200846508 九、發明說明： 【發明所屬之技術領域】 本發明係一種表面黏著式被動元件之端電極及其製 法尤扣種此改善端電極喷錫缺點的端電極及其製法。 【先前技術】 被動元件隨著封裝技術之演變，目前概分為有插腳 (DIP)及表面黏著（SMD)兩種型式，以表面黏著型式 的被動S件來說，其主要於端電極表面形成有焊锡用的 錫5’故與電路板結合時，只要於回焊製程中加熱令表面錫 ,、、、融即可與电路板接點電連接，相較插腳式被動元件與電 路板的加工簡單許多。 近來由於電子產品愈趨輕薄短小，因此電路板上線路 之間的線距愈近，而上述表面黏著式被動元件在回焊製程 1短：因、為！錫現象而有機會造成電路板上的不同信號線 路多路。洙九此一現象發現噴錫現象如下： 首先請參閱第五圖所示，係、為—種表面黏著式被動元 件（2 〇 )的側’其兩側分別設置有端電極…）， 了電極（21) &含有三層結構，内層為—電極層 (^ /中間層為-保護層（2 3 )及最外層則為錫層 貴全屬（二該電極層（22)通常為卑金屬（銅）或 良'寻材質，保護層（23)則是錄材質，而錫 則為錫或錫合金材質。以下進一步說明各層製 \ 4 200846508 首先電極層（2 1 )係使用沾附機於被動元件（2 〇 ) 兩側沾附銀膏或銅膏後，再於一烘乾爐内烘乾以及一還原 爐内燒附固結於被動元件兩侧而成，惟因銀膏或銅膏内含 燒結助劑’因此會於燒結過程中產生許多微小孔洞，一般 來說微小孔洞可有小5微米以下，而大可至5微米至4〇 微米之間不等之尺寸。當電極層形成後，保護層（2 3 ) 及錫層（24)再採電鍍方式依序鍍至該電極層（22) 上。 由上述說明可知，電極層形成後會有大小不一的微孔 洞產生，而保護層（2 3 )及錫層（2 4 )卻又是採直流 電鍍方式依序電鍍至電極層（2丄）表面上，因此該等微 小孔洞以直流電鍍方式將不易由習知直流電流電鍍於該微 孔洞内，最後造成保護層不連續。 以下再說明保護層（2 3 )及錫層（2 4 )的直流電 鍍過程，請再配合參閱第六圖所示，為端電極一電極層（2 2 )表面進行直流電鍍之過程，所謂電鍍係於一電解槽中 將端電極置入電解液中，再置入一鎳金屬塊（3 〇 )，之 後再令電極層（2 2 )及鎳金屬塊（3 〇 )連接至一直流 電源（如第八圖所示），其中該端電極（2 i )連接負極， 而鎳金屬塊（3 0 )則連接正極。如圖所示，當通入直流 私源日守，鎳金屬塊（3 〇 )開始解離出帶正電之鎳金屬離 子（Ni )於電解液中，而且會形成一電鑛擴散層（匕）， 而該電鍍擴散層（L)較厚且離子（Ni2+)濃度低，而使得 最後鍍於電極層（22)表面上時，如第七圖所示，如遇 5 200846508 有微小孔洞（2 2 1、仞里+ . / ) 4置處，會無法填平該孔洞（2 2 中 j再毛鍍上-錫層I，即會將微小孔洞包覆於其 .0 ,來成型後的被動元件端電極於回焊加熱銲接 的匕程中，會因為加埶 亡收…、便侍微小孔洞的水氣或空氣膨脹 而將溶融的錫向外噴出。200846508 IX. Description of the Invention: [Technical Field] The present invention is a terminal electrode of a surface-adhesive passive component and a method for manufacturing the same, and a method for manufacturing the terminal electrode for improving the defect of the terminal electrode. [Prior Art] With the evolution of packaging technology, passive components are generally divided into two types: pin (DIP) and surface mount (SMD). For surface-adhesive passive S-pieces, they are mainly formed on the surface of the terminal electrode. There is tin 5' for soldering, so when it is combined with the circuit board, as long as it is heated in the reflow process, the surface tin can be electrically connected to the circuit board, compared with the processing of the pin passive component and the circuit board. A lot simpler. Recently, as electronic products become lighter and thinner, the closer the line spacing between the lines on the circuit board, and the above-mentioned surface-adhesive passive components are short in the reflow process: The tin phenomenon has the opportunity to cause multiple signal lines on the board to be multiplexed. This phenomenon is found in the following phenomenon: First, please refer to the figure shown in the fifth figure. The side of the surface-adhesive passive component (2 〇) is provided with a terminal electrode on both sides... (21) & has a three-layer structure, the inner layer is the electrode layer (^ / the intermediate layer is - the protective layer (2 3 ) and the outermost layer is the tin layer of the genus (the electrode layer (22) is usually the base metal (Copper) or good 'seeking material, protective layer (23) is recorded material, and tin is tin or tin alloy material. The following further explains each layer system \ 4 200846508 First electrode layer (2 1 ) is attached to the machine The passive component (2 〇) is coated with silver paste or copper paste on both sides, and then dried in a drying oven and fixed in a reducing furnace to be fixed on both sides of the passive component, but the silver paste or copper paste Containing a sintering aid', it will produce many tiny holes in the sintering process. Generally, the tiny holes can be as small as 5 microns or less, and as large as 5 microns to 4 microns in size. When the electrode layer is formed After that, the protective layer (23) and the tin layer (24) are sequentially plated to the electrode layer (2). 