200907086 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種鍍膜裝置及鍍膜方法，尤其涉及一種 歲鑛式鑛膜裝置及採用該濺鍍式鍍膜裝置之鍍臈方法。 【先前技術】 濺鍍係利用等離子體產生之離子去撞擊陰極靶材，將 乾材内之原子撞出而沈積於基材表面上堆積成膜層。由於 濺鍍可另達成較佳之沈積效率、精確控制成份、以及較低 之製造成本，是故於工業上被廣泛應用。 當前手機數碼相機鏡頭之應用已日漸普及，是故有必 要提升其關鍵零部件之製造技術，以#效地降低其製造成 本及提升其良率。作為相機鏡頭關鍵零部件之一之鏡頭模 組通常包括鏡座、鏡筒以及收容於鏡筒内之鏡片、墊片 (Spacer)光圈、紅外截止濾光片（IR-Cut Filter)等元件。鏡 片之„又α十方法请參閱chao等人於2〇〇〇年ieee系統、超聲 波會議（2000 IEEE Ultrasonics Symp〇sium)上發表之論文200907086 IX. Description of the Invention: [Technical Field] The present invention relates to a coating apparatus and a coating method, and more particularly to an aged ore type mineral film apparatus and a plating method using the sputtering type coating apparatus. [Prior Art] Sputtering uses ions generated by plasma to strike a cathode target, and atoms in the dry material are knocked out and deposited on the surface of the substrate to form a film layer. Since sputtering can achieve better deposition efficiency, precise control composition, and lower manufacturing cost, it is widely used in the industry. The application of the current mobile digital camera lens has become increasingly popular, so it is necessary to improve the manufacturing technology of its key components to reduce its manufacturing cost and increase its yield. The lens module, which is one of the key components of the camera lens, usually includes a lens holder, a lens barrel, and a lens, a spacer, an IR-Cut filter, and the like housed in the lens barrel. Please refer to the paper published by chao et al. in the 2 years of ieee system and ultrasound conference (2000 IEEE Ultrasonics Symp〇sium).
Aspheric lens design ° 於鏡頭模組組裝過程中，通常需將該鏡片、墊片、光 圈、紅外截止濾光片等元件通過—定順序裝入鏡筒，再將 鏡筒旋入鏡座以組裝成一完整之鏡頭模組。另外，如圖i 所示，為了降低該鏡頭模組受電磁幹擾之程度，於對該鏡 頭模組進行組裝前，一般還需於鏡座2a之外圓周面2〇a上 濺鍍上一層防電磁幹擾（Electromagnetic Interference，EMI) 膜層，以提升組裝後鏡頭模組抗電磁幹擾之能力。 6 200907086 先珂技術以濺鍍法來製備該鏡座以 .層時，為了增加該膜層厚度之均勾产周面20a之膜 .該鏡座2a之外圓周面2〇a進 ^使乾材u於對 速度朝某-方向行進，且當該膜V之二 保持—定 需根據膜層之厚度選擇革巴材之數旦予二而要调整時，還 用較少之靶材。然，當购^ ’ p膜層較薄時，可選 數量較多時，需要容置 ' 二:+且相對應地要求該乾材 備將不得不相應地增加層之設 之更換頻率及由此帶來之經濟成本。X W加了設備 有馨於此，有必盈挺彳丑 膜層厚度之濺 I— 7於鍍膜過程中方便調節 【發明内容】式鍍膜裝置及鎪膜方法。 層厚施例說明—種可於鍍膜過程中方便調節膜 子度之_切職置及制方法。 ㈣ 本1明提供—種_式鍍膜裝置 至；一運載步罢 、匕栝鍍膜工作 做線性運動，'該運=沿該㈣工作室之底部之延伸方向 該至少L载裝置包括m及至少—承載台， 置，用於承繞該固定座旋轉且其相對於該固定座設 作室内，用::：，以及至少一乾材，其設置於該鍍膜工 、用於對該工件進行鍍膜。 法，：ΐ括：種採用上述濺鍍式鍍膜裳置之濺鍍式鍍膜方. /、G栝Μ下步驟： (1)提供. 待鑛膜m申請專利範圍1該滅鍵式缠膜裝置，將 又载於先接近該至少一靶材之承載台上；（2)該 7 200907086 承載台沿接近於該至少—革巴材之方向作 少峨該工件進行鍍膜；(4)該承载：，⑺該至 度，該至少-乾材對該工件進行二次口翻（一預定角 相；前技術，賤鍵式崎 -置一可沿鑛膜工作室作線性運万U 載裝置之承載台連載衣置，亚將該運 方面，可經由該運載裝置帶動承載台上承=座：轉，、- 行鍍膜，從而可實現鍍膜之作 =依次進 之均勻度；另—方而^ 作菜亚且美尚膜層厚度 铖由將田工件表面所需之膜層較厚時，可 是故，該_式鍍^置:件進行二次賤鍛， 下，每規勒供广又、衣可於不增加靶材之數量之前提 低生產成本之目的。、尽度之调卽，進而可達到降 【實施方式】 :=合圖式對本發明作進-步之詳細說明。 式錄二=02及圖3,本發明第一實施例提供之一種濺鍍 膜。如圖3所干用於對鏡座30之待鑛膜表面3_進行鍍 座30a上延伸：來:鏡座：通常包括-底座3〇a及從該底 形成㈣2結構通，該防電磁幹擾膜層 、、、Q構30b之外圓周面300b上。 21如所不’該濺鍍式錢膜裝置20包括—鍍膜工作室 —運載褒置22以及—靶材23。 至 該鍵膜工作宮？ 鍍膜工作室21勺紅 供—真空藏鍍環境。通常’該 G括與该鍍膜工作室21相連通之一氣體入 200907086 口（圖未示）及一氣體出口（未標示）。其中，氣體入口用於向 鍍膜工作室21内導入放電氣體，例如氬氣、氮氣等，氣體 出口用於使鍍膜工作室21於工作時保持一定之真空度。該 氣體出口通常與一抽真空裝置24相連，該抽真空裝置24 可為分子泵、洛茨真空泵或幹式機械真空泵等。 該運載裝置22包括一傳輸裝置221、一固定座222、 一轉盤223、一旋轉單元224，以及至少一承載台如第一承 載台225a及第二承載台225b。