200845269 九、發明說明： 【發明所屬之技術領域】 本毛明係關於一種用於傳遞丰導和科壯斗 半導體封裝件切割與裝㈣置树j ’其構形成用於-該半導體封裝件切割與裝卸I置製造製程期間， 件於該卸載裝置之該碟上，且分叙半導體封裝 f 吸附住該等單獨之半導體封“，於猎由產生真空而 或卸載位置。 件料傳遞雜視覺檢視位置 【先前技術】 通苇而吕，半導體封裝件經 制 度積體電路之半導體晶片（舉例：言，p:j::十形成高 在Ϊ成」=該半導體基底之上表面上成型樹脂。 體> 被附接至諸如錯之該半靜其 /微柵極陣列封裝 接。在電接頭T油體基底^面以與該等晶片電連 條Τ半導體封裝件經歷一 i 土上赴, 刀^衣％其中在该製程中該等半導體 在該切割 :氕乾製程之後半：ϊΐΐ被《ίί -基本型半導體二徠二、Ml形成於該半導體基底上之後， 帶本塞與4壯从成。該最終之半導體基底稱為條帶。該 扭駐氹竑；, 〜別衣征7丹1r隹琢裂程中 製“後74ίί ΐϊ切割為_之半導體_件。在該切割 裝件、《清洗與·製程， 置’其確賴等半導體封裝件是 視結果，分類該等半導體封裝件並儲存在-個碟二基於私 裝件謂該科㈣聽件騎狀半導體封 裝卸穿置㈣難藉由—半導體封裝件切割與 6 200845269 給-條π之條帶载Μ置，_ $ 谢呆作時供 碟之半導體封裝件傳遞裝置。+ν體封衣件至該卸載裝置之該 括··-基座塾塊1，並安穿Μ白用丰ν體封衣件傳遞裳置包 架水平移動；複數個;;於沿—導向 垂直滑動；複數個升降妙5，立;^於5亥基座墊塊1上且適合於 3 : ^ 该等升降塊5 -起上升/下降 由=且適合於隨同 體封裝件。 用^精由產生真空而吸附住—半導 -齒條4a於垂直方向上形成 猎由-馬達4e轉動之小齒輪4b伊’且與-2=2之間的兩齒條4a嗜合。因此:當^ ^寺^相鄰 達，轉動時’與該小齒輪⑧嗜合之該等齒條如其"=由該馬 而，、餘之齒條4a則上升。換言之，該小吿於、^ 下降’ 鄰之選擇器3，同時亦降下i餘之雜^輪^之傳動既提升相 藉由產生真⑼域找铸體封裳件 同樣，該等選擇器3藉由該等齒條4ai# 轉而上升/下降—期望距離。然而，條輪^之運 運轉時其間會產生唾人麗 木4a興5亥專小齒輪4b 所期望之^ 攸而會有礙該等選擇器精確移動至 ㈣合間隙而產生之誤差，綠技藝係_ _輪6 軸6絲於錄座墊塊1讀，且適合於在_=16 ’ 車I導動。大小蚊之氣壓經由氣厘管路8a被供給至 軸la之上端，以便該等選擇器3受到恒定的向=隙 另外，絲錄塊i具有若干緊急制動汽缸7，該緊♦、=二 之该等活塞桿適合於垂直滑動，以便在緊急狀態下^活二 200845269 ^错，氣壓侧騎高/降低，肋恢賴等選 3至初始高 ^缺A ’若辭導體封裝件傳遞裝置祕供f意外中斷 2止運行，、鱗活塞桿藉由經由上覆之氣壓管路8b所供給之氣 ^了降。紐’該等活塞桿壓縮且降低彼等處於較高位置之選 且提升相鄰位置上反方向移動之其餘麵器3。該等選擇 态3以此種方式恢復至其初始高度。 側之SilH3，急狀態下^移動至該等初始位置，則一 擇哭Y二重1之作用而下降。若操作者手動移動該等選 低部分之選觀3可能與另—在下面之物體碰撞， 在itii: #電源恢復後’該等選擇器3可能未精確定位。 在此h形下，不可能正確操作該等選擇器3。 然，，該習用半導體封裝件傳遞裝置具有如下問題。 且會肖隙軸6被固定至該等升降軸2與該等選擇器3， 形下里二於該等消隙軸上。因此，在提升選擇器之情 ί你士 隙之力成為阻力。這使得該等馬達如上之 之門i㈣/，轉升降軸2與轉消軸6不同軸使得兩軸 之間=觀。這進—步使得轉馬達上之㈣增大。 分離，、i適軸2與該等消隙軸6 哭你指5甘、」止以荨&擇為下降且在緊急狀態下使該等選擇 導體封料傳遞裝置之結構 之驅練置之【以大 動該半導體封裝體傳遞裝置 【發明内容】 技術問題 導體係針對上述問題而產生，且本發明提供—種半 同之車 ，其結構簡單，且適合於沿與該等升降軸相 u于侧於料馬達上之貞載降低至最小程度。 200845269 且使其保持在-ii t卜I 止該等選擇器因其自重而下降， 壞之半導體封裝件更回處以便避免對該設備產生任何破 技術解決方案 包括根據-種半導體封裝件傳遞裝置，其 孔；一安裝用於沿該軸導二塾巧之，向 固連至該升降軸，且其藉由該升降軸之垂直運動、高人’其 導向孔之-下端，用以向壓力至該軸 嚙合間隙。门上祕δ亥升降軸之-下端，且防止產生 之整體件，裝置具有一實質上被簡化 擇器之升降軸之下端用以:上擠適等選 ^生任付力矩成為可能’其中該等升降馬達適合於驅動該等升降 電源tif急狀gT (即，供給至辭導體封裝件傳遞裝置之 用而下降μ預trf或更喊（即，其不因受其自重之作 動，則C以楼封裝件傳遞裝置在緊急狀態下移 ^裝置之其他元件碰撞並被破壞。 有利效果 於，’根，發明之該半導體封裝件傳遞裝置之優勢在 、疋大小之氣壓被供給至用於升高該等選擇器之該等升降 200845269 軸之下端，以向上壓縮該等升降軸。如此 降低作用於驅動該等升降軸之該等升降馬達上之J袁嚙; 任何力矩。 、个座生 另外’本發明僅依賴於應用氣壓至該等升降轴之 急情況，而非如先前技藝之實例一樣使用單ί ϋί轴::制動&如此使得該半導體封餅傳遞裝置之整體 結構得以化，且進-步使侧於該等馬達上之負載降低。正體 f 【實施方式】 發明方式 下文將參照該等 現將參照圖2-6 體封裝件傳遞裝置。 附圖彳田述本發明之示例性具體實施例。 描述根據本發明之第一具體實施例之一半導 參照圖2-4，根據本發明之該半導體封裝件傳遞裝置且 向塊10,該導向塊安裝於-半導體封裝件切割與裝卸裝置之: 部’且適合於沿一導向架G水平滑動。200845269 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a semiconductor package for cutting and mounting and packaging (4) a structure for forming - the semiconductor package is cut During the manufacturing process of loading and unloading, the device is mounted on the disc of the unloading device, and the semiconductor package f is dissipated to adsorb the individual semiconductor packages, and the vacuum is generated or unloaded. Position [Prior Art] Throughout the semiconductor package, the semiconductor package is formed by a semiconductor