200901507 九、發明說明： 【發明所屬之技術領域】 本發明係關於包含至少一發光二極體、至少一導熱基板 及一配置以接收藉由該至少一發光二極體發射之光的光導 板之一發光裝置’並係關於包含至少一此類發光裝置之一 發光體。 【先前技術】 包含發光二極體（LED)之半導體發光裝置屬於目前可用 的最有效率且強固的光源。 由於其較小尺寸、電位能節省及較長壽命所致，LED在 迅速發展成一般照明應用之一可行光源。 為產生一般環境照明，可將LED與額外光學裝置組合， 例如能夠將由該LED發射之光轉換與混合成數個光束分佈 之光導，從而照亮一内部空間，例如辦公室。可將一光 導配置於一或複數個LED上。 然而，在操作中，高功率lED在熱與光強度兩方面產生 能量。為較佳地操作該LED，必須以一有效率方式將熱導 離。若不有效率地冷卻該LED，則該LED之亮度、效率及 流明輸出減小。 在傳統發光裝置中，該等LED係安裝於一基板上，其將 耗散之熱散佈於一較大區域上以便克服熱耗散問題。 可將包含配置於一基板上之一或複數個LED的此類發光 裝置與用於一般照明應用之一光導連接。光係在該光導中 刀佈以獲得該光導之整個表面上之一合需要的同質照度。 128324.doc 200901507BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light guide plate including at least one light emitting diode, at least one heat conductive substrate, and a light guide plate configured to receive light emitted by the at least one light emitting diode. A illuminating device 'and relates to an illuminant comprising at least one such illuminating device. [Prior Art] A semiconductor light-emitting device including a light-emitting diode (LED) belongs to the most efficient and strong light source currently available. Due to its small size, potential energy savings and long life, LEDs are rapidly becoming a viable source for general lighting applications. To create a general ambient illumination, the LED can be combined with additional optics, such as a light guide that can convert and mix the light emitted by the LED into a plurality of beam profiles to illuminate an interior space, such as an office. A light guide can be placed on one or more of the LEDs. However, in operation, high power lED produces energy in both heat and light intensity. To operate the LED better, heat must be conducted in an efficient manner. If the LED is not cooled efficiently, the brightness, efficiency, and lumen output of the LED are reduced. In conventional lighting devices, the LEDs are mounted on a substrate that spreads the dissipated heat over a large area to overcome heat dissipation problems. Such a light-emitting device comprising one or a plurality of LEDs disposed on a substrate can be coupled to a light guide for use in general illumination applications. A light system is placed in the light guide to obtain a desired uniform illumination of one of the entire surface of the light guide. 128324.doc 200901507
Epstein等人的 US 2005/〇265〇29 A1說明一包含一 led陣 列與一光學片之LED陣列系統，其係調適以將藉由該等 led發射之光散佈於該光學片之本質上整個表面上。 然而，該等散熱器藉由對流與熱輻射至環境的冷卻在某 種程度上係不確定的’因為其上配置該等散熱器之表面 (例如天花板或牆壁）可能係熱絕緣的。為使該裝置更強固 並且-般適用而與天花板品質無_，有利的係該散熱器的 冷卻還透過該光導，因為光導與周圍大氣接觸。 然而，在US 20〇5/〇265029 A1中，通常一中間層係配置 於該LED陣列與該光學片之間。此中間層可能妨礙從該 LED陣列至該光學片的熱傳導。 若與導熱基板直接接觸地配置該光導，則導熱係可能 的。然而，因為該光導之後表面上的全内反射之可能性係 移除，故該系統之光學效率將係減低。 該光導與該導熱基板之間的較強機械焊接不可避免地導 致光之吸收及/或光束品質之干擾。 因而，此項技術中需要克服此矛盾並需要提供一發光裝 置，其中藉由該等LED耗散之熱係從該等LED有效率地導 離，且其中在該光導中一較高光利用效率係可能的。 【發明内容】 本發明之一目的係至少部分克服此等問題並提供包含至 ^發光一極體、一導熱基板及光導板之一發光裝置，其 中該光導板允許在其表面中的全内反射同時該裝置展現從 該導熱基板至該光導板之較佳熱轉移。 128324.doc 200901507 因而，、在-第—態樣中，本發明提供—發光裝置，其包 發光—極體，至少__導熱基板，其用以將熱從 該至卜發光二極料離；以及—料，其係配置以接收 藉由該至乂-發光二極體發射之光的至少部分。 該光導具有面向該至少—導熱基板之—側，該側包含至 夕區域邻分’其一主要區域百分比係藉由具有一從大約 2至大約200 _之寬度之—間隙從該基板分開。US 2005/〇265〇29 A1 to Epstein et al. describes an LED array system comprising a LED array and an optical sheet adapted to spread light emitted by the LEDs over the entire surface of the optical sheet. on. However, the cooling of the heat sinks by convection and heat radiation to the environment is somewhat uncertain as the surface on which the heat sinks are disposed (e.g., ceiling or wall) may be thermally insulated. In order to make the device stronger and generally applicable without the ceiling quality, it is advantageous that the cooling of the heat sink also passes through the light guide because the light guide is in contact with the surrounding atmosphere. However, in US 20 〇 5/〇 265 029 A1, an intermediate layer is typically disposed between the LED array and the optical sheet. This intermediate layer may interfere with heat transfer from the LED array to the optical sheet. If the light guide is disposed in direct contact with the heat conductive substrate, heat conduction is possible. However, because the possibility of total internal reflection on the surface behind the light guide is removed, the optical efficiency of the system will be reduced. The strong mechanical welding between the light guide and the thermally conductive substrate inevitably results in interference of light absorption