該傳輸裝置221設置於該鍍 膜工作室21之底部210並可沿該底部210之延伸方向（如圖 2中箭頭所示方向）做線性運動。優選地，該傳輸裝置221 可為一傳輸帶，該固定座222設置於該傳輸裝置221上， 該轉盤223進一步設置該固定座222上並可繞該固定座222 旋轉。具體地，該轉盤223可通過與其轴心（未標示）相連接 之旋轉單元224帶動旋轉，優選地，該旋轉單元224可為 旋轉馬達元件或旋轉汽缸元件。 該第一承載台225a及第二承載台225b用於承載鏡座 30,其分別設置於該轉盤223之兩端（未標示）且與該固定座 222形成相對設置，由於該轉盤223可繞該固定座222旋 轉，是故分別設置於該轉盤223之兩端上之第一承載台225a 及第二承載台225b亦可繞該固定座222旋轉。具體地，該 第一承載台225a及第二承載台225b可由導電材料，如鐵、 鋁等金屬製成，其於濺鍍過程中充當陽極。於本實施例中， 該第一承載台225a、第二承載台225b及旋轉單元224位於 同一條直線上，且該第一承載台225a與第二承載台225b 9 200907086 分處該旋轉單元224之兩側，誃 .單元224間之距離等於該第二承〔载台225a與該旋轉 間之距離。 栽口 U5b與該旋轉單元 該靶材23設置於該鍍膜工作 該靶材23為銅靶材，其數目 ，貫施例中’ 沿圖”箭頭，即該傳輸裝置二置之=固，且該三個把材 該三餘材23分別可裝載於二 =二方向分佈。另外， 電極230可為板狀電極，其於濺:'23^’且該三個乾 開關狀態可分別獨立控制。、、、又、王通常充當陰極且其 請進一步參閱圖4、圖5、圖6 述一種利用本發明第—實施 下面將間要插 於鏡座30之外圓周自 鐘式鐘膜裝置20 缝式鍵膜方法，其包括以下步衣JV、有防電磁幹擾膜層之 台上⑴將待鍛膜工件裝載於可先接近該至少—乾材之承載 如圖2所不，该轉盤223設置於該 其將隨該傳輸裝置221沿該傳輸裝置 W箭頭心方向）運動並接近 ^如圖 之運動方向上定義該第一承載台22心，=裝= ’並將該鏡座3〇設置於該 ：弟:承载口 (2)該承栽a、VL_ ， 戟。225a上。 動。 u近於該至少i材之方向作線性運. 可以理解，當該轉盤223於該傳輸 私 進入該鑛膜工作室料，可經由與錢膜工V室二帶Γ 作至21相連通 10 200907086 •之抽真空ft置24對賴工作室21抽真空至預定壓力之直 空狀=，並、經由與鑛膜工作室21相連通之氣“ 口向㈣ 工作至21通入放電氣體，如氬氣等。 、 (3)該至少一靶材對該工件進 士如圖4所示，當該鏡座30運動至與該峰材23相對 二Ifp㈣（圖未示）向該乾電極230施加負電壓，另 7载。⑽接地（目未*)，使得該絲材 離並產生㈣子m轉子之料於銅乾 材23上撞擊出原子或原子團 '钔靶 膜之外圓周面遞，可㈣外^⑽子團沈積於該待鑛 層。 該外0周面3_上形成-層銅膜 (4)該承載台翻轉— 之表面進行二次躁鑛。角度該至少-乾材對該工件 之外:;:=二一…一 線性運動，從而使承载於功繼續作 依次分別與該三個銅乾材23相對 a上之鏡座30 其進行鍍膜，以使該鏡座3〇 μ —個銅靶材23對 厚度分饰均勾。當該 卜0周面_上之銅膜層 銅乾材23被撞擊出之原 三個絲材23,使得該 外圓周面30〇b以形成层：團未旎到達該鏡座30之 極230施加負電麼，此時，層該，部電源停止向該靶電. 轉盤223旋轉—預定译忒旋轉單元224旋轉以帶動該 理解’由於此時該傳輪裝置22ι=:如圖…斤示’可 作線性運動之方向未變， 200907086 所以該第一承載台225a旋轉180度後，其將再次於該傳輸 裝置221之帶動下朝接近該三個銅靶材23之方向運動，以 再一次依次分別與該三個銅靶材23相對，並由該三個銅靶 材23對其進行二次鍍膜，如圖6所示。 由此可知，該鏡座3 0經歷兩次鑛膜後，其外圓周面 300b上所鍍之銅膜層將可達到所需厚度。進一步地，可經 由該傳輸裝置221將其移出該鍍膜工作室21。 可理解，當該鏡座30外圓周面300b所需之銅膜層之 厚度較薄時，該第一承載台225a及第二承載台225b可分 別承載一鏡座30，通過該傳輸裝置221帶動該第一承載台 225a及第二承載台225b作線性運動，可使該第一承載台 225a及第二承載台225b上裝載之鏡座30依次分別與該三 個銅靶材23相對，從而可利用該三個銅靶材23對讓鏡座 30進行一次鍍膜而達到所需之膜層厚度。當然，當該鏡座 30外圓周面300b所需之銅膜層之厚度需進一步減薄時，還 可通過選擇性地開關該三個靶電極230以選擇地性利用該 三個銅靶材23對該鏡座30之外圓周面300b進行鍍膜，例 如，可只開啟一靶電極230，並且只採用一銅靶材23對該 鏡座30之外圓周面300b進行鍍膜。 於不增加該濺鍍式鍍膜裝置20之體積之前提下，該濺 鍍式鍍膜裝置20還可進一步設置三個位於該鍍膜工作室 21内且與該三個銅靶材23相鄰之不銹鋼靶材，以利用該三 個不銹鋼靶極進一步於該鏡座30之外圓周面300b之銅膜 層上藏鍍上一層不銹鋼膜層。 12 200907086 請參閱圖7，本發明第二實施例提供之一種濺鍍式鍍膜 裝置70，其與本發明第一實施例提供之濺鍍式鍍膜裝置20 結構基本相同，其區別在於：該濺鍍式鍍膜裝置70還進一 步包括一裝載室72、一卸載室73、一加熱室74及一清洗 室75,該傳輸裝置221分別設置於該裝載室72、加熱室74、 清洗室75、鍍膜工作室21及卸載室73之底部210，該抽 真空裝置24分別通過一抽氣管與該裝載室72、加熱室74、 清洗室75及卸載室73相連通。 具體地，該裝載室72、加熱室74、清洗室75、鍍膜工 作室21及卸載室73依次相鄰設置。其中，該裝載室72用 於收容待鍍膜之鏡座30,該卸載室73用於收容已鍍膜之鏡 座30。 該加熱室74用在於將該待鍍膜之鏡座30送入該清洗 室75進行等離子清洗前，收容並加熱該鏡座30，以對該鏡 座30進行乾燥，並提升該鏡座30於該鍍膜工作室21進行 鍍膜時之鍍膜品質。 該清洗室75用在於將該鏡座30送入鍍膜工作室21進 行鍍膜前，對該鏡座30之待鍍膜外圓周面300b進行等離 子體清洗（plasma cleaning)，以使該鏡座30之待鍍膜外圓周 面300b保持潔淨，從而於該鍍膜工作室21内獲得較佳之 鍍膜效果。 該傳輸裝置221設置於該裝載室72、加熱室74、清洗 室75、鍍膜工作室21及卸載室73之底部210，從而可帶 動該鏡座30於依次分別於該裝載室72、加熱室74、清洗 13 200907086 室75、鍍膜工作室21及卸載室乃作線性運動。 另外，該抽真空裝置24可分別獨立地 加熱室74、清洗室75、鑛膜m及卸载室73抽直Γ 使該裝載室72、加熱室74、清洗室75、鍍膜工作室？及 卸載室73之真空度可根據作業需要進行調整。 及 ㈣：：明弟一實施例及第二實施例分別所提供之替式 鍍腰裝置2〇、7〇,其經由設置—可沿鍍膜工 = 運動之運載裝置22、並將該運載裝置22之第—承載 及=載台225b設置為可繞該運載裝置22之旋 4方疋軺，一方面，可經由該運載裝置U帶動該 台225a及第二承載台225b上承 以 7載 /XA ^ 戰之鏡座3〇依次進行铲 、产仗％、現鍍膜之連續作業，並且提高膜層厚度之均 产B: ’ ：：：面’當鏡座30外圓周面3_所需之膜層較 —承載台225a及第二承載台咖翻 度以對該鏡座30進行二次濺鍍，是故，卞 式鍍膜裝置20、70可於不增加_ 23之數量之乂提^又 2對鍍朗程中膜層之厚度之調節，⑼可^ ^ 產成本之目的。 