200906235 九、發明說明： • 【發明所屬之技術領域】 本發明關於一種電路板，尤其涉及一種撓折時具有良 好機械強度之軟性電路板。 【先前技術】 軟性印刷電路板（Flexible Printed Circuit Board，FPCB) 由於具有輕、薄、短、小以及可彎折之特點而被廣泛應用 於手機等電子產品中，用於不同電路之間之電性連接。隨 ' 著折疊手機與滑蓋手機等電子產品之不斷發展，對於FPCB 之性能隨之提出更高之要求，特別係FPCB之彎折性能面 臨著更大之考驗。 為得到具有良好撓折性能之FPCB，目前大多傾向於改 善或提升FPCB所用基膜材料之撓折性能。近年來，對於 可用於FPCB基膜材料業界投入了更多之研究，例如，現 階段FPCB基膜所常用之聚醯亞胺材料於日本就掀起過一 陣狂潮，參見 Electrical Insulation Maganize，Volume 5, Issue 1, Jan.-Feb.， 1989 Papers: 15-23, Applications of200906235 IX. Description of the invention: • Technical field to which the invention pertains The present invention relates to a circuit board, and more particularly to a flexible circuit board having good mechanical strength when flexed. [Prior Art] Flexible Printed Circuit Board (FPCB) is widely used in electronic products such as mobile phones because of its characteristics of lightness, thinness, shortness, smallness, and bendability. Sexual connection. With the continuous development of electronic products such as folding mobile phones and slider phones, the performance of FPCB has been put forward with higher requirements, especially the bending performance of FPCB is facing a greater test. In order to obtain FPCB with good flexural properties, most of them tend to improve or improve the flexural properties of the base film materials used in FPCB. In recent years, more research has been devoted to the industry of FPCB base film materials. For example, the poly-imine materials commonly used in FPCB base film have experienced a wave of frenzy in Japan. See Electrical Insulation Maganize, Volume 5, Issue. 1, Jan.-Feb., 1989 Papers: 15-23, Applications of
Polyimide Films to the Electrical and Electronic Industries in Japan”. 根據FPCB用於不同電路間之電性連接，FPCB之結 構中通常會包括金手指區。金手指區用於實現FPCB與其 他電子元件之間之電性連接，當FPCB與其他電子元件連 接時，金手指區通常需要外力擠壓插接入電子元件之介面 處。如圖4所示，先前技術中之FPCB10具有第一線路區 6 200906235 域11 ’金手指區域12及霜芸腊 及设風犋13。該覆蓋膜丨3與金手指 成12相接觸之端面14為平面，即，金手指區域12企覆 盍膜13之端面Η相交之六妗去士 & 一设 指區域η時，金當壓接或插接金手 午才曰£域12所承受之作用力基本上分備 =盍膜13與金手指區域12之直線型交線上，即，由於 =線型交線基本垂直于金手指區域12之每一條金手指： =樣=谷易造成金手指區域12沿該直線型交線斷裂。因 =讀術之軟性電路㈣折時機_ 性電路板之使用壽命被很大程度之縮短。 而軟 板。為此提供—種撓折時具有良好機械強度之軟性電路 【發明内容】 以下以實施例說明一種择 性電路板。撓折k具有良好機械強度之軟 板美2難電路板，其包括電路板基板與形成於該電路 膜^右之覆蓋膜’該電路板基板包括換折部，該覆罢 膜具有與該撓折部相交之端面，該端面為曲面。 - 板其=實施例中軟性電路板基板上之覆蓋膜與軟性電路 \ <撓折部相交接之端面設置為曲面，這樣，當 反作用而擠壓覆蓋膜之端面時，覆蓋膜之；二 樣，相上之作用力’會按照不同角度被分散，這 排佈^ ί前f術中反作用於挽折部上之作用力按直線 撓折部不谷易發生變形，亦不容易發生斷裂。 200906235 .【實施方式】 下面將結合附圖及複數實施例對本技術巧 路板作進一步之詳細說明。 软『生电 千本技術方案之軟性電路板包括電路板基板以及形成於 电路板基板上之覆蓋膜。該電路板基板係指已經 雨 孔、線路寻線路板自身結構之製作，且準備進行 = 表面形成覆蓋膜等後續製程之電路板基本結構：二 路板基板通常包括至少一撓折部，該挽折部係 = 板ΐ與其他電子元件連接時或者為了安排電路板空間^ 而而要育曲或需要受到外力擠壓之部位。舉例來戈 折部包括金手指區域（或稱作金手指部）與斷差區域= 接對於金手指區域來說’電路板於與其他電子: 手指區域通常需要外力擠壓插接入電子元 2之以處。&區域係指電路板上層數不同區域之交接 处’層數較少之區域相對於層數較多之區域來說， 性能較好，通常於安排電路板之空間位置時需要將 較少之區域彎曲。 直才而要將該層數 折邱述具有撓折部之電路板基板來說，覆蓋膜與撓 為曲面’用以將撓折部於彎折或被㈣ 叶所產生之應力進行右外八 it Λ 有效之刀放，例如，將通常分佈於直 路板LV 板斷裂之應力進行分散，使得作用於電 ===力分佈於曲線上，從而削弱電路板基板之 板基板上線路之斷裂。下面以具體幾個例 子H折部相交接之覆蓋膜之結構進行具體說明。 200906235 如圖1所示’本技術方案第一實施例提供一種軟性带 路板100,其包括電路板基才反110與覆蓋膜14〇。該電路ς 基板no包括第-線路區域120與金手指區域13Q。該” 膜⑽形成於第一線路區土或120上，且該覆蓋膜14〇呈^ -與金手指區物相交之端自⑷，該端面⑷為曲面， 即，覆蓋膜ho之端面141與金手指區域13()相交 150為曲線，如該交線150為波浪型、鋸齒型、弧形或1他 形狀之曲線。 該覆蓋膜140之端φ 141包括交替排佈之凸面盥凹 面’該凸面與金手指_ 13Q <端面相交之交線為波峰 151，該凹面與金手指區域13Q《端面㈣之交線為波欠 152，该波峰151和波谷152交替排佈形成交線15〇。該波 峰⑸與波谷152之寬度可相同亦可不同，且波峰1512 ，奋152之見度約為〇·25_〇 5毫米。當然，實際中具體交 ㈣〇管曲之程度’即，波峰151與波谷152之間之距離、 相鄰波峰m之間之距離或者相鄰波谷152之間之距離之 ^、，根據軟性電路板1⑽之金手指區域丨30之尺寸所設 本實施例中’兩個波峰151間可設置四條金手指，每 :金手指之寬度為0.15毫来，相鄰金手指之間距為〇15毫 =P廇兩個波峰151之寬度和再加上-個波谷152之 =需要等於或大》4xGi5+3xQi5，即等於或大於 顯然’上述波導i5i與波谷152之尺寸範圍可滿 足本汽苑例中金手指區域Π0設定之需要。 