and/or beam quality. Accordingly, there is a need in the art to overcome this contradiction and to provide an illumination device in which the heat dissipated by the LEDs is efficiently conducted away from the LEDs, and wherein a higher light utilization efficiency is employed in the light guide. possible. SUMMARY OF THE INVENTION It is an object of the present invention to at least partially overcome such problems and to provide a light-emitting device comprising a light-emitting body, a thermally conductive substrate and a light guide plate, wherein the light guide plate allows total internal reflection in its surface At the same time the device exhibits a preferred thermal transfer from the thermally conductive substrate to the light guide. 128324.doc 200901507 Thus, in the first aspect, the present invention provides a light-emitting device comprising a light-emitting body, at least a heat-conducting substrate for separating heat from the light-emitting diode; And a material configured to receive at least a portion of the light emitted by the light-emitting diode. The light guide has a side facing the at least one thermally conductive substrate, the side comprising an adjacent portion of the region, wherein a percentage of a major region is separated from the substrate by a gap having a width of from about 2 to about 200 Å.
在本發明之—發光裝置中’藉由該等lEd發射之光進入 该光導中並在其中傳播。在操作期間，該等發光二極體耗 散熱’而此熱係在-較大程度上藉由該導熱基板從該哪 導離。 為以其長時間有效率執行之溫度來操作LED，較佳的係 熱能係從該裝置導離。一選項係將該光導用作一散熱片， 其係藉由周®大氣冷卻下來。該料通常具有朝向大氣的 相對較大表面區域，並因而適合於作為一用於將熱從該裝 置導離的構件。 為從該導熱基板將熱傳導至該光導，其間需要較佳的熱 傳導性質。 同時，並為獲得較佳光傳播，較佳的係全内反射可發生 於該光導之表面中，包括後表面。 藉由配置該光導之該側之至少一部分以使得該至少一部 分之一主要區域百分比係在與該導熱基板之一特定與明確 定義的距離處定位，獲得從該導熱基板至該光導的較佳熱 轉移’同時致能該（等）部分中的全内反射（TIR)。 128324.doc 200901507 該光導與該基板之間的距離必須實質上高於光之波長以 允許全内反射’並通常係大約2 μηι或更多。若該距離較 小’則全内反射不會發生’從而由於光之吸收所致而導致 該光導中之一明顯削弱的光傳播。同時，該距離應較小以 保持從該光導至該導熱基板之一較佳熱轉移，並通常應不 超過大約200 μηι。 在本發明之具體實施例中’藉由該間隙從該導熱基板分 離的該至少一區域部分本質上平行於該導熱基板。因此， 该光導板之該侧之一空間延伸區域部分係配置於與該導熱 基板之規定距離處’從而允許從該基板之有效率熱轉移同 時還允許該至少一區域部分中的全内反射。 在本發明之具體實施例中，該至少一區域部分之至少 90%的區域（例如多於95，諸如多於99%的區域）係藉由該 間隙從該基板分離。 為將儘可能多的後表面用於全内反射與同時較佳的熱轉 移，平行於該基板的區域部分之一較高區域百分比應係定 位於上面定義的與該基板之距離處。 為增加從該光導板至該導熱基板的熱轉移，該間隙之寬 度應儘可能小’同時相對容易獲得’例如從5至25 μιη。 在本發明之具體實施例中，平行於該導熱基板之區域部 分可構成該後側之一主要區域百分比。 忒間隙通常包含一氣體以致能熱透過該間隙從該導熱基 ^ ^該光導板之傳導。該系統通常係環境大氣（例如空氣） 或可以係特別針對情況選擇的另一氣體或氣體混合物。 128324.doc 200901507 為將儘可能多的後表面用於全内反射與同時較佳的熱轉 移’滿足上面關於氣體間隙之寬度的要求的光導之後側之 區域部分應較大，例如構成該後侧之一主要部分，例如至 少50%的區域、多於75%的區域或多於9〇%的區域。 在本發明之具體實施例中，至少一間隔物元件係配置於 該基板與該等區域部分之間。 為使該光導與該基板之間的空氣間隙之寬度穩定，有利 的係可在其間配置間隔物元件。該間隔物元件之表面較小 並係包括於上面不滿足上面關於該間隙寬度之要求的區域 百分比中。 在本發明之具體實施例中，該導熱基板之導熱率較佳的 係高於該光導之導熱率。 在本發明之具體實施例中，該導熱基板可包括一多孔表 面，其係針對該光導板之該等區域部分配置。當該光導板 係針對一多孔基板表面配置時上述該後侧之區域部分在 複數個接觸位置處與該基板接觸.然而，每一此類接觸位 置表示一很小區域，以使得該等區域部分之主要區域百分 比係藉由上面規定的寬度之一空氣間隙離開基板材料。一 多孔導熱基板之使用較為有利，因為可藉由僅將該光導板 針對該多⑶基板纟面放置來形成豸光導板與該基板之間的 規定距離，其利於此類裝置之生產。 。由於尚孔隙率與高導熱率之所需組合所致，金屬發泡材 料與金屬毛絨係用於該導熱材料中的較佳多孔材料。 【實施方式】 128324.doc • 11 - 200901507 本發明係關於包含至少— 及一配置以接收藉由該至少 板之一發光裝置。 發光二極體、至少一導熱基板 發光二極體發射之光的光導In the light-emitting device of the present invention, light emitted by the lEd enters and propagates in the light guide. During operation, the light-emitting diodes dissipate heat and the heat is largely removed therefrom by the thermally conductive substrate. In order to operate the LED at a temperature that is efficiently performed for a long period of time, the preferred thermal energy is directed away from the device. One option is to use the light guide as a heat sink that is cooled by the Week® atmosphere. The material typically has a relatively large surface area towards the atmosphere and is thus suitable as a means for directing heat away from the apparatus. In order to conduct heat from the thermally conductive substrate to the light guide, better thermal conductivity properties are required therebetween. At the same time, and to achieve better light propagation, preferred total internal reflection can occur in the surface of the light guide, including the back surface. A preferred heat from the thermally conductive substrate to the light guide is obtained by arranging at least a portion of the side of the light guide such that a percentage of the at least one portion of the primary region is positioned at a specific and well-defined distance from one of the thermally conductive substrates Transfer 'Also enables total internal reflection (TIR) in this (etc.) part. 