200848992 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種散熱架構，尤指一種電子設備中藉由導熱元件直 傳導熱源於外界者。 … 【先前技術】 電子科技技術日益精進，廣泛運用於不同領域，其中作為運算處理中 心的電腦設備，伴隨處理資訊日趨龐大與複雜，電腦之效能與速度:為消 費者與業界所重視。除了高效能外，搭配材料科技之進步，電腦之體積趙 於輕薄短小，尤其是微電麟者相型電腦，在相#有限之崎空間中搭 Γ 倾雜之電子元件，但由於魏子元件運射不可魏之熱難生，將景: 響正常運作之穩定性，因此散熱技術因應而生。 … 電子没備之散熱技術包含主動型散熱(active cooling)與被動型散熱 (paSSlve⑽㈣；主動型為利用外界動力源以驅動散熱之進行，如散熱風扇 或水冷循環等，而被動酬侧導熱材料傳導鱗之雜，將熱源由電子 裝f導引於空氣巾進行散熱，如散_片或鮮管等。為求增進散熱效果， ^前普遍於單-電子裝置上同時設置域動型散熱元件，若僅以單一電子 4置而吕或許可以提高散熱鱗，但於一電子設備中具有複數且排列複雜 電子裝置環境下，衫的散熱元件勢必關該電子設備達顺型化之目 ( 標。此外，若架設複數高轉速散熱風扇同時運轉將產生極大之噪音或震動， 丨 亦可能造成内職流之統，形航流，反而無法將熱源有效排出甚至積 滞。 為解決因架設複數高轉速散熱風扇所造成之問題，習知美國專利第 7，177，154號以及第2006/0056155號分別揭露兩種不使用冷卻風扇之電腦； 前者係至少-熱料單元將誠生元件所產生之熱能傳導域殼上， 並藉此達到放熱效果；而後者之發熱元件熱連接於該外置於機殼之散熱 板將熱虽藉由該散熱板排出於機殼；上述兩習知技術，因不使用冷卻風 扇可以無噪音之方式來降低機殼的内部溫度。然而此種純被動式散熱技 術’因散熱材觸能達職熱效率之關，若制於高熱職生電子裝置 或疋微型化電子裝置，極可能因散熱速度不如產熱速度而積滯熱源，並無 5 200848992 •- 法廣泛使用於各種電子裝置之上。 【發明内容】 本發明之主要目的，在於改善電子設備過去因架設過多散熱裝置，導 致空間上之關或者散紐果之健，因此欲簡錄熱賴之裝設，以運 用於微型電腦或車用型電腦，或縮小電腦之使用體積。 為達上述目的，本發明提供一種電子設備之散熱架構，該散熱架構包 括有-機殼、-導熱體與—風扇，該機殼包含—上蓋與—下蓋，並於内部 形成-容置空間以容設至少一熱源產生元件，該導熱體亦裝設於該容置空 間内，該導熱體包含-與該熱源產生元件相接之導熱塊，以及複數第一散 ( _片；其巾，該機殼為導熱材質，其上設有與該第-散熱則平行之複 數第-散熱鰭片，該上蓋開設—對應於該導熱體位置之開σ，使該導熱體 之第-散熱n片向上延伸出該開口並露出於該機殼，該熱源產生元件所產 生之熱源藉由該導熱體傳導，直接散失於電子裝置之外，上蓋另設有一相 =於，風扇位置之抽風口，該風扇可抽吸該容置空間内之熱空氣，其驅動 工氣流經該第一散熱鰭片以促進散熱速率；此外，該機殼上設有一封蓋， 該封蓋同時覆於該開口與該風扇上方，藉由該封蓋與該機殼相結合後，形 成-出風π並定⑲—導顺道’使觀扇轉之氣流進人該導風通道， 以單-方向引流之方式流經該導熱體，最後由該出風口將熱空氣導出。 I , 本㈣奸設備之雜雜，透過料紐Μ於概外之設計，達 到直接散熱之效果，並健設單—風融加強賴之效率，可有效減少 扇之架設’應用於微型化電腦設備内部空間之限制，防止因多散財 導致魏流縣，以絲設過纽顧造成的噪音及振鱗問題、，、此 亦可達到高效率之散熱目的。 【實施方式】 有關本發明之詳細說明及技術内容，現就配合圖式說明如下· 請參閱『第i圖』、『第2圖』以及『第3圖』所示，係本發明 ，例之外觀立體、結齡解以及結構剖面示意圖，如騎示：本 f 一種電子設備之散熱架構，包括有一機殼1〇、一導熱體20以及—風戶、 0 ’該機殼1G包含-上蓋1G1與-下蓋1G2，兩者結合後内部形成一容$ 6 200848992 間11以今认至熱源產生元件’如中央處理單元4卜頌示卡咬電源供 23心中央處理單元41作為散熱之目標)以及其他電子' 硬碟43、輪出入介面44等，該導熱體20亦裝設於該 :及二:體2〇分為一與該中央處理單元41接觸之導熱塊& 熱源之複數第-散熱鰭片22 ;射，該機㈣為 元41運作_生_，殻1G僅提供低 效率之政熱效果’於本發明中γ系於兮卜雲 W^FIa 1? , ，、、〜上盍10〗開設一對應於該導熱體20位 該中^理二，0之第—散熱鰭片22部分露出於該上蓋1〇卜 Γ禮道早70所產生之熱源，藉由該導熱塊21以及第—散敎續片22 =====機殼10外部之部分位於該風扇30驅動風流區 30之:==該第散熱鰭片22，該上蓋他對應於該風扇 3〇之位置開§又-抽風口 13，將容置空間n^ 流流經該導熱體20之第-散埶㈣2?⑽“七'，，、原另—方面驅動軋 產生之熱源，大幅促進整體電;備之散熱速;中央處理單元41所 體20為Γ有本備之f熱架構對於該第一散熱鰭片22,針對該導熱 散_ 22平行=效二=1〇之上蓋⑼亦可設有與該第-一麵片可位於該第 =、盍15同時覆餅該第—散熱鰭片22露出之開口戶 方，該封蓋15與該上蓋101結合後形成一出風口 15 := 土 上蓋101所限制出物狀義為-導風通道。 義该封盍15與 容置Γ車㈣鱗，輪止水氣進入 =該風扇30與該上蓋1〇1之交界處，以及該封蓋i5 二 父界處’皆設置有一防水氣密件他、⑽、1δ 密^盍诎之 脱可為彈性橡膠圈或者密封膠等；此防水氣密件收、 200848992 防水之效果，亦可限制藉由風扇3〇所驅 單一引流之效果。 動之氣流方向 防止氣流外泡加強 以下利用『第3圖』，說明本發明之氣流流 源氣流之方向，當電子設_運作所產生J7 刖頭所不為… 田、类、η兮紅门 η、公 > 心熟，原，藉由該風扇30之抽吸作 15 ΖΖ 4 Γ ^ 305 30 =Γΐ 限制流人該導風通道，成為單-引流之散執 方式，被驅動之氣流流經該第一散熱鰭片22 σσ … 熱源散失，最後熱源氣流由該出風π 151排出。Μ中央處理早70 41之200848992 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation structure, and more particularly to an electronic device in which a heat source is directly conducted by a heat conducting element to the outside. ... [Prior Art] Electronic technology is becoming more and more sophisticated and is widely used in different fields. Among them, computer equipment as an arithmetic processing center, with the increasing complexity and complexity of processing information, the efficiency and speed of computers: the attention of consumers and the industry. In addition to high-performance, with the advancement of materials technology, the volume of the computer is light and short, especially the micro-electricity phase-type computer, which is used in the phase of the limited sakis space, but due to the Weizi components. The fire can not be difficult to heat, the scene: the stability of normal operation, so the heat dissipation technology is born. ... The electronic cooling technology includes active cooling and passive cooling (paSSlve (10) (4); active