200907533 - 九、發明說明： . 【發明所屬之技術領域】 本發明關於一種相機模組，尤其係關於具有電磁防 護能力之相機模組。 【先前技術】 隨著電子科技之不斷發展與進步，各式各樣之電子 產品均朝著數位化發展。並且，為了符合輕便性與實用 性之需要’在電子產品之設計規格上’都趨向輕薄短小、 功能多、且處理速度快發展，以利於製作之產品能更容 易攜帶；且更符合現代之生活需求。特別係在多媒體電 腦大行其道後，強大的運算能力，可輕易地處理各種音 效、影像、圖樣等數位化資料。連帶的使與影像有關之 周邊設備，亦受到廣泛之發展與運用。例如，個人數位 處理器、數位音響、掃描器以及數位相機等。 例如，以目前極為流行之個人數位助理系統來說， 便由於其方便攜帶，可處理大量數位資訊，並可通過相 ' 關之通訊裝置取得即時關鍵字因此受到社會大眾普遍喜 愛與使用。特別係隨著積體電路技術之發展，具有相機 模組之個人數位助理系統具有更強大的運算功能，且記 憶體容量不斷增加係以愈來愈多之謀劃應用軟體、資料 庫等皆被存放於小巧的個人數位助理系統中，並籍著結 合網際網路與通訊系統，而使個人數位助理器具有影像 攝取及多媒體播放的功能。 然而，隨著積體電路越趨密集，為了改善應用於相 7 200907533 機或手機等之相機模組攝取之影像之效果與能力，相機 模組之電磁遮蔽技術也要求越來越高。 現有一種可降低相機模組電磁干擾之裝置，如圖1 所示’為-相機模組用電路板本體i，該電路板本體1 Γ圖有未至干"^^^板讀電連狀轉接π 2，鏡頭模級 (Θ二）·1 又置於电路板本體1之相對於地線接口 2 側’並與5亥電路板本f 1 I $、查垃 敗之膏… 接，以將鏡頭模組所獲 取之:像《傳輸給魏板本體丨， 該影像訊號傳輪出去 Μ體1再將 遮蔽罩3,該遮蔽罩3之^所7"為_模組電磁遮蔽用 1之地線如與魏板本體 罩3罩設***述電路二孔連接之導電泡棉4。該遮蔽 上述防護相機二=以及鏡頭模組。 部設置之導電擾技術係通過遮蔽罩3底 電氣連接，即導*Μ〜之電路板本體1之地線接口2 導除靜電，同“用^與地線接口 2之相應貼合，以 波加以阻戴以達磁:罩3對電子70件所產生之電磁 導電泡棉4與之作用。但是這種方法會因 ^ ^ , ^ 2之公差尺寸之原因會導致接觸 不良〜響電磁遮蔽效果。 【發明内容】 有鑒於此，右"西上 相機模組。有必要提供—種能提高電磁遮罩效果之 一種相機楔έ 設置於鏡頭料像㈣、包括—用於成像之鏡頭模組，一 像側且具有至少一地線接口之電路板， 8 200907533 一設置於所述鏡頭模組及電路板外侧之防護裝置。該相 機模組還包括與所述至少一地線接口電氣連接之導電 片，該導電片從電路板邊緣延伸而出，且該導電片延伸 出電路板之部分收容於防護裝置並與該防護裝置電氣連 接。 上述相機模組利用導電片之彈力將導電片壓在防護 裝置之側壁上，從而將電路板之地線接口與防護裝置導 通，從而完成消除靜電，而且由於導電片之可撓性及彈 性，使得導電片緊貼防護裝置，避免了接觸不良之現象。 【實施方式】 下面將結合附圖，舉一較佳實施例並配合圖式詳細 描述如下。 請參閱圖3及圖4，本發明實施例之所提供之相機 模組包括一用於成像之鏡頭模組10，一設置於所述鏡頭 模組10像侧且具有至少一地線接口 111之電路板11，一 設置於所述鏡頭模組10及電路板111外側之防護裝置12 ' 以及一與所述地線接口 111電氣連接之導電片13。 所述鏡頭模組10包括一鏡筒101，至少一收容於鏡 筒101中之鏡片102, 一套接於所述鏡筒101之像側端之 鏡座103以及一收容於鏡座103内且位於鏡座103之遠 離鏡筒101 —侧之影像感測器104。在本實施例中，該鏡 筒101與所述鏡座103相連之一端之外側還設置有外螺 紋105,在所述鏡座103之内側設置有與鏡筒101之外螺 紋105相配合之内螺紋106,用於與鏡筒101螺紋連接以 9 200907533 便於鏡筒101沿鏡座1〇3軸線移動。 “像感測器1〇4包括_影像感測晶片1〇7及一用 於放置。亥影像感測晶片107且與該影像感測晶片⑽電 連接之基板1G8。該影像感剛器1()4用於感測來自鏡片 1〇2之光並將其轉換為電訊號以便於相機處理器（圖未示) 處理所述基板108用於與電路板u相連，用於將該影 像感測器104所獲得之數據傳輸出去。 所述電路板11包括-電路板基板112，至少一貼附 於基板112上之地線接口川，至少一固接於該電路板基 板112上且位於地線接0 lu相對面之焊盤⑴以及一 條用於傳輪數據之數據線115。 R所述電路板11可以為印刷線電路板(Printed Circuit =，，f)。該電路板可將具有特定功能之電子 子：器件夕:鑲之亥p巧板上。而且除了固定各種小的電 之電:接。：上紐元_供相互 10之影像感測器電路板係指用於與鏡頭模組 測器HM所獲得之數據連接之電路板U，以傳輸影像感 f绫路板基板112為-絕緣層，其材料可以為由 =^，所製作成，且所述電路板基板 印刷在===112上可刪職術將電路 所述地線接“ ^路、電阻等電子元件（圖未示）。 導除電路板u内各電子?1電路板基板112上，用於 凡器件中存在之靜電。所述地線 200907533 接口 111與電路板11之印刷電路（圖未示）電連接。該地 線接口 111可以為一個或複數個，在本實施例中，該地 線接口 111有兩個。 所述纟干盤114設置在電路板基板112之相對於設置 地線接口 ill表面之另一面上，且該複數焊盤114暴露 於电路板11之表面，該複數焊盤114用於與影像感測器 104之基板1〇8電氣連接。 所述數據線115與電路板U之焊盤114電氣連接。 該數據線115用於將輸人電路板11之數據傳輸出去。 所述防護裝置12可以為一個無底筒形結構，其套設 ^、兄頭模、.且1 〇及電路板η之外側。該防護裝置12之材 貝可以為金屬或導電橡膠。在本實施例中，|亥防護裝置 12之材f為導電橡膠。該防護裝置12之靠近電路板η 壁底端上設置有—開σ 12卜用於引出電路板11之 ^ 且°玄開口 121之I度與數據線115之寬度相 所述導f片13可以與職地線接口⑴—體成型， 通過焊接、膠財方法與所述地線接口⑴ 接口 m通例 述導電片13與所述地線 可以為銅:^雙面導電膠M相連，該導電片13之材料 接口 二可以想到的是，若該導電片u與地線 材質相同。以W電片13與地線接口⑴所用 該導電片路板U邊緣延伸而出，且200907533 - IX. INSTRUCTIONS: 1. Field of the Invention The present invention relates to a camera module, and more particularly to a camera module having electromagnetic protection capability. [Prior Art] With the continuous development and advancement of electronic technology, all kinds of electronic products are moving toward digitalization. In addition, in order to meet the needs of portability and practicability, 'the design specifications of electronic products' tend to be thin, short, multi-functional, and processing speed, so that the products can be more easily carried; and more in line with modern life. demand. In particular, after the multimedia computer is popular, it has powerful computing power and can easily process digital information such as various sound effects, images, and patterns. The accompanying imaging-related peripherals are also widely used and developed. For example, personal