128324.doc 200901507 The distance between the light guide and the substrate must be substantially higher than the wavelength of light to allow total internal reflection 'and is typically about 2 μηι or more. If the distance is small, then total internal reflection does not occur' resulting in a significant weakening of light propagation in one of the light guides due to absorption of light. At the same time, the distance should be small to maintain a preferred thermal transfer from the light guide to one of the thermally conductive substrates, and typically should not exceed about 200 μη. In a particular embodiment of the invention, the at least one region portion separated from the thermally conductive substrate by the gap is substantially parallel to the thermally conductive substrate. Thus, a portion of the spatially extending region of the side of the light guide plate is disposed at a predetermined distance from the thermally conductive substrate to permit efficient heat transfer from the substrate while also permitting total internal reflection in the at least one region portion. In a particular embodiment of the invention, at least 90% of the at least one portion of the region (e.g., more than 95, such as more than 99% of the region) is separated from the substrate by the gap. In order to use as much of the back surface as possible for total internal reflection and at the same time better thermal transfer, the higher area percentage of one of the area portions parallel to the substrate should be at a distance defined above from the substrate. In order to increase the heat transfer from the light guiding plate to the thermally conductive substrate, the width of the gap should be as small as possible 'at the same time relatively easy to obtain', for example from 5 to 25 μm. In a particular embodiment of the invention, the portion of the region parallel to the thermally conductive substrate may constitute a percentage of the primary region of the back side. The helium gap typically includes a gas such that heat can be conducted through the gap from the thermally conductive substrate. The system is typically an ambient atmosphere (e.g., air) or may be another gas or gas mixture selected specifically for the situation. 128324.doc 200901507 In order to use as many rear surfaces as possible for total internal reflection and at the same time better heat transfer 'the portion of the rear side of the light guide that satisfies the above requirements for the width of the gas gap should be large, for example to constitute the back side One of the main parts, such as at least 50% of the area, more than 75% of the area, or more than 9% of the area. In a particular embodiment of the invention, at least one spacer element is disposed between the substrate and the area portions. In order to stabilize the width of the air gap between the light guide and the substrate, it is advantageous to arrange the spacer elements therebetween. The surface of the spacer element is small and included in the percentage of the area above which does not satisfy the above requirements for the width of the gap. In a specific embodiment of the invention, the thermal conductivity of the thermally conductive substrate is preferably higher than the thermal conductivity of the optical waveguide. In a particular embodiment of the invention, the thermally conductive substrate can include a porous surface that is disposed for portions of the regions of the light guide. When the light guiding plate is disposed on a surface of a porous substrate, the portion of the rear side portion is in contact with the substrate at a plurality of contact positions. However, each such contact position represents a small area such that the areas The percentage of the main area of the portion is separated from the substrate material by an air gap of one of the widths specified above. The use of a porous thermally conductive substrate is advantageous because the prescribed distance between the calendering guide and the substrate can be formed by merely placing the optical guiding sheet against the surface of the plurality of substrates, which facilitates the production of such devices. . Metal foam materials and metal wool are used as preferred porous materials in the thermally conductive material due to the desired combination of porosity and high thermal conductivity. [Embodiment] 128324.doc • 11 - 200901507 The present invention relates to at least one and one configuration for receiving a light-emitting device by means of the at least one of the plates. Light-emitting diode, at least one heat-conducting substrate, light guide of light emitted by the light-emitting diode