type is to use external power source to drive heat dissipation, such as cooling fan or water cooling cycle, and passive side heat conduction material conduction The scale is mixed, and the heat source is guided by the electronic device f to the air towel for heat dissipation, such as scattered film or fresh tube, etc. In order to improve the heat dissipation effect, the field-type heat dissipation component is generally disposed on the single-electronic device at the same time. If only a single electronic device is used, it may be possible to increase the heat dissipation scale. However, in an electronic device having a plurality of complicated electronic devices, the heat dissipation component of the shirt is bound to be the target of the electronic device. If a large number of high-speed cooling fans are installed at the same time, it will generate great noise or vibration. It may also cause internal traffic flow and shape airflow, but it can not effectively discharge or even accumulate heat sources. To solve the problem of erecting multiple high-speed cooling fans The problems caused by the prior art, U.S. Patent Nos. 7,177,154 and 2006/0056155 respectively disclose two computers that do not use a cooling fan. The former is at least - the hot material unit is formed on the thermal energy conduction domain shell of the Chengsheng component, and thereby achieves an exothermic effect; and the latter heating element is thermally connected to the heat dissipation plate externally disposed on the casing, although the heat is The heat dissipation plate is discharged to the casing; the above two conventional techniques can reduce the internal temperature of the casing by using a cooling fan without noise. However, the pure passive heat dissipation technology is capable of achieving thermal efficiency due to the contact of the heat dissipation material. If it is made in a high-heat electronic device or a miniaturized electronic device, it is very likely that the heat dissipation rate is not as good as the heat generation rate. Therefore, it is not widely used in various electronic devices. [Invention] The main purpose of the invention is to improve the electronic equipment in the past due to the installation of too many heat sinks, resulting in space or the health of the fruit. Therefore, it is necessary to briefly record the installation of the device for use in a microcomputer or a car type computer, or To reduce the volume of use of the computer. To achieve the above object, the present invention provides a heat dissipation structure of an electronic device, the heat dissipation structure including a casing, a heat conductor and a wind The heat dissipation body is included in the accommodating space, and the heat conductor includes-and the heat source. The heat sink is disposed in the accommodating space. a heat conducting block that is connected to the component, and a plurality of first diffusing materials (the film; the casing is a heat conducting material, and the plurality of heat radiating fins parallel to the first heat sink is disposed thereon, the upper cover is opened) Corresponding to the opening σ of the position of the heat conductor, the first heat sinking n piece of the heat conductor extends upwardly out of the opening and is exposed to the casing, and the heat source generated by the heat source generating component is directly transmitted and lost by the heat conductor. In addition to the electronic device, the upper cover is further provided with an air outlet of a phase of the fan, and the fan can suck the hot air in the accommodating space, and the