digital processors, digital audio, scanners, and digital cameras. For example, in the current highly popular personal digital assistant system, it is easy to carry, can handle a large amount of digital information, and can obtain instant keywords through the communication device, so it is widely loved and used by the public. In particular, with the development of integrated circuit technology, the personal digital assistant system with camera module has more powerful computing functions, and the memory capacity is increasing. More and more planning applications, databases, etc. are stored. In the compact personal digital assistant system, combined with the Internet and communication system, the personal digital assistant has the functions of image capture and multimedia playback. However, as the integrated circuits become denser, the electromagnetic shielding technology of the camera modules is also becoming more and more demanding in order to improve the effects and capabilities of the images taken by the camera modules such as the 200907533 or the mobile phone. There is a device for reducing the electromagnetic interference of the camera module, as shown in FIG. 1 'for the camera board body i for the camera module, the circuit board body 1 has an unfinished "^^^ board read electrical connection Transfer π 2, lens mode (Θ二)·1 is placed on the side of the circuit board body 1 relative to the ground interface 2' and with the 5 hai circuit board f 1 I $, check the ruin of the paste... The image obtained by the lens module is like: "Transferred to the body of the Weiban, the image signal is transmitted out of the body 1 and then the mask 3, the mask 3 is used as the module electromagnetic shielding 1 The grounding wire is covered with a conductive foam 4 that is connected to the two holes of the circuit. The masking of the above protective camera 2 = and the lens module. The conductive interference technology provided by the part is electrically connected through the bottom of the shielding cover 3, that is, the grounding interface 2 of the circuit board body 1 of the guiding body is guided to remove static electricity, and the corresponding bonding with the grounding interface 2 is used to wave It is blocked to wear magnetic: the electromagnetic conductive foam 4 produced by the cover 3 on the 70 pieces of electrons acts on it. However, this method may cause poor contact due to the tolerance size of ^^, ^2~ [Invention] In view of this, the right " west camera module. It is necessary to provide a kind of camera wedge that can improve the electromagnetic mask effect. It is set on the lens material image (4), including - the lens module for imaging a circuit board having at least one ground interface, 8 200907533 a guard disposed on the outside of the lens module and the circuit board. The camera module further includes an electrical connection with the at least one ground interface a conductive sheet extending from the edge of the circuit board, and the conductive strip extending from the circuit board is received in the protective device and electrically connected to the protective device. The camera module presses the conductive sheet with the elastic force of the conductive sheet The side wall of the protection device is connected to the grounding interface of the circuit board and the shielding device to complete the elimination of static electricity, and the conductive sheet is closely attached to the shielding device due to the flexibility and elasticity of the conductive sheet, thereby avoiding the phenomenon of poor contact. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings in conjunction with the drawings. Referring to FIG. 3 and FIG. 4, the camera module provided by the embodiment of the present invention includes a lens for imaging. a module 10, a circuit board 11 disposed on the image side of the lens module 10 and having at least one ground interface 111, a protection device 12' disposed on the outside of the lens module 10 and the circuit board 111, and a The grounding interface 111 is electrically connected to the conductive sheet 13. The lens module 10 includes a lens barrel 101, at least one lens 102 received in the lens barrel 101, and a set connected to the image side end of the lens barrel 101. The lens holder 103 and an image sensor 104 housed in the lens holder 103 and located on the side of the lens holder 103 away from the lens barrel 101. In the embodiment, the lens barrel 101 is connected to the lens holder 103. External snail The inner surface of the lens holder 103 is provided with an internal thread 106 matched with the external thread 105 of the lens barrel 101 for screwing with the lens barrel 101 to be 9 200907533 for facilitating the axis of the lens barrel 101 along the lens holder 1〇3 Move. "The sensor 1〇4 includes _image sensing wafers 1〇7 and one for placement. The image sensing wafer 107 and the substrate 1G8 electrically connected to the image sensing wafer (10). The image sensor 1()4 is configured to sense the light from the lens 1〇2 and convert it into an electrical signal so that the camera processor (not shown) processes the substrate 108 for connection with the circuit board u. The data obtained by the image sensor 104 is transmitted. The circuit board 11 includes a circuit board substrate 112, at least one ground interface port attached to the substrate 112, and at least one pad fixed on the circuit board substrate 112 and located on the opposite side of the ground line (1) And a data line 115 for routing data. R The circuit board 11 may be a printed circuit board (Printed Circuit =,, f). The board can be used with a specific function of the electronics: device eve: inlaid on the board. And in addition to fixing a variety of small electric power: connection. The upper _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The material can be made of =^, and the circuit board substrate can be printed on ===112, and the ground wire of the circuit can be connected to the electronic component such as "^, resistor, etc. (not shown). The electronic circuit 1 on the circuit board u is used for the static electricity existing in the device. The ground wire 200907533 interface 111 is electrically connected to the printed circuit (not shown) of the circuit board 11. The line interface 111 may be one or plural. In the embodiment, the ground interface 111 has two. The dry disk 114 is disposed on the other surface of the circuit board substrate 112 opposite to the surface of the grounding interface ill. The plurality of pads 114 are exposed on the surface of the circuit board 11, and the plurality of pads 114 are electrically connected to the substrate 1 8 of the image sensor 104. The data lines 115 and the pads 114 of the circuit board U are electrically connected. The data line 115 is used to transmit data of the input circuit board 11. The protective device 12 can be a bottomless cylindrical structure, which is sleeved, and the other is the outer side of the circuit board η. The material of the protective device 12 can be metal or conductive rubber. In the example, the material f of the protective device 12 is a conductive rubber. The bottom end of