回路，吸熱體2〇 用來吸收電子所產生之熱量’該微液滴產生器4〇對冷卻液 進行傳輸’使冷卻液在該回路中循環流動，從而源源不斷 地將吸熱體20所吸收之熱量帶走。 18 200912238 該微液滴產生器40中，上極板料與下極板42均可採 制程技術進2作1作卫藝簡單，適合進行微型 對;；用於内:空間較小之筆記型電腦等電子裝置内 1子讀進行散熱。下極板42上之控制電極422與上極 ^偷上^參考電極442均設計成條形，上極板44蓋設於 下極板42上時，該等控制電極422與參考電極術呈十字 父又狀排列，只需要少數幾條控制電極似歲 就可以在控制電極似與參考電極442相重疊:= 二個控制區45。藉由外接之控制電路對該等 律性地施加電壓，可實現同時對多個液滴進行多路傳輪， t部液之傳輸量大’從而使微型液體冷卻裝置勘具有較 ==性犯。另外’該微型液體冷卻裝置2QQ中，採用 生器40來對冷卻液進行傳輪，沒有像幫浦這類機 械傳動件，故具有良好之靜音效果。 V. 、上述實施例中，微液滴產生器4〇之下_42之兩端 为別設有第-、第二凹槽426、427，第一、第 =收容於該第-、第二凹槽426、427内以將微^產生 盗4〇之兩端密封。可以理解地，該第一、第 49亦可與下極板42或上_44 一體成型，當第一、第二 端蓋48、49與下極板42 —體成型時，則不需要在下極板 42之兩端設置第一、第二凹槽426、427。 一上述實施例中，微液滴產生器40之進液口設於第—端 ^ 48上。可以理解地，該微液滴產生器40之進液口亦可 叹置於上極板44上並與控制電極422之右端相對。另外， 19 200912238 亦可將進液σ之多個出口端設置成-個整的出口端。 上述實施例中，微液滴產生器40之下極板42與上極 板44之間設有兩支撐件46’從而在下板板42與上極板44 之間對應每一控制電極422形成用於傳輸液滴之液滴通道 43 °可以理解地，該下極板42與上極板44之間亦可不設 置支撐件46 ’此種情況下，藉由在下極板42上凹設若幹 細長之槽體’ _體之兩端分別與微㈣產生器40之進液 口及出液ϋ相連通’該上極板44紐蓋設於該下極板42 上，k而在所述槽體之位置形成傳輸液滴之液滴通道。該 槽體之I度與控制電極422之寬度相同或略大於控制電極 422之i度，母一控制電極422對應設於一槽體内。 如圖9所示為本發明微形液體冷卻裝置第二實施例之 立體組裝不意圖，該微形液體冷卻裝置600包括兩吸熱體 61、兩散熱體62、一微液滴產生器7〇及複數傳輸管64。 請一併參考圖10，微液滴產生器7〇中，第一端蓋71設有 第一、第二進液口，第二端蓋72上相應地設有第一、第二 出液口。所述第一進液口設有一入口端乃13與三個出口 端，该二個出口端分別與下極板73上之控制電極、 731b、731c之右端相對，與第一進液口相對應第一出液口 設有三個入口端721a、721b、721c與一個出口端，該三個 入口端721a、721b、721c分別與下極板73上之控制電極 731a、731b、731c之左端相對。所述第二進液口設有—入 口端711b及兩個出口端，該兩個出口端分別與下極板乃 上之控制電極731d、731e之右端相對，與第二進液口相對 200912238 應第二出液口設有兩個入口端721d、721e與一個出口端， 該兩個入口端721d、721e分別與下極板73上之控制電極 731d、731e之左端相對。所述進液口之入口端及出口端之 形狀與所述出液口之出口端及入口端之形狀相對應，圖1〇 中僅示出進液口之入口端711a、711b及出液口之入口端 721a 721b、721c、721d、721e。該兩吸熱體 61、兩散熱 體62—及微㈣產生器7Q藉由傳輸f &連接形成兩個回 路’母-回路中串接有—吸熱體61與―散熱體62。該微 液滴產生ϋ 70在外接之控制電路之控制作用下，冷卻液可 分別在該兩個回路中猶環流動。將該微型液體冷卻裝置_ 之兩吸熱體61分顺—發熱電子元件熱連接，從而可實現 同時對兩個電子元件散熱，比如同時對筆記型電腦中之 CPU及顯卡ΒΒ>；散熱。藉由外接之控制電路控制，可精確 地控制每1財之冷麵之流量，以實賴不同發孰量 之電子元件分配相對應之冷卻液量，使冷卻液得到合理地 利用’且在財較小内部安 源散熱。 丨口… 利申本發卿合發料财件，爰依法提出專12 200912238 Layer 424. The lower substrate 421 can be used as a glass substrate or a substrate, and the substrate 421 is a glass substrate. The lower substrate 421 has a plurality of strip-shaped control electrodes 422 extending toward the right side of the control electrode 4, and the two sides P22 are spaced apart from each other by a ship. Control electrode 422 pole 4'22 2 has a germanium layer 423 formed by depositing a layer of insulating material on the surface of the control circuit. The surface of the dielectric layer 423 is covered with a thin layer of hydrophobic material as a hydrophobic layer. In May, the succession is shown in Fig. 3. The lower end of the lead 428 is connected to the control electrode 422, and the outer end of the lead 428 is extended to the lower pole. Control circuits external to the outside of the board 42 are connected. The surface of the lead 428 is also covered with a dielectric layer in addition to the portion connected to the control circuit. The upper plate 44 is also a rectangular parallelepiped plate substrate 441, a plurality of strip-shaped reference electrode tears, a dielectric layer 2 = 3, and a hydrophobic layer (shown in Fig. 6). The upper substrate 441 can be a glass substrate or a dream substrate. In the present embodiment, the upper substrate is bonded to the glass substrate. The reference electrodes 442 are parallel to each other and spaced apart from each other. The surface of the reference electrode 442 is covered with a dielectric layer 443. The H443 is covered with a layer on the surface of the reference electrode 443. The hydrophobicity of the thin film 2 = the water layer 444. The upper substrate is opposite to the wire-reference electrode, such as a lead 445. The inner end of the lead wire 445 is connected to the corresponding 442, and the material end extends to the outer side of the upper substrate 441 for connection with the σ control circuit. . In addition to the portion connected to the control circuit, the surface of the lead 445 is also covered with a dielectric layer. As