圖1解說依據本發明的一發光裝置之一具體實施例。 依據此具體實施例之發光裝置α含複數個相互隔開的BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 illustrates one embodiment of a lighting device in accordance with the present invention. The illuminating device α according to this embodiment has a plurality of spaced apart
LED 2 ’其將光發射入—'Ll ηα / I 六將兀^财入先學透明/半透明的光導板4中。 該光導板4具有-後側5與一相對的前側6,透過其接收於 該光導板4中之光係從該板耦出。 在該光導板4之後側5上定位複數個導熱基板3，其係配 置以將熱從該等發光二極體2導離。 該光導板4之後側5包含區域部分7 ’其本質上平行於該 基板3。 / 該後側5之區域部分7係藉由一空氣間隙8從該基板3分 離。 通常，該發光裝置1係配置於一表面（例如一天花板或牆 壁10)上或配置於與該表面之某一距離處。 如本文所使用，術語”光導"表示一元件，其透過一光接 收表面接收光且其中該光朝向一光輸出表面傳播而無顯著 透射損失。一般而言，光導在全内反射之原理上運作，從 而透過該光導行進之光係基於該光導之材料與直接圍繞其 之材料（例如空氣、覆層等）的折射率之差異而於該光導之 表面受到反射。 該光導之材料係至少部分透射性的（例如半透明或甚至 透明）’至少對於藉由該發光裝置之發光二極體發射之 128324.doc 12 200901507 光。 適當光導材料之範例包括但不限於玻璃'透明陶瓷及透 明聚合物’例如聚（曱基丙烯酸甲酯）(PMMA)或聚碳酸 酯。當該光導係由一聚合材料製成時，其較佳的係藉由射 出成型來形成。 該光導材料應較佳地具有實質上高於直接圍繞其之材料 (通常係空氣）之一折射率。因此，一高於大約1，4之折射率 一般較為適合。 該光導4通常係具有前側與後側之板的一般形狀，其中 預期光應透過該前侧離開該發光裝置。例如，可將光透過 該光導板之後側或透過該光導板之橫向表面來耦入該光導 板中。 該光導之形狀可改變，並且許多形狀係可能的並為熟習 此項技術者所知。該光導通常包含某種光擷取結構以使得 在該光導中傳播之光最終可從該光導耗出，較佳的係於其 前側。 例如，該光導之後侧可具有一重複性的鋸齒形狀，而前 側本質上係平坦的。在該光導内傳播之光係在前側與後側 上交替反射。由於該後側之鋸齒形狀，該前側上之入射角 度將針對每—反射而改變，並將最終達到全内反射之臨界 角之下，使得光將係從該光導耦出。 在另-範财，該光導包含㈣Μ槽，錢以對前表 面之一特定角度形成。 此項技術中已知此類光擷取結構之若干範例。然而，該 128324.doc • 13- 200901507 光導中之光擷取結構之精確實現對於本發明並非必需的， 並且可將本質上所有熟習此項技術者已知的光導設計用於 本發明之一發光裝置。 如本文中所使用的術語”發光二極體”（本文中亦縮寫為 LED)表示所有類型的發光二極體，包括但不限於以無機為 主之LED、以有機為主之Led(OLED)及以聚合為主之 LED(polyLED)。 通常’該等LED係調適以在可見或近可見波長範圍内發 射光，從UV(ultraviolet;紫外）至lR(infrared;紅外）光。 數個方法可月b用於將光輕入該光導板，如此項技術中已 知。例如’該發光二極體可僅係置於該光導板之一光接收 表面處，並係允許朝向此光接收表面發射光。該光接收表 面（例如）可以係該光導之後側或其部分，可以係連接該後 侧與該前側之一橫向邊緣侧，或可以係該光導中之一凹陷 的側壁，例如一透過該基板之開口中。 該等發光二極體可以係配置於與該光導之一距離處或可 以係至少部分地位於該光導内，例如模製於該光導中。 根據該光導設計，適於使用頂發射或側發射發光二極 體。 然而，將光從該等發光二極體耦入該光導板中之精確設 計對於本發明並非必需，並且可將本質上所有熟習此項技 術者已知的光導设计用於本發明之一發光裝置。 該等發光二極體係連接至一驅動電路（未顯示），其用於 向該等LED提供驅動電力。 128324.doc •14- 200901507 在操作期間，該等led耗散熱。大量熱係藉由與該等The LED 2 ' emits light into the 'Ll ηα / I six 兀 兀 ^ into the transparent / translucent light guide 4 . The light guide plate 4 has a rear side 5 and an opposite front side 6, from which light rays received in the light guide plate 4 are coupled out. A plurality of thermally conductive substrates 3 are positioned on the rear side 5 of the light guiding plate 4 and are configured to conduct heat away from the light emitting diodes 2. The rear side 5 of the light guiding plate 4 comprises a region portion 7' which is substantially parallel to the substrate 3. The area portion 7 of the rear side 5 is separated from the substrate 3 by an air gap 8. Typically, the illumination device 1 is disposed on a surface (e.g., a ceiling or wall 10) or at a distance from the surface. As used herein, the term "lightguide" means an element that receives light through a light receiving surface and wherein the light propagates toward a light output surface without significant transmission loss. In general, the principle of total internal reflection of the light guide The light that travels through the light guide is reflected at the surface of the light guide based on the difference in refractive index between the material of the light guide and the material directly surrounding it (eg, air, cladding, etc.) The material of the light guide is at least partially Transmissive (eg translucent or even transparent) 'at least for 128324.doc 12 200901507 light emitted by the light-emitting diode of the illumination device. Examples of suitable light-guiding materials include, but are not limited to, glass 'transparent ceramics and transparent polymers 'For example, poly(methyl methacrylate) (PMMA) or polycarbonate. When the light guide is made of a polymeric material, it is preferably formed by injection molding. The light guiding material should preferably have It is substantially higher than the refractive index of one of the materials directly surrounding it (usually air). Therefore, a refractive index above about 1,4 is generally suitable. The light guide 4 is generally of a general shape having a front side and a