chip of an integrated circuit (for example, p:j::10 is formed in the high-definition) = the resin is molded on the surface of the semiconductor substrate. > is attached to the semi-static/micro-gate array package such as the wrong one. On the surface of the electrical connector T oil body, the semiconductor package is electrically connected to the semiconductor package, and the knives are processed. ^%% of the semiconductors in the process in the cutting: the second half of the drying process: ϊΐΐ 《 ί ί 基本 基本 基本 基本 基本 、 、 、 、 、 、 、 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成 形成The most The semiconductor substrate is called a strip. The twisted 凼竑 凼竑;, ~ 衣衣征 7 Dan 1r 隹琢 中 制 后 后 后 后 ί ί ί ί 74 74 后 后 后 后 后 后 后 后 后 后 后 后 后 后 后 后 后 后 后 在 在 。 在The process, the 'it depends on the semiconductor package is the result, classify the semiconductor package and store it in a disc. According to the private parts, the division (four) listening to the semiconductor package unloading (four) is difficult to use - The semiconductor package is cut and 6 200845269 is given to the strip of π strips, _ $ 谢 呆 呆 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体Block 1 , and wear the white 用 用 用 用 用 用 用 用 用 用 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 丰 水平 水平On the block 1 and suitable for 3: ^ The lifting blocks 5 are raised/lowered by = and are suitable for the same body package. The vacuum is used to absorb the semi-conductor-rack 4a in the vertical direction. Forming the pinion 4b of the hunting-motor 4e rotation and fitting the two racks 4a between -2=2. Therefore: when ^^寺^ is adjacent When rotating, the racks that are in harmony with the pinion 8 are as "by" the horse, and the remaining racks 4a are raised. In other words, the small jaws are lowered, and the selectors 3 are lowered. Also, the transmission of the i-turning ^ wheel ^ is increased. The same is achieved by the generation of the true (9) domain to find the casting body. Similarly, the selectors 3 are raised/declined by the racks 4ai#. However, during the operation of the bar wheel, there will be a 期望 期望 丽 4 4 4 4 4 4 4 4 亥 亥 亥 亥 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 , , , , , , , , , , , , , , , , The system _ _ wheel 6 axis 6 wire is read in the recording block 1 and is suitable for guiding in the _=16' car I. The air pressure of the mosquitoes is supplied to the upper end of the shaft la via the gas line 8a so that the selectors 3 are subjected to a constant direction of the gap. In addition, the wire block i has a plurality of emergency brake cylinders 7, which are tight These piston rods are suitable for vertical sliding, so that in the emergency state, the second one is 200845269. Incorrect, the air pressure side rides high/lower, the ribs are retracted, etc. 3 to the initial height ^ lack of A 'If the conductor package transmission device secret supply f Unexpected interruption 