干-土 ，本發明確已符合發明專利之要件，遂依法 ^出^利申^。惟，以上所述者僅為本發明之較佳實施方 自不能以此限制本案之申請專利範圍 = = + =本發明之精神所作之等效修飾或變化，皆 應，函盍於以下申請專利範圍内。 【圖式簡單說明】 14 200907086 圖1係習知採用濺渡法對鏡座進行鍍膜之原理示意圖。 圖2係本發明第一實施例提供之濺鍍式鍍膜裝置之結 構示意圖。 圖3係鏡筒之結構示意圖。 圖4係圖2所示之藏鍍式鍍膜裝置對鏡座之外圓周面 進行鍍膜之示意圖。 圖5係圖2所示之濺鍍式鍍膜裝置之轉盤翻轉180度 以對鏡座之外圓周面進行二次鍍膜之示意圖。 圖6係圖2所示之濺鍍式鍍膜裝置對鏡座之外圓周面 進行二次鍍膜之示意圖。 圖7係本發明第二實施例提供之濺鍍式鍍膜裝置之結 構示意圖。 【主要元件符號說明】 靶材 la 藏鐘式鍍膜裝置 20 鏡座 2a 鍍膜工作室 21 鏡座之外圓周面 20a 運載裝置 22 旋轉單元 224 靶材 23 底部 210 抽真空裝置 24 傳輸裝置 221 濺鍍式鍍膜裝置 70 固定座 222 裝載室 72 轉盤 223 卸載室 73 第一承載台 225a 加熱室 74 第二承載台 225b 清洗室 75 靶電極 230 圓筒形結構 30b 15 200907086 300b 鏡座 30 鏡座底座 圓筒形結構之外圓周面 30a 16Aspheric lens design ° In the assembly process of the lens module, it is usually necessary to insert the components such as the lens, the spacer, the aperture, the infrared cut filter, and the like into the lens barrel, and then screw the lens barrel into the lens holder to assemble the lens. Complete lens module. In addition, as shown in FIG. 1 , in order to reduce the degree of electromagnetic interference of the lens module, before assembling the lens module, it is generally required to be sputtered on the outer surface 2〇a of the lens holder 2a. Electromagnetic interference (EMI) film layer to improve the ability of the assembled lens module to resist electromagnetic interference. 6 200907086 The first technique is to use the sputtering method to prepare the lens holder. In order to increase the thickness of the film layer, the film of the circumferential surface 20a is produced. The outer surface of the lens holder 2a is 2〇a. The material u travels in a certain direction toward the speed, and when the film V is maintained, it is necessary to adjust the number of deniers according to the thickness of the film layer, and less target is used. However, when the purchase of the film layer is thinner, when there are more optional numbers, it is necessary to accommodate 'two:+ and correspondingly requires that the dry material preparation will have to increase the replacement frequency of the layer accordingly. The economic cost of this. X W added equipment is sweet, there must be ugly and ugly. The thickness of the film layer is splashed. I-7 is easy to adjust during the coating process. [Invention] The coating device and the enamel film method. Layer thickness example description—a method of making and adjusting the film size during the coating process. (4) The present invention provides a type of _ type coating device to; a carrying step, 匕栝 coating work to do linear motion, 'the operation = along the extension of the bottom of the (four) studio, the at least L carrier includes m and at least - The loading platform is configured to rotate around the fixing base and is disposed indoors relative to the fixing seat, and::: and at least one dry material disposed on the coating machine for coating the workpiece. Method: ΐ : : : : : : : : : : : : : : : : : : 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 采用 溅 溅 溅 溅 溅 溅 溅 溅 溅 溅 溅 溅 