rear side plate through which light is expected to exit the light emitting device. For example, light can be coupled through the rear side of the light guide plate or through the lateral surface of the light guide plate. The shape of the light guide can vary, and many shapes are possible and known to those skilled in the art. The light guide typically includes a light extraction structure such that light propagating in the light guide can ultimately The light guide is consuming, preferably on the front side thereof. For example, the rear side of the light guide may have a repeating sawtooth shape, and the front side is substantially flat. Light propagating in the light guide is on the front side and the back side. Alternate reflection. Due to the zigzag shape of the back side, the angle of incidence on the front side will change for each reflection and will eventually reach below the critical angle of total internal reflection so that light will be coupled out of the light guide. - Fan Cai, the light guide comprises (iv) a groove, the money is formed at a specific angle to one of the front surfaces. Several examples of such light extraction structures are known in the art. However, the 128324.doc • 13-200 The precise implementation of the light extraction structure in the 901507 light guide is not essential to the invention, and all light guides known to those skilled in the art can be designed for use in one of the illumination devices of the present invention. Terms as used herein. "Light-emitting diodes" (also abbreviated as LEDs herein) denotes all types of light-emitting diodes, including but not limited to inorganic-based LEDs, organic-based LEDs (OLEDs), and polymer-based LEDs. (polyLED). Typically these LEDs are adapted to emit light in the visible or near visible wavelength range, from UV (ultraviolet) to lR (infrared). Several methods can be used to light light. The light guide plate is known in the art. For example, the light-emitting diode can be placed only at one light receiving surface of the light guide plate and allows light to be emitted toward the light receiving surface. The light receiving surface may be, for example, a rear side of the light guide or a portion thereof, and may be connected to the rear side and one of the front side lateral edge sides, or may be a recessed side wall of the light guide, for example, through the substrate In the opening. The light emitting diodes may be disposed at a distance from one of the light guides or may be at least partially located within the light guide, such as molded into the light guide. Depending on the light guide design, it is suitable to use a top emitting or side emitting light emitting diode. However, the precise design of coupling light from the light-emitting diodes into the light guide plate is not essential to the present invention, and all light guides known to those skilled in the art can be designed for use in one of the light-emitting devices of the present invention. . The light emitting diode systems are coupled to a drive circuit (not shown) for providing drive power to the LEDs. 128324.doc •14- 200901507 These LEDs dissipate heat during operation. a large amount of heat by virtue of
…、接觸配置的導熱基板（散熱器）3吸收。通常，該LED 之邛分係直接或經由焊料凸塊或類似者與該基板實體接 觸。 於過向溫度，該等LED係損壞並發射更少的光。因此， . 需要將熱從該等LED導離。 藉由配置該光導4以使得在其與導熱基板3之間獲得一較 佳導熱率，該光導4可用作一用於在藉由周圍大氣冷卻下 來時將熱從該裝置導離的構件。 該導熱基板通常包含一具有一高導熱率之材料，例如但 不限於金屬材料（例如銅、鋁、鋼等及其合金）及其他材料 (例如具有一高導熱率之塑膠或陶瓷材料）。 通常，邊政熱器材料之傳導率應顯著高於該光導材料 (及空氣）之傳導率。透明聚合物通常具有大約〇·2 w/mK2 導熱率與大約1 W/mK的玻璃。因而，該散熱器材料之導 〔 熱率通常應高於大約2，例如從大約2至大約2500 W/mK， 其適用於幾乎所有金屬與許多陶資^。 該導熱基板可以係一分離元件或可以係配置於另一載體 材料上之一導熱材料層。 如上所述，較佳的係該光導允許其前側與後側兩者上的 全内反射。因此，該後側5不應與該導熱基板3接觸。另一 方面，該後侧5應接近於該導熱基板以允許較佳的熱傳 導。 因此，該光導4之後側5應包含本質上平行於下部導熱基 128324.doc -15- 200901507 板的區域部分7，且其中該等區域部分7之至少一主要區域 百分比係藉由空氣間隙從該導熱基板分離。在形成此間隙 之處，允許該光導4中之全内反射同時獲得對該導熱基板3 之較佳熱傳導。較佳的係此區域百分比（其中該間隙係形 成）儘可能高。因此，該光導之平行部分的較佳的係至少 50(例如至少90，例如至少95或至少99)%的區域應形成朝 向該導熱基板的規定空氣間隙。 為在組合的全内反射與熱傳導方面的最大效率，本質上 平行於該導熱基板的區域部分7應表示該光導之後側5之一 主要區域百分比。 通常，本質上平行於該等導熱基板3的區域部分7表示該 光導之後侧的至少大約50(例如至少75 ,例如至少9〇)%的 區域。該等區域部分7通常係分佈於該光導4之後側5上。 例如，此類區域部分7位於兩個相鄰隔開的發光二極體2、 2之間以使付至該光導之熱傳導係分佈於該後側$之區域 上。 為允許該光導之後側上的全内反射，該區域部分7與該 傳導基板3之間的空氣間隙應實質上超過藉由該等發光二 極體2發射之光的波長。因此，該空氣間隙的寬度應超過 大約2 μιη。當考慮製造容限及類似者時為確保該間隙的存 在’ δ亥寬度應較佳地超過大約$ 。 然而，為儘可能高地保持從該導熱基板之該光導的熱傳 導，該空氣間隙的寬度應不過高，並應通常不超過大約 200 μηι。