2 stops the operation, and the scale piston rod is lowered by the gas supplied through the overlying pneumatic line 8b. The piston rods compress and lower their choice of higher position and raise the remaining face 3 of the opposite position in the opposite direction. These selection states 3 return to their original height in this manner. On the side of SilH3, moving to the initial position in the emergency state, the effect of crying Y double 1 is lowered. If the operator manually moves the selection of the lower portion of the selection 3 may collide with another object below, after the itii: #power recovery, the selector 3 may not be accurately positioned. Under this h shape, it is impossible to operate the selectors 3 correctly. However, the conventional semiconductor package transfer device has the following problems. And the clearance shaft 6 is fixed to the lifting shaft 2 and the selectors 3, and is formed on the anti-backlash shafts. Therefore, in the case of improving the selector, the force of yours becomes a resistance. This causes the motors to be gated i(4)/, and the axis of the lift shaft 2 and the cancel shaft 6 are different so that the two axes are between. This advancement causes the (four) on the motor to increase. Separate, i fit the shaft 2 and the anti-backlash axis 6 crying you mean 5, "stop" and select the lowering and in the emergency state to make the structure of the selected conductor sealing device transfer [Inventive content] The technical problem guiding system is generated in response to the above problems, and the present invention provides a vehicle of the same type, which has a simple structure and is suitable for being along with the lifting shafts. The load on the side feed motor is reduced to a minimum. 200845269 and keep it at -ii t I stop the selectors due to their own weight, the bad semiconductor package is more back in order to avoid any technical solution to the device including the semiconductor package transfer device a hole; a mounting for guiding along the axis, fixed to the lifting shaft, and by the vertical movement of the lifting shaft, the high man's guiding hole - the lower end, for the pressure The gap is engaged to the shaft. On the door, the lower end of the lifting axis, and the prevention of the resulting integral part, the device has a lower end of the lifting shaft which is substantially simplified for the purpose of: the upper extrusion is suitable for the selection of the torque. The hoisting motor is adapted to drive the lifting power supply tif urgency gT (ie, to supply the singular conductor package transfer device for decreasing the pre-trf or shouting (ie, it is not operated by its own weight, then C The floor package transfer device collides and is destroyed by other components of the device in an emergency state. Advantageous effects, the root of the invention, the semiconductor package transfer device