200906262 九、發明說明： 【發明所屬之技術領域】 本發明係關於撓性印刷電路板及利用此撓性印刷電路板之 行動電話終端機。 切式 【先前技術】 近年來，行動電話終端機(以下又稱行動電話)急速地普及 而^以行鱗話之小型化為目的，㈣摘絲產生無賴$ 方疋轉式、摺疊式的各種需要。最近，卩更小型化為 = - 電話則顯著地普及。 ~ κ月動式仃動 '然而，撓性印刷電路板(以下又稱FPC勤反)由於目有良好之柔如 性、彎曲性’目此廣泛使用於行子設備，尤其是行動電話了人 ^ ’在此所謂的FPC基板可大致分為以下兩種難。其 ί接ΐΤΐΐ亞胺膜等電絕緣層的一面或兩面設置黏接層，並叠層 ，接銅W金屬純形成導體層，將3層基板的導體層 二 ί路電絕緣層及黏接層所構成的表覆層疊層緊貼在該 ΐίΐίΐ佈後硬化之2層基板的導體層形成電路，且使表覆層 且_緊貼在遠電路形成後之導體層上。 曰 發。ίίίίΛ型之Γ動严付備，Fpc基板也謀求往薄型化開 號公^ 11 電路板而言，例如日本特開2005-2_13 二者藉由黏接劍fit性電路板’包含至少基膜(basefiim)與極薄銅箔 劑^❹if f成物之硬化物所疊層而構成的部分。該基膜、黏接 =文=物、極薄_轉叙__厚度為卿m= 此表覆展之^5’235948號公報提出—種極薄表覆層以及使用 厚°，等表覆層係用於保護撓性電路板，係於 半經為2mm 文4獻）。然而，該等公報之技術係使耐折 的耐折性试驗，或者係使耐折半徑為O.imm或0.38mm 200906262 ===曲特性提高的技術，而與滑動半徑極小之提升滑動特 著將該上部框體鱼、力各/口平仃方向彼此移動而連結，且隨 '該種薄型^之ΞΓ^ι動電_可達到薄型化。 。滑既定滑動半徑之所使用的fpc基板，係於動時保持 下又稱滑動部之窄匕^;使此時的滑動半徑相當小(以 時，=衫〜數萬次時會產為路題又，使用習知的即C基板 【專』=曰本特開2005_209913號公報 【ί矛日本特開·235948號公報 【專利文獻3】日本特開2〇〇3_29鹏號公報 【發明内容】 從而，本發明之日, 於滑動式行動用電子設備i滑ϋ的印刷電路板，尤其可適用 反覆進行數十萬次滑動，“ 化，而且即使於此種條件下 又，本發明之另一 動式行動電話終端機。、’、、、0供—種彻該撓性印刷電路板之滑 ΑϋΜΜ^±Μ ^ 層上’設有—導體層所構成之基板 表覆層係藉由該黏接劑層而設置。a電、、邑'、、彖層所構成之表覆層；此 此挽性印刷電路板之特徵為：6該黏接劑層由儲存彈性係數£，為i 200906262 〜4GPa ’損失彈性係數E”為0〇3〜〇 以上的樹脂所構成；該基板之雷且延伸後的復原率為9〇% 覆層之電絕緣層的厚度為7 5〜鄉^的厚度為7.5〜2Gpm，而該表 量環氧樹2之雜印刷電路板中，構成該黏接劑層之樹脂含有高分子 $4^細嶋顿巾，輸彻麵的分子量為 〜^Ομηι。貞Ζ載之撓性印刷電路板巾’該黏接劑層的厚度為5 金屬荡或路板中’該基板之細由壓延 6.該1〜5令任—二番 ，《細表覆層各別 框體，將該^示示晝面之第1框體、與第2 第If體以2 第2框體，且該 =部，以可滑動地收納有該1 ^體與該第2框體 该第1框體移動時，收响於㈣壬項记载之撓性印刷電路板。 體之該電路板略呈平 ^ U该電路板對收納於該第2框 8.—種表覆層，使^^動6 的半徑保持在〇.4〜lmmR。 記載之滑動式行動電^終端機中任一如己载之撓性印刷電路板或該7 此表覆層之特徵為：表覆戶 該黏接劑層則由儲存彈性由^妾劑層及電絕緣層所構成； 之滑 200906262 部的窄1Mb，而且可於此種條件下即使反覆數十萬次以上也不會 發生短路，為習知FPC基板所無法達到者。 【實施方式】 實施發明之最佳形_ 、以下’透過發明之實施形態以說明本發明。然而，以下之實施形 態ϊίί定依專利中請範圍的發明。又，實施形態中所說明之特徵的 組合並未必然全部為發明的解決手段所必需。 [撓性印刷電路;}：反] 將本發明之撓性印刷電路板的較佳實施形態 圖1顯示第1實施形態之撓性印刷電路板的立體圖。用狀而碎這 如圖1所示，第i實施形態之撓性印刷電路板1〇〇中， 層11及形成有電路圖案的導體層12所構成之基板1〇1 接= 層η及電絕緣層14所構成之表覆層搬，藉由該黏接劑 又，圖1 /刀開顯不基板ιοί及表覆層1〇2，俾於容易理解。 另外，表覆層102的黏接劑層13,由儲存彈性传 瓦 損失彈性係數E”為_〜G.1GPa，錢伸❹為^4GPa， 樹脂所構成。 ⑽设料為90%以上的 本發明中，儲存彈性係數E，及損失彈性係數e Sc_fie公㈣造德__収裝置 e=nc 的復原率則以後述之實施例中的試驗方法所得到=值& ’延伸後 構成黏接劑層13之樹脂的儲存彈性係數e，雖為 其就用以展現撓性而言，則較佳為1〜3GPa ^ ‘、 a，但尤 又，同樹脂的損失彈性係數E”雖為〇.〇3〜〇 mp 提南原性，並提高黏性而言，則較佳為 ±另外，同樹脂的延伸後的復原率雖為9〇%以: ^細13之_嶋5〜2_糊内，尤佳為5〜 200906262 環劑層13之_旨’若係_性印刷電路板領域所使用之以 ‘特^告I 土 士質的黏接?1用樹脂添加高分子量環氧樹脂而成者，則並 ί該复二二本施形態中’係採用苯氧樹脂作為高分子量環氧樹脂。 聛‘辇：挪月曰而吕’可採用主鏈的骨架由雙酚Α、雙酚f、雙酚s、 ^ίί二f構成，ί者也可採用包含由例如雙齡A、雙_所構成 «或磷旨為了提供FPC基板所需之阻燃性，亦可使用含有 而言’除使用伽A環氧樹脂以外，也可採用例如雙 ?狀(線1大t之ΐϊΐί ^之樹脂較佳又為，如*氧樹脂的分子鏈係直鏈 造的樹r ^衣氧樹脂。其原因為：此相較於具有三維網織構 庫力有線狀分子鏈的樹脂由於分子鏈為線狀，故當受到外部 力存應力；而自該應力脫離日細會早期釋出所儲存之應 20^90% 0 5 〜層13咖旨，其重量平均分子量較佳為2〇扉 復原性ρ好' :G〜5G，_。其原因為：當分子量在此範圍内時， f』 旻京f良好，且後述之塗佈等的加工性將提高。 #i ^ ΪΓ: ? 二氣二胺等之硬化劑b本風、―⑯二相、料、六亞曱二胺、 的撓'Si: 二厚度雷為7·5〜4〇-。尤其就基板整體 —。在此，對絕緣層14的厚賴佳為7.5〜 範圍内者睹懕恶之電絕緣層14係採用厚度在此既定 覆層102之電^^日±因’參照圖9以說明之。圖9⑻顯示表 緣層14較厚時的壓曰_車3 ,縮應力的狀態;圖職 半徑相同時的狀態“。又’圖9⑻及圖9⑻係比較於滑動 200906262 絕缘，於義彻目同之軌下，當表覆層之電 、iiC 板内侧的外徑(内徑)變小(變窄)(圖9(b))。因此， ===夺所產生之作用越大，窄R的滑以性=。 的滑動試行白tii於兩面設置屏蔽層的構成)係於後述之實施例 聚趟如獅雜魏膜、雜麵、聚醯祕亞胺膜、 醯亞胺膜。、絕緣膜。尤其’較佳為具有充分耐熱性及撓性的聚 M sl，於表覆層102之形成方法，可藉由在電絕緣層14的表面蔣點接 脂適當塗佈、加熱乾燥，而呈半硬化狀態(以下又“ ，覆層1〇!設置於基板1〇1之形成有電路圖案的 板。 ’、σ,、，、硬化’藉此开>成第1實施形態之撓性印刷電路 涂你=佈黏接劑層13用之樹脂時的塗佈方法而言，可舉例如雙輥筒 c^er)箄⑽日、模具塗佈機(Die C〇ater)、凹槽塗佈機(gravure ^ ’可因應各層之所希望的厚度等，適當採用。 垆性3 緣層11的厚度為7·5〜20隅。尤其就基板整體的 SI 1，縮應力降低而言’電絕緣層11的厚度較佳為7.5〜 μ ^，壓縮應力降低的原理如前所述。 i 性之Ρ例如採用聚醯亞胺、聚醯胺、聚醯胺醯亞胺等具絕緣 ίΪΪΐϋ。尤其就耐熱性等而言，較佳係使用聚輕胺。又， 冤、、、邑、，彖層11可為單層或多數層。 內，Hi構成魏緣層11的翻旨巾，可在*使職轉低之範圍 消泡,^而而加入各種添加劑，例如勻塗劑(leVeling agent)、偶合劑、 夕1〇1之導體層12採用例如銅、SUS等的金屬箱。金屬羯等 為展王ΐ = ΐ於本領域所使用之厚度的範圍内’並無特別限制。又， ^。 ’’、黏接性，可在該金屬箔表面施加合金處理、有機處理 本赉月中基板101之導體層12可使用銅箔，尤其較佳係由壓延 200906262 寺殊;==。於導體層12由壓酬構成時，就裂縫 -ΐ雷二^ : 言’係屬較佳。又，特殊電解銅箱相較二 上?解銅Γ，由於結晶粒較大，具有類似於壓延銅箔之構造= 就可侍到同等於壓延銅荡的效果而言，係屬較佳。 b ,1、一 ，基板1〇<l及表覆層102各別之電絕緣層11、W中，至 ί性所構成時，此就絕緣可靠性、财熱性良好，且具言 ωι ΐίί:尤其，兩者皆由聚醯亞胺所構成則更佳/、门 的製ii。 例如可採用以鑄造法所為之2層單面電路板 試舉2層單面電路板的製造方法之一例如下： 亞胺前驅物樹脂液加以塗佈、乾燥後，以熱醯亞胺ί法或化風 」亞胺化法將該樹脂加以醯亞胺化而製造2層面 ^ 3办子 係一種補足進酿亞胺化反應的方法;化學Ϊ亞ί化Ϊ: 法。於亞胺賴物樹脂液添加脫水劑與觸媒而進行醯亞胺化的 苯二前=樹脂液而言’可採用聚醢胺酸等，能舉例如對 四麵之二胺類’以及與3,3，，4,4，_聯苯四賴軒等之 接著，〜範，内進行階段式升溫，同時乾燥1〜又3“鐘。 在亂氣私兄下，Ρ白段式升溫3小時，達到18〇〜約侧 _脂的醯亞胺化反應，得到2層單面基板(圖3。 {進 下時i行=應溫度為該樹脂的玻璃轉移點溫度以上、熱分解溫度以 另外’可細姻進行去除•錢而得 醯亞胺層⑼及銅f|層(Cu)所構成之2 在圖3所不聚 望之電路圖案。 鴨成之2層早面基板的銅箱層形成所希 可借L iisn，採用2層單面基板作為基板；但本發明也 了使用2層雙面基板。就此種2層雙面基板的製造方法而言本^下舉 200906262 例之壓合法如下。