driving airflow passes through the first heat dissipation fin to promote the heat dissipation rate; a cover is disposed on the casing, and the cover covers the opening and the fan at the same time, and the cover is combined with the casing to form an air outlet π and a 19-way guide Fan-turning airflow enters the air guiding passage, in a single-square The heat conductor is flowed in a way of draining, and finally the hot air is led out by the air outlet. I. This (4) miscellaneous equipment is designed to achieve the effect of direct heat dissipation through the design of the material, and to strengthen the efficiency of the wind-melting, which can effectively reduce the erection of the fan. The limitation of the internal space of the equipment prevents Weiliu County from causing noise and vibration scale problems caused by the use of the silk, and this can also achieve high efficiency heat dissipation. [Embodiment] The detailed description and the technical contents of the present invention will be described below with reference to the drawings. Please refer to the "i", "second" and "figure 3" drawings, which are examples of the present invention. Appearance three-dimensional, knot-age solution and structural profile diagram, such as riding: this f is an electronic device heat dissipation structure, including a casing 1 〇, a thermal body 20 and - wind household, 0 'the casing 1G contains - upper cover 1G1 And the lower cover 1G2, the combination of the two forms a volume of $6 200848992 11 to recognize the heat source generating component 'such as the central processing unit 4, the card biting power supply for the 23 core central processing unit 41 as the target of heat dissipation) and others The electronic heat hard disk 43, the wheel inlet and outlet interface 44, and the like, the heat conductor 20 is also mounted on the body: and the second body 2 is divided into a heat conducting block & a heat source of the central processing unit 41. Sheet 22; shot, the machine (four) is the operation of the element 41_sheng_, the shell 1G only provides the low-efficiency political heat effect. In the present invention, the γ system is in the 兮Buyun W^FIa 1?, ,,~~上盍10 〗 Open a corresponding to the heat conductor 20 position of the middle 2, 0 of the first - the heat sink fin 22 The heat source generated by the upper cover 1 〇 Γ Γ 早 早 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 70 30: == the first heat sink fin 22, the upper cover corresponding to the position of the fan 3〇 opening and the air extracting port 13, flowing the receiving space n^ through the first heat sink 20 (4) 2 (10) "seven",, the original another - the heat source generated by the rolling, greatly promotes the overall electricity; the heat dissipation speed; the central processing unit 41 body 20 is the heat structure of the heat dissipation for the first heat sink fin The cover 22, for the thermal conduction _ 22 parallel = effect 2 = 〇 upper cover (9) may also be provided with the first side piece can be located at the first, 盍 15 at the same time covering the first cooling fin 22 exposed In the open household, the cover 15 is combined with the upper cover 101 to form an air outlet 15 := The upper cover 101 limits the shape of the object to the air guiding channel. The sealing device 15 and the receiving wheel (four) scale, wheel The water stop gas enters = the junction of the fan 30 and the upper cover 1〇1, and the cover i5 and the second parent's are both provided with a waterproof airtight member, (10), 1δ, and the like. Elastic rubber ring or sealant; this waterproof airtight part, 200848992 waterproof