has the advantage that the gas pressure of the crucible is supplied to the rise The selectors of the lifter lift the lower end of the 200845269 shaft to compress the lift shaft upwards. This reduces the J-yuan engagement on the lift motors that drive the lift shafts; any torque. The present invention relies only on the application of air pressure to the emergency of the lifting shafts, rather than using a single shaft as in the prior art example:: Braking & thus making the overall structure of the semiconductor sealing device In order to reduce the load on the motors, the positive body f. [Embodiment] Hereinafter, reference will be made to the present invention with reference to the body package transfer device of Fig. 2-6. Exemplary Embodiments of the Invention. One half of a first embodiment of the present invention is described. Referring to Figures 2-4, the semiconductor package transfer device according to the present invention is directed to a block 10 that is mounted to a semiconductor package. The cutting and handling device of the piece: is 'and adapted to slide horizontally along a guide frame G.
該基座墊塊10具有複數個（在此具體實施例巾為8個）沿垂 直方向延伸之軸導向孔11。升降軸20安裝於各個軸導向孔n内， 且適合於齡職。該特_ 20藉由分別安裝於該等軸導向孔 11之該社部分與下部分上之導向絲22狀，同時亦能垂直滑 動。該等升降軸20之上部分延伸經過該等軸導向孔 自該基座墊塊10伸出。 ％ 該等升降軸20具有若干齒條41，該等齒條41分別與若干小 齒輪42嚙合，故該等齒條41藉由該等小齒輪42之轉動而上升或 下降，該等小齒輪42藉由安裝於該基座墊塊1〇後之升降馬達43 轉動。 該基座墊塊10具有複數個選擇器30，該等選擇器3〇安裝於 各個升降轴20前部且適合於垂直移動以藉由產生真空而吸附一半 導體封裝件。每一選擇器30包括··可旋轉墊塊31a與31b，其分 10 200845269 墊塊3!a與仙，同時能各個可旋轉之 ir;rr.r33 ϊΐίίί T2二附二半产封襄件;及-連接構件35，其連接 =r=ssr”，:整體。 體實施例中為4個）選擇哭旋榦馬、*之上心。複數個（此具 至該基座塾塊10 輪47 一起被連接 ί;二=動=力；=，輪47藉由該選擇器旋Ϊ 3〇-預定角度。 、“ 48同日令繞該垂直軸轉動兩選擇器 呈有^中未顯不’每—選擇器3G之該滚珠花鍵32 ===、ΪΓί轉塾塊31a與31b内且沿該垂直二 滑動。因此，當該等升祕？n、iL域’而僅能在該垂直方向 32相對於該等可旋轉墊塊3la旬+ 該㈣珠花鍵 以把加轉力至該等滾珠花鍵32時 動 4基座墊塊1〇具有一形成於其下 丘^ ；10 、向孔1之^亥下鳊之一側相通。一氣壓營路51 ζ： 該氣壓供給孔52之—端部，-供給狀ί力;巧連接i 吸入構件55被固聯至每一輛導向孔以： 200845269 詳細如圖5所示，每一氣壓吸入構件55具有一空心 下端***該空心體55a且能垂直滑動，且複數個 ΐ導之空氣能流進該體故内。儘管已假定在本ϋ ^列中四個通氣孔5外以90。之間隔形成於圓周方向上二 孔之數里與間隔角度可根據需要變化。 兮辨^體，空心部分之直徑稍大於該等升降軸2G之直徑，以便 =祝之_圓周表面與該升降軸20之該外表面之間存在微， nr 第一密封構件56安裝於每一氣壓吸入構件55之 下’且；丨於该氣壓吸入構件55之該外圓m矣；纟 _ 之該内圓周表面之間，用以維持周表面與_導向孔11 # 一，佳地，每一下導向襯套22同樣具有一安裝於1 第一岔封構件57，用以防止空、’、 哀玄· 20間之間軸漏。万止工H亥知向孔11與該升降軸 上述構造之該半導體封裝件傳遞裝置之操作。 田預疋控制k號施加至該等升降馬達43以传士 ^純與該等小齒輪42互相_，故該等升降望S =垂 ^爾降㈣__，選 每一巧吸入構件55之該體55a内。、、·工由遠通軋孔55b流進 55a内日t每一氣壓吸入構件55之該體 該等升降轴20之該等齒#41=^^!向上之作用力。因而驅動 此而防止任㈣合^ #輪2之讀此相互作用。由 藉由空氣流進該等氣壓吸入構件55使得該等升降轴2〇受到 12 200845269 向上之壓力作用之優勢同樣在於，當該等升降轴2 而向上移動時，該等升降馬達43上之負載減輕。重力作用 之空氣齡卩使錢急情況下(即， t厂封裝件傳遞裝置之電源意外中 ^卩 位置。緊Ϊ情況里〇。