200842560 • 九、發明說明： ’【發明所屬之技術領域】 ^ 本发明涉及一種散热模组，特别係指一種对电子元器 • 件散热之散热模组。 【先前技術】 如今，在電腦產業中，為將微處理晶片等發熱電子元 件產生之熱量有效散發，通常採用方法係將散熱裝置緊密 ^ 地貼設於發熱電子元件溢熱表面，以協助發熱電子元件散 熱，保證發熱電子元件在適當溫度下運作。 如圖1所示，中國大陸專利申請第200320103941.5號揭 示一種散熱模組，該散熱模組在底座100上方一定間距處設 有一鰭片組120，鰭片組120與底座100間通過複數“U”形 熱管130相連接。該鰭片組120由複數與底座100平行之散熱 鰭片彼此間隔堆疊形成，進而形成複數與底座100平行之氣 流通道，該籍片組12 0兩侧分別設置一轴流風扇110，風扇 x 110為一吹一吸式構造。該散熱模組工作時，底座100所吸 收之熱量借助熱管130傳至鰭片組120，再籍由氣流將熱量 帶出。由於底座100始終係熱量累積之高溫區，但風扇110 所產生之氣流並未直接流經底座100及其周圍，故高溫區之 熱量基本都有賴於熱管130之傳導，而若能直接對底座100 散熱，則會使散熱效率大幅度提升。而前述專利中二風扇 110產生之氣流處於同一直線上，大部分氣流沒有充分吸收 鰭片之熱量便被風扇100快速吸出至外部，風扇110氣流之 7 200842560 表面與基座1〇〇平行，亦影響鰭片 散熱效率仍有較大提升空間。 利用率較低；另外，韓片 之自然對流。綜上可見， 【發明内容】200842560 • Nine, invention description: ‘[Technical field to which the invention belongs] ^ The present invention relates to a heat dissipation module, and in particular to a heat dissipation module for dissipating heat from an electronic component. [Prior Art] Nowadays, in the computer industry, in order to effectively dissipate heat generated by heat-generating electronic components such as micro-processed wafers, a heat-dissipating device is closely attached to the heat-dissipating surface of the heat-generating electronic component to assist the heat-generating electrons. The components dissipate heat to ensure that the hot electronic components operate at the proper temperature. As shown in FIG. 1 , the Chinese Patent Application No. 200320103941.5 discloses a heat dissipation module. The heat dissipation module is provided with a fin group 120 at a certain interval above the base 100, and the plurality of "U" are passed between the fin group 120 and the base 100. The heat pipes 130 are connected. The fin group 120 is formed by stacking a plurality of heat dissipating fins parallel to the base 100, and forming a plurality of airflow channels parallel to the base 100. An axial fan 110 is disposed on each side of the chip group 120, and the fan x 110 is disposed. It is a blow-and-suction configuration. When the heat dissipation module is in operation, the heat absorbed by the base 100 is transmitted to the fin set 120 via the heat pipe 130, and the heat is taken out by the air flow. Since the base 100 is always a high temperature zone in which heat is accumulated, the airflow generated by the fan 110 does not directly flow through the base 100 and its surroundings, so the heat in the high temperature zone basically depends on the conduction of the heat pipe 130, and if the base 100 is directly Heat dissipation will greatly improve the heat dissipation efficiency. In the foregoing patent, the airflow generated by the two fans 110 is on the same straight line, and most of the airflow is not sufficiently absorbed by the heat of the fins, and is quickly sucked out to the outside by the fan 100. The surface of the airflow of the fan 110 is 2008 parallel and the surface of the base is parallel to the base. There is still much room for improvement in the efficiency of fin heat dissipation. The utilization rate is low; in addition, the natural convection of Korean films. In summary, [invention content]