shown in Fig. 7, when the upper plate 44 is placed on the lower plate 42, the reference electrode 442 of the upper plate 44 and the control electrode 422 of the lower plate 42 are arranged in a crisscross pattern. A position where the electrode 422 overlaps with the reference electrode * forms a complex control region 45. Referring to FIG. 3, the first and second end covers 48, 49 are correspondingly disposed on the first plate, the second groove, and the second groove. The first end cover 48 is provided with a liquid inlet. The mouth of the second end cover 49 is provided with a liquid outlet. The ship's liquid port includes an inlet end 481 and a plurality of outlet ends, wherein the female outlet of the inlet port is opposite to the corresponding control electrode on the lower plate 42. The liquid outlet includes a plurality of inlet ends 491 and an outlet end, wherein each inlet end 491 of the liquid outlet is opposite to a left end of a corresponding one of the control electrodes 422 of the lower plate 42. The shape of the inlet end 481 and the outlet end of the liquid inlet corresponds to the shape of the outlet end of the liquid outlet and the shape of the inlet end. Only the inlet end 481 of the inlet port and the inlet of the liquid outlet are shown in FIG. End 491. In order to prevent the coolant from flowing back from the inlet ends 491 of the liquid outlet provided by the second end cap 49, a one-way valve may be provided in each inlet end 491 of the liquid outlet. The two support members 46 are both elongated and disposed between the lower plate 42 and the upper plate 44 for supporting the upper plate 44. In this embodiment, the two floor members 46 are separate from the upper and lower plates 44, 42. It can be understood that the two support members can also be integrally formed with the upper plate 44 or the lower plate 42. As shown in FIG. 3 and FIG. 5, when the components of the micro-droplet generator 4 are assembled 14 200912238 together, the two support members 46 are disposed on the lower plate 42 and located at the control electrode 422 of the lower plate 42. On both sides, the upper plate 44 is disposed on the two supporting members 46, so as to form a droplet for transporting droplets between the lower plate 42 and the upper plate 44 at a position corresponding to each of the control electrodes 422. Channels 43 (FIG. 6) The lower plates 42 and the leads 428, 445 on the upper plate 44 extend to the outside of the lower plate 42 and the upper plate 44, respectively, so as to connect the outer ends of the leads 428, 445 to the outside. The control circuit is electrically connected. The lower plate 42, the upper plate 44 and the branch member 46 may be directly bonded or fixed by screwing together by providing mounting holes. The two support members 46 seal the sides of the micro-droplet generator 4 while supporting the upper plate 44. The first and second end covers 48 and 49 are respectively received in the first and second recesses 426 and 427 disposed at opposite ends of the lower plate 42 and the upper plate 44 is sandwiched between the first and second covers. Between 48 and 49. The lower plate 42 and the first and second end covers 48, 49 can be directly slid together or by means of a mounting hole and then screwed together to form a micro-droplet generator. The ends of the 4 inch are sealed. When the first and second end covers 48, 49 are mounted in the first and first recesses 426, 427 at the two ends of the lower plate 42, the outlet ends of the first end cover 48 are respectively connected to the lower end and the lower end. The right end of the corresponding control electrode 422 on the plate 42 is opposite, and the inlet ends 491 of the liquid outlet of the second end cover 49 are respectively opposite to the left end of the corresponding control electrode 422 of the lower plate, that is, each liquid