一起向上移動至一預定The susceptor pad 10 has a plurality of shaft guide holes 11 extending in the vertical direction (eight in this embodiment). The lifting shaft 20 is mounted in each of the shaft guiding holes n and is suitable for the aged. The _20 is also vertically slidable by being mounted on the guide wire 22 on the body portion and the lower portion of the isometric guide hole 11, respectively. The upper portion of the elevating shaft 20 extends through the equiaxed guide holes from the susceptor pad 10. The lifting shafts 20 have a plurality of racks 41 that are respectively meshed with the plurality of pinion gears 42 so that the racks 41 are raised or lowered by the rotation of the pinion gears 42. The pinion gears 42 The lift motor 43 mounted on the base block 1 turns. The susceptor pad 10 has a plurality of selectors 30 mounted to the front of each of the hoisting shafts 20 and adapted to move vertically to absorb half of the conductor package by creating a vacuum. Each of the selectors 30 includes a rotatable pad 31a and 31b, which is divided into 10 200845269 pads 3!a and sac, and can be rotated ir; rr.r33 ϊΐ ί ί ί ί; And - the connecting member 35, the connection = r = ssr",: the whole body. In the embodiment, the four are selected to be a crying dry horse, * the upper heart. A plurality of (this is to the base block 10 rounds 47 Connected together ί; two = motion = force; =, wheel 47 is rotated by the selector 3 〇 - predetermined angle. , " 48 same day rotation around the vertical axis of the two selectors have ^ not shown" - the ball spline 32 of the selector 3G ===, ΪΓί rotates within the blocks 31a and 31b and slides along the vertical two. Therefore, when the lifts n, iL domain 'only in the vertical direction 32 Relative to the rotatable spacers 3a + the (four) bead splines to apply the rotation force to the ball splines 32, the movement of the pedestal block 1 〇 has a formation formed in the lower abutment ^ 10, the hole One of the two sides of the 亥Hui 相 。 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一: 200845269 Details As shown in FIG. 5, each of the air pressure suction members 55 has a hollow lower end inserted into the hollow body 55a and can slide vertically, and a plurality of air conduction gases can flow into the body. Although it has been assumed in the present column The four venting holes 5 are formed at intervals of 90. The number of the two holes in the circumferential direction and the interval angle can be changed as needed. The diameter of the hollow portion is slightly larger than the diameter of the lifting shaft 2G, so that = n. There is a micro between the circumferential surface and the outer surface of the lifting shaft 20, nr the first sealing member 56 is mounted under each of the air pressure suction members 55'; and the outer circumference of the air pressure suction member 55 Between the inner circumferential surfaces of the 纟 用以 _ to maintain the circumferential surface and the _ guiding hole 11 #1, preferably, each lower guiding bushing 22 also has a first sealing member 57 mounted thereon for Preventing the leakage of air, ', 玄 · · 20 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 轴 轴The hoist motor 43 is yed with the pinion 42 and the pinion 42 is _, so the liter Looking down S = drop (4) __, selecting the body 55a of each