溅 溅And (2) the 7 200907086 loading platform is coated with the workpiece in a direction close to the at least one of the leather materials; (4) the bearing: (7) The degree to the workpiece, the at least-dry material is subjected to a secondary mouth turn (a predetermined angular phase; the prior art, the 贱-key type Kawasaki-set can be carried along the ore film studio for the linear transport of the U-loading device The station is connected to the clothing, and the sub-portion can be driven by the carrier to drive the support on the platform: turn, and - coating, so that the coating can be achieved = uniformity in sequence; The film thickness of the vegetable and the beauty of the film is thicker when the film layer required for the surface of the workpiece is thicker. Therefore, the _ type plating: the piece is subjected to secondary upsetting, and each piece is provided for wide and clothing. The purpose of lowering the production cost can be achieved without increasing the amount of the target. The tempering of the degree can be achieved, and then the reduction can be achieved [embodiment]: The present invention provides a detailed description of the steps of the present invention. The second embodiment of the present invention provides a sputter film, which is used as the dry film surface of the mirror holder 30 as shown in FIG. The plating base 30a is extended: the mirror base: usually includes a base 3〇a and a (4) 2 structure through the bottom, the anti-electromagnetic interference film layer, and the Q-shaped 30b outer circumferential surface 300b. Do not 'sputter type money film device 20 includes - coating studio - carrying device 22 and - target 23. To the bonding film working palace? coating studio 21 spoon red for - vacuum deposition plating environment. Usually 'G A gas connected to the coating working chamber 21 is connected to a port of 200907086 (not shown) and a gas outlet (not shown), wherein the gas inlet is used to introduce a discharge gas such as argon or nitrogen into the coating working chamber 21. Etc., the gas outlet is used to maintain a certain degree of vacuum during operation of the coating working chamber 21. The gas outlet is usually connected to a vacuuming device 24, which may be a molecular pump, a Lotz vacuum pump or a dry mechanical vacuum pump. The carrier 22 includes a transport device 22 1. A fixing base 222, a turntable 223, a rotating unit 224, and at least one carrying platform such as a first carrying base 225a and a second carrying base 225b. The conveying device 221 is disposed at the bottom 210 of the coating working chamber 21 and The linear movement is performed along the extending direction of the bottom portion 210 (the direction indicated by the arrow in FIG. 2). Preferably, the transmission device 221 can be a transmission belt, and the fixing base 222 is disposed on the transmission device 221, and the rotary tray 223 is further The fixing base 222 is disposed and rotatable about the fixing base 222. Specifically, the rotating plate 223 can be rotated by a rotating