具體而言為：（1)於鑄造法所製造之2層單面基板 的聚醯亞胺層(PI)的表面形成熱塑性聚醯亞胺層(τρι)後200906262 IX. Description of the Invention: [Technical Field] The present invention relates to a flexible printed circuit board and a mobile phone terminal using the same. Cut-off [Prior Art] In recent years, mobile phone terminals (hereinafter also referred to as mobile phones) have been rapidly popularized, and the purpose of miniaturization of line scales has been achieved. (4) Silk picking produces a rogue $ square-turn, folding type need. Recently, 卩 has become more miniaturized as = - the phone has become significantly popular. ~ κ月动式动动' However, the flexible printed circuit board (hereinafter also referred to as FPC diligent) has a good flexibility and flexibility because it is widely used in line equipment, especially mobile phones. ^ 'The so-called FPC substrate can be roughly divided into the following two kinds of difficulties. The adhesive layer is provided on one or both sides of the electric insulating layer such as the imide film, and is laminated, and the copper W metal is purely formed into a conductor layer, and the conductor layer of the three-layer substrate is electrically insulated and bonded. The formed cover layer is formed so as to be in close contact with the conductor layer forming circuit of the two-layer substrate which is hardened by the embossing, and the surface layer is placed on the conductor layer after the formation of the far circuit.曰 发. ί 严 严 , , , , , , , F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F Basefiim) A portion formed by laminating a hardened material of an extremely thin copper foil. The base film, bonding = text = material, extremely thin _ retelling _ _ thickness is qing m = this table is covered by the publication of 5'235948, a very thin surface coating and the use of thickness °, etc. The layer is used to protect the flexible circuit board, which is 2mm for the half-length. However, the techniques of these publications make the folding endurance test, or the technique of increasing the folding radius to O.imm or 0.38 mm 200906262 === the characteristic of the curve, and the sliding sliding with a small sliding radius. The upper frame body fish and the force/mouth are moved in the direction of each other and connected, and the thin type can be achieved with the thin type. . The fpc substrate used for sliding the predetermined sliding radius is also called the narrow 匕^ of the sliding portion when it is moving; so that the sliding radius at this time is quite small (in time, = shirt ~ tens of thousands of times will be produced as a road problem) In addition, a conventionally known C substrate is used, and the present invention is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. 2005-209913. On the day of the present invention, in the printed circuit board of the sliding type mobile electronic device i, it is particularly applicable to repeatedly perform hundreds of thousands of sliding operations, and even under such conditions, another type of motion of the present invention Mobile phone terminal., ',,, 0 for the smoothing of the flexible printed circuit board, the sliding layer of the flexible printed circuit board is provided with a conductor layer formed by the conductor layer. The layer is provided with a surface layer composed of a layer of electricity, 邑', and 彖; the characteristic of the printed circuit board is: 6 the layer of the adhesive layer is stored by a coefficient of elasticity of £200906262~4GPa' a resin having a loss elastic modulus E" of 0 〇 3 〇 or more; The recovery rate after extension is 9〇%, the thickness of the electrically insulating layer of the coating is 7 5~the thickness of the township is 7.5~2Gpm, and the adhesive layer of the surface of the epoxy tree 2 is formed in the printed circuit board. The resin of the layer contains a polymer of $4^ fine 嶋 towel, and the molecular weight of the transfer surface is ~^Ομηι. The flexible printed circuit board of the ' load has a thickness of 5 in the metal slab or in the road plate. The thickness of the substrate is controlled by rolling 6. The 1~5 order is the same as the second frame, and the frame of each of the fine cover layers is shown, and the first frame of the face and the second body of the second body are 2 When the first frame is slidably accommodated in the body and the second frame is slidably received, the flexible printed circuit board described in (4) is printed. The board is placed in the second frame 8. The surface of the board is held so that the radius of the movement 