of the suction members 55., the work flows from the far-passing hole 55b into the body 55a, the body of each of the air pressure suction members 55 The upward force of the teeth #41=^^! of the lifting shaft 20 is thus driven to prevent the reading of the interaction of any of the four wheels. This is caused by the air flowing into the air pressure inhaling members 55. The advantage of the lifting shaft 2〇 being subjected to the upward pressure of 12 200845269 is also that the load on the lifting motor 43 is reduced when the lifting shaft 2 is moved upward. The air age of gravity makes the money urgent (ie, the power supply of the t-package transmission device is unexpectedly in the position of the power supply. Close to the situation. Move up to a predetermined order together)
在根據本發明之該半導體封裝件傳遞裝置摔作期Η ί f給至該等升降軸2G之該等下端，故任何嗜L 結果’無力一肅降 3〇 裝置防止該等 具有若干聯該t導體封裝件傳遞裝置 55，以便氣壓被供給至談^之^下端之獨立壓力吸入構件 該等升降軸2〇。麸1 μ、軋^吸入構件55之内側，以向上擠壓 擠壓該等升降輛2〇、。A = 吏 =單^之氣壓吸入構件同樣可能向上 等下端被關閉ί與該舉例言之，該等柚導向孔Η之該 軸導向孔11之該等^Α形成一體’以便空氣可經由該等 圖7盥8 _ 用以向上擠塵該等升降軸20。 傳遞5置Γ_剌之另—具财_之半導體封穿件 封裝件傳狀娜該第—具财_之半導體 至該€降|^〇之之差異在於’根驗者，施加氣麼 緊急=^氣雜；同^生差响異合間隙。其用於處理 、疋^之根據該第二具體實施例，該等軸導向孔讥之該 13 200845269 口等軸導向孔 另外，該基座墊 ====== -氣塵供仏孔' / 隙乳祕給营路152與各個第 矾it、、、、口孔151之一側相連，用於以一預定壓力供妗处 在該半導贿餅傳魏置正轉行_繼鱗料ϋ之 下端。 部八if ΐ供給iL 15土形成於該等軸導向孔11之該等最低 二:/…相通。一緊急氣壓供給管路154連接至該基座墊塊 = ^在緊急情況下經由該等第二氣壓供給孔153供給 預疋Μ力之空氣。 卡古=活基mi裝於該等轴導向孔U之該等下端内且適合於 動。該等活塞155藉由經由該等第二氣壓供給孔153供给 之氣壓而向上移動，用以擠壓該等升降軸2G之該等下端。〜 根據本發明之該第二具體實施例之該半導體 2下方式運轉:當該裝置正常運行時，一預定大小 U嗜合間隙氣壓管路152供給，用以向上擠壓該等升降轴2由〇 之该等下端。藉此防止產生嚙合間隙。 + 緊急情況下，即，若該半導體封裝件傳遞裝置由於意外之 电源中斷而停止運行，則經由該消除嗜合間隙氣壓管路⑸ ^供給中斷。然、後，經由該緊急氣壓管路154與該等第二氣壓二 =孔153供給-預定壓力之空氣至該等軸導向孔u之該等最低^ 为。然後該等活塞155上升且擠壓該等升降軸2〇之下部分。 防止該等升㈣20與難錢等升降轴2()之鱗麵哭％下曰 时如圖8所示’本發明之該第二具體實施例同樣主張每摆 ，30之該吸附喷嘴構件133包括一噴嘴失持器1331鱼一適 易於附聯至該喷嘴夾持器1331及自該噴嘴夾持器1331分開^ =噴嘴1332。從而使得用-與該型半導體封裝件—致之吸附 替換該吸附喷嘴1332成為可能。 H h 14 200845269 更特定言之，一滑動構件1334安裝於該喰喈杰拄哭> ***/釋放凹槽1333外側，以便垂直滑ς 讀嘴_1331之該外表二二=In the semiconductor package transfer device according to the present invention, the lower end of the lifting shaft 2G is given to the lower end of the lifting shaft 2G, so that any of the L-results is incapable of reducing the 3〇 device to prevent the plurality of devices from being connected. The conductor package transfer device 55 is provided so that the air pressure is supplied to the independent pressure suction members of the lower end of the talker. The bran 1 μ, the inner side of the suction member 55, is pressed upward to press the lifting device 2〇. A = 吏 = single ^ air pressure suction member may also be closed up and down the lower end ί and, for example, the other of the shaft guiding holes 11 of the pomelo guiding hole 11 are integrated to allow air to pass through Figure 7盥8 _ is used to squeeze the lifting shafts 20 upwards. Passing 5 sets Γ 剌 另 — 具 _ 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体=^ 气杂; Same as the difference between the difference and the difference. According