the protective device 12 near the wall of the circuit board η is provided with an opening σ 12 for extracting the circuit board 11 and And the width of the data line 115, the guiding piece 13 can be integrally formed with the ground wire interface (1), and the conductive piece 13 and the grounding wire are exemplified by the welding, the plastic method and the grounding interface (1) It can be connected to copper: ^ double-sided conductive adhesive M. The material interface of the conductive sheet 13 is conceivable if the conductive sheet u is the same as the ground material. The conductive sheet is used for the W-electrode 13 and the ground interface (1). The edge of the road board U extends out, and
出電路板11之部分收容於防護裝置U 11 200907533 内並直接_防護裝置12電氣連接，優選地，該導電片 π延伸出電路板u之部分收容於㈣裝置12 组H)之間。該導電片13可以為分離的多片，其數量盘 地線接口 m之數量相同，分別與每個地線接口 iu二 -對應並電氣連接，也可以為整體一片與每個地線接口 ⑴電氣連接。在本實施例中，該導電片13丨整體一片 與所述兩個地線接口 電氣連接。 本發明利用導電片之彈力將導電片壓在防護裝置之 側壁上’從而將電路板之地線接口與防護裝置導通，從 :完成消除靜電’而且由於導電片之可撓性及彈性，使 付導電片緊貼防護裝置，避免了接觸不良之現象。 紅上所述’本發明符合發明專利要件，爱依法提出 專利申Μ。惟’以上所述者僅為本發明之較佳實施方式， 本發明之範圍並不以上述實施方式為限，舉凡熟習本案 技α之人士援依本發明之精神所作之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係通常具有地線接口之相機模組用電路板之結 構示意圖。 圖2係降低@ 1之相機模、_電路板電磁干擾之遮 罩罩之結構示意圖。 圖3係本發明實施例之相機模組之結構示意圖。 圖4係圖3之相機模組之立體結構示意圖。 200907533 【主要元件符號說明】 電路板本體 1 導電泡棉 4 鏡筒 101 鏡座 103 外螺紋 105 影像感測晶片 107 電路板 11 電路板基板 112 數據線 115 開口 121 雙面導電膠 14 遮蔽罩 3 鏡頭模組 10 鏡片 102 影像感測器 104 内螺紋 106 基板 108 地線接口 2、111 焊盤 114 防護裝置 12 導電片 13 13The portion of the output circuit board 11 is housed in the protection device U 11 200907533 and directly connected to the protection device 12. Preferably, the portion of the conductive plate π extending from the circuit board u is received between the (4) device group 12). The conductive sheet 13 may be a plurality of separate pieces, the number of which is the same as the number of the disk ground interfaces m, respectively corresponding to each ground interface iu two-corresponding and electrically connected, or may be an integral piece and each ground wire interface (1) electrical connection. In this embodiment, the conductive sheet 13 is integrally connected to the two ground interfaces. The invention utilizes the elastic force of the conductive sheet to press the conductive sheet on the side wall of the protection device, thereby conducting the ground connection of the circuit board and the shielding device, from: eliminating static electricity, and due to the flexibility and elasticity of the conductive sheet, The conductive sheet is in close contact with the guard to avoid contact failure. Red said that the invention meets the requirements of the invention patent, and loves to file a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. All should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing the structure of a circuit board for a camera module which usually has a ground interface. Figure 2 is a schematic view showing the structure of a mask for reducing the electromagnetic interference of the camera module and the circuit board of @1. FIG. 3 is a schematic structural diagram of a camera module according to an embodiment of the present invention. 4 is a schematic perspective view of the camera module of FIG. 3. 200907533 [Main component symbol description] Circuit board body 1 Conductive foam 4 Lens barrel 101 Mirror base 103 External thread 105 Image sensing wafer 107 Circuit board 11 Circuit board substrate 112 Data line 115 Opening 121 Double-sided conductive adhesive 14 Shield 3 Lens Module 10 Lens 102 Image Sensor 104 Internal Thread 106 Substrate 108 Ground Interface 2, 111 Pad 114 Guard 12 Conductive Sheet 13 13