有鑒於此，有必要括I -種散熱模組，用於電：元=率較高之散熱模組。 數相互間隔排列之散熱鰭片組成：:文:’其包括-由複 鰭片間形成複數氣流通道，㈣1片：二4等散熱 之兩側分別設有第—和第- 、/、巩机通迢相通 傾斜，且氣流口均朝向=件該Ϊ一和第二風扇相對 穿過第-韓片組吹向電子元哭二弟：風扇產生之氣流 “子元器件並經由第一鰭片組排出。 抽 :習：技術相比’本發明第—風扇之氣流口朝 兀阳件’其所產生之H户 开哭杜古a /X L可牙過弟一鰭片組直接吹向電子 〆Q *而使電子兀器件附近之高溫區獲得充分之 放熱；第二風扇之氣流口亦朝向電子元器件 =離電子元器件並穿過第組排出，由於二風^ 方向不處於同一直線’使氣流在氣流通道中產生柃 ^可充刀與散熱籍片換熱，從而提高散熱模組之散熱二 【實施方式】 本發明第—實施例散熱模組係用於安裝在中央處理器 圖未不）等發熱電子元器件上以對其進行散熱。 請參閱圖2至圖4，示出本發明的第一實施例之散熱模 200842560 ’ 組10。該散熱模組10包括一導熱基座50、一以一定間距設 ， 置於導熱基座50上方之第一鰭片組30、複數連接第一鰭片 組30和導熱基座50之熱管40、以及分別設置於第一鰭片組 30兩側且相對傾斜之第一風扇20和第二風扇22。 導熱基座50大致呈方形，其底面向下延伸形成一大致 呈方形之凸塊52，該凸塊52下表面521用於和發熱電子元器 件相接觸；導熱基座50上表面51中央處與其一侧面平行延 伸有一凸肋54，該凸肋54截面為矩形，其兩側分別平行設 有二長條狀凹槽53，用於容置熱管40 ;該導熱基座50靠近 四角處設有四螺孔55，用於安裝扣具（圖未示）。 第一散熱鰭片組30由複數散熱鰭片32相互間隔排列組 成，該等散熱鰭片32相對於導熱基座50垂直設置，其由高 導熱係數的銅、鋁等金屬片所製成。每一散熱鰭片32具有 一上緣320、一寬度大於上緣320之下緣322、以及分別與上 緣320和下緣322連接並左右對稱之二斜侧緣321、323。每 ' 一散熱鰭片32之上緣320為波浪形，具有二波谷及位於二波 谷間之一波峰；下緣322具有二弧形凸緣及位於二弧形凸緣 間之一較小直緣，該直緣垂直彎折延伸出第一折邊324 ;二 斜側緣321、323靠近上下緣320、322部分分別與第一折邊 324同向垂直彎折延伸出第二折邊325和第三折邊327。每一 散熱鰭片32表面靠近斜側緣321、323位置設有左右對稱之 四圓形通孔326，通孔326内緣與第一折邊324同向垂直彎折 延伸出一環形結合邊328，用於供熱管40結合。上述各折邊 324、325、327均具有卡扣結構（圖未示），複數散熱鰭片 9 200842560 ♦ 32通過卡扣結構相互扣合，形成第一鰭片組30。散熱鰭片 ，32間均為平行間隔設置，形成在散熱鰭片32四緣處均敞開 之氣流通道，且每一鰭片32之第二及第三折邊325、327組 合形成第一斜側面34和第二斜側面36，該二斜側面34、36 與發熱電子元器件所處平面所形成之内角均為銳角。 如圖4所示，該第一鰭片組30設置於導熱基座50上方， 散熱鰭片32下緣322與導熱基座50上表面51具有一定間 距，且散熱鰭片32與導熱基座50上表面51垂直。導熱基座 50和第一鰭片組30通過上述四熱管40相連接，每一熱管40 大致呈“匚”形，其具有相互平行之一冷凝段41和一蒸發 段42，以及連接二者之一彎折段43。其冷凝段41穿設於每 一散熱鰭片32通孔326中，蒸發段42嵌入於導熱基座50相應 之凹槽53内。 如圖5所示，第一風扇20和第二風扇22均為軸流風扇， 其中第一風扇20安裝於第一斜側面34上，由於第一斜侧面 > 34與發熱電子元器件所處平面形成之内角為銳角，故第一 風扇20將外部空氣吹入第一鰭片組30後，部分空氣穿過散 熱鰭片32下緣322直接流至導熱基座50上表面51 ;第二風扇 22安裝於第二斜侧面36上，其將已吸收熱量之空氣由第一 鰭片組30抽出至散熱模組10外部。與習知技術相比，由於 第一風扇20和第二風扇22之氣流口均朝向電子元器件，氣 流可直接吹向及抽離導熱基座50，使導熱基座50較高溫區 獲得充分氣流散熱，並且還可幫助導熱基座50周圍之其他 電子元器件（圖未示）散熱；同時，由於二風扇20、22之 10 200842560 氣方向不處於同一直後，而θ 2〇、22之輻㈣卜H疋均位於導熱基㈣至風扇 加充分與散熱鰭片32^Γ=高通 擾流，可更 扇22===:二了，二風 曰登^ ^ 办成之内角一般為45度， :弟-：扇2_圖未示)之轴線與第二風扇2_圖 未不)之轴線所形成内角呈9〇度，同時，依據不同之需求， 一抽線所形成之内角還可在⑽度至⑽度間變化。 / \ 如圖6所不，為本發明第二實施例。其與第一實施例區 別在於：在導熱基座5_向第—鰭片組如之表面加裝一第 二鰭片組6G’以增加散熱面積。第二鰭片請與導熱基座 50a通過;^接方式結合’且該第二鰭片組财散熱鰭片間形 成之氣流通道與第—鰭片組财之氣流通道直接相通。導 熱基座50a上表面51a之凹槽仏截面為矩形，複數熱管術 具有相應截面形狀之蒸發段42a，其完全容置於凹槽 内，仗而提供一平坦之表面供第二鰭片組6〇緊密結合，使 導熱基座50a之部分熱量通過該第二鰭片組6〇散發至周圍 空氣中。 可以理解地’還可通過其他方式來增加散熱面積，如 使散熱鰭片下緣延伸至導熱基座上表面。 如圖7所示，為本發明之第三實施例。其與第一實施例 之Εέ別在於·政熱縫片3 2b表面大致為矩形，其兩侧分別設 置一獨立支架212、214，二支架212、214具有一垂直侧面 11 200842560 -及與之相對之-斜側面，垂直側面與第—鰭片組—相應侧 •面結合，其設有一開口供氣流通過；斜側面用於安裝相應 之風扇20、22，其亦設有一供氣流通過之開口。可通過支 架212、214靈活調節風扇20、22之氣流方向以滿足不同之 需求。 如圖8所*，為本發明之第四實施例。其與第一實施例 之區別在於：散熱鰭片32c氣流通道入口之_斜側緣现為 f凹弧形，使第-籍片組30c和第—風扇2〇間形成一氣流緩衝 區，從而降低工作之噪音。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之中請專利範圍。舉凡熟悉本案技藝 ^士援依本發明之精神所作之等效修飾或變化，皆應涵 風於以下申請專利範圍内。 【圖式簡單說明】 圖1係一習知散熱模組之示意圖。 圖2係本發明第—實施例散熱模组之立體組合圖。 解圖圖3係本發明第一實施例散熱模組未含風扇之立體分 圖。圖4係本發明第一實施例散熱模組未含風扇之左側視 圖5係本發明第—實施例散熱模組之氣流走向圖。 圖6係本發明第二實施例散熱模組之剖面圖。 12 200842560 、 圖7係本發明第三實施例散熱模組之剖面圖。 • 圖8係本發明第四實施例散熱模組之剖面及氣流走向 圖。 【主要元件符號說明】 (本發明） 散熱模組 10 第一風扇 20 第二風扇 22 第一鰭片組 30,30b，30c 散熱鰭片 32,32b，32c 上緣 320 下緣 322 斜側緣 321，323,323c 第一折邊 324 第二折邊 325 第三折邊 327 通孔 326 環形結合邊 328 第一斜侧面 34 第二斜側面 36 敎管 40,40a 冷凝段 41 蒸發段 42,42a 彎折段 43 導熱基座 50,50a Jl ® 51，51a 下表面 52 凹槽 53,53a 凸肋 54 螺孔 55 支架 212,214 (習知） 底座 100 風扇 110 鰭片組 120 敎管 130 13In view of this, it is necessary to include an I-type heat-dissipating module for a heat-dissipating module having a higher electric power rate. The number of heat-dissipating fins arranged at intervals is:: text: 'It includes - a plurality of airflow channels are formed between the composite fins, (4) 1 piece: 2, 4, etc., the first and the second, respectively, the -, /, the Gongji wanted The airflow ports are oriented toward each other and the second fan is relatively traversed through the first-horizontal group to the electronic element crying brother: the airflow generated by the fan is "sub-components and discharged through the first fin group. Pumping: Xi: The technology compared to the 'the