to the second embodiment, the 13 200845269 port equiaxed guide hole of the isometric guide hole is additionally, the base pad ====== - dust supply hole / 隙 秘 给 给 营 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 152 Lower end. The portion of the IF 15 ΐ supply iL 15 is formed at the lowest of the equiaxed guide holes 11: /. An emergency air pressure supply line 154 is connected to the base block = ^ in the event of an emergency, the pre-compressed air is supplied via the second air pressure supply holes 153. The Kako = live base mi is mounted in the lower ends of the isometric guide holes U and is adapted to move. The pistons 155 are moved upward by the air pressure supplied through the second air pressure supply holes 153 for pressing the lower ends of the lift shafts 2G. ~ The semiconductor 2 according to the second embodiment of the present invention operates in a lower mode: when the device is in normal operation, a predetermined size U-adjoining gap air line 152 is supplied for upwardly pressing the lifting shaft 2 These are the lower ends. Thereby preventing the engagement gap from being generated. + In an emergency, that is, if the semiconductor package transfer device is stopped due to an unexpected power interruption, the supply is interrupted via the elimination of the insufficiency gap gas line (5). Then, the lowest pressure of the air of the predetermined pressure is supplied to the equiaxed guide hole u via the emergency air pressure line 154 and the second air pressure two holes 153. The pistons 155 then rise and squeeze the lower portions of the lifting shafts 2〇. Preventing the rise (4) 20 and the difficulty of the lifting shaft 2 () of the scale surface crying % squatting as shown in FIG. 8 'The second embodiment of the present invention also claims that each pendulum, 30 of the adsorption nozzle member 133 includes A nozzle drop holder 1331 is adapted to be attached to the nozzle holder 1331 and separated from the nozzle holder 1331 by a nozzle 1332. Thereby, it becomes possible to replace the adsorption nozzle 1332 with the adsorption of the type semiconductor package. H h 14 200845269 More specifically, a sliding member 1334 is attached to the outer side of the insertion/release groove 1333 so as to vertically slide the reading nozzle _1331 to the outer surface.
滾珠1336安細_持器S 槽1333之該内曰/外/側Γ月彳件1334接觸而偏置至該***/釋放凹 部分ΪΪυ^332具有—沿圓周方向形成紗外81周表面之- 便言 1等穿珠lSd7产其被***該***/釋放凹槽1333内，以 ίί I與被支撐之該等支標凹槽郎#。 兮、典如播i虽S亥吸附嘴嘴1332被輕合至該喷嘴夾持哭1331日士 ir::插上 吸入該吸附喷嘴⑽之該支 ^ ^^珠1f6被部分地 該喷嘴夾持器133卜克按叫1337内’然後其剛性固定至 13—•，且易於自該喷以=:卿 工業應用 用於S;it”體封裝件之裝半導體 實施例，熟據j發】之若干示例性具體 Ξ範=本發明之：=¾ 200845269 【圖式簡單說明】 藉由以上之詳細描述並結合該箄 目標、特點與優勢將更顯而易見。