200906235 本具％例中，設置於第一線路區 與金手指區域丨3〇 *日一拉+。 （设豈朕140 1 μ 〇相父接之端面⑷之表面設置為曲面。 丰=性電路板100在與其他電子元件連接時，例如 ^ 曰品域13Mf接於電子元件之插口中時，該金手浐 = 到外力之漏而將應力仙於與其連接覆^ 、匕。/而面141上，這樣，覆蓋膜140之端面141與金 手指區域13〇之間會存於仙力與反仙力。而由於端面 Μ1^曲面，因此’端面141反作用於金手指區i或130之力 :、不同之角度被分散，這樣，反作用於金手指區域13 0 ，力不會聚集於—條直線上’相對於先前技術來說，金手 才曰區域130不容易發生變形乃至斷裂。 如圖2所示，本技術方案第二實施例提供一種軟性電 路板200，其包括電路板基板210與覆蓋膜240。該電路板 基板210包括斷差區域，該斷差區域由第一基板區域22〇 與第二基板區域23〇所定義，且第—基板區域22Q之基板 層數大於第二基板區域23〇之基板層數。這樣第一基板區 域220之每度大於第二基板區域230之厚度，從而於第一 基板區域220與第二基板區域23〇之間形成高度差，即， 断差區域。由於第一基板區域220與第二基板區域230存 在厚度差’即’第一基板區域220與第二基板區域230之 表面未處於同一高度，因此，通常設置於第一基板區域220 與第二基板區域230之覆蓋膜並非一片完整之覆蓋膜，而 需要分別於該兩個區域上形成覆蓋膜。本實施例中，該覆 盖膜240形成於厚度大之第一基板區域22〇之表面，且該 200906235 覆蓋膜240具有一與第二基板區域230相交之端面241，該 端面241為曲面，即，覆蓋膜240之端面241與第二基板 區域230相交之交線250為曲線，如該交線250可為波浪 型、鋸齒型、弧形或其他其形狀之曲線。 該覆蓋膜240之端面241包括交替排佈之凸面與凹 面，該凸面與第二基板區域230相交之交線為波峰251，該 凹面與第二基板區域230相交之交線為波谷252，該波峰 251與波谷252交替排佈形成交線250。該波峰251與波谷 252之寬度可相同亦可不同，且波峰251與波谷252之寬度 約為0.3-1毫米。當然，實際中具體交線250彎曲之程度， 即，波峰251與波谷252之間之距離、相鄰波峰251之間 之距離或相鄰波谷252之間之距離之大小，根據軟性電路 板200之第二基板區域230之尺寸所設計。 本實施例中，設置於第一基板區域220上之覆蓋膜240 與第二基板區域230相交接之端面241之表面設置為曲 面。這樣，當軟性電路板200於進行空間位置之排佈時， 厚度小、撓折性好之第二基板區域230通常會被反復彎折， 這樣第二基板區域230會將所受到之剪切力作用於與其連 接覆蓋膜240之端面241上，這樣，覆蓋膜240之端面241 與第二基板區域230之間會存於作用力與反作用力。而由 於端面241為曲面，因此，端面241反作用於第二基板區 域230之力會按照不同之角度被分散，這樣，反作用於第 二基板區域230之力不會聚集於一條直線上，相對於先前 技術來說，第二基板區域230不容易發生變形，亦不會發 200906235 生斷裂。 如圖3所示，本技術方案第三實施例提供一種軟性電 路板300 ’其包括電路板基板3 1〇與覆蓋膜32〇。該電路板 基板310包括第一基板區域3U、第二基板區域312以及形 成於第一基板區域311上之金手指區域313。該第一基板區 域311之基板層數大於第二基板區域312之基板層數，即 第基板區域3 11肖第二基板區域3 i 2 t間开）成斷差區 域"亥復盍膜320形成於第一基板區域3丨丨之表面，該覆 蓋膜32G具有一與第二基板區域312相交之第—端面321， 該第一斷面321為曲面；同時，該覆蓋膜32〇具有一與金 手才曰區域313相父之第二端面322，肖第二斷面為曲 :。，第-端面切與第二端面322之表面結構根據其各 相父接之第二基板區域312與金手指區域313之結構設 計。 —本實施例中’該第二基板區域312與第二實施例之身 笛山 之、構、尺寸相同，因此，覆蓋膜320 ^ 弟一端面321盘笸-每—/ b /、 μ粑例之鳊面241之結構、尺寸相同 ^ S區域313與第一實施例之金手指區域130之衾 奋於例寸t同目此’覆蓋膜320之第二端面322與第一 只鈿例之端面141之結構、尺寸相同。 hi述，、_巾，設置於軟性電路板基板上之覆蓋膜座 軟性電路板結構中之掉袼加y,, ^復蛊膘興 戍第-其拉「 部，例如，金手指區域130、33 次弟一基板區域230、312 樣，當撓折部受到外力作 面设置為曲面’這 …卜力作用而擠壓覆蓋膜之端面時，覆蓋 12 200906235 膜之端面反作用於撓折部上之作用力，合松防丁 ㈢牧Μ?、不同之自 被分散，這樣，相對於先前技術中反作用於撓折部用度 用力按直線排佈來說’撓折部不容易於味掛 上之作 ν'王交形，也 發生^|。 谷易 綜上所述’本發明確已符合發明專利之要件，遂依法 提出專利申請。惟’以上所述者僅為本發明之較佳實施方 式二自不能以此限制本案之申請專利範圍。舉凡‘二二安 技藝之人士援依本發明之精神所作之等效修飾或變: 應涵蓋於以下申請專利範圍内。 白 【圖式簡單說明】 圖。圖1係本技術方案第-實施例之軟性電路板結構示意 圖2係本技财㈣二實施例之軟性電路板結構示意 圖3係本技射㈣三實_之軟性電路板結構示意 圖4係先前技狀軟性電路板基板結構示意圖 L主要兀*件符號說明】 軟性電路板 電路板基板 第一線路區域 金手指區域 覆蓋祺 端面 100 ， 200 ， 300 110 ’ 210 ， 310 120 130 140 ， 240 ， 320 141 ， 241 200906235 交線 150， 250 波峰 151 > 251 波谷 152， 252 第一基板區域 220， 311 弟二基板區域 230， 312 第一端面 321 第二端面 322 14Polyimide Films to the Electrical and Electronic Industries in Japan". According to the FPCB used for electrical connection between different circuits, the structure of the FPCB usually includes a gold finger area. The gold finger area is used to realize the electricity between the FPCB and other electronic components. Sexual connection, when the FPCB is connected with other electronic components, the gold finger area usually needs external force to be inserted into the interface of the electronic component. As shown in Fig. 4, the FPCB 10 of the prior art has the first line area 6 200906235 field 11 ' The gold finger region 12 and the frost wax and the wind raft 13 are provided. The end surface 14 of the cover film 丨3 which is in contact with the gold finger 12 is a plane, that is, the gold finger region 12 covers the end surface of the enamel film 13 and intersects six 妗. When