first fan of the invention - the airflow port of the fan toward the Xiangyang piece', the H-home opened crying Dugu a / XL can be beaten directly to the electronic 〆Q * The high temperature region near the electronic germanium device is fully exothermic; the air flow port of the second fan is also directed toward the electronic component = the electronic component is discharged through the first group, and the airflow is in the airflow because the two wind directions are not in the same line The heat exchange between the heat sink and the heat sink is generated in the channel, thereby improving the heat dissipation of the heat dissipation module. [Embodiment] The heat dissipation module of the first embodiment of the present invention is used for mounting the heat in the central processing unit. Dissipate heat on electronic components. Referring to FIG. 2 to FIG. 4, a heat dissipating mold 200842560' is set in the first embodiment of the present invention. The heat dissipating module 10 includes a heat conducting base 50 disposed at a certain distance and placed above the heat conducting base 50. The first fin set 30, the plurality of heat pipes 40 connecting the first fin set 30 and the heat conducting base 50, and the first fan 20 and the second fan 22 respectively disposed on opposite sides of the first fin set 30 and relatively inclined. The heat-conducting base 50 has a substantially square shape, and a bottom surface thereof extends downward to form a substantially square projection 52. The lower surface 521 of the projection 52 is for contacting the heat-generating electronic component; the central portion of the upper surface 51 of the heat-conductive base 50 is A rib 54 is extended in parallel with a side surface. The rib 54 has a rectangular cross section, and two long strips 53 are respectively arranged in parallel on the two sides for receiving the heat pipe 40. The heat conducting base 50 is provided near the four corners. a screw hole 55 for mounting a buckle (not shown). The first heat dissipation fin group 30 is composed of a plurality of heat dissipation fins 32 arranged at a distance from each other, and the heat dissipation fins 32 are vertically disposed with respect to the heat conduction base 50. Made of metal sheets such as copper and aluminum with high thermal conductivity. Each fin 32 has an upper edge 320, a lower edge 322 having a width greater than the upper edge 320, and two oblique side edges 321 and 323 respectively connected to the upper edge 320 and the lower edge 322 and bilaterally symmetric. Each of the heat dissipation fins 32 The edge 320 is wavy, has two troughs and one peak between the two troughs; the lower edge 322 has two curved flanges and one of the smaller straight edges between the two curved flanges, the straight edges are bent vertically The first bead 324; the two slanting edges 321 and 323 are bent perpendicularly to the first hem 324 to extend the second hem 325 and the third hem 327 respectively. A circular circular through hole 326 is formed on the surface of the sheet 32 near the oblique side edges 321 and 323. The inner edge of the through hole 326 is bent perpendicularly with the first folded edge 324 to form an annular joint edge 328 for The heat pipes 40 are combined. Each of the hem 324, 325, and 327 has a snap-fit structure (not shown), and the plurality of heat-dissipating fins 9 200842560 ♦ 32 are fastened to each other by a snap-fit structure to form the first fin set 30. The