，谓，本發明之前述與其他 面圖圖1為顯示-爾導體封裝件傳遞裝置之主要部分之橫截 圖2為顯示根據本發明之—且辦每 遞裝置結構之正視圖； 一體只轭例之一半導體封裝件傳 分之^戴ίΐίΙ ;2中所不之辨㈣封裝件傳遞裝置之主要部 圖；圖4為圖2情示之該半導體雖件傳遞裝置之賊面側視 中所示之該部分A之放大視圖； 該簡器已姻繼在緊急情況下 圖7與8係顯示根據木私明 遞裝置結構之__視^之另―具體實施例之—半導體傳 【主要元件符號說明】 基座墊塊 消隙軸導向孔 升降軸 選擇器 齒條 小齒輪 馬達 升降塊 消隙輛 緊急制動汽缸 氣壓管路 la 2 3 4a 4b 4c 5 6 7 8a 16 200845269 8b 氣壓管路 10 導向塊（基座墊塊） 11 轴導向孔 20 滑動轴（升降轴） 22 導向襯套 30 選擇器 31a 可旋轉墊塊 31b 可旋轉墊塊 32 空心滾珠花鍵 33 吸附喷嘴構件 35 連接構件 41 齒條 42 小齒輪 43 升降馬達 45 選擇器旋轉馬達 46 從動輪 47 驅動輪 48 動力傳遞帶 51 氣壓管路 52 氣壓供給孔 55 氣壓吸入構件 55a 空心體 55b 通氣孔 56 Ο環型第一密封構件 57 Ο環型第二密封構件 133 吸附喷嘴構件 151 第一氣壓供給孔 152 消除嚙合間隙氣壓供給管路 153 第二氣壓供給孔 17 200845269 154 緊急氣壓管路 155 活塞 1331 喷嘴夾持器 1332 吸附喷嘴 1333 ***/釋放凹槽 1334 滑動構件 1335 彈簧 1336 滾珠 1337 支撐凹槽The inner/outer/side lunar element 1334 of the ball 1336 is held to be offset to the insertion/release recess ΪΪυ 332 having a circumferential surface forming an outer surface of the yarn 81. In the case of the 1st, the bead lSd7 is inserted into the insertion/release groove 1333 to be supported by the yoke.兮, 典如播i Although the S Hai adsorption nozzle 1332 is lightly coupled to the nozzle to hold the crying 1331 ir:: insert the suction nozzle (10) into the nozzle ^ ^ ^ beads 1f6 is partially held by the nozzle 133b is called 1337' and then its rigidity is fixed to 13-•, and it is easy to spray from it=: Qing industrial application for S; it" body package semiconductor embodiment, familiar with j BRIEF DESCRIPTION OF THE DRAWINGS The present invention is based on the above detailed description and in conjunction with the objects, features and advantages of the present invention. 1 is a cross-sectional view showing a main portion of a transfer device for a conductor package, and FIG. 2 is a front view showing the structure of a transfer device according to the present invention; (2) a main part of the package transfer device; FIG. 4 is an enlarged view of the portion A shown in the side view of the thief of the semiconductor transfer device of FIG. 2; In the case of an emergency, Figures 7 and 8 show the delivery according to Mu Qianming. Structure __视^ Another embodiment--Semiconductor transmission [main component symbol description] pedestal pad anti-backlash axis guide hole lifting shaft selector rack pinion motor lifting block anti-backlash emergency brake cylinder air pressure tube Road la 2 3 4a 4b 4c 5 6 7 8a 16 200845269 8b Pneumatic line 10 Guide block (base block) 11 Shaft guide hole 20 Slide shaft (lift shaft) 22 Guide bush 30 selector 31a Rotatable block 31b Rotatable block 32 Hollow ball spline 33 Adsorption nozzle member 35 Connection member 41 Rack 42 Pinion 43 Elevator motor 45 Selector rotation motor 46 Drive wheel 47 Drive wheel 48 Power transmission belt 51 Air line 52 Air supply hole 55 Air pressure Suction member 55a Hollow body 55b Vent hole 56 Ring type first seal member 57 Ring type second seal member 133 Adsorption nozzle member 151 First air pressure supply hole 152 Elimination of meshing gap Air pressure supply line 153 Second air pressure supply hole 17 200845269 154 Emergency air line 155 Piston 1331 Nozzle holder 1332 Adsorption nozzle 1333 Insertion/release groove 1334 Sliding member 1335 Spring 1336 Pearl 1337 support groove