6 is maintained at 〇.4~lmmR. If the self-contained flexible printed circuit board or the 7-layer cover is characterized by: the cover layer of the adhesive layer is composed of a storage elastic layer and an electrically insulating layer; the sliding of the 200906262 portion is narrow 1Mb, Under such conditions, short-circuiting does not occur even if it is repeated hundreds of thousands of times or more, which is not possible in the conventional FPC board. [Embodiment] The best form of the invention is implemented _ The present invention will be described. However, the following embodiments are in accordance with the scope of the patent application. Further, combinations of the features described in the embodiments are not necessarily all necessary for the solution of the invention. [Flexible printed circuit; Fig. 1 is a perspective view showing a flexible printed circuit board according to a first embodiment of the present invention. Fig. 1 is a perspective view of the flexible printed circuit board according to the first embodiment. In the printed circuit board, the substrate 11 and the conductor layer 12 on which the circuit pattern is formed are connected to the surface layer of the layer η and the electrically insulating layer 14 by the adhesion layer. Moreover, Fig. 1 / knife opens without showing the substrate ιοί and the surface layer 1〇2, which is easy to understand. Further, the adhesive layer 13 of the cover layer 102 is composed of a resin elastic elastic loss coefficient E" of _~G.1 GPa, and Qian Qiang is ^4 GPa, and resin. (10) The material is 90% or more. In the invention, the storage elastic modulus E, and the loss elastic coefficient e Sc_fie (4) the recovery rate of the device e=nc is obtained by the test method in the embodiment described later = value & The storage elastic modulus e of the resin of the agent layer 13 is preferably 1 to 3 GPa ^ ', a for the purpose of exhibiting flexibility, but particularly, the loss elastic modulus E" of the resin is 〇 . 〇3~〇mp To improve the originality and improve the viscosity, it is preferably ± additionally, the recovery rate after the elongation of the resin is 9〇% to: ^细13__5~2_ paste In particular, it is especially suitable for the use of high-molecular-weight epoxy resin with resin in the field of the use of the resin. In the case of the person, the bis-second application form uses phenoxy resin as the high molecular weight epoxy resin.聛 '辇:Nuoyue 曰 吕 吕 ' can use the skeleton of the main chain composed of bisphenol hydrazine, bisphenol f, bisphenol s, ^ ίί two f, ί can also be included by, for example, double age A, double _ In order to provide the flame retardancy required for the FPC substrate, it is also possible to use, in addition to the use of the gamma A epoxy resin, for example, a double-shaped (line 1 large t ΐϊΐ ί ^ resin) It is also a tree made of a linear chain of oxygen-based resin, which is a linear resin. The reason is that the resin is linear compared to a resin having a three-dimensional network texture and a linear molecular chain. Therefore, when external stress is applied, the weight of the stored mass should be 20^90% 0 5 ~ layer 13 from the early release of the stress, and the weight average molecular weight is preferably 2 〇扉 restorative ρ is good' :G~5G, _. The reason is that when the molecular weight is within this range, f 旻 f f is good, and the workability such as coating described later is improved. #i ^ ΪΓ: ? Dihalodiamine or the like Hardener b, wind, "16 two-phase, material, hexamethylenediamine, flex"Si: two thicknesses of ray is 7. 5~4 〇 - especially on the substrate as a whole - here, The thickness of the edge layer 14 is 7.5 〜 ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ ～ When the layer 14 is thicker, the pressure _ car 3, the state of the contraction stress; the state when the figure radius is the same ". 