heat dissipating fins are arranged in parallel at intervals, and the air flow passages are formed at the four edges of the heat dissipation fins 32, and the second and third flanges 325 and 327 of each fin 32 are combined to form the first oblique side. 34 and the second oblique side surface 36, the inner angle formed by the planes of the two oblique sides 34, 36 and the heat generating electronic component are both acute angles. As shown in FIG. 4 , the first fin set 30 is disposed above the heat conductive base 50 , and the lower edge 322 of the heat dissipation fin 32 has a certain distance from the upper surface 51 of the heat conductive base 50 , and the heat dissipation fins 32 and the heat dissipation base 50 . The upper surface 51 is vertical. The heat conducting base 50 and the first fin set 30 are connected by the above four heat pipes 40. Each heat pipe 40 has a substantially "匚" shape, and has one condensation section 41 and an evaporation section 42 parallel to each other, and connects the two. A bent section 43. The condensation section 41 is disposed in the through hole 326 of each of the heat dissipation fins 32, and the evaporation section 42 is embedded in the corresponding groove 53 of the heat conduction base 50. As shown in FIG. 5, the first fan 20 and the second fan 22 are both axial fans, wherein the first fan 20 is mounted on the first inclined side surface 34, because the first oblique side surface > 34 and the heat generating electronic component are located The inner angle formed by the plane is an acute angle. Therefore, after the first fan 20 blows outside air into the first fin group 30, part of the air flows directly through the lower edge 322 of the heat dissipation fin 32 to the upper surface 51 of the heat conduction base 50; the second fan The second 22 is mounted on the second inclined side surface 36, and the air that has absorbed heat is extracted from the first fin set 30 to the outside of the heat dissipation module 10. Compared with the prior art, since the airflow ports of the first fan 20 and the second fan 22 are all facing the electronic components, the airflow can be directly blown and pulled away from the heat conduction base 50, so that the heat conduction base 50 obtains a sufficient airflow in a higher temperature zone. Dissipating heat, and can also help other electronic components (not shown) around the heat-conducting base 50 to dissipate heat; at the same time, since the two fans 20, 22 10 200842560 are not in the same straight direction, and θ 2〇, 22 (4) Bu H疋 are located in the thermal base (4) to the fan plus full and heat sink fins 32 ^ Γ = high-pass spoiler, can be more fan 22 ===: two, the second wind 曰 ^ ^ ^ into the internal angle is generally 45 degrees, The inner angle formed by the axis of the brother-:fan 2_not shown and the axis of the second fan 2_Fig. is 9 degrees. At the same time, according to different needs, the inner angle formed by a drawing line is still It can vary from (10) degrees to (10) degrees. / \ Figure 6 is not a second embodiment of the present invention. It differs from the first embodiment in that a second fin group 6G' is attached to the surface of the first fin group such as the heat conducting base 5_ to increase the heat dissipation area. The second fins are connected to the heat conducting base 50a, and the airflow passage formed between the second fins and the fins is directly communicated with the airflow passage of the first fin group. The groove 