the taxi is set to the area η, the force applied by the gold when the crimping or plugging of the gold hand is used is basically divided into the straight line of the 盍 film 13 and the gold finger area 12, That is, since the = line type intersection line is substantially perpendicular to each gold finger of the gold finger region 12: = sample = valley easy to cause the gold finger region 12 to break along the straight line intersection line. Because = soft circuit of reading (four) folding timing _ sex Circuit board life It is greatly shortened. The soft board provides a soft circuit with good mechanical strength when flexing. [Explanation] An optional circuit board is described below by way of example. The flexible k has good mechanical strength. A board circuit comprising: a circuit board substrate and a cover film formed on the right side of the circuit film; the circuit board substrate includes a fold-over portion, the cover film having an end face intersecting the flexure portion, the end face being Curved surface - In the embodiment, the cover film on the flexible circuit board substrate and the flexible circuit \ < the end face of the flexible portion are arranged as a curved surface, so that when the end surface of the cover film is pressed against the reaction, the cover film is In the same way, the force on the phase will be dispersed according to different angles. This arrangement of the force in the front part of the process is easy to deform according to the straight line of the bending part, and is not prone to breakage. 200906235. [Embodiment] The technical circuit board of the present invention will be further described in detail below with reference to the accompanying drawings and the embodiments. The soft circuit board of the soft power generation technology scheme includes a circuit board substrate. And a cover film formed on the circuit board substrate. The circuit board substrate refers to the basic structure of the circuit board which has been fabricated by the structure of the rain hole and the line circuit board, and is ready for the subsequent process such as forming a cover film: two-way board The substrate generally includes at least one flexure portion, which is a portion where the panel is to be spliced or to be pressed by an external force when it is connected to other electronic components or to arrange a board space. The gold finger area (or called the gold finger part) and the gap area = for the gold finger area 'the board is in contact with other electrons: the finger area usually requires an external force to squeeze into the access element 2. & area refers to the intersection of different layers on the board. 'The area with fewer layers has better performance than the area with more layers. Usually, it needs less space when arranging the space position of the board. The area is curved. In the case of a circuit board substrate having a flexing portion, the cover film and the curved surface are used to bend the bending portion or the stress generated by the (four) leaf. It Λ Effective knife placement, for example, disperses the stresses that are usually distributed in the LV plate of the straight-path plate, so that the force acting on the === force is distributed on the curve, thereby weakening the breakage of the line on the board substrate of the board substrate. The following is a detailed description of the structure of the cover film in which a plurality of examples of the H-fold portions are intersected. 