unit 224 connected to its axis (not shown). Preferably, the rotating unit 224 can be a rotating motor. Component or rotating cylinder component. The first carrier 225a and the second carrier 225b are configured to carry the lens holders 30, which are respectively disposed at opposite ends (not labeled) of the turntable 223 and are disposed opposite to the fixed seat 222. The fixing base 222 is rotated, so that the first carrier 225a and the second carrier 225b respectively disposed on the two ends of the turntable 223 can also rotate around the fixing base 222. Specifically, the first stage 225a and the second stage 225b may be made of a conductive material such as metal such as iron or aluminum, which serves as an anode during the sputtering process. In this embodiment, the first carrier 225a, the second carrier 225b, and the rotating unit 224 are located on the same straight line, and the first carrier 225a and the second carrier 225b 9 200907086 are located at the rotating unit 224. On both sides, the distance between the units 224 is equal to the distance between the second stage [the stage 225a and the rotation. The target U23b and the rotating unit are disposed on the coating unit, and the target 23 is a copper target, the number of which is the arrow along the figure in the embodiment, that is, the transmission device is set to be solid, and the The three materials 23 can be respectively loaded in the second=two direction distribution. In addition, the electrode 230 can be a plate electrode, which is splashed: '23^' and the three dry switch states can be independently controlled. , and again, the king usually acts as a cathode and it is further referred to FIG. 4, FIG. 5, and FIG. 6. The first embodiment of the present invention is to be inserted into the outer circumference of the lens holder 30 to be sewn from the bell-shaped clock device 20 a key film method comprising the following step JV, an anti-electromagnetic interference film layer on the stage (1) loading the workpiece to be forged into the load capable of first approaching the at least dry material, as shown in FIG. 2, the turntable 223 is disposed on the It will move with the transmission device 221 along the direction of the arrow in the direction of the transmission device W and close to the direction of the movement of the first carrier 22, === and set the lens holder 3 to: Brother: the carrying port (2) the bearing a, VL_, 戟. 225a. Move. u is close to the at least i material It can be understood that when the turntable 223 enters the film studio material privately in the transmission, it can be connected to the 21 phase through the second chamber of the money filmer V. 200907086 • The vacuum is ft 24 pairs The working chamber 21 draws a vacuum to a predetermined air pressure = and, through the gas connected to the film chamber 21, "ports (4) operates to 21 to discharge a discharge gas such as argon gas or the like. (3) the at least one target material is as shown in FIG. 4, when the lens holder 30 moves to the opposite side of the peak material 