51 of the upper surface 51a of the heat conducting base 50a has a rectangular cross section, and the plurality of heat pipes have an evaporation section 42a of a corresponding sectional shape, which is completely accommodated in the groove to provide a flat surface for the second fin group 6 The crucible is tightly coupled such that a portion of the heat of the thermally conductive base 50a is dissipated into the ambient air through the second fin set 6〇. It will be appreciated that the heat dissipation area may be increased by other means, such as extending the lower edge of the heat sink fin to the upper surface of the thermally conductive base. As shown in Fig. 7, it is a third embodiment of the present invention. The difference from the first embodiment is that the surface of the heat-sealing sheet 3 2b is substantially rectangular, and two independent brackets 212 and 214 are respectively disposed on both sides thereof, and the two brackets 212 and 214 have a vertical side surface 11 200842560 - and opposite thereto The oblique side, the vertical side is combined with the first fin group-corresponding side/face, and is provided with an opening for airflow; the oblique side is for mounting the corresponding fan 20, 22, which is also provided with an opening through which the airflow passes. The airflow directions of the fans 20, 22 can be flexibly adjusted by the brackets 212, 214 to meet different needs. 8 is a fourth embodiment of the present invention. The difference from the first embodiment is that the oblique side edge of the airflow passage inlet of the heat dissipation fin 32c is f concave, so that an air flow buffer is formed between the first film group 30c and the first fan 2 Reduce the noise of work. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent in this case. Any equivalent modifications or variations made by the Society in accordance with the spirit of the present invention shall be within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a conventional heat dissipation module. 2 is a perspective assembled view of a heat dissipation module according to a first embodiment of the present invention. FIG. 3 is a perspective view of a heat dissipation module of the first embodiment of the present invention without a fan. 4 is a left side view of the heat dissipation module of the first embodiment of the present invention, and FIG. 5 is a flow diagram of the air flow of the heat dissipation module of the first embodiment of the present invention. Figure 6 is a cross-sectional view showing a heat dissipation module of a second embodiment of the present invention. 12 200842560, FIG. 7 is a cross-sectional view of a heat dissipation module according to a third embodiment of the present invention. Fig. 8 is a cross-sectional view and a flow pattern of a heat dissipation module according to a fourth embodiment of the present invention. [Main component symbol description] (Invention) Thermal module 10 First fan 20 Second fan 22 First fin set 30, 30b, 30c Heat sink fins 32, 32b, 32c Upper edge 320 Lower edge 322 Oblique side edge 321 , 323, 323c first flange 324 second flange 325 third flange 327 through hole 326 annular joint 328 first oblique side 34 second oblique side 36 manifold 40, 40a condensation section 41 evaporation section 42, 42a bending Section 43 Thermal Conductive Base 50, 50a Jl ® 51, 51a Lower Surface 52 Groove 53, 53a Rib 54 Screw Hole 55 Bracket 212, 214 (General) Base 100 Fan 110 Fin Set 120 Tube 130 13