The right end of the drop channel is opposite to the outlet end of one of the liquid inlets provided on the first end cover 48, and the left end is opposite to the inlet end 491 of one of the liquid outlets provided on the other end cover 49 as shown in FIG. When the micro liquid cooling device is assembled, the microdroplet generator 4, the heat absorbing body 2, and the heat sink Deng 15 200912238 are formed by the transfer tube 50, thereby forming a loop in which the circuit is filled. Certain liquid The cold liquid is electrolyzable, polarizable, and liquid. In this embodiment, the abundance of tb force or f is the deionized water. The microdroplet generation 422 is controlled by the reference electrode 442 of the private 14 and the control electrode of the lower plate 42. The second wire is electrically connected to the external control circuit. The plurality of control electrodes 422 on the eclipse of the external control plate 44 and the upper electrode of the lower plate 44 are similar to the reference electrode === widely used for the control. The external control circuit uses the electrical region 45 to generate an electric potential for: Γ::, in the order of ===: in the circuit, the external control method and the control method of the size control method. Along the bottom == to Figure 8 (:, the process of generating droplets is (in the case of droplets only), where _ 422e produces the liquid port i first, from the first of the microdroplet generator 40 The coolant at the inlet end of the end cap that enters the microdroplet generator 40 will be the right end of the electrode 422; when the coolant is at the second end, the control electrode is connected to the control electrode by the external control circuit. By applying two cakes, a potential is generated in the control zone 45a as a wet effect, and the angle of the coolant in contact with the control zone 45a becomes smaller as the surface tension of the coolant is increased to a constant value. The liquid moves to the left along the control electrode 16 200912238 422c (shown in FIG. 8A); when the coolant moves to contact the edge of the control region, a voltage is applied between the control electrode 422c and the reference electrode 442a while the control electrode 422c is The same voltage is applied between the reference electrodes 442b to cause the coolant to move along the control electrode 422 (continuation to the left (shown in FIG. 8B); when the coolant moves to contact the edge of the control region 45c' to the control electrode Apply voltage to the reference electrode strip While the voltage applied between the control electrode 422c and the reference electrode 44% is canceled, the coolant will be broken at the control region 45b, thereby forming a droplet D (shown in Fig. 8C) as shown in Fig. SC to Fig. SE. The transfer process of the droplet D is (only taking the movement of the droplet D generated as described above along the control electrode of the lower plate 42 as an example). When the generated droplet D moves to contact the edge of the control region 45d, The control electrode 422c and the reference electrode are respectively applied with a voltage between the electrode and the reference electrode ♦, so that the droplet D is moved from the control region 45c to the shackle D movement to the control region. Must work, when the liquid is in contact with the contact, 'the control electrode 422c ^ test = between the strips while the money is applied to cancel the control (four) pole 422c two H % ° ° between the applied voltage, so that the droplet D, System: 45 movement to the left edge of the control zone movement, the second end D of the _ _ 420e ^ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ For the relative population end 49lc, only the droplet D is generated from the map to the bottom of the lower plate 42. 