23, Ifp (four) (not shown) applies a negative voltage to the dry electrode 230, and Loaded. (10) Grounding (not *), so that the wire is separated and produced (4) The sub-m rotor material hits the atomic or atomic group on the copper dry material 23, and the (4) outer (10) sub-group is deposited. In the mine layer. The surface of the outer 0-peripheral surface 3_ is formed by a copper film (4), and the surface of the substrate is inverted. The angle is at least - the dry material is outside the workpiece:;: = 2... a linear motion, so that the mirror holder 30 on the opposite side of the three copper dry materials 23 is coated in the order of the work, In order to make the mirror holder 3〇μ-copper target 23, the thickness is divided. When the copper film 23 of the copper film layer 23 is struck out of the original three wires 23, the outer circumferential surface 30〇b is formed to form a layer: the group reaches the pole 230 of the lens holder 30. Is the negative power applied, at this time, the layer power supply stops rotating to the target. The turntable 223 rotates - the predetermined translation rotation unit 224 rotates to drive the understanding 'because the transfer device 22 i =: Fig. The direction in which the linear motion can be made is unchanged. 200907086 Therefore, after the first carrier 225a is rotated by 180 degrees, it will be moved again in the direction of approaching the three copper targets 23 by the transmission device 221, again and again. The three copper targets 23 are respectively opposed to each other, and are subjected to secondary plating by the three copper targets 23, as shown in FIG. It can be seen that after the lens holder 30 has undergone two mineral films, the copper film layer coated on the outer circumferential surface 300b will reach the desired thickness. Further, it can be removed from the coating working chamber 21 via the transport device 221. It can be understood that when the thickness of the copper film layer required for the outer circumferential surface 300b of the lens holder 30 is thin, the first carrier 225a and the second carrier 225b can respectively carry a mirror holder 30, which is driven by the transmission device 221 The first carrier 225a and the second carrier 225b are linearly moved, so that the mirror holders 30 mounted on the first carrier 225a and the second carrier 225b are respectively opposite to the three copper targets 23, respectively. The mirror holder 30 is coated once by the three copper targets 23 to achieve a desired film thickness. Of course, when the thickness of the copper film layer required for the outer circumferential surface 300b of the lens holder 30 needs to be further thinned, the three copper targets 23 can be selectively utilized by selectively switching the three target electrodes 230. The outer circumferential surface 300b of the lens holder 30 is coated, for example, only one target electrode 230 can be opened, and only the outer peripheral surface 300b of the lens holder 30 is coated with a copper target 23. The sputter coating apparatus 20 may further be provided with three stainless steel targets located in the coating working chamber 21 adjacent to the three copper targets 23, without increasing the volume of the sputter coating apparatus 20. The material is further coated with a stainless steel film layer on the copper film layer of the outer circumferential surface 300b of the lens holder 30 by using the three stainless steel targets. 