2) Above. It can be seen from the above description that there are micropores of different sizes after the electrode layer is formed, and the protective layer (23) and the tin layer (2 4) are sequentially plated to the electrodes by DC plating. On the surface of the layer (2丄), the micro-holes are not easily plated into the micro-cavities by conventional DC current by DC plating, and finally the protective layer is discontinuous. The protective layer (23) and tin will be described below. For the DC plating process of the layer (2 4 ), please refer to the sixth figure for the DC plating process on the surface of the electrode layer (2 2 ) of the terminal electrode. The so-called electroplating is carried out in an electrolytic cell to place the terminal electrode. In the electrolyte, a nickel metal block (3 〇) is placed, and then the electrode layer (2 2 ) and the nickel metal block (3 〇) are connected to a DC power source (as shown in the eighth figure), wherein the end The electrode (2 i ) is connected to the negative electrode, and the nickel metal block (30) is connected to the positive electrode. As shown in the figure, when the DC private source is turned on, the nickel metal block (3 〇) begins to dissociate the positively charged nickel metal. Ions (Ni) are in the electrolyte, and an electric ore diffusion layer (匕) is formed. The plating diffusion layer (L) is thick and the ion (Ni2+) concentration is low, so that when finally plated on the surface of the electrode layer (22), as shown in the seventh figure, if there is a small hole in the 5 200846508 (2 2 1 ,仞里+ . / ) 4 Placement, it will not be able to fill the hole (2 2 in j and then plating - tin layer I, will cover the tiny hole in its .0, to form the passive component terminal electrode In the process of reflow soldering and soldering, the molten tin is ejected outward due to the addition of sputum, the moisture or air expansion of the micro-holes.
由上述說明可知，曰A ^ ^ ^ 目則表面黏著型電子元件的端電極 因為採用習知直流電鍍的製 ^ ^ ^ ^ I私方法，而將複數微小孔洞包 後方；/、中’對於電路板線 u K纷赘水更趨密集的今日，噴锡 必造成整體電路上的錯動作 次疋不良口口，應進一步尋求解 決万法。 【發明内容】 有鑑於上述現有端電子電鍍製程之缺點，本發 目山的係提供—種表面黏著式被動it件之端電極製法，令各 端電極三層結構間I> … 氣於微小孔洞内，構成連續 凡正0表面、.Ό構，大幅減低回烊噴錫之現象。 欲達上述目的所使用的主要技術特徵係令表面 被動兀件之端電極製法·· 飞 將於被動元件兩相對側位電極層及一第一全屬 一電解液中； 1入 •7屯極層及金屬塊連接至—外部電源的兩電極； 控制外部電源產生-正負接***互變換之直流H …極***互變換之直流電源係包含有一正電流 一負電流週期，其中負電流週期時間遠小於正電流週期日士 6 .200846508 間； 令各電極層上電鍍一定厚度的第一金屬層（即為保護 層）後，結束此一電鍍程序； 再執行第二道電鍍，以於保護層表面再形成一錫層。 由上述也明可知，本發明係主要改變電鑛端電極保護 層的電源波形，令其構成一正，負週期變化的電流波形， :匕技術特徵之作用在於，於正電流週期時，讓第一金屬解 離出濃度較高的金屬離子德， $ 傻於負电流週期時則瞬間交換 端電極及第-金屬塊之電極，令電解液中的第一金屬離子 快速地且大量鍍至電極厚矣 . 一 私a層表面，令電極層表面離子濃度提 2 ’使得電鍍擴散層相對變薄，是以金屬離子會容易進入 :極層表面之微小孔洞，進而填平該微小孔洞，於電極層 形成一連續的保護層，之後再電鑛成形一錫層，令本 發明被動元件之端電極完 包位凡王無包覆有微小孔洞之結構， 全解決回焊噴錫之問題。 本發明另一目的将蔣征 . 電極，其包含有」 面黏著式被動元件之端 ^ /、形成於被動元件側邊之電極層、一形 成於該電極層表面的彳謹 、"又“及一形成於該保護層表面的錫 :上:::::層表面係凹凸不平“含有微小 又層係連續形成於電極層凹凸平面表面上不間斷 取後外層之錫層亦同樣連續残斷形成於電極層表面。 【貫施方式】 本發明係關於& p t t β 、 >表面黏著型被動元件之端電極中 7 200846508 外兩層結構之製 國岍不，該製法包含 有以下步驟： 將於被動元件兩相對側位電 ._ ^ ^ 一電解液中；豆中該第—八s 弟一金屬塊置入 (4〇). 孟屬機係為鎳金屬塊或銅金屬塊 令電極層及金屬塊連接至-外部電源的兩電極（41) · 控制外部電源產生一正/ s ， /負週期、史換之電源，即該電 源包含有一正電流週期及一沒 电 時間（約100微秒）幻於、 其中負電流週期 Λ U小於正電流週期時間（約5000微 私）（42)，請配合參閱第二圖所示； 層上電鍍一定厚度的第一金屬層，即可形成 保°又層亚結束此一電鍍程序（43); 純行第：道錢，以於保護層表面再形成—錫層； ，、中弟二道電鍍係包含以下兩種： (1 )直流電鍍 :將形成有保護層的端電極之被動元件及第二金屬塊 電解液中（44)，再令保護層及第二金屬塊連接 /直流電源的兩電極，進行直流電鍍，將二金屬鍍 合層之表自（45)。其中第-金屬塊係為錫金屬或錫 (2)正/負電流週期變化電鍍 置 冑$成有保護層的端電極之被動元件及第二金屬塊 一外立+免解液中（46 )，再保護層及第二金屬塊連接至 #電源的兩電極（47) ’之後再控制外部電源產生一 8 200846508 正負極***互變換亩 週期及一… 源，§亥電源係包含有-正電流 、巧期士 、电流週期，其中負電流週期時間遠小於正電流 週期時間（48)，如此即 】於正0 的第二金屬層，而形成端電極之Γ層電鍍—定厚度 即當變=成形保護層之電鍍電流波形， 出*正带H月第一金屬係連接至正電極，而解離 期：ΠΓ，待解離出一定濃度後（控制正電流週 &制夕Μ ^極之電極層表面附近已有金屬離子，此時 广Μ電源轉換至負電流週期，令端電極瞬間變為正電 ❹^ 請千鍵至θ a極層表面，使電 ㈣^ 子漢度提高，，之後由於該負電流週 間相較正電流週期時間為，豆，待回復第一金屬與正 接冑，會再解離出第—金屬離子於電解液中；如此 设又替變換，即能使得電鍍擴散層變薄，令第一金屬容 :進入電極層之微小孔洞内，進而填平電極層之微小孔 =*於包極層表面構成一連續不中斷的第一金屬層；而此 第至屬層電鍍完成後即為端電極之中層保護層。 