'Fig. 9 (8) and Fig. 9 (8) are compared with the sliding 200906262 insulation, under the same axis, when The outer diameter (inner diameter) inside the iiC plate becomes smaller (narrowed) (Fig. 9(b)). Therefore, the greater the effect of ===, the slipperyness of narrow R = The sliding test white tii is provided with a shielding layer on both sides) is exemplified in the examples described later, such as lion-like Wei film, miscellaneous surface, polyimine film, yttrium film, and insulating film. Preferably, the poly-M sl having sufficient heat resistance and flexibility can be formed in the semi-hardened state by coating the surface of the electrically insulating layer 14 with a suitable coating and heating and drying. In the following, "the cladding layer 1" is provided on the substrate 1'1 in which the circuit pattern is formed. ', σ, ,, and hardening 'by opening" into the flexible printing of the first embodiment The coating method when the brush circuit is applied to the resin for the adhesive layer 13 may be, for example, a twin roll c er) 箄 (10) day, a die coater (Die C 〇 ater), a groove coating The cloth machine (gravure ^ ' can be suitably used in accordance with the desired thickness of each layer, etc. The thickness of the edge layer 11 is 7·5 to 20 隅. Especially for the SI1 of the entire substrate, the reduction of the stress is reduced. The thickness of the insulating layer 11 is preferably 7.5 to μ ^, and the principle of the reduction of the compressive stress is as described above. For example, the properties of the insulating layer are made of polyimide, polyimide, polyimide, and the like. In terms of heat resistance and the like, it is preferred to use a polyamine. Further, the 冤, , 邑, 彖 layer 11 may be a single layer or a plurality of layers. Inside, Hi constitutes the reversal towel of the Wei margin layer 11, which can be defoamed in the range of the lowering of the job, and various additives such as a coating agent (leVeling agent), a coupling agent, and a conductor of the eve 1〇1 are added. The layer 12 is made of a metal case such as copper or SUS. There is no particular limitation on the metal enamel, etc., which is within the range of thicknesses used in the art. Again, ^. ''Adhesiveness, alloying and organic treatment may be applied to the surface of the metal foil. The conductor layer 12 of the substrate 101 may be copper foil in the middle of the month, and it is particularly preferable to use the rolling 200906262; When the conductor layer 12 is composed of a pressure, it is preferable that the crack - ΐ雷二^: 言'. Moreover, the special electrolytic copper box is better than the copper bismuth solution, because the crystal grain is large, and the structure similar to the rolled copper foil is equivalent to the effect of rolling copper sway. b, 1, one, the substrate 1〇<l and the respective insulating layers 11 and W of the surface layer 102, when the composition is constitutive, the insulation reliability and the heat recovery are good, and the phrase ωι ΐ ί : In particular, both of them are made up of polyimine, which is better. For example, one of the manufacturing methods of the two-layer single-sided circuit board which is a two-layer single-sided circuit board by a casting method can be used, for example, the following: the imine precursor resin liquid is applied, dried, and then subjected to heat yttrium or The method of imidization of the resin by imidization of the resin to produce a two-layered system is a method for complementing the imidization reaction; In the case of the phenylene precursor = resin solution in which the deuterium imidization is added to the imine lysate resin liquid, poly-proline or the like can be used, for example, the tetra-diamines and the 3,3,,4,4,_Biphenyl four Lai Xuan, etc., followed by Fan, the internal temperature rise, while drying 1~3" bell. Hour, reach 18 〇 ~ about side _ lipid 醯 imidization reaction, get 2 layers of single-sided substrate (Figure 3. {When entering i line = temperature should be above the glass transition point temperature of the resin, thermal decomposition temperature to In addition, it can be removed by a fine marriage. The carbon dioxide is formed by the imine layer (9) and the copper f| layer (Cu). The circuit pattern that is not concentrated in Figure 3. The copper box of the two-layer early substrate of the duck. In the layer formation, a two-layer single-sided substrate is used as the substrate; however, the present invention also uses a two-layer double-sided substrate. For the method of manufacturing such a two-layer double-sided substrate, the pressure of 200,906,262 is used. The legal basis is as follows: (1) forming a thermoplastic polyimide layer (τρι) on the surface of the polyimide layer (PI) of the 2-layer single-sided substrate manufactured by the casting method. Rear