12 200907086 Please refer to FIG. 7 , a sputtering coating apparatus 70 according to a second embodiment of the present invention is substantially the same as the sputtering coating apparatus 20 provided by the first embodiment of the present invention, and the difference is that the sputtering is performed. The coating device 70 further includes a loading chamber 72, an unloading chamber 73, a heating chamber 74 and a cleaning chamber 75. The conveying device 221 is respectively disposed in the loading chamber 72, the heating chamber 74, the cleaning chamber 75, and the coating working chamber. 21 and the bottom portion 210 of the unloading chamber 73, the vacuuming device 24 is in communication with the loading chamber 72, the heating chamber 74, the cleaning chamber 75, and the unloading chamber 73 through an exhaust pipe, respectively. Specifically, the loading chamber 72, the heating chamber 74, the cleaning chamber 75, the coating working chamber 21, and the unloading chamber 73 are sequentially disposed adjacent to each other. The loading chamber 72 is for receiving a mirror holder 30 to be coated, and the unloading chamber 73 is for accommodating the coated mirror holder 30. The heating chamber 74 is configured to receive and heat the lens holder 30 before the plasma holder 30 to be coated into the cleaning chamber 75 for plasma cleaning, to dry the lens holder 30, and lift the lens holder 30. The coating quality of the coating working chamber 21 at the time of coating. The cleaning chamber 75 is used for plasma cleaning of the outer circumferential surface 300b of the mirror holder 30 to be coated before the mirror holder 30 is sent to the coating working chamber 21 for coating, so that the mirror holder 30 is to be treated. The outer circumferential surface 300b of the coating is kept clean, so that a preferable coating effect is obtained in the coating working chamber 21. The transport device 221 is disposed at the bottom 210 of the loading chamber 72, the heating chamber 74, the cleaning chamber 75, the coating working chamber 21, and the unloading chamber 73, so that the lens holder 30 can be driven in the loading chamber 72 and the heating chamber 74, respectively. , cleaning 13 200907086 Room 75, coating studio 21 and unloading chamber for linear motion. Further, the vacuuming device 24 can independently pump the heating chamber 74, the cleaning chamber 75, the mineral film m, and the unloading chamber 73 to the loading chamber 72, the heating chamber 74, the cleaning chamber 75, and the coating working chamber. And the degree of vacuum of the unloading chamber 73 can be adjusted according to the