山明配合苓閱第三圖及第四圖所示，本發明被動元件各 端電極（1 0 )包含有： 1 _黾極層（1 1 )，係形成於被動元件對應側邊，又 其包含有具有複數微小孔洞（111) (111，）之凹凸 不平表面； 一保護層（1 2 )，係連續形成於電極層凹凸平面表 面上且不間斷；及 9 200846508 錫層（1 3 )，係連續不間斷形成於保護 表面上。 3 、丄1 ) "二=圖及第四圖可知’當電極層（η)表面的微 / 1 1 1 )尺寸較大時，該保護層（2 2)仍 續形成於微小孔洞内壁’若較小尺寸之微小孔洞 則會直接被填平，故㈣絲㈣層（1 3 )與保護芦 2)之間亦無包含微小孔洞，是以，曰後被動元件‘It can be seen from the above description that the terminal electrode of the surface-adhesive electronic component is surrounded by a plurality of micro-holes by a conventional DC plating method; Today, the plate line u K is more dense, and the tin spray will cause the wrong operation on the whole circuit. It should be further sought to solve the problem. SUMMARY OF THE INVENTION In view of the above-mentioned shortcomings of the prior art electronic electroplating process, the present invention provides a method for preparing a terminal electrode of a surface-adhesive passive member, such that the three-layer structure of each end electrode is in a micro-cavity. Inside, it constitutes a continuous zero-surface, Ό structure, which greatly reduces the phenomenon of sputum spray. The main technical feature used to achieve the above purpose is to make the end electrode method of the surface passive element fly in two opposite side electrode layers of the passive component and a first all-in-one electrolyte; 1 into 7 poles The layer and the metal block are connected to the two electrodes of the external power source; the DC power source for controlling the external power source generation-positive and negative polarity interaction ... the DC power supply of the polarity alternating conversion includes a positive current and a negative current period, wherein the negative current cycle time is much smaller than The positive current cycle is between 6.200846508; after plating a certain thickness of the first metal layer (ie, the protective layer) on each electrode layer, the plating process is terminated; and the second plating is performed to protect the surface of the protective layer. A tin layer is formed. It is also apparent from the above that the present invention mainly changes the power supply waveform of the protective layer of the electrode end electrode of the electrode, so that it constitutes a positive and negative cycle current waveform, and the function of the 匕 technical feature is that during the positive current cycle, let the first A metal dissociates a higher concentration of metal ions, and when the negative current period is silly, the terminal electrode and the electrode of the first metal block are exchanged instantaneously, so that the first metal ion in the electrolyte is rapidly and largely plated to the electrode thickness. A private a layer surface, so that the surface ion concentration of the electrode layer is 2', so that the plating diffusion layer is relatively thin, so that metal ions can easily enter: tiny pores on the surface of the electrode layer, and then fill the micro holes to form an electrode layer. A continuous protective layer, followed by electroforming a tin layer, so that the terminal electrode of the passive component of the present invention completes the structure of the king without the micro-hole, and solves the problem of reflow soldering. Another object of the present invention is the electrode of Jiang Zheng. The electrode comprises a surface of the surface-adhesive passive component, an electrode layer formed on the side of the passive component, and a surface formed on the surface of the electrode layer. And a tin