T}PI 1,^" J 燥後’將銅箔層熱壓接而製造(請參照圖4)。 …就TPI而言，例如可採用使4,4，_二胺二苯醚或包含其衍生物之二 胺類與3,3’，4,4’-二苯基綱四羧酸針等之四緩酸類反應所得到的聚醯胺 酉文等。壓合溫度較佳為TPI的玻璃轉移點溫度以上、埶分解溫产以 更佳為250〜40(TC之範圍内。 又 f 另外，如圖4所示，藉由蝕刻進行去除•乾燥，俾於在2 板(圖的單面銅结層（圖之上側)形成所希望之電路圖案。然後，進 側基板(圖4⑻)之電路圖案的相反側’藉由侧將該 側之=面銅伯層(圖之下侧)全部進行去除•乾燥，而得到基板(圖4⑽。 第2 ίί开性印刷電路板的第2實施形態。圖2顯示 第2貫把形態之撓性印刷電路板的立體圖。 如圖2所示，第2實施形態之撓性印職路板· 二=|_板ΗΠ及表覆層撤上，進一步藉 [g I本目f，_爾細1辦 ^外，藉由設置屏蔽層20卜而具備接地、屏蔽電 第2實施形態之撓性印刷電路板巾， : 亦即由電絕緣層Π及形成有電路圖案的導 形態的層相同; 劑請構成者。電絕緣層21可上牛而 用聚賴等塑膠臈。又，金屬基鍵層22 f田、擇，例如可採 層。黏麵b謝賴 200906262 制。另外’各層的厚度可依使用結 以外，也可在表覆層表面將用以使°並且，除上述結構 塗佈、硬化，而作為屏蔽層使用。 主仏粒分散之糊狀樹脂加以 [滑動式行動電話終端機] 本發明之滑動式行動電話終端 態。 捉仏如圖5所不之一實施形 如圖5所示，滑動式行動電話終 1框體51、與第2框體52，重合兮、路_ + 匕3具有顯示晝面之第 與第2框體52二者，且該第月表面側之第1框體51 動而連結。在第1框體51與第2框體弟，體”略呈平行地移 第1實施形態之電路板1〇〇 ^第丨框 较卩，以可滑動地收納有 之電路板100對收納於第2框體52= 2納於第1框體51 滑動，且其滑動半徑保持在〇.4〜lmmg。卩刷電路板100略呈平行而 使用滑動式行動電話終端檣π 圖5(a)狀態(使用時)地使第足圖5(b)狀態(收納時)往 另外’滑動式行動電話終端 電路板100於使用時，使滑動半 弟1實轭形怨之撓性印刷 動而設置。於此狀態下，由於滑^ _^^0.4〜1mmR之同時並滑 發明之撓性印刷電路板’因此可诊轉端機5GG採用上述本 受性良好等雛。 所希望之_錄，具備使用耐 又，就一般之滑動類型而古，古 ^ 類型，以及滑動半徑於既定範士 ’、夺—疋滑動半徑狀態而滑動的 變動而滑動的類型；本發明於:―二0比65〜lmmR之範圍内滑動） 如圖6(a)、6(b)所示，在以往二叙^可發揮良好之滑動特性。 化的特性。但近年來，隨著五電話終端機並無須必備薄型 化之要求，滑動部的窄R化^必機=型=功能 足此種窄R化之要求。 罟本么明之盯動電活終端機即滿 又，本發明提供一種表覆异 滑動式行動電話終端機，至少:舰地上述撓性印刷電路板或上述 劑層係由儲存彈性係數E，為層^絕緣詹所構成。該黏接 馬 4GPa，知失彈性係數E”為0.03〜 Π 200906262 該電絕緣層之厚 O.IGPa ’且延伸後的復原率為9〇%以上的樹脂構成 度為7.5〜40μιη。 但本發 以下，舉本發明之實施例及試驗例，更具體說明本 明並不由於此等實施例而受限制。 χ (1)表覆層的製造 調製表1所示表覆層用樹脂，在APICAL(註冊商標)2Νρ Corporation)的單面’採用棍塗佈機塗佈該樹脂，再於15 ： i〇〇〇c^i8〇°c ^ ι^ιο ^4), b 十口（牛硬化)之表覆層膜。又，樹脂面以經脫膜處理之隔離膜 使用時則撕下隔離膜再使用。 一T}PI 1,^" J After drying, the copper foil layer is thermocompression bonded to manufacture (please refer to Figure 4). In the case of TPI, for example, 4,4,-diamine diphenyl ether or a diamine containing the same may be used, and a 3,3',4,4'-diphenyl tetracarboxylic acid needle or the like may be used. The polyamidamine obtained by the four acid-lowering reaction, and the like. The pressing temperature is preferably higher than the glass transition point temperature of the TPI, and the hydrazine decomposition temperature is preferably 250 to 40 (in the range of TC. Further f, as shown in Fig. 4, removal by etching; drying, 俾The desired circuit pattern is formed on the two-plate (the upper side copper layer of the figure (the upper side of the figure). Then, the opposite side of the circuit pattern of the side substrate (Fig. 4 (8)) is made by the side of the side = surface copper The primary layer (the lower side of the figure) is completely removed and dried to obtain a substrate (Fig. 4 (10). The second embodiment of the second printed circuit board. Fig. 2 shows the flexible printed circuit board of the second embodiment. As shown in Fig. 2, the flexible printed road board of the second embodiment, the second =|_ board and the surface layer are removed, and further borrowed [g I, the original f, _ er fine 1 The flexible printed circuit board according to the second embodiment is provided with a grounding and shielding electric current by providing the shielding layer 20, that is, the layer having the electrically insulating layer and the conductive pattern in which the circuit pattern is formed is the same; The insulating layer 21 can be embossed with a plastic or the like. In addition, the metal-based key layer 22 f, the selection, for example, the layer can be collected. 200906262. In addition, the thickness of each layer may be used as a shielding layer in addition to the use of the knot, or on the surface of the surface coating layer, and coated and hardened in addition to the above structure. The main granule-dispersed paste resin [Sliding mobile phone terminal] The sliding type mobile phone terminal state of the present invention. As shown in FIG. 5, the sliding mobile phone terminal 1 frame 51 and the second frame are shown in FIG. The body 52, the superimposed 兮, the road _ + 匕3 has both the first and second frames 52 showing the kneading surface, and the first frame 51 on the surface side of the first month is movably connected. The first frame 51 and the first frame 51 (2) The body of the frame body is slightly parallel to the circuit board of the first embodiment. The first frame is relatively sturdy, and the circuit board 100 slidably received is housed in the second