0912238 Electrode 422 is a process of dragging, which can be (4) solved by ground, and can be simultaneously produced by external connection = control electrode 422 and reference electrode 442 are controlled. When adding unit, the amount of fine coffee is transmitted. 422 transmits the wheel and 増 ^ Refer to Figure 2 , Micro-liquid cooling system · During operation, the suction material is on the heating electronic component (not shown). The control circuit of the externally-adjusted side lower plate 42 is connected to the upper electrode plate 442. Or disconnected, thereby achieving the generation of droplets and transferring the j droplet channel 43 to the left. The droplets are transmitted to the leftmost end of the control electrode. % • The movement will continue to move forward due to the constant velocity, and the second end cap The inlet end 491 of the milk outlet port flows into the second end cap 49. By controlling the loop control of the regularity of the private road, it is possible to continuously generate droplets from the coolant entering the first end ^48 and transfer it along the control electrode to the second, and the cover 49 is 'A' The cooling in the two end caps 49 is hydraulically discharged and transmitted to the heat absorbing body 20 via the transmission & The cooling liquid exchanges heat with the heat absorbing body 2〇 in the heat absorbing body 2〇, and the heated cooling liquid flows to the scattered body 3〇 through the transmission f 5Q, and the cooling liquid is cooled by the loose clock 30, and then the fresh 5Q flow is generated to the micro droplets. The device 40' is flowed back into the micro-droplet generation H 40 via the liquid inlet provided by the first end cap 48 of the micro-droplet generator 4, thereby completing the --cycle flow. In the micro liquid cooling system, a heat absorbing body 2, a heat sink 3, a microdroplet generator 40, and a transfer tube 50 are connected in series to form a circuit, and the heat absorbing body 2 is used to absorb heat generated by electrons. The micro-droplet generator 4 〇 transmits the coolant to 'circulate the coolant in the loop, so that the heat absorbed by the heat absorber 20 is continuously taken away. 18 200912238 In the micro-droplet generator 40, the upper plate and the lower plate 42 can be processed by the process technology and made into a single 1 for a simple, suitable for micro-pair; for internal: a small space type notebook In a computer such as a computer, 1 sub-reading is performed to dissipate heat. The control electrode 422 on the lower plate 42 and the upper electrode and the reference electrode 442 are both designed in a strip shape. When the upper plate 44 is placed on the lower plate 42, the control electrodes 422 and the reference electrode are crossed. The parent is arranged in a shape, and only a few control electrodes are required to be old enough to overlap the reference electrode 442 at the control electrode: = two control regions 45. By applying a voltage to the law by an external control circuit, it is possible to carry out multi-passing of a plurality of droplets at the same time, and the amount of liquid transported by the t-liquid is large, so that the micro-liquid cooling device has a comparison of == sex . Further, in the micro-liquid cooling device 2QQ, the developer 40 is used to transfer the coolant, and there is no mechanical transmission member such as a pump, so that it has a good mute effect. V. In the above embodiment, the ends of the micro-droplet generator 4 below the _42 are provided with the first and second grooves 426, 427, and the first and the second are accommodated in the first and second The grooves 426, 427 are sealed to seal the ends of the microcrow. It can be understood that the first and the 49th can also be integrally formed with the lower plate 42 or the upper plate 44. When the first and second end covers 48, 49 and the