由於寬度越低熱傳導越好，因而該寬度可低於大 128324.doc -16 - 200901507 約200 μηι ’例如低於大約10〇 μηι，例如低於大約25 μπι。 熟習此項技術者應意識到上面使用的術語，，空氣間隙”不 使應用限於該間隙係使用空氣填充的事實。如將明白，該 光導與該基板之間的間隙係一開放間隙，其係以實際大氣 - 之氣體（例如空氣，或係其他氣體/氣體混合物，例如氮 氣、氦氣等）或以具有所需性質的任何其他氣體或其他混 合物來填充。特定言之，該氣體應能夠從該導熱基板至該 光導傳導熱。例如，氮氣或氦氣之傳導率處於比空氣之傳 ι 導率高五倍之等級。 該導熱基板3的形狀係調適成該光導4之後側5的形狀（或 反之亦然）以使得上面關於該空氣間隙定義之特徵係滿 足。 §亥後側5的形狀可以係（例如）平坦、凹形、凸形的，或 可具有一不規則或規則的重複性結構，例如一鋸齒結構。 該導熱基板可本質上覆蓋該光導的全部後側5或可替代 Q 性地覆蓋該傳導基板之部分。特定言之，該導熱基板可包 含開口 ’例如以使得可透過該些開口導引至該等led之傳 導線。 可將間隔物元件9配置於該導熱基板3與該光導4之間以 便使該裝配件穩定並保持該規定的空氣間隙。 該等間隔物元件9之區域佔用面積應相對於該等區域部 分7較小’以使其本質上不干擾全内反射。一般而言，該 等間隔物元件9之佔用面積係包括於該等區域部分7之次要 區域百分比中，其不保持於與該導熱基板之規定距離内。 128324.doc -17- 200901507 可將該等間隔物元件9形成為從該光導4及/或從該導熱 基板3之突出部分’或可以係分離元件，例如分離小元 件，例如球或導線。 可藉由固持構件（例如一彈簧（未顯示）)將該光導4與該 I板3固持在—起，例如其中該等間隔物元件9保持該光導 • 4與該等基板3之間的空氣間隙8。 圖2解說依據本發明之一發光裝置之另一具體實施例。 【 在此具體實施例中，該至少-導熱基板23係多孔的或至 >具有一面向該光導4之後側5的多孔表面，並且該傳導基 板23係配置以使得該光導4之後側5之區域部分7與該傳導 基板23直接接觸。 由於該傳導基板23之孔隙率所致，該等區域部分7之一 主要區域百分比形成至該基板23之一空氣間隙8 ,該空氣 間隙具有一在2與200 μηι之間的寬度。藉由選擇具有適當 孔隙率之基板材料，該等區域部分27之至少5〇(例如至少 〇 90，例如至少95)%的區域將形成一具有至該導熱基板之規 疋寬度（即2至200 μηι，例如5至2 5 μιη)的空氣間隙8。 多孔基板材料之非限制性範例包括金屬發泡材料，例如 銘發泡材料或金屬毛絨。金屬發泡材料係由一固態金屬 (多為鋁）組成之一蜂巢式結構，其包含一較大體積分率的 充氣孔。該等孔可以係密封的（閉孔泡洙），或其可形成_ 互連網路（開孔泡沫）。金屬發泡材料的定義特性係一復高 孔隙率：通常，體積之80%以上由空隙空間組成。 圖3之曲線圖說明與以米為單位的空氣間隙之寬度成函 128324.doc -18- 200901507 數關係的以W/m2K為單位的空氣間隙之導熱性（熱轉移係 數）’其係針對50C之溫度計算’其可表示本發明之一發 光二極體之空氣間隙中的典型溫度，因為此溫度高於正常 環境溫度但低於針對聚（甲基丙烯酸甲酯）(較佳光導材料之 一者）之大約70°C的最大使用溫度。 如可看出，該傳導率隨增加的空氣間隙寬度而明顯減 小。比較而&，一典型LED(Lumileds 的"Luxeon LED”）具 有一 100 W/m2K的傳導性’其在此對應一具有一 2〇〇 之 寬度的空氣間隙。 因此，當該光導與該導熱基板之間的空氣間隙低於2〇〇 μιη時，此空氣間隙中的傳導性超過透過該led之傳導性 (例如當該LED形成從該光導至該基板之一接觸時）。 熟知此項技術者會意識到本發明絕非限於上述較佳具體 實施例。相反，可在隨附申請專利範圍之範疇内進行許多 修改及變更。例如，基於本發明之―發光裝置的發光體可 包含一或多個（即複數個）本發明之發光裝置集，即包含複 數=分離的光導。例如’該等分離光導可以係平鋪以集中 覆盖比-單—光導之區域更大的區域。將該裝置分成複數 —步證明係有用的，例 由於金屬與聚合物之間的膨脹、 置之變形。 ’例如以便保持平坦並防止 、腫脹及收縮差異所致的裝 可將本應用之發光裝置用作針對..., the heat-conducting substrate (heat sink) 3 in contact with the absorption is absorbed. Typically, the LEDs are in direct contact with the substrate body either directly or via solder bumps or the like. At the over temperature, the LEDs are damaged and emit less light. Therefore, it is necessary to conduct heat away from the LEDs. By arranging the light guide 4 such that a better thermal conductivity is obtained between it and the thermally conductive substrate 3, the light guide 4 can be used as a means for directing heat away from the device when cooled by ambient air. The thermally conductive substrate typically comprises a material having a high thermal conductivity such as, but not limited to, metallic materials (e.g., copper, aluminum, steel, etc. and alloys thereof) and other materials (e.g., plastic or ceramic materials having a high thermal conductivity). Generally, the conductivity of the edge heat exchanger material should be significantly higher than the conductivity of the light guide material (and air). Transparent polymers typically have a thermal conductivity of about 〇·2 w/mK 2 and a glass of about 1 W/mK. Thus, the heat transfer rate of the heat sink material should generally be above about 2, such as from about 2 to about 2500 W/mK, which is suitable for almost all metals and many ceramics. The thermally conductive substrate can be a separate component or can be disposed on one of the other carrier materials. As mentioned above, it is preferred that the light guide allows for total internal reflection on both the front side and the back side. Therefore, the rear side 5 should not be in contact with the thermally conductive substrate 3. On the other hand, the back side 5 should be close to the thermally conductive substrate to allow for better thermal conduction. Therefore, the rear side 5 of the light guide 4 should comprise a region portion 7 substantially parallel to the lower thermal conductivity 128324.doc -15-200901507 plate, and wherein at least one major region percentage of the region portions 7 is from the air gap The thermally conductive substrate is separated. Where this gap is formed, total internal reflection in the light guide 4 is allowed to simultaneously achieve better heat transfer to the thermally conductive substrate 3. Preferably, the percentage of this area (where the gap is formed) is as high as possible. Accordingly, a preferred portion of the parallel portion of the light guide of at least 50 (e.g., at least 90, such as at least 95 or at least 99)% should