formed on the surface of the protective layer: the surface of the upper layer::::: is uneven; the tin layer containing the minute and continuous layers formed on the surface of the uneven surface of the electrode layer without interruption is also continuously broken. Formed on the surface of the electrode layer. [Comprehensive application method] The present invention relates to the method of <ptt β, > surface-adhesive passive element end electrode 7 200846508 outer two-layer structure, the method comprises the following steps: Lateral electricity._ ^ ^ In an electrolyte; in the bean, the first - eight s brother is placed in a metal block (4〇). The Meng system is a nickel metal block or a copper metal block to connect the electrode layer and the metal block to - Two electrodes of the external power supply (41) · Control the external power supply to generate a positive / s, / negative cycle, history of the power supply, that is, the power supply contains a positive current cycle and a no power time (about 100 microseconds) illusion, The negative current period Λ U is less than the positive current cycle time (about 5000 micro-private) (42), please refer to the second figure; the first metal layer of a certain thickness is plated on the layer to form a guaranteed layer. This electroplating procedure (43); pure line: money, in order to re-form the surface of the protective layer - tin layer;,, Zhongdi Erdao electroplating system contains the following two: (1) DC plating: will form a protective layer Passive component of the terminal electrode and the second metal block electrolyte (44) Then, the protective layer and the second metal block are connected to the two electrodes of the DC power source, and DC plating is performed to display the two metal plating layers from (45). The first metal block is tin metal or tin (2) positive/negative current period change plating, the passive component of the protective layer is formed, and the second metal block is an external + free solution (46) The re-protection layer and the second metal block are connected to the two electrodes of the power source (47)', and then the external power source is controlled to generate an 8200846508 positive and negative polarity interactive conversion mu cycle and a... source, § hai power system contains - positive current, The cycle time of the negative current, wherein the negative current cycle time is much smaller than the positive current cycle time (48), so that the second metal layer of the positive 0, and the formation of the end electrode of the Γ layer plating - the thickness is the change = forming The plating current waveform of the protective layer is connected to the positive electrode with the first metal line of the positive band, and the dissociation period: ΠΓ, after the certain concentration is released (control the positive current week & There is already a metal ion nearby. At this time, the power supply is switched to a negative current cycle, so that the terminal electrode becomes positively charged instantaneously. ^Please push the key to the surface of the θ a pole layer to increase the electric power (4) ^, and then Negative current between weeks and positive current cycles For the bean, the first metal and the positive electrode are to be recovered, and the first metal ion is dissociated from the electrolyte; if the electrode is replaced, the plated diffusion layer can be thinned, and the first metal capacity is entered into the electrode layer. The micro-holes in the micro-holes, and then filling the electrode layers, form a continuous uninterrupted first metal layer on the surface of the cladding layer; and the first-level