lower plate 42 are integrally formed, the lower pole is not required. First and second grooves 426, 427 are disposed at both ends of the plate 42. In the above embodiment, the liquid inlet of the microdroplet generator 40 is disposed at the first end ^ 48. It will be understood that the liquid inlet of the microdroplet generator 40 may also be placed on the upper plate 44 and opposed to the right end of the control electrode 422. In addition, 19 200912238 may also set a plurality of outlet ends of the inlet σ to a complete outlet end. In the above embodiment, two support members 46' are disposed between the lower plate 42 and the upper plate 44 of the micro-droplet generator 40 so as to form a corresponding control electrode 422 between the lower plate 42 and the upper plate 44. In the case of the droplet channel 43 for transporting the droplets, it is understood that the support member 46' may not be disposed between the lower plate 42 and the upper plate 44. In this case, a plurality of elongated portions are recessed on the lower plate 42. The two ends of the tank body _ body are respectively connected with the liquid inlet port and the liquid discharge port of the micro (four) generator 40. The upper plate 44 is disposed on the lower plate 42 and k is in the groove body. The location forms a droplet channel that transports droplets. The I degree of the groove is the same as or slightly larger than the width of the control electrode 422, and the mother-control electrode 422 is correspondingly disposed in a groove. FIG. 9 is a schematic view showing the three-dimensional assembly of the second embodiment of the micro-liquid cooling device of the present invention. The micro-liquid cooling device 600 includes two heat absorbing bodies 61, two heat sinks 62, and a micro-droplet generator. A plurality of transfer tubes 64. Referring to FIG. 10 together, in the micro-droplet generator 7, the first end cover 71 is provided with first and second liquid inlets, and the second end cover 72 is correspondingly provided with first and second liquid outlets. . The first liquid inlet is provided with an inlet end 13 and three outlet ends, and the two outlet ends are respectively opposite to the right ends of the control electrodes 731b and 731c on the lower plate 73, corresponding to the first inlet port. The first liquid outlet is provided with three inlet ends 721a, 721b, 721c and one outlet end, and the three inlet ends 721a, 721b, 721c are respectively opposed to the left ends of the control electrodes 731a, 731b, 731c on the lower plate 73. The second liquid inlet is provided with an inlet end 711b and two outlet ends respectively opposite to the right end of the control electrodes 731d, 731e on the lower plate, and the second inlet port is opposite to the 200912238 The second liquid outlet is provided with two inlet ends 721d, 721e and one outlet end, and the two inlet ends 721d, 721e are respectively opposed to the left ends of the control electrodes 731d, 731e on the lower plate 73. The shape of the inlet end and the outlet end of the liquid inlet corresponds to the shape of the outlet end and the inlet end of the liquid outlet, and only the inlet ends 711a, 711b and the liquid outlet of the liquid inlet are shown in FIG. The inlet ends 721a 721b, 721c, 721d, 721e. The two heat absorbing bodies 61, the two heat sinks 62 and the micro (4) generators 7Q are connected by a transmission f & a two-way 'mother-circuit is connected in series with the heat absorbing body 61 and the heat sink 62. The micro-droplet generation ϋ 70 is controlled by an external control circuit, and the coolant can flow in the two loops respectively. The two liquid heat absorbing devices _ the two heat absorbing bodies 61 are branched and the heat generating electronic components are thermally connected, so that heat can be dissipated to the two electronic components at the same time, for example, the CPU and the graphics card in the notebook computer are simultaneously cooled. By controlling the external control circuit, the flow rate of each cold surface can be accurately controlled, so that the amount of coolant corresponding to the different electronic components can be allocated to make the coolant be used reasonably. Small internal source heat dissipation.丨口... Lishen Benfa issued a joint financial statement, and proposed a special