frame 52 = 2 nano The first frame body 51 slides, and the sliding radius thereof is maintained at 〇.4 to lmmg. The brush circuit board 100 is slightly parallel and uses a slide type mobile phone terminal 樯π Figure 5 (a) state (when used) In the state of FIG. 5(b) (when stored), when the other 'sliding mobile phone terminal circuit board 100 is in use, the sliding half is 1 yoke. The flexible printing of the blame is set. In this state, since the flexible printed circuit board of the invention is slipped while sliding _^^0.4~1mmR, the diagnosable translating machine 5GG adopts the above-mentioned goodness. The desired _ recording, with the use of resistance, the general sliding type and the ancient, the type of the ancient, and the sliding radius in the established Fan's, the 疋-疋 sliding radius state and the sliding of the sliding type of change; the present invention : ―Two 0 is slipped within the range of 65 to lmmR. As shown in Fig. 6(a) and Fig. 6(b), in the past, it is possible to exhibit good sliding characteristics. However, in recent years, with five The telephone terminal does not need to be thinned, and the narrow R of the sliding portion is required to function as such a narrow R. The present invention provides a surface-sliding mobile phone terminal, at least: the flexible printed circuit board of the ship or the agent layer is stored by an elastic modulus E, Layer ^ insulation is composed of Zhan. The bonded horse 4GPa has a known loss coefficient of elasticity E" of 0.03 to Π 200906262. The thickness of the electrically insulating layer is O.IGPa' and the degree of resilience after elongation is 〇 〇 以上 的 7.5 7.5 7.5 7.5 7.5 7.5 。 。 。 。 。 。 。 。 。 。 Hereinafter, the examples and test examples of the present invention will be more specifically described. The present invention is not limited by these examples. χ (1) Preparation of surface coating layer The resin for surface coating layer shown in Table 1 is used in APICAL. (registered trademark) 2Νρ Corporation)'s single-sided 'coating the resin with a stick coater, then 15 : i〇〇〇c^i8〇°c ^ ι^ιο ^4), b ten mouths (bovine hardening) The cover film is used. Further, when the resin surface is used as a release film, the separator is peeled off and used.
[表1] _樹脂組成 調配份數(PHR、 組成 —物品名 製造者 樹脂類型A 樹脂類型B 高分子量環 苯氧樹脂 Incheon 100 0 氧樹脂 Corporation. 環氧樹脂 雙酚A型 Japan Epoxy 20 100 環氧樹脂 Resins Co.,Ltd. 柔軟劑 NBR ΖΕΟΝ 0 80 CORPORATION. 硬化劑 酚醛苯酚 SHOWADENKO 6 25 樹脂 K.K. -__存彈性係數)(Pa) 2.4xl09 9.2xl07 _失彈性係數)(Pa) 4.9χ107 2.2χ107 Tan5 0.02 0.23 --斷伸長率(％) 4 193 _JL長率(％)( 1 st/2nd) 0.114/0.116 25.065/30.746 -之復原率(％)(lst/2nd) 99.992/99.988 90.701/87.555 --__Ji動次數(萬次） 100 4.6 ※NBR:丙烯腈_丁二烯橡膠 14 200906262 用以測定表1所示各樹脂之物性的樣本， 造。首先，如表1所示之調配_而加人各材用以下步驟而製[Table 1] _ Resin composition blending number (PHR, composition - article name manufacturer resin type A resin type B high molecular weight cyclophenoxy resin Incheon 100 0 oxygen resin Corporation. Epoxy resin bisphenol A type Japan Epoxy 20 100 ring Oxygen Resins Co., Ltd. Softener NBR ΖΕΟΝ 0 80 CORPORATION. Hardener Phenolic Phenol SHOWADENKO 6 25 Resin KK -__ Storage Elasticity Factor) (Pa) 2.4xl09 9.2xl07 _ Loss of Elasticity) (Pa) 4.9χ107 2.2 Χ107 Tan5 0.02 0.23 - elongation at break (%) 4 193 _JL long rate (%) (1 st/2nd) 0.114/0.116 25.065/30.746 - recovery rate (%) (lst/2nd) 99.992/99.988 90.701/87.555 --__Ji movement times (10,000 times) 100 4.6 *NBR: acrylonitrile _ butadiene rubber 14 200906262 A sample for measuring the physical properties of each resin shown in Table 1. First of all, as shown in Table 1, the addition of each material is made by the following steps.
下將该樹脂加熱硬化30分鐘，以使該樹脂成為二授拌後，於18〇C 表1所示各樹脂之彈性係數(E，、E”)係於本形狀。 〒e〇metric Scientific公司製造之動態黏彈性測定壯2、下的值，以 彈性之測定於如下條件中進行： 、衣置所測得。動態黏 樣本尺寸：40mmxl0mmx厚 0.1mm 溫度範圍：~30°C〜150。〇 又，裂斷伸長率係依據J1SC2318測定而得之估.士奋> . 斷伸長率之測定於如下條件中進行： 值，本實轭例中，裂 ( 樣本尺寸：2〇〇mmxl3mmx厚 〇.imm 固定治具間的距離：100mm 拉伸速度：5〇mm/min 於上述條件下將樣本拉伸，以樣本裂斷時之 利用下式計算出裂斷伸長率。 ’申長I為L，可 裂斷伸長率(％)=(L/夾具間的距離) χΙΟΟ 又，樹脂的伸縮試驗方法係依據如圖8所 如下條件中進行： 丨丁您加窒交化曲線，於 樣本尺寸：llmm><5mmx厚 〇.imm 。ίί溫島津製作所；SHIMADZUC〇RP〇娜0N.) - 加重速度：50g/min 減重速度：一50g/min 最大加重值：l〇〇g 伸長率之計算式係依據圖8之l〇、LI、L3而如下. 〈第1循環〉 而如下· {(LI—L0)/L0} χΙΟΟ 〈第2循環〉 {(L3 — L0)/L0 } X1 〇〇 復原率之計算式係依據圖8之L〇、L2、L4而如下： 200906262 〈第1循環〉The resin was heat-hardened for 30 minutes to make the resin into two, and the elastic modulus (E, E) of each resin shown in Table 1 at 18 ° C was in this shape. 