effect, can also limit the effect of single drainage by the fan 3〇. The direction of the air flow prevents the air bubble from strengthening the following use "3rd picture" The direction of the airflow source airflow of the present invention is illustrated. When the electronic device is operated, the J7 steamed head is not... The field, the class, the η兮红门 η, the male > the familiar, the original, by the fan 30 The suction is 15 ΖΖ 4 Γ ^ 305 30 = 限制 The flow channel is restricted to flow, and becomes a single-drainage dispersion mode. The driven airflow flows through the first heat dissipation fin 22 σσ ... heat source is lost, and finally the heat source airflow It is discharged by the outlet π 151. ΜCentral processing early 70 41
ι:ΐ=!ϊ 散熱架構利用導熱體20直接露出於電子 ί， 更利用—風扇3g之驅動’搭配導風通道所 =;=’=電子設備容置空間11内之熱源，以及協同 失中央處理早το 41傳導至第-散熱鰭片22之熱源，大幅提 之散熱效果，以及減少風扇3G設置，因財效解決 ^ =起之料或鑛，甚至目驗訊触紅齡娜 紐果之目的。本發條驗錄及符合㈣發明專利之 要件，麦依法提出申請，祈鈞局早曰賜准專利，實感德便。 以上已將本發明做-詳細綱，惟社所述者，僅爲本伽之一較佳 而已，當不能限定本發明實施之範圍。即凡依本發日騎請範圍所作 句專變化與修飾等，應仍屬本發明之專利涵蓋範圍内。 8 200848992 【圖式簡單說明】 第1圖，係本發明電子設備之散熱架構一較佳實施例之外觀立體示意圖 第2圖，係本發明電子設備之散熱架構一較佳實施例之結構分解示意圖 第3圖，係本發明電子設備之散熱架構一較佳實施例之結構剖面示意圖 【主要元件符號說明】 10 .............機殼 101 .............上蓋 102 .............下蓋 11 .............容置空間ι:ΐ=!ϊ The heat dissipation structure is directly exposed to the electrons by the heat conductor 20, and is driven by the fan 3g's with the air guiding channel=====the heat source in the electronic device housing space 11 and the center of the synergy Handling the heat source of the early το 41 conduction to the first heat sink fin 22, greatly improving the heat dissipation effect, and reducing the fan 3G setting, due to the financial effect of the ^^ material or mine, and even witnessing the news of the red age Nana fruit purpose. This is a record of the issue and conforms to (4) the requirements of the invention patent. Mai applied for it according to law, and the Pray Bureau gave the patent as soon as possible. The present invention has been described above in detail, but it is only one of the preferred embodiments of the present invention, and the scope of the present invention is not limited. That is, the sentence changes and modifications made by the scope of the ride on the date of this issue shall remain within the scope of the patent of the present invention. 8 200848992 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of a heat dissipation structure of an electronic device according to the present invention. FIG. 2 is a schematic exploded view of a preferred embodiment of a heat dissipation structure of an electronic device according to the present invention. FIG. 3 is a cross-sectional view showing the structure of a heat dissipation structure of an electronic device according to the present invention. [Main component symbol description] 10 . . . ... casing 101 ... .......Upper cover 102 ............. Lower cover 11 .............Receiving space
12 .............開口 13 · 抽風口 14、14a、14b.............第二散熱鰭片 15.............封蓋 151 · ............出風口 防水氣密件 16a、16b、16c 20 .............導熱體 21 .............導熱塊 22 .............第一散熱鰭片 30.............風扇 41 .............中央處理單元 42 .............主機板 43 .............硬碟 44 .............輸出入介面 912 ............. Opening 13 · Exhaust vents 14, 14a, 14b............. Second heat sink fins 15....... ... cover 151 · ............ air outlet waterproof airtight parts 16a, 16b, 16c 20 .......... heat conductor 21 . ............thermal block 22..................first heat sink fins.............fan 41. ......... central processing unit 42 ............... motherboard 43 ............. hard disk 44 .. ...........Import and export interface 9