200906235 As shown in Fig. 1, the first embodiment of the present technical solution provides a flexible circuit board 100 including a circuit board base 110 and a cover film 14A. The circuit 基板 substrate no includes a first line region 120 and a gold finger region 13Q. The film (10) is formed on the first line region soil or 120, and the cover film 14 is at the end intersecting with the gold finger region from (4), the end surface (4) is a curved surface, that is, the end surface 141 of the cover film ho The gold finger region 13 () intersects 150 as a curve, such as the intersection line 150 is a curve of a wave shape, a zigzag shape, an arc shape or a shape of the other shape. The end φ 141 of the cover film 140 includes a convex surface concave surface which is alternately arranged. The intersection of the convex surface and the gold finger _ 13Q < end face intersects with the peak 151, and the intersection of the concave surface and the gold finger region 13Q "end surface (four) is the undulation 152, and the peak 151 and the trough 152 are alternately arranged to form the intersection line 15". The width of the peak (5) and the valley 152 may be the same or different, and the peak of the peak 1512 and the peak of the 152 is about 2525_〇5 mm. Of course, the actual degree of the intersection of the four (four) 〇 曲 即 即 即 151 151 151 The distance from the valley 152, the distance between the adjacent peaks m, or the distance between the adjacent valleys 152 is set according to the size of the golden finger region 丨30 of the flexible circuit board 1 (10). Four gold fingers can be set in each of the 151 peaks, each: the width of the gold finger is 0.15 millimeters. The distance between adjacent gold fingers is 〇15 millimeters=P廇the width of two peaks 151 and plus-the valleys 152=need to be equal to or larger” 4xGi5+3xQi5, ie equal to or greater than obviously 'the above-mentioned waveguide i5i and trough The size range of 152 can meet the needs of the setting of the gold finger area 本0 in this example. 200906235 In this example, it is set in the first line area and the gold finger area 丨3〇*日一拉+. (Setting 岂朕140 The surface of the end face (4) of the 1 μ 〇 父 parent is set as a curved surface. When the sturdy circuit board 100 is connected to other electronic components, for example, when the product field 13Mf is connected to the socket of the electronic component, the golden hand 浐 = The leakage of the external force causes the stress to be applied to the surface 141, and the surface 141, so that the end surface 141 of the cover film 140 and the gold finger region 13 会 will exist between the Xianli and the anti-xian force. Μ1^ curved surface, so the 'end surface 141 reacts against the force of the gold finger region i or 130: different angles are dispersed, so that the reaction is applied to the gold finger region 130, and the force does not gather on the straight line' relative to the prior art In other words, the golden hand area 130 is not prone to deformation. As shown in FIG. 2, the second embodiment of the present invention provides a flexible circuit board 200 including a circuit board substrate 210 and a cover film 240. The circuit board substrate 210 includes a gap region, and the fault region is A substrate region 22〇 and a second substrate region 23〇 are defined, and the number of substrate layers of