〒e〇metric Scientific The dynamic viscoelasticity of the measurement was measured in the following two conditions. The measurement of elasticity was carried out under the following conditions: Measured by clothing. Dynamic viscosity sample size: 40 mm x l0 mm x thickness 0.1 mm Temperature range: ~ 30 ° C ~ 150. Further, the elongation at break was estimated based on J1SC2318. The determination of the elongation at break was carried out under the following conditions: Value, in the example of the yoke, crack (sample size: 2〇〇mmxl3mmx thick 〇 .imm Distance between fixtures: 100mm Tensile speed: 5〇mm/min The sample is stretched under the above conditions, and the elongation at break is calculated by the following formula when the sample is broken. 'Shen Chang I is L Elongation at break (%) = (L / distance between clamps) χΙΟΟ Also, the test method for the expansion and contraction of the resin is carried out according to the following conditions as shown in Fig. 8: 丨 您 窒 窒 窒 窒 窒 窒 窒 窒 窒 窒 窒 窒 窒Llmm><5mmx thick 〇.imm. ίί 温岛津制作所;SHIMADZUC〇RP〇 0N.) - Weighting speed: 50g/min Weight loss speed: 50g/min Maximum weighting value: l〇〇g The calculation formula of elongation is based on l〇, LI, L3 of Fig. 8 as follows. <1st cycle> As follows: {(LI-L0)/L0} χΙΟΟ <2nd cycle> {(L3 — L0)/L0 } The calculation formula of X1 〇〇 recovery rate is based on L〇, L2, L4 of Figure 8 as follows: 200906262 <1st cycle>
(L0/L2) xlOO 〈第2循環〉(L0/L2) xlOO <2nd cycle>
(L0/L4) xlOO 量除i樣驗^樣本產生最大變形時的變形 (賴驗後樣本之復原程度加 (2) 基板 的冓法構成的基板係採用有澤製造所 列。 構成的基板則採用有澤製造所的PNS Η系 (3) 屏蔽材 本實施例所使用之屏蔽材，係採(L0/L4) xlOO The amount of deformation in the case of the maximum deformation of the i-sample test (the degree of restoration of the sample after the test is added (2) The substrate structure of the substrate is listed in the manufacturing of the substrate. The substrate is composed of PNS of Osawa Manufacturing Co., Ltd. (3) Shielding material used in this embodiment.
Co.，Ltd.的 SFPC5000。 用 TatSUTA System Electronics (4) 撓性印刷電路板的製造 將表2所减板(郷醯亞胺上 經撕下隔離膜之表覆層的黏接面二有！^電路的2層基，)以及 18〇rx2.94MPax30 ^ 5MPa、10〜60分鐘)之條件下衝壓成形 i力2〜 屏蔽材的黏接面貼合到表覆層盥基板^ '等經撕下隔離膜的 分鐘之條件下成形，而得 延銅羯採用日鑛金屬(股)公司所生產者 而吕，壓 解(股)公司所生產者。 f姝電解銅泊則採用日本電 針對由表2所示各實施例及比較例之纟 板，依據如下之測定方法與裝置，進行滑動 、f印刷電路 1〜Π顯示實施例；比較1〜3之結構顯示比較^。’表2中的結構 [滑動的測定方法] 滑動方法：依據IPC-FC-241A2.4.3而進行測定。 裝置：低速窄R滑動試驗機(請參照圖7(a)及圖7卬)） 200906262 、# 八> 丁私'月動才之移動距離(單程)）：50mm 速度(1刀知之滑動次數）：l〇〇cpm 滑動半徑：lmm 測定溫度：室溫 [滑動評價所使用裝置] 乂 ^、·Ι(1)顯不本實施例中之滑動評價所使狀裝置的概略剖面圖。 在此之滑動評價方法係依據IPC-FC-241A2 4 3。 轉而使樣;S:滑動半徑在^，並利用凸輪之旋 内徑在將用以固定樣本之板的間隙除以2(並非樣本之 ^圖7(b)所示’評價時所使用之樣本的形態，採用由細長狀 所的圖案為Μ(線寬/間隔寬)=75"一、長15醜的銅線2〇條 又，測定時，於作為表覆層之聚亞胺面、與基板側之聚 面兩面上，設置屏蔽層後再進行試驗。 兄妝 針對’骨動稍之結果’將细實施例及比較例之表覆層與基 構成(各層之厚度、樹脂類型、銅紐類、製法)—併顯示於表2。 17 200906262 [表2] to tt#交 3 1 1 (¾ 1 1 X Η VQ < CN I CN f 8 τ·^ ◎ tbft2 1 1 1 η 00 X 1 1 1 丄 1 <·η 〇 iQ V£^ CN IS 8 ◎ 2 1 1 1 1 1 JO 1 8 1·« 'f ◎ on 1 1 3 齡 <] (N 习 t—< R C oo I Cj f 8 ◎ I-< 1 1 1 (N m 1 8 r~H ◎ o 1 4 1 兰 1 1 1 〇 Os 3 |T> < CN 1 觀 8 τ-^ ◎ 00 1 *£> <N 特殊 鱗 3 1 8 r~H ◎ 卜 1 |Q 1 1 1 8 ◎ V〇 R < CN 觀 2; m- S ◎ U-i 1 8 1 1 1 $ »—Η <] 寸 a JT> C oo 觀 2 4 8 r·^ ◎ rn 1 1 1 1 1 36.9 〇 <N 1 1 1 1 1 <Ν 〇 fcbfel 1 1 1 1 (Ν X r—H (N JQ < 觀 3i 8 ◎ 厚度("m) 厚度i"m) 糊麵 _1 厚度("m) VCBC s 厚度(“m) 势擴員 Π 接 f 證 t!?: 18 200906262 時，貝=ίί達顯示結果為10G萬次；次數在其以上 付.而滑動次數的分等如下： 上〇:2_以上萬次以上x:未滿1〇 【產業上利用性】 板之滑動式杆稀立之巧動―人數’並提供利用此撓性印刷電路 具有產業ί可利^終端機；就_於鱗發明之表㈣而言，也 【圖式簡單說明】 層及態之換性印刷電路板，分開基板、表覆 立體Ξ。 顯 的製造法—例之壓合法的—步驟的概略 剖面=⑻、5(b)係顯示滑動式行動電話終端機之—實施形態的概略 概略=r(b)軸示行純雜频之電路« r化之必要性的 圖.顯示本實施例中之滑動評價所使用之裝置的概略剖面 ^圖圖7_咖於同評價之樣本的部分層省略而顯示的概略俯 Ξ 例i比較，_之樹脂伸縮試驗的測定概要圖。 *壯二2 _不只施形悲1之表覆層之電絕緣層較薄時的壓縮岸 19 200906262 【主要元件符號說明】 π〜電絕緣層 12〜導體層 13〜黏接劑層 14〜電絕緣層 21〜電絕緣層 22〜金屬蒸鍍層 23〜黏接劑層 51〜第1框體 52〜第2框體 100〜撓性印刷電路板 101〜基板 102〜表覆層 200〜撓性印刷電路板 201〜屏蔽層 500〜滑動式行動電話終端機 Cu〜銅箔層 L〜線寬 L〇〜樣本之初始長度 L!、L3〜樣本之最大變形量 L2、L4〜樣本於伸縮試驗後之長度 Π〜聚醯亞胺層 R〜滑動半徑 S〜間隔寬 TPI〜熱塑性聚醯亞胺層 20SFPC5000 of Co., Ltd. The manufacture of the TatSUTA System Electronics (4) flexible printed circuit board will be reduced in Table 2 (the bonding surface of the surface layer of the yttrium-impregnated separator is provided with a 2-layer base of the circuit) And 18 〇rx2.94MPax30 ^ 5MPa, 10~60 minutes) under the condition of press forming i force 2~ The bonding surface of the shielding material is attached to the surface of the surface layer 盥 substrate ^ ', etc. Formed, and the extended copper enamel is produced by the company of Nippon Mining & Metals Co., Ltd. and produced by the company. f姝electrolytic copper poise was carried out by using Nippon Electric for the slabs of the respective examples and comparative examples shown in Table 2, and the sliding and f-printing circuits 1 to Π were shown according to the following measurement methods and apparatus; comparison 1 to 3 The structure shows comparison ^. 