layer is formed as a protective layer in the end electrode. As shown in the third and fourth figures, the terminal electrodes (10) of the passive component of the present invention include: 1 _ drain layer (1 1 ) formed on the corresponding side of the passive component, and An uneven surface having a plurality of minute holes (111) (111,); a protective layer (12) continuously formed on the surface of the uneven surface of the electrode layer without interruption; and 9 200846508 Tin layer (13) Continuously formed on the protective surface continuously. 3 , 丄 1 ) " 2 = and 4, the protective layer (2 2 when the surface of the electrode layer (η) is large / 1 1 1 ) ) still formed on the inner wall of the tiny hole 'if the small hole of the smaller size Directly filled, so the wire (iv) (iv) layer (13) and comprising between 2 and had no protective Lo) micro-cavities, are, after said passive element '
進入回”程加熱時，即不會因為微小孔洞包覆水… 軋’叉到焉熱而膨脹而將端電極外層熔融錫向外噴出二 本發明於電鍍成形保護層後，保護層與電極芦之 無微小孔洞，是以’後續電鍍成形錫金屬層即 J 流電鍍’或者如本發明保護層之正負電流週期交替電源· 亦請配合參閱附件，係為本發明實際應用製作： 电（知片一）及既有直流電鍛端電極（照片二）之 尺寸之照片比對圖’由此圖的紅色圈晝處即比對可知|本 發明確實能夠有效地填平微小孔洞，而不包覆於含有水氣 或空氣之空間於三層結構中。 、 【圖式簡單說明】 第一圖：係本發明-較佳實施例的流程圖。 第二圖：係本發明外部電源之電流波形示意圖 第三圖：係本發明—端電極部份剖視圖。 第四圖：係本發明另-端電極之剖視圖。 第五圖：係既有被動元件之側部圖。 10 200846508 • 第六圖：係既有直流電鍍之金屬解離擴散過程示意 - 圖。 第七圖：係既有一端電極部份剖視圖。 第八圖：係第七圖端電極電鍍用之外部直流電源電流 波形圖。 附 件：係本發明實際應用製作端電極及既有直流電 鍍端電極之微小尺寸之照片比對圖。When entering the "heating process", it will not cover the water due to the tiny holes... Rolling the 'fork to the heat and expanding, and the outer electrode of the terminal electrode is sprayed outwardly. The second layer of the invention is formed after the plating forming protective layer, the protective layer and the electrode There is no micro hole, it is the 'subsequent electroplating forming tin metal layer, ie J-flow plating' or the positive and negative current cycle alternate power supply of the protective layer of the present invention. Please also refer to the annex for the practical application of the invention: a) and a photo comparison of the dimensions of the existing DC forging terminal electrode (Photo 2). The red circle of the figure is aligned. It is known that the present invention can effectively fill the micro holes without being covered. The space containing moisture or air is in a three-layer structure. [Simplified description of the drawings] The first drawing is a flow chart of the present invention - a preferred embodiment. The second drawing is a schematic diagram of the current waveform of the external power supply of the present invention. Figure 3 is a cross-sectional view of a portion of a terminal electrode of the present invention. Figure 4 is a cross-sectional view of another electrode of the present invention. Fig. 5 is a side view of a passive component. 10 200846508 • Fig. 6 Schematic diagram of metal dissociation and diffusion process with DC plating - Fig. 7 is a cross-sectional view of an electrode at one end. Figure 8: External DC power supply current waveform for electroplating of the electrode at the end of the seventh figure. The actual application of the terminal electrode and the photo-alignment of the tiny size of the DC-plated terminal electrode.
(11) 電極層 (12) 保護層 (2 0 )被動元件 (2 2 )電極層 (2 3 )保護層 (3 0 )鎳金屬塊 【主要元件符號說明】 (1 〇 )端電極 (111)微小孔洞 (13)錫層 (2 1 )端電極 (2 2 1 )微小孔動 (2 4 )錫層(11) Electrode layer (12) Protective layer (2 0 ) Passive component (2 2 ) Electrode layer (2 3 ) Protective layer (30) Nickel metal block [Main component symbol description] (1 〇) terminal electrode (111) Tiny hole (13) tin layer (2 1 ) terminal electrode (2 2 1 ) micro hole moving (2 4 ) tin layer
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