operation needs. And (4): an alternative embodiment of the present invention and the second embodiment, respectively, provided by the plating device 2〇, 7〇, which is disposed along the carrier 22 of the coating machine = movement, and the carrier 22 The first carrier and the carrier 225b are arranged to be rotatable around the carrier 22. On the one hand, the carrier 225a and the second carrier 225b can be driven by the carrier U for 7 carriers/XA. ^ The mirror frame 3 〇 shovel, 仗%, continuous coating operation, and increase the film thickness of the average production B: ' ::: face' when the outer surface of the lens holder 30 3_ required film The layer is compared with the carrier 225a and the second carrier to perform secondary sputtering on the lens holder 30. Therefore, the 镀 coating device 20, 70 can be raised without increasing the number of _ 23 For the adjustment of the thickness of the film layer in the plating process, (9) can be used for the purpose of production cost. Dry-earth, the invention has indeed met the requirements of the invention patent, and the law has been issued according to law. However, the above-mentioned only preferred embodiments of the present invention are not intended to limit the scope of the patent application of the present invention. = = + = equivalent modifications or variations of the spirit of the present invention are applicable to the following patent applications. Within the scope. [Simple description of the diagram] 14 200907086 Figure 1 is a schematic diagram showing the principle of coating the mirror holder by the splash method. Fig. 2 is a schematic view showing the structure of a sputtering type coating apparatus according to a first embodiment of the present invention. Figure 3 is a schematic view of the structure of the lens barrel. Fig. 4 is a schematic view showing the coating of the outer circumferential surface of the lens holder by the Tibetan plating apparatus shown in Fig. 2. Fig. 5 is a schematic view showing that the turntable of the sputter coating apparatus shown in Fig. 2 is flipped by 180 degrees to perform secondary coating on the outer circumferential surface of the mirror holder. Fig. 6 is a schematic view showing the secondary plating of the outer circumferential surface of the lens holder by the sputtering type plating apparatus shown in Fig. 2. Fig. 7 is a view showing the structure of a sputtering type plating apparatus according to a second embodiment of the present invention. [Main component symbol description] Target la bell-type coating device 20 Mirror holder 2a Coating working chamber 21 Mirror seat outer circumferential surface 20a Carrier 22 Rotating unit 224 Target 23 Bottom 210 Vacuuming device 24 Transmission device 221 Sputtering Coating device 70 Fixing seat 222 Loading chamber 72 Turntable 223 Unloading chamber 73 First carrying table 225a Heating chamber 74 Second carrying table 225b Cleaning chamber 75 Target electrode 230 Cylindrical structure 30b 15 200907086 300b Mirror base 30 Mirror base cylindrical Outside the structure 30a 16