define a defined air gap toward the thermally conductive substrate. For maximum efficiency in combined total internal reflection and heat transfer, the portion 7 that is substantially parallel to the thermally conductive substrate should represent the percentage of the primary region of the rear side 5 of the light guide. Typically, the portion 7 of the material substantially parallel to the thermally conductive substrates 3 represents at least about 50 (e.g., at least 75, e.g., at least 9 〇) percent of the rear side of the light guide. The area portions 7 are typically distributed on the rear side 5 of the light guide 4. For example, such a portion 7 is located between two adjacent spaced apart light emitting diodes 2, 2 such that the thermal conduction to the light guide is distributed over the area of the back side $. In order to allow total internal reflection on the rear side of the light guide, the air gap between the region portion 7 and the conductive substrate 3 should substantially exceed the wavelength of light emitted by the light-emitting diodes 2. Therefore, the width of the air gap should exceed approximately 2 μηη. To ensure the presence of the gap, the width of the gap should preferably exceed about $ when considering manufacturing tolerances and the like. However, in order to maintain the thermal conduction of the light guide from the thermally conductive substrate as high as possible, the width of the air gap should not be too high and should generally not exceed about 200 μm. Since the lower the width, the better the heat conduction, the width may be lower than about 128324.doc -16 - 200901507 by about 200 μηι ', such as less than about 10 μm, such as less than about 25 μm. Those skilled in the art will recognize that the terminology used above, the air gap" does not limit the application to the fact that the gap is filled with air. As will be appreciated, the gap between the light guide and the substrate is an open gap. It is filled with a gas of the actual atmosphere (for example, air, or other gas/gas mixture such as nitrogen, helium, etc.) or with any other gas or other mixture having the desired properties. In particular, the gas should be able to The thermally conductive substrate conducts heat to the light guide. For example, the conductivity of nitrogen or helium is at a level five times higher than the transmission rate of air. The shape of the thermally conductive substrate 3 is adapted to the shape of the rear side 5 of the light guide 4 ( Or vice versa) such that the features defined above with respect to the air gap are satisfied. § The shape of the rear side 5 may be, for example, flat, concave, convex, or may have an irregular or regular repeatability. a structure, such as a sawtooth structure. The thermally conductive substrate may substantially cover all of the back side 5 of the light guide or may replace the portion of the conductive substrate in place of Q. In particular, The thermally conductive substrate may include openings 'for example such that the conductive lines may be guided through the openings to the led. A spacer element 9 may be disposed between the thermally conductive substrate 3 and the light guide 4 to stabilize and maintain the assembly The specified air gap. The area occupied by the spacer elements 9 should be smaller relative to the area portions 7 so that they do not substantially interfere with total internal reflection. In general, the spacer elements 9 are occupied. The area is included in the percentage of the minor area of the area portion 7, which is not maintained within a prescribed distance from the thermally conductive substrate. 128324.doc -17- 200901507 The spacer elements 9 can be formed from the light guide 4 And/or from the protruding portion of the thermally conductive substrate 3, or may separate elements, such as small components, such as balls or wires. The light guide 4 and the I plate may be held by a holding member such as a spring (not shown). 