熟悉本案技藝之人士 J H比# 友依本1明精神所作之等效修飾 或交化，皆應涵蓋於以下之中請專利範圍内。 【圖式簡單說明】 圖，與為介質材料上之電潤濕效應原理之示意 21 200912238 、圖1A為不加電壓時，液滴之靜態接觸角為θ〇>9〇。之 情況； 圖1Β為施加一定電壓作訂，液滴之靜態接觸角為Θ (V)<9〇。之情況。 圖2係本發明微型液體冷卻裝置第—實施例之立體也 裝不意圖。 圖3係圖2所示微型液體冷卻裝置中微液滴產生器之 立體分解示意圖。 圖4係圖3中微液滴產生器之上極板倒轉後之 意圖。 ® 5係圖3中微液滴產生器之立體組裝示意圖。 圖6係圖5所示微液滴產生器之局部剖視圖。 圖7係表示圖5中下極板上之控制電極與上極板上之 參考電極之間位置關係之示意圖。 圖8A至圖8E係表示液滴之產生及傳輸過程之示意 圖。- ^ 圖9係本發明微型液體冷卻裝置第二實施例之立體分 解示意圖。 圖10係圖9所示微型液體冷卻裴置中微液滴產生器之 立體分解示意圖。 【主要元件符號說明】 〈本發明〉 微型液體冷卻裝置 200、600 吸熱體 20、61 上蓋 21 22 200912238Anyone who is familiar with the skill of this case J H than #友友 According to the spirit of this spirit, the equivalent modification or cross-linking should be covered in the following patents. [Simple diagram of the diagram] Figure, and the principle of electrowetting effect on the dielectric material 21 200912238, Figure 1A shows that the static contact angle of the droplet is θ〇>9〇 when no voltage is applied. In the case of Fig. 1 , a certain voltage is applied, and the static contact angle of the droplet is Θ (V) < 9 〇. The situation. Fig. 2 is a perspective view of the first embodiment of the micro-liquid cooling device of the present invention. Figure 3 is a perspective exploded view of the micro-droplet generator of the micro-liquid cooling device shown in Figure 2. Figure 4 is an illustration of the reverse of the upper plate of the microdroplet generator of Figure 3. ® 5 is a schematic diagram of the three-dimensional assembly of the microdroplet generator in Figure 3. Figure 6 is a partial cross-sectional view of the microdroplet generator of Figure 5. Fig. 7 is a view showing the positional relationship between the control electrode on the lower plate of Fig. 5 and the reference electrode on the upper plate. 8A to 8E are schematic views showing the process of generating and transporting droplets. - ^ Figure 9 is a perspective exploded view of a second embodiment of the micro-liquid cooling device of the present invention. Figure 10 is a perspective exploded view of the microdroplet generator in the micro liquid cooling device shown in Figure 9. [Description of main component symbols] <The present invention> Micro liquid cooling device 200, 600 Heat absorbing body 20, 61 Upper cover 21 22 200912238
底座 22 散熱體 30、62 基座 31 散熱片 32 微液滴產生器 40、70 下極板 42 下基板 421、73 介電層 423 、 443 疏水層 424 、 444 表面 425 第一凹槽 426 第二凹槽 427 引線 428 、 445 上極板 44 上基板 441 支撐件 46 第一端蓋 48 > 71 第二端蓋 49、72 傳輸管 50、64 液滴 D 控制電極 422、422c、731a、731b、731c、731d、731e 參考電極 442、442a、442b、422c、442d、442e 控制區 45、45a、45b、45c、45d、45e ^ 481、491、491c、711a、711b、721a、721b、 入口端 721c、721d、721e <習知> 下極板 10 基底 11 下電極層 12 絕緣層 13 液滴 14 上電極 15 開關 16 可調電源 17 靜態接觸角 θο ' θ(ν) 23Base 22 heat sink 30, 62 pedestal 31 heat sink 32 microdroplet generator 40, 70 lower plate 42 lower substrate 421, 73 dielectric layer 423, 443 hydrophobic layer 424, 444 surface 425 first groove 426 second Groove 427 lead 428, 445 upper plate 44 upper substrate 441 support 46 first end cover 48 > 71 second end cover 49, 72 transfer tube 50, 64 drop D control electrode 422, 422c, 731a, 731b, 731c, 731d, 731e reference electrodes 442, 442a, 442b, 422c, 442d, 442e control regions 45, 45a, 45b, 45c, 45d, 45e ^ 481, 491, 491c, 711a, 711b, 721a, 721b, inlet end 721c, 721d, 721e <conventional> lower plate 10 substrate 11 lower electrode layer 12 insulating layer 13 droplet 14 upper electrode 15 switch 16 adjustable power supply 17 static contact angle θο ' θ(ν) 23