'Structure in Table 2 [Measurement method of sliding] Sliding method: Measurement was carried out in accordance with IPC-FC-241A2.4.3. Device: Low-speed narrow R sliding test machine (please refer to Figure 7(a) and Figure 7卬)) 200906262, #八> Ding private 'moving distance of moon movement (one way)): 50mm speed (1 knife knows the number of slides) ): l〇〇cpm Sliding radius: lmm Measurement temperature: room temperature [device used for sliding evaluation] 乂^,·Ι(1) A schematic cross-sectional view of the device for sliding evaluation in the present embodiment. The sliding evaluation method here is based on IPC-FC-241A2 43. In turn, S: The sliding radius is ^, and the inner diameter of the cam is used to divide the gap of the plate used to fix the sample by 2 (not the sample shown in Figure 7(b). The shape of the sample is such that the pattern of the elongated shape is Μ (line width/space width) = 75 " one, the length of the ugly copper wire 2 〇 又, and, when measured, on the surface of the polyimide layer, The test layer was placed on both sides of the stacking surface on the substrate side, and then the test was carried out. The brother makeup was applied to the surface layer and the base of the fine examples and the comparative examples for the results of the 'bone movement slightly' (thickness of each layer, resin type, copper) New Zealand, method) - and shown in Table 2. 17 200906262 [Table 2] to tt#交3 1 1 (3⁄4 1 1 X Η VQ < CN I CN f 8 τ·^ ◎ tbft2 1 1 1 η 00 X 1 1 1 丄1 <·η 〇iQ V£^ CN IS 8 ◎ 2 1 1 1 1 1 JO 1 8 1·« 'f ◎ on 1 1 3 Age<] (N 习t-< RC oo I Cj f 8 ◎ I-< 1 1 1 (N m 1 8 r~H ◎ o 1 4 1 兰1 1 1 〇Os 3 |T>< CN 1 View 8 τ-^ ◎ 00 1 *£> ; <N Special scales 3 1 8 r~H ◎ Bu 1 |Q 1 1 1 8 ◎ V〇R < ; CN View 2; m- S ◎ Ui 1 8 1 1 1 $ »—Η <] inch a JT> C oo view 2 4 8 r·^ ◎ rn 1 1 1 1 1 36.9 〇<N 1 1 1 1 1 <Ν 〇fcbfel 1 1 1 1 (Ν X r—H (N JQ < View 3i 8 ◎ Thickness ("m) Thickness i"m) Paste_1 Thickness ("m) VCBC s Thickness ("m) Potential expansion Π 接 f certificate t!?: 18 200906262, Bei = ίί Da display results for 10G million times; the number of times paid above it. The number of sliding times is as follows: Captain: 2_ More than 10,000 times x: less than 1 〇 [Industrial use] The slide-type lever of the board is a fascinating movement - the number of people and provides the use of this flexible printed circuit with the industry's profitable ^ terminal machine; Table (4), also [simplified description of the diagram] layer and state of the flexible printed circuit board, separate the substrate, the surface of the three-dimensional Ξ. Explicit manufacturing method - example of the pressure - the outline of the steps = (8), 5 (b) shows the sliding mobile phone terminal - the outline of the embodiment = r (b) axis shows the line of pure frequency Fig. 7 shows a schematic cross-sectional view of the apparatus used for the sliding evaluation in the present embodiment. Fig. 7_Compared with the partial layer of the sample of the same evaluation, the summary is shown. A summary of the measurement of the resin expansion test. *Zhuang 2 2 _ not only the shape of the thin layer of the electric insulating layer of the thin layer of the compressed shore 19 200906262 [main symbol description] π ~ electrically insulating layer 12 ~ conductor layer 13 ~ adhesive layer 14 ~ electricity Insulation layer 21 to electrically insulating layer 22 to metal deposition layer 23 to adhesive layer 51 to first frame 52 to second frame 100 to flexible printed circuit board 101 to substrate 102 to surface layer 200 to flexible printing Circuit board 201 to shield layer 500 to slide type mobile phone terminal machine Cu to copper foil layer L to line width L〇 to sample initial length L!, L3 to sample maximum deformation amount L2, L4~ sample after stretching test Length Π ~ polyimine layer R ~ sliding radius S ~ spacing wide TPI ~ thermoplastic polyimide layer 20