3 is held in, for example, wherein the spacer elements 9 maintain an air gap 8 between the light guide 4 and the substrate 3. Figure 2 illustrates another embodiment of a light-emitting device in accordance with the present invention. In a particular embodiment, the at least thermally conductive substrate 23 is porous or to a porous surface having a rear side 5 facing the light guide 4, and the conductive substrate 23 is configured such that the region 7 of the rear side 5 of the light guide 4 Direct contact with the conductive substrate 23. Due to the porosity of the conductive substrate 23, a percentage of the main area of the area portion 7 is formed to one of the air gaps 8 of the substrate 23, the air gap having an interval of 2 and 200 μm Between the widths of the substrate, at least 5 Å (e.g., at least 〇90, e.g., at least 95)% of the area of the portion 27 will form a gauge width to the thermally conductive substrate. (i.e., 2 to 200 μηι, such as 5 to 2 5 μηη) of the air gap 8. Non-limiting examples of porous substrate materials include metal foam materials such as inlaid foam materials or metal fleece. The metal foamed material is a honeycomb structure composed of a solid metal (mostly aluminum) containing a large volume fraction of the inflated holes. The holes may be sealed (closed cell foam) or they may form an interconnected network (open cell foam). The defined properties of metal foamed materials are complex. Porosity: Generally, more than 80% of the volume consists of void spaces. Figure 3 is a graph illustrating the thermal conductivity (heat transfer coefficient) of the air gap in W/m2K as a function of the width of the air gap in meters, 128324.doc -18- 200901507. The temperature calculation 'which can represent a typical temperature in the air gap of one of the light-emitting diodes of the present invention because the temperature is higher than the normal ambient temperature but lower than for the poly(methyl methacrylate) (preferably one of the photoconductive materials) The maximum operating temperature of approximately 70 ° C. As can be seen, this conductivity is significantly reduced with increasing air gap width. Comparing &, a typical LED (Lumileds "Luxeon LED" has a conductivity of 100 W/m2K, which here corresponds to an air gap having a width of 2 。. Therefore, when the light guide is When the air gap between the thermally conductive substrates is less than 2 μm, the conductivity in the air gap exceeds the conductivity through the LED (for example, when the LED is formed from the light guide to one of the substrates). It will be appreciated by those skilled in the art that the present invention is not limited to the preferred embodiments described above. Instead, many modifications and variations are possible within the scope of the appended claims. For example, an illuminator based on the illuminating device of the present invention may comprise a Or a plurality (i.e., a plurality) of light-emitting devices of the present invention, i.e., comprising a plurality of separate light guides. For example, the separate light guides may be tiled to collectively cover a larger area than the area of the single-light guide. It is useful to divide the device into plural-step proofs, for example due to expansion and deformation between the metal and the polymer. 'For example, in order to maintain flatness and prevent, swollen and contraction differences The light emitting device of the present application as for
128324.doc 一般照明之發光體，例 。此外’可將其用於或用作針 示裝置之背光單元，例如Lcd •19- 200901507 顯示裝置。 【圖式簡單說明】 已參考顯示本發明之具體實施例的附圖而更加詳細地說 明本發明之此等與其他態樣。 圖1解說本發明之一發光裝置之一具體實施例。 圖2解說本發明之一發光裝置之另一具體實施例。 圖3解說與該空氣間隙之厚度成函數關係的一空氣間隙 於50°C的導熱率。 【主要元件符號說明】 1 發光裝置 2 發光二極體 3 基板 4 光導（板） 5 後侧 6 前側 7 區域部分 8 間隙 9 間隔物元件 10 天花板/牆壁 23 基板 128324.doc -20-128324.doc General lighting illuminators, examples. Further, it can be used or used as a backlight unit of a pointing device, such as a Lcd 19-200901507 display device. BRIEF DESCRIPTION OF THE DRAWINGS These and other aspects of the present invention have been described in more detail with reference to the accompanying drawings in which FIG. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 illustrates a specific embodiment of a light-emitting device of the present invention. Figure 2 illustrates another embodiment of a light emitting device of the present invention. Figure 3 illustrates the thermal conductivity of an air gap at 50 °C as a function of the thickness of the air gap. [Description of main components] 1 Illumination device 2 Light-emitting diode 3 Substrate 4 Light guide (plate) 5 Rear side 6 Front side 7 Area part 8 Clearance 9 Spacer element 10 Ceiling/wall 23 Substrate 128324.doc -20-