the first substrate region 22Q is greater than the number of substrate layers of the second substrate region 23〇. Thus, each degree of the first substrate region 220 is greater than the second substrate. The thickness of the region 230 is such that a height difference, that is, a gap region, is formed between the first substrate region 220 and the second substrate region 23A. Since the first substrate region 220 and the second substrate region 230 have a difference in thickness, that is, the surfaces of the first substrate region 220 and the second substrate region 230 are not at the same height, they are generally disposed on the first substrate region 220 and the second substrate. The cover film of the region 230 is not a complete cover film, and it is necessary to form a cover film on the two regions, respectively. In this embodiment, the cover film 240 is formed on the surface of the first substrate region 22 having a large thickness, and the cover film 240 has an end surface 241 intersecting the second substrate region 230. The end surface 241 is a curved surface, that is, The intersection 250 of the end surface 241 of the cover film 240 intersecting the second substrate region 230 is curved, and the intersection line 250 may be a curve of a wave shape, a zigzag shape, an arc shape or other shapes thereof. The end surface 241 of the cover film 240 includes a convex surface and a concave surface which are alternately arranged. The intersection of the convex surface and the second substrate region 230 is a peak 251. The intersection of the concave surface and the second substrate region 230 is a valley 252. 251 and the troughs 252 are alternately arranged to form an intersection line 250. The peaks 251 and troughs 252 may be the same or different in width, and the peaks 251 and troughs 252 may have a width of about 0.3 to 1 mm. Of course, the actual degree of intersection of the intersection line 250, that is, the distance between the peak 251 and the trough 252, the distance between adjacent peaks 251, or the distance between adjacent troughs 252, according to the flexible circuit board 200 The size of the second substrate region 230 is designed. In this embodiment, the surface of the end surface 241 of the cover film 240 disposed on the first substrate region 220 and the second substrate region 230 is provided as a curved surface. Thus, when the flexible circuit board 200 is arranged in the spatial position, the second substrate region 230 having a small thickness and good flexibility is usually repeatedly bent, so that the second substrate region 230 will receive the shearing force. The action is applied to the end surface 241 of the cover film 240, such that a force and a reaction force are present between the end surface 241 of the cover film 240 and the second substrate region 230. Since the end surface 241 is a curved surface, the force of the end surface 241 reacting to the second substrate region 230 is dispersed at different angles, so that the forces counteracting the second substrate region 230 do not gather in a straight line, relative to the previous Technically, the second substrate region 230 is less prone to deformation and does not break the 200906235. As shown in FIG. 3, the third embodiment of the present technical solution provides a flexible circuit board 300' which includes a circuit board substrate 31 and a cover film 32A. The circuit board substrate 310 includes a first substrate region 3U, a second substrate region 312, and a gold finger region 313 formed on the first substrate region 311. The number of substrate layers of the first substrate region 311 is greater than the number of substrate layers of the second substrate region 312, that is, the substrate region 3 11 and the second substrate region 3 i 2 t are separated into a gap region " Formed on the surface of the first substrate region 3, the cover film 32G has a first end surface 321 intersecting with the second substrate region 312, the first surface 321 is a curved surface; meanwhile, the cover film 32 has a The second end face 322 of the parent of the 313 phase of the golden hand is the song, and the second section of the second is the curved:. The surface structure of the first end face and the second end face 322 is designed according to the structure of the second substrate region 312 and the gold finger region 313 which are adjacent to each other. - In the present embodiment, the second substrate region 312 is the same as the structure and size of the body of the second embodiment. Therefore, the cover film 320 ^ 端 321 笸 每 - per / / b /, μ example The structure and size of the second surface 241 are the same. The S area 313 and the gold finger area 130 of the first embodiment are similar to the second end surface 322 of the cover film 320 and the end surface of the first example. 141 has the same structure and dimensions. Hi,, _ towel, the cover of the flexible circuit board structure provided on the flexible circuit board substrate, y, y, ^ 蛊膘 戍 戍 其 其 其 其 其 , , , , 33 The next-generation substrate area 230, 312, when the flexure is pressed by the external force surface to form the end surface of the cover film by the surface force, the cover 12 200906235 film end surface acts on the flexure The force, the combination of the pine and the anti-small (three) animal husbandry?, the different self-distributed, so that compared with the prior art, the reaction to the flexing portion is forced to be arranged in a straight line, so that the flexing portion is not easy to hang on. As a ν '王交形, also occurs ^|. 谷易 综合上的 'The invention has indeed met the requirements of the invention patent, 提出 filed a patent application. Only the above is only the preferred embodiment of the present invention. It is not possible to limit the scope of the patent application in this case. The equivalent modifications or changes made by the person of the '2nd Artifact' in accordance with the spirit of the present invention shall be included in the scope of the following patent application. White [Simple Description] Figure. Figure 1 is the first technical solution of this technical solution. Schematic diagram of the flexible circuit board structure of the embodiment 2 is a schematic diagram of the structure of the flexible circuit board of the second embodiment of the present invention. (4) The structure of the flexible circuit board of the present technology (four) three real _ the structure diagram of the flexible circuit board 4 Main 兀 * symbol description] Soft circuit board circuit board substrate first line area gold finger area cover 祺 end face 100, 200, 300 110 ' 210 , 310 120 130 140 , 240 , 320 141 , 241 200906235 intersection line 150 , 250 wave crest 151 > 251 troughs 152, 252 first substrate area 220, 311 second substrate area 230, 312 first end surface 321 second end surface 322 14